A resin composition, a resin adhesive and a preparation method and application thereof

Abstract

This invention relates to the field of membrane module encapsulation technology, and more particularly to a resin composition, a resin adhesive, its preparation method, and its application. This invention involves mixing component A and component B of the resin adhesive in a specific ratio, and then using this mixture for encapsulating hollow fiber membrane modules. The resulting hollow fiber membrane module has excellent airtightness and pressure resistance at the sealed end, making it suitable for applications in hollow fiber membranes such as gas separation, nanofiltration, water treatment, and reverse osmosis.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of membrane module packaging, in particular to a resin composition, a resin glue and a preparation method and application thereof. BACKGROUND

[0002] Hollow fiber membrane technology is one of the common key technologies to solve the global water resource and energy crisis, environmental pollution and other major problems, and is also an important technical support for high-quality development in energy saving and emission reduction, clean production, system efficiency and product quality improvement. In water treatment applications, hollow fiber membranes are widely used in water treatment, including upgrading and reconstruction of waterworks, upgrading and reconstruction of sewage treatment plants, and providing effective technical means for wastewater resource utilization and ensuring drinking water safety. With the continuous decline of membrane material cost and the improvement of process stability, hollow fiber membranes are increasingly used in ultrafiltration water plants and membrane bioreactor technology. In petroleum and chemical applications, hollow fiber membrane technology has been widely used, such as petroleum refining, oilfield produced water and petrochemical wastewater treatment, petrochemical product and derivative production, pervaporation separation, and high-purity gas preparation. In biological and pharmaceutical applications, hollow fiber membranes are widely used in artificial kidneys (hemodialysis), artificial lungs (oxygenation membranes), blood component separation, Chinese and Western medicine separation and purification, and other biological and pharmaceutical fields. In addition, hollow fiber membranes also have broad application prospects in food and beverage applications, environmental protection and resource recycling, and new energy industries.

[0003] The use of hollow fiber membrane modules requires the use of glue to package the hollow fiber membranes in metal, plastic and other housings. The glue not only needs good flowability, but also cannot damage the membrane. In addition, it also needs to maintain good air tightness and pressure resistance after packaging.

[0004] However, the existing glue formula and packaging process are only suitable for the packaging of small component hollow fiber membranes. For membrane modules with a diameter greater than 30 cm, there are still problems such as low yield, poor air tightness and burning of the membrane, which limits large-scale development.

[0005] Therefore, the present application is proposed. SUMMARY

[0006] In order to solve the above-mentioned problems in the prior art, the present application provides a resin composition, a resin glue and a preparation method and application thereof, which can not only consider the corrosion resistance and thermal conductivity of the material, but also enhance the hydrophilicity and high and low temperature impact resistance of the material.

[0007] Based on this, the present application has the following technical solutions:

[0008] In a first aspect, the present application provides a resin composition composed of component A and component B.

[0009] The A component comprises resin X1, resin X2 and diluent Z;

[0010] The B component comprises curing agent M and coupling agent N;

[0011] The diluent Z is composed of active diluent Z1 and non-active diluent Z2; the curing agent M is composed of curing agent M1, curing agent M2 and curing agent M3;

[0012] The resin X1 is selected from one or more of bisphenol A epoxy resin, diaminodiphenylmethane tetraglycidyl amine, diglycidyl p-aminophenol; the resin X2 is selected from one or more of bisphenol F epoxy resin, aliphatic glycidyl ether epoxy resin, aliphatic glycidyl ether epoxy resin; the curing agent M1 is selected from one or more of polyether amine, 2-methylpentanediamine, 1,2-cyclohexanediamine, thiourea modified m-phenylenediamine and hexanediamine, polyetherdiamine; the curing agent M2 is selected from one or more of 4,4'-diaminodiphenylmethane, 3,3'-diethyl-4,4'-diaminodiphenylmethane, diethyltoluenediamine; the curing agent M3 is selected from one or more of 4,4'-diaminodicyclohexylmethane, 3,3'-diaminodiphenylmethane; in the A component, the mass ratio of the resin X1 and the resin X2 is (70~80):(10~15).

[0013] The present application finds that by optimizing the resin and the curing agent, and controlling the content of resin X1 and resin X2, the glue can have suitable viscosity and better hardness after curing.

[0014] In the present application, in the A component, the content of the resin X1 can be any value in 70wt%, 71wt%, 72wt%, 73wt%, 74wt%, 75wt%, 76wt%, 77wt%, 78wt%, 79wt% and 80wt%, or a value range with any two of the above values as the end points.

[0015] According to the resin composition provided by the present application, in the A component, the content of the resin X1 is 70wt%~80wt%.

[0016] In the present application, in the A component, the content of the resin X2 can be any value in 10wt%, 11wt%, 12wt%, 13wt%, 14wt%, 15wt%, or a value range with any two of the above values as the end points.

[0017] According to the resin composition provided by the present application, the mass ratio of the curing agent M1, the curing agent M2 and the curing agent M3 is (30~35):(40~45):(20~25).

[0018] The present application finds that, through the synergy of the above three curing agents, the temperature of the glue curing process can be controlled.

[0019] In the present application, the content of the curing agent M1 in the A component can be any value in 30wt%, 31wt%, 32wt%, 33wt%, 34wt%, 35wt%, or a value range with any two of the above values as the end points.

[0020] In the present application, the content of the curing agent M2 in the A component can be any value in 40wt%, 41wt%, 42wt%, 43wt%, 44wt%, 45wt%, or a value range with any two of the above values as the end points.

[0021] In the present application, the content of the curing agent M3 in the A component can be any value in 20wt%, 21wt%, 22wt%, 23wt%, 24wt%, 25wt%, or a value range with any two of the above values as the end points.

[0022] According to the resin composition provided by the present application, the active diluent Z1 is selected from one or more of 1,4-butanediol diglycidyl ether, polyethylene glycol diglycidyl ether, and Cadence LITE 513DF.

[0023] According to the resin composition provided by the present application, the non-active diluent Z2 is selected from one or more of diisobutyl ketone, methyl isobutyl ketone, and cyclohexanone.

[0024] More preferably, the mass ratio of the active diluent Z1 to the non-active diluent Z2 is (5-8):(1-3).

[0025] In the present application, the content of the active diluent Z1 in the A component can be any value in 5wt%, 6wt%, 7wt%, 8wt%, or a value range with any two of the above values as the end points.

[0026] In the present application, the content of the non-active diluent Z2 in the A component can be any value in 1wt%, 2wt%, 3wt%, or a value range with any two of the above values as the end points.

[0027] According to the resin composition provided by the present application, the mass ratio of the A component to the B component is (10-15):1.

[0028] In the present application, the mass ratio of the A component to the B component can be any ratio in 10:1, 11:1, 12:1, 13:1, 14:1, 15:1, or a ratio range with any two of the above ratios as the end points.

[0029] According to a resin composition provided by the present invention, component A further contains a toughening agent Y, wherein the toughening agent Y is selected from one or more of styrene-butadiene copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-butene-styrene block copolymer, and styrene-ethylene-propylene-styrene block copolymer.

[0030] More preferably, in component A, the content of toughening agent Y is 2wt%~4wt%.

[0031] In this invention, the content of toughening agent Y in component A can be any value among 2wt%, 3wt%, and 4wt%, or a range of values ​​with any two of the above values ​​as endpoints.

[0032] According to a resin composition provided by the present invention, the coupling agent N is selected from one or more of tris(hydroxymethyl)nitromethane, 1,3,5-tris(hydroxymethyl)benzene, trimethylolpropane, and 1,3,5-trimethylbenzene.

[0033] More preferably, in component B, the content of coupling agent N is 1wt%~2wt%.

[0034] According to the present invention, a resin composition is composed of component A and component B in a mass ratio of (10~15):1;

[0035] Component A comprises the following components in parts by mass:

[0036] Resin X1 70-80 parts,

[0037] Resin X2, 10-15 parts

[0038] Toughening agent Y: 2-4 parts

[0039] Reactive diluent Z1: 5-8 parts

[0040] Inactive diluent Z2: 1 to 3 parts;

[0041] Component B comprises the following components in parts by mass:

[0042] The curing agent M1 is 30 to 35 parts.

[0043] The curing agent M2 is 40 to 45 parts.

[0044] The curing agent M3 is 20 to 25 parts.

[0045] The coupling agent N is 1 to 2 parts.

[0046] Secondly, the present invention provides a resin adhesive, the preparation method of which includes mixing the resin composition at a temperature T1; preferably, the temperature T1 is 15°C to 20°C.

[0047] In this invention, the temperature T1 can be any value among 15℃, 16℃, 17℃, 18℃, 19℃, and 20℃, or a range of values ​​with any two of the above values ​​as endpoints.

[0048] Thirdly, the present invention provides the application of the resin composition or the resin adhesive described herein in the encapsulation of hollow fiber membrane modules; the encapsulation steps include:

[0049] (1) Mix component A and component B at temperature T1 to obtain resin glue;

[0050] (2) The resin is poured into the hollow fiber membrane module to encapsulate the module;

[0051] (3) The encapsulated membrane module is first dried at temperature T2 for t1 hours, and then dried at temperature T3 for t2 hours.

[0052] Preferably, the temperature T2 is 4℃~10℃, and the temperature T3 is 70℃~90℃.

[0053] Preferably, t1 and t2 are each independently, identically, or differently 20 to 40 hours.

[0054] In this invention, the temperature T2 can be any value among 4℃, 5℃, 6℃, 7℃, 8℃, 9℃, and 10℃, or a range of values ​​with any two of the above values ​​as endpoints.

[0055] In this invention, the temperature T3 can be any value among 70℃, 71℃, 72℃, 73℃, 74℃, 75℃, 76℃, 77℃, 78℃, 79℃, 80℃, 81℃, 82℃, 83℃, 84℃, 85℃, 86℃, 87℃, 88℃, 89℃, and 90℃, or a range of values ​​with any two of the above values ​​as endpoints.

[0056] The resin adhesive of this invention is used for encapsulation of hollow fiber membrane modules, which can achieve excellent airtightness and pressure resistance, and has good application prospects in gas separation, nanofiltration, water treatment, reverse osmosis and other fields.

[0057] According to the present invention, the resin composition or the resin adhesive is used in the encapsulation of hollow fiber membrane modules. The resin composition or the resin adhesive is suitable for encapsulating hollow fiber membrane modules with a diameter of 5cm to 60cm, and more preferably, for encapsulating hollow fiber membrane modules with a diameter of 30cm to 60cm.

[0058] Based on this, the technical solution of the present invention has the following beneficial effects:

[0059] This invention mixes components A and B of the resin adhesive in a specific ratio and then uses it for encapsulation of hollow fiber membrane modules. The resulting hollow fiber membrane module has excellent airtightness and pressure resistance at the sealed end, making it suitable for applications in hollow fiber membrane fields such as gas separation, nanofiltration, water treatment, and reverse osmosis. Attached Figure Description

[0060] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0061] Figure 1 This is a physical image of the resin adhesive in Embodiment 1 provided by the present invention.

[0062] Figure 2 This is a cross-sectional view of the hollow fiber membrane module encapsulated in Embodiment 1 of the present invention. Detailed Implementation

[0063] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0064] Unless otherwise specified, all raw materials used in the examples and comparative examples are commercially available conventional raw materials, and the technical means used are conventional means well known to those skilled in the art.

[0065] Example 1

[0066] This embodiment provides a resin composition comprising component A and component B:

[0067] Its component A has the following composition:

[0068] Resin X1 is bisphenol A epoxy resin with a mass percentage of 70%.

[0069] Resin X2 is an aliphatic glycidyl ether epoxy resin with a mass percentage of 15%.

[0070] Toughening agent Y is a styrene-ethylene-propylene-styrene block copolymer with a mass percentage of 4%.

[0071] Reactive diluent Z1 is 1,4-butanediol diglycidyl ether, with a mass percentage of 8%.

[0072] Inactive diluent Z2 is cyclohexanone, with a mass percentage of 3%.

[0073] The composition of its component B is as follows:

[0074] Curing agent M1 is polyether diamine, with a mass percentage of 30%;

[0075] Curing agent M2 is diethyltoluenediamine, with a mass percentage of 45%;

[0076] The curing agent M3 is 3,3'-diaminodiphenylmethane, with a mass percentage of 24%.

[0077] The coupling agent N is 1,3,5-tris(hydroxymethyl)benzene, with a mass percentage of 1%.

[0078] This embodiment also provides a resin adhesive prepared from the above-mentioned resin composition, the preparation method of which includes: mixing component A and component B at a mass ratio of 10, stirring evenly at a temperature of 20°C to obtain the resin adhesive.

[0079] This embodiment also provides an application process for resin adhesive in the encapsulation of hollow fiber membrane modules, the encapsulation including the following steps:

[0080] (1) The obtained resin glue is poured into the hollow fiber membrane module to encapsulate the module;

[0081] (2) The encapsulated membrane module is first dried at 4°C for 40 hours, and then dried at 70°C for 40 hours to finally obtain a fully encapsulated membrane module.

[0082] The photograph of the resin adhesive obtained in this embodiment is shown below. Figure 1 As shown, the cross-section of the hollow fiber membrane module encapsulated using this embodiment is as follows. Figure 2 As shown.

[0083] Example 2

[0084] This embodiment provides a resin composition comprising component A and component B:

[0085] Its component A has the following composition:

[0086] Resin X1 is diglycidyl-p-aminophenol, with a mass percentage of 80%.

[0087] Resin X2 is bisphenol F epoxy resin, with a mass percentage of 10%.

[0088] Toughening agent Y is a styrene-butadiene copolymer with a mass percentage of 2%.

[0089] Reactive diluent Z1 is Cardelli LITE 513DF, with a mass percentage of 5%;

[0090] Inactive diluent Z2 is diisobutyl ketone, with a mass percentage of 3%;

[0091] The composition of its component B is as follows:

[0092] Curing agent M1 is polyetheramine, with a mass percentage of 34%;

[0093] Curing agent M2 is 4,4'-diaminodiphenylmethane, with a mass percentage of 44%;

[0094] Curing agent M3 is 4,4'-diaminodicyclohexylmethane, with a mass percentage of 20%;

[0095] Coupling agent N is tris(hydroxymethyl)nitromethane, with a mass percentage of 2%;

[0096] This embodiment also provides a resin adhesive prepared from the above-mentioned resin composition, the preparation method of which includes: mixing component A and component B at a mass ratio of 15, stirring evenly at a temperature of 15°C to obtain the resin adhesive.

[0097] This embodiment also provides an application process for resin adhesive in the encapsulation of hollow fiber membrane modules, the encapsulation including the following steps:

[0098] (1) The obtained resin glue is poured into the hollow fiber membrane module to encapsulate the module;

[0099] (2) The membrane module after potting and encapsulation is first dried at 10°C for 20 hours, and then dried at 90°C for 20 hours to finally obtain a fully encapsulated membrane module.

[0100] Example 3

[0101] This embodiment provides a resin composition comprising component A and component B:

[0102] Its component A has the following composition:

[0103] Resin X1 is diaminodiphenylmethane tetraglycidylamine, with a mass percentage of 76%;

[0104] Resin X2 is an aliphatic glycidyl ether epoxy resin with a mass percentage of 13%.

[0105] Toughening agent Y is a styrene-isoprene-styrene block copolymer with a mass percentage of 3%.

[0106] Reactive diluent Z1 is polyethylene glycol diglycidyl ether, with a mass percentage of 7%;

[0107] Inactive diluent Z2 is methyl isobutyl ketone, with a mass percentage of 1%.

[0108] The composition of its component B is as follows:

[0109] Curing agent M1 is 2-methylpentanediamine, with a mass percentage of 31%;

[0110] The curing agent M2 is 3,3'-diethyl-4,4'-diaminodiphenylmethane, with a mass percentage of 42.5%.

[0111] Curing agent M3 is 3,3'-diaminodiphenylmethane, with a mass percentage of 25%;

[0112] Coupling agent N is trimethylolpropane, with a mass percentage of 1.5%;

[0113] This embodiment also provides a resin adhesive prepared from the above-mentioned resin composition, the preparation method of which includes: mixing component A and component B at a mass ratio of 13, stirring evenly at 17°C to obtain the resin adhesive.

[0114] This embodiment also provides an application process for resin adhesive in the encapsulation of hollow fiber membrane modules, the encapsulation including the following steps:

[0115] (1) The obtained resin glue is poured into the hollow fiber membrane module to encapsulate the module;

[0116] (2) The membrane module after potting and encapsulation is first dried at 8°C for 30 hours, and then dried at 80°C for 30 hours to finally obtain a fully encapsulated membrane module.

[0117] Example 4

[0118] This embodiment provides a resin composition comprising component A and component B:

[0119] Its component A has the following composition:

[0120] Resin X1 is bisphenol A epoxy resin with a mass percentage of 74%.

[0121] Resin X2 is an aliphatic glycidyl ether epoxy resin with a mass percentage of 12%.

[0122] Toughening agent Y is a styrene-ethylene-butene-styrene block copolymer with a mass percentage of 4%.

[0123] Reactive diluent Z1 is 1,4-butanediol diglycidyl ether, with a mass percentage of 8%.

[0124] Inactive diluent Z2 is diisobutyl ketone, with a mass percentage of 2%;

[0125] The composition of its component B is as follows:

[0126] The curing agent M1 is 1,2-cyclohexanediamine, with a mass percentage of 32%.

[0127] Curing agent M2 is 4,4'-diaminodiphenylmethane, with a mass percentage of 43%;

[0128] The curing agent M3 is 4,4'-diaminodicyclohexylmethane, with a mass percentage of 24%.

[0129] Coupling agent N is 1,3,5-tris(hydroxymethyl)benzene, with a mass percentage of 1%;

[0130] This embodiment also provides a resin adhesive prepared from the above-mentioned resin composition, the preparation method of which includes: mixing component A and component B at a mass ratio of 14, stirring evenly at a temperature of 16°C to obtain the resin adhesive.

[0131] This embodiment also provides an application process for resin adhesive in the encapsulation of hollow fiber membrane modules, the encapsulation including the following steps:

[0132] (1) The obtained resin glue is poured into the hollow fiber membrane module to encapsulate the module;

[0133] (2) The encapsulated membrane module is first dried at 6°C for 35 hours, and then dried at 85°C for 25 hours to finally obtain a fully encapsulated membrane module.

[0134] Example 5

[0135] This embodiment provides a resin composition, a resin adhesive made therefrom, and its application, which differs from Example 1 only in that the mass ratio of curing agent M1, curing agent M2, and curing agent M3 is 1:1:1.

[0136] Example 6

[0137] This embodiment provides a resin composition, a resin adhesive made therefrom, and its application, which differs from Example 1 only in that the active diluent Z1 (1,4-butanediol diglycidyl ether) is replaced with an equal amount of cyclohexanediol diglycidyl ether.

[0138] Comparative Example 1

[0139] This comparative example provides a resin composition, a resin adhesive made therefrom, and its application, which differs from Example 1 in that the mass ratio of resin X1 to resin X2 is 1:1.

[0140] Comparative Example 2

[0141] This comparative example provides a resin composition, a resin adhesive made therefrom, and its application, which differs from Example 1 only in that: in component B, polyether diamine is replaced with an equal amount of diethyltoluene diamine.

[0142] Comparative Example 3

[0143] This comparative example provides a resin composition, a resin adhesive made therefrom, and its application, which differs from Example 1 only in that bisphenol A epoxy resin is replaced with an equal amount of bisphenol S epoxy resin.

[0144] Comparative Example 4

[0145] This comparative example provides a resin composition, a resin adhesive made therefrom, and its application, which differs from Example 1 in that the encapsulated membrane assembly is dried at 30°C.

[0146] Comparative Example 5

[0147] Commercially available ordinary epoxy resin adhesive, which was purchased from Weiligute E51 epoxy resin.

[0148] Test case

[0149] Performance testing

[0150] The hollow fiber membrane modules obtained in each embodiment and comparative example were subjected to air tightness tests and pressure resistance tests, respectively.

[0151] The testing method is as follows:

[0152] Air tightness test: A certain pressure of gas is introduced into the prepared hollow fiber membrane module, and the air tightness of each part of the membrane module is tested with soap bubbles.

[0153] Pressure resistance test: Seal one end of the prepared hollow fiber membrane module and introduce high-pressure gas into the other end to test its pressure resistance performance. If the membrane module can maintain a pressure of 1.5MPa for 24 hours without leakage, it is judged to have good pressure resistance. If the membrane module can maintain a pressure of 2.5MPa for 24 hours without leakage, it is judged to have excellent pressure resistance.

[0154] The test results are shown in Table 1:

[0155] Table 1

[0156]

[0157] The results above show that the hollow fiber membrane modules prepared in the embodiments of the present invention have good airtightness and pressure resistance, and the embodiments 1-3 are better than the embodiment 4.

[0158] It should be noted that the endpoints and any values ​​of the ranges disclosed herein are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to these ranges or values. For numerical ranges, the endpoint values ​​of the various ranges, the endpoint values ​​of the various ranges and individual point values, and individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed herein.

[0159] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A resin composition, characterized in that, It consists of component A and component B in a mass ratio of (10~15):1; Component A comprises the following components in parts by mass: Resin X1 70-80 parts, Resin X2, 10-15 parts Toughening agent Y: 2-4 parts Reactive diluent Z1: 5-8 parts Inactive diluent Z2: 1 to 3 parts; Component B comprises the following components in parts by mass: Hardener M1 30-35 parts, Hardener M2 40-45 parts Hardener M3 20-25 parts, Coupling agent N: 1 to 2 parts; The resin X1 is selected from one or more of bisphenol A epoxy resin and diaminodiphenylmethane tetraglycidylamine; the resin X2 is selected from bisphenol F epoxy resin. The toughening agent Y is selected from one or more of styrene-butadiene copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-butene-styrene block copolymer, and styrene-ethylene-propylene-styrene block copolymer. The curing agent M1 is selected from one or more of polyetheramine, 2-methylpentanediamine, and 1,2-cyclohexanediamine; the curing agent M2 is selected from one or more of 4,4'-diaminodiphenylmethane, 3,3'-diethyl-4,4'-diaminodiphenylmethane, and diethyltoluenediamine; the curing agent M3 is selected from one or more of 4,4'-diaminodicyclohexylmethane and 3,3'-diaminodiphenylmethane. The active diluent Z1 is selected from one or more of 1,4-butanediol diglycidyl ether, polyethylene glycol diglycidyl ether, and Cardlite LITE 513DF; the inactive diluent Z2 is selected from one or more of diisobutyl ketone, methyl isobutyl ketone, and cyclohexanone. The coupling agent N is selected from one or more of tris(hydroxymethyl)nitromethane, 1,3,5-tris(hydroxymethyl)benzene, and tris(hydroxymethyl)propane.

2. The resin composition according to claim 1, characterized in that, In component A, the content of resin X1 is 70wt%~80wt%.

3. The resin composition according to claim 1 or 2, characterized in that, In component A, the content of toughening agent Y is 2wt%~4wt%.

4. The resin composition according to claim 1 or 2, characterized in that, In component B, the content of coupling agent N is 1wt%~2wt%.

5. The resin composition according to claim 1, characterized in that, The polyetheramine is polyether diamine.

6. A resin adhesive, characterized in that, The preparation method includes mixing the resin composition according to any one of claims 1 to 5 at a temperature T1.

7. The resin adhesive according to claim 6, characterized in that, The temperature T1 is 15℃~20℃.

8. The application of the resin composition according to any one of claims 1 to 5 or the resin adhesive according to claim 6 or 7 in the encapsulation of hollow fiber membrane modules; the encapsulation steps include: (1) Mix component A and component B at temperature T1 to obtain resin glue; (2) The resin is poured into the hollow fiber membrane module to encapsulate the module; (3) The membrane module after potting and encapsulation is first dried at temperature T2 for t1 hours, and then dried at temperature T3 for t2 hours; The temperature T2 is 4℃~10℃, and the temperature T3 is 70℃~90℃; t1 and t2 are both the same or different and range from 20 to 40 hours.

9. The application according to claim 8, characterized in that, The resin composition according to any one of claims 1 to 5 or the resin adhesive according to claim 6 or 7 is suitable for encapsulating hollow fiber membrane modules with a diameter of 5 cm to 60 cm.

10. The application according to claim 9, characterized in that, The resin composition or the resin adhesive described herein is suitable for encapsulating hollow fiber membrane modules with a diameter of 30cm to 60cm.

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