Low-heat-conductivity and high-temperature-resistant self-cleaning material for heating cigarettes and preparation method of self-cleaning material

Abstract

The invention provides a low-heat-conductivity and high-temperature-resistant self-cleaning material for heating cigarettes and a preparation method of the self-cleaning material. The self-cleaning material is prepared from the following preparation raw materials in parts by weight: 50 to 65 parts of polyether-ether-ketone, 10 to 20 parts of polydimethylsiloxane, 12 to 25 parts of micron-sized hydrophobic modified hollow glass beads and 3 to 5 parts of nano-sized hydrophobic modified silicon dioxide. According to the self-cleaning material disclosed by the invention, polyether-ether-ketone and polydimethylsiloxane in specific parts by weight are mixed, so that a polymer base material with high-temperature-resistant and low-surface-energy characteristics can be formed; the hollow glass beads subjected to hydrophobic modification treatment have hollow structures, so that the heat-conducting property of the self-cleaning material can be reduced; meanwhile, micron-scale hydrophobic modified hollow glass beads and nano-scale hydrophobic modified silicon dioxide are mixed according to specific parts by mass, and a micro-nano rough structure can be formed on the surface of a polymer base material, so that the self-cleaning material has hydrophobic and self-cleaning properties.

Description

Technical Field

[0001] The present application relates to the technical field of self-cleaning materials, and in particular to a low thermal conductivity, high temperature resistant self-cleaning material for heating cigarettes and a preparation method thereof. Background Art

[0002] With the continuous advancement of science and technology, the application of high-temperature equipment, such as aerospace equipment, chemical equipment, and heated cigarette smoking devices, is becoming increasingly widespread. During use, dust and other particulate contaminants easily adhere to and accumulate on the surfaces of these high-temperature equipment, requiring regular cleaning, which incurs significant labor and material costs. Therefore, it is necessary to provide a self-cleaning material that is suitable for use on high-temperature equipment surfaces.

[0003] However, traditional self-cleaning materials have high thermal conductivity, which causes high heat loss when high-temperature equipment is working, so further improvement is still needed. Summary of the Invention

[0004] Based on this, one or more embodiments of the present application provide a self-cleaning material with low thermal conductivity and high temperature resistance for heating cigarettes and a preparation method thereof.

[0005] According to the first aspect of the embodiment of the present application, a low thermal conductivity, high temperature resistant self-cleaning material for heated cigarettes is provided, which includes the following preparation raw materials, measured by weight: 50-65 parts of polyetheretherketone, 10-20 parts of polydimethylsiloxane, 12-25 parts of micron-sized hydrophobically modified hollow glass microspheres, and 3-5 parts of nano-sized hydrophobically modified silica.

[0006] In some embodiments, the self-cleaning material satisfies at least one of the following characteristics:

[0007] (1) The particle size of the micron-sized hydrophobically modified hollow glass microspheres is 10 μm to 150 μm;

[0008] (2) The particle size of the nano-scale hydrophobically modified silica is 5 nm to 100 nm;

[0009] (3) The wall thickness of the micron-sized hydrophobically modified hollow glass microspheres is 1 μm to 2 μm.

[0010] In some embodiments, the self-cleaning material satisfies at least one of the following characteristics:

[0011] (1) The hydrophobic modifier of the micron-sized hydrophobically modified hollow glass microspheres includes a perfluorosilane coupling agent;

[0012] (2) The hydrophobic modifier of the nano-scale hydrophobically modified silica includes a perfluorosilane coupling agent.

[0013] In some embodiments, the perfluorosilane coupling agent includes at least one of tridecafluorooctyltriethoxysilane, tridecafluorooctyltrimethoxysilane, tridecafluorooctyltrichlorosilane, heptadecafluorodecyltriethoxysilane, heptadecafluorodecyltrimethoxysilane and heptadecafluorodecyltrichlorosilane.

[0014] According to a second aspect of an embodiment of the present application, a method for preparing a low thermal conductivity, high temperature resistant self-cleaning material for heating cigarettes is provided, comprising the following steps:

[0015] Providing the raw materials for preparing the self-cleaning material, and mixing the raw materials with an organic solvent to prepare a suspension;

[0016] The suspension is transferred to the surface of a substrate and solidified to prepare the self-cleaning material.

[0017] In some embodiments, the steps of preparing the suspension include:

[0018] mixing the polydimethylsiloxane with an organic solvent to prepare a mixed solution;

[0019] The mixed solution is mixed with the polyetheretherketone, the micron-sized hydrophobically modified hollow glass microspheres and the nano-sized hydrophobically modified silica to prepare a suspension.

[0020] In some embodiments, the organic solvent includes at least one of hexane, heptane, octane, nonane, decane, ethanol, propanol, butanol, pentanol, hexanol, heptanol, octanol, ethyl acetate and butyl acetate.

[0021] In some embodiments, the curing treatment temperature is 350° C. to 400° C., and the curing time is 5 min to 30 min.

[0022] In some embodiments, the micron-sized hydrophobically modified hollow glass microspheres are prepared by the following steps:

[0023] mixing a hydrophobic modifier, an organic solvent and hollow glass microspheres, and filtering and washing them in sequence to obtain a hollow glass microsphere intermediate;

[0024] The hollow glass microsphere intermediate is dried at 100° C. to 200° C. for 0.5 h to 3 h to prepare the micron-sized hydrophobically modified hollow glass.

[0025] In some embodiments, the nano-scale hydrophobically modified silica is prepared by the following steps:

[0026] Mixing a hydrophobic modifier, an organic solvent and nano-silica, and filtering and washing in sequence to obtain a nano-silica intermediate;

[0027] The nano-silica intermediate is dried at 100° C. to 200° C. for 0.5 h to 3 h to prepare the nano-scale hydrophobically modified silica.

[0028] Compared with traditional technologies, this application has the following beneficial effects:

[0029] In the self-cleaning material of the present application, polyetheretherketone and polydimethylsiloxane are mixed in specific weight proportions to form a polymer matrix with both high temperature resistance and low surface energy properties; the hollow glass microbeads that have been hydrophobically modified have a hollow structure, which can reduce the thermal conductivity of the self-cleaning material; at the same time, micron-scale hydrophobically modified hollow glass microbeads and nano-scale hydrophobically modified silica are mixed in specific mass proportions to form a micro-nano rough structure on the surface of the substrate together with the polymer matrix, so that the self-cleaning material has hydrophobic and self-cleaning properties, and can be suitable for heating cigarette smoking devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions of the specific implementation methods of this application, the following is a brief introduction to the drawings required for the description of the specific implementation methods. Obviously, the drawings described below are some implementation methods of this application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0031] Figure 1 This is a microscopic morphology of the self-cleaning material prepared in Example 1 of the present application;

[0032] Figure 2 This is a surface contact angle diagram of the self-cleaning material prepared in Example 1 of the present application;

[0033] Figure 3 This is a comparison chart of the surface thermal conductivity test results of pure polyetheretherketone material and the self-cleaning material prepared in Example 2 of the present application;

[0034] Figure 4 Schematic diagram of the self-cleaning ability test in Example 1. DETAILED DESCRIPTION

[0035] In order to make the above-mentioned objects, features and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the connotations of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art in the technical field of this application. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. Unless otherwise specified, the various raw materials, reagents, instruments and equipment used in this application can be purchased from the market or can be prepared by existing methods.

[0037] The terms "and / or", "or / and", and "and / or" used herein include any one of two or more related listed items, and also include any and all combinations of the related listed items, wherein the arbitrary and all combinations include any combination of two related listed items, any more related listed items, or all related listed items. It should be noted that when at least three items are connected by at least two conjunctions selected from "and / or", "or / and", and "and / or", it should be understood that in this application, the technical solution undoubtedly includes technical solutions connected by "logical and" and also undoubtedly includes technical solutions connected by "logical or". For example, "A and / or B" includes three parallel solutions of A, B and A+B. For example, the technical solution of "A, and / or, B, and / or, C, and / or, D" includes any one of A, B, C, and D (that is, the technical solution of all being connected by "logical OR"), and also includes any and all combinations of A, B, C, and D, that is, the combination of any two or any three of A, B, C, and D, and also includes the four-item combination of A, B, C, and D (that is, the technical solution of all being connected by "logical AND").

[0038] In this application, "plurality", "multiple", "multiple times", "multiples", etc., unless otherwise specified, refer to a quantity greater than or equal to 2. For example, "one or more" means one or more than or equal to two.

[0039] As used herein, "combination thereof", "any combination thereof", "any combination thereof" and the like include all suitable combinations of any two or more of the listed items.

[0040] Herein, the “suitable” mentioned in “suitable combination”, “suitable method”, “any suitable method”, etc. shall be based on the ability to implement the technical solution of this application, solve the technical problems of this application, and achieve the expected technical effects of this application.

[0041] Herein, "preferred", "better", "more preferred" and "suitable" are merely used to describe implementation methods or examples with better effects. It should be understood that they do not constitute limitations on the scope of protection of this application.

[0042] In this application, "further", "further", "particularly" and the like are used for descriptive purposes to indicate differences in content, but should not be understood as limiting the scope of protection of this application.

[0043] In this application, the terms "optionally," "optional," and "optional" mean optional or dispensable, i.e., they refer to either option being selected from two parallel options: "with" or "without." If a technical solution contains multiple "optional" clauses, each "optional" clause is independent unless otherwise specified and there are no contradictions or constraints.

[0044] In this application, the technical features described in an open manner include closed technical solutions composed of the listed features, and also include open technical solutions containing the listed features.

[0045] In this application, when referring to a numerical interval (i.e., a numerical range), unless otherwise specified, the optional numerical distribution within the numerical interval is considered continuous and includes the two numerical endpoints of the numerical range (i.e., the minimum and maximum values), as well as every numerical value between these two numerical endpoints. Unless otherwise specified, when a numerical interval refers only to integers within the numerical interval, it includes the two numerical endpoints of the numerical range, as well as every integer between the two numerical endpoints. In this document, this is equivalent to directly listing each integer. For example, "t is an integer selected from 1-10" means that t is any integer selected from the group consisting of 1, 2, 3, 4, 5, 6, 7, 8, 9, and 10. In addition, when multiple ranges are provided to describe a feature or characteristic, these ranges may be combined. In other words, unless otherwise specified, ranges disclosed herein should be understood to include any and all subranges subsumed therein.

[0046] Unless otherwise specified, the temperature parameters in this application allow for both constant temperature treatment and temperature fluctuations within a certain temperature range. It should be understood that the constant temperature treatment allows for temperature fluctuations within the accuracy range of instrument control. Fluctuations within ranges such as ±5°C, ±4°C, ±3°C, ±2°C, and ±1°C are permitted.

[0047] Some embodiments of the present application provide a low thermal conductivity, high temperature resistant self-cleaning material for heated cigarettes, which includes the following raw materials, calculated by weight: 50-65 parts of polyetheretherketone, 10-20 parts of polydimethylsiloxane, 12-25 parts of micron-sized hydrophobically modified hollow glass microspheres, and 3-5 parts of nano-sized hydrophobically modified silica.

[0048] In the self-cleaning material of the present application, polyetheretherketone and polydimethylsiloxane are mixed in specific weight proportions to form a polymer substrate with both high temperature resistance and low surface energy properties; the hollow glass microbeads that have been hydrophobically modified have a hollow structure, which can reduce the thermal conductivity of the self-cleaning material; at the same time, micron-scale hydrophobically modified hollow glass microbeads and nano-scale hydrophobically modified silica are mixed in specific mass proportions to form a micro-nano rough structure on the surface of the polymer substrate, so that the self-cleaning material can have hydrophobic and self-cleaning properties.

[0049] As an example, the weight proportions of polyetheretherketone can be 50 parts, 51 parts, 52 parts, 53 parts, 54 parts, 55 parts, 56 parts, 57 parts, 58 parts, 59 parts, 60 parts, 61 parts, 62 parts, 63 parts, 64 parts, 65 parts, or any value within the range formed by any two of the above point values.

[0050] Furthermore, the weight percentage of polyetheretherketone is 55 parts to 65 parts; furthermore, the weight percentage of polyetheretherketone is 55 parts to 62 parts.

[0051] As an example, the weight percentage of polydimethylsiloxane can be 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, 16 parts, 17 parts, 18 parts, 19 parts, 20 parts, or any value within the range formed by any two of the above point values.

[0052] Furthermore, the weight portion of polydimethylsiloxane is 15 to 20 parts; furthermore, the weight portion of polydimethylsiloxane is 15 to 18 parts.

[0053] As an example, the weight proportions of the micron-sized hydrophobically modified hollow glass microspheres can be 12 parts, 13 parts, 14 parts, 15 parts, 16 parts, 17 parts, 18 parts, 19 parts, 20 parts, 21 parts, 22 parts, 23 parts, 24 parts, 25 parts, or any value within the range formed by any two of the above point values.

[0054] Furthermore, the weight ratio of the micron-sized hydrophobically modified hollow glass microspheres is 12 to 20 parts; furthermore, the weight ratio of the micron-sized hydrophobically modified hollow glass microspheres is 15 to 20 parts.

[0055] As an example, the weight percentage of the nano-scale hydrophobically modified silica can be 3 parts, 4 parts, 5 parts, or any value within the range formed by any two of the above values.

[0056] In some embodiments, the raw materials for preparing the self-cleaning material further include an organic solvent. Optionally, the organic solvent includes at least one of hexane, heptane, octane, nonane, decane, ethanol, propanol, butanol, pentanol, hexanol, heptanol, ethyl octanol and butyl acetate.

[0057] In some embodiments, the particle size of the micron-sized hydrophobically modified hollow glass microspheres is 10 μm to 150 μm.

[0058] As an example, the particle size of the micron-sized hydrophobically modified hollow glass microspheres can be 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, or any value within the range formed by any two of the above point values.

[0059] In some embodiments, the particle size of the nano-scale hydrophobically modified silica is 5 nm to 100 nm.

[0060] As an example, the particle size of the nano-scale hydrophobically modified silica can be 5 nm, 10 nm, 20 nm, 30 nm, 40 nm, 50 nm, 60 nm, 70 nm, 80 nm, 90 nm, 100 nm, or any value within the range formed by any two of the above point values.

[0061] In some embodiments, the wall thickness of the micron-sized hydrophobically modified hollow glass microspheres is 1 μm to 2 μm.

[0062] As an example, the wall thickness of the micron-sized hydrophobically modified hollow glass microspheres can be 1 μm, 1.1 μm, 1.2 μm, 1.3 μm, 1.4 μm, 1.5 μm, 1.6 μm, 1.7 μm, 1.8 μm, 1.9 μm, 2 μm, or any value within the range formed by any two of the above point values.

[0063] In some embodiments, the hydrophobic modifier of the micron-sized hydrophobically modified hollow glass microspheres includes a perfluorosilane coupling agent.

[0064] In some embodiments, the hydrophobic modifier of the nano-scale hydrophobically modified silica includes a perfluorosilane coupling agent.

[0065] In some embodiments, the perfluorosilane coupling agent includes at least one of tridecafluorooctyltriethoxysilane, tridecafluorooctyltrimethoxysilane, tridecafluorooctyltrichlorosilane, heptadecafluorodecyltriethoxysilane, heptadecafluorodecyltrimethoxysilane, and heptadecafluorodecyltrichlorosilane. It is understood that the hydrophobic modifier for the micron-sized hydrophobically modified hollow glass microspheres and the hydrophobic modifier for the nano-sized hydrophobically modified silica can each be independently selected from the above-mentioned perfluorosilane coupling agents.

[0066] The self-cleaning material of some embodiments of the present application has a contact angle of water droplets of more than 150°C, a thermal conductivity of less than 0.12 / (m·K), and can withstand high temperature conditions of 280°C for 7 days, with good low thermal conductivity and high temperature resistance.

[0067] Some embodiments of the present application further provide a method for preparing a low thermal conductivity, high temperature resistant self-cleaning material for heating cigarettes, comprising the following steps:

[0068] S10, providing raw materials for preparing the self-cleaning material, and mixing the raw materials with an organic solvent to prepare a suspension;

[0069] S20, transferring the suspension to the surface of the substrate and preparing a self-cleaning material through a curing treatment.

[0070] In some embodiments, the step of preparing the suspension in S10 includes:

[0071] S11, mixing polydimethylsiloxane with an organic solvent to prepare a mixed solution;

[0072] S12. Mixing the mixed solution with polyetheretherketone, micron-sized hydrophobically modified hollow glass microspheres and nano-sized hydrophobically modified silica to prepare a suspension.

[0073] In some embodiments, the organic solvent includes at least one of hexane, heptane, octane, nonane, decane, ethanol, propanol, butanol, pentanol, hexanol, heptanol, ethyl octanolate, and butyl acetate.

[0074] In some embodiments, the curing process in S20 is performed at a temperature of 350° C. to 400° C. for a time of 5 min to 30 min.

[0075] As an example, the temperature of the curing treatment can be 350°C, 355°C, 360°C, 365°C, 370°C, 375°C, 380°C, 385°C, 390°C, 395°C, 400°C, or any value within the range formed by any two of the above point values; the time of the curing treatment can be 5min, 10min, 15min, 20min, 25min, 30min, or any value within the range formed by any two of the above point values.

[0076] In some embodiments, micron-sized hydrophobically modified hollow glass microspheres are prepared by the following steps:

[0077] mixing a hydrophobic modifier, an organic solvent and hollow glass microspheres, and filtering and washing them in sequence to obtain a hollow glass microsphere intermediate;

[0078] The hollow glass microsphere intermediate is dried at 100° C. to 200° C. for 0.5 h to 3 h to prepare micron-sized hydrophobically modified hollow glass.

[0079] As an example, the drying temperature can be 100° C., 110° C., 120° C., 130° C., 140° C., 150° C., 160° C., 170° C., 180° C., 190° C., or 200° C., or any value within a range formed by any two of the foregoing values. The drying time can be 0.5 h, 1 h, 1.5 h, 2 h, 2.5 h, or 3 h, or any value within a range formed by any two of the foregoing values.

[0080] In some embodiments, nano-scale hydrophobically modified silica is prepared by the following steps:

[0081] Mixing a hydrophobic modifier, an organic solvent and nano-silica, and filtering and washing in sequence to obtain a nano-silica intermediate;

[0082] The nano-silica intermediate is dried at 100° C. to 200° C. for 0.5 h to 3 h to prepare nano-scale hydrophobically modified silica.

[0083] As an example, the drying temperature can be 100° C., 110° C., 120° C., 130° C., 140° C., 150° C., 160° C., 170° C., 180° C., 190° C., or 200° C., or any value within a range formed by any two of the foregoing values. The drying time can be 0.5 h, 1 h, 1.5 h, 2 h, 2.5 h, or 3 h, or any value within a range formed by any two of the foregoing values.

[0084] The preparation method of the self-cleaning material of the present application has the advantages of simple process and can be cured by heating.

[0085] The present application will be further described below in conjunction with specific examples and comparative examples, but they should not be construed as limiting the scope of protection of the present application. The raw materials involved in the following specific examples, unless otherwise specified, can all be sourced from commercial sources, the instruments used, unless otherwise specified, can all be sourced from commercial sources, and the processes involved, unless otherwise specified, are all routinely selected by those skilled in the art.

[0086] Example 1

[0087] (1) Preparation of micron-sized hydrophobically modified hollow glass microspheres: Heptafluorodecyltrichlorosilane was mixed with ethanol and stirred for 30 minutes, and hollow glass microspheres with a particle size of 60 μm to 100 μm and a wall thickness of about 1 μm were added and stirred continuously for 2.5 hours; then the hollow glass microsphere intermediate was obtained by filtration and washing, and then dried at 150°C for 1 hour to obtain micron-sized hydrophobically modified hollow glass microspheres.

[0088] (2) Preparation of nano-scale hydrophobically modified silica: Heptafluorodecyltrichlorosilane and ethanol were mixed and stirred for 30 minutes, and then silica particles with a particle size of 5 nm to 10 nm were added and stirred continuously for 2.5 hours; then the silica intermediate was obtained by filtration and washing, and then dried at 150°C for 1 hour to obtain nano-scale hydrophobically modified silica.

[0089] (3) Add 1.5 g of polydimethylsiloxane to 20 g of cyclohexane, dissolve and stir evenly, then add 5.5 g of polyetheretherketone powder, 1.5 g of hydrophobically modified hollow glass microspheres obtained in step (1), and 0.3 g of hydrophobically modified silica obtained in step (2), and stir to obtain a uniform suspension. Then, coat the suspension evenly on the surface of an aluminum sheet, wait for the solvent to evaporate, and place the suspension in a muffle furnace at 360°C for 10 minutes to obtain a low thermal conductivity self-cleaning material.

[0090] Figure 1 This is a microscopic morphology of the self-cleaning material prepared in Example 1; Figure 2 This is a surface contact angle diagram of the self-cleaning material prepared in Example 1.

[0091] Example 2

[0092] The method is basically the same as Example 1, except that step (3) is different. Specifically, step (3) in Example 2 includes:

[0093] 1.5 g of polydimethylsiloxane was added to 20 g of cyclohexane, and after dissolving and stirring evenly, 6 g of polyetheretherketone powder, 2 g of the hydrophobically modified hollow glass microspheres obtained in step (1), and 0.4 g of the hydrophobically modified silica obtained in step (2) were added. After stirring, a uniform suspension was obtained, which was then evenly coated on the surface of an aluminum sheet. After the solvent evaporated, it was placed in a muffle furnace at 360°C for 13 minutes to obtain a low thermal conductivity self-cleaning material.

[0094] Figure 3 This is a comparison chart of the surface thermal conductivity test results of pure polyetheretherketone material and the self-cleaning material prepared in Example 2.

[0095] Example 3

[0096] The method is basically the same as Example 1, except that step (3) is different. Specifically, step (3) in Example 3 includes:

[0097] 1.5 g of polydimethylsiloxane was added to 20 g of cyclohexane, and after dissolving and stirring evenly, 5.5 g of polyetheretherketone powder, 1.5 g of the hydrophobically modified hollow glass microspheres obtained in step (1), and 0.4 g of the hydrophobically modified silica obtained in step (2) were added, and a uniform suspension was obtained after stirring. The suspension was then evenly coated on the surface of an aluminum sheet. After the solvent evaporated, the suspension was placed in a muffle furnace at 360°C for 15 minutes to obtain a low thermal conductivity self-cleaning material.

[0098] Example 4

[0099] The method is basically the same as Example 1, except that step (3) is different. Specifically, step (3) in Example 4 includes:

[0100] 1.8 g of polydimethylsiloxane was added to 20 g of n-octane, and after dissolving and stirring evenly, 6 g of polyetheretherketone powder, 1.8 g of the hydrophobically modified hollow glass microspheres obtained in step (1), and 0.4 g of the hydrophobically modified silica obtained in step (2) were added. After stirring, a uniform suspension was obtained, which was then evenly coated on the surface of an aluminum sheet. After the solvent evaporated, it was placed in a muffle furnace at 370°C for 7 minutes to obtain a low thermal conductivity self-cleaning material.

[0101] Example 5

[0102] The method is basically the same as Example 1, except that step (3) is different. Specifically, step (3) in Example 5 includes:

[0103] 1.5 g of polydimethylsiloxane was added to 20 g of n-octane, dissolved and stirred evenly, and then 6 g of polyetheretherketone powder, 1.8 g of the hydrophobically modified hollow glass microspheres obtained in step (1), and 0.5 g of the hydrophobically modified silica obtained in step (2) were added. After stirring, a uniform suspension was obtained, which was then evenly coated on the surface of an aluminum sheet. After the solvent evaporated, it was placed in a muffle furnace at 380°C for 5 minutes to obtain a low thermal conductivity self-cleaning material.

[0104] Example 6

[0105] The method is basically the same as Example 1, except that step (3) is different. Specifically, step (3) in Example 6 includes:

[0106] 1.6 g of polydimethylsiloxane was added to 20 g of cyclohexane, and after dissolving and stirring evenly, 6.2 g of polyetheretherketone powder, 1.5 g of the hydrophobically modified hollow glass microspheres obtained in step (1), and 0.4 g of the hydrophobically modified silica obtained in step (2) were added. After stirring, a uniform suspension was obtained, which was then evenly coated on the surface of an aluminum sheet. After the solvent evaporated, it was placed in a muffle furnace at 370°C for 10 minutes to obtain a low thermal conductivity self-cleaning material.

[0107] Example 7

[0108] The method is basically the same as Example 1, except that step (3) is different. Specifically, step (3) in Example 7 includes:

[0109] 1.7 g of polydimethylsiloxane was added to 20 g of cyclohexane, and after dissolving and stirring evenly, 5.5 g of polyetheretherketone powder, 1.6 g of the hydrophobically modified hollow glass microspheres obtained in step (1), and 0.4 g of the hydrophobically modified silica obtained in step (2) were added. After stirring, a uniform suspension was obtained, which was then evenly coated on the surface of an aluminum sheet. After the solvent evaporated, it was placed in a muffle furnace at 360°C for 10 minutes to obtain a low thermal conductivity self-cleaning material.

[0110] Example 8

[0111] The method is basically the same as Example 1, except that step (3) is different. Specifically, step (3) in Example 8 includes:

[0112] 1.7 g of polydimethylsiloxane was added to 20 g of cyclohexane, and after dissolving and stirring evenly, 5.5 g of polyetheretherketone powder, 2.5 g of the hydrophobically modified hollow glass microspheres obtained in step (1), and 0.4 g of the hydrophobically modified silica obtained in step (2) were added. After stirring, a uniform suspension was obtained, which was then evenly coated on the surface of an aluminum sheet. After the solvent evaporated, it was placed in a muffle furnace at 360°C for 10 minutes to obtain a low thermal conductivity self-cleaning material.

[0113] Comparative Example 1

[0114] The method is basically the same as Example 1, except that step (3) is different. Specifically, step (3) in Comparative Example 1 includes:

[0115] 7.2 g of polyetheretherketone powder was added to 20 g of cyclohexane, dissolved and stirred evenly, and then 1.6 g of the hydrophobically modified hollow glass microspheres prepared in step (1) and 0.4 g of the hydrophobically modified silica prepared in step (2) were added. After stirring, a uniform suspension was obtained, which was then evenly coated on the surface of an aluminum sheet. After the solvent evaporated, it was placed in a muffle furnace at 360°C for 10 minutes to obtain a low thermal conductivity composite material.

[0116] Comparative Example 2

[0117] The method is basically the same as Example 1, except that step (3) is different. Specifically, step (3) in Comparative Example 2 includes:

[0118] 7.2 g of polydimethylsiloxane was added to 20 g of cyclohexane, dissolved and stirred evenly, and then 1.6 g of the hydrophobically modified hollow glass microspheres prepared in step (1) and 0.4 g of the hydrophobically modified silica prepared in step (2) were added. After stirring, a uniform suspension was obtained, which was then evenly coated on the surface of an aluminum sheet. After the solvent evaporated, it was placed in a muffle furnace at 360°C for 10 minutes to obtain a low thermal conductivity self-cleaning material.

[0119] Comparative Example 3

[0120] The method is basically the same as Example 1, except that step (3) is different. Specifically, step (3) in Comparative Example 3 includes:

[0121] 1.7 g of polydimethylsiloxane was added to 20 g of cyclohexane, and after dissolving and stirring evenly, 5.5 g of polyetheretherketone powder and 2 g of the hydrophobically modified silica obtained in step (2) were added, and after stirring, a uniform suspension was obtained. The suspension was then evenly coated on the surface of the aluminum sheet. After the solvent evaporated, the suspension was placed in a muffle furnace at 360°C for 10 minutes to obtain a low thermal conductivity composite material.

[0122] Some process parameters and weights of raw materials used in the above examples and comparative examples are shown in Table 1.

[0123] Table 1

[0124]

[0125] The properties of the self-cleaning materials prepared in the above examples and comparative examples were tested respectively, and the results are shown in Table 2.

[0126] Among them, the thermal conductivity test of the material is carried out using a TCi thermal conductivity analyzer produced by Canadian C-Therm Company.

[0127] Material high temperature resistance test: Place the sample in a muffle furnace at 280°C and heat it. Take it out every other day and test the change in its surface contact angle.

[0128] Material self-cleaning performance test method: Prepare the sample on an aluminum plate substrate, tilt the sample 25°, sprinkle carbon powder (simulated pollutants) on the sample surface, and then drip water droplets onto the sample surface to observe whether the rolling water droplets can carry away the pollutants. If they can completely carry them away, it has self-cleaning ability.

[0129] Figure 4 Schematic diagram of the self-cleaning ability test in Example 1, wherein (a)-1 is before the self-cleaning test, (a)-2 is during the self-cleaning test, and (a)-3 is after the self-cleaning test; if the rolling water droplets can easily carry away the pollutants from the coating surface, it means that the material has self-cleaning ability.

[0130] Table 2

[0131]

[0132] In Example 8, when the amount of hydrophobically modified hollow glass microspheres reached 2.5g, the resulting self-cleaning material had similar thermal conductivity and high-temperature resistance to Examples 1-7, but exhibited surface pulverization. In Comparative Example 1, in which polydimethylsiloxane was omitted, the resulting composite material failed to achieve a self-cleaning effect and exhibited a slight increase in thermal conductivity. In Comparative Example 2, in which polyetheretherketone was omitted, the resulting self-cleaning material survived only one day at 280°C. In Comparative Example 3, in which hydrophobically modified hollow glass was omitted, the resulting composite material failed to achieve a self-cleaning effect.

[0133] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0134] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present application shall be determined by the appended claims.

Claims

1. A low thermal conductivity, high temperature resistant self-cleaning material for heating cigarettes, characterized in that: The preparation comprises the following raw materials in parts by weight: 50-65 parts of polyetheretherketone, 10-20 parts of polydimethylsiloxane, 12-25 parts of micron-sized hydrophobically modified hollow glass microspheres, and 3-5 parts of nano-sized hydrophobically modified silicon dioxide.

2. The low thermal conductivity, high temperature resistant self-cleaning material according to claim 1, characterized in that: The self-cleaning material satisfies at least one of the following characteristics: (1) The particle size of the micron-sized hydrophobically modified hollow glass microspheres is 10 μm to 150 μm; (2) The particle size of the nano-scale hydrophobically modified silica is 5 nm to 100 nm; (3) The wall thickness of the micron-sized hydrophobically modified hollow glass microspheres is 1 μm to 2 μm.

3. The low thermal conductivity, high temperature resistant self-cleaning material according to claim 1, characterized in that: The self-cleaning material satisfies at least one of the following characteristics: (1) The hydrophobic modifier of the micron-sized hydrophobically modified hollow glass microspheres includes a perfluorosilane coupling agent; (2) The hydrophobic modifier of the nano-scale hydrophobically modified silica includes a perfluorosilane coupling agent.

4. The low thermal conductivity, high temperature resistant self-cleaning material according to claim 3, characterized in that: The perfluorosilane coupling agent includes at least one of tridecafluorooctyltriethoxysilane, tridecafluorooctyltrimethoxysilane, tridecafluorooctyltrichlorosilane, heptadecafluorodecyltriethoxysilane, heptadecafluorodecyltrimethoxysilane and heptadecafluorodecyltrichlorosilane.

5. A method for preparing a low thermal conductivity, high temperature resistant self-cleaning material for heating cigarettes, characterized in that: The following steps are involved: Providing raw materials for preparing the self-cleaning material according to any one of claims 1 to 4, and mixing each raw material with an organic solvent to prepare a suspension; The suspension is transferred to the surface of a substrate and solidified to prepare the self-cleaning material.

6. The method for preparing the low thermal conductivity, high temperature resistant self-cleaning material according to claim 5, characterized in that: The steps of preparing the suspension include: mixing the polydimethylsiloxane with an organic solvent to prepare a mixed solution; The mixed solution is mixed with the polyetheretherketone, the micron-sized hydrophobically modified hollow glass microspheres and the nano-sized hydrophobically modified silica to prepare a suspension.

7. The method for preparing the low thermal conductivity, high temperature resistant self-cleaning material according to claim 6, characterized in that: The organic solvent includes at least one of hexane, heptane, octane, nonane, decane, ethanol, propanol, butanol, pentanol, hexanol, heptanol, octanol, ethyl acetate and butyl acetate.

8. The method for preparing a low thermal conductivity, high temperature resistant self-cleaning material according to any one of claims 5 to 7, characterized in that: The curing treatment temperature is 350° C. to 400° C., and the curing time is 5 min to 30 min.

9. The method for preparing a low thermal conductivity, high temperature resistant self-cleaning material according to any one of claims 5 to 7, characterized in that: The micron-sized hydrophobically modified hollow glass microspheres are prepared by the following steps: mixing a hydrophobic modifier, an organic solvent and hollow glass microspheres, and filtering and washing them in sequence to obtain a hollow glass microsphere intermediate; The hollow glass microsphere intermediate is dried at 100° C. to 200° C. for 0.5 h to 3 h to prepare the micron-sized hydrophobically modified hollow glass.

10. The method for preparing a low thermal conductivity, high temperature resistant self-cleaning material according to any one of claims 5 to 7, characterized in that: The nano-scale hydrophobically modified silica is prepared by the following steps: Mixing a hydrophobic modifier, an organic solvent and nano-silica, and filtering and washing in sequence to obtain a nano-silica intermediate; The nano-silica intermediate is dried at 100° C. to 200° C. for 0.5 h to 3 h to prepare the nano-scale hydrophobically modified silica.

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