A planar finishing system suitable for large workpieces

Abstract

A planar finishing system suitable for large-sized workpieces belongs to the technical field of ultra-precision planar machining equipment. This invention solves the problems of deformation and secondary deformation during the processing and detection processes of existing surface finishing equipment for large-sized and heavy workpieces, resulting in low processing efficiency and difficulty in guaranteeing processing accuracy. The system includes a control center and, respectively, a primary platform, a secondary platform, a primary leveling assembly, a secondary leveling assembly, a processing device, a clamping assembly, a laser interferometer, and two sets of laser reflection assemblies, all signal-connected to the control center. The two sets of laser reflection assemblies are orthogonally arranged horizontally, and each set includes a laser, a laser reflector, and a photosensitive position sensor. This invention is used for the planar finishing of large-sized workpieces.

Description

Technical Field

[0001] This invention relates to a planar finishing system suitable for large-sized workpieces, belonging to the technical field of ultra-precision planar machining equipment. Background Technology

[0002] Traditional surface finishing of large and heavy workpieces such as grinding plates usually involves precision grinding and polishing followed by surface finishing, which presents three significant technical bottlenecks:

[0003] Firstly, large-mass, large-size workpieces are prone to asymmetric deformation under free gravity, which leads to deviation of the surface shape from the design tolerance.

[0004] Secondly, the off-site contact detection introduces secondary deformation error and lacks real-time closed-loop monitoring methods, making it impossible to immediately correct the reference surface offset caused by dynamic disturbances such as temperature deformation and stress release.

[0005] Third, traditional processing techniques rely more on manual experience to adjust processing parameters, which is time-consuming and makes it difficult to guarantee surface accuracy.

[0006] Therefore, there is an urgent need for a new planar finishing system to better achieve the finishing of the surface shape of large and heavy workpieces. Summary of the Invention

[0007] The present invention aims to solve the above-mentioned technical problems and provide a planar finishing system suitable for large-sized workpieces.

[0008] The technical solution adopted by the present invention to solve the above-mentioned technical problems is as follows:

[0009] A planar finishing system suitable for large-sized workpieces includes a control center and a primary platform, a secondary platform, a primary leveling assembly, a secondary leveling assembly, a processing device, a clamping assembly, a laser interferometer, and two sets of laser reflection assemblies, all signal-connected to the control center.

[0010] The primary platform is horizontally arranged on the primary leveling assembly, and the secondary platform is horizontally arranged on the primary platform via the secondary leveling assembly. The primary and secondary leveling assemblies are arranged orthogonally in the horizontal direction. A first tilt measuring instrument is installed on the primary platform, and a second tilt measuring instrument is installed on the secondary platform.

[0011] The clamping components are evenly distributed circumferentially on the outside of the workpiece to be processed, and the workpiece is fixed to the secondary platform by the clamping components.

[0012] The laser interferometer is mounted on the secondary platform via a support assembly, and the laser interferometer is positioned above the workpiece to be processed.

[0013] The machining device is mounted on a secondary platform via a three-axis linkage assembly, and the machining device is positioned above the workpiece to be processed.

[0014] Each tilt meter, support assembly, and three-axis linkage assembly is connected to the control center via signals.

[0015] Two sets of laser reflection components are orthogonally arranged in the horizontal direction. Each set of laser reflection components includes a laser, a laser reflector and a photosensitive position sensor. The two lasers are respectively installed on the secondary platforms on the adjacent sides of the workpiece to be processed. The two photosensitive position sensors are respectively installed above the two lasers. The two laser reflectors are vertically installed on the top of the processing device and are orthogonally arranged in the horizontal direction.

[0016] Furthermore, the processing device includes a cutting tool and an angle adjustment assembly, wherein the angle adjustment assembly is installed between the cutting tool and the end of the three-axis linkage assembly.

[0017] Furthermore, the angle adjustment assembly includes a first fixed plate, a second fixed plate, and a plurality of first piezoelectric ceramics fixed between the two fixed plates and arranged in a circular array, with the cutter fixed at the bottom end of the second fixed plate.

[0018] Furthermore, the primary leveling component includes a plurality of primary leveling mechanisms evenly distributed in the circumference, and each primary leveling mechanism includes a second piezoelectric ceramic.

[0019] Furthermore, each primary leveling mechanism is equipped with a vibration isolator at its bottom.

[0020] Furthermore, each primary leveling mechanism has a corresponding support leg fixed between its top end and the bottom end of the primary platform.

[0021] Furthermore, the secondary leveling component includes multiple secondary leveling mechanisms evenly distributed in the circumference, and each secondary leveling mechanism includes a third piezoelectric ceramic.

[0022] Furthermore, a two-dimensional moving platform is provided at the bottom of each laser.

[0023] Furthermore, the two-dimensional mobile platform includes a first support plate, a second support plate, and multiple lifting mechanisms fixed between the first support plate and the second support plate. The laser is fixed on the first support plate, and the second support plate is fixed on the secondary platform.

[0024] Furthermore, the support assembly includes a base, a support frame, and a mounting base. The base is fixedly mounted parallel to a secondary platform on one side of the workpiece to be processed. The bottom end of the support frame is slidably connected to the base in the horizontal direction, and the support frame is vertically adjustable. The mounting base is circumferentially rotatably mounted on the top of the support frame, and the rotation axis of the mounting base is horizontally arranged. The laser interferometer is fixedly mounted on the mounting base.

[0025] Compared with the prior art, the present invention has the following advantages:

[0026] In this invention, by evenly distributing the clamping components circumferentially on the outside of the workpiece to be processed, asymmetrical deformation of large-sized workpieces under free gravity is avoided, thereby effectively preventing the surface shape from deviating from the design tolerance. The clamping components can be any structure in the prior art capable of clamping the workpiece to be processed, and their specific structure will not be described in detail here.

[0027] The planar finishing system of the present invention can detect the surface shape while processing, and can adjust the processing process in real time according to the surface shape. Compared with the existing off-site contact detection method, it effectively avoids the introduction of secondary deformation error, realizes real-time closed-loop monitoring, and can immediately correct the reference surface offset caused by dynamic interference such as temperature deformation and stress release.

[0028] The planar finishing system of the present invention no longer relies on manual experience to adjust the processing parameters, which effectively improves the processing efficiency and greatly improves the surface accuracy.

[0029] The control center receives data from two tilt measuring instruments in real time, and then controls two leveling components to adjust the horizontal accuracy and tilt angle of the two-stage platform in real time. By setting up a laser interferometer, the surface shape error is monitored in real time during the fine finishing of large-size workpieces, and the monitored surface shape error data is transmitted to the control center in real time, so that the tilt angle of the processing device can be adjusted in real time by the control center. The position of the laser interferometer can also be controlled by the support components. Attached Figure Description

[0030] Figure 1 This is a first three-dimensional structural schematic diagram of a planar finishing system suitable for large-sized workpieces according to the present invention;

[0031] Figure 2 This is a second three-dimensional structural schematic diagram of a planar finishing system for large-sized workpieces according to the present invention;

[0032] Figure 3 This is a schematic diagram of a third-dimensional structure of a planar finishing system for large-sized workpieces according to the present invention.

[0033] Figure 4 This is a front view schematic diagram of a planar finishing system suitable for large-sized workpieces according to the present invention;

[0034] Figure 5 This is a three-dimensional structural diagram of a three-axis linkage assembly;

[0035] Figure 6 This is a three-dimensional structural diagram of the processing device;

[0036] Figure 7 This is a schematic diagram of the connection structure between the laser and the two-dimensional moving platform.

[0037] Figure 8 for Figure 7 Side view diagram (not to scale);

[0038] Figure 9 A schematic diagram of the working principle of a laser reflector (view from top).

[0039] Figure 10 This is a schematic diagram of the working principle of the laser reflection component (side view, where the dashed line represents the position change of the laser beam reflected onto the photosensitive position sensor when the laser reflector deflects).

[0040] In the picture:

[0041] 1. Primary platform; 2. Secondary platform; 3. Primary leveling mechanism; 4. Secondary leveling mechanism; 5. Machining device; 51. Cutting tool; 52. First fixed plate; 53. Second fixed plate; 54. First piezoelectric ceramic; 6. Clamping assembly; 7. Laser interferometer; 8. Laser; 9. Laser reflector; 10. Photosensitive position sensor; 11. First tilt measuring instrument; 12. Second tilt measuring instrument; 13. Support assembly; 131. Base; 132. Support frame; 133. Mounting seat; 14. Three-axis linkage assembly; 141. First support seat; 142. Second support seat; 143. First telescopic rod; 144. Second telescopic rod; 15. Vibration isolator; 16. Outrigger; 17. Two-dimensional moving platform; 171. First support plate; 172. Second support plate; 173. Lifting mechanism; 18. Wedge block; 100. Workpiece to be processed. Detailed Implementation

[0042] Specific implementation method one: Combining Figures 1-10 This description of embodiments provides a clear and complete description of the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0043] It should be noted that the descriptions of "front," "rear," "left," "right," "inner," "outer," "left side," "right side," "upper part," "lower part," "top," and "bottom" in this invention are defined based on the orientation or positional relationships shown in the accompanying drawings. They are merely for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the described structure must be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0044] In the description of this invention, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0045] A planar finishing system suitable for large-sized workpieces includes a control center and a primary platform 1, a secondary platform 2, a primary leveling assembly, a secondary leveling assembly, a processing device 5, a clamping assembly 6, a laser interferometer 7, and two sets of laser reflection assemblies, all signal-connected to the control center.

[0046] The primary platform 1 is horizontally arranged on the primary leveling assembly, and the secondary platform 2 is horizontally arranged on the primary platform 1 via the secondary leveling assembly. The primary and secondary leveling assemblies are arranged orthogonally in the horizontal direction. A first tilt measuring instrument 11 is installed on the primary platform 1, and a second tilt measuring instrument 12 is installed on the secondary platform 2.

[0047] The clamping components 6 are evenly distributed around the outer side of the workpiece 100 to be processed, and the workpiece 100 is fixed on the secondary platform 2 by the clamping components 6.

[0048] The laser interferometer 7 is mounted on the secondary platform 2 via the support assembly 13, and the laser interferometer 7 is positioned above the workpiece 100 to be processed.

[0049] The machining device 5 is mounted on the secondary platform 2 via a three-axis linkage assembly 14, and the machining device 5 is positioned above the workpiece 100 to be processed.

[0050] Each tilt meter, support assembly 13, and three-axis linkage assembly 14 is connected to the control center via signal transmission.

[0051] Two sets of laser reflection components are orthogonally arranged in the horizontal direction. Each set of laser reflection components includes a laser 8, a laser reflector 9, and a photosensitive position sensor 10. The two lasers 8 are respectively installed on the secondary platform 2 on the adjacent sides of the workpiece 100 to be processed. The two photosensitive position sensors 10 are respectively installed above the two lasers 8. The two laser reflectors 9 are both vertically installed on the top of the processing device 5, and the two laser reflectors 9 are orthogonally arranged in the horizontal direction.

[0052] The planar finishing system of this invention is suitable for nanoscale planar machining of large-size, high-density workpieces such as cast iron plates and semiconductor wafers. This technology can be extended to fields such as optical component coating and precision measuring tools.

[0053] The planar finishing system of the present invention has a two-stage leveling system. The first tilt measuring instrument 11 and the second tilt measuring instrument 12 monitor the level of the first-stage platform 1 and the second-stage platform 2 in real time, and transmit the monitoring data to the control center in real time. The level of the first-stage platform 1 is controlled by the first-stage leveling component, and the level of the second-stage platform 2 is controlled by adding a second-stage leveling component as a supplementary leveling mechanism. The second-stage leveling component is arranged orthogonally to the first-stage leveling component in the horizontal direction, which can effectively improve the overall leveling accuracy of the machining system.

[0054] A photosensitive position sensor, or PSD, is a mature detector, and its specific structure and working principle will not be elaborated here.

[0055] Two lasers 8 form two orthogonal laser beams, which are transmitted to two photosensitive position sensors 10 via two orthogonal reflectors. If the reflector angle shifts, the position of the laser beam hitting the photosensitive position sensor 10 will change. The laser reflection components can monitor the reflector angle in real time, thereby monitoring the deflection angle of the processing device 5 and facilitating real-time adjustment of the device's pose during processing. The orthogonal arrangement of the two laser reflection components enables more precise monitoring.

[0056] The machining device 5 is mounted on the secondary platform 2 via a three-axis linkage assembly 14, enabling precise displacement control in the X, Y, and Z directions. The three-axis linkage assembly 14 includes a first support base 141, a second support base 142, a horizontally arranged first telescopic rod 143, and multiple vertically arranged second telescopic rods 144. The machining device 5 is mounted at the end of the first telescopic rod 143. The multiple second telescopic rods 144 are vertically fixed between the first support base 141 and the second support base 142. The second support base 142 is fixedly connected to the secondary platform 2. The Z-direction displacement adjustment of the first support base 141 is achieved through the multiple second telescopic rods 144, thereby achieving Z-direction displacement adjustment of the machining device 5. The first end of the first telescopic rod 143 is slidably connected to the first support base 141 along the X direction, thereby achieving X-direction displacement adjustment of the machining device 5. The Y-direction displacement adjustment of the machining device 5 is achieved through the extension and retraction of the first telescopic rod 143.

[0057] In this invention, by evenly distributing the clamping components 6 circumferentially on the outer side of the workpiece 100 to be processed, asymmetrical deformation of large-sized workpieces under free gravity is avoided, thereby effectively preventing the surface shape from deviating from the design tolerance. The clamping components 6 can be any structure in the prior art that can clamp the workpiece 100 to be processed, and its specific structure will not be described in detail here.

[0058] The planar finishing system of the present invention can detect the surface shape while processing, and can adjust the processing process in real time according to the surface shape. Compared with the existing off-site contact detection method, it effectively avoids the introduction of secondary deformation error, realizes real-time closed-loop monitoring, and can immediately correct the reference surface offset caused by dynamic interference such as temperature deformation and stress release.

[0059] The planar finishing system of the present invention no longer relies on manual experience to adjust the processing parameters, which effectively improves the processing efficiency and greatly improves the surface accuracy.

[0060] The control center receives data from two tilt measuring instruments in real time, and then controls two leveling components to adjust the horizontal accuracy and tilt angle of the two-stage platform in real time. By setting up a laser interferometer 7, the surface shape error is monitored in real time during the fine finishing of large-size workpieces, and the monitored surface shape error data is transmitted to the control center in real time. The control center then adjusts the tilt angle of the processing device 5 in real time. The position of the laser interferometer 7 can also be controlled by the support component 13.

[0061] The processing device 5 includes a cutting tool 51 and an angle adjustment assembly, wherein the angle adjustment assembly is installed between the cutting tool 51 and the end of the three-axis linkage assembly 14. This design allows for the adjustment of the angle of the cutting tool 51. The angle adjustment assembly is signal-connected to the control center, enabling real-time adjustment of the cutting tool 51's angle. The cutting tool 51 is a small, high-hardness flat tool used for finishing the deformed surface to be processed; this is existing technology and will not be described further here. A reflector is installed on top of the angle adjustment assembly.

[0062] The angle adjustment assembly includes a first fixed plate 52, a second fixed plate 53, and a plurality of first piezoelectric ceramics 54 fixed between the two fixed plates in a circular array. The cutting tool 51 is fixed to the bottom end of the second fixed plate 53. This design integrates a circular piezoelectric ceramic array into the angle adjustment assembly, achieving nanometer-level displacement compensation through the inverse piezoelectric effect, significantly improving the angle adjustment accuracy and stability of the cutting tool 51. Each first piezoelectric ceramic 54 is equipped with a first displacement sensor, which monitors the displacement changes of the first piezoelectric ceramic 54 in real time. A first pressure sensor is also provided between the second fixed plate 53 and the cutting tool 51, which monitors the pressure exerted on the cutting tool 51 during processing in real time. The preferred number of first piezoelectric ceramics is eight.

[0063] The primary leveling assembly includes multiple circumferentially distributed primary leveling mechanisms 3, each of which includes a second piezoelectric ceramic. In this design, the primary leveling mechanism 3 also includes a second displacement sensor and a second piezoelectric ceramic. The second displacement sensor is mounted on the second piezoelectric ceramic, and the second pressure sensor is positioned between the second piezoelectric ceramic and the primary platform 1. The second displacement sensor monitors the displacement change of the second piezoelectric ceramic in real time, and the second pressure sensor monitors the pressure exerted on the second piezoelectric ceramic during processing in real time.

[0064] Each primary leveling mechanism 3 is equipped with a vibration isolator 15 at its bottom. This design effectively reduces the impact of table vibration on machining accuracy by using vibration isolators 15.

[0065] Each primary leveling mechanism 3 has a corresponding support leg 16 fixed between its top end and the bottom end of the primary platform 1. This design provides support for the primary platform 1 by using the support legs 16.

[0066] The secondary leveling assembly includes multiple circumferentially distributed secondary leveling mechanisms 4, each of which includes a third piezoelectric ceramic. In this design, the secondary leveling mechanism 4 also includes a third displacement sensor and a third pressure sensor, wherein the third displacement sensor is disposed on the third piezoelectric ceramic, and the third pressure sensor is disposed between the third piezoelectric ceramic and the secondary platform 2.

[0067] Each laser 8 has a two-dimensional moving platform 17 at its bottom. This design allows for position adjustment of the laser 8 via the two-dimensional moving platform 17, thereby adjusting the laser emission angle. The two-dimensional moving platform 17 is connected to the control center for real-time displacement adjustment of the laser 8. A wedge 18 is installed at the bottom of the laser 8, causing it to be mounted at an angle on the secondary platform 2, so that the laser beam, after being reflected by a mirror, can hit the photosensitive position sensor 10.

[0068] The two-dimensional mobile platform 17 includes a first support plate 171, a second support plate 172, and multiple lifting mechanisms 173 fixed between the first support plate 171 and the second support plate 172. The laser 8 is fixed on the first support plate 171, and the second support plate 172 is fixed on the secondary platform 2. This design allows for height adjustment of the laser 8 and the photosensitive position sensor 10 mounted above it through the lifting adjustment of the multiple lifting mechanisms 173. The lifting mechanism 173 can be any mechanism capable of lifting adjustment in the prior art, such as a piezoelectric ceramic column, a telescopic cylinder, etc.

[0069] The support assembly 13 includes a base 131, a support frame 132, and a mounting base 133. The base 131 is fixedly mounted parallel to the secondary platform 2 on one side of the workpiece 100. The bottom end of the support frame 132 is slidably connected to the base 131 in the horizontal direction, and the support frame 132 is vertically adjustable. The mounting base 133 is rotatably mounted on the top of the support frame 132, and the axis of rotation of the mounting base 133 is horizontally arranged. The laser interferometer 7 is fixedly mounted on the mounting base 133. This design allows for a wide range of deflection angle adjustment of the laser interferometer 7 within the space above the workpiece 100 via the mounting base 133. The support frame 132 allows for height adjustment of the laser interferometer 7, and the sliding connection between the support frame 132 and the base 131 allows for lateral position adjustment of the laser interferometer 7 above the workpiece 100. The sliding connection between the support frame 132 and the base 131 can be achieved by setting a self-locking slide rail on the base 131, allowing the support frame 132 to be locked at any position on the base 131.

[0070] Working principle:

[0071] The workpiece 100 to be processed is clamped onto the secondary platform 2 by the clamping assembly 6. The level of the primary platform 1 and the secondary platform 2 is monitored in real time by the first tilt measuring instrument 11 and the second tilt measuring instrument 12. The primary platform 1 and the secondary platform 2 are adjusted in real time by the primary leveling assembly and the secondary leveling assembly to keep them level.

[0072] The laser interferometer 7 monitors the surface shape of the workpiece 100 in real time and feeds the monitoring data back to the control center. The control center determines the machining plan (i.e., the tool angle and feed rate) based on the surface shape of the workpiece 100 and sends the machining plan to the three-axis linkage assembly 14. After determining the machining plan, the angle adjustment assembly controls the angle of the tool 51. The laser 8 hits the reflector and reflects the laser beam onto the photosensitive position sensor 10, detecting the reflector's deflection angle (which can be determined according to the law of reflection and trigonometric functions). This allows for real-time monitoring of the tool 51's pose, and the monitoring data is fed back to the control center. The control center adjusts the tool 51's pose in real time based on the surface shape monitored by the laser interferometer 7. The workpiece is then machined using the three-axis linkage assembly 14. Alternatively, the angle adjustment assembly can be used to move the tool 51 within a small range and monitor its pose (i.e., the tool 51's trajectory) in real time to correct the surface shape.

[0073] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A planar finishing system suitable for large-sized workpieces, characterized in that: This includes a control center and a primary platform (1), a secondary platform (2), a primary leveling assembly, a secondary leveling assembly, a processing device (5), a clamping assembly (6), a laser interferometer (7), and two sets of laser reflection assemblies, all of which are connected to the control center via signals. The first-level platform (1) is horizontally arranged on the first-level leveling component, and the second-level platform (2) is horizontally arranged on the first-level platform (1) through the second-level leveling component. The first-level leveling component and the second-level leveling component are arranged orthogonally in the horizontal direction. The first-level platform (1) is equipped with a first tilt measuring instrument (11), and the second-level platform (2) is equipped with a second tilt measuring instrument (12). The clamping components (6) are evenly distributed around the outside of the workpiece (100) to be processed, and the workpiece (100) to be processed is fixed on the secondary platform (2) by the clamping components (6). The laser interferometer (7) is mounted on the secondary platform (2) via a support assembly (13), and the laser interferometer (7) is positioned above the workpiece (100) to be processed. The machining device (5) is mounted on the secondary platform (2) via a three-axis linkage assembly (14), and the machining device (5) is located above the workpiece (100) to be processed. Each tilt meter, support assembly (13), and three-axis linkage assembly (14) is connected to the control center via signal transmission. Two sets of laser reflection components are orthogonally arranged in the horizontal direction. Each set of laser reflection components includes a laser (8), a laser reflector (9), and a photosensitive position sensor (10). The two lasers (8) are respectively installed on the secondary platform (2) on the adjacent sides of the workpiece (100) to be processed. The two photosensitive position sensors (10) are respectively installed above the two lasers (8). The two laser reflectors (9) are both vertically installed on the top of the processing device (5), and the two laser reflectors (9) are orthogonally arranged in the horizontal direction.

2. The planar finishing system for large-size workpieces according to claim 1, characterized in that: The processing device (5) includes a cutting tool (51) and an angle adjustment assembly, wherein the angle adjustment assembly is installed between the cutting tool (51) and the end of the three-axis linkage assembly (14).

3. The planar finishing system for large-size workpieces according to claim 2, characterized in that: The angle adjustment assembly includes a first fixed plate (52), a second fixed plate (53), and a plurality of first piezoelectric ceramics (54) fixed between the two fixed plates and arranged in a ring array. The cutter (51) is fixed at the bottom end of the second fixed plate (53).

4. The planar finishing system for large-size workpieces according to claim 1, characterized in that: The primary leveling assembly includes multiple primary leveling mechanisms (3) evenly distributed in the circumference, and each primary leveling mechanism (3) includes a second piezoelectric ceramic.

5. A planar finishing system suitable for large-size workpieces according to claim 4, characterized in that: Each primary leveling mechanism (3) is equipped with a vibration isolator (15) at its bottom.

6. A planar finishing system suitable for large-size workpieces according to claim 4 or 5, characterized in that: Each primary leveling mechanism (3) has a corresponding support leg (16) fixed between its top end and the bottom end of the primary platform (1).

7. A planar finishing system suitable for large-size workpieces according to claim 1, characterized in that: The secondary leveling assembly includes multiple secondary leveling mechanisms (4) evenly distributed in the circumference, and each secondary leveling mechanism (4) includes a third piezoelectric ceramic.

8. A planar finishing system suitable for large-size workpieces according to claim 1, characterized in that: Each laser (8) has a two-dimensional moving platform (17) at its bottom.

9. A planar finishing system suitable for large-size workpieces according to claim 8, characterized in that: The two-dimensional mobile platform (17) includes a first support plate (171), a second support plate (172), and a plurality of lifting mechanisms (173) fixed between the first support plate (171) and the second support plate (172). The laser (8) is fixed on the first support plate (171), and the second support plate (172) is fixed on the secondary platform (2).

10. A planar finishing system suitable for large-size workpieces according to claim 1, characterized in that: The support assembly (13) includes a base (131), a support frame (132), and a mounting seat (133). The base (131) is fixedly mounted on the secondary platform (2) on one side of the workpiece (100) to be processed. The bottom end of the support frame (132) is slidably connected to the base (131) in the horizontal direction and the support frame (132) is vertically adjustable. The mounting seat (133) is circumferentially rotatably mounted on the top of the support frame (132) and the rotation axis of the mounting seat (133) is horizontally arranged. The laser interferometer (7) is fixedly mounted on the mounting seat (133).

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