Display device

Abstract

A display device is provided. The display device includes: a substrate including a display area and a non-display area, the non-display area including a first area; a connection wiring on the substrate in the first region; a reinforcing member on the connection wiring in the first region; and a barrier layer between the connection wiring and the reinforcement member in the first region.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority from Korean Patent Application No. 10-2024-0038091 filed on March 19, 2024, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference. Technical Field

[0003] The present disclosure relates to a display device. Background Art

[0004] As technology advances in modern society, various display devices are being developed to provide information to users. Examples of display devices that display images may include various types of display devices, such as liquid crystal display devices, organic light emitting display devices, and inorganic light emitting display devices.

[0005] Since the electroluminescent display apparatus displays images using a self-luminous device, it does not require a separate light source and can thus be implemented in a thin and diverse form.

[0006] Display devices are expanding their application range, and research is being conducted on display devices having reduced volume and weight while having a large display area. Summary of the Invention

[0007] As display devices become smaller and smaller, efforts are being made to reduce a bezel area, which is an outer portion of a display area and serves as a non-display area, in order to increase an effective display screen size in a display device of the same area.

[0008] In flexible display devices that utilize a flexible substrate made of a flexible material such as plastic to maintain display performance even when the flexible display device is bent, stress can be transmitted to wiring in the bent area, causing cracks. This can increase the risk of display panel failure at room or high temperatures. The inventors of the present disclosure have recognized the aforementioned issues and have developed a new display device that can mitigate cracks in the bent portion of the display device and improve its performance.

[0009] An object to be achieved by the present disclosure is to provide a display device capable of minimizing cracks in a display panel in a bending region and minimizing short circuits of wirings.

[0010] Another object to be achieved by the present disclosure is to provide a display device with improved reliability.

[0011] The objects of the present disclosure are not limited to the above-mentioned objects, and other objects not mentioned above can be clearly understood by those skilled in the art from the following description.

[0012] A display device according to an exemplary embodiment of the present disclosure includes: a substrate including a display area and a non-display area, the non-display area including a first area; connection wiring on the substrate in the first area; a reinforcement member on the connection wiring in the first area; and a barrier layer between the connection wiring and the reinforcement member in the first area.

[0013] Additional details of exemplary embodiments are included in the detailed description and drawings.

[0014] According to exemplary embodiments of the present disclosure, by applying a barrier layer to a display device, failure of the display device may be minimized or reduced, thereby improving performance and / or reliability of the display device.

[0015] According to exemplary embodiments of the present disclosure, an environmentally friendly, low-power consumption display device with reduced power consumption may be provided by improving the lifespan of the display device.

[0016] According to exemplary embodiments of the present disclosure, by applying a barrier layer to a display device to minimize or reduce cracks in a bending region, a display device capable of minimizing damage to a bending region may be provided.

[0017] According to exemplary embodiments of the present disclosure, it is possible to minimize or reduce breakage of the protective layer by providing the barrier layer, and minimize or reduce malfunction of the display device by suppressing short circuit of the signal wiring.

[0018] Effects of the present disclosure are not limited to the above-mentioned effects, and other effects not mentioned above will be clearly understood by those of ordinary skill in the art from the following description.

[0019] The above-described objects to be achieved by the present disclosure, means for achieving the objects, and effects of the present disclosure do not specify essential features of the claims, and therefore, the scope of the claims is not limited to the disclosure of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and other aspects, features and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0021] Figure 1 is a diagram illustrating a display device according to an exemplary embodiment of the present disclosure;

[0022] Figure 2 is a plan view of a display device according to an exemplary embodiment of the present disclosure;

[0023] Figure 3is a diagram illustrating a display device before bending according to an exemplary embodiment of the present disclosure;

[0024] Figure 4 is a diagram illustrating a display device after bending according to an exemplary embodiment of the present disclosure;

[0025] Figure 5 It is along Figure 2 A cross-sectional view of the display panel taken along line II';

[0026] Figures 6A to 6C yes Figure 3 An enlarged view of region A;

[0027] Figure 7 is a diagram illustrating a display device before bending according to another exemplary embodiment of the present disclosure;

[0028] Figure 8 yes Figure 7 An enlarged view of region B;

[0029] Figure 9 is a diagram illustrating a display device after bending according to another exemplary embodiment of the present disclosure; and

[0030] Figure 10 yes Figure 8 Magnified view of area C. DETAILED DESCRIPTION

[0031] The advantages and features of the present disclosure and methods for achieving these advantages and features will be apparent by reference to the exemplary embodiments described in detail below in conjunction with the accompanying drawings. However, the present disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. The exemplary embodiments are provided only by way of example so that those skilled in the art can fully understand the disclosure and scope of the present disclosure.

[0032] The shapes, sizes, ratios, angles, numbers, etc. used to describe the exemplary embodiments of the present disclosure shown in the accompanying drawings are merely examples, and the present disclosure is not limited thereto. Throughout the specification, similar reference numerals generally represent similar elements. In addition, in the following description of the present disclosure, detailed descriptions of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of the present disclosure. Terms such as "including," "having," and "consisting of" used herein are generally intended to allow the addition of other components, unless these terms are used together with the term "only." Unless otherwise expressly stated, any reference to the singular may include the plural.

[0033] Even if not explicitly stated, the components are interpreted as including the ordinary error range.

[0034] When terms such as "on," "above," "below," and "beside" are used to describe the positional relationship between two parts, one or more parts may be located between the two parts, unless these terms are used together with the terms "immediately" or "directly."

[0035] When terms such as "after," "continuing to," "next," and "before" are used to describe a temporal sequence relationship, the sequence may not be sequential unless these terms are used with the terms "immediately" or "directly."

[0036] Although the terms "first," "second," and the like are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from other components. Therefore, the first component mentioned below may be the second component in the technical concept of the present disclosure.

[0037] When describing the components of the exemplary embodiments of the present disclosure, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are used to distinguish one component from another, but the nature, order, or number of the components are not limited by the terms. When a component is "linked," "coupled," or "connected" to another component, the component may be directly linked or connected to the other component. However, unless otherwise specifically stated, it should be understood that a third component may be inserted between components that may be indirectly linked or connected.

[0038] It should be understood that “at least one” includes all combinations of one or more of the associated components. For example, “at least one of a first component, a second component, and a third component” means not only including the first component, the second component, or the third component, but also including all combinations of two or more of the first component, the second component, and the third component.

[0039] In the present disclosure, a "display device" in a narrow sense may include a display device including a display panel and a driver for driving the display panel, such as a liquid crystal module (LCM), an organic light emitting module (OLED module), and a quantum dot module. In addition, a "display device" may also include a complete electronic device or a complete device (or complete equipment) that is a complete product or final product including an LCM, an OLED module, a QD module, etc., such as a notebook computer, a television or a computer monitor, an automobile display device or a device display device including another type of vehicle, and a mobile electronic device including a smart phone or an electronic tablet.

[0040] Therefore, the display device of the present disclosure may include not only the display device itself in a narrow sense such as LCM, OLED module, QD module, etc., but also an application product or package device that is an end consumer device including LCM, OLED module, QD module, etc.

[0041] In addition, in some cases, an LCM, an OLED module, or a QD module configured by a display panel and a driver may be expressed as a "display device" in a narrow sense, and an electronic device as a complete product including the LCM, the OLED module, and the QD module may be expressed as a "set". For example, a display device in a narrow sense includes a liquid crystal (LCD) display panel, an OLED display panel, or a quantum dot display panel, and a source PCB as a controller for driving the display panel. In contrast, a set may be a concept that also includes a set PCB, which is a set controller electrically connected to the source PCB to control the entire set.

[0042] As the display panel used in the exemplary embodiment of the present disclosure, any type of display panel such as a liquid crystal display panel, an organic light emitting diode (OLED) display panel, a quantum dot (QD) display panel, and an electroluminescent display panel can be used. The display panel of the exemplary embodiment is not limited to a specific display panel in which the frame is bent together with the flexible substrate for the organic light emitting diode (OLED) display panel and the backplane support structure thereunder. In addition, the display panel used for the display device according to the exemplary embodiment of the present disclosure is not limited to the shape or size of the display panel.

[0043] For example, when the display panel is an OLED display panel, the display panel may include a plurality of gate lines, data lines, and pixels formed at the intersection of the gate lines and / or data lines. In addition, the display panel may be configured to include an array, a light-emitting diode layer on the array, an encapsulation substrate or an encapsulation layer provided on the array to cover the light-emitting diode layer, etc., the array includes a thin film transistor, which is an element that selectively applies voltage to each pixel. The encapsulation layer can protect the thin film transistor, the light-emitting diode layer, etc. from external impact, and can inhibit moisture or oxygen from penetrating into the light-emitting diode layer. In addition, the layer formed on the array may include an inorganic light-emitting layer, such as a nano-sized material layer, quantum dots, etc.

[0044] The features of the various embodiments of the present disclosure may be partially or completely dependent on or combined with each other, and may be technically related and operated in various ways, and the embodiments may be performed independently of each other or in association with each other.

[0045] Hereinafter, exemplary embodiments of the present disclosure will be described with reference to the following drawings and exemplary embodiments. For descriptive purposes, the proportions of components shown in the drawings are different from the actual proportions, so that the proportions are not limited to those shown in the drawings.

[0046] Figure 1 is a diagram illustrating a display device according to an exemplary embodiment of the present disclosure.

[0047] The display device 1 according to an exemplary embodiment of the present disclosure may include a substrate 110. The display device 1 may include a display area AA disposed on the substrate 110 and a non-display area NA disposed around the display area AA.

[0048] In an exemplary embodiment, the substrate 110 may be made of a flexible plastic material to achieve bending. For example, the substrate 110 may be made of materials such as polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyethersulfone (PES), polyarylate (PAR), polysulfone (PSF), and cyclic olefin copolymer (COS), and the exemplary embodiments of the present disclosure are not limited thereto. For example, glass is not excluded as a material for the substrate 110. In another exemplary embodiment of the present disclosure, the substrate 110 may be made of a semiconductor material such as a silicon wafer.

[0049] The display area AA may be an area in which a plurality of pixels PX are provided and an image is displayed. The plurality of pixels PX may include a plurality of sub-pixels. Each of the plurality of sub-pixels may be a separate unit that emits light. A light-emitting element and a driving circuit may be provided in each of the plurality of sub-pixels. For example, a display element for displaying an image and a circuit unit for driving the display element may be provided in the plurality of sub-pixels. For example, when the display device 1 is an organic light-emitting display device, the display element may include an organic light-emitting diode (OLED), and when the display device 1 is an inorganic light-emitting display device, the display element may include a micro-inorganic light-emitting diode (micro-LED). The plurality of pixels PX may include red sub-pixels, green sub-pixels, blue sub-pixels, white sub-pixels, etc., and the exemplary embodiments of the present disclosure are not limited thereto.

[0050] The non-display area NA may be an area where no image is displayed. The non-display area NA may be an area where various wirings and driver ICs for driving the plurality of pixels PX disposed in the display area AA are disposed. For example, at least one of a data driver and a gate driver may be disposed in the non-display area NA, but exemplary embodiments of the present disclosure are not limited thereto.

[0051] The non-display area NA may be a region that at least partially surrounds the display area AA. For example, the non-display area NA may surround the display area AA. For example, the non-display area NA may be a region extending from the display area AA, or may be a region where the plurality of pixels PX are not disposed, and exemplary embodiments of the present disclosure are not limited thereto.

[0052] The non-display area NA where no image is displayed may further include a first area NA1 which is a bezel area or a bent area where the substrate 110 is bent, and exemplary embodiments of the present disclosure are not limited thereto.

[0053] The pixels PX of the display area AA may include thin film transistors or transistors formed of a semiconductor layer. For example, the thin film transistors or transistors may include an oxide semiconductor material, and the exemplary embodiments of the present disclosure are not limited thereto. For example, the thin film transistors may be transistors, and the term is not limited thereto.

[0054] The first area NA1 may be a curved area where the substrate 110 is curved (bent). The substrate 110 may remain flat except for the first area NA1.

[0055] A pad PD is provided at one side of the substrate 110 in the non-display area NA so that an external module can be bonded.

[0056] The non-display area NA is not an area displaying an image and therefore does not need to be identified on the top surface of the substrate 110. Therefore, a portion of the non-display area NA of the substrate 110 may be bent to reduce the bezel area while ensuring an area for wiring and driving circuits.

[0057] Various wirings may be formed on the substrate 110. The wirings may be formed in the display area AA of the substrate 110, or a plurality of connection wirings CL formed in the non-display area NA may transmit signals by connecting driving circuits, gate drivers, data drivers, etc. to each other.

[0058] The connection wiring CL may be disposed in the first area NA1 as a bending area. For example, various connection wirings CL may be disposed in the first area NA1 and connected to the data pad.

[0059] The plurality of connection wirings CL are made of a conductive material and can be made of a conductive material with excellent flexibility to reduce the occurrence of cracks when the substrate 110 is bent. The plurality of connection wirings CL can be made of a conductive material with excellent flexibility, such as gold (Au), silver (Ag), and aluminum (Al), or can be made of one of the various conductive materials used in the display area AA. The plurality of connection wirings CL can also be made of an alloy of molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), silver (Ag), and magnesium (Mg).

[0060] The plurality of connection wirings CL may be formed of a multilayer structure including various conductive materials, for example, a three-layer structure of titanium (Ti) / aluminum (Al) / titanium (Ti), but is not limited thereto.

[0061] The plurality of connection wirings CL formed in the non-display area NA may be subjected to tension when bent. The plurality of connection wirings CL extending in the same direction as the bending direction on the substrate 110 may be subjected to the greatest tension, which may cause cracks or disconnections. For example, instead of forming the plurality of connection wirings CL to extend in the bending direction, at least some of the plurality of connection wirings CL arranged to include the bending area may be formed to extend in a diagonal direction different from the bending direction, thereby minimizing the tension.

[0062] The plurality of connection wirings CL may be formed in various shapes, and may be formed in, for example, a trapezoidal wave shape, a triangle wave shape, a sawtooth wave shape, a sine wave shape, an omega (Ω) shape, a diamond shape, etc. Exemplary embodiments of the present disclosure are not limited thereto.

[0063] Figure 2 is a plan view of a display device according to an exemplary embodiment of the present disclosure.

[0064] Figure 3 is a diagram illustrating a display device before bending according to an exemplary embodiment of the present disclosure. Figure 3 It is along Figure 2 1-1' is a cross-sectional view of the display device before being bent.

[0065] Figure 4 is a diagram illustrating a display device after bending according to an exemplary embodiment of the present disclosure. Figure 4 It is along Figure 2 FIG. 5 is a cross-sectional view of the display device after bending, taken along line II′.

[0066] exist Figure 2 , only the display panel PN, the optical film LF, the driving circuit unit FF, and the circuit board PB among the various components of the display device 1 are shown.

[0067] Reference Figure 2 and Figure 3 The display device 1 may include a cover member CW, a first fixing member AD1, an optical film LF, a second fixing member AD2, a display panel PN, a third fixing member AD3, a support member BP, a fourth fixing member AD4, a reinforcing member MC, a driving circuit unit FF and a circuit board PB such as a printed circuit board (PCB).

[0068] Reference Figure 2 , the display panel PN may include a display area AA and a non-display area NA surrounding at least a portion of the display area AA.

[0069] The display area AA is an area on the display device 1 where an image is displayed.

[0070] The non-display area NA is an area where an image is not displayed, and may be an area extending from the display area AA. The non-display area NA may include a first area NA1, a second area NA2, and a third area NA3.

[0071] The first area NA1 may be an area that is bent to minimize or reduce a bezel area. For example, the second area NA2 may be an area that at least partially surrounds the display area AA.

[0072] The first area NA1 may be a region extending from the second area NA2 .

[0073] A plurality of connection wirings CL connected to the plurality of pad electrodes of the third area NA3 may be provided in the second area NA2. The plurality of connection wirings CL may be, for example, link wirings.

[0074] The plurality of connection wirings CL may extend from the display area AA to the first area NA1 , the second area NA2 , and the third area NA3 .

[0075] The third area NA3 is an area extending from the first area NA1. When the first area NA1 is bent, the third area NA3 may be disposed to face the display area AA and the second area NA2. The third area NA3 may be an area where a plurality of pad electrodes are disposed and where a plurality of driving circuit units FF are bonded.

[0076] The display panel PN may include a substrate 110 and a light emitting element.

[0077] In an exemplary embodiment, the substrate 110 is a support member for supporting other components provided on the substrate of the display device 1 and may be made of an insulating material. For example, the substrate 110 may be made of glass, resin, or the like. In addition, the substrate 110 may be made of a polymer such as polyimide (PI) or plastic, or may be made of a flexible material.

[0078] A light-emitting element may be provided on the substrate 110. The light-emitting element may be defined differently depending on the type of the display panel PN. When the display panel PN is, for example, an organic light-emitting display panel, the light-emitting element may be an organic light-emitting diode (OLED). When the display panel PN is, for example, an inorganic light-emitting display panel, the light-emitting element may be an inorganic light-emitting diode or a micro LED. Exemplary embodiments of the present disclosure are not limited thereto.

[0079] A driving transistor for driving the light-emitting element may be provided between the substrate and the light-emitting element. The driving transistor may be provided in each of the plurality of pixels PX. The driving transistor may include, for example, a gate electrode, an active layer, a source electrode, and a drain electrode. In addition, the driving transistor may further include a gate insulating layer for insulating the gate electrode from the active layer, and may further include an interlayer insulating layer for insulating the gate electrode, the source electrode, and the drain electrode.

[0080] Reference Figures 2 to 4 Multiple drive circuit units FF may be provided at one end of the display device 1. For example, the multiple drive circuit units FF may be provided in the third area NA3. The multiple drive circuit units FF may be a film for supplying signals to the multiple sub-pixels in the display area AA by providing various components such as a driver IC on a flexible base film. The multiple drive circuit units FF may be provided at one end of the non-display area NA of the display device 1 to supply data voltages, etc., to the multiple sub-pixels SP in the display area AA.

[0081] Drivers such as gate drivers and data drivers may be provided in the plurality of driving circuit units FF. Depending on the method of installing the driver, the driver may be provided by methods such as chip on glass (COG), chip on film (COF), and tape carrier package (TCP), but the installation method is not limited thereto. Figure 2 The shapes and numbers of the plurality of driving circuit units FF shown in FIG. 1 are merely exemplary, and the shapes and numbers of the driving circuit units FF may be variously changed as needed and are not limited thereto.

[0082] Reference Figure 2 The circuit board PB can be connected to a plurality of driving circuit units FF. For example, the circuit board PB can be a printed circuit board (PCB). The circuit board PB can be connected to a plurality of driving circuit units FF. The circuit board PB is a component that supplies signals to the driving IC.

[0083] Various components for supplying various driving signals (eg, driving signals and data voltages) to the driving IC may be provided on the circuit board PB. Exemplary embodiments of the present disclosure are not limited thereto.

[0084] Reference Figure 4 A third fixing member AD3 may be provided between the display panel PN and the support member BP. The third fixing member AD3 may fix the display panel PN and the first support member BPa of the support member BP. The third fixing member AD3 may be formed of a material such as a pressure-sensitive adhesive (PSA), an optically clear adhesive (OCA), or an optically clear resin (OCR), or materials including these materials, but is not limited thereto.

[0085] A fourth fixing member AD4 may be provided between the curved display panel PN and the second supporting member BPb. The fourth fixing member AD4 may fix the second supporting member BPb (BP). The fourth fixing member AD4 may be formed of a material such as a pressure-sensitive adhesive (PSA), an optically clear adhesive (OCA), or an optically clear resin (OCR), or materials including these materials, but is not limited thereto.

[0086] The fifth fixing member AD5 may be provided to fix the support members BP, which are provided to be spaced apart from each other before the display device 1 is bent, by engaging the support members BP after the display device 1 is bent. Figure 4 , the fifth fixing member AD5 is shown as being bent while being disposed and engaged under the first supporting member BPa, but exemplary embodiments are not limited thereto. The fifth fixing member AD5 is formed of a material such as a pressure-sensitive adhesive (PSA), an optically clear adhesive (OCA), or an optically clear resin (OCR), and materials including these materials, but is not limited thereto.

[0087] Reference Figure 4 , for example, the cover member CW may be formed of a cover glass of a transparent plastic material and a transparent glass material that can transmit an image, but is not limited thereto.

[0088] For example, the light shielding pattern 21 may be formed on four edges of the cover member CW. For example, the light shielding pattern 21 may be formed on the edge of the rear surface of the cover member CW. In an exemplary embodiment, the light shielding pattern 21 may be formed to overlap with a portion of the first fixing member AD1, the optical film LF, and the display panel PN below the light shielding pattern 21.

[0089] For example, the light shielding pattern 21 may include a black material having low transmittance, such as black ink or black pigment, to define the boundary of the display area AA.

[0090] In an exemplary embodiment, the light shielding pattern 21 may be made of chromium (Cr) and graphite.

[0091] The optical film LF can suppress the reflection of external light to improve the outdoor visibility and contrast of the image displayed on the display panel PN. The optical film LF can be, for example, a polarizing plate (POL) composed of a polarizer and a protective film that protects the polarizer, and can be formed by coating a polarizing material to obtain flexibility. Exemplary embodiments of the present disclosure are not limited thereto.

[0092] The driving circuit unit FF may be provided in the form of a chip on plastic (COP) or a chip on film (COF) mounted on the substrate 110 , but is not limited thereto. Figure 5 It is along Figure 2 1-1' is a cross-sectional view of the display panel taken along line II'.

[0093] according to Figure 5 Referring to an exemplary embodiment of the present disclosure, a display panel may include a plurality of first electrodes 161 disposed on a substrate 110 , a plurality of light emitting elements 10 disposed on the plurality of first electrodes 161 , a first optical layer 141 disposed on the plurality of light emitting elements 10 , and a second electrode 170 .

[0094] A buffer layer 119 may be provided on the substrate 110. The buffer layer 119 may be, for example, an inorganic material or an inorganic layer. The buffer layer 119 may be used by stacking a multilayer of an inorganic insulating material such as silicon nitride (SiNx) or silicon oxide (SiO2), and may be used by stacking a multilayer of an organic insulating material and an inorganic insulating material. The exemplary embodiments of the present disclosure are not limited thereto. For example, the buffer layer 119 may be provided in the second area NA2 and / or the third area NA3 in addition to the first area NA1 which is a bending area for bending.

[0095] An insulating layer AH may be provided on the substrate 110. For example, the insulating layer AH may be an adhesive layer. An area where the insulating layer AH is removed may exist in the non-display area NA or the first area NA1. For example, this may be because there is a risk that the components or layers in the first area NA1 may be damaged or broken due to the presence of more components or layers in the first area NA1. The insulating layer AH may be selected from, for example, any one of an adhesive polymer, an epoxy resin, a UV resin, a polyimide series, an acrylate series, a polyurethane series, and polydimethylsiloxane (PDMS), but is not limited thereto.

[0096] In the display area AA, a pixel driving circuit 20 implemented as a driving driver may be provided on the insulating layer AH.

[0097] For example, the pixel driving circuit 20 may be provided in the display area AA on the substrate 110. The pixel driving circuit 20 may include a plurality of thin film transistors using an amorphous silicon semiconductor, a polysilicon semiconductor, or an oxide semiconductor.

[0098] The pixel driving circuit 20 may include at least one driving thin film transistor, at least one switching thin film transistor, and at least one storage capacitor. When the pixel driving circuit 20 includes a plurality of thin film transistors, they may be formed on the substrate 110 by a process for manufacturing thin film transistors (TFTs). In an exemplary embodiment, the pixel driving circuit 20 may be a concept collectively referring to a plurality of thin film transistors electrically connected to the light emitting element 10.

[0099] The pixel driving circuit 20 may be a driver manufactured using a process for manufacturing metal oxide silicon field effect transistors (MOSFETs) on a single crystal semiconductor substrate. The driver may include multiple pixel driving circuits for driving multiple sub-pixels. When the pixel driving circuit 20 is implemented as a driver, after providing an insulating layer AH on the substrate 110, the driver may be mounted on the insulating layer AH through a transfer process. The pixel driving circuit 20 may be a micro driver or a microchip, and the exemplary embodiments of the present disclosure are not limited thereto.

[0100] A coating layer 120 may be formed on the insulating layer AH to protect the pixel driving circuit 20. The coating layer 120 may cover at least a portion or all of the side surfaces of the pixel driving circuit 20 and may cover a portion of the top surface of the pixel driving circuit 20. For example, the coating layer 120 may cover the entire substrate 110 and may also cover a portion or all of the third area NA3. The coating layer 120 may be made of an organic insulating material such as a photosensitive photoacrylic resin or a photosensitive polyimide, but is not limited thereto.

[0101] A buffer layer 121 may be disposed on the overcoat layer 120 and / or the pixel driving circuit 20 . When the overcoat layer 120 covers only a portion of the third area NA3 , a side surface of the overcoat layer 120 may be covered by the buffer layer 121 .

[0102] A protective layer 122 may be provided on the buffer layer 121. The protective layer 122 may be, for example, an organic material. Exemplary embodiments of the present disclosure are not limited thereto. A 1a-th wiring RT1a, a 2a-th wiring RT2a, and a plurality of connection wirings CL may be provided on the buffer layer 121.

[0103] For example, the protective layer 122 may be an insulating layer and / or an organic layer. Exemplary embodiments of the present disclosure are not limited thereto. In exemplary embodiments, the protective layer 122 may include a first protective layer 122a, a second protective layer 122b on the first protective layer 122a, a third protective layer 122c on the second protective layer 122b, and / or a fourth protective layer 122d on the third protective layer 122c.

[0104] The first protective layer 122a may be provided on the 1a wiring RT1a, the 2a wiring RT2a, and the plurality of connection wirings CL.

[0105] The 1b wiring RT1b, the 2b wiring RT2b, and the fourth wiring RT4 may be provided on the first protective layer 122a.

[0106] The second protective layer 122b may be provided on the 1b wiring RT1b, the 2b wiring RT2b, and the fourth wiring RT4.

[0107] The 1c wiring RT1c, the 2c wiring RT2c, and the fifth wiring RT5 may be provided on the second protective layer 122b.

[0108] The third protective layer 122c may be provided on the 1c wiring RT1c, the 2c wiring RT2c, and the fifth wiring RT5.

[0109] The 1d wiring RT1d, the 2d wiring RT2d, and the sixth wiring RT6 may be provided on the third protective layer 122c.

[0110] The fourth protective layer 122d may be provided on the 1d wiring RT1d, the 2d wiring RT2d, and the sixth wiring RT6. The more protective layers exist in the first region NA1, the more defects that the protective layers are damaged during bending may occur. The fourth protective layer 122d may not be provided in at least some regions of the first region NA1. n (0 < n < 5, and n is an integer) protective layers may be provided in the first region NA1.

[0111] In an exemplary embodiment, the 1a wiring RT1a may be the first wiring.

[0112] Refer to Figure 5 , the 1a wiring RT1a is included on the substrate in the display area AA, and the connection wiring CL in the first region NA1 may be of the same material as the first wiring in the display area AA.

[0113] To facilitate bending in the bending region, the buffer layer 119 as an inorganic material may not be provided in the first region NA1. Therefore, the distance from the substrate 110 to the connection wiring CL may be different from the distance from the substrate 110 to the 1a wiring RT1a. For example, the distance from the substrate 110 to the connection wiring CL may be shorter than the distance from the substrate 110 to the 1a wiring RT1a.

[0114] A plurality of signal wirings TL and seventh wirings TL7 may be provided on the fourth protective layer 122 d. For example, the plurality of signal wirings TL and seventh wirings TL7 may be provided on the same layer. Providing the plurality of signal wirings TL and seventh wirings TL7 on the same layer may mean that they are completely formed on a single layer and then separated by a patterning process, etc. However, this is not necessarily limited to this, and a plurality of wirings or electrodes may be defined as being provided on the same layer, as long as the plurality of wirings or electrodes are formed on the same layer, although their heights may differ.

[0115] The 1a-th wiring RT1a, the 1b-th wiring RT1b, the 1c-th wiring RT1c, the 1d-th wiring RT1d, and the plurality of signal wirings TL can be electrically connected through contact holes each provided on the protective layer and penetrating the protective layer.

[0116] The 2a-th wiring RT2a, the 2b-th wiring RT2b, the 2c-th wiring RT2c, and the 2d-th wiring RT2d can be electrically connected through contact holes each provided on the protective layer and penetrating the protective layer.

[0117] The anode voltage supplied from the pixel driving circuit 20 may be supplied to the light emitting element 10 through the 1a-th wiring RT1a, the 1b-th wiring RT1b, the 1c-th wiring RT1c, the 1d-th wiring RT1d, the plurality of signal wirings TL, and the first electrode 161 .

[0118] The cathode voltage supplied from the pixel driving circuit 20 may be supplied to the light emitting element 10 through the 2a-th wiring RT2a, the 2b-th wiring RT2b, the 2c-th wiring RT2c, the 2d-th wiring RT2d, the plurality of signal wirings TL, and the second electrode 170.

[0119] The wirings listed above are examples, and each wiring may include a plurality of connection wirings or a plurality of wiring patterns arranged in different layers with one or more protective layers interposed therebetween. The wiring patterns arranged in different layers may be electrically connected through contact holes penetrating the protective layers.

[0120] A plurality of connection wirings CL are provided on the buffer layer 121. The plurality of connection wirings CL may extend from the display area AA to the third area NA3. The plurality of connection wirings CL may be third wirings.

[0121] The fourth wiring RT4 is disposed on the first protective layer 122 a and may extend to the third area NA3 .

[0122] The fifth wiring RT5 is disposed on the second protective layer 122 b and may extend to the third area NA3 .

[0123] The sixth wiring RT6 is disposed on the third protective layer 122 c and may extend to the third area NA3 .

[0124] The seventh wiring RT7 is disposed on the fourth protective layer 122 d and may extend to the third area NA3 .

[0125] For example, a signal from a driving circuit unit FF, such as a chip on film (COF) connected to a circuit board PB, can be transmitted to a pixel driving circuit 20 set in the display area AA through the seventh wiring TL7, the sixth wiring RT6, the fifth wiring RT5, the fourth wiring RT4 and multiple connecting wirings CL.

[0126] A plurality of banks 130 may be provided on the protective layer 122. At least one light emitting element 10 may be provided on each bank 130. For example, a first light emitting element may be provided on a first bank, a second light emitting element may be provided on a second bank, and a third light emitting element may be provided on a third bank.

[0127] The first electrode 161 may be disposed on the bank 130. For example, the first metal layer ML1 may be disposed in a region overlapping the first electrode 161 and the light emitting element 10. For example, the first metal layer ML1 may not be disposed in a region other than the region overlapping the light emitting element 10. The first metal layer ML1 may not be disposed in the third region NA3.

[0128] A solder pattern 162 may be provided on the first electrode 161. The solder pattern 162 may be made of, but not limited to, indium (In), tin (Sn), or an alloy thereof. The solder pattern 162 may include a first portion 162a and a second portion 162b.

[0129] The first portion 162a may include indium (In), and the second portion 162b may include gold (Au). When the light-emitting element 10 is transferred, the first portion 162a and the second portion 162b may be bonded by pressure and then eutectic bonded by heating. When the second portion 162b is subjected to pressure, a portion of the second portion 162b may cover at least a portion or all of the side surface of the first portion 162a. For example, the contact area between the first portion 162a and the second portion 162b may be increased, thereby increasing the bonding strength and improving the transmission of electrical signals.

[0130] A plurality of light emitting elements 10 may be mounted on the solder patterns 162 , respectively.

[0131] For example, the first optical layer 141 may include a 1-1th optical layer 141 a and a 1-2th optical layer 141 b .

[0132] The first optical layer 141 may include an organic insulating material in which fine metal particles such as titanium dioxide particles are dispersed. Light emitted from the plurality of light emitting elements 10 may be scattered by the fine metal particles dispersed in the first optical layer 141 and emitted to the outside.

[0133] The 1-1st optical layer 141a may be disposed on the plurality of light emitting elements 10 and the bank 130. For example, the 1-1st optical layer 141a may cover between the plurality of light emitting elements 10 and between the plurality of banks 130. The planar arrangement of the 1-1st optical layer 141a may be the same as that of the first optical layer 141.

[0134] A second electrode 170 may be provided on the plurality of light emitting elements 10. The second electrode 170 may be connected to the pixel PXL. The second electrode 170 may be commonly connected to the sub-pixels.

[0135] The 1-2 th optical layer 141b may overlap the 1-1 th optical layer 141a on the second electrode 170. The 1-2 th optical layer 141b may be disposed above the second electrode 170 to increase the amount of light emitted toward the front surface.

[0136] The second optical layer 142 may be an organic insulating material surrounding the first optical layer 141. The second optical layer 142 may be disposed on the protective layer 122 together with the first optical layer 141. The first optical layer 141 may be disposed on the display area AA.

[0137] The second optical layer 142 may be an organic insulating material surrounding the first optical layer 141. The second optical layer 142 may be disposed on the insulating layer 122 together with the first optical layer 141. The first optical layer 141 and the second optical layer 142 may include the same material (e.g., siloxane). For example, the first optical layer 141 may be siloxane including titanium oxide (TiOx), while the second optical layer 142 may be siloxane not including titanium oxide (TiOx). However, this is not necessarily limited thereto, and the first optical layer 141 and the second optical layer 142 may be made of the same material or different materials.

[0138] A black matrix 190 may be provided on the 1-2 optical layer 141 b, the second electrode 170, and the second optical layer 142. The black matrix 190 may be provided on the 1-2 optical layer 141 b and the second electrode 170. Transmission holes may be formed between patterns of the black matrix 190, and light emitted from the light emitting element 10 is emitted to the outside through the transmission holes.

[0139] Figures 6A to 6C yes Figure 3 Magnified view of area A.

[0140] Specifically, Figure 6A and Figure 6C are diagrams for describing a process of manufacturing the reinforcing member MC according to the exemplary embodiment.

[0141] Reference Figure 3 、 Figure 4 and Figures 6A to 6C , the region A may be a first region NA1, for example, a bending region. The first region NA1 may include a reinforcement member MC on the display panel PN.

[0142] For example, the reinforcing member MC may be a resin, and may require a curing process.

[0143] The reinforcing member MC may include resin.

[0144] The display panel PN may include a plurality of connection wirings CL on the substrate 110 and a protective layer 122 on the plurality of connection wirings CL. The protective layer 122 may be, for example, an organic material.

[0145] The reinforcing member MC may be disposed on the display panel PN in the first area NA1 to reinforce bending. For example, the reinforcing member MC may include a micro coating layer. The micro coating layer (MCL) may be a micro cover layer (MCL).

[0146] The reinforcement member MC may cover the display panel PN of the first area NA1 and may extend to cover a portion of the third area NA3 of the display panel PN that contacts the first area NA1.

[0147] The reinforcing member MC may include a resin, and may include, but is not limited to, an ultraviolet (UV) curable acrylic resin. For example, the reinforcing member MC may be formed from a cured product of the resin that has undergone a curing process after being coated with the resin. When the resin is a UV curable resin, UV curing may be performed.

[0148] The reinforcement member MC may be disposed outside the display panel PN to cover various signal wirings of the display panel PN. The reinforcement member MC may suppress moisture from penetrating into the signal connection wirings CL while protecting the signal wirings from external impacts.

[0149] The reinforcement member MC may supplement the rigidity of the display panel PN in the curved region where the support member is removed by being disposed on the outer portion of the display panel PN in the first region NA1 .

[0150] Reference Figures 6A to 6C , the reinforcing member MC on the display panel PN can be cured using a curing device 299. In an exemplary embodiment, the reinforcing member MC can be cured by an ultraviolet (UV) light curing process. The ultraviolet (UV) light can include short wavelength UV-C 29a, medium wavelength UV-B 29b, and long wavelength UV-A 29c, depending on the wavelength range.

[0151] Reference Figure 6A , the wavelength range of the short-wavelength UV-C 29a is about 200 nm to 280 nm, and the surface of the reinforcing member MC can be cured.

[0152] Reference Figure 6B , the wavelength range of the medium wavelength UV-B 29b is about 280 nm to 315 nm, and the central portion of the reinforcing member MC can be cured.

[0153] Reference Figure 6C The long-wavelength UV-A29c has a wavelength range of approximately 315 nm to 380 nm and may harden or brittlely deform the surface of the display panel PN (e.g., the surface of the protective layer 122) by passing through the reinforcing member MC. As a result, cracks may occur in the plurality of connection wirings CL in the first area NA1, which is a bending area, leading to malfunction of the display device.

[0154] Figure 7 is a diagram illustrating a display device before bending according to another exemplary embodiment of the present disclosure.

[0155] Figure 8 yes Figure 7 Magnified view of area B.

[0156] Figure 9 is a diagram illustrating a display device after being bent according to another exemplary embodiment of the present disclosure.

[0157] Figure 10 yes Figure 8 Magnified view of area C.

[0158] Figures 7 to 9 The display device 2 can be used with Figures 1 to 4 The display device 1 is substantially the same except for the barrier layer 303, and therefore the description of overlapping contents may be omitted or simplified.

[0159] Reference Figures 7 to 9 , the display device 2 may include a cover member CW, a first fixing member AD1 , an optical film LF, a display panel PN, a reinforcing member MC, a driving circuit unit FF, and a circuit board PB.

[0160] Reference Figures 7 to 9 , a barrier layer 303 may be provided on the display panel PN. Figure 8 , a barrier layer 303 may be provided between the plurality of connection wirings CL and the reinforcement member MC in the first area NA1.

[0161] The substrate 110 of the display panel PN may include a display area AA and a non-display area NA. The non-display area NA may include a first area NA1, a second area NA2, and a third area NA3.

[0162] The non-display area NA may have a plurality of connection wirings CL on the substrate 110 in the first area NA1 , the second area NA2 , and the third area NA3 .

[0163] The reinforcement member MC may exist on the plurality of connection wirings CL in at least a portion of the first area NA1 , the second area NA2 , and the third area NA3 .

[0164] A barrier layer 303 may exist between the plurality of connection wirings CL and the reinforcement member MC in at least a portion of the first, second, and third areas NA1, NA2, and NA3. The barrier layer 303 may overlap with the reinforcement member MC and may be different from the reinforcement member MC.

[0165] The protective layer 122 may be on the plurality of connection wirings CL. The protective layer 122 may be, for example, an organic material, an organic insulating material, or an organic layer.

[0166] For example, the protective layer 122 may include multiple layers.

[0167] The protection layer 122 may extend from the display area AA and may be on at least a portion of the first area NA1 , the second area NA2 , and / or the third area NA3 .

[0168] The protective layer 122 may be obliquely disposed on the stepped portion ST of the insulating layer AH.

[0169] For example, the connection wiring CL and / or the barrier layer 303 may be disposed on the stepped portion ST of the insulating layer AH. Therefore, the barrier layer 303 may include a stepped portion.

[0170] The barrier layer 303 may be between the protective layer 122 and the reinforcement member MC.

[0171] Reference Figure 8 , the barrier layer 303 may include a base layer 310b and a plurality of beads 310a. The barrier layer 303 may include a base layer 310b and a plurality of beads 310a dispersed in the base layer 310b.

[0172] For example, the blocking layer 303 may block ultraviolet (UV) rays.

[0173] In exemplary embodiments, the barrier layer 303 may have a thickness of 1 μm to 50 μm.

[0174] In an exemplary embodiment, the barrier layer 303 may be a film in which a polyvinyl alcohol resin is used as a base layer 310b and a plurality of beads 310a, which are composite nanoparticles formed of zinc oxide and titanium oxide, are dispersed within the base layer 310b. In an exemplary embodiment, the beads 310a of the barrier layer 303 may be, for example, titanium dioxide (TiO2), but are not limited thereto.

[0175] The beads 310a of the barrier layer 303 may be nanoparticles formed of a material including titanium (Ti). For example, the beads 310a of the barrier layer 303 may be nanoparticles having a size of nanometers (nm) formed by a sol-gel method, but are not limited thereto.

[0176] The first area NA1 may be a curved area of ​​the substrate. The barrier layer 303 may overlap the reinforcement member MC in the first area NA1. The barrier layer 303 and the reinforcement member MC may be different materials. For example, the reinforcement member MC may be a resin. For example, the barrier layer 303 may include a base layer 310b and / or a plurality of beads 310a.

[0177] For example, the base layer 310b may be an adhesive material. The base layer 310b may be an acrylic adhesive. Exemplary embodiments of the present disclosure are not limited thereto.

[0178] For example, the base layer 310 b of the barrier layer 303 may be a low modulus material having a low modulus because it is configured to include the first area NA1 as the bending area.

[0179] For example, Figures 6A to 7 As described above, for example, when a process of bending the display panel PN while hardening the surface of the protective layer 122 is performed, propagation of cracks that may occur in the protective layer 122 may cause disconnection of the plurality of connection wirings CL.

[0180] Reference Figure 10 During the curing process of the reinforcing member MC on the display panel PN in the first area NA1 serving as the bending region, the beads 310a of the barrier layer 303 can physically block the long-wavelength UV-A 29c of the curing device 299. Therefore, damage or cracking of the protective layer 122 of the display panel PN can be minimized or reduced. Consequently, cracking of the connection wiring CL can be minimized or reduced, thereby minimizing malfunctions.

[0181] Reference Figure 8The drive circuit unit FF is disposed in the third area NA3, and a plurality of connection wirings CL are connected to the drive circuit unit FF. The barrier layer 303 may not overlap with the drive circuit unit FF. Because the barrier layer 303 can suppress damage to the plurality of connection wirings CL caused by ultraviolet (UV) curing of the reinforcement member MC, the barrier layer 303 may be disposed between the reinforcement member MC and the connection wirings CL. In an exemplary embodiment, the plurality of connection wirings CL are connected to the drive circuit unit FF, and therefore, the barrier layer 303 and the drive circuit unit FF, such as a chip on film (COF), may not overlap.

[0182] The barrier layer 303 may overlap the first area NA1 between the second area NA2 and the third area NA3. The barrier layer 303 may overlap at least a portion of the second area NA2 and / or at least a portion of the third area NA3.

[0183] For example, the diameter of the plurality of beads 310a may be 20 nm or less. The exemplary embodiments of the present disclosure are not limited thereto. By minimizing the diameter of the plurality of beads 310a, the surface area may be increased, thereby improving the ultraviolet (UV) blocking effect.

[0184] The thickness of the barrier layer 303 may be thinner than the thickness of the reinforcing member MC.

[0185] For example, the barrier layer 303 may be a thin film having a thickness of 1 μm or less.

[0186] For example, the weight percentage of the plurality of beads 310a may be 5% by weight.Exemplary embodiments of the present disclosure are not limited thereto.

[0187] The barrier layer 303 is disposed on the connection wiring CL and below the reinforcement member MC. Therefore, since the connection wiring CL of the display panel PN is hardened by the process of curing the reinforcement member MC, cracks in the curved first area NA1 can be minimized or reduced. By minimizing cracks in the curved area via the barrier layer 303, malfunctions can be improved.

[0188] For example, the buffer layer 119 including an inorganic material may be included in the display area AA and / or the third area NA3. The buffer layer 119 may not be provided in the first area NA1 as a bending area. An opening area of ​​the buffer layer 119 may be included in the first area NA1.

[0189] Reference Figure 8In the second area NA2 extending from the display area AA, an optical film LF may be disposed on the display panel PN, a first fixing member AD1 may be disposed on the optical film LF, a light shielding pattern 21 may be disposed on the first fixing member AD1, and a cover member CW may be disposed on the light shielding pattern 21.

[0190] For example, the display panel PN in the second area NA2 may include a buffer layer 119 on the substrate 110 , an insulating layer AH on the buffer layer 119 , an overcoat layer 120 on the insulating layer AH, connection wirings CL on the overcoat layer 120 , and a protective layer 122 on the connection wirings CL.

[0191] For example, an area adjacent to the display area AA in at least a portion of the second area NA2 may include the first fixing member AD1 on the optical film LF on the display panel PN and the cover member CW on the first fixing member AD1 .

[0192] For example, a region adjacent to the first area NA1 in at least a portion of the second area NA2 may include the barrier layer 303 on the display panel PN and the reinforcement member MC on the barrier layer 303 .

[0193] For example, the display panel PN in the first area NA1 may not include the buffer layer 119, which is an inorganic material. The display panel PN in the first area NA1 may include an insulating layer AH on the substrate 110, connection wirings CL on the insulating layer AH, and a protective layer 122 on the connection wirings CL. In addition, the display panel PN in the first area NA1 may further include a coating layer 120 between the insulating layer AH and the connection wirings CL, similar to that in the second area NA2, which is not restrictive.

[0194] In the first area NA1 , the barrier layer 303 may be disposed on the display panel PN, and the reinforcement member MC may be disposed on the barrier layer 303 .

[0195] Reference Figure 8 In an exemplary embodiment, the display panel PN in the first area NA1 as the bending area may not include the buffer layer 119 as an inorganic material. Therefore, the insulating layer AH disposed between the substrate 110 and the plurality of connection wirings CL is included and may have a stepped portion.

[0196] By designing a neutral plane in the plurality of connection wirings CL during bending of the display panel PN, stress of the connection windings CL may be minimized or reduced during bending.

[0197] The reinforcing member MC may control the neutral plane of the first area NA1 which is a bending area.

[0198] As mentioned above, a neutral plane refers to a virtual plane where no stress is applied because the compressive and tensile forces applied to a structure when bent cancel each other out. When two or more structures are laminated, a virtual neutral plane can be formed between them. When the entire structure is bent in one direction, structures aligned with the neutral plane in the direction of the bend are compressed and thus subjected to compressive forces. Conversely, structures aligned with the neutral plane in the direction opposite to the bend are stretched and thus subjected to tensile forces. Because structures are more fragile when subjected to tension, given the same combination of compressive and tensile forces, they are more likely to crack when subjected to tension.

[0199] The substrate of the display panel PN disposed below the neutral plane is compressed and may therefore be subjected to pressure, while the circuit wiring disposed above the neutral plane may be subjected to tension. Due to the tension, cracks may occur. Therefore, in order to minimize or reduce the tension applied to the circuit wiring, the circuit wiring may be disposed above the neutral plane.

[0200] By placing the reinforcing member MC in the bending region, the neutral plane can be raised. The circuit wiring can be placed at the same position as the neutral plane or higher than the neutral plane, so that it is not subjected to stress or pressure during bending, thereby suppressing the occurrence of cracks.

[0201] For example, the height of the display panel PN in the display area AA may be different from the height of the display panel PN in the first area NA1.

[0202] The insulating layer AH may be provided in the display area AA, the first area NA1, the second area NA2, and / or the third area NA3. A stepped portion of the insulating layer AH may be provided between the first area NA1 and the third area NA3 and corresponding to a boundary therebetween.

[0203] Reference Figure 8 A protective layer 122 for protecting the connection wirings CL may be provided on the plurality of connection wirings CL. The protective layer 122 may be made of the same material as the protective layer 122 in the display area AA.

[0204] The display device according to the exemplary embodiment of the present disclosure can be applied to mobile devices, video phones, smart watches, watch phones, wearable devices, foldable devices, rollable devices, bendable devices, flexible devices, bending devices, sliding devices, variable devices, electronic notebooks, electronic books, portable multimedia players (PMPs), personal digital assistants (PDAs), MP3 players, mobile medical devices, desktop PCs, laptop PCs, netbook computers, workstations, navigation systems, vehicle navigation systems, vehicle display devices, vehicle devices, theater devices, theater display devices, televisions, wallpaper devices, signage devices, gaming devices, notebooks, monitors, camera devices, video cameras, home appliances, etc. In addition, the display device of the present disclosure can be applied to organic light emitting lighting devices or inorganic light emitting lighting devices.

[0205] Exemplary embodiments of the present disclosure may also be described as follows:

[0206] According to one aspect of the present disclosure, a display device is provided. The display device includes: a substrate including a display area and a non-display area, the non-display area including a first area; connection wiring on the substrate in the first area; a reinforcement member on the connection wiring in the first area; and a barrier layer between the connection wiring and the reinforcement member in the first area.

[0207] The display device may further include a protective layer on the connection wiring, and a barrier layer may be between the protective layer and the reinforcement member.

[0208] The first region may be a region where the substrate is bent.The barrier layer may overlap with the reinforcement member and may be different from the reinforcement member.

[0209] The non-display area may further include a second area. The second area may surround at least a portion of the display area. The connection wiring may extend from the display area to the second area and the first area.

[0210] The non-display area may further include a third area extending from the first area. A driving circuit unit may be disposed in the third area. The connection wiring and the driving circuit unit may be connected. The barrier layer may not overlap with the driving circuit unit.

[0211] The barrier layer may overlap the first region between the second region and the third region, and may overlap at least a portion of the second region and at least a portion of the third region.

[0212] The display device may further include an insulating layer provided between the substrate and the connection wiring. The insulating layer may have a stepped portion.

[0213] The insulating layer may be provided in at least one of the display region, the second region, and the third region.

[0214] The stepped portion of the insulating layer may be provided to correspond to between the first region and the third region and between the second region and the third region.

[0215] The display device may further include a protective layer on the connection wiring, and the protective layer may be made of an organic material.

[0216] The protection layer may be provided obliquely on the stepped portion of the insulating layer.

[0217] The connection wiring and the barrier layer may be provided on the stepped portion of the insulating layer. The barrier layer may include a stepped portion.

[0218] The display device may further include a pixel driving circuit disposed in the display area. The insulating layer may be an adhesive layer. The pixel driving circuit may be disposed on the insulating layer. The pixel driving circuit may be a microchip.

[0219] The display device may further include a first wiring on the substrate in the display area. The connecting wiring in the first area may be made of the same material as the first wiring in the display area. The distance from the substrate to the connecting wiring may be less than the distance from the substrate to the first wiring.

[0220] The barrier layer may comprise a plurality of beads.

[0221] The barrier layer may include a base layer and beads dispersed in the base layer.

[0222] The barrier layer may include a base layer. The base layer may include an adhesive material.

[0223] The beads may be 20 nm or less in diameter.

[0224] The thickness of the barrier layer may be thinner than the thickness of the reinforcing member.

[0225] Although the exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and can be implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are illustrative in all aspects and do not limit the present disclosure. All technical concepts within the equivalent scope of the present disclosure should be interpreted as falling within the scope of the present disclosure.

Claims

1. A display device comprising: A substrate, the substrate comprising a display area and a non-display area, the non-display area comprising a first area; connecting wiring on the substrate in the first region; a reinforcing member on the connection wiring in the first region; as well as A barrier layer between the connection wiring and the reinforcement member in the first region.

2. The display device according to claim 1, further comprising: a protective layer on the connecting wiring, Wherein, the barrier layer is between the protective layer and the reinforcing member.

3. The display device according to claim 1, wherein The first region is a region where the substrate is bent, and The barrier layer overlaps the reinforcement member and is distinct from the reinforcement member.

4. The display device according to any one of claims 1 to 3, wherein: The non-display area also includes a second area, The second area surrounds at least a portion of the display area, and The connection wiring extends from the display area to the second area and further extends to the first area.

5. The display device according to claim 4, wherein The non-display area further includes a third area extending from the first area, A driving circuit unit is provided in the third region, The connection wiring and the drive circuit unit are connected, and The barrier layer does not overlap with the driving circuit unit. The display device according to claim 5 , wherein: the barrier layer overlaps the first region between the second region and the third region, and The barrier layer overlaps at least a portion of the second region and at least a portion of the third region.

7. The display device according to claim 5, further comprising: an insulating layer provided between the substrate and the connecting wiring, Wherein, the insulating layer has a stepped portion.

8. The display device according to claim 7, wherein: The insulating layer is provided in at least one of the display region, the first region, the second region, and the third region.

9. The display device according to claim 7, wherein: The stepped portion of the insulating layer is provided to correspond to a boundary between the first region and the third region and a boundary between the second region and the third region.

10. The display device according to claim 7, further comprising: The protective layer on the connecting wiring, Wherein, the protective layer is an organic material.

11. The display device according to claim 10, wherein: The protection layer is obliquely provided on the stepped portion of the insulating layer.

12. The display device according to claim 10, wherein: The connection wiring and the barrier layer are provided on the stepped portion of the insulating layer, and The barrier layer includes a stepped portion.

13. The display device according to claim 7, further comprising: A pixel driving circuit is provided in the display area, wherein the insulating layer is an adhesive layer, The pixel driving circuit is provided on the insulating layer, and The pixel driving circuit is a microchip.

14. The display device according to any one of claims 1 to 3, further comprising: a first wiring on the substrate in the display area, wherein the connecting wiring in the first area and the first wiring in the display area are made of the same material, and A distance from the substrate to the connection wiring is shorter than a distance from the substrate to the first wiring.

15. The display device according to any one of claims 1 to 3, wherein: The barrier layer includes a plurality of beads.

16. The display device according to any one of claims 1 to 3, wherein: The barrier layer includes a base layer and beads dispersed in the base layer.

17. The display device according to any one of claims 1 to 3, wherein: The barrier layer includes a base layer, and The base layer includes an adhesive material.

18. The display device according to claim 16, wherein: The beads have a diameter of 20 nm or less.

19. The display device according to any one of claims 1 to 3, wherein: The barrier layer has a thickness thinner than that of the reinforcing member.

20. The display device according to any one of claims 1 to 3, wherein: The reinforcing member is a curable resin.

21. The display device according to claim 7, further comprising: A buffer layer is provided between the substrate and the insulating layer, Wherein, the buffer layer is not provided in the first region.

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