Microfluidic domain controller and vehicle

Abstract

The application provides a micro flow channel field controller and a vehicle, comprising: a shell, a cover plate and a circuit board; wherein the surface of the shell is provided with a groove; the side of the cover plate facing the groove is provided with a convex rib; the convex rib is installed on the groove to form a flow channel for liquid to pass through; the circuit board is arranged on the other side of the shell where the flow channel is located for heat dissipation of the circuit board; wherein a fixed wall is arranged in the groove for guiding the liquid entering the flow channel; the convex rib and the fixed wall are embedded with each other to reduce the gap of the flow channel, increase the flow rate of the flow channel and improve the heat dissipation efficiency of the circuit board. The application solves the local overheating defects caused by the dead water area in the traditional large flow channel, and the problems that the existing micro flow channel has insufficient heat dissipation capacity under extreme power consumption conditions and is difficult to break through the heat dissipation limit.

Description

Technical Field

[0001] This invention relates to the field of automotive cockpit technology, and more specifically, to a microfluidic domain controller and a vehicle. Background Technology

[0002] With the increasing computing power of automotive intelligent cockpits and infotainment navigation systems, the demand for heat dissipation of high-power chips has surged. Traditional water-cooling solutions using millimeter-level flow channel designs have significant drawbacks: high-flow-rate channels result in excessively large channel structures, increasing the overall vehicle weight, and are prone to creating stagnant zones that reduce heat dissipation efficiency. While existing cross-microchannel solutions can balance voltage drop and heat dissipation, their heat dissipation capacity is limited when chip power consumption exceeds its capacity limits or when industrial-grade replacement chips are used. Furthermore, existing microchannel manufacturing relies on high-cost processes such as etching and 3D printing, and full-area microchannel designs pose a risk of excessive system voltage drop. Therefore, there is an urgent need for a low-cost, lightweight solution that improves heat dissipation efficiency. Summary of the Invention

[0003] The problem solved by this invention is the local overheating defect caused by the dead water zone in traditional high-flow channels, and the insufficient heat dissipation capacity of existing microchannels under extreme power consumption conditions, making it difficult to break through the heat dissipation limit.

[0004] To address the aforementioned problems, this invention provides a microfluidic domain controller, comprising: a housing, a cover plate, and a circuit board; wherein, the surface of the housing is provided with a groove; the cover plate is provided with a rib on the side facing the groove; the rib is installed on the groove to form a flow channel through which liquid passes; the circuit board is disposed on the outside of the housing where the flow channel is located for heat dissipation of components on the circuit board; wherein, a fixed wall is provided in the groove for guiding the liquid entering the flow channel; the rib and the fixed wall interlock to reduce the gap in the flow channel, thereby increasing the flow velocity in the flow channel and improving the heat dissipation efficiency of the circuit board.

[0005] The technical effects achieved by adopting this solution are as follows: Compared with existing technologies, the interlocking design of the ribs and fixed walls reduces the channel gap, increases the liquid flow velocity in the channel, thereby enhancing convective heat transfer and improving heat dissipation efficiency. By setting a fixed wall in the groove and interlocking it with the ribs on the cover plate, the liquid flow is effectively guided, breaking the "dead water zone" that is easily formed in traditional high-flow channels, thus avoiding excessively high local temperatures and improving the uniformity and efficiency of overall thermal management. Integrating the channel structure between the shell and the cover plate, and arranging the circuit board on the other side of the channel, achieves a compact design, which is conducive to achieving efficient heat dissipation in a limited space.

[0006] Furthermore, the distance between the cover plate and the groove is between 1mm and 3mm.

[0007] The technical benefits of this solution include: controlling the distance between the cover plate and the groove within the range of 1mm to 3mm, ensuring good heat dissipation while avoiding costly etching processes. The flow channel structure within this size range can be achieved through conventional machining or stamping processes, which helps reduce manufacturing costs and improves the feasibility of mass production.

[0008] Furthermore, the flow channel gap between the rib and the fixed wall is between 0.1mm and 0.9mm; the fluid in the flow channel is close to the bottom surface of the flow channel to improve the heat exchange efficiency of the circuit board.

[0009] The technical effects achieved by adopting this solution are as follows: By controlling the gap between the rib and the fixed wall within 0.1mm to 0.9mm, the cross-sectional area of ​​the flow channel is effectively reduced, thereby significantly increasing the flow velocity of the liquid in this area. The increased flow velocity enhances the convective heat transfer coefficient between the fluid and the flow channel wall, thus improving overall heat dissipation efficiency. This narrow gap design allows the coolant to be closer to the bottom surface of the flow channel, shortening the heat conduction path and improving heat transfer efficiency. The heat generated by the circuit board can be rapidly conducted to the bottom surface of the flow channel through the casing and carried away by the high-speed flowing coolant, achieving efficient cooling of areas with high heat flux density. In a small-gap flow channel, the coolant flow more easily disrupts the development of the thermal boundary layer, reducing local thermal resistance and improving heat transfer efficiency. Compared to the problems of a thick thermal boundary layer and low heat transfer efficiency in traditional large flow channels, this solution effectively improves heat transfer performance.

[0010] Furthermore, the flow channel is equipped with a heat dissipation section, and a fixed wall is installed within the heat dissipation section; among which, the fixed wall is equipped with a flow guide wall, which is used to guide the liquid into the heat dissipation section to improve the heat dissipation efficiency of the circuit board.

[0011] The technical effects achieved by adopting this solution are as follows: The design of the flow-guiding wall effectively guides the liquid into the key areas of the heat dissipation section, ensuring that the liquid fully covers areas with high heat flux density, significantly improving local heat exchange efficiency and preventing heat accumulation. Through the structural design of the flow-guiding wall, the flow distribution of the liquid within the channel can be improved, preventing stagnation or eddies, thereby reducing overheating problems caused by stagnant areas or uneven flow, and improving the uniformity of overall thermal management. The flow-guiding wall actively guides the liquid to the bottom surface of the channel near the circuit board, making the liquid more closely conform to the heat conduction path, shortening the heat conduction distance, improving heat conduction efficiency, and thus achieving more efficient heat exchange.

[0012] Furthermore, the drainage wall divides the heat dissipation section into a first region and a second region; the first region is located in the middle of the heat dissipation section, and the second region is located on both sides of the heat dissipation section.

[0013] The technical effects achieved by adopting this solution are as follows: The flow-guiding wall divides the heat dissipation section into a first and a second zone, allowing the liquid to be guided in a targeted manner according to the heat source distribution. Electronic components are typically concentrated in the center of the circuit board, where heat flux density is high. Therefore, the first zone is designated as a high-priority heat dissipation section, enabling precise cooling of critical heat-generating areas and improving heat dissipation efficiency. The presence of the flow-guiding wall effectively controls the flow direction and distribution of the coolant, preventing short circuits or uneven distribution of the coolant in the flow channels, thereby reducing local hot spots, improving the uniformity of the overall temperature distribution of the circuit board, and enhancing the thermal stability of the system. In practical applications, the heat source distribution on the circuit board is often uneven, with concentrated heat generation in the center and lower heat generation on the sides being common. By designing the heat dissipation section in zones, the heat source distribution characteristics can be better matched, enabling on-demand cooling and improving the flexibility and adaptability of the thermal management system.

[0014] Furthermore, the fixed wall is provided with a first diversion wall, which is located in the first area; the first diversion wall has raised structures on both sides, which are staggered to form turbulence through the liquid between the first diversion walls, so as to achieve the cooling effect of the circuit board.

[0015] The technical effects achieved by adopting this solution are as follows: By setting staggered protrusions on both sides of the first flow divider wall, the liquid is periodically disturbed when flowing through this area, disrupting the boundary layer structure and inducing turbulence. Compared to laminar flow, turbulence has a stronger convective heat transfer capacity, which can significantly improve the heat transfer coefficient between the liquid and the flow channel wall, thereby improving the cooling efficiency of the circuit board. The combined design of the first flow divider wall and the staggered protrusions not only induces turbulence but also performs secondary distribution and guidance of the coolant, making the coolant distribution more uniform and the flow more complete in key areas, avoiding problems such as coolant short-circuiting or localized low flow velocity, thereby improving the efficiency of coolant utilization. The formation of turbulence helps to thin the thermal boundary layer, accelerating the transfer of heat from the shell wall to the coolant, thereby reducing the overall thermal resistance and improving heat conduction efficiency.

[0016] Furthermore, the fixed wall is provided with a second diversion wall, which is located in the second area; the second diversion wall is used to reduce the pressure drop in the flow channel.

[0017] The technical effects achieved by adopting this solution are as follows: The second flow divider is located in the second region of the heat dissipation section, where the heat load is typically low, and the requirements for liquid flow velocity and heat transfer intensity are relatively small. By setting up the second flow divider, the liquid flow path can be effectively dispersed, avoiding the formation of local high-pressure areas or flow bottlenecks during the liquid flow process, thereby reducing the flow resistance and pressure drop of the entire flow channel system and improving pumping efficiency. Building upon the enhanced heat transfer and turbulence created in the first region by the first flow divider, the second flow divider in the second region balances flow and heat transfer performance. It ensures sufficient liquid flow while reducing pressure drop, avoiding unnecessary energy consumption due to excessive disturbance or high flow velocity, thus achieving an optimized match between heat transfer efficiency and fluid dynamics performance.

[0018] Furthermore, several positioning ribs are provided on both sides of the cover plate to ensure that when the cover plate is installed on the shell, the positioning ribs limit the movement of the protruding ribs and the fixed wall.

[0019] The technical effects achieved by adopting this solution are as follows: Positioning ribs are installed at the bottom of the cover plate to precisely position the ribs relative to the fixed walls during the assembly of the cover plate and the shell, preventing assembly misalignment or displacement. This helps ensure the consistency of the flow channel clearance, avoiding localized narrowing or blockage of the flow channel due to assembly errors, thereby improving the reliability and repeatability of the flow channel structure. Through the limiting effect of the positioning ribs, the ribs can be more stably and accurately embedded between the fixed walls, forming a tightly fitted flow channel structure. This not only improves the flow channel sealing performance and prevents liquid leakage, but also enhances the structure's vibration resistance and deformation resistance during operation, improving the safety and long-term stability of the liquid cooling system.

[0020] Furthermore, the circuit board has a chip, which corresponds to the outer side of the first area on the housing; a heat-conducting structure is provided between the chip and the outer side of the housing, and the chip transfers heat to the location corresponding to the first area on the housing through the heat-conducting structure to achieve device cooling.

[0021] The technical effects achieved by adopting this solution are as follows: As the primary heat-generating component on the circuit board, the chip directly conducts heat to the corresponding first area on the outside of the casing via a thermally conductive structure. This area has the highest liquid flow rate and strongest heat exchange capacity in the flow channel, thus forming a highly efficient heat conduction path and significantly improving the chip's cooling effect. The thermally conductive structure directly connects the chip to the casing, avoiding the high thermal resistance problems caused by heat conduction through multi-layer PCBs, brackets, or air gaps in traditional heat dissipation methods. This shortens the heat conduction path, improves heat conduction efficiency, and effectively reduces the chip's operating temperature.

[0022] To address the aforementioned problems, the present invention provides a vehicle comprising a domain controller provided by any of the above technical solutions. The vehicle includes a refrigeration device connected to a flow channel. Heat in the flow channel is cooled by the refrigeration device and then returns to the flow channel, thus achieving circulation.

[0023] The technical effects achieved by adopting this solution are as follows: By connecting the flow channels of the domain controller to the refrigeration equipment, a closed-loop liquid cooling circulation system is formed. The coolant absorbs the heat generated by the domain controller in the flow channels, then enters the refrigeration equipment for cooling, and finally circulates back to the flow channels, achieving continuous and stable heat removal and cooling. This system can effectively address the heat dissipation requirements of high-power-density electronic components under complex operating conditions, significantly improving the overall vehicle thermal management capabilities.

[0024] In summary, the above-mentioned technical solutions of this application can have one or more of the following advantages or beneficial effects: i) By setting a fixed wall in the groove of the shell and interlocking with the ribs on the cover plate, the liquid flow path is guided, effectively breaking the dead water zone that is easily formed in traditional high-flow-rate channels, avoiding local overheating, and improving the uniformity of thermal management and overall heat dissipation efficiency. ii) By controlling the gap between the ribs and the fixed wall to be between 0.1mm and 0.9mm, the coolant flow rate is significantly increased, the convective heat transfer coefficient between the coolant and the channel wall is enhanced, thereby improving heat dissipation efficiency, which is particularly suitable for high heat flux density scenarios. iii) Only in key heat dissipation sections (such as the first area) is a small-gap turbulence enhancement design adopted, rather than a full-channel microchannel structure. While achieving efficient local cooling, it avoids the manufacturing difficulty and easy clogging caused by the complexity of the overall structure, and has good engineering practicality. iv) The distance between the cover plate and the groove is controlled between 1mm and 3mm, avoiding the use of high-cost etching processes, adapting to various coolant types, and facilitating assembly and sealing design, thereby improving the manufacturability and reliability of the system. v) Divide the heat dissipation section into a central first region (high heat flux density region) and two side second regions (auxiliary heat dissipation sections) to achieve graded utilization of coolant, avoid waste of cooling resources, and improve the overall efficiency of the cooling system. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall structure of a microfluidic domain controller according to an embodiment of the present invention;

[0026] Figure 2 for Figure 1 Exploded view;

[0027] Figure 3 This is a schematic diagram of the microfluidic domain controller from another perspective in an embodiment of the present invention. Figure 1 ;

[0028] Figure 4 for Figure 3 Sectional view along AA;

[0029] Figure 5 for Figure 4 Enlarged view at point B;

[0030] Figure 6 This is a schematic diagram of the structure of the microfluidic domain controller cover plate in an embodiment of the present invention;

[0031] Figure 7 This is a schematic diagram of the microfluidic domain controller from another perspective in an embodiment of the present invention. Figure 2 .

[0032] Explanation of reference numerals in the attached figures:

[0033] 1-Microfluidic domain controller; 12-Housing; 121-Groove; 122-Fixing wall; 1221-Drainage wall; 1222-First diversion wall; 1223-Protruding structure; 1224-Second diversion wall; 123-Inlet; 124-Outlet; 13-Cover plate; 131-Rib; 132-Reinforcing rib; 14-Circuit board; 141-Chip; 142-Heat-conducting structure; 15-Bottom cover; 16-Fastener; 17-Flow channel; 171-Heat dissipation section; 1711-First area; 1712-Second area; 1713-Positioning rib. Detailed Implementation

[0034] The purpose of this invention is to provide a microfluidic domain controller and an automobile, which realizes microfluidic design through the ribs of the water channel cover and the grooves of the shell flow channel, avoids the existence of dead water zones in the flow channel, and breaks through the boundary of the flow channel heat dissipation capacity; the microfluidic effect is achieved using ordinary die casting and machining low-cost processes, avoiding the use of high-cost etching and 3D printing technologies to achieve the microfluidic effect.

[0035] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0036] See Figures 1 to 5 This invention provides a microfluidic domain controller, comprising: a housing 12, a cover plate 13, and a circuit board 14; wherein, the surface of the housing 12 is provided with a groove 121; the cover plate 13 is provided with a rib 131 on the side facing the groove 121; the rib 131 is installed on the groove 121 to form a flow channel 17 for liquid to pass through; the circuit board 14 is disposed on the outside of the housing 12 where the flow channel 17 is located for heat dissipation of components on the circuit board 14; wherein, a fixing wall 122 is provided in the groove 121 for guiding the liquid entering the flow channel 17; the rib 131 and the fixing wall 122 are interlocked to reduce the gap of the flow channel 17.

[0037] Specifically, the microfluidic domain controller 1 includes: a housing 12, a cover plate 13, a circuit board 14, and a bottom cover 15. The housing 12 serves as the main structural component supporting the flow channel 17 structure and the circuit board 14; the cover plate 13 cooperates with the housing 12 to form a closed flow channel 17; the circuit board 14, carrying electronic components, is located on the other side of the housing 12 and dissipates heat through heat conduction via the housing 12; the bottom cover 15 covers the circuit board 14 and is fixedly connected to the housing 12 by fasteners 16. The housing 12 is made of metal, and one side surface has a groove 121 for forming the flow channel 17 structure for liquid flow. A fixing wall 122 is provided within the groove 121 to guide the liquid flow direction and improve the uniformity of fluid distribution within the flow channel 17. The cover plate 13 is made of metal or composite material, and the side facing the groove 121 of the housing 12 has a raised rib 131 structure. The narrowed area of ​​the local flow channel 17 formed between the protruding rib 131 and the fixed wall 122 causes the coolant to flow faster in this area, forming local turbulence and enhancing the heat exchange capacity.

[0038] Preferably, the liquid flowing in the flow channel 17 is a coolant.

[0039] Preferably, the shape of the groove 121 is optimized according to the heat source of the circuit board 14.

[0040] Preferably, the rib 131 is a linear or strip-shaped structure, which usually corresponds to the position of the fixing wall 122 of the groove 121, and is used to cooperate with the fixing wall 122 to form a locally reduced gap in the flow channel 17.

[0041] Preferably, the rib 131 and the cover plate 13 are integrally formed structures and can be manufactured by casting or stamping.

[0042] Preferably, the interlocking structure of the rib 131 and the fixed wall 122 effectively breaks the thermal boundary layer, improves the heat exchange efficiency, and is suitable for heat dissipation in high heat flux density areas such as the chip 141.

[0043] Preferably, the top surface of the cover plate 13 is provided with reinforcing ribs 132 to prevent the cover plate 13 from deforming.

[0044] See Figure 1 and Figure 2 The distance between the cover plate 13 and the groove 121 is between 1mm and 3mm.

[0045] Specifically, after the microfluidic domain controller 1 is assembled, the vertical distance between the inner surface of the cover plate 13 (the side with the rib 131) and the bottom surface of the groove 121 of the housing 12 is as follows.

[0046] Preferably, the vertical spacing constitutes the height of the main channel for liquid flow, that is, the overall height of the flow channel 17.

[0047] Preferably, within the range of 1mm to 3mm, it can be achieved through conventional machining, stamping or casting processes, without the need for costly etching or micromachining techniques, which helps to reduce manufacturing costs.

[0048] See Figure 5 The gap between the rib 131 and the fixed wall 122 in the flow channel 17 is between 0.1 mm and 0.9 mm; wherein, the fluid in the flow channel 17 is close to the bottom surface of the flow channel 17 to improve the heat exchange efficiency of the circuit board 14.

[0049] Specifically, by controlling the gap between the rib 131 and the fixed wall 122 in the flow channel 17 to be between 0.1 mm and 0.9 mm, microchannels are formed. When the liquid flows through these areas, it is forced to accelerate due to the narrowing of the channels. According to the principles of fluid mechanics, the increase in flow velocity leads to an increase in the convective heat transfer coefficient, thereby enhancing the ability of heat to be transferred from the solid surface to the liquid.

[0050] Preferably, microchannels refer to channels with a gap between 0.1mm and 0.9mm, which must be achieved through conventional die casting and machining.

[0051] Preferably, the distance between the fluid and the wall in the microchannel is closer, the boundary layer is thinner, the thermal resistance is lower, and the heat conduction is more efficient. The surface area to volume ratio of the microchannel can be several times that of the traditional water channel. This design can improve the heat exchange efficiency by 5%-10%.

[0052] Preferably, in narrow gaps, liquids are more likely to form turbulent flow rather than laminar flow. In turbulent flow, the mixing between liquid molecules is more intense, which can more effectively remove heat and further improve heat exchange efficiency.

[0053] Preferably, when the liquid flows close to the bottom surface of the flow channel 17, it can directly act on the part that needs the most heat dissipation, reducing the distance that heat must travel and the number of material interfaces, thereby reducing the overall thermal resistance and improving the heat dissipation efficiency of the system.

[0054] See Figure 7 The flow channel 17 is provided with a heat dissipation section 171, and a fixed wall 122 is provided inside the heat dissipation section 171; wherein, the fixed wall 122 is provided with a flow guiding wall 1221, which is used to guide liquid into the heat dissipation section 171 to improve the heat dissipation efficiency of the circuit board 14.

[0055] Specifically, inside the heat dissipation section 171, a fixing wall 122 is disposed within the groove 121 of the housing 12, and is integrally formed by the housing 12 or fixed by welding, embedding or other methods. The fixing wall 122 includes a flow guiding wall 1221, which is used to separate the flow channel 17, control the liquid flow path, prevent uneven liquid flow in the flow channel 17, and ensure that the liquid flows through the heat-generating area of ​​the circuit board 14 in a limited manner.

[0056] Preferably, the heat dissipation section 171 refers to the area in the flow channel 17 specifically designed for centralized heat exchange, located at the positions corresponding to the main heat-generating components on the housing 12 and circuit board 14. The heat dissipation section 171 is the part in the liquid flow path where heat exchange is most intense and thermal management is most critical.

[0057] See Figure 7 The flow-guiding wall 1221 divides the heat dissipation section 171 into a first region 1711 and a second region 1712; the first region 1711 is located in the middle of the heat dissipation section 171, and the second region 1712 is located on both sides of the heat dissipation section 171.

[0058] Specifically, the first region 1711 is typically located in the center of the heat dissipation area, corresponding to the location of the main heat-generating components on the circuit board 14. This region has the highest heat flux density and therefore requires priority cooling to avoid localized overheating. The second region 1712 is located on both sides of the heat dissipation area and is mainly used for auxiliary heat dissipation, handling heat from other electronic components or the housing 12 itself, ensuring a more uniform temperature distribution throughout the system.

[0059] See Figure 7 The fixed wall 122 is provided with a first diversion wall 1222, which is located in the first region 1711. The first diversion wall 1222 is provided with protruding structures 1223 on both sides. The protruding structures 1223 are staggered, and the liquid between the first diversion walls 1222 forms turbulence to achieve the cooling effect of the circuit board 14.

[0060] Specifically, the first diversion wall 1222 is located between the two guide walls 1221, in the area corresponding to the main heat-generating components such as the chip 141 on the circuit board 14. The first diversion wall 1222 is typically a strip-shaped structure, arranged approximately perpendicular to the liquid flow direction or at a certain angle, used to divert and guide the liquid. On both sides of the first diversion wall 1222, i.e., the two side walls of the liquid flow path, protruding structures 1223 are provided. The protruding structures 1223 are staggered on both sides of the first diversion wall 1222, i.e., the protrusions on one side are offset from those on the other. When the liquid flows through the narrow channel between the first diversion walls 1222, the originally laminar liquid is broken by the disturbance effect of the protruding structures 1223, forming local eddies and turbulence. In the turbulent state, the thermal boundary layer of the liquid is thinner, enhancing the heat exchange efficiency between the fluid and the wall surface, thereby significantly improving the heat transfer coefficient.

[0061] Preferably, the shape of the protrusion structure 1223 can be semi-circular, triangular, rectangular, wavy, etc., and the specific design is optimized based on the results of fluid dynamics simulation.

[0062] See Figure 1 and Figure 2The fixed wall 122 is provided with a second diversion wall 1224, which is located in the second region 1712; the second diversion wall 1224 is used to reduce the pressure drop in the flow channel 17.

[0063] Specifically, the second diversion wall 1224 is located outside the diversion wall 1221 to reduce the pressure drop of the liquid in the entire flow channel 17 and avoid increasing pumping energy consumption due to excessive local resistance.

[0064] Preferably, by rationally designing the structure and quantity of the second diversion wall 1224, balanced control of the pressure drop in the flow channel 17 can be achieved.

[0065] See Figure 6 The cover plate 13 has several positioning ribs 1713 on both sides to ensure that when the cover plate 13 is placed on the shell 12, the positioning ribs 1713 limit the protruding ribs 131 and the fixed wall 122.

[0066] Specifically, the cover plate 13 is a downwardly recessed structure. Several positioning ribs 1713 are provided on both sides of the bottom surface of the cover plate 13. During the assembly process of the cover plate 13 and the housing 12, the positioning ribs 1713 abut against the edge of the groove 121 to limit the protruding rib 131 and the fixed wall 122, so as to avoid the protruding rib 131 and the fixed wall 122 from being misaligned or offset, which would cause the flow channel 17 to be blocked.

[0067] See Figure 2 The circuit board 14 is provided with a chip 141, which corresponds to the outer side of the first area 1711 on the housing 12. A heat-conducting structure 142 is provided between the chip 141 and the outer side of the housing 12. The chip 141 transfers heat to the position corresponding to the first area 1711 on the housing 12 through the heat-conducting structure 142, thereby cooling the device.

[0068] Specifically, chip 141 is the main heat-generating element on the circuit board, typically located in the area with the highest heat flux density on the circuit board 14. It is the key component in the microfluidic domain controller 1 that requires priority for heat dissipation. Chip 141 is positioned on the circuit board 14 corresponding to the first region 1711 of the housing 12. The first region 1711 is the central region of the heat dissipation section 171, where the liquid flow rate is fastest and the heat exchange capacity is strongest. Chip 141 conducts heat to this region through the housing 12, where it is efficiently carried away by the liquid. The thermally conductive structure 142 refers to the thermally conductive medium between chip 141 and housing 12, used to efficiently conduct the heat generated by chip 141 to housing 12.

[0069] Preferably, the thermally conductive structure 142 has good thermal conductivity and compressibility, ensuring a tight fit between the chip 141 and the housing 12 with low thermal resistance.

[0070] The present invention provides a vehicle including a microfluidic domain controller 1 provided by any of the above technical solutions. The vehicle includes a refrigeration device, which is connected to a flow channel 17. Heat in the flow channel 17 is cooled by the refrigeration device and then returns to the flow channel 17 to achieve circulation.

[0071] Specifically, the microfluidic domain controller 1 is connected to the refrigeration equipment, forming a closed-loop liquid cooling circulation system. Coolant flows out from the refrigeration equipment, enters the flow channel 17 through the inlet 123 of the housing 12, and is guided into the first region 1711 by the guide wall 1221. It absorbs the heat conducted by the heat-generating elements such as the chip 141 through the housing 12, and flows out through the outlet 124. The cooled coolant then enters the refrigeration equipment for cooling, and the cooled coolant re-enters the flow channel 17 to achieve continuous circulation cooling.

[0072] Preferably, the cooling equipment can ensure that the microfluidic domain controller 1 can maintain a stable temperature under high load operation, preventing overheating, frequency reduction, or failure.

[0073] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A microfluidic domain controller, characterized in that, include: A housing (12) has a groove (121) on its surface; a cover plate (13) has a rib (131) on one side facing the groove (121); the rib (131) is installed on the groove (121) to form a flow channel (17) through which liquid passes; a circuit board (14) is disposed on the outside of the housing (12) where the flow channel (17) is located, for heat dissipation of components on the circuit board (14); wherein, a fixed wall (122) is provided in the groove (121) for guiding the liquid into the flow channel (17); the rib (131) and the fixed wall (122) are interlocked to reduce the gap in the flow channel (17); The flow channel (17) is provided with a heat dissipation section (171), and the fixed wall (122) is provided in the heat dissipation section (171); wherein, the fixed wall (122) is provided with a flow guide wall (1221), the flow guide wall (1221) is used to guide liquid into the heat dissipation section (171) to improve the heat dissipation efficiency of the circuit board (14); the flow guide wall (1221) divides the heat dissipation section (171) into a first region (1711) and a second region (1712); the first region (1711) is provided in the heat dissipation section (171). In the middle of section (171), the second region (1712) is located on both sides of the heat dissipation section (171); the fixed wall (122) is provided with a first diversion wall (1222), which is located in the first region (1711); the first diversion wall (1222) is provided with protruding structures (1223) on both sides of the first diversion wall (1222), and the protruding structures (1223) are staggered, so that the liquid between the first diversion walls (1222) forms turbulence to achieve the cooling effect of the circuit board (14).

2. The microfluidic domain controller according to claim 1, characterized in that, The distance between the cover plate (13) and the groove (121) is between 1 mm and 3 mm.

3. The microfluidic domain controller according to claim 2, characterized in that, The gap between the rib (131) and the fixed wall (122) in the flow channel (17) is between 0.1 mm and 0.9 mm; wherein the fluid in the flow channel (17) is close to the bottom surface of the flow channel (17) to improve the heat exchange efficiency of the circuit board (14).

4. The microfluidic domain controller according to claim 1, characterized in that, The fixed wall (122) is provided with a second diversion wall (1224), which is located in the second region (1712); the second diversion wall (1224) is used to reduce the pressure drop in the flow channel (17).

5. The microfluidic domain controller according to claim 1, characterized in that, The cover plate (13) has several positioning ribs (1713) on both sides to ensure that when the cover plate (13) is placed on the shell (12), the positioning ribs (1713) limit the position of the protruding rib (131) and the fixed wall (122).

6. The microfluidic domain controller according to claim 1, characterized in that, The circuit board (14) is provided with a chip (141), and the chip (141) corresponds to the outer side of the area where the first area (1711) is located on the housing (12); A heat-conducting structure (142) is provided between the chip (141) and the outer side of the housing (12). The chip (141) transfers heat to the location corresponding to the first area (1711) on the housing (12) through the heat-conducting structure (142) to achieve device cooling.

7. A vehicle, characterized in that, The vehicle includes the microfluidic domain controller according to any one of claims 1 to 6, wherein the vehicle comprises: The refrigeration equipment is connected to the flow channel (17). The heat in the flow channel (17) is cooled down by the refrigeration equipment and then returns to the flow channel (17) to achieve circulation.

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