A semiconductor package quality visual inspection device

Abstract

The application discloses a kind of semiconductor package quality visual detection device, belong to semiconductor detection technical field, this kind of semiconductor package quality visual detection device, including base, the base top end is fixedly connected with sorting table, the sorting table middle portion is slidably connected with mobile placement table, the sorting table top end is fixedly connected with detection box, the sorting table one end is fixedly connected with collection hopper, the detection box middle portion is installed with light change subassembly, the detection box inboard is slidably connected with several light irradiation module group.The application utilizes inverted Y type chute mobile placement table, ensures that semiconductor package is accurately moved to the detection box below, the detection box is equipped with a variety of light module that can be automatically replaced, by adjusting the irradiation distance, highlight package features, improve detection accuracy, finally the device can be according to analysis result, sorting table passes through electric sliding table and push rod etc. Component, automatically with the package piece of qualified and unqualified respectively sent to corresponding collection box, realize automatic distinction.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor detection, and particularly relates to a visual detection device for semiconductor packaging quality. BACKGROUND

[0002] Semiconductor packaging is a key link in integrated circuit manufacturing, and its core function is to protect the chip from physical damage, environmental erosion such as moisture and dust, and to provide electrical connection and heat dissipation path. With the Moore's Law approaching the physical limit, advanced packaging technologies such as SiP, 2.5D / 3D packaging, Chiplet, etc. improve system performance through stacking and heterogeneous integration, but also make the packaging structure increasingly complex, which brings new quality risks.

[0003] At present, the traditional manual visual inspection has the problems of low efficiency, less than 200 units / hour per person, strong subjectivity, high omission rate, etc., and it is difficult to meet the precision requirements of modern high-density packaging: the defect recognition needs to reach 10 pm level. Although the automatic optical inspection (AOI) can improve the efficiency, it still faces challenges such as image acquisition and processing under different lighting conditions, accurate identification and classification of small defects, etc., which are the key technical bottlenecks hindering further improvement of the precision of semiconductor packaging quality detection. SUMMARY

[0004] The technical problem to be solved by the application is to overcome the shortcomings of the prior art and provide a visual detection device for semiconductor packaging quality.

[0005] The technical solution adopted to solve the above technical problems is: a visual detection device for semiconductor packaging quality, comprising a base, a sorting table is fixedly connected to the top end of the base, a movable placement table is slidably connected to the middle part of the sorting table, a detection box is fixedly connected to the top end of the sorting table, a collecting hopper is fixedly connected to one end of the sorting table, a light changing assembly is installed in the middle part of the detection box, and a plurality of light irradiation modules are slidably connected to the inner side of the detection box.

[0006] Further, a reverse Y-shaped sliding groove is arranged in the middle part of the sorting table, and the reverse Y-shaped sliding groove is slidably connected with the movable placement table in engagement.

[0007] Through the above technical solution, the reverse Y-shaped sliding groove in the sorting table is slid to ensure that the semiconductor packaging piece can be accurately moved under the detection box. According to the analysis result, the sorting table guides the qualified semiconductor packaging piece and the unqualified semiconductor packaging piece to the flawless collecting box and the defective collecting box respectively through the sorting rail system, i.e. the electric sliding table and the first push rod and other components, to realize automatic physical separation.

[0008] Further, the detection box comprises a shell, one end of the shell is fixedly connected with a plurality of long slides and short slides on the inner side, and the long slides and the short slides are in pairs as a group, and the inner sides of the long slides and the short slides in the same group are slidably connected with a single light irradiation module.

[0009] Through the above technical scheme, the light irradiation module can be flexibly slid along the long slide and the short slide, ensuring that the light irradiation module is more convenient to store and take, and the design of sliding connection facilitates the maintenance and replacement of the light irradiation module, thereby improving the service life and maintenance efficiency of the detection device.

[0010] Further, the light irradiation module comprises a plurality of fixed frames, the fixed frames are slidably connected with the long slides and the short slides, and the inner sides of the plurality of fixed frames are fixedly connected with a ring light group, a dome light group, a coaxial light group and a low-angle light slow shooting lamp group.

[0011] Through the above technical scheme, the ring light group, the dome light group, the coaxial light group and the low-angle light slow shooting lamp group can provide light of different angles and intensities respectively, ensuring that various defects on the surface of the semiconductor package can be clearly captured under different light conditions. The design of this multi-light source combination greatly improves the accuracy and reliability of detection.

[0012] Further, a plurality of first hydraulic push rods are fixedly connected on both sides of the shell, and the first hydraulic push rods are located between the long slides and the short slides, and a reinforcing column is fixedly connected on both sides of the first hydraulic push rods on the same side, and the bottom end of the reinforcing column is fixedly connected with a sorting table, and the extension end of the first hydraulic push rod is fixedly connected with a C-shaped push plate, and the C-shaped push plate is slidably attached to the surface of the fixed frame.

[0013] Through the above technical scheme, the first hydraulic push rod is provided to enable the C-shaped push plate to smoothly and powerfully push the fixed frame, thereby realizing the automatic selection and taking of the light irradiation module. The addition of the reinforcing column enhances the stability of the first hydraulic push rod, ensuring that it is not prone to shaking or deviation during operation, further improving the reliability and safety of the device. The sliding attachment design of the C-shaped push plate and the surface of the fixed frame not only reduces the frictional resistance in the pushing process, but also ensures the accuracy of the pushing, so that the light irradiation module can be accurately delivered to the predetermined position, facilitating subsequent replacement work. This design of automatic sorting and positioning greatly improves the detection efficiency and reduces the tediousness and errors of manual operation.

[0014] Further, the light changing assembly comprises a transverse electric guide rail strip, both ends of the transverse electric guide rail strip are fixedly connected with the inner wall of the shell, the middle part of the transverse electric guide rail strip is slidably connected with a longitudinal electric guide rail strip, the middle part of the longitudinal electric guide rail strip is slidably connected with an L-shaped mounting plate, the middle part of the L-shaped mounting plate is fixedly connected with a servo motor, the power output end of the servo motor is fixedly connected with a limiting protruding column, the middle part of the limiting protruding column is fixedly connected with a fixed clamping plate, both sides of the fixed clamping plate are fixedly connected with electric telescopic columns, the bottom end of the limiting protruding column penetrates through and is slidably connected with a sliding clamping plate, the telescopic end of the electric telescopic column is fixedly connected with the sliding clamping plate, and one side of the fixed clamping plate and the sliding clamping plate is engaged with the fixed frame.

[0015] Through the above technical scheme, the combination design of the transverse electric guide rail strip and the longitudinal electric guide rail strip enables the L-shaped mounting plate to move flexibly in a two-dimensional plane, thereby adjusting the position of the light irradiation module. The introduction of the servo motor provides accurate power output, ensuring that the light irradiation module can accurately and quickly reach the specified position. The design of the limiting protruding column not only enhances the stability of the fixed clamping plate but also realizes firm clamping of the fixed frame through cooperation with the sliding clamping plate. The telescopic function of the electric telescopic column enables the sliding clamping plate to adaptively adjust according to the thickness of the fixed frame, ensuring the tightness and stability of clamping. This multi-degree-of-freedom adjustment and precise clamping design enables the light irradiation module to be flexibly adjusted according to different detection requirements, greatly improving the flexibility and adaptability of detection.

[0016] Further, the inner side of the shell is fixedly connected with a T-shaped bracket, the middle part of the T-shaped bracket is installed with an industrial camera, the top middle part of the shell is installed with a junction box, the top of the shell is rotatably connected with a display host, the industrial camera is electrically connected with the display host through the junction box, the top of the shell is installed with an operation keyboard away from the junction box, and the both sides of the detection box are respectively installed with side plate doors.

[0017] Through the above technical scheme, the design of the T-shaped bracket provides a stable mounting platform for the industrial camera, ensuring that it can maintain a stable shooting angle and position during detection. The industrial camera, as the core detection component, can capture subtle defects and flaws on the surface of the semiconductor package in real time through high-precision image acquisition. The junction box serves as a bridge connecting the industrial camera and the display host, ensuring the stability and efficiency of data transmission. The rotatable connection design of the display host enables the operator to adjust the display angle according to actual needs, improving the convenience and comfort of operation. The installation of the operation keyboard provides an intuitive and simple control method for the operator, enabling precise control of the detection process. The side plate doors facilitate detection and maintenance of the interior of the shell, and also enhance the structural strength and sealing performance of the entire detection device.

[0018] Further, the top end surface of the sorting table is fixedly connected with a plurality of column supports, the column supports are located on both sides of the inverted Y-shaped chute, a plurality of sliding tables are fixedly connected to the top ends of the column supports on the same side, the top end of the sliding table is slidingly connected with the movable placement table, a plurality of round head supports are fixedly connected to the top end of one side of the sorting table, a lifting strip is rotatably connected to the top end of the round head support, the end of the lifting strip away from the round head support is rotatably engaged with the sliding table, a linkage rod is fixedly connected between the two lifting strips at the middle two rotating ends, a push rod is fixedly connected to the middle of the linkage rod, an L-shaped plate is slidingly connected to one side surface of the inverted Y-shaped chute, the L-shaped plate is penetratingly rotatably connected with the sorting table, the middle corner end of the L-shaped plate is rotatably connected with the sorting table, and a second push rod is fixedly connected to the end of the L-shaped plate away from the push rod.

[0019] Through the above technical scheme, the design of the column support not only provides stable support for the sliding table, but also ensures the smooth sliding of the sliding table in the horizontal direction. The sliding connection of the sliding table and the movable placement table enables the movable placement table to move flexibly on the sliding table, facilitating the sorting of semiconductor packages at different positions. The rotatable connection of the round head support and the lifting strip, in cooperation with the linkage rod and the push rod, enables the lifting of one end of the sliding table to be controlled. When the push rod is subjected to external force, it drives the linkage rod and the lifting strip to rotate, and then automatically lifts the sliding table through the supporting action of the round head support, so that the packaged semiconductor after detection falls into the collection hopper, ensuring the stability and accuracy of the sorting process, and greatly improving the flexibility and practicality of the entire semiconductor package quality visual detection device.

[0020] Further, the bottom end of the sorting table is fixedly connected with first guide rails on both sides, the surface of the first guide rails is slidingly connected with electric sliding tables, and the electric sliding tables are fixedly connected with a first push rod.

[0021] Through the above technical scheme, the design of the electric sliding table enables the first push rod to move smoothly in the horizontal direction, thereby driving the movable placement table to slide. The sliding connection of the first guide rail not only ensures the stability of the movement of the electric sliding table, but also improves the positioning accuracy of the movable placement table on the sliding table. The penetrating sliding connection of the first push rod and the movable placement table enables the movable placement table to move smoothly and accurately to the specified position along the first guide rail under the pushing of the electric sliding table, thereby facilitating accurate sorting of semiconductor packages. This design further enhances the flexibility and accuracy of the entire semiconductor package quality visual detection device, ensuring the stability and efficiency of the sorting process.

[0022] Further, the two blocking blocks are respectively slidably connected through the inverted Y-shaped sliding groove, and the two blocking blocks are symmetrically arranged.

[0023] Through the above technical scheme, the two blocking blocks can smoothly slide in the inverted Y-shaped sliding groove, and the precise positioning and control of the blocking blocks are realized through the meshing transmission of the rack and the gear. The design of the first motor enables the gear to rotate, thereby driving the rack and the blocking blocks to move. When the semiconductor package is moved to the designated position, the two blocking blocks can symmetrically move to the middle to stably clamp the semiconductor package on the sorting table for visual inspection. When the detection result is obtained, the blocking block on the corresponding side is retracted to realize automatic material distribution. The whole process does not require manual intervention, greatly improving the detection efficiency and accuracy.

[0024] Further, the moving placement table comprises a placement disc, the bottom end of the placement disc is slidably connected with the sliding table, the inside of the placement disc is provided with an air suction hole, a cylindrical sliding block is rotatably arranged at the bottom end of the middle part of the placement disc, the cylindrical sliding block is slidably connected with the inverted Y-shaped sliding groove, a support column is fixedly connected with the top end of the cylindrical sliding block, the top end of the support column is attached with the placement disc, an L-shaped pipe is arranged in the middle part of the support column, a micro fan is installed in the L-shaped pipe, the top opening of the L-shaped pipe is in communication with the air suction hole, two connecting plates are respectively fixedly connected with the bottom end of the placement disc on both sides, the connecting plates are slidably connected with the first push rod, and the connecting plates are slidably attached with the second push rod on one side.

[0025] Through the technical scheme, the design of the micro fan, air is extracted from the air suction hole through the L-shaped pipe, further enhancing the adsorption of the placement disc on the semiconductor package, forming a negative pressure inside the placement disc, which can stably adsorb the semiconductor package on the placement disc, avoiding shaking or falling during movement, the meshing sliding connection of the cylindrical slider and the inverted Y-shaped sliding groove enables the placement disc to move along a specific trajectory, ensuring that the semiconductor package is accurately moved to the detection position, meanwhile, the arrangement of the first push rod and the second push rod enables the placement disc to advance in the horizontal direction and reach the lifting strip position, the second push rod at the bottom end of the advancing cylindrical slider contacts and pushes the second push rod, driving the second push rod linkage structure, and then pushing the lifting strip to lift the placement disc and keep it inclined, at this time, the L-shaped pipe is disconnected from the air suction hole, and the semiconductor package slides to the collecting hopper under the action of its own gravity, completing the entire sorting process, this design not only improves the sorting efficiency of the semiconductor package, but also ensures the accuracy of sorting, avoiding damage caused by shaking or falling, greatly improving the practicability and reliability of the semiconductor package quality visual detection device.

[0026] Further, the collecting hopper includes a flawless collecting box and a defective collecting box, the flawless collecting box and the defective collecting box are jointly installed on the same side of the sorting table, the flawless collecting box and the defective collecting box correspond to two branches of the inverted Y-shaped sliding groove respectively, guide plates are fixedly connected to the connection positions of the flawless collecting box and the defective collecting box and the sorting table respectively, and the guide plates are rotatably engaged with the cylindrical edges of the placement disc.

[0027] Through the technical scheme, when the semiconductor package is sorted, it is guided to the flawless collecting box or the defective collecting box according to the quality detection result, specifically, when the placement disc carrying the semiconductor package moves along the inverted Y-shaped sliding groove to the corresponding branch, due to the rotatable engagement design of the guide plate and the cylindrical edge of the placement disc, the placement disc can stably push the semiconductor package into the corresponding collecting box, further improving the reliability and practicability of the device.

[0028] The beneficial effects of the present application are as follows:

[0029] 1. The semiconductor package to be detected is placed on the movable placement table, the movable placement table slides through the inverted Y-shaped sliding groove in the sorting table, ensuring that the semiconductor package can be accurately moved under the detection box, according to the analysis result, the sorting table guides the qualified semiconductor package and the unqualified semiconductor package into the flawless collecting box and the defective collecting box respectively through the split rail track system, i.e. the electric sliding table and the first push rod and other components, realizing automatic physical separation;

[0030] 2. The application detects the inside of the box by detecting a variety of light irradiation modules, which can be automatically replaced as needed, and adjusting the irradiation distance by replacing the light assembly, to highlight different features of the semiconductor package, thereby enhancing the accuracy of detection. Under the light irradiation, the industrial camera captures the image of the semiconductor package, and displays and analyzes it in real time through the display host. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 is the first perspective view of the overall structure of the application;

[0032] Figure 2 is the second perspective view of the overall structure of the application;

[0033] Figure 3 is the expanded view of the internal structure of the application;

[0034] Figure 4 is the first perspective view of the sorting table structure of the application;

[0035] Figure 5 is the second perspective view of the sorting table structure of the application;

[0036] Figure 6 is the internal structure of the sorting table of the application;

[0037] Figure 7 is the cross-sectional view of the overall structure of the application;

[0038] Figure 8 is the three-dimensional structure of the light replacement assembly of the application;

[0039] Figure 9 is the internal structure of the detection box of the application;

[0040] Figure 10 is the structure of the light irradiation module of the application;

[0041] Figure 11 is the first perspective view of the moving placement table structure of the application;

[0042] Figure 12 is the second perspective view of the moving placement table structure of the application.

[0043] Label: 1, base; 2, sorting table; 201, inverted Y-shaped chute; 202, blocking block; 203, first motor; 204, column support; 205, sliding table; 206, material guiding missing plate; 207, round head support column; 208, lifting strip; 209, linkage rod; 210, push rod; 211, first push rod; 212, electric sliding table; 213, first guide rail; 214, second push rod; 215, L-shaped plate; 216, rack; 217, gear; 3, moving placement table; 301, placement disc; 302, cylindrical slider; 303, connecting plate; 304, air suction hole; 305, support column; 306, L-shaped tube; 307, micro fan; 4, detection box; 401, shell; 402, junction box; 403, side plate door; 404, T-shaped frame; 405, industrial camera; 406, long slide bar; 407, short slide bar; 408, first hydraulic push rod; 409, reinforcing column; 410, C-shaped push plate; 5, display host; 6, operation keyboard; 7, collection hopper; 701, flawless collection box; 702, defective collection box; 8, light changing assembly; 801, horizontal electric guide rail strip; 802, vertical electric guide rail strip; 803, L-shaped mounting plate; 804, servo motor; 805, limiting convex column; 806, fixed clamping plate; 807, sliding clamping plate; 808, electric telescopic column; 9, light irradiation module; 901, fixed frame; 902, ring-shaped light lamp group; 903, dome-shaped light lamp group; 904, coaxial light lamp group; 905, low-angle light slow lamp group. DETAILED DESCRIPTION

[0044] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application is further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the present application and do not limit the present application.

[0045] As Figures 1 to 12As shown, the semiconductor package quality visual detection device of the embodiment includes a base 1, the top end of the base 1 is fixedly connected with a sorting table 2, the middle part of the sorting table 2 is slidably connected with a moving placement table 3, the top end of the sorting table 2 is fixedly connected with a detection box 4, one end of the sorting table 2 is fixedly connected with a collecting hopper 7, the middle part of the detection box 4 is installed with a light changing assembly 8, the inner side of the detection box 4 is slidably connected with a plurality of light irradiation modules 9, through the cooperation of the light changing assembly 8 and the light irradiation modules 9, the detection of the semiconductor package under multiple angles and multiple light conditions can be realized, so that the defects and flaws on the surface of the semiconductor package can be more comprehensively captured, the design of the light changing assembly 8 enables the light irradiation modules 9 to be quickly and accurately replaced to adapt to different detection requirements, the annular light lamp group 902, the dome light lamp group 903, the coaxial light lamp group 904 and the low-angle light slow lamp group 905 arranged inside the light irradiation modules 9 can respectively highlight different features of the semiconductor package, such as edges, surface textures, internal defects, etc., so as to greatly enhance the accuracy and reliability of the detection, during the detection process, the operator can input instructions through the operation keyboard 6 to control the working state of the light changing assembly 8 and the light irradiation modules 9, and adjust the shooting parameters of the industrial camera 405, realize the comprehensive and efficient detection of the semiconductor package, at the same time, the display host 5 can display the detection image and analysis results in real time to provide intuitive and clear detection feedback for the operator, further improve the detection efficiency and accuracy.

[0046] As Figures 3 to 4As shown, the middle of the sorting table 2 is provided with an inverted Y-shaped chute 201, which is in sliding engagement with the movable placing table 3. The top surface of the sorting table 2 is fixedly connected with a plurality of column supports 204, which are located on both sides of the inverted Y-shaped chute 201. The top ends of the column supports 204 on the same side are fixedly connected with a sliding table 205, which is in sliding engagement with the movable placing table 3. The top end of one side of the sorting table 2 is fixedly connected with a plurality of round head columns 207, the top end of which is rotatably connected with a lifting strip 208. The end of the lifting strip 208 away from the round head column 207 is in rotational engagement with the sliding table 205. A linkage rod 209 is fixedly connected between the rotating ends of the two lifting strips 208 in the middle. The linkage rod 209 is fixedly connected with a push rod 210 in the middle. The surface of one side of the inverted Y-shaped chute 201 is slidingly connected with an L-shaped plate 215, which is in penetrating rotational connection with the sorting table 2. The middle corner end of the L-shaped plate 215 is in rotational connection with the sorting table 2. The end of the L-shaped plate 215 away from the push rod 210 is fixedly connected with a second push rod 214, which enhances the automation degree and control precision of the entire device. The design of the L-shaped plate 215, through the linkage of the push rod 210 and the second push rod 214, realizes the precise control of the lifting action of the sliding table 205. When the push rod 210 is subjected to external force (such as the pushing of an electric device or a pneumatic cylinder), it will drive the linkage rod 209 and the lifting strip 208 to rotate. At this time, due to the penetrating rotational connection between the L-shaped plate 215 and the sorting table 2, and the fixed connection between the end of the L-shaped plate 215 away from the push rod 210 and the second push rod 214, the second push rod 214 will move, and further interact with the movable placing table 3 or the sliding table 205 through its structural design, to ensure that the sliding table 205 is smoothly lifted at the appropriate time point, so that the detected semiconductor package can be smoothly slid into the collecting hopper 7. Not only does it improve the smoothness and stability of the sorting action, but also effectively avoids the damage of the semiconductor package during the sorting process, further improving the performance and reliability of the entire semiconductor package quality visual detection device.

[0047] As Figures 3 to 7As shown, the bottom end of the sorting table 2 is fixedly connected with first guide rails 213 on both sides, the first guide rails 213 are slidingly connected with electric sliding tables 212, the electric sliding tables 212 are fixedly connected with a first push rod 211, the first push rod 211 is slidingly connected with the moving placement table 3, two blocking blocks 202 are slidingly connected in the middle of the inverted Y-shaped sliding groove 201, the two blocking blocks 202 are symmetrically arranged, one end of the blocking block 202 inside the sorting table 2 is fixedly connected with a rack 216, one side of the rack 216 is meshingly and drivingly connected with a gear 217, the gear 217 is rotatably connected with the sorting table 2, the gear 217 is rotatably connected with a first motor 203 in the middle, the power output end of the first motor 203 is fixedly connected with the gear 217, the rotation of the gear 217 is driven by the start of the first motor 203, since the gear 217 is meshingly and drivingly connected with the rack 216, the rack 216 will move with the rotation of the gear 217, the movement of the rack 216 further drives the sliding of the blocking block 202 in the inverted Y-shaped sliding groove 201, this design enables the blocking block 202 to accurately block or pass the semiconductor package on the moving placement table 3 when needed, the sliding connection of the electric sliding table 212 on the surface of the first guide rail 213 and the sliding connection of the first push rod 211 with the moving placement table 3 together realize the stable movement and accurate positioning of the moving placement table 3 during the sorting process, through the cooperation of the first motor 203, the gear 217, the rack 216 and the blocking block 202, the visual detection device can realize the automatic sorting of the semiconductor package, improve the sorting efficiency and accuracy, at the same time, this design also enhances the flexibility and controllability of the whole device, so that the device can adapt to the sorting needs of semiconductor packages of different sizes and specifications.

[0048] As Figures 4 to 6As shown, the collection bucket 7 includes a flawless collection box 701 and a defective collection box 702, which are jointly installed on the same side of the sorting table 2, and correspond to two branches of the inverted Y-shaped chute 201, respectively. The flawless collection box 701 and the defective collection box 702 are fixedly connected with guide plates 206 at the connection with the sorting table 2, respectively, and the two guide plates 206 are rotatably engaged with the cylindrical edge of the placement disc 301 at the end away from the flawless collection box 701 and the defective collection box 702. The design of the guide plate 206 not only ensures that the semiconductor package can smoothly and accurately slide into the corresponding collection box, but also effectively reduces the impact and friction of the semiconductor package during the sliding process through the rotating engagement feature, further protecting the integrity of the semiconductor package. In addition, the engagement of the guide plate 206 with the cylindrical edge of the placement disc 301 also plays a guiding and positioning role, allowing the semiconductor package to slide according to the predetermined trajectory, avoiding chaos or damage caused by deviation of the sliding path. This design not only improves the sorting efficiency and accuracy of the semiconductor package, but also enhances the reliability and practicality of the entire device, providing strong support for visual detection of semiconductor packaging quality.

[0049] As shown in Figures 7 to 9 The detection box 4 includes a housing 401, one end of which is fixedly connected with a plurality of long slides 406 and short slides 407 on the inside, and the long slides 406 and short slides 407 are in pairs. The inner sides of the long slides 406 and short slides 407 in the same group are slidably connected with a single light irradiation module 9. The light irradiation module 9 can freely slide along the tracks of the long slides 406 and short slides 407. This design allows the detection personnel to flexibly switch different light irradiation according to the needs of the semiconductor package, meeting different irradiation needs. In addition, the internal space layout of the housing 401 is reasonable, which can accommodate and protect the light irradiation module 9 and other related detection components, making the entire detection box 4 compact in structure and complete in function. This flexible and efficient light irradiation design provides more accurate and reliable lighting conditions for visual detection of semiconductor packaging quality, further improving the accuracy and reliability of the detection results.

[0050] As shown in Figures 7 to 9As shown, the inside of the shell 401 is fixedly connected with a plurality of first hydraulic push rods 408 on both sides, a plurality of first hydraulic push rods 408 are respectively located between the long slide bar 406 and the short slide bar 407, and a reinforcing column 409 is fixedly connected on both sides of the first hydraulic push rod 408 on the same side. The bottom end of the reinforcing column 409 is fixedly connected with the sorting table 2, the telescopic end of the first hydraulic push rod 408 is fixedly connected with a C-shaped push plate 410, the C-shaped push plate 410 is in sliding fit with the surface of the fixed frame 901, and the design of the C-shaped push plate 410 enables the light irradiation module 9 to realize rapid and stable sliding switching during detection. When it is necessary to replace the light irradiation module 9, the first hydraulic push rod 408 will be started to drive the C-shaped push plate 410 to slide along the surface of the fixed frame 901, thereby pushing the light irradiation module 9 to move along the track of the long slide bar 406 and the short slide bar 407 to the predetermined position. This design not only improves the switching efficiency of the light irradiation module 9, but also ensures the stability and accuracy of the light irradiation module 9 during sliding. In addition, the sliding fit design of the C-shaped push plate 410 and the fixed frame 901 effectively reduces the shaking and noise of the light irradiation module 9 during sliding, providing a more quiet and stable detection environment for visual detection of semiconductor packaging quality.

[0051] As shown in Figures 7 to 9 The inside top end of the shell 401 is fixedly connected with a T-shaped frame 404, the middle part of the T-shaped frame 404 is installed with an industrial camera 405, the top end of the shell 401 is installed with a junction box 402, the top end of the shell 401 is rotatably connected with a display host 5, the industrial camera 405 is electrically connected with the display host 5 through the junction box 402, the top end of the shell 401 is installed with an operation keyboard 6 away from the junction box 402, and the both sides of the detection box 4 are respectively installed with side plate doors 403. The design of the T-shaped frame 404 provides a stable mounting platform for the industrial camera 405, ensuring that it can maintain high stability and accuracy when shooting semiconductor packaging parts. As the core component of visual detection, the performance of the industrial camera 405 directly affects the accuracy and efficiency of detection. Through the electrical connection with the display host 5 through the junction box 402, the industrial camera 405 can transmit the captured image data to the display host 5 in real time for display and analysis. This design not only simplifies the connection lines of the equipment, but also improves the stability and speed of data transmission.

[0052] As shown in Figures 7 to 8As shown, the light changing assembly 8 includes a transverse electric guide rail strip 801, both ends of which are fixedly connected with the inner wall of the shell 401, and a longitudinal electric guide rail strip 802 is slidingly connected with the middle part of the transverse electric guide rail strip 801, and an L-shaped mounting plate 803 is slidingly connected with the middle part of the longitudinal electric guide rail strip 802, and a servo motor 804 is fixedly connected with the middle part of the L-shaped mounting plate 803, and a limiting protruding column 805 is fixedly connected with the power output end of the servo motor 804, and a fixed clamping plate 806 is fixedly connected with the middle part of the limiting protruding column 805, and electric telescopic columns 808 are fixedly connected with both sides of the fixed clamping plate 806, and a sliding clamping plate 807 is slidingly connected with the bottom end of the limiting protruding column 805, and the telescopic end of the electric telescopic column 808 is fixedly connected with the sliding clamping plate 807, and one side of the fixed frame 901 is engaged between the fixed clamping plate 806 and the sliding clamping plate 807, and through the driving of the servo motor 804, the limiting protruding column 805 can drive the fixed clamping plate 806 and the sliding clamping plate 807 to clamp or release the fixed frame 901 of the light irradiation module 9, when the light irradiation module 9 needs to be replaced, the servo motor 804 is started, and the fixed frame 901 is loosened by the limiting protruding column 805 driving the fixed clamping plate 806 and the sliding clamping plate 807, then the transverse electric guide rail strip 801 and the longitudinal electric guide rail strip 802 work cooperatively to drive the L-shaped mounting plate 803 and the light irradiation module 9 fixedly connected therewith to move to a predetermined position, at this time, the electric telescopic column 808 is telescoped to push the sliding clamping plate 807 to approach the fixed clamping plate 806, thereby realizing the fixation of the new light irradiation module 9, this design not only improves the automation degree of the replacement of the light irradiation module 9, but also ensures the stability and accuracy thereof during the replacement process, meanwhile, the cooperation of the limiting protruding column 805, the fixed clamping plate 806, the sliding clamping plate 807 and the electric telescopic column 808 provides a reliable clamping mechanism for the light irradiation module 9, effectively preventing the shaking and falling thereof during the detection process, and further improving the detection precision and reliability.

[0053] As shown, Figures 9 to 10 The light irradiation module 9 includes a plurality of fixed frames 901, which are slidingly connected with the long slide strip 406 and the short slide strip 407, and the inner sides of the plurality of fixed frames 901 are respectively fixedly connected with an annular light lamp group 902, a dome light lamp group 903, a coaxial light lamp group 904 and a low-angle light slow-shooting lamp group 905, the annular light lamp group 902 is mainly used for highlighting the edge features of the semiconductor package, helping to detect edge defects; the dome light lamp group 903 provides uniform and soft light, which is used for detecting surface texture and tiny defects; the coaxial light lamp group 904 can reduce reflection and shadow, making internal defects more clearly visible; and the low-angle light slow-shooting lamp group 905 emphasizes the unevenness of the semiconductor package through low-angle illumination, facilitating the capture of subtle height changes, the combined use of such multi-light assembly not only greatly improves the detection accuracy and comprehensiveness, but also significantly enhances the adaptability of the device to different types of semiconductor packages.

[0054] As Figures 11 to 12 shown, the mobile placement table 3 comprises a placement disc 301, the bottom end of which is slidingly connected with the sliding table 205, the inside of the placement disc 301 is provided with an air suction hole 304, the middle bottom end of the placement disc 301 is rotatably provided with a cylindrical sliding block 302, the cylindrical sliding block 302 is slidingly connected with the inverted Y-shaped sliding groove 201 in meshing mode, the top end of the cylindrical sliding block 302 is fixedly connected with a support column 305, the top end of the support column 305 is attached to the placement disc 301, the middle part of the support column 305 is provided with an L-shaped pipe 306, the L-shaped pipe 306 is internally installed with a micro fan 307, the top end opening of the L-shaped pipe 306 is in communication with the air suction hole 304, the bottom end of the placement disc 301 is fixedly connected with a connecting plate 303 on both sides, the connecting plate 303 is slidingly connected with the first push rod 211 in penetrating mode, one side of the connecting plate 303 is slidingly attached to the second push rod 214, when it is needed to detect the semiconductor package, the micro fan 307 is started to suck out the air inside the placement disc 301 through the L-shaped pipe 306 to form a negative pressure environment, at this time, the semiconductor package will be tightly adsorbed on the surface of the placement disc 301 due to the action of atmospheric pressure, which effectively prevents the semiconductor package from falling or mispositioning due to vibration or movement in the detection process, at the same time, the cylindrical sliding block 302 is slidingly connected with the inverted Y-shaped sliding groove 201 in meshing mode, which ensures the stability and accuracy of the placement disc 301 in the movement process, along with the pushing of the first push rod 211, the connecting plate 303 drives the placement disc 301 to slide along the preset track to the inside of the detection box 4 for detection, after the detection is completed, the placement disc 301 is lifted by the lifting strip 208, the L-shaped pipe 306 is separated from the air suction hole 304, the negative pressure environment disappears, and the semiconductor package can easily fall from the placement disc 301 for subsequent sorting operation, this design not only improves the stability and safety of the semiconductor package in the detection process, but also effectively simplifies the operation process and improves the detection efficiency.

[0055] The working principle of the embodiment is as follows:

[0056] When it is needed to detect the quality of the semiconductor package, first, the operator places the semiconductor package to be detected on the placement disc 301 of the mobile placement table 3, then the electric sliding table 212 is started to drive the first push rod 211 to slide along the first guide rail 213, thereby pushing the mobile placement table 3 to slide along the sliding table 205, in the sliding process, the cylindrical sliding block 302 in the middle part of the placement disc 301 is slidingly connected with the inverted Y-shaped sliding groove 201 on the sorting table 2 in meshing mode, which ensures that the placement disc 301 can stably move along a specific track.

[0057] When the placing disc 301 moves to the detection box 4, the industrial camera 405 inside the detection box 4 starts to capture the image of the semiconductor package, at this time, the light switching assembly 8 is started, according to the detection requirement, the electric telescopic column 808 is telescoped, the required light irradiation module 9 is pushed out, the servo motor 804 drives the limiting protrusion column 805 to rotate, through the cooperation of the fixed clamping plate 806 and the sliding clamping plate 807, the selected light irradiation module 9 is pushed into the shooting range of the industrial camera 405, and the best lighting condition is provided.

[0058] The image captured by the industrial camera 405 is transmitted to the display host 5 through the junction box 402 for real-time display and analysis, after the analysis is completed, according to the analysis result, the first motor 203 corresponding to one side drives the gear 217 to rotate, the rotation of the gear 217 drives the rack 2216 engaged with the gear 217 to move linearly, at this time, the blocking block 202 corresponding to the channel is pulled open, the electric sliding table 212 continues to push the moving placing table 3 to move along the inverted Y-shaped sliding groove 201 to the corresponding branch, at this time, the material guiding missing plate 206 and the rotating engagement design of the cylindrical edge of the placing disc 301 stably push the semiconductor package into the flawless collection box 701 or the defective collection box 702.

[0059] During the whole detection process, the micro fan 307 constantly draws air from the air suction hole 304 through the L-shaped pipe 306, forms negative pressure, and stably adsorbs the semiconductor package on the placing disc 301, avoids shaking or falling during the movement, when the placing disc 301 reaches the lifting strip 208 position, the second push rod 214 pushes the connecting plate 303, drives the placing disc 301 to tilt, at this time, the L-shaped pipe 306 is disconnected with the air suction hole 304, the semiconductor package slides to the collection hopper 7 under the action of its own gravity, and the whole sorting process is completed.

[0060] As described above, the operator only needs to place the semiconductor package to be detected on the moving placing table 3, and the device can automatically complete the subsequent detection, sorting and collection work, which not only greatly improves the work efficiency, but also reduces the difficulty and error rate of manual operation.

[0061] The above only describes the preferred embodiments of the present application and is not used to limit the protection scope of the present application.

Claims

1. A semiconductor packaging quality visual inspection device, comprising a base (1), characterized in that: The top of the base (1) is fixedly connected to a sorting table (2), the middle of the sorting table (2) is slidably connected to a movable placement table (3), the top of the sorting table (2) is fixedly connected to a detection box (4), one end of the sorting table (2) is fixedly connected to a collection hopper (7), the middle of the detection box (4) is equipped with a light exchange component (8), and several light irradiation modules (9) are slidably connected to the inside of the detection box (4). The sorting table (2) is provided with an inverted Y-shaped chute (201) in the middle, and the inverted Y-shaped chute (201) is engaged and slidably connected with the movable placement table (3); The detection box (4) includes a shell (401). Several long slide bars (406) and short slide bars (407) are fixedly connected to the inner side of one end of the shell (401). Several long slide bars (406) and short slide bars (407) are paired up. The inner side of the long slide bars (406) and short slide bars (407) in the same group is slidably connected to a single light irradiation module (9). The lighting module (9) includes several fixed frames (901), which are slidably connected to long slide bars (406) and short slide bars (407). The inner sides of the several fixed frames (901) are respectively fixedly connected to a ring light group (902), a dome light group (903), a coaxial light group (904), and a low-angle slow-motion light group (905). The light-changing assembly (8) includes a transverse electric guide rail (801), both ends of which are fixedly connected to the inner wall of the housing (401). A longitudinal electric guide rail (802) is slidably connected to the middle of the transverse electric guide rail (801). An L-shaped mounting plate (803) is slidably connected to the middle of the longitudinal electric guide rail (802). A servo motor (804) is fixedly connected to the middle of the L-shaped mounting plate (803). The servo motor (804) outputs power. A limiting protrusion (805) is fixedly connected to the end, and a fixed clamping plate (806) is fixedly connected to the middle of the limiting protrusion (805). Electric telescopic columns (808) are fixedly connected to both sides of the fixed clamping plate (806). A sliding clamping plate (807) is slidably connected to the bottom end of the limiting protrusion (805). The telescopic end of the electric telescopic column (808) is fixedly connected to the sliding clamping plate (807). The fixed clamping plate (806) and the sliding clamping plate (807) engage with one side of the fixed frame (901). The mobile placement platform (3) includes a placement tray (301), the bottom end of which is slidably connected to a sliding platform (205). An air intake hole (304) is provided inside the placement tray (301). A cylindrical slider (302) rotates at the bottom of the middle part of the placement tray (301). The cylindrical slider (302) is engaged and slidably connected to an inverted Y-shaped groove (201). A support column (305) is fixedly connected to the top of the cylindrical slider (302). The top of the support column (305) is in contact with the placement tray (301). An L-shaped tube (306) is provided in the middle of the support column (305). A miniature fan (307) is installed inside the L-shaped tube (306). The top opening of the L-shaped tube (306) is connected to the air intake hole (304). Connecting plates (303) are fixedly connected to both sides of the bottom end of the placement tray (301).

2. The semiconductor packaging quality visual inspection device according to claim 1, characterized in that, Several first hydraulic push rods (408) are fixedly connected to both sides inside the housing (401). Several first hydraulic push rods (408) are located between the long slide bar (406) and the short slide bar (407). The first hydraulic push rods (408) on the same side are fixedly connected to both sides of the first hydraulic push rods (408). The bottom end of the reinforcing column (409) is fixedly connected to the sorting table (2). The telescopic end of the first hydraulic push rod (408) is fixedly connected to a C-shaped push plate (410). The C-shaped push plate (410) slides and fits against the surface of the fixed frame (901).

3. The semiconductor packaging quality visual inspection device according to claim 1, characterized in that, A T-shaped frame (404) is fixedly connected to the top of the inner side of the housing (401). An industrial camera (405) is installed in the middle of the T-shaped frame (404). A junction box (402) is installed in the middle of the top of the housing (401). A display host (5) is rotatably connected to the top of the housing (401). The industrial camera (405) is electrically connected to the display host (5) through the junction box (402). An operation keyboard (6) is installed on the top of the housing (401) away from the junction box (402). Side doors (403) are installed on both sides of the detection box (4).

4. The semiconductor packaging quality visual inspection device according to claim 1, characterized in that, The sorting table (2) has several column supports (204) fixedly connected to its top surface. The column supports (204) are all located on both sides of the inverted Y-shaped chute (201). The top of the column supports (204) on the same side is fixedly connected to a sliding table (205). The top of the sliding table (205) is slidably connected to the movable placement table (3). The top of one side of the sorting table (2) has several round-headed pillars (207) fixedly connected to its top. The top of the round-headed pillars (207) is rotatably connected to a lifting bar (208). The end of the lifting bar (208) away from the round-headed pillars (207) is connected to the sliding table (205). The two lifting bars (208) in the middle are fixedly connected to a linkage rod (209). A lever (210) is fixedly connected to the middle of the linkage rod (209). An L-shaped plate (215) is slidably connected to one side surface of the inverted Y-shaped chute (201). The L-shaped plate (215) is rotatably connected to the sorting table (2). The corner end of the L-shaped plate (215) is rotatably connected to the sorting table (2). A second push rod (214) is fixedly connected to one end of the L-shaped plate (215) away from the lever (210). The second push rod (214) is slidably attached to one side of the connecting plate (303).

5. The semiconductor packaging quality visual inspection device according to claim 1, characterized in that, The sorting table (2) is fixedly connected to the bottom two sides of the first guide rail (213), and the electric slide table (212) is slidably connected to the surface of the first guide rail (213). The electric slide tables (212) are fixedly connected to each other by a first push rod (211), and the first push rod (211) is slidably connected to the connecting plate (303).

6. The semiconductor packaging quality visual inspection device according to claim 1, characterized in that, The inverted Y-shaped chute (201) has two blocking blocks (202) that slide through the middle of the separated section. The two blocking blocks (202) are symmetrically arranged. One end of the blocking block (202) inside the sorting table (2) is fixedly connected to a rack (216). A gear (217) is meshed and driven on one side of the rack (216). The gear (217) is rotatably connected to the sorting table (2). A first motor (203) is rotatably connected to the middle of the gear (217). The power output end of the first motor (203) is fixedly connected to the gear (217).

7. The semiconductor packaging quality visual inspection device according to claim 1, characterized in that, The collection hopper (7) includes a flawless collection box (701) and a flawed collection box (702). The flawless collection box (701) and the flawed collection box (702) are installed on the same side of the sorting table (2). The flawless collection box (701) and the flawed collection box (702) correspond to the two branches of the inverted Y-shaped chute (201). The connection between the flawless collection box (701) and the flawed collection box (702) and the sorting table (2) is fixedly connected to the guide plate (206). The ends of the two guide plates (206) away from the flawless collection box (701) and the flawed collection box (702) can rotate and engage with the cylindrical edge of the placement tray (301).

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