An industrial vision-based testing and sorting all-in-one machine for digital-analog hybrid chips

Abstract

The application relates to the technical field of chip testing, and discloses a number-mode mixed chip testing and sorting integrated machine based on industrial vision, which comprises a cabinet body, an opening and closing door rotatably connected to the inner wall of the cabinet body, a supporting table fixedly connected to the inner wall of the cabinet body, and a face array camera fixedly connected to the inner wall of the cabinet body. The hollow pressing plate can preliminarily fix the number-mode mixed chip, can improve the number-mode mixed chip testing stability and data precision, the face array camera can measure the chip surface, can ensure the consistency of the imaging posture, can avoid the deviation of the visual angle, can improve the measurement precision of the number-mode mixed chip, can eliminate the influence of the chip position deviation, can avoid the measurement error caused by the position deviation, can preliminarily position the number-mode mixed chip, can improve the measurement efficiency of the number-mode mixed chip by the device, and can improve the sorting efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip testing, in particular to a mixed analog-digital chip testing and sorting integrated machine based on industrial vision. BACKGROUND

[0002] The traditional mixed analog-digital chip testing and sorting method mainly relies on manual detection and semi-automatic equipment. Manual detection is not only inefficient, but also difficult to meet the needs of large-scale production, and the detection results are greatly affected by the subjective factors of the operators, and are prone to miss detection, false detection and other problems. Although the semi-automatic equipment improves the detection efficiency to a certain extent, it still has defects such as insufficient detection accuracy, poor flexibility and inability to adapt to diversified chip models. Especially in the face of the complex circuit structure and performance parameters of mixed analog-digital chips, the traditional method is difficult to realize comprehensive, rapid and accurate testing and sorting.

[0003] The patent with publication number CN212160007U discloses an automatic chip testing device, which comprises a testing machine body provided with a chute in the length direction and a chip mounting seat movably connected with the chute arranged on the chute; wherein the testing machine body is provided with a feeding port and a detection port in the vertical direction to guide the chute, and an upper chip testing seat is arranged at the upper end of the detection port; wherein the chip mounting seat is connected with the push rod of the stroke cylinder, and a lower chip testing seat is arranged at the upper end of the chip mounting seat, the lower chip testing seat has a placing port for accommodating and fixing the tested chip in the circumferential direction, when the upper chip testing seat and the lower chip testing seat are closed, the upper chip testing seat is used for testing the tested chip. The patent proposes an automatic chip testing device, which aims to achieve efficient testing of chips.

[0004] However, the above-mentioned device is difficult to realize preliminary positioning of the chip before clamping the chip, which affects the subsequent chip measurement and detection efficiency, so a mixed analog-digital chip testing and sorting integrated machine based on industrial vision is proposed to solve the above-mentioned problems. SUMMARY

[0005] The present application relates to the technical field of chip testing, in particular to a mixed analog-digital chip testing and sorting integrated machine based on industrial vision.

[0006] To solve the above technical problems, the technical scheme adopted by the present application is: a digital-analog hybrid chip testing and sorting integrated machine based on industrial vision, comprising a cabinet body, an opening and closing door is rotatably connected to the inner wall of the cabinet body, a support table is fixedly connected to the inner wall of the cabinet body, a face array camera is fixedly connected to the inner wall of the cabinet body, a gas cylinder is fixedly connected to the inner wall of the cabinet body, a placing plate is fixedly connected to the inner wall of the support table, a motor is fixedly connected to the top of the support table, the output end of the gas cylinder is fixedly connected with a horizontal plate, the top of the horizontal plate is fixedly connected with a fixed block one, a pull rod is rotatably connected to the circumferential surface of the fixed block one, a round slide block is slidably connected to the inner wall of the support table, a connecting plate is fixedly connected to the circumferential surface of the round slide block, an elastic telescopic rod one is fixedly connected to the inner wall of the connecting plate, a hollow pressing plate is fixedly connected to the telescopic end of the elastic telescopic rod one, a rear connecting block one is fixedly connected to the inner wall of the connecting plate, a fixed plate is slidably connected to the inner wall of the connecting block one, a vertical plate is fixedly connected to the circumferential surface of the fixed plate, a sorting mechanism for chip sorting is arranged on the top of the support table, a protection mechanism for chip protection is arranged on the inner wall of the placing plate, the placing plate is located directly below the face array camera, and the face array camera is used for external numerical value measurement of the digital-analog hybrid chip, the pull rod is rotatably connected to the circumferential surface of the round slide block, the hollow pressing plate is in contact with the support table, and the hollow pressing plate is used for fixing the digital-analog hybrid chip, the vertical plate is in contact with the support table, and the vertical plate is used for preliminary positioning of the digital-analog hybrid chip, so that the hollow pressing plate can preliminarily fix the digital-analog hybrid chip, the stability of the digital-analog hybrid chip testing and the data accuracy can be improved, at the same time, the face array camera can measure the surface of the chip, the consistency of the imaging posture can be ensured, the deviation of the visual angle can be avoided, the measurement accuracy of the digital-analog hybrid chip can be improved, the influence of the chip position deviation can be eliminated, the measurement error caused by the position deviation can be avoided, the vertical plate can adjust the angle of the digital-analog hybrid chip through the thrust, the digital-analog hybrid chip can be preliminarily positioned, the cost of manual placement and positioning can be reduced, the measurement efficiency of the device can be improved, the unity of the measurement reference can be ensured, the position deviation can be eliminated, and the measurement efficiency of the device on the digital-analog hybrid chip can be improved.

[0007] Preferably, the sorting mechanism comprises a reciprocating wire rod, a moving block, a limiting column, a fixed block two, an elastic telescopic rod two, a groove plate, a hinged plate, a push plate, the reciprocating wire rod is fixedly connected at the output end of the motor, the moving block is movably connected at the circumference of the reciprocating wire rod, the fixed block two is fixedly connected at the top of the support table, the limiting column is fixedly connected at the inner wall of the fixed block two, the elastic telescopic rod two is fixedly connected at the inner wall of the moving block, the groove plate is fixedly connected at the telescopic end of the elastic telescopic rod two, the hinged plate is rotatably connected at the inner wall of the groove plate through a torsional spring, the push plate is fixedly connected at the inner wall of the hinged plate, the sorting mechanism further comprises a connecting column and a blocking plate, the connecting column is fixedly connected at the inner wall of the connecting plate, the blocking plate is fixedly connected at the circumference of the connecting column, and the blocking plate is used for limiting and protecting the digital-analog hybrid chip, the reciprocating wire rod is rotatably connected at the inner wall of the fixed block two, the moving block is slidably connected at the circumference of the limiting column, the groove plate is in contact with the support table, the push plate is in contact with the support table, and the push plate is used for pushing and sorting the unqualified digital-analog hybrid chip, so that the push plate is in contact with the unqualified digital-analog hybrid chip and pushes the digital-analog hybrid chip to move, the measured digital-analog hybrid chip can be automatically sorted, the use efficiency of the device is improved, the use effect of the device is increased, the manual sorting cost is reduced, when the device is started, the vibration caused by the movement of parts is avoided, the digital-analog hybrid chip is moved, the digital-analog hybrid chip is displaced, and then moves away from the measurement area, the stability of the digital-analog hybrid chip measurement can be relatively improved, the damage of the digital-analog hybrid chip is avoided, and the use safety of the device is improved.

[0008] Preferably, the protection mechanism comprises a guide plate, a hinged column, a buffer plate, a rotating column, a roller, the guide plate is fixedly connected to the inner wall of the support table, the hinged column is rotatably connected to the inner wall of the guide plate through a torsion spring, the buffer plate is fixedly connected to the circumferential surface of the hinged column, and the buffer plate is used for preliminary buffering of the digital-analog hybrid chip, the rotating column is rotatably connected to the inner wall of the placement plate, the roller is fixedly connected to the circumferential surface of the rotating column, and the roller is used to reduce the friction generated when the digital-analog hybrid chip moves, and the protection mechanism further comprises a connecting block two, a rotating column, a roller, a sticking column, a cleaning brush plate and a collection box, the connecting block two is fixedly connected to the rear of the push plate, the rotating column is rotatably connected to the inner wall of the connecting block two, the roller is fixedly connected to the circumferential surface of the rotating column, the sticking column is fixedly connected to the circumferential surface of the rotating column, and the sticking column is used to clean dust and sundries on the surface of the placement plate, the cleaning brush plate is fixedly connected to the circumferential surface of the rotating column, and the collection box is fixedly connected to the inner wall of the cabinet body, the sticking column is in contact with the support table, the roller is in contact with the support table, and the roller is used to drive the rotating column to rotate, so that the unqualified digital-analog hybrid chip can slowly fall into the collection box, ensuring that the unqualified digital-analog hybrid chip will not be damaged again when returning to the warehouse, improving the overall sorting of the device, improving the overall sorting effect of the device, improving the smoothness of the device, and the sticking column and the cleaning brush plate can adhere and clean dust and sundries on the surface of the placement plate during rotation, preventing the digital-analog hybrid chip from being damaged due to dust and sundries during voltage flow testing, improving the measurement accuracy of the device.

[0009] The technical scheme disclosed by the application can bring the following beneficial effects:

[0010] 1. The industrial vision-based digital-analog hybrid chip testing and sorting all-in-one machine, through the mutual cooperation and movement between the cabinet body, the opening and closing door, the support table, the area array camera, the air cylinder, the placement plate, the motor, the horizontal plate, the first fixed block, the pull rod, the round smooth block, the connecting plate, the first elastic telescopic rod, the hollow pressing plate, the first connecting block, the fixed plate and the vertical plate, the hollow pressing plate can preliminarily fix the digital-analog hybrid chip, the testing stability and data accuracy of the digital-analog hybrid chip can be improved, the area array camera can measure the surface of the chip, the consistency of the imaging posture can be ensured, the deviation of the viewing angle can be avoided, the measurement accuracy of the digital-analog hybrid chip can be improved, the influence of the chip position deviation can be eliminated, the measurement error caused by the position deviation can be avoided, the vertical plate can adjust the angle of the digital-analog hybrid chip through the pushing force, the digital-analog hybrid chip can be preliminarily positioned, the cost of manual placement and positioning can be reduced, the measurement efficiency of the device can be improved, the uniformity of the measurement reference can be ensured, the position deviation can be eliminated, and the measurement efficiency of the device on the digital-analog hybrid chip can be improved.

[0011] 2. The industrial vision-based digital-analog hybrid chip testing and sorting integrated machine, through the mutual cooperation and movement between the reciprocating screw rod, the moving block, the limiting column, the fixed block two, the elastic telescopic rod two, the groove plate, the hinged plate, the push plate, the connecting column and the blocking plate, the push plate contacts the unqualified digital-analog hybrid chip and pushes the digital-analog hybrid chip to move, so that the digital-analog hybrid chip after measurement can be automatically sorted, the use efficiency of the device is improved, the use effect of the device is increased, the manual sorting cost is reduced, when the device is started, the vibration caused by the movement of the parts is avoided, the digital-analog hybrid chip is moved, the displacement of the digital-analog hybrid chip is caused, and the digital-analog hybrid chip is further away from the measurement area, the stability of the digital-analog hybrid chip measurement can be relatively improved, the damage of the digital-analog hybrid chip is avoided, and the use safety of the device is improved.

[0012] 3. The industrial vision-based digital-analog hybrid chip testing and sorting integrated machine, through the mutual cooperation and movement between the guide plate, the hinged column, the buffer plate, the rotating column, the roller, the connecting block two, the rotating column, the roller, the adhesion column, the cleaning brush plate and the collecting box, the unqualified digital-analog hybrid chip can slowly fall into the collecting box, the unqualified digital-analog hybrid chip is ensured not to be damaged again when returning to the warehouse, the overall sorting of the device is improved, the overall sorting effect of the device is improved, the smoothness of the device is improved, the dust and impurities on the surface of the placement plate can be adhered and cleaned during the rotation of the adhesion column and the cleaning brush plate, the damage of the digital-analog hybrid chip caused by dust and impurities during the voltage flow test of the digital-analog hybrid chip can be prevented, the measurement accuracy of the device can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is a whole structure schematic view of the application;

[0014] Figure 2 It is a cabinet structure half-section view of the application;

[0015] Figure 3 It is a support table structure schematic view of the application;

[0016] Figure 4 It is a Figure 3 structure enlarged view of A in the application;

[0017] Figure 5 It is a sorting mechanism schematic view of the application;

[0018] Figure 6 It is a Figure 5 structure enlarged view of B in the application;

[0019] Figure 7 It is a protection mechanism schematic view of the application;

[0020] Figure 8 It is aFigure 7 Enlarged view of structure at C;

[0021] Figure 9 For the invention Figure 7 Enlarged view of structure at D.

[0022] In the figure: 1, cabinet; 2, open-close door; 3, support table; 4, area array camera; 5, air cylinder; 6, placement plate; 7, sorting mechanism; 8, protection mechanism; 9, motor; 10, cross plate; 11, fixed block one; 12, pull rod; 13, round smooth block; 14, connecting plate; 15, elastic telescopic rod one; 16, hollow pressing plate; 17, connecting block one; 18, fixed plate; 19, vertical plate; 701, reciprocating screw rod; 702, moving block; 703, limiting column; 704, fixed block two; 705, elastic telescopic rod two; 706, groove plate; 707, hinged plate; 708, push plate; 709, connecting column; 710, blocking plate; 801, guide plate; 802, hinged column; 803, buffer plate; 804, rotating column; 805, roller; 806, connecting block two; 807, rotating column; 808, roller; 809, adhesion column; 810, cleaning brush plate; 811, collection box. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0024] Please refer to Figures 1-9 An embodiment of the present application is: an industrial vision-based number-mode mixed chip test and sorting all-in-one machine, comprising a cabinet 1, an open-close door 2 is rotatably connected to the inner wall of the cabinet 1, a support table 3 is fixedly connected to the inner wall of the cabinet 1, an area array camera 4 is fixedly connected to the inner wall of the cabinet 1, an air cylinder 5 is fixedly connected to the inner wall of the cabinet 1, a placement plate 6 is fixedly connected to the inner wall of the support table 3, a motor 9 is fixedly connected to the top of the support table 3, a cross plate 10 is fixedly connected to the output end of the air cylinder 5, a fixed block one 11 is fixedly connected to the top of the cross plate 10, a pull rod 12 is rotatably connected to the circumferential surface of the fixed block one 11, a round smooth block 13 is slidably connected to the inner wall of the support table 3, a connecting plate 14 is fixedly connected to the circumferential surface of the round smooth block 13, an elastic telescopic rod one 15 is fixedly connected to the inner wall of the connecting plate 14, a hollow pressing plate 16 is fixedly connected to the telescopic end of the elastic telescopic rod one 15, a connecting block one 17 is fixedly connected to the inner wall of the connecting plate 14, a fixed plate 18 is slidably connected to the inner wall of the connecting block one 17, a vertical plate 19 is fixedly connected to the circumferential surface of the fixed plate 18;

[0025] When the device starts, the operator first opens the door 2, and then places the D / A mixed chip to be measured on the top of the placement plate 6. At this time, the air cylinder 5 starts to work, and the output end of the air cylinder 5 drives the horizontal plate 10 to move downward. During the downward movement of the horizontal plate 10, the horizontal plate 10 drives the fixed block one 11 to move downward, and the downward movement of the fixed block one 11 drives the pull rod 12 to move, and at the same time, the pull rod 12 adjusts its angle during the movement. The pull rod 12 drives the smooth block 13 to move horizontally on the inner wall of the support table 3 during the movement of the pull rod 12. The movement of the smooth block 13 drives the connecting plate 14 to move. The connecting plate 14 gradually approaches the D / A mixed chip. The movement of the connecting plate 14 drives the elastic extension rod one 15 to move. The movement of the elastic extension rod one 15 drives the hollow pressing plate 16 to move. When the hollow pressing plate 16 moves a distance, the hollow pressing plate 16 moves downward due to the slope of the support table 3 and the reset characteristics of the elastic extension rod one 15. After the hollow pressing plate 16 moves a distance downward through the slope of the support table 3, the hollow pressing plate 16 at this time contacts the top of the D / A mixed chip. At this time, the hollow pressing plate 16 can preliminarily fix the D / A mixed chip, improve the test stability and data accuracy of the D / A mixed chip, and the face array camera 4 can measure the surface of the chip to ensure the consistency of the imaging posture, avoid the deviation of the viewing angle, improve the measurement accuracy of the D / A mixed chip, eliminate the influence of the chip position deviation, and avoid the measurement error caused by the position deviation.

[0026] The top of the support table 3 is provided with a sorting mechanism 7 for chip sorting, and the inner wall of the placement plate 6 is provided with a protection mechanism 8 for chip protection. The placement plate 6 is located directly below the face array camera 4, and the face array camera 4 is used for external value measurement of the D / A mixed chip. The pull rod 12 is rotationally connected to the circumferential surface of the smooth block 13. The hollow pressing plate 16 contacts the support table 3, and the hollow pressing plate 16 is used for fixing the D / A mixed chip. The vertical plate 19 contacts the support table 3, and the vertical plate 19 is used for preliminarily positioning the D / A mixed chip.

[0027] When the device starts, the movement of the connecting plate 14 drives the connecting block one 17 to move. The movement of the connecting block one 17 drives the fixed plate 18 to move. The movement of the fixed plate 18 drives the vertical plate 19 to move. After the vertical plate 19 moves a distance, the vertical plate 19 contacts the D / A mixed chip. At this time, the vertical plate 19 continues to move through the movement of the fixed plate 18. During the movement of the vertical plate 19, the vertical plate 19 adjusts the angle of the D / A mixed chip through the pushing force, preliminarily positions the D / A mixed chip, reduces the cost of manual placement and positioning, improves the measurement efficiency of the device, ensures the unity of the measurement reference, eliminates the position deviation, and improves the measurement efficiency of the device on the D / A mixed chip.

[0028] The overall working principle is: after the hollow pressing plate 16 moves downward by a distance through the inclined surface of the support table 3, the hollow pressing plate 16 at this time is in contact with the top of the digital-analog hybrid chip, the hollow pressing plate 16 at this time can preliminarily fix the digital-analog hybrid chip, can improve the test stability and data accuracy of the digital-analog hybrid chip, at the same time, the area array camera 4 can measure the chip surface, can ensure the consistency of the imaging posture, avoid the deviation of the visual angle, can improve the measurement accuracy of the digital-analog hybrid chip, eliminate the influence of the chip position deviation, can avoid the measurement error caused by the position deviation, in the moving process of the vertical plate 19, the vertical plate 19 will adjust the angle of the digital-analog hybrid chip through the thrust, can preliminarily position the digital-analog hybrid chip, reduce the cost of manual placement and positioning, improve the measurement efficiency of the device, ensure the unity of the measurement reference, eliminate the position deviation, improve the measurement efficiency of the device on the digital-analog hybrid chip.

[0029] Please refer to Figures 1-9 On the basis of the above embodiment, in another embodiment of the present application, the sorting mechanism 7 comprises a reciprocating wire rod 701, a moving block 702, a limiting column 703, a fixed block two 704, an elastic telescopic rod two 705, a slot plate 706, a hinged plate 707, and a push plate 708. The reciprocating wire rod 701 is fixedly connected to the output end of the motor 9. The moving block 702 is movably connected to the circumferential surface of the reciprocating wire rod 701. The fixed block two 704 is fixedly connected to the top of the support table 3. The limiting column 703 is fixedly connected to the inner wall of the fixed block two 704. The elastic telescopic rod two 705 is fixedly connected to the inner wall of the moving block 702. The slot plate 706 is fixedly connected to the telescopic end of the elastic telescopic rod two 705. The hinged plate 707 is rotatably connected to the inner wall of the slot plate 706 through a torsional spring. The push plate 708 is fixedly connected to the inner wall of the hinged plate 707.

[0030] When the measurement of the digital-analog hybrid chip is completed, the measurement data is unqualified, and the hollow pressing plate 16 has been released from fixing the digital-analog hybrid chip. At this time, the motor 9 will start, and the output end of the motor 9 will drive the reciprocating screw rod 701 to rotate. The rotation of the reciprocating screw rod 701 will drive the moving block 702 to rotate. However, the moving block 702 is limited by the limiting column 703 at this time. The limiting column 703 will cause the moving block 702 to move horizontally through the reciprocating groove on the surface of the reciprocating screw rod 701 during the rotation of the reciprocating screw rod 701. During the movement of the moving block 702, the moving block 702 will drive the elastic expansion rod two 705 to move. The movement of the elastic expansion rod two 705 will drive the groove plate 706 to move. The movement of the groove plate 706 will drive the hinged plate 707 to move. During the movement of the hinged plate 707, the hinged plate 707 will drive the push plate 708 to move. When the groove plate 706 moves a distance, the groove plate 706 will move downward a distance during the horizontal movement due to the slope of the support table 3 and the reset characteristics of the elastic expansion rod two 705. At this time, the groove plate 706 itself will contact the placing plate 6. At this time, the movement of the groove plate 706 will drive the hinged plate 707 to move. The movement of the hinged plate 707 will drive the push plate 708 to move. After the push plate 708 moves a distance, it will also contact the placing plate 6. At this time, the push plate 708 will continue to move. After the push plate 708 moves a distance, the push plate 708 will contact the unqualified digital-analog hybrid chip and push the digital-analog hybrid chip to move. This can automatically sort the measured digital-analog hybrid chip, improve the use efficiency of the device, increase the use effect of the device, and reduce the sorting cost of manual work.

[0031] The sorting mechanism 7 further comprises a connecting column 709 and a blocking plate 710. The connecting column 709 is fixedly connected to the inner wall of the connecting plate 14. The blocking plate 710 is fixedly connected to the circumferential surface of the connecting column 709 and is used for limiting and protecting the digital-analog hybrid chip. The reciprocating screw rod 701 is rotatably connected to the inner wall of the fixed block two 704. The moving block 702 is slidably connected to the circumferential surface of the limiting column 703. The groove plate 706 contacts the support table 3. The push plate 708 contacts the support table 3 and is used for pushing and sorting the unqualified digital-analog hybrid chip.

[0032] When the device starts, the movement of the round smooth block 13 drives the movement of the connecting plate 14, and the connecting plate 14 drives the movement of the connecting column 709 in the movement. In the process of movement, the connecting column 709 drives the movement of the blocking plate 710, and at this time the blocking plate 710 moves synchronously with the connecting plate 14. After a distance, the blocking plate 710 isolates the opening in the front of the support table 3 from the digital-analog hybrid chip placed on the top of the placement plate 6, so that the vibration caused by the movement of parts when the device starts does not move the digital-analog hybrid chip, so that the digital-analog hybrid chip is displaced, and then moves away from the measurement area, which can relatively improve the stability of the digital-analog hybrid chip measurement, avoid damage to the digital-analog hybrid chip, and improve the use safety of the device;

[0033] The protection mechanism 8 comprises a guide plate 801, a hinged column 802, a buffer plate 803, a rotating column 804 and a roller 805. The guide plate 801 is fixedly connected to the inner wall of the support table 3. The hinged column 802 is rotatably connected to the inner wall of the guide plate 801 through a torsion spring. The buffer plate 803 is fixedly connected to the circumferential surface of the hinged column 802 and is used for preliminarily buffering the digital-analog hybrid chip. The rotating column 804 is rotatably connected to the inner wall of the placement plate 6. The roller 805 is fixedly connected to the circumferential surface of the rotating column 804 and is used for reducing the frictional force generated by the digital-analog hybrid chip during movement;

[0034] When the push plate 708 pushes the unqualified digital-analog hybrid chip to move a distance, the digital-analog hybrid chip will contact the roller 805. After the digital-analog hybrid chip passes through a plurality of rollers 805, the digital-analog hybrid chip can preliminarily slide down through the inclined surface of the guide plate 801. In the process of sliding down of the digital-analog hybrid chip, the digital-analog hybrid chip will contact the buffer plate 803. At this time, the buffer plate 803 can buffer and guide the digital-analog hybrid chip, so that the unqualified digital-analog hybrid chip slowly falls into the collection box 811, ensuring that the unqualified digital-analog hybrid chip will not be damaged again when returning to the warehouse, improving the overall sorting of the device, improving the overall sorting effect of the device, and improving the smoothness of the device;

[0035] The protection mechanism 8 further comprises a connecting block two 806, a rotating column 807, a roller 808, a sticky column 809, a cleaning brush plate 810 and a collection box 811. The connecting block two 806 is fixedly connected to the rear of the push plate 708. The rotating column 807 is rotatably connected to the inner wall of the connecting block two 806. The roller 808 is fixedly connected to the circumferential surface of the rotating column 807. The sticky column 809 is fixedly connected to the circumferential surface of the rotating column 807 and is used for cleaning dust and sundries on the surface of the placement plate 6. The cleaning brush plate 810 is fixedly connected to the circumferential surface of the rotating column 807. The collection box 811 is fixedly connected to the inner wall of the cabinet 1. The sticky column 809 is in contact with the support table 3. The roller 808 is in contact with the support table 3 and is used for driving the rotating column 807 to rotate.

[0036] When the push plate 708 moves, the movement of the push plate 708 drives the connecting block two 806 to move. The movement of the connecting block two 806 drives the rotating column 807 to move. The rotating column 807 drives the roller 808 to move in the process of movement. At this time, the roller 808 rotates first in the process of movement due to the friction generated by the contact with the support table 3. The rotation of the roller 808 drives the rotating column 807 to rotate. The rotation of the rotating column 807 drives the sticky column 809 to rotate. The rotation of the rotating column 807 also drives the cleaning brush plate 810 to rotate. In the process of rotation, the sticky column 809 and the cleaning brush plate 810 can adhere and clean the dust and sundries on the surface of the placement plate 6. This can prevent the adverse effects caused by dust and sundries when the digital-analog hybrid chip is tested under voltage and current, which can prevent the damage of the digital-analog hybrid chip and improve the measurement accuracy of the device.

[0037] Whole working principle: The movement of the hinged plate 707 drives the push plate 708 to move, and the push plate 708 also contacts the placing plate 6 after moving a distance, at this time, the push plate 708 continues to move, and the push plate 708 contacts the unqualified digital-analog hybrid chip after moving a distance, and pushes the digital-analog hybrid chip to move, so that the measured digital-analog hybrid chip can be automatically sorted, the use efficiency of the device is improved, the use effect of the device is increased, the manual sorting cost is reduced, the blocking plate 710 isolates the opening in the front of the supporting table 3 from the digital-analog hybrid chip placed on the top of the placing plate 6, so that the vibration caused by the movement of the parts when the device starts does not cause the digital-analog hybrid chip to move and cause the digital-analog hybrid chip to displace and further move away from the measurement area, the stability of the digital-analog hybrid chip measurement can be relatively improved, the damage of the digital-analog hybrid chip is avoided, the use safety of the device is improved, the buffer plate 803 can buffer and guide the digital-analog hybrid chip, so that the unqualified digital-analog hybrid chip slowly falls into the collection box 811, so that the unqualified digital-analog hybrid chip does not cause secondary damage when returning to the warehouse, the sorting comprehensiveness of the device is improved, the overall sorting effect of the device is improved, the smoothness of the device is improved, the rotation of the rotating column 807 drives the adhesion column 809 to rotate, and the rotation of the rotating column 807 also drives the cleaning brush plate 810 to rotate, the adhesion column 809 and the cleaning brush plate 810 can adhere and clean the dust and sundries on the surface of the placing plate 6 in the rotating process, so that the dust and sundries do not cause adverse effects on the digital-analog hybrid chip when testing the voltage flow, so that the damage of the digital-analog hybrid chip is avoided, and the measurement accuracy of the device is improved.

[0038] The application provides an industrial vision-based digital-analog hybrid chip testing and sorting all-in-one machine. There are many methods and ways to achieve the technical scheme, and the above description is only the preferred embodiment of the application. It should be noted that those skilled in the art can make some improvements and refinements without departing from the principles of the application, and these improvements and refinements should also be considered as the protection scope of the application. The components not explicitly described in the embodiment can be realized by using existing technology.

Claims

1. An integrated testing and sorting machine for mixed-signal chips based on industrial vision, comprising a cabinet (1), characterized in that: The inner wall of the cabinet (1) is rotatably connected to an opening and closing door (2). The inner wall of the cabinet (1) is fixedly connected to a support platform (3). The inner wall of the cabinet (1) is fixedly connected to a surface array camera (4). The inner wall of the cabinet (1) is fixedly connected to a cylinder (5). The inner wall of the support platform (3) is fixedly connected to a placement plate (6). The top of the support platform (3) is fixedly connected to a motor (9). The output end of the cylinder (5) is fixedly connected to a horizontal plate (10). The top of the horizontal plate (10) is fixedly connected to a fixing block (11). The circumferential surface of the fixing block (11) rotates... A pull rod (12) is dynamically connected. A circular slider (13) is slidably connected to the inner wall of the support platform (3). A connecting plate (14) is fixedly connected to the circumferential surface of the circular slider (13). An elastic telescopic rod (15) is fixedly connected to the inner wall of the connecting plate (14). A hollow pressure plate (16) is fixedly connected to the telescopic end of the elastic telescopic rod (15). A connecting block (17) is fixedly connected to the inner wall of the connecting plate (14). A fixing plate (18) is slidably connected to the inner wall of the connecting block (17). A vertical plate (19) is fixedly connected to the circumferential surface of the fixing plate (18).

2. The integrated testing and sorting machine for mixed-signal chips based on industrial vision according to claim 1, characterized in that: The top of the support platform (3) is provided with a sorting mechanism (7) for chip sorting, and the inner wall of the placement plate (6) is provided with a protective mechanism (8) for chip protection. The placement plate (6) is located directly below the area scan camera (4), and the area scan camera (4) is used to perform appearance numerical measurement on the mixed-signal chip.

3. The integrated testing and sorting machine for mixed-signal chips based on industrial vision according to claim 2, characterized in that: The pull rod (12) is rotatably connected to the circumferential surface of the circular slider (13), the hollow pressure plate (16) is in contact with the support platform (3), and the hollow pressure plate (16) is used to fix the digital-analog mixed chip. The vertical plate (19) is in contact with the support platform (3), and the vertical plate (19) is used to perform preliminary positioning of the digital-analog mixed chip.

4. The integrated testing and sorting machine for mixed-signal chips based on industrial vision according to claim 3, characterized in that: The sorting mechanism (7) includes a reciprocating screw (701), a moving block (702), a limiting post (703), a second fixed block (704), a second elastic telescopic rod (705), a slotted plate (706), a hinged plate (707), and a push plate (708). The reciprocating screw (701) is fixedly connected to the output end of the motor (9). The moving block (702) is movably connected to the circumferential surface of the reciprocating screw (701). The second fixed block (704) is fixedly connected to the output end of the motor (9). The limiting post (703) is fixedly connected to the inner wall of the fixed block two (704) attached to the top of the support platform (3), the elastic telescopic rod two (705) is fixedly connected to the inner wall of the moving block (702), the groove plate (706) is fixedly connected to the telescopic end of the elastic telescopic rod two (705), the hinge plate (707) is rotatably connected to the inner wall of the groove plate (706) by a torsion spring, and the push plate (708) is fixedly connected to the inner wall of the hinge plate (707).

5. The integrated testing and sorting machine for mixed-signal chips based on industrial vision according to claim 4, characterized in that: The sorting mechanism (7) further includes a connecting column (709) and a baffle plate (710). The connecting column (709) is fixedly connected to the inner wall of the connecting plate (14), and the baffle plate (710) is fixedly connected to the circumferential surface of the connecting column (709). The baffle plate (710) is used to limit and protect the mixed-signal chip.

6. The integrated testing and sorting machine for mixed-signal chips based on industrial vision according to claim 5, characterized in that: The reciprocating lead screw (701) is rotatably connected to the inner wall of the fixed block (704), the moving block (702) is slidably connected to the circumferential surface of the limiting post (703), the slot plate (706) is in contact with the support platform (3), the push plate (708) is in contact with the support platform (3), and the push plate (708) is used to push and sort unqualified digital-analog mixed chips.

7. The integrated testing and sorting machine for mixed-signal chips based on industrial vision according to claim 6, characterized in that: The protective mechanism (8) includes a guide plate (801), a hinge column (802), a buffer plate (803), a rotating column (804), and a roller (805). The guide plate (801) is fixedly connected to the inner wall of the support platform (3). The hinge column (802) is rotatably connected to the inner wall of the guide plate (801) by a torsion spring. The buffer plate (803) is fixedly connected to the circumferential surface of the hinge column (802) and is used to provide initial buffering for the mixed-signal chip. The rotating column (804) is rotatably connected to the inner wall of the placement plate (6). The roller (805) is fixedly connected to the circumferential surface of the rotating column (804) and is used to reduce the friction generated when the mixed-signal chip moves.

8. The integrated testing and sorting machine for mixed-signal chips based on industrial vision according to claim 7, characterized in that: The protective mechanism (8) also includes a connecting block two (806), a rotating column (807), a roller (808), an adhesive column (809), a cleaning brush plate (810), and a collection box (811). The connecting block two (806) is fixedly connected to the rear of the push plate (708). The rotating column (807) is rotatably connected to the inner wall of the connecting block two (806). The roller (808) is fixedly connected to the circumferential surface of the rotating column (807). The adhesive column (809) is fixedly connected to the circumferential surface of the rotating column (807). The adhesive column (809) is used to clean dust and debris from the surface of the placement plate (6). The cleaning brush plate (810) is fixedly connected to the circumferential surface of the rotating column (807). The collection box (811) is fixedly connected to the inner wall of the cabinet (1).

9. A mixed-signal chip testing and sorting integrated machine based on industrial vision as described in claim 8, characterized in that: The adhesive column (809) is in contact with the support platform (3), the roller (808) is in contact with the support platform (3), and the roller (808) is used to drive the rotating column (807) to rotate.

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