Bonding head, bonding apparatus, bonding method, and storage medium

Abstract

The application provides a bonding head, a bonding device, a bonding method and a storage medium. The bonding head comprises a transmission mechanism, an elastic mechanism and a measuring mechanism. The elastic mechanism comprises an elastic unit and an adsorption unit connected with each other. The elastic unit is used for driving the adsorption unit to produce displacement under the action of pressure. The adsorption unit is used for adsorbing a substrate and driving the substrate to produce displacement. The transmission mechanism can transmit the pressure to the elastic unit and collect the force. The measuring mechanism comprises a first displacement sensor and a second displacement sensor. The first displacement sensor is used for collecting displacement data of the substrate in the direction perpendicular to the thickness direction of the substrate. The second displacement sensor is used for collecting displacement data of the substrate in the thickness direction of the substrate. According to the application, the bonding force can be accurately controlled, the upper and lower substrates and the motion table are prevented from being damaged due to excessive force, and the bonding quality is improved. Meanwhile, the displacement deviation of the bonding head can be accurately detected and compensated, and high-precision bonding is realized.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, and in particular to a bonding head, bonding device, bonding method and storage medium. Background Technology

[0002] With the development of semiconductor technology, the precision requirements for chip bonding in the chip packaging process are becoming increasingly stringent. During chip packaging, a transmission mechanism is often needed to move the bonding head vertically to achieve bonding between the upper substrate held by the bonding head and the lower substrate supported on the lower moving stage. In the bonding process, the displacement accuracy of the bonding head significantly affects the bonding accuracy. Furthermore, both chips and silicon wafers are fragile, and in practice, it is difficult to accurately identify and control the applied bonding force, leading to damage to the chip and wafer, and even damage to the moving stage, thus affecting the bonding yield. Therefore, improving bonding accuracy and bonding yield is a pressing technical problem that needs to be solved. Summary of the Invention

[0003] This application provides a bonding head, bonding device, bonding method, and storage medium, which can precisely control the bonding force and can detect and compensate for the displacement deviation of the bonding head with high precision, thereby improving bonding accuracy and yield.

[0004] In a first aspect, this application proposes a bonding head, comprising:

[0005] An elastic mechanism includes an elastic unit and an adsorption unit connected together. The elastic unit is used to drive the adsorption unit to move under pressure. The adsorption unit is used to adsorb the substrate and drive the substrate to move.

[0006] The transmission mechanism includes a motor, a first transmission unit, and a second transmission unit. The first transmission unit is connected to both the motor and the second transmission unit. The motor drives the first transmission unit, which in turn drives the second transmission unit. The second transmission unit transmits pressure to the elastic unit, causing the elastic unit to displace the adsorption unit. The second transmission unit includes a force sensor, which is used to collect the force applied to the substrate.

[0007] The measuring mechanism includes a first displacement sensor and a second displacement sensor. The first displacement sensor is used to collect displacement data of the substrate in the direction perpendicular to its thickness, and the second displacement sensor is used to collect displacement data of the substrate in the direction of its thickness.

[0008] Furthermore, the second transmission unit also includes a bracket and a pressure head; the bracket is connected to the first transmission unit and the force sensor respectively; the pressure head is connected to the force sensor and the elastic unit respectively; the force sensor is located between the bracket and the pressure head; the pressure head has a hemispherical structure on the side near the elastic unit, and the hemispherical structure abuts against the elastic unit.

[0009] Furthermore, the elastic unit includes a connecting unit and an elastic element; the adsorption unit is connected to the elastic element via the connecting unit.

[0010] Furthermore, when there are multiple elastic elements, the connecting unit includes multiple connectors and multiple support plates; the support plates are hollow structures; each support plate is located on the side of each elastic element near the adsorption unit and supports the elastic element; multiple elastic elements are connected and fixed to each other with the connecting unit along the thickness direction of the substrate; the number of support plates corresponds to the number of elastic elements.

[0011] Furthermore, when the number of elastic elements is one, the connecting unit includes multiple connectors and a support plate; the support plate has a hollow structure; the support plate is located on the side of the elastic element close to the adsorption unit and supports the elastic element; the elastic element is connected to and fixed to the connecting unit along the thickness direction of the substrate.

[0012] Furthermore, the elastic element includes an elastic element body and a plurality of elastic arms; the plurality of elastic arms are diagonally symmetrically distributed or in a cross-shaped symmetrical distribution; the plurality of elastic arms are connected to the inner edge of the elastic element body.

[0013] Furthermore, the elastic arm is provided with an arched structure.

[0014] Furthermore, the adsorption unit includes a suction cup adapter plate and a suction cup, one side of the suction cup adapter plate is connected to the elastic unit, and the other side is connected to the suction cup; the first displacement sensor is used to detect the displacement of the adsorption unit in the direction perpendicular to the thickness of the substrate.

[0015] Furthermore, the second displacement sensor is fixedly installed on the second transmission unit; the second displacement sensor includes a grating ruler body and a grating ruler reading head, used to detect the displacement of the adsorption unit in the substrate thickness direction.

[0016] Secondly, this application proposes a bonding device, comprising:

[0017] The bonding head as described in any of the above embodiments is used to adsorb the upper substrate and drive the upper substrate to move.

[0018] A motion table is used to support and move the lower substrate.

[0019] A control module is used to control the bonding head and the motion table.

[0020] Thirdly, this application proposes a bonding method, comprising the following steps:

[0021] Drive the bonding head in the above bonding device to move along the thickness direction of the upper substrate;

[0022] Acquire the displacement data of the upper substrate in the direction perpendicular to its thickness, the displacement data of the upper substrate in its thickness direction, and the bonding force data;

[0023] Based on the obtained displacement data of the upper substrate in the direction perpendicular to its thickness, the displacement data of the upper substrate in its thickness direction, and the bonding force data, the movement of the bonding head and the motion stage, as well as the magnitude of the bonding force, are adjusted until the bonding conditions are met.

[0024] Perform bonding between the upper and lower substrates.

[0025] Fourthly, this application proposes a storage medium storing computer instructions thereon, which, when executed by a processor, implement the steps of the above-described bonding method.

[0026] This application achieves the following beneficial effects: The bonding head proposed in this embodiment can accurately detect and compensate for vertical displacement deviation caused by the backlash between the external thread of the lead screw and the internal thread of the transmission nut in the structure of the first transmission unit. Simultaneously, it can accurately detect and compensate for horizontal displacement caused by the gap between the linear guide and the slider in the structure of the first transmission unit when the bonding head is moving vertically. Furthermore, the force sensor in the transmission mechanism can accurately control the magnitude of the bonding force, thereby preventing excessive pressure from damaging the upper and lower substrates, the suction cup, or the lower motion stage, thus improving bonding quality. Therefore, the bonding head proposed in this embodiment can achieve high-precision bonding of the upper and lower substrates. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0029] Figure 1 A front view schematic diagram of a bonding head provided for an embodiment of this application;

[0030] Figure 2 A side view of a bonding head provided for an embodiment of this application;

[0031] Figure 3 A cross-sectional view of the first embodiment of the elastic unit provided in this application;

[0032] Figure 4 A cross-sectional view of a second embodiment of the elastic unit provided in this application;

[0033] Figure 5 A schematic diagram of the structure of the first embodiment of the elastic element provided in this application;

[0034] Figure 6 A schematic diagram of the structure of the second embodiment of the elastic element provided in this application;

[0035] Figure 7 A schematic diagram of the structure of the third embodiment of the elastic element provided in this application;

[0036] Figure 8 This is a schematic flowchart of a bonding method provided for an embodiment of this application.

[0037] Explanation of reference numerals in the attached figures:

[0038] 100-Transmission mechanism; 1-Motor; 2-First transmission unit; 21-Linear guide rail; 22-Slider; 23-Ball screw; 3-Second transmission unit; 31-Bracket; 32-Force sensor; 33-Indenter; 331-Hemispherical structure;

[0039] 200 - Elastic mechanism; 4 - Elastic unit; 41 - Connecting unit; 411 - First connector; 412 - Second connector; 413 - Third connector; 414 - First support plate; 415 - Second support plate; 42 - Elastic element; 421 - Elastic element body; 422 - Elastic arm; 423 - Through hole; 424 - Arch structure; 5 - Adsorption unit; 51 - Suction cup adapter plate; 52 - Suction cup; 6 - Support outer frame;

[0040] 300 - Measuring mechanism; 7 - First displacement sensor; 8 - Second displacement sensor; 81 - Grating ruler body; 82 - Grating ruler reading head. Detailed Implementation

[0041] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0042] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the term "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Furthermore, the character " / " in this document, unless otherwise specified, generally indicates that the preceding and following related objects have an "or" relationship.

[0043] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0044] The following description, in conjunction with the accompanying drawings, describes a bonding head, bonding apparatus, bonding method, and storage medium provided in this application.

[0045] See Figure 1 As shown in the embodiment of this application, a bonding head is proposed, comprising: a transmission mechanism 100, an elastic mechanism 200, and a measuring mechanism 300.

[0046] The transmission mechanism 100 includes a motor 1, a first transmission unit 2, and a second transmission unit 3. The motor 1 is connected to the first transmission unit 2, and the first transmission unit 2 is connected to the second transmission unit 3. The first transmission unit 2 is located between the motor 1 and the second transmission unit 3. The second transmission unit 3 includes a force sensor 32, which can collect the magnitude of the bonding force during the substrate bonding process in real time.

[0047] The elastic mechanism 200 includes an elastic unit 4 and an adsorption unit 5 connected together. The elastic unit 4 is used to drive the adsorption unit 5 to move under pressure, and the adsorption unit 5 is used to adsorb the substrate and drive the substrate to move.

[0048] The measuring mechanism 300 includes a first displacement sensor 7 and a second displacement sensor 8. The first displacement sensor 7 is used to collect displacement data of the substrate in the direction perpendicular to the substrate thickness (i.e., the horizontal direction, which includes the X and Y directions in this application), and the second displacement sensor 8 is used to collect displacement data of the substrate in the direction of substrate thickness (i.e., the vertical direction, which is the Z direction in this application; and the X, Y, and Z directions are mutually perpendicular).

[0049] In some embodiments, the motor 1 drives the first transmission unit 2, which in turn drives the second transmission unit 3. The second transmission unit 3 transmits pressure to the elastic unit 4, causing the elastic unit 4 to displace the adsorption unit 5. It should be noted that the adsorption unit 5 adsorbs the substrate, therefore the displacement result of the adsorption unit 5 is considered to represent the displacement result of the substrate.

[0050] In some embodiments, a control module and a motion stage for carrying and moving another substrate (lower substrate) are provided independently of the bonding head structure. The control module is communicatively connected to the transmission mechanism 100, the elastic mechanism 200, the measuring mechanism 300, and the motion stage in the bonding head.

[0051] In some embodiments, during the process of gradually moving the bonding head closer to the motion stage in the vertical direction until the bonding operation is completed, due to the unavoidable gap in the structure of the first transmission unit 2 in the transmission mechanism 100, when the transmission mechanism 100 drives the substrate to move in the vertical direction, on the one hand, the vertical displacement is inaccurate, and on the other hand, it inevitably causes the horizontal offset. This results in the bonding position of the substrate (upper substrate) adsorbed by the bonding head and another substrate (lower substrate) placed on the motion stage being inaccurate, affecting the bonding accuracy. Since the bonding accuracy is related to the circuit conduction between the two substrates, the bonding accuracy directly affects the final bonding yield and bonding quality.

[0052] Based on the aforementioned technical problems, in the embodiments of this application, the first displacement sensor 7 detects the horizontal displacement data of the substrate and sends it to the control module. The control module generates a control command based on the displacement data and sends the control command to the motion stage. The motion stage executes the control command to control its own movement, thereby causing the lower substrate to move, achieving compensation for horizontal positional offset, and ensuring precise alignment between the upper and lower substrates or the bonding area in the lower substrate, thus guaranteeing bonding accuracy. Specifically, there are two first displacement sensors 7, one for collecting displacement offset data of the substrate in the X direction and the other for collecting displacement offset data of the substrate in the Y direction. For example, if the first displacement sensor 7 collects a displacement data of 0.05mm in the X direction, the control command will control the motion stage to move 0.05mm in the X direction. As another example, if the first displacement sensor 7 collects a displacement data of 0.04mm in the Y direction, the control command will control the motion stage to move 0.04mm in the Y direction. Alternatively, depending on specific needs, only one first displacement sensor 7 may be used.

[0053] In the embodiments of this application, the second displacement sensor 8 is used to collect displacement data of the substrate in the vertical direction and send the displacement data to the control module. The control module can compensate for the displacement deviation of the transmission mechanism 100 in the vertical direction based on the displacement data. If the displacement data is less than a preset displacement, the transmission mechanism 100 can be controlled to make the bonding head move further downward in the vertical direction until the preset displacement is met, and vice versa. By setting the second displacement sensor 8, the transmission mechanism 100 can accurately complete the preset displacement and drive the substrate to accurately complete the preset displacement, thereby achieving precise bonding control and ensuring bonding accuracy.

[0054] In some embodiments, the force sensor 32 in the second transmission unit 3 can collect the magnitude of the bonding force during the bonding process in real time and send the bonding force data to the control module. The control module adjusts the magnitude of the force in the vertical direction of the transmission mechanism 100 according to the magnitude of the bonding force, thereby accurately controlling the bonding force and avoiding damage to the upper substrate, lower substrate, or motion stage due to excessive bonding force, while also preventing the bonding operation from being unable to be completed due to insufficient bonding force. By setting up a force sensor, the bonding yield and bonding quality are improved.

[0055] Based on the above embodiments, the bonding head of this application can precisely control the magnitude of the bonding force; at the same time, it can eliminate the influence caused by the gap in the structure of the first transmission unit 2 in the transmission mechanism 100, and can detect and compensate for the displacement deviation of the bonding head in the vertical direction and the offset in the horizontal direction in a timely manner, thereby greatly improving the substrate bonding accuracy and bonding quality.

[0056] In some embodiments, see Figure 1 and Figure 2 As shown, the first transmission unit 2 includes a ball screw 23 and a linear guide assembly, which includes a linear guide 21 and a slider 22.

[0057] The second transmission unit 3 also includes a bracket 31 and a pressure head 33. The slider 22 of the first transmission unit 2 is connected to the bracket 31, the bracket 31 is connected to the force sensor 32, the force sensor 32 is connected to the pressure head 33, and the pressure head 33 is connected to the elastic unit 4. The force sensor 32 is located between the bracket 31 and the pressure head 33.

[0058] Motor 1 generates power to drive the ball screw 23, linear guide assembly, bracket 31, force sensor 32, and pressure head 33 of the first transmission unit 2 to generate vertical displacement. In the embodiments of this application, motor 1 can be a servo motor or a stepper motor. An encoder is installed inside motor 1, which, together with the vertically mounted second displacement sensor 8, forms a closed-loop control system to ensure the vertical displacement accuracy of the adsorption unit 5 and the substrate.

[0059] It should be noted that in actual working conditions, there is an unavoidable backlash between the external thread of the ball screw 23 in the first transmission unit 2 and the internal thread of the transmission nut (not shown), resulting in an error (or deviation) between the actual vertical displacement of the substrate and the preset displacement. Based on this, this application adjusts the vertical displacement of the transmission mechanism 100 according to the vertical displacement data of the substrate collected by the second displacement sensor 8 to compensate for the vertical positional deviation of the substrate. Specifically, the second displacement sensor 8 includes a grating ruler body 81 and a grating ruler reading head 82. The grating ruler body 81 is mounted on the bracket 31 of the second transmission unit 3 in the transmission mechanism 100. The encoder of the motor 1, together with the grating ruler body 81 and the grating ruler reading head 82, forms a closed-loop control system that collects the vertical displacement data of the second transmission unit 3 in real time as the vertical displacement data of the substrate, thereby enabling high-precision detection and compensation of the vertical displacement of the substrate, ensuring the vertical displacement accuracy of the substrate.

[0060] Furthermore, in actual working conditions, due to the unavoidable gap between the linear guide 21 and the slider 22 in the first transmission unit 2, the transmission mechanism 100 inevitably causes the substrate to move in the horizontal direction when it drives the substrate to move in the vertical direction. Based on this, this application can detect the horizontal displacement of the substrate in a timely manner by collecting the horizontal displacement data of the substrate from the first displacement sensor 7, and thus can perform high-precision compensation for the horizontal displacement of the upper substrate by adjusting the position of the motion table (and the lower substrate on the motion table).

[0061] In some embodiments, see Figure 1 , Figure 2 As shown, the bonding head also includes a supporting outer frame 6, which supports the transmission mechanism 100, the elastic mechanism 200, and the measuring mechanism 300 in the bonding head.

[0062] In some embodiments, see Figure 3 As shown, the pressure head 33 has a hemispherical structure 331 formed on the side near the elastic unit 4, and the hemispherical structure 331 abuts against the elastic unit 4. Pressure is transmitted to the elastic unit 4 through the hemispherical structure 331 of the pressure head 33, causing the elastic unit 4 to undergo elastic deformation in the vertical direction, thereby displacing the adsorption unit 5 (and the substrate) in the vertical direction. Through the synergistic effect of the hemispherical structure 331 and the elastic unit 4 below it, the transmission effect is prevented from jamming, and the pressure distribution on the contact surface is made more uniform, helping to reduce local stress concentration and lower the risk of substrate damage. Furthermore, due to the symmetrical characteristics of the hemispherical structure 331, the substrate is better able to remain horizontal during vertical movement.

[0063] In some embodiments, see Figure 3 As shown ( Figure 3 (Adsorption unit 5 not shown) The elastic unit 4 includes a connecting unit 41 and an elastic element 42. The adsorption unit 5 is connected to the elastic element 42 via the connecting unit 41. The number of elastic elements 42 can be single or multiple. The connecting unit 41 and the elastic element 42 can be connected and fixed by fasteners (e.g., screws).

[0064] Among them, see Figure 3As shown, when there are two elastic elements 42, the structure of the elastic unit 4 is as follows: The two elastic elements 42 are arranged perpendicularly to each other. The connecting members in the connecting unit 41 include a first connecting member 411, a second connecting member 412, and a third connecting member 413. The support plates in the connecting unit 41 include a first support plate 414 and a second support plate 415. The first connecting member 411 is vertically connected to the hemispherical structure 331 of the pressure head 33 and the elastic element 42 away from the adsorption unit 5 (i.e., the upper elastic element 42). The third connecting member 413 is vertically connected to the elastic element 42 close to the adsorption unit 5 (i.e., the lower elastic element 42) and the adsorption unit 5. The second connecting member 412 is disposed between and connected to the two elastic elements 42. The first support plate 414 and the second support plate 415 are hollow structures. The first support plate 414 is used to support the upper elastic element 42, and the second support plate 415 is used to support the lower elastic element 42. The number of support plates corresponds to the number of elastic elements 42. By using two elastic elements 42, the pressure transmitted from above can be distributed more evenly. This reduces the risk of damage to a single elastic element 42 due to excessive stress, thus improving the stability of the bonding head. Furthermore, it makes the force applied to the substrate surface more uniform, thereby improving bonding quality. In addition, using two elastic elements 42 increases the overall rigidity of the elastic elements, reducing the possibility of horizontal displacement of the substrate due to vertical movement. Moreover, the two elastic elements 42 can have different stiffnesses; by combining elastic elements 42 with different stiffnesses, a wider range of elasticity can be achieved to meet different mechanical requirements. It is understood that the number of elastic elements is not limited to this and can be selected according to actual needs.

[0065] In some embodiments, see Figure 4 As shown ( Figure 4 (Adsorption unit 5 not shown) When there is only one elastic element 42, the structure of the elastic unit 4 is as follows. The connecting elements in the connecting unit 41 include a first connecting element 411 and a third connecting element 413, and the support plate in the connecting unit 41 includes a first support plate 414. The first support plate 414 is a hollow structure. The first connecting element 411 is vertically connected to the hemispherical structure 331 of the pressure head 33 and the elastic element 42, respectively. The third connecting element 413 is vertically connected to the elastic element 42 and the adsorption unit 5, respectively. By providing one elastic element 42, the volume of the bonding head can be reduced.

[0066] In some embodiments, see Figure 5As shown, the elastic element 42 includes an elastic element body 421 and multiple elastic arms 422, which are connected to the inner edge of the elastic element body 421. The multiple elastic arms 422 are symmetrically distributed along a diagonal, and their intersection points converge at the geometric center of the elastic element 42, which is also the intersection of the diagonals. In this configuration, the relatively long length of each elastic arm reduces the force required for deformation, facilitating the bonding action. Simultaneously, the symmetrical distribution of the multiple elastic arms 422 ensures a more uniform force distribution on the surface of the elastic element 42, resulting in a more uniform force transmitted to the substrate. The elastic arms 422 undergo elastic deformation in the vertical direction under the pressure of the pressure head 33. A through hole 423 is provided at the center of the elastic element 42, through which it is fixed to the connecting unit 41.

[0067] In some embodiments, see Figure 6 As shown, the elastic element 42 includes an elastic element body 421 and multiple elastic arms 422, which are connected to the inner edge of the elastic element body 421. The multiple elastic arms 422 are symmetrically distributed in a right-hand cross shape, and their intersection points converge at the geometric center of the elastic element 42, which is also a cross intersection point. The advantage of this type of elastic element is its simple manufacturing process and ease of processing. In this embodiment, the elastic element 42 also has through holes (not shown) for fixed connection with the connecting unit, which will not be described in detail here.

[0068] In some embodiments, see Figure 7 As shown, based on the second embodiment of the elastic element described above, an arched structure 424 is provided on the elastic arm 422. By providing the arched structure 424, the length of the elastic arm 422 is increased while the overall size of the elastic element 42 remains unchanged. Therefore, the elastic force of the elastic arm 422 can be enhanced, thereby enabling the substrate to move over a wider range, which is beneficial for bonding operations. In this embodiment, the elastic element 42 also has a through hole (omitted from the figure) for fixed connection with the connecting unit, which will not be described in detail here. It should be noted that the arched structure can also be provided on the elastic arm based on the first embodiment of the elastic element described above.

[0069] In some embodiments, see Figure 1 As shown, the adsorption unit 5 includes a suction cup adapter plate 51 and a suction cup 52 connected to each other. The suction cup adapter plate 51 is connected to the third connector 413, and the suction cup adapter plate 51 is located below the third connector 413. The suction cup adapter plate 51 is used to drive the suction cup 52 to generate displacement, and the suction cup 52 is used to adsorb the substrate and drive the substrate to generate displacement.

[0070] In some embodiments, see Figure 1As shown, the first displacement sensor 7 is set around the suction cup adapter plate 51 via a bracket plate (not shown) to collect the displacement data of the suction cup adapter plate 51 in the horizontal direction as the displacement data of the substrate in the horizontal direction.

[0071] In the embodiments of this application, the upper and lower substrates can be a chip and a wafer, respectively. However, it should be noted that the lower substrate can also be a chip or a PCB board. Furthermore, the embodiments of this application are not limited to the accompanying drawings, but also include combinations of the above embodiments.

[0072] This application provides a bonding apparatus, the bonding apparatus comprising:

[0073] The bonding head as described in any of the above embodiments is used to adsorb the upper substrate and drive the upper substrate to move.

[0074] A motion table is used to support and move the lower substrate.

[0075] The control module is used to control the movement of the bonding head and the motion table.

[0076] This application provides a bonding method, see the following embodiments. Figure 8 As shown, it includes:

[0077] S101: Drive the bonding head in the bonding device described above to move along the thickness direction of the upper substrate;

[0078] S102: Obtain the displacement data of the upper substrate in the direction perpendicular to its thickness, the displacement data of the upper substrate in its thickness direction, and the bonding force data;

[0079] S103: Based on the obtained displacement data of the upper substrate in the direction perpendicular to its thickness, the displacement data of the upper substrate in its thickness direction, and the bonding force data, adjust the movement of the bonding head and the motion table and the magnitude of the bonding force until the bonding requirements are met.

[0080] S104: Perform bonding between the upper and lower substrates.

[0081] This application provides a storage medium storing computer instructions, which, when executed by a processor, implement the steps described in the bonding method above.

[0082] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0083] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0084] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A bonding head, characterized in that, include: An elastic mechanism includes an elastic unit and an adsorption unit connected together. The elastic unit is used to drive the adsorption unit to generate displacement under pressure. The adsorption unit is used to adsorb the substrate and drive the substrate to generate displacement. The transmission mechanism includes a motor, a first transmission unit, and a second transmission unit. The first transmission unit is connected to both the motor and the second transmission unit. The motor drives the first transmission unit, which in turn drives the second transmission unit. The second transmission unit transmits pressure to the elastic unit, causing the elastic unit to displace the adsorption unit. The second transmission unit includes a force sensor, which is used to collect the force applied to the substrate. The measuring mechanism includes a first displacement sensor and a second displacement sensor. The first displacement sensor is used to collect displacement data of the substrate in the direction perpendicular to its thickness, and the second displacement sensor is used to collect displacement data of the substrate in the direction of its thickness. The first transmission unit includes a ball screw and a linear guide assembly; The second transmission unit further includes a pressure head, which is connected to the force sensor and the elastic unit respectively; the pressure head has a hemispherical structure on the side near the elastic unit, and the hemispherical structure abuts against the elastic unit; The elastic unit includes an elastic element, which includes an elastic element body and multiple elastic arms. The multiple elastic arms are distributed diagonally or in a cross-shaped symmetrical arrangement. The plurality of elastic arms are connected to the inner edge of the elastic body.

2. The bonding head according to claim 1, characterized in that, The second transmission unit also includes a bracket; The bracket is connected to the first transmission unit and the force sensor respectively; The force sensor is located between the bracket and the pressure head.

3. The bonding head according to claim 1, characterized in that, The elastic unit includes a connecting unit; The adsorption unit is connected to the elastic element via the connecting unit.

4. The bonding head according to claim 3, characterized in that, When there are multiple elastic elements, the connecting unit includes multiple connectors and multiple support plates; the support plates are hollow structures. Each support plate is located on the side of each elastic element closest to the adsorption unit and supports the elastic element. Multiple elastic elements are connected and fixed to the connecting unit along the thickness direction of the substrate; The number of support plates corresponds to the number of elastic elements.

5. The bonding head according to claim 3, characterized in that, When the number of elastic elements is one, the connecting unit includes multiple connectors and a support plate; the support plate has a hollow structure. The support plate is located on the side of the elastic element closer to the adsorption unit and supports the elastic element. The elastic element is connected to and fixed to the connecting unit along the thickness direction of the substrate.

6. The bonding head according to claim 1, characterized in that, The elastic arm is provided with an arched structure.

7. The bonding head according to any one of claims 1 to 5, characterized in that, The adsorption unit includes a suction cup adapter plate and a suction cup. One side of the suction cup adapter plate is connected to the elastic unit, and the other side is connected to the suction cup. The first displacement sensor is used to detect the displacement of the adsorption unit in the direction perpendicular to the thickness of the substrate.

8. The bonding head according to any one of claims 1 to 5, characterized in that, The second displacement sensor is fixedly installed on the second transmission unit; The second displacement sensor includes a grating ruler body and a grating ruler reading head, used to detect the displacement of the adsorption unit in the substrate thickness direction.

9. A bonding device, characterized in that, The bonding device includes: The bonding head as described in any one of claims 1 to 8 is used to adsorb the upper substrate and drive the upper substrate to move; A motion table is used to support and move the lower substrate. A control module is used to control the bonding head and the motion table.

10. A bonding method, characterized in that, Includes the following steps: Drive the bonding head in the bonding apparatus as described in claim 9 to move along the thickness direction of the upper substrate; Acquire the displacement data of the upper substrate in the direction perpendicular to its thickness, the displacement data of the upper substrate in its thickness direction, and the bonding force data; Based on the obtained displacement data of the upper substrate in the direction perpendicular to its thickness, the displacement data of the upper substrate in its thickness direction, and the bonding force data, the movement of the bonding head and the motion stage, as well as the magnitude of the bonding force, are adjusted until the bonding conditions are met. Perform bonding between the upper and lower substrates.

11. A storage medium, characterized in that, It stores computer instructions that, when executed by a processor, implement the steps of the method of claim 10.

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