Element coupling method and device

Abstract

The invention provides an element coupling method and device. The element coupling method comprises the following steps: providing an optical fiber array element, wherein the optical fiber array element is provided with an optical coupling part; providing an integrated circuit element, wherein the integrated circuit element is provided with a photon integrated circuit; enabling a holding mechanism to hold the optical fiber array element, and enabling the optical coupling part of the optical fiber array element to be adhered to the photonic integrated circuit through a first adhesive material; enabling the holding mechanism to continuously hold the optical fiber array element, and measuring an intensity value of an optical signal transmitted between the optical fiber array element and the integrated circuit element; enabling the holding mechanism to continuously hold the optical fiber array element, adjusting the posture of the optical fiber array element according to the strength value until the strength value falls within a preset range, and curing the first adhesive material; therefore, the defect that the posture of the optical fiber array element cannot be adjusted after the optical fiber array element and the integrated circuit element are adhered in the prior art can be overcome.

Description

Technical Field

[0001] The present invention relates to a device coupling method and device, and more particularly to a device coupling method and device for coupling an optical fiber array device to an integrated circuit device. Background Art

[0002] In order to produce chips with higher transmission efficiency and lower power consumption in the semiconductor process, silicon photonics (SiPh; Silicon Photonics) technology has become a key focus of industrial development. In silicon photonics technology, whether it is pluggable transceiver optics (PTO; Pluggable Transceiver Optics), on-board optical architecture (OBO; On-Board Optics), co-packaged optical architecture (CPO; Co-Packaged Optics) or optical I / O architecture (Optical I / O), it is necessary to couple fiber array elements (FAU; Fiber Array Unit) to integrated circuit components (IC; Integrated Circuit). Currently, semiconductor processes have evolved to 2.5D or 3D packaging. Integrated circuit components and fiber array components have also changed in structure to match the process evolution. For example, integrated circuit components are equipped with photonic integrated circuits (PIC; Photonic Integrated Circuit) The optical fiber array element is provided with an optical coupler, a socket, and an optical fiber connected between the optical coupler and the socket. The photonic integrated circuit of the integrated circuit element is coupled to the optical coupler of the optical fiber array element and optically communicates with the outside world via the optical fiber and the socket of the optical fiber array element.

[0003] When coupling the optical fiber array element to the integrated circuit element, a multi-axis movable gantry mechanism is typically used to hold the optical fiber array element and adhere the optical fiber array element to the integrated circuit element using adhesive. However, prior art techniques do not allow the optical fiber array element to be moved after the gantry mechanism adheres the optical fiber array element to the integrated circuit element, making it impossible to adjust the position of the optical fiber array element according to the situation. This requires further improvement. Summary of the Invention

[0004] Therefore, an object of the present invention is to provide a device coupling method that can improve at least one disadvantage of the prior art.

[0005] Another object of the present invention is to provide a component coupling device that can be used to perform the component coupling method.

[0006] The component coupling method according to the present invention includes: providing a fiber array component having an optical coupling portion; providing an integrated circuit component having a photonic integrated circuit; causing a holding mechanism to hold the fiber array component and adhere the optical coupling portion of the fiber array component to the photonic integrated circuit via a first adhesive; causing the holding mechanism to continue holding the fiber array component and measure an intensity of an optical signal transmitted between the fiber array component and the integrated circuit component; causing the holding mechanism to continue holding the fiber array component and adjust the posture of the fiber array component according to the intensity value until the intensity value falls within a predetermined range, and then curing the first adhesive.

[0007] According to another aspect of the present invention, a component coupling apparatus can be used to perform the component coupling method.

[0008] In the device coupling method and apparatus of the embodiments of the present invention, after the optical coupling portion is bonded to the photonic integrated circuit via the first adhesive, the holding mechanism continues to hold the optical fiber array component and adjusts the posture of the optical fiber array component as needed before the first adhesive cures. This overcomes the disadvantage of prior art that the posture of the optical fiber array component cannot be adjusted after bonding to the integrated circuit component. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is an incomplete three-dimensional exploded view illustrating the optical fiber array component and part of the integrated circuit component in an embodiment of the present invention.

[0010] Figure 2 It is a partial cross-sectional view illustrating how the optical fiber array element is coupled to the integrated circuit element.

[0011] Figure 3 is a perspective view illustrating the optical fiber array element.

[0012] Figure 4 It is a stereogram with different Figure 3 The optical fiber array elements are illustrated from a perspective of FIG.

[0013] Figure 5 It is a partial cross-sectional view illustrating the optical signal transmitted between the optical fiber array element and the integrated circuit element.

[0014] Figure 6 It is a schematic diagram illustrating that the component coupling device in an embodiment of the present invention is provided with a measuring unit, a component coupling device, a control unit, a first carrier device, a second carrier device, a detection station, a first track device, a second track device, a component transfer device, and a gluing station on the machine.

[0015] Figure 7It is a schematic diagram illustrating the configuration relationship of the component coupling device, the first carrier device, the second carrier device, the inspection station, the first track device, the second track device, the component transfer device, and the glue coating station on the machine.

[0016] Figure 8 is a perspective view illustrating a component coupling device according to an embodiment of the present invention.

[0017] Figure 9 It is a perspective exploded view illustrating the third direct-acting assembly, the second driving mechanism, the holding mechanism, and the inspection mechanism of the component coupling device.

[0018] Figure 10 It is a perspective exploded view illustrating the first rotating assembly, the second rotating assembly, and the third rotating assembly of the second driving mechanism.

[0019] Figure 11 It is a three-dimensional diagram illustrating that the first movable seat of the first rotating assembly is swung leftward or rightward along the first base with the first axis as the axis center.

[0020] Figure 12 It is a three-dimensional diagram illustrating that the second movable seat of the second rotating assembly is deflected in an upward and downward arc path along the second base with the second axis as the axis center.

[0021] Figure 13 It is a three-dimensional diagram illustrating that the third movable seat of the third rotating assembly is swung forward and backward along the third base with the third axis as the axis center.

[0022] Figure 14 It is a partial side view illustrating the various connecting surfaces of the second driving mechanism.

[0023] Figure 15 It is an incomplete three-dimensional diagram, illustrating that the first axis, the second axis, and the third axis intersect with each other.

[0024] Figure 16 is a perspective exploded view illustrating the retaining mechanism and its curing components.

[0025] Figure 17 It is a partial side view illustrating the holding mechanism and its airway.

[0026] Figure 18 It is a partial side view illustrating the retaining member of the retaining mechanism.

[0027] Figure 19 It is a fragmentary perspective view illustrating the retaining member from an inverted perspective.

[0028] Figure 20is a perspective view illustrating the drive assembly of the holding mechanism.

[0029] Figure 21 It is a perspective view illustrating the docking member of the retaining mechanism.

[0030] Figure 22 is a schematic diagram illustrating that the docking member can be driven to selectively dock with the optical fiber array element.

[0031] Figure 23 is a schematic diagram illustrating the illumination of ultraviolet light toward the optical fiber array element.

[0032] Figure 24 is a schematic diagram illustrating that the holding mechanism drives the optical fiber array element to the detection station.

[0033] Figure 25 is a schematic diagram illustrating that the holding mechanism drives the optical fiber array element to the glue coating station.

[0034]

Explanation of symbols

[0035] 1: Measurement unit

[0036] 2: Component coupling device

[0037] 3: Control unit

[0038] 4: First stage device

[0039] 41: First carrier

[0040] 42: First rotating seat

[0041] 43: First platform rail seat

[0042] 5: Second stage device

[0043] 51: Second platform

[0044] 52: Second platform rail seat

[0045] 6: Inspection Station

[0046] 61: Second imaging component

[0047] 62: Second distance sensor

[0048] 63: Optical Integrator

[0049] 7: First track device

[0050] 71: First Track

[0051] 8: Second track device

[0052] 81: Second Track

[0053] 9: Component transfer device

[0054] 91: Gantry

[0055] 92: First pick-and-place mechanism

[0056] 93: Second pick-and-place mechanism

[0057] 10: Gluing station

[0058] 101: First glue valve

[0059] 1011: First nozzle

[0060] 102: Second glue valve

[0061] 1021: Second nozzle

[0062] 11: Component coupling device

[0063] A: First drive mechanism

[0064] A1: The first linear actuator

[0065] A11: First rail seat

[0066] A12: First slide

[0067] A2: Second direct-acting component

[0068] A21: Second rail seat

[0069] A22: Second slide

[0070] A3: The third direct-acting component

[0071] A31: Third Rail Seat

[0072] A32: Third slide

[0073] B: Second drive mechanism

[0074] B1: First rotating component

[0075] B11: First Pedestal

[0076] B12: First mobile seat

[0077] B13: First Drive

[0078] B14: First connecting piece

[0079] B141: First connection surface

[0080] B142: Second connection surface

[0081] B2: Second rotating component

[0082] B21: Second base

[0083] B22: Second mobile seat

[0084] B23: Second drive

[0085] B24: Second connecting piece

[0086] B241: Third connection surface

[0087] B242: Fourth connection surface

[0088] B3: The third rotating component

[0089] B31: Third base

[0090] B32: Third mobile seat

[0091] B33: Third Drive

[0092] B34: Third connecting piece

[0093] B341: Fifth connection surface

[0094] B342: Sixth connection surface

[0095] C: Holding mechanism

[0096] C1: Bracket

[0097] C11: Air nozzle

[0098] C12: Airway

[0099] C2: Retaining parts

[0100] C21: First holding part

[0101] C211: First holding surface

[0102] C212: First negative pressure hole

[0103] C22: Second holding part

[0104] C221: Second holding surface

[0105] C222: Second negative pressure hole

[0106] C23: First limiter

[0107] C231: First yielding area

[0108] C24: Second limiter

[0109] C241: Second yielding area

[0110] C3: docking piece

[0111] C31: Optical channel

[0112] C32: Optical Transmission Department

[0113] C33: Guide

[0114] C331: Guide pin

[0115] C34: Butt joint

[0116] C4: Drive components

[0117] C41: driving parts

[0118] C42: Moving parts

[0119] C43: Mounting

[0120] C5: Curing components

[0121] C51: First Light Source

[0122] C511: Ultraviolet light

[0123] D: Inspection agency

[0124] D1: First imaging component

[0125] D11: Image Finder

[0126] D12: Lens

[0127] D13: Light Source

[0128] D2: First distance sensor

[0129] F1: First plastic material

[0130] F2: Second adhesive

[0131] T:Machine

[0132] L1: First axis

[0133] L2: Second axis

[0134] L3: The third axis

[0135] Lp: Pivot point

[0136] R1: First track

[0137] R2: Second track

[0138] R3: The third track

[0139] S1: First tray

[0140] S2: Second tray

[0141] W1: Fiber Array Components

[0142] W11: Optocoupler

[0143] W111: Prism

[0144] W112: First side

[0145] W12: socket

[0146] W121: Second side

[0147] W122: First seat

[0148] W123: Second seat

[0149] W124: Guide hole

[0150] W13: Fiber Optic Department

[0151] W131: Fiber Optic

[0152] W2: integrated circuit components

[0153] W21: Carrier board

[0154] W22: Cover

[0155] W221: First cover

[0156] W222: Second cover

[0157] W223: hollow area

[0158] W23: Photonic Integrated Circuits

[0159] W231: Lens Array

[0160] W2311: Lens

[0161] W3: Optical signal

[0162] d1: first direction

[0163] d2: second direction

[0164] d3: third direction

[0165] r1: radius

[0166] r2: radius

[0167] r3: radius DETAILED DESCRIPTION

[0168] See also Figure 1 The embodiment of the present invention is applicable to the process of coupling an optical fiber array element W1 to an integrated circuit element W2.

[0169] See also Figure 2 、 3 4. The optical fiber array element W1 includes an optical coupler W11, a socket W12, and an optical fiber W13 connected to the optical coupler W11 and the socket W12.

[0170] The optical coupling portion W11 is made of a light-transmissive material and has a prism W111 disposed on a first side surface W112 of the optical coupling portion W11 away from the socket portion W12.

[0171] The socket portion W12 allows the optical fiber portion W13 to pass through and be exposed on a second side surface W121 of the socket portion W12 away from the optical coupler portion W11. The socket portion W12 has a first seat portion W122 with a relatively wide width, a second seat portion W123 with a relatively narrow width, and two guide holes W124 passing through the first seat portion W122 and the second seat portion W123. The second side surface W121 is inclined outward from top to bottom.

[0172] The optical fiber portion W13 is composed of a plurality of optical fibers W131 and is flexible.

[0173] See also Figure 1 、 2 The integrated circuit element W2 is provided with a carrier W21, a cover W22 provided on the carrier W21, and a photonic integrated circuit W23 provided on the carrier W21 (in the embodiment of the present invention, a plurality of photonic integrated circuits W23 are provided on the carrier W21);

[0174] The carrier W21 is slightly rectangular, and the photonic integrated circuit W23 can be arranged on one side of the carrier W21;

[0175] The cover member W22 includes a first cover portion W221, a second cover portion W222 slightly lower than the first cover portion W221, and a hollow region W223 between the first cover portion W221 and the second cover portion W222 for exposing the photonic integrated circuit W23. The hollow region W223 may be configured according to the design requirements of the photonic integrated circuit W23, for example, at each of the four proximal sides of the rectangular carrier W21.

[0176] Each photonic integrated circuit W23 is provided with a lens array W231 ; the lens array W231 is formed by a plurality of lenses W2311 arranged in a matrix.

[0177] See also Figure 2 、 5When the optical fiber array element W1 is coupled to the integrated circuit element W2, the optical coupling portion W11 of the optical fiber array element W1 is in contact with the photonic integrated circuit W23 and the socket portion W12 is in contact with the second cover portion W222 of the cover W22; the optical fiber array element W1 uses the prism W111 to correspond to the lens array W231, so that an optical signal W3 can be transmitted between the prism W111 of the optical fiber array element W1 and the lens array W231 of the photonic integrated circuit W23. The optical signal W3 is generated by a measuring unit 1 ( Figure 6 ) is supplied to the optical fiber array element W1, the measuring unit 1 ( Figure 6 ) can measure the intensity of the optical signal W3 transmitted from the optical fiber array element W1 to the integrated circuit element W2 and then back to the optical fiber array element W1; specifically, when the optical signal W3 is transmitted from the optical fiber array element W1 to the integrated circuit element W2, it can be reflected by the prism W111 and then transmitted forward and downwardly inclined to the lens W2311 of the lens array W231; the optical coupling portion W11 and the photonic integrated circuit W23 can be adhered and fixed by a first adhesive F1, and the socket portion W12 and the cover W22 can be adhered and fixed by a second adhesive F2. The shrinkage rate of the first adhesive F1 after curing is smaller than the shrinkage rate of the second adhesive F2 after curing, and the strength of the second adhesive F2 after curing is greater than the strength of the first adhesive F1 after curing; the first adhesive F1 is a UV-curing adhesive in the embodiment of the present invention, and the second adhesive F2 is a heat-curing adhesive in the embodiment of the present invention;

[0178] In other embodiments of the present invention, the cover W22 may only include the first cover portion W221 , and the socket portion W12 is attached to the carrier W21 .

[0179] See also Figure 6 、 7 The component coupling method of the embodiment of the present invention can be performed by a component coupling device 11 as shown in the figure. The component coupling device 11 is suitable for coupling the optical fiber array component W1 to the integrated circuit component W2. The component coupling device 11 is provided on a machine T with: the measurement unit 1, a component coupling device 2, a control unit 3, a first stage device 4, a second stage device 5, a detection station 6, a first track device 7, a second track device 8, a component transfer device 9, and a glue coating station 10;

[0180] In the embodiment of the present invention, in order to increase the working efficiency, the component coupling device 11 is provided with two component coupling devices 2 facing each other, but the present invention is not limited thereto. The component coupling device 11 may also be provided with only one component coupling device 2 .

[0181] See also Figure 7 、 8The component coupling device 2 is adapted to hold and move the optical fiber array element W1 and couple the optical fiber array element W1 to the integrated circuit element W2. The component coupling device 2 is provided with:

[0182] a first driving mechanism A, provided on the machine platform T;

[0183] a second driving mechanism B, disposed on the first driving mechanism A and capable of being driven by the first driving mechanism A to perform multi-axial linear movement;

[0184] a holding mechanism C disposed on the second drive mechanism B and capable of being driven by the second drive mechanism B to perform multi-axial rotational movement; the holding mechanism C can hold the optical fiber array element W1 and, under the drive of the first drive mechanism A and the second drive mechanism B, drive the optical fiber array element W1 to perform multi-axial linear movement or rotational movement;

[0185] An inspection mechanism D is provided on the first driving mechanism A and can be driven by the first driving mechanism A to move linearly in multiple axes and can inspect the integrated circuit element W2 ( Figure 1 ) for inspection.

[0186] See also Figure 8 In the following description of the embodiment of the present invention, the horizontal direction is a first direction d1, the horizontal direction and perpendicular to the first direction d1 is a second direction d2, and the longitudinal direction and perpendicular to the first direction d1 and the second direction d2 is a third direction d3.

[0187] See also Figure 8 、 9 The first driving mechanism A comprises: a first direct-acting assembly A1 provided on the machine T, a second direct-acting assembly A2 provided on the first direct-acting assembly A1, and a third direct-acting assembly A3 provided on the second direct-acting assembly A2;

[0188] The first linear motion assembly A1 includes two first rails A11 spaced apart from each other and disposed on the machine T, and two first slides A12 disposed on the two first rails A11, respectively. The first rails A11 extend along the first direction d1, and the first slides A12 are movable on the first rails A11 along the first direction d1.

[0189] The second direct-acting assembly A2 includes a second rail base A21 straddling the two first slides A12 and a second slide A22 mounted on the second rail base A21. The second rail base A21 extends along the second direction d2, and the second slide A22 is movable on the second rail base A21 along the second direction d2.

[0190] The third direct-acting assembly A3 includes a third rail base A31 mounted on the second slide A22 and a third slide A32 mounted on the third rail base A31. The third rail base A31 extends along the third direction d3, and the third slide A32 is movable on the third rail base A31 along the third direction d3.

[0191] The first driving mechanism A can drive the second driving mechanism B to link the holding mechanism C to drive the optical fiber array element W1 to perform linear movement with three degrees of freedom in the first direction d1, the second direction d2, and the third direction d3;

[0192] In the embodiment of the present invention, the first rail seat A11 and the second rail seat A21 drive the first slide A12 and the second slide A22 by a linear motor, but the present invention is not limited to this, and a combination of a rotary motor and a screw rod may also be used; in the embodiment of the present invention, the third rail seat A31 drives the third slide A32 by a combination of a rotary motor and a screw rod, but the present invention is not limited to this, and a linear motor may also be used.

[0193] See also Figure 9 The inspection mechanism D is provided with a first imaging component D1 and a first distance sensor D2; the first imaging component D1 is provided with an image finder D11, a lens D12, and a light source D13; please refer to Figure 1 The first imaging component D1 can capture the photonic integrated circuit W23 and / or the lens array W231 above the integrated circuit element W2 to obtain the orientation of the photonic integrated circuit W23 and / or the lens array W231; the first distance sensor D2 can be, for example, an optical reflective sensor, which can sense the distances at different positions on the upper surface of the photonic integrated circuit W23 to obtain the flatness of the upper surface of the photonic integrated circuit W23.

[0194] See also Figure 9 、 10 The second driving mechanism B includes: a first rotating component B1 disposed on the third slide A32, a second rotating component B2 disposed on the first rotating component B1, and a third rotating component B3 disposed on the second rotating component B2.

[0195] See also Figure 10 、 11 The first rotating assembly B1 is provided with a third sliding seat A32 ( Figure 7) a first base B11, a first movable base B12 provided on the first base B11, a first driver B13 capable of driving the first movable base B12 to move, and a first connecting member B14 provided on the first movable base B12; the first base B11 is provided with an arc-shaped concave surface facing the first movable base B12, the first movable base B12 is provided with an arc-shaped convex surface facing the first base B11, the first movable base B12 can be driven by the first driver B13 to move in an arc shape along the first base B11 and link the first connecting member B14 to deflect in a left or right arc-shaped path, and a first trajectory R1 formed by the deflection of the arc path of the first movable base B12 is centered on a first axis L1 parallel to the third direction d3 ( Figure 9 The radius from the first trajectory R1 to the first axis L1 is r1); in the embodiment of the present invention, the first base B11 and the first movable base B12 are connected by a cross bearing to enable relative movement between the two.

[0196] See also Figure 10 、 12 The second rotating assembly B2 is provided with a first connecting member B14 ( Figure 9 ) a second base B21, a second movable base B22 provided on the second base B21, a second driver B23 capable of driving the second movable base B22 to move, and a second connecting member B24 provided on the second movable base B22; the second base B21 is provided with an arc concave surface facing the second movable base B22, the second movable base B22 is provided with an arc convex surface facing the second base B21, the second movable base B22 can be driven by the second driver B23 to move in an arc along the second base B21 and link the second connecting member B24 to deflect in an upward or downward arc path, and a second trajectory R2 formed by the deflection of the arc path of the second movable base B22 is centered on a second axis L2 parallel to the first direction d1 ( Figure 10 The radius from the second trajectory R2 to the second axis L2 is r2); in the embodiment of the present invention, the second base B21 and the second movable base B22 are cross-bearings to enable relative movement between the two.

[0197] See also Figure 10 、 13 The third rotating assembly B3 is provided with a second connecting member B24 ( Figure 10) a third base B31, a third movable base B32 provided on the third base B31, a third driver B33 capable of driving the third movable base B32 to move, and a third connecting member B34 provided on the third movable base B32; the third base B31 is provided with an arc concave surface facing the third movable base B32, the third movable base B32 is provided with an arc convex surface facing the third base B31, the third movable base B32 can be driven by the third driver B33 to move in an arc along the third base B31 and link the third connecting member B34 to deflect in a forward and backward arc path, a third trajectory R3 formed by the deflection of the arc path of the third movable base B32 is centered on a third axis L3 parallel to the second direction d2 ( Figure 11 The radius from the third trajectory R3 to the third axis L3 is r3); in the embodiment of the present invention, the third base B31 and the third movable base B32 are cross-bearings to enable relative movement between the two.

[0198] See also Figure 10 、 14 The first connecting member B14 has a vertical first connecting surface B141 and a horizontal second connecting surface B142; the second connecting member B24 has a horizontal third connecting surface B241 and an inclined fourth connecting surface B242; the third connecting member B34 has an inclined fifth connecting surface B341 and a vertical sixth connecting surface B342; the first connecting surface B141 is approximately parallel to the sixth connecting surface B342; the fourth connecting surface B242 is approximately parallel to the fifth connecting surface B341;

[0199] The first connecting member B14 is disposed on the first movable base B12 of the first rotating assembly B1 via the first connecting surface B141;

[0200] The second rotating assembly B2 is disposed below the first connecting member B14. The second base B21 is disposed on the second connecting surface B142 of the first connecting member B14. The second connecting member B24 is disposed on the second movable base B22 via the third connecting surface B241.

[0201] The third rotating assembly B3 is mounted on the inclined fourth connection surface B242 of the second connection member B24 with the third base B31; the third connection member B34 is mounted on the third movable base B32 with the inclined fifth connection surface B341;

[0202] The holding mechanism C ( Figure 9 ) is located on the sixth connecting surface B342.

[0203] See also Figure 15The first axis L1, the second axis L2, and the third axis L3 intersect (are orthogonal to) each other at an axis point Lp; the second driving mechanism B can drive the holding mechanism C to drive the optical fiber array element W1 to rotate with the axis point Lp as the rotation center and to perform three-degree-of-freedom rotation with the first axis L1, the second axis L2, and the third axis L3 as the axis center; the preset position of the axis point Lp is that when the optical fiber array element W1 is held by the holding mechanism C, it is preset to correspond to the bottom of the optical coupling portion W11 and the front of the prism W111; please refer to Figure 5 When the optical fiber array element W1 is coupled to the integrated circuit element W2, the position below the optical coupling portion W11 and in front of the prism W111 is also approximately located on the upper surface of the photonic integrated circuit W23 and corresponds to the lens array W231.

[0204] See also Figure 16 、 17 The holding mechanism C is provided with: a bracket C1, a holding member C2 provided on the bracket C1 and capable of holding the optical fiber array element W1, a docking member C3 provided on the bracket C1 and connected to the measuring unit 1, a driving assembly C4 provided on the bracket C1 and capable of driving the docking member C3 to move along the first direction d1, and a curing assembly C5 provided on the bracket C1 and capable of curing the adhesive; an air passage C12 connected to an air nozzle C11 is provided in the bracket C1, and the air nozzle C11 is connected to a negative pressure source (not shown); the holding member C2 and the docking member C3 are provided on the bracket C1 and can move synchronously, and the docking member C3 can move relative to the holding member C2 and selectively dock or not dock with the optical fiber array element W1, so that the holding mechanism C can not only hold the optical fiber array element W1 but also facilitate the measuring unit 1 to measure the optical fiber array element W1.

[0205] See also Figure 17 、 18 19. The holder C2 includes a first holding portion C21 and a second holding portion C22 spaced apart from the first holding portion C21 in the first direction d1. The first holding portion C21 can hold the optical coupler portion W11 of the optical fiber array element W1, and the second holding portion C22 can hold the socket portion W12 of the optical fiber array element W1. The holder C2 simultaneously holds both ends of the optical fiber array element W1, thereby firmly holding the optical fiber array element W1 on the holder C2, thereby reducing the possibility of the optical fiber array element W1 falling from the holding mechanism C.

[0206] The first holding portion C21 is provided with a first holding surface C211 and a first negative pressure hole C212 communicating with the first holding surface C211, and the optical coupling portion W11 of the optical fiber array element W1 can be adsorbed and held on the first holding surface C211 via the first negative pressure hole C212; the second holding portion C22 is provided with a second holding surface C221 and a second negative pressure hole C222 communicating with the second holding surface C221, and the socket portion W12 of the optical fiber array element W1 can be adsorbed and held on the second holding surface C221 via the second negative pressure hole C222; the first negative pressure hole C212 and the second negative pressure hole C222 are communicated with the airway C12;

[0207] The retaining member C2 has a first limiting portion C23 and a second limiting portion C24. The first limiting portion C23 is located on a side of the second retaining portion C22 closer to the first retaining portion C21, and the second limiting portion C24 is located on a side of the second retaining portion C22 farther from the first retaining portion C21. The first limiting portion C23 has a first clearance area C231 for the optical fiber portion W13 of the optical fiber array element W1 to pass through, and the second limiting portion C24 has a second clearance area C241 for the second seat portion W123 of the socket portion W12 of the optical fiber array element W1 to pass through.

[0208] When the optical fiber array element W1 is adsorbed and held by the retaining member C2, the first seat portion W122 of the socket portion W12 with a wider width will be located between the first limiting portion C23 and the second limiting portion C24 and be limited, so that the first limiting portion C23 and the second limiting portion C24 limit the movement of the optical fiber array element W1 on the retaining member C2 in the first direction d1.

[0209] See also Figure 17 、 20 , 21, 22, the docking member C3 is indirectly provided on the bracket C1 via the driving assembly C4, the driving assembly C4 comprising a driving member C41, a moving member C42 driven by the driving member C41, and a mounting seat C43 provided on the moving member C42; the docking member C3 is provided on the mounting seat C43 and can be driven by the driving member C41 to reciprocate relative to the holding member C2 along the first direction d1 to selectively dock or not dock with the optical fiber array element W1;

[0210] The docking member C3 is provided with an optical through portion C31, an optical transmission portion C32 connected between the optical through portion C31 and the measuring unit 1, and a guide portion C33 that can be selectively inserted into the optical fiber array element W1; the optical through portion C31 and the guide portion C33 are provided on a docking surface C34 of the docking member C3 facing the retaining member C2, the docking surface C34 is inclined from bottom to top toward the retaining member C2, and the inclination of the docking surface C34 corresponds to the second side surface W121 of the optical fiber array element W1, specifically, the docking surface C34 and the second side surface W121 are parallel to each other; the guide portion C33 is provided with two guide pins C331 spaced apart on both sides of the optical through portion C31, the guide pins C331 can be inserted into the guide hole W124 ( Figure 3 ); When the docking member C3 is docked with the optical fiber array element W1, the guide pin C331 is inserted into the guide hole W124, and the docking surface C34 is abutted against the second side surface W121, so that the optical through portion C31 corresponds to the optical fiber portion W13 exposed in the socket portion W12, so that the measuring unit 1 can supply the optical signal W3 ( Figure 5 ) to the optical fiber array element W1.

[0211] See also Figure 16 、 18 23, the curing assembly C5 is provided with two first light sources C51, the two first light sources C51 are spaced apart and disposed on both sides of the holder C2 in the second direction d2, and the first light sources C51 can be tilted to irradiate ultraviolet light C511 toward the first holding portion C21 of the holder C2;

[0212] In other embodiments of the present invention, the curing assembly C5 is further provided with a second light source (not shown), and the second light source can be tilted to irradiate the laser toward the second holding portion C22 of the holding member C2.

[0213] See also Figure 7 The first stage device 4 and the second stage device 5 are arranged in parallel with each other at a distance in the second direction d2, and are arranged within the range where the component coupling device 2 can perform operations;

[0214] The first stage device 4 includes a first stage 41 capable of carrying the integrated circuit device W2, a first rotating base 42 capable of driving the first stage 41 to rotate horizontally, and a first stage rail base 43 capable of driving the first rotating base 42 and the first stage 41 to move along the first direction d1.

[0215] The second stage device 5 includes a second stage 51 capable of supporting the optical fiber array element W1 and a second stage rail 52 capable of driving the second stage 51 to move along the first direction d1 .

[0216] See also Figure 7 、 24 The inspection station 6 is located between the first stage device 4 and the second stage device 5 and is located within the range where the component coupling device 2 can perform operations. The inspection station 6 can inspect or measure the optical fiber array component W1;

[0217] The inspection station 6 is provided with a second imaging component 61, a second distance sensor 62, and an optical integrator 63;

[0218] The second imaging component 61 can capture the optical coupling portion W11 and / or the prism W111 below the optical fiber array element W1 held by the holding mechanism C to obtain the orientation of the optical coupling portion W11 and / or the prism W111; the second distance sensor 62 can sense the distances at different positions on the lower surface of the optical coupling portion W11 to obtain the flatness of the lower surface of the optical coupling portion W11; the structure of the second imaging component 61 and the second distance sensor 62 can be, for example, the first imaging component D1 ( Figure 9 ) and the first distance sensor D2 ( Figure 9 );

[0219] The optical integrator 63 can measure the intensity value of the optical signal W3 below the optical fiber array element W1 held by the holding mechanism C. The optical integrator 63 can be, for example, an optical integrating sphere. Specifically, the optical integrator 63 measures the intensity value of the optical signal W3 transmitted from the optical fiber array element W1, and the optical signal W3 transmitted from the optical fiber array element W1 to the integrated circuit element W2 ( Figure 5 ) and then transmitted back to the optical fiber array element W1, the optical signal W3 is generated by the measuring unit 1 ( Figure 17 ) measurement.

[0220] See also Figure 7 The first track device 7 and the second track device 8 are arranged in parallel with each other at a distance in the second direction d2;

[0221] The first track device 7 includes a first track 71 , which can transport a first tray S1 along the first direction d1 . The first tray S1 carries the integrated circuit device W2 . The first track 71 can be, for example, a combination of a rail frame and a conveyor belt.

[0222] The second track device 8 has a second track 81, and the second track 81 can transport a second tray S2 along the first direction d1, and the second tray S2 carries the optical fiber array element W1; the second track 81 can be, for example, a combination of a rail frame and a conveyor belt;

[0223] The component transfer device 9 is provided with a gantry 91 spanning over the first rail device 7 and the second rail device 8, a first pick-and-place mechanism 92 provided on the gantry 91, and a second pick-and-place mechanism 93 provided on the gantry 91; the first pick-and-place mechanism 92 and the second pick-and-place mechanism 93 can move on the gantry 91 along the second direction d2; the first pick-and-place mechanism 92 can move between the first material tray S1 and the first carrier 41, and the second pick-and-place mechanism 93 can move between the second material tray S2 and the second carrier 51; the first pick-and-place mechanism 92 and the second pick-and-place mechanism 93 can be, for example, a combination of suction cups or suction nozzles.

[0224] See also Figure 7 、 25 The glue coating station 10 is located on a side of the second stage device 5 away from the inspection station 6 and is located within the range where the component coupling device 2 can perform operations;

[0225] The glue coating station 10 is equipped with a first glue valve 101 for coating the first glue material F1 and a second glue valve 102 for coating the first glue material F2. The first glue valve 101 is equipped with a first glue nozzle 1011 for dispensing glue upward, and the second glue valve 102 is equipped with a second glue nozzle 1021 for dispensing glue upward. In the embodiment of the present invention, the first glue valve 101 and the second glue valve 102 can be, for example, syringe pumps, but are not limited to such pumps. Alternatively, screw glue valves, piezoelectric glue valves, spray glue valves, etc. can be used.

[0226] In the implementation of the component coupling method according to an embodiment of the present invention, the first tray S1 carries at least one integrated circuit component W2 (in this embodiment of the present invention, one component) and is fed into the first track 71 from one end of the first track device 7. The second tray S2 carries at least one optical fiber array component W1 (in this embodiment of the present invention, multiple components) and is fed into the second track 81 from one end of the second track device 8.

[0227] The first rail 71 and the second rail 81 respectively transport the first tray S1 and the second tray S2 to the bottom of the gantry 91, and the first platform 41 and the second platform 51 are respectively driven by the first platform rail seat 43 and the second platform rail seat 52 to the bottom of the gantry 91;

[0228] The first pick-and-place mechanism 92 of the component transfer device 9 is moved to the first tray S1 to extract the integrated circuit component W2 onto the first carrier 41 , and the second pick-and-place mechanism 93 is moved to the second tray S2 to extract the optical fiber array component W1 onto the second carrier 51 .

[0229] After the first carrier 41 and the second carrier 51 respectively carry the integrated circuit device W2 and the optical fiber array device W1, the first carrier 41 and the second carrier 51 are driven by the first carrier rail 43 and the second carrier rail 52 to the bottom of the second direct-acting component A2 of the first driving mechanism A.

[0230] The first driving mechanism A drives the inspection mechanism D to move laterally above the first stage 41 , and the inspection mechanism D obtains the orientation of the photonic integrated circuit W23 and / or the lens array W231 and the flatness of the upper surface of the photonic integrated circuit W23 , and then the control unit 3 records the obtained orientation.

[0231] After obtaining the orientation of the photonic integrated circuit W23 and / or the lens array W231 and the flatness of the upper surface of the photonic integrated circuit W23, the first driving mechanism A drives the second driving mechanism B to link the holding mechanism C to move horizontally to above the second carrier 51, and the first driving mechanism A drives the second driving mechanism B to link the holding mechanism C to move downward so that the holding member C2 contacts the optical fiber array element W1 on the second carrier 51, and at the same time, the negative pressure source turns on the negative pressure so that the first holding portion C21 and the second holding portion C22 of the holding member C2 respectively adsorb the optical coupling portion W11 and the socket portion W12 of the optical fiber array element W1, and then the driving component C4 drives the docking member C3 to approach the optical fiber array element W1 and dock with the optical fiber array element W1, so that the measuring unit 1 can supply the optical signal W3 to the optical fiber array element W1;

[0232] After the docking member C3 is docked with the optical fiber array element W1, the first driving mechanism A drives the second driving mechanism B to link the holding mechanism C to move upward, so that the holding member C2 adsorbs and holds the optical fiber array element W1 and moves it away from the second carrier 51, and the first driving mechanism A drives the second driving mechanism B to link the holding mechanism C to drive the optical fiber array element W1 to move horizontally to the detection station 6 for inspection and measurement of the intensity value of the optical signal W3, and obtains the orientation of the optical coupling part W11 and / or the prism W111 and the flatness of the lower surface of the optical coupling part W11 and the measured optical signal at the detection station 6. The intensity value of the signal W3 is then recorded by the control unit 3; wherein, the control unit 3 can compare the deviation between the orientation of the optical coupling portion W11 and / or the prism W111 and the orientation of the photonic integrated circuit W23 and / or the lens array W231, and control the first rotating component B1 of the second driving mechanism B to swing left and right in an arc path with the first axis L1 as the axis with reference to the deviation, so as to adjust the posture of the optical fiber array element W1 held by the holding mechanism C so that the orientation of the optical coupling portion W11 and / or the prism W111 can correspond to the orientation of the photonic integrated circuit W23 and / or the lens array The control unit 3 can compare the deviation between the flatness of the lower surface of the optical coupling portion W11 and the flatness of the upper surface of the photonic integrated circuit W23, and control the second rotating component B2 of the second driving mechanism B to swing in an upward and downward arc path with the second axis L2 as the axis center according to the deviation, and control the third rotating component B3 to swing in a forward and backward arc path with the third axis L3 as the axis center, so as to adjust the posture of the optical fiber array element W1 held by the holding mechanism C so that the lower surface of the optical coupling portion W11 can be parallel to the upper surface of the photonic integrated circuit W23; and the control unit The unit 3 records the intensity value of the optical signal W3 measured by the detection station 6 for calibration purposes. This is because optical loss may occur during the transmission of the optical signal W3. For example, the measurement unit 1 supplies the optical signal W3 with an intensity value of 100 units to the optical fiber array element W1, but the optical integrator 63 actually measures the intensity value of the optical signal W3 transmitted from the optical fiber array element W1 as 90 units. The control unit 3 will record the intensity value of the optical signal W3 measured by the detection station 6 as 90 units and use it for subsequent readjustment of the posture (orientation or level) of the optical fiber array element W1.

[0233] After the second driving mechanism B drives the holding mechanism C to adjust the posture of the optical fiber array element W1, the first driving mechanism A drives the second driving mechanism B, which in turn moves the holding mechanism C laterally to the glue coating station 10 for glue coating. The holding mechanism C can hold the optical fiber array element W1 and move it relative to the first glue valve 101 and the second glue valve 102 along the second direction d2, so that the first glue valve 101 and the second glue valve 102 respectively coat the lower surface of the optical coupling portion W11 and the lower surface of the socket portion W12 with a layer of the first glue F1 and a layer of the second glue F2.

[0234] After the optical fiber array element W1 is coated with glue, the first driving mechanism A drives the second driving mechanism B to move the holding mechanism C horizontally to the top of the first carrier 41. Because the second driving mechanism B has previously driven the holding mechanism C to adjust the orientation of the optical coupling portion W11 and / or the prism W111 to correspond to the orientation of the photonic integrated circuit W23 and / or the lens array W231, and the lower surface of the optical coupling portion W11 has been adjusted to be parallel to the upper surface of the photonic integrated circuit W23, after the holding mechanism C is above the first carrier 41, the first driving mechanism A can be directly driven to move the second driving mechanism B to the top of the first carrier 41. The driving mechanism A drives the second driving mechanism B, which in turn moves the holding mechanism C downward, causing the lower surface of the optical coupling portion W11 and the lower surface of the socket portion W12 to adhere to the upper surface of the photonic integrated circuit W23 and the upper surface of the second cover portion W222 of the cover W22 via the first adhesive F1 and the second adhesive F2, respectively, so that the optical signal W3 can be transmitted between the optical fiber array element W1 and the integrated circuit element W2 via the prism W111 and the lens array W231. At this time, the holding mechanism C continues to hold the optical fiber array element W1 via the holding member C2.

[0235] After the optical fiber array element W1 is adhered to the integrated circuit element W2, because the first adhesive F1 and the second adhesive F2 have not yet solidified and the first adhesive F1 and the second adhesive F2 have a certain height, the optical fiber array element W1 can float on the first adhesive F1 and the second adhesive F2 and can still be adjusted by the holding mechanism C; at this time, the measuring unit 1 can measure whether the intensity value of the optical signal W3 falls within a preset range. When the intensity value of the optical signal W3 does not fall within the preset range, the control unit 3 controls the second driving mechanism B to drive the holding mechanism C to drive the optical fiber array element W1 to the axis according to demand. The point Lp is used as the rotation center to perform three-degree-of-freedom rotation about the first axis L1, the second axis L2, and the third axis L3. The posture of the optical fiber array element W1 is slightly adjusted while the optical fiber array element W1 is adhered to the integrated circuit element W2. The second driving mechanism B is controlled to stop actuating when the intensity value of the optical signal W3 measured by the measuring unit 1 falls within the preset range. When the intensity value of the optical signal W3 falls within the preset range, it indicates that the optical signal W3 transmitted between the optical fiber array element W1 and the integrated circuit element W2 has a better transmission efficiency. The preset range is consistent with the range in which the optical fiber array element W1 is adhered to the integrated circuit element W2. The detection station 6 has recorded a positive correlation with the intensity value of the optical signal W3 in the control unit 3. For example, the intensity value of the optical signal W3 has been recorded as 90 units. Considering that optical loss occurs during the transmission of the optical signal W3 between the optical fiber array element W1 and the integrated circuit element W2, the preset range can be preset between 80 and 90 units. If the intensity value of the optical signal W3 measured by the measuring unit 1 is 75 units, the control unit 3 controls the second driving mechanism B to continuously drive the holding mechanism C to adjust the posture of the optical fiber array element W1 until the optical signal W3 measured by the measuring unit 1 is 75 units. The intensity value of the optical signal W3 falls between 80 and 90 units; wherein the first rotating assembly B1, the second rotating assembly B2, and the third rotating assembly B3 of the second driving mechanism B are actuated in the order of the third rotating assembly B3 first, followed by the second rotating assembly B2, and finally the first rotating assembly B1; if the intensity value of the optical signal W3 measured by the measuring unit 1 falls within the preset range after the third rotating assembly B3 drives the holding mechanism C to cause the optical fiber array element W1 to rotate about the third axis L3, then the first rotating assembly B1 and the second rotating assembly B2 do not need to be actuated again;After the second driving mechanism B drives the holding mechanism C to slightly adjust the posture of the optical fiber array element W1, if the intensity value of the optical signal W3 still cannot fall within the preset range, the control unit 3 can control the first driving mechanism A to drive the second driving mechanism B to link the holding mechanism C to drive the optical fiber array element W1 to perform linear movement with three degrees of freedom along the first direction d1, the second direction d2, and the second direction d3, and continue to control the second driving mechanism B to drive the holding mechanism C to drive the optical fiber array element W1 to perform rotational movement with three degrees of freedom about the first axis L1, the second axis L2, and the third axis L3 as axes, thereby adjusting the posture of the optical fiber array element W1 to a greater extent while the optical fiber array element W1 is adhered to the integrated circuit element W2, and controlling the first driving mechanism A and the second driving mechanism B to stop operating until the intensity value of the optical signal W3 measured by the measuring unit 1 falls within the preset range;

[0236] After the intensity of the optical signal W3 falls within the preset range, the curing assembly A5 uses the ultraviolet light C511 and the laser to cure the first adhesive F1 and the second adhesive F2, respectively. Because the optical coupler W11 is made of a light-transmitting material, the ultraviolet light C511 can penetrate the optical coupler W11 and cure the first adhesive F1 between the optical coupler W11 and the photonic integrated circuit W23. Furthermore, because the laser can generate heat, the second adhesive F2 between the socket W12 and the second cover W222 of the cover W22 is heated and cured.

[0237] After the first adhesive material F1 and the second adhesive material F2 are cured, the driving assembly C4 drives the docking member C3 away from the optical fiber array element W1 to release the docking with the optical fiber array element W1;

[0238] After the docking member C3 is released from the docking with the optical fiber array element W1, the negative pressure source turns off the negative pressure and moves the retaining member C2 away from the optical fiber array element W1, thereby completing the process of coupling the optical fiber array element W1 to the integrated circuit element W2;

[0239] The first driving mechanism A and the second driving mechanism B of the element coupling device 2 can drive the holding mechanism C to repeat the above-mentioned actions in sequence to couple a preset number of the optical fiber array elements W1 to the integrated circuit element W2; when the photonic integrated circuit W23 is arranged on the four proximal sides of the carrier W21 of the integrated circuit element W2, the two element coupling devices 2 can respectively perform the operation of coupling the optical fiber array element W1 to the integrated circuit element W2 on two opposite proximal sides of the four proximal sides of the integrated circuit element W2, and after the coupling operation is completed on the two opposite proximal sides, the first rotating seat 42 drives the first carrier 41 to rotate 90 degrees , and then use the two component coupling devices 2 to continue to perform coupling operations on the other two proximal sides opposite to the integrated circuit component W2; after the integrated circuit component W2 has coupled a preset number of the optical fiber array components W1, the first carrier 41 is driven by the first carrier rail seat 43 to return to the bottom of the gantry 91, and the first pick-and-place mechanism 92 extracts the integrated circuit component W2 that has completed the coupling operation and returns it to the first material tray S1, and then sends it out of the first track 71 from the other end of the first track device 7; after the optical fiber array component W1 is no longer on the second material tray S2, the second material tray S2 will be sent out of the second track 81 from the other end of the second track device 8.

[0240] In the device coupling method and apparatus of the embodiments of the present invention, after the optical coupling portion W11 is adhered to the photonic integrated circuit W23 via the first adhesive F1, the holding mechanism C continues to hold the optical fiber array device W1 and adjusts the posture of the optical fiber array device W1 as needed before the first adhesive F1 solidifies. This overcomes the disadvantage of the prior art that the posture of the optical fiber array device W1 cannot be adjusted after the optical fiber array device W1 is adhered to the integrated circuit device W2.

[0241] The above descriptions are merely embodiments of the present invention and should not be used to limit the scope of implementation of the present invention. Any simple equivalent changes and modifications made in accordance with the scope of the patent application and the contents of the patent specification of the present invention are still within the scope of the patent of the present invention.

Claims

1. A component coupling method, comprising: Providing an optical fiber array element, the optical fiber array element is provided with an optical coupling portion; Providing an integrated circuit component, wherein the integrated circuit component has a photonic integrated circuit; Using a holding mechanism to hold the optical fiber array element, and allowing the optical coupling portion of the optical fiber array element to adhere to the photonic integrated circuit via a first adhesive; The holding mechanism continues to hold the optical fiber array element, and measures an intensity value of an optical signal transmitted between the optical fiber array element and the integrated circuit element; The holding mechanism is made to continue holding the optical fiber array element, and the posture of the optical fiber array element is adjusted according to the strength value until the strength value falls within a preset range, and then the first adhesive is solidified.

2. The component coupling method according to claim 1, wherein: When the holding mechanism holds the optical fiber array element, the holding mechanism holds the optical fiber array element with a holding member and docks the optical fiber array element with a docking member, and measures the intensity value of the optical signal with a measuring unit connected to the docking member.

3. The component coupling method according to claim 2, wherein: After the first adhesive is cured, the docking member is released from the optical fiber array component and the retaining member is moved away from the optical fiber array component.

4. The component coupling method according to claim 1, wherein: Before the optical coupling portion of the optical fiber array element is adhered to the photonic integrated circuit via the first adhesive, the orientation of the optical coupling portion and the photonic integrated circuit and the flatness of the lower surface of the optical coupling portion and the upper surface of the photonic integrated circuit are obtained.

5. The component coupling method according to claim 4, wherein: After obtaining the orientation of the optical coupler and the photonic integrated circuit and the flatness of the lower surface of the optical coupler and the upper surface of the photonic integrated circuit, the holding mechanism is driven to adjust the orientation of the optical fiber array element to correspond to the orientation of the photonic integrated circuit and to adjust the lower surface of the optical coupler to be parallel to the upper surface of the photonic integrated circuit.

6. The component coupling method according to claim 1, wherein: The optical fiber array component is further provided with a socket portion, and the integrated circuit component is further provided with a cover. When the holding mechanism holds the optical fiber array component and causes the optical coupler portion to adhere to the photonic integrated circuit, the socket portion is adhered to the cover portion via a second adhesive, and the second adhesive is cured after the strength value falls within the preset range.

7. The component coupling method according to claim 6, wherein: The first adhesive material is ultraviolet curing adhesive, and the second adhesive material is heat curing adhesive. The holding mechanism uses a curing component to irradiate the first adhesive material and the second adhesive material with ultraviolet light and laser light respectively to cure the first adhesive material and the second adhesive material.

8. The component coupling method according to claim 6, wherein: The shrinkage rate of the first adhesive after curing is smaller than that of the second adhesive after curing, and the strength of the second adhesive after curing is greater than that of the first adhesive after curing.

9. The component coupling method according to claim 6, wherein: The holding mechanism uses a first holding portion and a second holding portion spaced apart by a holding member to respectively absorb and hold the optical coupling portion and the socket portion of the optical fiber array element.

10. The component coupling method according to claim 1, wherein: Adjusting the posture of the optical fiber array element involves driving the retaining mechanism to cause the optical fiber array element to move linearly in a first direction, a second direction, and a third direction, wherein the first direction and the second direction are transverse, the third direction is longitudinal, and the first direction, the second direction, and the third direction are orthogonal to each other.

11. The component coupling method according to claim 1, wherein: Adjusting the posture of the optical fiber array element involves driving the retaining mechanism to cause the optical fiber array element to rotate about a first axis, a second axis, and a third axis; the first axis is parallel to a third direction, the second axis is parallel to a first direction, the third axis is parallel to a second direction, the first direction and the second direction are transverse, the third direction is longitudinal, and the first direction, the second direction, and the third direction are orthogonal to each other.

12. The component coupling method according to claim 1, wherein: The first axis, the second axis, and the third axis intersect each other at an axis point; the holding mechanism is driven to drive the optical fiber array element to rotate with the axis point as the rotation center.

13. A component coupling device, capable of executing the component coupling method according to any one of claims 1 to 12.

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