Electronic component

Abstract

The electronic component includes: an element body having first and second main surfaces facing each other in a first direction, first and second end surfaces facing each other in a second direction, and first and second side surfaces facing each other in a third direction; a first terminal electrode formed on the first end surface; a second terminal electrode formed on the second end surface; an external connection conductor formed on at least one of the first and second side surfaces; a first internal electrode provided in the element body and connected to the first terminal electrode at a first end surface; a second internal electrode provided in the element body, separated from the first internal electrode, and connected to the second terminal electrode at a second end surface; and a third internal electrode that is provided in the element body, faces the first and second internal electrodes in the first direction, and is connected to the external connection conductor, and a first capacitor section in which the first and third internal electrodes face each other and a second capacitor section in which the second and third internal electrodes face each other are connected in series. The third internal electrode has an opening in a region between the first and second internal electrodes when viewed from the first direction.

Description

Technical Field

[0001] The present invention relates to an electronic component. Background Art

[0002] As a conventional electronic component, the electronic component described in Japanese Patent Application Laid-Open No. 2019-46876 is known. This electronic component comprises a body and a pair of terminal electrodes. Internal electrodes are formed within the body to form two sets of capacitors. The body comprises a first internal electrode and a second internal electrode, which are arranged in a spaced-apart pattern, and a third internal electrode, which opposes these internal electrodes. Summary of the Invention

[0003] Here, there is a demand for improved performance of electronic components including a plurality of capacitor portions connected in series inside an element body.

[0004] The present invention has been made to solve the above-mentioned technical problems, and an object of the present invention is to provide an electronic component having a plurality of capacitor units connected in series, which can improve performance.

[0005] An electronic component according to the present invention comprises: an element body having a first principal surface and a second principal surface opposing each other in a first direction, a first end surface and a second end surface opposing each other in a second direction perpendicular to the first direction, and a first side surface and a second side surface opposing each other in a third direction perpendicular to the first and second directions; a first terminal electrode formed on the first end surface; a second terminal electrode formed on the second end surface; an external connecting conductor formed on at least one of the first side surface and the second side surface; a first internal electrode provided within the element body and connected to the first terminal electrode at the first end surface; a second internal electrode provided within the element body, spaced apart from the first internal electrode, and connected to the second terminal electrode at the second end surface; and a third internal electrode provided within the element body, opposing the first internal electrode and the second internal electrode in the first direction and connected to the external connecting conductor, wherein a first capacitor portion formed by the opposing first and third internal electrodes and a second capacitor portion formed by the opposing second and third internal electrodes are connected in series, and the third internal electrode has an opening in a region between the first and second internal electrodes as viewed in the first direction.

[0006] In this electronic component, the first internal electrode connected to the first terminal electrode faces the third internal electrode, and the second internal electrode connected to the second terminal electrode faces the third internal electrode. With this structure, the first capacitor section, formed by the first and third internal electrodes facing each other, and the second capacitor section, formed by the second and third internal electrodes facing each other, are connected in series via the third internal electrode. Therefore, even in the event of a short circuit in one capacitor section, the function of the other capacitor section can be maintained, thereby improving reliability. Furthermore, by using terminal electrodes and external connecting conductors, it is possible to detect and inspect the presence of short circuit defects in each capacitor section. Here, when viewed from the first direction, the third internal electrode has an opening in the region between the first and second internal electrodes. Therefore, the electric field strength can be reduced near the region between the first and second internal electrodes. Consequently, cracks in the element body caused by electric field concentration can be suppressed. As a result, the performance of an electronic component having multiple capacitor sections connected in series can be improved.

[0007] Alternatively, the third inner electrode may include a first region located closer to the first end surface than the opening; a second region located closer to the second end surface than the opening; and a connecting portion connecting the first and second regions, the connecting portion being formed on the side surface where the external connecting conductor is provided. In this case, the connecting portion can be positioned close to the external connecting conductor. Therefore, by shortening the length of the lead portion of the third inner electrode extending to the external connecting conductor, Joule heating caused by current in the lead portion can be reduced, thereby minimizing the possibility of damage due to this Joule heating.

[0008] Alternatively, the external connecting conductor may be formed on both the first and second side surfaces, and the third internal electrode may include a first connecting portion connected to the external connecting conductor on the first side surface and a second connecting portion connected to the external connecting conductor on the second side surface. In this case, the presence of a short circuit can be detected using either the external connecting conductor on the first or second side surfaces.

[0009] Alternatively, the width of the connecting portion of the third inner electrode in the third direction may be 10% or more of the overlapping width of the first and second capacitor portions in the third direction. In this case, ensuring the width of the connecting portion reduces Joule heating caused by the current flow and suppresses damage caused by this Joule heating.

[0010] Alternatively, the length of the connecting portion of the third inner electrode in the second direction may be less than 100% of the overlapping length of the first and second capacitor portions in the second direction. In this case, by reducing the length of the connecting portion, Joule heating caused by the current can be reduced, thereby suppressing damage caused by this Joule heating.

[0011] Alternatively, the width of the connecting portion of the third inner electrode in the third direction may be greater than the width of the lead portion connected to the external connecting conductor in the second direction. In this case, by ensuring the width of the connecting portion, Joule heating caused by current flow can be reduced while ensuring reliable connectivity with the external connecting conductor.

[0012] Alternatively, the first internal electrode may include a first lead portion extending from the first capacitor portion to the first terminal electrode, and the second internal electrode may include a second lead portion extending from the second capacitor portion to the second terminal electrode, wherein the first and second lead portions are narrower in the third direction than the first and second capacitor portions. In this case, the area of ​​the first and second internal electrodes overlapping the edge of the third internal electrode near the edge of the end surfaces of the first and second capacitor portions can be reduced. This reduces the electric field strength near the end surfaces and reduces cracking.

[0013] Alternatively, the width of the opening in the second direction may be at least twice the thickness of the first dielectric layer between the first and second inner electrodes and the third inner electrode in the first direction. In this case, the withstand voltage performance near the opening can be improved to a level higher than the interlayer withstand voltage performance of the first dielectric layer.

[0014] Alternatively, a first relaxing layer for relaxing the depression formed in the element body may be formed inside the opening. In this case, the depression on the main surface of the element body can be reduced, thereby facilitating the pickup of the element body by suction.

[0015] A second relaxation layer may be formed between the first and second internal electrodes to mitigate the concavity formed in the element body. In this case, the concavity on the main surface of the element body can be reduced, thereby facilitating the pickup of the element body by suction.

[0016] Alternatively, the first and second buffer layers may be formed of a conductive layer or a second dielectric layer. In this case, the conductive layer or the second dielectric layer sufficiently supports the inner side of the opening, thereby reducing the concavity on the main surface of the element body. This facilitates the pickup of the element body by suction.

[0017] According to the present invention, it is possible to provide an electronic component having a plurality of capacitor portions connected in series, which can improve performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 (a) is a top view of the electronic component of this embodiment. Figure 1 (b) is a front view of the electronic component of this embodiment.

[0019] Figure 2 (a) is along Figure 1The cross-sectional view along line IIa-IIa shown in (a) is shown in FIG. Figure 2 (b) is along Figure 1 This is a cross-sectional view taken along line IIb-IIb shown in (a).

[0020] Figure 3A is a diagram showing a third internal electrode, Figure 3B is a diagram showing a first internal electrode and a second internal electrode, Figure 3C It is a diagram showing the positional relationship when the first internal electrode, the second internal electrode, and the third internal electrode overlap.

[0021] Figure 4 It is a developed perspective view showing the stacking state.

[0022] Figure 5 It is a graph showing the results of simulating the electric field intensity of the comparative example and the example.

[0023] Figure 6 It is a graph showing the relationship between the stacking deviation amount and the electric field concentration factor in the comparative example and the example.

[0024] Figure 7 (a) and (b) are cross-sectional views of electronic components according to an embodiment of the present invention. Figure 7 (c) and (d) are cross-sectional views of electronic components according to comparative examples.

[0025] Figure 8 It is a diagram showing internal electrodes of an electronic component according to a modified example.

[0026] Figure 9 It is a diagram showing internal electrodes of an electronic component according to a modified example.

[0027] Figure 10 It is a diagram showing internal electrodes of an electronic component according to a modified example.

[0028] Figure 11 It is a diagram showing internal electrodes of an electronic component according to a modified example.

[0029] Figure 12 It is a diagram showing internal electrodes of an electronic component according to a modified example.

[0030] Figure 13 It is a diagram showing internal electrodes of an electronic component according to a modified example.

[0031] Figure 14 It is a diagram showing internal electrodes of an electronic component according to a modified example.

[0032] Figure 15 It is a diagram showing internal electrodes of an electronic component according to a modified example.

[0033] 2…element body, 2a…first principal surface, 2b…second principal surface, 2c…first end surface, 2d…second end surface, 2e…first side surface, 2f…second side surface, 3…first terminal electrode, 4…second terminal electrode, 5…dielectric layer, 6A, 6B…external connecting conductor, 10A…first capacitor section, 10B…second capacitor section, 11…first internal electrode, 12…second internal electrode, 13…third internal electrode, 21…first region, 22…second region, 23…first connecting section, 24…second connecting section, 26, 27…lead-out section, 28…first lead-out section, 29…second lead-out section, 30…opening, 31…first relaxation layer, 32…second relaxation layer, 100…electronic component. DETAILED DESCRIPTION

[0034] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same elements or elements having the same functions are denoted by the same reference numerals, and repeated descriptions are omitted.

[0035] First, refer to Figures 1 to 4 The structure of the electronic component 100 according to this embodiment will be described. Figure 1 (a) is a top view of the electronic component of this embodiment. Figure 1 (b) is a front view of the electronic component of this embodiment. Figure 2 (a) is along Figure 1 The cross-sectional view along line IIa-IIa shown in (a) is shown in FIG. Figure 2 (b) is along Figure 1 (b) is a cross-sectional view taken along line IIb-IIb. Figure 2 The cross-sectional position of (a) is Figure 3C The cutting site CP1 in FIG. Figure 2 The cross-sectional position of (b) is Figure 3C The cutting part CP2 in is shown. Figure 3A is a diagram showing a third internal electrode, Figure 3B is a diagram showing a first internal electrode and a second internal electrode, Figure 3C It is a diagram showing the positional relationship when the first internal electrode, the second internal electrode, and the third internal electrode overlap. Figure 4 This is an expanded perspective view showing the stacking situation. Figure 3C In FIG, the first internal electrode and the second internal electrode are indicated by imaginary lines.

[0036] In addition, in the following description, the electronic component 100 is sometimes described by setting an XYZ coordinate system. The Z-axis direction (first direction) is the stacking direction of the internal electrodes described later. The Z-axis direction is a direction perpendicular to the surface of the circuit substrate serving as the installation object during installation. The X-axis direction (second direction) is a direction perpendicular to the Z-axis direction, and is a direction parallel to the surface of the circuit substrate during installation. In addition, the X-axis direction corresponds to the long side direction of the element body 2. The Y-axis direction (third direction) is a direction perpendicular to the Z-axis direction and the X-axis direction, and is a direction parallel to the surface of the circuit substrate and perpendicular to the X-axis direction during installation. Figure 1 In the figure, the upper side is the positive side in the Z-axis direction, and the lower side is the negative side in the Z-axis direction.

[0037] like Figure 1 As shown, the electronic component 100 includes an element body 2, a first terminal electrode 3, a second terminal electrode 4, and first and second external connection conductors 6A and 6B. Figure 2 As shown, the electronic component 100 includes a first internal electrode 11 , a second internal electrode 12 , and a third internal electrode 13 in the element body 2 .

[0038] like Figure 1 As shown, the element body 2 is a rectangular parallelepiped component extending along the X-axis direction as the long side direction. The element body 2 has a first main surface 2a and a second main surface 2b opposite to each other in the Z-axis direction, a first end surface 2c and a second end surface 2d opposite to each other in the X-axis direction, and a first side surface 2e and a second side surface 2f opposite to each other in the Y-axis direction. The first main surface 2a is arranged on the negative side in the Z-axis direction, and the second main surface 2b is arranged on the positive side in the Z-axis direction. The first end surface 2c is arranged on the negative side in the X-axis direction, and the second end surface 2d is arranged on the positive side in the X-axis direction. The first side surface 2e is arranged on the negative side in the Y-axis direction, and the second side surface 2f is arranged on the positive side in the Y-axis direction. Among them, the first main surface 2a becomes the mounting surface opposite to the mounting substrate during installation.

[0039] The shape of the element body 2 is not particularly limited; however, it is a rectangular parallelepiped with the dimension in the X-axis direction being greater than the dimensions in the Z-axis and Y-axis directions. This rectangular parallelepiped shape includes a rectangular parallelepiped with chamfered corners and edges, and a rectangular parallelepiped with rounded corners and edges. For example, the length of the element body 2 in the X-axis direction may be 0.5 to 7.7 mm, the length in the Y-axis direction may be 0.29 to 4.7 mm, and the length in the Z-axis direction may be 0.29 to 4.0 mm.

[0040] In the element body 2, a plurality of dielectric layers ( Figure 2Each dielectric layer 5 is composed of, for example, a sintered body of a ceramic green sheet containing a dielectric material (e.g., a BaTiO3-based, Ba(Ti, Zr)O3-based, or (Ba, Ca)TiO3-based dielectric ceramic). In the actual element body 2, the dielectric layers 5 are integrated to the extent that the boundaries between the dielectric layers 5 are not discernible.

[0041] The terminal electrodes 3 and 4 are provided so as to cover the end faces 2c and 2d of the element body 2. The terminal electrodes 3 and 4 are portions for electrically connecting other components to the electronic component 100. The terminal electrodes 3 and 4 have main bodies 3a and 4a and wrap-around portions 3b and 4b. The main bodies 3a and 4a are formed on the end faces 2c and 2d of the element body 2. The main bodies 3a and 4a are formed so as to cover the entire surfaces of the end faces 2c and 2d. The wrap-around portions 3b and 4b are formed so as to wrap around from the main bodies 3a and 4a toward the main faces 2a and 2b and the side faces 2e and 2f. The wrap-around portion 3b is formed so as to cover a portion of the main faces 2a and 2b and the side faces 2e and 2f near the first end face 2c. The wrap-around portion 4b is formed so as to cover a portion of the main faces 2a and 2b and the side faces 2e and 2f near the second end face 2d.

[0042] The first external connecting conductor 6A is a conductor connected to the plurality of third internal electrodes 13 on the outside of the element body 2. The second external connecting conductor 6B is a conductor connected to the plurality of third internal electrodes 13 on the outside of the element body 2. The first and second external connecting conductors 6A and 6B are formed approximately at the center of the element body 2 in the X-axis direction. The first and second external connecting conductors 6A and 6B are formed so as to be spaced apart from the terminal electrodes 3 and 4 in the X-axis direction. The first external connecting conductor 6A is formed on the side surface 2e. The first external connecting conductor 6A extends along the entire length of the side surface 2e in the Z-axis direction. The first external connecting conductor 6A wraps around the main surfaces 2a and 2b. The second external connecting conductor 6B is formed on the side surface 2f. The second external connecting conductor 6B extends along the entire length of the side surface 2f in the Z-axis direction. The second external connecting conductor 6B wraps around the main surfaces 2a and 2b. The ends 6a and 6b of the first and second external connecting conductors 6A and 6B on the main surface 2b are spaced apart from each other in the Y-axis direction. The ends of the first and second external connecting conductors 6A and 6B on the main surface 2a (although not shown in the figure, they are connected to the Figure 1 (a) The main surfaces 2b of the first and second main surfaces 2a and 2b are separated from each other in the Y-axis direction. This allows the areas near the center of the first and second main surfaces 2a and 2b to be exposed to the first and second external connecting conductors 6A and 6B. Furthermore, this structure mechanically and electrically separates the first and second external connecting conductors 6A and 6B from each other.

[0043] The materials of the terminal electrodes 3, 4 and the external connecting conductor 6 are not particularly limited and may include copper. Furthermore, the terminal electrodes 3, 4 and the first and second external connecting conductors 6A, 6B may comprise copper sintered layers, or alternatively, Ni plating, Sn plating, or the like may be formed on these sintered layers. Furthermore, the terminal electrodes 3, 4 and the external connecting conductor 6 may include a conductive resin layer made of, for example, silver.

[0044] like Figure 2 As shown, the internal electrodes 11, 12, and 13 are flat-plate-shaped conductive patterns extending parallel to the XY plane. Multiple internal electrodes 11, 12, and 13 are formed in the Z-axis direction. The first internal electrode 11 is provided in a region on the negative side of the X-axis within the element body 2 and is connected to the first terminal electrode 3 at the first end face 2c. The second internal electrode 12 is provided in a region on the positive side of the X-axis within the element body 2 and is connected to the second terminal electrode 4 at the second end face 2d. The first and second internal electrodes 11, 12 are arranged in the same plane. That is, the first and second internal electrodes 11, 12 are formed on the same dielectric layer 5 and are positioned at the same position in the Z-axis direction. Before lamination, the conductive patterns of the first and second internal electrodes 11, 12 are formed on the ceramic green sheets of the dielectric layer 5. The first and second internal electrodes 11, 12 are mechanically (physically, structurally) separated from each other. The layer containing the first and second internal electrodes 11, 12 is sometimes referred to as the first electrode layer 41. When the internal electrodes are separated from each other, the material of the dielectric layer 5 is interposed in the entire region between one internal electrode and the other internal electrode.

[0045] The third internal electrode 13 is provided in regions on both the negative and positive sides of the element body 2 in the X-axis direction, and is led out to the first side surface 2e and the second side surface 2f (see Figure 3A In a state before lamination, the third internal electrode 13 is formed on the ceramic green sheet of the dielectric layer 5. In addition, the layer having the third internal electrode 13 is sometimes referred to as a second electrode layer 42.

[0046] like Figures 3A to 3C As shown, in the Z-axis direction, the first inner electrode 11 faces a portion of the first region 21 of the third inner electrode 13 on the negative side in the X-axis direction, but does not face the second inner electrode 12. In the Z-axis direction, the second inner electrode 12 faces a portion of the second region 22 of the third inner electrode 13 on the positive side in the X-axis direction, but does not face the first inner electrode 11. The first inner electrode 11 and the first region 21 are arranged to be separated from the second inner electrode 12 and the second region 22 in the X-axis direction with a gap therebetween.

[0047] Reference Figures 3A to 3C An example of the specific shape of each internal electrode 11, 12, 13 will be described. Figure 3BAs shown, the first internal electrode 11 extends from the first end face 2c toward the center of the element body 2 toward the positive side in the X-axis direction. The edge 11a of the first internal electrode 11 on the inner side (positive side) in the X-axis direction extends parallel to the Y-axis direction. The edge of the first internal electrode 11 on the negative side in the X-axis direction is exposed from the first end face 2c and connected to the first terminal electrode 3. The edge of the first internal electrode 11 on the negative side in the Y-axis direction is spaced apart from and parallel to the first side face 2e. The edge of the first internal electrode 11 on the positive side in the Y-axis direction is spaced apart from and parallel to the second side face 2f.

[0048] The second inner electrode 12 extends from the second end face 2d toward the center of the element body 2, toward the negative side in the X-axis direction. The inner edge 12a of the second inner electrode 12 in the X-axis direction (the negative side in the X-axis direction) extends parallel to the Y-axis direction. The edge 12a of the second inner electrode 12 is spaced apart in the X-axis direction and parallel to the edge 11a of the first inner electrode 11. The positive edge of the second inner electrode 12 in the X-axis direction is exposed from the second end face 2d and connected to the second terminal electrode 4. The negative edge of the second inner electrode 12 in the Y-axis direction is spaced apart from and parallel to the first side face 2e. The positive edge of the second inner electrode 12 in the Y-axis direction is spaced apart from and parallel to the second side face 2f. The edges on both sides of the second inner electrode 12 in the Y-axis direction are co-located with the edges on both sides of the first inner electrode 11 in the Y-axis direction.

[0049] like Figure 3A As shown, the third inner electrode 13 includes a first region 21, a second region 22, a first connecting portion 23, a second connecting portion 24, a lead portion 26, and a lead portion 27. The third inner electrode 13 has an opening 30 in a region between the first inner electrode 11 and the second inner electrode 12 as viewed in the Z-axis direction.

[0050] The first region 21 is a region closer to the first end face 2c than the opening 30. The first region 21 is a portion arranged to overlap with the first internal electrode 11 (see Figure 3C The edge of the first region 21 on the positive side in the X-axis direction (edge ​​30a of the opening 30) extends parallel to the Y-axis direction. The edge of the first region 21 on the negative side in the X-axis direction separates from the first end surface 2c toward the positive side in the X-axis direction. The edges on both sides in the Y-axis direction of the first region 21 have the same shape as the ends on both sides in the Y-axis direction of the first internal electrode 11 and are arranged at the same position (see Figure 3C ).

[0051] The second region 22 is a region closer to the second end face 2d than the opening 30. The second region 22 is a portion arranged to overlap with the second internal electrode 12 (see Figure 3CThe edge of the second region 22 on the negative side in the X-axis direction (edge ​​30b of the opening 30) extends parallel to the Y-axis direction. The edge of the second region 22 on the positive side in the X-axis direction separates from the second end face 2d toward the negative side in the X-axis direction. The edges on both sides of the second region 22 in the Y-axis direction have the same shape as the ends on both sides of the second internal electrode 12 in the Y-axis direction and are arranged at the same position (see Figure 3C ).

[0052] The first connecting portion 23 and the second connecting portion 24 connect the first region 21 and the second region 22. The first connecting portion 23 is formed on the first side surface 2e where the first external connecting conductor 6A is provided. The first connecting portion 23 is connected to the first external connecting conductor 6A on the first side surface 2e via the lead portion 26. The negative edge of the first connecting portion 23 in the Y-axis direction extends in the X-axis direction at the same position as the negative edges of the first and second regions 21 and 22 in the Y-axis direction. The positive edge of the first connecting portion 23 in the Y-axis direction (edge ​​30c of the opening 30) defines the negative edge of the opening 30 in the Y-axis direction and extends in the X-axis direction. The second connecting portion 24 is formed on the second side surface 2f where the second external connecting conductor 6B is provided. The second connecting portion 24 is connected to the second external connecting conductor 6B on the second side surface 2f via the lead portion 27. The edge of the second connecting portion 24 on the positive side in the Y-axis direction extends in the X-axis direction at the same position in the Y-axis direction as the edges of the first and second regions 21 and 22 on the positive side in the Y-axis direction. The edge of the second connecting portion 24 on the negative side in the Y-axis direction (edge ​​30d of the opening 30) defines the edge of the opening 30 on the positive side in the Y-axis direction and extends in the X-axis direction.

[0053] The lead portion 26 extends from the first connecting portion 23 toward the negative side in the Y-axis direction, is exposed on the first side surface 2e, and is connected to the first external connecting conductor 6A. The lead portion 26 extends parallel to the Y-axis direction from the center of the first connecting portion 23 in the X-axis direction. However, as long as it is connected to the first external connecting conductor 6A, the position of the lead portion 26 in the X-axis direction is not particularly limited, and it may extend obliquely with respect to the Y-axis direction. The lead portion 27 extends from the second connecting portion 24 toward the positive side in the Y-axis direction, is exposed on the second side surface 2f, and is connected to the second external connecting conductor 6B. The lead portion 27 extends parallel to the Y-axis direction from the center of the second connecting portion 24 in the X-axis direction. However, as long as it is connected to the second external connecting conductor 6B, the position of the lead portion 27 in the X-axis direction is not particularly limited, and it may extend obliquely with respect to the Y-axis direction.

[0054] The opening 30 is an area where the conductive layer constituting the third internal electrode 13 is not provided. However, as with the first relaxing layer 31 described later, a conductive layer separate from the third internal electrode 13 may also be provided within the opening 30. The opening 30 is an area surrounded by edges 30a, 30b, 30c, and 30d. Edge 30a is formed by the positive edge of the first region 21 in the X-axis direction. Edge 30b is formed by the negative edge of the second region 22 in the X-axis direction. Edge 30c is formed by the positive edge of the first connecting portion 23 in the Y-axis direction. Edge 30d is formed by the negative edge of the second connecting portion 24 in the Y-axis direction. In this embodiment, the opening 30 is a rectangular shape with its longitudinal side in the Y-axis direction. However, the shape of the opening 30 is not particularly limited and may also have an oblong shape. The opening 30 may be formed in a range that includes at least the center of the element body 2 in the Y-axis direction. Note that the size of the opening 30 and the like will be described later.

[0055] In the present embodiment, the first inner electrode 11 does not overlap with the second inner electrode 12 or the second region 22 in the Z-axis direction. The second inner electrode 12 does not overlap with the first inner electrode 11 or the first region 21 in the Z-axis direction. The inner electrodes 11, 12, 13 are mechanically and electrically isolated from each other.

[0056] like Figure 2 As shown, when viewed in the Z-axis direction, the element body 2 has a gap 25 at the position of the opening 30 where no internal electrodes 11, 12, or 13 are formed. Specifically, the gap 25 is formed by combining the gap between the edge 11a of the first internal electrode 11 and the edge 12a of the second internal electrode 12, and the gap between the edges 30a and 30b of the opening 30 of the third internal electrode 13. Furthermore, the combination of these gaps forms the gap 25 by being continuous in the Z-axis direction.

[0057] The stacking order of the first electrode layer 41 and the second electrode layer 42 is not particularly limited. For example, Figure 4 The order shown. Figure 4 As shown, in the element body 2, a plurality of first electrode layers 41 and a plurality of second electrode layers 42 are stacked. The first electrode layers 41 and the second electrode layers 42 are stacked alternately. That is, from the bottom, the first electrode layer 41, the second electrode layer 42, the first electrode layer 41, and the second electrode layer 42 are stacked in this order, and this stacking order is repeated.

[0058] The first internal electrode 11 and the second internal electrode 12 are arranged in the outermost layer of the stacked internal electrodes. That is, among the internal electrodes arranged inside the element body 2, the first internal electrode 11 and the second internal electrode 12 are arranged on the most positive side in the Z-axis direction, and the first internal electrode 11 and the second internal electrode 12 are arranged on the most negative side in the Z-axis direction.

[0059] Next, the circuit structure formed by the above-mentioned stacked structure is described. Figure 4 As shown, current flows through the first inner electrode 11. A first capacitor portion 10A is formed between the first inner electrode 11 and the first region 21 of the third inner electrode 13. The first region 21 and the second region 22 of the third inner electrode 13 are connected via the connecting portions 23 and 24. A second capacitor portion 10B is formed between the second region 22 of the third inner electrode 13 and the second inner electrode 12. As described above, the first capacitor portion 10A, formed by the first inner electrode 11 and the first region 21 facing each other, and the second capacitor portion 10B, formed by the second inner electrode 12 and the second region 22 facing each other, are connected in series via the connecting portions 23 and 24.

[0060] Furthermore, the first internal electrode 11 has a first lead portion 28 (see FIG. 1 ) that is led out from the first capacitor portion 10A toward the first terminal electrode 3. Figure 3B 、 3C The second inner electrode 12 has a second lead portion 29 ( Figure 3B 、 3C ).

[0061] Next, the dimensional relationship is explained. Figure 3C As shown, the overlap width W1 of the first capacitor portion 10A and the second capacitor portion 10B in the Y-axis direction can be set to 0.25 to 4.3 mm, and the overlap length L1 of the first capacitor portion 10A and the second capacitor portion 10B in the X-axis direction can be set to 0.20 to 3.8 mm.

[0062] like Figure 3A As shown, the width W2 of the connecting portions 23 and 24 of the third inner electrode 13 in the Y-axis direction relative to the overlapping width W1 of the first capacitor portion 10A and the second capacitor portion 10B in the Y-axis direction can be 10% or more, and more preferably 12% or more. The upper limit of the width W2 of the connecting portions 23 and 24 is not particularly limited, but can be 45% or less relative to the overlapping width W1. The width W2 of the connecting portions 23 and 24 of the third inner electrode 13 in the Y-axis direction can be greater than the width W3 of the lead portions 26 and 27 connected to the external connecting conductors 6A and 6B in the X-axis direction. The width W2 of the connecting portions 23 and 24 relative to the width W3 of the lead portions 26 and 27 is not particularly limited, and can be 105% to 3500% of the width W3.

[0063] like Figure 3AAs shown, the length L2 of the connecting portions 23, 24 of the third inner electrode 13 in the X-axis direction may be 100% or less, and more preferably 70% or less, of the overlapping length L1 of the first capacitor portion 10A and the second capacitor portion 10B in the X-axis direction. The lower limit of the length L2 of the connecting portions 23, 24 is not particularly limited and may be at least twice the thickness T of the dielectric layer 5.

[0064] like Figure 3C As shown, the area of ​​the lead portions 28, 29 of the internal electrodes 11, 12 may be larger than the area of ​​the connecting portions 23, 24 of the third internal electrodes 13. The area of ​​the lead portions 28, 29 of the internal electrodes 11, 12 may be 103% to 1000% of the area of ​​the connecting portions 23, 24 of the third internal electrodes 13.

[0065] The width W4 of the opening 30 in the X-axis direction may be the width of the dielectric layer 5 between the internal electrodes 11, 12 and the third internal electrode 13 (see FIG. Figure 2 ) in the Z-axis direction, more preferably more than 5 times. The upper limit of the width W4 of the opening 30 is not particularly limited and can be 1000 times or less of the thickness T of the dielectric layer 5. The thickness T of the dielectric layer 5 is not particularly limited and can be set to about 1 to 50 μm. In addition, the dimension in the X-axis direction between the edges 11a and 12a of the internal electrodes 11 and 12 can be approximately equal to the width W4 of the opening 30. Therefore, the width of the gap 25 in the X-axis direction can be approximately equal to the width W4 of the opening 30. The width of the gap 25 in the X-axis direction is the maximum dimension in the gap 25 in the X-axis direction.

[0066] Here, if Figure 2 As shown in (a), the edge 30a on the negative side in the X-axis direction of the opening 30 is preferably arranged at the same position in the X-axis direction as the edge 11a of the first internal electrode 11. The edge 30b on the positive side in the X-axis direction of the opening 30 is preferably arranged at the same position in the X-axis direction as the edge 12a of the second internal electrode 12. Figure 2In the cross-sectional view shown in (a), a reference line SL1 extending in the Z-axis direction relative to the position of the edge 11a of the first internal electrode 11 is set, and a reference line SL2 extending in the Z-axis direction relative to the position of the edge 12a of the second internal electrode 12 is set. At this time, the edges 30a, 30b of the opening 30 are preferably arranged on the reference lines SL1, SL2. The dimension in the X-axis direction between the edges 30a, 30b of the opening 30 and the reference lines SL1, SL2 is referred to as the "stack offset." A state in which there is no X-axis offset between the edges 11a, 12a and the edges 30a, 30b is defined as "stack offset = 0." The stack offset between the edges 11a, 12a and the edges 30a, 30b is acceptable as long as it is within a specified range.

[0067] Reference Figure 5 and Figure 6 The allowable range of stacking offset is explained. Figure 5 (a) is a diagram showing the results of simulating the electric field strength for the model of the electronic component of the comparative example. The electronic component of the comparative example uses a third internal electrode 123 without an opening 30. In this case, the third internal electrode 123 extends to both sides of the Y-axis direction above and below the edge 12a of the second internal electrode 12. In this case, Figure 5 As shown in A in (b), a portion with a high electric field intensity is formed near the edge 12a. The electric field concentration factor is calculated based on the maximum value of the electric field intensity at this time and is set to Figure 6 The electric field concentration factor is a parameter indicating the relative electric field intensity at the location with the maximum electric field intensity when the electric field intensity at the center of the capacitor portion is set to 1.

[0068] Next, a model of the electronic component of the embodiment having the opening 30 was prepared and the electric field strength was simulated. Here, the stacking offset was varied on both the positive and negative sides in the X-axis direction and the electric field concentration coefficient was calculated and plotted. Figure 6 's curve graph.

[0069] Figure 6 The horizontal axis of the graph represents the stacking offset, and the vertical axis represents the electric field concentration factor. In addition, the stacking offset is expressed as a multiple of the thickness T of the dielectric layer 5 set to 1. When the stacking offset is 0, as shown in FIG. Figure 5 As shown in (c), the electric field intensity near the edge 12a is relaxed. Figure 6 As shown, the electric field concentration factor increases with increasing stacking offset. When the stacking offset is "dielectric layer thickness T x 8," the electric field concentration factor is roughly the same as that of the comparative example. Thus, setting the stacking offset to 8 times or less the thickness T of the dielectric layer 5 effectively suppresses electric field concentration.

[0070] In addition, electric field intensity simulations were performed using the finite element method. The dimensions of the electronic components of the examples and comparative examples were set as follows. Specifically, the element body 2 had an "X-axis length L = 1.6 mm, a Y-axis width W = 0.8 mm, and a Z-axis thickness T = 0.8 mm." The thickness of the dielectric layer was set to 1 to 5 μm. The dimension of the opening 30 in the X-axis direction was set to 0.1 to 0.3 mm, and the dimension in the Y-axis direction was set to 0.36 mm.

[0071] Next, the operation and effects of the electronic component 100 according to this embodiment will be described.

[0072] First, an electronic component of a comparative example will be described. Figure 7 (c) is a schematic cross-sectional view showing the internal structure of the element body 2 of the electronic component 200 of the comparative example. The electronic component 200 includes an internal electrode 115 instead of the internal electrode 13 of the present embodiment. The internal electrode 115 forms both the first capacitor unit 10A and the second capacitor unit 10B and does not have an opening 30. The internal electrode 115 is also not connected to an external connecting conductor. The internal electrode 115 extends in a manner opposite to both the first internal electrode 11 and the second internal electrode 12. Therefore, no gap 25 is formed in the element body 2, and the internal electrode 115 has a connecting portion CT connecting the first capacitor unit 10A and the second capacitor unit 10B. In this electronic component 200, since it does not have an external connecting conductor, if one of the first capacitor unit 10A and the second capacitor unit 10B is short-circuited, the short circuit cannot be detected. In addition, if a crack CR occurs in one first capacitor unit 10A, the crack CR may reach the other second capacitor unit 10B along the connecting portion CT. In this case, due to the influence of the short circuit of the first capacitor unit 10A, both capacitor units 10A and 10B are short-circuited.

[0073] Figure 7 (d) is a schematic cross-sectional view of an electronic component 250 of a comparative example having the structure disclosed in Japanese Patent Application Laid-Open No. 2019-46876. This electronic component 250 includes capacitor sections 10A and 10B in the stacking direction. In electronic component 250, short circuits in each capacitor section 10A and 10B can be detected individually. However, due to the short interlayer distance, if a flex crack CR occurs, both capacitor sections 10A and 10B may short-circuit.

[0074] In contrast, in the electronic component 100 of the present embodiment, the first internal electrode 11 connected to the first terminal electrode 3 is opposite to the first region 21 of the third internal electrode 13, and the second internal electrode 12 connected to the second terminal electrode 4 is opposite to the second region 22 of the third internal electrode 13. Here, the first region 21 and the second region 22 of the third internal electrode 13 are electrically connected via the connecting portions 23 and 24. With this structure, the first capacitor portion 10A formed by the first internal electrode 11 and the first region 21 being opposite to each other, and the second capacitor portion 10B formed by the second internal electrode 12 and the second region 22 being opposite to each other are connected in series via the connecting portions 23 and 24. Therefore, it is possible to improve accessibility. For example, Figure 7 As shown in (a), even if a crack CR occurs in capacitor unit 10A and short-circuits, capacitor unit 10B can continue to be used. In addition, the presence of a short-circuit failure in capacitor units 10A and 10B can be measured and inspected by using first terminal electrode 3 and external connection conductors 6A and 6B.

[0075] Here, if Figure 7 As shown in (c), in the electronic component 200 of the comparative example, the electric field intensity becomes high near the edge of the center side of the internal electrodes 11 and 12 due to the influence of the connecting portion CT (see also Figure 5 (a)(b)). Therefore, cracks CRX may form, originating from the electric field concentration area at the edge of the center side of the internal electrodes 11 and 12. In contrast, in this embodiment, the third internal electrode 13 has an opening 30 in the region between the first internal electrode 11 and the second internal electrode 12, as viewed in the Z-axis direction. Therefore, the electric field intensity can be reduced near the region between the first internal electrode 11 and the second internal electrode 12. As a result, cracks in the element body 2 caused by electric field concentration can be suppressed. As a result, the performance of the electronic component 100 having multiple capacitor sections connected in series can be improved.

[0076] In addition, a gap 25 is formed between the capacitor portion 10A and the capacitor portion 10B due to the opening 30. Therefore, Figure 7 As shown in (b), the crack CR generated in one capacitor portion 10A can be prevented from reaching the other capacitor portion 10B along the connecting portion CT. Therefore, the crack CR can be prevented from entering both capacitor portions 10A and 10B and causing a short circuit.

[0077] The third inner electrode 13 may include a first region 21 located closer to the first end face 2c than the opening 30, a second region 22 located closer to the second end face 2d than the opening 30, and connecting portions 23 and 24 connecting the first and second regions 21 and 22. The connecting portions 23 and 24 may be formed on the side faces 2e and 2f where the external connecting conductors 6A and 6B are provided. In this case, the connecting portions 23 and 24 can be brought closer to the external connecting conductors 6A and 6B. Therefore, by shortening the length of the lead portions 26 and 27 of the third inner electrode 13 extending to the external connecting conductors 6A and 6B, Joule heating caused by current flowing through the lead portions 26 and 27 can be reduced, thereby minimizing the possibility of damage due to this Joule heat.

[0078] The external connecting conductors 6A and 6B may be formed on the first side face 2e and the second side face 2f, and the third inner electrode 13 may include a first connecting portion 23 connected to the external connecting conductor 6A on the first side face 2e, and a second connecting portion 24 connected to the external connecting conductor 6B on the second side face 2f. In this case, the presence of a short circuit can be inspected using either of the external connecting conductors 6A and 6B on the first side face 2e and the second side face 2f.

[0079] The width W2 of the connecting portions 23 and 24 of the third inner electrode 13 in the Y-axis direction may be 10% or more of the overlapping width W1 of the first capacitor portion 10A and the second capacitor portion 10B in the Y-axis direction. In this case, by ensuring the width of the connecting portions 23 and 24, Joule heating caused by the current can be reduced, and damage caused by this Joule heating can be suppressed.

[0080] The length L2 of the connecting portions 23 and 24 of the third inner electrode 13 in the X-axis direction may be 100% or less of the overlapping length L1 of the first capacitor portion 10A and the second capacitor portion 10B in the X-axis direction. In this case, by reducing the length of the connecting portions 23 and 24, Joule heating caused by the current can be reduced, and damage caused by this Joule heating can be suppressed.

[0081] The width W2 of the connecting portions 23 and 24 of the third inner electrode 13 in the Y-axis direction may be greater than the width W3 of the lead portions 26 and 27 connected to the external connecting conductors 6A and 6B in the X-axis direction. In this case, by ensuring the width of the connecting portions 23 and 24, Joule heating due to current flow can be reduced while ensuring reliable connectivity with the external connecting conductors 6A and 6B.

[0082] The width W4 of the opening 30 in the X-axis direction may be at least twice the thickness T in the Z-axis direction of the dielectric layer 5 (first dielectric layer) between the first and second inner electrodes 11, 12 and the third inner electrode 13. In this case, the withstand voltage performance near the opening 30 can be improved to a level higher than the interlayer withstand voltage performance of the dielectric layer 5.

[0083] The present invention is not limited to the above-described embodiment.

[0084] The shapes of the internal electrodes 11 and 12 are not limited to the above-mentioned embodiment. Figure 8 The structure shown. Figure 8 In the example shown, first and second lead portions 28 and 29 can be narrower in the Y-axis direction than first and second capacitor portions 10A and 10B. Specifically, the Y-axis width W5 of lead portions 28 and 29 is smaller than the overlapping width W1 of capacitor portions 10A and 10B. While not particularly limited, width W5 can be 90% or less of overlapping width W1. Furthermore, as described above, the lower limit of width W5 can be set within a range where the area of ​​lead portions 28 and 29 is larger than that of connecting portions 23 and 24.

[0085] As described above, the first internal electrode 11 may have a first lead portion 28 extending from the first capacitor portion 10A to the first terminal electrode 3, and the second internal electrode 12 may have a second lead portion 29 extending from the second capacitor portion 10B to the second terminal electrode 4, and the first lead portion 28 and the second lead portion 29 may be narrower in the Y-axis direction than the first capacitor portion 10A and the second capacitor portion 10B. Figure 5 The electric field concentration shown in (a) and (b) can also be generated near the edge of the first capacitor part 10A and the second capacitor part 10B on the side of the end surface 2c and 2d. Figure 8 The structure shown can reduce the area of ​​the first and second inner electrodes 11, 12 that overlaps with the edge of the third inner electrode 13. This reduces the electric field intensity near the end faces 2c, 2d and reduces cracking.

[0086] You can also use Figure 9 The structure shown. Figure 9In the example shown, a first relaxation layer 31 is formed inside the opening 30 to alleviate the formation of a depression in the element body 2. In addition, a second relaxation layer 32 is formed between the first internal electrode 11 and the second internal electrode 12 to alleviate the formation of a depression in the element body 2. The first relaxation layer 31 and the second relaxation layer 32 can be composed of a conductor layer or a second dielectric layer. The relaxation layers 31 and 32 as the second dielectric layer are dielectric layers different from the dielectric layer 5 (first dielectric layer) between the first and second internal electrodes 11, 12 and the third internal electrode 13. The dielectric layers of the relaxation layers 31 and 32 have a strength that makes it difficult to form a depression than the dielectric layer 5. The first relaxation layer 31 is separated from the third internal electrode 13. The second relaxation layer 32 is separated from the internal electrodes 11 and 12. There is no particular limitation on the size of the relaxation layers 31 and 32 relative to the opening 30. For example, the area of ​​the relaxation layers 31 and 32 can be less than 97% of the area of ​​the opening 30, and more preferably less than 80%. In addition, as Figure 10 As shown, the lead-out portions 28 and 29 can be used. Figure 9 However, if the second dielectric layer is used, the first relaxation layer 31 and the second relaxation layer 32 may be formed to overlap with the opening 30 and the edges of the internal electrodes 11 and 12 .

[0087] As described above, a first buffering layer 31 may be formed inside the opening 30 to mitigate the depression formed in the element body 2. In this case, the depression on the main surfaces 2a and 2b of the element body 2 can be reduced. The main surfaces 2a and 2b can be used as surfaces for suction by a suction device when the element body 2 is transported. Therefore, by reducing the depression on the main surfaces 2a and 2b, the element body 2 can be easily picked up by suction.

[0088] A second relaxing layer 32 for relaxing the depression in the element body 2 may be formed between the first internal electrode 11 and the second internal electrode 12. In this case, the depression on the main surfaces 2a and 2b of the element body 2 can be reduced. This facilitates pickup of the element body 2 by suction.

[0089] The first and second relaxing layers 31 and 32 may be formed of a conductive layer or a second dielectric layer. In this case, the conductive layer or the second dielectric layer sufficiently supports the inside of the opening 30, thereby reducing the concavity on the main surfaces 2a and 2b of the element body 2. This facilitates the pickup of the element body 2 by suction.

[0090] The connection portion does not need to be provided on both sides of the Y-axis direction, and only one of the connection portions 23 and 24 needs to be provided. Figure 11 In the example shown, the connecting portion 24 is omitted and the third internal electrode 13 has only the connecting portion 23. The opening 30 opens on the positive side in the Y-axis direction. Figure 12 As shown, it can be used relative to Figure 11 The structure of the relaxation layer 31, 32 is provided. Figure 13 As shown, the lead-out portions 28 and 29 can be used. Figure 12 The structure width is narrow.

[0091] like Figure 14 As shown, the connecting portion 120 can be provided at the center position in the Y-axis direction. The lead portions 26 and 27 are provided to extend from the connecting portion 120 to both sides in the Y-axis direction. In this case, the opening 30 is formed between the lead portions 26 and 27 and the first region 21, and between the lead portions 26 and 27 and the second region 22. Figure 15 As shown, the lead-out portions 28 and 29 can be used. Figure 13 The structure width is narrow.

[0092] The shape of the element body 2 is not limited to a rectangular parallelepiped as long as it has a pair of main surfaces facing each other and side surfaces extending between the main surfaces.

[0093] [Method 1]

[0094] An electronic component comprising:

[0095] A body having a first main surface and a second main surface opposite to each other in a first direction, a first end surface and a second end surface opposite to each other in a second direction perpendicular to the first direction, and a first side surface and a second side surface opposite to each other in a third direction perpendicular to the first and second directions;

[0096] a first terminal electrode formed on the first end surface;

[0097] a second terminal electrode formed on the second end surface;

[0098] an external connection conductor formed on at least one of the first side surface and the second side surface;

[0099] a first internal electrode disposed in the element body and connected to the first terminal electrode at the first end surface;

[0100] a second internal electrode disposed in the element body, separated from the first internal electrode, and connected to the second terminal electrode on the second end surface;

[0101] a third internal electrode provided in the element body, facing the first internal electrode and the second internal electrode in the first direction, and connected to the external connection conductor;

[0102] A first capacitor portion formed by the first inner electrode and the third inner electrode facing each other and a second capacitor portion formed by the second inner electrode and the third inner electrode facing each other are connected in series.

[0103] The third inner electrode has an opening in a region between the first inner electrode and the second inner electrode when viewed from the first direction.

[0104] [Method 2]

[0105] The electronic component according to embodiment 1, wherein

[0106] The third internal electrode comprises:

[0107] a first region located closer to the first end surface than the opening;

[0108] a second region located closer to the second end surface than the opening;

[0109] a connecting portion connecting the first region and the second region,

[0110] The connecting portion is formed on the side surface where the external connecting conductor is provided.

[0111] [Method 3]

[0112] The electronic component according to embodiment 2, wherein

[0113] The external connection conductor is formed on the first side surface and the second side surface,

[0114] The third inner electrode includes, as the connecting portion, a first connecting portion connected to the outer connecting conductor at the first side face and a second connecting portion connected to the outer connecting conductor at the second side face.

[0115] [Method 4]

[0116] The electronic component according to aspect 2 or 3, wherein

[0117] The width of the connecting portion of the third inner electrode in the third direction is equal to or greater than 10% of the overlapping widths of the first capacitor portion and the second capacitor portion in the third direction.

[0118] [Method 5]

[0119] The electronic component according to any one of aspects 2 to 4, wherein

[0120] The length of the connecting portion of the third inner electrode in the second direction is equal to or less than 100% of the overlapping length of the first capacitor portion and the second capacitor portion in the second direction.

[0121] [Method 6]

[0122] The electronic component according to any one of aspects 2 to 5, wherein

[0123] The width of the connecting portion of the third inner electrode in the third direction is larger than the width of the lead portion connected to the external connecting conductor in the second direction.

[0124] [Method 7]

[0125] The electronic component according to any one of aspects 1 to 6, wherein

[0126] The first internal electrode has a first lead portion extending from the first capacitor portion to the first terminal electrode.

[0127] The second inner electrode has a second lead portion extending from the second capacitor portion to the second terminal electrode.

[0128] The first lead portion and the second lead portion are narrower in width than the first capacitor portion and the second capacitor portion in the third direction.

[0129] [Method 8]

[0130] The electronic component according to any one of aspects 1 to 7, wherein

[0131] The width of the opening in the second direction is at least twice the thickness of the first dielectric layer between the first and second inner electrodes and the third inner electrode in the first direction.

[0132] [Method 9]

[0133] The electronic component according to any one of aspects 1 to 8, wherein

[0134] A first relaxing layer is formed inside the opening to relax a depression formed in the element body.

[0135] [Method 10]

[0136] The electronic component according to any one of aspects 1 to 9, wherein

[0137] A second relaxing layer is formed between the first internal electrode and the second internal electrode to relax a recess formed in the element body.

[0138] [Method 11]

[0139] The electronic component according to aspect 9 or aspect 10, wherein:

[0140] The first relaxation layer and the second relaxation layer are formed of a conductor layer or a second dielectric layer.

Claims

1. An electronic component, wherein: have: A body having a first main surface and a second main surface opposite to each other in a first direction, a first end surface and a second end surface opposite to each other in a second direction perpendicular to the first direction, and a first side surface and a second side surface opposite to each other in a third direction perpendicular to the first and second directions; a first terminal electrode formed on the first end surface; a second terminal electrode formed on the second end surface; an external connection conductor formed on at least one of the first side surface and the second side surface; a first internal electrode disposed in the element body and connected to the first terminal electrode at the first end surface; a second internal electrode disposed in the element body, separated from the first internal electrode, and connected to the second terminal electrode on the second end surface; as well as a third internal electrode provided in the element body, facing the first internal electrode and the second internal electrode in the first direction, and connected to the external connection conductor; A first capacitor portion formed by the first inner electrode and the third inner electrode facing each other and a second capacitor portion formed by the second inner electrode and the third inner electrode facing each other are connected in series. The third inner electrode has an opening in a region between the first inner electrode and the second inner electrode when viewed from the first direction.

2. The electronic component according to claim 1, wherein The third internal electrode comprises: a first region located closer to the first end surface than the opening; a second region located closer to the second end surface than the opening; and a connecting portion connecting the first region and the second region, The connecting portion is formed on the side surface where the external connecting conductor is provided.

3. The electronic component according to claim 2, wherein The external connection conductor is formed on the first side surface and the second side surface, The third inner electrode includes, as the connecting portion, a first connecting portion connected to the outer connecting conductor at the first side face and a second connecting portion connected to the outer connecting conductor at the second side face.

4. The electronic component according to claim 2, wherein The width of the connecting portion of the third inner electrode in the third direction is equal to or greater than 10% of the overlapping widths of the first capacitor portion and the second capacitor portion in the third direction.

5. The electronic component according to claim 2, wherein The length of the connecting portion of the third inner electrode in the second direction is equal to or less than 100% of the overlapping length of the first capacitor portion and the second capacitor portion in the second direction. The electronic component according to claim 2 , wherein The width of the connecting portion of the third inner electrode in the third direction is larger than the width of the lead portion connected to the external connecting conductor in the second direction.

7. The electronic component according to claim 1, wherein The first internal electrode has a first lead portion extending from the first capacitor portion to the first terminal electrode. The second inner electrode has a second lead portion extending from the second capacitor portion to the second terminal electrode. The first lead portion and the second lead portion are narrower in width than the first capacitor portion and the second capacitor portion in the third direction.

8. The electronic component according to claim 1, wherein The width of the opening in the second direction is at least twice the thickness of the first dielectric layer between the first and second inner electrodes and the third inner electrode in the first direction.

9. The electronic component according to claim 1, wherein A first relaxing layer is formed inside the opening to relax a depression formed in the element body.

10. The electronic component according to claim 1, wherein A second relaxing layer is formed between the first internal electrode and the second internal electrode to relax a recess formed in the element body.

11. The electronic component according to claim 9 or 10, wherein The first relaxation layer and the second relaxation layer are formed of a conductor layer or a second dielectric layer.

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