Defect graph file processing method and device, terminal equipment and storage medium

Abstract

The embodiment of the invention discloses a defect image file processing method and device, terminal equipment and a storage medium, and the method comprises the steps: regularly executing a first operation according to a first preset timing rule: obtaining at least two pieces of standard structured data, and generating at least one piece of defect image original data based on the at least two pieces of standard structured data; executing a second operation regularly according to a second preset timing rule: generating at least one defect image file based on the at least one defect image original data, and storing the at least one defect image file in the file server; when the request used for obtaining the defect graph file is received, according to the index field used for indexing the defect graph file and included in the request, the at least one target defect graph file associated with the index field is output based on the at least one defect graph file stored in the file server, the drawing speed and the calling speed of the defect graph file are high, and the defect graph file can be quickly drawn and called. And the reusability and the applicability are high.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a defect image file processing method, apparatus, terminal device and storage medium. Background Art

[0002] Wafer defect detection and analysis are important links in the field of wafer semiconductor production. How to quickly generate wafer defect images based on the original data of wafer scanning is the key to improving the speed of wafer semiconductor detection.

[0003] In the prior art, wafer defect detection and analysis using raw wafer data requires technicians to process data from tens to hundreds of millions of wafers using office computers. When processing raw wafer data, technicians often need to obtain large quantities of wafer raw data within the same time period and generate large quantities of wafer defect map files based on this large amount of raw data. This results in a timeframe of several hours from the technician initiating a defect map file drawing request to receiving the defect map file. This slows the drawing speed of defect map files, which in turn leads to slow call speeds for defect map files. Furthermore, the generated defect map files can only be used once and are difficult to reuse multiple times or for other devices, resulting in poor reusability and applicability. Summary of the Invention The present application provides a defect image file processing method, apparatus, terminal device and storage medium, which have fast drawing and calling speeds for defect image files, strong reusability and applicability.

[0004] In a first aspect, the present application provides a defect image file processing method, the method comprising: executing a first operation according to a first preset timing rule: acquiring at least two standard structured data, and generating at least one defect image original data based on the at least two standard structured data; one of the above standard structured data is used to indicate the characteristics of at least one dimension of a wafer; the above defect image original data is used to indicate the graphic characteristics of the defect image; executing a second operation according to a second preset timing rule: generating at least one defect image file based on the at least one defect image original data, and storing the at least one defect image file to a file server; when receiving a request for obtaining a defect image file, according to the index field for indexing the defect image file included in the above request, outputting at least one target defect image file associated with the above index field based on the at least one defect image file stored on the above file server. By adopting the present application, defect image original data for indicating the graphic features of the defect image can be generated based on the standard structured data according to the first preset timing rule. The defect image file generated by the defect image original data can improve the drawing speed of the defect image file; and the defect image file can be drawn based on the defect image original data according to the second preset timing rule. Different timing rules are used to avoid processing large quantities of standard structured data at the same time and the computing power pressure caused by drawing a large number of defect image files at the same time. Therefore, it can be applicable to low-computing power products and has strong applicability; by storing the defect image file obtained by timed drawing to a file server, when a request for obtaining a defect image file is received, the target defect image file can be directly output based on the completed defect image file stored in the file server, thereby saving the time spent on temporarily drawing the defect image file when receiving the request for obtaining the defect image file, so the calling speed of the defect image file is fast; in addition, the defect image file in the file server can be called repeatedly and has strong reusability.

[0005] In a possible implementation of the first aspect, the timing duration for executing the first operation according to the first preset timing rule is the first duration; the timing duration for executing the second operation according to the second preset timing rule is the second duration; and the first duration is less than or equal to the second duration. With the present application, since the first duration is less than or equal to the second duration, the real-time and continuity of the defect image raw data generated by the first operation can be guaranteed, thereby providing sufficient defect image raw data input for the second operation; in addition, through the differentiated configuration of the first duration and the second duration, process blockages caused by synchronous operations can be avoided, which is suitable for multi-dimensional data fusion scenarios and can also flexibly allocate computing resources, thereby further improving computing efficiency and applicability.

[0006] In a possible implementation of the first aspect, after generating at least one defect image file based on the at least one defect image original data, the method further comprises: generating index information for each of the defect image files, establishing at least one call link for the at least one defect image file based on the at least one defect image file and the index information corresponding to each of the defect image files; one of the index information includes at least one index field, one of the index fields is associated with at least one call link, and one of the call links corresponds to one of the defect image files; and generating a defect image file index table based on the at least one index field and the at least one call link. According to the present application, by generating the index information and call link for the defect image file, the index information, the defect image file, and the call link can be bound together, and by establishing the defect image file index table, a connection can be established between the defect image file, the call link, and at least one index field in the index information, so that the call link associated with the index field can be quickly indexed through the defect image file index table, thereby improving the indexing speed and further improving the call speed of the defect image file; in addition, since one index field can be associated with multiple call links, and different index fields can also be associated with the same call link, the defect image file processing system can be applied to a variety of indexing scenarios and has strong applicability.

[0007] In a possible implementation of the first aspect, according to the index field for indexing the defect image file included in the request, outputting at least one target defect image file associated with the index field based on the at least one defect image file stored in the file server includes: obtaining the at least one call link associated with the at least one index field based on the defect image file index table and the at least one index field in the request; calling at least one target defect image file corresponding to the at least one call link from the file server based on the at least one call link, and outputting the at least one target defect image file. By adopting the present application, at least one call link associated with the at least one index field can be quickly obtained from the defect image file index table through the at least one index field in the request, so as to call and output at least one target defect image file corresponding to the at least one call link. The indexing speed of indexing through the defect image file index table is fast, and multiple target defect image files can be called simultaneously through one or more index fields, further improving the calling speed of the defect image file.

[0008] In a possible implementation of the first aspect, the above-mentioned acquisition of at least two standard structured data includes: acquiring standard structured data of at least one wafer information and standard structured data of at least one defect information to obtain the above-mentioned at least two standard structured data, wherein the above-mentioned standard structured data of wafer information includes the product model and the original data corresponding to the first dimension set, the above-mentioned first dimension set includes at least the wafer size, and the above-mentioned standard structured data of defect information includes the original data corresponding to the product model and the second dimension set, the above-mentioned second dimension set includes at least the defect location. By adopting the present application, by separating the standard structured data of defect information and the standard structured data of wafer information, the standard structured data can be classified to improve the processing speed of the standard structured data; in addition, by associating the standard structured data of wafer information and defect information by product model, the associated standard structured data can be quickly screened, thereby further improving the processing speed of the standard structured data.

[0009] In a possible embodiment of the first aspect, the generating of at least one defect image raw data based on the at least two standard structured data includes: determining at least two target dimensions for drawing the defect image file from the first dimension set and the second dimension set based on the generation requirements of the defect image file; obtaining at least two image feature data based on the at least two target dimensions and the at least two standard structured data, wherein one target dimension corresponds to at least one image feature data, and the at least two target dimensions include at least the wafer size and the defect position; splicing the at least two image feature data corresponding to the at least two target dimensions to generate at least one defect image raw data, wherein each target dimension used to generate one defect image raw data corresponds to one image feature data. By adopting the present application, the standard structured data can be filtered to eliminate part of the raw data that is not related to the drawing of the defect image file, thereby reducing the data that needs to be analyzed when generating the defect image file, thereby improving the drawing speed of the defect image file; and the image feature data can be converted into defect image raw data that is more suitable for the drawing of the defect image file by data splicing, thereby further improving the drawing speed of the defect image file.

[0010] In a possible implementation of the first aspect, before obtaining the at least two standard structured data, the method further includes: executing a third operation at a fixed time according to the first preset timing rule: obtaining at least one raw data file from a wafer scanning device, performing data parsing on the at least one raw data file, and obtaining at least three raw data; one raw data corresponds to one dimension, and the dimensions of the at least three raw data include at least the product model, the wafer size, and the defect position, the wafer size belongs to the first dimension set, and the defect position belongs to the second dimension set; based on the product model, the first dimension set, and the second dimension set, the at least three raw data are classified for structured processing to generate the at least two standard structured data, and the at least two standard structured data are stored in a database; one standard structured data includes the product model and at least one raw data corresponding to at least one of the dimensions in the first dimension set, or includes the product model and at least one raw data corresponding to at least one of the dimensions in the second dimension set. By adopting the present application, unstructured raw data files can be converted into structured standard structured data by performing data parsing and classification on the raw data files. Since the analysis speed of structured standard structured data is higher than the analysis speed of raw data files when generating defect image raw data, the generation speed of defect image raw data can be improved, thereby further improving the drawing speed of defect image files; in addition, by storing it in a database, multiple calls of standard structured data can be realized, and it has strong reusability.

[0011] In a possible implementation of the first aspect, the storing of the at least two standard structured data into a database includes: generating at least one wafer configuration data table according to the product model in the at least two standard structured data and the first dimension set, and generating at least one wafer defect data table according to the product model in the at least two standard structured data and the second dimension set, so as to obtain at least two standard structured data tables; recording at least one of the standard structured data corresponding to the first dimension set into the wafer configuration data table according to the product model and the first dimension set, and recording at least one of the standard structured data corresponding to the second dimension set into the wafer defect data table according to the product model and the second dimension set, so as to record the at least two standard structured data; storing the at least one wafer defect data table and the at least one wafer configuration data table into a database to store the at least two standard structured data. By adopting the present application, by generating at least two standard structured data tables, classified storage of standard structured data can be achieved, thereby avoiding repeated reading of standard structured data, thereby improving the analysis speed of standard structured data and reducing the storage space occupied by standard structured data; in addition, by storing in standard formatted data tables of different topics, the indexing speed of standard structured data can be improved.

[0012] In a second aspect, the present application provides a defect image file processing device, which includes a module or unit for executing the defect image file processing method provided in the first aspect or any possible implementation method of the first aspect.

[0013] Exemplarily, the apparatus includes: a first processing module and a second processing module; The first processing module is configured to perform a first operation according to a first preset timing rule: acquiring at least two standard structured data, and generating at least one defect image raw data based on the at least two standard structured data; the one standard structured data is used to indicate a feature of at least one dimension of the wafer; and the defect image raw data is used to indicate a graphic feature of the defect image; The second processing module is configured to periodically perform a second operation according to a second preset timing rule: after the first processing module periodically generates the at least one defect image raw data, generate at least one defect image file based on the at least one defect image raw data, and store the at least one defect image file in a file server; The above-mentioned second processing module is also used to, when receiving a request for obtaining a defect image file, output at least one target defect image file associated with the above-mentioned index field based on the above-mentioned at least one defect image file stored in the above-mentioned file server according to the index field for indexing the defect image file included in the above-mentioned request.

[0014] In a third aspect, the present application provides a terminal device comprising: a processor and a memory; the processor is connected to the memory, wherein the memory is used to store program code, and the processor is used to call the program code from the memory to execute the defect image file processing method provided in the first aspect or any possible implementation method of the first aspect.

[0015] In a fourth aspect, the present application provides a computer-readable storage medium, in which a computer program is stored. The computer program is used to be loaded by a processor and executed by a defect image file processing method as provided in the first aspect or any possible implementation method of the first aspect.

[0016] In a fifth aspect, the present application provides a computer program product, which includes computer instructions, and the computer instructions are used by a processor to load and execute the defect image file processing method provided in the first aspect or any possible implementation method of the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the architecture of the defect image file processing system provided by this application; Figure 2 This is another schematic diagram of the architecture of the defect image file processing system provided by this application; Figure 3 This is a flowchart of the defect image file processing method provided by this application; Figure 4 This is a schematic diagram of the defect map file provided by this application; Figure 5 It is a structural diagram of the defect image file processing device provided by this application; Figure 6 It is a structural diagram of the terminal device provided in this application.

[0018] Description of reference numerals: 1-Defect image file processing system; 1a-wafer scanning equipment; 1b-defect image file processing module; 1c-data analysis platform; 1d-file server; 101b-data acquisition module; 102b-database; 103b-data analysis module; 104b-chart drawing module; 10-Defect map file processing device; 101 - first processing module; 102 - second processing module; 103 - third processing module; 104 - fourth processing module; 105 - parsing module; 106 - structuring module; 1011-determining unit; 1012-selecting unit; 1013-joining unit; 1021-acquisition unit; 1022-output unit; 1061-generating unit; 1062-recording unit; 1063-storing unit; 100 - terminal device; 1001 - processor; 1002 - communication bus; 1003 - user interface; 1004 - network interface; 1005 - memory; 1006 - controller. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.

[0020] For ease of understanding, this application first describes the defect map file processing system. The wafer image alignment method can be applied to the defect map file processing system. The above-mentioned defect map file processing system can be applied to wafer defect map generation scenarios, wafer defect analysis scenarios, etc. Taking the wafer defect map generation scenario as an example, to facilitate understanding of the architecture of the defect map file processing system, please refer to Figure 1 , Figure 1 This is a schematic diagram of the architecture of the defect image file processing system provided by this application. Figure 1 As shown, the defect image file processing system 1 may include a defect image file processing module 1b, a wafer scanning device 1a, a file server 1d, and a data analysis platform 1c. The defect image file processing module 1b may be configured to establish a wired or wireless connection with the wafer scanning device 1a, the file server 1d, and the data analysis platform 1c for data exchange, which is not limited in this application.

[0021] In some feasible embodiments, the wafer scanning device 1a may be a machine or other device for scanning wafers, and the wafer scanning device 1a is used to scan the wafer to obtain at least one original data file of the wafer. The file server 1d may be a server or memory for storing files, or may be other storage space carried by a terminal device (such as a mobile phone, computer, tablet, etc.), which is not limited in this application. The file server 1d may be used to store defect image files to realize multiple calls of defect image files. The data analysis platform 1c may be an application, a web page, or a terminal device that can send a request for obtaining a defect image file, which is not limited in this application. The data analysis platform 1c is used to send a request for obtaining a defect image file or other types of requests to the defect image file processing system 1 to perform data analysis based on the defect image file.

[0022] In some feasible implementations, the above-mentioned defect image file processing module 1b can be an application in the form of software, or it can be implemented in the form of hardware. In other words, the above-mentioned defect image file processing module 1b can be carried in the form of software in a terminal device, or the functions implemented by the defect image file processing module 1b can be implemented by at least one server or terminal device. This application does not impose any restrictions. The above-mentioned defect image file processing module 1b can execute the first operation according to the first preset timing rule to generate the original data of the defect image, or execute the second operation according to the second preset timing rule to generate the defect image file. Among them, the timing duration for executing the first operation according to the first preset timing rule is the first duration; the timing duration for executing the second operation according to the second preset timing rule is the second duration; the above-mentioned first duration is less than or equal to the above-mentioned second duration. Exemplarily, the defect image file processing module 1b can be used to store a pre-set first preset timing rule and a second preset timing rule. The first duration and the second duration can be a few seconds, minutes, or hours. That is, the first preset timing rule can stipulate that the first operation is performed every few seconds, minutes, or hours; the second preset timing rule can stipulate that the second operation is performed every few seconds, minutes, or hours. For example, the defect image file processing module 1b can perform the first operation once every five minutes and the second operation once every ten minutes. The specific values ​​of the first duration and the second duration should be determined according to the actual product form and are not limited in this application. It can be understood that since the first duration is less than or equal to the second duration, the real-time and continuity of the defect image raw data generated by the first operation can be guaranteed, thereby providing sufficient defect image raw data input for the second operation; in addition, through the differentiated configuration of the first duration and the second duration, process blockage caused by synchronous operation can be avoided. It is suitable for multi-dimensional data fusion scenarios and can also flexibly allocate computing resources, thereby further improving computing efficiency and applicability.

[0023] In some feasible implementations, the above-mentioned defect image file processing module 1b may also include multiple modules, and multiple modules interact to realize the functions realized by the above-mentioned defect image file processing module 1b. In other words, the above-mentioned defect image file processing module 1b can be integrated into one software, or multiple software can interact to realize the functions realized by the defect image file processing module 1b; or, the above-mentioned defect image file processing module 1b can be integrated into one terminal device, or multiple terminal devices can interact to realize the functions realized by the defect image file processing module 1b. To facilitate understanding of the architecture of the above-mentioned defect image file processing module 1b, Figure 1 Based on the implementation provided, please also refer to Figure 2 , Figure 2 This is another schematic diagram of the defect image file processing system 1 provided by this application. Figure 2As shown, the defect image file processing module 1b includes a data acquisition module 101b, a database 102b, a data analysis module 103b, and a chart drawing module 104b. The following describes the functions of the defect image file processing module 1b and the functions and interactions of the data acquisition module 101b, database 102b, data analysis module 103b, and chart drawing module 104b.

[0024] In some feasible embodiments, the above-mentioned defect image file processing module 1b can be used to perform a first operation according to a first preset timing rule. The above-mentioned first operation may include: obtaining at least two standard structured data, and generating at least one defect image raw data based on the above-mentioned at least two standard structured data. Among them, one standard structured data is used to indicate the characteristics of at least one dimension of the wafer (such as defect location, wafer size, etc.). Exemplarily, the above-mentioned defect image file processing module 1b can obtain standard structured data every five minutes, and the above-mentioned defect image file processing module 1b can obtain at least two standard structured data from an external memory or storage space; or, the defect image file processing module 1b can receive at least two standard structured data transmitted by other devices or applications; or, the defect image file processing module 1b can obtain the wafer's raw data file from the wafer scanning device 1a and generate at least two standard structured data based on the raw data file. This application is not limited.

[0025] In some feasible embodiments, the above-mentioned standard structured data is data obtained after data parsing and structuring the raw data file of the scanned wafer. In addition to the product model, each standard structured data also includes the raw data of at least one dimension of the wafer. The above-mentioned raw data is data obtained after parsing the raw data file obtained by scanning the wafer, which can be used to indicate the characteristics of at least one dimension of the wafer. The above-mentioned dimensions may include: batch identification, wafer identification, chip identification, wafer size, data acquisition time, defect location, etc., which are not limited in this application. It should be noted that since the defect image file processing module 1b does not change the settings, the format of the defect image raw data generated is usually unchanged. The above-mentioned format includes at least two different dimensions (for example, at least the wafer size and defect location). Therefore, at least two standard structured data are required to generate a defect image raw data.

[0026] In some feasible embodiments, the at least two standard structured data acquired by the defect image file processing module 1b include at least one standard structured data of wafer information and at least one standard structured data of defect information. The standard structured data of the wafer information include the product model and the original data corresponding to the first dimension set, and the first dimension set includes at least the wafer size. The standard structured data of the defect information include the original data corresponding to the product model and the second dimension set, and the second dimension set includes at least the defect position. In other words, one of the standard structured data includes at least one original data corresponding to the product model and at least one dimension in the first dimension set, or includes at least one original data corresponding to the product model and at least one dimension in the second dimension set. It can be understood that the standard structured data of wafer information and the standard structured data of defect information both include the product model, so the standard structured data of wafer information and the standard structured data of defect information can be associated with the product model, thereby improving the retrieval efficiency of the standard structured data.

[0027] In some feasible embodiments, after the defect image file processing module 1b obtains at least two standard structured data, it can be used to generate at least one defect image raw data based on the at least two standard structured data, wherein the defect image raw data is used to indicate the graphical features of the defect image, and the above-mentioned defect image can be stored in the form of a defect image file. The above-mentioned defect image file processing module 1b can generate the defect image raw data according to the format required for defect image file drawing by screening, splicing, etc. of the at least two standard structured data. The defect image file processing module 1b can quickly identify the graphical features of the defect image through the above-mentioned defect image raw data. Exemplarily, the defect image file processing module 1b can screen the standard structured data of wafer information and the standard structured data of defect information by product model to obtain the wafer size and defect location of the same product model, and then generate the defect image raw data based on the above-mentioned wafer size and defect location. It should be noted that if the standard structured data is not converted into defect image raw data, when the order of the various dimensions in the above-mentioned standard structured data does not meet the requirements for generating the defect image, the rendering time of the defect image is long. Furthermore, the defect image file processing module 1b analyzes all standard structured data when analyzing standard structured data. However, the standard structured data may include data unrelated to the drawing of the defect image, which may result in additional analysis time and thus reduce the speed of drawing the defect image. Since the format of the defect image raw data required by the defect image file processing module 1b to draw the defect image file generally remains unchanged when the settings are not changed, the standard structured data can be periodically converted into defect image raw data in the above-mentioned format according to the first preset timing rule, thereby increasing the data analysis speed and defect image drawing speed of the defect image file processing module 1b, and further increasing the speed of generating the defect image file. It is understandable that the above-mentioned process of periodically converting the standard structured data into defect image raw data according to the first preset timing rule can also be referred to as a preprocessing process.

[0028] Optionally, in some feasible embodiments, the data analysis module 103b can implement the functions implemented by the defect image file processing module 1b mentioned above. The defect image file processing module 1b can execute the first operation according to the first preset timing rule through the data analysis module 103b to generate at least one defect image original data based on the at least two standard structured data obtained and transmit the above-mentioned defect image original data to the chart drawing module 104b. In some feasible embodiments, the defect image file processing module 1b may perform a second operation according to a second preset timing rule. The second operation may include: generating at least one defect image file based on at least one defect image raw data, and storing the at least one defect image file on the file server 1d. The defect image file is generated from at least one defect image raw data. The defect image raw data should at least include information on the wafer size and the defect location. The wafer size information cannot be empty, and the information indicating the defect location can be empty. When the defect image raw data only includes wafer size information and all other data are empty, it can be used to indicate that the wafer corresponding to the defect image raw data has no defects, and the defect image of the original wafer output by the defect image file does not display defects. After the defect image is generated by the defect image file processing module 1b, the defect image can be output and stored in the form of a defect image file. It can be understood that by timing the second operation according to the second preset timing rule, the regularly generated defect map file can be stored on the file server 1d. This allows the defect map file processing module 1b to directly retrieve the already-drawn defect map file from the file server 1d when it receives a request to retrieve the defect map file. This saves the time spent temporarily drawing the defect map file when receiving the request to retrieve the defect map file, thereby expediting the retrieval of the defect map file. Furthermore, the defect map file in the file server 1d can be repeatedly retrieved, thus providing high reusability.

[0029] Optionally, in some feasible implementations, the chart drawing module 104b can implement the functions implemented by the defect image file processing module 1b mentioned above. The defect image file processing module 1b can implement the second operation according to the second preset timing rule through the chart drawing module 104b to receive the defect image original data from the data analysis module 103b, generate at least one defect image file based on at least one defect image original data, and store at least one defect image file to the file server 1d.

[0030] In some feasible embodiments, upon receiving a request for obtaining a defect map file, the defect map file processing module 1b may output, based on at least one defect map file stored on the file server 1d, at least one target defect map file associated with an index field for indexing the defect map file included in the request. The index field may be an identifier indicating a dimension in standard structured data, such as a product model, batch identifier, wafer identifier, chip identifier, defect location, etc. The target defect map file associated with the index field may be retrieved using the index field.

[0031] Optionally, in some feasible implementations, the chart drawing module 104b can implement the functions implemented by the defect image file processing module 1b mentioned above. The defect image file processing module 1b can be implemented through the chart drawing module 104b: when receiving a request for obtaining a defect image file sent by the data analysis platform 1c or other terminal device, according to the index field for indexing the defect image file included in the request, at least one target defect image file associated with the index field is output based on at least one defect image file stored in the file server 1d.

[0032] It can be understood that the defect image file processing module 1b can generate defect image raw data for indicating the graphic features of the defect image based on the standard structured data according to the first preset timing rule. The defect image file can be generated by the defect image raw data to improve the drawing speed of the defect image file, and the defect image file can be drawn based on the defect image raw data according to the second preset timing rule. Different timing rules are used to avoid the computing power pressure caused by processing large quantities of standard structured data and drawing large quantities of defect image files at the same time. Therefore, it can be suitable for low-computing power products and has strong applicability; the defect image file processing module 1b stores the defect image file obtained by the timed drawing to the file server 1d. When receiving a request for obtaining the defect image file, it can directly output the target defect image file based on the completed defect image file stored in the file server 1d, thereby saving the time consumed in temporarily drawing the defect image file when receiving the request for obtaining the defect image file, so the defect image file is called quickly; in addition, the defect image file in the file server 1d can be called repeatedly and has strong reusability.

[0033] In some feasible implementations, after generating at least one defect image file based on at least one defect image raw data, the defect image file processing module 1b can also be used to generate index information for each defect image file, and establish at least one call link for at least one defect image file based on at least one defect image file and the index information corresponding to each defect image file. The above-mentioned index information may include at least one index field, and the above-mentioned index field may be an identifier or parameter indicating the dimension of the wafer, such as: product model, batch identification, wafer identification, chip identification, wafer size, wafer scanning time, defect location, etc. The above-mentioned defect image files correspond one-to-one to the call link, and the defect image file processing module 1b can call the defect image file corresponding to the above-mentioned call link through the call link. The call link of the defect image file has an association relationship with any index field in the index information of the defect image file. In other words, the defect image file processing module 1b can obtain the call link associated with the index field by indexing any index field in the index information.

[0034] In some feasible implementations, the defect image file processing module 1b can also generate a defect image file index table based on at least one index field and at least one call link. Through the above-mentioned defect image file index table, the index link associated with the index field can be quickly indexed based on the index field, thereby further improving the calling speed of the defect image file.

[0035] Optionally, in some feasible implementations, the chart drawing module 104b can implement the functions implemented by the defect image file processing module 1b mentioned above. The defect image file processing module 1b can generate index information for each defect image file through the chart drawing module 104b, establish at least one call link for at least one defect image file based on at least one defect image file and the index information corresponding to each defect image file, and then generate a defect image file index table based on the at least one index field and the at least one call link. The above-mentioned defect image file index table can be stored in the chart drawing module 104b.

[0036] It can be understood that by generating index information and call links of the defect image file, the index information, the defect image file and the call link can be bound together, and by establishing a defect image file index table, a connection can be established between the defect image file, the call link and at least one index field in the index information, so that the call link associated with the index field can be quickly indexed through the defect image file index table, thereby improving the indexing speed and further improving the call speed of the defect image file; in addition, since one index field can be associated with multiple call links, different index fields can also be associated with the same call link, so the defect image file processing system 1 can be applicable to a variety of indexing scenarios and has strong applicability.

[0037] In some feasible embodiments, the defect image file processing module 1b can be configured to obtain at least one call link associated with the at least one index field in the request based on the defect image file index table and the at least one index field in the request. Based on the at least one call link, the module can then call at least one target defect image file corresponding to the at least one call link from the file server 1d and output the at least one target defect image file. The defect image file processing module 1b can analyze the request for obtaining the defect image file to obtain the at least one index field included in the request. Optionally, the defect image file processing module 1b can provide a valid index field to the data analysis platform 1c or other terminal device that sent the request for obtaining the defect image file based on the defect image file index table, thereby preventing the request from including index fields that are not associated with a defect image file, thereby improving indexing efficiency. The defect image file processing module 1b can then index the defect image file index table based on the at least one index field in the request to obtain the at least one call link associated with the at least one index field. Furthermore, the defect image file processing module 1b can call at least one target defect image file corresponding to the at least one call link from the file server 1d based on the at least one call link determined from the defect image index table and output the at least one target defect image file. It can be understood that a call link can indicate the storage address of a defect map file, so the defect map file processing module 1b can quickly determine the defect map file corresponding to the call link based on the call link, and the call speed is fast.

[0038] Optionally, in some feasible implementations, the chart drawing module 104b can implement the functions implemented by the defect image file processing module 1b mentioned above. The defect image file processing module 1b can obtain at least one call link associated with at least one index field based on the defect image file index table and at least one index field in the request through the chart drawing module 104b, and then call at least one target defect image file corresponding to at least one call link from the file server 1d based on the above at least one call link, and output the above at least one target defect image file to the data analysis platform 1c or other terminal device.

[0039] It can be understood that the defect image file processing module 1b can quickly obtain at least one call link associated with the at least one index field in the request from the defect image file index table to call and output at least one target defect image file corresponding to the at least one call link. The indexing speed of indexing through the defect image file index table is fast, and multiple target defect image files can be called at the same time through one or more index fields, further improving the calling speed of the defect image file.

[0040] In some feasible embodiments, the defect map file processing module 1b can be configured to obtain at least two standard structured data, including image feature data of at least two dimensions of the wafer, and determine at least two target dimensions for generating the defect map file from these at least two dimensions. Exemplarily, the defect map file processing module 1b can obtain the at least two standard structured data from an external application or terminal device, or it can obtain raw wafer data from the wafer scanning device 1a to generate the at least two standard structured data, although this application does not impose any restrictions. The at least two standard structured data may include image feature data of at least two dimensions, such as wafer size and defect location. This application does not impose any restrictions on the number or content of dimensions included in the standard structured data. However, in practical applications, the at least two standard structured data should at least include image feature data of wafer size and defect location. The defect map file processing module 1b can determine the at least two target dimensions for generating the defect map file from these at least two dimensions based on the requirements for generating the defect map file (e.g., data format). For example, if the defect image file processing module 1b obtains three standard structured data, including image feature data in the three dimensions of "wafer size," "defect location," and "batch," the "batch" dimension can be used to indicate the batch information of the defect image of the wafer corresponding to the standard structured data, but is irrelevant to the drawing of the wafer defect image. Therefore, the "batch" dimension can be eliminated. If the generation requirements of the defect image file are: the data format is "wafer size" and "defect location," then the defect image file processing module 1b can determine the "wafer size" and "defect location" dimensions as the two target dimensions for drawing the defect image file.

[0041] In some feasible implementations, the defect image file processing module 1b can be used to obtain at least two image feature data from at least two standard structured data based on at least two target dimensions, wherein one target dimension corresponds to at least one image feature data. The above-mentioned image feature data is part of the original data included in the standard structured data, which is used to indicate the graphic features of the defect image. The defect image file processing module 1b can be used to determine the at least two image feature data corresponding to the above-mentioned at least two target dimensions based on the generation requirements of the defect image file. One of the above-mentioned target dimensions can correspond to one or more image feature data, wherein the image feature data can be empty (which can be represented by parameters such as "0" or "NULL").

[0042] In some feasible embodiments, the defect image file processing module 1b can be used to splice at least two image feature data corresponding to at least two target dimensions to generate at least one defect image raw data, wherein each target dimension used to generate one defect image raw data corresponds to one standard structured data. It is understood that the multiple image feature data of the same dimension can be arranged in columns when stored, and the at least two standard structured data obtained by the same wafer scan can be arranged in rows when stored. Therefore, the defect image file processing module 1b can select multiple image feature data of different dimensions by row, thereby splicing at least two image feature data of different dimensions obtained by the same wafer scan to generate one defect image raw data. It is understood that the defect image file processing module 1b can simultaneously select multiple image feature data of the same target dimension when selecting image feature data, but when splicing, it is necessary to ensure that when generating one defect image raw data, each target dimension corresponds to one standard structured data, rather than splicing multiple standard structured data of one target dimension.

[0043] Optionally, in some feasible implementations, the data analysis module 103b can implement the functions implemented by the defect image file processing module 1b mentioned above. The defect image file processing module 1b can obtain at least two standard structured data from the database 102b through the data analysis module 103b, and then determine at least two target dimensions for drawing the defect image file from the first dimension set and the above-mentioned second dimension set; obtain at least two image feature data based on the at least two target dimensions and the at least two standard structured data; splice the at least two image feature data corresponding to the at least two target dimensions to generate at least one defect image original data, and transmit the above-mentioned defect image original data to the chart drawing module 104b.

[0044] It can be understood that the defect image file processing module 1b can filter the standard structured data, eliminate some original data that is not related to the drawing of the defect image file, reduce the data that needs to be analyzed when generating the defect image file, and thus improve the drawing speed of the defect image file; and through data splicing, the image feature data can be converted into defect image original data that is more suitable for the drawing of the defect image file, thereby further improving the drawing speed of the defect image file.

[0045] In some feasible embodiments, the defect image file processing module 1b can be used to perform a third operation according to a first preset timing rule before obtaining at least two standard structured data. The third operation includes: obtaining at least one raw data file from the wafer scanning device 1a, performing data parsing on the at least one raw data file, and obtaining at least three parsed raw data. Exemplarily, the defect image file processing module 1b can obtain at least one raw data file obtained by scanning the wafer from the wafer scanning device 1a (such as a machine) according to the first preset timing rule (for example, once every five minutes). The time interval for the defect image file processing module 1b to obtain the raw data file should be determined according to the actual product form, and this application does not impose any restrictions. Among them, the defect image file processing module 1b can obtain at least three parsed raw data by parsing the at least one raw data file. The dimensions of the at least three raw data include at least product model, wafer size and defect location. The wafer size belongs to the first dimension set, and the above-mentioned defect location belongs to the second dimension set. For example, if the defect image file processing module 1b needs to obtain standard structured data of the two dimensions of "wafer size" and "defect location", the defect image file processing module 1b can obtain at least one raw data file from the wafer scanning device 1a, and parse the at least one raw data file to obtain the raw data of the two dimensions of "wafer size" and "defect location". In some feasible implementations, the raw data file can also be empty. When the raw data file is empty, the raw data obtained by parsing is also empty, which can be represented by parameters such as "0" or "NULL", which is not limited in this application. The defect image file processing module 1b can parse the at least one raw data file through decoding or data segmentation by an application program, thereby obtaining at least three parsed raw data.

[0046] In some feasible embodiments, the third operation further includes: classifying the at least three raw data based on the product model, the first dimension set, and the second dimension set for structured processing to generate at least two standard structured data, and storing the at least two standard structured data in a database. The defect image file processing module 1b can be used to classify the at least three parsed raw data based on the product model, the first dimension set, and the second dimension set for structured processing to generate at least two standard structured data, and storing the at least two standard structured data in the database. A standard structured data includes at least one raw data corresponding to the product model and at least one dimension in the first dimension set, or includes at least one raw data corresponding to at least one dimension in the product model and the second dimension set. Optionally, the database can also be other types of storage space or memory, and the database can be a distributed database. The database can be constructed using a big data analysis component, which can improve data entry and acquisition capabilities and support elastic and scalable database resources. The defect image file processing module 1b can classify the at least three parsed raw data by dimension for structured processing.

[0047] Optionally, in some feasible embodiments, the data acquisition module 101b can implement the functions implemented by the defect image file processing module 1b mentioned above. The defect image file processing module 1b can perform a third operation according to the first preset timing rule through the data acquisition module 101b to receive at least one original data file of the wafer from the wafer scanning device 1a, and perform data parsing on the above-mentioned at least one original data file to obtain at least three parsed original data, classify the at least three parsed original data according to at least two dimensions of the wafer for structured processing, so as to generate at least two standard structured data, and store the at least two standard structured data in the database 102b.

[0048] It can be understood that the defect image file processing module 1b can convert unstructured raw data into structured standard structured data by parsing and classifying the raw data. Since the defect image file processing module 1b analyzes the structured standard structured data at a higher speed than the raw data file when generating the defect image raw data, the generation speed of the defect image raw data can be improved, thereby further improving the drawing speed of the defect image file; in addition, multiple calls of the standard structured data can be realized by storing it in a database, which has strong reusability.

[0049] In some feasible embodiments, the defect map file processing module 1b can be configured to generate at least one wafer configuration data table based on the product model and the first dimension set in the at least two standard structured data, and to generate at least one wafer defect data table based on the product model and the second dimension set in the at least two standard structured data, thereby obtaining at least two standard structured data tables. The at least two standard structured data include standard structured data of defect information, and the at least two standard structured data tables include at least one wafer defect data table, which is used to store the standard structured data of defect information. Optionally, the defect map file processing module 1b can also generate other types of standard structured data tables based on the product model and the first dimension set, such as a scan configuration data table. The multiple standard structured data tables can be associated through dimension identifiers (e.g., product model identifier, wafer identifier, batch identifier), thereby enabling data in one standard structured data table to be associated with data in another standard structured data table, thereby reducing storage space for standard formatted data. Since the amount of standard structured data of defect information is huge, usually reaching tens of millions or even hundreds of millions of data, if all the data are combined into a standard structured data table, the defect image file processing module 1b needs to read all the data including the standard structured data of the defect information when reading the standard structured data table before proceeding to the next step, which greatly increases the data analysis time of the defect image file processing module 1b.

[0050] In some feasible implementations, the defect map file processing module 1b may also be used to record, based on the product model and the first dimension set, at least one standard structured data corresponding to the first dimension set to the wafer configuration data table, and based on the product model and the second dimension set, record at least one standard structured data corresponding to the second dimension set to the wafer defect data table, so as to record at least two standard structured data. Exemplarily, the defect map file processing module 1b may record multiple standard structured data of the same product model based on the product model, for example, recording multiple standard structured data corresponding to the first dimension set to the wafer configuration table data based on the product model, or recording multiple standard structured data corresponding to the second dimension set to the wafer defect data table based on the product model.

[0051] In some feasible implementations, the defect image file processing module 1b can also be used to store the above-mentioned at least one wafer defect data table and at least one wafer configuration data table into a database to store at least two standard structured data. In order to improve the data analysis speed of the defect image file processing module 1b, the defect image file processing module 1b can store the standard formatted data of the defect information and other types of standard formatted data separately, that is, the standard structured data table may include the wafer defect data table and other types of standard structured data tables. In addition, since the dimension format to be stored is fixed when all standard structured data are stored in the same standard formatted data table, multiple standard formatted data of the same dimension and the same value need to occupy a storage location respectively, resulting in repeated storage of standard formatted data and increasing the storage space required for standard formatted data. Therefore, the present application further saves storage space by classifying and storing multiple standard formatted data tables.

[0052] Optionally, in some feasible embodiments, the data acquisition module 101b can implement the functions implemented by the defect image file processing module 1b mentioned above. The defect image file processing module 1b can generate at least one wafer configuration data table based on the product model and the first dimension set in at least two standard structured data through the data acquisition module 101b, and generate at least one wafer defect data table based on the product model and the second dimension set in at least two standard structured data; record at least one standard structured data corresponding to the first dimension set to the wafer configuration data table based on the product model and the first dimension set, and record at least one standard structured data corresponding to the second dimension set to the wafer defect data table based on the product model and the second dimension set; store at least one wafer defect data table and at least one wafer configuration data table in the database 102b to store at least two standard structured data.

[0053] It can be understood that by generating at least one wafer configuration data table and at least one wafer defect data table, the defect map file processing module 1b can achieve classified storage of standard structured data, thereby avoiding repeated reading of standard structured data, thereby improving data analysis speed and reducing the storage space occupied by standard structured data. In addition, storing data in standard formatted data tables of different themes can also improve the indexing speed of standard structured data.

[0054] Optionally, in some feasible embodiments, the defect image file processing module 1b can also be used to directly generate at least one defect image file through at least one original data file of the wafer and output the above-mentioned defect image file when at least one original data file of the wafer obtained cannot be converted into standard formatted data (that is, data parsing or classification cannot be performed).

[0055] Optionally, in some feasible implementations, the defect image file processing module 1b can also be used to receive a real-time rendering request for a defect image file sent by the data analysis platform 1c or other terminal devices or software. When the defect image file processing module 1b receives the real-time rendering request for a defect image file, it can obtain at least one raw data file of the wafer from the wafer scanning device 1a. If the at least one raw data file can be converted into standard structured data, the defect image file processing module 1b can perform data parsing and classification on the at least one raw data file to generate at least two standard formatted data, and generate at least one defect image raw data based on the at least two standard formatted data, thereby generating a defect image file based on the at least one defect image raw data and outputting the defect image file. If the at least one raw data file cannot be converted into standard structured data, the defect image file processing module 1b can generate at least one defect image file based on the at least one raw data file and output the at least one defect image file.

[0056] By adopting the present application, the defect image file processing module in the defect image file processing system can generate defect image original data indicating the graphic features of the defect image based on the standard structured data according to the first preset timing rule. The defect image file can be generated by the defect image original data to improve the drawing speed of the defect image file, and the defect image file can be drawn based on the defect image original data according to the second preset timing rule. Different timing rules can be used to avoid processing large quantities of standard structured data at the same time, and the computing power pressure caused by drawing a large number of defect image files at the same time. Therefore, it can be applicable to low-computing power products and has strong applicability; by storing the defect image file obtained by timed drawing to the file server, when a request for obtaining the defect image file is received, the target defect image file can be directly output based on the completed defect image file stored in the file server, thereby saving the time consumed in temporarily drawing the defect image file when receiving the request for obtaining the defect image file, so the calling speed of the defect image file is fast; the defect image file in the file server can be called repeatedly and has strong reusability. In addition, by implementing the functions realized by the above-mentioned defect image file processing module through multiple modules, the steps of generating defect image files by the defect image file processing module can be decoupled. The above-mentioned multiple modules can be loaded on multiple terminal devices for multiple applications, or the functions of the above-mentioned modules can be realized by multiple terminal devices. It can be applied to a variety of application scenarios and has strong applicability.

[0057] In some feasible implementations, the defect image file processing method can be applied to the above Figures 1 to 2 For the convenience of description, the defect image file processing system 1 provided in the corresponding embodiment will be described below with the defect image file processing module as the execution subject to describe the above-mentioned defect image file processing method. Figure 1 and Figure 2 Based on the implementation provided, see Figure 3 , Figure 3 This is a flowchart of the defect image file processing method provided by this application. The above defect image file processing method may include the following steps: Step S101, executing the first operation according to the first preset timing rule: obtaining at least two standard structured data, and generating at least one defect image original data based on the at least two standard structured data; one of the above standard structured data is used to indicate the characteristics of at least one dimension of the wafer; the above defect image original data is used to indicate the graphic characteristics of the defect image.

[0058] In some feasible implementations, the defect image file processing module can be used to periodically acquire at least two standard structured data according to a first preset timing rule, and the timing duration for periodically executing the first operation according to the first preset timing rule is the first duration. For example, the above-mentioned first duration may be five minutes, and the above-mentioned defect image file processing module may acquire standard structured data every five minutes. The above-mentioned defect image file processing module may acquire at least two standard structured data from an external memory or storage space; or, the defect image file processing module may receive at least two standard structured data transmitted by other devices or applications; or, the defect image file processing module may acquire the original data file of the wafer from the wafer scanning device and generate at least two standard structured data based on the original data file, and this application does not impose any restrictions.

[0059] In some feasible embodiments, the defect map file processing module can obtain standard structured data of at least one wafer information and standard structured data of at least one defect information to obtain at least two standard structured data. Among them, the standard structured data of wafer information includes the original data corresponding to the product model and the first dimension set, and the first dimension set includes at least the wafer size. The standard structured data of defect information includes the original data corresponding to the product model and the second dimension set, and the second dimension set includes at least the defect position. It should be noted that the defect map file processing module can index the above-mentioned standard structured data of wafer information and the standard structured data of defect information by product model. Exemplarily, the above-mentioned standard structured data of defect information and the standard structured data of wafer information can be stored in the form of a table. To facilitate understanding of the format of the above-mentioned standard structured data of wafer information, please refer to Table 1, which is the wafer configuration data table provided in this application.

[0060] Table 1

[0061] Table 1 can be used to store standard structured data of wafer information. As shown in Table 1, Table 1 records the wafer sizes corresponding to product model A and product model B, respectively, wherein the wafer size of product model A is 200mm, and the wafer size of product model B is 300mm. It can be understood that the above Table 1 only shows the standard structured data of two dimensions of product model and wafer size. In actual application scenarios, the above wafer configuration data table may include standard structured data of other dimensions, and the number of standard structured data in each dimension is not limited in this application. In some feasible implementations, the defect map file processing module can retrieve the wafer size corresponding to the product model from the wafer configuration data table through the product model, thereby obtaining standard structured data for indicating wafer information of product model and wafer size.

[0062] To facilitate understanding of the format of the standard structured data of the above defect information, please refer to Table 2, which is a wafer defect data table.

[0063] Table 2

[0064] As shown in Table 2, Table 2 records the defect locations corresponding to product model A and product model B, respectively, where the defect location of product model A is (1, 1) and the defect location of product model B is (2, 2). It can be understood that the above Table 2 only shows the standard structured data of the two dimensions of product model and defect location. In actual application scenarios, the standard structured data table of the above defect information may include standard structured data of other dimensions, and the number of standard structured data in each dimension is not limited in this application. In some feasible implementations, the defect image file processing module can retrieve the defect location corresponding to the product model from the standard structured data table of the defect information through the product model, thereby obtaining the standard structured data of the defect information used to indicate the product model and defect location.

[0065] In combination with Table 1 and Table 2 above, in some feasible implementations, the defect image file processing module can associate the standard structured data of wafer information and the standard structured data of defect information through the product model. For example, based on product model A, the above Table 1 and Table 2 can be retrieved to obtain the wafer size and defect position corresponding to product model A, and then obtain the two standard structured data corresponding to product model A.

[0066] In some feasible embodiments, the defect image file processing module can generate at least one defect image raw data based on the above-mentioned at least two standard structured data. Among them, one standard structured data is used to indicate the characteristics of at least one dimension of the wafer, and the defect image raw data is used to indicate the graphic characteristics of the defect image. For example, the defect image file processing module can determine at least two target dimensions for drawing the defect image file from the above-mentioned at least two dimensions based on the generation requirements of the defect image file. The defect image file processing module can obtain at least two standard structured data from an external application or terminal device, or obtain the wafer's raw data file from a wafer scanning device to generate at least two standard structured data, and this application does not impose any restrictions. The above-mentioned at least two standard structured data include at least image feature data of at least two dimensions such as wafer size and defect position. This application does not impose any restrictions on the number of dimensions and dimensional content included in the above-mentioned standard structured data, but in actual application scenarios, the above-mentioned at least two standard structured data should at least include image feature data of two dimensions: wafer size and defect position. The defect map file processing module can determine at least two target dimensions for drawing the defect map file from the at least two dimensions mentioned above based on the defect map file generation requirements (e.g., data format). The at least two target dimensions include at least wafer size and defect location. For example, if the standard structured data obtained by the defect map file processing module includes raw data of the three dimensions of "wafer size," "defect location," and "batch," then when the defect map file generation requirements are: the data format is "wafer size" and "defect location," the defect map file processing module can determine the two dimensions of "wafer size" and "defect location" as the two target dimensions for drawing the defect map file.

[0067] In some feasible embodiments, the defect image file processing module may select at least two image feature data from at least two raw data included in the at least two standard structured data based on the at least two target dimensions, where each target dimension corresponds to at least one image feature data. The defect image file processing module may determine the at least two image feature data corresponding to the at least two target dimensions based on the at least two target dimensions determined based on the defect image file generation requirements. Exemplarily, the image feature data selection may be achieved using algorithms such as convolution algorithms and farthest point sampling compression algorithms. For example, the target dimensions may include "wafer size" and "defect location," and the standard structured data p may include "product model A," "200 mm," and "(1, 1)." The standard structured data p includes the dimensions "product model," "wafer size," and "defect location." The raw data corresponding to the "product model" dimension is "product model A," the raw data corresponding to the "wafer size" dimension is "200 mm," and the raw data corresponding to the "defect location" dimension is "(1, 1)." The defect image file processing module can determine the original data corresponding to the two target dimensions of "wafer size" and "defect position" in the above-mentioned standard structured data p as image feature data, that is, the image feature data obtained by the defect image file processing module are: "200mm" and "(1, 1)".

[0068] In some feasible embodiments, after the defect image file processing module obtains at least two standard structured data, it can generate at least one defect image raw data based on the at least two standard structured data. Exemplarily, if the above-mentioned defect image raw data includes wafer size and defect location, the defect image file processing module can determine the wafer size in the defect image file based on the wafer size in the defect image raw data, and determine the defect location in the defect image file based on the defect location. The defect image file processing module can splice at least two image feature data corresponding to at least two target dimensions to generate at least one defect image raw data, wherein each target dimension used to generate one defect image raw data corresponds to one image feature data. It should be noted that the raw data belonging to the same dimension can be stored in columns, and the at least two raw data obtained by the same wafer scan can be stored in rows. Therefore, the defect image file processing module can select at least two image feature data from the at least two raw data by row and splice them, thereby splicing at least two image feature data of different dimensions obtained by the same wafer scan to generate one defect image raw data. Exemplarily, the defect image file processing module obtains image feature data in the dimensions of "wafer size" and "defect location". For example, the obtained image feature data is: "200mm", "(1, 1)", "300mm", and "(2, 2)", where "200mm" and "(1, 1)" are image feature data located in the same row, and "300mm" and "(2, 2)" are image feature data located in the same row. If the target format for drawing the defect image file is: "wafer size"; "defect location", the defect image file processing module can splice "200mm" and "(1, 1)" located in the same row (i.e., image feature data obtained from the same wafer scan) to obtain a defect image raw data of "200mm; (1, 1)"; and splice "300mm" and "(2, 2)" to obtain another defect image raw data of "300mm; (2, 2)". It can be understood that the defect image file processing module can filter the raw data in the standard structured data, eliminate the raw data that is not related to the drawing of the defect image file, reduce the amount of data that needs to be analyzed when generating the defect image file, and thus improve the drawing speed of the defect image file; and through data splicing, the image feature data can be converted into defect image raw data that is more suitable for the drawing of the defect image file, thereby further improving the drawing speed of the defect image file.

[0069] In some feasible embodiments, the defect image file processing module may, before acquiring at least two standard structured data, periodically perform a third operation according to a first preset timing rule to acquire at least one raw data file from a wafer scanning device, parse the at least one raw data file, and obtain at least three raw data. Exemplarily, the defect image file processing module may periodically (for example, once every minute) acquire at least one raw data file obtained by scanning a wafer from a wafer scanning device (such as a machine). The time interval for the defect image file processing module to acquire the raw data file should be determined based on the actual product form, and this application does not impose any restrictions. Exemplarily, the defect image file processing module may acquire at least one raw data file from a wafer scanning device, and then parse the at least one raw data file (for example, by decoding or data segmentation through an application) to obtain at least three parsed raw data. Exemplarily, the above parsing process may convert the file format from ".ilm" to ".txt", or may segment the above raw data by symbols such as spaces, delimiters, and semicolons. For example, the defect image file processing module receives a raw data file. After parsing this raw data file, it can obtain the following: Scan start time: 2025-1-1; Operating machine: A1; Product model: B; Wafer size: 300mm; Defect location: (2, 2). Parsing this raw data file can generate five parsed raw data, with each adjacent parsed raw data separated by a semicolon.

[0070] In some feasible embodiments, the defect map file processing module may classify the at least three parsed raw data based on the product model, the first dimension set, and the second dimension set for structured processing, generating at least two standard structured data sets, and storing the at least two standard structured data sets in a database. A standard structured data set includes at least one raw data set corresponding to the product model and at least one dimension in the first dimension set, or includes at least one raw data set corresponding to at least one dimension in the second dimension set. Exemplarily, the defect map file processing module may classify the at least three raw data sets by dimension. For example, the defect map file processing module obtains six parsed raw data sets, namely: "Product Model A," "200mm," "(1,1)," "Product Model B," "300mm," and "(2,2)." Based on the dimensions, the six raw data sets can be divided into three categories: "Product Model," "Wafer Size," and "Defect Location," for example, "Product Model A" and "Product Model B" in the "Product Model" dimension, "200mm" and "300mm" in the "Wafer Size" dimension, and "(1,1)" and "(2,2)" in the "Defect Location" dimension. Among them, the data of the "product model" dimension is used to associate the data of other dimensions. For example, "product model A" is associated with "200mm" and "(1, 1)", and "product model B" is associated with "300mm" and "(2, 2)", so that standard structured data can be obtained: "Product model A; 200mm", "Product model A; (1, 1)", "Product model B; 300mm" and "Product model B; (2, 2)".

[0071] It can be understood that the defect image file processing module can convert unstructured raw data files into structured standard structured data by parsing and classifying the raw data files. Since the defect image file processing module analyzes structured standard structured data at a higher speed than the raw data file when generating defect image raw data, the generation speed of defect image raw data can be improved, thereby further improving the drawing speed of defect image files; by associating wafer information and defect information with standard structured data through product models, the associated standard structured data can be quickly screened, thereby further improving the processing speed of standard structured data; in addition, by storing standard structured data in a database, multiple calls of standard structured data can be realized, which has strong reusability.

[0072] In some feasible embodiments, the defect map file processing module can generate at least two standard structured data tables based on at least two standard structured data. Specifically, the defect map file processing module can generate at least one wafer configuration data table based on the product model and the first dimension set in the at least two standard structured data, and generate at least one wafer defect data table based on the product model and the second dimension set in the at least two standard structured data, so as to obtain at least two standard structured data tables. Furthermore, the defect map file processing module can record at least one standard structured data corresponding to the first dimension set to the wafer configuration data table based on the product model and the first dimension set, and record at least one standard structured data corresponding to the second dimension set to the wafer defect data table based on the product model and the second dimension set, so as to record at least two standard structured data. Finally, the defect map file processing module can store the above-mentioned at least one wafer defect data table and the above-mentioned at least one wafer configuration data table in a database to store the above-mentioned at least two standard structured data. The above-mentioned wafer configuration data table may include standard structured data of dimensions such as wafer size, milling edge width, product model, chip width, chip height, the number of chips in the horizontal axis direction of one exposure, the number of chips in the vertical axis direction of one exposure, the horizontal axis width of the interval between chips, the vertical axis width of the interval between chips, the horizontal axis offset distance of the center chip from the center of the wafer, and the vertical axis offset distance of the center chip from the center of the wafer. The above-mentioned wafer defect data table may include standard structured data of dimensions such as product model, batch identification, wafer identification, scan start time, scan end time, horizontal axis defect position, and vertical axis defect position. This application does not limit the dimensions contained in the above-mentioned wafer defect data table, wafer configuration data table and other standard structured data tables, but the wafer defect data table should at least contain standard structured data of product model and defect information, and the wafer configuration data table should at least contain standard structured data of product model and wafer size. The aforementioned multiple standard structured data tables can be linked through dimensional identifiers (such as product model, wafer ID, and batch ID), thereby linking data in one standard structured data table with data in another standard structured data table, thereby reducing the storage space required for the standard structured data. For example, if the dimensions that need to be stored include: defect location, wafer size, and product model, if the standard structured data obtained from the first wafer scan is: "(1, 1)", "200mm", and "Product Model A", the standard structured data obtained from the second wafer scan is: "(2, 2)", "200mm", and "Product Model A".If the standard structured data of the defect information is stored separately in the wafer defect data table, the wafer defect data table can store: "(1, 1)" and "product model A" in the first row, and "(2, 2)" and "product model A" in the second row. Another standard structured data table can store "200mm" and "product model A", among which "(1, 1)", "(2, 2)" and "200mm" are associated through "product model A", and the standard structured data "200mm" that appears twice is only stored once.

[0073] As can be seen, storing multiple standard structured data tables allows for the consolidation of duplicate data, saving the required amount of standard structured data. This savings is particularly significant when the amount of standard structured defect information is substantial. It is understood that by generating at least two standard structured data tables, the defect image file processing module can achieve categorized storage of standard structured data, thereby avoiding repeated reading of standard structured data, thereby accelerating data analysis and reducing the storage space occupied by standard structured data.

[0074] Step S102 , performing a second operation according to a second preset timing rule: generating at least one defect image file based on the at least one defect image original data, and storing the at least one defect image file in a file server.

[0075] In some feasible embodiments, the defect image file processing module may perform a second operation according to a second preset timing rule to identify the graphic features indicated by at least one defect image raw data, thereby generating at least one defect image file based on the above graphic features, and storing the at least one defect image file in a file server. The above-mentioned defect image file is generated by at least one defect image raw data, and the above-mentioned defect image raw data should at least include the graphic features of the wafer size and the graphic features of the defect position. Among them, the graphic features indicating the wafer size cannot be empty, and the information indicating the defect position can be empty. When the defect image raw data only includes the wafer size and other data are empty, it indicates that the wafer corresponding to the defect image raw data has no defects, and the defect image output by the defect image file processing module does not display defects. After the defect image file processing module generates the defect image, it can output and store the defect image in the form of a defect image file. For example, the defect image generation module can store the defect image file in the file server.

[0076] It should be noted that the timing duration for executing the second operation according to the second preset timing rule is the second duration; the first duration is less than or equal to the second duration. Since the first duration is less than or equal to the second duration, the real-time and continuity of the defect image raw data generated by the first operation can be guaranteed, thereby providing sufficient defect image raw data input for the second operation; in addition, through the differentiated configuration of the first duration and the second duration, the process blockage caused by synchronous operation can be avoided, which is suitable for multi-dimensional data fusion scenarios and can also flexibly allocate computing resources, thereby further improving computing efficiency and applicability. It can be understood that the defect image file processing module can store the defect image files generated periodically through the file server, so that when the defect image file processing module receives a request for obtaining a defect image file, it can directly call the already drawn defect image file from the file server, thereby saving the time spent on temporarily drawing the defect image file when receiving the request for obtaining the defect image file, so the defect image file is called quickly. In addition, the defect image files in the file server can be called repeatedly and have strong reusability. Step S103: When a request for obtaining a defect map file is received, according to the index field for indexing the defect map file included in the request, at least one target defect map file associated with the index field is output based on the at least one defect map file stored in the file server.

[0077] In some feasible embodiments, upon receiving a request for obtaining a defect map file, the defect image file processing module may output, based on at least one defect map file stored on a file server, at least one target defect map file associated with an index field for indexing defect map files included in the request. For example, the file server may include defect map file j and defect map file k, where defect map file j contains defect images for wafer a from batch m, and defect map file k contains defect images for wafer b from batch m. Then, when the index field in the request for obtaining the defect image file is "wafer a", the defect image file processing module may use the defect image file j as the target defect image file and output the above-mentioned defect image file j; when the index field in the request for obtaining the defect image file is "batch m", the defect image file processing module may use the defect image file j and the defect image file k as the target defect image files and output the above-mentioned defect image file j and the defect image file k; when the index field in the request for obtaining the defect image file is "chip q", the defect image file indicating "chip q" cannot be retrieved from the file server, so the index field "chip q" can be associated with a defect image file indicating "empty" (for example, a blank image), so that the defect image file processing module outputs the above-mentioned defect image file indicating "empty". Optionally, if the defect image file indicating "chip q" cannot be retrieved from the file server, it can also not be output, and this application does not impose any restrictions.

[0078] In some feasible implementations, after generating at least one defect image file based on at least one defect image original data, the defect image file processing module may also generate index information for each defect image file, and establish at least one call link for at least one defect image file based on at least one defect image file and the index information corresponding to each defect image file. The above-mentioned index information may include at least one index field, and the above-mentioned index field may be an identifier or parameter indicating the dimension of the wafer, such as: batch identifier, wafer identifier, chip identifier, wafer size, wafer scanning time, etc. For example, if the batch identifier of a defect image file is "batch m", the wafer identifier is "wafer a", and the wafer size is "200mm", then the index information of the defect image file may be: "batch m, wafer a, 200mm". The index information may use symbols such as commas, spaces, and semicolons to separate the various index fields, or may be directly spliced ​​without separating the various index fields. This application does not impose any restrictions. If the index information of the defect image file j is: "Batch m, wafer a, 200mm", then the index fields contained in the index information are: "Batch m", "Wafer a" and "200mm", respectively. The defect image file processing module can obtain the call link of the defect image file j by indexing one or more index fields among "Batch m", "Wafer a" and "200mm". It should be noted that one of the above index fields can be associated with multiple call links. For example, if the index information of the defect image file j is: "Batch m, Wafer a, 200mm", and the index information of the defect image file k is: "Batch m, Wafer b, 200mm", then the index field "Batch m" is associated with the call link of the defect image file j and the call link of the defect image file k, and the index field "200mm" is also associated with the call link of the defect image file j and the call link of the defect image file k.

[0079] In some feasible implementations, the defect image file processing module can also generate a defect image file index table based on at least one index field and at least one call link. Through the above-mentioned defect image file index table, the index link associated with the index field can be quickly indexed based on the index field, thereby further improving the call speed of the defect image file. It can be understood that the defect image file processing module can bind the index information, the defect image file and the call link by generating the index information and call link of the defect image file. By establishing the defect image file index table, a connection can be established between the defect image file, the call link and at least one index field in the index information, so that the call link associated with the index field can be quickly indexed through the defect image file index table, thereby improving the indexing speed, thereby further improving the call speed of the defect image file; in addition, since one index field can be associated with multiple call links, and different index fields can also be associated with the same call link, the defect image file processing system can be applied to a variety of indexing scenarios and has strong applicability.

[0080] In some feasible implementations, the defect image file processing module may obtain at least one call link associated with at least one index field based on the defect image file index table and at least one index field in the request, thereby calling at least one target defect image file corresponding to the at least one call link from the file server based on the at least one call link, and outputting at least one target defect image file. The defect image file processing module may analyze the request for obtaining the defect image file to obtain at least one index field included in the above request. Optionally, the defect image file processing module may provide an index field that can be effectively indexed to the data analysis platform or other terminal device that sends the request for obtaining the defect image file based on the defect image file index table, thereby avoiding the inclusion of index fields that are not associated with defect image files in the above request, thereby improving indexing efficiency. The defect image file processing module may index the defect image file index table based on at least one index field in the above request to obtain at least one call link associated with the above at least one index field. Exemplarily, the index fields included in the above-mentioned defect image file index table may be "batch m", "wafer a" and "wafer b", the call links associated with "batch m" are "call link n" and "call link o", the call link associated with "wafer a" is "call link n", and the call link associated with "wafer b" is "call link o". Then when the index field in the request is "wafer a", the defect image file processing module can obtain the call link associated with "wafer a" as "call link n" according to the defect image file index table index, and so on, which will not be repeated. Furthermore, the defect image file processing module can call and output the target defect image file corresponding to the call link from the file server according to the call link determined from the defect image index table. Exemplarily: if the above-mentioned "call link n" corresponds to "defect image file j", the defect image file processing module can call the above-mentioned "defect image file j" as the target defect image file from the file server through "call link n", and output the above-mentioned "defect image file j". It can be understood that the defect image file processing module can quickly obtain at least one call link associated with the at least one index field in the request from the defect image file index table, so as to call and output at least one target defect image file corresponding to the at least one call link. The indexing speed of indexing through the defect image file index table is fast, and multiple target defect image files can be called at the same time through one or more index fields, which further improves the calling speed of the defect image file.

[0081] In some feasible implementations, the target defect map file output by the above defect map file processing method can be used for defect traceability analysis during wafer processing. To understand the effect of the target defect map file output by the above defect map file processing method, please refer to Figure 4 , Figure 4 This is a page diagram of the defect map file provided by this application. It should be noted that Figure 4 This is a feasible example diagram. This application does not limit the display page layout of the defect image file, the display rules of the index information, etc.

[0082] like Figure 4 The schematic diagram of the defect image file page shown in the figure can be a schematic diagram of the data analysis platform sending a request for obtaining a defect image file to the defect image file processing module, receiving the defect image file fed back by the defect image file processing module and displaying it. Figure 4 The page diagram shown may include multiple defect map files and index information corresponding to the multiple defect map files. For example, the wafer identification may include wafer a, wafer b, and wafer c, which are used to indicate the defect map files corresponding to wafer a, wafer b, and wafer c respectively; the index information may include acquisition time d, scanning device e, defect location f and acquisition time g, scanning device h, defect location i. Figure 4 Each defect map file shown may display the defect location and number of defects on the wafer. Optionally, the page schematic diagram of the above-mentioned defect map file may also provide one or more annotation boxes. When the data analysis platform receives a click instruction for a defect map file, a annotation box for indicating the click may be displayed on the defect map file. When the data analysis platform receives a pending annotation instruction for a defect map file, a annotation box for indicating that the defect map file is pending may be displayed on the defect map file. When the data analysis platform receives a confirmed annotation instruction for a defect map file, a annotation box for indicating that the defect map file has been confirmed may be displayed on the defect map file. This application does not limit the style of the above-mentioned annotation box.

[0083] By adopting the present application, defect image original data for indicating the graphic features of the defect image can be generated based on the standard structured data according to the first preset timing rule. The defect image file generated by the defect image original data can improve the drawing speed of the defect image file; and the defect image file can be drawn based on the defect image original data according to the second preset timing rule. Different timing rules are used to avoid processing large quantities of standard structured data at the same time and the computing power pressure caused by drawing a large number of defect image files at the same time. Therefore, it can be applicable to low-computing power products and has strong applicability; by storing the defect image file obtained by timed drawing to a file server, when a request for obtaining a defect image file is received, the target defect image file can be directly output based on the completed defect image file stored in the file server, thereby saving the time spent on temporarily drawing the defect image file when receiving the request for obtaining the defect image file, so the calling speed of the defect image file is fast; in addition, the defect image file in the file server can be called repeatedly and has strong reusability.

[0084] This application also provides a defect image file processing device, see Figure 5 , Figure 5 This is a schematic diagram of the structure of the defect image file processing device provided by this application. Figure 5 The defect image file processing device 10 shown can be a computer device that has a computer program (including program code) for implementing the above-mentioned wafer image alignment method. The defect image file processing device 10 can also be a computer program, for example, the computer program is an application software. The device can be used to execute the corresponding steps in the wafer image alignment method provided in this application. Figure 5 As shown, the defect image file processing device 10 may include: a first processing module 101 and a second processing module 102 .

[0085] The first processing module 101 is configured to perform a first operation according to a first preset timing rule: acquiring at least two standard structured data, and generating at least one defect image raw data based on the at least two standard structured data; the one standard structured data is used to indicate a feature of at least one dimension of the wafer; and the defect image raw data is used to indicate a graphic feature of the defect image; The second processing module 102 is configured to perform a second operation according to a second timing rule: generating at least one defect image file based on the at least one defect image original data, and storing the at least one defect image file in a file server; The second processing module 102 is also used to, when receiving a request for obtaining a defect image file, output at least one target defect image file associated with the index field for indexing the defect image file included in the request and based on the at least one defect image file stored in the file server.

[0086] In some feasible implementations, the timing duration for executing the first operation according to the first preset timing rule is the first duration; the timing duration for executing the second operation according to the second preset timing rule is the second duration; the first duration is less than or equal to the second duration.

[0087] In some feasible implementations, the defect map file processing device 10 further includes: a third processing module 103 and a fourth processing module 104 .

[0088] The third processing module 103 is configured to generate index information for each of the defect map files, and establish at least one call link for the at least one defect map file based on the at least one defect map file and the index information corresponding to each of the defect map files; each of the index information includes at least one index field, each of the index fields is associated with at least one of the call links, and each of the call links corresponds to one of the defect map files; The fourth processing module 104 is configured to generate a defect map file index table based on the at least one index field and the at least one call link.

[0089] In some feasible implementations, the second processing module 102 includes: an acquisition unit 1021 and an output unit 1022 .

[0090] An acquiring unit 1021 is configured to acquire the at least one call link associated with the at least one index field based on the defect map file index table and the at least one index field in the request; The output unit 1022 is configured to call at least one target defect map file corresponding to the at least one calling link from the file server based on the at least one calling link, and output the at least one target defect map file.

[0091] In some feasible embodiments, the first processing module 101 is also used to obtain standard structured data of at least one wafer information and standard structured data of at least one defect information to obtain the at least two standard structured data, wherein the standard structured data of the wafer information includes the original data corresponding to the product model and the first dimension set, and the first dimension set includes at least the wafer size; the standard structured data of the defect information includes the original data corresponding to the product model and the second dimension set, and the second dimension set includes at least the defect position.

[0092] In some feasible implementations, the first processing module 101 includes: a determination unit 1011 , a selection unit 1012 , and a splicing unit 1013 .

[0093] A determining unit 1011 is configured to determine at least two target dimensions for drawing the defect map file from the first dimension set and the second dimension set based on a generation requirement of the defect map file; A selection unit 1012 is configured to obtain at least two image feature data based on the at least two target dimensions and the at least two standard structured data, wherein one target dimension corresponds to at least one image feature data, and the at least two target dimensions include at least the wafer size and the defect location; The stitching unit 1013 is used to stitch the at least two image feature data corresponding to the at least two target dimensions to generate at least one defect image original data, wherein each of the target dimensions used to generate one defect image original data corresponds to one image feature data.

[0094] In some feasible implementations, the defect image file processing device 10 further includes: a parsing module 105 and a structuring module 106. The parsing module 105 and the structuring module 106 are used to execute the third operation according to the first preset timing rule before the first processing module 101 obtains at least two standard structured data.

[0095] The parsing module 105 is configured to periodically acquire at least one raw data file from the wafer scanning device according to the first preset timing rule, perform data parsing on the at least one raw data file, and obtain at least three raw data; each raw data corresponds to one dimension, and the dimensions of the at least three raw data include at least the product model, the wafer size, and the defect location, where the wafer size belongs to the first dimension set, and the defect location belongs to the second dimension set; The structuring module 106 is used to perform data classification on the at least three original data based on the product model, the first dimension set and the second dimension set according to the first preset timing rule for structured processing, so as to generate the at least two standard structured data, and store the at least two standard structured data in the database; one standard structured data includes the product model and at least one original data corresponding to at least one of the dimensions in the first dimension set, or includes the product model and at least one original data corresponding to at least one of the dimensions in the second dimension set.

[0096] In some feasible implementations, the structuring module 106 includes a generating unit 1061 , a recording unit 1062 and a storage unit 1063 .

[0097] A generating unit 1061 is configured to generate at least one wafer configuration data table based on the product model in the at least two standard structured data and the first dimension set, and to generate at least one wafer defect data table based on the product model in the at least two standard structured data and the second dimension set, to obtain at least two standard structured data tables; The recording unit 1062 is configured to record, based on the product model and the first dimension set, at least one of the standard structured data corresponding to the first dimension set into the wafer configuration data table, and based on the product model and the second dimension set, record at least one of the standard structured data corresponding to the second dimension set into the wafer defect data table, so as to record the at least two standard structured data. The storage unit 1063 is configured to store the at least one wafer defect data table and the at least one wafer configuration data table into a database to store the at least two standard structured data.

[0098] In some feasible implementations, the parsing module 105, the structuring module 106, the generating unit 1061, the recording unit 1062 and the storage unit 1063 in the defect image file processing device 10 can cooperate to implement the above Figure 2 The functions implemented by the data acquisition module 101b provided in the embodiment shown; the first processing module 101, the determination unit 1011, the selection unit 1012 and the splicing unit 1013 in the defect image file processing device 10 can cooperate to implement the above Figure 2 The functions implemented by the data analysis module 103b provided in the embodiment shown; the second processing module 102, the third processing module 103, the acquisition unit 1021 and the output unit 1022 in the defect image file processing device 10 can cooperate to implement the above Figure 2 The functions implemented by the chart drawing module 104b provided in the embodiment shown. The implementation of each module and / or unit included in the defect map file processing device 10 can be referred to the above Figure 3 The implementation methods provided in each step of the wafer image alignment method shown are not described in detail.

[0099] By using the defect image file processing device provided by the present application, at least one defect image original data for indicating the graphic features of the defect image can be generated based on at least two standard structured data according to a preset timing rule. At least one defect image file can be generated by at least one defect image original data, which can improve the drawing speed of the defect image file. The method of obtaining the defect image original data and drawing the defect image file according to the preset timing rule can avoid the computing power pressure caused by processing a large amount of standard structured data and drawing a large amount of defect image files at the same time. Therefore, it can be applied to low-computing power products and has strong applicability. The defect image file processing device stores the defect image file obtained by the timed drawing to the file server. When receiving a request for obtaining the defect image file, it can directly output the target defect image file based on the completed defect image file stored in the file server, thereby saving the time consumed in temporarily drawing the defect image file when receiving the request for obtaining the defect image file. Therefore, the calling speed of the defect image file is fast. In addition, the defect image file in the file server can be called repeatedly and has strong reusability.

[0100] See also Figure 6 , Figure 6 This is a schematic diagram of the structure of the terminal device provided by this application. Figure 6As shown, the terminal device 100 may include: a processor 1001, a network interface 1004, a memory 1005, and a controller 1006. In addition, the terminal device 100 may also include: a user interface 1003, and at least one communication bus 1002. The communication bus 1002 is used to realize the connection and communication between these components. The user interface 1003 may include a display screen (Display), a keyboard (Keyboard), and the optional user interface 1003 may also include a standard wired interface and a wireless interface. The network interface 1004 may optionally include a standard wired interface and a wireless interface (such as a WI-FI interface). The memory 1005 includes random access memory (RAM) and non-volatile memory (NVM), such as erasable programmable read-only memory (EPROM). The memory 1005 may optionally be at least one storage device located away from the aforementioned processor 1001. The above-mentioned controller 1006 can be used to receive data sent by the processor and generate control instructions, which can execute the above Figures 1 to 4 The functions implemented by the controller involved in the embodiment shown can be controlled by the controller 1006, for example. Figures 1 to 4 The defect image file processing module in the embodiment shown executes the step of generating a defect image file according to a preset timing rule. Figure 6 As shown, the memory 1005 as a computer readable storage medium may include an operating system, a network communication module, a user interface module and a device control application. Figures 1 to 2 The processor 1001 described in this embodiment can execute the above Figures 1 to 2 Functions performed by the processor (such as the defect image file processing module) provided in the illustrated embodiment.

[0101] In such Figure 6 In the terminal device 100 shown, the network interface 1004 can provide network communication functions; the user interface 1003 is mainly used to provide an input interface for the user; and the processor 1001 can be used to call the device control application stored in the memory 1005 to implement the aforementioned Figure 3 The defect image file processing method in the illustrated embodiment.

[0102] In some feasible implementations, the memory 1005 can implement the above Figures 1 to 4The functions implemented by the file server mentioned in the embodiment shown are as follows: the memory 1005 can be used to store the defect map file; the processor 1001 is further used to call the defect map file from the memory 1001 to execute the above Figure 3 The defect image file processing method of the embodiment shown.

[0103] It should be understood that the terminal device 100 described in the embodiment of the present application can execute the above Figure 3 The defect image file processing method of the embodiment shown is not described in detail. In addition, the beneficial effects of the same method are not described in detail either.

[0104] In addition, it should be pointed out here that: the embodiment of the present application also provides a computer-readable storage medium, and the computer-readable storage medium stores a computer program executed by the wafer measurement method based on the measurement mark point mentioned above, and the computer program includes program instructions. When the processor executes the program instructions, the computer program can execute the above-mentioned Figure 3 The defect image file processing method provided in the illustrated embodiment is therefore not described in detail. In addition, the description of the beneficial effects of using the same method is also not repeated. For technical details not disclosed in the computer-readable storage medium embodiment involved in this application, please refer to the description of the method embodiment of this application.

[0105] The computer-readable storage medium can be the internal storage unit of the terminal device provided in any of the aforementioned embodiments, such as the terminal device's hard drive or memory. The computer-readable storage medium can also be an external storage device of the terminal device, such as a plug-in hard drive, a smart media card (SMC), a secure digital (SD) card, a flash memory card, etc. Furthermore, the computer-readable storage medium can include both the internal storage unit of the terminal device and an external storage device. The computer-readable storage medium is used to store the computer program and other programs and data required by the terminal device. The computer-readable storage medium can also be used to temporarily store data that has been output or is about to be output.

[0106] In addition, it should be noted that the embodiment of the present application also provides a computer program product or computer program, which includes computer instructions stored in a computer-readable storage medium. The processor of the terminal device loads and executes the computer instructions, so that the terminal device can execute the above Figures 3 and 4 The embodiment shown provides a method for processing defect image files.

[0107] Those skilled in the art will appreciate that the systems and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented using electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of function in the above description. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this application.

Claims

1. A defect image file processing method, characterized in that: include: Performing a first operation according to a first preset timing rule: acquiring at least two standard structured data, and generating at least one defect image raw data based on the at least two standard structured data; one of the standard structured data is used to indicate a feature of at least one dimension of a wafer; and the defect image raw data is used to indicate a graphic feature of a defect image; Performing a second operation according to a second preset timing rule: generating at least one defect image file based on the at least one defect image original data, and storing the at least one defect image file in a file server; When a request for obtaining a defect map file is received, at least one target defect map file associated with the index field for indexing a defect map file included in the request is output based on the at least one defect map file stored in the file server.

2. The method according to claim 1, characterized in that The timing duration for executing the first operation according to the first preset timing rule is the first duration; the timing duration for executing the second operation according to the second preset timing rule is the second duration; The first duration is less than or equal to the second duration.

3. The method according to claim 2, characterized in that After generating at least one defect map file based on the at least one defect image original data, the method further includes: generating index information for each of the defect map files, and establishing at least one call link for the at least one defect map file based on the at least one defect map file and the index information corresponding to each of the defect map files; wherein each of the index information includes at least one index field, each of the index fields is associated with at least one of the call links, and each of the call links corresponds to one of the defect map files; A defect map file index table is generated based on the at least one index field and the at least one call link.

4. The method according to claim 3, characterized in that The step of outputting, based on the index field for indexing a defect map file included in the request and based on the at least one defect map file stored in the file server, at least one target defect map file associated with the index field comprises: Based on the defect map file index table and the at least one index field in the request, obtaining the at least one call link associated with the at least one index field; At least one target defect map file corresponding to the at least one calling link is called from the file server based on the at least one calling link, and the at least one target defect map file is output.

5. The method according to any one of claims 1 to 4, characterized in that The obtaining of at least two standard structured data includes: Obtain standard structured data of at least one wafer information and standard structured data of at least one defect information to obtain the at least two standard structured data, wherein the standard structured data of the wafer information includes the original data corresponding to the product model and a first dimension set, the first dimension set includes at least the wafer size, and the standard structured data of the defect information includes the original data corresponding to the product model and a second dimension set, the second dimension set includes at least the defect position.

6. The method according to claim 5, characterized in that The generating at least one defect image original data based on the at least two standard structured data includes: Determining at least two target dimensions for drawing the defect map file from the first dimension set and the second dimension set based on a generation requirement of the defect map file; Acquire at least two image feature data based on the at least two target dimensions and the at least two standard structured data, wherein one target dimension corresponds to at least one image feature data, and the at least two target dimensions include at least the wafer size and the defect position; The at least two image feature data corresponding to the at least two target dimensions are spliced ​​to generate at least one defect image original data, wherein each of the target dimensions used to generate one defect image original data corresponds to one image feature data.

7. The method according to claim 6, characterized in that Before acquiring at least two standard structured data, the method further includes: Perform the third operation according to the first preset timing rule: Acquire at least one raw data file from a wafer scanning device, perform data parsing on the at least one raw data file to obtain at least three raw data; each raw data corresponds to one dimension, the dimensions of the at least three raw data at least include the product model, the wafer size, and the defect location, the wafer size belongs to the first dimension set, and the defect location belongs to the second dimension set; The at least three original data are classified based on the product model, the first dimension set and the second dimension set for structured processing to generate the at least two standard structured data, and the at least two standard structured data are stored in the database; one standard structured data includes the product model and at least one original data corresponding to at least one of the dimensions in the first dimension set, or includes the product model and at least one original data corresponding to at least one of the dimensions in the second dimension set.

8. The method according to claim 7, characterized in that Storing the at least two standard structured data in a database includes: Generating at least one wafer configuration data table according to the product model in the at least two standard structured data and the first dimension set, and generating at least one wafer defect data table according to the product model in the at least two standard structured data and the second dimension set, to obtain at least two standard structured data tables; According to the product model and the first dimension set, at least one of the standard structured data corresponding to the first dimension set is recorded in the wafer configuration data table, and according to the product model and the second dimension set, at least one of the standard structured data corresponding to the second dimension set is recorded in the wafer defect data table, so as to record the at least two standard structured data; The at least one wafer defect data table and the at least one wafer configuration data table are stored in a database to store the at least two standard structured data.

9. A defect image file processing device, characterized in that: include: a first processing module and a second processing module; The first processing module is configured to perform a first operation according to a first preset timing rule: acquiring at least two standard structured data, and generating at least one defect image raw data based on the at least two standard structured data; one of the standard structured data is used to indicate a feature of at least one dimension of a wafer; and the defect image raw data is used to indicate a graphic feature of a defect image; The second processing module is configured to periodically perform a second operation according to a second preset timing rule: after the first processing module periodically generates the at least one defect image raw data, generate at least one defect image file based on the at least one defect image raw data, and store the at least one defect image file in a file server; The second processing module is further configured to, when receiving a request for obtaining a defect map file, output at least one target defect map file associated with the index field included in the request for indexing the defect map file based on the at least one defect map file stored in the file server.

10. A terminal device, characterized in that: include: processor and memory; The processor is connected to the memory, wherein the memory is used to store program code, and the processor is used to call the program code from the memory to execute the method according to any one of claims 1 to 8.

11. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, and the computer program is used for a processor to load and execute the method according to any one of claims 1 to 8.

12. A computer program product, characterized in that The computer program product comprises computer instructions, and the computer instructions are used to be loaded by a processor and execute the method according to any one of claims 1 to 8.

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