Chip double-sided detection system and method based on optical imaging and image processing

Abstract

The invention discloses a chip double-sided detection system based on optical imaging and image processing, at least one side of a detected chip is provided with pins which are distributed along an outline array and extend outwards, each pin comprises a pin inclined section and a pin transverse section, and the pin transverse sections are flush with the bottom surface of the detected chip; the AOI detection system comprises a chip conveying belt which extends horizontally and linearly, an AOI detection camera is arranged right above the chip conveying belt, detected chips are flatly placed on the chip conveying belt in a state that the back surfaces of the detected chips face upwards, and the chip conveying belt can convey the detected chips with the back surfaces facing upwards to the position right below the AOI detection camera one by one in the extending direction of the chip conveying belt; and under the condition that only one AOI detection camera is adopted, one-by-one front and back AOI detection of the chip is realized through a unique turn-over structure.

Description

Technical Field

[0001] The invention belongs to the field of chip AOI detection. Background Art

[0002] Automated optical inspection (AOI) of pinned chips (such as those in QFP, QFN, and SOP packages) is a critical step in ensuring chip quality and product reliability. These chips use pins to achieve electrical and mechanical connections to the circuit board. The soldering quality, morphological integrity, and coplanarity of the pin area directly determine the functional stability and long-term durability of the chip.

[0003] Among existing batch chip AOI inspection equipment, most focus on front-side inspection of the chip, such as identifying the clarity of the silkscreen on the chip body, the correctness of its orientation, and the presence of damage or contamination. Although this single-sided inspection is highly efficient, it ignores another crucial area of ​​the chip—the bottom surface and the image characteristics of its pins when viewed from above.

[0004] However, the bottom surface of a chip with pins is a critical area for pin soldering, and AOI must inspect the integrity of the solder joints here, including defects such as cold solder joints, bridging solder, insufficient or excessive solder, pin offset, and pin lift. These defects cannot be detected by front-side inspection alone. The pins themselves may bend, deform, break, or be contaminated during production or transportation. These defects are also located on the bottom surface of the chip and require AOI to capture and identify them from a specific angle. Therefore, front-side inspection alone cannot fully control the quality risks of chips with pins. Summary of the Invention

[0005] Purpose of the invention: In order to overcome the shortcomings of the prior art, the present invention provides a chip double-sided inspection system and method based on optical imaging and image processing. While using only one AOI inspection camera, the unique flip structure realizes AOI inspection of the front and back sides of the chip one by one.

[0006] Technical Solution: To achieve the above objectives, the present invention provides a chip double-sided inspection system based on optical imaging and image processing. The inspected chip has pins distributed along a contour array on at least one side and extending outward. The pins include an oblique pin section and a horizontal pin section. The horizontal pin section is flush with the bottom surface of the inspected chip.

[0007] The AOI inspection system includes a horizontally extending chip conveyor belt with an AOI inspection camera set directly above the chip conveyor belt. The chips to be inspected are placed flat on the chip conveyor belt with the reverse side facing up. The chip conveyor belt can transport the chips to be inspected with the reverse side facing up one by one along its own extension direction to the position directly below the AOI inspection camera.

[0008] The device also includes a device for flipping the chip under inspection, which flips the chip under inspection that is transferred to the bottom of the AOI inspection camera with the back side facing up, and redirects the flipped chip under inspection with the front side facing up to the bottom of the AOI inspection camera.

[0009] The device for flipping the chip under inspection includes a flipping guide unit, which includes a servo a on one side of the chip conveyor belt. The servo a shaft of the servo a is directly above the chip conveyor belt, and the servo a shaft is horizontal and perpendicular to the extension direction of the chip conveyor belt; the servo a shaft is coaxially connected to an arc-shaped arc-shaped cross-section arc-shaped resisting body, and the clockwise end of the arc-shaped resisting body is integrally connected to a flipping guide arm extending radially and outward along the servo a shaft.

[0010] The conveying direction of the chip conveyor belt is recorded as "forward"; when the arc-surface retaining body is at the rear side of the a servo shaft; during the forward conveying of the inspected chip on the chip conveyor belt, when the end limit of the pin on the front side of the inspected chip contacts the outer arc surface of the arc-surface retaining body, the inspected chip limited by the arc-surface retaining body is just centered directly below the AOI inspection camera. On this basis, the a servo shaft rotates counterclockwise, causing the flip guide arm to swing downward with the a servo shaft to press down on the pin cross section of the front pin of the inspected chip, thereby causing the rear end of the inspected chip to tilt upward until the end of the pin cross section swings down to contact the upper surface of the chip conveyor belt.

[0011] When the flip guide arm rotates along with the a-servo shaft to just face vertically downward, the end of the flip guide arm just contacts and slides with the upper surface of the chip conveyor belt.

[0012] When the arc-surface stopper is on the upper side of the steering gear shaft a, the gap between the lower end of the steering gear shaft a and the chip conveyor belt just exceeds the thickness of the chip being tested in the height direction.

[0013] A linear displacer is provided in parallel on one side of the chip conveyor belt; the linear displacer can drive the steering gear A to move horizontally along the extension direction of the chip conveyor belt.

[0014] A first auxiliary flip roller and a second auxiliary flip roller are respectively provided on the front and rear sides below the AOI inspection camera; the first auxiliary flip roller and the second auxiliary flip roller are both parallel to the a steering gear axis;

[0015] The inner rings of the first auxiliary turning roller and the second auxiliary turning roller are coaxially rotatably sleeved on the first shaft and the second shaft through bearings.

[0016] Also includes b servo and c servo;

[0017] The b servo shaft of the b servo is fixedly connected in parallel to the first shaft through the b rocker arm;

[0018] The c servo shaft of the c servo is fixedly connected to the second shaft in parallel through the c rocker arm;

[0019] When the second auxiliary flip roller is directly behind the C servo shaft, the rear end of the inspected chip directly below the AOI inspection camera will not touch the second auxiliary flip roller during the upward tilting process; when the rear end of the inspected chip directly below the AOI inspection camera has already tilted upward, the second auxiliary flip roller can swing counterclockwise under the rotation drive of the C servo shaft until it contacts the lower side of the rear end of the inspected chip.

[0020] The upper surface of the chip conveyor belt is a rubber non-slip frosted surface.

[0021] Servo a, servo b, and servo c are all on the same side of the chip conveyor belt when viewed from above.

[0022] Step 1: During the forward conveying of a chip to be inspected with its reverse side facing upward on a chip conveyor belt, when the pin ends on the front side of the chip to be inspected contact the arc surface and resist the external arc surface, the chip conveyor belt is paused;

[0023] Step 2: Control the a-servo shaft to rotate clockwise so that the flip guide arm avoids the "sight range" of the AOI inspection camera to avoid blocking the pins, and then inspect the back side of the chip to be inspected;

[0024] Step 3: Rotate the steering gear shaft a counterclockwise to make the flip guide arm press down on the pins on the front side of the chip to be tested, so that the rear end of the chip to be tested tilts upwards;

[0025] Step 4: The second auxiliary flip roller is driven by the rotation of the C servo shaft to swing counterclockwise until it contacts the lower side of the rear end of the chip to be tested;

[0026] Step 5: Rotate the steering gear shaft a clockwise until the flip guide arm rotates with the steering gear shaft a to just face vertically downward. At the same time, control the rotation of the steering gear shaft b to deflect the first auxiliary flip roller from the front side of the steering gear shaft b to the rear side of the steering gear shaft b.

[0027] Step 6: The flip guide unit as a whole moves backward, so that the end of the flip guide arm pushes the end of the front pin of the chip under inspection backward, so that the chip under inspection gradually tends to become upright under the constraint of the second auxiliary flip roller;

[0028] In step seven, the linear displacer continues to drive the flip guide unit to translate backward as a whole, so that the lower part of the chip under inspection, which has tended to be upright, is pushed backward by the flip guide unit, and the chip under inspection begins to flip forward. Subsequently, the chip under inspection that flips forward is buffered and supported by the first auxiliary flip roller. Finally, the linear displacer drives the flip guide unit to translate forward as a whole to the position in step one.

[0029] Step 8: Control the steering gear shaft b to rotate rapidly counterclockwise to quickly separate the first auxiliary flip roller from the chip under test. The chip under test falls to a horizontal position under the action of gravity, and the chip under test is now facing up.

[0030] Step 9: The linear actuator drives the flip guide unit to move backward as a whole, so that the end of the flip guide arm pushes the inspected chip with the front side facing up backward, causing the inspected chip to slide backward to be centered directly below the AOI inspection camera. The AOI inspection camera then inspects the front side of the inspected chip.

[0031] Step 10: Control the rotation of the a-servo shaft until the arc-shaped stopper is on the upper side of the a-servo shaft, and then restart the chip conveyor belt to convey it forward, so that the inspected chip that has completed double-sided inspection can smoothly pass through the gap between the lower end of the a-servo shaft and the surface of the chip conveyor belt.

[0032] Beneficial effects: This solution uses a unique flip-over structure to achieve AOI inspection of the front and back sides of the chip one by one while only using one AOI inspection camera during the straight-line transmission of the chip, greatly reducing the cost of core inspection equipment. It can then accurately capture the key features of the front and back sides of the chip in sequence, especially the subtle defects in the bottom pin area, truly achieving the goal of "zero defect" manufacturing and ensuring the high performance and long life of the chip in the final product. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 Schematic diagram of the front and back of the chip under test;

[0034] Figure 2 This is the overall front view of the scheme;

[0035] Figure 3 This is the overall three-dimensional schematic diagram of the scheme;

[0036] Figure 4 This is a state diagram at the end of "Step 1";

[0037] Figure 5 This is a state diagram at the end of "Step 2";

[0038] Figure 6 This is a state diagram at the end of "Step 3";

[0039] Figure 7 This is a state diagram at the end of "Step 4";

[0040] Figure 8 This is a schematic diagram of the status at the end of "Step 5";

[0041] Figure 9 This is a schematic diagram of the status at the end of "Step 6";

[0042] Figure 10 This is a schematic diagram of the status at the end of "Step 7";

[0043] Figure 11 This is a schematic diagram of the status at the end of "Step 8";

[0044] Figure 12 This is a schematic diagram of the status at the end of "Step 9";

[0045] Figure 13 This is a status diagram at the end of "Step 10". DETAILED DESCRIPTION

[0046] The present invention will be further described below with reference to the accompanying drawings.

[0047] As attached Figures 1 to 13 The chip double-sided detection system based on optical imaging and image processing is shown in FIG. Figure 1 The chip 2 to be tested has pins 1 distributed along the contour array and extending outward on at least one side. In this solution, there are pins 1 on both sides of the chip 2 to be tested. The pins 1 include a pin oblique section 1b and a pin transverse section 1a. The pin transverse section 1a is flush with the bottom surface of the chip 2 to be tested. The pins 1 in this solution are wide, flat and regular metal pins with a thickness greater than 1 mm. The bending moment capacity they are subjected to is sufficient to overcome the gravity of the chip 2 to be tested.

[0048] like Figure 2 and 3 As shown, the AOI inspection system includes a chip conveyor belt 3 extending horizontally and straight, and an AOI inspection camera 5 is arranged directly above the chip conveyor belt 3. The inspected chip 2 is placed flat on the chip conveyor belt 3 with the reverse side facing up, and the chip conveyor belt 3 can convey the inspected chip 2 with the reverse side facing up one by one along its own extension direction to directly below the AOI inspection camera 5; in order to prevent slipping during the flipping process of this scheme, the upper surface of the chip conveyor belt 3 is a rubber non-slip frosted surface, in order to maintain the horizontality of the section of the chip conveyor belt 3 used for transportation; the lower surface of the chip conveyor belt 3 is slidably matched with a horizontal support slide, and a limited position edge is set on the edge of the chip conveyor belt 3 to prevent deviation.

[0049] It also includes a device for flipping the chip to be inspected, which can flip the chip to be inspected 2 that is conveyed to the bottom of the AOI inspection camera 5 with the back side facing up, and redirect the flipped chip to be inspected 2 with the front side facing up to the bottom of the AOI inspection camera 5; the device for flipping the chip to be inspected includes a flipping guide unit 7, which includes an a servo 30 on one side of the chip conveyor belt 3, and the a servo shaft 17 of the a servo 30 is directly above the chip conveyor belt 3, and the a servo shaft 17 is horizontal and perpendicular to the extension direction of the chip conveyor belt 3; the a servo shaft 17 is coaxially connected to an arc-shaped arc-shaped cross-section arc-shaped blocker 19, and the clockwise end of the arc-shaped blocker 19 is integrally connected to a flipping guide arm 18 that extends radially and outward along the a servo shaft 17.

[0050] In this scheme, the conveying direction of the chip conveyor belt 3 is recorded as "forward"; when the arc-surface blocking body 19 is at the rear side of the a servo shaft 17; during the forward conveying of the inspected chip 2 on the chip conveyor belt 3, when the end of the pin 1 on the front side of the inspected chip 2 is limited to contact the outer arc surface of the arc-surface blocking body 19, the inspected chip 2 limited by the arc-surface blocking body 19 is just centered directly below the AOI inspection camera 5. On this basis, the a servo shaft 17 rotates counterclockwise, causing the flip guide arm 18 to swing downward with the a servo shaft 17 to press downward on the pin cross section 1a of the pin 1 on the front side of the inspected chip 2, thereby causing the rear end of the inspected chip 2 to tilt upward until the end of the pin cross section 1a swings down to contact the upper surface of the chip conveyor belt 3; when the flip guide arm 18 rotates with the a servo shaft 17 to just vertically downward, the end of the flip guide arm 18 just contacts and slides with the upper surface of the chip conveyor belt 3.

[0051] When the arc-shaped retaining body 19 is on the upper side of the steering gear shaft a 17, the gap between the lower end of the steering gear shaft a 17 and the chip conveyor belt 3 just exceeds the thickness of the chip 2 to be tested in the height direction. Figure 13 As shown, this feature enables the chip 2 to pass smoothly through the gap between the lower end of the a-servo shaft 17 and the chip conveyor belt 3 in step 10 after completing the double-sided inspection.

[0052] A linear displacer 16 is arranged parallel to one side of the chip conveyor belt 3. The linear displacer 16 is a horizontal electric telescopic device, a linear motor, etc. The linear displacer 16 can drive the a servo 30 to translate along the extension direction of the chip conveyor belt 3; the first auxiliary flip roller 6 and the second auxiliary flip roller 4 are respectively arranged on the front and rear sides below the AOI inspection camera 5; the first auxiliary flip roller 6 and the second auxiliary flip roller 4 are both parallel to the a servo shaft 17; the inner rings of the first auxiliary flip roller 6 and the second auxiliary flip roller 4 are coaxially rotatably sleeved on the first shaft 15 and the second shaft 8 through bearings.

[0053] It also includes a b servo 13 and a c servo 10; the a servo 30, the b servo 13 and the c servo 10 are all on the same side of the chip conveyor belt 3 when viewed from above; the b servo shaft 12 of the b servo 13 is fixedly connected in parallel to the first shaft 15 through the b rocker arm 14; the c servo shaft 11 of the c servo 10 is fixedly connected in parallel to the second shaft 8 through the c rocker arm 9.

[0054] When the second auxiliary flip roller 4 is directly behind the c-servo shaft 11, the rear end of the inspected chip 2 directly below the AOI inspection camera 5 will not touch the second auxiliary flip roller 4 during the upward tilting process; when the rear end of the inspected chip 2 directly below the AOI inspection camera 5 has already tilted upward, the second auxiliary flip roller 4 can swing counterclockwise under the rotation drive of the c-servo shaft 11 until it contacts the lower side of the rear end of the inspected chip 2.

[0055] Working methods:

[0056] Step 1: In the initial state, the second auxiliary turning roller 4 is located directly behind the steering gear shaft c 11, the first auxiliary turning roller 6 is located directly in front of the steering gear shaft b 12; the arc-shaped retaining member 19 is located behind the steering gear shaft a 17;

[0057] During the forward conveying of a chip 2 to be inspected with its reverse side facing upward on the chip conveyor belt 3, when the end of the pin 1 on the front side of the chip 2 to be inspected contacts the outer arc surface of the arc surface retaining body 19, the chip 2 to be inspected cannot move forward further under the restriction of the arc surface retaining body 19, and slips on the surface of the chip conveyor belt 3. At this time, the chip conveyor belt 3 is immediately paused; at this point, the chip 2 to be inspected, which is restricted by the arc surface retaining body 19, is just centered under the AOI inspection camera 5. Figure 4 .

[0058] Step 2: Control the a-servo shaft 17 to rotate clockwise to make the flip guide arm 18 avoid the "sight range" of the AOI inspection camera 5 to avoid blocking the pin 1. Then the AOI inspection camera 5 obtains an unobstructed complete image of the chip 2 under inspection with the reverse side facing up, and uses a high-resolution optical system to capture tiny defects on the chip surface, including scratches, contamination, broken wires, short circuits, poor welding, etc., thus achieving the reverse side inspection of the chip 2 under inspection. Figure 5 .

[0059] Step 3: The steering gear shaft 17 rotates counterclockwise, causing the flip guide arm 18 to finally swing downward along with the steering gear shaft 17 until it presses down the pin cross section 1a of the pin 1 on the front side of the chip 2 to be tested, thereby causing the rear end of the chip 2 to tilt upward until the end of the pin cross section 1a swings down to contact the upper surface of the chip conveyor belt 3; Figure 6 .

[0060] Step 4: When the rear end of the chip 2 being tested tilts upward, the second auxiliary flip roller 4 is immediately controlled to swing counterclockwise under the rotation drive of the C servo shaft 11 until it contacts the lower side of the rear end of the chip 2 being tested, so that the second auxiliary flip roller 4 upwardly supports the rear end of the chip 2 being tested; Figure 7 .

[0061] Step 5: While the second auxiliary flip roller 4 holds the rear end of the chip 2 being tested upward, the a servo shaft 17 is immediately controlled to rotate clockwise until the flip guide arm 18 rotates with the a servo shaft 17 to just face vertically downward, and the end of the flip guide arm 18 just contacts and slides with the upper surface of the chip conveyor belt 3; at the same time, the b servo shaft 12 is controlled to rotate, so that the first auxiliary flip roller 6 is deflected from the front side of the b servo shaft 12 to the rear side of the b servo shaft 12; Figure 8 .

[0062] Step 6: The linear displacer 16 drives the flip guide unit 7 to move backward as a whole, so that the end of the flip guide arm 18 pushes the end of the front pin 1 of the detected chip 2 backward, so that the detected chip 2 gradually tends to become upright under the constraint of the second auxiliary flip roller 4. Figure 9 .

[0063] In step seven, the linear displacer 16 continues to drive the flip guide unit 7 to move backward as a whole, so that the lower part of the detected chip 2, which has tended to be upright, is pushed backward by the flip guide unit 7, and the detected chip 2 begins to flip forward. Subsequently, the detected chip 2 that flips forward is buffered and supported by the first auxiliary flip roller 6. Finally, the linear displacer 16 drives the flip guide unit 7 to move forward as a whole to the position in step one. The state at this time is as follows: Figure 10 As shown;

[0064] Step 8: By controlling the b servo shaft 12 to rotate counterclockwise rapidly, the first auxiliary flip roller 6 is quickly deflected from the rear side of the b servo shaft 12 to the front side of the b servo shaft 12, so that the first auxiliary flip roller 6 quickly breaks away from the supporting effect on the detected chip 2, and the detected chip 2 falls to a horizontal position under the action of gravity. At this time, the detected chip 2 is facing up. Figure 11 ;

[0065] In step nine, the linear displacer 16 drives the flip guide unit 7 to translate backward as a whole, so that the end of the flip guide arm 18 pushes the front-facing chip 2 to be inspected backward, so that the chip 2 to be inspected slides backward to the center directly below the AOI inspection camera 5. Then the AOI inspection camera 5 obtains an unobstructed complete image of the front-facing chip 2 to be inspected directly below, and uses a high-resolution optical system to capture tiny defects on the chip surface, including scratches, contamination, broken wires, short circuits, poor welding, etc., thereby realizing the front detection of the chip 2 to be inspected. So far, when only one AOI inspection camera 5 is used, the unique flip structure of this solution realizes the AOI inspection of the front and back sides of the chip one by one, greatly reducing the cost of the core inspection equipment; Figure 12 .

[0066] Step 10: Control the rotation of the a-servo shaft 17 until the arc-surface stopper 19 is on the upper side of the a-servo shaft 17, so that the gap between the lower end of the a-servo shaft 17 and the chip conveyor belt 3 just exceeds the thickness of the chip 2 to be inspected in the height direction. Then restart the chip conveyor belt 3 to convey forward, so that the chip 2 to be inspected that has completed double-sided inspection can smoothly pass through the gap between the lower end of the a-servo shaft 17 and the surface of the chip conveyor belt 3, and continue to convey forward to the point where it is just below the AOI inspection camera 5. At this point, a double-sided inspection cycle is completed; wait for the double-sided inspection of the next chip 2 to be inspected, such as Figure 13 .

[0067] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A chip double-sided detection system based on optical imaging and image processing, wherein the chip to be detected (2) has pins (1) distributed along a contour array and extending outward on at least one side, the pins (1) comprising a pin oblique section (1b) and a pin transverse section (1a), and the pin transverse section (1a) is flush with the bottom surface of the chip to be detected (2); Its characteristics are: The AOI inspection system includes a chip conveyor belt (3) extending horizontally and linearly, an AOI inspection camera (5) is arranged directly above the chip conveyor belt (3), and the inspected chip (2) is placed flat on the chip conveyor belt (3) with its reverse side facing upward. The chip conveyor belt (3) can convey the inspected chips (2) with their reverse side facing upward one by one along its own extension direction to directly below the AOI inspection camera (5); The invention also includes a device for flipping a chip to be inspected, which flips the chip to be inspected (2) that is transferred to the bottom of the AOI inspection camera (5) with the back side facing upward, and redirects the flipped chip to be inspected (2) with the front side facing upward to the bottom of the AOI inspection camera (5).

2. The chip double-side inspection system based on optical imaging and image processing according to claim 1, characterized in that: The device for flipping a detected chip comprises a flipping guide unit (7), wherein the flipping guide unit (7) comprises a servo (30) on one side of a chip conveyor belt (3), wherein a servo shaft (17) of the servo (30) is directly above the chip conveyor belt (3), and the servo shaft (17) is horizontal and perpendicular to the extending direction of the chip conveyor belt (3); an arc-shaped resisting body (19) with a circular arc cross section is integrally connected to the coaxial outer side of the servo shaft (17), and a flipping guide arm (18) extending radially and outwardly along the servo shaft (17) is integrally connected to the clockwise end of the servo shaft (19); The conveying direction of the chip conveyor belt (3) is recorded as "forward"; when the arc surface retaining body (19) is at the rear side of the a steering gear shaft (17); during the forward conveying process of the detected chip (2) on the chip conveyor belt (3), when the end of the pin (1) on the front side of the detected chip (2) is limited to contact the outer arc surface of the arc surface retaining body (19), the detected chip (2) limited by the arc surface retaining body (19) is just centered below the AOI detection camera (5), based on this, the a steering gear shaft (17) rotates counterclockwise, causing the flip guide arm (18) to swing downward along with the a steering gear shaft (17) to press the pin cross section (1a) on the front side of the detected chip (2), thereby causing the rear end of the detected chip (2) to tilt upward until the end of the pin cross section (1a) swings down to contact the upper surface of the chip conveyor belt (3); When the flip guide arm (18) rotates along with the steering gear shaft (17) to just face vertically downward, the end of the flip guide arm (18) just contacts and slides with the upper surface of the chip conveyor belt (3).

3. The chip double-side inspection system based on optical imaging and image processing according to claim 2, characterized in that: When the arc-surface blocking body (19) is on the upper side of the steering gear shaft a (17), the gap between the lower end of the steering gear shaft a (17) and the chip conveyor belt (3) just exceeds the thickness of the chip (2) being tested in the height direction.

4. The chip double-side inspection system based on optical imaging and image processing according to claim 3, characterized in that: A linear displacer (16) is provided in parallel on one side of the chip conveyor belt (3); the linear displacer (16) can drive a steering gear (30) to move in parallel along the extension direction of the chip conveyor belt (3).

5. The chip double-side inspection system based on optical imaging and image processing according to claim 4, characterized in that: A first auxiliary flip roller (6) and a second auxiliary flip roller (4) are respectively provided on the front and rear sides below the AOI detection camera (5); the first auxiliary flip roller (6) and the second auxiliary flip roller (4) are both parallel to the a steering gear shaft (17); The inner rings of the first auxiliary turning roller (6) and the second auxiliary turning roller (4) are coaxially rotatably sleeved on the first shaft (15) and the second shaft (8) via bearings; Also includes a b steering gear (13) and a c steering gear (10); The b-steering gear shaft (12) of the b-steering gear (13) is fixedly connected in parallel to the first shaft (15) via the b-rocker arm (14); The c-steering gear shaft (11) of the c-steering gear (10) is fixedly connected in parallel to the second shaft (8) via the c-rocker arm (9); When the second auxiliary flip roller (4) is located directly behind the C steering gear shaft (11), the rear end of the chip to be inspected (2) directly below the AOI inspection camera (5) will not touch the second auxiliary flip roller (4) during the upward tilting process; when the rear end of the chip to be inspected (2) directly below the AOI inspection camera (5) has already tilted upward, the second auxiliary flip roller (4) can swing counterclockwise under the rotation drive of the C steering gear shaft (11) until it contacts the lower side of the rear end of the chip to be inspected (2).

6. The chip double-side inspection system based on optical imaging and image processing according to claim 5, characterized in that: The upper surface of the chip conveyor belt (3) is a rubber anti-skid frosted surface.

7. The chip double-side inspection system based on optical imaging and image processing according to claim 6, characterized in that: The a servo (30), the b servo (13) and the c servo (10) are all on the same side of the chip conveyor belt (3) when viewed from above.

8. The chip double-side inspection system based on optical imaging and image processing according to claim 7, characterized in that: Step 1: During the forward conveyance of a chip (2) to be tested with its reverse side facing upward on the chip conveyor belt (3), when the end of the pin (1) on the front side of the chip (2) to be tested contacts the outer arc surface of the arc surface stopper (19), the chip conveyor belt (3) is paused; Step 2: Control the steering gear shaft (17) to rotate clockwise so that the flip guide arm (18) avoids the "sight range" of the AOI inspection camera (5) to avoid blocking the pin (1), and then inspect the back side of the inspected chip (2); Step 3: the steering gear shaft (17) rotates counterclockwise, causing the flip guide arm (18) to press down the pin (1) on the front side of the chip to be tested (2), causing the rear end of the chip to be tested (2) to tilt upward; Step 4: The second auxiliary turning roller (4) is driven by the rotation of the C steering gear shaft (11) to swing counterclockwise until it contacts the lower side of the rear end of the chip to be detected (2); Step 5: the steering gear shaft a (17) rotates clockwise until the turning guide arm (18) rotates with the steering gear shaft a (17) to just face vertically downwards. At the same time, the steering gear shaft b (12) is controlled to rotate so that the first auxiliary turning roller (6) is deflected from the front side of the steering gear shaft b (12) to the rear side of the steering gear shaft b (12). Step 6: The flip guide unit (7) is entirely translated backward, so that the end of the flip guide arm (18) pushes the end of the front pin (1) of the chip to be tested (2) backward, so that the chip to be tested (2) gradually tends to become upright under the constraint of the second auxiliary flip roller (4); In step seven, the linear displacer (16) continues to drive the flip guide unit (7) to move backward as a whole, so that the lower part of the detected chip (2) that has tended to stand upright is pushed backward by the flip guide unit (7), and the detected chip (2) begins to flip forward, and then the flipped chip (2) is buffered and supported by the first auxiliary flip roller (6). Finally, the linear displacer (16) drives the flip guide unit (7) to move forward as a whole to the position in step one; Step eight, by controlling the b steering gear shaft (12) to rotate rapidly counterclockwise, the first auxiliary flip roller (6) is quickly separated from the detected chip (2), and the detected chip (2) falls to a horizontal position under the action of gravity, and the detected chip (2) is now facing upward; Step nine, the linear displacer (16) drives the flip guide unit (7) to move backward as a whole, so that the end of the flip guide arm (18) pushes the inspected chip (2) facing upward backward, so that the inspected chip (2) slides backward to the center directly below the AOI inspection camera (5), and then the AOI inspection camera (5) inspects the front of the inspected chip (2); Step 10, controlling the rotation of the steering gear shaft a (17) until the arc-shaped resisting body (19) is on the upper side of the steering gear shaft a (17), and then restarting the chip conveyor belt (3) to convey it forward, so that the inspected chip (2) that has completed the double-sided inspection can smoothly pass through the gap between the lower end of the steering gear shaft a (17) and the surface of the chip conveyor belt (3).

Images