Electrical assembly, supporting structure and high-voltage power supply

Abstract

An electrical assembly, a support structure and a high voltage power supply wherein the electrical assembly includes a circuit board and a support structure. The supporting structure comprises a body, the body is connected to the circuit board, at least one protruding part is arranged on the side wall of the body, and the protruding part is arranged on the body in a surrounding mode in the circumferential direction of the body. According to the electrical assembly provided by the embodiment of the invention, under the condition that the body has a relatively small height, the circuit board can be reliably supported, the creepage distance can be greatly prolonged, the limited space in equipment such as a high-voltage power supply is saved, the distance between the circuit board and the shell is favorably compressed, and the service life of the circuit board is prolonged. And miniaturization design of equipment such as a high-voltage power supply is realized. Besides, by adopting the electrical assembly provided by the invention, the circuit board does not need to adopt a high-CTI plate with relatively high cost, for example, a circuit board made of an FR-4 material, so that the cost is saved.

Description

Technical Field

[0001] The present application relates to the technical field of electrical components, and in particular to an electrical component, a supporting structure, and a high-voltage power supply. Background Art

[0002] A high-voltage transformer and a high-voltage circuit board are generally provided inside a chassis-type high-voltage power supply. The high-voltage transformer is responsible for achieving AC voltage step-up, and the high-voltage circuit board is responsible for rectifying the AC high voltage into DC high voltage. Inside the chassis, in order to support the high-voltage circuit board, a support member is usually placed between the power supply housing and the high-voltage circuit board. At the same time, according to the requirements of the production safety compliance, the power supply housing needs to be reliably grounded so that the potential of the power supply housing is equal to the ground potential. There is a high-voltage network port on the high-voltage circuit board. There is a high-voltage voltage difference between the high-voltage network port and the power supply housing. Therefore, the creepage distance requirements in the production safety compliance must be met between the two potentials. However, due to the limited volume of the chassis-type high-voltage power supply, the distance between the high-voltage network port and the power supply housing for installing the support member is small, which makes it difficult to meet the creepage distance requirements while supporting the high-voltage circuit board. Summary of the Invention

[0003] In view of this, the present application provides an electrical component, a support structure and a high-voltage power supply to simultaneously support the circuit board and increase the creepage distance.

[0004] In a first aspect, embodiments of the present application provide an electrical assembly comprising: a circuit board and a support structure. The support structure comprises a body connected to the circuit board, and at least one protrusion is disposed on a side wall of the body, the protrusion being disposed around the body along a circumference of the body.

[0005] The electrical assembly provided in this embodiment can provide reliable support for the circuit board while significantly extending the creepage distance, saving limited space within devices such as high-voltage power supplies. It also helps reduce the distance between the circuit board and the housing, enabling miniaturization of devices such as high-voltage power supplies. Furthermore, the electrical assembly provided in this application eliminates the need for expensive high-CTI board materials for the circuit board; instead, FR-4 materials, for example, can be used, thus saving costs.

[0006] In one possible design, multiple protrusions are provided, and the protrusions are spaced apart along the height of the body. Multiple protrusions can be spaced apart along the height of the body, and each protrusion can increase the length of the charge migration path. Thus, the multiple protrusions can effectively increase the creepage distance, thereby enabling the body to be designed with a smaller height. This facilitates achieving reliable support for the circuit board while meeting creepage distance requirements within a smaller space using a smaller support structure.

[0007] In one possible design, a gap is provided between the end face of the body and the protrusion along the height direction of the body. The end face of the body, or a portion adjacent to the end face, can be used for connection to a circuit board or a high-voltage power supply housing. Maintaining a certain gap between the protrusion and the end face of the body facilitates secure connection between the body and the circuit board or housing, facilitating assembly and disassembly.

[0008] In one possible design, a gap is provided between the protrusion and the circuit board. After the support structure is mounted on the circuit board, the gap between the protrusion and the circuit board prevents the protrusion from contacting or interfering with circuits or components on the circuit board, while also increasing creepage distance.

[0009] In one possible design, the cross-section of the protrusion along the height of the body is wavy. This cross-section can be a cross-section of the protrusion along the height of the body. Assuming the edge of the protrusion is the same distance from the body, a protrusion with a wavy cross-section has a larger surface area than a protrusion with a straight rectangular cross-section, thereby increasing the length of the charge migration path and the creepage distance.

[0010] In one possible design, the protrusion is provided with a plurality of bumps and / or dimples. Such bumps or dimples may be distributed discretely on the surface of the protrusion or according to a predetermined pattern. Compared to a flat surface of the protrusion, the bumps or dimples can increase the surface area of ​​the protrusion, thereby increasing the length of the charge migration path and the creepage distance.

[0011] In one possible design, a blind hole is provided on the main body, and an internal thread is provided in the blind hole. The main body is connected to the circuit board through the cooperation of the blind hole and the connecting piece. The internal thread in the blind hole can achieve a cooperative connection between the blind hole and the screw. When the support structure is connected to the circuit board, the circuit board has corresponding holes that cooperate with the blind holes. The screws can pass through the holes on the circuit board and then be fastened in the blind holes of the main body, thereby achieving a connection and fixation between the support structure and the circuit board, which is convenient for operation. Similarly, the housing of the high-voltage power supply can also be provided with corresponding holes. The screws can pass through the holes on the housing and then be fastened in the blind holes at one end of the main body away from the circuit board, thereby achieving a connection and fixation between the support structure and the housing. The depth of the blind hole can match the screw-in depth of the screw in the main body. The blind hole will not penetrate the main body, thereby avoiding the phenomenon of electric charge creeping from the inner wall of the hole, which leads to a shortened creepage distance.

[0012] In one possible design, multiple blind holes are provided, with at least one blind hole provided at one end of the body and at least another blind hole provided at the other end along the height of the body. This facilitates connection of the support structure with the circuit board and housing, facilitating operation while ensuring connection reliability.

[0013] In one possible design, the circuit board is provided with a groove, into which at least a portion of the body is embedded. The groove does not necessarily extend through the circuit board; however, it can also be a through-slot extending through the circuit board. The body can be securely embedded in the groove without the need for screws or other fasteners, thereby saving the cost of screws and other fasteners. The circuit board and support structure can be pre-assembled and fixed to form an electrical assembly, which can be installed as a whole in equipment such as a high-voltage power supply, facilitating assembly and disassembly.

[0014] In one possible design, the body and the groove are bonded together using glue to ensure a stable connection. Alternatively, the body and the groove have an interference fit, where friction between the body and the groove ensures a reliable connection and facilitates operation.

[0015] In one possible design, the support structure and the circuit board are integrally formed, that is, during the circuit board processing and forming process, the support structure can be directly formed on the circuit board, thereby realizing the integration of the circuit board and the support structure, ensuring the reliability of the connection between the circuit board and the support structure, and also facilitating disassembly and assembly in equipment such as high-voltage power supplies, and facilitating operation.

[0016] In a second aspect, the present application also provides a support structure, which includes a main body, a blind hole is provided on the main body, an internal thread is provided in the blind hole, at least one protrusion is provided on the side wall of the main body, and the protrusion is arranged around the main body along the circumference of the main body.

[0017] The support structure provided in this embodiment can provide reliable support for the circuit board while significantly extending the creepage distance, saving limited space within devices such as high-voltage power supplies. It also helps reduce the distance between the circuit board and the housing, enabling miniaturization of devices such as high-voltage power supplies. Furthermore, with the support structure provided in this application, the circuit board does not need to use high-cost high-CTI sheet materials; for example, FR-4 material can be used, which helps save costs. Furthermore, the blind holes can be directly formed during the body processing process, and the internal threads within the blind holes enable the blind holes to be connected to the screws. When the support structure is connected to the circuit board, the circuit board has corresponding holes that match the blind holes. The screws can be inserted through the holes in the circuit board and then fastened into the blind holes in the body, thereby achieving a secure connection between the support structure and the circuit board, making operation easier. Similarly, the housing of the high-voltage power supply can also be provided with corresponding holes. The screws can be inserted through the holes in the housing and then fastened into the blind holes on the end of the body away from the circuit board, thereby achieving a secure connection between the support structure and the housing.

[0018] In one possible design, multiple protrusions are provided, and the protrusions are spaced apart along the height of the body. Multiple protrusions can be spaced apart along the height of the body, and each protrusion can increase the length of the charge migration path. Thus, the multiple protrusions can effectively increase the creepage distance, thereby enabling the body to be designed with a smaller height. This facilitates achieving reliable support for the circuit board while meeting creepage distance requirements within a smaller space using a smaller support structure.

[0019] In one possible design, a gap is provided between the end face of the body and the protrusion along the height direction of the body. The end face of the body, or a portion adjacent to the end face, can be used for connection to a circuit board or a high-voltage power supply housing. Maintaining a certain gap between the protrusion and the end face of the body facilitates secure connection between the body and the circuit board or housing, facilitating assembly and disassembly.

[0020] In one possible design, the cross-section of the protrusion along the height of the body is wavy. This cross-section can be a cross-section of the protrusion along the height of the body. Assuming the edge of the protrusion is the same distance from the body, a protrusion with a wavy cross-section has a larger surface area than a protrusion with a straight rectangular cross-section, thereby increasing the length of the charge migration path and the creepage distance.

[0021] In one possible design, the protrusion is provided with a plurality of bumps and / or dimples. Such bumps or dimples may be distributed discretely on the surface of the protrusion or according to a predetermined pattern. Compared to a flat surface of the protrusion, the bumps or dimples can increase the surface area of ​​the protrusion, thereby increasing the length of the charge migration path and the creepage distance.

[0022] In one possible design, multiple blind holes are provided, with at least one blind hole provided at one end of the body and at least another blind hole provided at the other end along the height of the body. This facilitates connection of the support structure with the circuit board and housing, facilitating operation while ensuring connection reliability.

[0023] In a possible design, the support structure is integrally formed, that is, during the main body processing and forming process, a protrusion can be formed on the main body at the same time, thereby facilitating the processing and forming process while ensuring the reliability of the overall structure of the support structure.

[0024] In a third aspect, the present application provides a high-voltage power supply, which includes a housing and the electrical component provided in the first aspect of the present application, wherein an end of the support structure in the electrical component away from the circuit board is connected to the housing.

[0025] It should be understood that the foregoing general description and the following detailed description are merely illustrative and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0027] Figure 1 A schematic diagram of the structure of a high-voltage power supply provided in an embodiment of the present application;

[0028] Figure 2 A schematic diagram showing the connection between the support structure provided by one embodiment of the present application and the housing and the circuit board;

[0029] Figure 3 A schematic structural diagram of a support structure provided in one embodiment of the present application;

[0030] Figure 4 for Figure 3 A top view of

[0031] Figure 5 for Figure 3 Front view of

[0032] Figure 6 for Figure 5 The cross-sectional view at AA in FIG.

[0033] Figure 7 A schematic diagram of a support structure provided in another embodiment of the present application;

[0034] Figure 8 A schematic diagram of a support structure provided in yet another embodiment of the present application;

[0035] Figure 9 A schematic diagram showing the connection between the support structure provided by another embodiment of the present application and the housing and the circuit board respectively;

[0036] Figure 10 A schematic diagram of a support structure provided in yet another embodiment of the present application;

[0037] Figure 11 for Figure 10 a half-section view of the support structure shown;

[0038] Figure 12 A schematic diagram showing the connection between the support structure provided by another embodiment of the present application and the housing and the circuit board respectively;

[0039] Figure 13 A schematic diagram of the connection between a support structure and a circuit board provided in one embodiment of the present application;

[0040] Figure 14 A schematic diagram of the connection between a support structure and a circuit board provided in another embodiment of the present application.

[0041] Reference numerals:

[0042] 1- shell;

[0043] 2-Support structure;

[0044] 21-Ontology;

[0045] 211-end face;

[0046] 22- protrusion;

[0047] 221-convex hull;

[0048] 222-pit;

[0049] 23-blind hole;

[0050] 3- Circuit board;

[0051] 31-groove;

[0052] 4-strip holes;

[0053] 5- screws;

[0054] Z-height direction. DETAILED DESCRIPTION

[0055] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0056] It should be clear that the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0057] The terms used in the embodiments of the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. The singular forms "a", "an", "the" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0058] It should be understood that the term "and / or" as used herein simply describes a relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A alone, A and B together, or B alone. Furthermore, the character " / " in this document generally indicates an "or" relationship between the associated objects.

[0059] In the description of this application, unless otherwise specified or limited, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance; unless otherwise specified or explained, the term "plurality" refers to two or more; the terms "connected" and "fixed" should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0060] Creepage distance: The shortest distance along the surface of an insulating material between two conductive parts with a potential difference.

[0061] Chassis-type high-voltage power supplies are widely used in medical and industrial equipment, among other applications. Chassis-type high-voltage power supplies typically contain a high-voltage transformer and a high-voltage circuit board. The high-voltage transformer boosts the AC voltage, while the high-voltage circuit board rectifies the AC high voltage into DC high voltage and performs filtering, protection, sampling, and other processing. To support the high-voltage circuit board, a support member is typically placed between the power supply housing and the circuit board. Furthermore, to comply with safety production regulations, the power supply housing must be reliably grounded, ensuring that its potential is equal to ground. The high-voltage circuit board includes a high-voltage network port capable of outputting high voltage. Consequently, a high-voltage voltage difference exists between the high-voltage network port and the power supply housing, and therefore, the creepage distance requirements of safety production regulations must be met between the two potentials. However, due to the limited size of chassis-type high-voltage power supplies, the distance available for mounting the support member between the high-voltage network port and the power supply housing is relatively small. Consequently, the height of the support member is relatively short, resulting in a small creepage distance between the high-voltage network port and the power supply housing. This means that it is difficult for the support member to simultaneously support the high-voltage circuit board and meet the creepage distance requirements.

[0062] In order to take into account both the support and creepage distance requirements for the high-voltage circuit board, those skilled in the art will generally consider potting the high-voltage circuit board as a whole. The creepage distance requirement below 5kV can be reduced from 50mm to 25mm, thereby reducing the height of the support member. However, the use of a potting process will increase the process cost and the cost of the potting material. At the same time, the high-voltage circuit board after potting is difficult to maintain. If the device on the high-voltage circuit board is damaged, it is necessary to first destroy the potting glue and then replace the device, which is very difficult to operate. In addition, traditional high-voltage circuit boards are usually printed circuit boards (PCBs). The material of the PCB board can be a flame-resistant material (FR-4) dielectric board. FR-4 is a code for a grade of flame-resistant material. PCB boards made of this material require a higher creepage distance. Therefore, those skilled in the art will generally also consider using a plate with a high comparative tracking index (CTI) to replace the traditional PCB board made of FR-4 material. As the CTI of the plate increases, the required creepage distance decreases. Therefore, the creepage distance can be reduced by using a PCB material made of a high CTI plate. However, compared with traditional FR-4 material PCB boards, the cost of high CTI boards will increase significantly, which will lead to an increase in the overall cost of high-voltage power supplies.

[0063] An embodiment of the present application provides a support structure, which can be used in a high-voltage power supply. Figure 1 The schematic diagram of the high voltage power supply provided in the embodiment of the present application is shown in FIG. Figure 1 The high-voltage power supply includes a shell 1 and a circuit board, and the circuit board is arranged inside the shell. Figure 2 Schematic diagram of the support structure provided in the embodiment of the present application being connected to the housing and the circuit board, see Figure 2 The two ends of the support structure can be connected to the circuit board and the housing, respectively. The circuit board has a high-voltage network, and the end of the support structure connected to the circuit board is at a high potential. The housing 1 is grounded, and the end of the support structure connected to the housing is at ground potential. The support member can support the circuit board and ensure that the creepage distance between the housing and the circuit board meets the requirements of safety production regulations.

[0064] in, Figure 3 This is a schematic diagram of the support structure provided by an embodiment of the present application, refer to Figure 2 and Figure 3 The support structure 2 is made of insulating material and includes a main body 21. The main body 21 has a certain height. One end of the main body 21 in the height direction Z can be connected to the circuit board 3, and the other end of the main body 21 in the height direction Z can be connected to the shell 1. At least one protrusion 22 can be provided on the side wall of the main body 21. The direction of the side wall of the main body 21 is perpendicular to the height direction Z of the main body 21. The protrusion 22 protrudes from the surface of the side wall, and the protrusion 22 is arranged around the main body 21 along the circumference of the main body 21. The circumference of the main body 21 is perpendicular to the height direction Z of the main body 21. Among them, the shape of the main body 21 can be a cylinder, an elliptical cylinder, a prism, etc., and this embodiment does not limit the shape of the main body 21. The contour shape of the protrusion 22 can be circular, elliptical, runway-shaped, etc., and this embodiment does not limit the contour shape of the protrusion 22.

[0065] in, Figure 4 for Figure 3 A top view of Figure 5 for Figure 3 Front view of Figure 6 for Figure 5 The cross-sectional view at AA, refer to Figures 4 to 6The protrusion 22 surrounds the circumference of the body 21, that is, there is no through structure, such as a through hole or through gap, at the connection between the protrusion 22 and the body 21. This can prevent the migration of charge from one end of the body 21 to the other end along the height direction Z of the body 21, allowing the charge to migrate from one end of the body 21 to the other end through the surface of the body 21 and the protrusion 22. In other words, the length of the charge migration path is not the straight height of the body 21. The charge path is a tortuous path passing through the surface of the body 21 and the protrusion 22, and the length of this path is much greater than the height dimension of the body 21. Therefore, the support structure 2 provided in this embodiment can not only achieve reliable support for the circuit board 3 when the body 21 has a relatively small height, but also greatly extend the creepage distance, saving limited space in equipment such as high-voltage power supplies, and also helping to reduce the distance between the circuit board 3 and the housing 1, realizing a miniaturized design of equipment such as high-voltage power supplies. In addition, using the support structure 2 provided by this application, the circuit board 3 does not need to use a high-CTI sheet material with high cost. For example, the circuit board 3 can be made of FR-4 material, which is beneficial to cost saving.

[0066] In one embodiment, referring to Figure 5 , a plurality of protrusions 22 can be provided, and the plurality of protrusions 22 are distributed at intervals along the height direction Z of the main body 21. The protrusion 22 can be a thin sheet structure, and the protrusion 22 has a certain thickness in the height direction Z of the main body 21, and the protrusion 22 has a certain length in the direction perpendicular to the height direction Z of the main body 21, so that the length of the charge migration path can be increased and the creepage distance can be increased. Such protrusions 22 can be arranged in plurality at intervals along the height direction ZX of the main body 21, and each protrusion 22 can increase the length of the charge migration path, so that the creepage distance can be effectively increased by the plurality of protrusions 22, thereby enabling the main body 21 to be designed with a smaller height, which is conducive to achieving reliable support for the circuit board 3 in a smaller space through a smaller height support structure 2, while meeting the creepage distance requirements.

[0067] In one embodiment, Figure 7 This is a schematic diagram of a support structure 2 provided in another embodiment of the present application, referring to Figure 7 The cross-section of the protrusion 22 can be a corrugated shape, and this cross-section can be a cross-section of the protrusion 22 in the height direction Z of the body 21. Assuming that the edge of the protrusion 22 is the same distance from the body 21, the protrusion 22 with a corrugated cross-section has a larger surface area than the protrusion 22 with a straight rectangular cross-section, thereby more conducive to increasing the length of the charge migration path and increasing the creepage distance.

[0068] In one embodiment, Figure 8A schematic diagram of a support structure 2 provided in another embodiment of the present application is shown in FIG. Figure 8 The protrusion 22 may be provided with a plurality of bumps 221 and / or dimples 222. Such bumps 221 or dimples 222 may be distributed discretely on the surface of the protrusion 22, or may be distributed according to a predetermined pattern. Compared to a flat surface of the protrusion 22, the bumps 221 or dimples 222 can increase the surface area of ​​the protrusion 22, thereby increasing the length of the charge migration path and the creepage distance.

[0069] In one embodiment, referring to Figure 5 , along the height direction Z of the main body 21, there is a gap between the end face 211 of the main body 21 and the protrusion 22. Among them, the end face 211 of the main body 21 or a part adjacent to the end face 211 can be used to connect the circuit board 3 or the housing 1 of the high-voltage power supply. By maintaining a certain distance between the protrusion 22 and the end face 211 of the main body 21, it is convenient to connect and fix the main body 21 to the circuit board 3 or the housing 1, and facilitate the disassembly and assembly operations. In addition, after the support structure 2 is installed on the circuit board 3, there is a gap between the protrusion 22 and the circuit board 3. This gap can prevent the protrusion 22 from contacting or interfering with the circuits or devices on the circuit board 3, and can also increase the creepage distance through the protrusion 22.

[0070] In one embodiment, the support structure 2 can be an integrally formed structure, that is, during the processing of the main body 21, the protrusion 22 can be simultaneously formed on the main body 21, thereby facilitating the processing and forming process while ensuring the reliability of the overall structure of the support structure 2.

[0071] In one embodiment, referring to Figure 6, a blind hole 23 may be provided on the main body 21, and an internal thread may be provided in the blind hole 23. Specifically, the blind hole 23 is provided at one end of the main body 21 along the height direction Z, and may also be provided at both ends of the main body 21 along the height direction Z. The blind hole 23 is a hole that does not pass through the main body 21, and the depth of the blind hole 23 is less than the length of the main body 21 along the height direction Z. The blind hole 23 can be directly formed during the processing of the main body 21, and the internal thread in the blind hole 23 can realize the matching connection between the blind hole 23 and the screw 5. When the support structure 2 is connected to the circuit board 3, the circuit board 3 has a corresponding hole position that matches the blind hole 23, and the screw 5 can pass through the hole position on the circuit board 3 and be fastened in the blind hole 23 of the main body 21, thereby realizing the connection and fixation between the support structure 2 and the circuit board 3, which is convenient for operation. Similarly, the housing 1 of the high-voltage power supply may also be provided with corresponding holes. Screws 5 can be inserted through the holes in the housing 1 and fastened into blind holes 23 on the end of the body 21 away from the circuit board 3, thereby securing the support structure 2 to the housing 1. The depth of the blind holes 23 can match the depth of the screws 5 screwed into the body 21. The blind holes 23 do not penetrate the body 21, thereby preventing charge from creeping along the inner wall of the holes and shortening the creepage distance.

[0072] In one embodiment, a plurality of blind holes 23 may be provided. As described above, at least one blind hole 23 may be provided at one end of the main body 21, and at least another blind hole 23 may be provided at the other end of the main body 21. The main body 21 may be connected to the circuit board 3 and the housing 1 respectively through the blind holes 23 at both ends.

[0073] In one embodiment, a circular hole may be provided on the circuit board 3 or the housing 1 at a position for connecting with the support structure 2, as shown in FIG. Figure 6 , a blind hole 23 may be provided at each end of the body 21, Figure 9 This is a schematic diagram of another embodiment of the present application providing a support structure 2 connected to the housing 1 and the circuit board 3, with reference to Figure 9 The main body 21 is connected and fixed to the circuit board 3 through the cooperation of a blind hole 23 and a screw 5, and the main body 21 is connected and fixed to the housing 1 through the cooperation of another blind hole 23 and another screw 5.

[0074] In one embodiment, a strip hole may be provided on the circuit board 3 or the housing 1 at a position for connection with the support structure 2. The screw 5 has space to move in the length direction of the strip hole. Such movement may cause relative movement between the body 21 and the circuit board 3 or the housing 1, making it difficult to ensure the stability of the connection between the support structure 2 and the circuit board 3 or the housing 1. For this reason, Figure 10 This is a schematic diagram of a support structure 2 provided in yet another embodiment of the present application. Figure 11 for Figure 10The half-section view of the support structure 2 is shown, referring to Figure 10 and Figure 11 In order to ensure the stability of the connection between the support structure 2 and the circuit board 3 or the housing 1, two blind holes 23 may be provided at one end of the body 21, and two blind holes 23 may also be provided at the other end of the body 21. Figure 12 This is a schematic diagram of another embodiment of the present application providing a support structure 2 connected to the housing 1 and the circuit board 3, with reference to Figure 12 For the end of the body 21 that cooperates with the circuit board 3, the screw 5 connected to one blind hole 23 can abut against one end of the strip hole 4 on the circuit board 3 along its length direction, and the screw 5 connected to the other blind hole 23 can abut against the other end of the strip hole 4 on the circuit board 3 along its length direction, so that the two screws 5 can cooperate with the strip holes 4 on the circuit board 3 to ensure the reliability of the connection between the circuit board 3 and the support structure 2. Similarly, the connection method between the body 21 and the shell 1 with the strip holes 4 is the same as that of the circuit board 3, which will not be repeated here. In some other embodiments, the blind holes 23 on the body 21 can also be set to other numbers, for example, one blind hole 23 is provided at one end of the body 21, and two blind holes 23 are provided at the other end, etc. The specific number of blind holes 23 can be determined according to the structural form and number of the holes on the circuit board 3 or the shell 1 to ensure the reliability of the connection between the support structure 2 and the circuit board 3 or the shell 1.

[0075] In one embodiment, Figure 13 This is a schematic diagram of the connection between the support structure 2 and the circuit board 3 provided in one embodiment of the present application, referring to Figure 13 The circuit board 3 may be provided with a groove 31, into which at least a portion of the body 21 may be embedded. The groove 31 may not extend through the circuit board 3; however, the groove 31 may also be a through-slot extending through the circuit board 3. The body 21 may be fixedly embedded in the groove 31 without the need for fasteners such as screws 5, thereby saving the cost of fasteners such as screws 5. The circuit board 3 and the support structure 2 may be pre-assembled and fixed to form an electrical assembly, which can be installed as a whole in a device such as a high-voltage power supply, thereby facilitating assembly and disassembly.

[0076] In one embodiment, the body 21 and the groove 31 can be bonded together by adhesive, thereby ensuring the stability of the connection between the body 21 and the groove 31. In one embodiment, the body 21 and the groove 31 can be interference fit, that is, the friction between the body 21 and the groove 31 can ensure the reliability of the connection between the body 21 and the groove 31, while also facilitating operation.

[0077] In one embodiment, Figure 14 This is a schematic diagram of the connection between the support structure 2 and the circuit board 3 provided in another embodiment of the present application, referring to Figure 14The support structure 2 and the circuit board 3 can be integrally formed, that is, during the processing of the circuit board 3, the support structure 2 can be directly formed on the circuit board 3, thereby realizing the integration of the circuit board 3 and the support structure 2, ensuring the reliability of the connection between the circuit board 3 and the support structure 2, and also facilitating disassembly and assembly in equipment such as high-voltage power supplies, and facilitating operation.

[0078] The above are merely preferred embodiments of the present application and are not intended to limit the present application. Those skilled in the art will readily appreciate that various modifications and variations are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. An electrical component, characterized in that include: circuit boards; The supporting structure includes a main body connected to the circuit board, and at least one protrusion is provided on the side wall of the main body, and the protrusion is arranged around the main body along the circumference of the main body.

2. The electrical component according to claim 1, wherein There are a plurality of protrusions, and the protrusions are distributed at intervals along the height direction of the body.

3. The electrical component according to claim 1 or 2, characterized in that Along the height direction of the body, there is a gap between the end surface of the body and the protrusion.

4. The electrical component according to any one of claims 1 to 3, characterized in that: There is a gap between the protruding portion and the circuit board.

5. The electrical component according to any one of claims 1 to 4, characterized in that: The cross-sectional shape of the protrusion along the height direction of the body is corrugated.

6. The electrical component according to any one of claims 1 to 5, characterized in that: The protruding portion is provided with a plurality of convex bumps and / or concave pits.

7. The electrical component according to any one of claims 1 to 6, characterized in that: The main body is provided with a blind hole, and an internal thread is provided in the blind hole. The main body is connected to the circuit board through the cooperation of the blind hole and the connecting piece.

8. The electrical component according to claim 7, wherein: There are multiple blind holes. Along the height direction of the body, at least one blind hole is arranged at one end of the body, and at least another blind hole is arranged at the other end of the body.

9. The electrical component according to any one of claims 1 to 6, characterized in that: A groove is provided on the circuit board, and at least a portion of the body is embedded in the groove.

10. The electrical component according to claim 9, characterized in that The body and the groove are bonded together by glue; or the body and the groove are interference fit.

11. The electrical component according to any one of claims 1 to 6, characterized in that: The supporting structure and the circuit board are integrally formed.

12. A support structure, characterized in that: include: The main body is provided with a blind hole, the blind hole is provided with an internal thread, the side wall of the main body is provided with at least one protrusion, and the protrusion is arranged around the main body along the circumference of the main body.

13. The support structure according to claim 12, characterized in that There are a plurality of protrusions, and the protrusions are distributed at intervals along the height direction of the body.

14. The support structure according to claim 12 or 13, characterized in that Along the height direction of the body, there is a gap between the end surface of the body and the protrusion.

15. The support structure according to any one of claims 12 to 14, characterized in that: The cross-sectional shape of the protrusion along the height direction of the body is corrugated.

16. The support structure according to any one of claims 12 to 15, characterized in that: The protruding portion is provided with a plurality of convex bumps and / or concave pits.

17. The support structure according to any one of claims 12 to 16, characterized in that: There are multiple blind holes. Along the height direction of the body, at least one blind hole is arranged at one end of the body, and at least another blind hole is arranged at the other end of the body.

18. The support structure according to any one of claims 12 to 17, characterized in that: The supporting structure is integrally formed.

19. A high voltage power supply, characterized in that: It comprises a housing and the electrical component according to any one of claims 1 to 11, wherein one end of the support structure in the electrical component away from the circuit board is connected to the housing.

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