A circuit board spectral signal sorting method and system

Abstract

The present application relates to the technical field of circuit board anti-shock performance design, and in particular to a circuit board spectrum signal sorting method and system, the circuit board spectrum signal sorting method of the present application realizes the optimization of the anti-shock performance of the circuit board through intelligent sorting of spectrum signals, and the specific mode is as follows: the height representation ability of laser scanning spectrum pattern is used to analyze the spectrum sub-pattern of each key component area to calculate the offset parameter of the key component, and the anti-shock index of the key component under different assembly parameters is comprehensively evaluated based on the assembly parameter and the offset parameter of the key component, and then the optimal assembly parameter is obtained, the present method automatically sorts out the optimal assembly parameter combination based on the anti-shock indexes of multiple groups of experiments of the same component, and guides the design iteration.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board anti-vibration performance design, in particular to a circuit board spectrum signal sorting method and system. BACKGROUND

[0002] In the field of electronic device reliability testing, circuit board vibration experiment is the core means to evaluate its anti-vibration performance. The existing technology mainly relies on manual visual inspection or two-dimensional image comparison to detect component deviation, which has significant defects. For example, manual measurement is difficult to quantify millimeter-level displacement and micro-inclination angle (such as electrolytic capacitor inclination angle less than 5°), and is easily affected by subjective judgment. In addition, the traditional method cannot systematically associate component assembly parameters (such as pin length, pad size) with actual displacement after vibration, resulting in lack of data support for anti-vibration design optimization.

[0003] Especially for high-inertia devices (such as electrolytic capacitors and high-power inductors), their deviation mode is complex (including inclination and body displacement), and the existing technology cannot accurately analyze multi-dimensional deviation characteristics. Therefore, there is an urgent need for an intelligent sorting method that can automatically and accurately analyze component vibration deformation and associate assembly parameters with anti-vibration performance. SUMMARY

[0004] The purpose of the present application is to provide a circuit board spectrum signal sorting method and system to improve the problem that manual measurement is difficult to quantify millimeter-level displacement and micro-inclination angle after circuit board vibration experiment.

[0005] To achieve the above purpose, the embodiments of the present application provide the following technical solutions:

[0006] On the one hand, the present application provides a circuit board spectrum signal sorting method, which comprises: after the end of the circuit board vibration experiment, the front surface of a plurality of different experimental circuit boards is scanned in turn by a laser scanner, and then the spectrum pattern corresponding to the front surface of each experimental circuit board is obtained, which is used to represent the height of the electronic device on the front surface of the experimental circuit board; the spectrum sub-pattern of the region of a plurality of key components in each spectrum pattern is automatically intercepted by manually inputting the circuit board code, the key components including electrolytic capacitors, high-power inductors and transformers; the deviation parameters of the key components are calculated based on the spectrum sub-pattern of each key component region, the assembly parameters and the corresponding deviation parameters of the same key component on different experimental circuit boards are counted, and the anti-vibration index of the key component on different experimental circuit boards is evaluated by a weighting algorithm; based on the plurality of anti-vibration indexes of the same key component, an optimal assembly parameter is sorted from a plurality of assembly parameters.

[0007] Optionally, the deviation parameters of the key components are calculated based on the spectrum sub-pattern of each key component region, which comprises:

[0008] If the key component is an electrolytic capacitor, a preset shape feature extraction algorithm based on the arc-shaped front and rear ends and the square-shaped connecting segment in the middle is used to frame the corresponding spectral feature region in the spectral subgraph;

[0009] A middle axis of the spectral feature region is constructed, and the highest point on the middle axis is identified by the RGB value. A perpendicular line segment passing through the highest point and perpendicular to the middle axis is constructed, which is denoted as a demarcation line;

[0010] The spectral feature region is divided into four quadrant regions with the middle axis as the X axis and the demarcation line as the Y axis. A plurality of flatness collection lines with the same spacing and perpendicular to the middle axis are set on both sides of the demarcation line as the reference line;

[0011] The average RGB fluctuation of the plurality of flatness collection lines in the first quadrant region and the average RGB fluctuation of the plurality of flatness collection lines in the second quadrant region are calculated in turn;

[0012] The quadrant region with smaller average RGB fluctuation and the corresponding associated quadrant region are identified as the inclined surface reference region;

[0013] The maximum length value in the Y axis direction and the distance value in the X axis of the inclined surface reference region are measured, the distance value in the X axis is corrected based on the difference between the maximum length value in the Y axis direction and the standard diameter of the electrolytic capacitor, and the inclination angle of the electrolytic capacitor after the vibration test is calculated based on the corrected distance value in the X axis;

[0014] A first reference line is constructed based on the solder position of the two pins of the electrolytic capacitor, and the vertical included angle between the first reference line and the middle axis is calculated.

[0015] Optionally, the anti-vibration index calculation method of the electrolytic capacitor is: obtaining the pin length in the electrolytic capacitor assembly parameter, and configuring the weight of the vertical included angle and the inclination angle based on the pin length, and then calculating the anti-vibration index of the electrolytic capacitor under the current pin length based on the vertical included angle and the inclination angle by a weighted algorithm.

[0016] In a second aspect, the embodiment provides a circuit board spectral signal sorting system, which comprises:

[0017] After the end of the circuit board vibration experiment, the front surface of each experimental circuit board is scanned in turn by a laser scanner, and then the corresponding spectral pattern of the front surface of each experimental circuit board is obtained, which is used to represent the height of the electronic device on the front surface of the experimental circuit board;

[0018] The spectral subgraph of the region of each key component in each spectral pattern is automatically intercepted by manually inputting the circuit board code, and the key components include electrolytic capacitors, high-power inductors and transformers;

[0019] The offset parameter of the key component is calculated based on the spectrum subgraph of each key component area, and the assembly parameters and corresponding offset parameters of the same key component on different experimental circuit boards are counted, and the anti-shock index of the key component on different experimental circuit boards is evaluated through a weighting algorithm;

[0020] Based on the multiple anti-shock indexes of the same key component, an optimal assembly parameter is sorted out from the multiple assembly parameters.

[0021] In a third aspect, the embodiments of the present application provide a circuit board spectrum signal sorting device, which comprises a memory and a processor.

[0022] The memory is used to store a computer program, and the processor is used to execute the computer program to realize the steps of the circuit board spectrum signal sorting method.

[0023] In a fourth aspect, the embodiments of the present application provide a medium, which stores a computer program, and the computer program is executed by a processor to realize the steps of the circuit board spectrum signal sorting method.

[0024] The beneficial effects of the present application are as follows:

[0025] The circuit board spectrum signal sorting method realizes the optimization of the anti-shock performance of the circuit board through intelligent sorting of the spectrum signal, and the specific mode is as follows: the height representation ability of the laser scanning spectrum pattern is used to analyze the spectrum subgraph of each key component area to calculate the offset parameter of the key component, and the anti-shock index of the key component under different assembly parameters is comprehensively evaluated based on the assembly parameter and the offset parameter of the key component, and then the optimal assembly parameter is obtained.

[0026] As for the electrolytic capacitor, the method intelligently correlates the assembly parameter and the anti-shock parameter, uses the height representation ability of the laser scanning spectrum pattern, combines the quadrant segmentation algorithm of the electrolytic capacitor and the flatness collection line, quantifies the micron-level height fluctuation, accurately calculates the tilt angle (the accuracy is ±0.5°) and the non-tilt displacement (the vertical angle error is less than 1°) of the electrolytic capacitor, greatly improves the detection accuracy and detection efficiency of the key component, and generates the device-specific anti-shock index through the weighting algorithm fusion of the pin length, the tilt angle, the non-tilt displacement and other parameters, and secondly, the characteristics difference of the long pin anti-bending and the short pin anti-pulling is accurately reflected through the dynamic adjustment of the electrolytic capacitor pin length weight.

[0027] Other features and advantages of the present application will be set forth in the following description, and in part will be apparent from the description, or can be learned by practice of the application. The objects and other advantages of the present application will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly introduced as follows. It should be understood that the following drawings only show some of the embodiments of the present application, and therefore should not be considered as limiting the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0029] Figure 1 is a flow diagram of a circuit board spectrum signal sorting method according to an embodiment of the present application;

[0030] Figure 2 is a structural diagram of a circuit board spectrum signal sorting device according to an embodiment of the present application. DETAILED DESCRIPTION

[0031] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be described clearly and completely below with reference to the drawings of the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by those skilled in the art without creative labor on the basis of the embodiments of the present application belong to the scope of protection of the present application.

[0032] It should be noted that: similar reference numerals or letters in the following drawings represent similar items, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. Meanwhile, in the description of the present application, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0033] Embodiment 1:

[0034] Before the principle is explained, the scene applied to the embodiment needs to be briefly described. For the field with high reliability requirement such as automobile or military, the vibration test is mainly used for testing the components with high gravity center, large mass, strong inertial force during vibration, which is easy to generate torque on the welding point, leading to welding point fatigue or body displacement. Such components mainly include electrolytic capacitor, high-power inductor, radiator, transformer and large connector, etc. common welding parts of circuit board.

[0035] The same component is set with different welding assembly parameters on different experimental boards, and then the anti-vibration performance of different welding assembly parameters is evaluated by detecting the displacement or crack of the component after vibration test.

[0036] As shown in Figure 1 The embodiment provides a circuit board spectrum signal sorting method, which comprises steps S100, S200, S300 and S400.

[0037] Step S100: After the end of the circuit board vibration test, the front surface of a plurality of different experimental circuit boards is scanned in sequence by a laser scanner, and then the spectrum pattern corresponding to the front surface of each experimental circuit board is obtained, which is used to represent the height of the electronic device on the front surface of the experimental circuit board.

[0038] Step S200: The spectrum sub-patterns of a plurality of key component regions in each spectrum pattern are automatically intercepted by manually inputting the circuit board code, and the key components include electrolytic capacitor, high-power inductor and transformer.

[0039] Step S300: The displacement parameters of the key components are calculated based on the spectrum sub-patterns of each key component region, the assembly parameters of the same key component on different experimental circuit boards and the corresponding displacement parameters are counted, and the anti-vibration index of the key component on different experimental circuit boards is evaluated by a weighting algorithm.

[0040] Step S400: Based on a plurality of anti-vibration indexes of the same key component, an optimal assembly parameter is sorted from a plurality of assembly parameters.

[0041] In step S300, the specific way of calculating the displacement parameters of the key components based on the spectrum sub-patterns of each key component region can be:

[0042] For the electrolytic capacitor, the welding length of the pin determines the anti-vibration performance to a large extent. If the pin is too short, the solder joint is prone to come off after the vibration test, and if the pin is too long, the electrolytic capacitor body will be displaced. However, the pin length is not proportional to the displacement of the electrolytic capacitor body. Therefore, it is necessary to find the most suitable (small displacement) pin length, that is, to provide certain anti-vibration performance, avoid pin soldering, and minimize displacement. However, the displacement here is not in the traditional sense. The displacement includes the tilt angle and the movement in the horizontal direction of the electrolytic capacitor body. However, considering the tilt angle, it is difficult to measure the movement in the horizontal direction. Therefore, the present embodiment measures the angle between the tilt direction of the electrolytic capacitor after the vibration test and the angle between the two pin solder joints of the electrolytic capacitor. In the ideal state (no movement in the horizontal direction), the angle is 90°, that is, the electrolytic capacitor tilts or bends in the vertical plane of the pin solder joint connection line.

[0043] In step S310, if the key component is an electrolytic capacitor, a preset shape image feature extraction algorithm with an arc-shaped front and rear end and a square-shaped connecting section in the middle is used to frame the corresponding spectral feature region in the spectral subgraph;

[0044] In step S320, a middle axis of the spectral feature region is constructed, and the highest point on the middle axis is identified by the RGB value. A perpendicular line segment passing through the highest point and perpendicular to the middle axis is constructed, which is referred to as a boundary line.

[0045] In step S330, the spectral feature region is divided into four quadrant regions with the middle axis as the X axis and the boundary line as the Y axis. A plurality of flatness collection lines with the same spacing and perpendicular to the middle axis are set on both sides of the boundary line as the reference line.

[0046] In step S340, the average RGB fluctuation of the plurality of flatness collection lines in the first quadrant region and the average RGB fluctuation of the plurality of flatness collection lines in the second quadrant region are calculated in sequence.

[0047] In step S350, the quadrant region with smaller average RGB fluctuation and the corresponding associated quadrant region are identified as the tilt surface reference region.

[0048] In step S360, the maximum length value in the Y axis direction and the distance value in the X axis direction of the tilt surface reference region are measured. The distance value in the X axis direction is corrected based on the difference between the maximum length value in the Y axis direction and the standard diameter of the electrolytic capacitor. The tilt angle of the electrolytic capacitor after the vibration test is calculated based on the corrected distance value in the X axis direction.

[0049] In step S370, a first reference line is constructed based on the solder joint positions of the two pins of the electrolytic capacitor, and the perpendicular angle between the first reference line and the middle axis is calculated.

[0050] The anti-shock index of the electrolytic capacitor is calculated in the following manner: the pin length in the electrolytic capacitor assembly parameters is obtained, and the weights of the vertical included angle and the tilt angle are configured based on the pin length, and then the anti-shock index of the electrolytic capacitor under the current pin length is calculated based on the vertical included angle and the tilt angle through a weighted algorithm. The weights of the vertical included angle and the tilt angle are configured based on the pin length, which are obtained through previous experiments on different plates. The weights are mainly used to adapt to different vibration experiment execution parameters. That is, different cyclic vibration experiments (used to simulate the actual vibration running environment of the circuit board loaded on the related equipment) are needed for electrolytic capacitors due to different equipment and positions of the electrolytic capacitors. In addition, with the increase of the pin length, the influence of the vertical included angle and the tilt angle is nonlinear, so a large amount of historical experimental data is needed for preset allocation.

[0051] The circuit board spectrum signal sorting method described in the embodiment optimizes the anti-shock performance of the circuit board through intelligent sorting of the spectrum signal. Specifically, the height representation capability of the laser scanning spectrum pattern is used to analyze the spectrum sub-pattern of each key component region to calculate the shift parameter of the key component, and the anti-shock index of the key component under different assembly parameters is comprehensively evaluated based on the assembly parameters and the shift parameter of the key component, and then the optimal assembly parameter is obtained. Based on the anti-shock indexes of multiple groups of experiments of the same component, the optimal assembly parameter combination is automatically sorted out to guide the design iteration.

[0052] As for the electrolytic capacitor, the method intelligently associates the assembly parameters with the anti-shock parameters, uses the height representation capability of the laser scanning spectrum pattern, combines the quadrant segmentation algorithm of the electrolytic capacitor and the flatness collection line, quantifies the micron-level height fluctuation, accurately calculates the tilt angle (with an accuracy of ±0.5°) and the non-inclined displacement of the electrolytic capacitor body (with a vertical included angle error of <1°), greatly improves the detection accuracy and efficiency of the key component, and generates a component-specific anti-shock index by fusing parameters such as pin length, tilt angle, and non-inclined displacement of the body through a weighted algorithm. In addition, the electrolytic capacitor pin length weight is dynamically adjusted to accurately reflect the differences in characteristics such as long pin anti-bending and short pin anti-pulling.

[0053] Embodiment 2:

[0054] The embodiment provides a circuit board spectrum signal sorting system, which comprises:

[0055] The scanning module is configured to scan the front surfaces of the plurality of different experimental circuit boards in sequence through a laser scanner after the end of the circuit board vibration experiment, and then obtain the spectrum pattern corresponding to the front surface of each experimental circuit board. The spectrum pattern is used to represent the height of the electronic component on the front surface of the experimental circuit board.

[0056] A local spectrum intercepting module is configured to automatically intercept the spectrum sub-patterns of a plurality of key component regions in each spectrum pattern by manually inputting a circuit board code, the key components including electrolytic capacitors, high-power inductors, and transformers.

[0057] An anti-vibration index evaluating module is configured to calculate a shift parameter of each key component based on the spectrum sub-patterns of each key component region, to count the assembly parameters and corresponding shift parameters of the same key component on different experimental circuit boards, and to evaluate the anti-vibration indexes of the key components on the different experimental circuit boards by a weighting algorithm.

[0058] A sorting module is configured to sort an optimal assembly parameter from a plurality of assembly parameters based on a plurality of anti-vibration indexes of the same key component.

[0059] It should be noted that, as to the apparatus in the above-mentioned embodiments, the specific manners in which the various modules perform operations have been described in detail in the embodiments of the method, and thus will not be described in detail here.

[0060] Embodiment 3

[0061] Corresponding to the above-mentioned method embodiments, the present disclosure also provides a circuit board spectrum signal sorting device. The circuit board spectrum signal sorting device described below can be mutually corresponding to the circuit board spectrum signal sorting method described above.

[0062] Figure 2 is a block diagram of a circuit board spectrum signal sorting device according to an example embodiment. As shown in Figure 2 The electronic device 800 can include one or more of a processor 801, a memory 802, a multimedia component 803, an I / O interface 804, and a communication component 805.

[0063] The processor 801 is configured to control overall operations of the electronic device 800 to complete all or part of the steps of the circuit board spectrum signal sorting method described above. The memory 802 is configured to store various types of data to support operations of the electronic device 800, which can include, for example, instructions for any application or method operating on the electronic device 800, and application-related data, such as contact data, sent and received messages, pictures, audio, video, and the like. The memory 802 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disk. The multimedia component 803 can include a screen and an audio component. The screen can be, for example, a touch screen, and the audio component is configured to output and / or input audio signals. For example, the audio component can include a microphone configured to receive external audio signals. The received audio signals can be further stored in the memory 802 or transmitted through the communication component 805. The audio component also includes at least one speaker configured to output audio signals. The I / O interface 804 provides an interface between the processor 801 and other interface modules, which can be a keyboard, a mouse, a button, and the like. The buttons can be virtual buttons or physical buttons. The communication component 805 is configured to perform wired or wireless communication between the electronic device 800 and other devices. Wireless communication, such as Wi-Fi, Bluetooth, near field communication (NFC), 2G, 3G or 4G, or a combination of one or more of them, so the corresponding communication component 805 can include a Wi-Fi module, a Bluetooth module, an NFC module.

[0064] In an example embodiment, the electronic device 800 can be implemented by one or more Application Specific Integrated Circuit (ASIC), Digital Signal Processor (DSP), Digital Signal Processing Device (DSPD), Programmable Logic Device (PLD), Field Programmable Gate Array (FPGA), controller, microcontroller, microprocessor or other electronic elements for performing the above-mentioned circuit board spectrum signal sorting method.

[0065] In another example embodiment, a computer readable storage medium including program instructions is also provided, which when executed by a processor, implement the steps of the above-mentioned circuit board spectrum signal sorting method. For example, the computer readable storage medium can be the above-mentioned memory 802 including program instructions, which can be executed by the processor 801 of the electronic device 800 to complete the above-mentioned circuit board spectrum signal sorting method.

[0066] Embodiment 4:

[0067] Corresponding to the above method embodiments, the embodiments of the present disclosure also provide a readable storage medium. The readable storage medium described below can be referred to each other corresponding to the above-mentioned circuit board spectrum signal sorting method.

[0068] A readable storage medium, the readable storage medium has a computer program stored thereon, the computer program is executed by a processor to implement the steps of the above-mentioned circuit board spectrum signal sorting method of the method embodiments.

[0069] The readable storage medium can be specifically a U disk, a mobile hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and various readable storage media that can store program codes.

[0070] The above only describes the preferred embodiments of the present disclosure and is not used to limit the present disclosure. For those skilled in the art, the present disclosure can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A method of sorting circuit board spectral signals, the method comprising: The method comprises: After the end of the circuit board vibration experiment, the front surface of a plurality of different experimental circuit boards is sequentially scanned by a laser scanner, and then the corresponding spectral pattern of the front surface of each experimental circuit board is obtained, and the spectral pattern is used to represent the height of the electronic device on the front surface of the experimental circuit board; The spectral sub-patterns of a plurality of key components in each spectral pattern are automatically intercepted by manually inputting the circuit board code, and the key components include electrolytic capacitors, high-power inductors and transformers; The offset parameters of the key components are calculated based on the spectral sub-patterns of each key component region, and the assembly parameters and the corresponding offset parameters of the same key component on different experimental circuit boards are counted, and the anti-shock index of the key component on different experimental circuit boards is evaluated by a weighting algorithm; Based on a plurality of anti-shock indexes of the same key component, an optimal assembly parameter is selected from a plurality of assembly parameters; Wherein, the offset parameters of the key components are calculated based on the spectral sub-patterns of each key component region, comprising: If the key component is an electrolytic capacitor, a preset shape feature extraction algorithm with the front and rear ends as arc lines and the middle as a square-shaped connection segment is used to frame the corresponding spectral feature region in the spectral sub-pattern; The middle axis of the spectral feature region is constructed, and the highest point on the middle axis is identified by RGB value, and a vertical line segment passing through the highest point and perpendicular to the middle axis is constructed, which is recorded as a boundary line; The spectral feature region is divided into four quadrant regions with the middle axis as the X axis and the boundary line as the Y axis, and a plurality of flatness collection lines with the same spacing and perpendicular to the middle axis are set on both sides of the boundary line as the reference line; The average RGB fluctuation of a plurality of flatness collection lines in the first quadrant region and the average RGB fluctuation of a plurality of flatness collection lines in the second quadrant region are calculated in sequence; And the quadrant region with smaller average RGB fluctuation and the corresponding associated quadrant region are identified as the inclined surface reference region; The maximum length value of the inclined surface reference region in the Y axis direction and the distance value in the X axis direction are measured, the distance value in the X axis direction is corrected based on the difference between the maximum length value in the Y axis direction and the standard diameter of the electrolytic capacitor, and the inclination angle of the electrolytic capacitor after the vibration test is calculated based on the corrected distance value in the X axis direction; A first reference line is constructed based on the solder position of the two pins of the electrolytic capacitor, and the vertical included angle between the first reference line and the middle axis is calculated. Wherein, the anti-shock index of the electrolytic capacitor is calculated by: obtaining the pin length in the electrolytic capacitor assembly parameter, configuring the weight of the vertical included angle and the inclination angle based on the pin length, and then calculating the anti-shock index of the electrolytic capacitor under the current pin length based on the vertical included angle and the inclination angle by a weighting algorithm.

2. A circuit board spectral signal sorting system, characterized by, The system comprises: A scanning module is used to sequentially scan the front surface of a plurality of different experimental circuit boards by a laser scanner after the end of the circuit board vibration experiment, and then the corresponding spectral pattern of the front surface of each experimental circuit board is obtained, and the spectral pattern is used to represent the height of the electronic device on the front surface of the experimental circuit board; A local spectrum intercepting module is configured to automatically intercept a spectrum subgraph of a plurality of key component regions in each spectrum pattern by a manually input circuit board code, the key components including electrolytic capacitors, high-power inductors, and transformers; An anti-shock index evaluation module is configured to calculate a shift parameter of each key component based on the spectrum subgraph of each key component region, and to statistically analyze the assembly parameters and corresponding shift parameters of the same key component on different experimental circuit boards, and to evaluate the anti-shock index of the key component on the different experimental circuit boards by a weighting algorithm; A sorting module is configured to sort an optimal assembly parameter from a plurality of assembly parameters based on a plurality of anti-shock indexes of the same key component. The anti-shock index evaluation module calculates the shift parameter of each key component based on the spectrum subgraph of each key component region, including: If the key component is an electrolytic capacitor, a preset front and rear end arc middle square connection segment shape image feature extraction algorithm is used to frame the corresponding spectral feature region in the spectrum subgraph; A central axis of the spectral feature region is constructed, and the highest point on the central axis is identified by an RGB value, and a perpendicular line segment passing through the highest point and perpendicular to the central axis is constructed, which is denoted as a boundary line; The spectral feature region is divided into four quadrant regions with the central axis as the X axis and the boundary line as the Y axis, and a plurality of flatness collection lines with the same interval and perpendicular to the central axis are set on both sides of the boundary line as the reference line; The average RGB fluctuation of the plurality of flatness collection lines in the first quadrant region and the average RGB fluctuation of the plurality of flatness collection lines in the second quadrant region are calculated in sequence; The quadrant region with smaller average RGB fluctuation and the corresponding associated quadrant region are identified as the inclined surface reference region; The maximum length value in the Y axis direction and the distance value in the X axis of the inclined surface reference region are measured, the distance value in the X axis is corrected based on the difference between the maximum length value in the Y axis direction and the standard diameter of the electrolytic capacitor, and the inclination angle of the electrolytic capacitor after the vibration test is calculated based on the corrected distance value in the X axis; A first reference line is constructed based on the solder position of the two pins of the electrolytic capacitor, and the vertical included angle between the first reference line and the central axis is calculated; The anti-shock index of the electrolytic capacitor in the anti-shock index evaluation module is calculated by: obtaining the pin length in the electrolytic capacitor assembly parameter, configuring the weight of the vertical included angle and the inclination angle based on the pin length, and then calculating the anti-shock index of the electrolytic capacitor under the current pin length based on the vertical included angle and the inclination angle by a weighting algorithm.

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