Conductive silver paste, chip polymer laminated aluminum capacitor and preparation method thereof

CN120727337BActive Publication Date: 2026-08-28SHENZHEN CAPCHEM TECH CO LTD
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Patent Information

Application Number
CN202410378520.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-03-29
Publication Date
2026-08-28
Estimated Expiration
2044-03-29

AI Technical Summary

Technical Problem

[0005]针对现有导电银浆存在粘接力不足和电阻率偏高的问题，本发明提供了一种导电银浆、片式聚合物叠层铝电容器及其制备方法

Benefits of technology

[0016]根据本发明提供的导电银浆，采用丙烯酸改性环氧树脂作为导电银浆中的主体树脂，其中，发明人通过大量试验发现，在所述导电银浆中，通过控制其中游离丙烯酰氧基的质量百分含量处于1%~10%时，固化后的导电银浆具有更高的粘接强度和更低的电阻率，推测是由于游离丙烯酰氧基来自于所述丙烯酸改性环氧树脂中未完全反应的丙烯酸单体，对导电银浆起到活性稀释剂的作用，在固化阶段，当通过一定量的丙烯酰氧基和环氧以及羟基的相互反应，形成互穿网络聚合物，提高与银粉的相容性，可以有效防止银粉沉降，降低导电银浆的电阻率，同时也提高了导电银浆的粘接强度和固化后的耐高温性能。

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Abstract

In order to overcome the problems of insufficient adhesion and high resistivity of the existing conductive silver paste, the application provides a conductive silver paste, which comprises silver powder, a first solvent and acrylic modified epoxy resin, and the mass content of free acryloyloxy in the acrylic modified epoxy resin is 1-10%. Meanwhile, the application also discloses a preparation method of the conductive silver paste and a chip polymer laminated aluminum capacitor comprising the conductive silver paste. The conductive silver paste provided by the application has low resistivity, high adhesion strength and high temperature resistance.
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Citation Information

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