Circuit board dispensing quality detection device

Abstract

The invention discloses a circuit board dispensing quality detection device, and relates to the technical field of circuit board processing detection, the circuit board dispensing quality detection device comprises a base, a conveying positioning mechanism, an upper shooting detection unit and a lower shooting detection unit, the conveying positioning mechanism is installed on the base and is used for conveying and positioning a carrier carrying a circuit board; the upper shooting detection unit and the lower shooting detection unit are respectively located above and below the conveying positioning mechanism, are used for acquiring dispensing images on the front and back surfaces of the circuit board and respectively comprise a shooting module, the shooting module comprises two symmetrically arranged three-dimensional line scanning cameras, and shooting light paths of the two symmetrically arranged three-dimensional line scanning cameras are inclined and are crossed and opposite; the shooting light path of the central camera is vertical; the plurality of circumferential cameras are circumferentially distributed around the central camera, a shooting light path is inclined, and the inclination angle is adjustable; and the light source assembly is used for supplementing light when the three-dimensional line scanning camera, the central camera and / or the circumferential cameras collect images. The scheme is used for automatically detecting the glue coverage quality of the circuit board after glue dispensing.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board processing and detection, and specifically to a circuit board dispensing quality detection device. Background Art

[0002] In the electronics manufacturing industry, circuit boards (also known as PCBs, printed circuit boards, etc.) are key components of electronic products. As electronic products continue to evolve towards miniaturization and higher performance, the design and manufacturing processes of circuit boards are becoming increasingly complex. During the production process, glue dispensing is a critical step in ensuring the stable installation and operation of electronic components. Multiple electronic components are typically mounted on both the front and back of a circuit board. To prevent these components from being damaged or falling off due to environmental factors such as moisture, dust, and vibration, glue dispensing is required to cover and encapsulate some of these components. The quality of glue dispensing directly impacts the performance and reliability of the circuit board. Insufficient glue thickness will fail to effectively protect the electronic components; excessive glue may cause glue overflow and contaminate other areas or increase the weight of the circuit board. Uneven glue coverage, insufficient glue, or excess glue can compromise the protective effect and even cause faults such as short circuits.

[0003] Currently, the quality inspection of circuit board glue dispensing mainly relies on manual sampling, which has many difficult-to-overcome problems: First, the inspection efficiency is low. Manual sampling requires observing the circuit boards piece by piece, which is difficult to meet the high-beat production requirements for mass-produced circuit boards. Moreover, as the integration of circuit boards increases, the number of glue points increases and the size decreases, manual inspection takes longer, which seriously restricts production efficiency. Second, the inspection accuracy is insufficient. Manual inspection mainly relies on naked eye observation and simple tools (such as gauges). It is difficult to identify tiny glue dispensing defects (such as glue shortage within 0.1mm and thickness deviation of 0.05mm). , and is affected by subjective factors such as the experience, vision, and fatigue level of the inspectors. The judgment standards are inconsistent, and missed inspections and false inspections are prone to occur, resulting in unqualified products flowing into subsequent processes; thirdly, the detection dimensions are limited. Manual inspections focus more on the plane coverage of the glue dispensing, and it is difficult to accurately measure the thickness of the glue dispensing. In addition, the detection of the shape of the side edges of the glue (such as whether there are burrs or depressions) is not comprehensive enough, and the quality of the glue dispensing cannot be fully evaluated; fourthly, the cost is high. Manual random inspections require a lot of manpower. In the long run, the labor cost remains high, and the rework and scrap costs caused by missed inspections and false inspections further increase the burden on enterprises.

[0004] Therefore, the development of a device that can achieve fully automatic, high-precision, and multi-dimensional detection of circuit board dispensing quality has become an urgent need for the circuit board manufacturing industry to improve product quality and reduce costs. Summary of the Invention

[0005] The present invention aims to solve the problems of low efficiency, insufficient precision and limited dimension in the existing manual inspection of circuit board dispensing quality, and provides a circuit board dispensing quality inspection device to realize fully automatic, all-round and high-precision inspection of the thickness, coverage, edge shape, etc. of the circuit board dispensing, thereby improving inspection efficiency and accuracy and reducing production costs.

[0006] The technical solutions adopted in this application are: A circuit board dispensing quality inspection device comprises a base and a conveying and positioning mechanism, an upper shooting and detection unit and a lower shooting and detection unit respectively installed on the base, the conveying and positioning mechanism being installed on the base for conveying a carrier carrying a circuit board and achieving positioning, the upper shooting and detection unit being located above the conveying and positioning mechanism, and the lower shooting and detection unit being located below the conveying and positioning mechanism, the upper shooting and detection unit and the lower shooting and detection unit being respectively used for collecting dispensing images on the front and back sides of the circuit board and both comprising a shooting module, the shooting module comprising two symmetrically arranged three-dimensional line scan cameras, a central camera, a plurality of circumferential cameras and a light source assembly, the shooting light paths of the two three-dimensional line scan cameras being inclined and cross-opposite, the shooting light path of the central camera being vertical, and the plurality of circumferential cameras being distributed circumferentially around the central camera, the shooting light paths of the circumferential cameras being inclined and the inclination angle being adjustable, and the light source assembly being used for fill light when the three-dimensional line scan camera, the central camera and / or the circumferential camera collect images.

[0007] Preferably, the upper shooting and detection unit and the lower shooting and detection unit also include a two-dimensional mobile platform, which includes an X-axis moving module, a Y-axis moving module and a mounting base, the X-axis moving module is fixed to the base, the Y-axis moving module is installed on the sliding part of the X-axis moving module, and the mounting base is fixed to the sliding part of the Y-axis moving module and is used to carry the shooting module; wherein, the two-dimensional mobile platform drives the shooting module to cover the circuit board detection area.

[0008] Preferably, the mounting seat is provided with a plurality of support blocks, and the plurality of support blocks are fixed at circumferential intervals around the central camera; a rotating shaft is provided between adjacent support blocks, and the rotating shaft installs the circumferential camera through a support frame, and the rotating shaft is pivotally connected to the support block, and the inclination angle of the shooting light path of the circumferential camera is adjustable by rotating the rotating shaft; the support block is provided with a first arc-shaped groove, and the first protrusion at the end of the rotating shaft is engaged in the first arc-shaped groove to limit the rotation angle of the rotating shaft, and the arc-shaped trajectory of the first arc-shaped groove limits the shooting light paths of all circumferential cameras to tilt in the direction toward the glue dispensing area of ​​the circuit board, and the shooting light paths of each circumferential camera jointly enclose a shooting range covering the edge of the glue dispensing area.

[0009] Preferably, the support frame is provided with an oblique slide groove, and the support frame is fixed to the rotating shaft by a first fastener. When the first fastener is loosened, the support frame drives the circumferential camera to move obliquely upward or downward in a direction perpendicular to the rotating shaft through the sliding of the oblique slide groove and the first fastener, thereby realizing the height adjustment of the circumferential camera; the center camera is connected to the mounting seat through a height adjustment structure, and the height adjustment structure includes a vertical slide groove provided on the mounting seat and a second fastener passing through the vertical slide groove. The center camera is fixed to the mounting seat by the second fastener. When the second fastener is loosened, the second fastener can move up and down along the vertical slide groove and re-fix the center camera, thereby realizing the height adjustment of the center camera.

[0010] Preferably, the light source assembly includes a central ring light source corresponding to the central camera and circumferential ring light sources corresponding one by one to the multiple circumferential cameras; the central ring light source is fixed to the mounting seat, and the shooting light path of the central camera passes through the central through hole of the central ring light source; the circumferential ring light source is fixed on the support frame, and the shooting light path of the circumferential camera passes through the central through hole of the circumferential ring light source.

[0011] Preferably, a fill light source is provided between adjacent support blocks, the fill light source is pivotally connected to the support block, the support block is provided with a second arc groove, and the second protrusion at the end of the fill light source is engaged in the second arc groove to limit the rotation angle of the fill light source.

[0012] Preferably, a fill light source is provided between adjacent support blocks, the mounting seat includes a horizontal plate, the horizontal plate includes a first mounting area and a second mounting area, the circumferential camera is fixed to the first mounting area through the multiple support blocks, the three-dimensional line scan camera is fixed to the second mounting area, and the projections of the first mounting area and the second mounting area on the horizontal plane are spaced apart.

[0013] Preferably, the conveying and positioning mechanism includes a fixed cross frame and a movable cross frame arranged in parallel, a spacing adjustment mechanism and a synchronous conveyor belt assembly respectively arranged on opposite sides of the fixed cross frame and the movable cross frame, the fixed cross frame is fixed on the base; the spacing adjustment mechanism includes a spacing adjustment drive motor and a screw-nut mechanism driven by the spacing adjustment drive motor, the movable cross frame is installed on the nut of the screw-nut mechanism, and the drive motor drives the screw of the screw-nut mechanism to drive the movable cross frame close to or away from the fixed cross frame; the synchronous conveyor belt assembly is used to carry and convey the carrier, including a conveyor belt, a driving wheel, a driven wheel and a conveying drive motor, the conveyor belt is tensioned on the driving wheel and the driven wheel, and the conveying drive motor is connected to the driving wheel.

[0014] Preferably, the conveying positioning mechanism also includes a carrier positioning unit, which includes a first transverse telescopic cylinder installed on the fixed horizontal frame and a composite positioning mechanism installed on the fixed horizontal frame, and the composite positioning mechanism includes a second transverse telescopic cylinder and a vertical telescopic cylinder installed at the end of the second transverse telescopic cylinder. The composite positioning mechanism has an avoidance position and a clamping position: in the avoidance position, the vertical telescopic cylinder descends to the bottom of the conveyor belt; in the clamping position, the vertical telescopic cylinder first extends above the conveyor belt, and the second transverse telescopic cylinder then drives the vertical telescopic cylinder to push the carrier to abut against the first transverse telescopic cylinder, thereby clamping and positioning the carrier at the detection station.

[0015] Preferably, the base includes a base and a frame structure fixed on the base, the frame structure includes a lower frame and an upper frame, the lower frame and the upper frame are connected by columns, cross beams and longitudinal beams, the conveying and positioning mechanism is installed on the lower frame, the upper shooting and detection unit is installed on the upper frame, and the lower shooting and detection unit is installed on the base; the base, the columns, the cross beams and the longitudinal beams are all internal hollow structures, and the interior is filled with vibration-absorbing and vibration-reducing materials.

[0016] Through the above technical solution, at least the following technical effects can be achieved: 1. By setting up a base, a conveying and positioning mechanism, an upper shooting and detection unit, and a lower shooting and detection unit, the system achieves automated inspection of the dispensing quality of circuit boards, solving the problems of missed inspections and low efficiency during manual spot checks. Two symmetrically arranged three-dimensional line scan cameras with intersecting optical paths can accurately detect the thickness of the dispensing glue. By using intersecting optical paths to cover the height dimensions of different sides of the dispensing area, the accuracy of the thickness data is ensured. The central camera shoots vertically to clearly capture the planar coverage, flatness, and overall shape of the dispensing glue. Multiple circumferential cameras are distributed circumferentially around the central camera and have adjustable angles. They can capture the edge contours of the dispensing glue from different sides to determine whether there are defects such as glue shortages, glue overflows, and bubbles. Combined with fill light from the light source component, shadow interference is eliminated to ensure image clarity. All-round dispensing information is collected to provide comprehensive data for subsequent quality analysis, significantly improving the accuracy and comprehensiveness of inspections. During actual inspection, the shooting modules of the upper shooting inspection unit and the lower shooting inspection unit shoot the dispensing image of the circuit board and transmit the image data to the control system (such as PLC or industrial computer). The control system analyzes and processes the dispensing image: first, the image is pre-processed, and the image data obtained by the three-dimensional line scan camera, the center camera and the circumferential camera are optimized through algorithms such as denoising and contrast enhancement to highlight the difference between the dispensing area and the circuit board substrate; for the image of the three-dimensional line scan camera, the height data of the dispensing surface is calculated using the principle of triangulation to generate a thickness distribution map, which is compared with the preset thickness standard range to determine whether there are defects such as too thick or too thin; for the center camera, the height data of the dispensing surface is calculated using the principle of triangulation to generate a thickness distribution map, which is compared with the preset thickness standard range to determine whether there are defects such as too thick or too thin. The image from the centroid camera is used to extract the plane contour of the dispensing through the edge detection algorithm, and the coverage area and shape are calculated. It is then compared with the dispensing area in the design drawing to identify problems such as glue shortage, glue overflow or incomplete coverage. For the image from the circumferential camera, the edge information taken from multiple angles is combined to form a three-dimensional contour of the side of the dispensing to detect whether there are burrs, dents, bubbles and other side defects. At the same time, the control system integrates multi-dimensional inspection data and makes a comprehensive judgment through a preset AI model (based on historical qualified and unqualified sample training). Finally, it outputs the result of whether the dispensing quality is qualified and the specific defect location and type information, realizing fully automatic and high-precision dispensing quality inspection.

[0017] 2. The X-axis and Y-axis moving modules of the 2D mobile platform drive the mounting base and camera module to move, covering all dispensing areas on the circuit board. This eliminates the need for manual adjustment of the circuit board position and adapts to the inspection needs of circuit boards of different sizes. A fixed number of cameras can cover the inspection area of ​​any size and any number of circuit boards on the carrier, eliminating the need to increase the number of cameras to accommodate large-size boards. This significantly reduces hardware costs while ensuring full-board scanning without blind spots.

[0018] 3. The cooperation between the support block and the rotating shaft makes the shooting angle of the circumferential camera adjustable to meet the side inspection requirements of different dispensing shapes. For example, when the inclination angle of the dispensing edge is different, the camera angle can be adjusted by rotating the rotating shaft to obtain a clear shot. The cooperation between the first arc groove and the first convex portion of the rotating shaft limits the rotation angle of the circumferential camera, which limits the rotation angle range of the circumferential camera. The shooting light paths of all circumferential cameras are directed towards the dispensing area, and the light paths together enclose a shooting range covering the edge of the dispensing area. During actual inspection, this enclosed structure can ensure that every edge of the dispensing area (including corners, recessed or raised areas) is within the shooting field of view of at least one circumferential camera. For example, when a certain dispensing on the circuit board is an irregular polygon, multiple circumferential cameras can shoot from different sides at an angle to capture the contours of each edge respectively, avoiding edge omissions due to a single angle, and significantly improving the comprehensiveness and accuracy of the detection of dispensing edge defects (such as glue deficiency, burrs, and glue overflow).

[0019] 4. The circumferential camera is height-adjustable via an oblique slot and the first fastener. The distance from the dispensing area can be adjusted according to the dispensing height, ensuring image clarity and detail. For example, when dispensing thicker glue, the camera height can be lowered to magnify the details. The central camera is height-adjustable via a vertical slot and the second fastener. This adapts to dispensing on circuit boards of varying thicknesses, ensuring it is always in the optimal focal length position, further improving image quality and providing reliable data for detecting the dispensing plane morphology and coverage.

[0020] 5. The central ring light source provides fill light for the central camera, while the circumferential ring light source provides fill light for the circumferential cameras. The central through-hole of the light source aligns with the camera optical path, preventing direct light from interfering with the image. This creates a sharp contrast between the dispensing area and the circuit board substrate, highlighting the edges and contours of the dispensing. This is especially effective when inspecting transparent or light-colored glue, effectively enhancing image contrast, reducing missed and false detections, and improving inspection accuracy.

[0021] 6. The fill light source can adjust the light projection angle to supplement light for different dispensing positions and shapes. For example, the shadow area caused by the dispensing depression or the circumferential camera shooting angle can be eliminated by adjusting the fill light source angle to ensure that all parts of the dispensing area are clearly illuminated, further optimizing image quality and ensuring comprehensive inspection.

[0022] 7. The first and second mounting areas of the mounting base are spaced apart on the horizontal plane to prevent interference between the 3D line scan camera, the circumferential camera, and the central camera. This ensures that each camera can independently and clearly capture the target image. The compact layout saves installation space, makes the camera module structure more reasonable, and improves space utilization.

[0023] 8. The fixed and movable cross frames of the conveyor positioning mechanism are combined with a spacing adjustment mechanism. The spacing can be precisely adjusted through a screw-nut mechanism to accommodate the conveying of carriers of different sizes without the need to replace conveying components, reducing equipment costs. The synchronous conveyor belt assembly can stably convey carriers, preventing the circuit boards from shaking or shifting during transportation, providing a stable position foundation for subsequent filming and inspection, and ensuring inspection consistency.

[0024] 9. The first transverse telescopic cylinder and composite positioning mechanism of the carrier positioning unit cooperate to not affect carrier transportation when in the avoidance position, and can accurately position the carrier at the inspection station when in the clamping position, avoiding image misalignment caused by carrier position deviation, ensuring that the dispensing area is always within the camera's shooting range, and improving inspection accuracy. It is especially suitable for high-precision dispensing inspection scenarios.

[0025] 10. The frame structure of the base is connected by columns, crossbeams, and longitudinal beams to ensure the overall stability of the structure and provide stable support for all components. The internal hollow structure is filled with vibration-absorbing and vibration-reducing materials to reduce vibration during equipment operation and prevent vibration (such as vibration caused by the movement of the two-dimensional mobile platform) from affecting the image clarity and positioning accuracy of the camera. At the same time, it reduces equipment noise, improves the working environment, and increases the stability and service life of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings: Figure 1 Schematic diagram of the structure of the circuit board dispensing quality detection device provided in the embodiment of the application Figure 1 ; Figure 2 Schematic diagram of the structure of the circuit board dispensing quality detection device provided in the embodiment of the application Figure 2 , which is the state after the base is hidden; Figure 3 Schematic diagram of the structure of the upper shooting detection unit provided in the embodiment of the present application Figure 1 ; Figure 4 Schematic diagram of the structure of the upper shooting detection unit provided in the embodiment of the present application Figure 2 , which is the state after the two-dimensional mobile platform is hidden; Figure 5 Schematic diagram of the structure of the upper shooting detection unit provided in the embodiment of the present application Figure 3 ,The dotted lines indicate that the shooting light paths of the bilaterally symmetrical 3D line scan cameras are tilted and cross oppositely; Figure 6 Schematic diagram of the structure of the upper shooting detection unit provided in the embodiment of the present application Figure 4 ; Figure 7 A cross-sectional view of the upper shooting and detection unit provided in an embodiment of the present application; Figure 8 Installation distribution diagram of the central camera and circumferential cameras provided in the embodiment of the present application; Figure 9 A schematic diagram of the structure of the mounting base provided in an embodiment of the present application; Figure 10 This is an installation diagram of the circumferential camera and circumferential ring light source provided in an embodiment of the present application; Figure 11 A schematic diagram of the structure of the support frame and the rotating shaft provided in an embodiment of the present application; Figure 12 Installation diagram of the rotating shaft and fill light source provided in the embodiment of the present application on the mounting base; Figure 13 Schematic diagram of the structure of the conveying and positioning mechanism provided in the embodiment of the present application Figure 1 ; Figure 14 Schematic diagram of the structure of the conveying and positioning mechanism provided in the embodiment of the present application Figure 2 ; Figure 15 A schematic diagram of the structure of the base provided in an embodiment of the present application; Figure 16 This is a structural schematic diagram of the circuit board dispensing quality detection device provided in an embodiment of the present application being built into a protective housing.

[0027] List of parts and reference numerals: 1 base, 11 plinth, 12 lower frame, 13 upper frame, 14 column, 15 crossbeam, 16 longitudinal beam; 2 conveying positioning mechanism, 21 fixed horizontal frame, 22 movable horizontal frame, 231 spacing adjustment drive motor, 232 screw nut mechanism, 241 conveyor belt, 242 driving wheel, 243 driven wheel, 244 conveying drive motor, 25 first horizontal telescopic cylinder, 26 second horizontal telescopic cylinder, 27 vertical telescopic cylinder; 3. Shooting and detection unit; 4-shot detection unit; 51 3D line scan camera, 52 center camera, 53 circumferential camera, 541 X-axis moving module, 542 Y-axis moving module, 55 mounting seat, 551 support block, 5511 first arc groove, 5512 second arc groove, 552 horizontal plate, 553 vertical slide, 56 rotating shaft, 57 support frame, 571 oblique slide, 581 central ring light source, 582 circumferential ring light source, 583 fill light source; 6 protective shell, 61 upward-lifting protective door. DETAILED DESCRIPTION

[0028] In order to more clearly illustrate the overall concept of the present application, a detailed description is given below in an illustrative manner in conjunction with the accompanying drawings.

[0029] In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present application is not limited to the specific embodiments disclosed below.

[0030] In addition, in the description of the present application, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential", "lateral", "longitudinal", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0031] In this application, unless otherwise expressly specified or limited, terms such as "installed," "connected," "connect," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0032] In this application, unless otherwise expressly specified and limited, a first feature "above" or "below" a second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in an appropriate manner in any one or more embodiments or examples.

[0033] In the embodiments of this application, refer to Figures 1 to 16As shown, to address the problems of low efficiency, insufficient precision, and limited dimensions in manual inspection of circuit board glue dispensing, a circuit board glue dispensing quality inspection device is provided. For ease of explanation and understanding, the following content provided in this application is all based on the illustrated product structure. Of course, those skilled in the art will understand that the above structure is only a specific example and schematic description, and does not constitute a specific limitation of the technical solution provided in this application.

[0034] like Figure 1 、 Figure 2 、 Figure 3 and Figure 6 As shown, the circuit board dispensing quality inspection device includes a base 1 and a conveying and positioning mechanism 2, an upper shooting and detection unit 3 and a lower shooting and detection unit 4 respectively installed on the base 1. The conveying and positioning mechanism 2 is installed on the base 1, and is used to convey a carrier carrying a circuit board and realize positioning. The upper shooting and detection unit 3 is located above the conveying and positioning mechanism 2, and the lower shooting and detection unit 4 is located below the conveying and positioning mechanism 2. The upper shooting and detection unit 3 and the lower shooting and detection unit 4 are respectively used to collect the dispensing images on the front and back sides of the circuit board and both include a shooting module. The shooting module includes two symmetrically arranged three-dimensional line scan cameras 51, a central camera 52, multiple circumferential cameras 53 and a light source assembly. The shooting light paths of the two three-dimensional line scan cameras 51 are inclined and cross-opposite ( Figure 5 In the figure, the dotted lines L1 and L2 respectively indicate the shooting light paths of the two three-dimensional line scan cameras 51), the shooting light path of the central camera 52 is vertical, and multiple circumferential cameras 53 are distributed circumferentially around the central camera 52. The shooting light paths of the circumferential cameras 53 are inclined and the inclination angle is adjustable. The light source assembly is used to provide fill light when the three-dimensional line scan camera 51, the central camera 52 and / or the circumferential camera 53 capture images.

[0035] The device includes a base 1, a conveying and positioning mechanism 2, an upper shooting and detection unit 3 and a lower shooting and detection unit 4, which structurally improves or solves the problems of low efficiency, insufficient accuracy and limited dimensions of manual detection.

[0036] During actual use, the base 1 provides stable support for the overall structure to prevent equipment vibration from affecting image acquisition; the conveying and positioning mechanism 2 realizes the automatic conveying and positioning of the carrier, replacing manual handling and placement, greatly improving the detection cycle.

[0037] The upper shooting detection unit 3 and the lower shooting detection unit 4 respectively collect the glue spotting images on the front and back of the circuit board. Among them, two symmetrically arranged three-dimensional line scan cameras 51 with opposite shooting light paths scan the glue spotting sides through cross-projected laser lines. For example, one of the three-dimensional line scan cameras 51 scans on one side of the glue spotting and the other three-dimensional line scan camera 51 scans on the other side of the glue spotting. The thickness of the glue layer can be accurately calculated, solving the problem that the thickness cannot be accurately measured manually. In addition, it can be understood by those skilled in the art that if the shooting detection unit is only set above the carrier, after collecting the glue spotting image on the front of the circuit board, the carrier needs to be flipped over so that the circuit board is turned over before continuing to collect the glue spotting image on the back, which increases the detection steps and reduces the detection efficiency. Therefore, in this application, the upper shooting detection unit 3 and the lower shooting detection unit 4 respectively collect glue spotting images from the top and bottom directions at the same time, covering the glue spotting on both sides of the circuit board at the same time, greatly improving the detection efficiency. The upper shooting detection unit 3 and the lower shooting detection unit 4 adopt the same structure, but because the upper shooting detection unit 3 shoots from top to bottom and the lower shooting detection unit 4 shoots from bottom to top, the two are installed in opposite directions.

[0038] The central camera 52 shoots in the vertical direction and can clearly capture the plane coverage of the glue dispensing (such as whether the glue completely wraps the electronic components and whether there are areas where glue is missing), avoiding missed inspections caused by manual visual fatigue.

[0039] Multiple circumferential cameras 53 are distributed around the central camera 52, with adjustable angles. They can capture the edge of the adhesive layer from different sides (e.g., to see if there are any burrs or indentations caused by overflowing glue). Combined with fill light from the light source component (especially to address the reflection issues of transparent glue), this ensures clear image details and enables full-dimensional inspection of dispensing quality, covering surface, thickness, and side defects that are difficult to detect manually. This application does not limit the number of circumferential cameras 53. The accompanying drawings illustrate an embodiment with four circumferential cameras 53 distributed circumferentially. The number of circumferential cameras 53 can also be adjusted according to actual inspection needs.

[0040] In addition, in order to realize the shooting and detection of the upper shooting and detection unit 3 and the lower shooting and detection unit 4 together, a certain structural design is usually performed on the carrier. For example, a grid-shaped hollow structure is set on the carrier to carry the circuit board (the glue dispensing area is located in the hollow area), so that the lower shooting and detection unit 4 can penetrate the carrier to directly shoot the circuit board.

[0041] During actual inspection, after the shooting modules of the upper shooting inspection unit 3 and the lower shooting inspection unit 4 shoot the glue spotting image of the circuit board, the image data can be transmitted to the control system (such as PLC or industrial computer), and the control system analyzes the glue spotting image. For example, the control system first pre-processes the image, and optimizes the image data obtained by the three-dimensional line scanning camera 51, the center camera 52 and the circumferential camera 53 through algorithms such as denoising and contrast enhancement to highlight the difference between the glue spotting area and the circuit board substrate; for the image of the three-dimensional line scanning camera 51, the height data of the glue spotting surface is calculated using the triangulation principle to generate a thickness distribution map, which is compared with the preset thickness standard range (such as 0.5-1.0mm) to determine whether there is In the case of defects such as excessive thickness or thinness; for the image of the central camera 52, the plane contour of the glue spot is extracted through the edge detection algorithm, the coverage area and shape are calculated, and compared with the glue spot area in the design drawing to identify problems such as glue shortage, glue overflow or incomplete coverage; for the image of the circumferential camera 53, the edge information taken from multiple angles is combined to form a three-dimensional contour of the side of the glue spot to detect whether there are burrs, dents, bubbles and other side defects; at the same time, the control system integrates multi-dimensional detection data, and makes a comprehensive judgment through the preset AI model (based on historical qualified and unqualified sample training), and finally outputs the result of whether the glue spot quality is qualified and the specific defect location and type information, realizing fully automatic and high-precision glue spot quality detection.

[0042] As a preferred embodiment of the present application, Figure 1 、 Figure 2 and Figure 3As shown, the upper and lower camera inspection units 3 and 4 also include a two-dimensional mobile platform, which includes an X-axis mobile module 541, a Y-axis mobile module 542, and a mounting base 55. The X-axis mobile module 541 is fixed to the base 1, the Y-axis mobile module 542 is mounted on the sliding portion of the X-axis mobile module 541, and the mounting base 55 is fixed to the sliding portion of the Y-axis mobile module 542 and is used to support the camera module. The two-dimensional mobile platform drives the camera module to cover the circuit board inspection area. The X-axis mobile module 541 and Y-axis mobile module 542 of the two-dimensional mobile platform drive the mounting base 55 and the camera module to move, eliminating the disadvantage of manually adjusting the position of the circuit board during manual inspection. In actual inspections, for multiple densely distributed glue points on a circuit board (e.g., a circuit board may contain 20-50 glue points), the two-dimensional mobile platform can automatically move the camera module along a preset path to ensure that each glue point is accurately photographed without manual intervention. Its high drive accuracy ensures consistent shooting positions and avoids missed items due to manual placement deviations. For example, when inspecting the glue points of multiple chips on a mobile phone motherboard, the platform can position itself above each chip in turn, allowing the camera to accurately align with the glue area, significantly improving inspection efficiency and coverage. In actual use, by controlling the module's movement path through a program, each glue point can be accurately located, ensuring that no glue points are missed in the image. This is particularly suitable for scenarios with a large number of glue points on circuit boards and complex distributions, improving inspection efficiency and automation. Specifically, the X-axis moving module 541 and the Y-axis moving module 542 can select a variety of proven mature solutions in the existing industrial field, such as a linear slide module. The movement of the Y-axis moving module 542 along the X-axis moving module 541 and the movement of the mounting base 55 along the Y-axis moving module 542 can be driven by a stepper motor with a trapezoidal screw or other suitable structures.

[0043] As a preferred embodiment of this embodiment, Figure 6 、 Figure 7 、 Figure 8 、 Figure 9 and Figure 12As shown, the mounting base 55 is provided with multiple support blocks 551, which are fixed circumferentially and spaced apart around the central camera 52. A rotating shaft 56 is provided between adjacent support blocks 551. The rotating shaft 56 is mounted on the circumferential camera 53 via a support frame 57. The rotating shaft 56 is pivotally connected to the support block 551, allowing the tilt angle of the shooting light path of the circumferential camera 53 to be adjusted. The support block 551 is provided with a first arcuate groove 5511. The first protrusion at the end of the rotating shaft 56 fits into the first arcuate groove 5511 to limit the rotation angle of the rotating shaft 56. The arc trajectory of the first arcuate groove 5511 restricts the shooting light paths of all circumferential cameras 53 to tilt in the direction toward the glue dispensing area of ​​the circuit board. The shooting light paths of each circumferential camera 53 collectively enclose a shooting range covering the edge of the glue dispensing area. Corresponding to the embodiment of four circumferential cameras 53 distributed circumferentially, four support blocks 551 are provided accordingly. The four support blocks 551 and the four rotating shafts 56 form a square area. In actual use, the rotating shaft 56 between adjacent support blocks 551 can be flexibly rotated, driving the circumferential cameras 53 to adjust their tilt angles via the support frame 57. For example, when inspecting the right-angled edges of square glue dots, the corresponding circumferential camera 53 can be adjusted to 45° to clearly capture any glue accumulation at the corners. When inspecting circular glue dots, evenly distributed circumferential cameras 53 can capture images from different angles to ensure that no circular edges are missed. The first arcuate groove 5511 cooperates with the first protrusion of the rotating shaft 56 to limit the rotation range of the circumferential cameras 53 (e.g., 0-60°), ensuring that their imaging light path always faces the glue dot area. The optical paths of multiple circumferential cameras 53 collectively enclose a range that covers the entire glue dot edge. For example, for a 5mm diameter glue dot, four circumferential cameras 53 can cover the edges at 0°, 90°, 180°, and 270°, respectively, preventing side defects from being missed due to angle deviation. Specifically, a rotating protrusion can be set at both ends of the rotating shaft 56, and a pivot hole can be set on the support block 551, and a pivot connection can be achieved through the cooperation between the rotating protrusion and the pivot hole; in addition, as an alternative solution, on the basis of setting a pivot hole on the support block 551, a connecting hole can be set on the rotating shaft 56 corresponding to the pivot hole, and the rotating shaft 56 and the support block 551 can be pivotally connected by a pin shaft passing through the pivot hole and the connecting hole.

[0044] The first protrusion is not shown in the accompanying drawings. In a preferred embodiment, the first protrusion can be configured as a thumb screw or butterfly nut connected to the end of the rotating shaft 56. When the angle of the circumferential camera 53 needs to be adjusted, the thumb screw or butterfly nut is loosened, and the rotating shaft 56 can rotate freely along the trajectory of the first arcuate groove 5511, driving the circumferential camera 53 to adjust to the target tilt angle. After the angle is determined, the thumb screw or butterfly nut is re-tightened, and its end will press against the surface of the support block 551, firmly fixing the rotating shaft 56 through friction, preventing angular deviation caused by equipment vibration during the inspection process, ensuring that the circumferential camera 53 always maintains the preset shooting angle, and stably capturing the dispensing edge image. This structure does not require additional tools, and the operator can complete angle adjustment and fixation by hand, which is suitable for rapid changeovers or daily debugging needs of the production line. At the same time, the thumb screw or butterfly nut naturally fits into the first arcuate groove 5511, which not only limits the rotation range of the rotating shaft 56 but also achieves reliable fixation through thread locking, balancing adjustment flexibility and structural stability.

[0045] Furthermore, if Figure 10 and Figure 11 As shown, the support frame 57 is provided with an oblique sliding groove 571, and the support frame 57 is fixed to the rotating shaft 56 by a first fastener. When the first fastener is loosened, the support frame 57 drives the circumferential camera 53 to move obliquely upward or downward along the direction perpendicular to the rotating shaft 56 through the sliding of the oblique sliding groove 571 and the first fastener, thereby realizing the height adjustment of the circumferential camera 53; Figure 4 As shown, the central camera 52 is connected to the mounting base 55 via a height adjustment structure. The height adjustment structure includes a vertical slot 553 provided on the mounting base 55 and a second fastener extending through the slot 553. The central camera 52 is secured to the mounting base 55 by the second fastener. When the second fastener is loosened, it can move up and down along the slot 553 and re-secure the central camera 52, thereby adjusting the height of the central camera 52. The height adjustment structure of the circumferential camera 53 and the central camera 52 solves the problem of adapting to different thicknesses of glue and circuit boards, and compensates for the lack of flexible adjustment tools during manual inspection. In practice, the height of the circumferential camera 53 is adjusted via the oblique slot 571 and the first fastener. When the glue is thick (e.g., 2 mm), the camera can be moved diagonally downward to shorten the distance to the side of the glue layer and zoom in on details (e.g., whether there are bubbles on the glue surface). When the glue is thin (e.g., 0.5 mm), the camera can be moved diagonally upward to expand the field of view and ensure a complete image of the glue edge. The center camera 52 adjusts its height through the vertical slide groove 553 and the second fastener: for example, for a circuit board with a thickness of 1 mm, the camera height can be lowered to 50 mm to obtain a clear image of the dispensing plane; for a circuit board with a thickness of 3 mm, it can be raised to 80 mm to avoid the lens touching the circuit board while ensuring accurate focal length.

[0046] It should be noted that the first fastener and the second fastener are not shown in the accompanying drawings. In a preferred embodiment, the first fastener and the second fastener can be hand screws or butterfly nuts. The height adjustment operation process of the circumferential camera 53 is as follows: loosen the first fastener connecting the rotating shaft 56 and the support frame 57. At this time, the support frame 57 can slide relative to the rotating shaft 56 along the oblique slide 571, driving the circumferential camera 53 to move obliquely upward or downward in a direction perpendicular to the axis of the rotating shaft 56 to adjust the height distance between the circumferential camera 53 and the glue dispensing area of ​​the circuit board; after adjusting to the appropriate height (such as determined by the glue dispensing thickness or the shooting clarity requirement), re-tighten the first fastener, and fix the position of the support frame 57 by the locking force of the fastener and the slide, thereby stabilizing the circumferential camera 53 at the adjusted height. The height adjustment operation process of the center camera 52 is as follows: loosen the second fastener that passes through the vertical slide groove 553, and the center camera 52 can move up and down along the vertical slide groove 553 with the second fastener to achieve height adjustment with the gluing area of ​​the circuit board; after adjusting to the target height (such as adapting to different circuit board thicknesses to ensure the shooting focal length), re-tighten the second fastener so that the second fastener is tightly locked with the mounting bracket 55, and use friction to fix the center camera 52 at the current height to ensure that the shooting position is stable.

[0047] Furthermore, if Figure 6 、 Figure 7 and Figure 8 As shown, the light source assembly includes a central ring light source 581 corresponding to the central camera 52 and circumferential ring light sources 582 corresponding one-to-one to the plurality of circumferential cameras 53. The central ring light source 581 is fixed to the mounting base 55, and the optical path of the central camera 52 passes through the central through-hole of the central ring light source 581. The circumferential ring light sources 582 are fixed to the support frame 57, and the optical path of the circumferential cameras 53 passes through the central through-hole of the circumferential ring light source 582. In actual use, the central ring light source 581 surrounds the lens of the central camera 52, and the light evenly illuminates the glue dispensing surface from all sides, avoiding shadows caused by a single light source. This makes the boundary between the glue dispensing area and the circuit board substrate clear (such as the outline of white glue on a green circuit board substrate), facilitating the identification of glue-deficient areas. The circumferential ring light sources 582 are mounted on the support frame 57 and adjust their angles together with the circumferential cameras 53. The light illuminates the side of the glue layer along the camera's shooting direction, highlighting uneven defects on the edge (such as the step where the glue does not completely cover the electronic device). For example, when detecting black glue, the ring light source can enhance the contrast between the glue and metal components, making glue defects as small as 0.1mm clearly visible and avoiding misjudgment caused by insufficient light by the naked eye.

[0048] Furthermore, if Figure 6 、 Figure 7 and Figure 12As shown, a fill light source 583 is provided between adjacent support blocks 551. The fill light source 583 is pivotally connected to the support block 551, which is provided with a second arcuate slot 5512. A second protrusion at the end of the fill light source 583 engages within the second arcuate slot 5512 to limit the rotation angle of the fill light source 583. The angle-adjustable structure of the fill light source 583 provides fill light for complex shapes in the dispensing area (such as shadows cast by electronic components), resolving the problem of insufficient local light during inspection. During actual inspections, when tall vertical electronic components (such as capacitors) are located near the dispensing area, their shadows may obscure the edge of the adhesive layer. In this case, the fill light source 583 can be rotated (with the second arcuate slot 5512 limiting the angle, e.g., 0-45°) to illuminate the shadowed area from the side, ensuring that the circumferential camera 53 can clearly capture the obscured edge of the adhesive layer. To avoid equipment overheating caused by prolonged operation of each light source, the light sources can be turned on and off using the existing "flashlight" operating mode. This means that each light source (central ring light source 581, circumferential ring light source 582, and fill light source 583) is synchronized and turned on only at the moment the camera captures the image, and then turned off immediately after the image is captured. This significantly reduces the light source's operating time and heat generation, preventing sustained high temperatures from affecting the light source's lifespan or causing temperature-related changes in the uncured glue on the circuit board (such as flowing and bubbling). Furthermore, this mode can be implemented by linking the camera trigger signal with the light source driver circuit through a control system (such as a PLC). This mature and easy-to-integrate technology balances equipment stability and detection accuracy without compromising the fill light effect (the light source provides normal illumination during capture), making it suitable for the actual working conditions of circuit board dispensing quality inspection.

[0049] Furthermore, if Figure 4 and Figure 6 As shown, the mounting base 55 includes a horizontal plate 552, which includes a first mounting area and a second mounting area. The circumferential camera 53 is fixed to the first mounting area via the multiple support blocks 551, and the three-dimensional line scan camera 51 is fixed to the second mounting area. The projections of the first mounting area and the second mounting area on the horizontal plane are spaced apart. The projections of the first mounting area and the second mounting area of ​​the mounting base 55 are spaced apart to solve the problem of interference between the field of view of the three-dimensional line scan camera 51 and other cameras, ensuring that each camera operates independently. In actual use, the three-dimensional line scan camera 51 needs to project a laser line to the dispensing area. If it is installed too close to the circumferential camera 53 and the center camera 52, the laser may be blocked by other cameras or light sources, resulting in thickness measurement errors. The spaced mounting areas can avoid this interference, making the laser light path of the three-dimensional line scan camera 51 unobstructed. At the same time, the shooting fields of the circumferential camera 53 and the center camera 52 are not blocked by the laser device, ensuring that the accuracy of thickness detection and shape detection do not affect each other.

[0050] As a preferred embodiment of the present application, Figure 13 and Figure 14 As shown, the conveying and positioning mechanism 2 includes a fixed horizontal frame 21 and a movable horizontal frame 22 arranged in parallel, a spacing adjustment mechanism, and a synchronous conveyor belt 241 assembly. The fixed horizontal frame 21 is fixed to the base 1. The spacing adjustment mechanism includes a spacing adjustment drive motor 231 and a screw-nut mechanism 232 driven by the spacing adjustment drive motor 231. The movable horizontal frame 22 is mounted on the nut of the screw-nut mechanism 232. The drive motor drives the screw of the screw-nut mechanism 232, driving the movable horizontal frame 22 toward or away from the fixed horizontal frame 21. The synchronous conveyor belt 241 assembly is used to carry and transport carriers and includes a conveyor belt 241, a driving pulley 242, a driven pulley 243, and a conveying drive motor 244. The conveyor belt 241 is tensioned on the driving pulley 242 and the driven pulley 243, and the conveying drive motor 244 is connected to the driving pulley 242. The fixed horizontal frame 21, movable horizontal frame 22, and spacing adjustment mechanism of the conveying and positioning mechanism 2 can solve the inconvenience of transporting carriers and circuit boards of different sizes and adapt to a variety of product specifications. In actual production, for example, when the size of the carrier increases, the spacing adjustment drive motor 231 drives the screw nut mechanism 232, driving the movable cross frame 22 away from the fixed cross frame 21, so that the distance between the two cross frames increases. The entire process is completed with one click on the control panel, and no manual disassembly and adjustment is required; the synchronous conveyor belt 241 assembly can drive the conveyor belt 241 to run at a uniform speed through the driving wheel 242, the driven wheel 243 and the conveying drive motor 244, ensuring smooth transportation of the carrier, avoiding deformation of the circuit board due to bumps and glue, and providing a stable shooting basis for subsequent inspection.

[0051] Furthermore, if Figure 13 and Figure 14 As shown, the conveying positioning mechanism 2 also includes a carrier positioning unit, which includes a first transverse telescopic cylinder 25 installed on the fixed cross frame 21 and a composite positioning mechanism installed on the fixed cross frame 21, the composite positioning mechanism includes a second transverse telescopic cylinder 26 and a vertical telescopic cylinder 27 installed at the end of the second transverse telescopic cylinder 26, and the composite positioning mechanism has an avoidance position and a clamping position: in the avoidance position, the vertical telescopic cylinder 27 descends to the bottom of the conveyor belt 241; in the clamping position, the vertical telescopic cylinder 27 first extends above the conveyor belt 241, and the second transverse telescopic cylinder 26 then drives the vertical telescopic cylinder 27 to push the carrier to abut against the first transverse telescopic cylinder 25, thereby clamping and positioning the carrier at the detection position. During actual inspection, the carrier moves with the conveyor belt 241 to the front of the inspection station, and the vertical telescopic cylinder 27 of the composite positioning mechanism is in the avoidance position (lower than the conveyor belt 241), which does not affect the transportation; when the carrier approaches the inspection station, the vertical telescopic cylinder 27 rises to above the conveyor belt 241, and the second transverse telescopic cylinder 26 pushes the carrier to abut against the first transverse telescopic cylinder 25, forming a two-way clamping, ensuring that the carrier and the circuit board are reliably and stably in their position and inspection area, thereby ensuring the reliability of the inspection data.

[0052] As a preferred embodiment of the present application, Figure 15 As shown, the base 1 includes a base 11 and a frame structure fixed to the base 11. The frame structure includes a lower frame 12 and an upper frame 13, which are connected by columns 14, crossbeams 15, and longitudinal beams 16. The conveying and positioning mechanism 2 is mounted on the lower frame 12, the upper imaging and detection unit 3 is mounted on the upper frame 13, and the lower imaging and detection unit 4 is mounted on the base 11. The base 11, columns 14, crossbeams 15, and longitudinal beams 16 are all hollow structures filled with vibration-absorbing and damping materials. In actual use, not only are there multiple vibration sources in the surrounding environment, but the X-axis moving module 541 and Y-axis moving module 542 of the 2D mobile platform also generate continuous vibrations due to motor operation and guide rail friction when driving the imaging module for rapid movement. If this vibration is transmitted to the imaging module, it may cause the laser scanning trajectory of the 3D line scan camera 51 to deviate (affecting thickness measurement accuracy) and blur the images captured by the center camera 52 and circumferential camera 53 (especially during high-speed capture, where vibration can cause distortion of the dispensing edge contour). The vibration-absorbing and damping materials (such as damping rubber and foam metal) within the hollow structure can absorb vibration energy through their own deformation, significantly attenuating the vibration generated by the two-dimensional mobile platform before it is transmitted to the camera module and the conveying and positioning mechanism 2. This ensures that the three-dimensional line scan camera 51 can accurately capture the height information of the dispensing surface, and the center camera 52 and the circumferential camera 53 can capture clear images of the dispensing plane and edges, thereby avoiding detection errors caused by vibration. In a preferred embodiment, the mating surfaces of the base 11 and the lower frame 12, as well as the mating surfaces of the lower frame 12 and the upper frame 13, can be refined (for example, by performing rough milling, semi-finishing milling, and fine milling on a milling machine) to reduce roughness and improve parallelism. After refined processing, the base 11, lower frame 12, and upper frame 13 are assembled to ensure that the parallel tolerance of the conveying and positioning mechanism 2, the upper camera detection unit 3, and the lower camera detection unit 4 is controlled within the range of ±0.05mm, thereby ensuring detection accuracy.

[0053] As a preferred embodiment of the present application, Figure 16 As shown, the device can be installed as a whole in a protective shell 6. The protective shell 6 can be provided with a flip-up protective door 61. One end of the flip-up protective door 61 extends to the top of the protective shell 6 and is hinged on the main structure of the protective shell 6, and the other end extends to the front side of the protective shell 6. Maintenance personnel can flip up the flip-up protective door 61 at the front side of the device to facilitate maintenance of the interior of the device, especially for the maintenance of the upper shooting detection unit 3.

[0054] After the device is started, the carrier (with a circuit board placed on it and glue dispensing areas on both sides) is transported by the synchronous conveyor belt 241 assembly. When the carrier triggers the photoelectric sensor in front of the detection station, the conveying drive motor 244 slows down to a stop, and the carrier positioning unit is activated: the vertical telescopic cylinder 27 of the composite positioning mechanism rises from the avoidance position to the clamping position, and the second transverse telescopic cylinder 26 extends to push the carrier to abut against the first transverse telescopic cylinder 25 to achieve positioning; the control system calls the preset program according to the circuit board model, and the two-dimensional mobile platform drives the camera module to move and align with each glue dispensing area in turn: the three-dimensional line scan camera 51 emits a laser line scan on the glue dispensing surface to generate three-dimensional point cloud data; the central camera 52 captures the plane image of the glue dispensing; the circumferential camera 53 captures the side image from four directions, and the light sources are turned on synchronously during the shooting and turned off immediately after the shooting is completed; the image data is transmitted to the industrial computer, and after pre-processing, the 3D data is triangulated to calculate the glue dispensing thickness and compared with the standard range; the plane image is extracted by edge detection to determine whether the coverage area meets the standard; after splicing the side images, it is detected whether there are burrs or depressions on the edges. After comprehensive judgment is qualified, the carrier positioning unit is released, the carrier is manually removed or the conveyor belt 241 is reversed to transport the circuit board out; if it is unqualified, an alarm is triggered, the defect position is marked and the image data is stored.

[0055] Anything not described in this application can be achieved by adopting or drawing on existing technologies.

[0056] The various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on the differences from other embodiments.

[0057] The foregoing is merely an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should all be included within the scope of the claims of the present application.

Claims

1. A circuit board dispensing quality detection device, characterized in that: The device comprises a base and a conveying and positioning mechanism, an upper shooting and detection unit, and a lower shooting and detection unit respectively mounted on the base. The conveying and positioning mechanism is mounted on the base and is used to convey a carrier carrying a circuit board and realize positioning. The upper shooting and detection unit is located above the conveying and positioning mechanism, and the lower shooting and detection unit is located below the conveying and positioning mechanism. The upper shooting and detection unit and the lower shooting and detection unit are respectively used to collect dispensing images on the front and back of the circuit board and both include a shooting module, which includes: Two symmetrically arranged three-dimensional line scan cameras, whose shooting light paths are tilted, and the shooting light paths of the two three-dimensional line scan cameras are tilted and cross-opposite; A central camera with a vertical shooting light path; Multiple circumferential cameras are distributed circumferentially around the central camera, with shooting light paths inclined and adjustable inclination angles; The light source assembly is used to provide fill light when the three-dimensional line scan camera, the central camera and / or the circumferential camera capture images.

2. The circuit board dispensing quality detection device according to claim 1, characterized in that: The upper shooting and detection unit and the lower shooting and detection unit further include a two-dimensional mobile platform, and the two-dimensional mobile platform includes: An X-axis moving module is fixed to the base; A Y-axis moving module is installed on the sliding part of the X-axis moving module; A mounting seat, fixed to the sliding portion of the Y-axis moving module, for carrying the shooting module; The two-dimensional mobile platform drives the shooting module to cover the circuit board detection area.

3. The circuit board dispensing quality detection device according to claim 2, characterized in that: The mounting seat is provided with a plurality of support blocks, and the plurality of support blocks are fixed at intervals around the central camera; A rotating shaft is provided between adjacent support blocks, and the circumferential camera is mounted on the rotating shaft through a support frame. The rotating shaft is pivotally connected to the support block, and the tilt angle of the optical path of the circumferential camera can be adjusted by rotating the rotating shaft; The support block is provided with a first arc-shaped groove, and the first protrusion at the end of the rotating shaft is engaged in the first arc-shaped groove to limit the rotation angle of the rotating shaft. The arc-shaped trajectory of the first arc-shaped groove limits the shooting light paths of all circumferential cameras to tilt in the direction toward the dispensing area of ​​the circuit board, and the shooting light paths of each circumferential camera jointly enclose a shooting range covering the edge of the dispensing area.

4. The circuit board dispensing quality detection device according to claim 3, characterized in that: The support frame is provided with an oblique sliding groove, and the support frame is fixed to the rotating shaft by a first fastener. When the first fastener is loosened, the support frame drives the circumferential camera to move obliquely upward or downward in a direction perpendicular to the rotating shaft through the sliding of the oblique sliding groove and the first fastener, thereby realizing height adjustment of the circumferential camera; The center camera is connected to the mounting seat through a height adjustment structure, and the height adjustment structure includes a vertical slide groove provided on the mounting seat and a second fastener passing through the vertical slide groove. The center camera is fixed to the mounting seat through the second fastener. When the second fastener is loosened, the second fastener can move up and down along the vertical slide groove and re-fix the center camera, thereby realizing height adjustment of the center camera.

5. The circuit board dispensing quality detection device according to claim 4, characterized in that: The light source assembly includes a central annular light source corresponding to the central camera and circumferential annular light sources corresponding one-to-one to the multiple circumferential cameras; The central annular light source is fixed to the mounting base, and the shooting light path of the central camera passes through the central through hole of the central annular light source; The circumferential ring light source is fixed on the supporting frame, and the shooting light path of the circumferential camera passes through the central through hole of the circumferential ring light source.

6. The circuit board dispensing quality detection device according to claim 5, characterized in that: A fill light source is provided between adjacent support blocks, and the fill light source is pivotally connected to the support block. The support block is provided with a second arc groove, and the second convex portion at the end of the fill light source is engaged in the second arc groove to limit the rotation angle of the fill light source.

7. The circuit board dispensing quality detection device according to claim 3, characterized in that: The mounting base includes a horizontal plate, which includes a first mounting area and a second mounting area. The circumferential camera is fixed to the first mounting area through the multiple support blocks, and the three-dimensional line scan camera is fixed to the second mounting area. The projections of the first mounting area and the second mounting area on the horizontal plane are arranged at intervals.

8. The circuit board dispensing quality detection device according to claim 1, characterized in that: The conveying and positioning mechanism comprises: A fixed horizontal frame and a movable horizontal frame are arranged in parallel, wherein the fixed horizontal frame is fixed on the base; The spacing adjustment mechanism includes a spacing adjustment drive motor and a screw-nut mechanism driven by the spacing adjustment drive motor, wherein the movable horizontal frame is mounted on the nut of the screw-nut mechanism, and the drive motor drives the screw of the screw-nut mechanism to drive the movable horizontal frame toward or away from the fixed horizontal frame; The synchronous conveyor belt assembly is respectively arranged on the opposite sides of the fixed cross frame and the movable cross frame, and is used to carry and transport the carrier, including a conveyor belt, a driving wheel, a driven wheel and a conveying drive motor. The conveyor belt is tensioned on the driving wheel and the driven wheel, and the conveying drive motor is connected to the driving wheel.

9. The circuit board dispensing quality detection device according to claim 8, characterized in that: The conveying and positioning mechanism further includes a carrier positioning unit, and the carrier positioning unit includes: a first transverse telescopic cylinder mounted on the fixed horizontal frame; A composite positioning mechanism is installed on the fixed horizontal frame, comprising a second transverse telescopic cylinder and a vertical telescopic cylinder installed at the end of the second transverse telescopic cylinder, and the composite positioning mechanism has an avoidance position and a clamping position: When in the avoidance position, the vertical telescopic cylinder descends to the bottom of the conveyor belt; when in the clamping position, the vertical telescopic cylinder first extends above the conveyor belt, and the second transverse telescopic cylinder then drives the vertical telescopic cylinder to push the carrier to abut against the first transverse telescopic cylinder, thereby clamping and positioning the carrier at the inspection position.

10. The circuit board dispensing quality detection device according to claim 1, characterized in that: The base includes a base and a frame structure fixed to the base, the frame structure includes a lower frame and an upper frame, the lower frame and the upper frame are connected by columns, cross beams, and longitudinal beams, the conveying and positioning mechanism is installed on the lower frame, the upper shooting and detection unit is installed on the upper frame, and the lower shooting and detection unit is installed on the base; The base, the columns, the cross beams, and the longitudinal beams are all hollow structures filled with vibration absorbing and reducing materials.

Images