PCB thick plate drill dirt removing device

Abstract

The application provides a PCB thick plate drill dirt removing device and relates to the technical field of PCBs.The device comprises a supporting mechanism, a dirt removing mechanism arranged on the side of the supporting mechanism, an upper connecting box arranged above the supporting mechanism in a liftable manner, a lower connecting box arranged below the supporting mechanism in a liftable manner, a plurality of dirt removing components arranged on the bottom of the upper connecting box and the top of the lower connecting box, the positions of the plurality of dirt removing components on the bottom of the upper connecting box and the top of the lower connecting box corresponding to the positions of holes on the PCB thick plate, the dirt removing components comprising dirt removing pipes in communication with the corresponding upper connecting box or lower connecting box, dirt removing heads arranged at the ends of the dirt removing pipes and in contact with the PCB thick plate, cavities arranged inside the dirt removing heads and penetrating through the dirt removing heads, a first circulating pipeline and a second circulating pipeline in communication between the upper connecting box and the lower connecting box, swelling agents circulating in the first circulating pipeline, and oxidizing agents circulating in the second circulating pipeline.The application greatly reduces the amount of agents and improves the drill dirt removing efficiency.

Description

Technical Field

[0001] This invention relates to the field of PCB board technology, and more specifically to a device for removing drilling debris from thick PCB boards. Background Technology

[0002] Currently, PCB manufacturing processes include inner layer fabrication, lamination, drilling, and hole metallization. After drilling, drill slag remains inside the holes and needs to be removed. Due to localized temperature increases, the resin inside the holes softens and melts into a paste-like consistency, adhering to the hole walls and becoming residue upon cooling. Currently, the main methods for cleaning drill slag are chemical soaking combined with dynamic spraying. This method suffers from the problem of large chemical usage, and for thicker PCBs, the removal efficiency of residue from the hole walls through soaking is low due to the larger hole diameters and depths. Summary of the Invention

[0003] The purpose of this invention is to develop a PCB thick board desmearing device that significantly reduces reagent usage and improves desmearing removal efficiency.

[0004] This invention is achieved through the following technical solution:

[0005] A device for removing drilling debris from thick PCB boards, comprising:

[0006] Support mechanism, to support and fix the thick PCB board;

[0007] The decontamination mechanism, located on the side of the support mechanism, includes:

[0008] The upper header is vertically mounted above the support mechanism;

[0009] The lower junction box is vertically mounted below the support mechanism;

[0010] Multiple cleaning components are located at the bottom of the upper header and the top of the lower header;

[0011] The positions of multiple cleaning components at the bottom of the upper header and the top of the lower header correspond to the positions of the holes on the PCB thick plate. Each cleaning component includes a cleaning pipe that communicates with the corresponding upper or lower header. The end of the cleaning pipe is provided with a cleaning head that contacts the PCB thick plate. The cleaning head has a through cavity inside.

[0012] The upper and lower headers are connected by a first circulation pipeline and a second circulation pipeline. The first circulation pipeline contains a swelling agent, and the second circulation pipeline contains an oxidizing agent.

[0013] Optionally, the cavity of the cleaning head is bullet-shaped, and the cavity gradually increases in the direction away from the cleaning tube, and the inner diameter of the opening end of the cleaning head is larger than the inner diameter of the corresponding hole.

[0014] Optionally, the outer edge of the cleaning head opening is provided with a sealing ring that contacts the PCB thick plate.

[0015] Optionally, both the first and second circulation pipelines are equipped with circulation pumps and filters, and both the first and second circulation pipelines connected to the upper and lower manifolds are equipped with solenoid valves.

[0016] Optionally, the first circulation pipeline is equipped with a swelling agent tank, which contains an organic solvent that causes the resin to expand, and a heater is provided in the swelling agent tank.

[0017] Optionally, the second circulation pipeline is equipped with an oxidizing agent tank, which contains oxides that oxidize and decompose the resin, and a heater is provided in the oxidizing agent tank.

[0018] Optionally, a drain pipe is connected to the lower header, a solenoid valve is installed on the drain pipe, and a waste liquid tank is connected to the drain pipe.

[0019] Optionally, the upper header is connected to a neutralizing agent tank via a pipeline. The neutralizing agent tank contains a neutralizing agent and a heater. A solenoid valve and a delivery pump are installed on the pipeline between the neutralizing agent tank and the upper header.

[0020] Optionally, the upper header is connected to an air inlet pipe and a water inlet pipe, and the air inlet pipe and the water inlet pipe are equipped with solenoid valves. The air inlet pipe is connected to a nitrogen source, and the water inlet pipe is connected to a water source.

[0021] Optionally, the support mechanism includes a vertically arranged enclosure along the edge trajectory of the PCB thick plate, and the inner wall of the enclosure is provided with a horizontally arranged support ring.

[0022] A slider is slidably mounted on the enclosure above the support ring. The slider slides horizontally and is perpendicular to the inner wall of the enclosure at its location. A cylinder for driving the slider is correspondingly mounted on the outer wall of the enclosure. The distance between the bottom of the slider and the support ring is adapted to the thickness of the PCB board. The bottom of the outer end of the slider is an arc-shaped surface.

[0023] The beneficial effects of this invention are:

[0024] This invention targets holes in thick PCB boards. By establishing a closed-loop circulation pipeline with the hole, it achieves precise removal of drilling debris inside the hole, significantly reducing the amount of reagent used. Furthermore, the reagent flows within the hole, avoiding low contact efficiency between the reagent and the hole interior, increasing the contact amount between the reagent and the hole interior, and improving the drilling debris removal efficiency. Due to the large opening of the cleaning head, impurities generated during drilling that fall outside the hole are also cleaned inside the cleaning head. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a structural diagram of the present invention;

[0027] Figure 2 This is a structural diagram of the stain removal component.

[0028] Reference numerals: 1. Enclosure; 2. Slider; 3. Support ring; 4. Upper header; 5. Lower header; 6. Cleaning pipe; 7. Cleaning head; 71. Cavity; 72. Sealing ring; 8. Waste liquid tank; 9. Drain pipe; 10. Neutralizing agent tank; 11. Air inlet pipe; 12. Water inlet pipe; 13. First circulation pipe; 14. Second circulation pipe; 15. Swelling agent tank; 16. Oxidizing agent tank; 17. Filter. Detailed Implementation

[0029] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of the invention. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0030] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0032] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0033] like Figure 1 and Figure 2 As shown, the present invention discloses a PCB thick board descaling device, including a support mechanism and a descaling mechanism. The support mechanism supports and fixes the PCB thick board. The support mechanism includes a vertically arranged enclosure 1 that is arranged along the edge trajectory of the PCB thick board. The inner wall of the enclosure 1 is provided with a horizontally arranged support ring 3.

[0034] A slider 2 is slidably provided on the enclosure 1 above the support ring 3. The slider 2 slides horizontally and is perpendicular to the inner wall of the enclosure 1 at its location. A cylinder is provided on the outer wall of the enclosure 1 to drive the slider 2 to slide.

[0035] The distance between the bottom of slider 2 and support ring 3 is adapted to the thickness of the PCB board, and the bottom of the outer end of slider 2 is an arc-shaped surface. If the PCB board is not fully in contact with support ring 3, the height of the top edge of the PCB board is slightly higher than the bottom height of slider 2. When slider 2 slides out from the side wall of enclosure 1, the arc-shaped surface of the bottom of the outer end of slider 2 first contacts the edge of the PCB board. As slider 2 slides, its arc-shaped surface slides and engages with the PCB board, causing the PCB board to be pushed down onto support ring 3 for positioning. The engagement between the bottom of slider 2 and support ring 3 clamps and fixes the PCB board.

[0036] The cleaning mechanism includes an upper header 4 located above the support ring 3 and a lower header 5 located below the support ring 3. The top of the upper header 4 and the bottom of the lower header 5 are both connected to a drive device (not shown in the figure). The drive device can drive the upper header 4 and the lower header 5 to move up and down.

[0037] Multiple sets of symmetrical cleaning components are provided at the bottom of the upper header 4 and the top of the lower header 5. The positions of the multiple cleaning components correspond to the holes of the PCB thick plate. After the PCB thick plate is fixed on the support mechanism, the upper header 4 and the lower header 5 can be moved to make the cleaning components on the upper and lower sides of the PCB thick plate contact the holes of the PCB thick plate.

[0038] The cleaning assembly includes a cleaning pipe 6 vertically connected to the corresponding upper header 4 or lower header 5, and the cleaning pipe 6 is connected to the corresponding upper header 4 or lower header 5.

[0039] The cleaning tube 6 is connected to a cleaning head 7 at its end. The cleaning head 7 has a cavity 71 that passes through it. The cavity 71 is bullet-shaped and gradually increases in size away from the cleaning tube 6. The inner diameter of the opening end of the cleaning head 7, that is, the inner diameter of the end of the cavity 71 away from the cleaning tube 6, is larger than the inner diameter of the corresponding hole on the PCB thick plate. This ensures that when the cleaning head 7 is aligned with the hole, the hole can be located inside the opening end of the cleaning head 7 within a certain error range.

[0040] A sealing ring 72 is provided on the outer edge of the opening end of the cleaning head 7, and the sealing ring 72 contacts the PCB thick plate outside the hole.

[0041] The upper header 4 and the lower header 5 are connected by a first circulation pipe 13 and a second circulation pipe 14. Both the first circulation pipe 13 and the second circulation pipe 14 are equipped with circulation pumps and filters 17. Solenoid valves are installed on the first circulation pipe 13 and the second circulation pipe 14 at the connection between the upper header 4 and the lower header 5.

[0042] The first circulation pipe 13 is equipped with a swelling agent tank 15, which contains an organic solvent that causes the resin to expand.

[0043] The second circulation pipe 14 is equipped with an oxidizing agent tank 16, which contains oxides that oxidize and decompose the resin.

[0044] The lower header 5 is also connected to a drain pipe 9, which is equipped with a solenoid valve and a waste liquid tank 8.

[0045] The upper header 4 is also connected to a neutralizing agent tank 10 via a pipeline. The neutralizing agent tank 10 contains neutralizing agent. A solenoid valve and a delivery pump are installed on the pipeline between the neutralizing agent tank 10 and the upper header 4.

[0046] The neutralizing agent tank 10, the swelling agent tank 15, and the oxidizing agent tank 16 are all equipped with heaters to control the temperature of the agents.

[0047] The upper header 4 is also connected to an air inlet pipe 11 and a water inlet pipe 12. Solenoid valves are installed on the air inlet pipe 11 and the water inlet pipe 12. The air inlet pipe 11 is connected to a nitrogen source, and the water inlet pipe 12 is connected to a clean water source.

[0048] When removing contaminants from a thick PCB board, the PCB board is placed on a support mechanism, which positions and secures it. Then, the upper header 4 descends and the lower header 5 rises. The cleaning heads 7 of multiple cleaning components at the bottom of the upper header 4 are aligned with the corresponding holes and descend until they contact the top surface of the PCB board. Similarly, the cleaning heads 7 of multiple cleaning components at the top of the lower header 5 are aligned with the corresponding holes and rise until they contact the bottom surface of the PCB board. The holes are enclosed by the corresponding cleaning heads 7 on both the top and bottom sides, and the sealing ring 72 seals against the PCB board.

[0049] When the two solenoid valves of the first circulation pipe 13 are opened and the circulation pump operates, the swelling agent in the swelling agent tank 15 enters the upper header 4 through the first circulation pipe 13. From the upper header 4, it enters the decontamination pipe 6 of multiple decontamination components. The decontamination head 7 at the end of the decontamination pipe 6 enters the orifice. After passing through the orifice, the swelling agent sequentially enters the decontamination head 7 and decontamination pipe 6 of the decontamination component below the orifice, and then collects in the lower header 5. From the lower header 5, it enters the filter 17 on the first circulation pipe 13 and then flows back into the swelling agent tank 15. This circulation process achieves pre-treatment of the orifice by the swelling agent. Before the swelling agent circulates, the heater in the swelling agent tank 15 operates to keep the swelling agent within its operating temperature range. The filter 17 filters out impurities in the swelling agent. The swelling agent circulating in the swelling agent tank 15 can be regenerated or replaced. During regeneration, membrane distillation is used, and then the heavy components are discarded. The distillate is replenished with a certain amount of new agent for reuse.

[0050] After the swelling agent completes the swelling pretreatment of the orifice, the two solenoid valves on the first circulation pipe 13 are closed. Then, the solenoid valve near the upper header 4 on the second circulation pipe 14 is opened, while the solenoid valve near the lower header 5 remains closed. The circulation pump operates, and the solenoid valve on the drain pipe 9 is opened. The oxidizing agent in the oxidizing agent tank 16 enters the upper header 4 through the second circulation pipe 14, and then sequentially enters the cleaning pipes 6 and cleaning heads 7 of multiple cleaning components from the upper header 4 and enters the orifice. Then, it flows from the orifice into the lower cleaning head 7, cleaning pipe 6, and lower header 5, and finally into the waste liquid tank 8 through the drain pipe 9. This allows the initial oxidizing agent to flush the upper header 4, cleaning components, and lower header 5, removing residual swelling agent. The flushing waste liquid is collected by the waste liquid tank 8. After rinsing, the solenoid valve on drain pipe 9 closes, and the solenoid valve on the second circulation pipe 14 near the lower manifold 5 opens, allowing the oxidizing agent to circulate. The oxidizing agent output from the lower manifold 5 flows back into the oxidizing agent tank 16 after passing through filter 17. The oxidizing agent oxidizes and decomposes impurities in the orifice. Before the oxidizing agent circulates, the heater in the oxidizing agent tank 16 operates to keep the oxidizing agent within its operating temperature range. Filter 17 filters out impurities from the oxidizing agent, and the oxidizing agent in the oxidizing agent tank 16 can be regenerated or replaced. The main component of the oxidizing agent is generally potassium permanganate, which can be regenerated through electrolysis.

[0051] After the oxidizing agent completes its circulation and removes residues from the orifice, the two solenoid valves on the second circulation pipe 14 close. Then, the solenoid valve and delivery pump on the pipeline between the neutralizing agent tank 10 and the upper header 4 open, and the solenoid valve on the drain pipe 9 opens. The neutralizing agent in the neutralizing agent tank 10 is fed into the upper header 4, and subsequently into the cleaning pipe 6, cleaning head 7, the orifice, and the cleaning head 7 and cleaning pipe 6 connected to the lower header 5. Finally, it is output from the lower header 5 to the drain pipe 9 and enters the waste liquid tank 8. The neutralizing agent neutralizes the residual oxidizing agent in the orifice. Before the neutralizing agent enters the upper header 4, the heater in the neutralizing agent tank 10 operates to keep the neutralizing agent within its operating temperature range.

[0052] After the neutralizing agent removes residual oxides from the borehole, the solenoid valve and delivery pump between the neutralizing agent tank 10 and the upper header 4 stop. Then, the solenoid valve on the water inlet pipe 12 opens, allowing clean water to flush the upper header 4, the cleaning assembly, and the lower header 5. The flushing water eventually enters the waste liquid tank 8 through the drain pipe 9. After flushing, the solenoid valve on the water inlet pipe 12 closes, and the solenoid valve on the air inlet pipe 11 opens. Dry nitrogen enters the loading / unloading, cleaning assembly, and lower header 5 through the air inlet pipe 11 to assist in cleaning and drying the borehole. After completion, the upper header 4 and lower header 5 drive the cleaning assembly to detach from the PCB board, and then the PCB board is removed.

[0053] This invention targets drilling debris in holes larger than 2mm in diameter on thick PCB boards. By establishing a closed-loop circulation pipeline with the hole, it achieves precise removal of drilling debris, significantly reducing the amount of reagent used. Furthermore, the reagent flows within the hole, avoiding low contact efficiency between the reagent and the hole interior, thus increasing the contact amount between the reagent and the hole interior and improving the drilling debris removal efficiency. Due to the large opening of the cleaning head 7, impurities generated during drilling that fall outside the hole are also cleaned inside the cleaning head 7.

[0054] The above embodiments are merely preferred embodiments of the present invention and are not intended to limit the technical solutions of the present invention. Any technical solution that can be implemented based on the above embodiments without creative effort should be considered to fall within the scope of protection of the patent of the present invention.

Claims

1. A device for removing drilling debris from thick PCB boards, characterized in that, include: Support mechanism, to support and fix the thick PCB board; The decontamination mechanism, located on the side of the support mechanism, includes: The upper header is vertically mounted above the support mechanism; The lower junction box is vertically mounted below the support mechanism; Multiple cleaning components are located at the bottom of the upper header and the top of the lower header; The positions of multiple cleaning components at the bottom of the upper header and the top of the lower header correspond to the positions of the holes on the PCB thick plate. Each cleaning component includes a cleaning pipe that communicates with the corresponding upper or lower header. The end of the cleaning pipe is provided with a cleaning head that contacts the PCB thick plate. The cleaning head has a through cavity inside. The upper and lower headers are connected by a first circulation pipeline and a second circulation pipeline. The first circulation pipeline contains a swelling agent, and the second circulation pipeline contains an oxidizing agent.

2. The PCB thick board descaling device according to claim 1, characterized in that, The cavity of the cleaning head is bullet-shaped, and the cavity gradually increases in the direction away from the cleaning tube. The inner diameter of the opening end of the cleaning head is larger than the inner diameter of the corresponding hole.

3. The PCB thick board descaling device according to claim 2, characterized in that, The outer edge of the opening of the cleaning head is provided with a sealing ring that contacts the PCB thick plate.

4. The PCB thick board descaling device according to claim 1, characterized in that, Both the first and second circulation pipelines are equipped with circulation pumps and filters, and both the first and second circulation pipelines connected to the upper and lower manifolds are equipped with solenoid valves.

5. The PCB thick board descaling device according to claim 4, characterized in that, The first circulation pipeline is equipped with a swelling agent tank, which contains an organic solvent that causes the resin to expand, and a heater is provided inside the swelling agent tank.

6. The PCB thick board descaling device according to claim 4, characterized in that, The second circulation pipeline is equipped with an oxidizing agent tank, which contains oxides that oxidize and decompose the resin, and a heater is also provided in the oxidizing agent tank.

7. The PCB thick board descaling device according to claim 1, characterized in that, The lower manifold is connected to a drain pipe, which is equipped with a solenoid valve and a waste liquid tank.

8. The PCB thick board descaling device according to claim 1, characterized in that, The upper header is connected to a neutralizing agent tank via a pipeline. The neutralizing agent tank contains a neutralizing agent and a heater. A solenoid valve and a delivery pump are installed on the pipeline between the neutralizing agent tank and the upper header.

9. The PCB thick board descaling device according to claim 1, characterized in that, The upper header is connected to an air inlet pipe and a water inlet pipe, and the air inlet pipe and the water inlet pipe are equipped with solenoid valves. The air inlet pipe is connected to a nitrogen source, and the water inlet pipe is connected to a water source.

10. The PCB thick board descaling device according to any one of claims 1 to 9, characterized in that, The support mechanism includes a vertically arranged enclosure that is positioned along the edge trajectory of the PCB thick plate, and the inner wall of the enclosure is provided with a horizontally arranged support ring. A slider is slidably mounted on the enclosure above the support ring. The slider slides horizontally and is perpendicular to the inner wall of the enclosure at its location. A cylinder for driving the slider is correspondingly mounted on the outer wall of the enclosure. The distance between the bottom of the slider and the support ring is adapted to the thickness of the PCB board. The bottom of the outer end of the slider is an arc-shaped surface.

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