Heat exchanger, electronic equipment and temperature control method

Abstract

The embodiment of the invention provides a heat exchanger, electronic equipment and a temperature control method, and relates to the technical field of heat dissipation of electronic equipment. The heat exchanger is used for being installed on a case front shell of the heat dissipation case. A circuit board accommodating cavity is formed in the heat dissipation case; the heat exchanger comprises an air-air heat exchange assembly and a liquid metal heat exchange assembly; the air-air heat exchange assembly comprises heat exchange fins, a hot end fan and a cold end fan; the heat exchange fins are arranged in the heat dissipation case in the height direction of the heat dissipation case; a plurality of hot air flow channels and a plurality of cold air flow channels adjacent to the hot air flow channels are formed in the heat exchange fins, and each hot air flow channel is isolated from the adjacent cold air flow channel; the liquid metal heat exchange assembly comprises a circulating pipeline and an electromagnetic pump; the circulating pipeline penetrates through the heat exchange fins, and a heat transfer working medium flowing along the circulating pipeline is arranged in the circulating pipeline; the electromagnetic pump is installed on the circulating pipeline and used for driving the heat transfer working medium to flow along the circulating pipeline.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of electronic equipment, and in particular to a heat exchanger, electronic equipment and a temperature control method. Background Art

[0002] With the advancement of power electronics technology, product power density continues to increase, size is trending towards miniaturization, and application scenarios in harsh environments are increasing, leading to increasing thermal management challenges. For example, industrial control cabinets contain high-heat generating components such as power modules and resistors, as well as components such as capacitors and batteries that generate little or no heat but are very sensitive to temperature. During operation, the equipment must dissipate heat within the cavity promptly to prevent overheating of heat-generating components and keep heat-sensitive components within a safe temperature range.

[0003] The industrial environment is relatively complex, and the air is often accompanied by dust particles or high-humidity gases. This requires the cabinet to be made into a highly protected or even sealed cavity to prevent dust, moisture, etc. from entering the cavity and causing short circuits and other problems.

[0004] Existing equipment cabinet designs often use air-to-air heat exchangers to cool the enclosed cavity. This involves dissipating heat inside the cabinet by exchanging cold air outside the cabinet with the hot air inside. However, this heat exchange efficiency is low. Improving the heat exchange capacity and efficiency of air-to-air heat exchangers for cabinets has become a technical problem that needs to be urgently addressed by those skilled in the art. Summary of the Invention

[0005] The purpose of the embodiments of the present application is to provide a heat exchanger, an electronic device, and a temperature control method to improve heat dissipation efficiency. The specific technical solutions are as follows:

[0006] The present application provides a heat exchanger, which is used to be installed on the front shell of a heat dissipation chassis; a circuit board accommodating cavity is formed in the heat dissipation chassis; the heat exchanger includes: an air-to-air heat exchange component and a liquid-metal heat exchange component;

[0007] The air-to-air heat exchange assembly includes: heat exchange fins, a hot end fan, and a cold end fan; the heat exchange fins are arranged inside the heat dissipation chassis along the height direction of the heat dissipation chassis;

[0008] The heat exchange fins are formed with a plurality of hot air flow channels and a plurality of cold air flow channels adjacent to each of the hot air flow channels, wherein each hot air flow channel is isolated from its adjacent cold air flow channel;

[0009] The hot end fan is arranged on the side of the heat exchange fin facing away from the front shell, is located in the circuit board accommodating cavity, and is communicated with the hot air flow channel, and is used to guide the hot air flow inside the circuit board accommodating cavity into the hot air flow channel;

[0010] The cold-end fan is arranged on the other side of the heat exchange fins and is connected to the cold air flow channel. It is used to guide the cold air from the external environment into the cold air flow channel through the area on the front shell of the chassis that is connected to the external environment, and to exchange heat with the hot air in the hot air flow channel through the heat exchange fins; the hot air flows back into the circuit board accommodating cavity after heat exchange, and the cold air flows out to the external environment after heat exchange;

[0011] The liquid-metal heat exchange component includes: a circulation pipe and an electromagnetic pump; the circulation pipe passes through the heat exchange fins and is provided with a heat transfer medium flowing along the circulation pipe; the electromagnetic pump is installed on the circulation pipe to drive the heat transfer medium to flow along the circulation pipe.

[0012] The present application also provides an electronic device, comprising the heat exchanger and the heat dissipation chassis according to any one of the embodiments of the present application;

[0013] The heat exchanger is mounted on the front shell of the heat dissipation chassis.

[0014] The present application also provides a temperature control method, which is applied to a controller, wherein the controller is electrically connected to a hot-end fan, a cold-end fan, and an electromagnetic pump of an air-to-air heat exchange assembly in an electronic device according to any one of the embodiments of the present application; the method comprises:

[0015] The current temperature of the heat-generating module in the heat-dissipating chassis is obtained in real time by a first temperature sensor provided in the circuit board receiving cavity;

[0016] Based on the preset control mode, when the control mode is the fan-coupled electromagnetic pump control mode, the operating parameters of the hot-end fan, the cold-end fan and the electromagnetic pump are determined based on the current temperature of the heating module, and the hot-end fan, the cold-end fan and the electromagnetic pump are controlled using the determined operating parameters.

[0017] Beneficial effects of the embodiments of the present application:

[0018] The embodiments of the present application provide a heat exchanger, an electronic device, and a temperature control method. Inside a heat dissipation chassis, heat exchange fins are used to form mutually isolated hot air flow channels and cold air flow channels. The hot air flow in the hot air flow channel and the cold air flow in the cold air flow channel flow in the hot air flow channel and the cold air flow in the cold air flow channel, respectively, and exchange heat through the heat exchange fins. In some embodiments, the heat exchange fins are bent into a plurality of "X" shapes arranged in a line, and the side walls and boss end faces of the "X"-shaped heat exchange fins are thin-walled structures. When the hot air flow and the cold air flow exchange heat through the heat exchange fins, the heat conduction path is in the direction of the thin-wall thickness of the heat exchange fins, which effectively reduces the length of the heat conduction path, reduces the thermal resistance of the heat conduction, and thus improves the heat dissipation efficiency.

[0019] The hot-end fan draws hot air from the circuit board cavity into the hot air flow channel, while the cold-end fan draws cold air from the outside environment into the cold air flow channel. The hot and cold air flows are isolated from each other, circulating in the hot air flow channel and the cold air flow in the cold air flow channel, exchanging heat between the two as they pass through the heat exchanger. After the heat exchange, the hot air returns from the hot air flow channel to the circuit board cavity, while the cold air is discharged from the cold air flow channel to the outside environment.

[0020] Furthermore, the heat transfer medium inside the liquid metal heat exchange assembly flows through the circulation pipe under the action of the electromagnetic pump, transferring heat from the hot air flow in the hot air flow channel to the cold air flow in the cold air flow channel, further improving the heat exchange efficiency of the heat exchanger. This ensures high flow and heat exchange efficiency while ensuring the high IP protection level of electronic equipment.

[0021] Of course, it is not necessary to achieve all the advantages described above at the same time when implementing any product or method of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other embodiments can also be obtained based on these drawings.

[0023] Figure 1a A schematic structural diagram of a first embodiment of a heat exchanger provided in this application;

[0024] Figure 1b for Figure 1a The heat exchanger shown does not show the structural schematic diagram of the second heat exchange element;

[0025] Figure 1c An exploded view of a first embodiment of a heat exchanger provided in the present application (the first heat exchanger shell is not shown);

[0026] Figure 1d for Figure 1c The heat exchanger does not show a schematic structural diagram of the second heat exchange element;

[0027] Figure 2a for Figure 1a The heat exchanger shown is installed in the heat dissipation chassis;

[0028] Figure 2b for Figure 2a A cross-sectional view of the heat exchanger shown is mounted in a heat sink chassis;

[0029] Figure 3 for Figure 2a A top-down perspective view of the heat dissipation chassis is shown;

[0030] Figure 4a for Figure 1b The structural diagram of the circulation pipeline shown;

[0031] Figure 4b for Figure 4a The main view of the circulation pipe is shown;

[0032] Figure 5a for Figure 3 Cross-sectional view in the AA direction;

[0033] Figure 5b for Figure 3 Cross-sectional view in the middle BB direction;

[0034] Figure 6a for Figure 1a The structural diagram of the first waste cooling recovery assembly is shown;

[0035] Figure 6b for Figure 6a The schematic structural diagram of the cooling row in the first residual cold recovery assembly is shown;

[0036] Figure 7a for Figure 5b Cross-sectional view in CC direction;

[0037] Figure 7b for Figure 5b Cross-sectional view in the middle DD direction;

[0038] Figure 7c for Figure 5b Cross-sectional view in the EE direction;

[0039] Figure 7d for Figure 7c Cross-sectional view in the FF direction;

[0040] Figure 8 for Figure 1b The heat exchange fin shown in the exploded view is divided into two parts;

[0041] Figure 9a A schematic structural diagram of a second embodiment of a heat exchanger provided in this application;

[0042] Figure 9b for Figure 9a (the second heat exchanger shell is not shown);

[0043] Figure 10a for Figure 9a The heat exchanger shown is installed in the heat dissipation chassis;

[0044] Figure 10b for Figure 9a The heat exchanger shown is installed in Figure 10a The cross-sectional view when inside the heat dissipation chassis is shown;

[0045] Figure 11a for Figure 9a The heat exchanger is arranged inside the heat dissipation chassis and the cross-sectional direction is as follows Figure 3 Cross-sectional view shown in the AA direction;

[0046] Figure 11b for Figure 9a The heat exchanger is arranged inside the heat dissipation chassis and the cross-sectional direction is as follows Figure 3 Cross-sectional view when shown in the BB direction;

[0047] Figure 12 for Figure 10b The structural diagram of the circulation pipeline shown;

[0048] Figure 13a for Figure 11b Cross-sectional view in the GG direction;

[0049] Figure 13b for Figure 11b Cross-sectional view in the HH direction;

[0050] Figure 13c for Figure 11b Cross-sectional view in the II direction;

[0051] Figure 14a A schematic structural diagram of a third embodiment of a heat exchanger provided in this application;

[0052] Figure 14b A schematic structural diagram of the third embodiment of the heat exchanger provided in this application from another perspective;

[0053] Figure 14c for Figure 14a An exploded view of the heat exchanger shown;

[0054] Figure 15a for Figure 14a A schematic diagram of the structure of a heat exchanger installed in a heat dissipation chassis;

[0055] Figure 15b for Figure 14a The heat exchanger shown is installed in Figure 15a The cross-sectional view when inside the heat dissipation chassis is shown;

[0056] Figure 16a for Figure 14a Schematic diagram of the structure where the heat exchanger is installed inside the heat dissipation chassis;

[0057] Figure 16b for Figure 14aA schematic diagram of the structure of the heat dissipation chassis from another perspective is shown;

[0058] Figure 17a for Figure 14a The heat exchanger is arranged inside the heat dissipation chassis and the cross-sectional direction is as follows Figure 3 Cross-sectional view shown in the AA direction;

[0059] Figure 17b for Figure 14a The heat exchanger is arranged inside the heat dissipation chassis and the cross-sectional direction is as follows Figure 3 Cross-sectional view when shown in the BB direction;

[0060] Figure 18 for Figure 16a The structural diagram of the circulation pipeline shown;

[0061] Figure 19a for Figure 17b Cross-sectional view in the JJ direction;

[0062] Figure 19b for Figure 17b Cross-sectional view in the KK direction;

[0063] Figure 19c for Figure 17b Cross-sectional view in the LL direction;

[0064] Figure 20a This is a schematic structural diagram of a fourth embodiment of a heat exchanger provided in this application;

[0065] Figure 20b Schematic diagram of parameters of the third heat exchange coating;

[0066] Figure 21a for Figure 20a The heat exchanger is arranged inside the heat dissipation chassis and the cross-sectional direction is as follows Figure 3 Cross-sectional view shown in the AA direction;

[0067] Figure 21b for Figure 20a The heat exchanger is arranged inside the heat dissipation chassis and the cross-sectional direction is as follows Figure 3 Cross-sectional view when shown in the BB direction;

[0068] Figure 22 for Figure 21b Cross-sectional view in the MM direction;

[0069] Figure 23a Schematic diagram of the thermal architecture of the heat dissipation chassis provided for this application;

[0070] Figure 23b A schematic diagram of another thermal architecture of the heat dissipation chassis provided in this application;

[0071] Figure 24 A flow chart of the temperature control scheme provided for this application;

[0072] Figure 25a for Figure 24 In the embodiment shown, a schematic diagram of a heat transfer medium located in a hot air flow channel before being pumped by an electromagnetic pump;

[0073] Figure 25b for Figure 25a Schematic diagram of a section of heat transfer medium located in a cold air flow channel after being pumped a distance;

[0074] Figure 26a for Figure 24 A flow chart of the process for setting the pump force level of the electromagnetic pump in the embodiment shown;

[0075] Figure 26b for Figure 24 Flowchart of the heating module temperature sensor and related threshold setting process in the embodiment shown;

[0076] Figure 26c for Figure 24 A flow chart of a liquid metal temperature sensor and a method for setting related threshold values ​​in the illustrated embodiment;

[0077] Figure 27a for Figure 24 A control curve diagram of the fixed-frequency, fixed-force, intermittent mode in the embodiment shown;

[0078] Figure 27b for Figure 24 A control flow chart of the fixed-frequency, fixed-force, intermittent mode in the embodiment shown;

[0079] Figure 28a for Figure 24 A control curve diagram of the variable frequency and variable force intermittent mode in the embodiment shown;

[0080] Figure 28b for Figure 24 A control flow chart of the variable frequency and variable force intermittent mode in the embodiment shown;

[0081] Figure 29a for Figure 24 The frequency conversion logic diagram of the electromagnetic pump in the variable frequency variable force intermittent mode of the embodiment shown;

[0082] Figure 29b for Figure 24 The variable force logic diagram of the electromagnetic pump in the variable frequency variable force intermittent mode of the embodiment shown;

[0083] Figure 30a for Figure 24 A control curve diagram for the continuous mode in the illustrated embodiment;

[0084] Figure 30b for Figure 24 A control flow chart of the persistence mode in the illustrated embodiment;

[0085] Figure 31a for Figure 24 A control curve diagram of the hybrid mode in the illustrated embodiment;

[0086] Figure 31b for Figure 24 The control flow chart of the hybrid mode in the illustrated embodiment.

[0087] Reference numerals:

[0088] Heat dissipation chassis 100, chassis front shell 101, chassis air inlet 1011, first chassis air outlet 1021, second chassis air outlet 1022, third chassis air outlet 1023, circuit board accommodating cavity 110, split fins 120, printed circuit board 200, power supply capacitor 300, first heating module 400, second heating module 500;

[0089] Air-to-air heat exchange assembly 1, heat exchange fin 11, first narrow fin 111, first stepped structure 1111, second stepped structure 1112, first wide fin 112, first sealing structure 1121, second sealing structure 1122, second wide fin 113, third sealing structure 1131, fourth sealing structure 1132, seventh sealing structure 1133, second narrow fin 114, third stepped structure 1141, fourth stepped structure 1142, fifth stepped structure structure 1143, sixth stepped structure 1144, third wide fin 115, fifth sealing structure 1151, sixth sealing structure 1152, eighth sealing structure 1153, hot end fan 12, cold end fan 13, hot air flow channel 14, cold air flow channel 15, first fin extension port 150a, second fin extension port 150b, first residual cooling extension port 151, second residual cooling extension port 152, accommodating groove 16, fan guard 160, fan air inlet 170;

[0090] Liquid-metal heat exchange assembly 2, circulation pipe 21, first parallel straight pipe 211, hot zone pipe 2111, cold zone pipe 2112, first bent pipe 212, first end-to-end connecting straight pipe 2131, second end-to-end connecting straight pipe 2132, first horizontal portion 214, first connecting portion 215, second horizontal portion 216, second parallel straight pipe 217, horizontal hot zone pipe 2171, horizontal cold zone pipe 2172, second bent pipe 218, third horizontal portion 219, first sub-parallel straight pipe 2191, first sub-bent pipe 2192, second connecting portion 220, connecting straight pipe 2201, fourth horizontal portion 221, second sub-parallel straight pipe 2211, second sub-bent pipe 2212, electromagnetic pump 22, thermoelectric generator 23;

[0091] First waste cold recovery assembly 3, first waste cold recovery chamber 31, first cold air flow inlet 311, first cold air flow outlet 312, first heat exchange element 32, cold plate 320, second heat exchange element 33, cold row 330, cold row fin 331, refrigerant channel 332, phase change gas pipe 34, phase change liquid pipe 35, first end cover 36, first sealing portion 361, first opening portion 362;

[0092] First heat exchanger housing 41, first cavity 410, first hot end air inlet 411, first hot end air outlet 412, first cold end air inlet 413, first hot end air inlet side 414, first cold end air inlet side 415, first hot air flow cavity 416, first cold air flow cavity 417;

[0093] A second heat exchanger housing 42 , a second hot end air inlet side 421 , a second hot end air inlet 4211 , a second hot end air outlet 4212 , a second sidewall 422 , and a second hot air flow cavity 423 ;

[0094] Second waste cold recovery assembly 5, second waste cold recovery chamber 51, second cold air flow inlet 511, second cold air flow outlet 512, third heat exchange element 52, radiator 520, heat pipe 521, second end cover 53, second sealing portion 531, second opening portion 532;

[0095] A first heat exchange coating 71 , a second heat exchange coating 72 , and a third heat exchange coating 73 . DETAILED DESCRIPTION

[0096] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field based on this application are within the scope of protection of this application.

[0097] The first embodiment of the present application provides a heat exchanger, such as Figures 2a to 3 As shown, Figure 2a for Figure 1a The heat exchanger shown is installed in the heat dissipation chassis. Figure 2b for Figure 2a The cross-sectional view of the heat exchanger shown is installed in the heat dissipation chassis. Figure 3 for Figure 2aA perspective view of a heat dissipation chassis from a top view is shown. The X and Y directions in the figure represent the horizontal directions of the heat exchanger, and the Z direction represents the vertical direction of the heat exchanger. The heat dissipation chassis 100 is mounted on the front chassis 101. A circuit board accommodating cavity 110 is formed within the heat dissipation chassis 100. The heat exchanger comprises an air-to-air heat exchange assembly 1 and a liquid-metal heat exchange assembly 2. The air-to-air heat exchange assembly 1 comprises heat exchange fins 11, a hot-end fan 12, and a cold-end fan 13. The heat exchange fins 11 are arranged within the heat dissipation chassis 100 along the height direction of the heat dissipation chassis 100. The heat exchange fins 11 are formed with a plurality of hot air flow channels 14 and a plurality of cold air flow channels 15 adjacent to each hot air flow channel 14, wherein each hot air flow channel 14 is isolated from its adjacent cold air flow channel 15.

[0098] In this embodiment, inside the heat dissipation chassis 100, mutually isolated hot air flow channels 14 and cold air flow channels 15 are formed by the heat exchange fins 11. The hot air flow in the hot air flow channel 14 and the cold air flow in the cold air flow channel 15 flow in the hot air flow channel 14 and the cold air flow in the cold air flow channel 15, respectively, and exchange heat through the heat exchange fins 11. In some embodiments, the heat exchange fins are bent into a plurality of "X" shapes arranged in a line, and the side walls and boss end surfaces of the "X"-shaped heat exchange fins are thin-walled structures. When the hot air flow and the cold air flow exchange heat through the heat exchange fins 11, the heat conduction path is in the direction of the thin-wall thickness of the heat exchange fins 11, which effectively reduces the length of the heat conduction path, makes the thermal resistance smaller, and thus improves the heat dissipation efficiency. The circuit board accommodating chamber 110 is a sealed chamber, thereby ensuring the high IP rating of the built-in power electronic components and preventing them from being affected by pollutants such as dust and moisture in the external environment and causing short circuit problems.

[0099] In the first embodiment of the present application, Figures 1a to 1d As shown, Figure 1a A schematic structural diagram of a first embodiment of a heat exchanger provided in this application; Figure 1b for Figure 1a The heat exchanger shown does not show the structural schematic diagram of the second heat exchange element; Figure 1c An exploded view of a first embodiment of a heat exchanger provided in the present application (the first heat exchanger shell is not shown); Figure 1d for Figure 1cThe heat exchanger does not show a schematic diagram of the structure of the second heat exchange component. The hot-end fan 12 of the heat exchanger is arranged on the side of the heat exchange fins 11 facing away from the front shell 101 of the chassis, located in the circuit board accommodating cavity 110, and connected to the hot air flow channel 14, and is used to guide the hot air flow inside the circuit board accommodating cavity 110 into the hot air flow channel 14; the cold-end fan 13 is arranged on the other side of the heat exchange fins 11, and is connected to the cold air flow channel 15, and is used to guide the cold air flow from the external environment into the cold air flow channel 15 through the area on the front shell 101 of the chassis that is connected to the external environment, and heat exchange with the hot air flow in the hot air flow channel 14 through the heat exchange fins 11; after heat exchange, the hot air flows back to the circuit board accommodating cavity 110, and the cold air is discharged to the external environment after heat exchange.

[0100] In this embodiment, hot air is drawn from the circuit board housing cavity 110 into the hot air flow channel 14 by the hot-end fan 12, while cold air is drawn from the external environment into the cold air flow channel 15 by the cold-end fan 13. The hot and cold air flows are isolated from each other. The hot air circulates within the hot air flow channel 14, while the cold air circulates within the cold air flow channel 15. Heat is exchanged between the two air flows through the heat exchanger. After heat exchange, the hot air returns from the hot air flow channel to the circuit board housing cavity 110, while the cold air is discharged from the cold air flow channel 15 to the external environment.

[0101] In the first embodiment of the present application, Figure 4a and Figure 4b As shown, Figure 4a This is a schematic diagram of the structure of the circulation pipeline provided in the first embodiment of the present application. Figure 4b for Figure 4a The front view of the circulation pipe is shown. The liquid-metal heat exchange assembly 2 includes a circulation pipe 21 and an electromagnetic pump 22. The circulation pipe 21 passes through the heat exchange fins 11 and contains a heat transfer medium that flows along the circulation pipe 21. The electromagnetic pump 22 is installed on the circulation pipe 21 to drive the heat transfer medium to flow along the circulation pipe 21.

[0102] In this embodiment, the heat transfer medium within liquid-metal heat exchange assembly 2 flows within circulation conduit 21 under the action of electromagnetic pump 22, transferring heat from the hot air flow within hot air flow channel 14 to the cold air flow within cold air flow channel 15, further improving the heat exchange efficiency of the heat exchanger. A portion of the heat within circuit board cavity 110 is efficiently transferred to the external environment through the combined action of air-to-air heat exchange assembly 1 and liquid-metal heat exchange assembly 2. This ensures high flow and heat exchange efficiency while maintaining a high IP protection rating for electronic equipment.

[0103] Liquid metal can be used as a heat transfer medium. Liquid metal is a low-melting-point metal or alloy that is liquid at room temperature and has high electrical and thermal conductivity and good fluidity. Gallium-based or bismuth-based liquid metals are preferred.

[0104] The electromagnetic pump 22 is a device that uses electromagnetic force to drive the heat transfer medium. This pump generates a magnetic field within the conductive liquid, using the Lorentz force to propel the liquid, thereby achieving its conveying function. Electromagnetic pumps offer advantages such as compact structure, excellent sealing, and no moving parts, resulting in high reliability. The heat transfer medium circulates under the propulsion of the electromagnetic pump 22, effectively improving heat exchange efficiency.

[0105] Driven by the electromagnetic pump 22, the heat transfer medium will flow along the circulation pipe 21 and alternately flow through the hot air flow channel 14 and the cold air flow channel 15. The "mass transfer process" of the heat transfer medium enables rapid transfer and replacement of heat, which helps to further narrow the temperature difference between the hot air flow channel 14 and the cold air flow channel 15 and enhance the heat exchange effect.

[0106] The following description will be given by taking the heat exchanger provided in the first embodiment as an example.

[0107] In some embodiments of the present application, Figure 3 and Figure 1b As shown, the heat exchange fins 11 of the heat exchanger are bent into a plurality of "X" shapes arranged in a line, forming a plurality of first groove portions and second groove portions arranged alternately; among the plurality of "X" shapes of the heat exchange fins 11, the plurality of first groove portions with opening directions facing away from the front shell 101 of the chassis form a hot air flow channel 14, and among the plurality of "X" shapes, the plurality of second groove portions with opening directions opposite to the first groove portions form a cold air flow channel 15; the hot air flow channel 14 is connected to the circuit board accommodating cavity 110, and the cold air flow channel 15 is connected to the external environment outside the heat dissipation chassis 100.

[0108] In this embodiment, the heat exchange fins 11 are bent into a plurality of "X" shapes arranged in a line, forming a hot air flow channel 14 and a cold air flow channel 15. The hot and cold air flows can flow and exchange heat at the end surfaces of the bosses of the hot and cold air flow channels 14 and 15, respectively, or flow and exchange heat through the sidewalls of the hot and cold air flow channels 14 and 15, respectively. This increases the heat exchange area of ​​the hot and cold air flows, thereby enhancing the heat exchange effect and further improving the heat dissipation efficiency. Preferably, the heat exchange fins 11 are bent at equal intervals, that is, the sidewalls of the heat exchange fins 11 are distributed at equal intervals.

[0109] The heat exchange fins 11 can ensure that the hot air flow channel 14 and the cold air flow channel 15 are isolated from each other, effectively improving the short circuit problem caused by the influence of pollutants such as dust and water vapor in the external environment on the printed circuit board 200, the power supply capacitor 300 and the first heating module 400 inside the circuit board accommodating cavity 110.

[0110] Under the action of the heat exchange fins 11, although the cold airflow and the hot airflow are not in direct contact, they form a state of mutual penetration and surrounding fusion, which is conducive to making the heat exchange process more sufficient.

[0111] In some embodiments of the present application, Figure 1b 、 Figure 5a and Figure 5b As shown, Figure 5a for Figure 3 Cross-sectional view in the AA direction, Figure 5b for Figure 3 The heat exchanger further comprises: a first waste cold recovery component 3; the first waste cold recovery component 3 comprises: a first waste cold recovery chamber 31, a first heat exchange member 32 and a second heat exchange member 33; the first waste cold recovery chamber 31 is arranged at the top of the heat exchange fin 11; the first heat exchange member 32 is in contact with the first heating module 400 in the circuit board accommodating chamber 110, and is used to conduct heat generated by the first heating module 400; the second heat exchange member 33 is arranged in the first waste cold recovery chamber 31; the second heat exchange member 33 is in contact with the first heating module 400 in the circuit board accommodating chamber 110, and is used to conduct heat generated by the first heating module 400; the second heat exchange member 33 is arranged in the first waste cold recovery chamber 31; the second heat exchange member 33 is in contact with the first heating module 400; the first ... The heat exchange element 32 is connected and is used to exchange heat with the cold air flow in the cold air flow channel 15 and the heat exported by the first heating module 400; the first waste cold recovery chamber 31 has a first cold air flow inlet 311 and a first cold air flow outlet 312; the first waste cold recovery chamber 31 is connected with the cold air flow channel 15 through the first cold air flow inlet 311 to allow the cold air to flow into the first waste cold recovery chamber 31 to cool the second heat exchange element 33; after heat exchange, the cold air flow is exported to the external environment through the first cold air flow outlet 312.

[0112] In this embodiment, the first residual cold recovery component 3 is provided to further dissipate heat inside the circuit board accommodating cavity 110. Among them, the first heat exchanger 32 is provided in contact with the first heating module 400, which can effectively absorb the heat of the first heating module 400 and transfer it to the second heat exchanger 33 in the first residual cold recovery cavity 31. The first residual cold recovery cavity 31 is provided at the top of the heat exchange fin 11, and the first cold air flow inlet 311 is connected to the cold air flow channel 15 formed by the heat exchange fin 11. After the cold air flow in the cold air flow channel 15 exchanges heat with the hot air flow in the hot air flow channel 14 through the heat exchange fin 11, it still has a certain degree of coolness compared to the second heat exchanger 33. When the cold air flow flows to the first residual cold recovery cavity 31, the remaining coolness (also known as "residual coolness") can be used to replace and release the heat in the second heat exchanger 33. The cold air flow after heat exchange in the first waste cold recovery chamber 31 brings heat to the external environment. The heat here includes the heat transferred through the heat exchange fins 11 and the heat transferred through the first waste cold recovery component 3.

[0113] In some embodiments of this application, see Figure 1bA first end cover 36 is provided between the first waste cooling recovery chamber 31 and the cold air flow channel 15; a first sealing portion 361 and a first opening portion 362 are provided on the first end cover 36; the cold air flow channel 15 is connected to the first waste cooling recovery chamber 31 through the first opening portion 362, and the hot air flow channel 14 is isolated from the first waste cooling recovery chamber 31 by the first sealing portion 361.

[0114] In this embodiment, the first sealing portion 361 on the first end cover 36 can isolate the first residual cooling recovery chamber 31 from the hot air flow channel 14, while the first opening portion 362 on the first end cover 36 can connect the first residual cooling recovery chamber 31 with the cold air flow channel 15. This ensures that only the cold air in the cold air flow channel 15 can flow into the first residual cooling recovery chamber 31, exchange heat with the second heat exchange element 33, and then flow to the external environment, further ensuring the high IP protection level of the circuit board accommodating chamber 110.

[0115] In some embodiments of the present application, Figure 2b 、 Figure 5a and Figure 6a As shown, the first heat exchange component 32 is a cold plate 320 with refrigerant arranged inside; the second heat exchange component is a cold row 330; the cold plate 320 and the cold row 330 are connected by a phase change air pipe 34 and a phase change liquid pipe 35; at least a part of the cold row 330 is arranged inside the first residual cold recovery chamber 31; the cold plate 320 is arranged in the circuit board accommodating chamber 110; the cold plate 320 is arranged in contact with the first heating module 400 in the circuit board accommodating chamber 110; the refrigerant in the cold plate 320 is heated by the first heating module 400 and changes into a gaseous state; the gaseous refrigerant flows along the phase change air pipe 34 to the cold row 330, and changes into a liquid state after heat exchange with the cold air flow in the first residual cold recovery chamber 31; the liquid refrigerant flows back to the cold plate 320 along the phase change liquid pipe 35. The height of the radiator 330 is higher than the height of the cold plate 320 in the circuit board accommodating cavity 110 ; the phase change gas pipe 34 is located above the phase change liquid pipe 35 .

[0116] In this embodiment, a through hole is provided on the first waste cold recovery chamber 31, through which the phase change air pipe 34 and the phase change liquid pipe 35 can pass, so as to connect the cold plate 320 located outside the first waste cold recovery chamber 31 and the cold row 330 located inside the first waste cold recovery chamber 31. Among them, the cold plate 320, the cold row 330, the phase change air pipe 34 and the phase change liquid pipe 35 are connected to form a closed chamber with a negative pressure environment, which is filled with a refrigerant that can undergo phase change after vacuuming. In a negative pressure environment, the boiling point of the refrigerant is low, and when there is heat input at the cold plate 320, evaporation / boiling phase change behavior (heat absorption) can occur, and condensation phase change behavior (heat release) can occur after encountering cold at the cold row 330.

[0117] The cold plate 320 is connected to the first heating module 400 via a thermal interface material such as thermal grease. It absorbs heat generated by the first heating module 400 and transfers it to the refrigerant within the cold plate 320. After absorbing the heat, the refrigerant evaporates or boils, producing steam, thereby forming a gaseous refrigerant. Due to density and pressure differences, the gaseous refrigerant flows upward along the phase-change gas pipe 34 to the radiator 330 located in the first residual cold recovery chamber 31. There, it encounters cold air, releases heat, and recondenses into liquid refrigerant. Under the influence of gravity, the liquid refrigerant flows downward along the phase-change liquid pipe 35 back to the cold plate 320, repeating the cycle. Through this process, accompanied by the refrigerant's phase-change flow (evaporating and absorbing heat at the cold plate 320 and condensing and releasing heat at the radiator 330), a portion of the heat from the first heating module 400 is transferred to the cold airflow in the first residual cold recovery chamber 31, where it is carried away from the heat dissipation chassis 100.

[0118] At the same time, in the direction of gravity, Figure 5a and Figure 5b The cold row 330 is located above the cold plate 320, so that the first residual cold recovery chamber 31 is located above the first heating module 400 to ensure the reciprocating gas-liquid phase change flow cycle of the refrigerant.

[0119] In the direction of gravity, Figure 5a and Figure 5b The phase change gas pipe 34 is located above the phase change liquid pipe 35. In this way, under the action of density difference and gravity, the gaseous refrigerant will flow along the upper phase change gas pipe 34, while the condensed liquid refrigerant will flow along the lower phase change liquid pipe 35. The gas and liquid flows are separated from each other and do not interfere with each other.

[0120] like Figures 6a to 6b As shown, Figure 6a This is a structural diagram of the first waste cold recovery assembly provided in the first embodiment of the present application. Figure 6b This is a schematic diagram of the structure of a radiator in a circulation pipeline according to the first embodiment of the present application. The radiator 330 comprises radiator fins 331 and refrigerant channels 332. The gaseous refrigerant enters the radiator 330 through the phase-change gas pipe 34. As it flows along the refrigerant channels 332, the gaseous refrigerant exchanges heat with the cold air flow through the radiator fins 331. The condensed liquid refrigerant flows back to the cold plate 320 through the phase-change liquid pipe 35.

[0121] A portion of the heat of the first heating module 400 can be efficiently transferred to the external environment under the action of the "first waste cold recovery component 3".

[0122] In actual use, the refrigerant can be deionized water, ethanol, or other phase-change fluids, as long as they can undergo phase change and complete heat absorption and release in the first residual cold recovery assembly 3. The cold plate 320, radiator 330, phase-change gas pipe 34, and phase-change liquid pipe 35 can be made of copper, aluminum, or other materials with high thermal conductivity, as long as they can effectively transfer heat to the refrigerant.

[0123] The first waste cold recovery assembly 3 used in this embodiment can also be applied to other embodiments of the present application.

[0124] In the first embodiment of the present application, Figures 5a to 6b As shown, a power supply capacitor 300 is also provided in the circuit board accommodating cavity 110; the power supply capacitor 300 is electrically connected to the electromagnetic pump 22 for supplying power to the electromagnetic pump 22; the heat exchanger also includes: one or more thermoelectric generators 23 embedded in the heat exchange fins 11; one side of each thermoelectric generator 23 is located in the hot air flow channel 14, and the other side is located in the cold air flow channel 15; each thermoelectric generator 23 is electrically connected to the electromagnetic pump 22 and the power supply capacitor 300 for charging the power supply capacitor 300; and / or, supplying power to the electromagnetic pump 22.

[0125] In this embodiment, a power supply capacitor 300 is used to power the electromagnetic pump 22. The capacitor can provide high current, improving the driving capability of the electromagnetic pump 22, thereby enhancing the flow and heat transfer capacity of the heat transfer medium. The power supply capacitor 300 stores electricity through the printed circuit board 200 (PCB) and provides (auxiliary) electricity storage through the thermoelectric generator 23 (TEG).

[0126] Mounted on the walls of the narrow fins are thermoelectric generators 23, devices that convert heat directly into electricity using the thermoelectric effect (using temperature differences to generate electricity, also known as the Seebeck effect). Because the walls of the narrow fins are upstream of the hot and cold air flows, where the hot air is at its highest temperature and the cold air is at its lowest, the temperature difference between the two sides of the thermoelectric generator 23 is maximized, helping to improve power generation efficiency.

[0127] When one end of the thermoelectric generator 23 is heated and the other is cooled, the Seebeck effect generates an electric current, thereby converting thermal energy into electrical energy. The thermoelectric generator 23 penetrates the heat exchange fins 11, with one side exposed to the hot air flow channel 14 and the other side exposed to the cold air flow channel 15. This creates a temperature difference between the two sides of the thermoelectric generator 23, which "absorbs waste heat" to generate electricity. This stored electricity can then be used to power the electromagnetic pump.

[0128] In actual use, the thermoelectric generator 23 can be placed anywhere on the heat exchange fin 11, as long as one side of the thermoelectric generator 23 is in contact with the hot airflow and the other side is in contact with the cold airflow, creating a certain temperature difference between the two sides. As described above, the power supply capacitor 300 and the thermoelectric generator 23 achieve the reuse of "waste heat", helping to improve the energy efficiency of the entire device.

[0129] The power supply capacitor 300 and the thermoelectric generator 23 used in this embodiment can also be applied to other embodiments of the present application.

[0130] In the first embodiment of the present application, Figure 1a and Figure 1b As shown, the chassis front shell 101 is provided with: a chassis air inlet 1011 and a first chassis air outlet 1021; the heat exchanger also includes: a first heat exchanger shell 41; the first heat exchanger shell 41 is located in the heat dissipation chassis 100, and its side close to the chassis front shell 101 is the first cold end air inlet side 415, and the other side away from the chassis front shell 101 is the first hot end air inlet side 414; the first hot end air inlet side 414 is spaced apart and provided with a first hot end air inlet 411 and a first hot end air outlet 412; the first cold end air inlet side 415 is provided with a first cold end air inlet 413; the top of the first heat exchanger shell 41 is open, specifically, as shown Figure 1bAs shown, a first end cover 36 can be provided at the top opening of the first heat exchanger shell 41; wherein, the cold air flow channel 15 is connected to the first waste cold recovery chamber 31 through the first opening portion 362 on the first end cover 36, and the hot air flow channel 14 is isolated from the first waste cold recovery chamber 31 through the first sealing portion 361 on the first end cover 36; the air-to-air heat exchange component 1 and the liquid-metal heat exchange component 2 are provided inside the first heat exchanger shell 41; wherein, the heat exchange fin 11 is located between the first hot end air inlet 411 and the first cold end air inlet 413, and divides the first cavity 410 inside the first heat exchanger shell 41 into a first hot air flow chamber 416 and a first cold air flow chamber 417 that are isolated from each other along the height direction of the first heat exchanger shell 41; the hot end fan 12 is provided in the first hot air flow chamber 41 6 and corresponds to the first hot end air inlet 411, the cold end fan 13 is arranged in the first cold air flow cavity 417 and corresponds to the first cold end air inlet 413; the first hot end air inlet 411 and the first hot end air outlet 412 are connected to the first hot air flow cavity 416; the first cold end air inlet 413 is connected to the first cold air flow cavity 417; the first waste cold recovery cavity 31 is arranged at the top of the first heat exchanger shell 41; the first cold air flow inlet 311 is connected to the first cold air flow cavity 417 through the first open part 362 on the first end cover 36 located at the top of the first heat exchanger shell 41; the chassis air inlet 1011 corresponds to the first cold end air inlet 413 of the first heat exchanger shell 41; the first chassis air outlet 1021 corresponds to the first cold air flow outlet 312 of the first waste cold recovery cavity 31.

[0131] In this embodiment, both the air-to-air heat exchange assembly 1 and the liquid-metal heat exchange assembly 2 are disposed within the first heat exchanger housing 41. Driven by the hot-end fan 12, the hot air flows through the first hot-end air inlet 411 on the first hot-end air inlet side 414 into the first hot air flow chamber 416. After heat exchange within the first hot air flow chamber 416, it exits the heat exchanger through the first hot-end air outlet 412. Driven by the cold-end fan 13, the cold air flows through the first cold-end air inlet 413 on the first cold-end air inlet side 415 into the first cold air flow chamber 417. Because the first end cap 36 is located between the first waste cold recovery chamber 31 and the top of the first heat exchanger housing 41, the cold air, after heat exchange within the first cold air flow chamber 417, can flow through the first opening 362 of the first end cap 36 into the first waste cold recovery chamber 31, exchange heat with the second heat exchange element 33, and exit the heat exchanger through the first cold air outlet 312. Among them, the hot air flow and the cold air flow are isolated from each other, the hot air flow circulates in the first hot air flow cavity 416, and the cold air flow circulates in the first cold air flow cavity 417. The two complete heat exchange when passing through the heat exchanger, while ensuring the high IP protection level of the electronic equipment, having higher flow and heat exchange efficiency.

[0132] In the first embodiment of the present application, Figure 1b 、 Figure 2b 、 Figure 5a and Figure 5b As shown, the heat exchange fin 11 includes: a first narrow fin 111 and a first wide fin 112 arranged in sequence along the height direction; the circulation pipe 21 is passed through the first wide fin 112; the first narrow fin 111 is fixed to the bottom plate of the first heat exchanger shell 41; the side of the first narrow fin 111 close to the first hot end air inlet side 414 and the side of the first wide fin 112 close to the first hot end air inlet side 414 form a first stepped structure 1111; the hot end fan 12 is arranged at the first stepped structure 1111; the side of the first narrow fin 111 close to the first cold end air inlet side 415 and the side of the first wide fin 112 close to the first cold end air inlet side 415 form a second stepped structure 1112; the cold end fan 13 is arranged at the second stepped structure 1112.

[0133] In this embodiment, the hot-end fan 12 can be arranged at the first stepped structure 1111, and the cold-end fan 13 can be arranged at the second stepped structure 1112. This allows the first wide fin 112 to be arranged closer to the first heat exchanger housing 41. By guiding the airflow through the first heat exchanger housing 41, it is possible to ensure that the airflow in the first hot air flow cavity 416 and the first cold air flow cavity 417 always flows along the surface of the heat exchange fins, which helps to improve the heat exchange efficiency. The first narrow fin 111 and the first wide fin 112 can be processed in a corresponding manner according to actual conditions. For example, they can be spliced ​​together into one piece by welding, or they can be directly molded into one piece using additive manufacturing methods such as 3D printing. As long as the first narrow fin 111 and the first wide fin 112 can be fixedly connected, it will be sufficient.

[0134] Furthermore, the heat exchange fins 11 at the positions of the first stepped structure 1111 and the second stepped structure 1112 are symmetrically distributed, which can ensure that the areas of the heat exchange fins 11 in the first cold air flow cavity 417 and the first hot air flow cavity 416 are balanced.

[0135] In the first embodiment of the present application, Figures 7a to 7d As shown, Figure 7a for Figure 5b Cross-sectional view in CC direction, Figure 7b for Figure 5b Cross-sectional view in the DD direction, Figure 7c for Figure 5b Cross-sectional view in the EE direction, Figure 7d for Figure 7cCross-sectional view taken along the FF direction. Each hot air flow channel 14 of the first narrow fin 111 is connected to a portion of the hot air flow channels 14 of the first wide fin 112; each cold air flow channel 15 of the first narrow fin 111 is connected to a portion of the cold air flow channels 15 of the first wide fin 112; on the first stepped structure 1111, a first sealing structure 1121 is provided at the bottom of the remaining cold air flow channels 15 of the first wide fin 112 that are not connected to the respective cold air flow channels 15 of the first narrow fin 111; on the second stepped structure 1112, a second sealing structure 1122 is provided at the bottom of the remaining hot air flow channels 14 of the first wide fin 112 that are not connected to the respective hot air flow channels 14 of the first narrow fin 111.

[0136] In this embodiment, a first sealing structure 1121 is provided at the bottom of the cold air flow channels 15 in the first wide fins 112 that are not connected to the cold air flow channels 15 of the first narrow fins 111 on the first stepped structure 1111. This isolates the cold air flow channels 15 from the first hot air flow chamber 416. A second sealing structure 1122 is provided at the bottom of the hot air flow channels 14 in the first wide fins 112 that are not connected to the hot air flow channels 14 of the first narrow fins 111 on the second stepped structure 1112. This isolates the hot air flow channels 14 from the first cold air flow chamber 417. This alleviates the problem of short circuits caused by external pollutants such as dust and moisture in the electronic components within the circuit board housing chamber 110, further ensuring the high IP protection rating of the circuit board housing chamber. Hot and cold air flows can exchange heat both at the end surface of the boss and within the hot air flow channels 14 and cold air flow channels 15, increasing the heat exchange area and enhancing the heat exchange effect.

[0137] In the first embodiment of this application, see Figure 5aAfter the hot air flow enters the first hot air flow cavity 416, it flows from bottom to top, gradually transitioning from the hot air flow channel 14 of the first narrow fin 111 to the hot air flow channel 14 of the first wide fin 112, forming a "gradually expanding" air duct. After the hot air flow passes through the first stepped structure 1111 and the second sealing structure 1122, the flow channel becomes wider, and the streamlines will expand from the middle to both sides, thereby achieving the expansion of the heat exchange area. That is, within the limited heat exchange cavity space, the heat exchange area between the heat exchange fins and the fluid is maximized. In addition, whether before or after expansion, the hot air flow always flows close to the surface of the heat exchange fin 11 (inside the air flow channel and at the end face of the boss), which helps to break the boundary layer and enhance the flow and heat exchange efficiency. At the same time, the gradually expanding air duct enhances the disturbance of the local air flow in the channel, helps to enhance the local convective heat transfer coefficient, and enhances heat exchange. After heat exchange, the hot air flow cools down and flows out of the first hot end outlet 412 into the circuit board accommodating cavity 110, cooling and dissipating the heat from the first heat-generating module 400. In the aforementioned "gradually expanding" air duct conditions formed by the air-to-air heat exchange assembly 1, the convective heat exchange capacity between the hot air flow and the heat exchange fins 11 is strong, achieving efficient heat transfer.

[0138] Among them, the boss end surface is each bend in the heat exchange fin 11, and each bent boss end surface forms a gap with the first hot end air inlet side 414 or the first cold end air inlet side 415, and part of the hot air flow or cold air flow can flow in the gap.

[0139] When the hot air flow flows in the gap between the boss end face near the first hot end air inlet side 414 and the first hot end air inlet side 414, the hot air flow can exchange heat with the cold air flow in the cold air flow channel 15 located on the other side of the boss end face through the boss end face near the first hot end air inlet side 414.

[0140] When the cold air flows in the gap between the boss end surface near the first cold end air inlet side 415 and the first cold end air inlet side 415, the cold air can exchange heat with the hot air in the hot air flow channel 14 located on the other side of the boss end surface through the boss end surface near the first cold end air inlet side 415. This allows the cold air and the hot air to exchange heat through convection at the boss end surface, as well as through convection in the hot air flow channel 14 and the cold air flow channel 15.

[0141] See also Figure 5bThe cold airflow flows within the "gradually expanding" air duct, and its flow pattern is similar to that of the hot airflow, except that downstream, the cold airflow first enters the first residual cold recovery chamber 31 before flowing out of the heat dissipation chassis 100. In the first residual cold recovery chamber 31, the cold airflow still has a certain amount of "residual cold" relative to the radiator 330, which can absorb the heat of the first heating module 400 transferred from the cold plate 320 by the radiator 330, thereby enhancing the heat dissipation of the first heating module 400. The presence of the first residual cold recovery component 3 realizes the reuse of "waste cold", which helps to improve the heat exchange efficiency and energy saving of the entire machine.

[0142] During the heat exchange process, both the cold and hot air flows pass through the walls of circulation pipe 21 and exchange heat with the heat transfer medium within the pipe. Driven by electromagnetic pump 22, the flowing heat transfer medium rapidly transfers and replaces heat and cold, helping to further reduce the temperature difference between first hot air flow chamber 416 and first cold air flow chamber 417, thereby enhancing the heat exchange effect. The presence of liquid-metal heat exchange assembly 2, as an auxiliary and supplement to air-to-air heat exchange assembly 1, further enhances the overall heat exchange capacity of the heat exchanger.

[0143] In the first embodiment of this application, see Figure 7a The hot-end fan 12 and the cold-end fan 13 are located on opposite sides of the first narrow fin 111. A thermoelectric generator 23 is installed on the wall of the first narrow fin 111, penetrating the fin. One side of the thermoelectric generator 23 is exposed to the hot air flow cavity, while the other side is exposed to the cold air flow cavity. This creates a temperature difference on both sides of the thermoelectric generator 23, generating electricity through the Seebeck effect. This electricity can be used to power the electromagnetic pump.

[0144] The thermoelectric generator 23 can be installed on the heat exchange fin 11 at the location of the hot air flow channel 14 or the cold air flow channel 15, or on the heat exchange fin 11 at the end surface of the boss. Multiple thermoelectric generators 23 can be installed on multiple heat exchange fins 11. The thermoelectric generator 23 is sealed with the heat exchange fin 11 to ensure isolation between the hot air flow channel 14 and the cold air flow channel 15.

[0145] In the first embodiment of the present application, Figure 8 As shown, Figure 8 This is an exploded view of the heat exchange fins when they are divided into two parts. The circulation pipe 21 is located in the same plane. The first wide fin 112 is divided into two split fins 120 along the assembly plane of the circulation pipe 21. Each split fin 120 has a receiving groove 16 on its opposing surface, which is compatible with the circulation pipe 21 and is used to install the circulation pipe 21.

[0146] The circulation pipe 21 also has heat storage microcapsules.

[0147] In this embodiment, the circulation pipe 21 and the heat exchange fins 11 are assembled using a split assembly method. The heat exchange fins 11 are divided into two split fins 120 along the assembly plane of the circulation pipe 21, and each split fin 120 is provided with a receiving groove 16 that matches the circulation pipe 21. The shape and diameter of the receiving groove 16 match those of the circulation pipe 21, and the distribution of the receiving grooves 16 on the heat exchange fins 11 matches the distribution of the circulation pipe 21. In this embodiment, the shape of the receiving groove 16 is circular. In actual use, the receiving groove 16 can also be provided with other shapes according to the shape of the circulation pipe 21.

[0148] See also Figure 8 , half of the accommodating groove 16 is distributed at the interface of one of the split fins 120, and the other half is distributed at the interface of the other split fin 120. The circulation pipe 21 with the electromagnetic pump 22 is assembled in the accommodating groove 16 of one of the split fins 120, and then the other split fin 120 is assembled, thus completing the assembly of the heat exchange fins and the liquid metal circulation pipe. On the contact surface of the circulation pipe 21 and the heat exchange fin 11, as well as on the contact surface of the two split fins 120, welding or other methods can be selected to seal and fix them together. In actual production, other manufacturing methods can be used to shape the heat exchange fins 11 and the liquid metal heat exchange component 2, such as additive manufacturing methods such as 3D printing.

[0149] Thermal storage microcapsules are added to the heat transfer fluid base fluid. When the electromagnetic pump operates intermittently, the heat transfer fluid, temporarily at rest in hot air flow channel 14, has its internal thermal storage microcapsules deeply absorb the heat of the hot air flow through "latent heat" (the phase change material absorbs heat and melts). Once pumped to the cold air flow channel 15, the internal thermal storage microcapsules can release this "latent heat" and transfer it to the cold air flow (the phase change material releases heat and solidifies, restoring its heat absorption capacity). As the heat transfer fluid intermittently flows and stagnates in the hot and cold air flow channels 14, the thermal storage microcapsules transfer some of the heat of the hot air flow to the cold air flow through "latent heat."

[0150] In the first embodiment of the present application, Figure 4a and Figure 4bAs shown, the circulation pipe 21 is a circulation pipe formed by repeatedly bending a long straight pipe in the same plane and connecting the end to the end, including a plurality of first parallel straight pipes 211, a plurality of first bent pipes 212 connecting adjacent first parallel straight pipes 211, and a first end-to-end connected straight pipe 2131; wherein, two adjacent first parallel straight pipes 211 correspond to the adjacent hot air flow channel 14 and the cold air flow channel 15 respectively; the circulation pipe 21 is obliquely arranged in the first wide fin 112, and in actual production, the circulation pipe 21 can also be obliquely arranged in the first narrow fin 111; the electromagnetic pump 22 is installed on any first parallel straight pipe 211.

[0151] In this embodiment, Figure 2b As shown, the bending plane of the circulation pipe 21 has a certain angle with the horizontal plane of the heat exchange fin 11, that is, the circulation pipe 21 is installed inside the heat exchange fin 11 in an inclined manner, which can significantly increase the convection area and convection time between the circulation pipe 21 and the airflow, thereby improving the heat exchange intensity.

[0152] The first parallel straight tubes 211 are evenly spaced, and the spacing between adjacent first parallel straight tubes 211 is consistent with the bend spacing of the heat exchange fins 11. Furthermore, the number of first parallel straight tubes 211 does not exceed the number of protrusions on the ends of the heat exchange fins 11. The electromagnetic pump 22 installed on any first parallel straight tube 211 can promote the flow of the heat transfer medium within the circulation pipe 21, further improving the heat exchange efficiency between the adjacent hot air flow channels 14 and cold air flow channels 15.

[0153] Also, see Figure 7c Each first parallel straight tube 211 in the circulation duct 21 may not contact the heat exchange fins 11, while each first bent tube 212 penetrates the heat exchange fins 11. The hot zone tubes 2111 located in the hot air flow channel 14 and the cold zone tubes 2112 located in the cold air flow channel 15 are alternately distributed. Therefore, each first parallel straight tube 211 is also alternately distributed in the hot air flow channel 14 and the cold air flow channel 15.

[0154] The circulation pipe 21 can be made of a metal pipe such as a copper-based or stainless steel-based pipe, or a pipe made of a high thermal conductivity material such as a thermal conductive plastic.

[0155] The present invention further provides an electronic device, comprising a heat exchanger and a heat dissipation chassis 100 ; the heat exchanger is mounted on a chassis front shell 101 of the heat dissipation chassis 100 .

[0156] In this embodiment, a heat exchanger is provided in the heat dissipation chassis 100, and can dissipate heat for the first heating module 400 and the second heating module 500 inside the chassis. The external environment is connected to the cold air flow channel 15, and the cold air flow in the external environment can enter the cold air flow channel 15, and after heat exchange, it is then guided out of the cold air flow channel 15 to the external environment. The circuit board accommodating cavity 110 is connected to the hot air flow channel 14, and the hot air flow in the circuit board accommodating cavity 110 can enter the hot air flow channel 14, and after heat exchange, it is then guided out of the hot air flow channel 14 to the circuit board accommodating cavity 110, thereby cooling the printed circuit board 200, the power supply capacitor 300, the first heating module 400 and the second heating module 500 in the circuit board accommodating cavity 110.

[0157] Specifically, including Figures 1a to 2b The heat exchanger and heat dissipation chassis of the electronic equipment shown, such as Figure 2a and Figure 2b As shown, it includes a heat exchanger and a heat dissipation chassis 100 ; the heat exchanger is installed on the chassis front shell 101 of the heat dissipation chassis 100 .

[0158] like Figure 2a and Figure 3 As shown. The heat exchanger is provided with a first waste cold recovery component 3, which has a first waste cold recovery chamber 31, and the first waste cold recovery chamber 31 is connected to the external environment through a first cold air flow outlet 312; the chassis front shell 101 is provided with: a chassis air inlet 1011 and a first chassis air outlet 1021; the heat exchanger includes: a first heat exchanger shell 41; the chassis air inlet 1011 corresponds to the first cold end air inlet 413 of the first heat exchanger shell 41, and is used to guide the cold air from the external environment into the first cold air flow chamber 417; the first chassis air outlet 1021 corresponds to the first cold air flow outlet 312 of the first waste cold recovery chamber 31, and is used to guide the cold air after heat exchange to the external environment. There is a top spacing area and a bottom spacing area between the top and bottom of the heat exchanger and the top and bottom of the heat dissipation chassis 100, respectively.

[0159] In this embodiment, the chassis air inlet 1011 corresponds to the first cold-end air inlet 413 of the first heat exchanger housing 41. Under the action of the cold-end fan 13, cold air from the external environment flows through the chassis air inlet 1011 into the first cold air flow chamber 417, where it exchanges heat with the hot air. After the cold air exchanges heat with the second heat exchange element 33 in the first excess cold recovery chamber 31, it flows through the first cold air outlet 312 and out of the first chassis air outlet 1021 to the external environment.

[0160] Furthermore, the top and bottom spacing areas between the top and bottom of the heat exchanger and the top and bottom of the heat dissipation chassis 100 can increase the contact area between the heat exchanger and the hot air flow, thereby improving the heat dissipation efficiency to a certain extent.

[0161] The second embodiment of the heat exchanger provided in this application is described in detail below.

[0162] The second embodiment of the heat exchanger of the present application is similar to the first embodiment and includes an air-to-air heat exchange assembly 1 and a liquid-metal heat exchange assembly 2. The second embodiment differs from the first embodiment in the specific structure of the heat exchange fins 11 of the air-to-air heat exchange assembly 1 and the specific locations of the hot-end fan 12 and the cold-end fan 13.

[0163] For details, see Figure 9a and Figure 9b ,in, Figure 9a This is a schematic structural diagram of the second embodiment of the heat exchanger provided in this application. Figure 9b for Figure 9a Exploded view of FIG. 1 (second heat exchanger housing not shown).

[0164] like Figure 9a and Figure 9b As shown, the heat exchange fins 11 of the heat exchanger include: a second wide fin 113, a second narrow fin 114 and a third wide fin 115 arranged in sequence from bottom to top; a circulation pipe 21 is arranged through the second wide fin 113, the second narrow fin 114 and the third wide fin 115; a third step structure 1141 is formed between the second narrow fin 114 and the second wide fin 113, the opening direction of which is opposite to the side of the chassis front shell 101; a fourth step structure 1142 is formed between the second narrow fin 114 and the second wide fin 113, the other side of which is opposite to the third step structure 1141; a fourth step structure 1142 is formed between the second narrow fin 114 and the third wide fin 115, the opening direction of which is opposite to the side of the chassis front shell 101; A fifth step structure 1143 is formed between one side of the front shell 101 of the chassis; a sixth step structure 1144 is formed between the second narrow fin 114 and the third wide fin 115, on the other side relative to the fifth step structure 1143; the hot end fan 12 is arranged between the third step structure 1141 and the fifth step structure 1143; the cold end fan 13 is arranged between the fourth step structure 1142 and the sixth step structure 1144; the cold air flow channel 15 located at the third step structure 1141 and the fifth step structure 1143 is isolated from the circuit board accommodating cavity 110; the hot air flow channel 14 located at the fourth step structure 1142 and the sixth step structure 1144 is isolated from the external environment.

[0165] Compared to the heat exchange fins 11 of the heat exchanger in the first embodiment, the heat exchange fins 11 in this embodiment comprise three sections, from bottom to top: second wide fins 113, second narrow fins 114, and third wide fins 115. Furthermore, the second wide fins 113 and second narrow fins 114 form a third stepped structure 1141 and a fourth stepped structure 1142, symmetrical with respect to the second narrow fins 114. The second narrow fins 114 and third wide fins 115 form a fourth stepped structure 1142 and a sixth stepped structure 1144, symmetrical with respect to the second narrow fins 114.

[0166] The hot-end fan 12 can be installed in the accommodation space formed by the third and fifth stepped structures 1141, 1143, while the cold-end fan 13 can be installed in the accommodation space formed by the fourth and sixth stepped structures 1142, 1144. The cold air flow channel 15 located between the third and fifth stepped structures 1141, 1143 is isolated from the circuit board accommodation cavity 110, while the hot air flow channel 14 located between the fourth and sixth stepped structures 1142, 1144 is isolated from the external environment. This ensures a high IP rating for the built-in power electronic components and prevents them from being affected by pollutants such as dust and moisture in the external environment, which could cause short circuits.

[0167] The heat exchange fins 11 and the circulation pipe 21 of the heat exchanger in the second embodiment of the present application can also be assembled using a split assembly method. Its structure is similar to that of the previous embodiment and will not be described in detail here. In addition, the connection method between the second wide fin 113, the second narrow fin 114 and the third wide fin 115 can also be selected according to the actual situation. For example, they can be spliced ​​into one piece by welding, or they can be directly molded into one piece using additive manufacturing methods such as 3D printing. As long as the first narrow fin 111 and the first wide fin 112 can be fixedly connected, it will be sufficient.

[0168] In the second embodiment of the present application, Figure 9a and Figure 9bAs shown, each hot air flow channel 14 of the second narrow fin 114 of the heat exchanger is respectively connected to part of the hot air flow channels 14 of the second wide fin 113 and the third wide fin 115; each cold air flow channel 15 of the second narrow fin 114 is respectively connected to part of the cold air flow channels 15 of the second wide fin 113 and the third wide fin 115; on the third stepped structure 1141, the top of the other cold air flow channels 15 in the second wide fin 113 that are not connected to the cold air flow channels 15 of the second narrow fin 114 is provided with a third sealing structure 1131; on the fourth stepped structure 1142, the top ... A fourth sealing structure 1132 is provided at the top of the other hot air flow channels 14 in the wide fins 113 that are not connected to the hot air flow channels 14 of the second narrow fins 114; a fifth sealing structure 1151 is provided at the bottom of the other cold air flow channels 15 in the third wide fins 115 that are not connected to the cold air flow channels 15 of the second narrow fins 114; and a sixth sealing structure 1152 is provided at the bottom of the other hot air flow channels 14 in the third wide fins 115 that are not connected to the hot air flow channels 14 of the second narrow fins 114.

[0169] In this embodiment, the provision of third sealing structure 1131, fourth sealing structure 1132, fifth sealing structure 1151, and sixth sealing structure 1152 isolates hot air flow channel 14 from first cold air flow chamber 417. This alleviates the problem of short circuits caused by external pollutants such as dust and moisture in the electronic components within circuit board housing chamber 110, further ensuring the high IP protection rating of the circuit board housing chamber. Hot and cold air flows can exchange heat both at the end surface of the boss and within hot air flow channel 14 and cold air flow channel 15, resulting in a large heat exchange area and enhanced heat exchange.

[0170] See also Figure 10a and Figure 10b , Figure 10a for Figure 9a The heat exchanger shown is installed in the heat dissipation chassis. Figure 10b for Figure 9a The heat exchanger shown is installed in Figure 10a A cross-sectional view of the heat sink inside the chassis is shown.

[0171] like Figure 10a and Figure 10bAs shown, the chassis front shell 101 of the heat dissipation chassis 100 is provided with: a second chassis air outlet 1022, a first fin extension port 150a and a third chassis air outlet 1023 arranged in sequence in the height direction; the heat exchanger also includes: a second heat exchanger shell 42; the second heat exchanger shell 42 includes: a second hot end air inlet side 421 and two second side walls 422 perpendicular to the second hot end air inlet side 421; the two second side walls 422 are arranged opposite to each other; the second The hot end air inlet side 421, the two second side walls 422 and the chassis front shell 101 form a second hot air flow cavity 423; the second hot end air inlet 421 is provided on the second hot end air inlet side 421 of the second heat exchanger housing 42 with a second hot end air inlet 4211 and a second hot end air outlet 4212 arranged at intervals; the second hot end air inlet 4211 and the second hot end air outlet 4212 are located in the circuit board accommodating cavity 110 and are both connected to the second hot air flow cavity 423; the second hot end air inlet 4211 and the second hot end air outlet 4212 are connected to the second hot end air inlet 4211. The hot end fan 12 is positioned correspondingly; the hot end fan 12 and a part of the heat exchange fins 11 of the air-to-air heat exchange component 1 are located in the second hot air flow chamber 423, and the cold end fan 13 and another part of the heat exchange fins 11 extend out of the first fin extension port 150a; a part of the circulation pipe 21 of the liquid-metal heat exchange component 2 is located in the second hot air flow chamber 423, and the other part is exposed to the external environment; wherein, the hot air flow channel 14 of the heat exchange fins 11 located in the external environment is isolated from the external environment; the outer cover of the cold end fan 13 is provided with a fan guard 160 with a fan air inlet 170; the first waste cold recovery chamber 31 is arranged at the top of the second heat exchanger shell 42; the second waste cold recovery chamber 51 is arranged at the bottom end of the second heat exchanger shell 42; the second chassis air outlet 1022 corresponds to the first cold air flow outlet 312 of the first waste cold recovery chamber 31; the third chassis air outlet 1023 corresponds to the second cold air flow outlet 512 of the second waste cold recovery chamber 51.

[0172] Compared to the first heat exchanger housing 41 of the heat exchanger in the first embodiment, the second heat exchanger housing 42 in this embodiment only has a second hot-end air inlet side 421 and two second sidewalls 422 perpendicular to the second hot-end air inlet side 421. The second hot-end air inlet side 421, the two second sidewalls 422, and the front case 101 form a second hot air flow chamber 423 that communicates with the circuit board accommodating chamber 110. This allows hot air to be drawn into the hot air flow channel 14 from the second hot-end air inlet 4211 under the action of the hot-end fan 12, and after heat exchange, it flows back into the circuit board accommodating chamber 110 from the second hot-end air outlet 4212. A fan guard 160 with a fan air inlet 170 can also be provided outside the hot-end fan 12 to protect it.

[0173] Since the side of the second heat exchanger housing 42 close to the chassis front shell 101 does not have a cold end air inlet side, part of the heat exchange fins 11 and part of the circulation pipe 21 can directly extend out of the heat dissipation chassis 100 through the first fin extension port 150a on the chassis front shell 101, so that the cold air flow channel 15 can be directly connected to the external environment. The cold air flow does not need to pass through the chassis shell 101 during the flow process, that is, the cold air flow can flow directly from the cold air flow channel 15 into the external environment, reducing the resistance when passing through the chassis shell 101. This makes the cold air flow channel 15 unobstructed and connected to the external environment, and the cold air flow has smaller air outlet resistance, which can also improve the flow and heat exchange efficiency and enhance the heat exchange capacity.

[0174] By providing a fan guard 160 covering the cold-end fan 13, the cold-end fan 13, which is exposed to the external environment, is protected. The cold-end fan 13 draws cold air from the external environment into the cold air flow channel 15 through the fan inlet 170 on the fan guard 160. After heat exchange, the cold air can flow directly from the cold air flow channel 15 to the external environment, thereby improving heat exchange efficiency. The intersection of the heat exchange fin 11 and the first fin extension 150a is sealed, ensuring the high IP protection level of the circuit board accommodating chamber 110.

[0175] At the same time, the top and bottom of the second heat exchanger shell 42 are both open. A first end cover 36 is provided at the top open portion of the second heat exchanger shell 42, which is connected to the first waste cold recovery component 3 through the first open portion 362 on the first end cover 36; a second end cover 53 is provided at the bottom open portion of the second heat exchanger shell 42, which is connected to the second waste cold recovery component 5 through the second open portion 532 on the second end cover 53, so as to enhance heat dissipation inside the circuit board accommodating cavity 110.

[0176] like Figures 9a to 10a As shown, the second wide fin 113 of the heat exchanger protrudes from the bottom of each hot air flow channel 14 of the chassis front shell 101, and a seventh sealing structure 1133 is provided; the third wide fin 115 protrudes from the top of each hot air flow channel 14 of the chassis front shell 101, and an eighth sealing structure 1153 is provided.

[0177] In this embodiment, a seventh sealing structure 1133 is provided at the bottom of each hot air flow channel 14 protruding from the front housing 101, and an eighth sealing structure 1153 is provided at the top of each hot air flow channel 14 protruding from the front housing 101. This isolates the hot air flow channel 14 from the external environment. Under the action of the heat exchange fins 11, the third sealing structure 1131, the fourth sealing structure 1132, the fifth sealing structure 1151, the sixth sealing structure 1152, the seventh sealing structure 1133, and the eighth sealing structure 1153, the hot air flow channels 14 protruding from the front housing 101 and the interior of the circuit board receiving cavity 110 are isolated from the external environment. The cold air flow channels protruding from the front housing 101 and the interior of the circuit board receiving cavity 110 are also isolated from the circuit board receiving cavity 110. This ensures the high IP rating of the built-in power electronic components and prevents them from being affected by pollutants such as dust and moisture in the external environment, which may cause short circuits.

[0178] like Figure 10b As shown, the heat exchanger in this embodiment also includes: a second waste cold recovery component 5; the second waste cold recovery component 5 includes: a second waste cold recovery chamber 51 and a third heat exchange element 52; the second waste cold recovery chamber 51 is arranged at the bottom end of the heat exchange fin 11; at least a portion of the third heat exchange element 52 is arranged inside the second waste cold recovery chamber 51; the third heat exchange element 52 is arranged in contact with the second heating module 500 in the circuit board accommodating chamber 110; or, it is connected to the second heating module 500 through a heat pipe 521, and is used to use the cold air in the cold air flow channel 15 to exchange heat with the heat emitted by the second heating module 500; the second waste cold recovery chamber 51 has a second cold air flow inlet 511 and a second cold air flow outlet 512; the second waste cold recovery chamber 51 is connected to the cold air flow channel 15 through the second cold air flow inlet 511, so as to allow the cold air to flow into the second waste cold recovery chamber 51 to cool the third heat exchange element 52; after heat exchange, the cold air is discharged to the external environment through the second cold air flow outlet 512.

[0179] like Figures 10b to 11b As shown, Figure 11a for Figure 9a The heat exchanger is arranged inside the heat dissipation chassis and the cross-sectional direction is as follows Figure 3 The cross-sectional view shown in the AA direction, Figure 11b for Figure 9a The heat exchanger is arranged inside the heat dissipation chassis and the cross-sectional direction is as follows Figure 3 Cross-sectional view shown in the direction BB. The third heat exchange element 52 is a radiator 520. A second end cap 53 is disposed between the second residual cooling recovery chamber 51 and the cold air flow channel 15. The second end cap 53 is provided with a second sealing portion 531 and a second opening portion 532. The cold air flow channel 15 communicates with the second residual cooling recovery chamber 51 through the second opening portion 532, while the hot air flow channel 14 is isolated from the second residual cooling recovery chamber 51 by the second sealing portion 531.

[0180] In this embodiment, the second chassis air outlet 1022 corresponds to the first cold air outlet 312 of the first waste cold recovery assembly 3. The third chassis air outlet 1023 corresponds to the second cold air outlet 512 of the second waste cold recovery assembly 5. A second sealing portion 531 is provided on the second end cover 53, isolating the second waste cold recovery chamber 51 from the hot air flow channel 14. A second opening 532 is provided on the second end cover 53, connecting the second waste cold recovery chamber 51 with the cold air flow channel 15. This ensures that only the cold air within the cold air flow channel 15 can flow into the second waste cold recovery chamber 51 and exchange heat with the third heat exchange element 52, further ensuring the high IP protection rating of the circuit board accommodating chamber 110. Under the action of the cold end fan 13, cold air from the external environment enters the cold air flow channel 15 through the fan inlet 170 on the fan guard 160. The cold air flows from the middle of the cold air flow channel 15 toward the top and bottom ends, passing through the heat exchange fins 11 to exchange heat with the hot air within the hot air flow channel 14. After heat exchange, a first end cap 36 is formed between the first cold air flow chamber 417 and the top of the second heat exchange housing 42. Cold air flowing toward the top of the heat exchanger can pass through the first opening 362 of the first end cap 36, flow from the top opening of the second heat exchange housing 42 into the first residual cold recovery chamber 31, exchange heat with the second heat exchange element 33 therein, and then, after further heat exchange, be discharged to the outside environment through the first cold air flow outlet 312. A second end cap 53 is formed between the second residual cold recovery chamber 51 and the bottom of the second heat exchange housing 42. Cold air flowing toward the bottom of the heat exchanger can pass through the second opening 532 of the second end cap 53, flow from the bottom opening of the second heat exchange housing 42 into the second residual cold recovery chamber 51, exchange heat with the third heat exchange element 52 therein, and then, after further heat exchange, be discharged to the outside environment through the second cold air flow outlet 512. Furthermore, a portion of the cold air flowing toward the top and bottom will flow directly out to the outside environment through the cold air flow channel 15 protruding from the heat dissipation chassis 100.

[0181] In actual production, different radiators 520 may be selected according to actual needs, as long as the radiator 520 has fins so that air can flow through the gaps between the fins to generate convective heat exchange.

[0182] The second waste cold recovery assembly 5 used in this embodiment can also be applied to other embodiments of the present application.

[0183] The second heating module 500 can transfer heat to the radiator 520 by direct contact heat conduction. Figure 10bAs shown, the heating surface of the second heating module 500 is attached to one side of the wall of the second waste cold recovery chamber 51, while the radiator 520 is attached to the other side of the wall. Therefore, the heat from the second heating module 500 can be transferred to the radiator 520 through the wall, and then carried out of the heat dissipation chassis 100 by the cold air flow.

[0184] See also Figure 15b , Figure 15b for Figure 14a The heat exchanger shown is installed in Figure 15a A cross-sectional view of the heat dissipation chassis shown. Corresponding through holes can also be provided on the wall surface of the second waste cold recovery chamber 51, and a heat pipe 521 can be passed through the through hole to connect the radiator 520 with the second heating module 500. The heat pipe 521 can be a heat conduction device with a high thermal conductivity coefficient of a certain length, such as a heat pipe, etc., which can transfer the heat of the second heating module 500 to the radiator 520 over a long distance, and transfer it to the external environment under the action of the cold air flow. Under the action of the heat pipe 521, the distribution position of the second heating module 500 in the circuit board accommodating chamber 110 will be more flexible. At the same time, the sealed assembly at the junction of the radiator 520 and the through hole can ensure the high IP protection level of the circuit board accommodating chamber 110.

[0185] The combined action of the air-to-air heat exchange assembly 1 and the liquid-metal heat exchange assembly 2 allows the cold and hot air flows to exchange heat directly through the heat transfer process of the heat exchange fins 11, while also utilizing the mass transfer process of the liquid-metal heat exchange assembly 2 for enhanced heat exchange. These two elements work together to provide the heat exchanger with a strong heat exchange capacity and maintain a safe temperature within the circuit board cavity 110. Furthermore, the combination of the first and second waste cold recovery assemblies 3 and 5 enhances the thermal reliability of the first and second heating modules 400 and 500, resulting in superior energy-saving performance for the entire system.

[0186] The structure of the first waste cold recovery assembly 3 in this embodiment is the same as that in the previous embodiment, and will not be described in detail here.

[0187] In the second embodiment of the present application, Figures 10b to 11b As shown, the second heat exchange element 33 is disposed within the first residual cold recovery chamber 31, with the first cold air flow outlet 312 of the first residual cold recovery chamber 31 abutting the inner wall surrounding the second chassis air outlet 1022. The third heat exchange element 52 is disposed within the second residual cold recovery chamber 51, with the second cold air flow outlet 512 of the second residual cold recovery chamber 51 abutting the inner wall surrounding the third chassis air outlet 1023. In this embodiment, the second heat exchange element 33 is entirely located within the first residual cold recovery chamber 31, and the third heat exchange element 52 is entirely located within the second residual cold recovery chamber 51.

[0188] like Figure 11aAs shown, after the hot air flow enters the hot air flow channel 14, the flow direction is divided into two, one part flows toward the top of the heat exchanger, and the other part flows toward the bottom of the heat exchanger. The hot air flow flowing toward the top of the heat exchanger gradually transitions from the hot air flow channel 14 of the second narrow fin 114 to the hot air flow channel 14 of the second wide fin 113, and the hot air flow flowing toward the bottom of the heat exchanger gradually transitions from the hot air flow channel 14 of the second narrow fin 114 to the hot air flow channel 14 of the second wide fin 113. A "gradually expanding" air duct is formed, and the logic of enhanced heat exchange under this air duct is similar to that of the first embodiment of the present application, and will not be elaborated on here. The temperature of the hot air flow after the heat exchange is completed is reduced, and it flows out from the second hot end air outlet 4212 and enters the circuit board accommodating cavity 110 to cool down and dissipate heat for the first heating module 400 and the second heating module 500.

[0189] Under the "gradually expanding" air duct condition, the convective heat transfer capacity between the airflow and the heat exchange fins 11 is relatively strong, and efficient heat transfer can be achieved.

[0190] See also Figure 11b , the cold air flow flows in the "gradually expanding" air duct, and its flow form is similar to that of the hot air flow, except that in the downstream of the flow, a part of the cold air flow will directly flow out to the external environment through the cold air flow channel 15 protruding from the heat dissipation chassis 100; the other part will enter the first waste cold recovery chamber 31 and the second waste cold recovery chamber 51. The cold air flow entering the first waste cold recovery chamber 31 exchanges heat with the cold row 330, indirectly dissipating heat for the first heating module 400. The cold air flow entering the second waste cold recovery chamber 51 exchanges heat with the radiator 520, indirectly dissipating heat for the second heating module 500. In the above flow process, the cold air flow has more outlet angles, a wider outlet area, and smaller outlet resistance.

[0191] like Figure 12 As shown, Figure 12 for Figure 10bThe schematic diagram of the circulation duct structure is shown. The circulation duct 21 includes: a first horizontal portion 214 passing through the second wide fin 113, a second horizontal portion 216 passing through the third wide fin 115, and a first connecting portion 215 passing through the second narrow fin 114 and used to connect the first horizontal portion 214 and the second horizontal portion 216; the first horizontal portion 214, the first connecting portion 215 and the second horizontal portion 216 are all connected. The circulation pipe 21 is formed by a long straight pipe that is repeatedly bent and connected end to end in the same plane to form a planar circulation pipe including multiple second parallel straight pipes 217, multiple second bent pipes 218 connecting adjacent second parallel straight pipes 217, and second end-to-end connected straight pipes 2132, and then the planar circulation pipe is bent twice to form a Z-shaped three-dimensional bend; wherein, two adjacent second parallel straight pipes 217 correspond to adjacent hot air flow channels 14 and cold air flow channels 15 respectively; the first connecting portion 215 is obliquely arranged in the second narrow fin 114; the electromagnetic pump 22 is installed on any second parallel straight pipe 217 of the first connecting portion 215.

[0192] In this embodiment, the first horizontal portion 214 and the second horizontal portion 216 are connected by the inclined first connecting portion 215, so that the circulation pipe 21 forms a Z-shaped structure. The Z-shaped circulation pipe 21 has a larger heat exchange area and a longer heat exchange time between the airflow and the circulation pipe 21, which helps to further improve the heat exchange intensity.

[0193] Also, see Figures 13a to 13c , Figure 13a for Figure 11b Cross-sectional view in the GG direction, Figure 13b for Figure 11b Cross-sectional view in the HH direction, Figure 13c for Figure 11b Cross-sectional view along the II direction. The second parallel straight tubes 217 are alternately interspersed in the hot air flow channel 14 and the cold air flow channel 15. The portion of the second parallel straight tubes 217 located in the hot air flow channel 14 is a horizontal hot zone pipe 2171, and the portion of the second parallel straight tubes 217 located in the cold air flow channel 15 is a horizontal cold zone pipe 2172. Since part of the circulation pipe 21 protrudes out of the heat dissipation chassis 100 through the first fin extension port 150a, the second parallel straight tubes 217 in the cold air flow channel 15 are in direct contact with the external environment, so that in addition to convection, heat dissipation between the circulation pipe 21 and the external environment can also be enhanced by radiation heat exchange. Under the comprehensive heat exchange mode composed of convection and radiation, the heat exchange capacity of the heat exchanger is significantly improved.

[0194] In this embodiment, the heat exchange fins 11 of the heat exchanger, in the area exposed to the outside of the heat dissipation chassis 100 , are coated with a first heat exchange coating 71 to enhance the heat radiation heat exchange intensity.

[0195] In this embodiment, the first heat exchange coating 71 has a high surface emissivity (≥0.9) in the near-infrared band of thermal radiation (≈0.76-20 μm), which can further enhance the thermal radiation heat exchange intensity between the exposed surface and the external environment. This is mainly suitable for indoor use of chassis equipment.

[0196] In some embodiments of the present application, an electronic device is provided which is equipped with the heat exchanger provided by the second embodiment, such as Figure 10a and Figure 10b As shown, the heat exchanger is provided with a first waste cooling recovery component 3 and a second waste cooling recovery component 5 . The first waste cold recovery component 3 has a first waste cold recovery chamber 31, which is connected to the external environment through the first cold air flow outlet 312; the second waste cold recovery component 5 has a second waste cold recovery chamber 51, which is connected to the external environment through the second cold air flow outlet 512; the chassis front shell 101 is provided with: a second chassis air outlet 1022, a first fin extension port 150a and a third chassis air outlet 1023 arranged in sequence in the height direction; the heat exchanger includes: a second heat exchanger shell 42; the second chassis air outlet 1022 corresponds to the first cold air flow outlet 312 of the first waste cold recovery chamber 31, and is used to guide the cold air flow after heat exchange to the external environment; the third chassis air outlet 1023 corresponds to the second cold air flow outlet 512 of the second waste cold recovery chamber 51, and is used to guide the cold air flow after heat exchange to the external environment; the cold end fan 13 and a part of the heat exchange fins 11 extend out of the first fin extension port 150a, and are used to guide the cold air flow into the cold air flow channel.

[0197] In this embodiment, the second chassis air outlet 1022 communicates with the first waste cold recovery chamber 31 of the first waste cold recovery assembly 3, and the third chassis air outlet 1023 communicates with the second waste cold recovery chamber 51 of the second waste cold recovery assembly 5. The cold-end fan 13 and a portion of the heat exchange fins 11 extend through the first fin extension opening 150a, directing cold air into the cold air flow channel 15. The cold air flows from the middle of the cold air flow channel 15 toward the top and bottom ends, exchanging heat within the heat exchange fins 11 with the hot air within the hot air flow channel 14. After heat exchange, because the first end cap 36 is located between the first cold air flow chamber 417 and the top of the second heat exchange housing 42, the cold air flowing toward the top of the heat exchanger can pass through the first opening 362 of the first end cap 36, flow from the top opening of the second heat exchange housing 42 into the first waste cold recovery chamber 31, exchange heat with the second heat exchange element 33 there, and then, after further heat exchange, be discharged to the outside environment through the second chassis air outlet 1022. Because a second end cap 53 is located between the second waste cold recovery chamber 51 and the bottom of the second heat exchange shell 42, cold air flowing toward the bottom of the heat exchanger can pass through the second opening 532 of the second end cap 53, flow from the bottom opening of the second heat exchange shell 42, and into the second waste cold recovery chamber 51. There, it undergoes heat exchange with the third heat exchange element 52. After further heat exchange, the air is discharged to the outside environment through the third chassis air outlet 1023. The presence of the first waste cold recovery assembly 3 and the second waste cold recovery assembly 5 enables the reuse of "waste cold," helping to improve the heat exchange efficiency and energy efficiency of the entire machine.

[0198] Furthermore, a portion of the cold airflow, as it flows toward the top and bottom, flows directly out to the outside environment through the cold airflow channel 15 protruding from the heat dissipation chassis 100. During this flow process, the cold airflow has more outlet angles, a wider outlet area, and lower outlet resistance, which helps improve overall heat exchange performance.

[0199] The third embodiment of the heat exchanger provided in this application is described in detail below.

[0200] The heat exchange fins 11 of the heat exchanger in the third embodiment have the same structure as that of the heat exchanger in the second embodiment.

[0201] like Figures 14a to 14c As shown, Figure 14a This is a schematic structural diagram of the third embodiment of the heat exchanger provided in this application. Figure 14b This is a structural schematic diagram of the third embodiment of the heat exchanger provided by this application from another perspective. Figure 14c for Figure 14aAn exploded view of the heat exchanger is shown. The front housing 101 of the chassis is provided with: a second fin extension opening 150b; a heat exchanger embedded in the second fin extension opening 150b; wherein the hot-end fan 12 and a portion of the heat exchange fins 11 of the air-to-air heat exchange assembly 1 are located within the circuit board receiving cavity 110, while the cold-end fan 13 and another portion of the heat exchange fins 11 extend out of the second fin extension opening 150b; wherein a portion of the circulation pipe 21 of the liquid-metal heat exchange assembly 2 is located within the circuit board receiving cavity 110, while the other portion is exposed to the external environment; wherein the heat exchange fins 11 isolate the cold air flow channel 15 located within the circuit board receiving cavity 110 from the circuit board receiving cavity 110; wherein the hot air flow channel 14 of the heat exchange fins 11 located in the external environment is isolated from the external environment; and the outer cover of the cold-end fan 13 is provided with a fan guard 160 having a fan air inlet 170.

[0202] In this embodiment, the heat exchange fins 11 are fixedly mounted on the front case 101 through the second fin extension opening 150b on the front case 101. Compared to the second embodiment, this embodiment eliminates the second heat exchanger housing 42, allowing the hot air flow channel 14 and a portion of the circulation conduit 21 to be directly exposed within the circuit board accommodating cavity 110.

[0203] In the third embodiment of the present application, Figures 15a to 16b As shown, Figure 15a for Figure 14a The heat exchanger is installed in the heat dissipation chassis schematic diagram, Figure 15b for Figure 14a The heat exchanger shown is installed in Figure 15a The cross-sectional view of the heat sink inside the chassis is shown. Figure 16a for Figure 14a Schematic diagram of the structure where the heat exchanger is installed inside the heat dissipation chassis. Figure 16b for Figure 14a The schematic diagram of the structure of the heat dissipation chassis from another perspective is shown. The chassis front shell 101 is further provided with: a first residual cooling outlet 151 located above the second fin outlet 150b and a second residual cooling outlet 152 located below the second fin outlet 150b; wherein a first spacing area is provided between the first residual cooling outlet 151 and the second fin outlet 150b; a second spacing area is provided between the second residual cooling outlet 152 and the second fin outlet 150b; the first residual cooling outlet 151 is provided corresponding to the first cold air flow outlet 312; the second heat exchange element 33 is partially provided in the first residual cooling recovery chamber 31 and partially extends from the first residual cooling outlet 151 to the heat dissipation chassis 100 through the first cold air flow outlet 312; the second residual cooling outlet 152 is provided corresponding to the second cold air flow outlet 512; and the third heat exchange element 52 is partially provided in the second residual cooling recovery chamber 51 and partially extends from the second residual cooling outlet 152 to the heat dissipation chassis 100 through the second cold air flow outlet 512.

[0204] In this embodiment, the structures of the first and second waste cold recovery assemblies 3 and 5 are identical and will not be further described here. A portion of the second heat exchange element 33 extends out of the heat sink chassis 100 from the first waste cold outlet 151 through the first cold air flow outlet 312, while a portion of the third heat exchange element 52 extends out of the heat sink chassis 100 from the second waste cold outlet 152 through the second cold air flow outlet 512. This allows the portions of the second and third heat exchange elements 33 and 52 protruding from the heat sink chassis 100 to directly exchange heat through radiation with the external environment. This integrated heat exchange method, combining convection and radiation, significantly improves the heat exchange capacity of the heat exchanger.

[0205] At the same time, the first cold air flow outlet 312 of the first waste cooling recovery chamber 31 is arranged corresponding to the first waste cooling extension port 151 of the heat dissipation chassis 100, and the second cold air flow outlet 512 of the second waste cooling recovery chamber 51 is arranged corresponding to the second waste cooling extension port 152 of the heat dissipation chassis 100, and the junction of the heat exchange fin 11 and the second fin extension port 150b is sealed and assembled, which can ensure the high IP protection level of the circuit board accommodating chamber 110 and prevent the built-in power electronic devices from being affected by pollutants such as dust and water vapor in the external environment and causing short circuit problems.

[0206] In the third embodiment of the present application, Figure 17a and Figure 17b As shown, Figure 17a for Figure 14a The heat exchanger is arranged inside the heat dissipation chassis and the cross-sectional direction is as follows Figure 3 The cross-sectional view shown in the AA direction, Figure 17b for Figure 14a The heat exchanger is arranged inside the heat dissipation chassis and the cross-sectional direction is as follows Figure 3 The gas flow mode in this embodiment is similar to that in the second embodiment, and will not be described in detail here.

[0207] In this embodiment, Figure 18 As shown, Figure 18 for Figure 16aThe heat exchanger's circulation pipe 21 includes a third horizontal portion 219 passing through the second wide fin 113, a fourth horizontal portion 221 passing through the third wide fin 115, and a second connecting portion 220 connecting the third horizontal portion 219 and the fourth horizontal portion 221. The second connecting portion 220 includes two connecting straight pipes 2201 located on either side of the second narrow fin 114. The third horizontal portion 219 and the fourth horizontal portion 221 are connected through the two connecting straight pipes 2201. The third horizontal portion 219 of the circulation pipe 21 is a first sub-circulation pipe formed by repeatedly bending a long straight pipe in the same plane and extending it by bending the ends, thereby forming a plurality of first sub-parallel straight pipes 2191 and a plurality of first sub-bent pipes 2192 connecting adjacent first sub-parallel straight pipes 2191; the fourth horizontal portion 221 of the circulation pipe 21 is a second sub-circulation pipe formed by repeatedly bending another long straight pipe in the same plane and extending it by bending the ends, thereby forming a plurality of second sub-parallel straight pipes 2211 and a plurality of second sub-bent pipes 2212 connecting adjacent second sub-parallel straight pipes 2211; the ends of the first sub-circulation pipe and the ends of the second sub-circulation pipe are connected by two connecting straight pipes 2201, forming a three-dimensional bending shape in the shape of a letter C; the electromagnetic pump 22 is installed on any one of the two connecting straight pipes 2201.

[0208] In this embodiment, the third horizontal portion 219 and the fourth horizontal portion 221 are connected by the vertically arranged second connecting portion 220, so that the circulation pipe 21 forms a C-shaped structure. The C-shaped circulation pipe 21 has a larger heat exchange area and a longer heat exchange time between the airflow and the circulation pipe 21, which helps to further improve the heat exchange intensity.

[0209] The second connecting portion 220 includes two connecting straight pipes 2201 to connect the third horizontal portion 219 and the fourth horizontal portion 221 end to end. Figures 19a to 19c , Figure 19a for Figure 17b Cross-sectional view in the JJ direction, Figure 19b for Figure 17b Cross-sectional view in the KK direction, Figure 19c for Figure 17bA cross-sectional view taken along the LL direction. The multiple first sub-parallel straight tubes 2191 in the third horizontal portion 219 and the second sub-parallel straight tubes 2211 in the fourth horizontal portion 221 alternately intersperse within the hot air flow channel 14 and the cold air flow channel 15, respectively. Because a portion of the circulation duct 21 protrudes from the heat dissipation chassis 100 through the second fin extension opening 150b, the first sub-parallel straight tubes 2191 and second sub-parallel straight tubes 2211 within the cold air flow channel 15 are in direct contact with the external environment. This allows for enhanced heat dissipation between the circulation duct 21 and the external environment, in addition to convection, through radiation heat exchange. This integrated heat exchange method, combining convection and radiation, significantly improves the heat exchange capacity of the heat exchanger.

[0210] The heat exchange fins 11 and the circulation pipe 21 in the third embodiment of the present application can also be assembled by a split assembly method. Its structure is similar to that of the previous embodiment and will not be described in detail here. In addition, the connection method between the second wide fins 113, the second narrow fins 114 and the third wide fins 115 can also be selected according to the actual situation. The corresponding processing method can be selected, for example, by welding them together, or by using additive manufacturing methods such as 3D printing to directly form them into one piece. As long as it can be ensured that the second wide fins 113, the second narrow fins 114 and the third wide fins 115 can be fixedly connected, it will be sufficient.

[0211] The circulation pipe 21 in the third embodiment of the present application can also be formed by repeatedly bending a long straight pipe. The specific forming process is as follows:

[0212] The circulation pipe 21 is a long straight pipe that is repeatedly bent and connected end to end in the same plane, and a first sub-circulation part is formed at the first end thereof, including a plurality of first sub-parallel straight pipes 2191 and a plurality of first sub-bent pipes 2192 connecting adjacent first sub-parallel straight pipes 2191; a second sub-circulation part is formed at the second end thereof, including a plurality of second sub-parallel straight pipes 2211 and a plurality of second sub-bent pipes 2212 connecting adjacent second sub-parallel straight pipes 2211; on the long straight pipe, an area located between the first sub-circulation part and the second sub-circulation part is formed, which are not repeatedly bent; the two ends of the two connecting straight pipes 2201 are respectively connected to the first sub-circulation part and the second sub-circulation part; the intersection of the two connecting straight pipes 2201 and the first sub-circulation part, and the intersection of the two connecting straight pipes 2201 and the second sub-circulation part are respectively bent once to form a C-shaped three-dimensional bending shape.

[0213] In this embodiment, Figures 16a to 17bAs shown, the outer surface of the heat exchange fins 11 of the heat exchanger and one or more of the outer surfaces of the second heat exchange element 33 are coated with a first heat exchange coating 71 to improve the heat exchange intensity of thermal radiation; the inner wall of the circulation pipe 21 is coated with an anti-corrosion coating; the outer surface of the circulation pipe 21 and one or more of the outer surfaces of the third heat exchange element 52 are coated with the first heat exchange coating 71 to improve the heat exchange intensity of thermal radiation; or, the outer surface of the circulation pipe 21 and one or more of the outer surfaces of the third heat exchange element 52 are coated with a second heat exchange coating 72 to suppress surface temperature rise.

[0214] In this embodiment, a first heat exchange coating 71 can be coated on the heat exchange surfaces in contact with the hot air flow and the cold air flow in each component of the heat exchanger to enhance the surface emissivity of the heat exchange surface in the infrared band, thereby improving the radiation heat exchange intensity between the heat exchange surface and the external environment. The effect of the first heat exchange coating 71 is the same as that in the aforementioned embodiment and will not be elaborated on here.

[0215] When the first heating module 400 is intermittently operated, the electromagnetic pump 22 can also be intermittently operated, and the operating frequency is consistent with the operating frequency of the first heating module 400 (relevant sensors can be set for the heating module). When the first heating module 400 is continuously operated, the electromagnetic pump 22 can be periodically intermittently operated. Intermittent operation can ensure that the storage speed in the power supply capacitor 300 is greater than the discharge speed, so that the electromagnetic pump 22 is always in an effective state. In addition, during the intermittent period of the heat transfer medium, a certain degree of heat exchange is still taking place between the fluids inside and outside the circulation pipe 21 (air flow and heat transfer medium), and the heat exchange effect can still be guaranteed with periodic operation; in addition, intermittent operation also reduces the total working time of the electromagnetic pump 22, which is beneficial to its life. The periodic frequency of the electromagnetic pump 22 can be adjusted according to actual conditions.

[0216] When the heat transfer medium in the circulation pipe 21 flows intermittently, a second heat exchange coating 72 may be coated on the outer surface of the circulation pipe 21 .

[0217] The second heating module 500 can operate intermittently. In this case, a second heat exchange coating 72 can be applied to the outer surface of the heat sink 520. When the second heating module 500 is operating, the heat conduction of the heat pipe 521 increases the temperature of the heat sink 520. When the second heating module 500 is inactive, the temperature of the heat sink 520 decreases.

[0218] The second heat exchange coating 72 is a "sweating coating." The sweating coating uses water vapor in the air as its water source and replenishes moisture through spontaneous adsorption of water vapor. During the device's heating process, the second heat exchange coating 72 desorbs water and absorbs a large amount of heat, which can suppress surface temperature increases to a certain extent. When the device is in a low-power standby state, the second heat exchange coating 72 can spontaneously adsorb water vapor from the environment to regenerate its operating capacity. Specifically, the second heat exchange coating 72 absorbs and desorbs water from the air, causing phase change heat transfer on the heat exchange surface. This results in a high heat transfer coefficient and significantly improves heat dissipation capacity.

[0219] See also Figure 16a Under the action of the first heat exchange coating 71, some of the heat from the first and second heat exchange modules 400, 500 is transferred to the heat exchange fins 11 through radiation heat exchange. Simultaneously, under the action of the second heat exchange coating 72, some of the heat inside the circuit board housing cavity 110 is transferred to the circulation conduit 21 through moisture adsorption and desorption.

[0220] See also Figure 16b Under the action of the first heat exchange coating 71, some of the heat in the heat exchange fins 11 and the first heat exchange element 32 is dissipated to the external environment through radiation heat transfer. Under the action of the second heat exchange coating 72, some of the heat in the circulation pipe 21 and the radiator 520 is transferred to the external environment through the adsorption and desorption of water.

[0221] See also Figure 17a and Figure 17b Heat can be transferred to the external environment through radiation of the first heat exchange coating 71, or transferred to the external environment through phase change of the second heat exchange coating 72; with the auxiliary effect of the heat exchange coating, the heat exchanger has a strong heat exchange capacity.

[0222] In some embodiments of the present application, an electronic device is provided which is equipped with the heat exchanger provided in the third embodiment, such as Figure 15a and Figure 15bAs shown, the heat exchanger is provided with a first waste cold recovery component 3 and a second waste cold recovery component 5; the first waste cold recovery component 3 has a first waste cold recovery chamber 31 and a second heat exchange member 33, and the first waste cold recovery chamber 31 is communicated with the external environment through a first cold air flow outlet 312; the second waste cold recovery component 5 has a second waste cold recovery chamber 51 and a third heat exchange member 52, and the second waste cold recovery chamber 51 is communicated with the external environment through a second cold air flow outlet 512; the heat exchanger is provided with a first waste cold recovery component 3 and a second waste cold recovery component 5; the first waste cold recovery component 3 has a first waste cold recovery chamber 31 and a second heat exchange member 33; the second waste cold recovery component 5 has a second waste cold recovery chamber 51 and a third heat exchange member 52; the front shell 101 of the chassis is provided with: a second fin extension port 150b, A first waste cooling extension port 151 is located above the second fin extension port 150b and a second waste cooling extension port 152 is located below the second fin extension port 150b; the cold end fan 13 and a portion of the heat exchange fins 11 extend out of the second fin extension port 150b; the first waste cooling extension port 151 is correspondingly arranged to the first cold air flow outlet 312; the second heat exchange element 33 is partially arranged in the first waste cooling recovery chamber 31, and partially extends from the first waste cooling extension port 151 to the heat dissipation chassis 100 through the first cold air flow outlet 312; the second waste cooling extension port 152 is correspondingly arranged to the second cold air flow outlet 512; the third heat exchange element 52 is partially arranged in the second waste cooling recovery chamber 51, and partially extends from the second waste cooling extension port 152 to the heat dissipation chassis 100 through the second cold air flow outlet 512.

[0223] In this embodiment, part of the second heat exchange element 33, part of the third heat exchange element 52 and part of the heat exchange fins 11 protrude out of the heat dissipation chassis 100 through the first residual cooling extension port 151, the second residual cooling extension port 152 and the second fin extension port 150b respectively. The gas flow process is similar to that of the second embodiment and will not be elaborated here.

[0224] The fourth embodiment of the heat exchanger will be described in detail below.

[0225] The difference between the fourth embodiment and the third embodiment of the heat exchanger is that the heat exchange surface exposed to the outside of the heat dissipation chassis 100 can be coated with a third heat exchange coating 73 .

[0226] In the fourth embodiment of the present application, Figure 20a As shown, Figure 20a This is a schematic diagram of the structure of the fourth embodiment of the heat exchanger provided in this application. The outer surfaces of the heat exchange fins 11 and the outer surfaces of the second heat exchange element 33, in one or more areas exposed outside the heat dissipation chassis 100, are coated with a third heat exchange coating 73, enabling radiant cooling. The outer surfaces of the circulation pipe 21 and the third heat exchange element 52, in areas exposed outside the heat dissipation chassis 100, are also coated with the third heat exchange coating 73, enabling radiant cooling.

[0227] In this embodiment, the coating setting of the heat exchange surface inside the circuit board accommodating cavity 110 is the same as that of the third embodiment, and the heat exchange surface exposed outside the heat dissipation chassis 100 can be coated with the third heat exchange coating 73.

[0228] The solar spectrum's radiant energy is primarily concentrated in the 0.2-2μm wavelength range, with the visible light band comprising a significant portion. When the solar spectrum strikes non-transparent objects, it is reflected and absorbed (reflectance and absorptivity, respectively, summing to 1). The more energy reflected, the less energy absorbed, resulting in a lower induced temperature rise. Therefore, electronic devices requiring heat dissipation require increased reflectivity.

[0229] Electronic devices generate heat due to their own power consumption, which in turn generates electromagnetic waves. In the industrial field, this radiation is primarily concentrated in the infrared range (0.76-20μm). The higher the emissivity, the stronger the radiation. Furthermore, there are atmospheric windows in the atmosphere, most notably the 8-13μm band. Through this window, objects on the Earth's surface can radiate electromagnetic waves into outer space, thereby achieving cooling, a process known as radiative cooling.

[0230] Therefore, the third heat exchange coating 73 in this embodiment is a radiation cooling coating, such as Figure 20b As shown, Figure 20b This is a diagram illustrating the parameters of the third heat transfer coating. It has a high emissivity within the solar spectrum, reflecting most of the energy when sunlight strikes its surface. Furthermore, its high emissivity within the atmospheric window wavelength range allows the coating surface to radiate heat through this window with cold sources in outer space, potentially achieving a cooling effect.

[0231] The first heat exchange coating 71 , the second heat exchange coating 72 and the third heat exchange coating 73 may also be films, etc., as long as they can be plated onto the heat exchange surface.

[0232] In the fourth embodiment of this application, see Figures 21a to 22 , Figure 21a for Figure 20a The heat exchanger is arranged inside the heat dissipation chassis and the cross-sectional direction is as follows Figure 3 The cross-sectional view shown in the AA direction, Figure 21b for Figure 20a The heat exchanger is arranged inside the heat dissipation chassis and the cross-sectional direction is as follows Figure 3 The cross-sectional view shown in the BB direction, Figure 22 for Figure 21b The flow process of the airflow is similar to that of the third embodiment and will not be described in detail here.

[0233] Some of the heat in the circuit board cavity 110 can be transferred to the heat exchange fins 11 through radiation from the first heat exchange coating 71, or transferred to the intermittently operating liquid-metal heat exchange assembly 2 through phase change from the second heat exchange coating 72. Along with the heat conduction of the heat exchange fins 11 and the heat and mass transfer of the liquid-metal heat exchange assembly 2, this heat can be further radiated and exchanged with the atmospheric window through the third heat exchange coating 73 on the exterior of the heat dissipation chassis 100, potentially generating a cooling effect. Furthermore, the energy from the solar spectrum that reaches the external heat exchange surface is efficiently reflected back by the third heat exchange coating 73.

[0234] Part of the heat from the first heating module 400 can be transferred to the cold row 330 through the phase change gas pipe 34 and the phase change liquid pipe 35, and then radiate heat with the atmospheric window through the third heat exchange coating 73, and even produce a cooling effect. In addition, part of the heat from the second heating module 500 can be transferred to the radiator 520 through the heat pipe 521, and then radiate heat with the atmospheric window through the third heat exchange coating 73, and even produce a cooling effect. The energy from the solar spectrum that irradiates the external heat exchange surface can be efficiently reflected back under the action of the third heat exchange coating 73. With the assistance of the heat exchange coating, the heat exchanger has a strong heat exchange capacity.

[0235] In addition to the outer surface of the heat exchanger, a third heat exchange coating 73 can also be provided on the entire outer surface of the heat dissipation chassis 100 to reduce the impact of solar radiation on the temperature rise induced by the outer shell of the heat dissipation chassis 100 and at the same time improve the radiation heat exchange or cooling capacity between the outer shell of the heat dissipation chassis 100 and the atmospheric window.

[0236] This application also provides a temperature control method, such as Figure 23a and Figure 23b As shown, Figure 23a Schematic diagram of the thermal architecture of the heat dissipation chassis provided for this application; Figure 23b This is another thermal architecture diagram of the heat dissipation chassis provided in this application. Figure 23b The thermal architecture diagram shown in FIG. 1 is used as an example for explanation.

[0237] In this embodiment, the heat exchange fins 11 separate the hot air flow channel 14 and the cold air flow channel 15. Under the action of the hot end fan 12 and the cold end fan 13, the cold air flow and the hot air flow convectively exchange heat through the heat exchange fins 11, thereby realizing the transfer of heat from the heat dissipation chassis 100 to the external environment.

[0238] A circulation pipe 21 filled with a heat transfer medium composite medium (referred to as heat transfer medium) is installed inside the heat exchanger. Under the action of the electromagnetic pump 22, the heat transfer medium flows alternately along the circulation pipe in the hot air flow channel 14 and the cold air flow channel 15, thereby realizing the rapid transfer and replacement of heat and cold through heat and mass transfer.

[0239] The electromagnetic pump 22 is powered by a power supply capacitor 300, which can realize high current power supply, thereby improving the flow and heat exchange efficiency of the heat transfer medium; the power supply capacitor can assist in storing electricity through a TEG (i.e., a thermoelectric generator 23) installed at the interface of the cold / hot air flow, thereby improving the energy-saving index of the entire machine.

[0240] Downstream of the cold air flow path, there is still a certain degree of coldness, which is transferred to the radiator 330 or the radiator 520 for a second time to cool them down, thereby indirectly cooling the first heating module 400 or the second heating module 500.

[0241] For details, see Figure 23a The heat exchange system provided in the present application includes: a main heat exchange system, a liquid-metal auxiliary heat exchange system, a waste cooling recovery system and a waste heat recovery system. Among them, in the main heat exchange system, the heat exchanger of the air-to-air heat exchange assembly 1 can gather hot and cold air flows, gather the hot air flow in the circuit board accommodating cavity 110 into the hot air flow channel, and gather the cold air flow in the external environment into the cold air flow channel. The hot air flow and the cold air flow in the heat exchanger are subjected to convection heat exchange through the "J"-shaped heat exchange fins 11 arranged in a row. At the same time, a heat exchange coating can also be applied to the surface of the heat exchanger, and the surface of the heat exchanger can be strengthened by heat exchange of the coating. Thereby, the air temperature in the circuit board accommodating cavity 110 is reduced, and the heat dissipation of the heating module is further enhanced.

[0242] The thermoelectric generator 23 (TEG) in the waste heat recovery system is installed on the heat sink fins 11 in the air-to-air heat exchange assembly 1, and can generate electricity by temperature difference based on the thermoelectric effect (Seebeck effect) using the temperature difference between the hot air flow cavity and the cold air flow cavity. The electricity generated by the thermoelectric generator 23 can be stored in the power supply capacitor 300, and the power supply capacitor 300 transmits the stored electricity to the electromagnetic pump 22 to drive the heat transfer medium in the circulation pipe 21 to flow. The thermoelectric generator 23 can also directly power the electromagnetic pump 22. At the same time, the power supply capacitor 300 can also store electricity through the printed circuit board 200 to drive the electromagnetic pump 22 to operate.

[0243] The liquid-metal auxiliary heat exchange system includes a liquid-metal heat exchange assembly 2 disposed within the heat exchanger. A circulation conduit 21 within the liquid-metal heat exchange assembly 2 extends through the heat exchange fins 11. A heat transfer medium (which may be liquid metal) within the circulation conduit 21 alternately flows between the cold air flow chamber and the hot air flow chamber. The heat transfer medium absorbs heat from the hot air flow and transfers it to the cold air flow. This heat and mass transfer allows for rapid transfer and exchange of heat and cold, further reducing the air temperature within the circuit board housing chamber 110.

[0244] The residual cold recovery device includes a first residual cold recovery assembly 3 located at the top of the heat exchanger and a second residual cold recovery assembly 5 located at the bottom of the heat exchanger. After the cold air flows through the heat exchange fins 11 through convection, residual cold remains. Recovering the residual cold through the first and second residual cold recovery assemblies 3 and 5 effectively enhances heat dissipation from the heating module.

[0245] The heat exchange system composed of the above four systems can effectively reduce the air temperature in the circuit board accommodating cavity 110, thereby enhancing the heat dissipation of the heating module.

[0246] See also Figure 23b In the liquid metal assisted heat exchange system, heat storage microcapsules can also be set in the circulation pipe 21. At this time, the liquid metal assisted heat exchange system has heat storage microcapsules and heat transfer medium that alternately flow in the cold air flow cavity and the hot air flow cavity. Therefore, the liquid metal assisted heat exchange system can not only intermittently absorb and release heat through the heat transfer medium (that is, liquid metal, referred to as "liquid metal"), and use "sensible heat" to deeply absorb the heat of the hot air flow; it can also intermittently absorb and release heat through the heat storage microcapsules, and use the "latent heat" effect to further absorb the heat of the hot air flow. Thereby reducing the air temperature in the circuit board accommodating cavity 110, further enhancing the heat dissipation of the heating module.

[0247] The heat exchanger, heat exchange chassis and heat exchange system used in the embodiment of the present application, the air-to-air heat exchange component 1 cooperates with the auxiliary heat exchange system and the waste cold recovery system, so that the whole machine has a strong heat exchange capacity; at the same time, under the action of the waste cold recovery system and the waste heat recovery system, it has a higher energy-saving index, which helps to save energy and reduce emissions.

[0248] In some embodiments of the present application, Figure 24 As shown, Figure 24 This is a flow chart of the temperature control scheme provided in this application. This temperature control method is applied to a controller electrically connected to the hot-end fan 12, the cold-end fan 13, and the electromagnetic pump 22 of the liquid-metal heat exchange assembly 2 of the air-to-air heat exchange assembly 1 in any of the aforementioned embodiments of the heat dissipation chassis; the method includes:

[0249] S100, obtaining the current temperature of the heat-generating module in the heat-dissipating chassis 100 in real time through a first temperature sensor disposed in the circuit board accommodating cavity 110;

[0250] S200. Based on the preset control mode, in the control mode of the fan-coupled electromagnetic pump, based on the current temperature of the heating module, the operating parameters of the hot-end fan 12, the cold-end fan 13 and the electromagnetic pump 22 are determined, and the hot-end fan 12, the cold-end fan 13 and the electromagnetic pump 22 are controlled using the determined operating parameters.

[0251] In this embodiment, the fan-coupled electromagnetic pump control mode determines the operating parameters of the hot-end fan 12, cold-end fan 13, and electromagnetic pump 22 corresponding to the current temperature of the heating module as measured by the first temperature sensor. The hot-end fan 12, cold-end fan 13, and electromagnetic pump 22 are then controlled in real time based on these operating parameters. Thus, under the fan-coupled electromagnetic pump control mode, both the air-to-air heat exchange assembly 1 and the liquid-metal heat exchange assembly 2 can exchange heat with the circuit board housing cavity 110. The combined action of the air-to-air heat exchange assembly 1 and the liquid-metal heat exchange assembly 2 completes the heat exchange, resulting in a robust heat exchange capability for the entire system.

[0252] In some embodiments of the present application, the operating parameters of the hot-end fan 12 and the cold-end fan 13 include: speed level, each speed level corresponds to a temperature range; the operating parameters of the electromagnetic pump 22 include: pumping frequency and pumping force level, wherein the pumping force level is used to indicate the distance that the heat transfer medium flows in the circulation pipe 21 in one pumping.

[0253] In some embodiments of the present application, the control mode of the fan-coupled electromagnetic pump further includes multiple electromagnetic pump operation modes. The control mode of the fan-coupled electromagnetic pump has the best heat exchange effect. The specific contents are as follows:

[0254] The control mode of the fan-coupled electromagnetic pump includes: the correspondence between the preset temperature and the speed level of the hot-end fan 12 and the cold-end fan 13, and the electromagnetic pump operation mode; the electromagnetic pump operation mode is one of: fixed frequency and fixed force intermittent mode, variable frequency and variable force intermittent mode, continuous mode and mixed mode.

[0255] Among them, the fixed frequency and fixed force intermittent mode is: when the temperature is lower than the first preset threshold value T3, the electromagnetic pump 22 is in the off state; when the temperature is not lower than the first preset threshold value T3, the electromagnetic pump is turned on and operates at a preset fixed frequency and fixed pump force level.

[0256] The variable frequency and variable force intermittent mode is: when the temperature is lower than the second preset threshold value T1, the electromagnetic pump 22 is in the off state; when the temperature is not lower than the second preset threshold value T1, after the electromagnetic pump 22 is turned on, based on the current temperature and the temperature difference between the hot air flow channel 14 and the cold air flow channel 15 of the circulation pipe 21, the pumping frequency and / or pump force level are adjusted in real time, and the pumping frequency and / or pump force level are operated according to the adjusted pumping frequency and / or pump force level.

[0257] Continuous mode: When the temperature is within different preset ranges, continuous pumping is performed using different pump force levels.

[0258] The hybrid mode is: when the temperature is lower than the second preset threshold value T1, the electromagnetic pump 22 is in the off state; when the temperature is within the range of the second preset threshold value T1 and the third preset threshold value T6, after the electromagnetic pump 22 is turned on, the pumping frequency and / or pumping force level are adjusted in real time based on the current temperature and the temperature difference between the hot air flow channel 14 and the cold air flow channel 15 of the circulation pipe 21, and the pumping frequency and / or pumping force level are operated at the adjusted pumping frequency and / or pumping force level; when the temperature is higher than the third preset threshold value T6, the electromagnetic pump 22 continues to operate at the highest pumping level.

[0259] The operating parameters of the hot-end fan 12, the cold-end fan 13 and the electromagnetic pump 22 are determined based on the current temperature of the heating module, and the hot-end fan 12, the cold-end fan 13 and the electromagnetic pump 22 are controlled using the determined operating parameters, including: determining the target speed level corresponding to the current temperature based on the current temperature of the heating module and the correspondence between the preset temperature and the speed levels of the hot-end fan 12 and the cold-end fan 13; controlling the hot-end fan 12 and the cold-end fan 13 to operate according to the target speed level, and controlling the electromagnetic pump 22 to operate according to the electromagnetic pump operation mode.

[0260] In this embodiment, the pumping frequency refers to the pumping frequency of the electromagnetic pump 22, that is, the time interval between two pumpings, and is applicable to scenarios where the electromagnetic pump 22 is operating intermittently. The pumping force level refers to the pumping speed or flow rate of the heat transfer medium pumped by the electromagnetic pump 22: in the intermittent operation mode, the pumping force determines the flow distance of the heat transfer medium during a single operation of the electromagnetic pump 22. Because the heat transfer medium and the composite medium have a certain viscosity, when the electromagnetic pump 22 is turned on, the medium flows immediately. When the electromagnetic pump 22 is turned off, the flow stops immediately due to the viscosity. In the continuous operation mode, the pumping force determines the speed at which the heat transfer medium continues to flow in the circulation pipe.

[0261] In the above electromagnetic pump operation mode, the pump force level is obtained in the experimental stage by testing using the following steps:

[0262] Set a single travel distance L of the heat transfer medium flowing in the circulation pipe; the single travel distance L is: the travel distance of the heat transfer medium in the circulation pipe 21 flowing through a hot air flow channel 14 or a cold air flow channel 15;

[0263] The electromagnetic pump 22 is tested for the pumping conditions of different numbers of single stroke distances L, and the different amounts of electricity required for the electromagnetic pump 22 to pump different stroke distances are counted to obtain the corresponding relationship between each pump force level, the pumping stroke distance and the required amount of electricity, so that the pump force level can be adjusted based on the amount of electricity required for the pump force level in the variable frequency and variable force intermittent mode; different pumping stroke distances are different odd numbers of single stroke distances L.

[0264] In this embodiment, reference Figure 4bIn the figure, "L" represents the single "stroke distance" of the heat transfer medium (L = length of each parallel tube + length of each bent tube). When the electromagnetic pump 22 operates intermittently, if each pumping can cause the heat transfer medium to flow a single stroke distance L, then the heat transfer medium, which is a length L, located in the hot air flow channel 14 before pumping, will be completely located in the cold air flow channel 15 after being pumped. Similarly, the heat transfer medium, which is a length L located in the cold air flow channel 15 before pumping, will be completely located in the hot air flow channel 14 after being pumped.

[0265] See also Figure 25a and Figure 25b , Figure 25a for Figure 24 In the embodiment shown, the heat transfer medium before the electromagnetic pump is pumped is located in the hot air flow channel. Figure 25b for Figure 25a Schematic diagram of a section of heat transfer medium located in a cold air flow channel after being pumped a distance.

[0266] In this embodiment, a heat transfer medium of length L is analyzed. When the electromagnetic pump 22 operates intermittently, the heat transfer medium, temporarily at rest in the hot air flow channel 14 before pumping, absorbs heat from the hot air flow through its "sensible heat" depth. Then, with each pumping of the electromagnetic pump 22, this section of heat transfer medium begins to flow. If the electromagnetic pump's pumping force in a single pumping stroke is sufficient to propel the heat transfer medium a distance of L before stopping, this section of heat transfer medium will fall into the cold air flow channel 15. At this point, the heat transfer medium, now at rest, can deeply transfer the heat it carries to the cold air flow. In this way, with each pumping stroke, the heat transfer medium can efficiently transfer heat from the hot air flow chamber to the cold air flow chamber. Furthermore, the above effect can be achieved as long as the pumping distance is an odd number of strokes, i.e., L, 3L, 5L, etc. In the above description, the so-called "depth" refers to the sufficient heat exchange between the heat transfer medium and the cold / hot fluid outside the circulation pipe 21 during the intermittent, stationary phase, causing the heat transfer medium's temperature to increase or decrease.

[0267] In addition, in this application, heat storage microcapsules are added to the heat transfer fluid base liquid. When the electromagnetic pump runs intermittently, the heat transfer fluid is temporarily stationary in the hot air flow channel 14. The heat storage microcapsules inside it will deeply absorb the heat of the hot air flow through the action of "latent heat" (the phase change material absorbs heat and melts). When it is pumped to the cold air flow channel 15, the internal heat storage microcapsules can deeply release the "latent heat" and transfer it to the cold air flow (the phase change material releases heat and solidifies, restoring its heat absorption capacity). As the heat transfer fluid intermittently flows and stagnates in the cold and hot air flow channels 14, the heat storage microcapsules can transfer part of the heat of the hot air flow to the cold air flow through "latent heat".

[0268] When the electromagnetic pump 22 runs continuously, the heat transfer medium in the circulation pipe 21 is always in a flowing state, and conducts convective heat exchange with the cold / hot fluid on the outside that is also in a flowing state through the pipe wall. The disturbance caused by the non-stop flow makes the two sides of the pipe wall have a stronger convective heat transfer coefficient, which can enhance the heat transfer medium base liquid (through sensible heat) and heat storage microcapsules (through latent heat) to fully absorb heat from the hot air flow when flowing through the hot air flow channel 14, and then fully release heat to the cold air flow when flowing through the cold air flow channel 15, thereby achieving the purpose of efficient heat transfer / heat exchange.

[0269] Thus, during the flow of the heat transfer medium, heat is transferred both through the "sensible heat" of the heat transfer medium base fluid and through the "latent heat" of the heat storage microcapsules. The interaction of these two factors gives the liquid-metal heat exchange assembly 2 a strong heat and mass transfer capability, further enhancing the overall heat exchange effect.

[0270] At the same time, high heat capacity particles, including ceramics, polymer powders, etc., can be added to the heat transfer fluid to enhance the total heat capacity of the heat transfer fluid, which is beneficial to enhance heat absorption and thus enhance the heat exchange effect.

[0271] The electromagnetic pump 22 is powered by a capacitor. It can be understood that during continuous operation, the electromagnetic pump 22 can only maintain an effective "powered" state in real time and perform actions according to a preset method only when the power storage speed of the power supply capacitor 300 is not less than the power consumption speed of the electromagnetic pump 22; during intermittent operation, the electromagnetic pump 22 can only perform the pumping action when the real-time power of the power supply capacitor 300 is greater than the power required for the next pumping.

[0272] In some implementations of this application, see Figure 26a , Figure 26a for Figure 24 The flowchart of the electromagnetic pump force level setting process in the embodiment shown is as follows: The statistical calculation of the different amounts of electricity required by the electromagnetic pump 22 to pump different travel distances, and the corresponding relationship between each pump force level, the pumping travel distance, and the required amount of electricity, includes:

[0273] A constant supply current is applied to the electromagnetic pump 22, and the levels are divided by the length of the pumping time; wherein the different durations of a single pumping are in a one-to-one correspondence with the different distances the heat transfer medium is pumped; or, a constant pumping time is applied to the electromagnetic pump, and the levels are divided by the magnitude of the supply current; wherein the different magnitudes of the supply current applied to the electromagnetic pump are in a one-to-one correspondence with the different distances the liquid metal medium is pumped;

[0274] The different amounts of electricity consumed for different travel distances are calculated, and the corresponding relationship between each pump force level, pumping travel distance, and required electricity is obtained.

[0275] In this embodiment, the "pump force level" and "power required for each pump force level" of the electromagnetic pump 22 are preset and counted. Figure 26a , there are two ways to do this:

[0276] Method 1: Using a constant supply current for the electromagnetic pump 22, the levels are divided according to the length of the pumping time; in this method, the longer the single pumping duration is, the longer the distance the heat transfer medium is transported.

[0277] Method 2: Using a constant pumping time for the electromagnetic pump 22 and dividing the levels by the supply current; in this method, the greater the supply current to the electromagnetic pump 22, the longer the distance the heat transfer medium is transported.

[0278] See also Figure 25a and Figure 25b Regardless of which method is used, the L value of a single travel distance needs to be determined based on the circulation pipeline 21.

[0279] Pump power level Single pumping distance Power consumption per pumping (kW·h / J / W) 1 1L S1 2 3L S2 3 5L S3 … … … n 2n-1L Sn

[0280] Table 1 Relationship between pumping distance and power consumption for a single operation at different pump force levels

[0281] See Table 1, which shows the relationship between pumping distance and power consumption for a single operation at different pumping force levels. Using any of the above methods, adjust the pumping force of electromagnetic pump 22 so that the internal heat transfer medium can flow 1, 3, 5, ... 2n-1 strokes L (n is an odd number, the maximum value is selected based on the specific situation) during each pumping operation of electromagnetic pump 22. These strokes correspond to pumping force levels 1, 2, 3, ... n, respectively. The pumping force levels are marked, and the power consumption Sn of electromagnetic pump 22 corresponding to each pumping force level is calculated.

[0282] The above can be carried out in the laboratory. For example, the circulation pipe 21 can be made transparent and each pump force level can be marked by observation or other methods. As long as the relationship between the pumping distance and power consumption of a single operation can be measured, it will be sufficient. During the measurement process, instruments (such as ammeters, voltmeters, or multimeters) can be connected to the circuit to test relevant parameters such as power consumption, voltage, and current, and then calculate the power loss.

[0283] In some implementations of this application, such as Figure 26b As shown, Figure 26b for Figure 24 Flowchart of the heating module temperature sensor and related threshold setting process in the embodiment shown.

[0284] In this embodiment, for the heating module, it is necessary to preset the temperature sensor and related thresholds:

[0285] 1. A temperature sensor is set for the heating module to monitor the temperature T of the heating module in real time;

[0286] 2. Preset "heating module temperature thresholds": T1, T2, T3, T4, T5, T6, etc., increasing in sequence from T1 to T6, used to judge the temperature level of the heating module;

[0287] 3. Preset "heating module temperature hysteresis thresholds": ΔT1', ΔT2', ΔT3', ΔT4', ΔT5', ΔT6', etc., for determining when the fan or electromagnetic pump 22 is degraded.

[0288] The above thresholds can be determined according to real-time conditions through testing in the laboratory stage.

[0289] In some implementations of this application, such as Figure 26c As shown, Figure 26c for Figure 24 Flowchart of the liquid metal temperature sensor and the related threshold setting method in the illustrated embodiment.

[0290] In this embodiment, for the heat transfer medium, it is necessary to preset the temperature sensor and related thresholds:

[0291] 1. See Figure 25a and Figure 25b , arrange temperature sensors on the "circulation pipe 21 surface" or "inside the circulation pipe 21" in the hot zone to monitor the temperature Th of the "pipe" or "liquid metal" in the hot zone in real time;

[0292] 2. See Figure 25a and Figure 25b , arrange temperature sensors on the "circulation pipe 21 surface" or "inside the circulation pipe 21" in the cold zone to monitor the temperature Tc of the "pipe" or "liquid metal" in the cold zone in real time;

[0293] 3. Calculate the temperature difference between the two, ΔT = Th - Tc;

[0294] 4. Preset the “liquid metal temperature difference threshold”: ΔT', where ΔT'>0.

[0295] The above thresholds can be determined according to real-time conditions through testing in the laboratory stage.

[0296] The overall heat exchange capacity of the heat exchanger increases gradually in the order of fixed frequency and fixed force intermittent mode, variable frequency and variable force intermittent mode, continuous mode, and hybrid mode. The following describes the four electromagnetic pump operating modes.

[0297] In some embodiments of the present application, Figure 27a and Figure 27b As shown, Figure 27a for Figure 24 The control curve diagram of the fixed frequency and fixed force intermittent mode in the embodiment shown is: Figure 27b for Figure 24 The control flow chart of the fixed-frequency, fixed-force intermittent mode in the embodiment shown is shown.

[0298] In this embodiment, the actual execution of the temperature control system can be completed under the joint action of the fan and the electromagnetic pump 22, wherein the control of the fan end and the electromagnetic pump 22 end do not interfere with each other, but will jointly affect the heat dissipation state of the heating module.

[0299] The following is a detailed description of the constant-frequency, constant-force intermittent operation mode.

[0300] refer to Figure 27a The fan speed is divided into three levels, namely the first, second and third levels. The higher the level, the higher the fan speed. The fan gear is determined according to the temperature T of the temperature sensor obtained from the heating module: when the temperature is higher, the fan gear is higher; when it is higher than the temperature Tn corresponding to each gear, the fan gear is directly upgraded; when it is lower than the temperature Tn-ΔTn' corresponding to each gear, the fan gear is downgraded.

[0301] In the intermittent operation mode of electromagnetic pump 22 with constant frequency and constant force, there are only two gears: off and on. In the off gear, electromagnetic pump 22 is in a closed state, and the heat transfer medium does not flow at all. In the on gear, electromagnetic pump 22 pumps the heat transfer medium at a preset constant frequency and constant pumping force, with the heat transfer medium flowing intermittently. The gear position of electromagnetic pump 22 is determined by the temperature sensor temperature T obtained from the heating module: when it is above T3, electromagnetic pump 22 is in the on gear; when it is below T3-ΔT3', electromagnetic pump 22 is in the off gear.

[0302] refer to Figure 27b In the initial state (which can be understood as the power-on state), the fan runs at the default gear speed, which can be set according to actual conditions; the electromagnetic pump 22 also runs at the default gear, for example, it can be in the off state. At this time, the thermal architecture of the entire machine is dominated by the "air-to-air heat exchange component 1 driven by the fan". When the power is on, the temperature T of the heating module is obtained in real time. According to the temperature T, the fan end and the electromagnetic pump 22 end respectively perform actions according to their own temperature control logic.

[0303] The fan end:

[0304] The sensor obtains the temperature T of the heating module in real time. When T is between the interval (0, T1), it runs at the first level of speed; when T is between the interval (T1, T2), it runs at the second level of speed; when T is between the interval (T2, ∞), it runs at the third level of speed. When the speed is upgraded, see the solid line, and when it is downgraded, see the dotted line.

[0305] Electromagnetic pump 22 end:

[0306] When the electromagnetic pump 22 is set to the fixed-frequency, fixed-force intermittent mode, when the heat dissipation chassis 100 is turned on, the hot-end fan 12 and the cold-end fan 13 run at a preset initial speed level, and the electromagnetic pump 22 is in the off state.

[0307] The sensor acquires the temperature T of the heating module in real time. When T < T3, electromagnetic pump 22 is in the off position and remains in the closed state. When T ≥ T3, electromagnetic pump 22 is in the on position and operates in a "constant frequency, constant force, intermittent mode." At this time, the liquid-metal heat exchanger assembly 2 is turned on. For a constant frequency, this means pumping once every m seconds; for a constant force, this means pumping for n strokes L each time (n = an odd number, such as 1, 3, 5, etc.). The values ​​of m and n can be selected based on actual conditions.

[0308] When the liquid metal heat exchange component 2 is turned on, the temperature T of the heating module continues to be obtained in real time. When the downshift condition is met, the electromagnetic pump 22 will be turned off; when the downshift condition is not met, the electromagnetic pump 22 continues to operate in the "constant frequency and constant force intermittent mode".

[0309] When the "constant frequency, constant force intermittent mode" of the liquid-metal heat exchanger 2 is activated, the electromagnetic pump 22 causes the heat transfer fluid to intermittently flow alternately through the hot air flow channel 14 and the cold air flow channel 15 at a constant frequency and speed. Heat transfer is achieved through the "sensible heat" of the heat transfer fluid base fluid and the "latent heat" of the heat storage microcapsules. These two factors work together to provide the liquid-metal heat exchanger 2 with strong heat and mass transfer capabilities.

[0310] The variable frequency and variable force intermittent operation mode is described in detail below.

[0311] like Figure 28a and Figure 28b As shown, Figure 28a for Figure 24 The control curve diagram of the variable frequency and variable force intermittent mode in the embodiment shown is: Figure 28b for Figure 24 The control flow chart of the variable frequency and variable force intermittent mode in the embodiment shown.

[0312] In this embodiment, the gear logic and control logic of the fan end are similar to those of the "fan coupled electromagnetic pump (constant frequency, constant force, intermittent) mode" and will not be repeated here.

[0313] In the "variable frequency and variable force intermittent operation mode", the electromagnetic pump 22 gears are multi-gear, among which Figure 28aThe diagram shows four gears: Level 0 (off), Level 1 (gear), Level 2 (gear), and Level 3 (gear). The last three gears correspond to the on gear. When in the off gear, electromagnetic pump 22 is off, and the heat transfer medium does not flow. When in the on gear, the higher the level, the stronger the pumping force of electromagnetic pump 22, and the greater the distance the heat transfer medium can be pumped. In the last three gears, the pumping frequency of electromagnetic pump 22 changes in real time based on demand, hence the term "variable frequency, variable force, intermittent operation mode."

[0314] refer to Figure 28b In the initial state (which can be understood as the power-on state), the fan runs at the default gear speed, which can be set according to actual conditions; the electromagnetic pump 22 also runs at the default gear, for example, it can be in the off state. At this time, the thermal architecture of the entire machine is dominated by the "air-to-air heat exchange component 1 driven by the fan". When the power is on, the temperature T of the heating module is obtained in real time. According to the temperature T, the fan end and the electromagnetic pump 22 end respectively perform actions according to their own temperature control logic.

[0315] The fan end:

[0316] The sensor obtains the temperature T of the heating module in real time. When T is between the interval (0, T2), it runs at the first level of speed; when T is between the interval (T2, T4), it runs at the second level of speed; when T is between the interval (T4, ∞), it runs at the third level of speed. When the speed is upgraded, see the solid line, and when it is downgraded, see the dotted line.

[0317] Electromagnetic pump 22 end:

[0318] When the electromagnetic pump 22 is set to the variable frequency and variable force intermittent mode, when the heat dissipation chassis 100 is turned on, the hot end fan 12 and the cold end fan 13 run at a preset initial speed level, and the electromagnetic pump 22 is in the off state.

[0319] That is, the sensor obtains the temperature T of the heating module in real time. When T<T1, the electromagnetic pump 22 is in the off gear and remains in the off state; when T≥T1, the electromagnetic pump 22 is in the on gear and will operate in the "variable frequency and variable force intermittent mode". At this time, the liquid metal heat exchange component 2 is turned on.

[0320] When the liquid-metal heat exchange assembly 2 is turned on, it continues to acquire the temperature T of the heating module in real time. When the shutdown condition is met (T+ΔT1'<T1), the electromagnetic pump 22 will be turned off. If the shutdown condition is not met, the electromagnetic pump 22 will continue to operate in the "variable frequency and variable force intermittent mode." In the "variable frequency and variable force intermittent mode," the electromagnetic pump 22 is upgraded when the temperature exceeds the temperature Tn corresponding to each gear level; when the temperature falls below the temperature Tn-ΔTn' corresponding to each gear level, the electromagnetic pump 22 is downgraded.

[0321] When the "variable frequency and variable force intermittent mode" of the liquid-metal heat exchanger assembly 2 is activated, the electromagnetic pump 22 causes the heat transfer fluid to flow on demand at varying frequencies and speeds, alternating and intermittently shuttling between the hot air flow channel 14 and the cold air flow channel 15. When heat dissipation pressure is high, the flow is at high frequency and speed, while when heat dissipation pressure is low, the flow is at low frequency and speed, thus balancing heat dissipation and energy conservation. Heat transfer is achieved through the "sensible heat" of the heat transfer fluid base fluid, and through the "latent heat" of the heat storage microcapsules. These two factors work together to give the liquid-metal heat exchanger assembly 2 strong heat and mass transfer capabilities.

[0322] In variable frequency and variable force intermittent mode, two second temperature sensors located inside or outside the circulation conduit 21 obtain the temperature difference between the hot air flow channel 14 and the cold air flow channel 15 in real time. If the temperature difference exceeds a preset difference threshold, the electromagnetic pump 22 is controlled to pump at the current pumping force level. The current pumping force level is determined in real time based on the current temperature and the correspondence between the preset temperature range and the pumping force level. In some embodiments, the pumping time interval can also be counted in real time. If the time interval exceeds the preset time interval threshold, a single pumping is performed at the current pumping force level.

[0323] In variable frequency and variable force intermittent mode, see Figure 29a , Figure 29a for Figure 24 The frequency conversion logic diagram of the electromagnetic pump in the variable frequency variable force intermittent mode is shown in the embodiment shown. Figure 29a As an example, the frequency conversion logic of the electromagnetic pump 22 is described.

[0324] In this embodiment, the pumping time interval t is first counted;

[0325] 1. When t≤t0 (t0 is preset according to actual conditions), the temperature difference ΔT=Th-Tc between the hot zone pipe and the cold zone pipe in the circulation pipe 21 is further calculated:

[0326] 1.1. If ΔT ≥ ΔT', the electromagnetic pump 22 pumps once;

[0327] 1.2. If ΔT<ΔT', the electromagnetic pump 22 stops pumping temporarily.

[0328] 2. When t>t0, the electromagnetic pump 22 directly pumps once.

[0329] In the "frequency conversion" logic, the "temperature difference between the hot zone pipe Th and the cold zone pipe Tc in the circulation pipe 21" and the "pumping time interval t" are comprehensively taken into consideration.

[0330] Before electromagnetic pump 22 begins pumping, the hot zone tubes in hot air flow channel 14 and the heat transfer medium within them fully absorb the heat from the hot air flow, causing the hot zone tube temperature Th to reach a relatively high level. Similarly, the cold zone tubes in cold air flow channel 15 and the heat transfer medium within them fully release heat to the cold air flow, causing the cold zone tube temperature Tc to reach a relatively low level. By comparison, Th > Tc, and as heat exchange proceeds, the temperature difference ΔT between Th and Tc gradually widens until a brief period of thermal equilibrium is reached, at which point the temperature difference may no longer widen and tend to remain constant. By presetting a threshold value ΔT' (the threshold value is greater than 0, which is basically close to the temperature difference value during short-term thermal equilibrium), when ΔT=Th-Tc is higher than the threshold value ΔT', it means that the hot zone pipe and the cold zone pipe have relatively fully absorbed and released heat. At this time, the electromagnetic pump 22 can be started to pump the heat transfer medium that has completed heat absorption in the hot zone pipe for an odd number of strokes and then enter the cold zone for release, and pump the heat transfer medium that has completed heat release in the cold zone pipe for an odd number of strokes and then enter the hot zone for re-absorption of heat, thereby achieving efficient heat transfer. After a single pumping is completed, the hot zone tube is replenished with working fluid from the cold zone, and the Th temperature will decrease; the cold zone tube is replenished with working fluid from the hot zone, Tc will increase, and the temperature difference ΔT between Th and Tc will decrease, and ΔT=Th-Tc<ΔT'; thereafter, the working fluid in the hot zone tube will reabsorb the heat of the hot air flow, and Th will gradually rise; the working fluid in the cold zone tube will release heat to the cold air flow again, and Tc will gradually decrease, and the temperature difference ΔT between Th and Tc will widen again until it approaches a new short-term thermal equilibrium, ΔT exceeds the threshold ΔT', and the next pumping process is started.

[0331] During actual operation, the temperature or power consumption within the chassis may fluctuate or interfere with the system, resulting in insensitivity to changes in ΔT. In this case, the pumping frequency of the electromagnetic pump 22 may become very slow or unresponsive. Therefore, a time threshold t0 is set. When the interval of inactivity of the electromagnetic pump 22 exceeds the threshold t0, the electromagnetic pump 22 is forced to pump, thereby avoiding prolonged inactivity of the electromagnetic pump 22.

[0332] In the circulation pipe 21, a temperature sensor can be set for a single pipe in the hot zone to calculate Th, and a temperature sensor can be set for a single pipe in the cold zone to calculate Tc; or temperature sensors can be set for multiple pipes in the hot zone and the average or maximum value of the multiple temperature sensors can be used as Th, and temperature sensors can be set for multiple pipes in the cold zone and the average or maximum value of the multiple temperature sensors can be used as Tc. Figure 25a and Figure 25b By means of two second temperature sensors arranged inside or outside the circulation pipe 21 , the temperature difference between the hot air flow channel 14 and the cold air flow channel 15 is obtained in real time.

[0333] In variable frequency and variable force intermittent mode, see Figure 29b, Figure 29b for Figure 24 The variable force logic diagram of the electromagnetic pump in the variable frequency variable force intermittent mode is shown in the embodiment shown. Figure 29b As an example, the variable force logic of the electromagnetic pump 22 is described.

[0334] In this embodiment, the current pump force level is determined in real time using the following steps: determining the first candidate pump force level corresponding to the current temperature based on the correspondence between the current temperature and the preset temperature range and the pump force level; obtaining the current remaining power of the capacitor that supplies power to the electromagnetic pump 22; comparing the current remaining power with the power required for each pump force level, and taking the maximum or second largest pump force level that can be supported by the current remaining power as the second candidate pump force level; and taking the lower one between the first candidate pump force level and the second candidate pump force level as the current pump force level.

[0335] Specifically, the following method A and method B are used to determine the pump force level of each state, and then the smaller one of A and B is taken.

[0336] For method A: Determine the pump force level based on the statistical temperature T of the heating module, refer to Figure 28a If T is between the interval (T1, T3), the pumping is performed intermittently at the first level of pumping force; if T is between the interval (T3, T5), the pumping is performed intermittently at the second level of pumping force; if T is between the interval (T5, ∞), the pumping is performed intermittently at the third level of pumping force; when the pumping force is upgraded, see the solid line, and when it is downgraded, see the dotted line. That is, method A is based on Figure 28a Determine the pump force level.

[0337] For method B, the pump force level is determined based on the statistical power supply capacitor 300 power S, and the real-time power supply capacitor 300 power S is compared with the power Sn required for each level of pump force. The maximum pump force level (or the second largest pump force level) that can be supported by the current power supply capacitor 300 power S is calculated, and this level is used as the pump force level corresponding to method B.

[0338] Then compare A and B and take the smaller of the two as the final pump force level. This method combines the heat dissipation pressure demand and the supply of the waste heat recovery system.

[0339] The persistence mode is described in detail below.

[0340] like Figure 30a and Figure 30b As shown, Figure 30a for Figure 24 The control curve diagram of the continuous mode in the embodiment shown, Figure 30b for Figure 24 A control flow diagram for the persistence mode in the illustrated embodiment.

[0341] In this embodiment, the gear logic and control logic of the fan end are similar to those of the "fan coupled electromagnetic pump (constant frequency, constant force, intermittent) mode" and will not be repeated here.

[0342] In the "fan coupled electromagnetic pump (continuous) mode", the "pump force logic" of the electromagnetic pump 22 is divided into multiple gears, among which Figure 30a Three gears are shown, namely the first gear, the second gear and the third gear, all of which are open gears, and the electromagnetic pump 22 is always in working state; the higher the level, the stronger the pumping force of the electromagnetic pump 22, and the greater the travel distance of the heat transfer medium that can be pumped.

[0343] In the "fan-coupled electromagnetic pump (continuous) mode," the "pump frequency" of the electromagnetic pump 22 is continuous operation, that is, the electromagnetic pump 22 does not stop. When working continuously, the heat transfer medium in the circulation pipe 21 is always in a flowing state, and conducts convective heat exchange with the cold / hot fluid on the outside that is also in a flowing state through the pipe wall. The disturbance caused by the continuous flow makes the two sides of the pipe wall have a stronger convective heat transfer coefficient, which can enhance the heat transfer medium base liquid to absorb heat from the hot air flow channel 14 through the "sensible heat" effect and release heat in the cold air flow channel 15. At the same time, along with the disturbance of the heat transfer medium flow, part of the heat absorbed by the base liquid will also be transferred to the heat storage microcapsules with a higher convective heat transfer coefficient, thereby enhancing the "latent heat" transfer process of the heat storage microcapsules. It can be considered that compared with the intermittent operation mode of the electromagnetic pump 22, the overall heat exchange capacity of the liquid-metal heat exchange component 2 is stronger when the electromagnetic pump 22 is in continuous operation mode.

[0344] When the electromagnetic pump is in continuous operation mode, it is necessary to ensure that the charging speed of the power supply capacitor 300 is greater than the discharging speed, so that the electromagnetic pump 22 is always in an effective state of "having power". It is understandable that when the power consumption of the heating module is higher (the greater the heat dissipation pressure), the more it is hoped that the electromagnetic pump 22 can work in a continuous mode to take away heat faster; in addition, when the power consumption of the heating module is higher, the temperature in the hot air flow channel 14 is also higher. At this time, the two end faces of the TEG in the waste heat recovery system also have a higher temperature difference, so its power generation is also faster; and if multiple TEGs are set on the heat exchange fins, it can support the continuous working state of the electromagnetic pump 22 under high heat dissipation pressure. Even in some harsh occasions when TEG alone cannot meet the continuous operation of the electromagnetic pump 22, the PCB end where the power supply capacitor 300 is located can also supply power to the power supply capacitor 300 to ensure that the electromagnetic pump 22 is always in an effective state of "having power".

[0345] refer to Figure 30bIn the initial state (which can be understood as the power-on state), the fan runs at the default gear speed, which can be set according to the actual situation; the electromagnetic pump 22 also runs at the default gear, such as the first gear, which can also be set according to the actual situation. At this time, the thermal architecture of the entire machine is jointly dominated by the "air-to-air heat exchange component 1 driven by the fan" and the "liquid-metal heat exchange component 2 driven by the electromagnetic pump 22". When the power-on is completed, the temperature T of the heating module is obtained in real time. According to the temperature T, the fan end and the electromagnetic pump 22 end respectively perform actions according to their own temperature control logic.

[0346] The fan end:

[0347] The sensor obtains the temperature T of the heating module in real time. When T is between the interval (0, T1), it runs at the first level of speed; when T is between the interval (T1, T3), it runs at the second level of speed; when T is between the interval (T3, ∞), it runs at the third level of speed. See the solid line when the speed is upgraded, and see the dotted line when the speed is downgraded.

[0348] Electromagnetic pump 22 end:

[0349] When the electromagnetic pump 22 is set to the continuous mode, when the heat dissipation chassis 100 is turned on, the hot-end fan 12 and the cold-end fan 13 run at a preset initial speed level, and the electromagnetic pump 22 runs at a preset initial pump force level.

[0350] That is, the sensor obtains the temperature T of the heating module in real time. When T is between the interval (0, T2), pumping is continued with the first level pumping force; when T is between the interval (T2, T4), pumping is continued with the second level pumping force; when T is between the interval (T4, ∞), pumping is continued with the third level pumping force; look at the solid line when the pumping force is upgraded, and look at the dotted line when it is downgraded.

[0351] In "Fan-Coupled Electromagnetic Pump (Continuous) Mode," both the fan and the electromagnetic pump 22 operate continuously, enabling them to handle even the most demanding cooling situations. Furthermore, while operating continuously, the fan speed and electromagnetic pump 22 pumping force levels are dynamically adjusted based on specific cooling requirements, balancing cooling and energy conservation.

[0352] The hybrid mode is described in detail below.

[0353] like Figure 31a and Figure 31b As shown, Figure 31a for Figure 24 The control curve diagram of the hybrid mode in the embodiment shown, Figure 31b for Figure 24 The control flow chart of the hybrid mode in the illustrated embodiment.

[0354] In this embodiment, the gear logic and control logic of the fan end are similar to those of the "fan coupled electromagnetic pump (constant frequency, constant force, intermittent) mode" and will not be repeated here.

[0355] In the "fan coupled electromagnetic pump (hybrid) mode", the "pump force logic" of the electromagnetic pump 22 is divided into multiple gears, among which Figure 31a The figure shows five gears: Level 0 (off), Level 1 (gear), Level 2 (gear), Level 3 (gear), and Level 4 (or the highest gear). The remaining four gears are all open. When in Level 0 (off), electromagnetic pump 22 is off, and the heat transfer medium does not flow. When in the open gear, the higher the level, the stronger the electromagnetic pump 22's working capacity (the stronger the pumping force, or the higher the pumping frequency). Levels 1 through 3 are variable frequency and variable force intermittent modes, with pumping force increasing sequentially and pumping frequency varying as needed. Level 4 is a continuous mode, with an uninterrupted pumping frequency and a higher or equal pumping force than Level 3. In short, the "hybrid mode" of the electromagnetic pump 22 is a combination of the "variable frequency and variable force intermittent mode" and the "continuous mode". It can dynamically adjust the pump force output mode of the electromagnetic pump 22 according to the heat dissipation pressure, etc. It runs at low pump force and low frequency when the heat dissipation pressure is low, and runs at high pump force and high frequency when the heat dissipation pressure is high, thereby better balancing indicators such as heat dissipation, energy saving, and even noise and life.

[0356] refer to Figure 31b In the initial state (which can be understood as the power-on state), the fan runs at the default gear speed, which can be set according to actual conditions; the electromagnetic pump 22 also runs at the default gear, for example, it can be in the off state. At this time, the thermal architecture of the entire machine is dominated by the "air-to-air heat exchange component 1 driven by the fan". When the power is on, the temperature T of the heating module is obtained in real time. According to the temperature T, the fan end and the electromagnetic pump 22 end respectively perform actions according to their own temperature control logic.

[0357] The fan end:

[0358] The sensor obtains the temperature T of the heating module in real time. When T is between the interval (0, T2), it runs at the first level of speed; when T is between the interval (T2, T4), it runs at the second level of speed; when T is between the interval (T4, ∞), it runs at the third level of speed. When the speed is upgraded, see the solid line, and when it is downgraded, see the dotted line.

[0359] Electromagnetic pump 22 end:

[0360] The sensor obtains the temperature T of the heating module in real time;

[0361] When the electromagnetic pump 22 is set to the hybrid mode, when the heat dissipation chassis 100 is turned on, the hot-end fan 12 and the cold-end fan 13 run at the preset initial speed level parameters, and the electromagnetic pump 22 is turned off.

[0362] That is, when T<T1, the electromagnetic pump 22 is in the off position and remains in the off state;

[0363] When T1≤T<T6, the electromagnetic pump 22 operates in the "variable frequency variable force intermittent mode" (the liquid metal heat exchange component 2 is turned on), that is, the electromagnetic pump 22 works between the first and third levels of pumping force; at this time, the frequency conversion logic is Figure 29a Similar to the above, the variable force logic is Figure 29b The above is similar and will not be described again.

[0364] When T≥T6, the electromagnetic pump 22 operates in "continuous mode" at the highest pumping force (the liquid-metal heat exchange component 2 is turned on). At this time, the output capacity of the electromagnetic pump 22 is the strongest, and the heat exchange capacity of the heat transfer medium is also the strongest.

[0365] When the liquid metal heat exchange component 2 is turned on, the temperature T of the heating module continues to be obtained in real time. When T+ΔT1'<T1 is satisfied, the electromagnetic pump 22 will be turned off; otherwise, it will continue to be compared with T6 to determine whether it is running in "variable frequency variable force intermittent mode" or "continuous mode".

[0366] In the "fan-coupled electromagnetic pump (hybrid) mode", the electromagnetic pump 22 can be turned off, pumped intermittently, or pumped continuously according to the actual heat dissipation needs; it can pump at low pumping force or high pumping force. At the same time, in conjunction with the fan-end control, it can support the heat exchange performance of the entire machine more intelligently and efficiently, so that it can better take into account indicators such as heat dissipation, energy saving, noise, and life.

[0367] In some embodiments of the present application, the preset control mode further includes: a pure fan control mode and a pure electromagnetic pump control mode; the heat dissipation chassis 100 is configured to use the pure fan control mode or the pure electromagnetic pump control mode for temperature control in the power-on state and / or the sleep state. It also includes "pure fan control mode" and "pure electromagnetic pump control mode", wherein the "pure fan control mode" is included in a certain working condition of the "fan-coupled electromagnetic pump mode". At this time, the electromagnetic pump 22 is in the off state, and the overall thermal architecture is dominated by the "air-to-air heat exchange component 1 driven by the fan".

[0368] In the "pure electromagnetic pump control mode", the fan is in the off state, and the thermal architecture of the entire machine is dominated by the "liquid metal heat exchange component 2 driven by the electromagnetic pump 22".

[0369] "Pure fan control mode" and "pure electromagnetic pump control mode" are mainly suitable for control methods when the heat dissipation pressure of the whole machine is relatively small, focusing on meeting the heat dissipation needs of low-power situations such as boot state and sleep state.

[0370] The "Constant Frequency and Constant Force Intermittent Mode" and "Variable Frequency and Variable Force Intermittent Mode" in the "Fan-Coupled Electromagnetic Pump Mode" are mainly suitable for control methods when the heat dissipation pressure of the entire machine is moderate, focusing on balancing heat dissipation and energy saving indicators.

[0371] The "continuous mode" in the "fan-coupled electromagnetic pump mode" is mainly suitable for control when the heat dissipation pressure of the entire machine is high, focusing on outputting high heat dissipation performance indicators.

[0372] The "hybrid mode" in the "fan-coupled electromagnetic pump mode" takes into account all of the above methods, is more comprehensive and intelligent, and enables the entire machine to have better heat dissipation, energy saving, noise, life and other indicators.

[0373] Of course, the number of fan gears and the number of electromagnetic pump force levels described in the above various operating modes are not limited to those shown in the drawings and can be flexibly configured according to actual conditions.

[0374] The heat exchanger, heat exchange chassis and heat exchange system used in this application, the air-to-air heat exchange component 1, the liquid-metal heat exchange component 2 and the waste cooling recovery system enable the whole machine to have a strong heat exchange capacity; at the same time, under the action of the waste cooling recovery system and the waste heat recovery system, it has a higher energy-saving index, which helps to save energy and reduce emissions.

[0375] At the same time, the present application provides relevant thermal control methods for the fan in the air-to-air heat exchange component 1 and the electromagnetic pump 22 in the liquid-metal heat exchange component 2, which can be flexibly selected according to actual needs, thereby enhancing the environmental adaptability and thermal reliability of the entire machine; the fan end and the electromagnetic pump 22 end are dynamically adjusted and cooperated with each other, so that the entire machine can better take into account heat dissipation, energy saving, noise, life and other indicators.

[0376] With the coupling effect of the air-to-air heat exchange component 1 and the liquid-metal heat exchange component 2, the whole machine has a strong heat exchange capacity.

[0377] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0378] Each embodiment in this specification is described in a related manner. Similar parts between the various embodiments can be referred to in conjunction with each other. Each embodiment focuses on the differences between the other embodiments. In particular, the system embodiment is generally similar to the method embodiment, so the description is relatively simple. For related parts, refer to the description of the method embodiment.

[0379] The above description is only a preferred embodiment of the present application and is not intended to limit the scope of protection of the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application are included in the scope of protection of the present application.

Claims

1. A heat exchanger, characterized in that: Used to be installed on the chassis front shell (101) of a heat dissipation chassis (100); a circuit board accommodating cavity (110) is formed in the heat dissipation chassis (100); the heat exchanger comprises: an air-to-air heat exchange component (1) and a liquid-metal heat exchange component (2); The air-to-air heat exchange assembly (1) comprises: heat exchange fins (11), a hot end fan (12) and a cold end fan (13); the heat exchange fins (11) are arranged inside the heat dissipation chassis (100) along the height direction of the heat dissipation chassis (100); The heat exchange fin (11) is formed with a plurality of hot air flow channels (14) and a plurality of cold air flow channels (15) adjacent to each hot air flow channel (14), wherein each hot air flow channel (14) is isolated from its adjacent cold air flow channel (15); The hot end fan (12) is arranged on a side of the heat exchange fin (11) facing away from the chassis front shell (101), is located in the circuit board accommodating cavity (110), is communicated with the hot air flow channel (14), and is used to guide the hot air flow inside the circuit board accommodating cavity (110) into the hot air flow channel (14); The cold end fan (13) is arranged on the other side of the heat exchange fin (11) and is connected to the cold air flow channel (15), and is used to introduce the cold air flow from the external environment into the cold air flow channel (15) through the area on the front shell (101) of the chassis that is connected to the external environment, and to exchange heat with the hot air flow in the hot air flow channel (14) through the heat exchange fin (11); the hot air flow flows back into the circuit board accommodating cavity (110) after heat exchange, and the cold air flow is guided out to the external environment after heat exchange; The liquid-metal heat exchange assembly (2) comprises: a circulation pipe (21) and an electromagnetic pump (22); the circulation pipe (21) is provided through the heat exchange fins (11), and a heat transfer medium is provided inside the circulation pipe (21) for flowing along the circulation pipe (21); the electromagnetic pump (22) is installed on the circulation pipe (21) and is used to drive the heat transfer medium to flow along the circulation pipe (21).

2. The heat exchanger according to claim 1, characterized in that The heat exchange fin (11) is bent into a plurality of "X" shapes arranged in a line, forming a plurality of first groove portions and second groove portions arranged alternately; among the plurality of "X" shapes of the heat exchange fin (11), the plurality of first groove portions with opening directions facing away from the front shell (101) of the chassis form a hot air flow channel (14), and among the plurality of "X" shapes, the plurality of second groove portions with opening directions opposite to the first groove portions form the cold air flow channel (15); the hot air flow channel (14) is connected to the circuit board accommodating cavity (110), and the cold air flow channel (15) is connected to the external environment outside the heat dissipation chassis (100).

3. The heat exchanger according to claim 1, characterized in that Also includes: A first residual cold recovery component (3); A first waste cold recovery component (3) comprises: a first waste cold recovery chamber (31), a first heat exchange element (32) and a second heat exchange element (33); the first waste cold recovery chamber (31) is arranged at the top end of the heat exchange fin (11); The first heat exchange component (32) is in contact with and connected to the first heating module (400) in the circuit board accommodating cavity (110), and is used to conduct heat generated by the first heating module (400); The second heat exchange element (33) is arranged in the first residual cold recovery chamber (31); the second heat exchange element (33) is connected to the first heat exchange element (32) and is used to utilize the cold air flow of the cold air flow channel (15) and the heat derived from the first heating module (400) to perform heat exchange; The first waste cold recovery chamber (31) has a first cold air flow inlet (311) and a first cold air flow outlet (312); the first waste cold recovery chamber (31) is connected to the cold air flow channel (15) through the first cold air flow inlet (311) to allow cold air to flow into the first waste cold recovery chamber (31) to cool the second heat exchange component (33); after heat exchange, the cold air flow is discharged to the external environment through the first cold air flow outlet (312).

4. The heat exchanger according to claim 3, characterized in that A first end cover (36) is provided between the first residual cold recovery chamber (31) and the cold air flow channel (15); a first sealing portion (361) and a first opening portion (362) are provided on the first end cover (36); The cold air flow channel (15) is connected to the first residual cold recovery chamber (31) through the first opening portion (362), and the hot air flow channel (14) is isolated from the first residual cold recovery chamber (31) through the first sealing portion (361).

5. The heat exchanger according to claim 3, characterized in that The first heat exchange component (32) is a cold plate (320) with a refrigerant disposed therein; the second heat exchange component is a cold row (330); the cold plate (320) and the cold row (330) are connected via a phase change gas pipe (34) and a phase change liquid pipe (35); At least a portion of the cold row (330) is disposed inside the first residual cold recovery chamber (31); The cold plate (320) is disposed in the circuit board accommodating cavity (110); the cold plate (320) is disposed in contact with the first heating module (400) in the circuit board accommodating cavity (110); The refrigerant in the cold plate (320) changes into a gaseous state after being heated by the first heating module (400); the gaseous refrigerant flows along the phase-change gas pipe (34) into the cold row (330), exchanges heat with the cold air flow in the first residual cold recovery chamber (31), and changes into a liquid state; the liquid refrigerant flows back into the cold plate (320) along the phase-change liquid pipe (35).

6. The heat exchanger according to claim 5, characterized in that The height of the cold row (330) is higher than the height of the cold plate (320) in the circuit board accommodating cavity (110); and the phase change air pipe (34) is located above the phase change liquid pipe (35).

7. The heat exchanger according to claim 4, characterized in that The chassis front shell (101) is provided with: a chassis air inlet (1011) and a first chassis air outlet (1021); the heat exchanger further comprises: a first heat exchanger shell (41); The first heat exchanger housing (41) is located in the heat dissipation chassis (100), and the side thereof close to the chassis front shell (101) is the first cold end air inlet side (415), and the other side away from the chassis front shell (101) is the first hot end air inlet side (414); the first hot end air inlet side (414) is provided with a first hot end air inlet (411) and a first hot end air outlet (412) at intervals; the first cold end air inlet side (415) is provided with a first cold end air inlet (413); the top of the first heat exchanger housing (41) is open; The air-to-air heat exchange component (1) and the liquid-metal heat exchange component (2) are arranged inside the first heat exchanger shell (41); wherein the heat exchange fin (11) is located between the first hot-end air inlet (411) and the first cold-end air inlet (413), and along the height direction of the first heat exchanger shell (41), separates the first cavity (410) inside the first heat exchanger shell (41) into a first hot air flow cavity (416) and a first cold air flow cavity (417) that are isolated from each other; the hot-end fan (12) is arranged in the first hot air flow cavity (416) and corresponds to the first hot-end air inlet (411), and the cold-end fan (13) is arranged in the first cold air flow cavity (417) and corresponds to the first cold-end air inlet (413); The first hot end air inlet (411) and the first hot end air outlet (412) are in communication with the first hot air flow cavity (416); the first cold end air inlet (413) is in communication with the first cold air flow cavity (417); The first residual cold recovery chamber (31) is arranged at the top of the first heat exchanger shell (41); the first cold air flow inlet (311) is connected to the first cold air flow chamber (417) through a first opening portion (362) on the first end cover (36) located at the top of the first heat exchanger shell (41); The chassis air inlet (1011) corresponds to the first cold end air inlet (413) of the first heat exchanger shell (41); the first chassis air outlet (1021) corresponds to the first cold air flow outlet (312) of the first residual cold recovery chamber (31).

8. The heat exchanger according to claim 7, characterized in that The heat exchange fins (11) include: a first narrow fin (111) and a first wide fin (112) sequentially arranged along a height direction; The circulation pipe (21) is passed through the first wide fin (112); The first narrow fin (111) is fixed to the bottom plate of the first heat exchanger shell (41); A side of the first narrow fin (111) close to the first hot end air inlet side (414) and a side of the first wide fin (112) close to the first hot end air inlet side (414) form a first stepped structure (1111); The hot end fan (12) is arranged at the first stepped structure (1111); A side of the first narrow fin (111) close to the first cold end air inlet side (415) and a side of the first wide fin (112) close to the first cold end air inlet side (415) form a second stepped structure (1112); The cold end fan (13) is arranged at the second stepped structure (1112).

9. The heat exchanger according to claim 8, characterized in that Each hot air flow channel (14) of the first narrow fin (111) is in communication with a portion of the hot air flow channels (14) of the first wide fin (112); Each cold air flow channel (15) of the first narrow fin (111) is in communication with a portion of the cold air flow channels (15) of the first wide fin (112); On the first stepped structure (1111), a first sealing structure (1121) is provided at the top of the other cold air flow channels (15) in the first wide fin (112) that are not connected to the cold air flow channels (15) of the first narrow fin (111); On the second stepped structure (1112), a second sealing structure (1122) is provided at the top of the other hot air flow channels (14) in the first wide fin (112) that are not connected to the hot air flow channels (14) of the first narrow fin (111).

10. The heat exchanger according to claim 8, characterized in that The circulation pipes (21) are circulation pipes located in the same plane; The first wide fin (112) is divided into two split fins (120) along the assembly plane of the circulation pipe (21); each of the split fins (120) is provided with a receiving groove (16) that matches the circulation pipe (21) on the opposite surface and is used for installing the circulation pipe (21).

11. The heat exchanger according to claim 10, characterized in that The circulation pipeline (21) is formed by repeatedly bending a long straight pipe in the same plane and connecting the end to the end, thereby forming a circulation pipeline including a plurality of first parallel straight pipes (211), a plurality of first bent pipes (212) connecting adjacent first parallel straight pipes (211), and a first end-to-end connected straight pipe (2131); wherein the two adjacent first parallel straight tubes (211) correspond to the adjacent hot air flow channel (14) and the cold air flow channel (15), respectively; The circulation pipe (21) is obliquely arranged in the first narrow fin (111); The electromagnetic pump (22) is installed on any one of the first parallel straight pipes (211).

12. The heat exchanger according to claim 4, characterized in that Also includes: A second waste cold recovery component (5); The second waste cold recovery component (5) comprises: a second waste cold recovery chamber (51) and a third heat exchange element (52); The second residual cold recovery chamber (51) is arranged at the bottom end of the heat exchange fin (11); At least a portion of the third heat exchange element (52) is disposed inside the second residual cold recovery chamber (51); the third heat exchange element (52) is disposed in contact with the second heating module (500) in the circuit board accommodating chamber (110); or, the third heat exchange element (52) is in contact with the second heating module (500) via a heat pipe (521), and is used to perform heat exchange with the heat emitted by the second heating module (500) using the cold air flow in the cold air flow channel (15); The second waste cold recovery chamber (51) has a second cold air flow inlet (511) and a second cold air flow outlet (512); the second waste cold recovery chamber (51) is connected to the cold air flow channel (15) through the second cold air flow inlet (511) to allow cold air to flow into the second waste cold recovery chamber (51) to cool the third heat exchange component (52); after heat exchange, the cold air flow is discharged to the external environment through the second cold air flow outlet (512).

13. The heat exchanger according to claim 12, characterized in that A second end cover (53) is provided between the second residual cold recovery chamber (51) and the cold air flow channel (15); a second sealing portion (531) and a second opening portion (532) are provided on the second end cover (53); The cold air flow channel (15) is connected to the second residual cold recovery chamber (51) through the second opening portion (532), and the hot air flow channel (14) is isolated from the second residual cold recovery chamber (51) through the second sealing portion (531).

14. The heat exchanger according to claim 12, characterized in that The third heat exchange element (52) is a radiator (520).

15. The heat exchanger according to claim 13, characterized in that The heat exchange fins (11) include: a second wide fin (113), a second narrow fin (114), and a third wide fin (115) arranged in sequence from bottom to top; The circulation pipe (21) is provided through the second wide fin (113), the second narrow fin (114) and the third wide fin (115); A third step structure (1141) is formed between the second narrow fin (114) and the second wide fin (113), with the opening facing away from the front shell (101) of the chassis; a fourth step structure (1142) is formed between the second narrow fin (114) and the second wide fin (113), with the other side opposite to the third step structure (1141); A fifth step structure (1143) is formed between the second narrow fin (114) and the third wide fin (115), with the opening facing away from the front shell (101) of the chassis; a sixth step structure (1144) is formed between the second narrow fin (114) and the third wide fin (115), with the opening facing away from the front shell (101) of the chassis; The hot end fan (12) is arranged between the third step structure (1141) and the fifth step structure (1143); The cold end fan (13) is arranged between the fourth step structure (1142) and the sixth step structure (1144); The cold air flow channel (15) located at the third step structure (1141) and the fifth step structure (1143) is isolated from the circuit board accommodating cavity (110); and the hot air flow channel (14) located at the fourth step structure (1142) and the sixth step structure (1144) is isolated from the external environment.

16. The heat exchanger according to claim 15, characterized in that Each of the hot air flow channels (14) of the second narrow fin (114) is respectively connected to a portion of the hot air flow channels (14) of the second wide fin (113) and the third wide fin (115); Each of the cold air flow channels (15) of the second narrow fin (114) is respectively connected to a portion of the cold air flow channels (15) of the second wide fin (113) and the third wide fin (115); On the third stepped structure (1141), a third sealing structure (1131) is provided at the top of the other cold air flow channels (15) in the second wide fins (113) that are not connected to the respective cold air flow channels (15) of the second narrow fins (114); On the fourth stepped structure (1142), a fourth sealing structure (1132) is provided at the top of the other hot air flow channels (14) in the second wide fins (113) that are not connected to the hot air flow channels (14) of the second narrow fins (114); On the fifth stepped structure (1143), a fifth sealing structure (1151) is provided at the bottom of the other cold air flow channels (15) in the third wide fin (115) that are not connected to the cold air flow channels (15) of the second narrow fin (114); On the sixth stepped structure (1144), a sixth sealing structure (1152) is provided at the bottom of the other hot air flow channels (14) in the third wide fin (115) that are not connected to the hot air flow channels (14) of the second narrow fin (114).

17. The heat exchanger according to claim 15, characterized in that The chassis front shell (101) is provided with: a second chassis air outlet (1022), a first fin extension opening (150a), and a third chassis air outlet (1023) which are sequentially spaced apart in the height direction; The heat exchanger further includes: a second heat exchanger shell (42); The second heat exchanger housing (42) comprises: a second hot end air inlet side (421) and two second side walls (422) perpendicular to the second hot end air inlet side (421); the two second side walls (422) are arranged opposite to each other; the second hot end air inlet side (421), the two second side walls (422) and the chassis front shell (101) form a second hot air flow cavity (423); A second hot end air inlet (4211) and a second hot end air outlet (4212) are provided on the second hot end air inlet side (421) of the second heat exchanger housing (42), which are spaced apart from each other; the second hot end air inlet (4211) and the second hot end air outlet (4212) are located in the circuit board accommodating cavity (110) and are both in communication with the second hot air flow cavity (423); the second hot end air inlet (4211) corresponds to the position of the hot end fan (12); The hot end fan (12) and a portion of the heat exchange fins (11) of the air-to-air heat exchange component (1) are located in the second hot air flow cavity (423), and the cold end fan (13) and another portion of the heat exchange fins (11) extend out of the first fin extension port (150a); a portion of the circulation pipe (21) of the liquid-metal heat exchange component (2) is located in the second hot air flow cavity (423), and the other portion is exposed to the external environment; wherein the heat exchange fins (11) are located in the hot air flow channel (14) in the external environment and isolated from the external environment; The outer cover of the cold end fan (13) is provided with a fan protective cover (160) having a fan air inlet (170); The first residual cold recovery chamber (31) is arranged at the top end of the second heat exchanger shell (42); the second residual cold recovery chamber (51) is arranged at the bottom end of the second heat exchanger shell (42); The second chassis air outlet (1022) corresponds to the first cold air flow outlet (312) of the first residual cold recovery chamber (31); the third chassis air outlet (1023) corresponds to the second cold air flow outlet (512) of the second residual cold recovery chamber (51).

18. The heat exchanger according to claim 17, characterized in that A seventh sealing structure (1133) is provided on the second wide fin (113), protruding outward from the bottom of each of the hot air flow channels (14) of the chassis front shell (101); An eighth sealing structure (1153) is provided on the third wide fin (115), protruding outward from the top of each of the hot air flow channels (14) of the chassis front shell (101).

19. The heat exchanger according to claim 17, wherein The second heat exchange element (33) is arranged in the first residual cold recovery chamber (31), and the first cold air flow outlet (312) of the first residual cold recovery chamber (31) abuts against the inner wall around the second chassis air outlet (1022); The third heat exchange component (52) is arranged in the second residual cold recovery chamber (51), and the second cold air flow outlet (512) of the second residual cold recovery chamber (51) abuts against the inner wall around the third chassis air outlet (1023).

20. The heat exchanger according to claim 17, wherein The circulation pipe (21) includes: a first horizontal portion (214) passing through the second wide fin (113), a second horizontal portion (216) passing through the third wide fin (115), and a first connecting portion (215) passing through the second narrow fin (114) and used to connect the first horizontal portion (214) and the second horizontal portion (216); The first horizontal portion (214), the first connecting portion (215) and the second horizontal portion (216) are all arranged in communication.

21. The heat exchanger according to claim 20, characterized in that The circulation pipe (21) is formed by repeatedly bending a long straight pipe in the same plane and connecting the ends thereof to form a plane circulation pipe including a plurality of second parallel straight pipes (217), a plurality of second bent pipes (218) connecting adjacent second parallel straight pipes (217), and a second end-to-end connected straight pipe (2132), and then bending the plane circulation pipe twice to form a Z-shaped three-dimensional bending shape; wherein the two adjacent second parallel straight tubes (217) correspond to the adjacent hot air flow channel (14) and the cold air flow channel (15), respectively; The first connecting portion (215) is obliquely arranged in the second narrow fin (114); The electromagnetic pump (22) is installed on any second parallel straight pipe (217) of the first connecting portion (215).

22. The heat exchanger according to claim 17, wherein The heat exchange fins (11) are coated with a first heat exchange coating (71) in the area exposed outside the heat dissipation chassis (100) to enhance the heat radiation heat exchange intensity.

23. The heat exchanger according to claim 15, characterized in that The chassis front shell (101) is provided with: a second fin extension opening (150b); The heat exchanger is embedded in the second fin extension opening (150b); The hot-end fan (12) and a portion of the heat exchange fins (11) of the air-to-air heat exchange assembly (1) are located in the circuit board accommodating cavity (110), and the cold-end fan (13) and another portion of the heat exchange fins (11) extend out of the second fin extension port (150b); A portion of the circulation pipe (21) of the liquid-metal heat exchange component (2) is located in the circuit board accommodating cavity (110), and the other portion is exposed to the external environment; wherein the heat exchange fins (11) isolate the cold air flow channel (15) located in the circuit board accommodating cavity (110) from the circuit board accommodating cavity (110); and the hot air flow channel (14) of the heat exchange fins (11) located in the external environment is isolated from the external environment; The outer cover of the cold end fan (13) is provided with a fan protective cover (160) having a fan air inlet (170).

24. The heat exchanger according to claim 23, characterized in that The chassis front shell (101) is further provided with: a first residual cooling outlet (151) located above the second fin outlet (150b) and a second residual cooling outlet (152) located below the second fin outlet (150b); The first residual cooling outlet (151) is arranged corresponding to the first cold air flow outlet (312); the second heat exchange element (33) is partially arranged in the first residual cooling recovery chamber (31), and partially extends from the first residual cooling outlet (151) to the heat dissipation chassis (100) through the first cold air flow outlet (312); The second residual cooling extension port (152) is arranged corresponding to the second cold air flow outlet (512); the third heat exchange component (52) is partially arranged in the second residual cooling recovery chamber (51), and partially extends from the second residual cooling extension port (152) to the heat dissipation chassis (100) through the second cold air flow outlet (512).

25. The heat exchanger according to claim 23, characterized in that The circulation pipe (21) includes: a third horizontal portion (219) passing through the second wide fin (113), a fourth horizontal portion (221) passing through the third wide fin (115), and a second connecting portion (220) connecting the third horizontal portion (219) and the fourth horizontal portion (221); The second connecting portion (220) comprises: two connecting straight tubes (2201) located on both outer sides of the second narrow fin (114); The third horizontal portion (219) and the fourth horizontal portion (221) are connected via the two connecting straight pipes (2201).

26. The heat exchanger according to claim 25, characterized in that The third horizontal portion (219) of the circulation pipe (21) is formed by repeatedly bending a long straight pipe in the same plane and extending it by bending the ends to form a first sub-circulation pipe including a plurality of first sub-parallel straight pipes (2191) and a plurality of first sub-bent pipes (2192) connecting adjacent first sub-parallel straight pipes (2191); The fourth horizontal portion (221) of the circulation pipe (21) is formed by repeatedly bending another long straight pipe in the same plane and extending it by bending the ends to form a second sub-circulation pipe including a plurality of second sub-parallel straight pipes (2211) and a plurality of second sub-bent pipes (2212) connecting adjacent second sub-parallel straight pipes (2211); The head and tail of the first sub-circulation pipeline and the head and tail of the second sub-circulation pipeline are connected through the two connecting straight pipes (2201), forming a three-dimensional C-shaped bend; The electromagnetic pump (22) is installed on any one of the two connecting straight pipes (2201).

27. The heat exchanger according to claim 23, characterized in that One or more of the outer surfaces of the heat exchange fins (11) and the outer surface of the second heat exchange element (33) are coated with a first heat exchange coating (71) for improving the heat radiation heat exchange intensity; or one or more of the outer surfaces of the heat exchange fins (11) and the outer surface of the second heat exchange element (33) in the area exposed to the outside of the heat dissipation chassis (100) are coated with a third heat exchange coating (73) for radiative cooling; The inner wall of the circulation pipe (21) is coated with an anti-corrosion coating; One or more of the outer surfaces of the circulation pipe (21) and the outer surfaces of the third heat exchange element (52) are coated with the first heat exchange coating (71) for improving the heat radiation heat exchange intensity; or one or more of the outer surfaces of the circulation pipe (21) and the outer surfaces of the third heat exchange element (52) are coated with the second heat exchange coating (72) for suppressing surface temperature rise; or the outer surfaces of the circulation pipe (21) and the third heat exchange element (52) in the area exposed to the outside of the heat dissipation chassis (100) are coated with the third heat exchange coating (73); for performing radiation cooling.

28. The heat exchanger according to any one of claims 1 to 27, characterized in that A power supply capacitor (300) is further provided in the circuit board accommodating cavity (110); the power supply capacitor (300) is electrically connected to the electromagnetic pump (22) and is used to supply power to the electromagnetic pump (22); The heat exchanger further includes: one or more thermoelectric generators (23) embedded in the heat exchange fins (11); One side of each of the thermoelectric generators (23) is located in the hot air flow channel (14), and the other side is located in the cold air flow channel (15); each of the thermoelectric generators (23) is electrically connected to the electromagnetic pump (22) and the power supply capacitor (300) to charge the power supply capacitor (300); and / or to supply power to the electromagnetic pump (22).

29. An electronic device, characterized in that: Comprising the heat exchanger according to any one of claims 1 to 28 and the heat dissipation chassis (100); The heat exchanger is mounted on the chassis front shell (101) of the heat dissipation chassis (100).

30. The electronic device according to claim 29, wherein The heat exchanger is provided with a first residual cold recovery component (3), the first residual cold recovery component (3) having a first residual cold recovery chamber (31), and the first residual cold recovery chamber (31) is connected to the external environment through a first cold air flow outlet (312); The chassis front shell (101) is provided with: a chassis air inlet (1011) and a first chassis air outlet (1021); The heat exchanger comprises: a first heat exchanger shell (41); The chassis air inlet (1011) corresponds to the first cold end air inlet (413) of the first heat exchanger housing (41), and is used to guide the cold air flow from the external environment into the first cold air flow cavity (417); The first chassis air outlet (1021) corresponds to the first cold air flow outlet (312) of the first residual cold recovery chamber (31), and is used to guide the cold air flow after heat exchange to the external environment.

31. The electronic device according to claim 29, wherein The heat exchanger is provided with a first waste cold recovery component (3) and a second waste cold recovery component (5); the first waste cold recovery component (3) has a first waste cold recovery chamber (31), and the first waste cold recovery chamber (31) is communicated with the external environment through a first cold air flow outlet (312); the second waste cold recovery component (5) has a second waste cold recovery chamber (51), and the second waste cold recovery chamber (51) is communicated with the external environment through a second cold air flow outlet (512); The chassis front shell (101) is provided with: a second chassis air outlet (1022), a first fin extension opening (150a), and a third chassis air outlet (1023) which are sequentially spaced apart in the height direction; The heat exchanger comprises: a second heat exchanger shell (42); The second chassis air outlet (1022) corresponds to the first cold air flow outlet (312) of the first residual cold recovery chamber (31), and is used to guide the cold air flow after heat exchange to the external environment; the third chassis air outlet (1023) corresponds to the second cold air flow outlet (512) of the second residual cold recovery chamber (51), and is used to guide the cold air flow after heat exchange to the external environment; The cold end fan (13) and a portion of the heat exchange fins (11) extend out of the first fin extension opening (150a) to guide the cold air flow into the cold air flow channel.

32. The electronic device according to claim 29, wherein The heat exchanger is provided with a first waste cold recovery component (3) and a second waste cold recovery component (5); the first waste cold recovery component (3) has a first waste cold recovery chamber (31) and a second heat exchange component (33), and the first waste cold recovery chamber (31) is connected to the external environment through a first cold air flow outlet (312); the second waste cold recovery component (5) has a second waste cold recovery chamber (51) and a third heat exchange component (52), and the second waste cold recovery chamber (51) is connected to the external environment through a second cold air flow outlet (512); The chassis front shell (101) is provided with: a second fin extension opening (150b), a first residual cooling extension opening (151) located above the second fin extension opening (150b), and a second residual cooling extension opening (152) located below the second fin extension opening (150b); The cold end fan (13) and a portion of the heat exchange fins (11) extend out of the second fin extension opening (150b); The first residual cooling outlet (151) is arranged corresponding to the first cold air flow outlet (312); the second heat exchange element (33) is partially arranged in the first residual cooling recovery chamber (31) and partially extends out of the heat dissipation chassis (100) through the first residual cooling outlet (151); The second residual cooling extension port (152) is arranged corresponding to the second cold air flow outlet (512); the third heat exchange component (52) is partially arranged in the second residual cooling recovery chamber (51), and partially extends out of the heat dissipation chassis (100) through the second residual cooling extension port (152).

33. The electronic device according to claim 29, wherein: A top spacing area and a bottom spacing area are respectively provided between the top and bottom of the heat exchanger and the top and bottom of the heat dissipation chassis (100).

34. A temperature control method, characterized in that: The method is applied to a controller, wherein the controller is electrically connected to a hot-end fan (12), a cold-end fan (13) of an air-to-air heat exchange component (1) in the electronic device according to any one of claims 30 to 33, and an electromagnetic pump (22) of the liquid-metal heat exchange component (2); the method comprises: The current temperature of the heating module in the heat dissipation chassis (100) is obtained in real time by a first temperature sensor arranged in the circuit board accommodating cavity (110); Based on a preset control mode, in a control mode in which the control mode is a fan-coupled electromagnetic pump, the operating parameters of the hot-end fan (12), the cold-end fan (13), and the electromagnetic pump (22) are determined based on the current temperature of the heating module, and the hot-end fan (12), the cold-end fan (13), and the electromagnetic pump (22) are controlled using the determined operating parameters.

35. The control method according to claim 34, characterized in that: The operating parameters of the hot end fan (12) and the cold end fan (13) include speed levels, each speed level corresponding to a temperature range; the operating parameters of the electromagnetic pump (22) include pumping frequency and pumping force level, wherein the pumping force level is used to indicate the travel distance of the heat transfer medium in the circulation pipe (21) during one pumping; The control mode of the fan-coupled electromagnetic pump includes: a correspondence between a preset temperature and a rotation speed level of the hot-end fan (12) and the cold-end fan (13), and an electromagnetic pump operation mode; the electromagnetic pump operation mode is one of a fixed-frequency fixed-force intermittent mode, a variable-frequency variable-force intermittent mode, a continuous mode, and a mixed mode; The fixed-frequency and fixed-force intermittent mode is as follows: when the temperature is lower than a first preset threshold value (T3), the electromagnetic pump (22) is in an off state; when the temperature is not lower than the first preset threshold value (T3), the electromagnetic pump is turned on and operates at a preset fixed frequency and fixed pump force level; The variable frequency and variable force intermittent mode is as follows: when the temperature is lower than a second preset threshold value (T1), the electromagnetic pump (22) is in an off state; when the temperature is not lower than the second preset threshold value (T1), the electromagnetic pump (22) is turned on, and based on the current temperature and the temperature difference between the hot air flow channel (14) and the cold air flow channel (15) of the circulation pipe (21), the pumping frequency and / or pumping force level are adjusted in real time, and the pumping frequency and / or pumping force level are operated; The continuous mode is: when the temperature is within different preset ranges, different pump force levels are used for continuous pumping; The hybrid mode is as follows: when the temperature is lower than the second preset threshold value (T1), the electromagnetic pump (22) is in an off state; when the temperature is within the range of the second preset threshold value (T1) and the third preset threshold value (T6), after the electromagnetic pump (22) is turned on, the pumping frequency and / or pumping force level are adjusted in real time based on the current temperature and the temperature difference between the hot air flow channel (14) and the cold air flow channel (15) of the circulation pipe (21), and the electromagnetic pump (22) is operated according to the adjusted pumping frequency and / or pumping force level; when the temperature is higher than the third preset threshold value (T6), the electromagnetic pump (22) is continuously operated at the highest pumping level; The method comprises determining the operating parameters of the hot-end fan (12), the cold-end fan (13), and the electromagnetic pump (22) based on the current temperature of the heating module, and controlling the hot-end fan (12), the cold-end fan (13), and the electromagnetic pump (22) using the determined operating parameters, including: Based on the current temperature of the heating module and the correspondence between the preset temperature and the rotation speed levels of the hot-end fan (12) and the cold-end fan (13), a target rotation speed level corresponding to the current temperature is determined; the hot-end fan (12) and the cold-end fan (13) are controlled to operate according to the target rotation speed level, and the electromagnetic pump (22) is controlled to operate according to the electromagnetic pump operation mode.

36. The control method according to claim 35, characterized in that: The pump force level is obtained during the experimental phase using the following test steps: A single travel distance L of the heat transfer medium flowing in the circulation pipe is set; the single travel distance L is: the travel distance of the heat transfer medium flowing through a hot air flow channel (14) or a cold air flow channel (15) in the circulation pipe (21); The electromagnetic pump (22) is tested for pumping conditions of different numbers of single stroke distances L, and different amounts of electricity required by the electromagnetic pump (22) for pumping different stroke distances are counted, and a corresponding relationship between each pump force level, the pumping stroke distance, and the required amount of electricity is obtained, so that the pump force level is adjusted based on the amount of electricity required for the pump force level in a variable frequency and variable force intermittent mode; different pumping stroke distances are different odd numbers of single stroke distances L.

37. The control method according to claim 36, characterized in that: The statistical electromagnetic pump (22) calculates different amounts of electricity required for pumping different travel distances, and obtains a corresponding relationship between each pump force level, the pumping travel distance, and the required amount of electricity, including: A constant supply current is used for the electromagnetic pump (22), and levels are divided by the length of the pumping time; wherein different durations of a single pumping correspond to different travel distances of the heat transfer medium being pumped; or, a constant pumping time is used for the electromagnetic pump, and levels are divided by the magnitude of the supply current; wherein different magnitudes of the supply current provided to the electromagnetic pump correspond to different travel distances of the liquid metal medium being pumped; The different amounts of electricity consumed for different travel distances are calculated, and the corresponding relationship between each pump force level, pumping travel distance, and required electricity is obtained.

38. The control method according to claim 36, characterized in that: When the electromagnetic pump (22) is set to the variable frequency variable force intermittent mode or the mixed mode, The method of adjusting the pumping frequency parameter and / or the pumping force level parameter in real time based on the current temperature and the temperature difference between the hot air flow channel (14) and the cold air flow channel (15) of the circulation pipe (21), and operating according to the adjusted pumping frequency and / or pumping force level, comprises: The temperature difference between the hot air flow channel (14) and the cold air flow channel (15) is obtained in real time by two second temperature sensors arranged inside or outside the circulation pipe (21); When the temperature difference is greater than a preset difference threshold, controlling the electromagnetic pump (22) to pump according to the current pump force level; The current pump force level is determined in real time based on the corresponding relationship between the current temperature and a preset temperature range and the pump force level.

39. The control method according to claim 38, characterized in that: The method further comprises adjusting the pumping frequency parameter and / or the pumping force level parameter in real time based on the current temperature and the temperature difference between the hot air flow channel (14) and the cold air flow channel (15) of the circulation pipe (21), and operating according to the adjusted pumping frequency and / or pumping force level. Real-time statistics of pumping time intervals; When the time interval is greater than the preset time interval threshold, pumping is performed once according to the current pump force level.

40. The control method according to claim 38, characterized in that: The current pump force level is determined in real time using the following steps: Determining a first candidate pump force level corresponding to the current temperature according to a correspondence between the current temperature and a preset temperature range and the pump force level; Obtaining the current remaining power of the capacitor that supplies power to the electromagnetic pump (22); Compare the current remaining power with the power required for each pumping power level, and use the maximum or second-largest pumping power level that can be supported by the current remaining power as the second candidate pumping power level; The lower one of the first candidate pump force level and the second candidate pump force level is used as the current pump force level.

41. The control method according to claim 35, characterized in that: The method of obtaining the current temperature of the heating module in the heat dissipation chassis (100) in real time by means of a first temperature sensor arranged in the circuit board accommodating cavity (110) is performed after the heat dissipation chassis is powered on; wherein, When the electromagnetic pump (22) is set to the fixed-frequency, fixed-force intermittent mode, when the heat dissipation chassis (100) is turned on, the hot-end fan (12) and the cold-end fan (13) operate at a preset initial speed level, and the electromagnetic pump (22) is in a closed state; When the electromagnetic pump (22) is set to the variable frequency variable force intermittent mode, when the heat dissipation chassis (100) is turned on, the hot end fan (12) and the cold end fan (13) operate at a preset initial speed level, and the electromagnetic pump (22) is in a closed state; When the electromagnetic pump (22) is set to the continuous mode, when the heat dissipation chassis (100) is turned on, the hot end fan (12) and the cold end fan (13) operate at a preset initial speed level, and the electromagnetic pump (22) operates at a preset initial pump force level; When the electromagnetic pump (22) is set to the hybrid mode, when the heat dissipation chassis (100) is turned on, the hot end fan (12) and the cold end fan (13) operate at preset initial speed level parameters, and the electromagnetic pump (22) is in a closed state.

42. The control method according to claim 34, characterized in that: The preset control mode also includes: a pure fan control mode and a pure electromagnetic pump control mode; The heat dissipation chassis is configured to perform temperature control in a power-on state and / or a sleep state using a pure fan control mode or a pure electromagnetic pump control mode.

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