Display panel and display device

Abstract

The invention discloses a display panel and a display device, and the display panel comprises an array substrate which comprises a first surface and a second surface which are oppositely arranged in a direction perpendicular to a light-emitting surface of the display panel, and a side surface which is connected with the first surface and the second surface; the first bonding pad is located on the first surface, and the second bonding pad is located on the second surface; the connecting wire is at least partially positioned on the side surface and is used for connecting the first bonding pad and the second bonding pad; the connecting wires comprise a first wire and a second wire; the first wire comprises a first area, the second wire comprises a second area, the first area and the second area are arranged along a first direction, and the first direction is intersected with the extension direction of the connecting wire; wherein the height of the first area is greater than that of the second area. By means of the scheme, reliable connection of the connection wires and the connection wires and the bonding pads can be guaranteed, effective transmission of signals is further guaranteed, and stability and reliability of image display are improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] A borderless tiled display is a display that uses technology to eliminate or reduce the borders between tiled screens, achieving a seamless effect. This borderless design offers a smoother visual experience and is ideal for large-screen displays and tiled displays. When multiple screens are joined together, the borderless design makes the seams virtually invisible, creating a more complete and coherent large-screen image.

[0003] For borderless tiled displays, the manufacturing process typically involves cutting and edging. After the substrate is edged, side routing is fabricated. During this process, due to process yield limitations, peeling can easily occur when the side routing overlaps the M4 metal layer on the front of the display array. This can lead to poor connection between the side routing and the side signal lead-out pads, such as a weak connection or slight disconnection. This can result in poor signal transmission, impacting the display quality. Summary of the Invention

[0004] The present application provides a display panel and a display device to ensure effective transmission of signals on the display panel and guarantee product quality.

[0005] In one aspect, an embodiment of the present application provides a display panel, comprising:

[0006] An array substrate comprising a first surface and a second surface arranged opposite to each other in a direction perpendicular to a light emitting surface of the display panel, and a side surface connecting the first surface and the second surface;

[0007] a first solder pad and a second solder pad, the first solder pad is located on the first surface, and the second solder pad is located on the second surface;

[0008] A connecting trace, at least partially located on the side, for connecting the first pad and the second pad; the connecting trace includes a first trace and a second trace; the first trace includes a first area, the second trace includes a second area, the first area and the second area are arranged along a first direction, and the first direction intersects with an extension direction of the connecting trace; wherein,

[0009] The height of the first region is greater than the height of the second region.

[0010] On the other hand, an embodiment of the present application further provides a display device, including a display panel.

[0011] The display panel and display device provided by the present application, in order to address the situation where the display panel connecting traces themselves are disconnected or the connecting traces and the lead-out pads are poorly overlapped, a reinforcement structure is formed by conductive material in the poorly overlapped area, and the two ends of the disconnected traces are connected through the reinforcement structure, or the pads with poor overlap are connected to the connecting traces, thereby acting as a bridge, ensuring the reliable connection of the connecting traces, or the connecting traces and the pads, thereby ensuring the effective transmission of signals and improving the stability and reliability of image display.

[0012] Furthermore, a reinforcement structure can be formed by using a variety of conductive materials and processes, facilitating applications in different scenarios and process conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without any creative work.

[0014] Figure 1 This is a structural schematic diagram of the front side of the display panel provided in an embodiment of the present application;

[0015] Figure 2 This is a structural schematic diagram of the back side of the display panel provided in an embodiment of the present application;

[0016] Figure 3 yes Figure 1 An AA-direction cross-sectional view of the display panel shown;

[0017] Figure 4 yes Figure 1 A B1-B1 cross-sectional view of the display panel shown;

[0018] Figure 5 yes Figure 1 A B2-B2 cross-sectional view of the display panel shown;

[0019] Figure 6 yes Figure 1 A CC cross-sectional view of the display panel shown;

[0020] Figure 7 yes Figure 1 Another B1-B1 cross-sectional view of the display panel shown;

[0021] Figure 8 yes Figure 1 Another B2-B2 cross-sectional view of the display panel shown;

[0022] Figure 9 This is a structural front view of the first wiring and the second wiring in the display panel provided by an embodiment of the present application;

[0023] Figure 10 This is another structural front view of the first wiring in the display panel provided by an embodiment of the present application;

[0024] Figure 11 This is another structural front view of the first wiring in the display panel provided by an embodiment of the present application;

[0025] Figure 12 This is a top view of the structure of the first wiring in the display panel provided by an embodiment of the present application;

[0026] Figure 13 yes Figure 1 Another B1-B1 cross-sectional view of the display panel shown;

[0027] Figure 14 yes Figure 1 Another B1-B1 cross-sectional view of the display panel shown;

[0028] Figure 15 This is a schematic structural diagram of a display device provided in an embodiment of the present application;

[0029] Figure 16 This is another structural schematic diagram of the display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0031] In order to address the problem that the connecting trace itself is disconnected or the connecting trace and the corresponding lead-out pad are poorly overlapped, which can easily lead to instability or complete failure of the corresponding signal transmission function of the connecting trace, the embodiments of the present application provide a display panel and a display device, which form a reinforcement structure on the connecting trace, and use the reinforcement structure to bridge the two ends of the disconnected connecting trace or the connecting trace and the pad to ensure effective signal transmission.

[0032] like Figure 1 , which is a structural diagram of a display panel provided in an embodiment of the present application, Figure 2 is a structural schematic diagram of the back side of the display panel provided in an embodiment of the present application. Figure 3 yes Figure 1An AA cross-sectional view of the display panel shown, Figure 4 yes Figure 1 A B1-B1 cross-sectional view of the display panel shown, Figure 5 yes Figure 1 A B2-B2 cross-sectional view of the display panel shown, Figure 6 yes Figure 1 A CC cross-sectional view of the display panel shown.

[0033] Referring to the above schematic diagrams, the display panel 100 provided in the embodiment of the present application includes:

[0034] The array substrate 10 includes a first surface F1 and a second surface F2, which are arranged opposite each other in a direction perpendicular to the light-emitting surface of the display panel 100, and a side surface connecting the first surface F1 and the second surface F2. The first surface F1 may be a surface on which a pixel circuit including a plurality of light-emitting elements 20 is disposed. Accordingly, the second surface F2 is the back surface, i.e., the non-luminous surface.

[0035] The side surface may include a first side surface S1 and a second side surface S2. In some embodiments, the first side surface S1 and the second side surface S2 may be provided with or without a connecting line L0. The connecting line L0 includes a first line L1 and a second line L2. For example, Figure 4 and Figure 5 The first side surface S1 of the array substrate 10 is shown. Figure 4 yes Figure 1 A B1-B1 cross-sectional view of the display panel is shown, where a trace L1 is provided on the first side surface S1. Figure 5 yes Figure 1 In a B2 - B2 cross-sectional view of the display panel shown, a second trace L2 is provided on the first side surface S1 . Figure 6 yes Figure 1 A CC cross-sectional view of the display panel shown shows the second side surface S2 of the array substrate 10 , on which no connecting trace L0 is provided.

[0036] The display panel 100 also includes a first pad P1 and a second pad P2, the first pad P1 is located on the first surface F1, and the second pad P2 is located on the second surface F2; the first pad P1 is used to connect to the signal line in the first surface F1, for example, to the data line DL, and transmit the data signal to the data line DL through the first pad P1, and the second pad P2 located on the second surface F2 can be electrically connected to the control chip or the flexible circuit board, for example. In this way, the control circuit and the like can be set on the back side of the display panel 100, so that it does not need to occupy the space on the front side of the display panel 100, which is conducive to realizing an extremely narrow frame or a frameless design of the display panel 100, meeting the splicing requirements of large-size display products.

[0037] In the display panel 100 provided in the embodiment of the present application, the connecting line L0 is at least partially located on the first side surface S1, and the connecting line L0 is used to connect the first pad P1 and the second pad P2 to achieve electrical connection between the signal line located on the first surface F1 and the second pad P2 located on the second surface F2, thereby achieving electrical connection between the signal line on the first surface F1 and the control chip or the flexible circuit board.

[0038] It should be noted that Figure 1 The rectangular display panel 100 is used as an example for illustration. The embodiment of the present application does not limit the actual shape of the display panel 100. In some other embodiments, the display panel 100 can also be any other feasible shape such as a circle or a rounded rectangle.

[0039] Optionally, the display panel 100 provided in this embodiment can be a display panel using inorganic light-emitting diode display technology, such as a Micro LED display panel, a Mini LED display panel, etc. This type of display panel has the advantages of high brightness, low power consumption, and easy splicing, and is widely used in display products.

[0040] Figure 1 In the display panel 100 shown, only the arrangement of the light-emitting elements 20 of the pixel circuit in the display panel 100 is exemplarily described, and the actual arrangement and quantity of the light-emitting elements 20 are not limited. For example, the light-emitting elements can be evenly arranged on the first surface F1 of the array substrate 10.

[0041] Figure 1 The data lines DL and the gate signal lines SL in the display panel 100, as well as the connection between the data lines DL and the first pads P1, are shown together, but the number of data lines DL and first pads P1 actually included in the display panel 100 is not limited. In some embodiments of the present application, the data lines DL may be connected to the first pads P1 directly, or may be connected to the first pads P1 through a multiplexing unit to reduce the number of first pads P1. This is not specifically limited in the embodiments of the present application.

[0042] Figure 3 The film structure of the array substrate 10 and the connection between the array substrate 10 and the light emitting element 20 are schematically illustrated.

[0043] Reference Figure 3 The array substrate 10 includes a substrate 101 and an array layer 102 disposed on the substrate 101. A plurality of transistors are disposed in the array layer 102. Optionally, the gates of the transistors are disposed on a first metal layer M1, and the sources and drains of the transistors are disposed on a second metal layer M2. The array substrate 10 also includes a semiconductor layer SC disposed on the side of the first metal layer M1 facing the substrate 101, and an auxiliary metal layer M0 disposed on the side of the semiconductor layer SC facing the substrate 101.

[0044] It should be noted that the display panel 100 may include a transistor with a single-gate structure, in which case the gate may be located in the first metal layer M1, or the gate may be located in the auxiliary metal layer M0; the display panel 100 may also include a transistor with a dual-gate structure, in which case one of the gates of the transistor may be located in the first metal layer M1, and the other gate may be located in the auxiliary metal layer M0.

[0045] Along a direction perpendicular to the plane of the substrate 101 , the first metal layer M1 and the auxiliary metal layer M0 overlap with the semiconductor layer SC. The auxiliary metal layer M0 also has a light shielding function to prevent light from affecting the semiconductor layer SC.

[0046] Optionally, a capacitor metal layer MC may be further included between the first metal layer M1 and the second metal layer M2 , and the capacitor metal layer MC may form a capacitor structure with the second metal layer M2 .

[0047] Optionally, a third metal layer M3 and a fourth metal layer M4 may be included on the side of the second metal layer M2 facing away from the substrate 101. Both the third metal layer M3 and the fourth metal layer M4 may be used to route signal lines. For example, in some embodiments, the connection electrodes P01 and P02 for the light-emitting element 20 on the array substrate 10 are located on the fourth metal layer M4, and the first pad P1 is also located on the fourth metal layer M4.

[0048] Optionally, an inorganic film layer may be provided on the side of the fourth metal layer M4 facing away from the substrate 101 as needed to protect the connection electrode, which is not specifically limited in the embodiment of the present application.

[0049] It should be noted that Figure 3 Only the film layer structure of the array substrate 10 and the connection between the array substrate 10 and the light emitting element 20 are illustrated, and the actual number and size of the film layers of the array substrate are not limited.

[0050] Also refer to Figure 1 、 Figure 4 and Figure 5 , the first line L1 includes a first area Ls1, such as Figure 4 The area occupied by the first line L1 in the first dotted box; the second line L2 includes the second area Ls2, such as Figure 5 The area occupied by the second trace L2 in the second dotted box. The first area Ls1 and the second area Ls2 are arranged along a first direction D1, which intersects with the extension direction D2 of the connecting trace L0; wherein the height of the first area is greater than the height of the second area.

[0051] The first region Ls1 and the second region Ls2 are located on any one or more of the following surfaces: the side surface, the first surface F1, and the second surface F2. In some embodiments, the first region Ls1 and the second region Ls2 are located on the side surface, such as Figure 4 and Figure 5 As shown in FIG, the first region Ls1 and the second region Ls2 are located on the first side surface S1.

[0052] In some embodiments, the first region Ls1 and the second region Ls2 are located on the first surface F1 or the second surface F2. Figure 7 and Figure 8 As shown in FIG, the first region Ls1 and the second region Ls2 are located on the first surface F1.

[0053] In order to more clearly illustrate the difference in structure between the first line L1 and the second line L2 in the connecting line L0, the following will be combined with Figures 9 to 12 The structure of the first line L1 and the second line L2 in the connecting line L0 in the display panel provided by the embodiment of the present application is further exemplified.

[0054] Reference Figure 9 ,in, Figure 9 (a) shows a structure of the first area Ls1 of the first line L1. Figure 9 (b) shows a structure of the second area Ls2 corresponding to the second line L2. It should be noted that the present embodiment does not limit the material, width, and other characteristics of the first line L1 and the second line L2. These characteristics can be the same or different, and the first line L1 and the second line L2 are connected.

[0055] The first region Ls1 of the first trace L1 includes a first conductive portion R1 and a reinforcement structure R′ located above the first conductive portion R1 . The second region Ls2 of the second trace L2 includes a second conductive portion R2 . The first conductive portion R1 and the second conductive portion R2 are located in the same layer.

[0056] In some embodiments, the first conductive portion R1 includes a first end R11 and a second end R12, and an opening L10 located between the first end R11 and the second end R12. The opening L10 overlaps with the reinforcement structure R', and the first end R11 and the second end R12 are connected by the reinforcement structure R'.

[0057] Borderless spliced ​​displays require side wiring design. However, during the side wiring production process, due to process yield limitations, the side wiring may become disconnected or slightly disconnected. In this case, the above-mentioned structure can be used to repair it. The above-mentioned reinforcement structure R' can electrically connect the first end R11 and the second end R12 on both sides of the opening L10. The reinforcement structure R' acts as a bridge, connecting the first end R11 and the second end R12 of the first conductive portion R1 through the reinforcement structure R', thereby ensuring the reliability of signal transmission on the side wiring.

[0058] The reinforcement structure R' may be formed of a conductive material, and the conductive material includes but is not limited to any one of the following: conductive paste, conductive ink, etc.

[0059] The reinforcement structure R' can be formed by, but is not limited to, any of the following methods: spraying, printing, pad printing, dispensing, etc.

[0060] Depending on the adopted process, the specific structural shapes of the reinforcement structure R' may also vary.

[0061] For example, in some embodiments, the reinforcement structure R' may be a convex structure. The shape of the convex structure may be Figure 9 and Figure 10 Moreover, the edge of the circular protrusion can be in a rounded state, such as Figure 9 As shown in ; or the edge of the circular protrusion is parallel to the connecting line L1, as shown in Figure 10 As shown in FIG. The shape of the protrusion structure can also be Figure 11 The square protrusion shown.

[0062] For another example, in some embodiments, the reinforcement structure R' can also be a strip structure, such as Figure 12 As shown. There can be one or more strip structures, and multiple strip structures can be distributed in parallel and spaced apart. The widths of different strip structures can be the same or different, which is not limited in this embodiment of the application.

[0063] It should be noted that in the structures of the connecting lines L0 in the above-mentioned embodiments, the first region Ls1 of the first line L1 and the second region Ls2 of the second line L2 may be located on at least one side surface of the display panel, and / or the first surface F1, and / or the second surface F2, and this is not limited in the present embodiment. Furthermore, the present embodiment does not limit the size of the above-mentioned opening L10.

[0064] One end of the reinforcement structure R' overlaps the first end R11 of the first conductive portion R1, and the other end of the reinforcement structure R' overlaps the second end R12 of the first conductive portion R1. In addition, part of the reinforcement structure R' is also covered on the array substrate 10, and part of the area can be covered on the side of the array substrate 10, such as Figure 4 or a portion of the area may be covered on the first surface F1 of the array substrate 10, as shown; Figure 7 or a partial area may be covered on the second surface F2 of the array substrate 10 .

[0065] It should be noted that in order to prevent the reinforcement structure R' from affecting the adjacent lines of the first line L1, when manufacturing the reinforcement structure R', the minimum distance between the edge of the reinforcement structure R' and the adjacent lines of the first line L1 can be controlled, for example, the minimum distance can be controlled to be greater than 10um to avoid short circuits with the adjacent lines. Figure 7 As shown, when the reinforcement structure R' is located on the first surface F1 of the array substrate 10, the height of the reinforcement structure R' is lower than the height of the light-emitting elements. That is, the surface of the reinforcement structure R' away from the array substrate 10 is lower than the surface of the light-emitting elements away from the array substrate 10, thereby preventing the mass transfer of the light-emitting elements from being affected.

[0066] In some embodiments, the display panel 10 further includes a connection structure, such as a teardrop connection structure, a cross connection structure, etc., and the first pad P1 and the first trace L1 are connected via the connection structure, and the connection structure may include the aforementioned reinforcement structure R'. For example, if the connection structure has a virtual connection or a slight disconnection, the aforementioned reinforcement structure R' may be added to the connection structure to achieve a reliable connection between the first pad P1 and the first trace L1.

[0067] In some embodiments, the display panel 100 may further include a packaging structure that covers at least the side of the array substrate 10 and is at least used to package the side of the array substrate 10 to prevent the influence of water, oxygen, etc. on the array substrate 10, wherein the packaging structure located on the first side S1 is different from the packaging structure located on the second side S2.

[0068] Figure 4 、 Figure 5 、 Figure 7 and Figure 8 The film layer and packaging structure at the position of the first side surface S1 of the array substrate 10, Figure 6 The main difference between the film layer and packaging structure at the second side S2 of the array substrate 10 is that the first side S1 is provided with a connecting line L0, and the second side S2 is not provided with a connecting line L0, and the packaging structure corresponding to the first side S1 is different from the packaging structure corresponding to the second side S2.

[0069] In this embodiment, the package structure on the first side S1 refers to a package structure provided on the first side S1 along a direction parallel to the first and second sides F1, F2, and perpendicular to the side of the substrate 101, and directed outward from the substrate 101. The package structure on the second side S2 refers to a package structure provided on the second side S2 along a direction parallel to the first and second sides F1, F2, and perpendicular to the side of the substrate 101, and directed outward from the substrate 101.

[0070] In the embodiment of the present application, the packaging structure at the position of the first side surface S1 is different from the packaging structure at the position of the second side surface S2. For example, for the first side surface S1 where the connecting trace L0 is provided, if the connecting trace L0 is affected by external moisture, oxygen, etc., corrosion and other problems may occur, affecting the reliability of signal transmission on the connecting trace L0. Therefore, the first side surface S1 has higher packaging requirements. Therefore, a packaging structure with higher packaging reliability can be provided at the position corresponding to the first side surface S1, such as Figure 4 、 Figure 5 、 Figure 7 and Figure 8 The first packaging structure 61 in the embodiment; for the second side surface S2 where the connecting trace L0 is not provided, its packaging requirement is lower than that of the first side surface S1, so there is no need to over-protect the second side surface S2, while ensuring effective packaging of the second side surface S2 and avoiding the introduction of unnecessary packaging film layers, so as to simplify the packaging process of the second side surface S2 and reduce the production cost, such as Figure 6 The second packaging structure 62 in FIG.

[0071] In some embodiments, the differentiated design of the first encapsulation structure 61 corresponding to the first side surface S1 and the second encapsulation structure 62 corresponding to the second side surface S2 can include different numbers of encapsulation layers, with the first encapsulation structure 61 including more encapsulation layers than the second encapsulation structure 62. For example, the first encapsulation structure 61 can include a trace encapsulation layer 601 (such as an insulating adhesive layer) and a filling encapsulation layer 602; the second encapsulation structure 62 can include only the filling encapsulation layer 602.

[0072] Continue to refer to Figures 4 to 8 The display panel 100 may further include a first light-shielding layer 30 and a light-transmitting layer 40 located on the first surface F1, the first light-shielding layer 30 is at least partially located between adjacent light-emitting elements 20, and the light-transmitting layer 40 is located on the side of the first light-shielding layer 30 away from the first surface F1 and covers the light-emitting elements 20 and at least part of the first light-shielding layer 30; the filling encapsulation layer 602 contacts the side surfaces of the first light-shielding layer 30 and the light-transmitting layer 40.

[0073] It should be noted that, in addition to being located in the area between adjacent light-emitting elements 20, the first light-shielding layer 30 can also be located directly below the light-emitting element 20 to cover the electrode of the light-emitting element 20 and avoid the problem of metal reflection from the electrode of the light-emitting element 20. The first light-shielding layer 30 can be used to block the metal film layer on the array substrate 10 to avoid the problem of metal reflection. Moreover, the first light-shielding layer 30 does not cover the upper surface of the light-emitting element 20, thereby avoiding affecting the light output of the light-emitting element 20. In some embodiments, the upper surface of the first light-shielding layer 30 may be lower than the upper surface of the light-emitting element 20, or the upper surface of the first light-shielding layer 30 may be flush with the upper surface of the light-emitting element 20.

[0074] The display panel 100 may further include a light-transmitting layer 40 on the side of the light-emitting element 20 and the first light-shielding layer 30 facing away from the first surface F1. The light-transmitting layer 40 can be used to encapsulate the light-emitting element 20 to prevent moisture and oxygen from entering, and at the same time, a flat surface can be formed on the side of the light-emitting element 20 facing away from the first surface F1.

[0075] When the height of the upper surface of the filling encapsulation layer 602 is greater than the height of the upper surface of the light-emitting element 20, the filling encapsulation layer 602 can contact the side surfaces of the first light-shielding layer 30 and the light-transmitting layer 40 respectively, and can cover the side interface area of ​​the first light-shielding layer 30 and the light-transmitting layer 40, thereby preventing external moisture and oxygen from infiltrating from the interface area between the two, thereby helping to improve the overall encapsulation effect of the filling encapsulation layer 602 on the display panel.

[0076] In some embodiments, the upper surface of the filling encapsulation layer 602 may be flush with or lower than the upper surface of the light emitting element 20 .

[0077] In actual production, the filling packaging layer 602 is produced after the first light-shielding layer 30 is produced. When the upper surface of the packaging filling layer 602 does not exceed the upper surface of the first light-shielding layer 30, the first light-shielding layer 30 can be used as a positioning reference for producing the filling packaging layer 602, which is conducive to simplifying the production difficulty of the filling packaging layer 602 and simplifying the overall production process of the display panel.

[0078] It should be noted that Figures 4 to 8 The array layer 101 in the array substrate 10 is not shown in detail. The connection relationship between the array layer 102 and the light emitting element 20 can be referred to in detail. Figure 3 .

[0079] In some embodiments, the second wiring L2, the first wiring L1 and the reinforcement structure R' are at least partially covered with the first light shielding layer 30, such as Figure 4 and Figure 6 shown.

[0080] In some embodiments, the second line L2, the first line L1 and the reinforcement structure R' may be covered with the above-mentioned encapsulation layer. For example, the first line L1 and the reinforcement structure R' are at least partially covered with the above-mentioned line encapsulation layer 601. Figure 13 and Figure 14 shown.

[0081] Reference Figure 13 and Figure 14 , Figure 13 and Figure 14 They are Figure 1 A B1-B1 cross-sectional view of the display panel shown.

[0082] An opening L20 is defined on the trace packaging layer 601 , and the reinforcement structure R′ is at least partially located within the opening L20 .

[0083] In some embodiments, the opening 120 on the trace packaging layer 601 may have one, such as Figure 13 The bottom of the opening 120 is connected to the first trace L1. Accordingly, a portion of the reinforcement structure R' is covered on the trace packaging layer 601, and the reinforcement structure R' is respectively connected to the first pad P1 and the first trace L1.

[0084] In other embodiments, there may be two openings 102 on the wiring packaging layer 601, such as Figure 14 As shown in FIG. The bottom of one opening connects to the first end R11 of the first conductive portion R1 in the first region Ls1, while the bottom of the other opening connects to the second end R12 of the first conductive portion R1. Accordingly, a portion of the reinforcement structure R' is overlaid on the trace packaging layer 601 and connects the first end R11 and the second end R12, respectively.

[0085] For example, during the manufacturing process of the display panel 100, after the side trace L0 is encapsulated by the trace encapsulation layer 601, the connection between the side trace L0 and the first pad P1 or the side trace 10 itself is disconnected or peeled off. A hole can be opened on the surface of the trace encapsulation layer 601 corresponding to the poorly overlapped area of ​​the side trace 10. After the hole is opened, the two ends of the side lead L0 under the trace encapsulation layer 601 with poor overlap are exposed, and then a reinforcement structure R' is manufactured to connect the two ends with poor overlap. At this time, a part of the reinforcement structure R' covers the trace encapsulation layer 601.

[0086] like Figure 13 In the example shown, the reinforcement structure R' at least partially covers the trace packaging layer 601 and connects to the first pad P1. The reinforcement structure R' at least partially penetrates into an opening L20 and connects to the first trace L1 until the bottom of the opening L20.

[0087] like Figure 14In the example shown, a portion of the reinforcement structure R' covers the trace packaging layer 601, and another portion of the reinforcement structure R' penetrates into the two openings L20 and respectively reaches the bottom of the openings L20 and connects with the first end R11 and the second end R12 of the first conductive portion R1 in the first region Ls1 of the first trace L1.

[0088] It should be noted that the opening structure on the wiring encapsulation layer 601 is also applicable to the first light shielding layer 30 and the light-transmitting layer 40 , and this embodiment of the present application does not limit this.

[0089] Through the above structure, after the display panel is packaged at different stages, if a side wiring break is detected, it can be effectively repaired to ensure the reliability of the side wiring and improve the stability and reliability of the display panel image.

[0090] The side connection traces of a borderless tiled display typically include upper and lower side traces. The upper side traces typically include power signal traces PVDD (positive voltage) and PVEE (negative voltage), while the lower side traces typically include power signal traces PVDD (positive voltage) and PVEE (negative voltage), drive signal traces GOA (Gate Driven on Array) and RFE (reference signal), and data signal traces DATA.

[0091] The reinforcement structures R' in the display panels and display devices provided in the embodiments of the present application can be applied to various types of side traces described above, either on their own or when poor connections between side traces and corresponding lead pads are present. Furthermore, the location of the side traces is not limited and can be at least partially located on one or more side surfaces. Accordingly, the side traces can have one or more of the aforementioned reinforcement structures R'.

[0092] Based on the same inventive concept, an embodiment of the present application further provides a display device, which includes the display panel 100 provided in any one of the above embodiments.

[0093] In some embodiments, the display device provided in the embodiments of the present application can be any electronic device with a display function, such as a mobile terminal, notebook, tablet computer, computer, wearable device, vehicle-mounted display device, etc., and is particularly suitable for electronic devices with special-shaped transparent display panels, which is not specifically limited in this application.

[0094] like Figure 15 , which is a schematic structural diagram of a display device provided in an embodiment of the present application.

[0095] The display device 200 provided in the embodiment of the present application includes at least two display panels 100 spliced ​​along a first direction D1; the first side surface S1 is located on at least one side of the display panel 100 along the first direction D1; and / or the first side surface S1 is located on at least one side of the display panel 100 along the first direction D2. The first direction D1 and the second direction D2 intersect perpendicularly and represent different splicing directions of the display panels 100.

[0096] Accordingly, the connection line is at least partially located on at least one first side surface S1 of the display panel 100 along the first direction; and / or the connection line is at least partially located on the display panel 100 along the extension direction, i.e. Figure 13 At least one side surface in the second direction D2.

[0097] for example, Figure 15 In the illustrated example, each display panel 100 includes a left edge and a right edge extending along the second direction D2 and disposed opposite each other along the first direction D1. The first side surface S1 of each display panel 100 may be located on a side of the second side surface S2 opposite thereto, facing the right edge of the display panel. The connection traces are at least partially located on one or more of the first side surfaces S1.

[0098] like Figure 16 , which is a schematic structural diagram of another display device provided in an embodiment of the present application.

[0099] In this example, the display device 200 includes four display panels 100 spliced ​​along a first direction D1 and a second direction D2. Each display panel 100 includes two first side surfaces S1 opposite to each other. The two first side surfaces S1 are arranged on the display panel 100 extending along the first direction D1 and having upper and lower edges opposite to each other along the second direction D2.

[0100] Accordingly, the connection traces are at least partially located on one or more of the first side surfaces S1 .

[0101] It should be noted that, during actual splicing, the arrangement directions of the first side surfaces CM1 in different display panels can be flexibly set according to actual conditions, and the embodiment of the present application does not impose any specific limitation on this.

[0102] in addition, Figure 15 and Figure 16 The display device 200 is illustrated only in a rectangular structure. In some other embodiments of the present application, the display device 200 may also be in other shapes, such as circular, elliptical, or any other feasible shape, which is not specifically limited in the embodiments of the present application.

[0103] The display device 200 provided in the embodiment of the present application has the beneficial effects of the display panel 100 provided in the embodiment of the present application. For details, please refer to the detailed description of the display panel 100 in the above embodiments, which will not be repeated in this embodiment.

[0104] It should be understood that in the description of the embodiments of this application, the term "and / or" is merely a description of the association relationship between associated objects, indicating that three relationships can exist. For example, "A and / or B" can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document indicates that the associated objects are in an "or" relationship.

[0105] In addition, the orientation or position relationship indicated by terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", and "circumferential" are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present application.

[0106] In addition, the terms "first" and "second" are used for descriptive purposes only, and are only used to illustrate and distinguish the objects being described. There is no order, and they cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated, and cannot constitute any limitation on the embodiments of this application. Therefore, the features defined as "first" and "second" can explicitly or implicitly include at least one of such features. In the description of the embodiments of this application, the meaning of "multiple" is at least two, for example, two, three, etc., unless otherwise clearly and specifically defined.

[0107] In the embodiments of this application, unless otherwise specified or limited, terms such as "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections, electrical connections, or communication between them; direct connections, indirect connections through an intermediate medium, and internal connections between two components or interactions between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0108] In the embodiments of the present application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, a first feature being "above," "above," and "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0109] In the embodiments of the present application, if the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" appear, it means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.

[0110] Although the embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application. Any person skilled in the art may make changes, modifications, substitutions, and variations to the above embodiments without departing from the spirit and scope of the present application.

Claims

1. A display panel, characterized in that: include: An array substrate comprising a first surface and a second surface arranged opposite to each other in a direction perpendicular to the light emitting surface of the display panel, and a side surface connecting the first surface and the second surface; a first pad and a second pad, wherein the first pad is located on the first surface, and the second pad is located on the second surface; A connecting trace, at least partially located on the side surface, for connecting the first pad and the second pad; the connecting trace includes a first trace and a second trace; the first trace includes a first area, the second trace includes a second area, the first area and the second area are arranged along a first direction, and the first direction intersects with the extension direction of the connecting trace; wherein, The height of the first region is greater than the height of the second region.

2. The display panel according to claim 1, wherein: The first region includes a first conductive part and a reinforcement structure located above the first conductive part, the second region includes a second conductive part, and the first conductive part and the second conductive part are in the same layer.

3. The display panel according to claim 2, wherein: The first area and the second area are located on any one or more of the following surfaces: the side surface, the first surface, and the second surface; The first conductive portion includes a first end portion and a second end portion, and an opening located between the first end portion and the second end portion; The opening overlaps with the reinforcement structure, and the first end portion and the second end portion are connected by the reinforcement structure.

4. The display panel according to claim 3, wherein: One end of the reinforcement structure overlaps the first end portion, and the other end of the reinforcement structure overlaps the second end portion.

5. The display panel according to claim 2, wherein: The first area and the second area are located on the first surface; the display panel includes a connection structure, the first pad and the first trace are connected via the connection structure, and the connection structure includes the reinforcement structure.

6. The display panel according to claim 5, wherein: It also includes a light-emitting element electrically connected to the array substrate and located on the first surface; the height of the reinforcement structure is lower than the height of the light-emitting element.

7. The display panel according to claim 2, wherein: The reinforcement structure is formed of a conductive material, and the conductive material includes any one of the following: conductive paste and conductive ink.

8. The display panel according to claim 2, wherein: The reinforcement structure is formed by any one of the following methods: spraying, printing, pad printing, and dispensing.

9. The display panel according to claim 2, wherein: The reinforcement structure is a convex structure or a strip structure.

10. The display panel according to claim 9, wherein: The protrusion structure is a circular protrusion or a square protrusion.

11. The display panel according to claim 10, wherein: The edge of the circular protrusion is in a smooth state, or is parallel to the connecting line.

12. The display panel according to claim 9, wherein: There are multiple strip structures, which are distributed in parallel and at intervals.

13. The display panel according to claim 3, wherein: The minimum distance between the edge of the reinforcement structure and the adjacent wiring of the connecting wiring is greater than 10 μm.

14. The display panel according to claim 13, wherein: Part of the reinforcement structure is covered on the array substrate.

15. The display panel according to claim 14, wherein: The first wiring and the reinforcement structure are further covered with a packaging layer.

16. The display panel according to claim 15, wherein: The packaging layer is provided with an opening, and the reinforcement structure is at least partially located in the opening.

17. The display panel according to claim 16, wherein: There are two openings, the bottom of one opening is connected to the first end, and the bottom of the other opening is connected to the second end; A partial area of ​​the reinforcement structure is covered on the packaging layer.

18. The display panel according to any one of claims 15 to 17, wherein: The packaging layer includes: a routing packaging layer and a filling packaging layer, and at least a portion of the routing packaging layer is located between the connecting routing and the filling packaging layer.

19. The display panel according to claim 18, wherein: Also includes: a light-emitting element electrically connected to the array substrate and located on the first surface, a light-shielding layer, and a light-transmitting layer; the light-shielding layer is at least partially located between adjacent light-emitting elements, and the light-transmitting layer is located on a side of the light-shielding layer facing away from the first surface and covers the light-emitting elements and at least a portion of the light-shielding layer; The filling encapsulation layer is in contact with side surfaces of the light shielding layer and the light transmitting layer.

20. The display panel according to claim 19, wherein Also includes: a protective layer, the protective layer being located on a side of the light-transmitting layer facing away from the first surface; The filling packaging layer is located on a side of the protection layer facing the array substrate.

21. The display panel according to claim 20, wherein: Also includes: A side blackening layer is provided, wherein at least a portion of the side blackening layer is located on a side of the filling encapsulation layer away from the side surface.

22. The display panel according to claim 1, wherein The side surfaces include a first side surface and a second side surface; the connecting trace is at least located on the first side surface, and the packaging structures of the first side surface and the second side surface are different.

23. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 22.

24. The display device according to claim 23, wherein: The display device includes at least two spliced ​​display panels; The connecting line is at least partially located on at least one side of the display panel along the first direction; and / or the connecting line is at least partially located on at least one side of the display panel along the extension direction; the first direction and the extension direction intersect perpendicularly and are different splicing directions of the display panel.

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