Deformable object

Abstract

The invention relates to an object comprising a body (1), wherein: at least one circuit board (3) and a conductor path (4) connected thereto are present on at least one surface of the body (1); the body (1) is deformable and at least said surface of the body (1) is porous; the conductor path (4) is stretchable and at least the conductor path (4) is covered by the elastomer (2); and the elastic body (2) extends into a hole in the surface of the main body (1).

Description

[0001] The invention relates to a deformable object comprising a body made of a deformable porous material, the deformable object being equipped with electronic components.

[0002] The object of the present invention is to produce an object equipped with electronic components, wherein the object is deformable, wherein the electronic components are prevented from being damaged or detached from the object during deformation of the object.

[0003] In order to solve this problem, an object according to claim 1 is proposed.

[0004] In one embodiment, an object is proposed, comprising a body, wherein at least one circuit board and conductor paths connected to the circuit board are present on at least one surface of the body, wherein the body is deformable and at least the surface of the body is porous, wherein the conductor paths are stretchable, and wherein at least the conductor paths are covered by an elastomer, wherein the elastomer extends into the pores of the surface of the body.

[0005] Preferably, the elastomer also at least partially covers the circuit board or each of the circuit boards.

[0006] Preferably, the surface of the main body on which the conductor paths and the circuit board are located is located at the bottom of a recess in the main body, wherein the recess is completely filled with the elastomer.

[0007] In one embodiment, the surface of the body on which the conductor paths and the at least one circuit board are located is completely covered by the elastomer.

[0008] In one embodiment, at least one circuit board has an electronic component or a contact surface, wherein the surface of the electronic component or the contact surface is flush with the surface of the elastomer.

[0009] In one embodiment, at least one circuit board has an electronic component, wherein in the region of the electronic component, instead of the elastomer, a plastic material different from the elastomer is present, which extends to the surface of the elastomer.

[0010] Preferably, the conductor path is in the form of a cable or wire having a winding, meandering or kinked course.

[0011] Preferably, the body is stretchable and elastic.

[0012] In one embodiment, a method for manufacturing an object is proposed, the object comprising a deformable body having at least one porous surface, wherein in a first step at least one circuit board and a stretchable conductor path connected to the circuit board are placed on the porous surface of the body, wherein in a second step at least the conductor path is covered with a first material which penetrates into the pores of the body surface and completely covers at least the conductor path, In the third step, the first material is cured to form an elastomer.

[0013] Preferably, in a first step, several circuit boards are placed on the porous surface of the body, which circuit boards are connected to each other at least via stretchable conductor paths, wherein there is at least one electronic component on each circuit board, and wherein in a second step, the stretchable conductor paths are completely covered and the circuit boards are at least partially covered.

[0014] Preferably, the surface of the main body on which the conductor paths and the at least one circuit board are located is located at the bottom of a recess in the main body, wherein the main body has originally been manufactured with this recess or is provided with this recess before the first step.

[0015] Preferably, in addition to the encapsulation with the first material, encapsulation is also carried out with a second material, wherein the second material is applied in the region of the at least one electronic component present on the circuit board, wherein the second material cures to form a plastic having different properties from the elastomer.

[0016] Preferably, the casting is carried out with the first casting compound such that the surface of the elastomer is flush with one or more of the following surfaces: a surface of the main body which is raised relative to the surface of the main body on which the conductor paths and at least one circuit board are present; a surface of a raised contact area on the circuit board; a surface of an electronic component raised on the circuit board; a surface of a plastic formed by molding with the second material in the area of ​​the electronic component on the circuit board.

[0017] The material of the body is porous, which means that it has a surface structure into which the casting compound or the coating applied in the liquid state can penetrate.

[0018] This ensures good adhesion of the applied layer to the porous body.

[0019] Preferably, the material of the body has pores whose average pore size is at least 25 μm, more preferably at least 100 μm, in particular at least 250 μm.

[0020] The porous body is deformable.

[0021] The porous body may be stretchable.

[0022] The porous body may be elastic.

[0023] The porous body preferably has a flat shape, ie the length and width are each a multiple of the thickness of the body.

[0024] The surface on which the electronic components and the stretchable conductor paths are located can be regarded as the plane of the body.The electronic components and the stretchable conductor paths can also be located on a curved surface of the body.

[0025] In this context, deformable refers to the ability of a body to deform transversely to the plane or surface on which the electronic components are located. This can, for example, cause the body to bend or fold, or cause the material of the body to dent. Stretchable refers to the ability of a body to deform in the longitudinal or transverse direction, accompanied by dimensional changes in the plane of the body, particularly the surface on which the electronic components are located. In this context, stretchable refers specifically to a body whose length or width can be extended by a tensile force. Elasticity refers to the fact that a body returns to its original dimensions after the tensile or compressive force is removed.

[0026] The material of the main body can in particular be textile, open-cell foam, felt, rough leather or a 3D-printed lattice structure (three-dimensional mesh).

[0027] In one embodiment, the present invention comprises a body made of a deformable and porous material (textile, open-cell foam, felt, rough leather, 3D-printed lattice structure), on the surface of the body there is a thin circuit board with electronic functions, which is connected by stretchable conductor paths, wherein the thin circuit board and the stretchable conductor paths are fixed to the surface of the body by being enclosed in a cured layer of an elastomer (e.g., silicone, polyurethane), wherein a precursor of the elastomer is applied in liquid form and cured on the body, wherein a portion of the elastomer has penetrated into the pores of the body material, thereby forming a mechanically strong bond.

[0028] Sensors, indicators and / or actuators may be present on the thin circuit boards, whereby one or more of the aforementioned electronic components may be present on each of the individual circuit boards.

[0029] In one embodiment, the stretchable conductor path is in the form of a meandering cable.

[0030] Stretchable conductor paths can exist without insulating material. A stretchable conductor path can include several individual parallel cables, each with its own insulating sheath. Several conductor paths can exist together in an elastic insulating material that electrically insulates the several conductor paths from each other and preferably also from the outside. However, the conductor paths can also be uninsulated on the surface of the substrate in the form of a stretchable strip. The conductor paths themselves can be composed of elastic conductive material. However, the conductor paths can also be arranged so that they can be stretched apart due to twisted or folded routes. The conductor paths can be printed on the stretchable substrate. The conductor paths can be in the form of wires or stranded cables. The conductor paths can be in the form of elastic conductive fibers, for example by wrapping a metal wire around an elastic fiber. The conductor paths can each have an insulation member and be attached to the stretchable substrate.

[0031] Elastomers are deformable, stretchable, and elastic.

[0032] The elastomer may be, for example, silicone or polyurethane.

[0033] The elastomer preferably completely covers the thin circuit board and the conductor paths.

[0034] The material of the conductor path is preferably a conductive metal, in particular aluminum, copper, silver or gold, with copper being particularly preferred. In addition, carbon black and conductive polymers can be used.

[0035] In one embodiment, the sensor surface, contact surface, display surface, display element or actuator protrudes from the elastomer or is flush with the surface of the elastomer.

[0036] The object may be a textile rubber coated by an elastomer, wherein the conductor paths and the circuit board are embedded in the rubber coating.

[0037] In a preferred embodiment, there is a recess in the surface of the object, into which recess the circuit board and the stretchable conductor path are inserted, whereby the recess is completely filled with the liquid precursor of the elastomer, so that the surface is continuous again and the circuit board and the conductor path are surrounded.

[0038] The body can be manufactured with the recess already in place, for example in the case of a 3D-printed body, or it can be manufactured in a mold, for example by foam extrusion. The recess can also be carved into the body in an additional work step, for example by cutting, milling or laser ablation.

[0039] Preferably, the elastic moduli of the main body and the elastic body match each other. The deviation between the two elastic moduli is preferably less than 10%. In one embodiment, the main body and the elastic body have the same elastic modulus.

[0040] In one embodiment, at least one circuit board comprises a pressure sensor, a humidity sensor, a strain sensor, a temperature sensor, a chemical sensor, or a combination of several of these sensors.

[0041] In one embodiment, at least one circuit board contains an LED, an actuator or an electrode for sending electrical pulses or a combination of several of these elements.

[0042] In one embodiment, the object is worn on a human body, for example as a garment, a shoe insole, or a headband. In one embodiment, the object is a cushion, a pillow, a seat cushion, or a mattress.

[0043] In one embodiment, a component is cast using at least two different materials, wherein a first material cures to form an elastomer and a second material is used to be cast in an area above at least one circuit board, the second material being different from the first material such that the second material cures to form a plastic having different properties than the elastomer.

[0044] Preferably, a second material is applied over the sensor of the circuit board instead of the first elastomeric material. This second material cures to form a plastic, allowing for better transmission of the sensor's measurement signal. In one embodiment, the second material is applied over the pressure sensor and cures to form a plastic with a higher hardness than the elastomer. In one embodiment, a gas- or water-permeable plastic formed from the second material is positioned over the humidity sensor, pH sensor, or chemical sensor. In the case of a light sensor or a display element such as one or more LEDs, a plastic formed from the second material that is more transparent than the elastomer can be positioned.

[0045] The elastomer may be opaque.

[0046] The elastomer may be transparent or translucent.

[0047] The elastomer is preferably liquid impermeable.

[0048] The elastomer is preferably airtight.

[0049] The circuit boards may form a network comprising several individual circuit boards located at nodes of the network and connected to each other by stretchable conductor paths.

[0050] In one embodiment, the network comprises several individual circuit boards and several stretchable connecting elements, each stretchable connecting element comprising at least one conductor path, wherein the individual circuit boards are connected to the stretchable connecting elements to form a two-dimensional grid structure.

[0051] The term "subject" is to be understood in particular as a physical subject or a physical object.

[0052] The body preferably has a surface that is curved in two dimensions.The body is preferably an object or a part of an object, rather than a body or a body part of a person or animal.

[0053] In one embodiment, the substrate material of the plate may be a material that is stretchable in two dimensions. In another embodiment, the substrate material is non-stretchable.

[0054] The body is preferably deformable (soft or thermoplastic in nature).

[0055] In one embodiment, the circuit board comprises a non-conductive carrier material on which at least one conductor path is present. The conductor path is formed by an electrically conductive material applied to the carrier material.

[0056] In one embodiment, the circuit board comprises a non-conductive carrier material, which can be infiltrated by an elastomeric precursor and / or a second material forming different plastics. The carrier material preferably exists in the form of a thin flat layer, for example, in the form of a sheet or strip. A permeable carrier material is a carrier material with an opening that extends from one side of the carrier material to the other. The permeable carrier material can be a film, fabric, nonwoven, fiber mat or open-cell foam or sponge. The material can first be produced as a dense layer and then made into a permeable carrier material by perforation. For example, a film can be made into a permeable carrier material by perforation. The permeable carrier material can especially be made of paper, fabric, glass fiber, mineral fiber or non-conductive plastic.

[0057] The thickness of the carrier material of the circuit board is preferably at most 2000 μm, particularly preferably at most 500 μm, in particular at most 50 μm.

[0058] Preferably, the support material has an average pore size of at least 1 μm, particularly preferably at least 10 μm and in particular at least 100 μm.

[0059] However, the circuit board can also be non-porous.

[0060] Preferably, the circuit board has a 2 The area of ​​the printed circuit board in the plane of the body surface is preferably within a range of -100 mm². Preferably, the maximum extension (length or diameter) of the printed circuit board in the plane of the body surface is a maximum of 10 mm. Preferably, the minimum extension (width or diameter) of the printed circuit board in the plane of the body surface is at least 0.5 mm.

[0061] Preferably, the layer thickness of the elastomer is between 0.2 mm and 2 mm.

[0062] Preferably, the height of the conductor paths is between 20 μm and 500 μm.

[0063] Preferably, the width of the conductor paths is between 20 μm and 500 μm.

[0064] Preferably, the several parallel conductor paths occupy a width on the surface of the body of between 0.2 mm and 2 mm.

[0065] Preferably, the thickness of the porous body is between 1 mm and 100 mm.

[0066] In one embodiment, the elastomer covers only a portion of the body, wherein the elastomer is only present in an area of ​​the body surface adjacent to the conductor path, preferably in another area of ​​the body surface adjacent to the circuit board.

[0067] This ensures that the body surface not covered by the elastomer retains its properties. Compared to the elastomer, the body surface not covered by the elastomer can in particular provide a better hold for attaching another layer.

[0068] In one embodiment, a further layer is applied over the elastomer. For example, the further layer may be solid and bonded to the main body. The further layer may be a covering layer, in particular made of fabric or leather.

[0069] In one embodiment, the additional layers are applied while the elastomer is still liquid.

[0070] The additional layer may, for example, be solid and bonded to the main body.

[0071] The additional layer may be porous or at least have a porous surface facing the elastomer.

[0072] In one embodiment, an additional layer (in particular in the form of a porous additional layer) applied to the elastomer before the elastomer is fully cured is fixed by the fully cured elastomer. An example of this is a foam insole as a porous body, to which another layer in the form of a textile covering is typically bonded.

[0073] The present invention is illustrated by the accompanying drawings: Figure 1 A first embodiment of an exemplary object is schematically shown.

[0074] Figure 2 A second embodiment of an exemplary object is schematically shown.

[0075] Figure 3 A third embodiment of an exemplary object is schematically shown.

[0076] Figure 4 A fourth embodiment of an exemplary object is schematically shown.

[0077] Figure 5 A fourth embodiment of the exemplary object in an alternative representation is schematically shown.

[0078] Figure 6 A fifth embodiment of an exemplary object is schematically shown.

[0079] Figure 7 A sixth embodiment of an exemplary object is schematically shown.

[0080] Figure 8 An embodiment is shown in which the recess is adapted to the shape of the conductor path and the circuit board.

[0081] Figure 9 An embodiment is shown in which the elastomer covers only a portion of the surface.

[0082] Figure 10 An embodiment is shown where there is an additional layer above the elastomer.

[0083] The embodiments shown in the drawings are merely possible embodiments. It should be noted that the present invention is not limited to these specifically shown embodiments, but rather combinations of the individual embodiments with one another and with the above general description are also possible. These further possible combinations do not need to be explicitly mentioned, as they are within the skill of a person skilled in the art based on the teachings of the present invention.

[0084] In the accompanying drawings, the stretchable conductor path 4 is shown as a wound conductor, which is a preferred but not mandatory embodiment. The conductor path 4 shown extends in a winding or meandering path, such that individual segments of the conductor path 4 extend transversely to, or not parallel to, their longitudinal direction. As the length of the conductor path 4 changes, the angles of the individual segments of the conductor path 4 relative to the longitudinal direction change, but the cross-section and length of the conductor path 4 remain unchanged. This maintains the resistance of the conductor path 4 constant as the length changes.

[0085] The figures show various embodiments, all of which have in common that they comprise a porous body 1 on which are present at least one circuit board 3 and at least one conductor path 4. These circuit board 3 and conductor path 4 are present in an elastomer 2 which has been solidified by casting an elastomer precursor in the form of a first liquid material. The liquid material penetrates the pores of the body 1 to achieve a good mechanical bond.

[0086] As shown, several circuit boards 3 are preferably embedded in the elastomer 2. Conductor paths 4 connect the circuit boards 3 to one another.

[0087] Furthermore, there may be a conductor path 4 extending from the circuit board 3 to the outside of the body 1 or the elastic body 2. As shown in the figure, the conductor path 4 may also lead to the outer edge between the body 1 and the elastic body 2. There may also be an interface in the elastic body 2, for example in the form of a socket or a plug, which is contacted by the conductor path 4. In one embodiment, the object has a socket and a plug.

[0088] Central electronics (not shown) can reside in the main body 1, in the elastomer 2, or external to the main body 1. They can communicate with all ICs (integrated circuits) on the circuit board 3 via conductor paths 4. The ICs on the circuit board 3 preferably include a combination of sensors, actuators, display elements, ADCs, DACs, analog signal processing components, and microcontrollers. Together, they can perform measurement, control, and / or display functions on the circuit board 3, which are controlled or read out by the central electronics. An interface can optionally be provided on the central electronics. This interface can provide energy and / or data transmission to the central electronics. Energy and / or data transmission can be contactless, allowing the interface to be completely enclosed within the main body 1 and / or elastomer 2. This interface can be in the form of a socket to enable wired energy and / or data transmission. The central electronics can include a rechargeable battery or another energy storage device. The central electronics can optionally be inserted into a recess in the main body 1 or enclosed within the material of the main body 1. The central electronics can be integrated into the main body 1 manufactured by 3D printing during the printing process.

[0089] At least one electronic component 5 is arranged on the respective printed circuit board 3 , in particular in the form of a sensor, actuator or display element.

[0090] For simplicity, the main body 1 is shown in the figures as a flat or plate-shaped component. The main body 1 can have various shapes. The surface of the main body 1 on which the circuit board 3 and conductor paths 4 are located can also have a curved contour. The circuit board 3 can also be located at a different level of the main body 1 than the conductor paths 4. Several circuit boards 3 can also be located at different levels relative to each other. During the casting process, unevenness, curvature, or structures in the main body 1 can be compensated, resulting in a flat, smooth surface for the elastomer 2.

[0091] Elastomer 2 in Figures 1-4 The elastic body 2 is shown transparently in the drawing so that the components hidden underneath are visible in the drawing. The actual elastic body 2 can be transparent, translucent or opaque.

[0092] The differences between the various embodiments are described below.

[0093] like Figure 1 As shown, the circuit board 3 and the conductor paths 4 can be placed on a continuous surface of the main body 1 and then encapsulated by the first material used to form the elastomer 2, thereby fixing it to the main body 1. Preferably, the surface of the main body 1 where the circuit board 3 and the conductor paths 4 are located is completely covered by the elastomer 2. To this end, the main body 1 can be placed in a mold and encapsulated with the elastomer.

[0094] like Figure 1As shown, the circuit board 3 and the conductor path 4 can be present in the recess 6 of the body 1. Preferably, the recess 6 is larger in size than the circuit consisting of the circuit board 3 and the conductor path 4 present in the recess. Preferably, the circuit board 3 and the conductor path 4 are spaced all around relative to the flanks of the recess 6. In one embodiment, the flanks of the recess 6 are inclined outwards and angled towards the center of the recess 6. The flanks of the recess 6 can also have undercuts. The flanks of the recess 6 can be porous. As shown in FIG. Figure 2 As shown, the circuit board 3 and the conductor path 4 can be placed on the continuous surface of the recess 6 of the main body 1 and then encapsulated by the first material used to form the elastomer 2, thereby being fixed to the main body 1. Figure 2 In the embodiment, the elastic body 2 is confined to the area of ​​the recess 6. The surface of the elastic body 2 is preferably flush with the surface of the main body 1 surrounding the recess 6.

[0095] Figure 3 The embodiment of FIG. 1 is different in that the elastic body 2 covers the area of ​​the recess 6 and the surface of the main body 1 surrounding the recess.

[0096] exist Figure 2 and Figure 3 In the embodiment shown, the recess 6 is shown as being open on one side. However, the recess 6 can advantageously be flanked on all sides, ie completely surrounded by the surface of the body 1. In this case, the recess 6 itself can be used as a casting mold.

[0097] Figure 4-Figure 6 An encapsulation with different materials is shown, whereby this can of course also be carried out with an embodiment having a recess 6 .

[0098] At the location of at least one electronic component 5 of at least one circuit board 3, a plastic material 7 is present, which has at least one property different from that of the elastomer 2. This can be accomplished by first encapsulating the circuit board 3, for example by placing the circuit board 3, which has not yet been placed on the body 1, in a mold or by placing a mold that is open on both sides over the circuit board 3 (before or after the circuit board 3 has been placed on the body 1). This mold is then filled with a second casting compound, and after at least partial curing, the mold is removed to form the plastic material 7. Thereafter, encapsulation with the first casting compound can be performed to form the elastomer 2.

[0099] However, this can also be done by first encapsulating the elastomer 2, whereby a protective body is placed on the circuit board 3, for example, a mold open on both sides, which leaves space for the second casting material. After the elastomer 2 has at least partially cured, the protective body can be removed and the remaining space can be filled with the second casting material.

[0100] The space for the second casting compound can be smaller than the area of ​​the circuit board 3, equal to the area of ​​the circuit board 3, or larger than the area of ​​the circuit board 3. The circuit board 3 can be porous or provided with at least one opening so that the second casting compound can penetrate the circuit board 3 to connect with the underlying porous material of the body 1. Figure 4 In FIG, the elastomer 2 and the plastic material 7 are shown as transparent. Figure 5 In the embodiment shown in FIG. 2 , the elastomer 2 is opaque and the plastic material 7 is transparent. This is preferred if the electronic component 5 is an optical component.

[0101] Figure 6 This embodiment is shown in a cross-sectional view. As shown, the circuit board 3 and its electronic components 5 can be completely covered by the elastomer 2 and the plastic material 7. Figure 6 As shown, different second casting compounds can be used, so that a first plastic material 7 is present on a first circuit board 3 and a second plastic material 8 is present on another circuit board 3, and these plastic materials 7, 8 differ from each other in at least one property. In addition, it is also possible to have several different plastic materials 7, 8 on one circuit board 3, which cover different electronic components 5. The at least one property of the plastic materials 7, 8 is preferably selected according to the type of electronic component 5.

[0102] Figure 7 Furthermore, an embodiment is shown in which at least one electronic component 5 on at least one circuit board 3 is flush with the surface of the elastomer 2. For example, there may also be electrodes or another conductive contact surface on the circuit board 3 that is flush with the surface of the elastomer 2.

[0103] Figure 7 An embodiment is also shown in which at least one electronic component 5 on at least one circuit board 3 protrudes beyond the surface of the elastomer 2. For example, there may also be electrodes or another conductive contact surface on the circuit board 3 protruding beyond the surface of the elastomer 2.

[0104] The additional interface can also be arranged so that it is completely surrounded by the elastic body 2, wherein the connection pins, connection wires, sockets or plugs of the interface protrude vertically from the elastic body. The interface can also be in the form of a transmission coil on the surface of the main body 1 and covered by the elastic body 2.

[0105] Figure 7 An embodiment is also shown in which an electronic component 5 or another component present on the circuit board 3 and protruding from or flush with the surface of the elastomer 2 is designed with a widened region 9, which is covered by the elastomer 2. This allows the electronic component 5 or another component (e.g., an interface) to also be anchored in the elastomer 2. In one embodiment, the widened region 9 is porous or provided with openings and is permeable to the elastomer 2 and / or the casting compound of the plastic material 7, 8.

[0106] exist Figure 8 and Figure 9 In the embodiment, the elastomer 2 only covers a partial area of ​​the main body 1, wherein the elastomer 2 is only present in an area of ​​the surface of the main body 1 adjacent to the conductor path 4, and preferably only in another area of ​​the surface of the main body 1 adjacent to the circuit board 3.

[0107] exist Figure 8 In the embodiment of FIG, the recess 6 is shaped according to the shape of the area occupied by the conductor path 4 and the circuit board 3. Preferably, the recess 6 is narrower in the area of ​​the conductor path 4 than in the area of ​​the circuit board 3. The distance of the groove side of the recess 6 from the conductor path 4 and the circuit board 3 is preferably between 0.5 mm and 5 mm.

[0108] exist Figure 9 In the embodiment, the conductor paths 4 and the circuit board 3 are located on a continuous surface of the body 1, with only a portion of this continuous surface being covered by the elastomer 2. This can be achieved by using a mold with a closed annular wall that is open on both sides. Preferably, the surface of the elastomer 2 is shaped according to the shape of the area occupied by the conductor paths 4 and the circuit board 3. Preferably, the surface of the elastomer 2 is narrower in the area of ​​the conductor paths 4 than in the area of ​​the circuit board 3. The distance from the edge of the elastomer 2 to the conductor paths 4 and the circuit board 3 is preferably between 0.5 mm and 5 mm.

[0109] exist Figure 10 In the embodiment of the present invention, a further layer 10 is applied over the elastomer 2. For example, the further layer 10 may be solid and may be bonded to the elastomer 2 and / or the main body 1. The further layer 10 may be a covering layer, in particular, made of fabric or leather.

[0110] In one embodiment, the further layer 10 is applied while the elastomer is still liquid. The further layer 10 may be, for example, solid and may be bonded to the main body.

[0111] The further layer 10 may be porous, or at least have a porous surface facing the elastomer 2 .

[0112] Can be Figures 1 to 9 In any embodiment of the present invention, a further layer 10 is applied. However, preferably, this is in accordance with Figure 2 、 Figure 8 or Figure 9 In this case, the further layer 10 can be directly connected to the exposed area of ​​the body 1. Figure 9 In the embodiment of , the further layer 10 can have recesses in the form of areas covered by the elastomer 2 .

[0113] The further layer 10 is preferably applied in solid form. Less preferably, the further layer 10 can also be applied as a hardening casting compound.

[0114] The further layer 10 may have a recess or opening in the region where the electronic component 5 is present on the circuit board 3, or may have a different material in this region than in the remaining regions of the further layer 10. A plastic material 7, 8 different from the material of the elastomer 2 and the further layer 10 may be present in the opening of the layer 10. The plastic material 7, 8 may, for example, extend through the further layer 10 and the elastomer 2, for example by pouring a hardened material forming the plastic material 7, 8 into the corresponding openings of the elastomer 2 and the further layer 10.

Claims

1. An object comprising a body (1), wherein At least one circuit board (3) and a conductor path (4) connected to the circuit board are present on at least one surface of the body (1), characterized in that the body (1) is deformable and at least the surface of the body (1) is porous, wherein the conductor path (4) is stretchable, and wherein at least the conductor path (4) is covered by an elastomer (2), wherein the elastomer (2) extends into the pores of the surface of the body (1).

2. The object according to claim 1, characterized in that The elastomer (2) also at least partially covers the circuit board (3) or each of the several circuit boards (3).

3. The object according to claim 1 or 2, characterized in that The surface of the body (1) on which the conductor paths (4) and the at least one circuit board are located is located at the bottom of a recess (6) of the body (1), wherein the recess (6) is completely filled with the elastomer (2).

4. The object according to any one of claims 1 to 3, characterized in that The surface of the main body (1) where the conductor path (4) and the circuit board (3) are present is completely covered by the elastomer (2).

5. The object according to any one of claims 1 to 3, characterized in that The surface of the body (1) on which the conductor paths (4) and the circuit board (3) are located is only partially covered by the elastomer (2).

6. The object according to claim 5, characterized in that The elastic body (2) covers the conductor path (4) and a partial area of ​​the surface of the main body (1) adjacent to the conductor path (4).

7. The object according to any one of claims 1 to 6, characterized in that An electronic component (5) or a contact surface is present on at least one circuit board (3), wherein the surface of the electronic component (5) or the contact surface is flush with the surface of the elastomer (2).

8. The object according to any one of claims 1 to 7, characterized in that An electronic component (5) is present on at least one circuit board (3), wherein in the region of the electronic component (5), a plastic material (7, 8) different from the elastomer (2) is present instead of the elastomer (2), the plastic material extending to the surface of the elastomer (2).

9. The object according to any one of claims 1 to 8, characterized in that The conductor path (4) is present as a cable or wire having a winding, meandering or kinked course.

10. The object according to any one of claims 1 to 9, characterized in that The body (1) is stretchable and elastic.

11. A method for producing an object comprising a deformable body (1) having at least one porous surface, characterized in that In a first step, at least one circuit board (3) and a stretchable conductor path (4) connected to the circuit board are placed on the porous surface of the body (1), wherein, in a second step, at least the conductor path (4) is covered with a first material, which penetrates into the pores of the surface of the body (1) and completely covers at least the conductor path (4), In the third step, the first material is solidified to form an elastomer (2).

12. The method according to claim 11, characterized in that In the first step, several circuit boards (3) are placed on the porous surface of the body (1), the circuit boards (3) being connected to one another at least via the stretchable conductor paths (4), wherein at least one electronic component (5) is present on each circuit board (3), and wherein in the second step, the stretchable conductor paths (4) are completely covered and the circuit boards (3) are at least partially covered.

13. The method according to claim 11 or 12, characterized in that The surface of the body (1) on which the conductor paths (4) and the at least one circuit board (3) are located is located at the bottom of a recess (6) in the body (1), wherein the body (1) has originally been produced with the recess (6) or is provided with the recess (6) before the first step.

14. The method according to any one of claims 11 to 13, characterized in that In addition to covering with the first material, covering is also performed with a second material, wherein the second material occupies the area of ​​at least one electronic component (5) present on the circuit board (3), wherein the second material solidifies into a plastic material (7, 8) having different properties from the elastomer (2).

15. The method according to any one of claims 11 to 14, characterized in that The covering with the first casting compound is performed to such an extent that the surface of the elastomer (2) is flush with one or more of the following surfaces: a surface of the body (1) which is raised relative to the surface of the body (1) on which the conductor path (4) and the at least one circuit board (3) are located; a surface of the contact area which is raised on the circuit board (3); a surface of the electronic component (5) which is raised on the circuit board (3); a surface of the plastic material (7, 8) which is formed by covering with the second material in the region of the electronic component (5) on the circuit board (3).

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