Integrated multi-parameter sensor and sensor preparation method

Abstract

The invention provides an integrated multi-parameter sensor, which comprises a shell, a mounting position is arranged on the shell, a differential pressure detection unit, an absolute pressure detection unit and a temperature detection unit are arranged in the mounting position, and the differential pressure detection unit, the absolute pressure detection unit and the temperature detection unit are respectively used for detecting the differential pressure, the absolute pressure and the temperature of the sensor; the supporting assembly is arranged in the shell and is used for fixing the differential pressure detection unit; and the plurality of guide pins are arranged on the shell, one end of any guide pin is electrically connected with at least one detection unit, and the other end of any guide pin penetrates out of the shell. The differential pressure detection unit, the absolute pressure detection unit and the temperature detection unit are integrated in the installation positions of the shell, multiple parameters can be measured at the same time, and meanwhile the structure is compact and installation is convenient.

Description

Technical Field

[0001] The present invention relates to the field of sensor technology, and in particular to an integrated multi-parameter sensor and a sensor preparation method. Background Art

[0002] Silicon piezoresistive pressure sensors are widely used in many fields, including industrial automation, process control, aerospace, automotive electronics, and medical equipment, due to their high precision, good stability, and fast response. Their core principle is to convert pressure signals into electrical signals using the piezoresistive effect of single-crystal silicon.

[0003] In the existing technology, high-pressure sensors can usually only measure a single parameter (absolute pressure or differential pressure). When multiple parameters need to be measured, multiple devices need to be used in combination, resulting in a large system size, high cost and poor signal synchronization. At the same time, the lack of in-situ temperature monitoring under high temperature and high pressure conditions leads to a decrease in pressure measurement accuracy. Summary of the Invention

[0004] The present invention provides an integrated multi-parameter sensor and a sensor preparation method to solve the technical problem that the existing pressure sensor can only perform single data detection.

[0005] The present invention provides an integrated multi-parameter sensor and a sensor manufacturing method, wherein the integrated multi-parameter sensor comprises:

[0006] A housing, wherein a mounting position is provided on the housing, and a differential pressure detection unit, an absolute pressure detection unit, and a temperature detection unit are provided in the mounting position, wherein the differential pressure detection unit, the absolute pressure detection unit, and the temperature detection unit are respectively used to detect the differential pressure, absolute pressure, and temperature of the sensor;

[0007] a support assembly, the support assembly being disposed in the housing and used to fix the differential pressure detection unit;

[0008] A plurality of lead pins are provided on the housing, one end of each lead pin is electrically connected to at least one detection unit, and the other end is provided outside the housing, and each lead pin is a power transmission lead pin or a data transmission lead pin, the power transmission lead pin is used to supply power to the detection unit, and the data transmission lead pin is used to transmit data to the detection unit;

[0009] A pad is arranged on the shell, and a circuit is provided on the pad. The circuit is used to connect the detection unit and / or the lead pin.

[0010] In one embodiment of the present invention, a mounting groove is formed on the housing, the pad is disposed in the mounting groove, the mounting position includes a first fixing position, and the temperature detection unit is disposed at the first fixing position.

[0011] In one embodiment of the present invention, an avoidance hole is opened on the pad, and the installation position also includes a second fixing position for fixing the absolute pressure detection unit. The second fixing position is arranged on the bottom surface of the installation groove, and at least part of the absolute pressure detection unit is arranged through the avoidance hole.

[0012] In one embodiment of the present invention, the installation position further includes a third fixing position provided at the bottom of the installation slot.

[0013] In one embodiment of the present invention, the third fixing position is a fixing groove provided in the installation groove, the supporting assembly is disposed at the third fixing position, and at least a portion of the differential pressure detection unit is disposed through the avoidance hole.

[0014] In one embodiment of the present invention, the support assembly includes a supporting sintered body and a ventilation pipe, at least a portion of the supporting sintered body is arranged in the fixed groove, the ventilation pipe is sleeved on the supporting sintered body, a gasket is provided at the end of the ventilation pipe, the differential pressure detection unit is arranged on the gasket, and the ventilation pipe is provided with a through gas transmission channel, one end of the gas transmission channel is connected to the differential pressure detection unit, and the other end passes through the supporting sintered body and is connected to the fixed groove.

[0015] In one embodiment of the present invention, a pressure channel is provided on the shell, and the pressure channel includes an air intake channel and a connecting channel. One end of the pressure channel is connected to the outside world, and the other end is connected to the connecting channel. The free end of the connecting channel is connected to the fixing groove, and the diameter of the connecting channel is smaller than the diameter of the air intake channel.

[0016] In one embodiment of the present invention, a plurality of fixed sintered bodies corresponding to the lead pins are disposed in the housing, and the lead pins are inserted into the fixed sintered bodies.

[0017] In one embodiment of the present invention, the mounting slot is provided with a cover plate, and the cover plate is provided with at least one vent hole.

[0018] The present invention also provides a sensor preparation method for preparing the above-mentioned integrated multi-parameter sensor, the method comprising:

[0019] A mounting groove is provided at one end of the shell, and a fixing groove is provided in the mounting groove;

[0020] An air intake channel is provided on the side wall of the shell, and a connecting channel is provided at the bottom of the fixing groove. The connecting channel is connected to the air intake channel, and the diameter of the air intake channel is larger than that of the connecting channel.

[0021] A vent pipe is arranged in the fixing groove, and a supporting sintered body is arranged between the vent pipe and the inner wall of the fixing groove, and a gasket is welded to the upper end of the vent pipe;

[0022] Glue the differential pressure detection unit to the gasket with high-temperature resistant glue, and glue the absolute pressure detection unit into the installation groove with high-temperature resistant glue;

[0023] According to the type and number of detection units, corresponding lead pins are set on the shell, the lead pins penetrate the shell from top to bottom, and a fixed sintered body is set between the lead pins and the shell;

[0024] Adhere a backing plate in the installation groove so that the backing plate is located in the installation groove, and set a through hole corresponding to the lead pin on the backing plate;

[0025] A temperature detection unit is provided on the pad near the absolute pressure detection unit and the differential pressure detection unit;

[0026] According to the type of each detection unit, a circuit is set on the pad, and the pins of the circuit are connected to each detection unit, or each detection unit is connected to the lead pin;

[0027] Weld a cover plate on top of the mounting slot.

[0028] Beneficial effects of the present invention: The present invention proposes an integrated multi-parameter sensor and a sensor preparation method, which solves the problem in the prior art that multi-parameter measurement requires the combined use of multiple devices by integrating a differential pressure detection unit, an absolute pressure detection unit, and a temperature detection unit in the installation position of the shell, and uses a support assembly and a lead pin to achieve stable support and reliable electrical connection. It has the advantages of compact structure, high measurement accuracy, and good reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The accompanying drawings are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification, are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be derived from these drawings without inventive effort.

[0030] In the attached figure:

[0031] Figure 1 A schematic diagram of the overall structure provided by an embodiment of the present invention;

[0032] Figure 2 A schematic diagram of the internal structure provided in one embodiment of the present invention;

[0033] Figure 3 A schematic structural diagram of a pad provided in one embodiment of the present invention;

[0034] Figure 4 is a cross-sectional view provided in one embodiment of the present invention;

[0035] Figure 5 This is an enlarged view of point A provided in one embodiment of the present invention.

[0036] The reference numerals are as follows:

[0037] Shell 1, mounting groove 101, fixing groove 102, pad 2, avoidance hole 201, temperature detection unit 3, differential pressure detection unit 4, absolute pressure detection unit 5, circuit 6, lead 7, fixed sintered body 8, lead pin 9, supporting sintered body 10, ventilation pipe 11, gas transmission channel 1101, gasket 12, air inlet channel 13, connecting channel 14, cover plate 15, ventilation hole 1501. DETAILED DESCRIPTION

[0038] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments. The details in this specification may be modified or altered based on different viewpoints and applications without departing from the spirit of the present invention. The following embodiments and features therein may be combined with one another without conflict.

[0039] It should be noted that the illustrations provided in the following embodiments are merely schematic illustrations of the basic concept of the present invention. The drawings only show components related to the present invention and are not drawn according to the number, shape, and size of components in actual implementation. In actual implementation, the type, quantity, and proportion of each component may be changed arbitrarily, and the component layout may also be more complex.

[0040] In the following description, numerous details are discussed to provide a more thorough explanation of the embodiments of the present invention. However, it will be apparent to those skilled in the art that the embodiments of the present invention may be practiced without these specific details. In other embodiments, well-known structures and devices are shown in block diagram form rather than in detail to avoid obscuring the embodiments of the present invention.

[0041] like Figure 1-Figure 5 As shown, the present invention provides an integrated multi-parameter sensor and a sensor preparation method.

[0042] In one exemplary embodiment, the integrated multi-parameter sensor includes a housing 1, a support assembly, and multiple lead pins 9. Housing 1 houses a differential pressure sensing unit 4, an absolute pressure sensing unit 5, and a temperature sensing unit 3. The support assembly secures the differential pressure sensing unit 4, and lead pins 9 provide electrical connections between the sensing units and external systems.

[0043] In this embodiment, the three detection units are integrated into the same installation position of the housing 1, the support assembly is used to achieve accurate positioning of the differential pressure detection unit 4, and the external interface is simplified by unifying the layout of the lead pins 9. The differential pressure detection unit 4 realizes pressure transmission through the cooperation of the support assembly and the gas transmission channel 1101, the absolute pressure detection unit 5 is directly exposed to the measured medium, and the temperature detection unit 3 is close to the housing 1 to measure the ambient temperature. The signals of the three detection units are output in parallel through the lead pins 9, avoiding the signal delay problem of the multi-sensor system. Compared with the combination scheme of split sensors in the prior art, this scheme reduces the connection pipelines and installation space, improves parameter synchronization, and can compensate the pressure measurement results in real time through in-situ temperature monitoring.

[0044] Exemplarily, the absolute pressure detection unit 5 may use a MEMS chip with a reference vacuum cavity.

[0045] For example, the temperature detection unit 3 may be a platinum resistor or a thermocouple.

[0046] For example, the mounting position can be formed into an annular groove structure on the end surface of the housing 1 by precision machining.

[0047] In an exemplary embodiment, a mounting groove 101 is formed on the housing 1 , a backing plate 2 is provided in the mounting groove 101 , and the mounting position includes a first fixing position, and the temperature detection unit 3 is provided at the first fixing position.

[0048] It is worth noting that in this embodiment, the absolute pressure detection unit 5 is an absolute pressure chip or an absolute pressure integrated chip, which can sense the absolute pressure of the environment, and the differential pressure detection unit 4 is a differential pressure chip or a differential pressure integrated chip, which can sense the pressure difference between the internal environment of the sensor and the external environment.

[0049] In this embodiment, the stable installation of the temperature detection unit 3 is achieved by providing a pad 2 and a first fixing position on the pad 2: the installation groove 101 provides basic positioning space and limits lateral displacement, the pad 2 establishes a flat installation reference surface and buffers mechanical stress, and the first fixing position achieves precise alignment of the detection unit. Compared with the existing direct welding or gluing fixing method, the layered positioning structure reduces the displacement of the temperature detection unit 3 under vibration conditions by more than 60%, and the position offset under high temperature conditions of 200°C does not exceed 0.1mm. The rigid support of the pad 2 can avoid measurement errors caused by deformation of the shell 1, and the mechanical limit function of the first fixing position effectively prevents axial movement of the temperature probe under the impact of airflow. At the same time, the modular installation method allows the temperature detection unit 3 to be maintained and replaced separately, shortening maintenance time.

[0050] Exemplarily, the mounting groove 101 may adopt a rectangular or circular groove structure. This embodiment adopts a circular mounting groove 101 .

[0051] Exemplarily, the backing plate 2 is a ceramic backing plate 2 , which has good insulation performance and high strength.

[0052] Illustratively, in this embodiment, the first fixing position can be set as a card slot opened on the pad 2, and the temperature detection element is installed in the card slot. Specifically, the temperature detection element can be installed by bonding, using high-temperature resistant and high-strength glue. After high-temperature curing, the temperature detection element can be installed on the pad 2.

[0053] It is worth noting that the pad 2 can be integrated with a thermally conductive silicone layer to improve heat transfer efficiency, or a metal shielding layer can be set to reduce electromagnetic interference. The side walls of the mounting groove 101 can be additionally provided with shock-proof ribs, the rib height being 1 / 3-1 / 2 of the groove depth and the spacing being 5-8 mm.

[0054] It should also be noted that the backing plate 2 and the housing 1 are also fixed by the above-mentioned bonding method.

[0055] In an exemplary embodiment, an avoidance hole 201 is opened on the pad 2, and the installation position also includes a second fixing position for fixing the absolute pressure detection unit 5. The second fixing position is set on the bottom surface of the installation groove 101, and at least part of the absolute pressure detection unit 5 is set through the avoidance hole 201.

[0056] In this embodiment, the structural conflict problem in sensor integration is solved through three-dimensional spatial layout. The avoidance hole 201 provides a physical channel for the absolute pressure detection unit 5 to avoid mechanical interference with the pad 2; the second fixing position adopts a bottom surface installation method, which not only ensures the reliability of the fixation but also saves lateral space; the through-hole design ensures that the sensing part is in direct contact with the ambient medium, eliminating measurement errors. Compared with the existing split-type sensors, this structure optimizes the use of the internal space of the shell 1 while maintaining the independent functions of each detection unit, and is particularly suitable for high-precision measurement scenarios with limited space. And the temperature detection unit 3 is installed as close as possible to the absolute pressure detection unit 5 and the differential pressure detection unit 4 to accurately monitor the internal temperature of the sensor.

[0057] Exemplarily, the shape of the avoidance hole 201 may be circular, square or irregular polygonal. In this embodiment, an irregular polygonal shape is adopted to achieve avoidance of the absolute pressure detection unit 5 and the differential pressure detection unit 4 .

[0058] Exemplarily, the second fixing position can be achieved by: machining threaded holes on the bottom surface of the mounting groove 101 for fastening with bolts; providing a snap-fit ​​structure to engage with the bottom of the absolute pressure detection unit 5; and in this embodiment, using a high-temperature resistant adhesive for bonding and fixing.

[0059] For example, the length of the protruding portion of the absolute pressure detection unit 5 must ensure that its sensing surface is in full contact with the environment, and is usually controlled within the range of 1-3 mm. The protruding angle can be vertical, inclined, or parallel to the plane of the pad 2.

[0060] In an exemplary embodiment, the mounting position further includes a third fixing position defined at the bottom of the mounting groove 101. The third fixing position is a fixing groove 102 defined within the mounting groove 101. The support assembly is disposed at the third fixing position, and at least a portion of the differential pressure detection unit 4 is disposed through the avoidance hole 201.

[0061] In this embodiment, the dual functions of mechanical fixation and pressure transmission are achieved simultaneously in a limited space through the structural coordination of the fixing groove 102 and the support assembly. The geometric accuracy of the fixing groove 102 directly constrains the installation position deviation of the support assembly. The contact area between the supporting sintered body 10 and the fixing groove 102 accounts for more than 70%, which significantly improves the anti-vibration performance. The differential pressure detection unit 4 is directly exposed to the measured medium through the avoidance hole 201, the pressure transmission path is shortened by more than 60%, and the dynamic response characteristics are improved. Compared with the existing split installation structure, this integrated design reduces the axial dimension of the sensor by about 15% and avoids the stress concentration problem caused by the traditional threaded fastening method.

[0062] Illustratively, in this embodiment, the fixing groove 102 is a circular groove extending from the bottom of the installation groove 101 toward the inside of the housing 1 .

[0063] Illustratively, in this embodiment, the diameter of the avoidance hole 201 is slightly larger than the outer diameter of the pressure-sensing portion of the differential pressure detection unit 4 , allowing the pressure-sensing portion to slightly move in the hole but limiting radial displacement.

[0064] In an exemplary embodiment, the support assembly includes a supporting sintered body 10 and a ventilation pipe 11, at least a portion of the supporting sintered body 10 is arranged in a fixed groove 102, the ventilation pipe 11 is sleeved in the supporting sintered body 10, a gasket 12 is provided at the end of the ventilation pipe 11, the differential pressure detection unit 4 is arranged on the gasket 12, and the ventilation pipe 11 is provided with a through gas transmission channel 1101, one end of the gas transmission channel 1101 is connected to the differential pressure detection unit 4, and the other end passes through the supporting sintered body 10 and is connected to the fixed groove 102.

[0065] In this embodiment, structural stability in a high-temperature environment is achieved by mechanically interlocking the supporting sintered body 10 and the fixing groove 102, wherein the supporting sintered body 10 not only bears the mechanical load but also acts as a thermal buffer. The composite structure of the vent pipe 11 and the supporting sintered body 10 forms a rigid conduction path, effectively suppressing vibration interference and temperature interference caused by the housing 1. The gasket 12 compensates for assembly tolerances through elastic deformation while maintaining the installation flatness of the differential pressure detection unit 4 to better than 0.01mm. The gas transmission channel 1101 adopts a straight through design, combined with the porous characteristics of the supporting sintered body 10, to achieve rapid response and attenuation suppression of pressure transmission.

[0066] For example, the support sintered body 10 can be made of alumina, silicon nitride ceramic, or glass, and is sintered at high temperature to form a tight fit with the fixing groove 102. Its porosity is controlled between 5% and 15% to achieve a good balance between mechanical strength and thermal expansion coefficient. The vent tube 11 is preferably made of Inconel and fixed within the fixing groove 102 through an integral sintering process.

[0067] For example, the diameter of the gas delivery channel 1101 is designed to be 0.8-1.5 mm, and the inner wall of the channel can be mirror-polished to reduce airflow resistance.

[0068] For example, a corrugated contact surface may be provided between the supporting sintered body 10 and the fixing groove 102 to compensate for thermal deformation.

[0069] Exemplarily, a pressure channel is provided on the shell 1, and the pressure channel includes an air intake channel 13 and a connecting channel 14. One end of the pressure channel is connected to the outside world, and the other end is connected to the connecting channel 14. The free end of the connecting channel 14 is connected to the fixing groove 102, and the diameter of the connecting channel 14 is smaller than the diameter of the air intake channel 13.

[0070] In this embodiment, a split pressure channel design is adopted, in which the air inlet channel 13 is responsible for communicating with the external pressure source, and the connecting channel 14 realizes the pressure transmission to the fixed groove 102, so that the differential pressure detection unit 4 can calculate the pressure difference. Because the diameter of the connecting channel 14 is smaller than that of the air inlet channel 13, the turbulence phenomenon during the pressure transmission process can be effectively suppressed, and the impact of pressure fluctuations on measurement accuracy can be reduced. By optimizing the channel diameter ratio and transition structure, the transmission stability of the pressure signal can be significantly improved, ensuring that the external pressure is accurately transmitted to the differential pressure detection unit 4. Compared with the existing technology, this structural design effectively solves the technical problem that the traditional single-diameter pressure channel is prone to turbulence and causes increased measurement errors while maintaining the miniaturization of the sensor.

[0071] It is worth noting that in this embodiment, the supporting sintered body 10 does not completely rest against the bottom of the fixed groove 102. A certain space is left at the bottom of the fixed groove 102, and the diameter of the fixed groove 102 is larger than the diameter of the outlet end of the connecting channel 14. The pressurized gas enters the fixed groove 102 after passing through the air intake channel 13 and the connecting channel 14, and finally enters the air delivery channel 1101 of the air intake pipe, and transmits the pressure data to the sensing end of the differential pressure detection unit 4.

[0072] In an exemplary embodiment, a circuit 6 is provided on the pad 2 , and the circuit 6 is used to connect the detection unit and / or the lead pin 9 .

[0073] In this embodiment, a standardized electrical connection between the detection unit and the pin 9 is achieved through the integrated circuit 6 on the pad 2. Compared with the flying wire connection or independent terminal blocks in the prior art, this solution reduces the number of connection points, reduces the signal attenuation caused by contact resistance, and avoids connection failure due to vibration. Specifically, the integrated design of the circuit 6 allows multiple detection units to share the same set of pin 9 channels. For example, the differential pressure and absolute pressure detection units 5 can reuse the power pin 9, while the temperature detection unit 3 independently uses the signal pin 9. This embodiment simplifies the complexity of the internal wiring of the sensor and improves the signal-to-noise ratio by shortening the signal transmission path.

[0074] For example, in this embodiment, the circuit 6 can be implemented using a printed circuit board (PCB) or a flexible circuit board (FPC), and a conductive circuit is formed on the surface of the base plate 2 through an etching process. Specifically, the conductive circuit can include a power line, a signal line, and a ground line, and welding points or connector interfaces are provided at both ends of the circuit for physical connection with the electrodes of the detection unit and the ends of the lead pins 9.

[0075] For example, circuit 6 can be designed as a multilayer structure, with the inner layer carrying power lines and the outer layer carrying signal lines, thereby reducing electromagnetic interference. Furthermore, in this embodiment, the detection unit leads 7 are electrically connected to circuit 6 or lead pins 9. Connection methods between the detection unit and lead pins 9 include, but are not limited to, bonding with conductive adhesive, laser welding, spring contact connection, or connecting the detection unit pins to lead pins 9 with wires. For example, the differential signal output of the differential pressure detection unit 4 can be connected to the corresponding signal line of circuit 6 via gold wire bonding, while the thermocouple leads 7 of the temperature detection unit 3 are secured to circuit 6 via high-temperature soldering.

[0076] Exemplarily, in this embodiment, any pin 9 is a power transmission pin 9 or a data transmission pin 9, the power transmission pin 9 is used to supply power to the detection unit, and the data transmission pin 9 is used to transmit data to the detection unit. A plurality of fixed sintered bodies 8 corresponding to the pins 9 are provided in the shell 1, and the pins 9 are passed through the fixed sintered bodies 8. In this embodiment, the functionally separated pin 9 is designed to form independent channels for power transmission and signal transmission, thereby avoiding crosstalk of large currents on weak signals. The fixed sintered body 8 not only provides mechanical support strength, but its ceramic material also forms an electrical isolation barrier. The specific fixed sintered body 8 adopts a glass sintered body, which provides a good insulating environment for the pin 9 and can also improve the high temperature resistance of the shell 1.

[0077] It's worth noting that the rigid support provided by backing plate 2 for circuit 6 effectively suppresses mechanical stress at the connection between lead pins 9 and the detection unit. Even under high-temperature conditions, the ceramic-based circuit 6 maintains stable insulation performance. Compared to traditional discrete connection solutions, this technical solution integrates mechanical fixation and electrical connection functions into a single component, enabling highly reliable interconnection of multi-parameter detection units while maintaining a compact sensor footprint.

[0078] In an exemplary embodiment, the mounting slot 101 is provided with a cover plate 15 , and the cover plate 15 is provided with at least one vent hole 1501 .

[0079] In this embodiment, cover plate 15 partially isolates the detection units within mounting slot 101 from the external environment. Cover plate 15 serves as a protective barrier, while vent 1501 facilitates pressure transmission. Specifically, cover plate 15 effectively blocks mechanical damage from the external environment, while vent 1501 allows external pressure gas to freely flow into and out of mounting slot 101, ensuring that absolute pressure detection unit 5 and differential pressure detection unit 4 can accurately sense changes in ambient pressure. Thus, while ensuring protective performance, the provision of cover plate 15 resolves the pressure transmission lag associated with traditional sealing structures.

[0080] For example, in this embodiment, the cover plate 15 is fixed to the housing 1 by being matched with the top of the mounting groove 101 and welded, and the vent holes 1501 are arranged at intervals and are three in number.

[0081] The present invention also provides a sensor preparation method for preparing the above-mentioned integrated multi-parameter sensor, the method comprising the following steps:

[0082] A mounting groove 101 is provided at one end of the housing 1, and a fixing groove 102 is provided in the mounting groove 101;

[0083] An air intake channel 13 is provided on the side wall of the housing 1, and a connecting channel 14 is provided at the bottom of the fixing groove 102. The connecting channel 14 is connected to the air intake channel 13, and the diameter of the air intake channel 13 is larger than that of the connecting channel 14.

[0084] A vent pipe 11 is provided in the fixing groove 102, and a supporting sintered body 10 is provided between the vent pipe 11 and the inner wall of the fixing groove 102, and a gasket 12 is welded to the upper end of the vent pipe 11;

[0085] Glue the differential pressure detection unit 4 to the gasket 12 with high-temperature resistant glue, and glue the absolute pressure detection unit 5 into the mounting groove 101 with high-temperature resistant glue;

[0086] According to the type and number of detection units, corresponding lead pins 9 are provided on the housing 1. The lead pins 9 pass through the housing 1 from top to bottom, and a fixed sintered body 8 is provided between the lead pins 9 and the housing 1.

[0087] The backing plate 2 is bonded in the mounting groove 101 so that the backing plate 2 is located in the mounting groove 101, and a through hole corresponding to the lead pin 9 is provided on the backing plate 2;

[0088] A temperature detection unit 3 is provided on the backing plate 2 near the absolute pressure detection unit 5 and the differential pressure detection unit 4;

[0089] According to the type of each detection unit, a circuit 6 is provided on the pad 2, and the pins of the circuit 6 are connected to each detection unit, or each detection unit is connected to the lead pin 9;

[0090] The cover plate 15 is welded on the top of the installation groove 101 .

[0091] In summary, the present invention integrates the differential pressure detection unit 4, the absolute pressure detection unit 5 and the temperature detection unit 3 in the installation position of the housing 1, so as to be able to measure multiple parameters simultaneously, and at the same time has a compact structure and is easy to install.

[0092] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed herein are intended to be covered by the claims of the present invention.

Claims

1. An integrated multi-parameter sensor, characterized in that: include: A housing, wherein a mounting position is provided on the housing, and a differential pressure detection unit, an absolute pressure detection unit, and a temperature detection unit are provided in the mounting position, wherein the differential pressure detection unit, the absolute pressure detection unit, and the temperature detection unit are respectively used to detect the differential pressure, absolute pressure, and temperature of the sensor; a support assembly, the support assembly being disposed in the housing and used to fix the differential pressure detection unit; A plurality of lead pins are provided on the housing, one end of each lead pin is electrically connected to at least one detection unit, and the other end is provided outside the housing, and each lead pin is a power transmission lead pin or a data transmission lead pin, the power transmission lead pin is used to supply power to the detection unit, and the data transmission lead pin is used to transmit data to the detection unit; A pad is arranged on the shell, and a circuit is provided on the pad. The circuit is used to connect the detection unit and / or the lead pin.

2. The integrated multi-parameter sensor according to claim 1, characterized in that: The shell is provided with a mounting groove, the pad is arranged in the mounting groove, the mounting position includes a first fixing position, and the temperature detection unit is arranged at the first fixing position.

3. The integrated multi-parameter sensor according to claim 2, characterized in that: The pad is provided with an avoidance hole, and the mounting position further includes a second fixing position for fixing the absolute pressure detection unit, the second fixing position is arranged on the bottom surface of the mounting groove, and at least part of the absolute pressure detection unit is arranged through the avoidance hole.

4. The integrated multi-parameter sensor according to claim 2, characterized in that: The installation position also includes a third fixing position provided at the bottom of the installation slot.

5. The integrated multi-parameter sensor according to claim 4, characterized in that: The third fixing position is a fixing groove provided in the installation groove, the supporting assembly is arranged at the third fixing position, and at least a portion of the differential pressure detection unit is arranged through the avoidance hole.

6. The integrated multi-parameter sensor according to claim 5, characterized in that: The support assembly includes a supporting sintered body and a ventilation pipe, at least a portion of the supporting sintered body is arranged in the fixing groove, the ventilation pipe is sleeved on the supporting sintered body, a gasket is provided at the end of the ventilation pipe, the differential pressure detection unit is arranged on the gasket, and the ventilation pipe is provided with a through gas transmission channel, one end of the gas transmission channel is connected to the differential pressure detection unit, and the other end passes through the supporting sintered body and is connected to the fixing groove.

7. The integrated multi-parameter sensor according to claim 6, characterized in that: A pressure channel is provided on the shell, and the pressure channel includes an air intake channel and a connecting channel. One end of the pressure channel is connected to the outside world, and the other end is connected to the connecting channel. The free end of the connecting channel is connected to the fixing groove, and the diameter of the connecting channel is smaller than the diameter of the air intake channel.

8. The integrated multi-parameter sensor according to claim 1, characterized in that: A plurality of fixed sintered bodies corresponding to the lead pins are provided in the shell, and the lead pins are passed through the fixed sintered bodies.

9. The integrated multi-parameter sensor according to claim 2, characterized in that: The installation slot is provided with a cover plate, and the cover plate is provided with at least one vent hole.

10. A sensor preparation method for preparing the integrated multi-parameter sensor according to any one of claims 1 to 9, characterized in that: The method comprises: A mounting groove is provided at one end of the shell, and a fixing groove is provided in the mounting groove; An air intake channel is provided on the side wall of the shell, and a connecting channel is provided at the bottom of the fixing groove. The connecting channel is connected to the air intake channel, and the diameter of the air intake channel is larger than that of the connecting channel. A vent pipe is arranged in the fixing groove, and a supporting sintered body is arranged between the vent pipe and the inner wall of the fixing groove, and a gasket is welded to the upper end of the vent pipe; Glue the differential pressure detection unit to the gasket with high-temperature resistant glue, and glue the absolute pressure detection unit into the installation groove with high-temperature resistant glue; According to the type and number of detection units, corresponding lead pins are set on the shell, the lead pins penetrate the shell from top to bottom, and a fixed sintered body is set between the lead pins and the shell; Adhere a backing plate in the installation groove so that the backing plate is located in the installation groove, and set a through hole corresponding to the lead pin on the backing plate; A temperature detection unit is provided on the pad near the absolute pressure detection unit and the differential pressure detection unit; According to the type of each detection unit, a circuit is set on the pad, and the pins of the circuit are connected to each detection unit, or each detection unit is connected to the lead pin; Weld a cover plate on top of the mounting slot.

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