A chip mounter

Abstract

The application relates to the technical field of semiconductor devices, in particular to a chip mounting machine which comprises a mounting machine body, a bearing disc rotatably arranged above the mounting machine body, a substrate arranged in a circumferential array on the upper end surface of the bearing disc, a feeding disc rotatably arranged above the mounting machine body, a plurality of groups of DAF chip films arranged on the upper end surface of the feeding disc, an L-shaped support rotatably arranged above the mounting machine body, an electric telescopic column mounted at the bottom end of the L-shaped support, and a vacuum chuck mounted at the telescopic end of the electric telescopic column; so that the substrate and the vacuum chuck are located on the same vertical plane, thereby facilitating the complete pressing of the DAF chip films into the substrate, avoiding the problem that the DAF chip films and the substrate are difficult to combine due to the deflection of the DAF chip films and the substrate in the prior art, and continuously mounting the substrate and the DAF chip films under the rotation of the bearing disc, so that the operation is relatively convenient and fast.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor devices, in particular to a chip mounting machine. BACKGROUND

[0002] The chip mounting machine is a key equipment in the semiconductor packaging production line, which has a very wide application in chip packaging. The purpose of the chip mounting machine is to fix the chip cut by grinding and scratching on the substrate, so as to facilitate the subsequent process operation, which is an important process of packaging and affects the whole chip packaging. The function is to produce a firm physical connection between the chip and the packaging body, produce a conductive or insulating connection between the chip and the packaging body, provide heat conduction and buffer absorption of internal stress.

[0003] The prior art also proposes some solutions, such as a chip mounting machine disclosed in a Chinese patent with publication number CN206388690U, which comprises a device main body, a chip suction device arranged on the device main body, and a cleaning device for cleaning the suction head of the chip suction device. The cleaning device is arranged on the path of the suction head returning along the second direction, and the cleaning part automatically cleans the suction head during the return of the suction head along the second direction. This solution solves the problem of time-consuming and laborious manual cleaning of the suction head, realizes automatic cleaning operation, and improves work efficiency.

[0004] Although the above technical solution can automatically clean the suction head, there are still other problems in specific use, such as when mounting the chip on the substrate and the DAF chip film, the DAF chip film needs to be pressed into the groove of the substrate, so the DAF chip film and the substrate need to be located on the same axis. However, due to the vibration of the chip mounting machine itself, the substrate may be displaced, which affects the mounting of the two.

[0005] Therefore, the present application provides a chip mounting machine. SUMMARY

[0006] To solve the above technical problems, the present application provides a chip mounting machine, which comprises a chip mounting machine main body, a bearing disc rotatably arranged above the chip mounting machine main body, a plurality of substrates arranged in a circumferential array on the upper end surface of the bearing disc, a feeding disc rotatably arranged above the chip mounting machine main body, a plurality of groups of DAF chip films arranged on the upper end surface of the feeding disc, an L-shaped support rotatably arranged above the chip mounting machine main body, an electric telescopic column mounted at the bottom end of the L-shaped support, a vacuum suction disc mounted at the telescopic end of the electric telescopic column, the vacuum suction disc being used for adsorbing the DAF chip film and transferring it to the inside of the substrate through the L-shaped support, and an electric heating plate arranged above the chip mounting machine main body and below the L-shaped support.

[0007] In one embodiment of the present application, the outer circumferential surface of the bearing disc is fixedly provided with a plurality of groups of contact points I, each group of contact points I is in one-to-one correspondence with each substrate, the upper portion of the chip mounter body is provided with a mounting rack, the end portion of the mounting rack is provided with contact points II, the contact points I and the contact points II are designed on the same plane, and the bearing disc is in contact with the contact points II during rotation of the contact points I.

[0008] In one embodiment of the present application, the upper end surface of the bearing disc is provided with a plurality of groups of placement frames, the inner portion of each group of placement frames is slidably provided with an attaching plate, the substrate is placed in the inner portion of the placement frame, and the attaching plate is used to fix the substrate.

[0009] In one embodiment of the present application, the inner side of each group of placement frames is provided with an electric push column, the attaching plate is mounted on the telescopic end of the electric push column, the inner side of the placement frame is provided with a temporary storage plate, the temporary storage plate is slidably arranged on the upper end surface of the bearing disc, the outer side of the bearing disc is provided with a collection unit, and the collection unit is used to collect the chips after die mounting; during operation, when the substrate is placed in the inner portion of the placement frame, the substrate is placed above the temporary storage plate, then the controller controls the movement of the electric push column, so that the electric push column drives the attaching plate to move, and the attaching plate can fix the substrate, the operation is relatively convenient, and the chips after die mounting can be automatically collected under the action of the subsequent collection unit.

[0010] In one embodiment of the present application, the collection unit comprises a plurality of penetration grooves, the penetration grooves are respectively arranged below each substrate, the diameter of the penetration grooves is greater than the diameter of the substrate, the upper portion of the chip mounter body is provided with contact points III through a support, and the telescopic end of the electric push column is connected with the side wall of the temporary storage plate through a support rod; during operation, when one of the substrates is completed after die mounting, the bearing disc is driven to rotate again by the controller, the bearing disc drives the substrate after die mounting to rotate, when the contact points I and the contact points II on the outer side of the subsequent substrate are in contact, the contact points I on the outer side of the substrate after die mounting are also in contact with the contact points III at this time, then the contact points III transmit the electrical signal to the controller, the controller controls the two electric push columns and the attaching plate to move away from the substrate, that is, the electric push column also drives the temporary storage plate to move away from the lower portion of the substrate after die mounting through the support rod, when the two temporary storage plates completely move away from the lower portion of the substrate, since the diameter of the penetration grooves is greater than the diameter of the substrate, the substrate after die mounting falls along the penetration grooves into the recycling seat below, so that the substrate after die mounting is automatically recycled.

[0011] In one embodiment of the present application, the lower end face of the temporary storage plate is provided with a limiting post, and the upper end face of the bearing disc is provided with a post-shaped groove matched with the limiting post; during operation, when the temporary storage plate moves, the limiting post moves simultaneously, and the limiting post moves under the limitation of the post-shaped groove on the surface of the bearing disc, so that the temporary storage plates on both sides are completely away from the lower side of the substrate on which the chips are mounted, and the recycling of the substrate on which the chips are mounted is facilitated

[0012] In one embodiment of the present application, the upper side of the chip mounting machine body is provided with a fixed support, the inner side of the fixed support is provided with a transmission table, the transmission table is composed of a conveying belt and a transmission roller, the upper end face of the transmission table is provided with a plurality of groups of DAF chip films, the upper end face of the feeding disc is provided with a suction hole, the suction hole is provided with a suction pipe inside, the suction pipe is connected with an external air pump, one group of the DAF chip films is located above the suction hole, and the edge of the transmission table is provided with the suction hole in correspondence.

[0013] In one embodiment of the present application, the upper end face of the feeding disc is provided with a storage circular groove, the shape of the storage circular groove is matched with the shape of the DAF chip film, and the suction hole is arranged at the center of the storage circular groove.

[0014] In one embodiment of the present application, the upper side of the chip mounting machine body is provided with a vertical shaft one, the bottom end of the vertical shaft one is connected with the output end of a motor, the top end of the vertical shaft one is provided with a disc, and the end of the L-shaped support is arranged on the upper end face of the disc; during operation, the disc drives the L-shaped support and the electric telescopic column to rotate forward and reverse through the motor, so that the feeding of the DAF chip film is facilitated.

[0015] In one embodiment of the present application, the outer circumferential surface of the vertical shaft one is provided with a limiting plate one and a limiting plate two, the limiting plate one and the limiting plate two are designed in a separated mode, the side wall of the chip mounting machine body is provided with a limiting post one and a limiting post two, and the limiting post one and the limiting post two are designed in correspondence with the limiting plate one and the limiting plate two, respectively.

[0016] The above technical scheme of the present application has the following advantages compared with the prior art:

[0017] The chip mounting machine disclosed by the application, through rotating the substrate on which the mounting is completed by the bearing disc, when the corresponding contact one and contact two outside the subsequent substrate contact, at this time, the contact one outside the substrate on which the mounting is completed also just contacts the contact three, then the contact three will transmit the electrical signal to the controller, the controller will control the two electric push columns and the attaching plate to move away from the substrate, that is, the electric push column will also drive the temporary storage plate to move away from the lower side of the substrate on which the mounting is completed through the support rod, when the temporary storage plates on both sides completely move away from the lower side of the substrate, since the diameter of the penetrating groove is larger than the diameter of the substrate, the substrate on which the mounting is completed will fall along the penetrating groove into the recycling seat below, so that the automatic recycling of the substrate on which the mounting is completed is realized.

[0018] The chip mounting machine disclosed by the application can ensure that the DAF chip film is located in the storage circular groove under the suction force of the suction hole, and avoid the problem that the DAF chip film is displaced due to external wind force. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to make the content of the application more easily understood, the application will be further described in detail below according to the specific embodiments of the application and in combination with the drawings.

[0020] Figure 1 is a three-dimensional structure schematic diagram of the application;

[0021] Figure 2 is a bearing disc partial structure schematic diagram of the application;

[0022] Figure 3 is a top view structure schematic diagram of the application;

[0023] Figure 4 is an electric telescopic column partial structure schematic diagram of the application;

[0024] Figure 5 is an electric heating plate partial structure schematic diagram of the application;

[0025] Figure 6 is an attaching plate partial structure schematic diagram of the application;

[0026] Figure 7 is a vertical shaft partial structure schematic diagram of the application;

[0027] Figure 8 is a feeding disc partial structure schematic diagram of the application;

[0028] Figure 9 is a transmission table partial structure schematic diagram of the application;

[0029] Figure 10 is a limit plate one and limit plate two partial structure schematic diagram of the application.

[0030] The description of the drawings is as follows: 1, the main body of the chip mounting machine; 101, the feeding disc; 102, the electric heating plate; 2, the bearing disc; 3, the base plate; 4, the DAF chip film; 5, the L-shaped support; 501, the electric telescopic column; 6, the vacuum chuck; 7, the contact one; 8, the mounting frame; 801, the contact two; 9, the placing frame; 10, the attaching plate; 11, the electric push column; 12, the temporary storage plate; 13, the penetration slot; 14, the contact three; 15, the limiting column; 16, the fixed support; 17, the transmission table; 18, the adsorption hole; 181, the storage circular groove; 19, the vertical shaft one; 20, the disc; 21, the limiting plate one; 22, the limiting plate two; 211, the limiting column one; 221, the limiting column two; DETAILED DESCRIPTION

[0031] The present application will be further described below in conjunction with the drawings and specific embodiments, so that those skilled in the art can better understand the present application and implement it, but the embodiments are not as a limitation on the present application.

[0032] Reference Figures 1 to 5 As shown in the drawings, the chip mounting machine described in the embodiments of the present application comprises a chip mounting machine main body 1, a bearing disc 2 is rotatably arranged above the chip mounting machine main body 1, a plurality of base plates 3 arranged in a circumferential array are placed on the upper end surface of the bearing disc 2, a feeding disc 101 is rotatably arranged above the chip mounting machine main body 1, a plurality of groups of DAF chip films 4 are arranged on the upper end surface of the feeding disc 101, an L-shaped support 5 is rotatably arranged above the chip mounting machine main body 1, an electric telescopic column 501 is mounted at the bottom end of the L-shaped support 5, a vacuum chuck 6 is mounted at the telescopic end of the electric telescopic column 501, the vacuum chuck 6 is used to adsorb the DAF chip film 4 and transfer it to the inside of the base plate 3 through the L-shaped support 5, an electric heating plate 102 is arranged above the chip mounting machine main body 1 and below the L-shaped support 5, and a groove matched with the base plate 3 is arranged above the bearing disc 2.

[0033] In specific work, the base plates 3 are placed in a circumferential array on the upper end surface of the bearing disc 2, and when one of the base plates 3 is located on the same vertical plane as the vacuum chuck 6, the positions of the vacuum chuck 6 and the L-shaped support 5 are the initial positions, then the electric heating plate 102 is controlled to preheat the corresponding base plate 3, the telescopic end of the electric telescopic column 501 is controlled to move downward, so that the electric telescopic column 501 drives the vacuum chuck 6 and the DAF chip film 4 to move downward, then the DAF chip film 4 is pressed into the corresponding base plate 3, the temperature of the preheated base plate 3 and the pressure of the electric telescopic column 501 can make the DAF adhere to the base plate 3 as soon as possible, then the heating of the electric heating plate 102 is stopped and the base plate 3 is cooled, that is, the chip mounting process is completed; after the process is completed, the vacuum chuck 6 is controlled not to adsorb the DAF chip film 4, and the vacuum chuck 6 is driven by the electric telescopic column 501 to move upward, away from the completed chip, and the process is completed.

[0034] Thus designed, the substrate 3 can be stably positioned above the carrier disc 2 and in the same vertical plane as the vacuum chuck 6, facilitating the complete pressing of the DAF chip film 4 into the substrate 3 and avoiding the problem that the substrate 3 may be displaced in the prior art, making it difficult to combine with the DAF chip film 4. Moreover, under the rotation of the carrier disc 2, the substrate 3 and the DAF chip film 4 can be continuously loaded, which is relatively convenient and fast. In addition, since the upper end of the carrier disc 2 is provided with a groove matching the substrate 3, the upper end of the carrier disc 2 can limit and fix each substrate 3, avoiding the problem that the vibration of the loading machine itself may cause the displacement of the substrate 3.

[0035] Referring to Figures 1 to 5 As shown in the drawings, the outer periphery of the carrier disc 2 is fixedly provided with a plurality of groups of contact points one 7, each group of contact points one 7 corresponding to each substrate 3. The upper end of the loading machine main body 1 is provided with a mounting rack 8, and the end of the mounting rack 8 is provided with contact points two 801. The contact points one 7 and the contact points two 801 are designed on the same plane. During the rotation of the carrier disc 2 driving the contact points one 7, the carrier disc 2 will contact the contact points two 801.

[0036] When the carrier disc 2 drives the substrate 3 to rotate, the carrier disc 2 will move towards the side close to the contact points two 801 during the synchronous rotation of the contact points one 7, because each substrate 3 is provided with a corresponding contact point one 7. When the contact points one 7 contact the contact points two 801, the circuit is connected, which will transmit electrical signals to the controller through the power line, and the controller will control the carrier disc 2 to stop rotating. At this time, one of the substrates 3 has just moved to the lower side of the vacuum chuck 6, i.e., one of the substrates 3 is located on the same vertical axis as the vacuum chuck 6. Then, the substrate 3 and the DAF chip film 4 can be loaded by moving down the extension end of the above-mentioned electric telescopic column 501. In this way, the substrate 3 and the DAF chip film 4 can be prevented from being skewed, making it difficult to combine and load.

[0037] Referring to Figures 2 to 6 As shown in the drawings, the upper end of the carrier disc 2 is provided with a plurality of groups of placing frames 9, and the inside of each placing frame 9 is slidably provided with an attaching plate 10. The substrate 3 is placed in the placing frame 9, and the attaching plate 10 is used to fix the substrate 3. The material of the attaching plate 10 is elastic rubber. Figure 2 As shown in the drawings, each substrate 3 is placed in the placing frame 9, and under the fixation of the attaching plate 10, the stability of the subsequent combination of the DAF chip film 4 and the substrate 3 can be improved, avoiding the problem that the substrate 3 may be displaced under the pressure of the electric telescopic column 501.

[0038] The inner side of each group of the placing frame 9 is provided with an electric push column 11, the attaching plate 10 is installed at the telescopic end of the electric push column 11, the inner side of the placing frame 9 is provided with a temporary storage plate 12, the temporary storage plate 12 is slidingly arranged on the upper end surface of the bearing disc 2, the outer side of the bearing disc 2 is provided with a collecting unit for collecting the chips with the wafer mounted, when the substrate 3 is placed in the placing frame 9, the substrate 3 is placed above the temporary storage plate 12, then the controller controls the electric push column 11 to move, so that the electric push column 11 drives the attaching plate 10 to move, the attaching plate 10 can fix the substrate 3, the operation is more convenient, and the chips with the wafer mounted can be automatically collected under the action of the subsequent collecting unit.

[0039] Referring to Figures 2 to 8 The collecting unit includes a penetrating groove 13, the penetrating groove 13 is opened in multiple groups and is arranged below each substrate 3, the diameter of the penetrating groove 13 is greater than the diameter of the substrate 3, the upper side of the wafer mounting machine body 1 is provided with a contact three 14 through a support, and the telescopic end of the electric push column 11 is connected with the side wall of the temporary storage plate 12 through a support rod; when one of the substrates 3 is completed, the bearing disc 2 is driven to rotate again by the controller, the bearing disc 2 drives the substrate 3 with the wafer mounted to rotate, when the contact one 7 on the outer side of the substrate 3 with the wafer mounted contacts the contact two 801, the contact one 7 on the outer side of the substrate 3 with the wafer mounted contacts the contact three 14 at this time, then the contact three 14 transmits the electric signal to the controller, the controller controls the two electric push columns 11 and the attaching plate 10 to move away from the substrate 3, that is, the electric push column 11 also drives the temporary storage plate 12 to move away from the lower side of the substrate 3 with the wafer mounted through the support rod, when the two temporary storage plates 12 completely move away from the lower side of the substrate 3, because the diameter of the penetrating groove 13 is greater than the diameter of the substrate 3, the substrate 3 with the wafer mounted falls along the penetrating groove 13 and falls into the recycling seat below, so that the substrate 3 with the wafer mounted is automatically recycled.

[0040] The lower end surface of the temporary storage plate 12 is provided with a limiting column 15, and the upper end surface of the bearing disc 2 is provided with a column-shaped groove matched with the limiting column 15; when the temporary storage plate 12 moves, the temporary storage plate 12 drives the limiting column 15 to move, the limiting column 15 moves under the limitation of the column-shaped groove on the surface of the bearing disc 2, so that the two temporary storage plates 12 can completely move away from the lower side of the substrate 3 with the wafer mounted, which is beneficial to the recycling of the substrate 3 with the wafer mounted.

[0041] Referring to Figures 3 to 10As shown, the upper part of the film mounting machine body 1 is provided with a fixed support 16, the inner side of the fixed support 16 is provided with a conveying table 17, the conveying table 17 is composed of a conveying belt and a transmission roller, the upper end surface of the conveying table 17 is provided with a plurality of groups of DAF chip films 4, the upper end surface of the feeding disc 101 is provided with a suction hole 18, the inside of the suction hole 18 is provided with a suction pipe, the suction pipe is connected with an external air pump, one group of the DAF chip films 4 is located above the suction hole 18, and the edge of the conveying table 17 is correspondingly arranged with the suction hole 18. Figure 9 As shown, the DAF chip film 4 which has not been mounted can be transported to the corresponding suction hole 18 above the feeding disc 101 through the conveying table 17, the suction hole 18 is in a negative pressure state through the external air pump and the suction pipe, so that the DAF chip film 4 which has not been mounted can be temporarily adsorbed on the surface of the feeding disc 101;

[0042] When the DAF chip film 4 below the vacuum suction cup 6 is mounted, the L-shaped support 5 is controlled to rotate close to the feeding disc 101, when the L-shaped support 5 moves to the position corresponding to the suction hole 18, the rotation of the L-shaped support 5 is stopped, then the electric telescopic column 501 is controlled to move downward, so that the electric telescopic column 501 drives the vacuum suction cup 6 to move to one side of the DAF chip film 4 above the suction hole 18, then the vacuum suction cup 6 can adsorb the DAF chip film 4, then the L-shaped support 5 is controlled to move to the initial position, so that the substrate 3 can be continuously mounted and the DAF chip film 4 can be continuously fed.

[0043] It should be noted that the suction force of the vacuum suction cup 6 is much greater than the negative pressure of the suction hole 18, so that the vacuum suction cup 6 can directly adsorb the DAF chip film 4; it should be further noted that when there is a DAF chip film 4 above the suction hole 18, the conveying table 17 is stopped at this time, when the DAF chip film 4 above the suction hole 18 is taken away, the conveying table 17 starts to rotate at this time, and the DAF chip film 4 above the conveying table 17 is transported to one side of the suction hole 18 below, since the edge of the conveying table 17 is correspondingly arranged with the suction hole 18, the DAF chip film 4 above the conveying table 17 can just fall to one side of the suction hole 18.

[0044] The upper end surface of the feeding disc 101 is provided with a storage circular groove 181, the shape of the storage circular groove 181 is matched with the shape of the DAF chip film 4, and the suction hole 18 is arranged at the center of the storage circular groove 181; when the conveying table 17 transports the DAF chip film 4 at the edge thereof to above the feeding disc 101, if the DAF chip film 4 can just fall into the inside of the storage circular groove 181, under the action of the suction force of the suction hole 18, the DAF chip film 4 can be ensured to be located in the storage circular groove 181, so as to avoid the problem that the DAF chip film 4 is displaced due to external wind force;

[0045] If the DAF chip film 4 does not fall completely into the storage groove 181, the suction force of the adsorption hole 18 can slowly and completely adsorb the DAF chip film 4 into the storage groove 181, which can have a certain correction effect on the position of the DAF chip film 4 and improve the subsequent adsorption docking between the vacuum chuck 6 and the DAF chip film 4.

[0046] A vertical shaft 19 is rotatably mounted on the top of the main body 1 of the loading machine. The bottom end of the vertical shaft 19 is connected to the output end of the motor, and a disc 20 is mounted on the top end of the vertical shaft 19. The end of the L-shaped bracket 5 is mounted on the upper surface of the disc 20. During operation, the motor drives the vertical shaft 19 and the disc 20 to rotate forward and backward, and the disc 20 can drive the L-shaped bracket 5 and the electric telescopic column 501 to rotate forward and backward, which facilitates the loading of DAF chip film 4.

[0047] Limiting plate 21 and limiting plate 22 are installed on the outer circumferential surface of the vertical shaft 19. Limiting plate 21 and limiting plate 22 are designed separately. Limiting post 211 and limiting post 221 are installed on the side wall of the main body 1 of the loading machine. Limiting post 211 and limiting post 221 correspond to limiting plate 21 and limiting plate 22, respectively. During operation, in the initial state, the end of limiting post 211 contacts the side wall of limiting plate 21, while limiting post 221 and limiting plate 22 do not contact each other. (Refer to the attached...) Figure 10 As shown in the figure; when the disc 20 drives the L-shaped bracket 5 to rotate towards the side closer to the feeding disc 101, the disc 20 will simultaneously drive the vertical shaft 19 and the limiting plate 22 to rotate. When the limiting plate 22 contacts the end of the limiting post 221, the vacuum suction cup 6 is just on the same vertical axis as the adsorption hole 18. At this time, the rotation of the vertical shaft 19 is stopped, and the DAF chip film 4 on the adsorption hole 18 is grasped through the above steps.

[0048] After the DAF chip film 4 is gripped, when the vertical axis 19 moves the disk 20 and the L-shaped bracket 5 closer to the substrate 3, and the ends of the limiting plate 21 and the limiting post 211 come into contact, the vacuum chuck 6 is exactly on the same vertical axis as the substrate 3. This facilitates its bonding with the substrate 3. This design ensures that the vacuum chuck 6 can be adsorbed to the center of the DAF chip film 4, and also makes it easy for the DAF chip film 4 to bond with the substrate 3, thus improving the wafer loading efficiency.

[0049] Working principle: the substrates 3 are placed in a circumferential array on the upper end face of the bearing disc 2, and when a group of substrates 3 are located in the same vertical plane as the vacuum chuck 6, the positions of the vacuum chuck 6 and the L-shaped support 5 are the initial positions, then the electric heating plate 102 is controlled to preheat the substrate 3 corresponding thereto, and then the telescopic end of the electric telescopic column 501 is controlled to move downward, so that the electric telescopic column 501 drives the vacuum chuck 6 and the DAF chip film 4 to move downward, and then the DAF chip film 4 is pressed into the inside of the substrate 3 corresponding thereto, and the preheating temperature of the substrate 3 and the pressure of the electric telescopic column 501 can make the DAF adhere to the substrate 3 as soon as possible, then the heating of the electric heating plate 102 is stopped, and the substrate 3 is cooled, that is, the chip mounting process is completed; when the process is completed, the vacuum chuck 6 is controlled not to adsorb the DAF chip film 4, and the electric telescopic column 501 drives the vacuum chuck 6 to move upward, away from the completed chip, and the process is completed;

[0050] When the bearing disc 2 drives the substrates 3 to rotate, since one side of each substrate 3 is provided with a contact one 7, during the synchronous rotation of the bearing disc 2 driving the contact one 7, the bearing disc 2 will move to the side close to the contact two 801, when the contact one 7 contacts the contact two 801, at this time the circuit is connected, which will transmit the electrical signal to the controller through the power line, and the controller will control the bearing disc 2 to stop rotating, and at this time one of the substrates 3 has just moved to the lower side of the vacuum chuck 6, that is, one of the substrates 3 is located in the same vertical axis as the vacuum chuck 6, and then the telescopic end of the above-mentioned electric telescopic column 501 is controlled to move downward, so as to realize the mutual mounting of the substrate 3 and the DAF chip film 4, which can avoid the problem that the substrate 3 and the DAF chip film 4 are inclined and difficult to combine and mount, and the mounting machine in the embodiment of the application is automatic;

[0051] When one of the substrates 3 is completed, the carrier disc 2 is rotated again by the controller, and the substrate 3 with the completed chip is rotated by the carrier disc 2. When the subsequent substrate 3 outside corresponds to the contact one 7 and the contact two 801, at this time, the contact one 7 outside the substrate 3 with the completed chip is just in contact with the contact three 14. After that, the contact three 14 will transmit the electrical signal to the controller, and the controller will control the two electric push columns 11 and the attachment plate 10 to move away from the substrate 3. That is, the electric push column 11 will also drive the temporary storage plate 12 through the support rod to move away from the bottom of the substrate 3 with the completed chip. When the temporary storage plates 12 on both sides completely move away from the bottom of the substrate 3, since the diameter of the penetration slot 13 is greater than the diameter of the substrate 3, the substrate 3 with the completed chip will fall along the penetration slot 13 to the recycling seat below, thereby realizing automatic recycling of the substrate 3 with the completed chip.

[0052] When the DAF chip film 4 below the vacuum chuck 6 is completed, the L-shaped support 5 is controlled to rotate close to the feeding disc 101. When the L-shaped support 5 moves to the position corresponding to the adsorption hole 18, the rotation of the L-shaped support 5 is stopped. Then the electric telescopic column 501 is controlled to move down, so that the electric telescopic column 501 drives the vacuum chuck 6 to move to one side of the DAF chip film 4 above the adsorption hole 18. Then the vacuum chuck 6 can adsorb the DAF chip film 4. Then the L-shaped support 5 is controlled to move to the initial position. In this way, the substrate 3 can be continuously chip-mounted, and the DAF chip film 4 can be continuously fed. When the transmission table 17 transports the DAF chip film 4 at the edge thereof to above the feeding disc 101, if the DAF chip film 4 can just fall into the storage circular groove 181, at this time, under the suction force of the adsorption hole 18, it can be ensured that the DAF chip film 4 is located in the storage circular groove 181, avoiding the problem that the DAF chip film 4 is displaced due to external wind force.

[0053] If the DAF chip film 4 cannot completely fall into the storage circular groove 181, under the suction force of the adsorption hole 18, the DAF chip film 4 can also be slowly adsorbed into the storage circular groove 181, that is, the position of the DAF chip film 4 can be corrected to a certain extent, improving the adsorption butt joint of the vacuum chuck 6 and the DAF chip film 4.

[0054] In the initial state, the end of the limiting column one 211 is in contact with the side wall of the limiting plate one 21, and the limiting column two 221 is not in contact with the limiting plate two 22, and the position is shown in the accompanying drawings. Figure 10 When the disc 20 drives the L-shaped support 5 to rotate close to the feeding disc 101, the disc 20 will simultaneously drive the vertical shaft one 19 and the limiting plate two 22 to rotate. When the limiting plate two 22 is in contact with the end of the limiting column two 221, at this time, the vacuum chuck 6 is just on the same vertical axis with the adsorption hole 18. At this time, the rotation of the vertical shaft one 19 is stopped, and the DAF chip film 4 on the adsorption hole 18 is grabbed through the above steps.

[0055] When the DAF chip film 4 is completed, the disc 20 and the L-shaped support 5 are moved to the side of the base plate 3, and when the end of the limiting plate 21 and the limiting column 211 contacts, the vacuum chuck 6 is just in the same vertical axis with the base plate 3, so as to facilitate the combination with the base plate 3. The design can ensure that the vacuum chuck 6 can be adsorbed to the center of the DAF chip film 4, and the DAF chip film 4 is combined with the base plate 3, and the efficiency of the chip is improved.

[0056] Obviously, the above embodiments are only examples for clearly illustrating, not limiting the embodiments. For those skilled in the art, other different forms of changes or variations can be made on the basis of the above description. Here, all the embodiments are not required to be exhausted, and the obvious changes or variations derived therefrom are still within the protection scope of the present application.

Claims

1. A chip mounter characterized by comprising: The application relates to a film loading machine, which comprises a film loading machine body, a bearing disc rotatably arranged above the film loading machine body, a plurality of substrates arranged in a circumferential array on the upper end surface of the bearing disc, a feeding disc rotatably arranged above the film loading machine body, a plurality of DAF chip films arranged on the upper end surface of the feeding disc, an L-shaped support rotatably arranged above the film loading machine body, an electric telescopic column mounted at the bottom end of the L-shaped support, a vacuum chuck mounted at the telescopic end of the electric telescopic column, the vacuum chuck being used for adsorbing the DAF chip films and transferring the DAF chip films into the substrates through the L-shaped support, and an electric heating plate arranged above the film loading machine body and below the L-shaped support. A plurality of contact points one are fixedly arranged on the outer circumferential surface of the bearing disc, each group of the contact points one is in one-to-one correspondence with each substrate, an installation frame is arranged above the film loading machine body, contact points two are arranged at the end of the installation frame, the contact points one and the contact points two are arranged on the same plane, and the bearing disc is in contact with the contact points two during rotation of the contact points one. A plurality of placing frames are arranged on the upper end surface of the bearing disc, an adhering plate is slidably arranged in each placing frame, and the substrates are placed in the placing frames. An electric pushing column is arranged on the inner side of each placing frame, the adhering plate is arranged at the telescopic end of the electric pushing column, a temporary storage plate is arranged on the inner side of the placing frame, the temporary storage plate is slidably arranged on the upper end surface of the bearing disc, and a collecting unit is arranged on the outer side of the bearing disc. The collecting unit comprises penetrating grooves, the penetrating grooves are arranged in groups and are arranged below each substrate, the diameter of the penetrating grooves is larger than the diameter of the substrate, contact points three are arranged on the upper end surface of the film loading machine body through a support, and the telescopic end of the electric pushing column is connected with the side wall of the temporary storage plate through a support rod.

2. The chip mounter according to Claim 1, characterized by: A limiting column is arranged on the lower end surface of the temporary storage plate, and a column-shaped groove matched with the limiting column is arranged on the upper end surface of the bearing disc.

3. The chip-on-board machine of claim 1, wherein: A fixing support is arranged on the upper end surface of the film loading machine body, a transmission table is arranged on the inner side of the fixing support, the transmission table is composed of a conveying belt and a transmission roller, a plurality of DAF chip films are arranged on the upper end surface of the transmission table, an adsorption hole is arranged on the upper end surface of the feeding disc, a suction pipe is arranged in the adsorption hole, the suction pipe is connected with an external air pump, one group of the DAF chip films is arranged above the adsorption hole, and the edge of the transmission table is arranged in correspondence with the adsorption hole.

4. The chip mounter according to Claim 3, characterized by: A storage circular groove is arranged on the upper end surface of the feeding disc, the shape of the storage circular groove is matched with the shape of the DAF chip film, and the adsorption hole is arranged at the center of the storage circular groove.

5. The chip mounter according to claim 4, characterized by: A vertical shaft one is rotatably arranged on the upper end surface of the film loading machine body, the bottom end of the vertical shaft one is connected with the output end of a motor, a disc is arranged at the top end of the vertical shaft one, and the end of the L-shaped support is arranged on the upper end surface of the disc.

6. A chip mounter according to claim 5, characterized by: The outer circumferential surface of the vertical shaft one is provided with a limiting plate one and a limiting plate two, which are designed in a separated mode. The side wall of the film mounting machine body is provided with a limiting column one and a limiting column two, which are designed in a corresponding mode with the limiting plate one and the limiting plate two respectively.

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