Display panel, manufacturing method thereof and display device

Abstract

The invention relates to a display panel, a manufacturing method thereof and a display device, and the display panel comprises a first substrate which comprises at least one first hole and comprises a first surface and a second surface which are oppositely arranged; the first metal layer is located on the side, away from the second surface, of the first surface, the first metal layer comprises a plurality of first binding terminals, and the first holes expose the corresponding first binding terminals on the second surface; the second substrate is located on the side, away from the first substrate, of the first metal layer, and the second substrate comprises a plurality of second open holes corresponding to the first binding terminals; the first conductive layer is located on one side of the second substrate away from the first substrate; wherein the first conductive layer comprises at least one limiting part, the limiting part comprises at least one first through hole, and the first through hole and the corresponding second open hole are overlapped in the thickness direction of the first substrate. The manufacturing yield can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] With the continuous development of display technology, organic light-emitting diode (OLED) display devices have been widely used in many fields such as flat panel displays, flexible displays, automotive displays and solid-state lighting due to their advantages such as wide color gamut, high contrast, energy saving and foldability.

[0003] However, with the development of display technology, how to improve the manufacturing yield when achieving an extremely narrow bezel or bezel-free design of a display panel is an urgent problem that needs to be solved. Summary of the Invention

[0004] Based on this, it is necessary to provide a display panel and a manufacturing method thereof, and a display device, aiming to solve the problem of how to improve the manufacturing yield when achieving an extremely narrow frame or frameless design of the display panel.

[0005] In a first aspect, an embodiment of the present application provides a display panel, comprising:

[0006] A first substrate comprising at least one first opening, wherein the first substrate comprises a first surface and a second surface disposed opposite to each other;

[0007] a first metal layer located on a side of the first surface away from the second surface, the first metal layer comprising a plurality of first binding terminals, the first openings exposing corresponding first binding terminals on the second surface;

[0008] a second substrate located on a side of the first metal layer away from the first substrate, the second substrate comprising a plurality of second openings corresponding to the plurality of first binding terminals;

[0009] a first conductive layer, located on a side of the second substrate away from the first substrate;

[0010] The first conductive layer includes at least one defining portion, the defining portion includes at least one first through hole, and the first through hole overlaps with the corresponding second opening in a thickness direction of the first substrate.

[0011] In a second aspect, based on the same application concept, the present application also provides a method for manufacturing a display panel, comprising:

[0012] providing a carrier board;

[0013] forming a first substrate on the carrier;

[0014] forming a first metal layer on a side of the first substrate away from the carrier;

[0015] forming a second substrate on a side of the first metal layer away from the carrier;

[0016] forming a first conductive layer on a side of the second substrate away from the carrier, wherein the first conductive layer includes at least one defining portion, and the defining portion includes at least one first through hole;

[0017] forming a photoblocking layer on a side of the first conductive layer away from the first substrate, wherein the photoblocking layer includes photoblocking holes, and the photoblocking holes overlap with the corresponding first through holes in a thickness direction of the first substrate;

[0018] Etching the second substrate through the light-blocking hole and the first through hole to form a second opening, wherein the first through hole overlaps with the corresponding second opening in a thickness direction of the first substrate;

[0019] The photoresist layer is removed.

[0020] On the third aspect, based on the same application concept, an embodiment of the present application further provides a display device, which includes any one of the display panels provided in the first aspect, or the display device includes a display panel manufactured by the manufacturing method of any one of the display panels provided in the second aspect.

[0021] In an embodiment of the present application, the first substrate includes at least one first opening; the first metal layer includes a plurality of first binding terminals, and the first openings expose the corresponding first binding terminals on the second surface; the second substrate includes a plurality of second openings corresponding to the plurality of first binding terminals; wherein the first conductive layer includes at least one limiting portion, the limiting portion includes at least one first through hole, and the first through hole overlaps with the corresponding second opening in the thickness direction of the first substrate. That is, the patterned portion of the first conductive layer serves as a defining portion, the defining portion including at least one first through-hole. When forming the second opening in the second substrate, a photoresist layer is first applied to the side of the first conductive layer facing away from the second substrate. The photoresist layer protects the remaining portion and includes the photoresist hole. The photoresist hole overlaps with the corresponding first through-hole in the thickness direction of the first substrate. Then, the second substrate is grooved by an etching process to form the second opening. In this case, even if the second substrate is thick, requiring a large etching amount, and even if the photoresist layer is partially etched, the defining portion is made of metal and is thick, which can prevent dimensional fluctuations in the first through-hole after etching. This can also prevent the second opening from not meeting required width in a direction parallel to the plane of the second substrate. For example, this can prevent the second opening from having an excessively large width, which can lead to reduced mechanical strength, or from having an excessively small width, which can lead to poor electrical conduction, or from shorting between adjacent second openings. This reduces dimensional fluctuations in the second openings and improves the yield of the display panel. At the same time, when the display panel has more or thicker film layers, for example, when there are more film layers or the thickness of the film layers is thicker between the wiring and the limiting part, the limiting part can serve as a connecting electrode between the wiring and the first binding terminal, thereby improving the stability of the electrical connection between the wiring and the first binding terminal. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 This is a schematic diagram of a first cross-sectional structure of a display panel provided in an embodiment of the present application.

[0024] Figure 2 This is a schematic diagram of a second cross-sectional structure of a display panel provided in an embodiment of the present application.

[0025] Figure 3 This is a first enlarged schematic diagram of a first opening and a second opening of a display panel provided in an embodiment of the present application.

[0026] Figure 4 This is a second enlarged schematic diagram of a first opening and a second opening of a display panel provided in an embodiment of the present application.

[0027] Figure 5 A schematic diagram of the process steps of a method for manufacturing a display panel provided in an embodiment of the present application.

[0028] Figure 6 This is a schematic diagram of a first intermediate process of a method for manufacturing a display panel provided in an embodiment of the present application.

[0029] Figure 7 This is a schematic diagram of a second intermediate process of a method for manufacturing a display panel provided in an embodiment of the present application.

[0030] Figure 8 This is a schematic diagram of a third intermediate process of a method for manufacturing a display panel provided in an embodiment of the present application.

[0031] Figure 9 A schematic diagram of a display device provided in an embodiment of the present application.

[0032] Reference numerals: display device 200; display panel 100; substrate 11; first substrate 111; first metal layer 113; first barrier layer 112; second substrate 114; first conductive layer J1; first insulating layer 14J; second conductive layer J2; first conductive electrode 273; first sub-defining portion 1311; second sub-defining portion 1312; first buffer layer 12; shielding metal layer 13; second buffer layer 14; semiconductor layer 15; first gate insulating layer 16; first conductive layer Metal layer 17; first interlayer insulating layer 18; first capacitor metal layer 19; second interlayer insulating layer 21; third interlayer insulating layer 22; second semiconductor layer 23; fourth insulating layer 24; second conductive metal layer 25; fourth interlayer insulating layer 26; third conductive metal layer 27; first planarizing layer 28; fourth conductive metal layer 29; second planarizing layer 31; first electrode layer 32; pixel definition layer 33; light-emitting functional layer 34; second electrode 35; photoresist layer 80; photoresist hole 81;

[0033] First opening 111k; second opening 114k; defining portion 131; first through hole 131k; second through hole 14k; first surface 111a; second surface 111b; first binding terminal 1131; slope angle α; shielding portion 132; active portion 151; gate 171; first capacitor electrode 172; second capacitor electrode 191; second source portion 231; second gate 251; first source 271; first drain 272; second source 274; second drain 275; first connecting electrode 291; first electrode 321; pixel definition structure 331; light-emitting device 345; circuit board 42; second binding terminal 421; first adhesive 41; conductive connecting portion 43; second adhesive 44. DETAILED DESCRIPTION

[0034] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure of the present application.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" as used herein includes any and all combinations of one or more of the relevant listed items.

[0036] When describing positional relationships, unless otherwise specified, when an element such as a layer, film, or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. Furthermore, when a layer is referred to as being "under" another layer, it can be directly under or one or more intervening elements may also be present. It will also be understood that when a layer is referred to as being "between" two layers, it can be the only layer between the two layers or one or more intervening elements may also be present.

[0037] In the case of using “including,” “having,” and “comprising” described herein, another component may be added unless a clear limiting term such as “only,” “consisting of,” etc. is used. Unless mentioned otherwise, a term in the singular form may include a plural form and should not be understood as having one number.

[0038] It should be understood that although the terms "first," "second," etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element, without departing from the scope of this application.

[0039] It should also be understood that when interpreting an element, even if not explicitly described, the element is interpreted as including a range of error, which should be within the acceptable deviation range of the specific value determined by those skilled in the art. For example, "approximately," "approximately," or "substantially" can mean within one or more standard deviations, and is not limited here.

[0040] Furthermore, in the specification, the phrase “planar distribution diagram” refers to a drawing when the target portion is viewed from above, and the phrase “cross-sectional diagram” refers to a drawing when a section taken by vertically cutting the target portion is viewed from the side.

[0041] In addition, the drawings are not drawn to a 1:1 scale, and the relative sizes of the elements in the drawings are drawn only as examples and not necessarily according to the true scale.

[0042] It will be apparent to those skilled in the art that various modifications and variations can be made to this application without departing from the spirit or scope of this application. Therefore, this application is intended to cover modifications and variations of this application that fall within the scope of the corresponding claims (technical solutions claimed for protection) and their equivalents. It should be noted that the embodiments provided in the examples of this application may be combined with each other unless there is any inconsistency.

[0043] As described in the background technology section, with the development of display technology, how to improve the manufacturing yield when realizing the extremely narrow frame or frameless design of the display panel is an urgent problem to be solved. Back-side binding technology has been gradually developed to realize the extremely narrow frame or frameless design. The substrate includes a first substrate and a second substrate, a first metal layer is located between the first substrate and the second substrate, the first metal layer includes a plurality of first binding terminals, the first substrate includes a first opening, the second substrate includes a second opening, the first binding terminal is electrically connected to the second binding terminal on the circuit board through the first opening, and the first binding terminal is electrically connected to the wiring in the display panel through the second opening, so that the circuit board can be electrically connected to the wiring through the first opening, the first binding terminal, and the second opening in sequence. In the related art, a process of first coating photoresist and then etching is required to groove the second substrate to produce the second opening. However, the second substrate is thicker and requires a larger amount of etching. At this time, the photoresist is also partially etched, which easily leads to the situation that the width of the second opening in the direction parallel to the plane of the second substrate does not meet the requirements. For example, when the width of the second opening is too large, it is easy to cause a serious decrease in the mechanical strength here. For example, when the width of the second opening is too small, it is easy to cause the electrical conduction here to be not smooth. For example, in severe cases, it causes a short circuit between two adjacent second openings, thereby reducing the yield of the display panel.

[0044] Based on the above technical problems, the inventors have found that the first substrate includes at least one first opening; the first metal layer includes multiple first binding terminals, and the first openings expose the corresponding first binding terminals on the second surface; the second substrate includes multiple second openings corresponding to the multiple first binding terminals; wherein, the first conductive layer includes at least one limiting portion, the limiting portion includes at least one first through hole, and the first through hole overlaps with the corresponding second opening in the thickness direction of the first substrate. That is, the patterned portion of the first conductive layer serves as a defining portion, the defining portion including at least one first through-hole. When forming the second opening in the second substrate, a photoresist layer is first applied to the side of the first conductive layer facing away from the second substrate. The photoresist layer protects the remaining portion and includes the photoresist hole. The photoresist hole overlaps with the corresponding first through-hole in the thickness direction of the first substrate. Then, the second substrate is grooved by an etching process to form the second opening. In this case, even if the second substrate is thick, requiring a large etching amount, and even if the photoresist layer is partially etched, the defining portion is made of metal and is thick, which can prevent dimensional fluctuations in the first through-hole after etching. This can also prevent the second opening from not meeting required width in a direction parallel to the plane of the second substrate. For example, this can prevent the second opening from having an excessively large width, which can lead to reduced mechanical strength, or from having an excessively small width, which can lead to poor electrical conduction, or from shorting between adjacent second openings. This reduces dimensional fluctuations in the second openings and improves the yield of the display panel. At the same time, when the display panel has more or thicker film layers, for example, when there are more film layers or the thickness of the film layers is thicker between the wiring and the limiting part, the limiting part can serve as a connecting electrode between the wiring and the first binding terminal, thereby improving the stability of the electrical connection between the wiring and the first binding terminal.

[0045] The above is the core concept of this application. The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making any creative work are within the scope of protection of this application.

[0046] See also Figures 1 to 4 . Figure 1 This is a schematic diagram of a first cross-sectional structure of a display panel provided in an embodiment of the present application. Figure 2 This is a schematic diagram of a second cross-sectional structure of a display panel provided in an embodiment of the present application. Figure 3 This is a first enlarged schematic diagram of a first opening and a second opening of a display panel provided in an embodiment of the present application. Figure 4 This is a second enlarged schematic diagram of a first opening and a second opening of a display panel provided in an embodiment of the present application.

[0047] The present application provides a display panel 100, which includes a first substrate 111, a first metal layer 113, a second substrate 114, and a first conductive layer J1. The first substrate 111 includes at least one first opening 111k and comprises a first surface 111a and a second surface 111b disposed opposite each other. The first metal layer 113 is located on a side of the first surface 111a away from the second surface 111b. The first metal layer 113 includes a plurality of first binding terminals 1131, and the first openings 111k expose corresponding first binding terminals 1131 on the second surface 111b. The second substrate 114 is located on a side of the first metal layer 113 away from the first substrate 111 and includes a plurality of second openings 114k corresponding to the plurality of first binding terminals 1131. The first conductive layer J1 is located on a side of the second substrate 114 away from the first substrate 111. The first conductive layer J1 includes at least one defining portion 131 , and the defining portion 131 includes at least one first through hole 131 k . The first through hole 131 k overlaps with the corresponding second opening 114 k in the thickness direction of the first substrate 111 .

[0048] For example, Figure 1 As shown, the substrate 11 includes a first substrate 111, a first barrier layer 112, a first metal layer 113, and a second substrate 114. The first barrier layer 112 and the first metal layer 113 are located between the first substrate 111 and the second substrate 114. Figure 1 As shown, the first metal layer 113 may be disposed between the first barrier layer 112 and the second substrate 114. Figure 2 As shown, the first metal layer 113 may be disposed between the first barrier layer 112 and the first substrate 111. The substrate 11 may also have other structures. For example, the substrate 11 may not include the first barrier layer 112.

[0049] For example, the first barrier layer 112 is a barrier layer. The first barrier layer 112 has a strong ability to block and isolate water vapor and oxygen. The material of the first barrier layer 112 includes but is not limited to silicon oxide, silicon nitride, and silicon oxynitride. The first barrier layer 112 is an insulating material.

[0050] For example, the material of the first substrate 111 may include polyimide (PI), and the material of the second substrate 114 may include polyimide (PI). The material of the first substrate 111 and the material of the second substrate 114 may be the same or different, which is not limited here.

[0051] For example, the first conductive layer J1 is located on a side of the second substrate 114 away from the first substrate 111. The first conductive layer J1 includes at least one defining portion 131, which includes at least one first through hole 131k. The first through hole 131k overlaps with the corresponding second opening 114k in the thickness direction of the first substrate 111. That is, the orthographic projection of the first through hole 131k on the second substrate 114 at least partially overlaps with the corresponding second opening 114k.

[0052] For example, the patterned portion of the first conductive layer J1 is used as the defining portion 131, and the defining portion 131 includes at least one first through hole 131k. When manufacturing the second opening 114k in the second substrate 114, a photoresist layer 80 is first coated on the side of the first conductive layer J1 away from the second substrate 114 (as shown in the subsequent embodiments). Figure 7 As shown in FIG, the photoresist layer 80 protects other parts and includes a photoresist hole 81. The photoresist hole 81 overlaps with the corresponding first through hole 131k in the thickness direction of the first substrate 111. The second substrate 114 is then grooved by an etching process to produce a second opening 114k. This process causes the first through hole 131k to overlap with the corresponding second opening 114k in the thickness direction of the first substrate 111.

[0053] For example, the first through hole 131 k and the corresponding second opening 114 k overlap in the thickness direction of the first substrate 111 , which can facilitate subsequent wiring to electrically connect the first binding terminal 1131 through the first through hole 131 k and the corresponding second opening 114 k in sequence.

[0054] In an embodiment of the present application, the first substrate 111 includes at least one first opening 111k; the first metal layer 113 includes a plurality of first binding terminals 1131, and the first opening 111k exposes the corresponding first binding terminals 1131 on the second surface 111b; the second substrate 114 includes a plurality of second openings 114k corresponding to the plurality of first binding terminals 1131; wherein, the first conductive layer J1 includes at least one limiting portion 131, the limiting portion 131 includes at least one first through hole 131k, and the first through hole 131k overlaps with the corresponding second opening 114k in the thickness direction of the first substrate 111. That is, the patterned portion of the first conductive layer J1 is used as the defining portion 131, and the defining portion 131 includes at least one first through hole 131k. When manufacturing the second opening 114k in the second substrate 114, a photoresist layer 80 is first coated on the side of the first conductive layer J1 away from the second substrate 114. The photoresist layer 80 protects the other portions and includes photoresist holes 81. The photoresist holes 81 overlap with the corresponding first through holes 131k in the thickness direction of the first substrate 111. Then, the second substrate 114 is grooved by an etching process to manufacture the second opening 114k. At this time, even if the thickness of the second substrate 114 is relatively thick and a large amount of etching is required, even if the photoresist layer 80 is thick, the second opening 114k is manufactured. There is also the possibility of partial etching, but the limiting portion 131 is made of metal and is relatively thick, which can prevent the first through hole 131k from fluctuating in size after being etched, thereby preventing the second opening 114k from having a width that does not meet the requirements in the direction parallel to the plane of the second substrate 114. For example, it can prevent the problem of the second opening 114k being too large, which leads to a decrease in mechanical strength at this location. For example, it can prevent the problem of the second opening 114k being too small, which leads to poor electrical conduction at this location. For example, it can prevent the problem of two adjacent second openings 114k short-circuiting. This reduces the fluctuation of the size of the second opening 114k and improves the yield of the display panel. At the same time, when the display panel has many or thicker film layers, for example, when there are many or thicker film layers between the wiring and the limiting portion 131, the limiting portion 131 can serve as a connecting electrode between the wiring and the first binding terminal 1131, thereby improving the stability of the electrical connection between the wiring and the first binding terminal 1131.

[0055] In some embodiments, the display panel 100 further includes a first insulating layer 14J and a second conductive layer J2. The first insulating layer 14J is located on a side of the first conductive layer J1 away from the first substrate 111; the second conductive layer J2 is located on a side of the first insulating layer 14J away from the first substrate 111. The first insulating layer 14J includes a second through hole 14k, and the second conductive layer J2 includes a first conductive electrode 273. The first conductive electrode 273 is electrically connected to the corresponding first binding terminal 1131 via at least the second through hole 14k and the first through hole 131k.

[0056] For example, the second conductive layer J2 includes a first conductive electrode 273, which is electrically connected to the corresponding first binding terminal 1131 via at least the second through-hole 14k and the first through-hole 131k. The first conductive electrode 273 may be part of a wiring, and the first conductive electrode 273 may be electrically connected to the wiring. The wiring may be any of, but is not limited to, a scan signal line, a data signal line, a clock signal line in a gate drive circuit, a first power signal line (VDD signal line) in a pixel drive circuit in an OLED panel, or a second power signal line (VSS signal line) in a pixel drive circuit in an OLED panel.

[0057] For example, in some embodiments, Figure 1 As shown, the second conductive layer J2 includes a first conductive electrode 273, which is electrically connected to the corresponding first binding terminal 1131 through at least the second through hole 14k and the first through hole 131k; a portion of the first conductive electrode 273 is filled in the second through hole 14k and the first through hole 131k to be electrically connected to the corresponding first binding terminal 1131.

[0058] For example, in some other embodiments, Figure 1 Not shown, the second conductive layer J2 includes a first conductive electrode 273, and the first conductive electrode 273 is electrically connected to the corresponding first binding terminal 1131 through at least the second through hole 14k and the first through hole 131k; the first conductive electrode 273 is connected to the connecting electrode filled in the second through hole 14k and the first through hole 131k to be electrically connected to the corresponding first binding terminal 1131, and the connecting electrode filled in the second through hole 14k and the first through hole 131k can be a conductive layer or a metal layer different from the second conductive layer J2.

[0059] In some embodiments, as Figure 3 and Figure 4 As shown, on a plane parallel to the first substrate 111, the limiting portion 131 includes a first sub-limiting portion 1311 close to the first through hole 131k, and a second sub-limiting portion 1312 located on the first sub-limiting portion 1311 away from the first through hole 131k; in a direction perpendicular to the plane of the first substrate 111, the thickness of the first sub-limiting portion 1311 is smaller than the thickness of the second sub-limiting portion 1312, and the surface of the limiting portion 131 away from the first substrate 111 is sloped or stepped.

[0060] For example, Figure 3 and Figure 4As shown, when preparing the second opening 114k, a photoresist layer 80 is first coated on the side of the first conductive layer J1 away from the second substrate 114. The photoresist layer 80 protects other parts and includes a photoresist hole 81. The photoresist hole 81 overlaps with the corresponding first through hole 131k in the thickness direction of the first substrate 111. Then, the second substrate 114 is grooved by an etching process to produce the second opening 114k. At this time, the thickness of the second substrate 114 is relatively thick and requires a larger amount of etching, so that the first sub-defining portion 1311 around the first through hole 131k is etched a small amount, so that the thickness of the first sub-defining portion 1311 is less than the thickness of the second sub-defining portion 1312.

[0061] For example, Figure 3 As shown, in some embodiments, the thickness of the first sub-defining portion 1311 is less than the thickness of the second sub-defining portion 1312, and the surface of the defining portion 131 away from the first substrate 111 is stepped, that is, the first sub-defining portion 1311 and the second sub-defining portion 1312 are stepped.

[0062] For example, Figure 4 As shown, in some embodiments, the thickness of the first sub-defining portion 1311 is less than the thickness of the second sub-defining portion 1312, and the surface of the defining portion 131 away from the first substrate 111 is sloped, that is, the first sub-defining portion 1311 and the second sub-defining portion 1312 are sloped.

[0063] In some embodiments, as Figure 4 As shown, the surface of the defining portion 131 away from the first substrate 111 is sloped, and the slope angle α is less than or equal to 75 degrees. The slope angle α is the angle between the tangent of the sloped surface and the surface of the defining portion 131 close to the first substrate 111.

[0064] For example, Figure 4 As shown, the slope angle α is less than or equal to 75 degrees, and the slope angle α can be any value among 75 degrees, 70 degrees, 65 degrees, 60 degrees, 55 degrees, 50 degrees, 45 degrees, 40 degrees, 35 degrees, and 30 degrees. Avoiding the slope angle α being too large and the slope being too steep can avoid poor contact such as disconnection and breakage when the first conductive electrode 273 is electrically connected to the corresponding first binding terminal 1131 at least through the second through hole 14k and the first through hole 131k.

[0065] In some embodiments, as Figure 3 and Figure 4 As shown, the orthographic projection of the second opening 114 k on the plane where the first substrate 111 is located is located within the range of the orthographic projection of the corresponding first through hole 131 k on the plane where the first substrate 111 is located.

[0066] For example, Figure 3 and Figure 4As shown, the orthographic projection of the second opening 114k on the plane where the first substrate 111 is located is located within the range of the orthographic projection of the corresponding first through hole 131k on the plane where the first substrate 111 is located. This can prevent the first conductive electrode 273 and other conductive materials from being unable to completely fill the second opening 114k, and can prevent the formation of a hollow structure at the second opening 114k, thereby improving the mechanical strength of the display panel 100 at this location.

[0067] In some embodiments, as Figure 3 and Figure 4 As shown, the center of the orthographic projection of the second opening 114 k on the plane where the first substrate 111 is located overlaps with the center of the orthographic projection of the corresponding first through hole 131 k on the plane where the first substrate 111 is located.

[0068] In some embodiments, as Figure 1 and Figure 2 As shown, the first through hole 131 k overlaps with the corresponding second through hole 14 k in the thickness direction of the first substrate 111 .

[0069] For example, Figure 1 and Figure 2 As shown, the first through hole 131k and the corresponding second through hole 14k overlap in the thickness direction of the first substrate 111, that is, the orthographic projection of the first through hole 131k on the second substrate 114 and the orthographic projection of the second through hole 14k on the second substrate 114 at least partially overlap, which can facilitate the first conductive electrode 273 to be electrically connected to the corresponding first binding terminal 1131 at least in sequence through the second through hole 14k, the first through hole 131k, and the second opening 114k, and can facilitate the first conductive electrode 273 to be deposited or fall into the second through hole 14k, the first through hole 131k, and the second opening 114k.

[0070] In some embodiments, as Figure 3 and Figure 4 As shown, the center of the orthographic projection of the first through hole 131 k on the plane where the first substrate 111 is located overlaps with the center of the orthographic projection of the corresponding second through hole 14 k on the plane where the first substrate 111 is located.

[0071] For example, the center of the orthographic projection of the first through hole 131k on the plane where the first substrate 111 is located overlaps with the center of the orthographic projection of the corresponding second through hole 14k on the plane where the first substrate 111 is located, and the performance of the first conductive electrode 273 being electrically connected to the corresponding first binding terminal 1131 at least in sequence through the second through hole 14k, the first through hole 131k, and the second opening 114k is better or optimal.

[0072] In some embodiments, as Figure 1 and Figure 2As shown, the display panel 100 further includes a first barrier layer 112, a first buffer layer 12, a blocking metal layer 13, a second buffer layer 14, and a semiconductor layer 15. The first barrier layer 112 is located between the first metal layer 113 and the first substrate 111, and the first opening 111k passes through the first barrier layer 112, or the first barrier layer 112 is located between the first metal layer 113 and the second substrate 114, and the second opening 114k passes through the first barrier layer 112; the first buffer layer 12 is located between the first metal layer 113 and the second substrate 114, and the second opening 114k passes through the first buffer layer 12; the blocking metal layer 13 is located on the side of the first buffer layer 12 away from the first substrate 111; the second buffer layer 14 is located on the side of the blocking metal layer 13 away from the first substrate 111; the semiconductor layer 15 is located on the side of the second buffer layer 14 away from the first substrate 111, and the semiconductor layer 15 includes an active portion 151 of a thin film transistor. Among them, the blocking metal layer 13 is the first conductive layer J1, the second buffer layer 14 is the first insulating layer 14J, the blocking metal layer 13 includes a blocking portion 132, and the orthographic projection of the active portion 151 on the first substrate 111 is located within the range of the orthographic projection of the blocking portion 132 on the first substrate 111.

[0073] For example, the shielding metal layer 13 includes a shielding portion 132, and the orthographic projection of the active portion 151 on the first substrate 111 is located within the orthographic projection of the shielding portion 132 on the first substrate 111; alternatively, the orthographic projection of the active portion 151 on the first substrate 111 at least partially overlaps with the orthographic projection of the corresponding shielding portion 132 on the first substrate 111. The semiconductor layer 15 may be made of low-temperature polysilicon. The shielding portion 132 can block external light from entering the active portion 151, or it can block impurity ions (such as impurity ions in the substrate 11) from entering the active portion 151, thereby improving the performance of the first thin-film transistor.

[0074] For example, Figure 1As shown, the film structure of the display panel 100 includes a first buffer layer 12, a blocking metal layer 13, a second buffer layer 14, a semiconductor layer 15, a first gate insulating layer 16, a first conductive metal layer 17, a first interlayer insulating layer 18, a first capacitor metal layer 19, a second interlayer insulating layer 21, a third interlayer insulating layer 22, a second semiconductor layer 23, a fourth insulating layer 24, a second conductive metal layer 25, a fourth interlayer insulating layer 26, a third conductive metal layer 27, a first planarizing layer 28, a fourth conductive metal layer 29, a second planarizing layer 31, a first electrode layer 32, a pixel definition layer 33, a light-emitting functional layer 34, and a second electrode 35, stacked sequentially on a second substrate 114. The blocking metal layer 13 includes a defining portion 131 and a blocking portion 132. The semiconductor layer 15 includes an active portion 151 (the first active portion of the first thin film transistor). The first conductive metal layer 17 includes a gate electrode 171 of the thin film transistor (the first gate electrode of the first thin film transistor) and a first capacitor electrode 172. The first capacitor metal layer 19 includes a second capacitor electrode 191. The second semiconductor layer 23 includes a second source portion 231 (the second active portion of the second thin film transistor). The second conductive metal layer 25 includes a second gate electrode 251 (the gate of the second thin film transistor). The third conductive metal layer 27 includes a first source electrode 271 and a first drain electrode 272 of the first thin film transistor, and a second source electrode 274 and a second drain electrode 275 of the second thin film transistor. The third conductive metal layer 27 also includes a first conductive electrode 273, a wiring or an electrode electrically connected to the wiring. Figure 1 , the first conductive electrode 273 is electrically connected to the first source electrode 271 of the first thin film transistor. The fourth conductive metal layer 29 includes a first connecting electrode 291, which is connected between the first electrode 321 and the first drain electrode 272. The first electrode layer 32 includes a plurality of first electrodes 321. The pixel definition layer 33 includes a pixel definition structure 331 and a plurality of pixel openings surrounded by the pixel definition structure 331. The pixel openings expose the corresponding first electrodes 321, and the light-emitting functional layer 34 is at least partially disposed within the pixel openings. The display panel 100 includes a plurality of light-emitting devices 345, each of which includes a first electrode 321, a light-emitting functional layer 34, and a second electrode 35 arranged in a stacked manner.

[0075] It should be noted that Figure 1 Schematically, the display panel 100 includes a first thin film transistor and a second thin film transistor. The active portion 151 of the first thin film transistor may be low-temperature polysilicon, and the second source portion 231 of the second thin film transistor may be an oxide semiconductor, which is not limited here.

[0076] It should be noted that the film structure of the display panel 100 is not limited to Figure 1As shown, for example, the display panel 100 includes one of a first thin film transistor and a second thin film transistor; for example, the film layer structure of the display panel 100 does not include one of the second interlayer insulating layer 21 and the third interlayer insulating layer 22; for example, one of the second interlayer insulating layer 21 and the third interlayer insulating layer 22 is a gate insulating layer; for example, the film layer structure of the display panel 100 does not include either the first capacitor metal layer 19 or the fourth conductive metal layer 29.

[0077] For example, Figure 1 It illustrates that the blocking metal layer 13 is the first conductive layer J1, the third conductive metal layer 27 is the second conductive layer J2, and the second buffer layer 14 is the first insulating layer 14J, but is not limited thereto. For example, in other embodiments, the wiring may also be patterned from other metal layers or conductive metal layers, for example, the first capacitor metal layer 19 may be the second conductive layer J2, for example, the fourth conductive metal layer 29 may be the second conductive layer J2, for example, the fourth interlayer insulating layer 26 may be the first insulating layer 14J.

[0078] For example, the blocking metal layer 13 is the first conductive layer J1, and the blocking metal layer 13 includes a limiting portion 131 and a blocking portion 132. Since the second substrate 114 is thicker, the blocking metal layer 13 is very close to the second substrate 114, and the film thickness between the blocking metal layer 13 and the second substrate 114 is small or 0. When etching to form the second opening 114k, it is easier to control the morphology of various parts of the second opening 114k in the direction perpendicular to the plane of the second substrate 114.

[0079] In some embodiments, the display panel 100 further includes a circuit board 42 , which is located on a side of the second surface 111 b away from the first surface 111 a . The circuit board 42 includes a plurality of second binding terminals 421 , which are electrically connected to corresponding first binding terminals 1131 .

[0080] For example, Figure 1 As shown, the circuit board 42 includes a circuit board body and a second binding terminal 421 located on the circuit board body. A first adhesive material 41 is arranged between the circuit board 42 and the first binding terminal 1131. The first adhesive material 41 can be NCF adhesive (non-conductive film). The first adhesive material 41 is used to support and carry the circuit board 42, but the material of the first adhesive material 41 is not limited to NCF adhesive.

[0081] For example, Figure 1As shown, the display panel 100 includes a plurality of conductive connecting parts 43, which connect the second binding terminal 421 with the corresponding first binding terminal 1131. The second binding terminal 421 and the corresponding first binding terminal 1131 are electrically connected by being bound through the conductive connecting part 43. The conductive connecting part 43 can be a conductive material such as silver glue, conductive ink, etc., but the material of the conductive connecting part 43 is not limited to silver glue and conductive ink.

[0082] For example, Figure 1 As shown, the outer side of the conductive connection part 43 is covered with a second adhesive material 44 . The second adhesive material 44 is an insulating protective adhesive that can protect the conductive connection part 43 and other parts.

[0083] See also Figures 5 to 8 , Figure 5 A schematic diagram of the process steps of a method for manufacturing a display panel provided in an embodiment of the present application. Figure 6 This is a schematic diagram of a first intermediate process of a method for manufacturing a display panel provided in an embodiment of the present application. Figure 7 This is a schematic diagram of a second intermediate process of a method for manufacturing a display panel provided in an embodiment of the present application. Figure 8 This is a schematic diagram of a third intermediate process of a method for manufacturing a display panel provided in an embodiment of the present application.

[0084] Based on the same application concept, the present application also provides a method for manufacturing a display panel, which can be used to manufacture any of the above-mentioned display panels 100. The method for manufacturing a display panel includes: step S100, step S200, step S300, step S400, step S500, step S600, step S700, and step S800.

[0085] Step S100: providing a carrier board.

[0086] Illustratively, a carrier board is provided.

[0087] Step S200 , forming a first substrate on the carrier.

[0088] Illustratively, a first substrate 111 is formed on a carrier.

[0089] Step S300 : forming a first metal layer on a side of the first substrate away from the carrier.

[0090] For example, the first metal layer 113 is formed on a side of the first substrate 111 away from the carrier.

[0091] Step S400 : forming a second substrate on a side of the first metal layer away from the carrier.

[0092] For example, the second substrate 114 is formed on a side of the first metal layer 113 away from the carrier.

[0093] Step S500 : forming a first conductive layer on a side of the second substrate away from the carrier, wherein the first conductive layer includes at least one defining portion, and the defining portion includes at least one first through hole.

[0094] For example, Figure 6 As shown, a first conductive layer J1 is formed on a side of the second substrate 114 away from the carrier, wherein the first conductive layer J1 includes at least one defining portion 131 , and the defining portion 131 includes at least one first through hole 131 k .

[0095] In step S600 , a photoresist layer is formed on a side of the first conductive layer away from the first substrate, wherein the photoresist layer includes photoresist holes, and the photoresist holes overlap with the corresponding first through holes in a thickness direction of the first substrate.

[0096] For example, Figure 7 As shown, a photoresist layer 80 is formed on a side of the first conductive layer J1 away from the first substrate 111 . The photoresist layer 80 includes photoresist holes 81 . The photoresist holes 81 overlap with the corresponding first through holes 131 k in the thickness direction of the first substrate 111 .

[0097] In step S700 , the second substrate is etched through the light-blocking hole and the first through hole to form a second opening, wherein the first through hole overlaps with the corresponding second opening in a thickness direction of the first substrate.

[0098] For example, the second substrate 114 is etched through the light blocking hole 81 and the first through hole 131 k to form the second opening 114 k . The first through hole 131 k overlaps with the corresponding second opening 114 k in the thickness direction of the first substrate 111 .

[0099] Step S800: removing the photoresist layer.

[0100] Illustratively, the photoresist layer 80 is removed.

[0101] For example, the method for manufacturing a display panel according to the embodiment of the present application has the effects of any of the above-mentioned display panels 100 , which will not be described in detail here.

[0102] In some embodiments, as Figure 3 and Figure 4As shown, on a plane parallel to the first substrate 111, the limiting portion 131 includes a first sub-limiting portion 1311 close to the first through hole 131k, and a second sub-limiting portion 1312 located on the first sub-limiting portion 1311 away from the first through hole 131k; in a direction perpendicular to the plane of the first substrate 111, the thickness of the first sub-limiting portion 1311 is smaller than the thickness of the second sub-limiting portion 1312, and the surface of the limiting portion 131 away from the first substrate 111 is sloped or stepped.

[0103] In some embodiments, as Figure 3 and Figure 4 As shown, the surface of the defining portion 131 away from the first substrate 111 is sloped, and the slope angle is less than or equal to 75 degrees. The slope angle is the angle between the tangent of the sloped surface and the surface of the defining portion 131 close to the first substrate 111.

[0104] In some embodiments, the orthographic projection of the second opening 114k on the plane where the first substrate 111 is located is located within the range of the orthographic projection of the corresponding first through hole 131k on the plane where the first substrate 111 is located; the center of the orthographic projection of the second opening 114k on the plane where the first substrate 111 is located overlaps with the center of the orthographic projection of the corresponding first through hole 131k on the plane where the first substrate 111 is located.

[0105] See also Figure 9 , Figure 9 A schematic diagram of a display device provided in an embodiment of the present application.

[0106] On the third aspect, based on the same application concept, the present application also provides a display device 200, which includes the display panel 100 of any one of the above items, or the display device 200 includes the display panel 100 combining any of the above features, or the display device 200 includes a display panel manufactured by the manufacturing method of any one of the above display panels.

[0107] For example, the display device 200 also has the beneficial effects of the display panel 100 in the above embodiment. The similarities can be understood by referring to the above explanation of the display panel 100 and will not be repeated below.

[0108] For example, the display device 200 provided in the embodiment of the present application can be Figure 9 The mobile phone shown can also be any electronic product with a display function, including but not limited to the following categories: televisions, laptops, desktop monitors, tablet computers, digital cameras, smart bracelets, smart glasses, car displays, industrial control equipment, medical display screens, touch interactive terminals, etc. The embodiments of this application do not specifically limit this.

[0109] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0110] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art could make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A display panel, characterized in that: include: A first substrate comprising at least one first opening, wherein the first substrate comprises a first surface and a second surface disposed opposite to each other; a first metal layer located on a side of the first surface away from the second surface, the first metal layer comprising a plurality of first binding terminals, the first openings exposing corresponding first binding terminals on the second surface; a second substrate located on a side of the first metal layer away from the first substrate, the second substrate comprising a plurality of second openings corresponding to the plurality of first binding terminals; a first conductive layer, located on a side of the second substrate away from the first substrate; The first conductive layer includes at least one defining portion, the defining portion includes at least one first through hole, and the first through hole overlaps with the corresponding second opening in a thickness direction of the first substrate.

2. The display panel according to claim 1, wherein: Also includes: a first insulating layer, located on a side of the first conductive layer away from the first substrate; a second conductive layer, located on a side of the first insulating layer away from the first substrate; The first insulating layer includes a second through hole, the second conductive layer includes a first conductive electrode, and the first conductive electrode is electrically connected to the corresponding first binding terminal at least through the second through hole and the first through hole.

3. The display panel according to claim 1, wherein: On a plane parallel to the first substrate, the defining portion includes a first sub-defining portion close to the first through hole, and a second sub-defining portion located on the first sub-defining portion away from the first through hole; In a direction perpendicular to the plane where the first substrate is located, the thickness of the first sub-defining portion is smaller than the thickness of the second sub-defining portion, and the surface of the defining portion away from the first substrate is sloped or stepped.

4. The display panel according to claim 3, wherein: The surface of the limiting portion away from the first substrate is in the slope shape, and the slope angle of the slope is less than or equal to 75 degrees. The slope angle is the angle between the tangent of the slope surface and the surface of the limiting portion close to the first substrate.

5. The display panel according to claim 2, wherein: The orthographic projection of the second opening on the plane where the first substrate is located is located within the range of the orthographic projection of the corresponding first through hole on the plane where the first substrate is located; and / or, The center of the orthographic projection of the second opening on the plane where the first substrate is located overlaps with the center of the orthographic projection of the corresponding first through hole on the plane where the first substrate is located; and / or, The first through hole overlaps with the corresponding second through hole in a thickness direction of the first substrate; A center of an orthographic projection of the first through hole on the plane where the first substrate is located overlaps with a center of an orthographic projection of the corresponding second through hole on the plane where the first substrate is located.

6. The display panel according to claim 2, wherein: include: a first barrier layer, located between the first metal layer and the first substrate, with the first opening penetrating the first barrier layer, or a first barrier layer located between the first metal layer and the second substrate, with the second opening penetrating the first barrier layer; a first buffer layer, located between the first metal layer and the second substrate, wherein the second opening passes through the first buffer layer; a shielding metal layer, located on a side of the first buffer layer away from the first substrate; a second buffer layer, located on a side of the shielding metal layer away from the first substrate; a semiconductor layer, located on a side of the second buffer layer away from the first substrate, the semiconductor layer including an active portion of a thin film transistor; The blocking metal layer is the first conductive layer, the second buffer layer is the first insulating layer, the blocking metal layer includes a blocking portion, and the orthographic projection of the active portion on the first substrate is within the range of the orthographic projection of the blocking portion on the first substrate.

7. The display panel according to claim 1, wherein: Also includes: The circuit board is located on a side of the second surface away from the first surface, and the circuit board includes a plurality of second binding terminals, and the second binding terminals are electrically connected to the corresponding first binding terminals.

8. A method for manufacturing a display panel, characterized in that: include: providing a carrier board; forming a first substrate on the carrier; forming a first metal layer on a side of the first substrate away from the carrier; forming a second substrate on a side of the first metal layer away from the carrier; forming a first conductive layer on a side of the second substrate away from the carrier, wherein the first conductive layer includes at least one defining portion, and the defining portion includes at least one first through hole; forming a photoblocking layer on a side of the first conductive layer away from the first substrate, wherein the photoblocking layer includes photoblocking holes, and the photoblocking holes overlap with the corresponding first through holes in a thickness direction of the first substrate; Etching the second substrate through the light-blocking hole and the first through hole to form a second opening, wherein the first through hole overlaps with the corresponding second opening in a thickness direction of the first substrate; The photoresist layer is removed.

9. The method for manufacturing a display panel according to claim 8, wherein: On a plane parallel to the first substrate, the defining portion includes a first sub-defining portion close to the first through hole, and a second sub-defining portion located on the first sub-defining portion away from the first through hole; In a direction perpendicular to the plane of the first substrate, the thickness of the first sub-defining portion is smaller than the thickness of the second sub-defining portion, and the surface of the defining portion away from the first substrate is sloped or stepped; or The surface of the defining portion on one side away from the first substrate is in the slope shape, and the slope angle of the slope is less than or equal to 75 degrees, and the slope angle is the angle between the tangent line of the slope surface and the surface of the defining portion close to the first substrate; or The orthographic projection of the second opening on the plane where the first substrate is located is located within the range of the orthographic projection of the corresponding first through hole on the plane where the first substrate is located; The center of the orthographic projection of the second opening on the plane where the first substrate is located overlaps with the center of the orthographic projection of the corresponding first through hole on the plane where the first substrate is located.

10. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 7.

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