Micro-channel domain controller and vehicle

Abstract

The invention provides a micro-channel domain controller and a vehicle. The micro-channel domain controller comprises a shell, a cover plate and a circuit board, wherein a groove is formed in the surface of the shell; a convex rib is arranged on one side, facing the groove, of the cover plate; the convex rib is mounted on the groove to form a flow channel, and the flow channel is used for liquid to pass through; the circuit board is arranged on the other side of the shell where the flow channel is located and used for heat dissipation of the circuit board. Wherein a fixed wall is arranged in the groove and is used for guiding liquid entering the flow channel; the convex ribs are embedded with the fixing walls, thereby reducing the gap of the flow channel, increasing the flow speed of the flow channel, and improving the heat dissipation efficiency of the circuit board. According to the invention, the defect of local overheating caused by a stagnant water area in a traditional large-flow channel is overcome, and the problems that the heat dissipation capability of an existing micro-channel is insufficient under the condition of extreme power consumption and the heat dissipation limit is difficult to break through are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of automobile cockpits, and in particular to a microfluidic domain controller and a vehicle. Background Art

[0002] As the computing power of automotive smart cockpits and entertainment and navigation systems increases, the demand for cooling high-power chips surges. Traditional water-cooling solutions employ millimeter-scale flow channel designs, which present significant drawbacks: large flow channels result in excessively large channel structures, increasing vehicle weight and easily forming dead zones that reduce heat dissipation efficiency. While existing cross-microchannel solutions can balance pressure drop and heat dissipation, their heat dissipation capabilities are limited when chip power consumption exceeds their capacity limits or when industrial-grade chips are used as replacements. Furthermore, existing microchannel manufacturing relies on high-cost processes such as etching and 3D printing, and full-area microchannel designs pose the risk of excessive system pressure drop. Therefore, a low-cost, lightweight solution with improved heat dissipation efficiency is urgently needed. Summary of the Invention

[0003] The problem solved by the present invention is the local overheating defect caused by the dead water area in the traditional large-flow flow channel, and the insufficient heat dissipation capacity of the existing micro-channel under extreme power consumption conditions, making it difficult to break through the heat dissipation limit.

[0004] To solve the above problems, the present invention provides a microfluidic domain controller, comprising: a shell, a cover plate and a circuit board; wherein, a groove is provided on the surface of the shell; a rib is provided on the side of the cover plate facing the groove; the rib is installed on the groove to form a flow channel for liquid to pass through; the circuit board is arranged on the outside of the shell where the flow channel is located, and is used for heat dissipation of components on the circuit board; wherein, a fixed wall is provided in the groove to guide the liquid entering the flow channel; the rib and the fixed wall are interlocked to narrow the flow channel gap, increase the flow rate of the flow channel, and improve the heat dissipation efficiency of the circuit board.

[0005] The technical effect achieved by adopting this technical solution: Compared with the existing technology, the interlocking design of the ribs and the fixed walls can reduce the flow channel gap and increase the flow rate of the liquid in the flow channel, thereby enhancing the convective heat transfer capacity and improving the heat dissipation efficiency. By setting a fixed wall in the groove and interlocking it with the ribs on the cover, the liquid flow is effectively guided, breaking the "dead water zone" that is easily formed in traditional high-flow flow channels, thereby avoiding local excessive temperatures and improving the uniformity and efficiency of the overall thermal management. The flow channel structure is integrated between the shell and the cover, and the circuit board is arranged on the other side of the flow channel to achieve a compact structural design, which is conducive to achieving efficient heat dissipation in a limited space.

[0006] Furthermore, the distance between the cover plate and the groove is between 1 mm and 3 mm.

[0007] This technical solution achieves the following: The distance between the cover and the groove is controlled within a range of 1mm to 3mm, ensuring good heat dissipation while avoiding the need for costly etching processes. Channel structures within this size range can be created through conventional machining or stamping processes, reducing manufacturing costs and improving the feasibility of mass production.

[0008] Furthermore, the flow channel gap between the rib and the fixed wall is between 0.1 mm and 0.9 mm; wherein, the fluid in the flow channel is close to the bottom surface of the flow channel to improve the heat exchange efficiency of the circuit board.

[0009] The technical effect achieved after adopting this technical solution is: by controlling the flow channel gap between the rib and the fixed wall to between 0.1mm and 0.9mm, the cross-sectional area of ​​the flow channel is effectively reduced, thereby significantly increasing the flow velocity of the liquid in this area. The increase in flow velocity can enhance the convective heat transfer coefficient between the fluid and the flow channel wall, thereby improving the overall heat dissipation efficiency. The narrow gap design allows the coolant to be closer to the bottom surface of the flow channel, thereby shortening the heat conduction path and improving the heat conduction efficiency. The heat generated by the circuit board can be quickly conducted to the bottom surface of the flow channel through the shell and carried away by the high-speed flowing coolant, achieving efficient cooling of high heat flux density areas. In a small-gap flow channel, the flow of coolant can more easily destroy the development of the thermal boundary layer, reduce local thermal resistance, and improve heat exchange efficiency. Compared with the problems of thick thermal boundary layer and low heat transfer efficiency in traditional large flow channels, this solution can effectively improve the thermal conduction performance.

[0010] Furthermore, the flow channel is provided with a heat dissipation section, and a fixed wall is provided in the heat dissipation section; wherein the fixed wall is provided with a drainage wall, and the drainage wall is used to guide the liquid into the heat dissipation section to improve the heat dissipation efficiency of the circuit board.

[0011] The technical effect achieved after adopting this technical solution: The design of the drainage wall can effectively guide the liquid into the key areas of the heat dissipation section, ensuring that the liquid fully covers the high heat flux density area, significantly improving the local heat exchange efficiency and avoiding heat accumulation. The structural design of the drainage wall can improve the flow distribution of the liquid in the flow channel, prevent the liquid from being retained or eddying in the flow channel, thereby reducing the overheating problems caused by dead water areas or uneven flow, and improving the uniformity of overall thermal management. The drainage wall actively guides the liquid to the bottom surface of the flow channel close to the circuit board, so that the liquid is more closely aligned with the heat conduction path, shortening the heat conduction distance, improving the heat conduction efficiency, and thus achieving more efficient heat exchange.

[0012] Furthermore, the guide wall divides the heat dissipation section into a first area and a second area; the first area is arranged in the middle of the heat dissipation section, and the second area is arranged on both sides of the heat dissipation section.

[0013] The technical effect achieved after adopting this technical solution is: the drainage wall divides the heat dissipation section into the first area and the second area, so that the liquid can be guided in a targeted manner according to the distribution of the heat source. Usually, electronic components are concentrated in the middle of the circuit board, and the heat flux density in this area is relatively high. Therefore, the first area is set as a high-priority heat dissipation section, which can achieve precise cooling of key heating areas and improve heat dissipation efficiency. The presence of the drainage wall can effectively control the flow direction and distribution of the coolant, avoid short circuits or uneven distribution of the coolant in the flow channel, thereby reducing local hot spots, improving the uniformity of the overall temperature distribution of the circuit board, and enhancing the thermal stability of the system. In actual applications, the distribution of heat sources on circuit boards is often uneven, and it is common to have concentrated heat in the middle and less heat on both sides. By zoning the heat dissipation section, the heat source distribution characteristics can be better matched, on-demand cooling can be achieved, and the flexibility and adaptability of the thermal management system can be improved.

[0014] Furthermore, the fixed wall is provided with a first diversion wall, which is arranged in the first area; protrusion structures are provided on both sides of the first diversion wall, and the protrusion structures are staggered to form turbulence through the liquid between the first diversion walls to achieve a cooling effect on the circuit board.

[0015] The technical effect achieved after adopting this technical solution: by arranging staggered protrusion structures on both sides of the first diverter wall, the liquid will be periodically disturbed when flowing through this area, destroying the boundary layer structure and inducing the formation of turbulence. Compared with the laminar state, turbulence has a stronger convective heat transfer capacity, which can significantly improve the heat transfer coefficient between the liquid and the flow channel wall, thereby improving the cooling efficiency of the circuit board. The combined design of the first diverter wall and the staggered protrusion structure can not only induce turbulence, but also perform secondary distribution and guidance of the coolant, so that the coolant is more evenly distributed in key areas and flows more fully, avoiding the problem of coolant short circuit or local low flow rate, thereby improving the use efficiency of the coolant. The formation of turbulence helps to thin the thermal boundary layer and speed up the speed of heat transfer from the shell wall to the coolant, thereby reducing the overall thermal resistance and improving the heat conduction efficiency.

[0016] Furthermore, the fixed wall is provided with a second diverter wall, and the second diverter wall is arranged in the second area; the second diverter wall is used to reduce the pressure drop in the flow channel.

[0017] The technical effect achieved after adopting this technical solution is: the second diverter wall is set in the second area of ​​the heat dissipation section, which is usually the area with the lowest heat load and relatively low requirements for liquid flow rate and heat exchange intensity. By setting the second diverter wall, the liquid flow path can be effectively dispersed to avoid the formation of local high-pressure areas or flow bottlenecks during the flow of the liquid, thereby reducing the flow resistance and pressure drop of the entire flow channel system and improving the pumping efficiency. On the basis of strengthening heat exchange and forming turbulence in the first area through the first diverter wall, the role of the second diverter wall in the second area is to balance the flow and heat exchange performance. It reduces the pressure drop while ensuring sufficient flow of the liquid, avoids unnecessary energy consumption due to excessive disturbance or excessive flow rate, and achieves an optimized match between heat exchange efficiency and fluid dynamics performance.

[0018] Furthermore, a plurality of positioning ribs are provided on both sides of the cover plate to ensure that when the cover plate is set on the shell, the positioning ribs limit the convex ribs and the fixed wall.

[0019] The technical effect achieved by adopting this technical solution is as follows: positioning ribs are set at the bottom of the cover plate to accurately locate the relative position of the ribs and the fixed walls during the assembly process of the cover plate and the shell, preventing assembly offset or misalignment. This helps to ensure the consistency of the flow channel gap and avoid local flow channel narrowing or blockage due to assembly errors, thereby improving the reliability and repeatability of the flow channel structure. Through the limiting effect of the positioning ribs, the ribs can be more stably and accurately embedded between the fixed walls, forming a tightly fitting flow channel structure. This not only improves the sealing of the flow channel and prevents liquid leakage, but also enhances the structure's resistance to vibration and deformation during operation, improving the safety and long-term stability of the liquid cooling system.

[0020] Furthermore, the circuit board is provided with a chip, which corresponds to the outside of the area where the first area on the shell is located; wherein a heat-conducting structure is provided between the chip and the outside of the shell, and the chip transfers heat to the position corresponding to the first area on the shell through the heat-conducting structure to achieve equipment cooling.

[0021] The technical effect achieved by adopting this solution is that the chip, the primary heat-generating element on the circuit board, conducts heat directly to the first area corresponding to the outer shell through the thermally conductive structure. This area, where the liquid flow rate and heat exchange capacity are highest in the flow channel, forms a highly efficient heat conduction path, significantly improving the cooling effect of the chip. The thermally conductive structure directly connects the chip and the shell, avoiding the high thermal resistance associated with traditional heat dissipation methods that conduct heat through multi-layer PCBs, brackets, or air gaps. This shortens the heat conduction path and improves heat conduction efficiency, effectively reducing the chip's operating temperature.

[0022] To solve the above problems, the present invention provides a vehicle, including a domain controller provided by any of the above technical solutions, and the vehicle includes: a refrigeration device, the refrigeration device is connected to the flow channel, and the heat in the flow channel is cooled by the refrigeration device and then returns to the flow channel to achieve circulation.

[0023] This technical solution achieves the following: By connecting the domain controller's flow channel with the refrigeration equipment, a closed-loop liquid cooling system is formed. After absorbing heat generated by the domain controller in the flow channel, the coolant enters the refrigeration equipment for cooling and then recirculates back to the flow channel, achieving continuous and stable heat removal and cooling. This system effectively addresses the heat dissipation requirements of high-power density electronic components under complex operating conditions, significantly improving the vehicle's thermal management capabilities.

[0024] In summary, the various technical solutions described above can offer one or more of the following advantages or beneficial effects: i) By providing a fixed wall within the housing recess and interlocking with the ribs on the cover plate, the liquid flow path is guided, effectively eliminating dead zones that are common in traditional high-flow channels, preventing local overheating and improving thermal management uniformity and overall heat dissipation efficiency. ii) By controlling the gap between the ribs and the fixed wall to between 0.1 mm and 0.9 mm, the coolant flow rate is significantly increased, enhancing the convective heat transfer coefficient between the coolant and the channel wall, thereby improving heat dissipation efficiency, making it particularly suitable for high-heat flux density scenarios. iii) By utilizing a small-gap turbulence enhancement design only in critical heat dissipation sections (such as the first region), rather than a full-channel microchannel structure, this design achieves efficient local cooling while avoiding the manufacturing difficulties and clogging associated with a complex overall structure, resulting in excellent engineering practicality. iv) The distance between the cover plate and the recess is controlled between 1 mm and 3 mm, avoiding the use of costly etching processes, adapting to a variety of coolant types, and facilitating assembly and sealing, thereby improving the system's manufacturability and reliability. v) The heat dissipation section is divided into a first area in the middle (high heat flux density area) and second areas on both sides (auxiliary heat dissipation sections), so as to realize the hierarchical utilization of the coolant, avoid the waste of cooling resources, and improve the efficiency of the overall cooling system. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 Schematic diagram of the overall structure of a microfluidic domain controller in an embodiment of the present invention; Figure 2 for Figure 1 Exploded diagram; Figure 3 Schematic diagram of the structure of the microfluidic domain controller from other perspectives in an embodiment of the present invention Figure 1 ; Figure 4 for Figure 3 Sectional view along AA; Figure 5 for Figure 4 Enlarged view at point B; Figure 6 Schematic diagram of the structure of the microfluidic domain controller cover in an embodiment of the present invention; Figure 7 Schematic diagram of the structure of the microfluidic domain controller from other perspectives in an embodiment of the present invention Figure 2 .

[0026] Description of reference numerals: 1-microfluidic domain controller; 12-housing; 121-groove; 122-fixed wall; 1221-drainage wall; 1222-first diversion wall; 1223-raised structure; 1224-second diversion wall; 123-water inlet; 124-water outlet; 13-cover plate; 131-raised rib; 132-reinforcement rib; 14-circuit board; 141-chip; 142-heat-conducting structure; 15-bottom cover; 16-fastener; 17-flow channel; 171-heat dissipation section; 1711-first area; 1712-second area; 1713-positioning rib. DETAILED DESCRIPTION

[0027] The purpose of the present invention is to provide a microfluidic domain controller and automobile, which are used to realize microfluidic design through the ribs of the water channel cover and the grooves of the shell flow channel, avoid the existence of dead water areas in the flow channel, and break through the boundaries of the flow channel heat dissipation capacity; use ordinary die-casting and machining low-cost processes to achieve the microfluidic effect, and avoid the use of high-cost etching and 3D printing and other technologies to achieve the microfluidic effect.

[0028] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0029] See also Figures 1 to 5 The present invention provides a microfluidic domain controller, comprising: a shell 12, a cover 13 and a circuit board 14; wherein, a groove 121 is provided on the surface of the shell 12; a rib 131 is provided on the side of the cover 13 facing the groove 121; the rib 131 is installed on the groove 121 to form a flow channel 17, and the flow channel 17 is for liquid to pass through; the circuit board 14 is arranged on the outer side of the shell 12 where the flow channel 17 is located, and is used for heat dissipation of components on the circuit board 14; wherein, a fixed wall 122 is provided in the groove 121, for guiding the liquid entering the flow channel 17; the rib 131 and the fixed wall 122 are interlocked with each other to narrow the gap in the flow channel 17.

[0030] Specifically, the microfluidic domain controller 1 includes: a shell 12, a cover 13, a circuit board 14 and a bottom cover 15. The shell 12 serves as the main structural component that carries the flow channel 17 structure and the circuit board 14; the cover 13 cooperates with the shell 12 to form a closed flow channel 17; the circuit board 14 carries electronic components and is arranged on the other side of the shell 12, and realizes heat conduction and heat dissipation through the shell 12; the bottom cover 15 covers the circuit board 14 and is fixedly connected to the shell 12 by fasteners 16. The shell 12 is made of metal, and a groove 121 is provided on one side of the surface. The groove 121 is used to form a flow channel 17 structure for liquid circulation. A fixed wall 122 is provided in the groove 121 to guide the flow direction of the liquid and improve the uniformity of the fluid distribution in the flow channel 17. The cover 13 is made of metal or a composite material, and a rib 131 structure is provided on the side facing the groove 121 of the shell 12. A local narrowing area of ​​the flow channel 17 is formed between the rib 131 and the fixed wall 122 , which accelerates the flow velocity of the coolant in this area, forms local turbulence, and enhances the heat exchange capacity.

[0031] Preferably, the liquid flowing in the flow channel 17 is a coolant.

[0032] Preferably, the shape of the groove 121 is optimized according to the heat source of the circuit board 14 .

[0033] Preferably, the rib 131 is a linear or strip-shaped structure, usually corresponding to the position of the fixed wall 122 of the groove 121 , and is used to cooperate with the fixed wall 122 to form a locally reduced gap in the flow channel 17 .

[0034] Preferably, the rib 131 and the cover plate 13 are an integrally formed structure and can be manufactured by casting or stamping.

[0035] Preferably, the interlocking structure of the rib 131 and the fixed wall 122 effectively destroys the thermal boundary layer, improves the heat exchange efficiency of the parts, and is suitable for heat dissipation in high heat flux density areas such as the chip 141.

[0036] Preferably, a reinforcing rib 132 is provided on the top surface of the cover plate 13 to prevent the cover plate 13 from deforming.

[0037] See also Figure 1 and Figure 2 The distance between the cover plate 13 and the groove 121 is between 1 mm and 3 mm.

[0038] Specifically, after the micro-channel domain controller 1 is assembled, the vertical distance between the inner surface of the cover 13 (the side with the rib 131 ) and the bottom surface of the groove 121 of the housing 12 is .

[0039] Preferably, the vertical spacing constitutes the main channel height for liquid circulation, that is, the overall height of the flow channel 17.

[0040] Preferably, within the range of 1 mm to 3 mm, it can be achieved through conventional machining, stamping or casting processes without the use of expensive etching or micromachining technology, which is conducive to reducing manufacturing costs.

[0041] See also Figure 5 The gap between the rib 131 and the fixed wall 122 in the flow channel 17 is between 0.1 mm and 0.9 mm; wherein, the fluid in the flow channel 17 is close to the bottom surface of the flow channel 17 to improve the heat exchange efficiency of the circuit board 14.

[0042] Specifically, by controlling the gap between the rib 131 and the fixed wall 122 within the flow channel 17 to between 0.1 mm and 0.9 mm, microchannels are formed. As the liquid flows through these areas, the narrowing of the channel forces it to accelerate. According to the principles of fluid mechanics, an increase in flow velocity leads to an increase in the convective heat transfer coefficient, thereby enhancing the ability to transfer heat from the solid surface to the liquid.

[0043] Preferably, the micro channel refers to a channel gap between 0.1 mm and 0.9 mm, which must be achieved through ordinary die casting and machining.

[0044] Preferably, the distance between the fluid and the wall in the microchannel is closer, the boundary layer is thin, the thermal resistance is lower, and the heat conduction is more efficient. The surface area and volume ratio of the microchannel can be several times that of the traditional water channel. This design can increase the heat exchange efficiency by 5%-10%.

[0045] Preferably, in a narrow gap, the liquid is more likely to form turbulent flow rather than laminar flow. In the turbulent state, the mixing between liquid molecules is more intense, which can more effectively remove heat and further improve the heat exchange efficiency.

[0046] Preferably, when the liquid flows close to the bottom surface of the flow channel 17, it can directly act on the part that needs heat dissipation the most, reducing the distance and the number of material interfaces that the heat must traverse, thereby reducing the overall thermal resistance and improving the heat dissipation efficiency of the system.

[0047] See also Figure 7 The flow channel 17 is provided with a heat dissipation section 171, and a fixed wall 122 is provided in the heat dissipation section 171; wherein, the fixed wall 122 is provided with a drainage wall 1221, and the drainage wall 1221 is used to guide the liquid into the heat dissipation section 171 to improve the heat dissipation efficiency of the circuit board 14.

[0048] Specifically, within heat dissipation section 171, fixed wall 122 is disposed within recess 121 of housing 12 and is integrally formed with housing 12 or secured by welding, embedding, or other methods. Fixed wall 122 includes drainage wall 1221, which is used to separate flow channel 17, control the liquid flow path, prevent uneven liquid flow in flow channel 17, and ensure that the liquid flows through the heating area of ​​PCB 14 in a limited manner.

[0049] Preferably, the heat dissipation section 171 is a region in the flow channel 17 specifically designed for centralized heat exchange, located at positions corresponding to the main heating elements on the housing 12 and the circuit board 14. The heat dissipation section 171 is the most intense heat exchange and most critical part of the liquid flow path for thermal management.

[0050] See also Figure 7 The guide wall 1221 divides the heat dissipation section 171 into a first area 1711 and a second area 1712 ; the first area 1711 is arranged in the middle of the heat dissipation section 171 , and the second area 1712 is arranged on both sides of the heat dissipation section 171 .

[0051] Specifically, first region 1711 is typically located in the middle of the heat dissipation zone, corresponding to the location of the primary heat-generating components on circuit board 14. This area has the highest heat flux density and therefore requires priority cooling to avoid local overheating. Second regions 1712, located on either side of the heat dissipation zone, primarily serve to assist in heat dissipation, handling heat from other electronic components or the housing 12 itself, ensuring a more uniform temperature distribution throughout the system.

[0052] See also Figure 7 The fixed wall 122 is provided with a first diversion wall 1222, and the first diversion wall 1222 is arranged in the first area 1711; protrusion structures 1223 are provided on both sides of the first diversion wall 1222, and the protrusion structures 1223 are staggered to form turbulence through the liquid between the first diversion walls 1222 to achieve a cooling effect on the circuit board 14.

[0053] Specifically, the first diverter wall 1222 is arranged between the two diversion walls 1221, that is, the area corresponding to the main heating components such as the chip 141 on the circuit board 14. The first diverter wall 1222 is usually a strip structure, which is arranged approximately perpendicular to the direction of liquid flow or at a certain angle, and is used to divert and guide the liquid. On both sides of the first diverter wall 1222, that is, on both side walls of the liquid flow path, a protruding structure 1223 is provided. The protruding structures 1223 are staggered on both sides of the first diverter wall 1222, that is, the protruding position on one side is staggered with that on the other side. When the liquid flows through the narrow channel between the first diverter walls 1222, due to the disturbing effect of the protruding structure 1223, the liquid in the original laminar state is broken, forming local eddies and turbulence. The thermal boundary layer of the liquid in the turbulent state becomes thinner, which enhances the heat exchange efficiency between the fluid and the wall surface, thereby significantly improving the heat transfer coefficient.

[0054] Preferably, the shape of the protruding structure 1223 can be semicircular, triangular, rectangular, wavy, etc., and the design is optimized according to the results of fluid dynamics simulation.

[0055] See also Figure 1 and Figure 2The fixed wall 122 is provided with a second diverter wall 1224 , and the second diverter wall 1224 is arranged in the second area 1712 ; the second diverter wall 1224 is used to reduce the pressure drop in the flow channel 17 .

[0056] Specifically, the second diversion wall 1224 is arranged on the outside of the guide wall 1221 to reduce the pressure drop of the liquid in the entire flow channel 17 and avoid increasing pumping energy consumption due to excessive local resistance.

[0057] Preferably, by reasonably designing the structure and number of the second diversion walls 1224 , balanced control of the pressure drop in the flow channel 17 can be achieved.

[0058] See also Figure 6 A plurality of positioning ribs 1713 are provided on both sides of the cover plate 13 to ensure that when the cover plate 13 is set on the shell 12, the positioning ribs 1713 limit the convex rib 131 and the fixing wall 122.

[0059] Specifically, the cover plate 13 is a downwardly concave structure, and a number of positioning ribs 1713 are provided on both sides of the bottom surface of the cover plate 13. During the assembly process of the cover plate 13 and the shell 12, the positioning ribs 1713 are abutted against the edge of the groove 121 to limit the convex rib 131 and the fixed wall 122, thereby avoiding misalignment or offset of the convex rib 131 and the fixed wall 122, which may cause blockage of the flow channel 17.

[0060] See also Figure 2 The circuit board 14 is provided with a chip 141, and the chip 141 corresponds to the outside of the area where the first area 1711 on the shell 12 is located; wherein, a heat-conducting structure 142 is provided between the chip 141 and the outside of the shell 12, and the chip 141 transfers heat to the position corresponding to the first area 1711 on the shell 12 through the heat-conducting structure 142 to achieve equipment cooling.

[0061] Specifically, the chip 141 is the main heating element on the circuit board. It is usually arranged in the area with the highest heat flux density on the circuit board 14. It is the key component in the microfluidic domain controller 1 that needs priority heat dissipation. The chip 141 is arranged at a position on the circuit board 14 corresponding to the first area 1711 of the shell 12. The first area 1711 is the middle area of ​​the heat dissipation section 171. The liquid has the fastest flow rate and the strongest heat exchange capacity in this area. The chip 141 conducts heat to this area through the shell 12, and the liquid carries it away efficiently. The heat-conducting structure 142 refers to a heat-conducting medium between the chip 141 and the shell 12, which is used to efficiently conduct the heat generated by the chip 141 to the shell 12.

[0062] Preferably, the heat-conducting structure 142 has good thermal conductivity and compressibility, ensuring a tight fit between the chip 141 and the housing 12 and low thermal resistance.

[0063] The present invention provides a vehicle, including the microfluidic domain controller 1 provided by any of the above technical solutions, and the vehicle includes: a refrigeration device, the refrigeration device is connected to the flow channel 17, and the heat in the flow channel 17 is cooled by the refrigeration device and then returns to the flow channel 17 to achieve circulation.

[0064] Specifically, the microfluidic domain controller 1 is connected to the refrigeration equipment, forming a closed-loop liquid cooling system. Coolant flows from the refrigeration equipment, enters the flow channel 17 through the water inlet 123 of the housing 12, and is guided by the drainage wall 1221 into the first area 1711. It absorbs heat transferred from the chip 141 and other heating elements through the housing 12, then flows out through the water outlet 124. After heat exchange, the coolant enters the refrigeration equipment for cooling, and then re-enters the flow channel 17, achieving continuous circulation cooling.

[0065] Preferably, the refrigeration equipment can ensure that the microfluidic domain controller 1 can maintain a stable temperature under high load operation, preventing overheating, frequency reduction or failure.

[0066] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be based on the scope defined by the claims.

Claims

1. A microfluidic domain controller, characterized in that: include: A housing (12), wherein a groove (121) is provided on a surface of the housing (12); A cover plate (13), wherein a convex rib (131) is provided on a side of the cover plate (13) facing the groove (121); the convex rib (131) is mounted on the groove (121) to form a flow channel (17), and the flow channel (17) is for liquid to pass through; a circuit board (14), the circuit board (14) being arranged outside the housing (12) where the flow channel (17) is located, and being used for heat dissipation of components on the circuit board (14); A fixed wall (122) is provided in the groove (121) for guiding the liquid entering the flow channel (17); the rib (131) and the fixed wall (122) are engaged with each other to reduce the gap in the flow channel (17).

2. The microfluidic domain controller according to claim 1, characterized in that The distance between the cover plate (13) and the groove (121) is between 1 mm and 3 mm.

3. The microfluidic domain controller according to claim 2, characterized in that: The gap between the rib (131) and the fixed wall (122) of the flow channel (17) is between 0.1 mm and 0.9 mm; wherein the fluid in the flow channel (17) is close to the bottom surface of the flow channel (17) to improve the heat exchange efficiency of the circuit board (14).

4. The microfluidic domain controller according to claim 1, characterized in that The flow channel (17) is provided with a heat dissipation section (171), and the fixed wall (122) is provided in the heat dissipation section (171); The fixed wall (122) is provided with a drainage wall (1221), and the drainage wall (1221) is used to guide liquid into the heat dissipation section (171), thereby improving the heat dissipation efficiency of the circuit board (14).

5. The microfluidic domain controller according to claim 4, characterized in that: The guide wall (1221) divides the heat dissipation section (171) into a first area (1711) and a second area (1712); the first area (1711) is arranged in the middle of the heat dissipation section (171), and the second area (1712) is arranged on both sides of the heat dissipation section (171).

6. The microfluidic domain controller according to claim 5, characterized in that: The fixed wall (122) is provided with a first diversion wall (1222), and the first diversion wall (1222) is arranged in the first area (1711); protrusion structures (1223) are provided on both sides of the first diversion wall (1222), and the protrusion structures (1223) are arranged in a staggered manner, so that turbulence is formed by the liquid between the first diversion walls (1222), so as to achieve a cooling effect on the circuit board (14).

7. The microfluidic domain controller according to claim 5, characterized in that: The fixed wall (122) is provided with a second diversion wall (1224), and the second diversion wall (1224) is arranged in the second area (1712); the second diversion wall (1224) is used to reduce the pressure drop in the flow channel (17).

8. The microfluidic domain controller according to claim 1, characterized in that: A plurality of positioning ribs (1713) are provided on both sides of the cover plate (13) to ensure that when the cover plate (13) is set on the shell (12), the positioning ribs (1713) limit the convex rib (131) and the fixed wall (122).

9. The microfluidic domain controller according to claim 5, characterized in that: The circuit board (14) is provided with a chip (141), and the chip (141) corresponds to the outside of the area where the first area (1711) on the housing (12) is located; A heat-conducting structure (142) is provided between the chip (141) and the outer side of the housing (12), and the chip (141) transfers heat to a position corresponding to the first area (1711) on the housing (12) through the heat-conducting structure (142), thereby achieving device cooling.

10. A vehicle, characterized in that: The vehicle comprises the microfluidic domain controller according to any one of claims 1 to 9, wherein: A refrigeration device is connected to the flow channel (17), and the heat in the flow channel (17) is cooled by the refrigeration device and then returns to the flow channel (17) to achieve circulation.

Images