Adhesive for electronic precision device and preparation method thereof

Abstract

The invention discloses an adhesive for an electronic precision device. The adhesive comprises the following components in parts by weight: 80-100 parts of naphthyl epoxy resin, 5-30 parts of siloxane, 5-25 parts of a diluent, 10-50 parts of an insulating heat-conducting material and 3-20 parts of a composite curing agent, the insulating and heat conducting material is an OH-BN / AlN / PLGA-PEG-NH2 composite material, and the insulating and heat conducting material is a composite material; the composite curing agent comprises a modified polythiol curing agent A and a modified polythiol curing agent B, the modified polythiol curing agent A and the modified polythiol curing agent B are mixed according to the mass ratio of (1-2.5): (1-2.5), 0.05%-1% of a silane coupling agent is added, stirring is conducted, and the composite curing agent is obtained. The adhesive prepared by the invention has excellent adhesive property and good heat-conducting property, is high in normal-temperature curing speed, and has a relatively good application prospect in the field of electronic and electrical appliances.

Description

[0001] This application claims priority to Chinese patent application number: 202411195425.2, filed on August 28, 2024, entitled “A kind of adhesive for electronic precision devices and its preparation method”, the entire text of which is hereby incorporated by reference. Technical Field

[0002] The present invention relates to the technical field of adhesives, and in particular to an adhesive for electronic precision devices and a preparation method thereof. Background Art

[0003] With the advancement of technology, the applications of thermally conductive adhesives are becoming increasingly widespread, encompassing aerospace, mobile communications, new energy vehicles, medical devices, electronics, and other related fields. Polymer composites, combining the advantages of a polymer matrix with thermally conductive fillers, play a crucial role in today's electronic devices. The trend toward increasing miniaturization and functional integration in electronic products places increasingly stringent demands on heat dissipation systems.

[0004] At present, the thermal conductivity of thermally conductive adhesives is mainly achieved by filling thermally conductive powder. Thermally conductive powders mainly include aluminum oxide, magnesium oxide, zinc oxide, aluminum nitride, boron nitride, silicon nitride, silicon carbide, carbon fiber and graphene, which form a random dispersion state in the adhesive, causing problems such as low strength of the adhesive. Epoxy resin is widely used in semiconductor and electronic packaging materials due to its excellent mechanical, electrical and heat resistance properties. Single-component epoxy adhesives are easy to use and can be directly extruded for use. However, the curing agent used in the single-component epoxy resin adhesives circulating on the market is a latent curing agent, which has poor storage stability, is prone to viscosity increase, and the glue solidifies, and generally requires high-temperature curing.

[0005] Therefore, there is still a need to develop a one-component adhesive that can be cured at room temperature and has good thermal conductivity. Summary of the Invention

[0006] The purpose of the present invention is to provide an adhesive for electronic precision devices and a preparation method thereof, wherein the adhesive cures quickly at room temperature, has good adhesion, is stable in storage, has good thermal conductivity, and better meets the use requirements of electronic appliances.

[0007] To this end, the present invention adopts the following technical solutions:

[0008] The present invention provides an adhesive for electronic precision devices, comprising the following components in parts by weight:

[0009] 80-100 parts of naphthalene epoxy resin, 5-30 parts of siloxane, 5-25 parts of diluent, 10-50 parts of insulating thermal conductive material and 3-20 parts of composite curing agent;

[0010] The insulating thermal conductive material is an OH-BN / AlN / PLGA-PEG-NH2 composite material;

[0011] The composite curing agent comprises a modified polythiol curing agent A and a modified polythiol curing agent B.

[0012] Mix the mixture in a mass ratio of (1-2.5):(1-2.5), add 0.05-1% of silane coupling agent, stir, and obtain the product.

[0013] Due to the rigid planar conjugated structure of the naphthalene ring, naphthalene-based epoxy resins have a series of excellent properties, such as low moisture absorption, high chemical stability, low CTE and excellent mechanical and thermomechanical properties.

[0014] Furthermore, the method for preparing the insulating thermally conductive material comprises the following steps:

[0015] The preparation method of the OH-BN / AlN / PLGA-PEG-NH2 composite material comprises the following steps:

[0016] (1) Add boron nitride to isopropanol and ultrasonically vibrate in a water bath for 10-24 hours, add NaOH solution and heat with stirring at a heating temperature of 110-150°C for 12-72 hours, filter, wash with pure water 3-5 times, dry, and grind to obtain hydroxyl-modified ON-BN powder;

[0017] (2) Mix OH-BN powder and aluminum nitride in a mass ratio of (0.5-1):(1-3), add to a mixture of tris(hydroxymethylaminomethane) buffer and ethanol, ultrasonically disperse for 20-30 minutes, stir and react for 12-24 hours, filter, wash with ethanol 2-3 times, dry, and grind to obtain OH-BN / AlN powder;

[0018] (3) Adding OH-BN / AlN powder to chloroform, ultrasonicating for 24-48 hours, then removing the solvent and drying to obtain OH-BN / AlN sheets;

[0019] (4) Dissolve the poly(lactic acid-co-glycolic acid) copolymer polyethylene glycol amino group in dichloromethane, add the OH-BN / AlN sheet obtained in step (3), stir and disperse for 15-40 minutes, then pour into a mold, remove the solvent, and demold to obtain the OH-BN / AlN / PLGA-PEG-NH2 composite material.

[0020] Preferably, the concentration of the sodium hydroxide solution in step (1) is 50-150 g / L.

[0021] Preferably, the mass percentage of OH-BN / AlN in the OH-BN / AlN / PLGA-PEG-NH2 composite material of step (3) is 10-50%.

[0022] Furthermore, the preparation method of the modified polythiol curing agent A comprises: heating and stirring the reaction of glycerol triglycidyl ether and pentaerythritol tetrakis(3-mercaptopropionic acid) in a molar ratio of (1-3):1 under the action of a catalyst to obtain the obtained product.

[0023] Preferably, the catalyst is triethylamine; and / or the heating reaction temperature is 60-80° C.; and / or the reaction time is 6-24 h.

[0024] Furthermore, the preparation method of the modified polythiol curing agent B comprises: heating and stirring the reaction of hexamethylene diisocyanate and pentaerythritol tetrakis(3-mercaptopropionic acid) in a molar ratio of (0.5-4):1 under the action of a catalyst to obtain the obtained product.

[0025] Preferably, the catalyst is an organotin catalyst, more preferably dibutyltin dilaurate; and / or the heating reaction temperature is 60-80° C.; and / or the reaction time is 6-24 h.

[0026] Preferably, the siloxane is selected from one or more of vinyl silane, amino silane, epoxy silane, mercapto silane and methacryloxy silane.

[0027] Preferably, the diluent is selected from one or more of alkylene glycidyl ether, 1,4-butanediol diglycidyl ether, ethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, benzyl glycidyl ether, and butyl glycidyl ether.

[0028] Preferably, the adhesive further comprises one or more of a toughening agent, a plasticizer, a defoaming agent, an anti-aging agent, and an antioxidant.

[0029] The present invention also provides a method for preparing an adhesive for electronic precision devices, comprising the following steps:

[0030] 1) After the naphthalene epoxy resin and siloxane are melted, a diluent is added and the mixture is stirred and mixed evenly;

[0031] 2) adding an insulating thermal conductive material and a composite curing agent for blending, with a curing temperature of 25-150° C. and a heating rate of 5-20° C. / min to prepare the adhesive for electronic precision devices.

[0032] Compared with the prior art, the present invention has the following beneficial effects:

[0033] The adhesive for electronic precision devices of the present invention is a composite curing agent obtained by mixing a naphthyl epoxy resin, siloxane, a diluent, an OH-BN / AlN / polylactic acid-glycolic acid copolymer polyethylene glycol amino composite thermal conductive insulating material, a modified polythiol curing agent A and a modified polythiol curing agent B. The composite curing agent has excellent bonding performance and thermal conductivity and a fast curing speed at room temperature.

[0034] The insulating thermally conductive material OH-BN / AlN / PLGA-PEG-NH2 composite material provided by the present invention uses nanosheets of edge-hydroxylated boron nitride and aluminum nitride composite material to react with PLGA-PEG-NH2, and the nanosheets are uniformly dispersed and bonded to the long molecular chain of PLGA-PEG-NH2, which greatly increases the specific surface area of ​​the nanomaterial and significantly improves the dispersibility of boron nitride and aluminum nitride and the compatibility of the system. Adding it can greatly improve the performance of the material.

[0035] The composite curing agent provided by the present invention is a composite of modified polythiol curing agents A and B. The modified agents introduce a more diverse range of functional groups and possess a well-developed cross-linked structure, enabling the adhesive system to achieve a better network structure and enhance bonding performance. The composite curing agent of the present invention achieves instant curing and exhibits excellent storage stability.

[0036] The present invention adopts naphthalene-based epoxy resin as the base resin, and by melt-mixing with siloxane, the resin base has better reactivity and heat resistance, and is combined with the thermal conductive material and curing agent of the system to obtain good bonding force and thermal conductivity.

[0037] The adhesive provided by the present invention has excellent comprehensive performance and has good application prospects in electronic devices. DETAILED DESCRIPTION

[0038] Below by specific embodiment, the specific embodiment of this explanation technical scheme is further described, and these embodiments are for the detailed description of this technical scheme, rather than for limiting this technical scheme. Based on the embodiment in this explanation, the every other embodiment that those of ordinary skill in the art obtain without making creative work premise all fall within the scope of this explanation protection. Unless otherwise specified, the reagent, method and equipment adopted in the present invention are conventional reagents, methods and equipment in the art, and the reagents and materials used in the following examples are all commercially available.

[0039] Naphthalene-based epoxy resin EBA-65 was purchased from Hubei Langbowan Biopharmaceutical Co., Ltd.;

[0040] Hexagonal boron nitride was purchased from Shenzhen Advanced New Materials Manufacturing Co., Ltd.

[0041] Aluminum nitride, CAS No. 24304-00-5, was purchased from Hebei Teng Bimetallic Materials Co., Ltd.;

[0042] Poly(lactic-co-glycolic acid)-poly(ethylene glycol)-amino) (PLGA-PEG-NH2) (product number: R-PL1005-5KD), molecular weight 2000, was purchased from Xi'an Ruixi Biotechnology Co., Ltd.

[0043] Preparation Example 1

[0044] This preparation example provides a modified thiol curing agent A. The preparation method is as follows: 49 g of pentaerythritol tetrakis(3-mercaptopropionic acid) ester and 1 g of triethylamine are weighed and added to a three-necked flask. After mechanical stirring, 13 g of propylene glycol triglycidyl ether is added dropwise to the three-necked flask. The temperature is raised to 70°C, the mixture is stirred for 18 hours, and the product is collected to obtain the product.

[0045] Preparation Example 2

[0046] This preparation example provides a modified thiol curing agent B. The preparation method is as follows: 85 g of pentaerythritol tetrakis(3-mercaptopropionic acid) ester and dibutyltin dilaurate are weighed and added to a three-necked flask. After mechanical stirring, 16.8 g of toluene diisocyanate is dropwise added to the three-necked flask. The mixture is stirred at 65°C for 12 h, and the product is collected to obtain the product.

[0047] Preparation Example 3

[0048] Preparation of composite curing agent: Modified thiol curing agent A of Preparation Example 1 and modified thiol curing agent B of Preparation Example 2 were mixed in a mass ratio of 1:1, 0.3% of silane coupling agent Z-6040 was added, and stirred for 20 minutes to obtain the composite curing agent.

[0049] The composite curing agent is used in the following examples and comparative examples.

[0050] Preparation Example 4

[0051] This preparation example provides an insulating thermal conductive material OH-BN / AlN / PLGA-PEG-NH2 composite material, and its preparation method includes the following steps:

[0052] (1) Add 20 g of boron nitride (BN) to 100 mL of isopropanol and ultrasonically vibrate in a water bath for 10-24 h. Add 50 mL of a 120 g / L NaOH solution and heat with stirring at 140 °C for 24 h. Filter, wash with pure water five times, dry, and grind to obtain hydroxyl-modified ON-BN powder.

[0053] (2) OH-BN and aluminum nitride (AlN) were mixed in a mass ratio of 1:3, added to a mixture of tris(hydroxymethylaminomethane) buffer and ethanol, ultrasonically dispersed for 30 minutes, stirred for 20 hours, filtered, washed with ethanol three times, dried, and ground to obtain OH-BN / AlN powder;

[0054] (3) The OH-BN / AlN powder prepared above was added to 150 mL of chloroform and ultrasonicated for 48 h. The solvent was then removed, dried, and ground to obtain OH-BN / AlN sheets.

[0055] (4) Dissolve poly(lactic acid-co-glycolic acid) polyethylene glycol amino (PLGA-PEG-NH2) in dichloromethane, add the OH-BN / AlN sheet prepared in step (3) at a mass ratio of 50%, stir and disperse for 40 minutes, then pour into a mold, remove the solvent, and demold to obtain an OH-BN / AlN / PLGA-PEG-NH2 composite material.

[0056] Example 1

[0057] This embodiment provides an adhesive for electronic precision devices, comprising the following components in parts by weight:

[0058] 80 parts of naphthyl epoxy resin, 20 parts of siloxane KH560, 15 parts of 1,4-butanediol diglycidyl ether, 40 parts of insulating thermal conductive material and 10 parts of composite curing agent;

[0059] The insulating thermal conductive material is the OH-BN / AlN / PLGA-PEG-NH2 composite material prepared in Preparation Example 4;

[0060] The composite curing agent is the composite curing agent prepared in Preparation Example 3, and the composite curing agent is compounded and prepared before preparing the adhesive.

[0061] The method for preparing an adhesive for electronic precision devices provided in this embodiment comprises the following steps:

[0062] 1) After the naphthalene epoxy resin and siloxane are melted, a diluent is added and the mixture is stirred and mixed evenly;

[0063] 2) adding an insulating thermal conductive material and a composite curing agent, blending the mixture, and dispersing the mixture by ultrasonication at a curing temperature of 25° C. to obtain the adhesive for electronic precision devices.

[0064] Example 2

[0065] This embodiment provides an adhesive for electronic precision devices, comprising the following components in parts by weight:

[0066] 100 parts of naphthalene epoxy resin, 10 parts of siloxane KH560, 15 parts of 1,4-butanediol diglycidyl ether, 40 parts of insulating thermal conductive material and 5 parts of composite curing agent;

[0067] The insulating thermal conductive material is the OH-BN / AlN / PLGA-PEG-NH2 composite material prepared in Preparation Example 4;

[0068] The composite curing agent is the composite curing agent prepared in Preparation Example 3, and the composite curing agent is compounded and prepared before preparing the adhesive.

[0069] The method for preparing an adhesive for electronic precision devices provided in this embodiment comprises the following steps:

[0070] 1) After the naphthalene epoxy resin and siloxane are melted, a diluent is added and the mixture is stirred and mixed evenly;

[0071] 2) adding an insulating thermal conductive material and a composite curing agent, blending the mixture, and dispersing the mixture by ultrasonication at a curing temperature of 25° C. to obtain the adhesive for electronic precision devices.

[0072] Example 3

[0073] This embodiment provides an adhesive for electronic precision devices, comprising the following components in parts by weight:

[0074] 90 parts of naphthyl epoxy resin, 20 parts of siloxane KH560, 20 parts of benzyl glycidyl ether, 50 parts of insulating thermal conductive material and 15 parts of composite curing agent;

[0075] The insulating thermal conductive material is the OH-BN / AlN / PLGA-PEG-NH2 composite material prepared in Preparation Example 4;

[0076] The composite curing agent is the composite curing agent prepared in Preparation Example 3, and the composite curing agent is compounded and prepared before preparing the adhesive.

[0077] The method for preparing an adhesive for electronic precision devices provided in this embodiment comprises the following steps:

[0078] 1) After the naphthalene epoxy resin and siloxane are melted, a diluent is added and the mixture is stirred and mixed evenly;

[0079] 2) adding an insulating thermal conductive material and a composite curing agent, blending the mixture, and dispersing the mixture by ultrasonication at a curing temperature of 25° C. to obtain the adhesive for electronic precision devices.

[0080] Comparative Example 1

[0081] Compared with Example 1, the difference is that the insulating thermal conductive material hydroxyl-modified BN / AlN / poly PLGA-PEG-NH2 composite material is replaced by BN in equal parts by weight, and the other parts are the same.

[0082] The preparation method of the adhesive in this comparative example is the same as that in Example 1.

[0083] Comparative Example 2

[0084] Compared with Example 1, the difference is that the insulating thermal conductive material hydroxyl-modified BN / AlN / PLGA-PEG-NH2 composite material is replaced by AlN in equal parts by weight, and the other parts are the same.

[0085] The preparation method of the adhesive in this comparative example is the same as that in Example 1.

[0086] Comparative Example 3

[0087] Compared with Example 1, the difference is that the insulating thermal conductive material hydroxyl-modified BN / AlN / PLGA-PEG-NH2 composite material is replaced with equal weight parts of BN and AlN mixed filler, and the molar ratio of BN and AlN is kept the same as the ratio of the two in the hydroxyl-modified BN / AlN / polylactic acid-glycolic acid copolymer polyethylene glycol amino complex, and the other conditions are the same.

[0088] The preparation method of the adhesive in this comparative example is the same as that in Example 1.

[0089] Comparative Example 4

[0090] Compared with Example 1, the difference is that the insulating thermal conductive material hydroxyl-modified BN / AlN / PLGA-PEG-NH2 composite material is not added, and the other parts are the same.

[0091] The preparation method of the adhesive in this comparative example is the same as that in Example 1.

[0092] Comparative Example 5

[0093] Compared with Example 1, the difference is that the composite curing agent is replaced by the conventional curing agent polyetheramine D400, and the other contents are the same.

[0094] The preparation method of the adhesive in this comparative example is the same as that in Example 1.

[0095] Comparative Example 6

[0096] Compared with Example 1, the difference is that the composite curing agent only contains the modified thiol curing agent A in equal parts by weight, and the other parts are the same.

[0097] The preparation method of the adhesive in this comparative example is the same as that in Example 1.

[0098] Comparative Example 7

[0099] Compared with Example 1, the difference is that the composite curing agent only contains the modified thiol curing agent B in equal parts by weight, and the other parts are the same.

[0100] The preparation method of the adhesive in this comparative example is the same as that in Example 1.

[0101] Comparative Example 8

[0102] The difference compared with Example 1 is that no siloxane is added, and the others are the same.

[0103] The adhesive of the present comparative example is prepared in the same way as Example 1.

[0104] Comparative Example 9

[0105] The difference compared with Example 1 is that the composite curing agent is replaced by 5 parts of modified thiol curing agent A and 5 parts of modified thiol curing agent B, which are only physically mixed, and the others are the same.

[0106] The adhesive of the present comparative example is prepared in the same way as Example 1.

[0107] Performance test: the adhesives prepared in Examples 1-3 and Comparative Examples 1-8 are subjected to the following performance tests.

[0108] 1. Thermal conductivity: determined in accordance with ASTM-5470 standard.

[0109] 2. Volume resistivity: 1) tested in accordance with GB / T 31838.2-2019 for volume resistivity in high humidity environment, the humidity of the test environment is 85%; 2) tested in accordance with JESD22-A101-C for volume resistivity after aging for 500h, the humidity of the test environment is 85% and the temperature is 85℃.

[0110] 3. Shear strength: the shear strength of the adhesives prepared in Examples 1-3 and Comparative Examples 1-8 in 3003Al-3003Al and PET-PET substrates is determined in accordance with GB / T 7124-2008.

[0111] 4. Curing time: the time required for curing at room temperature 25℃ is recorded.

[0112] The test results are shown in Tables 1 and 2.

[0113] Table 1 Test results of bonding and curing performance

[0114]

[0115] Table 2 Test results of insulation and thermal conductivity performance

[0116]

[0117] As can be seen from the test data of Examples 1-3 and Comparative Examples 1-9 given in Tables 1 and 2, the adhesive provided by the present application has excellent bonding ability to aluminum and PET plastic materials, the thermal conductivity of the adhesive provided by the present application can reach 9.05 W / m·K, which is significantly higher than the thermal conductivity of ordinary epoxy adhesive, and still maintains excellent insulation ability in a humid heat aging environment, the adhesive provided by the present application has fast curing speed and can be cured at room temperature in 18-25min.

[0118] From the test data of Example 1 and Comparative Examples 1-9, it can be seen that:

[0119] The addition of the insulating and thermally conductive material provided by the present invention significantly improves the thermal conductivity of the adhesive, and exhibits a superior thermal conductivity enhancement compared to conventional thermally conductive fillers such as BN and AlN. The insulating and thermally conductive material provided by the present invention also enhances the shear strength of the adhesive, improving its bonding properties to aluminum and plastic materials.

[0120] The addition of the composite curing agent provided by the present invention can significantly increase the curing speed of the adhesive and enhance curing performance better than conventional amine curing agents. Furthermore, the composite curing agent provided by the present invention is more effective in increasing the curing speed of the adhesive than any of its single-component curing agents, indicating that the combination of the two can synergistically enhance the curing speed and improve the bonding performance.

[0121] The adhesive provided by the present invention is scientifically matched with naphthalene epoxy resin, silicone, thermal conductive material, etc., and under the action of a composite curing agent, a system structure with both good rigidity and good network crosslinking degree is formed. The thermal conductive material is evenly dispersed and bonded to the molecular chain in the system, so that the adhesive has good thermal conductivity and mechanical properties.

[0122] The adhesive provided by the present invention has excellent thermal conductivity and bonding properties, a fast curing speed, helps to achieve more excellent application effects in the field of electronic packaging, and has good application prospects.

[0123] Although the embodiments of the present disclosure have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations may be made to the embodiments without departing from the principles and spirit of the present disclosure, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An adhesive for electronic precision devices, characterized in that: The composition comprises the following components in parts by weight: 80-100 parts of naphthalene epoxy resin, 5-30 parts of siloxane, 5-25 parts of diluent, 10-50 parts of insulating thermal conductive material and 3-20 parts of composite curing agent; The insulating thermal conductive material is an OH-BN / AlN / PLGA-PEG-NH2 composite material; The composite curing agent comprises a modified polythiol curing agent A and a modified polythiol curing agent B, which are mixed in a mass ratio of (1-2.5):(1-2.5), and 0.05-1% of a silane coupling agent is added and stirred to obtain the composite curing agent.

2. The adhesive for electronic precision devices according to claim 1, characterized in that: The preparation method of the OH-BN / AlN / PLGA-PEG-NH2 composite material comprises the following steps: (1) Add boron nitride to isopropanol and ultrasonically vibrate in a water bath for 10-24 hours, add NaOH and heat with stirring at a heating temperature of 110-150°C for 12-72 hours, filter, wash with pure water 3-5 times, dry, and grind to obtain OH-BN powder; (2) Mixing hydroxy-modified OH-BN powder and aluminum nitride in a mass ratio of (0.5-1):(1-3), adding the mixture to a mixture of tris(hydroxymethylaminomethane) buffer and ethanol, ultrasonically dispersing for 20-30 minutes, stirring for 12-24 hours, filtering, washing with ethanol 2-3 times, drying, and grinding to obtain OH-BN / AlN powder; (3) Adding OH-BN / AlN powder to chloroform, ultrasonicating for 24-48 hours, then removing the solvent and drying to obtain OH-BN / AlN sheets; (4) Dissolve the poly(lactic acid-co-glycolic acid) copolymer polyethylene glycol amino group in dichloromethane, add the OH-BN / AlN sheet obtained in step (3), stir and disperse for 15-40 minutes, then pour into a mold, remove the solvent, and demold to obtain the OH-BN / AlN / PLGA-PEG-NH2 composite material.

3. The adhesive for electronic precision devices according to claim 2, characterized in that: The molar concentration of the sodium hydroxide solution in step (1) is 1-3 mol / L.

4. The adhesive for electronic precision devices according to claim 2, characterized in that: The mass percentage of OH-BN / AlN in the OH-BN / AlN / PLGA-PEG-NH2 composite material of step (4) is 10-50%.

5. The adhesive for electronic precision devices according to claim 1, characterized in that: The preparation method of the modified polythiol curing agent A comprises: heating and stirring glycerol triglycidyl ether and pentaerythritol tetrakis(3-mercaptopropionic acid) in a molar ratio of (1-3):1 under the action of a catalyst to obtain the obtained product.

6. The adhesive for electronic precision devices according to claim 1, characterized in that: The preparation method of the modified polythiol curing agent B comprises: heating and stirring the reaction of hexamethylene diisocyanate and pentaerythritol tetrakis(3-mercaptopropionic acid) in a molar ratio of (0.5-4):1 under the action of a catalyst to obtain the modified polythiol curing agent B.

7. The adhesive for electronic precision devices according to claim 1, characterized in that: The siloxane is selected from one or more of vinyl silane, amino silane, epoxy silane, mercapto silane and methacryloxy silane.

8. The adhesive for electronic precision devices according to claim 1, characterized in that: The diluent further comprises one or more of alkylene glycidyl ether, 1,4-butanediol diglycidyl ether, ethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, benzyl glycidyl ether, and butyl glycidyl ether.

9. The adhesive for electronic precision devices according to any one of claims 1 to 8, characterized in that: It also includes one or more of a toughening agent, a plasticizer, a defoaming agent, an anti-aging agent, and an antioxidant.

10. A method for preparing an adhesive for electronic precision devices according to any one of claims 1 to 9, characterized in that: The steps include: 1) After the naphthalene epoxy resin and siloxane are melted, a diluent is added and the mixture is stirred and mixed evenly; 2) adding an insulating thermal conductive material and a composite curing agent for blending, with a curing temperature of 25-150° C. and a heating rate of 5-20° C. / min to prepare the adhesive for electronic precision devices.

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