Inductor assembly, filtering module and electronic equipment
The combined structure of differential common-mode integrated inductors and air core inductors solves the problem of large board area occupied by the filter module, achieving the effect of reducing board area and improving integration while maintaining performance.
Patent Information
- Application Number
- CN202410334097.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-22
- Publication Date
- 2025-09-23
AI Technical Summary
The existing technology is difficult to reduce the board area of the filter module while meeting the filtering performance and lightning protection performance, resulting in a decrease in the integration of the inductor component.
A combined structure of differential common-mode integrated inductors and air core inductors is adopted. By integrating the common-mode inductors and differential-mode inductors into differential common-mode integrated inductors and stacking them with air core inductors, the board area of the inductor components is reduced while maintaining or improving the inductance.
On the premise of meeting the filtering performance and lightning protection performance, the board area of the inductor components and filter modules is reduced, and the integration and miniaturization capability of the filter modules are improved.
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Figure CN120690564A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of filtering technology, and in particular to an inductor component, a filtering module and an electronic device. Background Art
[0002] Wireless base station products, such as remote radio units (RRUs) and multiple-input multiple-output (MIMO) systems, typically have internal filter modules, which may include decoupling inductors, common-mode inductors, and differential-mode inductors. These inductors work together to provide cored common-mode inductance, cored differential-mode inductance, and air-core inductance, thereby providing lightning protection and filtering. With the development of wireless base station products, power supply power has increased year by year, placing higher demands on the performance of filter modules. Consequently, the board area occupied by filter modules has also increased.
[0003] To increase power density, the filter module's footprint needs to be reduced. This is typically achieved by miniaturizing the decoupling, common-mode, and differential-mode inductors. However, this reduces the inductance of each inductor, making it difficult to achieve the desired filtering and lightning protection performance of the filter module.
[0004] Therefore, how to reduce the board area of the filter module while meeting the filtering performance and lightning protection performance of the filter module is a technical problem that needs to be solved urgently. Summary of the Invention
[0005] In order to solve the above technical problems, the present application provides an inductor component, a filter module and an electronic device, which can reduce the board area of the inductor component while meeting the filtering performance and lightning protection performance of the filter module, thereby reducing the occupied area of the filter module, thereby improving the integration of the filter module and better supporting the miniaturization evolution.
[0006] In the first aspect of the present application, an inductor component is provided, comprising: an air core inductor and a differential common mode integrated inductor. A magnetic core window is formed on the differential common mode integrated inductor. The differential common mode integrated inductor may refer to an inductor that can simultaneously perform differential mode filtering and common mode filtering. When the inductor component is applied to a filter module, the differential common mode integrated inductor can provide core common mode inductance, core differential mode inductance and air core inductance, and the air core inductor can provide air core inductance. Thus, the differential common mode integrated inductor and the air core inductor can work together to provide sufficient core common mode inductance, core differential mode inductance and air core inductance, thereby achieving filtering performance and lightning protection performance of the filter module.
[0007] Regarding the structure of an air core inductor, in one possible embodiment, the air core inductor includes a printed circuit board (PCB) winding, the PCB winding including a PCB board and a first winding disposed on the PCB board, and a differential common mode integrated inductor is fixed to the PCB board, with the projection of the differential common mode integrated inductor on the PCB board overlapping with the first winding. In other words, the differential common mode integrated inductor and the air core inductor are stacked in a direction perpendicular to the PCB board. When the filter module is applied to an electronic device, the PCB board can be fixed within the housing of the electronic device as the circuit board of the filter module and connected to the switching power supply in the electronic device. Therefore, the board area of the PCB board is the board area occupied by the inductor component and the filter module. Compared with the technical solution of fixing the decoupling inductor, common-mode inductor and differential-mode inductor separately on the circuit board, the present application integrates the common-mode inductor and the differential-mode inductor into a differential common-mode integrated inductor, and stacks the differential common-mode integrated inductor and the air core inductor, thereby reducing the PCB board area of the air core inductor, thereby reducing the board area occupied by the inductor component, and further reducing the board area occupied by the filter module. Therefore, the present application can reduce the board area occupied by the inductor component while meeting the filtering performance and lightning protection performance of the filter module, thereby reducing the occupied area of the filter module, thereby improving the integration of the filter module and better supporting the miniaturization evolution.
[0008] In another possible embodiment, the inductor assembly further includes a circuit board. That is, in this embodiment, the inductor assembly includes a circuit board, an air core inductor and a differential common mode integrated inductor. The air core inductor includes a three-dimensional winding, and the three-dimensional winding and the differential common mode integrated inductor are both fixed on the circuit board, and the three-dimensional winding is located in the magnetic core window. In this way, the total board area occupied by the three-dimensional winding and the differential common mode integrated inductor is the same as the board area occupied by the differential common mode integrated inductor. Compared with the technical solution of fixing the decoupling inductor, common mode inductor and differential mode inductor on the circuit board respectively, the present application integrates the common mode inductor and the differential mode inductor into a differential common mode integrated inductor, and arranges the three-dimensional inductor in the magnetic core window of the differential common mode integrated inductor, thereby reducing the board area of the circuit board, thereby reducing the board area occupied by the inductor assembly and the filter module. Therefore, the present application can reduce the occupied area of the inductor assembly and the filter module while meeting the filtering performance and lightning protection performance of the filter module, thereby improving the integration of the filter module and better supporting the miniaturization evolution.
[0009] When the air-core inductor includes a PCB winding, the first winding and the differential common-mode integrated inductor are located on the same side of the PCB, with a gap between the first winding and the differential common-mode integrated inductor perpendicular to the PCB. In a specific configuration, solder pads can be provided on the surface of the PCB where the first winding is located, and the ports of the differential common-mode integrated inductor can be connected to the solder pads, thereby facilitating electrical connection between the differential common-mode integrated inductor and the PCB. Furthermore, the solder pads on the PCB and the first winding can be manufactured in the same process, thereby improving the ease of manufacturing the inductor assembly.
[0010] Furthermore, one side of the PCB includes a first area and a second area, with the second area surrounding the first area. The first winding is located in the first area, and the differential and common-mode integrated inductors are fixed to the second area, with their projections on the PCB covering those of the air-core inductors. This fully utilizes the PCB surface area, further reducing the area occupied by the inductor assembly and, consequently, the filter module.
[0011] Regarding the number of layers of the PCB winding, in one possible embodiment, the air core inductor includes multiple layers of PCB windings stacked in sequence, and the differential common mode integrated inductor is arranged on the PCB board of the top layer of PCB windings. The first windings of each two adjacent layers of PCB windings are connected. In this way, the first end of the first winding in the bottom layer of PCB windings can serve as the first end of the air core inductor, and the second end of the first winding of the top layer of PCB windings that is not connected to other layers of PCB windings can serve as the second end of the air core inductor. Since the inductance is positively correlated with the number of layers of PCB windings, when the air core inductor includes multiple layers of PCB windings, the air core inductance provided by the air core inductor can be increased. Moreover, the stacked multiple layers of PCB windings do not increase the board area of the PCB board. Therefore, this solution can increase the air core inductance while keeping the board area of the inductor component unchanged. In another possible embodiment, the air core inductor may include a single layer of PCB windings.
[0012] Furthermore, with respect to the number of first windings in the PCB winding, in one possible embodiment, the PCB winding may include multiple first windings, each of which has the same winding direction, and the first ends of each first winding are connected, as well as the second ends of each first winding. Thus, when current passes through the air core inductor, it can enter each first winding from the first end, flow through each first winding, and then exit from the second end of each first winding. Multiple first windings can provide greater inductance. Furthermore, the current flowing through each first winding is more similar in magnitude, meaning that the current is more evenly distributed across each first winding, further improving the air core inductance.
[0013] Furthermore, the length of each first winding is the same, thereby making the current flowing through each first winding more uniform, thereby further increasing the air core inductance provided by the air core inductor.
[0014] In another possible implementation, the PCB winding may include a first winding. In order to increase the air core inductance generated by the first winding, the cross-sectional size of the first winding may be increased.
[0015] In some embodiments, the PCB board includes a first board surface and a second board surface relative to each other; the first winding includes multiple parallel first conductive wires, multiple parallel second conductive wires and multiple parallel third conductive wires, the multiple first conductive wires are all arranged on the first board surface, the multiple second conductive wires are all arranged on the second board surface, the projections of the first conductive wires on the second board surface intersect with the second conductive wires, the multiple third conductive wires pass through from the first board surface to the second board surface, and each third conductive wire connects a first conductive wire and a second conductive wire.
[0016] Regarding the structure of a differential common-mode integrated inductor, in one possible embodiment, the differential common-mode integrated inductor includes a base, a first magnetic core, a second magnetic core, a second winding, and a third winding. The first magnetic core and the second magnetic core are parallel, the second winding is wound around the first magnetic core, and the third winding is wound around the second magnetic core. A magnetic core window is formed between the second and third windings, and the winding direction of the second winding is opposite to that of the third winding. The direction of the magnetic field generated within the first magnetic core is opposite to that of the magnetic field generated within the second magnetic core, thereby forming a common magnetic circuit structure. As a result, the differential common-mode integrated inductor can provide cored common-mode inductance and cored differential-mode inductance.
[0017] When the air-core inductor includes a PCB winding, the axial directions of the first and second magnetic cores are both parallel to the PCB. This allows the magnetic fields generated by the second and third windings of the differential-common-mode integrated inductor to be parallel to the PCB, while the magnetic field generated by the first winding of the air-core inductor is perpendicular to the PCB. This means that the magnetic fields generated by the differential-common-mode integrated inductor and the air-core inductor are orthogonal, thus preventing cross-linking and the effects of mutual inductance, which in turn prevents any degradation in filtering effectiveness due to mutual inductance.
[0018] When the air core inductor includes a three-dimensional winding, in one example, the axial direction of the first magnetic core and the axial direction of the second magnetic core are both perpendicular to the axial direction of the three-dimensional winding. In this way, the direction of the magnetic field generated by the second winding and the third winding of the differential common mode integrated inductor is parallel to the circuit board, while the direction of the magnetic field generated by the three-dimensional winding is perpendicular to the circuit board. In other words, the magnetic field generated by the differential common mode integrated inductor is orthogonal to the magnetic field generated by the air core inductor, thereby avoiding cross-linkage, thereby avoiding the influence of mutual inductance, and further avoiding the reduction of filtering effect due to mutual inductance. In another example, the axial direction of the first magnetic core and the axial direction of the second magnetic core are both parallel to the axial direction of the three-dimensional winding.
[0019] Regarding the structure of a differential common-mode integrated inductor, in another possible embodiment, the differential common-mode integrated inductor includes a first magnetic ring, a second magnetic ring disposed outside the first magnetic ring with a gap therebetween, a second winding, and a third winding. The surface of the second magnetic ring includes a connected third region and a fourth region. The second winding is wound around the third region, and the third winding is wound around the fourth region. The second and third windings are wound in opposite directions. Thus, the differential common-mode integrated inductor with this structure can also form a common magnetic circuit structure, thereby enabling the differential common-mode integrated inductor to provide both cored common-mode inductance and cored differential-mode inductance.
[0020] When the air-core inductor includes a PCB winding, the axial directions of the first and second magnetic rings are both perpendicular to the PCB. This allows the magnetic fields generated by the second and third windings of the differential-common-mode integrated inductor to be parallel to the PCB, while the magnetic field generated by the first winding of the air-core inductor is perpendicular to the PCB. In other words, the magnetic fields generated by the differential-common-mode integrated inductor and the air-core inductor are orthogonal, thus preventing cross-linking and mutual inductance, which in turn prevents any degradation in filtering effectiveness due to mutual inductance.
[0021] When the air-core inductor includes a three-dimensional winding, the axial directions of the first and second magnetic rings are both perpendicular to the axial directions of the three-dimensional winding. This allows the magnetic fields generated by the second and third windings of the differential common-mode integrated inductor to be parallel to the circuit board, while the magnetic field generated by the three-dimensional winding is perpendicular to the circuit board. In other words, the magnetic fields generated by the differential common-mode integrated inductor are orthogonal to those generated by the air-core inductor, thus avoiding cross-linkage and the effects of mutual inductance, which in turn prevents any reduction in filtering effectiveness due to mutual inductance.
[0022] In some embodiments of the present application, the differential and common-mode integrated inductor further includes a magnetic conductive structure, a portion of which is connected to the interior of the first magnetic ring and a portion of which is connected between the first and second magnetic rings. The second and third windings are respectively located on either side of the magnetic conductive structure. The magnetic conductive structure has a low magnetic permeability, thereby conducting the magnetic circuit generated by the second winding and the magnetic circuit generated by the third winding, thereby increasing the cored differential-mode inductance provided by the differential and common-mode integrated inductor.
[0023] Furthermore, the magnetic conductive structure includes at least two first magnetic conductive bodies and a second magnetic conductive body. Each first magnetic conductive body is connected between the first magnetic ring and the second magnetic ring, and the second magnetic conductive body is connected inside the first magnetic ring. The two first magnetic conductive bodies are located in opposite directions of the second magnetic conductive body. This improves the magnetic circuit conduction function, thereby further increasing the core differential mode inductance provided by the differential common mode integrated inductor.
[0024] Furthermore, both the first magnetic conductor and the second magnetic conductor may comprise magnetic adhesive, so that the first magnetic ring and the second magnetic ring can be bonded together by the magnetic adhesive.
[0025] Regarding the number of ports of the inductor component, in one possible embodiment, the inductor component includes four ports, wherein the first end of the third winding of the differential common mode integrated inductor is connected to the first end of the air core inductor, the second end of the second winding of the differential common mode integrated inductor, the first end and the second end of the third winding serve as three ports of the inductor component respectively, and the second end of the air core inductor serves as one of the ports of the inductor component.
[0026] In another possible embodiment, the inductor assembly includes six ports. The first end and the second end of the second winding of the differential common mode integrated inductor, as well as the first end and the second end of the third winding, respectively serve as four of the ports of the inductor assembly, and the first end and the second end of the air core inductor respectively serve as two of the ports of the inductor assembly.
[0027] In a second aspect of the present application, a filter module is provided, comprising a protective device and an inductor assembly according to any of the above embodiments, wherein the protective device is fixed to a PCB or circuit board of the inductor assembly. The filter module can achieve all the effects of the inductor assembly.
[0028] In a third aspect of the present application, an electronic device is provided, comprising a housing and the aforementioned filter module, wherein the filter module is fixed in the housing. The electronic device can achieve all the effects of the filter module. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.
[0030] Figure 1 A circuit diagram of the connection between the filter module and the switching power supply in the related art;
[0031] Figure 2 for Figure 1 Schematic diagram of the structure of the differential mode inductor;
[0032] Figure 3a Common mode interference signal flows through Figure 1 Schematic diagram of the direction of the magnetic flux generated by the first winding and the second winding when the common mode inductor is in;
[0033] Figure 3b The differential mode current flows through Figure 1 Schematic diagram of the direction of the magnetic flux generated by the first winding and the second winding when the common mode inductor is in;
[0034] Figure 4 for Figure 1 Side view of;
[0035] Figure 5 for Figure 1 Current variation curve of the filter module under surge or impact in the illustrated embodiment;
[0036] Figure 6 This is a schematic structural diagram of the inductor assembly in the first embodiment of the present application;
[0037] Figure 7 for Figure 6 Side view of;
[0038] Figure 8 for Figure 6 A top view of
[0039] Figure 9 For application Figure 6 The circuit diagram of the filter module of the inductor component shown;
[0040] Figure 10 for Figure 6 A schematic diagram of a first structural embodiment of an air core inductor in the illustrated embodiment;
[0041] Figure 11 for Figure 6 A schematic diagram of a second structure of an air core inductor in the embodiment shown;
[0042] Figure 12 for Figure 6 A schematic diagram of a third structure of an air core inductor in the illustrated embodiment;
[0043] Figure 13 for Figure 6 A schematic diagram of a fourth structure of an air core inductor in the illustrated embodiment;
[0044] Figure 14 For Figure 10 The current distribution diagram of the air core inductor shown is obtained after the current distribution is tested;
[0045] Figure 15This is a current distribution diagram obtained after testing the current distribution of an air-core inductor including a first winding in a PCB winding;
[0046] Figure 16 for Figure 10 A comparison chart of the air core inductances obtained after testing the air core inductances of the air core inductor shown and the air core inductor including a first winding in the PCB winding;
[0047] Figure 17 for Figure 6 A schematic structural diagram of a differential and common mode integrated inductor in the embodiment shown;
[0048] Figure 18 For Figure 6 A schematic diagram of magnetic flux distribution obtained after testing the magnetic field generated by the differential and common-mode integrated inductor in the inductor assembly of the illustrated embodiment;
[0049] Figure 19 For Figure 6 A schematic diagram of the magnetic flux distribution obtained after testing the magnetic field generated by the air core inductor in the inductor assembly of the illustrated embodiment;
[0050] Figure 20 This is a schematic structural diagram of an inductor assembly in the second embodiment of the present application;
[0051] Figure 21 For application Figure 20 The circuit diagram of the filter module of the inductor component shown;
[0052] Figure 22 This is a schematic structural diagram of an inductor assembly in a third embodiment of the present application;
[0053] Figure 23 This is a schematic structural diagram of an inductor assembly in a fourth embodiment of the present application;
[0054] Figure 24 for Figure 23 A top view of
[0055] Figure 25 for Figure 23 Top view of;
[0056] Figure 26 The following is a comparison chart of the core common mode inductance obtained after testing the core common mode inductance provided by three filter modules with different structures;
[0057] Figure 27 The following is a comparison chart of the core differential mode inductance obtained after testing the core differential mode inductance provided by three filter modules with different structures;
[0058] Figure 28The air core differential mode inductance comparison chart is obtained after testing the air core differential mode inductance provided by three filter modules with different structures;
[0059] Figure 29 For including Figure 9 The back-end freewheeling comparison chart is obtained after testing the back-end freewheeling effect of the filter module of the inductor assembly with air core differential mode inductance of 1.08uH and 3.03uH;
[0060] Figure 30 This is a schematic structural diagram of an inductor assembly in a fifth embodiment of the present application;
[0061] Figure 31 for Figure 30 The schematic diagram of the structure of the inductor component and the second conductive line at the same viewing angle is shown;
[0062] Figure 32 for Figure 30 Schematic diagram of the positional relationship among the first conductive line, the second conductive line and the third conductive line of the inductor component shown.
[0063] Icons: 100-filter module; 200-switching power supply; 1-protection device; 2-capacitor; 3-inductor component; 301-decoupling inductor; 302-differential mode inductor; 3021-magnetic core; 3022-winding; 303-common mode inductor; 3031-magnetic core; 3032-first winding; 3033-second winding; 31-air core inductor; 311-PCB winding; 3111-PCB board; 3112-first winding; 3113-first board surface; 3114-second board surface; 3115-first conductive Wire; 3116-second conductive wire; 3117-third conductive wire; 312-gap; 32-differential common-mode integrated inductor; 321-base; 3211-connecting plate; 322-first magnetic core; 323-second magnetic core; 324-second winding; 325-third winding; 326-first magnetic ring; 327-second magnetic ring; 3271-third area; 3272-fourth area; 328-magnetic conductive structure; 3281-first magnetic conductor; 3282-second magnetic conductor; 329-magnetic core window; 33-circuit board. DETAILED DESCRIPTION
[0064] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.
[0065] The term "and / or" in this article is merely a description of the association relationship of associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural. The character " / " generally indicates that the objects associated before and after are in an "or" relationship. "At least one (item)" refers to one or more, and "plurality" refers to two or more. "At least one of the following items" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b or c can represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.
[0066] In the description and claims of the embodiments of this application, the terms "first" and "second" are used to distinguish different objects, rather than to describe a specific order of objects. For example, the terms "first target object" and "second target object" are used to distinguish different objects, rather than to describe a specific order of objects.
[0067] "Connected", "connected" and similar words are used to express the intercommunication or interaction between different components, which may include direct connection or indirect connection through other components. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, including a series of steps or units. The method, system, product or device is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices. "Up", "down", "left", "right" and the like are only used with respect to the orientation of the components in the drawings. These directional terms are relative concepts. They are used for description and clarification relative to the description, which may change accordingly according to the change in the orientation of the components in the drawings.
[0068] In the embodiments of this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be interpreted as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.
[0069] In the description of the embodiments of this application, unless otherwise specified, "multiple" means two or more. For example, "multiple processing units" means two or more processing units; "multiple systems" means two or more systems.
[0070] The following is an explanation of the professional terms designed in this application:
[0071] Decoupling: Prevents the current shock generated in the power supply circuit when the current size of the front and rear circuits changes from affecting the normal operation of the product.
[0072] Filtering: Filter out specific frequency bands in the received signal.
[0073] Differential mode interference signal: an unwanted potential difference between any two current-carrying conductors.
[0074] Common-mode interference signal: an unwanted potential difference between any current-carrying conductor and the reference ground.
[0075] Surge: A peak value that instantly exceeds the stable value, including surge voltage and surge current.
[0076] Inrush current: A large current generated inside a load when power is supplied to it.
[0077] Magnetic induction intensity: also known as magnetic flux density or magnetic flux density, it is a physical quantity that represents the magnetic flux passing through a standard area, with the symbol B.
[0078] Magnetization: A vector field representing the permanent or induced dipole magnetic moment of a magnetic material, usually represented by the symbol M.
[0079] Magnetic field strength: In a magnetic medium, if the magnetic induction intensity of a point is B and the magnetization intensity is M, the magnetic field strength of the point is defined as: H = B / μ0-M or B = μ0(H+M), where μ0 is the absolute magnetic permeability of vacuum.
[0080] Magnetic permeability: The degree of magnetization of a material in linear response to an external magnetic field. It is divided into absolute magnetic permeability and relative magnetic permeability. Absolute magnetic permeability is equal to the ratio of magnetic induction intensity B to magnetic field intensity H. The absolute magnetic permeability of vacuum is 4π×10 -7 H / m; relative permeability is the ratio of the absolute permeability of a substance to the absolute permeability of a vacuum. For common materials, magnetic permeability usually refers to relative permeability.
[0081] Core inductance: When the inductor has a magnetic core (relative magnetic permeability > 1), the ratio of the voltage induced in the conductor to the rate of change of the current that produces the voltage.
[0082] Air core inductance: The ratio of the voltage induced in the conductor to the rate of change of the current that produces the voltage when the inductor has no magnetic core (relative magnetic permeability = 1).
[0083] Magnetic flux: In a uniform magnetic field with a magnetic induction intensity of B, assuming a plane with an area of S and perpendicular to the direction of the magnetic field, the product of the magnetic induction intensity B and the area S is the magnetic flux passing through the plane, referred to as magnetic flux.
[0084] Magnetic Circuit: A closed loop containing magnetic flux. Typically contains portions of materials with relative magnetic permeability greater than 1, such as permanent magnets, ferromagnetic materials, and electromagnets, but may also contain air gaps and other materials.
[0085] Air Gap: The air gap in the magnetic circuit.
[0086] Core differential mode leakage inductance: In the common mode inductor magnetic circuit, the magnetic flux in the air is usually not in the ferromagnetic material part, and when the ferromagnetic material part is not saturated, it is called the core differential mode leakage inductance of the common mode inductor.
[0087] Through-current: The maximum current that a conductor can carry when its internal temperature reaches a specified rise relative to room temperature.
[0088] Winding: A set of coils that form an electrical circuit corresponding to a certain inductance value marked on the inductor, with a specific number of turns.
[0089] Number of turns: The number of turns of a coil refers to the number of times the wire wraps around an object.
[0090] Terminal: The part where the load device is connected to the external conductor.
[0091] Interlinked flux: There is interaction between different magnetic circuits, which is called interlinked flux.
[0092] Mutual inductance: There is an interlinked magnetic flux between the two inductive magnetic circuits. Under the influence of this, the self-inductance values of the two inductors will change. The coefficient of interaction between the two inductive magnetic circuits is called the mutual inductance of the two inductive magnetic circuits.
[0093] Litz wire: A special type of stranded wire or cable consisting of multiple individually insulated thin wires twisted or braided together.
[0094] Iron powder core: A magnetic core produced by batching, pressing and coating high-purity iron powder or hydroxyl iron powder.
[0095] Ferrite core: A magnetic core made of a dense and homogeneous ceramic structure non-metallic magnetic material. The materials of the ferrite core include iron oxide (Fe2O3) and one or more oxides or carbonate compounds of other metals (such as manganese, zinc, nickel or magnesium).
[0096] Metal powder core: A magnetic core made of metal alloy powder that can resist loss under high frequency conditions. It mainly includes four categories: iron powder core, sendust core, high flux powder core or molybdenum permalloy powder core.
[0097] Amorphous powder cores: Amorphous materials, also known as amorphous or glassy materials, are a broad class of rigid solids whose atoms and molecules exhibit neither periodicity nor translational symmetry. The long-range order of the crystalline state is destroyed. Only due to the interatomic interactions do they exhibit short-range order within a small region of a few atomic (or molecular) diameters. A magnetic core formed by grinding this material into powder, then pressing and coating it, is called an amorphous powder core.
[0098] Nanocrystalline powder core: A polycrystalline material with crystals measuring only a few nanometers (usually defined as crystals / grains less than 100 nanometers). Unlike amorphous materials, the long-range order of the crystalline state is retained. A magnetic core formed by pressing and coating the ground powder of this material is called a nanocrystalline powder core.
[0099] Sintering: converting powdered materials into dense bodies.
[0100] Ball milling: The materials are crushed and mixed by the impact of falling grinding bodies (such as steel balls) and the grinding action between the grinding bodies and the inner wall of the ball mill.
[0101] Strip throwing: The ultra-rapid cooling technology passes the liquid metal through a high-speed rotating wheel-mounted cooling device, and after high-speed cooling, it forms a solid thin strip with a thickness of 20μm to 40μm.
[0102] Metallization: The process of depositing a thin metal film on a non-metallic surface.
[0103] Through hole: A hole in a printed circuit board that connects the two outermost circuit layers (front and back).
[0104] Blind via: A hole in a printed circuit board that connects the outermost layer circuit to the adjacent inner layer circuit, but not to the opposite side.
[0105] Buried via: A hole in a printed circuit board that connects any two internal circuit layers but does not conduct to the outer layer.
[0106] Wireless base station products such as RRU, MIMO, photovoltaic energy station products or new energy charging piles usually have a power supply inside. The power port is equipped with Figure 1 The filter module 100 shown in FIG. Figure 1As shown, the filter module 100 is electrically connected to the switching power supply 200. The filter module 100 includes a protection device 1, a capacitor 2, and an inductor assembly 3. The inductor assembly 3 includes a decoupling inductor 301, a differential mode inductor 302, and a common mode inductor 303. The differential mode inductor 302 and the common mode inductor 303 are both filter inductors. The protection device 1 can be a gas discharge tube, a varistor, or a transient voltage suppressor (TVS diode). The first end of the protection device 1 is connected to the first end of the decoupling inductor 301, the second end of the decoupling inductor 301 and the first end of the capacitor 2 are connected to the first end of the differential mode inductor 302, and the second end of the capacitor 2 and the second end of the common mode inductor 303 are connected to the second end of the protection device 1. The second end of the differential mode inductor 302 is connected to the first end of the common mode inductor 303, and the third and fourth ends of the common mode inductor 303 are respectively connected to the two ends of the switching power supply 200.
[0107] The decoupling inductor 301 is used for starting the protection device 1 and the back-end freewheeling control, the common-mode inductor 303 is used for filtering the common-mode noise in the circuit, and the differential-mode inductor 302 is used for filtering the differential-mode noise in the circuit.
[0108] like Figure 2 As shown, the differential-mode inductor 302 typically has a unidirectional, single-winding structure. Specifically, the differential-mode inductor 302 includes a magnetic core 3021 and a winding 3022 wound around the magnetic core 3021. Winding 3022 may be one. The differential-mode interference signal in the differential-mode inductor 302 is a current loop signal formed by the two input power lines in opposite directions. When flowing through the differential-mode inductor 302, it generates an induced electromotive force in the opposite direction, thereby weakening or preventing the differential-mode interference signal from changing over time. This effectively separates the signal from the interference in the differential-mode inductor 302.
[0109] like Figure 3a and Figure 3b As shown, the common mode inductor 303 generally includes a magnetic core 3031, and a first winding 3032 and a second winding 3033 wound on the magnetic core 3031 in opposite directions. Figure 3a As shown, the common-mode interference signal in the common-mode inductor 303 is a current I loop signal formed by the same direction on the two input lines and the ground. When flowing through the first winding 3032 and the second winding 3033 of the common-mode inductor 303, since the winding directions of the first winding 3032 and the second winding 3033 are opposite, the magnetic flux generated by the first winding 3032 and the second winding 3033 can be superimposed on each other, thereby having a larger inductance, thereby filtering out the common-mode interference signal. Figure 3b As shown, when the differential mode current I flows through the common mode inductor 303, the magnetic flux generated by the first winding 3032 and the second winding 3033 will cancel each other and no reverse induced electromotive force will be generated, thus having no effect on the differential mode current.
[0110] Usually, when the grid voltage is unstable or there is a natural lightning strike, wireless base station products will experience surge and impact current. Figure 4 As shown, in this case, the peak value of the generated pulse wave can reach thousands of amperes, thereby damaging circuit components. The decoupling inductor 301 is a differential mode inductor 302, which is also a common component in power supplies. Its function is to cooperate with the protection device 1 to provide protection against surge and inrush current.
[0111] Figure 1 The circuit diagram shown can be simplified to Figure 5 The circuit diagram shown in Figure 5 The latter working circuit is equivalent to Figure 1 The combined circuit after the capacitor 2, differential mode inductor 302, common mode inductor 303 and switching power supply 200 are connected. Figure 5 As shown, the protection device 1 in the filter module 100 is in a high resistance state under normal conditions, with a flow rate of μA, which can be considered as an open circuit state. When the voltage across the protection device 1 is higher than the voltage V 导通 When , it is in a low-resistance state, and the protective device 1 can be regarded as a conductor. Assuming that the lightning strike is input from the negative phase, because the lightning strike current is all at the KA level, only when I2 is as small as possible can the subsequent working circuit be safe. And I1 = I2 + I3, increasing I3 can reduce I2. The current I2 borne by the subsequent working circuit is usually at most 10% of I1, that is, I3 needs to take away more than 90% of the current of I1. At this time, the protective device 1 must be in a low-resistance state, and the role of the decoupling inductor 301 is to provide the high voltage required to make the protective device 1 in a low-resistance state. The decoupling inductor 301 is connected in parallel with the protective device 1, and the voltage V across the protective device 1 is 防护 ≈V 退耦 , and V 退耦 =L×(dI / dt), where L represents the inductance of the decoupling inductor 301. The voltage across the decoupling inductor 301 is the product of the time-varying rate of the current across the inductor and the inductance. 防护 ≥V 导通 When V 防护 ≥V 导通 , the inductance value L of the decoupling inductor 301 needs to be as large as possible.
[0112] The decoupling inductor 301 can provide core inductance and air core inductance. Figure 4It can be seen that the current development will go through three stages: rising period, peak period and falling period. For rising current, since the current has not yet caused the magnetic core of the decoupling inductor 301 to reach saturation, the reverse induced electromotive force is induced through the decoupling inductor 301, and the lightning protection device is turned on, which is mainly determined by the core inductance. For peak current and falling current, since the protection device 1 has been turned on and has assumed more than 90% of the current-carrying task, it is only necessary to protect the current of about I2=I1×10%. The absolute magnitude of this current is generally about 100A~300A, which is called the rear-end freewheeling of the protection device 1. At this time, since the inductor core has usually reached saturation, the core inductance no longer works, and I2 can only be controlled by the air core inductance provided by the coil winding.
[0113] Currently, if Figure 1 As shown, a wireless base station product contains a decoupling inductor 301, a differential-mode inductor 302, and a common-mode inductor 303. These three inductors account for over 50% of the board area of the filter module 100. To increase power density, the board area of the filter module 100 needs to be reduced. This is typically achieved by miniaturizing the decoupling inductor 301, the common-mode inductor 303, and the differential-mode inductor 302. However, this results in a reduction in the inductance of each inductor, making it difficult to achieve the desired filtering and lightning protection performance of the filter module 100.
[0114] Based on this, Figure 6 、 Figure 7 and Figure 8 As shown, the embodiment of the present application provides an inductor component 3, which can be applied to Figure 9 In the filter module 100 shown. Figure 9 As shown, in addition to the inductor component 3, the filter module 100 may also include a protective device 1 and a capacitor 2. In this embodiment, the inductor component 3 may include four ports, namely a first port a1, a second port a2, a third port a3, and a fourth port a4. The first end of the capacitor 2 is connected to the first end of the protective device 1 and connected to the first port a1 of the inductor component 3, and the second end of the capacitor 2 is connected to the second end of the protective device 1 and connected to the second port a2 of the inductor component 3. The third port a3 of the inductor component 3 is connected to the first end of the switching power supply 200, and the fourth port a4 of the inductor component 3 is connected to the second end of the switching power supply 200.
[0115] like Figure 6 As shown, the inductor component 3 may include: an air core inductor 31 and a differential common mode integrated inductor 32. The differential common mode integrated inductor 32 may refer to an inductor that can simultaneously perform differential mode filtering and common mode filtering. The differential common mode integrated inductor 32 can be Figure 9The filter module 100 shown provides core common-mode inductance, core differential-mode inductance and air core inductance. The air core inductor 31 can provide air core inductance. Therefore, the differential common-mode integrated inductor 32 and the air core inductor 31 work together to provide sufficient core common-mode inductance, core differential-mode inductance and air core inductance, thereby achieving the filtering performance and lightning protection performance of the filter module 100.
[0116] like Figure 7 As shown, the air core inductor 31 can be implemented by stacking planar air core inductors 31. Specifically, the air core inductor 31 can include a PCB winding 311. Figure 10 As shown, the PCB winding 311 includes a PCB board 3111 and a first winding 3112 provided on the PCB board 3111. Figure 6 The differential and common-mode integrated inductor 32 is shown fixed to the PCB board 3111, and the projection of the differential and common-mode integrated inductor 32 on the PCB board 3111 overlaps with the first winding 3112. In other words, the differential and common-mode integrated inductor 32 and the air core inductor 31 are stacked in a direction perpendicular to the PCB board 3111. When the filter module 100 is applied to an electronic device, the PCB board 3111 can serve as the circuit board 33 of the filter module 100, fixed within the housing of the electronic device, and connected to the switching power supply 200 in the electronic device. Therefore, the surface area of the PCB board 3111 is the board area of the filter module 100. Compared with the technical solution of fixing the decoupling inductor 301, the common-mode inductor 303 and the differential-mode inductor 302 on the circuit board 33 respectively, the embodiment of the present application integrates the common-mode inductor 303 and the differential-mode inductor 302 into a differential-common-mode integrated inductor 32, and stacks the differential-common-mode integrated inductor 32 and the air-core inductor 31, thereby reducing the board area of the PCB board 3111 of the air-core inductor 31, thereby reducing the board area of the filter module 100. Therefore, the embodiment of the present application can reduce the board area of the filter module 100 while meeting the filtering performance and lightning protection performance of the filter module 100, thereby improving the integration of the filter module 100 and better supporting the miniaturization evolution. In addition, compared Figure 1 and Figure 9 As shown in the circuit diagram, it can be seen that this embodiment can simplify the circuit topology.
[0117] like Figure 7As shown, the first winding 3112 and the differential and common-mode integrated inductor 32 are located on the same side of the PCB board 3111, and a gap 312 is formed between the first winding 3112 and the differential and common-mode integrated inductor 32 in a direction perpendicular to the PCB board 3111. In a specific configuration, a solder pad can be provided on the surface of the PCB board 3111 where the first winding 3112 is provided, and the ports of the differential and common-mode integrated inductor 32 can be connected to the solder pad, thereby facilitating electrical connection between the differential and common-mode integrated inductor 32 and the circuit board 33. Furthermore, the solder pad on the PCB board 3111 and the first winding 3112 can be manufactured in the same process, thereby improving the manufacturing convenience of the inductor assembly 3.
[0118] Furthermore, one side of the PCB 3111 may include a first area and a second area, with the second area surrounding the first area. The first winding 3112 is disposed in the first area, and the differential and common-mode integrated inductor 32 is fixed to the second area, with its projection on the PCB covering the projection of the air-core inductor 31. This fully utilizes the PCB 3111's surface area, further reducing the footprint of the inductor assembly 3 and, consequently, the footprint of the filter module 100.
[0119] Regarding the number of layers of the PCB winding 311, in a possible implementation, as Figure 7 As shown, the air core inductor 31 includes multiple layers of PCB windings 311 stacked in sequence. The differential common mode integrated inductor 32 is provided on the PCB board 3111 of the top layer of PCB winding 311. The first windings 3112 in each of two adjacent layers of PCB windings 311 are connected, specifically via copper pillars, metallized through-holes, metallized blind vias, or metallized buried vias. Thus, the first end of the first winding 3112 in the bottom layer of PCB winding 311 can serve as the first end of the air core inductor 31, and the second end of the first winding 3112 in the top layer of PCB winding 311 that is not connected to other layers of PCB winding 311 can serve as the second end of the air core inductor 31. Since the inductance is positively correlated with the number of layers of PCB winding 311, when the air core inductor 31 includes multiple layers of PCB windings 311, the air core inductance provided by the air core inductor 31 can be increased. Furthermore, the stacked multi-layer PCB winding 311 does not increase the surface area of the PCB board 3111. Therefore, this solution can increase the air core inductance while maintaining the footprint of the inductor component 3. In another possible embodiment, the air core inductor 31 may include a single layer of PCB winding 311.
[0120] In addition, regarding the number of first windings 3112 in each PCB winding 311, in a possible implementation manner, as shown in FIG. Figure 10As shown, the PCB winding 311 may include multiple first windings 3112. These multiple first windings 3112 are wound in the same direction, and the first ends of each first winding 3112 are connected, and the second ends of each first winding 3112 are connected. Thus, when current passes through the air core inductor 31, it can enter each first winding 3112 from the first end, flow through each first winding 3112, and then exit from the second end of each first winding 3112. Multiple first windings 3112 can provide greater inductance. Furthermore, the current flowing through each first winding 3112 is more similar in magnitude, that is, the current distribution across each first winding 3112 is more even, further improving the air core inductance.
[0121] Moreover, further, Figure 10 As shown, the length of each first winding 3112 is the same, thereby making the current flowing through each first winding 3112 more uniform, thereby further increasing the air core inductance provided by the air core inductor 31 .
[0122] In addition, it can be understood that in this embodiment, if Figure 10 As shown, the plurality of first windings 3112 are wound to form a rectangular structure. In other embodiments, the plurality of first windings 3112 may be wound to form a polygonal structure or a circular structure with other numbers of sides.
[0123] In another possible embodiment, Figure 11 、 Figure 12 and Figure 13 As shown, the PCB winding 311 may include a first winding 3112. In order to increase the air core inductance generated by the first winding 3112, the cross-sectional size of the first winding 3112 may be increased. The first winding 3112 may be wound to form a polygonal structure or a circular structure. For example, Figure 11 As shown, the first winding 3112 can be wound into a rectangular structure; or, as shown Figure 12 As shown, the first winding 3112 can be wound into an octagonal structure; or, as shown Figure 13 As shown, the first winding 3112 can be wound into a hexagonal structure. The air core inductor 31 can be manufactured by a forming method such as wire winding, lamination or 3D printing.
[0124] right Figure 10 The current distribution of the air core inductor 31 including multiple first windings 3112 is tested and the current distribution of the air core inductor 31 can be obtained. Figure 14 The current distribution diagram shown is as follows. The current distribution of the air core inductor 31 including a first winding 3112 in the PCB winding 311 is tested, and the current distribution can be obtained. Figure 15 The current distribution diagram is shown. Figure 14 and Figure 15As can be seen from FIG, compared with the air core inductor 31 including one first winding 3112, when the air core inductor 31 includes multiple first windings 3112, the current distribution on each first winding 3112 is more uniform.
[0125] right Figure 10 The air core inductances of the air core inductor 31 including multiple first windings 3112 and the air core inductor 31 including one first winding 3112 are tested respectively, and the air core inductances can be obtained. Figure 16 The comparison chart of air core inductance is shown in the figure. Figure 16 As shown, the solid line curve is the air core inductance curve of the air core inductor 31 including multiple first windings 3112, and the dotted line curve is the air core inductance curve of the air core inductor 31 including one first winding 3112. Figure 16 It can be seen that Figure 10 The air core inductor 31 shown includes a plurality of first windings 3112 and generates an air core inductance of up to 2.34uH. Figure 11 The air core inductor 31 shown includes a first winding 3112 and generates an air core inductance of up to 0.77uH. Figure 10 The air core inductor 31 of the illustrated embodiment produces a higher air core inductance.
[0126] like Figure 17 As shown, the differential and common-mode integrated inductor 32 can be a horizontal rectangular magnetic toroidal inductor with an air-gap magnetic bridge. Specifically, the differential and common-mode integrated inductor 32 can include a base 321, a first magnetic core 322, a second magnetic core 323, a second winding 324, and a third winding 325. The base 321 includes two opposing connecting plates 3211. The first and second magnetic cores 322, 323 are parallel and fixed between the two connecting plates 3211. The first and second magnetic cores 322, 323 can be made of the same material. For example, the first and second magnetic cores 322, 323 can be made of iron powder cores, ferrite cores (such as manganese zinc and nickel zinc), metal magnetic powder cores (such as nickel iron, nickel iron molybdenum, and sendustine), amorphous powder cores and strips, nanocrystalline powder cores and strips, etc. The first and second magnetic cores 322, 323 can be manufactured by sintering, ball milling, belt spinning, or integrated molding. The integrated molding can specifically be cold pressing or hot pressing.
[0127] like Figure 17As shown, the second winding 324 is wound around the first magnetic core 322, and the third winding 325 is wound around the second magnetic core 323. A magnetic core window 329 is formed between the second winding 324 and the third winding 325. The winding direction of the second winding 324 is opposite to that of the third winding 325. The direction of the magnetic field generated within the first magnetic core 322 is opposite to that of the magnetic field generated within the second magnetic core 323, thereby forming a common magnetic circuit structure. As a result, the differential common-mode integrated inductor 32 can provide cored common-mode inductance and cored differential-mode inductance.
[0128] like Figure 8 As shown, the axial direction of the first magnetic core 322 and the axial direction of the second magnetic core 323 are both parallel to the PCB board 3111. Figure 6 The magnetic fields generated by the differential common mode integrated inductor 32 and the air core inductor 31 in the inductor assembly 3 of the embodiment shown are tested respectively, and the magnetic fields are obtained. Figure 18 and Figure 19 The magnetic flux distribution diagram is shown in Figure 2. Figure 18 and Figure 19 It can be seen from the figure that the direction of the magnetic field generated by the second winding 324 and the third winding 325 of the differential common mode integrated inductor 32 is parallel to Figure 6 The PCB board 3111 is shown, and the direction of the magnetic field generated by the first winding 3112 of the air core inductor 31 is perpendicular to the PCB board 3111. That is, the magnetic field generated by the differential common mode integrated inductor 32 is orthogonal to the magnetic field generated by the air core inductor 31, thereby avoiding cross-linking, thereby avoiding the influence of mutual inductance, and further avoiding the reduction of filtering effect due to mutual inductance.
[0129] like Figure 8 As shown, the first end of the third winding 325 of the differential common mode integrated inductor 32 is connected to the first end of the air core inductor 31, the first end of the second winding 324 of the differential common mode integrated inductor 32 serves as the first port a1 of the inductor component 3, the second end of the second winding 324 serves as the third port a3 of the inductor component 3, the second end of the third winding 325 serves as the second port a2 of the inductor component 3, and the second end of the air core inductor 31 serves as the fourth port a4 of the inductor component 3.
[0130] In other embodiments of the present application, Figure 20 As shown, Figure 6 The difference between the embodiments shown is that the number of ports of the inductor component 3 is different. Figure 20 As shown, the inductor component 3 includes six ports, namely a first port a1, a second port a2, a third port a3, a fourth port a4, a fifth port a5 and a sixth port a6. Figure 21As shown, the first end of the air-core inductor 31 serves as the first port a1 of the inductor component 3 and is connected to the first end of the protection device 1. The second end of the air-core inductor 31 serves as the second port a2 of the inductor component 3 and is connected to the first end of the capacitor 2. The first end of the second winding 324 of the differential common-mode integrated inductor 32 serves as the third port a3 of the inductor component 3 and is connected to the first end of the capacitor 2. The second end of the second winding 324 serves as the fourth port a4 of the inductor component 3 and is connected to the first end of the switching power supply 200. The first end of the third winding 325 serves as the fifth port a5 of the inductor component 3 and is connected to the second end of the capacitor 2. The second end of the third winding 325 serves as the sixth port a6 of the inductor component 3 and is connected to the second end of the switching power supply 200.
[0131] In other embodiments of the present application, Figure 22 As shown, Figure 6 The difference between the embodiments shown is that the structure of the air core inductor 31 and the positional relationship between the air core inductor 31 and the differential common mode integrated inductor 32 are different. Specifically, in this embodiment, as shown in FIG. Figure 22 As shown, the inductor assembly 3 includes not only the air core inductor 31 and the differential common mode integrated inductor 32, but also a circuit board 33. The air core inductor 31 includes a three-dimensional winding. The three-dimensional winding and the differential common mode integrated inductor 32 are both fixed on the circuit board 33, and the three-dimensional winding is located in the magnetic core window 329. In this way, the total board area occupied by the three-dimensional winding and the differential common mode integrated inductor 32 is the same as the board area occupied by the differential common mode integrated inductor 32. Figure 1 The decoupling inductor 301, the common mode inductor 303 and the differential mode inductor 302 are fixed at Figure 22 The technical solution on the circuit board 33 shown in the figure, in this embodiment of the application, by integrating the common-mode inductor and the differential-mode inductor into a differential-common-mode integrated inductor 32, and arranging the three-dimensional inductor within the magnetic core window 329 of the differential-common-mode integrated inductor 32, can reduce the board area of the circuit board 33, thereby reducing the board area occupied by the inductor component 3. Therefore, the embodiment of the application can reduce the occupied area of the inductor component 3 while meeting the filtering performance and lightning protection performance of the filter module 100, thereby improving the integration of the inductor component 3 and better supporting the miniaturization evolution.
[0132] In one example, Figure 22As shown, the axial direction of the first magnetic core 322 and the axial direction of the second magnetic core 323 are both perpendicular to the axial direction of the three-dimensional winding. In this way, the direction of the magnetic field generated by the second winding 324 and the third winding 325 of the differential common mode integrated inductor 32 is parallel to the circuit board 33, while the direction of the magnetic field generated by the three-dimensional winding is perpendicular to the circuit board 33. In other words, the magnetic field generated by the differential common mode integrated inductor 32 is orthogonal to the magnetic field generated by the air core inductor 31, thereby avoiding cross-linking, thereby avoiding the influence of mutual inductance, and further avoiding the reduction of filtering effect due to mutual inductance. In another example, the axial direction of the first magnetic core 322 and the axial direction of the second magnetic core 323 are both parallel to the axial direction of the three-dimensional winding.
[0133] In other embodiments of the present application, Figure 23 、 Figure 24 and Figure 25 As shown, Figure 6 The difference between the embodiments shown is the structure of the differential common mode integrated inductor 32 and the structure of the air core inductor 31. Specifically, Figure 24 As shown, the differential common-mode integrated inductor 32 includes a first magnetic ring 326, a second magnetic ring 327 sleeved outside the first magnetic ring 326 with a gap therebetween, a second winding 324, and a third winding 325. The surface of the first magnetic ring 326 includes a connected third region 3271 and a fourth region 3272. The second winding 324 is wound around the third region 3271, and the third winding 325 is wound around the fourth region 3272. The second winding 324 and the third winding 325 are wound in opposite directions. Thus, the differential common-mode integrated inductor 32 with this structure can also form a common magnetic circuit structure, thereby enabling the differential common-mode integrated inductor 32 to provide cored common-mode inductance and cored differential-mode inductance.
[0134] like Figure 24 As shown, the axial direction of the first magnetic ring 326 and the axial direction of the first magnetic ring 326 are both perpendicular to the PCB board 3111. In this way, the direction of the magnetic field generated by the second winding 324 and the third winding 325 of the differential common-mode integrated inductor 32 is parallel to the PCB board 3111, while the direction of the magnetic field generated by the first winding 3112 of the air-core inductor 31 is perpendicular to the PCB board 3111. In other words, the magnetic field generated by the differential common-mode integrated inductor 32 is orthogonal to the magnetic field generated by the air-core inductor 31, thereby avoiding cross-linkage and thus avoiding the influence of mutual inductance, thereby preventing the reduction of filtering effect due to mutual inductance.
[0135] like Figure 24As shown, the differential and common-mode integrated inductor 32 further includes a magnetic conductive structure 328. A portion of the magnetic conductive structure 328 is connected to the interior of the first magnetic ring 326 and a portion of the magnetic conductive structure 328 is connected between the first magnetic ring 326 and the second magnetic ring 327. The second winding 324 and the third winding 325 are respectively located on either side of the magnetic conductive structure 328. The low magnetic permeability of the magnetic conductive structure allows the magnetic circuit generated by the second winding 324 and the magnetic circuit generated by the third winding 325 to be conductive, thereby increasing the cored differential-mode inductance provided by the differential and common-mode integrated inductor 32.
[0136] Furthermore, if Figure 24 As shown, the magnetic conductive structure 328 includes at least two first magnetic conductive bodies 3281 and a second magnetic conductive body 3282. Each first magnetic conductive body 3281 is connected between the first magnetic ring 326 and the second magnetic ring 327, and the second magnetic conductive body 3282 is connected to the interior of the first magnetic ring 326. The two first magnetic conductive bodies 3281 are located in opposite directions of the second magnetic conductive body 3282. This can better facilitate magnetic circuit conduction, thereby further increasing the core differential mode inductance provided by the differential common mode integrated inductor 32.
[0137] Moreover, in a specific implementation, the first magnetic conductor 3281 and the second magnetic conductor 3282 may both include magnetic adhesive, so that the first magnetic ring 326 and the second magnetic ring 327 can be bonded together by the magnetic adhesive.
[0138] like Figure 23 As shown, the air core inductor 31 includes a multi-layer PCB winding 311. Figure 25 As shown, each layer of PCB winding 311 includes a PCB board 3111 and a first winding 3112, and the first windings 3112 of two adjacent layers of PCB winding 311 are connected, so that the first end of the first winding 3112 of the PCB winding 311 located on the bottom layer can serve as the first end of the air core inductor 31, and the second end of the first winding 3112 of the PCB winding 311 located on the top layer can serve as the second end of the air core inductor 31.
[0139] like Figure 25 As shown, in this embodiment, the first winding 3112 can be wound to form a hexagonal structure. In other embodiments, the first winding 3112 can be wound to form an octagonal structure or a circular structure. Moreover, in this embodiment, the PCB winding 311 includes a single first winding 3112. In other embodiments, the PCB winding 311 may include multiple first windings 3112.
[0140] To include Figure 6 The filter module 100 of the inductor component 3 shown includes Figure 23The filter module 100 of the inductor component 3 shown in FIG. 1 and the filter module 100 including only the differential common mode integrated inductor 32 but not the air core inductor 31 are tested to obtain the core common mode inductance. Figure 26 The comparison chart of the common mode inductance of the core is shown in the figure. Figure 6 The filter module 100 of the inductor component 3 shown includes Figure 23 The filter module 100 of the inductor component 3 shown in FIG. 1 and the filter module 100 including only the differential common mode integrated inductor 32 but not the air core inductor 31 are tested to obtain the core differential mode inductance. Figure 27 The comparison chart of differential mode inductance with core is shown in the figure. Figure 6 The filter module 100 of the inductor component 3 shown includes Figure 23 The air core differential mode inductance provided by the filter module 100 of the inductor component 3 and the filter module 100 including only the differential common mode integrated inductor 32 but not the air core inductor 31 is tested to obtain Figure 28 The air core differential mode inductance comparison chart is shown. Figure 26 、 Figure 27 and Figure 28 The parameters shown in Table 1 can be obtained.
[0141] Table 1
[0142]
[0143] As can be seen from Table 1, including Figure 6 The filter module 100 of the embodiment shown includes Figure 23 The common mode inductance of the filter module 100 of the embodiment shown is greater than 400uH, including Figure 6 The filter module 100 of the embodiment shown includes Figure 23 The core differential mode inductance of the filter module 100 of the embodiment shown is greater than 10uH, and the air core differential mode inductance also has obvious advantages. Figure 6 The illustrated embodiments and Figure 23 The core common mode inductance of the embodiment shown can meet the basic requirements while also improving the core differential mode inductance and the air core differential mode inductance.
[0144] To include Figure 9 The air core differential mode inductance of the filter module 100 of the inductor component 3 is 1.08uH and 3.03uH, and the back-end freewheeling effect is tested to obtain Figure 29 Here, the air core differential mode inductance is mainly provided by the air core inductor 31. Figure 29As can be seen from the figure, the back-end freewheeling current of the air core differential mode inductance of 1.08uH is significantly greater than that of the air core differential mode inductance of 3.03uH, with peak values of 1.5kA and 850A, respectively. A higher back-end freewheeling current can affect switching power supply 200, for example, causing it to burn out. In other words, the back-end freewheeling current of the air core differential mode inductance of 3.03uH is lower, thereby reducing the impact on switching power supply 200.
[0145] It will be appreciated that, in this embodiment, the air-core inductor 31 is implemented by stacking planar air-core inductors 31. In other embodiments, the air-core inductor 31 may include a three-dimensional winding. In this case, the axial direction of the first magnetic ring 326 and the axial direction of the second magnetic ring 327 are both perpendicular to the axial direction of the three-dimensional winding. In this way, the direction of the magnetic field generated by the second winding 324 and the third winding 325 of the differential common-mode integrated inductor 32 is parallel to the circuit board 33, while the direction of the magnetic field generated by the three-dimensional winding is perpendicular to the circuit board 33. In other words, the magnetic field generated by the differential common-mode integrated inductor 32 is orthogonal to the magnetic field generated by the air-core inductor 31, thereby avoiding cross-linkage, thereby avoiding the influence of mutual inductance, and further preventing the reduction of filtering effect due to mutual inductance.
[0146] In other embodiments of the present application, Figure 30 、 Figure 31 and Figure 32 As shown, Figure 6 The difference between the embodiments shown is the structure of the air core inductor 31. Specifically, the PCB board 3111 includes the following: Figure 30 The first plate surface 3113 shown and the Figure 31 The second plate surface 3114 shown in FIG. 31 is opposite to the first plate surface 3113 and the second plate surface 3114. The first winding 3112 includes Figure 30 The plurality of parallel first conductive lines 3115 shown, Figure 31 The plurality of parallel second conductive lines 3116 shown and Figure 32 As shown in FIG. Figure 30 As shown, a plurality of first conductive lines 3115 are all provided on the first plate surface 3113. Figure 31 As shown, a plurality of second conductive lines 3116 are all provided on the second plate surface 3114. Figure 32 As shown, the projection of the first conductive line 3115 on the second board surface 3114 intersects with the second conductive line 3116, and multiple third conductive lines 3117 pass through from the first board surface 3113 to the second board surface 3114, and each third conductive line 3117 connects one first conductive line 3115 and one second conductive line 3116.
[0147] It is understandable that the examples in this application list Figure 10 、 Figure 11、 Figure 12 、 Figure 13 、 Figure 22 and Figure 25 The structures of several air core inductors 31 are shown. In other embodiments, the differential and common mode integrated inductors 32 may also be planar ring air core inductors, etc.
[0148] It is also understandable that the examples in this application list Figure 8 Shown and Figure 24 The structures of the two differential common-mode integrated inductors 32 are shown. In other embodiments, the differential common-mode integrated inductors 32 may also be UU-type common-mode inductors, toroidal common-mode inductors, differential-mode magnetic bridge inductors, open-gap magnetic bridge inductors, inner-outer-ring unbalanced winding inductors, large-and-small-ring nested inductors, or dual-ring inductors.
[0149] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.
Claims
1. An inductor component, characterized in that: include: An air core inductor and a differential common mode integrated inductor, wherein a magnetic core window is formed on the differential common mode integrated inductor; The air core inductor includes a printed circuit board (PCB) winding, the PCB winding includes a PCB board and a first winding provided on the PCB board, the differential and common mode integrated inductor is fixed on the PCB board, and the projection of the differential and common mode integrated inductor on the PCB board overlaps with the first winding; or, the inductor component also includes a circuit board, the air core inductor includes a three-dimensional winding, the three-dimensional winding and the differential and common mode integrated inductor are both fixed on the circuit board, and the three-dimensional winding is located in the magnetic core window.
2. The inductor assembly according to claim 1, wherein: The first winding and the differential common mode integrated inductor are located on the same side of the PCB board, and a gap is formed between the first winding and the differential common mode integrated inductor along a direction perpendicular to the PCB board.
3. The inductor assembly according to claim 2, characterized in that One side surface of the PCB board includes a first area and a second area, the second area surrounds the first area, the first winding is arranged in the first area, the differential common mode integrated inductor is fixed to the second area, and the projection of the second area on the board surface covers the projection of the air core inductor on the board surface.
4. The inductor assembly according to any one of claims 1 to 3, characterized in that: The air core inductor includes multiple layers of PCB windings stacked in sequence, the differential common mode integrated inductor is arranged on the PCB board of the PCB winding on the top layer, and the first windings in each two adjacent layers of PCB windings are connected.
5. The inductor assembly according to any one of claims 1 to 4, characterized in that: The PCB winding includes a plurality of first windings, and the plurality of first windings are wound in the same direction.
6. The inductor assembly according to claim 5, characterized in that The length of each of the first windings is the same.
7. The inductor assembly according to claim 1, wherein: The PCB board includes a first board surface and a second board surface opposite to each other; The first winding includes multiple parallel first conductive wires, multiple parallel second conductive wires and multiple parallel third conductive wires. The multiple first conductive wires are all arranged on the first board surface, and the multiple second conductive wires are all arranged on the second board surface. The projection of the first conductive wire on the second board surface intersects with the second conductive wire. The multiple third conductive wires pass through from the first board surface to the second board surface, and each of the third conductive wires connects one first conductive wire and one second conductive wire.
8. The inductor assembly according to any one of claims 1 to 7, characterized in that: The differential common-mode integrated inductor includes a base, a first magnetic core, a second magnetic core, a second winding and a third winding. The first magnetic core and the second magnetic core are parallel, the second winding is wound on the first magnetic core, and the third winding is wound on the second magnetic core. The magnetic core window is formed between the second winding and the third winding, and the winding direction of the second winding is opposite to the winding direction of the third winding.
9. The inductor assembly according to claim 8, characterized in that: The axial direction of the first magnetic core and the axial direction of the second magnetic core are both parallel to the PCB board.
10. The inductor assembly according to claim 9, characterized in that: The axial direction of the first magnetic core and the axial direction of the second magnetic core are both perpendicular to the axial direction of the three-dimensional winding.
11. The inductor assembly according to any one of claims 1 to 7, characterized in that: The differential common-mode integrated inductor includes a first magnetic ring, a second magnetic ring arranged outside the first magnetic ring and having a gap with the first magnetic ring, a second winding and a third winding, the surface of the first magnetic ring includes a connected third area and a fourth area, the second winding is wound on the third area, the third winding is wound on the fourth area, and the second winding and the third winding are wound in opposite directions.
12. The inductor assembly according to claim 11, characterized in that The axial direction of the first magnetic ring and the axial direction of the second magnetic ring are both perpendicular to the PCB board.
13. The inductor assembly according to claim 11, wherein: The axial direction of the first magnetic ring and the axial direction of the second magnetic ring are both perpendicular to the axial direction of the three-dimensional winding.
14. The inductor assembly according to any one of claims 11 to 13, characterized in that: The differential common-mode integrated inductor also includes a magnetic conductive structure, part of which is connected to the inside of the first magnetic ring, and part of which is connected between the first magnetic ring and the second magnetic ring. The second winding and the third winding are respectively located on both sides of the magnetic conductive structure.
15. The inductor assembly according to claim 14, characterized in that: The magnetic conductive structure includes at least two first magnetic conductive bodies connected between the first magnetic ring and the second magnetic ring and a second magnetic conductive body connected inside the first magnetic ring, wherein the two first magnetic conductive bodies are located in two opposite extension directions of the second magnetic conductive body.
16. The inductor assembly according to claim 15, characterized in that The first magnetic conductor and the second magnetic conductor both include magnetic conductive glue.
17. The inductor assembly according to any one of claims 8 to 16, characterized in that: A first end of the third winding is connected to a first end of the air core inductor.
18. A filter module, characterized in that: It comprises a protective device and the inductor assembly according to any one of claims 1 to 17, wherein the protective device is fixed on a PCB board or a circuit board of the inductor assembly.
19. An electronic device, characterized in that: It comprises a housing and the filter module according to claim 18, wherein the filter module is fixed in the housing.