Aluminum-plastic blister packaging machine

Abstract

The invention discloses an aluminum-plastic blister packaging machine, which belongs to the field of aluminum-plastic blister packaging and comprises a supporting assembly, a forming mechanism is mounted on the upper surface of the supporting assembly, a sealing mechanism is mounted on one side of the upper surface of the supporting assembly, and a collecting mechanism is mounted on one side of the supporting assembly. The sealing mechanism comprises a mounting plate mounted on one side of the upper surface of the supporting assembly; through cooperative use of all the devices, the silica gel box deforms when force is applied through the electric push rod, so that the silica gel box compensates scratches on the upper mold, after the interior of the silica gel box is covered with magnetorheological fluid, the first electromagnet is powered on, the magnetorheological fluid is controlled, the magnetorheological fluid is converted into a high-viscosity and low-fluidity similar solid, and therefore the magnetorheological fluid is prevented from being scratched. The silica gel box is kept flat, so that deformation of the upper mold is compensated, and the situation that scratches or generated deformation on the upper mold affect heat sealing of the aluminum-plastic bubble cap, pressure loss is caused, and sealing failure of the aluminum-plastic bubble cap is caused is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of aluminum-plastic blister packaging, in particular to an aluminum-plastic blister packaging machine. Background Art

[0002] The aluminum-plastic blister packaging machine is a packaging device that uses roll-type or plate-type forming and roller-sealing technology. It is mainly used for sealing and packaging medicines (such as capsules and tablets) and snacks (such as chocolate beans). The machine has a compact structure and a high degree of automation. It has continuous operation functions such as forming, filling, heat sealing, and batch numbering. Its technical features include PLC control, variable frequency speed regulation, fluorine coating and uniform heating, which can improve the crispness of the blister and packaging efficiency. The mainstream model is suitable for industrial production and laboratory scenarios, and complies with GMP standards. It is suitable for the packaging of solid pharmaceuticals such as capsules, flat tablets, and sugar-coated tablets.

[0003] The aluminum-plastic blister packaging machine is specially designed and produced for small pharmaceutical factories, health care product factories, food factories, hospital preparation rooms, etc. The aluminum-plastic blister packaging machine is mainly used for packaging solid medicines such as capsules, tablets, pills, suppositories, etc.

[0004] Upon investigation, a Chinese invention patent discloses an aluminum-plastic blister packaging machine (publication number: CN115158807B). The machine comprises a packaging machine body, on which is mounted an adjustable punch head. The adjustable punch head comprises a fixed rod, a sleeve layer, and a rack. The first end of the fixed rod is fixedly connected to the sleeve layer. The sleeve layer comprises a first sleeve layer and a second sleeve layer, which are slidably connected to each other. The sleeve layer drives the two sides of the adjustable punch head to contract. By mounting the adjustable punch head on the stamping die, the present invention enables the diameter of the adjustable punch head to change with the die, thereby adapting to different die diameters and increasing the stamping range.

[0005] Although the above patent adjusts the punch head and other structures, and the diameter of the adjusting punch head can be changed with the change of the mold through the adjusting punch head installed on the punching mold to adapt to different mold diameters, and the fixed layer of the sliding connection on the outside of the adjusting head can be changed with the change of the adjusting punch head to make the surface of the adjusting punch head smooth, but during the use of the aluminum-plastic blister packaging machine, when the heat sealing mold is used for a long time, the surface of the upper mold may be scratched or deformed, resulting in a lack of local pressure on the heat sealing mold, causing the heat sealing mold to reduce the packaging effect when packaging the medicine. The above technology cannot compensate for the scratches or deformation on the surface of the upper mold in use, thereby affecting the packaging effect of the medicine, resulting in failure of the sealed packaging of the medicine, and increasing the defective rate of the aluminum-plastic blister packaging machine for medicine packaging.

[0006] Therefore, the present invention provides an aluminum-plastic blister packaging machine to solve the above problems. Summary of the Invention

[0007] The present invention provides an aluminum-plastic blister packaging machine, aiming to solve the problems raised in the background technology.

[0008] To achieve the above-mentioned object, the present invention provides the following technical solution: an aluminum-plastic blister packaging machine, comprising a support assembly, a forming mechanism mounted on the upper surface of the support assembly, a sealing mechanism mounted on one side of the upper surface of the support assembly, and a collecting mechanism mounted on one side of the support assembly;

[0009] The sealing mechanism includes a mounting plate installed on one side of the upper surface of the support assembly, an upper mold is provided above the mounting plate, an electric heater is provided inside the upper mold, the surface of the upper mold is fixedly connected to a silicone box by bolts, both sides of the silicone box are fixedly connected to a first electromagnet in a path array, both sides of the upper mold are fixedly connected to a hollow box with magnetorheological fluid inside, one side of the hollow box is fixedly connected to a second electromagnet corresponding to the magnetorheological fluid, the lower surface of the hollow box is fixedly connected to a connecting pipe connected to the silicone box in a path array, and one side of the upper surface of the hollow box is fixedly connected to a feeding pipe corresponding to the first electromagnet.

[0010] As a preferred technical solution of the present application, the sealing mechanism also includes a lower mold fixedly connected to the upper surface of the mounting plate and corresponding to the upper mold, both sides of the lower mold are fixedly connected with a connecting plate, and each two corresponding sides of the connecting plates are commonly fixedly connected with a support plate, the upper surfaces of the connecting plate and the support plate are fixedly connected with nozzles in a path array, and the lower surface of the lower mold is installed with an adjustment mechanism corresponding to the nozzle.

[0011] As a preferred technical solution of the present application, the adjustment mechanism includes a three-way pipe that is commonly fixedly connected to the lower surface of several connecting plates and connected to the connecting plates. One end of the three-way pipe is fixedly connected to a card tube, and the surface of the card tube is fixedly connected to an adjustment pipe connected to the card tube. Solenoid valves are installed on the surfaces of the card tube and the adjustment pipe.

[0012] As a preferred technical solution of the present application, the regulating mechanism also includes two air pumps fixedly connected to the clamping tube and one end of the regulating tube respectively, the input end of the air pump is fixedly connected to the air collecting box, the interiors of the two air collecting boxes are commonly fixedly connected to a Peltier semiconductor refrigeration module, the hot end and the cold end of the Peltier semiconductor refrigeration module are respectively plugged into the interior of the corresponding air collecting box, and the surface of the air collecting box is provided with air inlet grooves in the form of a path array.

[0013] As a preferred technical solution of the present application, the sealing mechanism also includes a support frame fixedly connected to the upper surface of the mounting plate, the surface of the support frame is fixedly connected to an electric push rod, the output end of the electric push rod is fixedly connected to a moving block, the four corners of the lower surface of the moving block are fixedly connected to buffer springs fixedly connected to the upper mold, the upper surface of the upper mold is fixedly connected to a pressure sensor in a path array, and one side of the upper mold is fixedly connected to a temperature sensor in a path array.

[0014] As a preferred technical solution of the present application, the support assembly includes a support frame installed in a path array, wherein the upper surface of one of the support frames is fixedly connected to a supporting plate in a path array, the four corners of the lower surface of the support frame are fixedly connected to moving wheels, the mounting plate is fixedly connected to the surface of the corresponding supporting plate, and the middle part of the upper surface of the support frame is fixedly connected to a feeding device.

[0015] As a preferred technical solution of the present application, the collection mechanism includes a collection box fixedly connected to one side of the upper surface of the corresponding support frame, the upper surface of the collection box is affixed with an operating panel, the upper surface of the operating panel is fixedly connected to a cutting device, and one side of the cutting device is fixedly connected to a cleaning plate with a fan installed in a path array on the surface, and the cleaning plate corresponds to the lower mold.

[0016] As a preferred technical solution of the present application, the forming mechanism includes a heating box fixedly connected to one side of the upper surface of the corresponding support frame by bolts, the inner top wall of the heating box is fixedly connected to the electric heating plate by bolts, the interior of the heating box is rotatably connected to a conveyor belt corresponding to the electric heating plate, one side of the conveyor belt is installed with an existing driving device, and the middle part of the upper surface of the support frame is fixedly connected to a positive pressure pneumatic forming device corresponding to the heating box, and the positive pressure pneumatic forming device corresponds to the lower mold.

[0017] As a preferred technical solution of the present application, the forming mechanism also includes a fixed plate fixedly connected to the other side of the upper surface of the corresponding support frame by bolts, and a horizontal plate for installing a cooling fan is fixedly connected to the inside of the fixed plate. The fixed plate and the initial state of the mold of the positive pressure pneumatic forming equipment are on the same horizontal line, and the other support frame corresponds to the load-bearing plate.

[0018] As a preferred technical solution of the present application, the forming mechanism also includes a clamping plate fixedly connected to an edge of the upper surface of the corresponding support frame, one side of the clamping plate is fixedly connected to a mounting roller, the surface of the mounting roller is sleeved with an aluminum foil assembly, the surface of the clamping plate is fixedly connected to support rollers corresponding to the aluminum foil assembly in a path array, one side of one of the supporting plates is fixedly connected to a winding roller corresponding to the aluminum foil assembly, and the aluminum foil assembly corresponds to the upper mold and the lower mold.

[0019] The advantages of the present invention are as follows: after the aluminum-plastic blister is formed through the mutual cooperation of the sealing mechanism and the collecting mechanism and other structures, the medicine is placed in the corresponding blister, the aluminum-plastic blister is driven to move by the conveyor belt and moved to just below the upper mold, the aluminum foil and the aluminum-plastic blister are heat-sealed based on the mutual cooperation of the aluminum foil assembly and the sealing mechanism, and the packaged aluminum-plastic blister is cut and cleaned through the mutual cooperation of the fan and the cutting device, which not only avoids the adhesion of cut debris to the aluminum-plastic blister and causes damage to the aluminum-plastic blister, but also divides the aluminum-plastic blister into small portions, which is convenient for subsequent further packaging of the aluminum-plastic blister and the medicine, and the cut aluminum-plastic blister is collected by the collecting box, which is convenient for subsequent staff to sort the aluminum-plastic blisters;

[0020] Based on the setting of the sealing mechanism, when the upper mold is in the process of heat-sealing the aluminum-plastic blister, the setting of the silicone box causes the silicone box to deform when force is applied by the electric push rod, so that the silicone box compensates for the scratches on the upper mold, and when the upper mold is deformed during use, the second electromagnet is powered off, so that the second electromagnet no longer generates magnetic force, so that the magnetorheological fluid inside the hollow box flows and enters the silicone box through the connecting pipe. When the magnetorheological fluid covers the inside of the silicone box, the first electromagnet is energized to generate magnetic force, which controls the magnetorheological fluid and converts it into a high-viscosity, low-fluidity solid-like substance to support the silicone box, so that the silicone box remains flat, thereby compensating for the deformation of the upper mold, thereby preventing the scratches or deformation on the upper mold from affecting the heat sealing of the aluminum-plastic blister, resulting in pressure loss, which in turn causes the aluminum-plastic blister to fail to seal, affecting the packaging of the medicine;

[0021] Based on the arrangement of the adjustment mechanism and other structures, when the upper mold heat-seals the aluminum-plastic blister, the air pump is started, so that the air pump sends the hot air generated by the operation of the various components inside the support frame and the heat generated by the hot end of the Peltier semiconductor refrigeration mold into the interior of the connecting plate through the clamping tube and the three-way pipe, and sprays it on the lower surface and both sides of the aluminum-plastic blister through the air nozzle. This can not only clean the surface of the aluminum-plastic blister, but also preheat the aluminum-plastic blister, thereby reducing the power used by the electric heater inside the upper mold. After the aluminum-plastic blister is heat-sealed, the air nozzle sprays on both sides of the aluminum-plastic blister to detect whether air has entered the interior of the aluminum-plastic blister, thereby detecting the heat-sealing effect of the aluminum-plastic blister.

[0022] Based on the mutual cooperation of structures such as the Peltier semiconductor refrigeration module, after the heat sealing of the aluminum-plastic blister is completed, the corresponding solenoid valve is started and stopped, so that the cold air generated by the cold end of the Peltier semiconductor refrigeration mold enters the interior of the interconnecting plate through the regulating tube and the three-way pipe, and finally the cold air is sprayed on the surface of the heat-sealed aluminum-plastic blister through the nozzle, accelerating the cooling speed of the aluminum-plastic blister, thereby avoiding heat retention on the aluminum-plastic blister due to slow temperature reduction, which affects the heat sealing of the aluminum-plastic blister. In addition, through the mutual cooperation of hot and cold air, pressure sensors, temperature sensors and the electric heater in the upper mold, a "closed-loop control system" is adopted to monitor the heat sealing status in real time, and the PLC is combined to automatically adjust the heating power and electric push rod pressure to ensure parameter stability, further ensuring the heat sealing effect of the aluminum-plastic blister. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of an aluminum-plastic blister packaging machine;

[0024] Figure 2 This is a schematic diagram of the structure of an aluminum-plastic blister packaging machine from a second perspective;

[0025] Figure 3 This is a structural diagram of a support assembly and sealing mechanism in an aluminum-plastic blister packaging machine;

[0026] Figure 4 This is a structural diagram of a sealing mechanism in an aluminum-plastic blister packaging machine;

[0027] Figure 5 This is a structural diagram of an upper mold and a moving block in an aluminum-plastic blister packaging machine;

[0028] Figure 6 This is a structural diagram of the lower mold and adjustment mechanism of an aluminum-plastic blister packaging machine;

[0029] Figure 7 This is a schematic diagram of the structure of an adjustment mechanism in an aluminum-plastic blister packaging machine;

[0030] Figure 8 This is a schematic diagram of the structure of a collecting mechanism in an aluminum-plastic blister packaging machine;

[0031] Figure 9 The figure is a structural diagram of the forming mechanism in an aluminum-plastic blister packaging machine.

[0032] In the figure: 1, support assembly; 101, support frame; 102, load-bearing plate; 103, feeding equipment;

[0033] 2. Forming mechanism; 201. Heating box; 202. Electric heating plate; 203. Conveyor belt; 204. Positive pressure air forming device; 205. Fixing plate; 206. Horizontal plate; 207. Clamping plate; 208. Mounting roller; 209. Aluminum foil assembly; 210. Support roller; 211. Winding roller;

[0034] 3. Sealing mechanism; 301. Mounting plate; 302. Upper mold; 303. Silicone box; 304. First electromagnet; 305. Hollow box; 306. Connecting pipe; 307. Lower mold; 308. Connecting plate; 309. Support plate; 310. Injection nozzle; 311. Support frame; 312. Electric push rod; 313. Moving block; 314. Buffer spring; 315. Pressure sensor; 316. Temperature sensor; 317. Second electromagnet;

[0035] 4. Collection mechanism; 401. Collection box; 402. Operation panel; 403. Cutting device; 404. Cleaning panel;

[0036] 5. Adjustment mechanism; 501. Three-way pipe; 502. Clamping pipe; 503. Adjustment pipe; 504. Solenoid valve; 505. Air pump; 506. Gas collecting box; 507. Peltier semiconductor refrigeration module. DETAILED DESCRIPTION

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0038] The present invention provides an aluminum-plastic blister packaging machine, referring to Figures 1-9 As shown, three embodiments are provided:

[0039] Example 1:

[0040] The aluminum-plastic blister packaging machine includes a support assembly 1, a forming mechanism 2 is installed on the upper surface of the support assembly 1, a sealing mechanism 3 is installed on one side of the upper surface of the support assembly 1, and a collecting mechanism 4 is installed on one side of the support assembly 1;

[0041] The sealing mechanism 3 includes a mounting plate 301 mounted on one side of the upper surface of the support assembly 1, an upper mold 302 is provided above the mounting plate 301, an electric heater is provided inside the upper mold 302, a silicone box 303 is fixedly connected to the surface of the upper mold 302 by bolts, both sides of the silicone box 303 are fixedly connected to the first electromagnet 304 in a path array, both sides of the upper mold 302 are fixedly connected to a hollow box 305 with magnetorheological fluid inside, one side of the hollow box 305 is fixedly connected to a second electromagnet 317 corresponding to the magnetorheological fluid, the lower surface of the hollow box 305 is fixedly connected to a connecting pipe 306 connected to the silicone box 303 in a path array, and one side of the upper surface of the hollow box 305 is fixedly connected to a feeding pipe corresponding to the first electromagnet 304;

[0042] The mounting plate 301 is used to support the support frame 311 and the upper mold 302;

[0043] The electric heater is used to heat the upper mold 302 to achieve heat sealing of the upper mold 302 to the aluminum foil;

[0044] Among them, the silicone box 303 is used to compensate for the scratches on the upper mold 302;

[0045] The first electromagnet 304 and the second electromagnet 317 are used to control the magnetorheological fluid;

[0046] Among them, the hollow box 305 is used to collect the magnetorheological fluid;

[0047] Wherein, the connecting pipe 306 is used to transport magnetorheological fluid;

[0048] Specifically, when scratches are generated on the surface of the upper mold 302, based on the material of the silicone box 303, when the electric push rod 312 applies a pushing force to the silicone box 303, the silicone box 303 is deformed to compensate for the scratches;

[0049] When the upper mold 302 is deformed, the power supply to the second electromagnet 317 is disconnected, so that the second electromagnet 317 no longer generates magnetic force, thereby no longer controlling the magnetorheological fluid, so that the magnetorheological fluid is converted into a flowable liquid and transported to the interior of the silicone box 303 through the connecting pipe 306. When the magnetorheological fluid completely covers the interior of the silicone box 303, the first electromagnet 304 is powered, so that the first electromagnet 304 generates magnetic force, so that the magnetorheological fluid inside the silicone box 303 is converted into a high-viscosity, low-fluidity solid-like substance, supporting the silicone box 303 so that the silicone box 303 remains flat, thereby compensating for the deformation of the upper mold 302. When the upper mold 302 heat-seals the aluminum-plastic blister, the position of the upper mold 302 where pressure may be lost is compensated, thereby avoiding a reduction in the heat sealing effect and affecting the sealed packaging of the medicine.

[0050] The sealing mechanism 3 further includes a support frame 311 fixedly connected to the upper surface of the mounting plate 301. An electric push rod 312 is fixedly connected to the surface of the support frame 311. The output end of the electric push rod 312 is fixedly connected to a moving block 313. The four corners of the lower surface of the moving block 313 are fixedly connected to buffer springs 314 fixedly connected to the upper mold 302. The upper surface of the upper mold 302 is fixedly connected to a pressure sensor 315 in a path array. A temperature sensor 316 is fixedly connected to one side of the upper mold 302 in a path array.

[0051] The support frame 311 is used to support the electric push rod 312 and the moving block 313;

[0052] Among them, the electric push rod 312 is used to drive the upper mold 302 to heat-seal the aluminum-plastic blister;

[0053] The moving block 313 and the buffer spring 314 are used to buffer the impact force of the electric push rod 312;

[0054] The pressure sensor 315 is used to monitor the pressure applied by the electric push rod 312 in real time;

[0055] The temperature sensor 316 is used to monitor the temperature of the upper mold 302 during the heat sealing process in real time;

[0056] Specifically, after the scratches or deformation are compensated, the electric push rod 312 is started, so that its output end drives the moving block 313 to move, so that the moving block 313 and the buffer spring 314 push the upper mold 302 to move, and the aluminum-plastic blister is heat-sealed. Through the cooperation of the pressure sensor 315, the temperature sensor 316 and the electric heater in the upper mold 302, a "closed-loop control system" is used to monitor the heat sealing status in real time. In combination with the PLC, the heating power and the pressure of the electric push rod 312 are automatically adjusted to ensure parameter stability, thereby further ensuring the heat sealing effect of the aluminum-plastic blister.

[0057] The sealing mechanism 3 further includes a lower mold 307 fixedly connected to the upper surface of the mounting plate 301 and corresponding to the upper mold 302. A connecting plate 308 is fixedly connected to both sides of the lower mold 307. A support plate 309 is fixedly connected to both sides of each two corresponding connecting plates 308. Air nozzles 310 are fixedly connected to the upper surfaces of the connecting plates 308 and the support plates 309 in a path array. An adjustment mechanism 5 corresponding to the air nozzles 310 is mounted on the lower surface of the lower mold 307.

[0058] Among them, the lower mold 307 is used to support the aluminum-plastic blister;

[0059] Among them, the connecting plate 308 is used to disperse the gas injected by the regulating mechanism 5;

[0060] The nozzle 310 is used to disperse and spray the gas around the aluminum-plastic bubble cover;

[0061] Specifically, when the upper mold 302 heat-seals the aluminum-plastic blister, the lower mold 307 supports the aluminum-plastic blister to prevent the aluminum-plastic blister from moving due to the downward pressure of the upper mold 302 and affecting the heat-sealing effect of the aluminum-plastic blister.

[0062] Embodiment 2, based on embodiment 1, further, the support assembly 1 includes support frames 101 installed in a path array, wherein the upper surface of one of the support frames 101 is fixedly connected to a carrier plate 102 in a path array, the four corners of the lower surface of the support frame 101 are fixedly connected to moving wheels, the mounting plate 301 is fixedly connected to the surface of the corresponding carrier plate 102, and the middle part of the upper surface of the support frame 101 is fixedly connected to the feeding device 103;

[0063] Among them, the support frame 101 is used to support each component;

[0064] The supporting plate 102 is used to support the sealing mechanism 3 and the collecting mechanism 4;

[0065] Among them, the feeding device 103 is used to place the medicine inside the formed aluminum-plastic blister;

[0066] The regulating mechanism 5 includes a three-way pipe 501 fixedly connected to the lower surface of the plurality of interconnecting plates 308 and communicating with the interconnecting plates 308. One end of the three-way pipe 501 is fixedly connected to a clamping pipe 502. The surface of the clamping pipe 502 is fixedly connected to a regulating pipe 503 that is in communication with the clamping pipe 502. Solenoid valves 504 are installed on the surfaces of the clamping pipe 502 and the regulating pipe 503.

[0067] The tee pipe 501 is used to divert the gas entering the tee pipe 501;

[0068] Among them, the card pipe 502 is used to transport hot air;

[0069] Among them, the regulating tube 503 is used to transport cold air;

[0070] The solenoid valve 504 is used to control the opening and closing of the card tube 502 and the regulating tube 503;

[0071] The regulating mechanism 5 also includes two air pumps 505 respectively fixedly connected to the clamping tube 502 and one end of the regulating tube 503. The input end of the air pump 505 is fixedly connected to the air collecting box 506. The interiors of the two air collecting boxes 506 are commonly fixedly connected to a Peltier semiconductor refrigeration module 507. The hot end and the cold end of the Peltier semiconductor refrigeration module 507 are respectively plugged into the interiors of the corresponding air collecting boxes 506. The surface of the air collecting box 506 is provided with air inlet grooves in the form of a path array.

[0072] The air pump 505 is used to transport the gas;

[0073] The gas collecting box 506 is used to guide the gas into the gas pump 505;

[0074] The Peltier semiconductor refrigeration module 507 is used to cool and heat the gas;

[0075] The air inlet slot is used to replenish the gas inside the gas collecting box 506;

[0076] Specifically, during the heat-sealing process of the aluminum-plastic blister, the hot end of the Peltier semiconductor refrigeration module 507 heats the gas inside the corresponding gas collecting box 506, and activates the corresponding solenoid valve 504, so that the heated hot gas and the hot gas generated during the use of each component are transported to the inside of the clamping tube 502, so that the gas enters the inside of the tee pipe 501, thereby allowing the hot gas to enter the inside of the connecting plate 308 and be sprayed onto the lower surface and both sides of the aluminum-plastic blister through the air nozzle 310. This not only cleans the surface of the aluminum-plastic blister, but also preheats the aluminum-plastic blister, reducing the power used by the electric heater inside the upper mold 302. After the aluminum-plastic blister is heat-sealed, the air nozzle 310 sprays onto both sides of the aluminum-plastic blister to detect whether air has entered the aluminum-plastic blister, thereby detecting the heat-sealing effect of the aluminum-plastic blister.

[0077] After the heat sealing of the aluminum-plastic blister is completed, the corresponding solenoid valve 504 is started and the other solenoid valve 504 is closed, so that the cold end of the Peltier semiconductor refrigeration module 507 cools the gas inside the gas collecting box 506, and then the cold air is transported to the connecting plate 308 through the air pump 505 and the regulating tube 503, and the cold air is sprayed on the surface of the aluminum-plastic blister through the nozzle 310, thereby accelerating the cooling speed of the aluminum-plastic blister, thereby avoiding heat retention on the aluminum-plastic blister due to too slow temperature reduction, which affects the heat sealing of the aluminum-plastic blister.

[0078] Embodiment 3, based on embodiment 1, further, the collecting mechanism 4 includes a collecting box 401 fixedly connected to one side of the upper surface of the corresponding supporting frame 101, an operating panel 402 is attached to the upper surface of the collecting box 401, a cutting device 403 is fixedly connected to the upper surface of the operating panel 402, a cleaning plate 404 with a fan mounted in a path array on its surface is fixedly connected to one side of the cutting device 403, and the cleaning plate 404 corresponds to the lower mold 307;

[0079] The collection box 401 is used to collect the packaged aluminum-plastic blisters, making it easier for subsequent staff to sort the aluminum-plastic blisters.

[0080] The cutting device 403 is used to cut the packaged aluminum-plastic blister into small portions, which is convenient for further packaging of the aluminum-plastic blister and the medicine.

[0081] The cleaning plate 404 and the fan cooperate with each other to clean the surface of the aluminum-plastic blister, thereby preventing the cutting debris from adhering to the aluminum-plastic blister and causing damage to the aluminum-plastic blister.

[0082] The forming mechanism 2 includes a heating box 201 fixedly connected to one side of the upper surface of the corresponding support frame 101 by bolts. The inner top wall of the heating box 201 is fixedly connected to an electric heating plate 202 by bolts. The interior of the heating box 201 is rotatably connected to a conveyor belt 203 corresponding to the electric heating plate 202. One side of the conveyor belt 203 is installed with an existing driving device. The middle part of the upper surface of the support frame 101 is fixedly connected to a positive pressure pneumatic forming device 204 corresponding to the heating box 201. The positive pressure pneumatic forming device 204 corresponds to the lower mold 307.

[0083] The heating box 201 and the electric heating plate 202 are used to heat the raw materials of the aluminum-plastic blister;

[0084] The conveyor belt 203 is used to transport the aluminum-plastic blister raw materials to move on the aluminum-plastic blister packaging machine;

[0085] Wherein, the driving device is used to drive the conveyor belt 203, and the driving device is a motor;

[0086] Among them, the positive pressure air pressure forming equipment 204 is used to stamp the heated aluminum-plastic blister raw material. Positive pressure is applied above the mold to press the sheet into the mold cavity for forming. After forming, the blister must be free of damage, wrinkles, and uniform wall thickness.

[0087] The molding mechanism 2 further includes a fixing plate 205 fixedly connected to the other side of the upper surface of the corresponding support frame 101 by bolts. A horizontal plate 206 for installing a cooling fan is fixedly connected to the interior of the fixing plate 205. The fixing plate 205 and the initial state of the mold of the positive pressure molding device 204 are on the same horizontal line. The other support frame 101 corresponds to the carrier plate 102;

[0088] The fixing plate 205 is used to install the horizontal plate 206 and the cooling fan;

[0089] The horizontal plate 206 and the cooling fan are used to cool the formed aluminum-plastic blister to ensure that it will not be deformed during the subsequent movement.

[0090] The forming mechanism 2 further includes a clamping plate 207 fixedly connected to an edge of the upper surface of the corresponding support frame 101. A mounting roller 208 is fixedly connected to one side of the clamping plate 207. An aluminum foil assembly 209 is sleeved on the surface of the mounting roller 208. Support rollers 210 corresponding to the aluminum foil assemblies 209 are fixedly connected to the surface of the clamping plate 207 in a path array. A winding roller 211 corresponding to the aluminum foil assembly 209 is fixedly connected to one side of one of the carrier plates 102. The aluminum foil assembly 209 corresponds to the upper mold 302 and the lower mold 307.

[0091] The clamping plate 207 is used to support the mounting roller 208 and the aluminum foil assembly 209;

[0092] Among them, the installation roller 208 is used to place the aluminum foil assembly 209;

[0093] The aluminum foil assembly 209 is composed of a straight rod and an aluminum-plastic film;

[0094] Among them, the support roller 210 is used to support the aluminum foil film to make it smoother during movement;

[0095] The winding roller 211 is used to collect the cut aluminum foil film;

[0096] Specifically, the aluminum foil film is moved to the bottom of the upper mold 302 by the rotation of the winding roller 211. When the aluminum-plastic blister moves to the bottom of the upper mold 302 and the aluminum foil film, based on the downward pressure and temperature of the upper mold 302, the aluminum foil film is heat-sealed on the aluminum-plastic blister to seal the aluminum-plastic blister.

[0097] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. An aluminum-plastic blister packaging machine, characterized by: It comprises a support assembly (1), a forming mechanism (2) is installed on the upper surface of the support assembly (1), a sealing mechanism (3) is installed on one side of the upper surface of the support assembly (1), and a collecting mechanism (4) is installed on one side of the support assembly (1); The sealing mechanism (3) comprises a mounting plate (301) mounted on one side of the upper surface of the support assembly (1); an upper mold (302) is arranged above the mounting plate (301); an electric heater is arranged inside the upper mold (302); a silicone box (303) is fixedly connected to the surface of the upper mold (302) by bolts; both sides of the silicone box (303) are fixedly connected to a first electromagnet (304) in a path array; both sides of the upper mold (302) are fixedly connected to a hollow box (305) with a magnetorheological fluid arranged therein; one side of the hollow box (305) is fixedly connected to a second electromagnet (317) corresponding to the magnetorheological fluid; a connecting pipe (306) communicating with the silicone box (303) is fixedly connected to the lower surface of the hollow box (305) in a path array; and a feeding pipe corresponding to the first electromagnet (304) is fixedly connected to one side of the upper surface of the hollow box (305).

2. The aluminum-plastic blister packaging machine according to claim 1, characterized in that: The sealing mechanism (3) further comprises a lower mold (307) fixedly connected to the upper surface of the mounting plate (301) and corresponding to the upper mold (302); both sides of the lower mold (307) are fixedly connected to a connecting plate (308); both sides of each two corresponding connecting plates (308) are fixedly connected to a supporting plate (309); the upper surfaces of the connecting plates (308) and the supporting plates (309) are fixedly connected to nozzles (310) in a path array; and an adjustment mechanism (5) corresponding to the nozzles (310) is installed on the lower surface of the lower mold (307).

3. The aluminum-plastic blister packaging machine according to claim 2, characterized in that: The regulating mechanism (5) comprises a three-way pipe (501) fixedly connected to the lower surfaces of a plurality of connecting plates (308) and communicating with the connecting plates (308); one end of the three-way pipe (501) is fixedly connected to a clamping pipe (502); a regulating pipe (503) communicating with the clamping pipe (502) is fixedly connected to the surface of the clamping pipe (502); and electromagnetic valves (504) are installed on the surfaces of the clamping pipe (502) and the regulating pipe (503).

4. The aluminum-plastic blister packaging machine according to claim 3, characterized in that: The regulating mechanism (5) further comprises two air pumps (505) respectively fixedly connected to the clamping tube (502) and one end of the regulating tube (503); the input end of the air pump (505) is fixedly connected to a gas collecting box (506); the interiors of the two gas collecting boxes (506) are commonly fixedly connected to a Peltier semiconductor refrigeration module (507); the hot end and the cold end of the Peltier semiconductor refrigeration module (507) are respectively plugged into the interiors of corresponding gas collecting boxes (506); and the surface of the gas collecting box (506) is provided with air inlet grooves in the form of a path array.

5. The aluminum-plastic blister packaging machine according to claim 2, characterized in that: The sealing mechanism (3) further comprises a support frame (311) fixedly connected to the upper surface of the mounting plate (301); an electric push rod (312) is fixedly connected to the surface of the support frame (311); an output end of the electric push rod (312) is fixedly connected to a moving block (313); buffer springs (314) fixedly connected to the upper mold (302) are fixedly connected at the four corners of the lower surface of the moving block (313); a pressure sensor (315) is fixedly connected to the upper surface of the upper mold (302) in a path array; and a temperature sensor (316) is fixedly connected to one side of the upper mold (302) in a path array.

6. The aluminum-plastic blister packaging machine according to claim 2, characterized in that: The support assembly (1) comprises a support frame (101) installed in a path array, wherein the upper surface of one of the support frames (101) is fixedly connected to a carrier plate (102) in a path array, and moving wheels are fixedly connected to the four corners of the lower surface of the support frame (101). The mounting plate (301) is fixedly connected to the surface of the corresponding carrier plate (102), and a feeding device (103) is fixedly connected to the middle of the upper surface of the support frame (101).

7. The aluminum-plastic blister packaging machine according to claim 6, characterized in that: The collecting mechanism (4) comprises a collecting box (401) fixedly connected to one side of the upper surface of the corresponding supporting frame (101); an operating panel (402) is attached to the upper surface of the collecting box (401); a cutting device (403) is fixedly connected to the upper surface of the operating panel (402); a cleaning plate (404) with a fan mounted in a path array on its surface is fixedly connected to one side of the cutting device (403); the cleaning plate (404) corresponds to the lower mold (307).

8. The aluminum-plastic blister packaging machine according to claim 6, characterized in that: The forming mechanism (2) comprises a heating box (201) fixedly connected to one side of the upper surface of the corresponding support frame (101) by bolts, the inner top wall of the heating box (201) is fixedly connected to an electric heating plate (202) by bolts, the interior of the heating box (201) is rotatably connected to a conveyor belt (203) corresponding to the electric heating plate (202), one side of the conveyor belt (203) is installed with an existing driving device, and the middle part of the upper surface of the support frame (101) is fixedly connected to a positive pressure air pressure forming device (204) corresponding to the heating box (201), and the positive pressure air pressure forming device (204) corresponds to the lower mold (307).

9. The aluminum-plastic blister packaging machine according to claim 8, characterized in that: The molding mechanism (2) further comprises a fixing plate (205) fixedly connected to the other side of the upper surface of the corresponding support frame (101) by bolts, a horizontal plate (206) for installing a heat dissipation fan being fixedly connected inside the fixing plate (205), the fixing plate (205) and the initial state of the mold of the positive pressure air pressure molding device (204) are on the same horizontal line, and the other support frame (101) corresponds to the bearing plate (102).

10. The aluminum-plastic blister packaging machine according to claim 8, characterized in that: The forming mechanism (2) further comprises a clamping plate (207) fixedly connected to an edge of the upper surface of the corresponding support frame (101), a mounting roller (208) being fixedly connected to one side of the clamping plate (207), an aluminum foil assembly (209) being sleeved on the surface of the mounting roller (208), supporting rollers (210) corresponding to the aluminum foil assembly (209) being fixedly connected to the surface of the clamping plate (207) in a path array, a winding roller (211) corresponding to the aluminum foil assembly (209) being fixedly connected to one side of one of the carrier plates (102), and the aluminum foil assembly (209) corresponding to the upper mold (302) and the lower mold (307).

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