Detection light source for positioning and cutting semiconductor wafer

Abstract

The detection light source comprises a bottom plate, at least one mounting hole is formed in the bottom plate, one end of the mounting hole is sleeved with a diffusion structure, the other end of the mounting hole is sleeved with a light source assembly, the diffusion structure is sleeved with the light source assembly, one end of the light source assembly is provided with a cover plate assembly, and the cover plate assembly is arranged on the bottom plate. The cover plate assembly is externally connected with a power line in electrical and signal connection with the light source assembly, one end of the bottom plate is externally connected with an air inlet pipe used for being communicated with an air source, a ventilation pipeline is arranged in the bottom plate, a ventilation opening is formed in one end of the diffusion structure, and the air inlet pipe, the ventilation pipeline and the ventilation opening are sequentially communicated. The detection light source for positioning and cutting the semiconductor wafer has the advantages that the detection light source passes through the air inlet pipe-gt; a ventilation pipeline-gt; the ventilation opening forms an air curtain on one side of the diffusion structure, and the air curtain can blow away chippings and dust or prevent liquid from splashing down, so that normal light propagation of the light source assembly and imaging quality are guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of detection light sources for semiconductor wafers, and in particular to a detection light source used for positioning and cutting semiconductor wafers. Background Art

[0002] In the semiconductor wafer dicing process, separating the wafer into individual chips is done using two mainstream methods: mechanical dicing and laser dicing. Due to cost constraints, mechanical dicing is the most common method. The machine dicing process uses a diamond blade. During the dicing process, the blade cuts along the dicing path while spraying deionized water to cool and flush away debris.

[0003] In the inspection of wafer positioning and cutting, a coaxial light source is generally used to illuminate the wafer.

[0004] The structure of the coaxial light source is for example patent document number: CN215489281U, patent name: A Chinese invention patent of an adjustable rectangular coaxial light source. The basic structure of the coaxial light source is: light source -> light-emitting panel -> half-mirror -> light-transmitting glass sheet. The half-mirror converts the light from the light source into vertical light through the inclined structure + semi-transmission and semi-reflection principle, and hits the wafer to be inspected, while providing observation for the camera above.

[0005] However, in the field of wafer positioning and cutting detection, the use of a coaxial light source to detect wafer positioning and cutting has the following defects: during the wafer positioning and cutting process, mechanical cutting of the wafer is used, which will cause the debris generated by the wafer or the liquid splashed by deionized water to adhere to the transparent glass sheet of the coaxial light source, thereby blocking or scattering the light of the coaxial light source and affecting the camera observation and imaging. Summary of the Invention

[0006] The purpose of the present invention is to overcome the above-mentioned defects in the prior art and provide a detection light source for semiconductor wafer positioning and cutting. An air curtain is formed on one side of the diffusion structure through the air inlet pipe -> ventilation duct -> ventilation opening. The air curtain can blow away debris and dust or prevent liquid splashing, thereby ensuring the normal propagation of light from the light source component and ensuring imaging quality.

[0007] To achieve the above-mentioned objectives, the present invention provides a detection light source for semiconductor wafer positioning and cutting, comprising a base plate, at least one mounting hole being provided on the base plate, a diffusion structure being provided at one end of the mounting hole, and a light source assembly being provided at the other end, the light source assembly being provided on the diffusion structure, a cover assembly being installed at one end of the light source assembly, the cover assembly being externally connected to a power line electrically and signal-connected to the light source assembly, an air inlet pipe being externally connected to an air source at one end of the base plate, an air duct being provided inside the base plate, a air opening being provided at one end of the diffusion structure, and the air inlet pipe, the air duct, and the air opening being connected in sequence.

[0008] Preferably, the number of the mounting hole, the diffusion structure, and the light source assembly is set to two.

[0009] Preferably, the diffusion structure includes a first annular structure and a second annular structure installed at one end of the first annular structure, the first annular structure is located at one end of the light source assembly, the second annular structure is respectively mounted on the light source assembly and the cover assembly, a truncated cone-shaped cavity is provided on the inner wall of one end of the first annular structure, the ventilation opening is opened at one end of the truncated cone-shaped cavity, and an observation hole is opened in the middle of the second annular structure.

[0010] Preferably, an annular wall is protruding from the inner wall of the mounting hole, and the annular wall divides the mounting hole into a first mounting hole located at one end of the annular wall and a second mounting hole located at the other end of the annular wall. A first step is provided at one end of the first annular structure of the diffusion structure, and the first annular structure is sleeved on the first mounting hole. The first step is sleeved on the annular wall, and the light source assembly is sleeved on the second mounting hole.

[0011] Preferably, the light source assembly includes an annular PCB board, an LED lamp bead area installed at one end of the annular PCB board, and a wiring area installed at the other end of the annular PCB board, and the wiring area is electrically and signal-connected to the power line.

[0012] Preferably, the LED lamp bead area includes an upper lamp bead area, a lower lamp bead area, a left lamp bead area and a right lamp bead area, and the upper lamp bead area, the lower lamp bead area, the left lamp bead area and the right lamp bead area are respectively used for individual lighting or for combined lighting, and the upper lamp bead area, the lower lamp bead area, the left lamp bead area and the right lamp bead area respectively include a number of evenly distributed LED lamp beads.

[0013] Preferably, the outer side of the annular PCB board is sleeved on the mounting hole, and the inner side of the annular PCB board is sleeved on the diffusion structure.

[0014] Preferably, the side wall of the bottom plate is provided with a plurality of evenly distributed screw holes, and the screw holes of the bottom plate are tightened by using Kimi screws to fix the diffusion structure.

[0015] Preferably, a mounting groove is provided at one end of the mounting hole, and the cover plate assembly includes an upper cover plate installed at one end of the light source assembly and a lower cover plate installed at the bottom of the upper cover plate, the upper cover plate, one end of the upper cover plate is provided with an annular double-sided adhesive coating, one end of the light source assembly is adhered to the annular double-sided adhesive coating, at least one through hole corresponding to the number of mounting holes is provided on the upper cover plate, the through hole is sleeved on the diffusion structure, the upper cover plate is sleeved on the upper part of the mounting groove, the power cord is inserted on the lower cover plate, and the lower cover plate is sleeved on the lower part of the mounting groove.

[0016] Preferably, glue is filled between the edge of the diffusion structure and the mounting hole, between the edge of the upper cover plate and the upper part of the mounting groove, and between the lower cover plate and the lower part of the mounting groove for sealing.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. The present invention provides a detection light source for semiconductor wafer positioning and cutting. Through an air inlet pipe, ventilation duct, and ventilation opening, an air curtain is formed on one side of the diffusion structure (the front side of the light source assembly). Once formed, this air curtain has the following three effects:

[0019] A. Prevent splashing liquid (cooling and lubricating liquid such as deionized water) from adhering to one side of the diffusion structure to prevent the splashing liquid from interfering with the light path emitted by the light source component;

[0020] B. Prevent or blow away debris and dust from adhering to the light path emitted by the light source assembly;

[0021] The above A and B ensure that the light path is not disturbed, the light intensity and uniformity are guaranteed, and the image quality is guaranteed;

[0022] C. The air curtain plays a role in heat dissipation when it flows.

[0023] 2. Further discussion and analysis,

[0024] The coaxial light source in the prior art has the following defects: the half-mirror in the coaxial light source is based on the principle of a semi-reflective and semi-transmissive spectroscope. It is set at 90 degrees between the light source and the wafer to be inspected, and the half-mirror is set at a certain tilt angle. The half-mirror has the following two defects:

[0025] A. The aging of the half-mirror will show a brightness decay of about 5%-8% per year;

[0026] B. Mechanical vibration can easily cause the half-mirror of the coaxial light source to shift, causing the half-mirror to change its tilt angle, which can easily cause the optical path to shift and requires daily calibration.

[0027] The positions of the light source assembly and the diffusion structure of the present invention are both level with the wafer to be inspected, and mechanical vibration will not cause the position angle of the light source assembly + the diffusion structure to shift. Therefore, the optical path of the present invention is simpler, the calibration is simpler, and the optical path is more stable, avoiding the problem of daily calibration due to mechanical vibration.

[0028] 3. Further discussion and analysis show that the number of mounting holes, diffusion structures, and light source components is set to two, that is, the present invention uses dual-station light sources to work simultaneously to improve efficiency.

[0029] 4. Further discussion and analysis,

[0030] The existing coaxial light source has the following defects: the coaxial light source uses a semi-transparent mirror to realize the vertical light path on the wafer to be inspected. The vertical light path is not sensitive enough to low-height features (such as shallow scratches), which can easily cause the subsequent cutting edge chipping rate to increase by 10%-15%;

[0031] The light emitted by the light source assembly of the present invention is respectively hit on the outer side of the first annular structure of the diffusion structure, the truncated cone-shaped cavity inside the first annular structure and the second annular structure, so that the light forms both vertical illumination and high and low angle illumination, thereby effectively avoiding the problem of an increase in the cutting edge chipping rate caused by the inability to detect shallow scratches on the wafer.

[0032] 5. Further discussion and analysis,

[0033] Existing coaxial light sources have the following drawbacks: Variations in wafer material thickness, uneven film deposition, or patterned structures (such as integrated current layers) can cause the vertical light path of the coaxial light source to cause inconsistent reflected / scattered light signals, thus affecting detection results.

[0034] The present invention improves this defect through the above-mentioned fourth point. At the same time, the present invention divides the LED lamp beads into four areas: upper lamp bead area, lower lamp bead area, left lamp bead area and right lamp bead area, which can be lit separately or in combination.

[0035] When individually or in combination, each lamp zone can dynamically adjust the light intensity of different areas, thereby solving the problem of inconsistent reflected / scattered light signals caused by differences in material thickness on the wafer surface.

[0036] When the center of the wafer to be inspected is dense (high-density chip), one of the lamp areas can be lowered to reduce the light intensity to avoid overexposure and improve defect contrast.

[0037] 6. The present invention seals the gaps between the edge of the diffusion structure and the mounting hole, between the edge of the upper cover plate and the upper part of the mounting groove, and between the lower cover plate and the lower part of the mounting groove with glue, thereby preventing the evaporation of water vapor generated by cooling and lubricating liquids such as deionized water from entering the light source and causing damage to the light source. It also avoids the problem of fogging of the semi-mirror of the coaxial light source causing damage to the optical path and affecting photography and imaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0039] Figure 1 1 is a schematic structural diagram of a detection light source for semiconductor wafer positioning and cutting provided by an embodiment of the present invention;

[0040] Figure 2 This is a schematic diagram of the exploded structure of a detection light source for semiconductor wafer positioning and cutting provided by an embodiment of the present invention;

[0041] Figure 3 1 is a front cross-sectional schematic diagram of a detection light source for semiconductor wafer positioning and cutting provided by an embodiment of the present invention;

[0042] Figure 4 This is a schematic oblique side cross-sectional view of a detection light source for semiconductor wafer positioning and cutting provided by an embodiment of the present invention;

[0043] Figure 5 is a structural schematic diagram of a diffusion structure provided by an embodiment of the present invention;

[0044] Figure 6 is a schematic oblique side cross-sectional view of a base plate provided by an embodiment of the present invention;

[0045] Figure 7 This is a schematic diagram of the exploded structure of the diffusion structure, light source assembly, annular double-sided adhesive coating, cover assembly, and power cord provided by an embodiment of the present invention from one viewing angle;

[0046] Figure 8 It is a schematic diagram of the exploded structure of the diffusion structure, light source assembly, annular double-sided adhesive coating, cover assembly and power cord provided by an embodiment of the present invention from another perspective.

[0047] Included in the diagram are:

[0048] 1. Bottom plate; 11. Mounting hole; 111. First mounting hole; 112. Second mounting hole; 113. Annular wall; 15. Screw hole; 16. Mounting slot; 2. Diffusion structure; 20. Ventilation opening; 21. First annular structure; 210. Cone-shaped cavity; 215. First step; 22. Second annular structure; 220. Observation hole; 225. Second step; 3. Light source assembly; 31. Annular PCB board; 311. Upper lamp bead area; 312. Lower lamp bead area; 313. Left lamp bead area; 314. Right lamp bead area; 32. LED lamp bead area; 33. Wiring area; 35. Annular double-sided adhesive coating; 4. Cover assembly; 41. Upper cover; 415. Through hole; 416. Inner convex wall; 42. Lower cover; 5. Power cord; 6. Air intake pipe; 7. Ventilation duct. DETAILED DESCRIPTION

[0049] The following will clearly and completely describe the technical solution in this embodiment of the present invention in conjunction with the drawings in this embodiment of the present invention. Obviously, the embodiment described is only one embodiment of the present invention, not all embodiments of the present invention. Based on this embodiment of the present invention, all other embodiments of the present invention obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0050] See also Figures 1 to 8 An embodiment of the present invention provides a detection light source for semiconductor wafer positioning and cutting, including a base plate 1, at least one mounting hole 11 is opened on the base plate 1, a diffusion structure 2 is sleeved on one end of the mounting hole 11, and a light source assembly 3 is sleeved on the other end, the light source assembly 3 is sleeved on the diffusion structure 2, a cover assembly 4 is installed at one end of the light source assembly 3, the cover assembly 4 is externally connected to a power line 5 connected to the light source assembly 3 electrically and signal-wise, an air inlet pipe 6 for connecting to an air source is externally connected to one end of the base plate 1, a ventilation duct 7 is opened inside the base plate 1, a ventilation opening 20 is opened at one end of the diffusion structure 2, and the air inlet pipe 6, the ventilation duct 7, and the ventilation opening 20 are connected in sequence.

[0051] Furthermore, the number of mounting holes 11, diffusion structures 2, and light source assemblies 3 is set to two. By setting the number of mounting holes 11, diffusion structures 2, and light source assemblies 3 to two, the detection light source for semiconductor wafer positioning and cutting according to the embodiment of the present invention adopts a dual-station light source working simultaneously, thereby improving efficiency.

[0052] The diffusion structure 2 includes a first annular structure 21 and a second annular structure 22 mounted on one end of the first annular structure 21. The first annular structure 21 is located at one end of the light source assembly 3, and the second annular structure 22 is respectively mounted on the light source assembly 3 and the cover assembly 4. A truncated cone-shaped cavity 210 is provided on the inner wall of one end of the first annular structure. The truncated cone-shaped cavity 210 gradually decreases from the outside to the inside. The truncated cone-shaped cavity 210 allows the light path emitted by the light source assembly 3 to irradiate at high and low angles. The ventilation opening 20 is provided at one end of the truncated cone-shaped cavity 210, and an observation hole 220 is provided in the middle of the second annular structure 22. The advantage of this arrangement of the diffusion structure 2 is that the light path emitted by the light source assembly 3 is formed with both vertical irradiation and high and low angle irradiation, thereby effectively avoiding the problem of an increase in the chipping rate due to the inability to detect shallow scratches on the wafer.

[0053] An annular wall 113 protrudes from the inner wall of the mounting hole 11. The annular wall 113 divides the mounting hole 111 into a first mounting hole 111 located at one end of the annular wall 113 and a second mounting hole 112 located at the other end of the annular wall 113. A first stepped platform 215 is provided at one end of the first annular structure 21 of the diffuser structure 2. The first annular structure 21 is sleeved on the first mounting hole 111. The first stepped platform 215 is sleeved on the annular wall 113. The light source assembly 3 is sleeved on the second mounting hole 112. The sleeved first stepped platform 215 on the annular wall 113 ensures more stable installation of the diffuser structure 2.

[0054] The light source assembly 3 includes an annular PCB board 31 , an LED lamp bead area 32 mounted on one end of the annular PCB board 31 , and a wiring area 33 mounted on the other end of the annular PCB board 31 . The wiring area 33 is electrically and signal-connected to the power line 5 .

[0055] The LED lamp bead area 32 includes an upper lamp bead area 311, a lower lamp bead area 312, a left lamp bead area 313, and a right lamp bead area 314. The upper lamp bead area 311, the lower lamp bead area 312, the left lamp bead area 313, and the right lamp bead area 314 are respectively used for lighting individually or for lighting in combination. The upper lamp bead area 311, the lower lamp bead area 312, the left lamp bead area 313, and the right lamp bead area 314 each include a plurality of evenly distributed LED lamp beads. The advantage of such an arrangement of the LED lamp bead area 32 is that when lighting individually or in combination, each lamp bead area can dynamically adjust the light intensity of different areas according to different areas, thereby solving the problem of inconsistent reflected / scattered light signals caused by differences in material thickness on the wafer surface.

[0056] for example:

[0057] When the scribe line in the upper edge area of ​​the wafer to be inspected is wider, the upper lamp bead area 311 can be brightened and other lamp bead areas can be dimmed to achieve enhanced lighting to compensate for the dark edge effect.

[0058] When the center of the wafer to be inspected is dense (high-density chip), one of the lamp areas can be lowered to reduce the light intensity to avoid overexposure and improve defect contrast.

[0059] The outer side of the annular PCB board 31 is mounted on the mounting hole 11, and the inner side of the annular PCB board 31 is mounted on the diffusion structure 2. Specifically, the outer side of the annular PCB board 31 is mounted on the second mounting hole 112 of the mounting hole 11, and the inner side of the annular PCB board 31 is mounted on the second annular structure 22 of the diffusion structure 2.

[0060] The side wall of the bottom plate 1 is provided with a plurality of evenly distributed screw holes 15 , and the screw holes 15 of the bottom plate 1 are tightened by screws to fix the diffusion structure 2 .

[0061] A mounting groove 16 is provided at one end of the mounting hole 11, and the cover assembly 4 includes an upper cover 41 installed at one end of the light source assembly 3 and a lower cover 42 installed at the bottom of the upper cover 41. The upper cover 41 has an annular double-sided adhesive coating 35 at one end, and one end of the light source assembly 3 is adhered to the annular double-sided adhesive coating 35. The upper cover 41 is provided with at least one through hole 415 corresponding to the number of the mounting holes 11. The through hole 415 is sleeved on the diffusion structure 2, the upper cover 41 is sleeved on the upper part of the mounting groove 16, the power cord 5 is inserted into the lower cover 42, and the lower cover 42 is sleeved on the lower part of the mounting groove 16.

[0062] Furthermore, an inner convex wall 416 is provided on the through hole 415 on the upper cover plate 41 , and a second stepped platform 225 is provided at one end of the second annular structure 22 of the diffusion structure 2 . The second stepped platform 225 is sleeved on the inner convex wall 416 .

[0063] Glue is filled between the edge of the diffusion structure 2 and the mounting hole 11 , between the edge of the upper cover plate 41 and the upper portion of the mounting groove 16 , and between the lower cover plate 42 and the lower portion of the mounting groove 16 for sealing.

[0064] Furthermore, glue is filled between the first annular structure 21 of the diffusion structure 2 and the mounting hole 11 for sealing. A number of threaded holes are respectively provided on the upper cover plate 41 and the lower cover plate 42. Bolts are installed through the threaded holes to fix the upper cover plate 41 and the lower cover plate 42 to the mounting groove 16 respectively. Glue is filled in the threaded hole for sealing. The advantage of this is to prevent water vapor generated by cooling and lubricating liquids such as deionized water from evaporating and entering the light source, causing damage to the light source.

[0065] The assembly principle of a detection light source for semiconductor wafer positioning and cutting according to an embodiment of the present invention is as follows:

[0066] S1: Remove the base plate 1 and insert the diffusion structure 2 into the mounting hole 11, that is, insert the first annular structure 21 of the diffusion structure 2 into the first mounting hole 111, insert the first stepped platform 215 of the first annular structure 21 of the diffusion structure 2 into the annular wall 113, and then screw the screws into the screw holes 15 on the side wall of the base plate 1 to fix the diffusion structure 2;

[0067] S2: Insert the power cord 5 into the lower cover 42, and weld the connection area 33 at the other end of the annular PCB board 31 of the light source assembly 3 to the power cord 5. After welding, put the light source assembly 3 into the second mounting hole 112, and then put the light source assembly 3 into the second annular structure 22 of the diffusion structure 2;

[0068] S3: The other end of the annular PCB board 31 of the light source assembly 3 is adhered with an annular double-sided adhesive coating 35. The upper cover plate 41 is placed on the upper portion of the mounting groove 16. One end of the upper cover plate 41 is abutted against and adhered to the light source assembly 3. The through hole 415 of the upper cover plate 41 is placed on the second annular structure 22 of the diffusion structure 2. The inner convex wall 416 of the through hole 415 is placed on the second stepped platform 225 of the second annular structure 22. Bolts are screwed into the threaded holes of the upper cover plate 41 to secure it.

[0069] S4: Slide the lower cover plate 42 over the lower portion of the mounting groove 16 and screw bolts into the threaded holes of the lower cover plate 42 to secure it;

[0070] S6: Insert the air inlet pipe 6 into one end of the base plate 1;

[0071] S7: Fill glue between the first annular structure 21 of the diffusion structure 2 and the mounting hole 11 for sealing, fill glue between the edge of the upper cover plate 41 and the upper part of the mounting groove 16 and between the lower cover plate 42 and the lower part of the mounting groove 16 for sealing, and fill glue in the threaded holes of the upper cover plate 41 and the lower cover plate 42 for sealing.

[0072] The working principle of a detection light source for semiconductor wafer positioning and cutting according to an embodiment of the present invention is as follows:

[0073] S1: Place the wafer to be inspected on one side of the diffusion structure 2, place the camera on one side of the cover assembly 4, connect the power cord 5 to the power and signal, and the light source assembly 3 emits light to the diffusion structure 2, so that the diffusion structure 2 forms both vertical illumination light paths and high-angle illumination light paths, and the vertical illumination light paths and high-angle illumination light paths are projected onto the wafer to be inspected;

[0074] S2: The LED lamp bead area 32 of the light source assembly 3 is divided into four areas: the upper lamp bead area 311, the lower lamp bead area 312, the left lamp bead area 313 and the right lamp bead area 314, which are illuminated individually or in combination. When individually or in combination, each lamp bead area can dynamically adjust the light intensity of different areas;

[0075] S3: The camera observes and images the wafer to be inspected through the observation hole 220.

[0076] The advantages of a detection light source for semiconductor wafer positioning and cutting according to an embodiment of the present invention are:

[0077] 1. Through the air inlet pipe 6 -> ventilation pipe 7 -> ventilation opening 20, an air curtain is formed on one side of the diffusion structure 2 (the front side of the light source assembly 3). After the air curtain is formed, it not only plays a role in heat dissipation, but also prevents the adhesion of liquid, debris and dust, thereby ensuring that the light path is not disturbed, and the light intensity and uniformity are guaranteed, thereby ensuring the quality of the image;

[0078] 2. The optical path of the present invention is simpler and more stable. Mechanical vibration will not cause the position angle of the light source assembly 3 + the diffusion structure 2 to shift, and no daily calibration is required.

[0079] 3. The present invention adopts dual-station light sources to work simultaneously, with a small layout structure and high detection efficiency;

[0080] 4. The present invention forms both vertical irradiation light paths and high and low angle irradiation light paths, thereby effectively avoiding the problem of failure to detect shallow scratches on the wafer causing an increase in the cutting edge chipping rate;

[0081] 5. The present invention has an upper lamp bead area 311, a lower lamp bead area 312, a left lamp bead area 313 and a right lamp bead area 314. When the four are lit individually or in combination, each lamp bead area can dynamically adjust the light intensity of different areas, thereby solving the problem of inconsistent reflected / scattered light signals caused by differences in material thickness on the wafer surface;

[0082] 6. The present invention fills glue for sealing between the first annular structure 21 of the diffusion structure 2 and the mounting hole 11, between the edge of the upper cover plate 41 and the upper part of the mounting groove 16, between the lower cover plate 42 and the lower part of the mounting groove 16, and fills glue for sealing in the threaded holes of the upper cover plate 41 and the lower cover plate 42, so as to prevent water vapor from evaporating into the light source and causing damage to the light source.

[0083] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A detection light source for semiconductor wafer positioning and cutting, characterized in that: The invention comprises a base plate (1), at least one mounting hole (11) is provided on the base plate (1), a diffusion structure (2) is sleeved on one end of the mounting hole (11), and a light source assembly (3) is sleeved on the other end of the mounting hole (11), the light source assembly (3) is sleeved on the diffusion structure (2), a cover plate assembly (4) is installed on one end of the light source assembly (3), the cover plate assembly (4) is externally connected to a power line (5) electrically and signal-connected to the light source assembly (3), an air inlet pipe (6) for connecting to an air source is externally connected to one end of the base plate (1), a ventilation duct (7) is provided inside the base plate (1), a ventilation opening (20) is provided on one end of the diffusion structure (2), and the air inlet pipe (6), the ventilation duct (7), and the ventilation opening (20) are sequentially connected.

2. A detection light source for semiconductor wafer positioning and cutting according to claim 1, characterized in that: The number of the mounting hole (11), the diffusion structure (2), and the light source assembly (3) is set to two.

3. The detection light source for semiconductor wafer positioning and cutting according to claim 1, characterized in that: The diffusion structure (2) comprises a first annular structure (21) and a second annular structure (22) mounted at one end of the first annular structure (21); the first annular structure (21) is located at one end of the light source assembly (3); the second annular structure (22) is respectively sleeved on the light source assembly (3) and the cover assembly (4); a truncated cone-shaped cavity (210) is provided on the inner wall of one end of the first annular structure; the ventilation opening (20) is provided at one end of the truncated cone-shaped cavity (210); and an observation hole (220) is provided in the middle of the second annular structure (22).

4. The detection light source for semiconductor wafer positioning and cutting according to claim 3, characterized in that: An annular wall (113) is convexly provided on the inner wall of the mounting hole (11), and the annular wall (113) divides the mounting hole (111) into a first mounting hole (111) located at one end of the annular wall (113) and a second mounting hole (112) located at the other end of the annular wall (113); a first stepped platform (215) is provided at one end of the first annular structure (21) of the diffusion structure (2); the first annular structure (21) is sleeved on the first mounting hole (111), the first stepped platform (215) is sleeved on the annular wall (113), and the light source assembly (3) is sleeved on the second mounting hole (112).

5. The detection light source for semiconductor wafer positioning and cutting according to claim 1, characterized in that: The light source assembly (3) comprises an annular PCB board (31), an LED lamp bead area (32) mounted on one end of the annular PCB board (31), and a wiring area (33) mounted on the other end of the annular PCB board (31), wherein the wiring area (33) is electrically and signal-connected to a power line (5).

6. The detection light source for semiconductor wafer positioning and cutting according to claim 5, characterized in that: The LED lamp bead area (32) comprises an upper lamp bead area (311), a lower lamp bead area (312), a left lamp bead area (313) and a right lamp bead area (314); the upper lamp bead area (311), the lower lamp bead area (312), the left lamp bead area (313) and the right lamp bead area (314) are respectively used for lighting up individually or for lighting up in combination; the upper lamp bead area (311), the lower lamp bead area (312), the left lamp bead area (313) and the right lamp bead area (314) respectively comprise a plurality of evenly distributed LED lamp beads.

7. The detection light source for semiconductor wafer positioning and cutting according to claim 5, characterized in that: The outer side of the annular PCB board (31) is sleeved on the mounting hole (11), and the inner side of the annular PCB board (31) is sleeved on the diffusion structure (2).

8. The detection light source for semiconductor wafer positioning and cutting according to claim 1, characterized in that: The side wall of the bottom plate (1) is provided with a plurality of evenly distributed screw holes (15), and the screw holes (15) of the bottom plate (1) are tightened by screws to fix the diffusion structure (2).

9. The detection light source for semiconductor wafer positioning and cutting according to claim 1, characterized in that: One end of the mounting hole (11) is provided with a mounting groove (16); the cover plate assembly (4) comprises an upper cover plate (41) mounted on one end of the light source assembly (3) and a lower cover plate (42) mounted on the bottom of the upper cover plate (41); one end of the upper cover plate (41) is provided with an annular double-sided adhesive coating (35); one end of the light source assembly (3) is adhered to the annular double-sided adhesive coating (35); the upper cover plate (41) is provided with at least one through hole (415) corresponding to the number of the mounting holes (11); the through hole (415) is sleeved on the diffusion structure (2); the upper cover plate (41) is sleeved on the upper part of the mounting groove (16); the power cord (5) is inserted into the lower cover plate (42); and the lower cover plate (42) is sleeved on the lower part of the mounting groove (16).

10. The detection light source for semiconductor wafer positioning and cutting according to claim 9, characterized in that: Glue is filled between the edge of the diffusion structure (2) and the mounting hole (11), between the edge of the upper cover plate (41) and the upper portion of the mounting groove (16), and between the lower cover plate (42) and the lower portion of the mounting groove (16) for sealing.

Images