A memory card assembly welding device and a working method thereof

Abstract

The application discloses a kind of storage card assembly welding device and working method thereof, it is related to the production technical field of storage card, including the mounting base fixed on workbench, the upper end surface of mounting base is provided with conveying assembly and placement round table, mobile seat is movably arranged above mounting base, the lower end surface of mobile seat is provided with point gluing assembly, the lower end surface of mobile seat is fixed with electric push rod one, the end of electric push rod one telescopic end is fixed with U-shaped frame one, the lower portion of U-shaped frame one is provided with suction plate, the lower end surface of suction plate is provided with a plurality of vacuum nozzles, and the elastic unit one is arranged between suction plate and mobile seat, two rotating plates are rotatably arranged on the inner wall of U-shaped frame one, the lower end of rotating plate is fixed with U-shaped frame two, a compression roller is rotatably arranged on the inner wall of U-shaped frame two, and the elastic unit two used in cooperation with rotating plate is arranged on U-shaped frame one;When using, the epoxy resin between PCB board and bare die chip can be more evenly distributed.

Description

Technical Field

[0001] This invention relates to the field of memory card manufacturing technology, and in particular to a memory card assembly and welding apparatus and its working method. Background Technology

[0002] A memory card is a portable, reusable data storage device, mainly used to expand the storage capacity of electronic devices or to enable mobile data storage. After data is stored on a memory card, it can retain information for a long time without the need for an external power source, and it features small size, large capacity, and fast read and write speeds.

[0003] In the production of some memory cards, a PCB substrate and a bare die chip need to be combined and connected. During the manufacturing process, epoxy resin is first applied to the upper surface of the PCB substrate. Then, a vacuum chuck is used to press the bare die chip onto the epoxy resin. The epoxy resin is then cured by a curing component, thus achieving an initial connection between the PCB substrate and the bare die chip. Gold wires are then soldered between the PCB substrate and the bare die chip using a soldering component, achieving a further combined connection between the PCB substrate and the bare die chip. However, when the vacuum chuck presses the bare die chip onto the epoxy resin, it can easily lead to uneven distribution of epoxy resin between the PCB substrate and the bare die chip, affecting the subsequent connection effect between the PCB substrate and the bare die chip. Summary of the Invention

[0004] This invention provides a memory card assembly and welding device and its working method, which can solve the problem in the prior art that when a bare die chip is pressed onto epoxy resin by a vacuum chuck, the epoxy resin between the PCB substrate and the bare die chip is easily unevenly distributed.

[0005] A memory card assembly and welding device includes a mounting base fixed to a workbench. The upper surface of the mounting base is provided with a conveying assembly and a placement truncated cone. A movable seat is movably mounted above the mounting base. A dispensing assembly is provided on the lower surface of the movable seat. An electric push rod is fixed to the lower surface of the movable seat. A U-shaped frame is fixed to the telescopic end of the electric push rod. An adsorption plate is located below the U-shaped frame. Multiple vacuum nozzles are provided on the lower surface of the adsorption plate. An elastic unit is provided between the adsorption plate and the movable seat. Two rotating plates are rotatably mounted on the inner wall of the U-shaped frame. A second U-shaped frame is fixed to the lower end of the rotating plates. A pressure roller is rotatably mounted on the inner wall of the second U-shaped frame. The first U-shaped frame has an elastic unit that works with the rotating plates. A moving mechanism that works with the movable seat is provided on the mounting base.

[0006] As a further technical solution of the present invention, the elastic unit includes a lower connecting block fixed to both sides of the adsorption plate, an upper connecting block fixed to both sides of the U-shaped frame, a guide rod fixed to the upper end face of the lower connecting block, the upper end face of the guide rod movably passing through the upper connecting block and fixing a limiting disk, and a spring fixed between the lower connecting block and the upper connecting block, the spring movably sleeved on the outer surface of the guide rod.

[0007] As a further technical solution of the present invention, a ventilation groove is provided on one side of one of the lower connecting blocks, the ventilation groove extends into the adsorption plate, the upper end of each vacuum nozzle is fixedly extended into the ventilation groove, and a ventilation hose is provided on one side of the lower connecting block, one end of the ventilation hose is connected to an external vacuum pumping unit.

[0008] As a further technical solution of the present invention, each rotating plate has a rotating column fixed on both sides, and one end of each rotating column movably passes through the U-shaped frame and is fixed with a connecting plate. The elastic unit two includes multiple torsion springs, which are movably sleeved on the outer surface of the rotating column. The two ends of the torsion springs are fixedly connected to the U-shaped frame and the connecting plate, respectively.

[0009] As a further technical solution of the present invention, an installation frame is provided below the adsorption plate, a sponge adsorption ring is detachably provided on the inner wall of the installation frame, a magnet ring one is fixed on the outer surface of the sponge adsorption ring, a magnet ring two is fixed on the inner wall of the installation frame, the magnet ring one and the magnet ring two are magnetically attracted, an elastic unit three is provided between the adsorption plate and the installation frame, and a photo-monitoring component is fixed on the upper surface of the installation base.

[0010] As a further technical solution of the present invention, the elastic unit three includes two pairs of extension plates fixed on both sides of the adsorption plate, and a plurality of guide rods three are fixed on the upper end surface of the mounting frame. The upper end of each guide rod three movably passes through the extension plate and is fixed with a limiting plate three. A plurality of springs three are fixed between the mounting frame and the extension plate, and the springs three are movably sleeved on the outer surface of the guide rods three.

[0011] As a further technical solution of the present invention, the conveying assembly includes a U-shaped base. Two conveying guide rails are symmetrically fixed on the upper end of the U-shaped base. Each conveying guide rail is provided with a conveying groove. Multiple conveying wheels are rotatably arranged in the inner bottom of the conveying groove. A drive mechanism is provided on the conveying guide rail to cooperate with the rotation of the multiple conveying wheels. A lifting plate is movably arranged on the inner wall of the U-shaped base. A baffle is fixed on one side of the lifting plate. Multiple sinking grooves are provided in the inner bottom of the U-shaped base. An electric push rod is fixed in each sinking groove. The end of the telescopic end of the electric push rod is fixedly connected to the lower end face of the lifting plate. Multiple guide columns are symmetrically fixed on the lower end face of the lifting plate. The lower ends of the guide columns movably penetrate into the U-shaped base.

[0012] As a further technical solution of the present invention, the moving mechanism includes two sliding grooves formed on the upper surface of the mounting base. A sliding block is slidably arranged in each sliding groove. A lead screw is rotatably arranged on the inner wall of the sliding groove. The lead screw thread passes through the sliding block. A second driving mechanism is provided in the mounting base to cooperate with the rotation of the lead screw. A connecting frame is fixed on the upper surface of each sliding block. An electric guide rail is fixed between the connecting frames. An electric slider is slidably arranged on the electric guide rail. The moving seat is fixed to the lower surface of the electric slider.

[0013] As a further technical solution of the present invention, a curing and welding chamber is fixed on the upper surface of the mounting base, and a curing treatment component and a welding component are provided inside the curing and welding chamber.

[0014] A method for operating a memory card assembly and welding device, comprising the following specific steps:

[0015] Step 1: The conveying assembly moves and conveys the PCB substrate to be processed to the processing position. Then, the moving seat moves to the top of the frustum. Then, the telescopic end of the electric push rod 1 extends, pushing the U-shaped frame 1, the adsorption plate and multiple vacuum nozzles downward until the multiple vacuum nozzles adsorb and adhere to the upper surface of the single bare die chip. Then, the telescopic end of the electric push rod 1 retracts.

[0016] Step 2: The moving mechanism causes the moving base, electric push rod 1, U-shaped frame 1, adsorption plate and bare die chip to move toward the corresponding PCB board until the dispensing assembly moves above the corresponding single PCB board, and then epoxy resin is applied to the upper surface of the PCB board.

[0017] Step 3: Under the action of the moving mechanism, the U-shaped frame 1, the adsorption plate and the bare die chip are moved to the top of the PCB board. Then the telescopic end of the electric push rod 1 extends, pushing the U-shaped frame 1, the adsorption plate and the bare die chip downward. During this process, the rotating plate, the U-shaped frame 2 and the pressure roller also move downward with the U-shaped frame 1 until the bare die chip is attached to the upper surface of the PCB board.

[0018] Step 4: The electric push rod continues to push the U-shaped frame 1 downward. During this process, the adsorption plate can no longer move downward. The rotating plate, the U-shaped frame 2 and the pressure roller rotate relative to the U-shaped frame 1, causing the pressure roller to roll against the upper surface of the bare die chip, and rolling the epoxy resin between the PCB board and the bare die chip evenly.

[0019] Step 5: The telescopic end of the electric actuator retracts, completing the combined connection of a single PCB board and a single bare die chip.

[0020] The beneficial effects of this invention are:

[0021] 1. In the application of this solution, the PCB substrate to be processed is transported to the processing position (near the placement of the frustum) by the conveying assembly and then stops moving. The moving seat, under the action of the moving mechanism, moves to above the placement of the frustum. Then, the telescopic end of the electric push rod extends, pushing the U-shaped frame, the suction plate, and multiple vacuum nozzles downwards until the multiple vacuum nozzles adhere to the upper surface of a single bare die chip. Then, the telescopic end of the electric push rod retracts, and the moving mechanism causes the moving seat, electric push rod, U-shaped frame, suction plate, and bare die chip to move towards the corresponding PCB board until the dispensing assembly moves above the corresponding single PCB board. Then, epoxy resin is applied to the upper surface of the PCB board. Finally, the moving mechanism... The electric actuator moves the U-shaped frame, the suction plate, and the bare die to the top of the PCB board. Then, the telescopic end of the electric actuator extends, pushing the U-shaped frame, the suction plate, and the bare die downwards. During this process, the rotating plate, the second U-shaped frame, and the pressure roller also move downwards with the first U-shaped frame until the bare die is attached to the upper surface of the PCB board. At this time, the lower surfaces of the two pressure rollers also contact the upper surface of the bare die. Then, the electric actuator continues to push the first U-shaped frame downwards. During this process, the suction plate can no longer move downwards, and the rotating plate, the second U-shaped frame, and the pressure roller rotate relative to the first U-shaped frame, causing the pressure roller to roll against the upper surface of the bare die. During this process, the epoxy resin between the PCB board and the bare die is rolled evenly.

[0022] 2. As the adsorption plate moves downwards with the bare die towards the PCB board, the mounting frame and sponge adsorption ring also move downwards with the adsorption plate. The mounting frame and sponge adsorption ring first contact the upper surface of the PCB board, and then the adsorption plate continues to move downwards until the bare die is attached to the upper surface of the PCB board. At this time, the sponge adsorption ring is located on the outer ring of the bare die. Then, the pressure roller moves on the surface of the bare die. If the dispensing assembly malfunctions and the amount of epoxy resin dripping onto the PCB board increases, the excess epoxy resin located between the PCB board and the bare die will be squeezed out during the pressure roller's rolling motion on the upper surface of the bare die. The squeezed-out epoxy resin will be absorbed by the sponge adsorption ring located on the outer ring of the bare die. Furthermore, when the pressure roller presses on the upper surface of the sponge adsorption ring, it can promote full contact between the sponge adsorption ring and the PCB board, thereby enabling the sponge adsorption ring to repeatedly absorb the extruded epoxy resin. Then, when the U-shaped frame, adsorption plate, mounting frame, and sponge adsorption ring leave the PCB board and pass through the photo-monitoring component (each time they pass through the photo-monitoring component, the U-shaped frame, adsorption plate, mounting frame, and sponge adsorption ring will pause at this position to take a picture of the lower surface of the sponge adsorption ring), if the photo-monitoring component detects that epoxy resin is adhered to the lower surface of the sponge adsorption ring, the machine is stopped for maintenance of the dispensing component, but the PCB board does not need to be cleaned, making it convenient to use.

[0023] 3. In the initial state, the baffle is higher than the height of the PCB substrate assembly, which allows the baffle to intercept and position the delivered PCB substrate assembly. At this time, the PCB substrate assembly is in the processing position for assembly and connection with the bare die chip. Then, the telescopic end of the second electric push rod extends further, pushing the lifting plate and the baffle to continue moving upward until the lifting plate contacts the substrate frame and the lower end surface of the PCB board, supporting the PCB board and preventing the PCB board from bending downward during the placement of the bare die chip, which would affect the assembly and connection between the PCB board and the bare die chip. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the connection between the mounting base and the frustum in this invention. Figure 1 ;

[0025] Figure 2 This is a schematic diagram of the connection between the mounting base and the frustum in this invention. Figure 2 ;

[0026] Figure 3 This is a schematic diagram of the structure of a PCB substrate assembly in the prior art;

[0027] Figure 4 This is a schematic diagram showing the connection between the movable base and the electric actuator in this invention;

[0028] Figure 5 This is a schematic diagram of the connection between the electric actuator and the U-shaped frame in this invention. Figure 1 ;

[0029] Figure 6 This is a schematic diagram of the connection between the electric actuator and the U-shaped frame in this invention. Figure 2 ;

[0030] Figure 7 This is a schematic diagram of the connection between the electric actuator and the U-shaped frame in this invention. Figure 3 ;

[0031] Figure 8 This is a schematic diagram of the connection between the electric actuator and the U-shaped frame in this invention. Figure 4 ;

[0032] Figure 9 This is a schematic diagram showing the connection between the rotating plate and the rotating column in this invention;

[0033] Figure 10 This is a schematic diagram showing the connection between the adsorption plate and the extension plate in this invention;

[0034] Figure 11 This is a schematic diagram showing the connection between the mounting frame and the guide rod three in this invention;

[0035] Figure 12 This is a schematic diagram showing the connection between the mounting frame and the sponge adsorption ring in this invention;

[0036] Figure 13 This is a schematic diagram showing the connection between the U-shaped base and the conveying guide rail in this invention;

[0037] Figure 14 This is a schematic diagram showing the connection between the lifting plate and the baffle in this invention;

[0038] Figure 15 This is a schematic diagram showing the connection between the electric actuator 2 and the lifting plate in this invention.

[0039] In the diagram: 100. Mounting base; 101. Frustum; 102. Movable seat; 103. Dispensing assembly; 104. Electric actuator one; 105. U-shaped frame one; 106. Adsorption plate; 107. Vacuum nozzle; 108. Rotating plate; 109. U-shaped frame two; 110. Pressure roller; 111. Lower connecting block; 112. Upper connecting block; 113. Guide rod one; 114. Limiting plate one; 115. Spring one; 116. Ventilation groove; 117. Ventilation hose; 118. Rotating column; 119. Connecting plate; 120. Torsion spring; 200. Mounting frame; 201. Sponge adsorption ring; 202. Magnetic ring 1; 203, Magnetic ring 2; 204, Photo monitoring component; 205, Extension plate; 206, Guide rod 3; 207, Limiting plate 3; 208, Spring 3; 300, U-shaped base; 301, Conveying guide rail; 302, Conveying through groove; 303, Lifting plate; 304, Baffle; 305, Electric push rod 2; 306, Guide column; 400, Sliding groove; 401, Sliding block; 402, Lead screw; 403, Connecting frame; 404, Electric guide rail; 500, Curing and welding chamber; 600, PCB substrate assembly; 601, Substrate frame; 602, PCB board; 700, Bare die chip. Detailed Implementation

[0040] The specific embodiments of the present invention will be described in detail below, but it should be understood that the scope of protection of the present invention is not limited to the specific embodiments.

[0041] Reference Figures 1-15A memory card assembly and welding device includes a mounting base 100 fixed to a workbench. A conveying assembly and a placement frustum 101 are disposed on the upper surface of the mounting base 100. A movable seat 102 is movably disposed above the mounting base 100. A dispensing assembly 103 is disposed on the lower surface of the movable seat 102. An electric push rod 104 is fixed to the lower surface of the movable seat 102. A U-shaped frame 105 is fixed to the telescopic end of the electric push rod 104. An adsorption plate 106 is disposed below the U-shaped frame 105 for adsorption. Multiple vacuum nozzles 107 are provided on the lower end face of plate 106. An elastic unit is provided between the adsorption plate 106 and the movable seat 102. Two rotating plates 108 are rotatably arranged on the inner wall of U-shaped frame 105. A second U-shaped frame 109 is fixed to the lower end of the rotating plate 108. A pressure roller 110 is rotatably arranged on the inner wall of the second U-shaped frame 109. An elastic unit 2 is provided on the first U-shaped frame 105 to cooperate with the rotating plate 108. A moving mechanism is provided on the mounting base 100 to cooperate with the movable seat 102.

[0042] The conveying assembly is used to convey the PCB substrate group 600 to be processed. The PCB substrate group 600 includes a substrate frame 601 and multiple PCB boards 602, with the multiple PCB boards 602 fixed inside the substrate frame 601.

[0043] The frustum 101 is used to receive and place the cut bare die chip 700, which is existing technology.

[0044] The dispensing assembly 103 is existing technology. The dispensing assembly 103 is connected to the glue supply tank of the peripheral device. The dispensing assembly 103 is used to drip epoxy resin onto the PCB board 602 for the initial connection and assembly of the PCB board 602 and the bare die chip 700.

[0045] In this application, the PCB substrate assembly 600 to be processed is transported to the processing position (near the placement frustum 101) by the conveying assembly and then stops moving. Then, the moving seat 102, under the action of the moving mechanism, moves to above the placement frustum 101. Then, the telescopic end of the electric push rod 104 extends, pushing the U-shaped frame 105, the suction plate 106, and multiple vacuum nozzles 107 downwards until the multiple vacuum nozzles 107 adhere to the upper surface of the single bare die chip 700. The telescopic end of the rear electric actuator 104 retracts, and the moving mechanism causes the moving base 102, electric actuator 104, U-shaped frame 105, suction plate 106, and bare die chip 700 to move toward the corresponding PCB board 602 until the dispensing assembly 103 moves above the corresponding single PCB board 602. Then, epoxy resin is applied to the upper surface of the PCB board 602. Subsequently, under the action of the moving mechanism, the U-shaped frame 105, suction plate 106, and bare die chip 700 are moved toward the PCB board 602. Above board 602, the telescopic end of electric push rod 104 extends, pushing U-shaped frame 105, adsorption plate 106, and bare die chip 700 downwards. During this process, rotating plate 108, U-shaped frame 109, and pressure roller 110 also move downwards with U-shaped frame 105 until the bare die chip 700 is attached to the upper surface of PCB board 602. At this time, the lower surfaces of the two pressure rollers 110 also contact the upper surface of the bare die chip 700. Then, electric push rod 104 continues to push U-shaped frame 105 downwards. 05 moves downwards. During this process, the adsorption plate 106 can no longer move downwards. The rotating plate 108, the second U-shaped frame 109, and the pressure roller 110 rotate relative to the first U-shaped frame 105, causing the pressure roller 110 to roll against the upper surface of the bare die chip 700. During this process, the epoxy resin located between the PCB board 602 and the bare die chip 700 is rolled evenly. Then, the telescopic end of the electric push rod 104 retracts, completing the combination connection of a single PCB board 602 and a single bare die chip 700.

[0046] As the pressure roller 110 rolls on the surface of the bare die chip 700, the vacuum nozzle 107 also applies a downward force to the middle section of the bare die chip 700.

[0047] According to the above working principle, the bare die chip 700 is attached to each PCB board 602 on the PCB substrate group 600.

[0048] refer to Figure 1 The upper surface of the mounting base 100 is fixed with a curing and welding chamber 500. The curing and welding chamber 500 is equipped with a curing treatment component and a welding component. Both the curing treatment component and the welding component are existing technologies.

[0049] After each PCB board 602 on the PCB substrate assembly 600 is attached to the bare die 700, the conveying component conveys the PCB substrate assembly 600 again to the curing and soldering chamber 500. Then, the curing component causes the epoxy resin between the PCB board 602 and the bare die 700 to cure, which promotes the initial connection between the PCB board 602 and the bare die 700 and avoids displacement between the bare die 700 and the PCB board 602 when the soldering component is working. After the epoxy resin cures, the soldering component works to solder gold wires onto the PCB board 602 and the bare die 700, which promotes the further connection between the PCB board 602 and the bare die 700.

[0050] refer to Figures 5-8 The elastic unit includes a lower connecting block 111 fixed to both sides of the adsorption plate 106, an upper connecting block 112 fixed to both sides of the U-shaped frame 105, a guide rod 113 fixed to the upper end face of the lower connecting block 111, the upper end face of the guide rod 113 movably passing through the upper connecting block 112 and fixing a limiting plate 114, and a spring 115 fixed between the lower connecting block 111 and the upper connecting block 112, the spring 115 movably sleeved on the outer surface of the guide rod 113.

[0051] After the adsorption plate 106 attaches the bare die chip 700 to the upper surface of the PCB board 602, the electric push rod 104 continues to push the U-shaped frame 105 downward. The adsorption plate 106 can no longer move downward, and the U-shaped frame 105 continues to move downward relative to the adsorption plate 106. During this process, the spring 115 is compressed and contracted. At this time, the spring 115 also applies a downward force to the lower connecting block 111, the adsorption plate 106 and the vacuum nozzle 107, so that the bare die chip 700 at the corresponding position of the vacuum nozzle 107 can be tightly attached to the PCB board 602.

[0052] refer to Figure 4 , Figure 5 and Figure 10 One of the lower connecting blocks 111 has a ventilation groove 116 on one side, which extends into the adsorption plate 106. The upper end of each vacuum nozzle 107 is fixedly inserted into the ventilation groove 116. A ventilation hose 117 is connected to one side of the lower connecting block 111. One end of the ventilation hose 117 is connected to an external vacuum pumping unit, which is existing technology.

[0053] When the vacuum nozzle 107 on the adsorption plate 106 comes into contact with and adheres to the upper end face of the bare die chip 700, the vacuum pumping unit works, thereby adsorbing the bare die chip 700 onto the working end face of the vacuum nozzle 107. When the vacuum pumping unit stops working, the vacuum nozzle 107 can release the adsorption of the bare die chip 700. This working principle is the prior art.

[0054] refer to Figures 5-9 Each rotating plate 108 has a rotating column 118 fixed on both sides. One end of each rotating column 118 movably passes through the U-shaped frame 105 and is fixed with a connecting plate 119. The elastic unit 2 includes multiple torsion springs 120. The torsion springs 120 are movably sleeved on the outer surface of the rotating column 118. The two ends of the torsion springs 120 are fixedly connected to the U-shaped frame 105 and the connecting plate 119, respectively.

[0055] When the bare die 700 moves downward and adheres to the upper surface of the PCB board 602, the lower surfaces of the two pressure rollers 110 also contact the upper surface of the bare die 700. Then, the electric push rod 104 continues to push the U-shaped frame 105 downward. At this time, the rotating plate 108, the U-shaped frame 109 and the pressure rollers 110 rotate relative to the U-shaped frame 105. During this process, the rotating plate 108 drives the rotating column 118 and the connecting plate 119 to rotate. During this process, the torsion spring 120 undergoes elastic deformation. Under the action of the torsion spring 120, the pressure rollers 110 can apply a downward force to the bare die 700, causing the bare die 700 and the PCB board 602 to adhere tightly together.

[0056] refer to Figure 5 , Figure 6 , Figure 10 , Figure 11 and Figure 12 Below the adsorption plate 106, there is a mounting frame 200. A sponge adsorption ring 201 is detachably mounted on the inner wall of the mounting frame 200. A magnet ring 202 is fixed on the outer surface of the sponge adsorption ring 201. A magnet ring 203 is fixed on the inner wall of the mounting frame 200. The magnet ring 202 and the magnet ring 203 are magnetically attracted to each other. An elastic unit 3 is provided between the adsorption plate 106 and the mounting frame 200. A photo-detecting component 204 is fixed on the upper surface of the mounting base 100. The photo-detecting component 204 is existing technology. A control box for use with the photo-detecting component 204 is provided on the workbench. The control box is existing technology.

[0057] As the adsorption plate 106 moves downwards with the bare die chip 700 towards the PCB board 602, the mounting frame 200 and the sponge adsorption ring 201 also move downwards along with the adsorption plate 106. The mounting frame 200 and the sponge adsorption ring 201 first contact the upper surface of the PCB board 602, and then the adsorption plate 106 continues to move downwards until the bare die chip 700 is attached to the upper surface of the PCB board 602. At this time, the sponge adsorption ring 201 is located on the outer ring of the bare die chip 700. Then, the pressure roller 110 moves on the surface of the bare die chip 700. If the dispensing assembly 103 malfunctions and the amount of epoxy resin dripping onto the PCB board 602 increases, then during the rolling of the pressure roller 110 on the upper surface of the bare die chip 700, the excess epoxy resin located between the PCB board 602 and the bare die chip 700 will be squeezed out. The squeezed-out epoxy resin will be held by the sponge adsorption ring 201 located on the outer ring of the bare die chip 700. 1. Adsorption: When the pressure roller 110 rolls on the upper surface of the sponge adsorption ring 201, it can promote full contact between the sponge adsorption ring 201 and the PCB board 602, thereby enabling the sponge adsorption ring 201 to repeatedly absorb the extruded epoxy resin. Then, when the U-shaped frame 105, adsorption plate 106, mounting frame 200 and sponge adsorption ring 201 leave the PCB board 602 and pass through the photo-monitoring component 204 (each time they pass through the photo-monitoring component 204, the U-shaped frame 105, adsorption plate 106, mounting frame 200 and sponge adsorption ring 201 will pause at this position to cooperate with the photo-monitoring component 204 to take a picture of the lower surface of the sponge adsorption ring 201), when the photo-monitoring component 204 detects that epoxy resin is adhered to the lower surface of the sponge adsorption ring 201, the machine is stopped to maintain the dispensing component 103, but the PCB board 602 does not need to be cleaned, making it convenient to use.

[0058] refer to Figure 5 , Figure 10 and Figure 11 The elastic unit three includes two pairs of extension plates 205 fixed on both sides of the adsorption plate 106. Multiple guide rods 206 are fixed on the upper end of the mounting frame 200. The upper end of each guide rod 206 movably passes through the extension plate 205 and is fixed with a limiting plate 207. Multiple springs 208 are fixed between the mounting frame 200 and the extension plate 205. The springs 208 are movably sleeved on the outer surface of the guide rods 206.

[0059] After the mounting frame 200 and the sponge adsorption ring 201 are attached to the upper surface of the PCB board 602, the adsorption plate 106 continues to move downward. At this time, the spring 3 208 is squeezed and contracted. Under the action of the elastic force of the spring 3 208, the sponge adsorption ring 201 can be tightly attached to the upper surface of the PCB board 602.

[0060] refer to Figure 1 , Figure 2 ,Figure 13 , Figure 14 and Figure 15 The conveying assembly includes a U-shaped base 300, with two conveying guide rails 301 symmetrically fixed on the upper end of the U-shaped base 300. Each conveying guide rail 301 has a conveying groove 302, and multiple conveying wheels are rotatably arranged at the bottom of the conveying groove 302. A drive mechanism is provided on the conveying guide rail 301 to cooperate with the rotation of the multiple conveying wheels.

[0061] The PCB substrate assembly 600 is transported and transferred through the cooperation of the set transport channel 302 and the transport wheel. This part is all existing technology.

[0062] refer to Figure 14 and Figure 15 A lifting plate 303 is movably installed on the inner wall of the U-shaped base 300. A baffle 304 is fixed on one side of the lifting plate 303. Multiple recessed grooves are opened in the inner bottom of the U-shaped base 300. An electric push rod 305 is fixed in each recessed groove. The end of the telescopic end of the electric push rod 305 is fixedly connected to the lower end face of the lifting plate 303. Multiple guide posts 306 are symmetrically fixed on the lower end face of the lifting plate 303. The lower ends of the guide posts 306 movably penetrate into the U-shaped base 300.

[0063] In the initial state, the baffle 304 is higher than the PCB substrate assembly 600, enabling the baffle 304 to intercept and position the delivered PCB substrate assembly 600. At this time, the PCB substrate assembly 600 is in the processing position for assembly and connection with the bare die chip 700. Then, the telescopic end of the electric push rod 305 extends further, pushing the lifting plate 303 and the baffle 304 to continue moving upward until the lifting plate 303 contacts the lower end face of the substrate frame 601 and the PCB board 602, supporting the PCB board 602 and preventing the PCB board 602 from bending downward during the placement of the bare die chip 700, which would affect the assembly and connection between the PCB board 602 and the bare die chip 700.

[0064] After each PCB board 602 on the PCB substrate group 600 is attached with a bare die chip 700, the telescopic end of the electric push rod 305 retracts, causing the lifting plate 303 and the baffle 304 to move downward, releasing the interception of the PCB substrate group 600. After the PCB substrate group 600 is transported away, the lifting plate 303 and the baffle 304 move upward to reset.

[0065] refer to Figures 1-3The moving mechanism includes two sliding grooves 400 formed on the upper surface of the mounting base 100. A sliding block 401 is slidably disposed in each sliding groove 400. A lead screw 402 is rotatably disposed on the inner wall of the sliding groove 400. The lead screw 402 is threaded through the sliding block 401. A second drive mechanism is provided in the mounting base 100 to cooperate with the rotation of the lead screw 402. The second drive mechanism is prior art. A connecting frame 403 is fixed on the upper surface of each sliding block 401. An electric guide rail 404 is fixed between the connecting frames 403. An electric slider is slidably disposed on the electric guide rail 404. The moving seat 102 is fixed to the lower surface of the electric slider.

[0066] When the drive mechanism 2 drives the lead screw 402 to rotate, it will drive the sliding block 401 to generate displacement, thereby causing the sliding block 401, the connecting frame 403, the electric guide rail 404 and the moving seat 102 to move laterally. When the electric guide rail 404 drives the electric slider to move, it will drive the moving seat 102 to move vertically.

[0067] A method for operating a memory card assembly and welding device, comprising the following specific steps:

[0068] Step 1: The conveying assembly moves and conveys the PCB substrate group 600 to be processed to the processing position. Then, the moving seat 102 moves above the placement frustum 101. Then, the telescopic end of the electric push rod 104 extends, pushing the U-shaped frame 105, the adsorption plate 106 and multiple vacuum nozzles 107 downward until the multiple vacuum nozzles 107 adsorb and adhere to the upper surface of the single bare die chip 700. Then, the telescopic end of the electric push rod 104 retracts.

[0069] Step 2: The moving mechanism causes the moving seat 102, electric push rod 104, U-shaped frame 105, adsorption plate 106 and bare die chip 700 to move toward the corresponding PCB board 602 until the dispensing assembly 103 moves above the corresponding single PCB board 602, and then epoxy resin is applied to the upper surface of the PCB board 602.

[0070] Step 3: Under the action of the moving mechanism, the U-shaped frame 105, the adsorption plate 106 and the bare die chip 700 are moved to the top of the PCB board 602. Then, the telescopic end of the electric push rod 104 extends, pushing the U-shaped frame 105, the adsorption plate 106 and the bare die chip 700 downward. During this process, the rotating plate 108, the U-shaped frame 109 and the pressure roller 110 also move downward with the U-shaped frame 105 until the bare die chip 700 is attached to the upper surface of the PCB board 602.

[0071] Step four: The electric push rod 104 continues to push the U-shaped frame 105 downward. During this process, the adsorption plate 106 can no longer move downward. The rotating plate 108, the U-shaped frame 109 and the pressure roller 110 rotate relative to the U-shaped frame 105, causing the pressure roller 110 to roll against the upper surface of the bare die chip 700, and to roll the epoxy resin between the PCB board 602 and the bare die chip 700 evenly.

[0072] Step 5: The telescopic end of the electric actuator 104 retracts, completing the combined connection of a single PCB board 602 and a single bare die chip 700.

[0073] In use, the PCB substrate assembly 600 to be processed is transported to the processing position (near the placement frustum 101) by the conveying assembly and then stops moving. Then, the moving seat 102, under the action of the moving mechanism, moves above the placement frustum 101. Then, the telescopic end of the electric push rod 104 extends, pushing the U-shaped frame 105, the suction plate 106, and multiple vacuum nozzles 107 downwards until the multiple vacuum nozzles 107 adhere to the upper surface of the single bare die chip 700. Then, the electric... The telescopic end of push rod 104 retracts, and the moving mechanism causes the moving base 102, electric push rod 104, U-shaped frame 105, adsorption plate 106, and bare die chip 700 to move toward the corresponding PCB board 602 until the dispensing assembly 103 moves above the corresponding single PCB board 602. Then, epoxy resin is applied to the upper surface of the PCB board 602. Subsequently, under the action of the moving mechanism, the U-shaped frame 105, adsorption plate 106, and bare die chip 700 are moved toward the PCB board. Above board 602, the telescopic end of electric push rod 104 extends, pushing U-shaped frame 105, adsorption plate 106, and bare die chip 700 downwards. During this process, rotating plate 108, U-shaped frame 109, and pressure roller 110 also move downwards with U-shaped frame 105 until the bare die chip 700 is attached to the upper surface of PCB board 602. At this time, the lower surfaces of the two pressure rollers 110 also contact the upper surface of the bare die chip 700. Then, electric push rod 104 continues to push U-shaped frame 105. 05 moves downward. During this process, the adsorption plate 106 can no longer move downward. The rotating plate 108, the second U-shaped frame 109 and the pressure roller 110 rotate relative to the first U-shaped frame 105, causing the pressure roller 110 to roll against the upper surface of the bare die chip 700. During this process, the epoxy resin between the PCB board 602 and the bare die chip 700 is rolled evenly. Then the telescopic end of the electric push rod 104 retracts, completing the combination connection of a single PCB board 602 and a single bare die chip 700.

[0074] Following the above working principle, the process continues until each PCB board 602 on the PCB substrate group 600 is attached with a bare die chip 700. Then, the conveying component conveys the PCB substrate group 600 again to the curing and soldering chamber 500. The curing component then causes the epoxy resin between the PCB board 602 and the bare die chip 700 to cure, which initially connects the PCB board 602 and the bare die chip 700 together and prevents displacement between the bare die chip 700 and the PCB board 602 when the soldering component is working. After the epoxy resin has cured, the soldering component works to solder gold wires onto the PCB board 602 and the bare die chip 700, which further connects the PCB board 602 and the bare die chip 700.

[0075] As the adsorption plate 106 moves downwards with the bare die chip 700 towards the PCB board 602, the mounting frame 200 and the sponge adsorption ring 201 also move downwards along with the adsorption plate 106. The mounting frame 200 and the sponge adsorption ring 201 first contact the upper surface of the PCB board 602, and then the adsorption plate 106 continues to move downwards until the bare die chip 700 is attached to the upper surface of the PCB board 602. At this time, the sponge adsorption ring 201 is located on the outer ring of the bare die chip 700. Then, the pressure roller 110 moves on the surface of the bare die chip 700. If the dispensing assembly 103 malfunctions and the amount of epoxy resin dripping onto the PCB board 602 increases, then during the rolling of the pressure roller 110 on the upper surface of the bare die chip 700, the excess epoxy resin located between the PCB board 602 and the bare die chip 700 will be squeezed out. The squeezed-out epoxy resin will be held by the sponge adsorption ring 201 located on the outer ring of the bare die chip 700. 1. Adsorption, and when the pressure roller 110 rolls on the upper surface of the sponge adsorption ring 201, it can promote the sponge adsorption ring 201 to fully contact the PCB board 602, thereby enabling the sponge adsorption ring 201 to repeatedly absorb the extruded epoxy resin. Then, when the U-shaped frame 105, adsorption plate 106, mounting frame 200 and sponge adsorption ring 201 leave the PCB board 602 and pass through the photo-monitoring component 204 (each time they pass through the photo-monitoring component 204, the U-shaped frame 105, adsorption plate 106, mounting frame 200 and sponge adsorption ring 201 will pause at this position to cooperate with the photo-monitoring component 204 to take a picture and monitor the lower surface of the sponge adsorption ring 201), when the photo-monitoring component 204 detects that epoxy resin is adhered to the lower surface of the sponge adsorption ring 201, the machine is stopped to maintain the dispensing component 103, but the PCB board 602 does not need to be cleaned, which is convenient to use;

[0076] In the initial state, the baffle 304 is higher than the PCB substrate assembly 600, which allows the baffle 304 to intercept and position the PCB substrate assembly 600 that is being transported. At this time, the PCB substrate assembly 600 is in the processing position where it is combined with the bare die chip 700. Then, the telescopic end of the electric push rod 305 extends further, pushing the lifting plate 303 and the baffle 304 to continue moving upward until the lifting plate 303 contacts the lower end face of the substrate frame 601 and the PCB board 602, supporting the PCB board 602 and preventing the PCB board 602 from bending downward during the process of placing the bare die chip 700 on the PCB board 602, which would affect the combination connection between the PCB board 602 and the bare die chip 700.

[0077] After each PCB board 602 on the PCB substrate group 600 is attached with a bare die chip 700, the telescopic end of the electric push rod 305 retracts, causing the lifting plate 303 and the baffle 304 to move downward, releasing the interception of the PCB substrate group 600. After the PCB substrate group 600 is transported away, the lifting plate 303 and the baffle 304 move upward to reset.

[0078] The above-disclosed embodiments are merely preferred embodiments of the present invention. However, the embodiments of the present invention are not limited thereto, and any variations that can be conceived by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. A memory card assembly and welding apparatus, comprising a mounting base (100) fixed to a workbench, characterized in that, The upper surface of the mounting base (100) is provided with a conveying assembly and a placement truncated cone (101). A movable seat (102) is movably arranged above the mounting base (100). A dispensing assembly (103) is provided on the lower surface of the movable seat (102). An electric push rod (104) is fixed on the lower surface of the movable seat (102). A U-shaped frame (105) is fixed at the end of the telescopic end of the electric push rod (104). An adsorption plate (106) is arranged below the U-shaped frame (105). A plurality of vacuum tubes are arranged on the lower surface of the adsorption plate (106). An elastic unit is provided between the air suction nozzle (107), the adsorption plate (106) and the movable seat (102). Two rotating plates (108) are rotatably provided on the inner wall of the U-shaped frame (105). A U-shaped frame (109) is fixed at the lower end of the rotating plate (108). A pressure roller (110) is rotatably provided on the inner wall of the U-shaped frame (109). An elastic unit (2) is provided on the U-shaped frame (105) to cooperate with the rotating plate (108). A moving mechanism is provided on the mounting base (100) to cooperate with the movable seat (102). The elastic unit includes a lower connecting block (111) fixed on both sides of the adsorption plate (106), an upper connecting block (112) fixed on both sides of the U-shaped frame (105), a guide rod (113) fixed on the upper end face of the lower connecting block (111), the upper end face of the guide rod (113) movably passes through the upper connecting block (112) and is fixed with a limit plate (114), a spring (115) is fixed between the lower connecting block (111) and the upper connecting block (112), and the spring (115) is movably sleeved on the outer surface of the guide rod (113); The conveying assembly includes a U-shaped base (300), with two conveying guide rails (301) symmetrically fixed on the upper end of the U-shaped base (300). Each conveying guide rail (301) is provided with a conveying groove (302). Multiple conveying wheels are rotatably arranged in the inner bottom of the conveying groove (302). A drive mechanism is provided on the conveying guide rail (301) to cooperate with the rotation of the multiple conveying wheels. A lifting plate (303) is movably arranged on the inner wall of the U-shaped base (300). A baffle (304) is fixed on one side of the lifting plate (303). Multiple sinking grooves are opened in the inner bottom of the U-shaped base (300). An electric push rod (305) is fixed in each sinking groove. The end of the telescopic end of the electric push rod (305) is fixedly connected to the lower end face of the lifting plate (303). Multiple guide columns (306) are symmetrically fixed on the lower end face of the lifting plate (303). The lower end of the guide column (306) movably penetrates into the U-shaped base (300). The conveying assembly is used to convey the PCB substrate group (600) to be processed, the placement frustum (101) is used to receive and place the cut bare die chip (700), and the dispensing assembly (103) is used to apply epoxy resin to the PCB board (602).

2. The memory card assembly and welding apparatus according to claim 1, characterized in that, One of the lower connecting blocks (111) has a ventilation groove (116) on one side, the ventilation groove (116) extends into the adsorption plate (106), and the upper end of each vacuum nozzle (107) is fixedly extended into the ventilation groove (116). A ventilation hose (117) is connected to one side of the lower connecting block (111), and one end of the ventilation hose (117) is connected to an external vacuum pumping unit.

3. The memory card assembly and welding apparatus according to claim 1, characterized in that, Each of the rotating plates (108) has a rotating column (118) fixed on both sides. One end of each rotating column (118) movably passes through the U-shaped frame (105) and is fixed with a connecting plate (119). The elastic unit includes multiple torsion springs (120). The torsion springs (120) are movably sleeved on the outer surface of the rotating column (118). The two ends of the torsion springs (120) are fixedly connected to the U-shaped frame (105) and the connecting plate (119) respectively.

4. The memory card assembly and welding apparatus according to claim 1, characterized in that, A mounting frame (200) is provided below the adsorption plate (106). A sponge adsorption ring (201) is detachably provided on the inner wall of the mounting frame (200). A magnet ring one (202) is fixed on the outer surface of the sponge adsorption ring (201). A magnet ring two (203) is fixed on the inner wall of the mounting frame (200). The magnet ring one (202) and the magnet ring two (203) are magnetically attracted. An elastic unit three is provided between the adsorption plate (106) and the mounting frame (200). A photo-taking monitoring component (204) is fixed on the upper surface of the mounting base (100).

5. A memory card assembly and welding apparatus according to claim 4, characterized in that, The elastic unit three includes two pairs of extension plates (205) fixed on both sides of the adsorption plate (106). Multiple guide rods (206) are fixed on the upper end of the mounting frame (200). The upper end of each guide rod (206) movably passes through the extension plate (205) and is fixed with a limiting plate (207). Multiple springs (208) are fixed between the mounting frame (200) and the extension plate (205). The springs (208) are movably sleeved on the outer surface of the guide rods (206).

6. The memory card assembly and welding apparatus according to claim 1, characterized in that, The moving mechanism includes two sliding grooves (400) opened on the upper end face of the mounting base (100). A sliding block (401) is slidably arranged in each sliding groove (400). A lead screw (402) is rotatably arranged on the inner wall of the sliding groove (400). The lead screw (402) is threaded through the sliding block (401). A second driving mechanism is provided in the mounting base (100) to cooperate with the rotation of the lead screw (402). A connecting frame (403) is fixed on the upper end face of each sliding block (401). An electric guide rail (404) is fixed between the connecting frames (403). An electric slider is slidably arranged on the electric guide rail (404). The moving seat (102) is fixed to the lower end face of the electric slider.

7. The memory card assembly and welding apparatus according to claim 1, characterized in that, The upper surface of the mounting base (100) is fixed with a curing and welding chamber (500), and the curing and welding chamber (500) is provided with a curing treatment component and a welding component.

8. A method for operating a memory card assembly and welding apparatus, applied to the memory card assembly and welding apparatus according to any one of claims 1-7, characterized in that, The specific steps are as follows: Step 1: The conveying assembly moves and conveys the PCB substrate group (600) to be processed to the processing position. Then, the moving seat (102) moves above the placement frustum (101). Then, the telescopic end of the electric push rod (104) extends, pushing the U-shaped frame (105), the adsorption plate (106) and multiple vacuum nozzles (107) to move downward until the multiple vacuum nozzles (107) adsorb and adhere to the upper surface of the single bare die chip (700). Then, the telescopic end of the electric push rod (104) retracts. Step 2: The moving mechanism causes the moving seat (102), electric push rod 1 (104), U-shaped frame 1 (105), adsorption plate (106) and bare die chip (700) to move toward the corresponding PCB board (602) until the dispensing assembly (103) moves above the corresponding single PCB board (602), and then epoxy resin is applied to the upper surface of the PCB board (602). Step 3: Under the action of the moving mechanism, the U-shaped frame 1 (105), the adsorption plate (106) and the bare die chip (700) are moved to the top of the PCB board (602). Then, the telescopic end of the electric push rod 1 (104) extends, pushing the U-shaped frame 1 (105), the adsorption plate (106) and the bare die chip (700) to move downward. During this process, the rotating plate (108), the U-shaped frame 2 (109) and the pressure roller (110) also follow the U-shaped frame 1 (105) to move downward until the bare die chip (700) is attached to the upper surface of the PCB board (602). Step four, the electric push rod one (104) continues to push the U-shaped frame one (105) downward. During this process, the adsorption plate (106) cannot continue to move downward. The rotating plate (108), the U-shaped frame two (109) and the pressure roller (110) rotate relative to the U-shaped frame one (105), causing the pressure roller (110) to roll against the upper surface of the bare die chip (700) and roll the epoxy resin between the PCB board (602) and the bare die chip (700) evenly. Step 5: The telescopic end of the electric actuator (104) retracts, completing the combined connection of a single PCB board (602) and a single bare die chip (700).

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