Monocrystal high-temperature alloy grinding machining plastic deformation layer thickness identification method and system

Abstract

The invention relates to the technical field of machining, and discloses a single-crystal high-temperature alloy grinding machining plastic deformation layer thickness identification method and system, and the method comprises the steps: collecting a port section image through the high-resolution imaging capability of a scanning electron microscope, and carrying out the preprocessing of the collected image, utilizing a Canny edge detection algorithm to accurately identify edge information in the image; performing crystal edge frame identification by using a Hough LinesP rectangular detection algorithm to calculate the crystal direction angle of each crystal in the image to distinguish the crystals in an undeformed area and a deformed area and the maximum depth value of the crystals in the corresponding area, and combining a preset crystal angle identification threshold value in a plastic deformation area after the single crystal high-temperature alloy material is ground and processed to identify the crystal edge frame of the single crystal high-temperature alloy material. And obtaining the thickness value of the plastic deformation area after the single-crystal high-temperature alloy material is ground. According to the method, the thickness value of the plastic deformation area of the ground single-crystal high-temperature alloy material can be accurately analyzed, and powerful technical support is provided for control and optimization of material machining quality.

Description

Technical Field

[0001] The invention relates to the technical field of mechanical processing and discloses a method and a system for identifying the thickness of a plastic deformation layer in grinding of a single crystal high-temperature alloy. Background Art

[0002] Single-crystal superalloys possess excellent high-temperature mechanical properties, significantly increasing the operating temperature of hot-end components in aircraft engines and improving engine efficiency. They have become one of the primary materials for aircraft engine turbine blades. However, the unique grain-boundary-free structure of these materials, while endowing them with exceptional high-temperature performance, also makes them susceptible to peculiar plastic deformation during machining. In particular, during precision grinding, the high-speed relative motion between the grinding wheel and the workpiece generates transient high temperatures and abnormal contact stresses in the contact area, inducing plastic deformation behaviors such as dynamic recovery, substructural evolution, and lattice distortion in the material surface, resulting in the formation of plastic deformation layers of varying thickness.

[0003] This microstructural degradation layer poses a serious threat to blade service reliability: micron-scale cracks easily initiate and propagate within the deformed area, forming fatigue crack sources along grain boundaries, ultimately leading to failure of the tenon-tooth connection or even blade fracture. Therefore, establishing an accurate method for measuring the thickness of the grinding deformation layer is crucial for optimizing machining parameters, controlling manufacturing quality, and predicting component life.

[0004] Currently, the industry mainly uses three detection methods: metallographic analysis uses destructive sampling to observe the structure. Although it can intuitively characterize the deformation morphology, it cannot achieve non-destructive testing; microhardness method indirectly infers the deformation depth through the change of hardness gradient, but the detection efficiency is low and the spatial resolution is insufficient; X-ray diffraction technology analyzes the degree of deformation based on lattice distortion, but the equipment is expensive and sensitive to surface roughness, which makes it difficult to meet the needs of complex surface detection. Summary of the Invention

[0005] The purpose of the present invention is to provide a method and system for identifying the thickness of the plastic deformation layer during grinding of single-crystal high-temperature alloy materials, which can accurately analyze the thickness value of the plastic deformation area after grinding of single-crystal high-temperature alloy materials, and provide strong technical support for the control and optimization of material processing quality.

[0006] In order to achieve the above technical effects, the technical solution adopted by the present invention is: The method for identifying the thickness of the plastic deformation layer during grinding of single crystal high-temperature alloys includes: Scanning electron microscope was used to collect cross-sectional images of the cut end of the single crystal superalloy material after grinding; Converting the port cross-sectional image into a grayscale image, and performing grid edge detection on the grayscale image using a Canny edge detection algorithm to obtain a weak edge curve on the grayscale image having a grayscale gradient less than a first preset gradient threshold, and a strong edge curve having a grayscale gradient greater than a second preset gradient threshold; wherein the first preset gradient threshold is less than the second preset gradient threshold; Using each of the strong edge curves as a backbone and anchor point, the weak edge curve segments connected to the corresponding strong edge curve are merged to form a complete and continuous grid border; The HoughLinesP rectangle detection algorithm is used to identify the grid borders in the grayscale image, and the direction angle is calculated according to the slope of the grid border line, and the average direction angle of all grid borders is calculated; Sort the identified grid center point depth values ​​in descending order of the direction angle, take the grid center point depth value corresponding to a first proportion value of the total number of identified grids as the minimum depth value of the plastic deformation layer during the grinding of the single crystal high-temperature alloy, and take the grid center point depth value corresponding to a second proportion value of the total number of identified grids as the maximum depth value of the plastic deformation layer during the grinding of the single crystal high-temperature alloy, wherein the first proportion value is less than the second proportion value; According to the minimum depth value of the plastic deformation layer, the maximum depth value of the plastic deformation layer, the average value of all grid direction angles and the preset crystal angle recognition threshold of the plastic deformation area of ​​the single crystal high-temperature alloy material after grinding, the thickness value of the plastic deformation area of ​​the single crystal high-temperature alloy material after grinding is analyzed and obtained.

[0007] Furthermore, after the port cross-section image is converted into a grayscale image, and before the Canny edge detection algorithm is used to perform grid edge detection on the grayscale image, a threshold algorithm is used to perform noise reduction preprocessing on the grayscale image.

[0008] Furthermore, when the HoughLinesP rectangle detection algorithm is used to identify the grid border in the grayscale image, the distance resolution in the HoughLinesP rectangle detection algorithm is 1 pixel, the angle resolution is 1 degree resolution, the accumulator threshold is 15 pixels, the minimum length of the line segment is 8 pixels, and the maximum allowable gap between points on the same straight line is 2 pixels.

[0009] Furthermore, when calculating the average value of all grid border angles, if the grid angle is greater than 90 degrees, 90 is subtracted to make the grid angle distribution between [0, 90°], and then the average value of all grid border angles is calculated.

[0010] Furthermore, the thickness of the plastic deformation area of ​​the single crystal high temperature alloy material after grinding is calculated based on The analysis obtained is the thickness of the plastic deformation area of ​​the single crystal high temperature alloy material after grinding, is the average value of all grid direction angles, It is the preset crystal angle recognition threshold of the plastic deformation area of ​​single crystal high temperature alloy material after grinding. The value is 15°. is the maximum depth of the plastic deformation layer, is the minimum depth value of the plastic deformation layer.

[0011] To achieve the above technical effects, the present invention also provides a system for identifying the thickness of a plastic deformation layer during grinding of a single crystal high-temperature alloy, comprising: An image acquisition module, used for acquiring a cross-sectional image of a port cut from a single crystal high-temperature alloy material after grinding using a scanning electron microscope; an edge curve processing module, configured to convert the port cross-sectional image into a grayscale image, perform grid edge detection on the grayscale image using a Canny edge detection algorithm, and obtain a weak edge curve on the grayscale image having a grayscale gradient less than a first preset gradient threshold, and a strong edge curve having a grayscale gradient greater than a second preset gradient threshold; wherein the first preset gradient threshold is less than the second preset gradient threshold; an edge contour processing module, configured to use each of the strong edge curves as a backbone and anchor point, and merge the weak edge curve segments connected to the corresponding strong edge curve to form a complete and continuous grid border; A direction angle analysis module is used to identify the grid borders in the grayscale image using the HoughLinesP rectangle detection algorithm, calculate the direction angle according to the slope of the grid border line, and calculate the average direction angle of all grid borders; a sorting and analysis module, configured to sort the identified grid center point depth values ​​in descending order of the direction angles, taking the grid center point depth value corresponding to a first proportion value of the total number of identified grids as the minimum depth value of the plastic deformation layer during the grinding process of the single crystal high-temperature alloy, and taking the grid center point depth value corresponding to a second proportion value of the total number of identified grids as the maximum depth value of the plastic deformation layer during the grinding process of the single crystal high-temperature alloy, wherein the first proportion value is less than the second proportion value; The thickness analysis module is used to analyze and obtain the thickness value of the plastic deformation area of ​​the single crystal high-temperature alloy material after grinding based on the minimum depth value of the plastic deformation layer, the maximum depth value of the plastic deformation layer, the average value of all grid direction angles, and the preset crystal angle recognition threshold of the plastic deformation area of ​​the single crystal high-temperature alloy material after grinding.

[0012] Furthermore, the edge curve processing module includes a preprocessing unit for converting the port cross-section image into a grayscale image and performing noise reduction preprocessing on the grayscale image using a threshold algorithm before performing grid edge detection on the grayscale image using a Canny edge detection algorithm.

[0013] Furthermore, in the directional angle analysis module, when the HoughLinesP rectangle detection algorithm identifies the grid border in the grayscale image, the distance resolution in the HoughLinesP rectangle detection algorithm is 1 pixel, the angle resolution is 1 degree resolution, the accumulator threshold is 15 pixels, the minimum length of the line segment is 8 pixels, and the maximum allowable gap between points on the same straight line is 2 pixels.

[0014] Furthermore, in the direction angle analysis module, when calculating the average direction angle of all grid frames, if the grid direction angle is greater than 90 degrees, 90 is subtracted so that the grid direction angle is distributed between [0, 90°], and then the average direction angle of all grid frames is calculated.

[0015] Furthermore, in the thickness analysis module, the thickness value of the plastic deformation area of ​​the single crystal high temperature alloy material after grinding is calculated based on The analysis obtained is the thickness of the plastic deformation area of ​​the single crystal high temperature alloy material after grinding, is the average value of all grid direction angles, It is the preset crystal angle recognition threshold of the plastic deformation area of ​​single crystal high temperature alloy material after grinding. The value is 15°. is the maximum depth of the plastic deformation layer, is the minimum depth value of the plastic deformation layer.

[0016] Compared with the existing technology, the beneficial effects of the present invention are: based on the advantages of surface detection technology of machine vision, the present invention analyzes the plastic deformation layer image of the surface of the single crystal high-temperature alloy material after grinding through machine vision methods and image processing algorithms, identifies the crystal orientation angles of each crystal in the image to distinguish the crystals in the undeformed area and the deformed area, as well as the maximum depth value of the crystal in the corresponding area, and combines the preset crystal angle recognition threshold of the plastic deformation area of ​​the single crystal high-temperature alloy material after grinding to accurately analyze the thickness value of the plastic deformation area of ​​the single crystal high-temperature alloy material after grinding, providing strong technical support for the control and optimization of material processing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a flow chart of the method for identifying the thickness of the plastic deformation layer during grinding of a single crystal high-temperature alloy in Example 1 or 2; Figure 2This is a structural block diagram of the plastic deformation layer thickness identification system for single crystal high-temperature alloy grinding in Example 1; Figure 3 This is the fracture cross-section microstructure diagram collected in Example 2; Figure 4 This is the microstructure image after Gaussian enhancement of the grayscale image in Example 2; Figure 5 This is the crystal direction identification result diagram in Example 2; Figure 6 The grid direction detection statistical histogram drawn in Example 2; Among them, 1. Image acquisition module; 2. Edge curve processing module; 201. Preprocessing unit; 3. Edge contour processing module; 4. Direction angle analysis module; 5. Sorting analysis module; 6. Thickness analysis module. DETAILED DESCRIPTION

[0018] The present invention will be described in further detail below with reference to the embodiments and accompanying drawings. However, this should not be construed as limiting the scope of the present invention to the following embodiments, as all technologies implemented based on the present invention fall within the scope of the present invention.

[0019] Example 1 See also Figure 1 and Figure 2 , a method for identifying the thickness of the plastic deformation layer during grinding of single crystal high-temperature alloys, including: Scanning electron microscope was used to collect cross-sectional images of the cut end of the single crystal superalloy material after grinding; Converting the port cross-sectional image into a grayscale image, and performing grid edge detection on the grayscale image using a Canny edge detection algorithm to obtain a weak edge curve on the grayscale image having a grayscale gradient less than a first preset gradient threshold, and a strong edge curve having a grayscale gradient greater than a second preset gradient threshold; wherein the first preset gradient threshold is less than the second preset gradient threshold; Using each of the strong edge curves as a backbone and anchor point, the weak edge curve segments connected to the corresponding strong edge curve are merged to form a complete and continuous grid border; The HoughLinesP rectangle detection algorithm is used to identify the grid borders in the grayscale image, and the direction angle is calculated according to the slope of the grid border line, and the average direction angle of all grid borders is calculated; Sort the identified grid center point depth values ​​in descending order of the direction angle, take the grid center point depth value corresponding to a first proportion value of the total number of identified grids as the minimum depth value of the plastic deformation layer during the grinding of the single crystal high-temperature alloy, and take the grid center point depth value corresponding to a second proportion value of the total number of identified grids as the maximum depth value of the plastic deformation layer during the grinding of the single crystal high-temperature alloy, wherein the first proportion value is less than the second proportion value; According to the minimum depth value of the plastic deformation layer, the maximum depth value of the plastic deformation layer, the average value of all grid direction angles and the preset crystal angle recognition threshold of the plastic deformation area of ​​the single crystal high-temperature alloy material after grinding, the thickness value of the plastic deformation area of ​​the single crystal high-temperature alloy material after grinding is analyzed and obtained.

[0020] In this embodiment, the high-resolution imaging capability of a scanning electron microscope is used to capture a cross-sectional image of the port to clearly reflect the microstructural characteristics of the material; the captured image is then preprocessed, converted into a grayscale image, and denoised, and the edge information in the image is accurately identified using the Canny edge detection algorithm; the HoughLinesP rectangle detection algorithm is then used to identify the crystal edge border to calculate the crystal orientation angle of each crystal in the image to distinguish between crystals in the undeformed area and the deformed area, as well as the maximum depth value of the crystal in the corresponding area, and combined with the preset crystal angle recognition threshold of the plastic deformation area of ​​the single crystal high-temperature alloy material after grinding, the thickness value of the plastic deformation area of ​​the single crystal high-temperature alloy material after grinding is accurately analyzed, providing strong technical support for the control and optimization of material processing quality.

[0021] Based on the same inventive concept, this embodiment also provides a system for identifying the thickness of a plastic deformation layer during grinding of a single crystal high-temperature alloy, comprising: Image acquisition module 1, used for acquiring a cross-sectional image of a port cut from a single crystal high-temperature alloy material after grinding using a scanning electron microscope; an edge curve processing module 2, configured to convert the port cross-section image into a grayscale image, perform grid edge detection on the grayscale image using a Canny edge detection algorithm, and obtain a weak edge curve on the grayscale image having a grayscale gradient less than a first preset gradient threshold, and a strong edge curve having a grayscale gradient greater than a second preset gradient threshold; wherein the first preset gradient threshold is less than the second preset gradient threshold; An edge contour processing module 3 is configured to use each of the strong edge curves as a backbone and anchor point, and merge the weak edge curve segments connected to the corresponding strong edge curve to form a complete and continuous grid border; Direction angle analysis module 4, used to identify the grid frame in the grayscale image using the HoughLinesP rectangle detection algorithm, calculate the direction angle according to the slope of the grid frame line, and calculate the average direction angle of all grid frames; a sorting and analysis module 5, configured to sort the identified grid center point depth values ​​in descending order of the direction angle, taking the grid center point depth value corresponding to a first proportion value of the total number of identified grids as the minimum depth value of the plastic deformation layer during the grinding process of the single crystal high-temperature alloy, and taking the grid center point depth value corresponding to a second proportion value of the total number of identified grids as the maximum depth value of the plastic deformation layer during the grinding process of the single crystal high-temperature alloy, wherein the first proportion value is less than the second proportion value; The thickness analysis module 6 is used to analyze and obtain the thickness value of the plastic deformation area of ​​the single crystal high-temperature alloy material after grinding based on the minimum depth value of the plastic deformation layer, the maximum depth value of the plastic deformation layer, the average value of all grid direction angles, and the preset crystal angle recognition threshold of the plastic deformation area of ​​the single crystal high-temperature alloy material after grinding.

[0022] The edge curve processing module 2 in this embodiment includes a preprocessing unit 201 for converting the port cross-section image into a grayscale image and performing noise reduction preprocessing on the grayscale image using a threshold algorithm before performing grid edge detection on the grayscale image using a Canny edge detection algorithm.

[0023] Example 2 See also Figure 1 , a method for identifying the thickness of the plastic deformation layer during grinding of single crystal high-temperature alloys, including: Step 1: Using a scanning electron microscope to collect a cross-sectional image of the end of the single crystal high-temperature alloy material after grinding; In this embodiment, after the surface roughness Ra of the single crystal high-temperature alloy material after grinding is controlled to be no greater than 2.4 μm, it is observed by a scanning electron microscope; before observation, the single crystal high-temperature alloy material to be observed needs to be placed in the central area of ​​the sample area of ​​the scanning electron microscope through electrical tape, facing the electron gun; the appropriate voltage is set in the controller to make the field of view clear and bright, and the spot size is adjusted to make the resolution above 500×400; then, the three steps of magnification, fine focusing, and astigmatism correction are repeated until the image magnification meets the requirements and the image is clear, and the collected port cross-section image is saved by the computer as shown in FIG. Figure 3 shown.

[0024] Step 2: converting the port cross-section image into a grayscale image, and performing noise reduction preprocessing on the grayscale image using a threshold algorithm to obtain a preprocessed image; 2.1 First, convert the image into a grayscale image using the OpenCV cvtcolor algorithm. If the image saved by the scanning electron microscope is a grayscale image, you can skip this step. Alternatively, you can calculate the grayscale value of each pixel using the following formula:

[0025] Where, For image Grayscale of the sample at each pixel; 、 and Pixel RGB values, 、 and is the grayscale weight corresponding to the RGB value. In this embodiment, it is recommended to select is 0.299, is 0.587, It is 0.114.

[0026] 2.2 In order to further improve the image recognition effect, this embodiment also uses the GaussianBlur algorithm of OpenCV to perform Gaussian enhancement on the grid boundaries in the image. It is recommended to select a Gaussian kernel size of 5×5 and a control parameter sigmax of 0. The enhanced image is as follows Figure 4 shown.

[0027] 2.3 Perform adaptive threshold processing through the threshold algorithm. Dynamically calculate the threshold according to the local characteristics of different areas of the image to eliminate the impact of uneven lighting. The recommended grayscale threshold is 180-255.

[0028] Step 3: Performing grid edge detection on the grayscale image using a Canny edge detection algorithm to obtain a weak edge curve on the grayscale image whose grayscale gradient is less than a first preset gradient threshold, and a strong edge curve whose grayscale gradient is greater than a second preset gradient threshold; wherein the first preset gradient threshold is less than the second preset gradient threshold; In this embodiment, the image is refined by using the Canny algorithm of OpenCV. It is recommended to select the first preset gradient threshold (i.e., the grayscale threshold for weak edge detection) as 50 and the second preset gradient threshold (i.e., the grayscale threshold for strong edge detection) as 150.

[0029] Step 4: Using each of the strong edge curves as a backbone and anchor point, merge the weak edge curve segments connected to the corresponding strong edge curve to form a complete and continuous grid border.

[0030] Step 5: Use the HoughLinesP rectangle detection algorithm to identify the grid borders in the grayscale image, calculate the direction angle according to the slope of the grid border line, and calculate the average value of the direction angles of all grid borders; In this embodiment, the fine edge borders of the crystal in the image are detected by the HoughLinesP rectangle detection algorithm of OpenCV after the refined edge detection. The recommended distance resolution of the HoughLinesP rectangle detection algorithm is 1 pixel, the angle resolution is 1 degree resolution, the accumulator threshold is 15 pixels, the minimum length of the line segment is 8 pixels, and the maximum allowable gap between points on the same straight line is 2 pixels. The crystal direction recognition result is shown in the figure below. Figure 5 shown.

[0031] In this embodiment, the directions of the identified grids are calculated and counted to draw a grid direction detection statistical histogram (e.g. Figure 6 ), if the recognition result is greater than 90 degrees, subtract 90 to make the angle distribution between [0, 90°], and then take the average value of all grid direction angles Calculation of the angle average As the crystal orientation of the undeformed area of ​​single crystal high-temperature alloy material after grinding.

[0032] Step 6: Sort the identified grid center point depth values ​​in descending order of the direction angle, take the grid center point depth value corresponding to the first proportion value of the total number of identified grids as the minimum depth value of the plastic deformation layer of the single crystal high temperature alloy grinding process, and take the grid center point depth value corresponding to the second proportion value of the total number of identified grids as the maximum depth value of the plastic deformation layer of the single crystal high temperature alloy grinding process, wherein the first proportion value is less than the second proportion value; In this embodiment, the longitudinal depth value of the central area position of each identified crystal is recorded. And sort them from largest to smallest, the largest The value is , Next, and so on. Record the number of crystals identified as , determine the depth threshold of the undeformed area , and the deformation region coordinate threshold The second ratio value is recommended to be selected , the first ratio value is recommended to be selected .

[0033] Step 7: Analyze and obtain the thickness of the plastic deformation area of ​​the single crystal high-temperature alloy material after grinding based on the minimum depth value of the plastic deformation layer, the maximum depth value of the plastic deformation layer, the average value of all grid direction angles, and a preset crystal angle recognition threshold of the plastic deformation area of ​​the single crystal high-temperature alloy material after grinding; In this embodiment, the thickness of the plastic deformation area of ​​the single crystal high temperature alloy material after grinding is calculated based on The analysis obtained is the thickness of the plastic deformation area of ​​the single crystal high temperature alloy material after grinding, is the average value of all grid direction angles, It is the preset crystal angle recognition threshold of the plastic deformation area of ​​single crystal high temperature alloy material after grinding. The value is 15°. is the maximum depth of the plastic deformation layer, is the minimum depth value of the plastic deformation layer.

[0034] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A method for identifying the thickness of the plastic deformation layer during grinding of a single crystal high-temperature alloy, characterized in that: include: Scanning electron microscope was used to collect cross-sectional images of the cut end of the single crystal superalloy material after grinding; Converting the port cross-sectional image into a grayscale image, performing grid edge detection on the grayscale image using a Canny edge detection algorithm, and obtaining a weak edge curve on the grayscale image whose grayscale gradient is less than a first preset gradient threshold, and a strong edge curve whose grayscale gradient is greater than a second preset gradient threshold; wherein the first preset gradient threshold is less than the second preset gradient threshold; Using each of the strong edge curves as a backbone and anchor point, the weak edge curve segments connected to the corresponding strong edge curve are merged to form a complete and continuous grid border; The HoughLinesP rectangle detection algorithm is used to identify the grid borders in the grayscale image, and the direction angle is calculated according to the slope of the grid border line, and the average direction angle of all grid borders is calculated; Sort the identified grid center point depth values ​​in descending order of the direction angle, take the grid center point depth value corresponding to a first proportion value of the total number of identified grids as the minimum depth value of the plastic deformation layer during the grinding of the single crystal high-temperature alloy, and take the grid center point depth value corresponding to a second proportion value of the total number of identified grids as the maximum depth value of the plastic deformation layer during the grinding of the single crystal high-temperature alloy, wherein the first proportion value is less than the second proportion value; According to the minimum depth value of the plastic deformation layer, the maximum depth value of the plastic deformation layer, the average value of all grid direction angles and the preset crystal angle recognition threshold of the plastic deformation area of ​​the single crystal high-temperature alloy material after grinding, the thickness value of the plastic deformation area of ​​the single crystal high-temperature alloy material after grinding is analyzed and obtained.

2. The method for identifying the thickness of the plastic deformation layer during grinding of a single crystal high-temperature alloy according to claim 1, characterized in that: After converting the port cross-section image into a grayscale image, and before performing grid edge detection on the grayscale image using the Canny edge detection algorithm, a threshold algorithm is used to perform noise reduction preprocessing on the grayscale image.

3. The method for identifying the thickness of the plastic deformation layer during grinding of a single crystal high-temperature alloy according to claim 1, characterized in that: When using the HoughLinesP rectangle detection algorithm to identify the grid border in the grayscale image, the distance resolution in the HoughLinesP rectangle detection algorithm is 1 pixel, the angle resolution is 1 degree, the accumulator threshold is 15 pixels, the minimum length of the line segment is 8 pixels, and the maximum allowable gap between points on the same straight line is 2 pixels.

4. The method for identifying the thickness of the plastic deformation layer during grinding of a single crystal high-temperature alloy according to claim 1, wherein: When calculating the average value of all grid border angles, if the grid angle is greater than 90 degrees, subtract 90 degrees to make the grid angle distribution between [0, 90 degrees], and then calculate the average value of all grid border angles.

5. The method for identifying the thickness of the plastic deformation layer during grinding of a single crystal high-temperature alloy according to claim 4, characterized in that: The thickness of the plastic deformation area after grinding of single crystal high temperature alloy material is calculated based on The analysis obtained is the thickness of the plastic deformation area of ​​the single crystal high temperature alloy material after grinding, is the average value of all grid direction angles, It is the preset crystal angle recognition threshold of the plastic deformation area of ​​single crystal high temperature alloy material after grinding. The value is 15°. is the maximum depth of the plastic deformation layer, is the minimum depth value of the plastic deformation layer.

6. The system for identifying the thickness of the plastic deformation layer during grinding of single crystal high-temperature alloys is characterized by: include: An image acquisition module, used for acquiring a cross-sectional image of a port cut from a single crystal high-temperature alloy material after grinding using a scanning electron microscope; an edge curve processing module, configured to convert the port cross-sectional image into a grayscale image, perform grid edge detection on the grayscale image using a Canny edge detection algorithm, and obtain a weak edge curve on the grayscale image whose grayscale gradient is less than a first preset gradient threshold, and a strong edge curve whose grayscale gradient is greater than a second preset gradient threshold; wherein the first preset gradient threshold is less than the second preset gradient threshold; an edge contour processing module, configured to use each of the strong edge curves as a backbone and anchor point, and merge the weak edge curve segments connected to the corresponding strong edge curve to form a complete and continuous grid border; A direction angle analysis module is used to identify the grid borders in the grayscale image using the HoughLinesP rectangle detection algorithm, calculate the direction angle according to the slope of the grid border line, and calculate the average direction angle of all grid borders; a sorting and analysis module, configured to sort the identified grid center point depth values ​​in descending order of the direction angles, taking the grid center point depth value corresponding to a first proportion value of the total number of identified grids as the minimum depth value of the plastic deformation layer during the grinding process of the single crystal high-temperature alloy, and taking the grid center point depth value corresponding to a second proportion value of the total number of identified grids as the maximum depth value of the plastic deformation layer during the grinding process of the single crystal high-temperature alloy, wherein the first proportion value is less than the second proportion value; The thickness analysis module is used to analyze and obtain the thickness value of the plastic deformation area of ​​the single crystal high-temperature alloy material after grinding based on the minimum depth value of the plastic deformation layer, the maximum depth value of the plastic deformation layer, the average value of all grid direction angles, and the preset crystal angle recognition threshold of the plastic deformation area of ​​the single crystal high-temperature alloy material after grinding.

7. The system for identifying the thickness of plastic deformation layer during grinding of single crystal high temperature alloy according to claim 6, characterized in that: The edge curve processing module includes a preprocessing unit for converting the port cross-section image into a grayscale image and performing noise reduction preprocessing on the grayscale image using a threshold algorithm before performing grid edge detection on the grayscale image using a Canny edge detection algorithm.

8. The system for identifying the thickness of plastic deformation layer during grinding of single crystal high temperature alloy according to claim 6, characterized in that: In the directional angle analysis module, when the HoughLinesP rectangle detection algorithm identifies the grid border in the grayscale image, the distance resolution in the HoughLinesP rectangle detection algorithm is 1 pixel, the angle resolution is 1 degree, the accumulator threshold is 15 pixels, the minimum length of the line segment is 8 pixels, and the maximum allowable gap between points on the same straight line is 2 pixels.

9. The system for identifying the thickness of plastic deformation layer during grinding of single crystal high temperature alloy according to claim 6, characterized in that: In the direction angle analysis module, when calculating the average direction angle of all grid frames, if the grid direction angle is greater than 90 degrees, 90 is subtracted so that the grid direction angle is distributed between [0, 90°], and then the average direction angle of all grid frames is calculated.

10. The system for identifying the thickness of plastic deformation layer during grinding of single crystal high temperature alloy according to claim 9, characterized in that: In the thickness analysis module, the thickness value of the plastic deformation area of ​​the single crystal high temperature alloy material after grinding is based on The analysis obtained is the thickness of the plastic deformation area of ​​the single crystal high temperature alloy material after grinding, is the average value of all grid direction angles, It is the preset crystal angle recognition threshold of the plastic deformation area of ​​single crystal high temperature alloy material after grinding. The value is 15°. is the maximum depth of the plastic deformation layer, is the minimum depth value of the plastic deformation layer.

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