Busbar substrate, busbar substrate device, stator, and method for manufacturing stator

Abstract

A bus bar substrate (10) having a resin substrate (11) and a bus bar (30) made of a conductive metal, characterized in that: the bus bar (30) has planar bus bar conductive parts (a first planar bus bar (31) and a second planar bus bar (32)) formed in a plate shape on one surface (an upper surface (12)) of the resin substrate (11); in a surface (upper surface (12)) of the resin substrate (11) on which the planar bus bar conductive parts (the first planar bus bar (31) and the second planar bus bar (32)) are provided, the planar bus bar conductive parts (the first planar bus bar (31) and the second planar bus bar (32)) are flush with the resin substrate (11).

Description

Technical Field

[0001] The present invention relates to a busbar substrate, a busbar substrate device, a stator and a method for manufacturing the stator. Background Art

[0002] In rotating electrical machines such as motors (engines) and generators, there is known a technique in which, when a coil is housed in a slot provided in a stator, the slot is filled with insulating paper or a resin material to ensure insulation between the slot and the coil (see, for example, Patent Document 1).

[0003] Patent Document 1 discloses a technique for forming an insulating layer by injecting and curing resin between a conductor (coil) and the peripheral wall of a slot. The coil is formed into the desired coil package structure by housing a straight rectangular wire within the slot and connecting the portions protruding from the slot ends by welding or other means.

[0004] Prior art literature Patent Literature Patent Document 1: Japanese Patent No. 6814568 Summary of the Invention

[0005] Technical problem to be solved by the invention However, demands for miniaturization of rotating electrical machines are increasing. As part of this, there is a growing need for technologies that achieve lower motor heights while ensuring insulation and heat dissipation. For example, in motors that use flat wire coils arranged in stator slots, a structure is employed in which U-shaped flat wires, known as segment conductors, are housed within the slots. The portions protruding from the slot ends are bent and connected by welding. This welding of the coils poses a technical challenge to achieving a lower profile.

[0006] The present invention has been made in view of the above-mentioned situation, and an object of the present invention is to provide a technology capable of reducing the height of a rotating machine such as a motor.

[0007] Means for solving technical problems According to the present invention, the following technical solutions are provided.

[0008] 1. A busbar substrate comprising an insulating substrate and busbars made of a conductive metal, wherein: The busbar has a planar busbar conductive portion formed in a plate shape on one surface of the insulating substrate. On the surface of the insulating substrate where the planar busbar conductive portion is provided, the planar busbar conductive portion is flush with the insulating substrate.

[0009] 2. The busbar substrate according to 1., wherein the busbar does not protrude from the outer shape of the insulating substrate.

[0010] 3. The busbar substrate according to 1. or 2., wherein the insulating substrate is formed from a cured product of a resin composition, and the cured product has a linear expansion coefficient of 50 ppm / K or less at a temperature below the glass transition temperature.

[0011] 4. The busbar substrate according to 1. or 2., wherein the insulating substrate is formed from a cured product of a resin composition comprising an epoxy resin or a phenolic resin.

[0012] 5. The busbar substrate according to 1. or 2., further comprising a through hole extending through both the insulating substrate and the planar busbar conductive portion.

[0013] 6. The busbar substrate according to 5., wherein the through-holes function as positioning means for the flat wires disposed in the grooves.

[0014] 7. The busbar substrate according to 1. or 2., wherein the insulating substrate is formed from a cured product of a resin composition, and the thermal conductivity of the cured product is 0.5 W / (m·K) or greater.

[0015] 8. A busbar substrate device, characterized in that it is formed by stacking a plurality of busbar substrates described in 1. or 2.

[0016] 9. The busbar substrate device according to 8., characterized in that: The busbar substrate device is mounted on at least one axial end portion of the stator of the motor. The busbar constitutes a portion of a coil winding arranged across slots of the stator.

[0017] 10. The busbar substrate device according to 9., characterized in that: The coil winding is a flat wire, The flat wire has a vertical coil wire that can be placed in the slot, Ends of the vertical coil wires extending from the slots are electrically connected to the busbars.

[0018] 11. The busbar substrate device according to 10., characterized in that: The through hole is provided so as to allow the end of the vertical coil wire to be inserted therethrough and guide the end of the vertical coil wire so as to be connected to the bus bar.

[0019] 12. A stator used in a motor, characterized in that: The busbar substrate device described in 8 is provided at at least one axial end portion of the stator.

[0020] 13. The stator according to 12., characterized in that: The stator is annular in shape when viewed from the axial end. The busbar substrate device is configured as a single annular element or a collective element in which a plurality of elements are arranged in an annular shape in the circumferential direction when viewed from an end portion in the axial direction.

[0021] 14. The stator according to 12., characterized in that: The vertical coil wire is a bare wire not covered with an insulating member.

[0022] 15. A method for manufacturing a stator having coil wires arranged between slots, the method comprising: a preparation step of preparing a busbar substrate including an insulating substrate, a busbar made of a conductive metal, and a through hole penetrating both the insulating substrate and the busbar; a busbar substrate disposing step of arranging the busbar substrate at an axial end portion of the stator; and The busbar / coil connecting step includes placing a vertical coil wire constituting the coil wire in a slot of the stator, inserting the vertical coil wire into the through hole of the busbar substrate, and electrically connecting the busbar and the vertical coil wire.

[0023] 16. The method for manufacturing a stator according to 15., wherein in the busbar substrate arranging step, a plurality of the busbar substrates are stacked one after another at one end in the axial direction of the stator.

[0024] 17. The stator manufacturing method according to 15. or 16. further comprising: a slot sealing step of injecting a sealing material into the slot after the busbar / coil connection step is performed at least at one axial end of the stator.

[0025] 18. The method for manufacturing a stator according to 17., wherein the sealing material comprises an epoxy resin or a phenolic resin as the resin composition.

[0026] 19. The method for manufacturing a stator according to 18., wherein the insulating substrate is formed of a cured product of a resin composition, and the resin composition of the insulating substrate is the same as the resin composition of the sealing material.

[0027] 20. The stator manufacturing method according to 15. or 16., characterized in that in the busbar / coil connecting step, the vertical coil wire is electrically connected to the busbar using at least one bonding method selected from the group consisting of laser welding, solder bonding, and bonding using a conductive adhesive.

[0028] 21. The stator manufacturing method according to 15. or 16., wherein in the busbar / coil connection step, the vertical coil wire is positioned within the slot by inserting the vertical coil wire through the through hole.

[0029] 22. The method for manufacturing a stator according to 15. or 16., wherein the vertical coil wire is a bare wire not covered by an insulating member.

[0030] Effects of the Invention According to the present invention, the height of the rotary machine can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a longitudinal sectional view of the motor according to the embodiment.

[0032] Figure 2 It is a cross-sectional view of a motor according to an embodiment.

[0033] Figure 3 This is an enlarged view of one groove according to the embodiment.

[0034] Figure 4 It is a diagram of a busbar substrate device according to an embodiment.

[0035] Figure 5 It is a plan view of a busbar substrate according to the embodiment.

[0036] Figure 6 The implementation method is Figure 5 A1-A1 cross-sectional view.

[0037] Figure 7 The implementation method is Figure 5 Magnified view of area B.

[0038] Figure 8 It means that the embodiment involves Figure 7 The diagram shows a state where the coil ends are inserted into the through-holes (the second through-hole and the fourth through-hole) shown.

[0039] Figure 9 The implementation method is Figure 7 A3-A3 cross-sectional view.

[0040] Figure 10The implementation method is Figure 8 A4-A4 cross-sectional view.

[0041] Figure 11 This is a cross-sectional view illustrating a coil joining portion according to the embodiment.

[0042] Figure 12 This is a flowchart showing a manufacturing process of a stator according to the embodiment.

[0043] Figure 13 This is a diagram schematically showing the manufacturing process of the stator according to the embodiment, focusing on the joining of coils using a busbar substrate. DETAILED DESCRIPTION

[0044] <Outline> In the present embodiment, an example in which the present invention is applied to an electric motor (motor) as a rotating electrical machine (electric motor, generator, or electric motor / generator combination) will be described. Figure 1 It is a longitudinal cross-sectional view of the motor 100 . Figure 2 is a cross-sectional view of the motor 100 .

[0045] The present embodiment is outlined as follows. In motor 100, when coils 9 made of flat rectangular wire are installed in stator 4, the portions protruding outward from the ends of slots 8 (coil ends 92) are connected using busbar substrate assembly 1 (busbar substrate 10), rather than simply aligning and joining the ends as in the conventional method. This allows the portions of coils 9 protruding from slots 8 to be lowered in height.

[0046] <Basic Structure of Motor 100> The motor 100 includes a rotor 2, a stator 4, a coil 9, a busbar substrate device 1, and an inverter device 99, which are housed in a housing 101. Coil ends 92 of the coil 9 are connected via busbars 30 of the busbar substrate device 1.

[0047] The housing 101 includes a cylindrical portion 101 a and side plates 101 b and 101 c that close both axial ends of the cylindrical portion 101 a. Examples of materials for the housing 101 include aluminum alloy (casting), resin, and combinations thereof.

[0048] Rotor 2 The rotor 2 is housed within the housing 101. A rotating shaft 3, serving as an output shaft, is mounted at the center of the rotor 2. Both ends of the rotating shaft 3 are supported by side plates 101b and 101c via bearings 3a, respectively. This allows the rotor 2 to rotate about the rotating shaft 3.

[0049] The rotor 2 has a built-in permanent magnet 5. Specifically, a plurality of permanent magnets 5 are arranged at equal intervals on the same circumference. At this time, the adjacent permanent magnets 5 are arranged so that the magnetic poles are different from each other.

[0050] A cylindrical stator 4 is disposed and fixed on the inner circumference of the cylindrical portion 101a so as to surround the outer circumference of the rotor 2. A small gap (air gap) is provided between the inner circumference of the stator 4 and the outer circumference of the rotor 2.

[0051] <Stator 4> The stator 4 is provided by stacking a plurality of electromagnetic steel sheets in the axial direction and fixing them tightly. Figure 2 As shown, when viewed from the axial end, a yoke 6 is provided in an annular shape and a plurality of teeth 7 are provided extending from the yoke 6 toward the rotor 2 side (inner circumference side). The plurality of teeth 7 are arranged at equal intervals in the circumferential direction.

[0052] <Tooth 7> The teeth 7 are provided corresponding to the permanent magnets 5 of the rotor 2 . When the coils 9 are sequentially excited, the corresponding permanent magnets 5 are attracted or repelled, thereby rotating the rotor 2 .

[0053] The tooth 7 is formed so that the width of the outer circumference is large and the width of the inner circumference is small, and the tooth becomes thinner toward the inner circumference. At the inner circumference of the tooth 7, a tooth tip 7b is formed that is opposite to the circumference in such a way as to reduce the width of the groove 8 (see FIG. Figure 3 ).

[0054] <Slot 8> exist Figure 3 The figure shows an enlarged view of one slot 8. Slot 8 is the space between adjacent teeth 7, defined by radially opposing tooth wall surfaces 7a and the inner circumferential wall surface 6a of the yoke 6. The area between the tooth tips 7b forms the inner circumferential opening of slot 8. Multiple coils 9 and a sealing layer 60 are located within slot 8.

[0055] <Sealing layer 60> The sealing layer 60 is a cured product of a resin material, and is provided so as to fill gaps between the coils 9 when the plurality of coils 9 are arranged in the slot 8 .

[0056] <Physical Properties of Sealing Layer 60> The physical properties of the cured product of the resin material constituting the sealing layer 60 are as follows, for example.

[0057] The thermal conductivity of a cured resin material is 0.5 W / (m·K) or higher. The lower limit of the thermal conductivity is preferably 1.0 W / (m·K) or higher, and more preferably 2 W / (m·K) or higher. The upper limit of the thermal conductivity is not particularly limited, but a practical value is 10 W / (m·K).

[0058] The resin composition of the sealing layer 60 has a glass transition temperature Tg of 120° C. or higher, preferably 140° C. or higher, and more preferably 160° C. or higher. By setting the glass transition temperature Tg within this range, the motor 100 can be used at high temperatures, can withstand heat generated by the coil 9, and can be used at high output.

[0059] Next, the resin composition of the sealing layer 60 will be described in detail.

[0060] <Material of Sealing Layer 60> The resin composition of the sealing layer 60 preferably contains a thermosetting resin (A), a filler (B), a curing agent (C), and the like.

[0061] (Thermosetting resin (A)) Examples of the thermosetting resin (A) include epoxy resins, cyanate resins, polyimide resins, benzoxazine resins, unsaturated polyester resins, phenolic resins, melamine resins, silicone resins, bismaleimide resins, phenoxy resins, and acrylic resins. The thermosetting resin (A) may be used alone or in combination of two or more.

[0062] Among them, epoxy resins, phenolic resins, and phenoxy resins are preferred as the thermosetting resin (A) from the viewpoint of high insulation properties, and epoxy resins are particularly preferred from the viewpoint of ensuring flow in extremely narrow portions during molding.

[0063] Examples of the epoxy resin include bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol E epoxy resin, bisphenol S epoxy resin, bisphenol M epoxy resin (4,4'-(1,3-phenylenediisopropylidene) bisphenol type epoxy resin), bisphenol P epoxy resin (4,4'-(1,4-phenylenediisopropylidene) bisphenol type epoxy resin), bisphenol Z epoxy resin (4,4'-cyclohexadiene bisphenol type epoxy resin), and the like; phenol novolac epoxy resin, cresol novolac epoxy resin, trisphenol methane novolac epoxy resin, tetraphenol type epoxy resin. Novolac-type epoxy resins such as ethylene-type novolac-type epoxy resins and novolac-type epoxy resins having a condensed ring aromatic hydrocarbon structure; biphenyl-type epoxy resins; arylalkylene-type epoxy resins such as xylene-type epoxy resins and biphenylaralkyl-type epoxy resins; naphthalene-type epoxy resins such as naphthalene ether-type epoxy resins, naphthol-type epoxy resins, naphthalenediol-type epoxy resins, bifunctional to tetrafunctional epoxy-type naphthalene resins, binaphthyl-type epoxy resins, and naphthalenearalkyl-type epoxy resins; anthracene-type epoxy resins; phenoxy-type epoxy resins; dicyclopentadiene-type epoxy resins; norbornene-type epoxy resins; adamantane-type epoxy resins; and fluorene-type epoxy resins. Any of these epoxy resins may be used alone or in combination of two or more.

[0064] Among epoxy resins, from the viewpoint of being able to further improve heat resistance and insulation reliability, one or more selected from bisphenol-type epoxy resins, novolac-type epoxy resins, biphenyl-type epoxy resins, aryl alkylene-type epoxy resins, naphthalene-type epoxy resins, anthracene-type epoxy resins, and dicyclopentadiene-type epoxy resins are preferred.

[0065] Examples of the phenolic resin include novolac-type phenolic resins such as phenol novolac resin, cresol novolac resin, and bisphenol A novolac resin, and resol-type phenolic resins, etc. These resins may be used alone or in combination of two or more.

[0066] Among the phenolic resins, phenol novolac resins are preferred.

[0067] The content of the thermosetting resin (A) is preferably 1% by mass or more, and more preferably 5% by mass or more, relative to the total amount of the resin composition in the sealing layer 60. On the other hand, the content is preferably 30% by mass or less, and more preferably 20% by mass or less, relative to the total amount of the resin composition in the sealing layer 60.

[0068] When the content of the thermosetting resin (A) is equal to or greater than the lower limit, the handleability of the resin composition of the sealing layer 60 is improved, the sealing layer 60 can be easily formed in the groove 8 , and the strength of the sealing layer 60 is improved.

[0069] When the content of the thermosetting resin (A) is equal to or less than the above upper limit, the linear expansion coefficient and elastic modulus of the sealing layer 60 are further improved, and the thermal conductivity is further improved.

[0070] (Filler (B)) The filler (B) in this embodiment is used from the viewpoint of improving the thermal conductivity of the sealing layer 60 and obtaining strength.

[0071] The filler (B) is preferably an inorganic filler, and a thermally conductive filler is particularly preferred. More specifically, from the perspective of achieving a balance between thermal conductivity and electrical insulation, examples of the filler (B) include silica, alumina, boron nitride, aluminum nitride, and silicon carbide. These fillers may be used alone or in combination of two or more. Among these, alumina and boron nitride are preferred.

[0072] The content of the filler (B), that is, the content of the filler, is preferably 60% by mass or more relative to the total amount of the resin composition.

[0073] (Curing agent (C)) When an epoxy resin or a phenol resin is used as the thermosetting resin (A), the resin composition preferably further contains a curing agent (C).

[0074] As the curing agent (C), one or more selected from a curing catalyst (C-1) and a phenolic curing agent (C-2) can be used.

[0075] Examples of the curing catalyst (C-1) include organic metal salts such as zinc naphthenate, cobalt naphthenate, tin octoate, cobalt octoate, cobalt diacetylacetonate (II), and cobalt triacetylacetonate (III); tertiary amines such as triethylamine, tributylamine, and 1,4-diazabicyclo[2.2.2]octane; imidazoles such as 2-phenyl-4-methylimidazole, 2-ethyl-4-methylimidazole, 2,4-diethylimidazole, 2-phenyl-4-methyl-5-hydroxyimidazole, and 2-phenyl-4,5-dihydroxymethylimidazole; organic phosphorus compounds such as triphenylphosphine, tri-p-tolylphosphine, tetraphenylphosphonium-tetraphenylborate, triphenylphosphine-triphenylborane, and 1,2-bis-(diphenylphosphino)ethane; phenol compounds such as phenol, bisphenol A, and nonylphenol; organic acids such as acetic acid, benzoic acid, salicylic acid, and p-toluenesulfonic acid; and mixtures thereof. As the curing catalyst (C-1), one species including derivatives thereof may be used alone, or two or more species including derivatives thereof may be used in combination.

[0076] The content of the curing catalyst (C-1) is not particularly limited, but is preferably 0.001% by mass or more and 1% by mass or less based on the total amount of the resin composition.

[0077] In addition, examples of the phenolic curing agent (C-2) include: novolac-type phenolic resins such as phenol novolac resin, cresol novolac resin, trisphenol methane novolac resin, naphthol novolac resin, and aminotriazine novolac resin; modified phenolic resins such as terpene-modified phenolic resin and dicyclopentadiene-modified phenolic resin; aralkyl-type resins such as phenol aralkyl resins having a phenylene skeleton and / or a biphenylene skeleton and naphthol aralkyl resins having a phenylene skeleton and / or a biphenylene skeleton; bisphenol compounds such as bisphenol A and bisphenol F; resol-type phenolic resins, etc. These may be used alone or in combination of two or more.

[0078] Among them, the phenolic curing agent (C-2) is preferably a novolac-type phenolic resin or a resol-type phenolic resin from the viewpoint of increasing the glass transition temperature and reducing the linear expansion coefficient.

[0079] The content of the phenolic curing agent (C-2) is not particularly limited, but is preferably 1% by mass or greater, and more preferably 5% by mass or greater, relative to the total amount of the resin composition. On the other hand, the content is preferably 30% by mass or less, and more preferably 15% by mass or less, relative to the total amount of the resin composition.

[0080] (Coupling agent (D)) The resin composition may contain a coupling agent (D). The coupling agent (D) can improve the wettability of the interface between the thermosetting resin (A) and the filler (B).

[0081] The coupling agent (D) is not particularly limited, but is preferably one or more coupling agents selected from epoxy silane coupling agents, cationic silane coupling agents, amino silane coupling agents, titanate coupling agents, and silicone oil coupling agents.

[0082] The content of the coupling agent (D) is not particularly limited, but is preferably 0.05% by mass or greater, and more preferably 0.1% by mass or greater, relative to 100% by mass of the filler (B). On the other hand, the content is preferably 3% by mass or less, and more preferably 2% by mass or less, relative to 100% by mass of the filler (B).

[0083] (Phenoxy resin (E)) The resin composition may further contain a phenoxy resin (E). By containing the phenoxy resin (E), the bending resistance of the sealing layer 60 can be improved, the elastic modulus can be reduced, and the stress relaxation ability of the sealing layer 60 can be improved.

[0084] Furthermore, when phenoxy resin (E) is included, viscosity increases and fluidity decreases, thereby suppressing the generation of voids, etc. Furthermore, when the sealing layer 60 is used in close contact with a metal component (i.e., the teeth 7), the adhesion between the metal and the cured resin composition can be improved.

[0085] Examples of the phenoxy resin (E) include phenoxy resins having a bisphenol skeleton, phenoxy resins having a naphthalene skeleton, phenoxy resins having an anthracene skeleton, and phenoxy resins having a biphenyl skeleton. Phenoxy resins having multiple structures of these skeletons may also be used.

[0086] The content of the phenoxy resin (E) is preferably 3% by mass or more and 10% by mass or less relative to the total amount of the resin composition.

[0087] (Release agent) The resin composition preferably includes a release agent. This improves the releasability after molding. Examples of release agents include natural waxes such as carnauba wax, synthetic waxes such as montanate wax and oxidized polyethylene wax, higher fatty acids such as zinc stearate and their metal salts, and paraffin wax. These may be used alone or in combination of two or more.

[0088] When a release agent is used, its content is preferably 0.01 to 3% by mass, more preferably 0.05 to 2% by mass, based on the total resin molding material. This ensures improved releasability and, as a result, improves the molding accuracy of the sealing layer 60 .

[0089] (Other ingredients) The resin composition may further contain an antioxidant, a leveling agent, and the like within a range that does not impair the effects of the present invention.

[0090] <Coil 9> Coil 9 is made of a good conductor such as copper and includes a coil body 91 of a rectangular flat wire with a rectangular cross section and a bus bar 30 connecting portions of coil body 91 that protrude axially outward from the ends of slots 8 (coil ends 92 ).

[0091] The busbar 30 is provided in the busbar substrate device 1 (busbar substrate 10 ), and will be described in detail later.

[0092] The coil bodies 91 are provided in a straight line and housed in the slots 8. Here, in one slot 8, four coil bodies 91 are arranged in a row at predetermined intervals in the radial direction (direction from the central axis toward the outside).

[0093] Furthermore, the coil bodies 91 are insulated by the sealing layer 60. Furthermore, the busbar substrate assembly 1 (through-hole 70), described later, provides high-precision positioning, ensuring that the coil bodies 91 are reliably spaced and insulated within the slot 8. This allows the use of bare coils without an insulating coating as the coils 9. Furthermore, while conventionally, a sealing process involving pre-installing an insulating member (insulating paper) on the walls of the slot 8 is required, this is unnecessary in this embodiment.

[0094] <Busbar substrate device 1> exist Figure 4 The busbar substrate device 1 is shown in FIG. Figure 4 (a) is a plan view of the busbar substrate device 1, Figure 4 (b) is a side view ( Figure 4 (a) is a view taken along arrow C of FIG. 1 . Here, the structure of the busbar substrate device 1 corresponding to the stator 4 having 48 slots 8 is exemplified.

[0095] The busbar substrate devices 1 are provided at both ends of the stator 4 in the axial direction, and connect the coil ends 92 of two predetermined coil bodies 91 .

[0096] The busbar substrate assembly 1 is configured in a circular ring or disk shape, corresponding to the shape of the axial end of the stator 4, when viewed axially. The circular ring or disk shape of the busbar substrate assembly 1 can be a single unit or divided into multiple components (units) in the circumferential direction. In this embodiment, a single component (busbar substrate assembly 1) is illustrated, where the circular ring shape is divided into multiple components in the circumferential direction. Therefore, to arrange coils corresponding to all slots 8, the number of busbar substrate assemblies 1 divided into the required number is arranged circumferentially. The number of divisions can be appropriately selected based on the size of the stator 4 and the number of slots 8.

[0097] like Figure 4 As shown in (a), the busbar substrate assembly 1 includes split busbar substrate assemblies 1a, each of which is a circular ring-shaped assembly divided into a plurality of equal sections in the circumferential direction when viewed from above. When the plurality of split busbar substrate assemblies 1a are not distinguished, they are simply referred to as "busbar substrate assembly 1" for the purposes of this description. Each split busbar substrate assembly 1a is provided corresponding to 16 slots 8.

[0098] like Figure 4 As shown in (b), the busbar substrate assembly 1 (split busbar substrate assembly 1a) is constructed by stacking a plurality of busbar substrates 10 each having a plurality of busbars 30. Here, a first through fourth busbar resin substrates 10A, 10D are stacked in order from the stator 4 side. Unless otherwise specified, the first through fourth busbar resin substrates 10A, 10D are collectively referred to as "busbar substrates 10."

[0099] The busbar substrate device 1 has a plurality of through holes 70 extending in the thickness direction. Figure 5 To explain, in this embodiment, in a certain busbar substrate 10, the through-holes 70 include: engaging holes (the first through-hole group 81, the seventh through-hole group 87), which are provided in the region corresponding to the slot 8 of the portion connecting the busbar 30 and the coil 90; and non-engaging holes (the second through-hole group 82 to the sixth through-hole group 86 and the eighth through-hole group 88), which are provided in the region corresponding to the slot 8 of the portion not connecting the busbar 30 and the coil 90. As engaging holes (the first through-hole group 81, the seventh through-hole group 87), a plurality of (in the) through-hole groups 81 and 87) are provided in accordance with the size of the cross section of each coil 90. Figure 51st through-hole 71 through 4th through-hole 74 are square in shape. As non-joining holes (second through-hole group 82 through 6th through-hole group 86 and eighth through-hole group 88), a common through-hole (fifth through-hole 75) is provided for the four coils 90 arranged in corresponding slots 8. Alternatively, instead of the non-joining holes (second through-hole group 82 through 6th through-hole group 86 and eighth through-hole group 88), through-holes 71 through 4th through-hole 74 may be provided one by one corresponding to each coil 90.

[0100] The coil ends 92 of the coil bodies 91 protruding from the slots 8 are inserted into the through-holes 70. The two predetermined through-holes 70 are connected by a plate-shaped bus bar 30, and the coil ends 92 inserted into the through-holes 70 are connected by the bus bar 30, thereby electrically connecting the coil ends 92 of the two coil bodies 91.

[0101] The coil end portion 92 and the bus bar 30 can be joined together using various joining methods such as joining with a conductive adhesive, joining with solder, and joining with laser welding.

[0102] <Busbar substrate 10> Here, a specific description will be given focusing on one busbar substrate 10 .

[0103] exist Figure 5 A plan view of the busbar substrate 10 is shown in FIG. Figure 6 Shown in Figure 5 A1-A1 cross-sectional view. Figure 7 Shown in Figure 5 An enlarged view of area B. Figure 8 Shown in Figure 7 The through-holes 70 (the second through-hole 72 and the fourth through-hole 74) are shown in FIG. Figure 9 Shown in Figure 7 A3-A3 cross-sectional view. Figure 10 Shown in Figure 8 A4-A4 cross-sectional view.

[0104] The busbar substrate assembly 1 (i.e., a divided busbar substrate assembly 1a) can be understood as follows: in a plan view, each group of eight circumferentially adjacent slots 8 is divided into a plurality (here, two) of first and second group regions 111 and 112. For ease of understanding, the boundary between the first and second group regions 111 and 112 is indicated by a dotted line 121.

[0105] Through-holes 70 and busbars 30 (first planar busbars 31 and second planar busbars 32) are similarly provided in each of the first group region 111 and the second group region 112. The following description of through-holes 70 and busbars 30 will primarily focus on the structure in the first group region 111 as a representative example.

[0106] The busbar substrate 10 includes a resin substrate 11, a plurality of busbars 30, and a plurality of through-holes 70. The busbars 30 include a first planar busbar 31 and a second planar busbar 32. While a configuration with two busbars 30 (the first planar busbar 31 and the second planar busbar 32) is illustrated here, the configuration is not limited thereto and can be appropriately set based on, for example, the number of busbar substrate device 1 segments and the number of coil bodies 91 arranged in slots 8. Furthermore, the shape and the through-holes 70 to be connected vary depending on the position at which the busbar substrates 10 are stacked, that is, depending on which coil bodies 91 are to be joined.

[0107] <Resin substrate 11> The resin substrate 11 is a plate-shaped structure composed of a cured product of a resin composition.

[0108] As the resin composition of the resin substrate 11 , the same material as that of the sealing layer 60 described above can be used, and the resin composition preferably contains an epoxy resin or a phenol resin.

[0109] The coefficient of linear expansion of the resin substrate 11 at temperatures below the glass transition temperature is 50 ppm / K or less. The coefficient of linear expansion is preferably 40 ppm / K or less, and more preferably 30 ppm / K or less. By setting the linear expansion coefficient in this manner, the difference in linear expansion coefficient with the busbar 30 can be minimized, and changes in the bonding state between the resin substrate 11 and the busbar 30 (such as a reduction in bonding strength or separation) caused by thermal effects can be suppressed. As a result, even when multiple busbar substrates 10 are stacked, degradation of the stacked state (for example, the formation of gaps between the busbar substrates 10) caused by changes in the bonding state between the resin substrate 11 and the busbar 30 can be suppressed.

[0110] The thickness of the resin substrate 11 can be, for example, 3 mm. From the perspective of reducing the height of the busbar substrate assembly 1 obtained by stacking the resin substrates 11, the resin substrate 11 is preferably as thin as possible. However, considering the thickness of the busbars 30 (first planar busbar 31 and second planar busbar 32) mounted on the resin substrate 11, the thickness can be, for example, not less than 0.5 mm and not more than 4 mm.

[0111] <First Plane Busbar Arrangement Portion 14, Second Plane Busbar Arrangement Portion 15> The resin substrate 11 includes a first planar busbar arrangement portion 14 and a second planar busbar arrangement portion 15 .

[0112] The first planar busbar arrangement portion 14 is formed in a concave shape of a predetermined depth on one surface (here, the upper surface 12) of the resin substrate 11 and is capable of accommodating the first planar busbar 31. The second planar busbar arrangement portion 15 is formed in a concave shape of a predetermined depth on one surface (here, the upper surface 12) of the resin substrate 11 and is capable of accommodating the second planar busbar 32.

[0113] The depth of the first plane busbar configuration portion 14 and the second plane busbar configuration portion 15 can be set in accordance with the thickness of the busbar 30, more specifically, set to the same thickness. When the first plane busbar 31 and the second plane busbar 32 are respectively arranged in the first plane busbar configuration portion 14 and the second plane busbar configuration portion 15 on the resin substrate 11, the upper surface 12 of the resin substrate 11 becomes the same plane. Moreover, the first plane busbar 31 and the second plane busbar 32 do not extend in the outer shape direction (i.e., the horizontal direction) of the resin substrate 11. That is, the first plane busbar configuration portion 14 and the second plane busbar configuration portion 15 become shapes that can accommodate the outer shapes of the first plane busbar 31 and the second plane busbar 32, respectively. Therefore, as shown from Figure 5 As can be seen, the outer peripheral line 33 (outer shape) of the bus bar 30 disposed on the outermost side does not protrude from the outer peripheral line 16 (outer shape) of the resin substrate 11 in a plan view.

[0114] <Through hole 70> Here, for convenience, a group of through holes 70 through which the coil ends 92 of the coil bodies 91 housed in the same slot 8 are inserted is referred to as a through hole group. Figure 5 In one group region (each of the first group region 111 and the second group region 112 ), the first through-hole group 81 to the eighth through-hole group 88 are provided in order from the left.

[0115] Each of the first through-hole group 81 and the seventh through-hole group 87 has four through-holes 70 arranged from the center outward, namely, the first through-hole 71 to the fourth through-hole 74. Each of the first through-hole 71 to the fourth through-hole 74 is formed into a substantially square shape corresponding to the cross-sectional shape of the coil end 92 inserted therethrough. Here, the coil end 92 inserted into the second through-hole 72 of the first through-hole group 81 and the coil end 92 inserted into the second through-hole 72 of the seventh through-hole group 87 are connected by the first planar busbar 31. The coil end 92 inserted into the fourth through-hole 74 of the first through-hole group 81 and the coil end 92 inserted into the fourth through-hole 74 of the seventh through-hole group 87 are connected by the second planar busbar 32.

[0116] On the other hand, the coil ends 92 inserted through the second through-hole group 82 to the sixth through-hole group 86 and the eighth through-hole group 88 are not connected to the busbar 30. Therefore, in this embodiment, a common through-hole (fifth through-hole 75) is provided in each of the second through-hole group 82 to the sixth through-hole group 86 and the eighth through-hole group 88. This common through-hole (fifth through-hole 75) is formed into a rectangular shape slightly larger than the shape connecting the first through-hole 71 to the fourth through-hole 74. In the following description, the first through-hole 71 to the fifth through-hole 75 are not distinguished and are referred to as "through-hole 70."

[0117] From the viewpoint of joining the coil end portions 92 to each other, the through-hole 70 penetrates both the resin substrate 11 and the bus bar 30 in the region where the bus bar 30 is provided.

[0118] Specifically, the through-hole 70 is a structure in which the substrate-side through-hole 40 provided on the resin substrate 11 and the busbar-side through-hole 50 provided on the busbar 30 overlap in the vertical direction. In addition, the substrate-side through-hole 40 and the busbar-side through-hole 50 do not need to constitute a completely closed hole when viewed from above. It is sufficient as long as the through-hole 70, when viewed as a whole, is constituted as a through hole so that the coil end 92 can be appropriately inserted. In the area where the busbar 30 is provided, the substrate-side through-hole 40 provided in each busbar configuration portion is provided in a manner consistent with the busbar-side through-hole 50 provided in the busbar configuration portion. In the area without the busbar 30, there are only the substrate-side through-hole 40. Here, the second through-hole 72 and the fourth through-hole 74 have both the substrate-side through-hole 40 and the busbar-side through-hole 50.

[0119] The through-holes 70 (here, the first through-hole 71 to the fourth through-hole 74) connected by the busbar 30 are sized so that the outer shape of the coil end 92 abuts the inner wall surface of the through-hole 70. In practice, to ensure smooth insertion of the coil end 92 into the through-hole 70, it is preferable to make the through-hole 70 slightly larger than the outer shape of the coil end 92. This allows the coil body 91 to be accurately positioned within the slot 8. Furthermore, the shape and size of the through-hole 70 can be adjusted to provide the required clearance depending on the connection method between the busbar 30 and the coil end 92. Furthermore, the positioning function provided by the through-hole 70 can be achieved by a single through-hole 70 in the busbar substrate 10 or by multiple through-holes 70 stacked together. Furthermore, when positioning is performed using the through-hole 70 in a single busbar substrate 10, the busbar substrate 10 used for positioning the coil body 91 can be different.

[0120] Busbar 30 The busbars 30 are formed of a plate-shaped conductive metal, and as described above, include the first planar busbar 31 and the second planar busbar 32. The conductive metal is not particularly limited, but copper, aluminum, and alloys thereof can be preferably used.

[0121] The thickness of the busbars 30 (the first and second planar busbars 31 and 32) can be set according to the specifications of the motor 100, for example, from 0.3 mm to 3.0 mm. As long as the motor 100 achieves the desired performance, the thickness of the first and second planar busbars 31 and 32 can be the same or different. Furthermore, the thickness of the busbars 30 can vary between different busbar substrates 10.

[0122] exist Figure 5 In the illustrated busbar substrate 10, the first planar busbar 31 is provided to connect the second through-hole 72 of the first through-hole group 81 with the second through-hole 72 of the seventh through-hole group 87. Here, the first planar busbar 31 includes an arcuate portion 31a and leg portions 31b extending from both ends of the arcuate portion toward the second through-hole 72. The second through-hole 72 is formed at the tip of the leg portion 31b.

[0123] The second planar busbar 32 is provided to connect the fourth through-hole 74 of the first through-hole group 81 with the fourth through-hole 74 of the seventh through-hole group 87. The second planar busbar 32 includes an arcuate portion 32a and leg portions 32b extending from both ends of the arcuate portion toward the fourth through-hole 74. The fourth through-hole 74 is formed at the distal end of the leg portion 32b.

[0124] The first planar bus bar 31 and the second planar bus bar 32 are not joined together, and are provided separately from the through-hole 70 that is not related to the connection with the coil end portion 92 .

[0125] <Coil joint structure> Figure 11 These are diagrams for explaining the joining structure between the coil end portion 92 of the coil 90 and the bus bar 30 (first plane bus bar 31 ). Here, three examples of the joining structure will be explained.

[0126] exist Figure 11 In the joint structure of (a), an example is shown in which the coil body 91 and the coil end 92 are configured as a straight line. In the busbar-side through-hole 50 of the busbar 30, the surface facing the coil end 92 becomes the busbar joint surface 30a. The surface of the coil end 92 facing the busbar-side through-hole 50 (more specifically, the surface facing the busbar joint surface 30a) becomes the coil joint surface 92a. In this case, the coil joint surface 92a and the busbar joint surface 30a are configured with a vertical cross-section. When they are in contact, they can be joined by a joining method such as joining with a conductive adhesive, joining with solder, or joining with laser welding.

[0127] exist Figure 11 In the joining structure of (b), a protrusion 93 is provided on the surface of the coil end 92 facing the busbar 30, which protrudes toward the busbar 30 in a hook-like shape. The lower surface 95 of the protrusion 93 is placed near the substrate-side through-hole 40 of the first-plane busbar arrangement portion 14. The surface of the protrusion 93 on the busbar 30 side becomes a coil joining surface 92a formed into an inverted tapered surface (referred to as an "inverted tapered surface 94") with a predetermined inclination angle. Furthermore, in the busbar 30, the wall surface of the busbar-side through-hole 50 on the coil end 92 side becomes the busbar joining surface 30b. The busbar joining surface 30b is formed into a cone with an inclination angle corresponding to the coil joining surface 92a as the inverted tapered surface 94. With the lower surface 95 of the protrusion 93 positioned near the substrate-side through-hole 40 of the first planar busbar arrangement portion 14 and the coil-joining surface 92a in contact with the busbar-joining surface 30b, bonding can be achieved using a bonding method such as bonding with a conductive adhesive, soldering, or laser welding. This bonding structure prevents the coil-joining surface 92a and the busbar-joining surface 30b from deviating during the bonding process, enabling stable bonding.

[0128] Figure 11 The bonding structure of (c) is Figure 11 In a modification of the joint structure of (b), a wall surface 17 is formed on the substrate-side through-hole 40 side of the first plane busbar arrangement portion 14 to separate the substrate-side through-hole 40 from the first plane busbar arrangement portion 14. The side surface of the busbar 30 on the coil end portion 92 side is formed in a stepped shape, and the stepped surface 30c is provided flush with the wall surface 17. Furthermore, the surface extending upward from the stepped surface 30c becomes the busbar joint surface 30b, which is aligned with the first plane busbar arrangement portion 14. Figure 11 The joint structure of (b) is similarly formed into a cone. Furthermore, the surface of the protrusion 93 on the busbar 30 side becomes an inverted tapered surface 94. Furthermore, the lower surface 95 of the protrusion 93 is placed on the wall surface 17 and the step surface 30c. The joint between the coil end 92 and the busbar 30 is formed by a first joint between the inverted tapered surface 94 and the busbar joint surface 30b and a second joint between the front end side of the lower surface 95 of the protrusion 93 and the step surface 30c. Thus, a joint with Figure 11 The same effect as the joining structure of (b) can be achieved, and the joining strength can be enhanced by the joining of the second joining portion.

[0129] <Method for Manufacturing Stator 4> A manufacturing method for providing the coil 9 in the stator 4 of this embodiment will be described. Figure 12 1 is a flowchart showing the manufacturing process of the stator 4 . Figure 13 This diagram schematically shows the manufacturing process of the stator 4 , focusing on the joining of the coils 9 using the busbar substrate 10 .

[0130] Preparation step S11: First, prepare the stator 4, which is composed of multiple electromagnetic steel sheets stacked and tightly fixed in the axial direction; four coil bodies 91a to 91d formed into a straight line of a predetermined length; and multiple busbar substrates 10 (first to fourth planar busbar resin substrates 10A to 10D). Each busbar substrate 10 is provided with a busbar 30 corresponding to the stacking position, that is, corresponding to the coil bodies 91a to 91d (coil ends 92) to be connected. The length of the coil bodies 91a to 91d is preferably set so that they do not substantially protrude from the busbar 30 to which they are connected.

[0131] Reference substrate placement step S12: Then, if Figure 13 (a) and Figure 13 As shown in FIG. 2( b ), the busbar substrate 10 (ie, the first planar busbar resin substrate 10A) is disposed at each of the two ends 4 a and 4 b of the stator 4 , and is provided closest to the stator 4 .

[0132] Coil insertion step S13: Then, if Figure 13 As shown in (c), four coil bodies 91a to 91d are arranged in slot 8 so that the coil ends 92 are inserted into the through-holes 70 provided in the first plane busbar resin substrate 10A. The second lower coil end 92 from the left (the lower end of coil body 91b) is arranged so that it is aligned with the lower side of the lower first plane busbar resin substrate 10A and does not protrude from the through-hole 70. Furthermore, the fourth upper coil end 92 from the left (the upper end of coil body 91d) is arranged so that it is aligned with the upper side of the upper first plane busbar resin substrate 10A and does not protrude from the through-hole 70. At this time, the coil ends 92 at both ends of the coil bodies 91a to 91d are inserted into the through-holes 70 of the first plane busbar resin substrate 10A, so the positions of the coil bodies 91a to 91d within the slot 8 are determined with high precision.

[0133] Busbar / coil bonding process S14: When the first plane busbar resin substrate 10A is configured, the coil ends 92 of the coil bodies 91b and 91d joined to the busbars 30 of the first plane busbar resin substrate 10A are joined using an adhesive or welding. Here, the second lower coil end 92 from the left is joined to the busbar 30 of the first plane busbar resin substrate 10A on the lower side, and the fourth upper coil end 92 from the left is joined to the busbar 30 of the first plane busbar resin substrate 10A on the upper side. The coil body 91d joined to the busbar 30 of the first plane busbar resin substrate 10A on the upper side shown in the figure, and the coil body 91b joined to the first plane busbar resin substrate 10A on the lower side, are positioned vertically by the joining of the coil bodies 91d and 91b to the busbars 30. Meanwhile, the coil bodies 91a and 91c, which are not bonded to the busbars 30 of the upper and lower first-plane busbar resin substrates 10A, are fixed in position in the direction of penetration of the through-hole 70 (vertical direction in the figure) by a predetermined jig. However, if no jig is used, it is conceivable that the positions of the coil bodies 91a and 91c may become uncertain, and the position of the coil bodies 91a and 91c may shift depending on the posture of the stator 4. Therefore, for example, a temporary positioning structure, such as a small protrusion made of resin material, may be provided on the side of the coil end 92 of these coil bodies 91a and 91c, just at the boundary where they protrude from the first-plane busbar resin substrate 10A, allowing for easy attachment and detachment.

[0134] Busbar substrate configuration step S15: After the coil bodies 91b and 91d (coil ends 92) are joined using the first plane busbar resin substrate 10A, the second plane busbar resin substrate 10B is stacked on the first plane busbar resin substrate 10A. At this time, the coil ends 92 of the coil bodies 91a and 91c other than the coil bodies 91b and 91d joined by the first plane busbar resin substrate 10A are inserted into the through-holes 70 of the second plane busbar resin substrate 10B. Figure 13 In the example, in the second plane busbar resin substrate 10B on the lower side, the area corresponding to the coil end 92 on the lower side of the coil body 91b joined by the first plane busbar resin substrate 10A is sealed without a through hole 70. Similarly, in the second plane busbar resin substrate 10B on the upper side, the area corresponding to the coil end 92 on the upper side of the coil body 91d joined by the first plane busbar resin substrate 10A is sealed without a through hole 70. In subsequent processing, in the second plane busbar resin substrate 10B to the fourth plane busbar resin substrate 10D to be configured next, the through hole 70 is not provided in the area where the coil end 92 is joined to the busbar 30.

[0135] Then, if Figure 13As shown in (d), the busbar 30 of the second plane busbar resin substrate 10B is joined to the coil end 92 (the lower end and the upper end of the coil body 91a) (S14), and the third plane busbar resin substrate 10C is arranged (S15), the busbar 30 of the third plane busbar resin substrate 10C is joined to the coil end 92 (the lower end of the coil body 91c and the upper end of the coil body 91b) (S14), the fourth plane busbar resin substrate 10D is arranged (S15), and the busbar 30 of the fourth plane busbar resin substrate 10D is joined to the coil end 92 (the lower end of the coil body 91d and the upper end of the coil body 91c) (S14), as shown in FIG. Figure 13 As shown in (e), when all the busbar substrates 10 (here, the first to fourth planar busbar resin substrates 10A to 10D) are joined to the coil end portions 92 , the arrangement of the coils 9 in the slots 8 by the busbar substrate device 1 is completed.

[0136] Sealing process S16: Finally, the groove 8 is filled with a sealing resin to form a sealing layer 60 .

[0137] In the above-described manufacturing method, the same steps are performed at both ends 4a and 4b of the stator 4. However, this is not limiting. For example, at one end 4a, the process may be continued until the busbar substrate placement step S15, where the coil end 92 is joined to the busbar 30 and a predetermined number of busbar substrates 10 are stacked. At the other end 4b, the coil end 92 is joined to the busbar 30, a predetermined number of busbar substrates 10 are stacked, and then the sealing step S16 is performed.

[0138] Furthermore, the coil end portion 92 and the bus bar 30 are joined together each time a bus bar substrate 10 is arranged in the above-described manufacturing process. However, the joining may be performed collectively after a plurality of bus bar substrates 10 are stacked.

[0139] The present embodiment described above is summarized as follows.

[0140] 1. A busbar substrate 10 comprising a resin substrate 11 (insulating substrate) and a busbar 30 made of a conductive metal, wherein: The busbar 30 includes a planar busbar conductive portion (herein, a first planar busbar 31 and a second planar busbar 32 ) formed in a plate shape on one surface (herein, the upper surface 12 ) of the resin substrate 11 . On the surface (upper surface 12 ) of the resin substrate 11 where the plane busbar conductive portions (first plane busbars 31 and second plane busbars 32 ) are provided, the plane busbar conductive portions (first plane busbars 31 and second plane busbars 32 ) are flush with the resin substrate 11 .

[0141] This reduces the space required for joining the coil end 92, particularly in the height direction, and enables a lower profile for the motor 100. Since the planar busbar conductive portions (first planar busbar 31 and second planar busbar 32) are flush with the resin substrate 11, a stable stacked structure can be achieved even when multiple busbar substrates 10 are stacked.

[0142] 2. The busbar substrate 10 according to 1., wherein the busbars 30 do not protrude from the outer shape (outer contour in plan view) of the resin substrate 11.

[0143] Since the busbars 30 do not protrude outward (laterally) from the outer shape of the resin substrate 11 , they do not extend outward beyond the outer shape of the stator 4 , thereby suppressing an increase in size of the motor 100 .

[0144] 3. The busbar substrate 10 according to 1. or 2., wherein the resin substrate 11 is formed from a cured product of a resin composition, and the cured product has a linear expansion coefficient of 50 ppm / K or less at a temperature below the glass transition temperature.

[0145] Thus, even when heat associated with motor driving acts, deformation does not occur in the arrangement of the resin substrate 11 and the bus bar 30 , and the stacked state of the bus bar substrate 10 can be maintained satisfactorily.

[0146] 4. The busbar substrate 10 according to any one of 1. to 3., wherein the resin substrate 11 is formed of a cured product of a resin composition, wherein the resin composition includes an epoxy resin or a phenolic resin.

[0147] 5. The busbar substrate 10 according to any one of 1. to 4. further comprising a through hole 70 (substrate-side through hole 40 and busbar-side through hole 50) penetrating both the resin substrate 11 and the planar busbar conductive portion (first planar busbar 31 and second planar busbar 32).

[0148] 6. The busbar substrate 10 according to 5. is characterized in that the through-holes 70 (substrate-side through-holes 40 and busbar-side through-holes 50) function as positioning mechanisms for the vertical coil wires in the slots.

[0149] Since the coil end portion 92 is inserted into the through-hole 70 , the position of the coil body 91 in the slot 8 can be controlled with high accuracy.

[0150] 7. The busbar substrate 10 according to any one of 1. to 6., wherein the resin substrate 11 is formed of a cured product of a resin composition, and the thermal conductivity of the cured product is 0.5 W / (m·K) or greater.

[0151] By using the resin substrate 11 of the busbar substrate 10 as a highly thermally conductive member, high heat dissipation can be achieved also from the coil end portion 92 .

[0152] 8. A busbar substrate device 1, characterized in that it is formed by stacking a plurality of busbar substrates 10 according to any one of 1. to 7.

[0153] 9. The busbar substrate device 1 according to 8. is characterized in that: The busbar substrate device 1 is installed at at least one axial end of the stator 4. The busbar 30 constitutes a portion of the coil 9 arranged across the slots 8 of the stator 4 .

[0154] 10. The busbar substrate device 1 according to 9. is characterized in that: The coil 9 is a flat wire. The flat wire has a vertical coil wire (coil body 91 ) that can be placed in the slot 8 . The end portion (coil end portion 92 ) of the vertical coil wire (coil main body 91 ) extending from the slot 8 is electrically connected to the bus bar 30 .

[0155] 11. The busbar substrate device 1 according to 10. is characterized by having a through-hole 70 through which the end portion (coil end portion 92) of the vertical coil wire (coil body 91) can be inserted and which guides the end portion (coil end portion 92) of the vertical coil wire (coil body 91) so as to be connected to the busbar 30.

[0156] 12. A stator 4 used in a motor 100, characterized in that: The busbar substrate device 1 described in any one of 8. to 11. is provided at at least one axial end portion of the stator 4.

[0157] 13. The stator 4 according to 12. is characterized in that: The stator 4 is in a circular ring shape when viewed from the axial end. The busbar substrate device 1 is configured as a single annular element or a collective element in which a plurality of elements are arranged in an annular shape in the circumferential direction when viewed from an end portion in the axial direction.

[0158] 14. The stator 4 according to 12. or 13., wherein the vertical coil wire (coil body 91) is a bare wire not covered with an insulating member.

[0159] 15. A method for manufacturing a stator 4 having a coil wire (coil 9) disposed between slots 8, the method for manufacturing the stator 4 comprising: A preparation step of preparing a busbar substrate 10 including a resin substrate 11 (insulating substrate), a busbar 30 made of a conductive metal, and a through hole 70 penetrating both the resin substrate 11 and the busbar 30 ; a busbar substrate arranging step of arranging the busbar substrate 10 at the axial ends ( 4 a , 4 b ) of the stator 4 ; and The busbar / coil connection step is to arrange the vertical coil wire (coil body 91) constituting the coil wire (coil 9) in the slot 8 of the stator 4, insert the vertical coil wire (coil body 91) into the through hole 70 of the busbar substrate 10, and electrically connect the busbar 30 and the vertical coil wire (coil end 92 of the coil body 91).

[0160] 16. The method for manufacturing a stator 4 according to 15. is characterized in that in the busbar substrate arranging step, a plurality of busbar substrates 10 are sequentially stacked and arranged at one axial end (ends 4a, 4b) of the stator 4.

[0161] 17. The method for manufacturing a stator 4 according to 15. or 16. further comprises a slot sealing step of injecting a sealing material into the slot 8 (i.e., forming a sealing layer 60) after the busbar / coil connection step is performed at at least one axial end of the stator 4 (at least one of the ends 4a, 4b).

[0162] 18. The method for manufacturing a stator 4 according to any one of 15. to 17., wherein the sealing material (ie, the sealing layer 60) contains an epoxy resin or a phenolic resin as the resin composition.

[0163] 19. The method for manufacturing a stator 4 according to 18. is characterized in that the resin substrate 11 is composed of a cured product of a resin composition, and the resin composition of the resin substrate 11 is the same as the resin composition of the sealing material (sealing layer 60).

[0164] 20. The method for manufacturing a stator 4 according to any one of 15. to 19., characterized in that in the busbar / coil connecting step, the vertical coil wire (coil end 92 of coil body 91) is electrically connected to the busbar 30 using at least one bonding method selected from the group consisting of laser welding, solder bonding, and bonding using a conductive adhesive.

[0165] 21. The method for manufacturing a stator 4 according to any one of 15. to 20., characterized in that in the busbar / coil connection step, the vertical coil wire (coil body 91) is positioned within the slot 8 by inserting the vertical coil wire (coil body 91) through the through-hole 70.

[0166] 22. The method for manufacturing a stator 4 according to any one of 15. to 21., wherein the vertical coil wire (coil body 91) is a bare wire not covered with an insulating member.

[0167] While the embodiments of the present invention have been described above, these are merely examples of the present invention, and various configurations other than those described above can be employed.

[0168] This application claims priority based on Japanese Patent Application No. 2023-030930, filed on March 1, 2023, and Japanese Patent Application No. 2023-030932, filed on March 1, 2023, and incorporates herein in its entirety the disclosures of these patent applications.

[0169] Description of Reference Numerals 1 Busbar substrate assembly, 2 Rotor, 4 Stator, 5 Permanent magnet, 6 Yoke, 7 Teeth, 8 Slots, 9 Coil, 10 Busbar substrate, 10A to 10D 1st to 4th busbar resin substrates, 11 Resin substrate, 14 1st busbar arrangement portion, 15 2nd busbar arrangement portion, 30 Busbar, 31 1st busbar, 32 2nd busbar, 40 Substrate-side through-hole, 50 Busbar-side through-hole, 60 Sealing layer, 70 Through-hole, 71 to 75 1st to 5th through-holes, 81 to 88 1st to 8th through-hole group, 91 Coil body, 92 Coil end, 100 Motor.

Claims

1. A busbar substrate comprising an insulating substrate and a busbar made of a conductive metal, wherein: The busbar has a planar busbar conductive portion formed in a plate shape on one surface of the insulating substrate. On the surface of the insulating substrate where the planar busbar conductive portion is provided, the planar busbar conductive portion is flush with the insulating substrate.

2. The busbar substrate according to claim 1, wherein: The busbar does not protrude from the outer shape of the insulating substrate.

3. The busbar substrate according to claim 1 or 2, wherein: The insulating substrate is composed of a cured product of a resin composition, and the cured product has a linear expansion coefficient of 50 ppm / K or less at a temperature below the glass transition temperature.

4. The busbar substrate according to claim 1 or 2, wherein: The insulating substrate is composed of a cured product of a resin composition, and the resin composition includes an epoxy resin or a phenolic resin.

5. The busbar substrate according to claim 1 or 2, wherein: A through hole is provided which penetrates both the insulating substrate and the planar busbar conductive portion.

6. The busbar substrate according to claim 5, wherein: The through-hole functions as a positioning mechanism for the flat wire arranged in the groove.

7. The busbar substrate according to claim 1 or 2, characterized in that: The insulating substrate is composed of a cured product of a resin composition, and the thermal conductivity of the cured product is 0.5 W / (m·K) or more.

8. A busbar substrate device, characterized in that: The busbar substrate according to claim 1 or 2 is formed by laminating a plurality of busbar substrates.

9. The busbar substrate device according to claim 8, wherein: The busbar substrate device is mounted on at least one axial end portion of the stator of the motor. The busbar constitutes a portion of a coil winding arranged across slots of the stator.

10. The busbar substrate device according to claim 9, wherein: The coil winding is a flat wire, The flat wire has a vertical coil wire that can be placed in the slot, Ends of the vertical coil wires extending from the slots are electrically connected to the busbars.

11. The busbar substrate device according to claim 9, wherein: The through hole is provided so as to allow the end of the vertical coil wire to be inserted therethrough and guide the end of the vertical coil wire so as to be connected to the bus bar.

12. A stator used in a motor, characterized in that: The busbar substrate device according to claim 8 is provided at at least one axial end portion of the stator.

13. The stator according to claim 12, characterized in that: The stator is annular in shape when viewed from the axial end. The busbar substrate device is configured as a single annular element or a collective element in which a plurality of elements are arranged in an annular shape in the circumferential direction when viewed from an end portion in the axial direction.

14. The stator according to claim 12, characterized in that: The vertical coil wire is a bare wire not covered with an insulating member.

15. A method for manufacturing a stator, the stator having coil wires arranged between slots, the method comprising: a preparation step of preparing a busbar substrate including an insulating substrate, a busbar made of a conductive metal, and a through hole penetrating both the insulating substrate and the busbar; a busbar substrate disposing step of arranging the busbar substrate at an axial end portion of the stator; and The busbar / coil connecting step includes placing a vertical coil wire constituting the coil wire in a slot of the stator, inserting the vertical coil wire into the through hole of the busbar substrate, and electrically connecting the busbar and the vertical coil wire.

16. The method for manufacturing a stator according to claim 15, characterized in that: In the bus bar substrate arrangement step, a plurality of the bus bar substrates are stacked one by one at one end in the axial direction of the stator.

17. The method for manufacturing a stator according to claim 15 or 16, characterized in that: Also features: The slot sealing step is to inject a sealing material into the slot after the busbar / coil connecting step is performed at least at one axial end of the stator.

18. The method for manufacturing a stator according to claim 17, wherein: The sealing material includes epoxy resin or phenolic resin as a resin composition.

19. The method for manufacturing a stator according to claim 18, wherein: The insulating substrate is composed of a cured product of a resin composition, and the resin composition of the insulating substrate is the same as the resin composition of the sealing material.

20. The method for manufacturing a stator according to claim 15 or 16, characterized in that: In the busbar / coil connection step, the vertical coil wire and the busbar are electrically connected using at least one bonding method selected from the group consisting of bonding by laser welding, bonding with solder, and bonding with a conductive adhesive.

21. The method for manufacturing a stator according to claim 15 or 16, characterized in that: In the busbar / coil connection step, the vertical coil wire is positioned in the slot by inserting the vertical coil wire into the through hole.

22. The method for manufacturing a stator according to claim 15 or 16, characterized in that: The vertical coil wire is a bare wire not covered by an insulating member.

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