Camera actuator and camera module including the same

Abstract

Disclosed in an embodiment of the present invention is a camera module comprising a first actuator, a second actuator, and a circuit board sequentially arranged in an optical axis direction, in which the circuit board comprises: a first circuit board unit on which an image sensor is mounted; and a second circuit board unit connected to the first circuit board and extending in the optical axis direction, and overlapping with the first actuator and the second actuator in a direction perpendicular to the optical axis direction so as to be connected with the first actuator.

Description

Technical Field

[0001] The present invention relates to a camera actuator and a camera module including the camera actuator. Background Art

[0002] A camera is a device that takes photos or videos of an object and is installed in portable devices, drones, vehicles, etc. Camera modules may have an image stabilization (IS) function that corrects or prevents image shaking caused by user movement; an autofocus function that automatically adjusts the gap between the image sensor and the lens to align the lens's focal length; and a zoom function that uses a zoom lens to increase or decrease the magnification of distant objects when taking photos to improve image quality.

[0003] Due to the trend of miniaturization of camera devices, effective electrical connections between circuit boards in camera devices are crucial.

[0004] Furthermore, a structure is needed to reduce assembly and reliability defects in miniaturized camera modules. Summary of the Invention

[0005] Technical issues

[0006] A technical problem to be solved by embodiments of the present invention is to provide a camera actuator and a camera module having improved assemblability and enhanced reliability through a connector portion even in the case of a long stroke.

[0007] According to embodiments of the present invention, a camera actuator and a camera module can be provided in which assembly tolerance is eliminated and inflow of foreign matter is suppressed by controlling the structure of a circuit board.

[0008] According to embodiments of the present invention, a camera actuator and a camera module suitable for an ultra-thin, ultra-small, and high-resolution camera can be provided.

[0009] Furthermore, the technical problem to be solved by the present invention is to provide a camera actuator and a camera device, wherein in the camera device including the actuator, an effective connection between a main board of the actuator and a circuit board can be achieved.

[0010] Another technical problem to be solved by the present invention is to provide a camera actuator suitable for ultra-thin, ultra-small and high-resolution cameras.

[0011] The problems to be solved by this embodiment are not limited thereto, and also include solutions to the problems to be described below or purposes or effects that can be obtained in the embodiments.

[0012] Technical Solution

[0013] According to one embodiment of the present invention, a camera module includes: a first actuator, a second actuator and an image sensor arranged in sequence along an optical axis direction, and a circuit board arranged adjacent to the first actuator and the second actuator, wherein the circuit board includes: a first circuit board portion on which the image sensor is placed; and a second circuit board portion connected to the first circuit board portion and extending along the optical axis direction, and the second circuit board portion overlaps with the first actuator and the second actuator in a direction perpendicular to the optical axis direction and is connected to the first actuator.

[0014] A length of the first actuator in a direction perpendicular to the optical axis direction may be smaller than a length of the second actuator in a direction perpendicular to the optical axis direction.

[0015] The second circuit board portion may include a first region located at the outermost side and a second region located within the first region.

[0016] The second circuit board portion may include a common board (common substrate), a first individual board (first individual board) disposed in the first region, and a second individual board (second individual board) disposed in the second region.

[0017] The length of the first individual plate in the optical axis direction may be 0.5 times or more the length of the common plate in the first region in the optical axis direction.

[0018] The length of the second individual plate in the optical axis direction may be 0.5 times or less of the length of the common plate in the optical axis direction in the second region.

[0019] The circuit board may include a third circuit board portion extending from the second circuit board portion in a direction perpendicular to the optical axis direction and including a first connector, and the second circuit board portion may include a second connector overlapping with the first actuator in a direction perpendicular to the optical axis direction and connected to the first actuator.

[0020] The first actuator may include a first board portion (first board portion) disposed on the side surface, and the second actuator may include a second board portion (second board portion) disposed on the side surface.

[0021] The first board portion may be pin-coupled and electrically connected to the second connector.

[0022] The first actuator may include a first driving unit provided on the first plate portion, the first driving unit may be provided to be spaced apart from the second connector, and the first driving unit may be provided to be offset from the second connector in a direction perpendicular to the optical axis direction.

[0023] The second connector may be provided at one end of the second circuit board portion in the optical axis direction.

[0024] The second circuit board portion may include a terminal groove and a coupling groove provided in a first region, and the first region may overlap with the first actuator portion in a direction perpendicular to the optical axis direction.

[0025] The second region may include a 2-1 region located at the innermost side and a 2-2 region provided between the first region and the 2-1 region in a direction perpendicular to the optical axis direction.

[0026] The 2-1 region may be in contact with the first actuator.

[0027] The camera module may include a cover surrounding the first actuator, the second actuator, and the circuit board, the cover may be asymmetric with respect to the optical axis, and the cover may include a first cover hole provided in an upper surface and a second cover hole adjacent to the second circuit board portion.

[0028] According to one embodiment of the present invention, a camera device includes: an image sensor; a first circuit board electrically connected to the image sensor; a first camera actuator; and a second circuit board electrically connected to the first camera actuator, wherein one end of the first circuit board includes a plurality of first solder pads, which extend in a first direction and are spaced apart from each other in a second direction perpendicular to the first direction; one end of the second circuit board includes a plurality of second solder pads, which extend in the first direction and are spaced apart from each other in the second direction; the plurality of first solder pads and the plurality of second solder pads correspond one to one, at least some areas of the plurality of first solder pads and at least some areas of the plurality of second solder pads are arranged to overlap with each other in a third direction perpendicular to the first direction and the second direction, the plurality of first solder pads and the plurality of second solder pads are connected by welding, a hole is formed in each of the plurality of first solder pads, and a hole is provided in each of the plurality of second solder pads.

[0029] Among the plurality of first pads and the plurality of second pads, a sum of lengths of the first pads and the second pads overlapped with each other in the third direction in the first direction may be greater than the lengths of the first pads and the second pads in the first direction in a state of overlapping with each other.

[0030] One end of the first circuit board may be disposed on one end of the second circuit board.

[0031] Solder may be provided in the hole of the first pad.

[0032] Solder may be provided in the holes, on lower surfaces of the plurality of first pads, and on upper surfaces of the plurality of second pads.

[0033] The width of the hole may be 40% to 70% of the width of each of the plurality of first pads.

[0034] One end of the first circuit board may be a flexible printed circuit board (FPCB).

[0035] The first circuit board may include an FPCB, a first area of ​​the FPCB may be disposed to overlap the second circuit board in a first direction, a second area of ​​the FPCB may be disposed to overlap the second circuit board in a third direction, and the first pad may be disposed in the second area of ​​the FPCB.

[0036] The first direction may be an optical axis direction.

[0037] The first camera actuator may be an optical image stabilization (OIS) actuator.

[0038] The first circuit board includes a 1-1 circuit board and a 1-2 circuit board, the 1-1 circuit board is configured to extend from the lower surface of the image sensor in a direction perpendicular to the first direction, the 1-2 circuit board is connected to the 1-1 circuit board and is configured to extend along the first direction, and a plurality of first solder pads can be set on the 1-2 circuit board.

[0039] The camera device may also include a second camera actuator arranged between the image sensor and the first camera actuator, wherein the 1-1 circuit board, the image sensor, the second camera actuator and the first camera actuator may be arranged sequentially in the first direction, and the 1-2 circuit board may be arranged on the side surface of the second camera actuator.

[0040] The first camera actuator may be an OIS actuator, and the second camera actuator may be a zoom actuator or an auto focus (AF) actuator.

[0041] Beneficial effects

[0042] A technical problem to be solved by embodiments of the present invention is to implement a camera actuator and a camera module with improved assemblability and enhanced reliability through a connector portion even in the case of a long stroke.

[0043] According to embodiments of the present invention, a camera actuator and a camera module that eliminate assembly tolerances and suppress inflow of foreign substances by controlling the structure of a circuit board can be implemented.

[0044] According to embodiments of the present invention, a camera actuator and a camera module that improve reliability by suppressing inflow of foreign matter through a board may be implemented.

[0045] In addition, according to the embodiments of the present invention, a camera actuator and a camera device can be obtained, wherein in the camera device including the actuator, an efficient connection between a main board of the actuator and a circuit board can be achieved.

[0046] According to the embodiments of the present invention, a camera actuator suitable for an ultra-thin, ultra-small, and high-resolution camera can be obtained.

[0047] Various useful advantages and effects of the present invention are not limited to the above contents and can be more easily understood in the course of describing specific embodiments of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 is a perspective view of a camera module according to an embodiment.

[0049] Figure 2 is an exploded perspective view of the camera module according to this embodiment.

[0050] Figure 3 It is along Figure 1 Cross-sectional view along line AA'.

[0051] Figure 4 is a perspective view of a second camera actuator according to this embodiment.

[0052] Figure 5 It is along Figure 4 Cross-sectional view along line DD'.

[0053] Figure 6 is a perspective view showing a circuit board according to this embodiment.

[0054] Figure 7 is a front view showing a circuit board according to this embodiment.

[0055] Figure 8 is a top view showing a circuit board according to this embodiment.

[0056] Figure 9 is a perspective view of a cover according to this embodiment.

[0057] Figure 10 is a bottom view of the cover according to this embodiment.

[0058] Figure 11 is a top view of the cover and circuit board according to this embodiment.

[0059] Figure 12 is a perspective view of a cover and a circuit board according to this embodiment.

[0060] Figure 13 is a perspective view of a camera module according to this embodiment.

[0061] Figure 14 is a top view of the camera module according to this embodiment.

[0062] Figure 15 is a perspective view of a first board portion, a second board portion, and a circuit board in the camera module according to this embodiment.

[0063] Figure 16 is a side view of the camera module according to this embodiment.

[0064] Figure 17 It is along Figure 16 Cross-sectional view along line II'.

[0065] Figure 18 yes Figure 17 Magnified view of part K in FIG.

[0066] Figure 19 is a perspective view of a camera device according to an embodiment.

[0067] Figure 20 is an exploded perspective view of the camera apparatus according to this embodiment.

[0068] Figure 21 It is along Figure 19 View along line AA'.

[0069] Figure 22 is a perspective view of a first camera actuator according to an embodiment.

[0070] Figure 23 is an exploded perspective view of a first camera actuator according to this embodiment.

[0071] Figure 24 is a perspective view of a second camera actuator according to this embodiment.

[0072] Figure 25 is a perspective view of the camera apparatus (excluding the cover) according to this embodiment.

[0073] Figure 26 is an exploded perspective view of the camera apparatus (excluding the cover) according to this embodiment.

[0074] Figure 27 is a perspective view of a circuit board of the camera device according to this embodiment.

[0075] Figure 28 is a front view of the connection structure of the circuit boards after soldering according to this embodiment.

[0076] Figure 29 FIG. 4 is a perspective view of a connection structure of circuit boards after soldering according to this embodiment.

[0077] Figure 30 is a cross-sectional view of the connection structure of the circuit boards after soldering according to this embodiment.

[0078] Figure 31 is a front view of the connection structure of the circuit boards before soldering according to this embodiment.

[0079] Figure 32 is a perspective view of the connection structure of the circuit boards before soldering according to this embodiment.

[0080] Figure 33 is a cross-sectional view of the connection structure of the circuit boards before soldering according to this embodiment.

[0081] Figure 34 is an exploded view for describing the connection structure of the circuit boards according to this embodiment.

[0082] Figure 35 This is an enlarged perspective view of a portion of the connection structure of the circuit board.

[0083] Figure 36 is a perspective view of a mobile terminal to which the camera module according to this embodiment is applied.

[0084] Figure 37 is a perspective view of a vehicle to which the camera module according to this embodiment is applied. DETAILED DESCRIPTION

[0085] Since various modifications and embodiments can be provided according to the embodiments of the present invention, specific embodiments are shown and described in the drawings. Here, this is not intended to limit the present invention to specific embodiments, and should be understood to include all modifications, equivalents or substitutes within the spirit and technical scope of the present invention.

[0086] Although included are terms used to describe ordinal numbers such as "second" and "first" for various constituent elements, these constituent elements are not limited by these terms. These terms are only used to distinguish one constituent element from another constituent element. For example, without departing from the scope of the present invention, the second constituent element can be named as the first constituent element, and similarly, the first constituent element can also be named as the second constituent element. The term "and / or" includes any combination of multiple related description items or any item in multiple related description items.

[0087] When it is mentioned that a component is “connected” or “coupled” to another component, it should be understood that it can be directly connected or coupled to the other component, but other components may exist between them. On the other hand, when it is mentioned that any component is “directly connected” or “directly coupled” to another component, it should be understood that there are no other components between them.

[0088] The terms used in this application are only used to describe specific embodiments and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, it should be understood that terms such as "including" or "having" are intended to specify the presence of features, numbers, steps, operations, constituent elements, parts, or combinations thereof described in the specification, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, constituent elements, parts, or combinations thereof.

[0089] Unless otherwise defined, all terms (including technical or scientific terms) used in this document have the same meaning as commonly understood by those skilled in the art to which the present invention belongs. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and will not be interpreted as an idealized or overly formal meaning unless otherwise explicitly defined in this application.

[0090] Hereinafter, the embodiments will be described in detail with reference to the accompanying drawings. Regardless of the figure numbers, the same or corresponding constituent elements are denoted by the same reference numerals, and redundant descriptions thereof will be omitted.

[0091] In this specification, the camera actuator is described as a device that moves a lens, but this encompasses both the concept of a device including a lens and the concept of a device not including a lens. In the following description, the first and second camera actuators are described as including the concept of both including a lens. Furthermore, the camera actuator that moves the lens may also be referred to as a "lens shifting device" or a "lens driving device."

[0092] Figure 1 is a perspective view of a camera module according to an embodiment, Figure 2 is an exploded perspective view of a camera module according to this embodiment, Figure 3 It is along Figure 1 Cross-sectional view along line AA'.

[0093] Reference Figure 1 and Figure 2 The camera module 1000 according to an embodiment may include a cover CV, a first camera actuator 1100, a second camera actuator 1200, and a circuit board 1300. Here, the first camera actuator 1100 may be used interchangeably with the first actuator, and the second camera actuator 1200 may be used interchangeably with the second actuator.

[0094] The cover CV may cover the first camera actuator 1100 and the second camera actuator 1200. A coupling force between the first camera actuator 1100 and the second camera actuator 1200 may be improved by the cover CV.

[0095] In addition, the cover CV may be made of a material that performs electromagnetic shielding. Therefore, the first camera actuator 1100 and the second camera actuator 1200 in the cover CV may be easily protected.

[0096] In addition, the first camera actuator 1100 may be an optical image stabilization (OIS) actuator. For example, the first camera actuator 1100 may move an optical member in a direction perpendicular to an optical axis (an axis of incident light).

[0097] The first camera actuator 1100 may include a fixed focus lens disposed in a predetermined lens barrel (not shown). The fixed focus lens may also be referred to as a "single focal length lens" or a "main lens."

[0098] The first camera actuator 1100 can change the optical path. In one embodiment, the first camera actuator 1100 can vertically change the optical path through an internal optical component (e.g., a prism or a reflector). For example, the optical component can change the direction of light from a first direction (X-axis direction) to a third direction (Z-axis direction). With this configuration, even if the thickness of the mobile terminal is reduced, a lens configuration having a size greater than the thickness of the mobile terminal can be provided in the mobile terminal, and magnification, autofocus (AF), zoom, and OIS functions can be performed by changing the optical path.

[0099] However, the present invention is not limited thereto, and the first camera actuator 1100 may change the optical path vertically or a plurality of times at a predetermined angle.

[0100] The second camera actuator 1200 may be disposed at a rear end of the first camera actuator 1100. The second camera actuator 1200 may be coupled to the first camera actuator 1100. In addition, the second camera actuator 1200 and the first camera actuator 1100 may be coupled in various ways.

[0101] In addition, the second camera actuator 1200 may be a zoom actuator or an AF actuator. For example, the second camera actuator 1200 may support one or more lenses and move the lenses in response to a control signal from a predetermined control unit to perform an auto focus function or a zoom function.

[0102] Furthermore, one or more lenses may be independently or individually movable along the optical axis.

[0103] The circuit board 1300 may be provided at the rear end of the second camera actuator 1200. The circuit board 1300 may be electrically connected to the second camera actuator 1200 and the first camera actuator 1100. In addition, a plurality of circuit boards 1300 may be provided.

[0104] The camera module according to this embodiment may be composed of one or more camera modules. For example, the plurality of camera modules may include a first camera module and a second camera module.

[0105] In addition, a camera module may include one or more actuators. For example, a camera module may include a first camera actuator 1100 and a second camera actuator 1200. In addition, the camera module may be used interchangeably with various terms such as camera device and imaging device.

[0106] In addition, the camera module can be set in a predetermined housing (not shown) and include an actuator (not shown) capable of driving the lens unit. The actuator can be a voice coil motor, a microactuator, a silicon actuator, etc., and can be applied in a variety of ways such as capacitive, thermal, dual-chip, electrostatic, etc., but is not limited to this. In addition, in this specification, the camera actuator can be referred to as an actuator, etc. In addition, a camera module composed of multiple camera modules can be installed in various electronic devices such as mobile terminals. In addition, the actuator can be a device for moving or tilting lenses and optical components. Here, in the following description, the actuator is described as a concept that the actuator includes a lens or an optical component. In addition, the actuator can be referred to as a "lens transfer device", "lens moving device", "optical component transfer device", "optical component moving device", etc.

[0107] Reference Figure 3 , the camera module according to this embodiment may include a first camera actuator 1100 that performs an OIS function and a second camera actuator 1200 that performs zoom and AF functions.

[0108] Light can be incident on the camera module or the first camera actuator through an opening area located in the upper surface of the first camera actuator 1100. That is, light can be incident on the first camera actuator 1100 along the optical axis direction (for example, based on the X-axis direction of the incident light), and the optical path can be vertically changed by the optical member. In addition, the light can pass through the second camera actuator 1200 and can be incident on the image sensor (PATH) located at one end of the second camera actuator 1200. In this specification, the Z-axis direction or the third direction is described as the optical axis direction as follows. In addition, in this specification, the optical axis direction can correspond to the third direction, the vertical direction can correspond to the first direction, and the horizontal direction can correspond to the second direction.

[0109] In this specification, the bottom surface refers to one side in the first direction. In addition, the first direction is the X-axis direction in the figure, and can be used interchangeably with the second axis direction, etc. The second direction is the Y-axis direction in the figure, and can be used interchangeably with the first axis direction, etc. The second direction is a direction perpendicular to the first direction. In addition, the third direction is the Z-axis direction in the figure, and can be used interchangeably with the third axis direction, etc. In addition, the third direction is a direction perpendicular to the first and second directions. Here, the third direction (Z-axis direction) corresponds to the direction of the optical axis, and the first direction (X-axis direction) and the second direction (Y-axis direction) are directions perpendicular to the optical axis. In addition, in the following description, in the description of the first camera actuator and the second camera actuator, the optical axis direction is the third direction (Z-axis direction), and the following description is made based on this.

[0110] In addition, in this specification, the inner side may be a side in the direction from the cover CV toward the first camera actuator, and the outer side may be a side in the direction opposite to the inner side. For example, the first camera actuator and the second camera actuator may be located inside the cover CV, and the cover CV may be located outside the first camera actuator or the second camera actuator.

[0111] The camera module according to this embodiment can improve the spatial constraints of the first and second camera actuators by altering the optical path. The camera module according to this embodiment can expand the optical path in response to the change, while minimizing the thickness of the camera module. Furthermore, it should be understood that the second camera actuator can also provide high-magnification zoom by controlling focus, etc., within the expanded optical path.

[0112] In addition, the camera module according to this embodiment can implement OIS by controlling the optical path through the first camera actuator, thereby reducing the occurrence of decentering or tilting phenomena as much as possible and producing optimal optical characteristics.

[0113] In addition, the second camera actuator 1200 may include an optical system and a lens driving unit. For example, at least one of the first lens group, the second lens group, and the third lens group may be provided in the second camera actuator 1200.

[0114] In addition, the second camera actuator 1200 may include coils and magnets to perform a high-magnification zoom function and an auto focus function.

[0115] For example, although the first lens group and the second lens group can be movable lenses that move via coils, magnets, and guide pins, and the third lens group can be a fixed lens, the present invention is not limited thereto. For example, the third lens group can be used as a focusing lens group (focator) that forms a light image at a specific position, and the third lens group has a significant magnification change due to a significant change in the distance to the object or the image distance caused by the movement of the first lens group. In addition, the first lens group, as a variator, can play an important role in changing the focal length or magnification of the optical system. At the same time, the image point formed in the first lens group as a variator can change slightly depending on its position. Therefore, the second lens group can perform a position compensation function on the image formed using the variator. For example, the second lens group can be used as a compensator lens group (compensator) that is used to accurately image the image point formed by the first lens group as a variator at the actual position of the image sensor.

[0116] Furthermore, the first and second lens groups can be driven using electromagnetic forces generated by the interaction between the coil and the magnet. The above description can also be applied to the lens groups (described below). Furthermore, the first or second lens group can be moved along the optical axis (i.e., along the third direction). Furthermore, the first or second lens group can be moved independently or in conjunction with each other along the third direction.

[0117] Furthermore, the third lens group may be located at the front of the first lens group or at the rear of the second lens group. That is, the third lens group may be located adjacent to the first camera actuator or adjacent to the image sensor. Furthermore, the third lens group may be fixed.

[0118] In an embodiment of the present invention, the first lens group and the second lens group can move along the optical axis. Furthermore, the third lens group can be located at the front end of the first lens group or the rear end of the second lens group. Furthermore, the third lens group does not need to move along the optical axis. That is, the third lens group can be a fixed unit. Furthermore, the first lens group and the second lens group can be movable units.

[0119] Furthermore, when an actuator for OIS and an actuator for AF / zoom are provided according to an embodiment of the present invention, magnetic interference with the magnet for AF / zoom can be prevented when the OIS is driven. Since the magnet of first camera actuator 1100 is provided separately from that of second camera actuator 1200, magnetic interference between first camera actuator 1100 and second camera actuator 1200 can be prevented. In this specification, OIS is used interchangeably with terms such as image stabilization, optical image stabilization, optical image correction, and shake correction.

[0120] Figure 4is a perspective view of a second camera actuator according to this embodiment, Figure 5 It is along Figure 4 Cross-sectional view along line DD'.

[0121] Reference Figure 4 and Figure 5 As described above, the second camera actuator 1200 according to this embodiment may include one or more lenses LG1 and LG2 (or a plurality of moving components and fixed components including lenses).

[0122] The second camera actuator may include a drive unit, and the drive unit may be used to move at least one of the multiple lenses along the optical axis or a third direction (Z-axis). Depending on the drive forces F3A, F3B, F4A, and F4B of the drive unit, lenses LG1 and LG2 may move individually or together. In one embodiment, each lens (or moving assembly) may be individually movable along the optical axis.

[0123] Figure 6 is a perspective view showing a circuit board according to this embodiment, Figure 7 is a front view showing a circuit board according to this embodiment, Figure 8 is a top view showing a circuit board according to this embodiment.

[0124] Reference Figure 6 , the circuit board 1300 according to this embodiment may include a first circuit board portion 1310 , a second circuit board portion 1320 and a third circuit board portion 1330 .

[0125] The first circuit board portion 1310 may be located at the rear end of the second camera actuator. In addition, the image sensor may be provided on the first circuit board portion 1310. In addition, the first circuit board portion 1310 and the image sensor may be electrically connected.

[0126] Furthermore, the first circuit board portion 1310 may be coupled to the sensor base (or base) SB. Furthermore, the optical filter F may be housed in the sensor base SB. The optical filter F may be coupled to the first circuit board portion 1310.

[0127] In this way, the image sensor and the circuit board (first circuit board portion) can be located at the rear end of the second camera actuator.

[0128] The first camera actuator, the second camera actuator, and the circuit board 1300 may be sequentially arranged along the optical axis. In addition, the first circuit board portion 1310 of the circuit board 1300 may be located at the rear end of the second camera actuator and may overlap with the second camera actuator in the optical axis direction.

[0129] In addition, the second circuit board portion 1320 may be located at the side of the camera module. In particular, the second circuit board portion 1320 may be connected to the first circuit board portion 1310. In addition, the second circuit board portion 1320 may extend from the first circuit board portion 1310 along the optical axis direction.

[0130] Therefore, the second circuit board portion 1320 can be positioned adjacent to the second board portion of the second camera actuator, and the second board portion is positioned adjacent to the first side portion. Therefore, the second circuit board portion 1320 can be easily electrically connected to the second camera actuator.

[0131] Furthermore, in various embodiments, the second circuit board portion 1320 may be located on either or both sides of the first and second camera actuators. Thus, at least one second circuit board portion 1320 may be provided. The following description will be based on a second circuit board portion 1320 provided on only one side.

[0132] The third circuit board portion 1330 may be connected to the second circuit board portion 1320 or the first circuit board portion 1310. Furthermore, the third circuit board portion 1330 may extend in a direction perpendicular to the optical axis direction (e.g., the second direction). For example, the third circuit board portion 1330 may extend outward from the second circuit board portion 1320. Thus, the third circuit board portion 1330 may extend in a direction different from that of the second circuit board portion 1320.

[0133] In addition, the circuit board 1300 may further include a fixing plate (not shown) on a side surface thereof. Therefore, even when the circuit board 1300 is made of a flexible material, the circuit board 1300 may be coupled to the base while maintaining rigidity due to the fixing plate.

[0134] Additionally, second circuit board portion 1320 of circuit board 1300 may be located to the side of the drive unit of the second camera actuator. Circuit board 1300 may be electrically connected to the drive unit of the first camera actuator and the drive unit of the second camera actuator. For example, an SMT or connector may be used for the electrical connection. This will be described below.

[0135] In addition, the circuit board 1300 may include a circuit board having an electrically connected wiring pattern, such as a rigid printed circuit board (rigid PCB), a flexible printed circuit board (flex PCB), and a rigid-flex printed circuit board (rigid-flex PCB). However, the present invention is not limited to these types.

[0136] In one embodiment, the circuit board 1300 according to this embodiment may include a common board and individual boards. The circuit board 1300 may include a common board and individual boards arranged according to their positions on the common board.

[0137] For example, the first circuit board portion 1310 may include a common board FP and a third separate board RP3 disposed in a region of the common board.

[0138] The third separate plate RP3 can be located on at least one of the two sides of the common plate FP. This configuration can enhance rigidity and facilitate electrical connection. For example, the third separate plate RP3 can be located on opposite sides of the common plate FP in the optical axis direction.

[0139] Furthermore, first circuit board portion 1310 may further include a reinforcing plate ST positioned on one of the third individual boards RP3. Thus, sensor base SB, third individual boards RP3, common board FP, third individual boards RP3, and reinforcing plate ST may be sequentially arranged along the optical axis. This improves the reliability of circuit board 1300 and facilitates heat dissipation.

[0140] In addition, the second circuit board portion 1320 may include a common board, and first and second separate boards RP1 and RP2 provided in some areas of the common board.

[0141] In addition, the second circuit board portion 1320 may include a first region RG1 located at the outermost side and a second region RG2 located inside the first region RG1 .

[0142] Specifically, the second circuit board portion 1320 may include a common board FP, a first individual board RP1 disposed in the first region RG1, and a second individual board RP2 disposed in the second region RG2.

[0143] The first separate panel RP1 and the second separate panel RP2 may be disposed spaced apart from each other in the optical axis direction. In addition, the first separate panel RP1 and the second separate panel RP2 may be positioned offset from each other in the optical axis direction.

[0144] Furthermore, the first separate board RP1 and the second separate board RP2 may be located on at least one of the inner side and the outer side with respect to the common board FP. With this configuration, rigidity can be enhanced and electrical connection can be facilitated.

[0145] In addition, the lengths or widths of the first camera actuator and the second camera actuator in the second direction (Y-axis direction) may be different. Accordingly, the second circuit board portion 1320 may have a structure extending in the optical axis direction and bending inward or outward.

[0146] In one embodiment, the second region RG2 may include a 2-1 region RG2a and a 2-2 region RG2b. The second region RG2 may include a 2-1 region RG2a and a 2-2 region RG2b.

[0147] The 2-1 region RG2a may be located inside the 2-2 region RG2b. For example, the 2-1 region RG2a may be closer to the first camera actuator than the 2-2 region RG2b. In addition, the 2-2 region RG2b may be arranged horizontally between the 2-1 region RG2a and the first region RG1.

[0148] Furthermore, circuit board 1300 may include a first connector CN1 and a second connector CN2. First connector CN1 may be located on third circuit board portion 1330. As described above, third circuit board portion 1330 may have a structure extending in a direction different from second circuit board portion 1320. Thus, circuit board 1300 can be easily electrically connected to another camera module in the terminal or the terminal's processor via first connector CN1. This ensures ease of assembly and improves the reliability of first connector CN1. Furthermore, the aforementioned camera actuator and camera device including the same can transmit and receive various signals within the terminal.

[0149] In addition, the second connector CN2 can be located on the second circuit board portion 1320. In addition, the second connector CN2 can be located in the second area RG2 on the second circuit board portion 1320. In addition, the second circuit board portion 1320 can be electrically connected to the first board portion of the first camera actuator via the second connector CN2. The first board portion of the first camera actuator and the second circuit board portion 1320 can be connected, for example, via the pins of the second connector CN2. With this configuration, control of the first camera actuator can be achieved through the circuit board 1300. In addition, process defects such as false solder joints, cold solder joints, and cracking caused by side soldering are reduced at the same time. Therefore, the reliability of the camera actuator can be improved. In addition, the application of a protective member (e.g., epoxy resin) for solder protection can be omitted. Therefore, the effect of simplifying the process and reducing manufacturing costs can be provided.

[0150] In one embodiment, the length L1 of the first region RG1 along the optical axis can be greater than the length L2 of the second region RG2. Furthermore, the length of the first individual panel RP1 along the optical axis can be less than the length L1 of the first region RG1. Furthermore, the length of the second individual panel RP2 can be less than the length L2 of the second region RG2. Here, the length L1 of the first region RG1 corresponds to the length of the common panel FP in the first region RG1. Furthermore, the length L2 of the second region RG2 corresponds to the length of the common panel FP in the second region RG2.

[0151] In the circuit board 1300 according to an embodiment of the present invention, the length of the first individual board RP1 in the optical axis direction may be 0.5 times or greater than the length L1 of the common board FP in the first region RG1. That is, the length of the first individual board RP1 in the optical axis direction in the first region RG1 is somewhat longer. Conversely, the length of the second individual board RP2 in the optical axis direction may be 0.5 times or less than the length L2 of the common board FP in the second region RG2.

[0152] Therefore, since the second circuit board portion 1320 includes the second connector CN2 , the size of the second separate board RP2 may be reduced due to the second connector, thereby easily achieving structural deformation of the second circuit board portion 1320 .

[0153] In addition, the second circuit board portion 1320 may include a terminal groove RG1h1 and a coupling groove RG1h2 in the first region RG1. The terminal groove RG1h1 may correspond to a first terminal portion described below.

[0154] At least one terminal slot RG1h1 may be provided. Electrical connection between the second camera actuator and the mainboard can be achieved through this terminal slot RG1h1. Optionally, a drive test of the second camera actuator can be controlled through this terminal slot RG1h1. Furthermore, soldering connections can be easily achieved through this terminal slot RG1h1. This will be described in detail below.

[0155] Furthermore, the coupling groove RG1h2 may be a hole or a groove. Through the coupling groove RG1h2, the second circuit board portion 1320 and the second camera actuator may be coupled to each other. In addition, alignment between the second circuit board portion 1320 and the second camera actuator may be achieved through the coupling groove RG1h2.

[0156] Figure 9 is a perspective view of a cover according to this embodiment, Figure 10 is a bottom view of the cover according to this embodiment, Figure 11 is a top view of the cover and circuit board according to this embodiment, Figure 12 is a perspective view of a cover and a circuit board according to this embodiment.

[0157] Reference Figures 9 to 12 According to this embodiment, the cover CV may surround the first camera actuator, the second camera actuator, and the circuit board. However, the circuit board may be partially located outside the cover CV. For example, the third circuit board portion of the circuit board may be provided outside the cover CV.

[0158] The shape of the cover CV may correspond to the shapes of the first camera actuator, the second camera actuator, and the circuit board to surround the first camera actuator, the second camera actuator, and the circuit board.

[0159] Therefore, the cover CV may include a first cover hole CVh1 provided in the upper surface US. Through the first cover hole CVh1, light may be provided to the optical member of the first camera actuator, and the first camera actuator may change the light path.

[0160] In addition, the cover CV may include second and third cover holes CVh2 and CVh3 provided in the side surface SS.

[0161] The second cover hole CVh2 can be positioned adjacent to the second circuit board portion. The first terminal portion (or terminal slot) and the second terminal portion can be exposed to the outside through the second cover hole CVh2. Therefore, even after the cover CV is assembled, testing can be easily performed.

[0162] In addition, the third cover hole CVh3 can be located adjacent to the second circuit board portion. The third circuit board can extend outward from the second circuit board portion through the third cover hole CVh3.

[0163] The cover CV may surround the first circuit board portion 1310 and the second circuit board portion 1320. For example, the first circuit board portion 1310 may overlap the cover CV in the optical axis direction or the second direction. Furthermore, the cover CV may overlap the second circuit board portion 1320 in the optical axis direction or the second direction.

[0164] In addition, the third circuit board portion 1330 may extend outward through the third cover hole CVh3 and may be disposed to be spaced apart from the cover CV in the second direction.

[0165] In addition, the side surface SS adjacent to the second circuit board portion in the cover CV may include a first side surface area SS1 , a second side surface area SS2 , and a third side surface area SS3 .

[0166] The first side surface area SS1 may face the first region. That is, the first side surface area SS1 may overlap the first region of the second circuit board portion in the second direction.

[0167] The second side surface area SS2 may face the 2-2 area of ​​the second region, that is, the second side surface area SS2 may overlap the 2-2 area of ​​the second region in the second direction.

[0168] The third side surface area SS3 may face the 2-1 area of ​​the second area, that is, the third side surface area SS3 may overlap the 2-1 area of ​​the second area in the second direction.

[0169] In this way, the shape of the side surface SS of the cover CV can correspond to the shape of the second circuit board portion. That is, the cover CV can be positioned so that the area of ​​the cover CV overlapping with the first camera actuator in the second direction (the second and third side surface areas) is further inward than the area of ​​the cover CV overlapping with the second camera actuator in the second direction (the first side surface area). This configuration makes it easier to protect the components in the cover CV (e.g., the circuit board).

[0170] Furthermore, due to the shape of the second circuit board portion, the cover CV may have an asymmetric structure relative to the optical axis. In a modified embodiment, for the sake of rigidity and ease of production, the cover CV may have two opposing sides corresponding to the side surface SS. In other words, the cover CV may have a symmetric structure relative to the optical axis.

[0171] Figure 13 is a perspective view of a camera module according to this embodiment, Figure 14 is a top view of the camera module according to this embodiment.

[0172] Reference Figure 13 and Figure 14 In the camera module according to this embodiment, the width W1 of the first camera actuator 1100 may be smaller than the width W2 of the second camera actuator 1200. Accordingly, as described above, the second circuit board portion 1320 may have first and second regions with inwardly folded or bent structures.

[0173] For example, the ratio of the width W1 of the first camera actuator 1100 to the width W2 of the second camera actuator 1200 may be 1:1.1 to 1:1.5. Preferably, the ratio of the width W1 of the first camera actuator 1100 to the width W2 of the second camera actuator 1200 may be 1:1.2 to 1:1.3. With this configuration, a camera module that is compact to a certain extent and provides a long stroke can be provided.

[0174] Furthermore, the length of the first camera actuator in the optical axis direction may be smaller than the length of the second camera actuator in the optical axis direction.

[0175] The second circuit board portion 1320 may overlap the first camera actuator 1100 and the second camera actuator 1200 in the second direction. Furthermore, the second camera actuator may overlap the first region of the second circuit board portion 1320 in the second direction. Furthermore, the first camera actuator 1100 may overlap the second region of the second circuit board portion 1320 in the second direction. The second circuit board portion 1320 may be electrically connected to the first camera actuator via a second connector CN2 provided in the second region.

[0176] Figure 15 is a perspective view of a first board portion, a second board portion, and a circuit board in a camera module according to this embodiment, Figure 16 is a side view of the camera module according to this embodiment. Figure 17 It is along Figure 16 View of line II', Figure 18 yes Figure 17 Enlarged view of part K in the middle.

[0177] Reference Figures 15 to 18 According to this embodiment, the circuit board 1300 may at least partially surround the side surface of the second camera actuator. For example, the circuit board 1300 may at least partially overlap the side surface of the second camera actuator or the side surface of the first camera actuator in the horizontal direction (the Y-axis direction, the second direction).

[0178] In addition, the second plate portion 1270 according to this embodiment may be provided on the side surface of the second camera actuator. For example, the second plate portion 1270 may contact the side surface of the main barrel in the second camera actuator.

[0179] In addition, the first plate portion 1154 according to this embodiment may be provided on a side surface of the first camera actuator. For example, the first plate portion 1154 may be in contact with a side surface of a housing of the first camera actuator.

[0180] In addition, the second circuit board portion 1320 according to this embodiment can extend in the optical axis direction to surround the first camera actuator. For example, as described above, the second circuit board portion 1320 can extend to at least partially overlap with the first camera actuator in the horizontal direction or the second direction (Y-axis direction).

[0181] In addition, the second circuit board portion 1320 can be connected to the end of the first circuit board portion 1310 and can extend in the optical axis direction or the third direction (Z-axis direction). That is, the second circuit board portion 1320 can be bent from the circuit board 1300 and can extend in the third direction.

[0182] The first circuit board portion 1310 and the second circuit board portion 1320 may be an integrally formed structure or a split structure. In one embodiment, the first circuit board portion 1310 and the second circuit board portion 1320 (and the third circuit board portion) may be integrally formed. In addition, the first circuit board portion 1310 and the second circuit board portion 1320 may include an integral common board ( Figure 8 FP in ). In addition, as described above, the first circuit board portion 1310 and the second circuit board portion 132 may each include a separate board.

[0183] In one embodiment, the first circuit board portion 1310 and the second circuit board portion 1320 may be composed of multiple layers. Furthermore, the first circuit board portion 1310 and the second circuit board portion 1320 may include holes or multiple layers for circuit patterns. That is, the first circuit board portion 1310 may have a structure composed of a single board, a shared board, and a single board stacked together. Furthermore, the second circuit board portion 1320 may also have a structure composed of a single board, a shared board, and a single board stacked together. In this case, the single board and the shared board may have circuit patterns therein and may be composed of one or more layers.

[0184] For example, multiple layers of rigid printed circuit boards and flexible or flexible printed circuit boards may be provided in first circuit board portion 1310 and second circuit board portion 1320. In a modified embodiment, first circuit board portion 1310 may have a structure in which a flexible printed circuit board, a rigid printed circuit board, and a flexible printed circuit board are stacked in sequence. Furthermore, reinforcing material or a reinforcing plate may be provided in the areas of first circuit board portion 1310 and second circuit board portion 1320 where the flexible printed circuit boards are provided.

[0185] In addition, in the camera module according to this embodiment, the first circuit board portion and the second circuit board portion may include a common board, which is a flexible printed circuit board. In addition, in the first circuit board portion and the second circuit board portion, the rigid printed circuit board may be arranged inside and / or outside the flexible printed circuit board.

[0186] In addition, the second plate portion 1270 of the second camera actuator 1200 may include a first plate 1271 and a second plate 1272. At least one of the first plate 1271 and the second plate 1272 may face the second circuit board portion 1320 and overlap the second circuit board portion 1320 in a horizontal direction.

[0187] In the second camera actuator 1200, the first and second plates 1271 and 1272 can be spaced apart from the first circuit board portion 1310 in the optical axis direction. This allows for the size of the sensor base and other components provided on the first circuit board portion 1310 to be maintained. Furthermore, the size of the sensor base can be increased, preventing components mounted on the first circuit board portion 1310 from being exposed to the outside. This improves the reliability of the circuit components. Furthermore, the reduced size of the first and second plates 1271 and 1272 effectively contributes to a more compact and lightweight camera module.

[0188] The first plate 1271 and the second plate 1272 may be symmetrically disposed relative to each other based on the optical axis or the optical axis direction. In addition, the first plate 1271 and the second plate 1272 may both be electrically connected to a driving unit (eg, a coil) of the second camera actuator.

[0189] The first board portion 1154 of the first camera actuator may include a first sub-board 1154 a disposed on a bottom surface of the first camera actuator, and second and third sub-boards 1154 b and 1154 c disposed on each side surface of the first camera actuator.

[0190] As described above, the first sub-board 1154a may be disposed below the first camera actuator and may at least partially overlap the first camera actuator in the first direction (X-axis direction).

[0191] The second sub-board 1154b and the third sub-board 1154c may surround the side surface of the first camera actuator. In addition, the second sub-board 1154b and the third sub-board 1154c may at least partially contact the side surface of the first camera actuator.

[0192] The second sub-board 1154b and the third sub-board 1154c can be symmetrically arranged relative to the optical axis or the optical axis direction. The second sub-board 1154b can be arranged adjacent to the side of the first housing. In addition, as described above, the third sub-board 1154c can be arranged adjacent to the side of the second housing.

[0193] In addition, the second sub-board 1154b can be disposed adjacent to the first board 1271. For example, the second sub-board 1154b can at least partially overlap the first board 1271 in the optical axis direction. Alternatively, the second sub-board 1154b can be located outside the first board 1271 relative to the optical axis.

[0194] Furthermore, the third sub-board 1154c may be disposed adjacent to the second board 1272. For example, the third sub-board 1154c may at least partially overlap the second board 1272 in the optical axis direction. Alternatively, the third sub-board 1154c may be located outside the second board 1272 relative to the optical axis.

[0195] In addition, the second sub-board 1154b may be in at least partial contact with the second circuit board portion 1320. In addition, the second sub-board 1154b may be surrounded by the second circuit board portion 1320.

[0196] In addition, the second camera actuator may include a first plate 1271 having a second terminal portion SG2. The second terminal portion SG2 may be soldered to the first terminal portion SG1 of the second circuit board portion 1320 (described below). To this end, the second circuit board portion 1320 and the first plate 1271 may overlap each other in a direction perpendicular to the optical axis (e.g., the second direction). At least a portion of the first terminal portion SG1 of the second circuit board portion 1320 may correspond to at least some of the plurality of solder pads (second terminal portions) of the first plate 1271. In addition, either the first plate 1271 or the second plate 1272 may include the second terminal portion SG2. The entire second terminal portion SG2 may be provided on each or either of the first plate 1271 and the second plate 1272.

[0197] Furthermore, as disclosed herein, at least one of the first board and / or the second board and the second board portion can be soldered and connected. Specifically, the second circuit board portion (including the plurality of terminals or the first terminal portion) and the board of the second camera actuator (including the plurality of solder pads or the second terminal portion) can be soldered and connected. In one embodiment, the first board 1271 of the second camera actuator can include the second terminal portion SG2. To this end, the first terminal portion SG1 can be positioned to correspond to the second terminal portion SG2.

[0198] In addition, at least a portion of the first terminal portion SG1 may be welded to at least a portion of the second terminal portion SG2 . In addition, the first terminal portion may be electrically connected to the second terminal portion.

[0199] The outer surface of the first terminal portion SG1 may be convex inward or concave outward. With this configuration, the first terminal portion SG1 can be easily filled with a conductive member (eg, solder).

[0200] For example, the second circuit board portion 1320 may be located on the first board 1271. Based on this, the second terminal portion SG2 may be located below the first terminal portion SG1. The first terminal portion SG1 may overlap the second terminal portion SG2 in the second direction (Y-axis direction).

[0201] The length of the first terminal portion SG1 in the first direction (X-axis direction) can be smaller than the length of the second terminal portion SG2 in the first direction (X-axis direction). With this configuration, when the conductive member is applied to the first terminal portion SG1 and the second terminal portion SG2, the conductive member does not flow into the first plate. In addition, the first terminal portion SG1 and the second terminal portion SG2 can be more easily connected to each other via the conductive member.

[0202] In addition, the length Waa of the first terminal portion SG1 in the third direction or the optical axis direction may be smaller than the length Wab of the second terminal portion SG2 in the optical axis direction. Therefore, the soldered conductive member does not flow into the first plate.

[0203] The area of ​​the first terminal portion SG1 can be smaller than the area of ​​the second terminal portion SG2. Therefore, electrical connection can be achieved more accurately. In addition, rigidity can be more easily ensured by welding. In addition, even if the first plate 1271 is displaced during the active alignment of the first lens group and the second lens group or the active alignment of the sensor base SB, the welding area can be easily ensured. In addition, the first plate 1271 may include an exposed area EPA that overlaps with the hole of the first terminal portion SG1 in the horizontal direction. The exposed area EPA may be an area separated from the second terminal portion SG2. As a result, the conductive material can flow to the first terminal portion SG1 and can be placed in the second terminal portion SG2. In a modified example, the electrical connection between the second circuit board portion and the second plate portion 1270 of the second camera actuator 1200 can be achieved by pin connection.

[0204] In addition, the first camera actuator 1100 may include a first drive unit disposed on the first plate portion 1154. For example, the first drive unit may include a coil C1. In this case, the first drive unit may not overlap with the second connector CN2 in the horizontal direction. That is, the first drive unit may be arranged to be spaced apart from the second connector CN2. Optionally, the first drive unit may deviate from the second connector CN2 in a direction perpendicular to the optical axis direction. With this configuration, it is easier to ensure space for electrical connections or patterns between the coil C1 and the Hall sensor, etc. and the first plate portion 1154. In addition, the influence of magnetic fields from other elements such as coils can also be reduced. In addition, the heat generated by the coil C1 is not directly provided to the second connector CN2.

[0205] Furthermore, the first region RG1 of the second circuit board portion 1320 can overlap the second camera actuator 1200 in a direction perpendicular to the optical axis (the second direction). Furthermore, the first region RG1 can partially overlap (OV) the first camera actuator 1100 in a direction perpendicular to the optical axis (the second direction). This configuration ensures the reliability of the first separate board in the first region RG1. Furthermore, the tolerance at the interface between the second camera actuator and the first camera actuator can be maintained, thereby enhancing ease of assembly.

[0206] Furthermore, the common plate FP of the second circuit board portion 1320 may be easily bent inward or toward the first camera actuator.

[0207] Additionally, the 2-1 region RG2a can contact the first plate portion 1154 of the first camera actuator 1100. Specifically, the 2-1 region RG2a can be positioned adjacent to the first drive unit or coil C1. For example, the 2-1 region RG2a can overlap the first drive unit or coil C1 in the second direction. This configuration can absorb heat generated by the first drive unit. Optionally, when the 2-1 region RG2a presses against the first plate portion 1154, the structural reliability of the camera module can be improved.

[0208] Furthermore, the 2-2 region RG2b can overlap with the second connector CN2 in the horizontal direction. The 2-2 region RG2b can be positioned horizontally spaced apart from the first plate portion 1154 to ensure space for the second connector CN2. Furthermore, since the 2-1 region RG2a is positioned further inward than the 2-2 region RG2b, the space between the second circuit board portion 1320 and the first camera actuator 1100 in the second direction can be reduced. Consequently, foreign matter can be prevented from entering the second connector CN2 located in the 2-2 region RG2b. Furthermore, the application of a protective member (e.g., epoxy resin) surrounding the second connector CN2 located in the 2-2 region RG2b can be easily achieved. Furthermore, the common plate FP extending from the 2-1 region RG2a in the area between the first region RG1 and the first plate portion 1154 can be more easily bent, making it easier to connect or assemble the second connector CN2 to the first plate portion 1154. In other words, the second circuit board portion 1320 does not protrude beyond the first region RG1, and alignment for improved assembly can be more easily performed.

[0209] Furthermore, the 2-1 region RG2a can be positioned between the 2-2 region RG2b and the first region RG1 in the optical axis direction. That is, the 2-2 region RG2b can be positioned further away from the first region RG1 than the 2-1 region RG2a. This configuration ensures greater connection tolerance for the second connector CN2 positioned in the 2-2 region RG2b. In other words, since the 2-2 region RG2b is spaced further apart from the 2-1 region RG2a and the first region RG1, tolerance issues that may arise in regions other than the 2-2 region RG2b can be addressed.

[0210] Furthermore, a magnetic yoke YK may be disposed between the first region RG1 and the second plate portion of the second camera actuator 1200. Specifically, the camera actuator 1200 may include a magnetic yoke YK disposed outside the second plate portion. The magnetic yoke YK may generate a force to maintain the position of the moving components in the second camera actuator 1200. Furthermore, the yoke YK may block externally applied magnetic forces.

[0211] The yoke YK may overlap the first region RG1 in the horizontal direction. In addition, the first region RG1 may not partially overlap the yoke YK in the horizontal direction. Therefore, the occurrence of cracks in the second circuit board portion due to the yoke YK can be reduced.

[0212] According to one embodiment of the present invention, a camera module includes: a first actuator, a second actuator and an image sensor arranged in sequence along an optical axis direction, and a circuit board arranged adjacent to the first actuator and the second actuator, the circuit board including a first circuit board portion and a second circuit board portion, the first circuit board portion being for the image sensor to be placed therein, the second circuit board portion being connected to the first circuit board portion and extending along the optical axis direction, and the second circuit board portion overlapping with the first actuator and the second actuator in a direction perpendicular to the optical axis direction and being connected to the first actuator.

[0213] A length of the first actuator in a direction perpendicular to the optical axis direction may be smaller than a length of the second actuator in a direction perpendicular to the optical axis direction.

[0214] The second circuit board portion may include a first region located at the outermost side and a second region located within the first region.

[0215] The second circuit board portion may include a common board, a first individual board disposed in the first region, and a second individual board disposed in the second region.

[0216] The length of the first individual plate in the optical axis direction may be 0.5 times or more the length of the common plate in the first region in the optical axis direction.

[0217] The length of the second individual plate in the optical axis direction may be 0.5 times or less of the length of the common plate in the optical axis direction in the second region.

[0218] The circuit board may include a third circuit board portion extending from the second circuit board portion in a direction perpendicular to the optical axis direction and including a first connector, and the second circuit board portion may include a second connector overlapping with the first actuator in a direction perpendicular to the optical axis direction and connected to the first actuator.

[0219] The first actuator may include a first plate portion provided on the side surface, and the second actuator may include a second plate portion provided on the side surface.

[0220] The first board portion may be coupled and electrically connected to the second connector pin.

[0221] The first actuator may include a first driving unit provided on the first plate portion, the first driving unit may be provided to be spaced apart from the second connector, and the first driving unit may be provided to be offset from the second connector in a direction perpendicular to the optical axis direction.

[0222] The second connector may be provided at one end of the second circuit board portion in the optical axis direction.

[0223] The second circuit board portion may include a terminal groove and a coupling groove provided in a first region, and the first region may overlap with the first actuator portion in a direction perpendicular to the optical axis direction.

[0224] The second region may include a 2-1 region located at the innermost side and a 2-2 region disposed between the first region and the 2-1 region in a direction perpendicular to the optical axis direction.

[0225] The 2-1 region may be in contact with the first actuator.

[0226] The camera module may include a cover surrounding the first actuator, the second actuator, and the circuit board, the cover may be asymmetric with respect to the optical axis, and the cover may include a first cover hole provided in an upper surface and a second cover hole adjacent to the second circuit board portion.

[0227] Figure 19 is a perspective view of a camera device according to an embodiment, Figure 20 is an exploded perspective view of the camera apparatus according to this embodiment, Figure 21 It is along Figure 19 View of line AA' in.

[0228] The drawings shown below correspond to the drawings shown by cutting along corresponding cross sections.

[0229] refer to Figure 19 and Figure 20 The camera device 100 according to this embodiment includes a cover CV, a first camera actuator 110, a second camera actuator 120, and a main board portion 130. In this specification, the first camera actuator 110 may be used interchangeably with the first actuator, and the second camera actuator 120 may be used interchangeably with the second actuator.

[0230] The cover CV may cover the first camera actuator 110 and the second camera actuator 120. The cover CV may improve a coupling force between the first camera actuator 110 and the second camera actuator 120.

[0231] In addition, the cover CV may be made of a material that performs electromagnetic shielding. Therefore, the first camera actuator 110 and the second camera actuator 120 in the cover CV may be easily protected.

[0232] The first camera actuator 110 may be an optical image stabilization (OIS) actuator. For example, the first camera actuator 110 may move an optical member in a direction perpendicular to an optical axis (an axis of incident light).

[0233] The first camera actuator 110 may include a fixed-focus lens disposed in a predetermined lens barrel (not shown). The fixed-focus lens may also be referred to as a "single focal length lens" or a "main lens."

[0234] The first camera actuator 110 can change the optical path. In one embodiment, the first camera actuator 110 can vertically change the optical path through an internal optical component (e.g., a prism or a reflector). For example, the optical component can change the direction of light from the X-axis direction to the Z-axis direction. Alternatively, the optical component can change the optical axis from the first axis to the second axis. With this configuration, even if the thickness of the mobile terminal is reduced, a lens configuration having a size greater than the thickness of the mobile terminal can be provided in the mobile terminal by changing the optical path, thereby performing magnification, auto focus (AF), zoom, and OIS functions.

[0235] However, the present invention is not limited thereto, and the first camera actuator 110 may change the optical path vertically or a plurality of times at a predetermined angle.

[0236] The second camera actuator 120 may be provided at a rear end of the first camera actuator 110. The second camera actuator 120 may be coupled to the first camera actuator 110. In addition, the second camera actuator 120 and the first camera actuator 110 may be coupled in various ways.

[0237] In addition, the second camera actuator 120 may be a zoom actuator or an AF actuator. For example, the second camera actuator 120 may support one or more lenses and move the lenses in response to a control signal from a predetermined control unit to perform an auto focus function or a zoom function.

[0238] Furthermore, one or more lenses may be independently or individually movable along the optical axis.

[0239] The main board portion 130 may be provided at a rear end of the second camera actuator 120. The main board portion 130 may be electrically connected to the second camera actuator 120 and the first camera actuator 110. In addition, a plurality of main board portions 130 may be provided.

[0240] In this specification, the first camera actuator 110 and the second camera actuator 120 may be voice coil motors, microactuators, silicon actuators, etc., and may be implemented in various ways, such as capacitive, thermal, bimorph, and electrostatic, but are not limited thereto. The first camera actuator 110 and the second camera actuator 120 may be devices for moving or tilting a lens or an optical member, and in this specification, the first camera actuator 110 and the second camera actuator 120 are described as each including a lens or an optical member. Furthermore, the first camera actuator 110 and the second camera actuator 120 may be referred to as a "lens transfer device," a "lens moving device," an "optical member transfer device," an "optical member moving device," or the like.

[0241] refer to Figure 21 , the camera apparatus according to this embodiment may include a first camera actuator 110 that performs an OIS function and a second camera actuator 120 that performs zoom and AF functions.

[0242] Light can be incident on the camera device or the first camera actuator 110 through the opening area located in the upper surface of the first camera actuator 110. That is, light can be incident on the first camera actuator 110 in the X-axis direction, and the optical path can be changed by the optical member (for example, from the X-axis direction to the Z-axis direction). In addition, the light can pass through the second camera actuator 120 and can be incident on the image sensor (PATH) located at one end of the second camera actuator 120. In this specification, the Z-axis direction is described as the optical axis direction, the X-axis direction and the Y-axis direction are perpendicular to each other, and the X-axis direction and the Y-axis direction are both described as directions perpendicular to the Z-axis direction.

[0243] In this specification, the inner side may refer to a side in a direction from the cover CV toward the first camera actuator, and the outer side may refer to a side in a direction opposite to the inner side. That is, the first camera actuator 110 and the second camera actuator 120 may be located inside the cover CV, and the cover CV may be located outside the first camera actuator 110 or the second camera actuator 120.

[0244] Furthermore, with this configuration, the camera device 100 according to this embodiment can improve the spatial limitations of the first camera actuator 110 and the second camera actuator 120 by changing the optical path. That is, the camera device 100 according to this embodiment can expand the optical path in response to the change in the optical path while minimizing the thickness of the camera device 100. Furthermore, it should be understood that the second camera actuator 120 can also provide high-magnification zoom by controlling focus, etc., in the expanded optical path.

[0245] In addition, the camera apparatus 100 according to this embodiment can implement OIS by controlling the optical path through the first camera actuator 110 , thereby reducing the occurrence of decentering or tilting phenomena as much as possible and producing optimal optical characteristics.

[0246] In addition, the second camera actuator 120 may include an optical system and a lens driving unit. For example, the second camera actuator 120 may include at least one of a first lens group, a second lens group, and a third lens group sequentially arranged in a direction from the first camera actuator 110 toward the image sensor.

[0247] In addition, the second camera actuator 120 may include a coil and a magnet to perform a high-magnification zoom function and an auto focus function.

[0248] For example, while the first and second lens groups can be movable lenses that move along the optical axis via coils, magnets, and guide pins, and the third lens group can be a fixed lens, the present invention is not limited to this. For example, the third lens group can function as a focusing lens group, forming an optical image at a specific position, while the first lens group can function as a variator, reshaping the image formed by the third lens group, which functions as a focusing lens group, at a different position. On the other hand, due to significant changes in the distance to the object or image distance, the first lens group can experience significant variations in magnification, and as a variator, the first lens group can play a significant role in varying the focal length or magnification of the optical system. Furthermore, the image point formed by the first lens group, which functions as a variator, can vary slightly depending on its position. Therefore, the second lens group can provide position compensation for the image formed by the variator. For example, the second lens group can function as a compensating lens group, precisely forming the image point formed by the first lens group, which functions as a variator, at the actual position on the image sensor. For example, due to the interaction between the coils and magnets, the first and second lens groups can be driven using electromagnetic force. The first lens group and the second lens group can move independently or in conjunction with each other. Here, although the second camera actuator 120 is described as including first to third lens groups, with the first and second lens groups being movable groups and the third lens group being a fixed group, the present invention is not limited thereto. The second camera actuator 120 may include multiple lens groups, and at least some of the multiple lens groups may be movable groups.

[0249] At the same time, when an actuator for OIS and an actuator for AF / zoom are provided according to an embodiment of the present invention, magnetic interference with the magnet for AF / zoom can be prevented when the OIS is driven. Since the first driving magnet of the first camera actuator 110 is provided separately from the second camera actuator 120, magnetic interference between the first camera actuator 110 and the second camera actuator 120 can be prevented. In this specification, OIS is used interchangeably with terms such as image stabilization, optical image stabilization, optical image correction, and shake correction.

[0250] Figure 22 is a perspective view of a first camera actuator according to an embodiment, Figure 23 is an exploded perspective view of a first camera actuator according to this embodiment.

[0251] refer to Figure 22 and Figure 23 According to this embodiment, the first camera actuator 110 may include a first housing 112, a mover 113, a rotating portion 114, a first driving unit 115, a first member 112-6, and a second member 113-11. In addition, the first camera actuator 110 may further include a plate CP.

[0252] The mover 113 may include a holder 113-1 and an optical member 113-2 positioned within the holder 113-1. Furthermore, the rotating portion 114 may include an inclined guide portion 114-1, as well as a second magnetic body 114-2 and a first magnetic body 114-3 having the same or different polarities to press against the inclined guide portion 114-1. For example, the first magnetic body 114-3 and the second magnetic body 114-2 may have the same polarity on their facing sides. Furthermore, the first drive unit 115 includes a drive magnet 115-1, a drive coil 115-2, a Hall sensor unit, a first plate portion 115-4, and a yoke unit.

[0253] First, the first camera actuator 110 may include a shield case (not shown). The shield case (not shown) may be located at the outermost side of the first camera actuator 110 and may be positioned to surround the rotating portion 114 and the first driving unit 115, as described below.

[0254] The shield cover (not shown) can block or reduce electromagnetic waves generated from the outside. That is, the shield cover (not shown) can reduce the occurrence of malfunctions in the rotating portion 114 or the first drive unit 115. The shield cover (not shown) can be the above-mentioned cover member CV, or can be a separate member provided in the cover member CV.

[0255] The first housing 112 may be located inside a shield case (not shown). In the absence of a shield case, the first housing 112 may be located at the outermost side of the first camera actuator 110 .

[0256] In addition, the first housing 112 may be located inside the first plate portion 115 - 4 (described below). The first housing 112 may be fitted into or aligned with a shield case (not shown) and may be fastened.

[0257] The first housing 112 may include a first housing side portion, a second housing side portion, a third housing side portion, and a housing wall.

[0258] The first member 112-6 may be provided in the first housing 112. The first member 112-6 may have some areas through which the second member 113-11 passes. The first member 112-6 may have a structure integrally formed with the first housing 112 or a separate structure.

[0259] In addition, the first camera actuator 110 may further include a plate (plate) CP disposed outside the first member 112-6. The plate CP can prevent foreign matter from passing through the first member 112-6 and entering the second member 113-11, etc. In addition, the plate CP can be made of a magnetic material. Therefore, the plate CP has magnetism and does not generate a magnetic force on the first magnetic body 114-3 and the second magnetic body 114-2 (which have polarity for pressing). In other words, the generation of a magnetic force that interferes with the driving (pressing) of the first magnetic body 114-3 and the second magnetic body 114-2 can be reduced.

[0260] When the plate CP is a magnetic body, the plate CP may be referred to as a magnetic member, a magnetic body, a cover plate, a metal member, a metal plate, or the like.

[0261] The mover 113 may include a holder 113 - 1 and an optical member 113 - 2 seated in the holder 113 - 1 .

[0262] The holder 113-1 can be placed in the receiving portion of the first housing 112. The holder 113-1 can include first to fourth holder outer surfaces, and these four outer surfaces correspond to the first housing side portion, the second housing side portion, the third housing side portion, and the first member 112-6, respectively. For example, the first to fourth holder outer surfaces can correspond to or face the inner surfaces of the first housing side portion, the second housing side portion, the third housing side portion, and the first member 112-6, respectively.

[0263] In addition, the holder 113-1 may include a second member 113-11 disposed in the fourth seating groove. The second member 113-11 may pass through the first member 112-6 and may be coupled to the holder 113-1. The second member 113-11 and the holder 113-1 may be coupled to each other by various connecting members or coupling members.

[0264] The optical member 113-2 may be seated in the holder 113-1. To this end, the holder 113-1 may have a seating surface, and the seating surface may be formed by a receiving groove.

[0265] The optical member 113-2 can improve the space limitation of the first camera actuator 110 and the second camera actuator 120 by changing the path of the reflected light. Therefore, it should be understood that the camera device can provide high-magnification zoom by expanding the optical path while minimizing its thickness.

[0266] In addition, the second member 113-11 can be coupled to the holder 113-1. The second member 113-11 can be disposed outside the holder 113-1 and inside the housing. Furthermore, the second member 113-11 can be positioned in an additional groove in an area other than the fourth positioning groove in the outer surface of the fourth holder in the holder 113-1. Thus, the second member 113-11 can be coupled to the holder 113-1, and at least a portion of the first member 112-6 can be positioned between the second member 113-11 and the holder 113-1. For example, at least a portion of the first member 112-6 can be positioned in the space formed between the second member 113-11 and the holder 113-1. The second member 113-11 can pass through a hole formed in the first member 112-6.

[0267] In addition, the second member 113-11 can be formed to have a structure separate from the holder 113-1. With this configuration, the following assembly of the first camera actuator 110 can be easily performed. Alternatively, the second member 113-11 can be formed integrally with the holder 113-1.

[0268] The rotating portion 114 includes an inclined guide portion 114 - 1 , and a second magnetic body 114 - 2 and a first magnetic body 114 - 3 having the same polarity to press the inclined guide portion 114 - 1 .

[0269] The inclined guide portion 114-1 can be coupled to the mover 113 and the first housing 112 as described above. Specifically, the inclined guide portion 114-1 can be disposed between the retaining frame 113-1 and the first member 112-6. Therefore, the inclined guide portion 114-1 can be coupled to the mover 113 and the first housing 112 of the retaining frame 113-1. However, in this embodiment, the inclined guide portion 114-1 can be disposed between the first member 112-6 and the retaining frame 113-1. Specifically, the inclined guide portion 114-1 can be located between the first member 112-6 and the fourth seating groove of the retaining frame 113-1. For example, at least a portion of the inclined guide portion 114-1 can be located in the fourth seating groove.

[0270] In the Z-axis direction, the second member 113-11, the first member 112-6, the inclined guide portion 114-1, and the holder 113-1 can be arranged in this order. In addition, the second magnetic element 114-2 and the first magnetic element 114-3 can be respectively placed in a first groove formed in the second member 113-11 and a second groove formed in the first member 112-6. The first groove can be located in the second member 113-11 and can move integrally with the holder and the second member 113-11. The second groove can be located in the first member 112-6 to correspond to the first groove and can be connected to the first housing 112.

[0271] Furthermore, the tilt guide portion 114-1 may be provided adjacent to the optical axis. Therefore, the actuator according to this embodiment can easily achieve a change in the optical path according to the tilt of the first and second axes.

[0272] The inclined guide portion 114 - 1 may include first protrusions disposed at intervals in the X-axis direction and second protrusions disposed at intervals in the Y-axis direction. In addition, the first protrusions and the second protrusions may protrude in opposite directions to each other.

[0273] In addition, the second magnetic body 114-2 may be located in the second member 113-11. In addition, the first magnetic body 114-3 may be located in the first member 112-6.

[0274] The second magnetic body 114-2 and the first magnetic body 114-3 can have the same polarity. For example, the second magnetic body 114-2 can be a magnet with an N pole, and the first magnetic body 114-3 can be a magnet with an N pole. Alternatively, the second magnetic body 114-2 can be a magnet with an S pole, and the first magnetic body 114-3 can be a magnet with an S pole. For example, as described above, the first polar surface of the first magnetic body 114-3 and the second polar surface of the second magnetic body 114-2 facing the first polar surface can have the same polarity.

[0275] Due to this polarity, the second magnetic body 114-2 and the first magnetic body 114-3 can generate a repulsive force between each other. With this configuration, this repulsive force can be applied to the second member 113-11 or holder 113-1 coupled to the second magnetic body 114-2, and the first member 112-6 or first housing 112 coupled to the first magnetic body 114-3. In this case, the repulsive force applied to the second member 113-11 can be transmitted to the holder 113-1 coupled to the second member 113-11. Consequently, the inclined guide portion 114-1 disposed between the second member 113-11 and the first member 112-6 can be pressed by the repulsive force. Furthermore, this repulsive force can also be transmitted to the housing and the mover. Consequently, the housing and the mover can be pressed against each other by the repulsive force. In other words, the repulsive force can correspond to a retaining force that maintains the position of the housing and the mover. That is, the repulsive force can keep the inclined guide portion 114-1 between the retaining frame 113-1 and the first shell 112 (or the first member 112-6). With this configuration, the position between the mover 113 and the first shell 112 can be maintained even when tilted relative to the X-axis or Y-axis. In addition, the inclined guide portion can be in close contact with the first member 112-6 and the retaining frame 113-1 due to the repulsive force between the first magnetic body 114-3 and the second magnetic body 114-2. In other words, the repulsive force between the first magnetic body 114-3 and the second magnetic body 114-2 can be the force for maintaining the position between the retaining frame 113-1 and the first shell 112.

[0276] The first driving unit 115 may include a driving magnet 115 - 1 , a driving coil 115 - 2 , a hall sensor unit, a first plate portion 115 - 4 , and a yoke unit.

[0277] The driving magnet 115 - 1 may include a first magnet, a second magnet, and a third magnet that provide a driving force by an electromagnetic force. The first magnet, the second magnet, and the third magnet may each be located on an outer surface of the holder 113 - 1 .

[0278] A plurality of driving coils 115 - 2 may be provided. In one embodiment, the driving coil 115 - 2 may include a first coil, a second coil, and a third coil.

[0279] The first coil can be positioned opposite the first magnet. Thus, the first coil can be located in the first housing hole of the first housing side portion. Furthermore, the second coil can be positioned opposite the second magnet. Thus, the second coil can be located in the second housing hole of the second housing side portion.

[0280] When OIS is implemented by rotating and controlling the mover 113 in the X-axis direction or the Y-axis direction through the electromagnetic force between the driving magnet 115-1 and the driving coil 115-2, the first camera actuator 110 according to this embodiment can provide optimal optical characteristics by minimizing the occurrence of decentering or tilting phenomena.

[0281] In addition, according to this embodiment, when OIS is achieved by the inclined guide portion 114-1 of the rotating portion 114 arranged between the first shell 112 and the mover 113, the size limitation of the actuator can be solved, thereby providing an ultra-thin, ultra-small camera actuator and a camera device including the camera actuator.

[0282] The first board portion 115 - 4 may include a first sub-board 115 - 41 , a second sub-board 115 - 42 , and a third sub-board 115 - 43 .

[0283] The second sub-board 115-42 and the third sub-board 115-43 may be disposed to face each other. In addition, the first sub-board 115-41 may be located between the second sub-board 115-42 and the third sub-board 115-43.

[0284] In addition, the first sub-board 115-41 can be located between the first housing side portion and the shield cover, the second sub-board 115-42 can be located between the second housing side portion and the shield cover. In addition, the third sub-board 115-43 can be located between the third housing side portion and the shield cover and can be the bottom surface of the first board portion 115-4.

[0285] The first sub-board 115-41 may be coupled and electrically connected to the first coil.In addition, the first sub-board 115-41 may be coupled and electrically connected to the first Hall sensor.

[0286] The second sub-board 115-42 may be coupled and electrically connected to the second coil. Additionally, it should be understood that the second sub-board 115-42 may be coupled and electrically connected to the first Hall sensor.

[0287] The third sub-board 115-43 may be coupled and electrically connected to the third coil.In addition, the third sub-board 115-43 may be coupled and electrically connected to the second Hall sensor.

[0288] Figure 24 is a perspective view of a second camera actuator according to this embodiment.

[0289] refer to Figure 24 , the second camera actuator 120 according to this embodiment may include one or more lens groups.

[0290] The second camera actuator 120 may include a driving unit, and the driving unit may be used to move at least one of the plurality of lens groups along the Z-axis. Depending on the driving force of the driving unit, the lens groups may move individually or together. In one embodiment, each lens may move along the optical axis.

[0291] Figure 25 is a perspective view of the camera apparatus (excluding the cover) according to this embodiment, Figure 26 is an exploded perspective view of the camera apparatus (excluding the cover) according to this embodiment, Figure 27 is a perspective view of a circuit board of the camera device according to this embodiment.

[0292] refer to Figures 25 to 27 In the camera device according to this embodiment, the first camera actuator 110, the second camera actuator 120, and the main board portion 130 may be arranged sequentially in one direction or in the optical axis direction (Z-axis direction). Therefore, the second camera actuator 120 may be located at the rear end of the first camera actuator 110.

[0293] Furthermore, the first camera actuator 110 and the second camera actuator 120 may have surfaces facing each other. For example, the first surface of the first camera actuator 110 and the second surface of the second camera actuator 120 may face each other. Here, the first surface may be the back surface of the first camera actuator 110. Furthermore, the second surface may be the front surface of the second camera actuator 120. Connecting members or the like may be applied to the first and second surfaces. Alternatively, the first and second surfaces may be coupled to each other via a protrusion / groove structure. Thus, the first camera actuator 110 and the second camera actuator 120 may be coupled to each other. That is, the first camera actuator 110 and the second camera actuator 120 may be coupled directly or indirectly in a variety of ways.

[0294] According to this embodiment, the main board portion 130 may be provided on at least a portion of the side surface of the second camera actuator 120. For example, the main board portion 130 may overlap at least a portion of the side surface of the second camera actuator 120 or the side surface of the first camera actuator 110 in the horizontal direction (Y-axis direction).

[0295] A circuit board 115 - 42 for the first camera actuator 110 may be provided on a side surface of the first camera actuator 110 . For example, the circuit board 115 - 42 may be in contact with the side surface of the first camera actuator 110 .

[0296] A circuit board 127 for the second camera actuator 120 may be provided on a side surface of the second camera actuator 120. For example, the circuit board 127 may be in contact with the side surface of the second camera actuator 120.

[0297] The main board portion 130 may include an image sensor mounted therein. The main board portion 130 may include a first main board 131 that overlaps with the second camera actuator (or the first camera actuator) in the optical axis direction (Z-axis direction), and a second main board 132 that bends from the first main board 131 and extends to the side surface of the second camera actuator 120. Furthermore, the main board portion 130 may extend to both side surfaces of the second camera actuator 120 and further include a third main board (not shown). The third main board (not shown) may face the second main board 132 relative to the optical axis.

[0298] First, an image sensor IS and a sensor base may be disposed on the first unit main board 131 .

[0299] Furthermore, at least one of the second unit main board 132 and the third unit main board (not shown) according to this embodiment may extend in the Z-axis direction to surround the second camera actuator 120. For example, the second unit main board 132 and the third unit main board (not shown) may overlap with the second camera actuator 120 in the Y-axis direction. According to this embodiment, the second unit main board 132 and the third unit main board (not shown) may also extend in the Z-axis direction to overlap with the first camera actuator 110 in the Y-axis direction.

[0300] Any one of the second unit main board 132 and a third unit main board (not shown) may be connected to the connector unit CN.

[0301] The first and second main boards 131, 132 can have an integral or split structure. In one embodiment, the first and second main boards 131, 132 can include a common, integrated flexible printed circuit board (FPCB) and separate, rigid printed circuit boards (RPCBs). Thus, the area between the first and second main boards 131, 132 can be easily folded over the area formed solely from the FPCB. Thus, the first main board 131 can be positioned perpendicular to the Z-axis, and the area between the first and second main boards 131, 132 can be folded over the FPCB, allowing the second main board 132 to be positioned along the Z-axis.

[0302] In one embodiment, the first and second unit main boards 131 and 132 may be composed of multiple layers. Furthermore, the first and second unit main boards 131 and 132 may include holes for circuit patterns or multiple layers. Specifically, the first unit main board 131 may have a structure comprising a stack of individual boards, a shared board, and individual boards. Furthermore, the second unit main board 132 may also have a structure comprising a stack of individual boards, a shared board, and individual boards. In this case, the individual boards and the shared board may each have circuit patterns and may comprise one or more layers.

[0303] The first board portion 115 - 4 included in the first camera actuator 110 may include a first sub-board 115 - 41 disposed on a bottom surface of the first camera actuator 110 , and second and third sub-boards 115 - 42 and 115 - 43 respectively disposed on side surfaces of the first camera actuator 110 .

[0304] The first sub-board 115 - 41 may be disposed under the first camera actuator and may at least partially overlap the first camera actuator in the X-axis direction.

[0305] The second and third sub-boards 115-42 and 115-43 may be disposed on a side surface of the first camera actuator 110. In addition, the second and third sub-boards 115-42 and 115-43 may at least partially contact the side surface of the first camera actuator 110.

[0306] The second sub-board 115 - 42 and the third sub-board 115 - 43 may be symmetrically arranged with respect to the optical axis or the direction of the optical axis.

[0307] According to an embodiment of the present invention, the second unit main board 132 and the second daughter board 115-42 are connected by soldering. Hereinafter, description will be made based on the second unit main board 132 referred to as the first circuit board 132 and the second daughter board 115-42 referred to as the second circuit board 115-42.

[0308] Figure 28 is a front view of the connection structure of the circuit board after soldering according to this embodiment, Figure 29 is a perspective view of the connection structure of the circuit board after welding according to this embodiment, Figure 30 is a cross-sectional view of the connection structure of the circuit boards after soldering according to this embodiment. Figure 31 is a front view of the connection structure of the circuit board before soldering according to this embodiment, Figure 32 is a perspective view of the connection structure of the circuit board before soldering according to this embodiment, Figure 33 is a cross-sectional view of the connection structure of the circuit boards before soldering according to this embodiment. Figure 34 is an exploded view for describing the connection structure of the circuit boards according to this embodiment, Figure 35 This is an enlarged perspective view of a portion of the connection structure of the circuit board.

[0309] Reference Figures 28 to 35 , the plurality of first solder pads 132P of the first circuit board 132 and the plurality of second solder pads 115P-42 of the second circuit board 115-42 are electrically connected by welding.

[0310] As described above, the first circuit board 132 may be the second unit main board 132 and may be a circuit board electrically connected to the image sensor IS. The second circuit board 115 - 42 may be the second sub-board 115 - 42 and may be a circuit board for the first camera actuator 110 .

[0311] The first circuit board 132, serving as the second unit main board 132, can be folded from the first unit main board 131 on which the image sensor is disposed, and can be disposed on a side surface of the second camera actuator 120. The first circuit board 132 can be a multilayer PCB, and a portion 132F can include only an FPCB, while the remaining portion 132R can include an FPCB and an RPCB that overlap in the Y-axis direction. For example, the first circuit board 132 can include a common FPCB, and the RPCB can be disposed on at least one of the two surfaces of some regions of the common FPCB.

[0312] According to an embodiment of the present invention, the plurality of first pads 132P may be provided in the region 132 of the first circuit board 132 including only the FPCB and may be bonded to the plurality of second pads 115P- 42 of the second circuit board 115 - 42 .

[0313] To this end, one end of a region 132F including only the FPCB can be disposed on the second circuit board 115-42 and can extend to the remaining region 132R including the FPCB and the RPCB. Therefore, the FPCB region 132F, which includes only the first circuit board 132, can include a first region 132F-1 that overlaps with the second circuit board 115-42 in the Z-axis direction and a second region 132F-2 that overlaps with the second circuit board 115-42 in the Y-axis direction. A plurality of first solder pads 132P can be disposed in the second region 132F-2. In other words, the second region 132F-2 can be disposed on the second circuit board 115-42, and the first region 132F-1 can be disposed on the circuit board 127 for the second camera actuator 120 by extending from the second region 132F-2 toward the image sensor IS. Therefore, since the first circuit board 132 can be flexibly bent according to the height of the second circuit board 115-42, a stable connection between the first circuit board 132 and the second circuit board 115-42 can be achieved.

[0314] Here, the positioning holes 132A may be provided in the remaining region 132R including the FPCB and the RPCB. The position of the first circuit board 132 may be aligned by the positioning holes 132A.

[0315] According to an embodiment of the present invention, the first circuit board 132 may include a plurality of first solder pads 132P formed at one end of the first circuit board 132. Here, the one end of the first circuit board 132 may be a second region 132F-2 that overlaps with the second circuit board 115-42 in the Y-axis direction within region 132F of the FPCB that includes only the first circuit board 132. That is, the one end of the first circuit board 132 may be a side of the first circuit board 132 that is opposite to the side connected to the first unit main board 131 in the Z-axis direction. That is, the one end of the first circuit board 132 may be a surface of the first circuit board 132 that is located in the Z-axis direction, away from the image sensor IS. The plurality of first solder pads 132P may be spaced apart from each other in the X-axis direction, which is perpendicular to the Z-axis direction. The plurality of first solder pads 132P may be exposed to the outside through a notch formed in the outermost layer of the first circuit board 132. Here, the outermost layer of the first circuit board 132 may be an insulating layer.

[0316] The second circuit board 115-42 may include a plurality of second solder pads 115P-42 formed at one end of the second circuit board 115-42. That is, one end of the second circuit board 115-42 may include an area overlapping with the first circuit board 132 in the Y-axis direction. One end of the second circuit board 115-42 may be a surface facing the image sensor 1, which is provided as both ends of the second circuit board 115-42 in the Z-axis direction. The plurality of second solder pads 115P-42 may be provided spaced apart from each other in the X-axis direction perpendicular to the Z-axis direction. The plurality of second solder pads 115P-42 may be exposed to the outside through a recess formed in the outermost layer of the second circuit board 115-42. Here, the outermost layer of the second circuit board 115-42 may be an insulating layer.

[0317] According to this embodiment, the plurality of first solder pads 132P and the plurality of second solder pads 115P-42 can correspond one to one, at least some areas of the plurality of first solder pads 132P and at least some areas of the plurality of second solder pads 115P-4 can be set to overlap each other in the Y-axis direction perpendicular to the Z-axis direction and the X-axis direction, and the plurality of first solder pads 132P and the plurality of second solder pads 115P-42 can be welded.

[0318] Therefore, compared with the case where multiple first solder pads 132P and multiple second solder pads 115P-42 are aligned in the Z-axis direction but are not arranged to overlap with each other in the Y-axis direction, during the welding process, as the distance between the end of the first circuit board 132 and the end of the second circuit board 115-42 increases, the probability of welding defects can be reduced, and the problem of the end of the first circuit board 132 and the end of the second circuit board 115-42 separating from each other after welding due to external influences (such as vibration) can be minimized.

[0319] According to this embodiment, among the plurality of first pads 132P and the plurality of second pads 115P-42, the sum of the lengths z1+z2 in the Z-axis direction of the first pads and the second pads arranged to overlap each other in the Y-axis direction may be greater than the length z3 in the Y-axis direction of the first pads and the second pads in a state of overlapping each other in the Y-axis direction. Therefore, compared with the case where the plurality of first pads 132P and the plurality of second pads 115P-42 are aligned in the Z-axis direction but are arranged not to overlap each other in the Y-axis direction, the amount of solder required can be significantly reduced.

[0320] According to this embodiment, a hole 132H may be formed in each of the plurality of first pads 132P, passing through each of the plurality of first pads 132P. Each hole 132H may be provided in each of the plurality of second pads 115P-42, and solder may be provided in the hole 132H. Therefore, when soldering the plurality of first pads 132P and the plurality of second pads 115P-42, the solder S may flow through the hole 132H and be provided between the lower surface of the plurality of first pads 132P and the upper surface of the plurality of second pads 115P-42. Therefore, since the contact area between the plurality of first pads 132P and the plurality of second pads 115P-42 increases, the bonding strength between the plurality of first pads 132P and the plurality of second pads 115P-42 may be improved, and the resistance between the plurality of first pads 132P and the plurality of second pads 115P-42 may be reduced.

[0321] At this time, the width W2 of the hole 132H may be 40% to 70% of the width W1 of each first pad 132P. When the width W2 of the hole 132H is less than 40% of the width W1 of each first pad 132P, not only is it difficult to process the hole 132H, but it is also difficult for the solder S to penetrate into the hole 132H. When the width W2 of the hole 132H exceeds 70% of the width W1 of each first pad 132P, the actual area of ​​the first pad 132P is reduced, which may cause poor contact between the first circuit board 132 and the second circuit board 115-42.

[0322] According to this embodiment, the maximum height of the solder S in the Y-axis direction after soldering can be lower than the maximum height of the first circuit board 132 in the Y-axis direction, or can be 1.2 times or less of the maximum height of the first circuit board 132 in the Y-axis direction. This is because the solder S flows through the hole 132H during the soldering process to minimize excess solder. Therefore, it is possible to prevent excess solder from overflowing onto another adjacent first solder pad and causing multiple first solder pads 132P to be electrically connected to each other. In addition, when the height of the solder S is limited as in the embodiment, the possibility of contact with the shielding cover or cover member is reduced. Therefore, the possibility of the shielding cover or cover member shorting can be minimized.

[0323] According to this embodiment, the second circuit board 115-42 may further include a plurality of test slots 115A-42. The plurality of test slots 115A-42 may be formed in a form in which a conductive layer is exposed by a hole formed in the outermost layer of the second circuit board 115-42. Each test slot 115A-42 is connected to each second solder pad 115P-42, and each test slot 115A-42 may be used to test the electrical connection between each first solder pad 132P and each second solder pad 115P-42. Therefore, the number of the plurality of first solder pads 132P, the plurality of second solder pads 115P-42, and the plurality of test slots 115A-42 may all be the same.

[0324] Figure 36 is a perspective view of a mobile terminal to which the camera module according to this embodiment is applied.

[0325] like Figure 36 As shown, the mobile terminal 1500 in the embodiment may include a camera module 1000 (or camera device 100 ), a flash module 1530 , and an auto focus device 1510 disposed on a rear surface thereof.

[0326] The camera module 1000 may include an image capturing function and an auto focus function. For example, the camera module 1000 may include an auto focus function using an image.

[0327] The camera module 1000 processes image frames of still or moving images obtained by an image sensor in a photographing mode or a video call mode.

[0328] The processed image frames can be displayed on a predetermined display unit and stored in a memory. A camera (not shown) can also be provided on the front of the mobile terminal body.

[0329] For example, the camera module 1000 may include a first camera module 1000A and a second camera module 1000B, and the first camera module 1000A may implement OIS as well as AF or zoom functions.

[0330] The flash module 1530 may include a light emitting element that emits light therein. The flash module 1530 may be operated by an operation of a camera of the mobile terminal or by a user's control.

[0331] The auto-focus device 1510 may include one of a plurality of packages of a surface emitting laser device as a light emitting unit.

[0332] The auto focus device 1510 may include an auto focus function using laser. The auto focus device 1510 may be mainly used under conditions where it is difficult to use the auto focus function when using an image of the camera module 1000, for example, within a close distance of 10 m or less or in a dark environment.

[0333] The auto-focus device 1510 may include a light emitting unit including a vertical cavity surface emitting laser (VCSEL) semiconductor device and a light receiving unit that converts light energy into electrical energy, such as a photodiode.

[0334] According to one embodiment of the present invention, a camera device includes: an image sensor; a first circuit board electrically connected to the image sensor; a first camera actuator; and a second circuit board electrically connected to the first camera actuator, wherein one end of the first circuit board includes a plurality of first solder pads, which extend in a first direction and are spaced apart from each other in a second direction perpendicular to the first direction; one end of the second circuit board includes a plurality of second solder pads, which extend in the first direction and are spaced apart from each other in the second direction; the plurality of first solder pads and the plurality of second solder pads correspond one to one, at least some areas of the plurality of first solder pads and at least some areas of the plurality of second solder pads are arranged to overlap with each other in a third direction perpendicular to the first direction and the second direction, the plurality of first solder pads and the plurality of second solder pads are connected by welding, a hole is formed in each of the plurality of first solder pads, and the hole is arranged in each of the plurality of second solder pads.

[0335] Among the plurality of first pads and the plurality of second pads, a sum of lengths in the first direction of the first and second pads disposed to overlap each other in the third direction may be greater than lengths in the first direction of the first and second pads in a state of overlapping each other.

[0336] One end of the first circuit board may be disposed on one end of the second circuit board.

[0337] Solder may be disposed in the hole of the first pad.

[0338] Solder may be provided in the holes, on lower surfaces of the plurality of first pads, and on upper surfaces of the plurality of second pads.

[0339] The width of the hole may be 40% to 70% of the width of each of the plurality of first pads.

[0340] One end of the first circuit board may be an FPCB.

[0341] The first circuit board may include an FPCB, a first area of ​​the FPCB may be disposed to overlap the second circuit board in a first direction, a second area of ​​the FPCB may be disposed to overlap the second circuit board in a third direction, and the first pad may be disposed in the second area of ​​the FPCB.

[0342] The first direction may be an optical axis direction.

[0343] The first camera actuator may be an optical image stabilization (OIS) actuator.

[0344] The first circuit board includes a 1-1 circuit board and a 1-2 circuit board, the 1-1 circuit board is configured to extend from the lower surface of the image sensor in a direction perpendicular to the first direction, the 1-2 circuit board is connected to the 1-1 circuit board and is configured to extend along the first direction, and a plurality of first solder pads can be set on the 1-2 circuit board.

[0345] The camera device may also include a second camera actuator arranged between the image sensor and the first camera actuator, wherein the 1-1 circuit board, the image sensor, the second camera actuator and the first camera actuator may be arranged sequentially in the first direction, and the 1-2 circuit board may be arranged on the side surface of the second camera actuator.

[0346] The first camera actuator may be an OIS actuator, and the second camera actuator may be a zoom actuator or an AF actuator.

[0347] Figure 37 is a perspective view of a vehicle to which the camera module according to this embodiment is applied.

[0348] For example, Figure 37 1 is an external view of a vehicle including a vehicle driving assistance apparatus to which the camera module 1000 (or camera apparatus 100 ) according to this embodiment is applied.

[0349] refer to Figure 37 The vehicle 700 in the embodiment may include wheels 13FL and 13FR rotated by a power source and a predetermined sensor. The sensor may be a camera sensor 2000, but is not limited thereto.

[0350] The camera sensor 2000 may be a camera sensor to which the camera module 1000 according to this embodiment is applied. The vehicle 700 in this embodiment may obtain image information through the camera sensor 2000 that captures a front image or a surrounding image, and use the image information to determine if a lane is not recognized, and create a virtual lane when a lane is not recognized.

[0351] For example, the camera sensor 2000 may photograph the front of the vehicle 700 to obtain a front image, and the processor (not shown) may analyze objects included in the front image to obtain image information.

[0352] For example, when objects such as lanes, adjacent vehicles, traffic obstacles, medians corresponding to indirect road markings, curbs, and roadside trees are captured in an image captured by the camera sensor 2000, the processor can detect these objects and incorporate information about them into the image information. At this point, the processor can obtain distance information to the objects detected by the camera sensor 2000 to further supplement the image information.

[0353] The image information may be information about an object photographed in the image. The camera sensor 2000 may include an image sensor and an image processing module.

[0354] The camera sensor 2000 may process a still image or a moving image obtained by an image sensor (eg, CMOS or CCD).

[0355] The image processing module can process static images or dynamic images obtained by the image sensor, extract necessary information, and send the extracted information to the processor.

[0356] At this time, although the camera sensor 2000 may include a stereo camera to improve the measurement accuracy of the object and obtain more information, such as the distance between the vehicle 700 and the object, the present invention is not limited thereto.

[0357] Although the above mainly describes the embodiments, these are merely examples and are not intended to limit the present invention. It will be apparent to those skilled in the art that various modifications and applications not exemplified herein can be made without departing from the basic characteristics of the present invention. For example, each component specifically shown in the embodiments can be modified and implemented. In addition, it should be understood that differences related to modifications and applications are included within the scope of the present invention as defined by the appended claims.

Claims

1. A camera module, comprising: The first actuator, the second actuator and the image sensor are sequentially arranged along the optical axis; as well as a circuit board disposed adjacent to the first actuator and the second actuator, Wherein, the circuit board includes: a first circuit board portion on which the image sensor is disposed; and a second circuit board portion connected to the first circuit board portion and extending in the optical axis direction, and The second circuit board portion overlaps the first actuator and the second actuator in a direction perpendicular to the optical axis direction, and is connected to the first actuator.

2. The camera module according to claim 1, wherein: A length of the first actuator in a direction perpendicular to the optical axis direction is smaller than a length of the second actuator in a direction perpendicular to the optical axis direction.

3. The camera module according to claim 1, wherein: The second circuit board portion includes: a first region located at the outermost side; and The second area is located inside the first area.

4. The camera module according to claim 3, wherein: The second circuit board portion includes: Shared board; a first separate plate disposed in the first region; and A second separate plate is disposed in the second region.

5. The camera module according to claim 4, wherein: A length of the first individual plate in the optical axis direction is 0.5 times or more a length of the common plate in the first region in the optical axis direction.

6. The camera module according to claim 5, wherein: A length of the second individual plate in the optical axis direction is 0.5 times or less than a length of the common plate in the second region in the optical axis direction.

7. The camera module according to claim 1, wherein: The circuit board includes a third circuit board portion extending from the second circuit board portion in a direction perpendicular to the optical axis direction and including a first connector, and The second circuit board portion includes a second connector that overlaps with the first actuator in a direction perpendicular to the optical axis direction and is connected to the first actuator.

8. The camera module according to claim 7, wherein: The first actuator includes a first plate portion provided on a side surface, and The second actuator includes a second plate portion provided on a side surface.

9. The camera module according to claim 8, wherein: The first board portion is coupled to and electrically connected to the second connector pins.

10. The camera module according to claim 8, wherein: The first actuator includes a first driving unit provided on the first plate portion, The first driving unit is disposed to be spaced apart from the second connector, and The first driving unit is disposed to be offset from the second connector in a direction perpendicular to the optical axis direction.

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