LED device, display device and manufacturing method of LED device

Abstract

The invention discloses an LED device, a display device and a manufacturing method of the LED device, and relates to the technical field of LED devices.The LED device comprises a substrate, an LED driving chip and at least one LED light-emitting chip, and the LED driving chip comprises a first driving part and a second driving part which are oppositely arranged on the substrate at intervals; the opposite sides of the first driving part and the second driving part are provided with top pins and bottom pins used for being connected with an external power source, each LED light-emitting chip is arranged on the substrate, and the two ends of each LED light-emitting chip are electrically connected with the top pins of the first driving part and the second driving part. According to the LED device, the LED driving chip is divided into two parts, namely the first driving part and the second driving part, the first driving part and the second driving part are both provided with the bottom pins used for being connected with the external power supply, that is, the LED driving chip which is originally heated integrally is divided into two parts, the contact area between the LED driving chip and the outside is increased, and the service life of the LED driving chip is prolonged. And heat dissipation of the LED driving chip and the LED light-emitting chip is facilitated.

Description

Technical Field

[0001] The present invention relates to the technical field of LED devices, and in particular to an LED device, a display device, and a method for manufacturing the LED device. Background Art

[0002] At present, LED devices have the advantages of high brightness, high contrast, high color gamut, long life, strong anti-collision ability, and high reliability. They are widely used in high-definition display fields such as high-end rental / car display / cinema live broadcast / virtual shooting, etc.

[0003] In the existing technology, the integrated LED device with integrated LED light-emitting chip and LED driver chip has the advantages of high integration, no scanning line, simple supporting substrate, etc., and is widely used in ultra-thin display and other fields.

[0004] However, existing LED devices that integrate LED light-emitting chips and LED driver chips generally have poor heat dissipation effects, which affects performance and service life. Summary of the Invention

[0005] The embodiments of the present invention provide an LED device, a display device, and a method for manufacturing the LED device to solve the technical problem in the related art that the existing LED device integrating an LED light-emitting chip and an LED driver chip has poor heat dissipation, which affects the performance and service life.

[0006] In a first aspect, an LED device is provided, comprising: substrate; An LED driver chip includes a first driver portion and a second driver portion disposed on the substrate in an interval and opposite to each other, wherein opposite sides of the first driver portion and the second driver portion are each provided with a top pin and a bottom pin for connecting to an external power supply; At least one LED light-emitting chip, each of the LED light-emitting chips is arranged on the substrate and has two ends electrically connected to the top pins of the first driving part and the second driving part respectively.

[0007] In some embodiments, a transparent encapsulant with a preset thickness is disposed on the substrate.

[0008] In some embodiments, the transparent encapsulating colloid contains high thermal conductivity powder.

[0009] In some embodiments, the substrate is made of transparent material.

[0010] In a second aspect, a display device is provided, comprising the aforementioned LED device, the display device further comprising: A circuit board is connected to the plurality of LED devices.

[0011] In some embodiments, the circuit board is made of transparent material.

[0012] In a third aspect, a method for manufacturing an LED device is provided, comprising the following steps: Dividing the substrate into a plurality of cutting units according to preset cutting lines; An LED driver chip and at least one LED light-emitting chip are arranged on each cutting unit of the substrate; wherein each LED driver chip includes a first driving part and a second driving part arranged on the corresponding cutting unit with an interval and relative to each other, and the first driving part and the second driving part are provided with a top pin and a bottom pin for connecting to an external power supply on opposite sides; Electrically connect the two ends of each LED light-emitting chip to the top pins of the corresponding first driving part and the second driving part respectively; The substrate is cut along preset cutting lines to obtain a plurality of LED devices.

[0013] In some embodiments, the step of providing an LED driver chip and at least one LED light-emitting chip on each cutting unit of the substrate includes: A layer of heat shrinkable colloid film is coated on the substrate, and an LED driving chip and at least one LED light emitting chip are arranged on the heat shrinkable colloid film corresponding to each cutting unit.

[0014] In some embodiments, the step of electrically connecting the two ends of each LED light-emitting chip to the top pins of the corresponding first driving part and the second driving part includes: Apply solder paste on both ends of each LED chip; Heat the substrate, all LED driver chips and all LED light-emitting chips.

[0015] In some embodiments, before cutting the substrate according to the preset cutting lines to obtain the plurality of LED devices, the method includes: Spray a preset thickness of transparent encapsulation colloid on the substrate.

[0016] The beneficial effects brought about by the technical solution provided by the present invention include: The embodiments of the present invention provide an LED device, a display device, and a method for manufacturing an LED device. The LED device divides an LED driver chip into two parts: a first driver part and a second driver part. Both the first driver part and the second driver part are provided with bottom pins for connecting to an external power source. This means that the LED driver chip, which originally generates heat as a whole, is divided into two parts, increasing the contact area between the LED driver chip and the outside world, which is beneficial to the heat dissipation of the LED driver chip and the LED light-emitting chip. In addition, each LED light-emitting chip is arranged between the corresponding first driver part and the second driver part, and only the two ends of the LED light-emitting chip are electrically connected to the top pins of the first driver part and the second driver part, respectively. This structurally reduces the contact area between the LED light-emitting chip and the LED driver chip, minimizes the contact area between the two major heat sources, and is also beneficial to the heat dissipation of the LED driver chip and the LED light-emitting chip. The LED device in the embodiment of the present invention has a better heat dissipation effect, can ensure the performance of the LED device, and extend the service life of the LED device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 A schematic structural diagram of an LED device provided by an embodiment of the present invention; Figure 2 The embodiment of the present invention provides Figure 1 Bottom view of Figure 3 A schematic diagram of the structure of an LED driver chip provided by an embodiment of the present invention; Figure 4 A circuit schematic diagram of an LED device provided by an embodiment of the present invention; Figure 5 A schematic diagram of a packaging structure of an LED device provided by an embodiment of the present invention; Figure 6 A schematic diagram of a display device provided by an embodiment of the present invention; Figure 7 A schematic diagram of a circuit board provided in an embodiment of the present invention; Figure 8 A schematic flow chart of a method for manufacturing an LED device according to an embodiment of the present invention; Figure 9 A schematic diagram of presetting cutting lines on a substrate according to an embodiment of the present invention; Figure 10A schematic diagram of providing solder paste at both ends of each LED light-emitting chip according to an embodiment of the present invention; Figure 11 A schematic diagram of coating a heat shrinkable colloid film on a substrate according to an embodiment of the present invention; Figure 12 A schematic diagram showing the electrical connection between the two ends of each LED light-emitting chip and the top pins of the corresponding first and second driving parts, respectively, provided in an embodiment of the present invention; Reference numerals: 1. Substrate; 2. LED driver chip; 21. First driver part; 22. Second driver part; 23. Top pin; 24. Bottom pin; 3. Heat shrinkable colloid film; 4. LED light-emitting chip; 5. Transparent encapsulation colloid; 6. Solder paste; 7. Circuit board. DETAILED DESCRIPTION

[0019] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0020] An embodiment of the present invention provides an LED device that solves the technical problem that the existing LED device integrating an LED light-emitting chip and an LED driver chip has poor heat dissipation, which affects the performance and service life.

[0021] See also Figure 1 and Figure 2 As shown, an embodiment of the present invention provides an LED device, including: a substrate 1, an LED driver chip 2 and at least one LED light-emitting chip 4.

[0022] The LED driver chip 2 includes a first driver part 21 and a second driver part 22 arranged on the substrate 1 with an interval therebetween. Top pins 23 and bottom pins 24 for connecting to an external power supply are provided on opposite sides of the first driver part 21 and the second driver part 22. Figure 3 The left side is from Figure 2 The view from the center looking left, Figure 3 The right side is from Figure 2 Center view looking to the right.

[0023] Each LED light emitting chip 4 is disposed on the substrate 1 and has two ends electrically connected to the top pins 23 of the first driving part 21 and the second driving part 22 , respectively.

[0024] Specifically, there are generally three LED light-emitting chips 4 (RGB three-color light-emitting chips), and solder paste is set at both ends of the LED light-emitting chip 4 to electrically connect the top pins 23 of the first driving part 21 and the second driving part 22. Figure 4 Schematic connections shown. Figure 4 As shown, taking the common anode design of LED light-emitting chip as an example, Figure 4 The VCC on the left can be understood as Figure 3 The VCC of the second driving part 22 on the right side is connected to the anode of the LED light emitting chip 4, and the cathodes of the three LED light emitting chips 4 are connected to the corresponding Figure 3 The three RGB pins of the first driving part 21 on the left side of the middle, Figure 4 The VCC on the right side can be understood as Figure 3 The VCC and GND pins of the first driver unit 21 on the left side of the center are grounded. DI is the data input port, and DO is the data output port. When VCC is powered on, the first driver unit 21 can control the grounding of the three RGB pins based on the input signal from the data input port DI. For example, if the R pin of the top pin 23 is grounded, the corresponding LED chip 4 will emit red light.

[0025] The LED device in the embodiment of the present invention divides the LED driver chip into two parts: a first driver part and a second driver part. The first driver part and the second driver part are both provided with bottom pins for connecting to an external power supply, that is, the LED driver chip that originally generates heat as a whole is divided into two parts, thereby increasing the contact area between the LED driver chip and the outside world, which is beneficial to the heat dissipation of the LED driver chip and the LED light-emitting chip. In addition, each LED light-emitting chip is arranged between the corresponding first driver part and the second driver part, and only the two ends of the LED light-emitting chip are electrically connected to the top pins of the first driver part and the second driver part respectively. The contact area between the LED light-emitting chip and the LED driver chip is structurally reduced, and the contact area between the two major heat sources is minimized, which is also beneficial to the heat dissipation of the LED driver chip and the LED light-emitting chip. The LED device in the embodiment of the present invention has a better heat dissipation effect, can ensure the performance of the LED device, and extend the service life of the LED device.

[0026] As an optional implementation, in one embodiment of the invention, participating Figure 5 As shown, a transparent encapsulant 5 of a preset thickness is provided on the substrate 1. The transparent encapsulant 5 can improve the airtightness of the LED light-emitting chip 4. The thickness of the transparent encapsulant 5 ensures that it can cover the LED light-emitting chip 4 and expose the bottom pins 24 of the first driving part 21 and the second driving part 22.

[0027] As an optional implementation, in one embodiment of the invention, the transparent encapsulating colloid 5 is doped with a high thermal conductivity powder (such as boron nitride powder). By adding boron nitride powder to the transparent encapsulating colloid 5, the heat dissipation of the LED light-emitting chip 4 can be improved. The thermal conductivity of the boron nitride powder can reach 200-400 W / m K.

[0028] As an optional implementation, in one embodiment of the invention, the substrate 1 is made of a transparent material. After the substrate 1 is made of a transparent material, the structure can achieve the effect of the LED light-emitting chip 4 emitting light at the top and bottom, realizing a fully transparent display.

[0029] See also Figure 6 As shown, an embodiment of the present invention further provides a display device, comprising the aforementioned multiple LED devices, and the display device further comprises: a circuit board 7, wherein the circuit board 7 is connected to the multiple LED devices.

[0030] Specifically, a circuit layer can be made on a PCB substrate, and pads corresponding to the LED devices are etched on the circuit to form a circuit board 7. Figure 7 As shown, the VCC of the circuit board 7 corresponds to the VCC of the bottom pin 24 of the LED device, the GND corresponds to the GND of the bottom pin 24 of the LED device, the DI corresponds to the DI of the bottom pin 24 of the LED device, and the DO corresponds to the DO of the bottom pin 24 of the LED device. The data source INPUT is connected to the DI of the first group of pads, the VCC is connected to the VCC of the first group of pads, the GND is connected to the GND of the first group of pads, and the DO of the first group of pads is connected to the DI of the next group of pads, completing the production of the circuit board 7. Figure 6 As shown, a plurality of LED devices are correspondingly soldered on a circuit board 7 to obtain a display device. Figure 6 The upper middle side is a front view and the lower side is a top view.

[0031] In addition, a transparent PCB substrate can be selected to manufacture the circuit board 7 according to needs, and the corresponding display device can achieve the effect of top and bottom lighting, realizing a fully transparent display.

[0032] In the display device in the embodiment of the present invention, its LED device divides the LED driver chip into two parts: a first driver part and a second driver part. The first driver part and the second driver part are both provided with bottom pins for connecting to an external power supply, that is, the LED driver chip that originally generates heat as a whole is divided into two parts, thereby increasing the contact area between the LED driver chip and the outside world, which is beneficial to the heat dissipation of the LED driver chip and the LED light-emitting chip. In addition, each LED light-emitting chip is arranged between the corresponding first driver part and the second driver part, and only the two ends of the LED light-emitting chip are electrically connected to the top pins of the first driver part and the second driver part respectively. The contact area between the LED light-emitting chip and the LED driver chip is structurally reduced, and the contact area between the two major heat sources is minimized, which is also beneficial to the heat dissipation of the LED driver chip and the LED light-emitting chip. The LED device in the embodiment of the present invention has a better heat dissipation effect, can ensure the performance of the LED device, and extend the service life of the LED device.

[0033] See also Figure 8 As shown, an embodiment of the present invention further provides a method for manufacturing an LED device, comprising the following steps: Step S10: Divide the substrate 1 into a plurality of cutting units according to the preset cutting lines. Figure 9 As shown, Figure 9 The horizontal and vertical lines in the figure can be understood as preset cutting lines.

[0034] In step S20, an LED driver chip 2 and at least one LED light-emitting chip 4 are arranged on each cutting unit of the substrate 1; wherein each LED driver chip 2 includes a first driving part 21 and a second driving part 22 which are arranged on the corresponding cutting unit at intervals, and opposite sides of the first driving part 21 and the second driving part 22 are provided with a top pin 23 and a bottom pin 24 for connecting to an external power supply.

[0035] Step S30 , electrically connecting the two ends of each LED light emitting chip 4 to the top pins 23 of the corresponding first driving part 21 and the second driving part 22 .

[0036] Step S40: cutting the substrate 1 according to the preset cutting line to obtain a plurality of LED devices. The LED devices finally obtained are shown in FIG. Figure 1 and Figure 2 shown.

[0037] The manufacturing method of the LED device in the embodiment of the present invention divides the LED driver chip into two parts: a first driver part and a second driver part. The first driver part and the second driver part are both provided with bottom pins for connecting to an external power supply. That is, the LED driver chip that originally generates heat as a whole is divided into two parts, thereby increasing the contact area between the LED driver chip and the outside world, which is beneficial to the heat dissipation of the LED driver chip and the LED light-emitting chip. In addition, the LED light-emitting chip is arranged between the first driver part and the second driver part, and only the two ends of the LED light-emitting chip are electrically connected to the top pins of the first driver part and the second driver part respectively. The contact area between the LED light-emitting chip and the LED driver chip is structurally reduced, and the contact area between the two major heat sources is minimized, which is also beneficial to the heat dissipation of the LED driver chip and the LED light-emitting chip. Overall, the LED device manufactured by the embodiment of the present invention has a better heat dissipation effect, can ensure the performance of the LED device, and extend the service life of the LED device.

[0038] As an optional implementation, in one embodiment of the invention, the LED driver chip 2 and at least one LED light-emitting chip 4 are provided on each cutting unit of the substrate 1, including: A heat shrinkable colloid film 3 is coated on the substrate 1, and an LED driver chip 2 and at least one LED light emitting chip 4 are arranged on the heat shrinkable colloid film 3 corresponding to each cutting unit. Figure 10 As shown, the heat shrinkable colloid film 3 can initially adhere the LED driver chip 2 and the LED light emitting chip 4 to the substrate 1 .

[0039] As an optional implementation, in one embodiment of the invention, the steps of electrically connecting the two ends of each LED light-emitting chip 4 to the top pins 23 of the corresponding first driving part 21 and the second driving part 22 include: Solder paste 6 is provided at both ends of each LED light emitting chip 4; The substrate 1 , all LED driver chips 2 and all LED light-emitting chips 4 are heated.

[0040] Figure 11 This is a schematic diagram of setting solder paste 6 at both ends of each LED light-emitting chip 4. Figure 12 The schematic diagram is a diagram showing that the two ends of each LED light emitting chip are electrically connected to the top pins of the corresponding first driving part and the second driving part. On this basis, the substrate 1 can be cut according to the preset cutting line to obtain multiple Figure 1 and Figure 2 The LED device shown.

[0041] On the one hand, the solder paste 6 melts after being heated and electrically connects the two ends of each LED light-emitting chip 4 to the corresponding top pins 23 of the first driving part 21 and the second driving part 22 respectively. On the other hand, due to the presence of the heat shrinkable colloid film 3, during the connection process between the LED light-emitting chip 4 and the top pins 23 of the first driving part 21 and the second driving part 22, the heat shrinkable colloid film 3 shrinks and generates a shrinkage force, making the connection between the LED light-emitting chip 4 and the top pins 23 of the first driving part 21 and the second driving part 22 tighter and more firmly.

[0042] As an optional implementation manner, in one embodiment of the invention, before cutting the substrate 1 according to the preset cutting line to obtain the plurality of LED devices, the method includes: The transparent encapsulating colloid 5 of a preset thickness is sprayed on the substrate 1, and the LED device finally obtained is shown in FIG. Figure 5 The transparent encapsulant 5 can improve the airtightness of the LED light emitting chip 4 , and the thickness of the transparent encapsulant 5 is sufficient to cover the LED light emitting chip 4 and expose the bottom pins of the first driving part 21 and the second driving part 22 .

[0043] In addition, high thermal conductivity powder (such as boron nitride powder) is added to the transparent packaging colloid 5. By adding boron nitride powder to the transparent packaging colloid 5, the heat dissipation of the LED light-emitting chip 4 can be improved. The thermal conductivity of boron nitride powder can reach 200-400W / mK.

[0044] As an optional implementation, in one embodiment of the invention, the substrate 1 and the heat shrinkable colloid film 3 are both made of transparent materials. After the substrate 1 and the heat shrinkable colloid film 3 are made of transparent materials, the structure can achieve the effect of the LED light-emitting chip 4 emitting light at the top and bottom, realizing a fully transparent display.

[0045] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "upper" and "lower" is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be internal communication between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0046] It should be noted that, in the present invention, relational terms such as "first" and "second" are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element.

[0047] The foregoing description is intended only to provide specific embodiments of the present invention, which will enable those skilled in the art to understand and implement the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not intended to be limited to the embodiments shown herein, but is to be construed in the widest possible manner consistent with the principles and novel features of the present invention.

Claims

1. An LED device, characterized in that: include: substrate(1); An LED driver chip (2) comprises a first driver portion (21) and a second driver portion (22) arranged on the substrate (1) at intervals and opposite to each other, wherein opposite sides of the first driver portion (21) and the second driver portion (22) are provided with a top pin (23) and a bottom pin (24) for connecting to an external power supply; At least one LED light-emitting chip (4), each of the LED light-emitting chips (4) being arranged on the substrate (1) and having two ends electrically connected to the top pins (23) of the first driving part (21) and the second driving part (22), respectively.

2. The LED device according to claim 1, wherein: A transparent encapsulating colloid (5) of a preset thickness is provided on the substrate (1).

3. The LED device according to claim 2, wherein: The transparent encapsulating colloid (5) is doped with high thermal conductivity powder.

4. The LED device according to claim 1, wherein: The substrate (1) is made of a transparent material.

5. A display device, characterized in that: The LED device according to any one of claims 1 to 4, wherein the display device further comprises: A circuit board (7), wherein the circuit board (7) is connected to a plurality of the LED devices.

6. The display device according to claim 5, wherein: The circuit board (7) is made of transparent material.

7. A method for manufacturing an LED device according to claim 1, characterized in that: The following steps are involved: Dividing the substrate (1) into a plurality of cutting units according to preset cutting lines; An LED driver chip (2) and at least one LED light-emitting chip (4) are arranged on each cutting unit of the substrate (1); wherein each LED driver chip (2) comprises a first driver portion (21) and a second driver portion (22) which are arranged on the corresponding cutting unit at intervals and opposite to each other, and top pins (23) and bottom pins (24) for connecting to an external power supply are provided on opposite sides of the first driver portion (21) and the second driver portion (22); Electrically connecting the two ends of each LED light-emitting chip (4) to the top pins (23) of the corresponding first driving part (21) and second driving part (22); The substrate (1) is cut according to a preset cutting line to obtain a plurality of LED devices.

8. The method for manufacturing an LED device according to claim 7, wherein: The method of arranging an LED driver chip (2) and at least one LED light-emitting chip (4) on each cutting unit of the substrate (1) comprises: A layer of heat shrinkable colloid film (3) is coated on the substrate (1), and an LED driving chip (2) and at least one LED light-emitting chip (4) are arranged on the heat shrinkable colloid film (3) corresponding to each cutting unit.

9. The method for manufacturing an LED device according to claim 7, wherein: The method of electrically connecting the two ends of each LED light-emitting chip (4) to the top pins (23) of the corresponding first driving part (21) and the second driving part (22) comprises: Solder paste (6) is provided at both ends of each LED light-emitting chip (4); The substrate (1), all LED driver chips (2) and all LED light-emitting chips (4) are heated.

10. The method for manufacturing an LED device according to claim 7, wherein: Before the substrate (1) is cut according to the preset cutting line to obtain a plurality of LED devices, the method includes: A transparent encapsulating colloid (5) having a preset thickness is sprayed on the substrate (1).

Images