A semiconductor packaging solder wire casting and forming device

Abstract

This invention discloses a semiconductor packaging solder wire casting and forming apparatus, relating to the field of semiconductor packaging technology. It includes a base frame, and a solder feeding module, a heating mechanism, a casting head, and an adjustment mechanism mounted on the base frame. The solder feeding module is used to feed solder wire into the casting head, and the module includes a casting tube for feeding the solder wire. The outlet of the casting tube is located at the casting head. The heating mechanism heats the solder wire in the casting tube, melting it into liquid tin. The casting head allows the liquid tin to be cast and formed on a substrate. The adjustment mechanism is connected to the casting head and automatically adjusts the angle of the casting head when it contacts the substrate, ensuring complete contact between the lower end of the casting head and the substrate. This invention prevents solder overflow and produces a regular shape with good forming effect.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and in particular to a semiconductor packaging solder wire casting and forming apparatus. Background Technology

[0002] Currently, solder wire forming technology in the industry is mainly divided into two types: one is the soldering + pre-shaping technology, which involves applying solder wire to a high-temperature copper substrate and then using a die head to press the solder wire onto the copper substrate into a designed shape. This technology has disadvantages such as unstable solder forming, irregular shape, and uneven solder thickness, which directly affect the quality of subsequent chip packaging. The other technology is the solder writing technology, which involves the cooperation of a solder feeding motor and a motor that controls the movement of the soldering head in two directions to control the soldering trajectory of the soldering head on a high-temperature frame to achieve solder forming. This technology has disadvantages such as low solder forming temperature and slow speed, which also directly affect the quality of subsequent chip packaging. Summary of the Invention

[0003] The purpose of this invention is to provide a semiconductor packaging solder wire casting and forming device to solve the problems existing in the prior art, prevent solder overflow, and form a regular shape with good forming effect.

[0004] To achieve the above object, the present invention provides the following solutions:

[0005] This invention provides a semiconductor packaging solder wire casting forming apparatus, including a base frame, and a solder feeding module, a heating mechanism, a casting head, and an adjustment mechanism mounted on the base frame. The solder feeding module is used to feed solder wire into the casting head, and the solder feeding module is provided with a casting tube for feeding the solder wire. The outlet of the casting tube is located at the casting head. The heating mechanism is used to heat the solder wire in the casting tube and melt the solder wire into liquid tin. The casting head can cast the liquid tin onto a substrate. The adjustment mechanism is connected to the casting head and can automatically adjust the angle of the casting head when the casting head contacts the substrate so that the lower end of the casting head is in complete contact with the substrate.

[0006] Preferably, the adjustment mechanism is installed at the lower end of the solder feeding module and at the upper end of the solder casting head.

[0007] Preferably, the adjustment mechanism includes a Y-axis adjustment housing and an X-axis adjustment housing. The two sides of the Y-axis adjustment housing are rotatably connected to the two opposing inner sidewalls of the lower end of the solder feeding module via a Y-axis rotation shaft. The Y-axis adjustment housing is located on the outer periphery of the X-axis adjustment housing, and the inner sidewall of the Y-axis adjustment housing is rotatably connected to the outer sidewall of the X-axis adjustment housing via two X-axis rotation shafts. The two X-axis rotation shafts are arranged opposite each other, and the line connecting the two X-axis rotation shafts is perpendicular to the line connecting the two Y-axis rotation shafts. The lower end of the X-axis adjustment housing is connected to the upper end of the soldering head.

[0008] Preferably, the lower end of the solder feeding module is provided with a mounting groove, and the two sides of the Y-axis adjustment housing are respectively rotatably mounted on the two opposite inner sidewalls of the mounting groove via the Y-axis rotation axis.

[0009] Preferably, the adjustment mechanism further includes a ball head, which is installed at the lower middle part of the adjustment mechanism, and the middle part of the ball head allows the tin tube to pass through, while the lower end of the ball head presses against the upper top surface of the X-direction adjustment housing.

[0010] Preferably, the tin head is rectangular in shape.

[0011] Preferably, an air groove is formed on the lower end face of the soldering head. The air groove is located near the lower outer edge of the soldering head. The outer ring of the air groove forms a sealing frame, which is a rectangular frame. The inner ring of the air groove forms a rectangular shaped protrusion. A solder outlet hole is provided in the middle of the shaped protrusion. The solder outlet hole is located near the outlet of the soldering tube. The lower end face of the sealing frame is lower than the lower end face of the shaped protrusion. Multiple guide plates are also installed on the lower end face of the shaped protrusion. The lower end face of the guide plates is higher than the lower end face of the sealing frame. The guide plates are located near the air groove, and a flow channel is formed between adjacent guide plates. Each flow channel is respectively located at each corner of the shaped protrusion.

[0012] Preferably, the solder feeding module includes a drive mechanism, a transmission mechanism, a solder feeding drive wheel, a solder feeding driven wheel, and a solder feeding housing. The drive mechanism is mounted on the base frame, and the output shaft of the drive mechanism is connected to the input shaft of the transmission mechanism. The output shaft of the transmission mechanism is connected to the rotating shaft of the solder feeding drive wheel. The solder feeding driven wheel is rotatably mounted on the base frame and is positioned close to the solder feeding drive wheel. The space between the solder feeding drive wheel and the solder feeding driven wheel is used for solder wire entry. When the solder feeding drive wheel rotates, it can drive the solder feeding driven wheel to rotate, and the solder feeding drive wheel and the solder feeding driven wheel clamp the solder wire into the tin tube. The solder feeding housing is sleeved on the outer periphery of the tin tube. The heating mechanism is installed inside the solder feeding housing and is located on the outer periphery of the tin tube.

[0013] Preferably, the heating mechanism is a heating rod, and the outer periphery of the tin feeding shell is also fitted with a heat insulation shell.

[0014] Preferably, it also includes a solder inspection mechanism, which is located above the tin tube and has a through hole for passing solder wire, the through hole being located directly above the tin tube.

[0015] The present invention achieves the following technical effects compared to the prior art:

[0016] The semiconductor packaging solder wire casting and forming apparatus provided by this invention includes a base frame, and a solder feeding module, a heating mechanism, a casting head, and an adjustment mechanism mounted on the base frame. The solder feeding module is used to feed solder wire into the casting head, and the solder feeding module is provided with a casting tube for feeding the solder wire, realizing the guiding and feeding of the solder wire. The outlet of the casting tube is located at the casting head. The casting tube and the solder head are integrated to facilitate the feeding of solder wire to the casting head and to achieve central soldering and surrounding forming. The heating mechanism is used to heat the solder wire in the casting tube and melt the solder wire into liquid tin. This allows the solder wire to reach the casting head in a liquid state, and the liquid solder is cast onto the substrate through the casting head. Compared to the traditional separate design for soldering and forming, this invention places the outlet of the casting tube in the center of the casting head, which enables the solder to have a regular shape, stable forming, and uniform solder thickness after casting, thereby improving the quality of subsequent chip packaging. The adjustment mechanism is connected to the casting head, and the adjustment mechanism can automatically adjust the angle of the casting head when it contacts the substrate, so that the lower end of the casting head is in full contact with the substrate, avoiding liquid solder overflow and affecting the casting effect. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the semiconductor packaging solder wire casting and forming device of the present invention;

[0019] Figure 2 This is a schematic diagram of the adjusting mechanism and the tin-casting head in this invention;

[0020] Figure 3 for Figure 2 A bottom view;

[0021] Figure 4This is a cross-sectional view of a portion of the structure of the semiconductor packaging solder wire casting and forming device of the present invention;

[0022] Figure 5 This is a schematic diagram of the adjustment mechanism in this invention;

[0023] Figure 6 This is a partial structural schematic diagram of the semiconductor packaging solder wire casting and forming device in this invention;

[0024] In the diagram: 1-Soldering inspection mechanism, 2-Transmission mechanism, 3-Soldering drive wheel, 4-Soldering driven wheel, 5-Heat insulation shell, 6-Sealing plate, 7-Adjustment mechanism, 8-Soldering head, 9-Guide column, 10-Sealing frame, 11-Air groove, 12-Forming protrusion, 13-Guide plate, 14-Flow channel, 15-Soldering hole, 16-Solder wire, 17-Soldering tube, 18-Ball head, 19-Heating mechanism, 20-Y-axis adjustment shell, 21-X-axis adjustment shell, 22-Y-axis rotation axis, 23-X-axis rotation axis. Detailed Implementation

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] The purpose of this invention is to provide a semiconductor packaging solder wire casting and forming device to solve the problems existing in the prior art, prevent solder overflow, and form a regular shape with good forming effect.

[0027] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0028] like Figures 1-6As shown, this embodiment provides a semiconductor packaging solder wire casting and forming apparatus, including a base frame, and a solder feeding module, a heating mechanism 19, a casting head 8, and an adjustment mechanism 7 mounted on the base frame. The solder feeding module is used to feed solder wire 16 into the casting head 8, and the solder feeding module is provided with a casting tube 17 for feeding the solder wire 16, realizing the guiding and feeding of the solder wire 16. The outlet of the casting tube 17 is located at the casting head 8. The casting tube 17 is integrated with the solder head to facilitate the feeding of the solder wire 16 to the casting head 8, and to achieve central soldering and surrounding forming. The heating mechanism 19 is used to heat the solder wire 16 in the casting tube 17 and make the solder wire 16 form a solid shape. The solder wire 16 is melted into liquid tin, so that the solder wire 16 is in liquid state when it reaches the casting head 8. The liquid tin is cast onto the substrate through the casting head 8. Compared with the traditional separate design of soldering and forming, this embodiment sets the outlet of the casting tube 17 in the center of the casting head 8, so that the solder casting is regular in shape, stable in forming and uniform in thickness, thereby improving the quality of chip packaging in the later stage. The adjustment mechanism 7 is connected to the casting head 8, and the adjustment mechanism 7 can automatically adjust the angle of the casting head 8 when the casting head 8 contacts the substrate, so that the lower end of the casting head 8 is in complete contact with the substrate, avoiding the overflow of liquid tin and affecting the casting forming effect.

[0029] Specifically, the adjustment mechanism 7 is installed at the lower end of the solder feeding module and at the upper end of the solder casting head 8, thereby enabling adaptive adjustment of the sway angle of the solder casting head 8 through the adjustment mechanism 7.

[0030] The adjustment mechanism 7 includes a Y-axis adjustment housing 20 and an X-axis adjustment housing 21. The two sides of the Y-axis adjustment housing 20 are rotatably connected to the two opposing inner sidewalls at the lower end of the solder feeding module via a Y-axis rotation shaft 22. Thus, the arrangement of the two Y-axis rotation shafts 22 enables the Y-axis adjustment housing 20 and its internal structure to adaptively rotate around the Y-axis. The Y-axis adjustment housing 20 is located on the outer periphery of the X-axis adjustment housing 21, and the inner sidewall of the Y-axis adjustment housing 20 is rotatably connected to the outer sidewall of the X-axis adjustment housing 21 via two X-axis rotation shafts 23. The two X-axis rotation shafts 23 are arranged opposite each other. Furthermore, by setting two X-axis rotation axes 23, the X-axis adjustment housing 21 can be adaptively rotated around the X-axis, and the line connecting the two X-axis rotation axes 23 is perpendicular to the line connecting the two Y-axis rotation axes 22. The lower end of the X-axis adjustment housing 21 is connected to the upper end of the soldering head 8. Thus, when the lower end of the soldering head 8 contacts the substrate, the yaw angle of the Y-axis adjustment housing 20 and the X-axis adjustment housing 21 can be adaptively adjusted according to the angle of the substrate, so that the lower end face of the soldering head 8 is in complete contact with the upper surface of the substrate, thereby preventing liquid solder from overflowing through the gap between the lower end of the soldering head 8 and the upper end of the substrate.

[0031] The lower end of the solder feeding module is provided with a mounting groove. The two sides of the Y-axis adjustment housing 20 are respectively mounted on the two opposite inner side walls of the mounting groove via the Y-axis rotation shaft 22, which facilitates the Y-axis adjustment housing 20 to swing around the Y-axis.

[0032] The adjustment mechanism 7 also includes a ball head 18, which is installed at the lower middle part of the adjustment mechanism 7. The middle part of the ball head 18 allows the tin tube 17 to pass through. The lower end of the ball head 18 presses against the upper top surface of the X-direction adjustment housing 21, thereby applying a squeezing force to the X-direction adjustment housing 21 through the ball head 18 to ensure stability during swaying.

[0033] As a preferred embodiment, the tin head 8 is rectangular in shape.

[0034] An air groove 11 is formed on the lower end face of the soldering head 8 to contain air during the soldering process. The air groove 11 is located near the lower outer edge of the soldering head 8 to avoid affecting the soldering process. The outer ring of the air groove 11 forms a sealing frame 10, which is a rectangular frame. The lower end of the sealing frame 10 is used to contact the upper surface of the substrate. At the same time, the sealing frame 10 can prevent liquid solder from overflowing. The inner ring of the air groove 11 forms a rectangular forming protrusion 12. A solder outlet hole 15 is provided in the middle of the forming protrusion 12. The solder outlet hole 15 is located near the outlet of the soldering tube 17 to discharge liquid solder. The lower end face of the sealing frame 10 is lower than the lower end face of the forming protrusion 12, which facilitates the soldering process. Tin casting is performed at the location of the protrusion 12. Multiple guide plates 13 are also installed on the lower end face of the protrusion 12. The guide plates 13 are preferably trapezoidal plates. The lower end face of the guide plate 13 is higher than the lower end face of the sealing frame 10, and the height difference between the lower end face of the guide plate 13 and the lower end face of the sealing frame 10 is 20μm. The thickness of the guide plate 13 is 10μm. The guide plate 13 is set close to the air groove 11, and a flow channel 14 is formed between adjacent guide plates 13. Each flow channel 14 is set corresponding to each corner of the protrusion 12 to ensure that the liquid tin discharged from the tin outlet 15 can flow to the periphery of the tin outlet 15 so as to form a cubic structure through tin casting.

[0035] The solder feeding module includes a drive mechanism, a transmission mechanism 2, a solder feeding drive wheel 3, a solder feeding driven wheel 4, and a solder feeding housing. The drive mechanism is mounted on a base frame, and its output shaft is connected to the input shaft of the transmission mechanism 2. The output shaft of the transmission mechanism 2 is connected to the rotating shaft of the solder feeding drive wheel 3. Thus, the drive mechanism drives the transmission mechanism 2 to rotate, causing the transmission mechanism 2 to drive the solder feeding drive wheel 3 to rotate. The solder feeding driven wheel 4 is rotatably mounted on the base frame and positioned close to the solder feeding drive wheel 3. The space above the solder feeding drive wheel 3 and the solder feeding driven wheel 4 is used for solder wire 1. The solder wire 16 enters through a guide groove on the outer periphery of the solder feeding drive wheel 3. This guide groove guides the solder wire 16. When the solder feeding drive wheel 3 rotates, it drives the solder feeding driven wheel 4 to rotate, causing the solder wire 16 to be clamped between the drive wheel 3 and the driven wheel 4 and enter the tin casting tube 17. The solder feeding housing is fitted around the outer periphery of the tin casting tube 17, serving a sealing function. The heating mechanism 19 is installed inside the solder feeding housing and located around the outer periphery of the tin casting tube 17, thereby heating the solder wire 16 inside the tin casting tube 17 and melting it into liquid tin. In a preferred embodiment, the transmission mechanism 2 includes two drive wheels and a conveyor belt, with the two drive wheels connected by the conveyor belt.

[0036] The heating mechanism 19 is a heating rod. Those skilled in the art can also select other forms of heating mechanism 19 according to actual needs. The outer periphery of the solder feeding shell is also covered with a heat insulation shell 5 to prevent the solder wire 16 from contacting the air in a high-temperature environment and causing oxidation, which would affect the quality of the tin casting.

[0037] The semiconductor packaging solder wire casting forming device in this embodiment also includes a solder inspection mechanism 1, which is located above the casting tube 17 and has a through hole for the solder wire 16 to pass through. The through hole is located directly above the casting tube 17.

[0038] The semiconductor packaging solder wire casting device in this embodiment also includes a sealing plate 6 and a guide post 9. The sealing plate 6 is located on the outer periphery of the heat insulation shell 5, and the upper end of the guide post 9 is connected to the base frame, while the lower end of the guide post 9 is connected to the upper end of the sealing plate 6, thus positioning the sealing plate 6. Simultaneously, the presence of the heat insulation shell 5 also prevents the solder wire 16 from melting the sealing plate 6 during transport, thereby achieving a better sealing effect.

[0039] In this embodiment, the semiconductor packaging solder wire casting device first guides the solder wire 16 through the through hole in the solder detection mechanism 1 to the space between the active solder feeding wheel 3 and the driven solder feeding wheel 4. The active solder feeding wheel 3 is driven to rotate by the transmission mechanism 2, so that the active solder feeding wheel 3 and the driven solder feeding wheel 4 work together to realize solder delivery. When the casting head 8 contacts the substrate, the adjustment mechanism 7 automatically adjusts the sway angle of the casting head 8 to achieve complete horizontal contact between the casting head 8 and the substrate, thereby achieving the casting effect and preventing solder overflow.

[0040] Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this invention. Furthermore, those skilled in the art will recognize that, based on the ideas of this invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this invention.

Claims

1. A semiconductor packaging solder wire casting and forming device, characterized in that: The device includes a base frame, and a solder feeding module, a heating mechanism, a solder casting head, and an adjustment mechanism mounted on the base frame. The solder feeding module is used to feed solder wire into the solder casting head, and the solder feeding module is provided with a solder tube for feeding the solder wire. The outlet of the solder tube is located at the solder casting head. The heating mechanism is used to heat the solder wire in the solder tube and melt the solder wire into liquid tin. The solder casting head can cast the liquid tin onto the substrate. The adjustment mechanism is connected to the solder casting head and can automatically adjust the angle of the solder casting head when the solder casting head contacts the substrate so that the lower end of the solder casting head is in complete contact with the substrate. The tin casting head is rectangular in shape; An air groove is formed on the lower end face of the soldering head. The air groove is located near the lower outer edge of the soldering head. The outer ring of the air groove forms a sealing frame, which is a rectangular frame. The inner ring of the air groove forms a rectangular shaped protrusion. A solder outlet hole is provided in the middle of the shaped protrusion. The solder outlet hole is located near the outlet of the solder tube. The lower end face of the sealing frame is lower than the lower end face of the shaped protrusion. Multiple guide plates are also installed on the lower end face of the shaped protrusion. The lower end face of the guide plates is higher than the lower end face of the sealing frame. The guide plates are located near the air groove, and a flow channel is formed between adjacent guide plates. Each flow channel is respectively located at each corner of the shaped protrusion.

2. The semiconductor packaging solder wire casting and forming apparatus according to claim 1, characterized in that: The adjustment mechanism is installed at the lower end of the solder feeding module and at the upper end of the solder casting head.

3. The semiconductor packaging solder wire casting and forming apparatus according to claim 2, characterized in that: The adjustment mechanism includes a Y-axis adjustment housing and an X-axis adjustment housing. The two sides of the Y-axis adjustment housing are rotatably connected to the two opposing inner sidewalls of the lower end of the solder feeding module via a Y-axis rotation shaft. The Y-axis adjustment housing is located on the outer periphery of the X-axis adjustment housing, and the inner sidewall of the Y-axis adjustment housing is rotatably connected to the outer sidewall of the X-axis adjustment housing via two X-axis rotation shafts. The two X-axis rotation shafts are arranged opposite each other, and the line connecting the two X-axis rotation shafts is perpendicular to the line connecting the two Y-axis rotation shafts. The lower end of the X-axis adjustment housing is connected to the upper end of the soldering head.

4. The semiconductor packaging solder wire casting and forming apparatus according to claim 3, characterized in that: The lower end of the solder feeding module is provided with a mounting groove, and the two sides of the Y-axis adjustment housing are respectively rotatably mounted on the two opposite inner sidewalls of the mounting groove via the Y-axis rotation axis.

5. The semiconductor packaging solder wire casting and forming apparatus according to claim 3, characterized in that: The adjustment mechanism also includes a ball head, which is installed at the lower middle part of the adjustment mechanism, and the middle part of the ball head allows the tin tube to pass through. The lower end of the ball head presses against the upper top surface of the X-direction adjustment housing.

6. The semiconductor packaging solder wire casting and forming apparatus according to claim 1, characterized in that: The solder feeding module includes a drive mechanism, a transmission mechanism, a solder feeding drive wheel, a solder feeding driven wheel, and a solder feeding housing. The drive mechanism is mounted on the base frame, and its output shaft is connected to the input shaft of the transmission mechanism. The output shaft of the transmission mechanism is connected to the rotating shaft of the solder feeding drive wheel. The solder feeding driven wheel is rotatably mounted on the base frame and positioned close to the solder feeding drive wheel. The space between the solder feeding drive wheel and the solder feeding driven wheel is used for solder wire entry. When the solder feeding drive wheel rotates, it can drive the solder feeding driven wheel to rotate, and the solder feeding drive wheel and the solder feeding driven wheel clamp the solder wire into the tin tube. The solder feeding housing is sleeved on the outer periphery of the tin tube. The heating mechanism is installed inside the solder feeding housing and is located on the outer periphery of the tin tube.

7. The semiconductor packaging solder wire casting and forming apparatus according to claim 6, characterized in that: The heating mechanism is a heating rod, and the outer periphery of the tin feeding shell is also fitted with a heat insulation shell.

8. The semiconductor packaging solder wire casting and forming apparatus according to claim 1, characterized in that: It also includes a solder testing mechanism, which is located above the tin tube and has a through hole for solder wire to pass through, the through hole being located directly above the tin tube.

Images