Manufacturing method of flexible circuit board of fine copper plating layer for high-speed computing power module

Abstract

The invention discloses a method for manufacturing a flexible circuit board of a fine copper coating for a high-speed computing power module, and the method comprises the steps: arranging an overflow groove at the top of an electroplating cylinder, and arranging an overflow circulating filtration system composed of a pump body and a filtration system for the electroplating cylinder, thereby forming an overflow electroplating cylinder; a liquid inlet and a liquid outlet of the overflow circulating filtration system are respectively connected with the bottom end of the overflow groove and the electroplating cylinder through pipelines; a metal net-shaped cylinder dragging plate is manufactured and used for carrying out cylinder dragging treatment on the overflow electroplating cylinder, and a cylinder dragging overflow electroplating cylinder is formed; manufacturing a conductor clamping screen frame with a hollow structure, and clamping a to-be-electroplated plate to form a to-be-electroplated combined plate; the accompanying plating board and the to-be-electroplated composition board are arranged and placed in a dragging cylinder overflow electroplating cylinder to be electroplated, and the flexible circuit board is formed; the overflow groove and the overflow circulating filtering system are arranged at the top of the electroplating cylinder, so that impurities in the electroplating cylinder body are effectively removed, and the problem that surface floating objects are difficult to remove through an existing filtering system is solved.

Description

Technical Field

[0001] The present invention relates to the field of flexible circuit board manufacturing, and in particular to a method for manufacturing a flexible circuit board with fine copper plating for a high-speed computing power module. Background Art

[0002] In the application scenario of high-speed computing power systems, the requirements for the lattice fineness and copper thickness uniformity of the circuit copper layer of the application circuit board are much higher than those of traditional circuit boards, in order to meet the needs of high-speed signal transmission and reduce signal loss and transmission instability.

[0003] However, there are many technical bottlenecks in the current copper electroplating process of this type of flexible circuit boards that need to be solved: Since the flexible circuit board is soft and its flatness needs to be guaranteed during electroplating, the existing technology mostly uses a frame-type electroplating fixture with two rows of upper and lower clamps to clamp the upper and lower ends of the board for fixation before electroplating.

[0004] However, for flexible circuit boards that require high copper plating precision, this method of clamping only the upper and lower ends of the flexible circuit board causes the current to flow preferentially to the upper and lower ends of the board. During electroplating, the electric field lines act preferentially on the upper and lower ends, which easily leads to the problem that the electroplated copper thickness at the upper and lower ends is greater than the copper thickness in the center area of ​​the board. If clamps are added to the left and right ends of the fixture to balance the current, the fixture will become bulky and complicated to operate, which will not only reduce processing efficiency but may also cause the board to be scrapped due to improper clamping.

[0005] During the long-term use of the electroplating cylinder, the chemical solution is easily mixed with impurities such as dry film debris and dust debris, which directly affects the flatness of the electroplated copper surface and even causes surface defects such as particles and protrusions.

[0006] For flexible circuit boards with increasingly higher requirements for copper plating fineness, although the existing filtration system can filter the syrup, it is difficult to effectively remove impurities floating on the surface of the syrup. In addition, long-term circulation filtration can easily cause tiny impurities to flow back into the cylinder again, and the filtration effect is very limited. It is difficult to form an effective filtration effect for such tiny impurities.

[0007] If the above-mentioned filtration problem is solved by regular maintenance of the cylinder body, it will not only consume a lot of manpower and time, but also require line shutdown, which is costly and difficult to implement frequently.

[0008] In the electroplating process, in order to balance the electric field lines before and after the plate to be plated and avoid excessive copper thickness at the edges of the first and last plates, accompanying plating plates are usually set before and after the plate to be plated.

[0009] The existing accompanying plating plate mostly adopts a bright copper plate (a bright copper surface copper-clad plate), but the bright copper plate may produce impurities during the accompanying plating process, and does not have adsorption and filtration functions, cannot assist in purifying electroplating chemicals, and has strong adsorption to electric field lines, which is easy to excessively adsorb electric field lines, thereby causing the copper thickness of the edges of the head and tail electroplating plates to be difficult to meet the standards, and affecting the plating precision.

[0010] When the electroplating line is stopped for a long time (usually more than 12 hours), the tank dragging treatment needs to be performed when it is restarted, so as to stimulate the activity of the chemicals and adsorb impurities, and to provide electroplating preparation for the electroplating production plate (the electroplating plate).

[0011] The existing tank dragging treatment mostly adopts a blank circuit board, a copper-clad plate or a scrapped copper surface circuit board, and such materials are difficult to effectively remove the small impurities in the chemicals, and the tank dragging effect is limited for the flexible circuit plate with fine copper plating demand, and it is difficult to guarantee the subsequent electroplating quality.

[0012] Therefore, in order to solve the systematic problems existing in the electroplating process of the high-speed computing flexible circuit plate, a flexible circuit plate manufacturing method for fine copper plating layer of high-speed computing module is needed. SUMMARY

[0013] The present application aims to solve the comprehensive problems of poor electroplating quality of the existing flexible plate processing method, and proposes a flexible circuit plate manufacturing method for fine copper plating layer of high-speed computing module, which takes a flexible copper-clad plate, processes the electroplating plate according to the design data, and processes the flexible circuit plate in the electroplating tank, and the manufacturing method comprises the following steps: S10: An overflow tank is arranged at the top of the electroplating tank, and an overflow circulation filtration system is arranged in the electroplating tank to form an overflow electroplating tank; the inlet and outlet of the overflow circulation filtration system are connected to the bottom end of the overflow tank and the electroplating tank through pipelines respectively, and the overflow circulation filtration system is composed of a pump body and a filtration system; S20: A metal plate is taken to make a metal mesh plate to form a tank dragging plate; the tank dragging plate is used to perform tank dragging treatment on the overflow electroplating tank to form a tank dragging overflow electroplating tank; S30: A conductor mesh frame is taken to remove the middle area of the electroplating plate to form a conductor clamping mesh frame with a hollow structure, and the conductor clamping mesh frame is used to clamp the electroplating plate to form an electroplating combined plate as a whole; S40: An accompanying plating plate is taken; the accompanying plating plate and the electroplating combined plate are arranged and placed in the tank dragging overflow electroplating tank for electroplating, and the flexible circuit plate is formed after the post-process.

[0014] Further, the overflow tank is arranged outside the electroplating tank, and the top end of the overflow tank is higher than the top end of the electroplating tank.

[0015] Furthermore, an overflow baffle is added to the top of the side wall inside the electroplating tank, the bottom of the overflow baffle is fixed to the side wall, and forms the overflow trough with an open upper end together with the side wall; the height of the overflow baffle is lower than the top of the electroplating tank.

[0016] Furthermore, the mesh size of the metal mesh plate is 100 to 500 meshes.

[0017] Furthermore, the metal mesh plate is made of stainless steel, titanium, titanium alloy or aluminum.

[0018] Furthermore, the accompanying plating plate is composed of two steel meshes sandwiching a filter cloth, and the size of the filter cloth is smaller than that of the steel mesh on one side.

[0019] Furthermore, the plate to be electroplated includes a forming line, the area outside the forming line is a tool edge, and the edge of the hollow structure falls within the range of the tool edge in the composite plate to be electroplated.

[0020] Furthermore, the electroplating plating line is a gantry line, and the number of the accompanying plating plates on both sides of the adjacent plate to be plated is greater than or equal to 1; the electroplating plating line is a vertical continuous electroplating line, and the number of the accompanying plating plates on both sides of the adjacent plate to be plated is greater than or equal to 2.

[0021] Furthermore, several of the plates to be plated are arranged adjacent to each other to form a plate group to be plated, and several of the accompanying plates to be plated are arranged to form an accompanying plate group, and two accompanying plate groups are respectively arranged on both sides of the adjacent plate groups to be plated.

[0022] Furthermore, after the electroplating is completed, the conductor clamping frame, the accompanying plating plate and the drag cylinder plate can be subjected to film stripping, first cleaning, stripping and second cleaning in sequence.

[0023] The technical solution of the present invention mainly has the following beneficial effects: By setting up an overflow tank and an overflow circulation filtration system on the top of the electroplating tank, and cooperating with the main circulation filtration system to form a double purification mechanism, it can effectively remove impurities floating on the surface of the electroplating tank, solve the problem that the existing filtration system is difficult to remove surface floating objects, and significantly improve the cleanliness of the electroplating solution.

[0024] By setting a metal mesh plate as a drag plate, the overflow electroplating tank is dragged. The tiny impurities in the potion are filtered through the mesh structure. At the same time, the contact area with the potion is increased, and the activity of the potion is quickly improved, solving the problems of poor purification effect and low activation efficiency of traditional drag materials.

[0025] By setting the accompanying plating plate as a sandwich structure with a filter cloth in the middle of two layers of steel mesh, on the one hand, the steel mesh can balance the electric field lines of the plate to be electroplated, and on the other hand, the filter cloth can absorb tiny impurities in the solution and improve the flatness of the coating, thus solving the problem that traditional accompanying plating plates (plain copper plates) can only balance the electric field but cannot purify the solution.

[0026] The edge of the plate to be plated is designed with a tool edge, and a hollow steel mesh frame is set to clamp the tool edge of the circuit board to be plated. The contact with the steel mesh realizes uniform current conduction, avoiding the problem of excessive copper thickness at the edge caused by traditional fixtures only clamping the two ends, and ensuring the electroplating accuracy.

[0027] By setting accompanying plating plates on both sides of the plate to be electroplated and increasing the number of accompanying plating plates, the electric field line balance is strengthened and the edge copper thickness deviation is solved, while the impurity adsorption capacity is enhanced and the overall electroplating uniformity is improved.

[0028] The overflow device provides the basis for the drag cylinder treatment, the drag cylinder activation prepares the environment for electroplating, the accompanying plating plate and the conductor clamping frame work together to optimize the electric field, and finally form a systematic technical correlation. The various process technologies promote each other to realize the systematic technology of "chemical purification-chemical activity activation-electric field optimization-impurity adsorption-recycling", which effectively solves the systematic problems of high-speed computing power flexible circuit boards in the electroplating process and realizes high-precision processing of flexible circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0030] Figure 1 Schematic diagram of the process flow of an embodiment of the present invention; Figure 2 Schematic diagram of a drag tank overflow electroplating tank with a first overflow tank according to an embodiment of the present invention; Figure 3 Schematic diagram of another drag tank overflow electroplating tank with a second overflow tank according to an embodiment of the present invention; Figure 4 Schematic diagram of a plan view of a plate to be electroplated according to an embodiment of the present invention; Figure 5 A schematic plan view of a composite plate to be electroplated according to an embodiment of the present invention; Figure 6 for Figure 5 AA cross-sectional structural diagram; Figure 7Schematic cross-sectional view of a plating plate according to an embodiment of the present invention; Figure 8 Schematic diagram of the arrangement structure of the to-be-plated plate group and the accompanying plate group according to an embodiment of the present invention.

[0031] Explanation of the accompanying symbols: 10, drag cylinder overflow electroplating cylinder; 1010, first overflow trough; 1020, overflow circulation filtration system; 1030, main circulation filtration system; 1040, spray pipe group; 1050, electroplating chuck; 1060, anode; 10A, another type of drag cylinder overflow electroplating cylinder; 1010A, overflow baffle; 1010B, second overflow trough; 100, electroplating cylinder; 200, board to be plated; 210, dry film pattern; 300, forming line; 400, tool edge; 20, combined board to be plated; 2010, conductor clamping mesh frame; 30, accompanying plating board; 3010, first steel mesh; 3020, second steel mesh; 3030, filter cloth; 40, arrangement structure; 4010, board group to be plated; 4020, accompanying plating board group.

[0032] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0034] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, inside, outside, etc.) are only used to explain the relative position relationship and movement status of the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0035] In addition, the terms "first," "second," and so on, used in this disclosure are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referenced. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this disclosure, "plurality" means at least two, such as two or three, unless otherwise specifically defined.

[0036] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in this field can implement it. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0037] See also Figure 1 , Figure 1 Schematic diagram of the process flow of an embodiment of the present invention.

[0038] The flexible copper-clad laminate is processed into a plate 200 according to design data, and the plate 200 is processed into a flexible circuit board in a plating tank 100. The manufacturing method includes the following steps: See also Figure 2 , Figure 2 Schematic diagram of a drag tank overflow electroplating tank with a first overflow tank according to an embodiment of the present invention.

[0039] Step S10: A first overflow trough 1010 is provided at the top of the electroplating cylinder 100, and an overflow circulation filtration system 1020 is provided at the electroplating cylinder 100 to form an overflow electroplating cylinder; a liquid inlet 1021 and a liquid outlet 1022 of the overflow circulation filtration system 1020 are respectively connected to the bottom end of the first overflow trough 1010 and the electroplating cylinder 100 through pipes, and the overflow circulation filtration system 1020 consists of a pump body and a filtration system.

[0040] Optionally, the first overflow trough 1010 is disposed outside the electroplating tank 100 , and a top of the first overflow trough 1010 is higher than a top of the electroplating tank 100 .

[0041] A first overflow trough 1010 is provided on the top of the electroplating tank 100 and is installed on the outside of the top ends of both sides of the tank body. The top end of the first overflow trough 1010 is higher than the top end of the electroplating tank 100. At the same time, the liquid level of the liquid in the first overflow trough 1010 is controlled to be lower than the top end of the electroplating tank 100. The bottom end of the first overflow trough 1010 is connected to the overflow circulation filtration system 1020 through a pipe, and the system is connected back to the electroplating tank 100 through another pipe to form a complete circulation loop.

[0042] The overflow circulation filtration system 1020 is composed of a pump body and a filtration system. The operation process of the entire overflow electroplating cylinder is as follows: (anodes 1060 are provided on both sides of the electroplating cylinder 100, and a spray pipe group 1040 is correspondingly provided in the middle. The electroplating chuck 1050 clamps the plate to be electroplated 200 for arrangement and is arranged between the spray pipe groups 1040 on both sides) During the electroplating process, the potion in the cylinder body will naturally overflow into the first overflow tank 1010 due to the height difference of the water flow, and then be transported to the overflow circulation filtration system 1020 through the pipeline. Driven by the pump body, the potion is purified by the filtration system and then transported back to the cylinder body to realize continuous circulation purification of the potion.

[0043] It is worth noting that the electroplating tank 100 itself is equipped with a main circulation filtration system 1030 of the existing technology. The medicine in the tank is transported to the main circulation filtration system 1030 through a pipe. After being filtered by the main circulation filtration system 1030, it is transported to the spray pipe group 1040 through a pipe, which can further enhance the effect of removing impurities in the medicine. An overflow circulation filtration system 1020 is further provided, especially for impurities floating on the surface of the medicine, to form a more comprehensive purification mechanism.

[0044] See also Figure 3 and Figure 4 , Figure 3 Schematic diagram of another drag tank overflow electroplating tank with a second overflow tank according to an embodiment of the present invention; Figure 4 This is a schematic plan view of a plate to be electroplated according to an embodiment of the present invention.

[0045] Optionally, an overflow baffle 1010A is added to the top of the side wall inside the electroplating cylinder 100, and the bottom of the overflow baffle 1010A is fixed to the side wall, and forms a second overflow trough 1010B with an open upper end together with the side wall; the height of the overflow baffle 1010A is lower than the top of the electroplating cylinder 100; the electroplating cylinder 100 forms another type of drag cylinder overflow electroplating cylinder 10A.

[0046] The operating logic of this embodiment is basically the same as the aforementioned overflow tank solution set on the outside of the electroplating cylinder 100. The liquid medicine in the cylinder passes over the overflow baffle 1010A and enters the tank. After being sent to the overflow circulation filtration system 1020 for purification through the pipeline, it flows back to the electroplating cylinder 100 to remove impurities. This solution does not require the replacement of the cylinder body and can enable old equipment to have overflow filtration function under the premise of controlling costs.

[0047] Optionally, the overflow baffle 1010A can be fixed inside the electroplating tank 100 by welding, bonding, etc.

[0048] Optionally, the overflow baffle 1010A may be a segmented structure, forming a plurality of overflow baffles 1010A, evenly distributed on the side wall of the cylinder body; this may fully utilize the free space inside the cylinder body, disperse processing risks, and reduce systemic problems caused by a single setting of the overflow baffle 1010A.

[0049] Step S20: A metal plate is taken to make a metal mesh plate to form a dragging cylinder plate (not shown in the drawings); and the dragging cylinder plate is then used to perform a dragging cylinder treatment on the overflow electroplating cylinder to form a dragging cylinder overflow electroplating cylinder 10 .

[0050] Optionally, the mesh size of the metal mesh plate is 100 mesh to 500 mesh.

[0051] A metal plate is selected and processed into a metal mesh plate to serve as a drag cylinder plate. The drag cylinder plate is then placed in an overflow electroplating tank for drag cylinder treatment. After the treatment is completed, a drag cylinder overflow electroplating tank 10 is formed.

[0052] The mesh size of the metal screen is 100 to 500 meshes, preferably 300 or 400 meshes.

[0053] On the one hand, the mesh structure can filter impurities in the electroplating solution; on the other hand, the mesh design increases the contact area with the solution, which can enhance the activity of the cylinder in a shorter time, effectively improve the efficiency of the cylinder dragging, and lay a good foundation for subsequent electroplating processing.

[0054] Optionally, the metal mesh is made of stainless steel, titanium, titanium alloy or aluminum. Using a metal material with properties different from those of electroplated copper as the metal mesh can remove only the copper attached to the surface when it is subsequently stripped and cleaned with a stripping solution, thereby reducing (or avoiding) damage to the metal mesh itself.

[0055] See also Figure 5 and Figure 6 , Figure 5 A schematic plan view of a composite plate to be electroplated according to an embodiment of the present invention; Figure 6 for Figure 5 Schematic diagram of the AA cross-section structure.

[0056] Step S30: Take a conductor mesh frame and remove the middle area of ​​the plate 200 to be plated to form a conductor clamping mesh frame 2010 with a hollow structure. Then use the conductor clamping mesh frame 2010 to clamp the plate 200 to be plated to form a composite plate 20 to be plated as a whole.

[0057] Optionally, the plate to be plated 200 includes a forming line 300 , and the area outside the forming line 300 is a tool edge 400 , and the edge of the hollow structure falls within the range of the tool edge 400 in the composite plate to be plated 20 .

[0058] In the structural design of the plate 200 to be electroplated, the area outside the forming line 300 is the tool edge 400, and the edge of the hollow structure of the conductor clamping mesh frame 2010 needs to fall within the range of the tool edge 400. At the same time, the edge of the plate 200 to be electroplated is set as the copper exposed area (that is, the edge area not covered by the dry film pattern 210). The setting of the copper exposed area provides a conductive basis for the steel mesh clamping, so that the copper layer at the edge of the plate 200 to be electroplated can fully contact with the stainless steel mesh frame, and the conductivity of the mesh frame is used to achieve uniform current conduction, effectively avoiding the problem of uneven current distribution caused by traditional clamps only clamping the two ends. Combined with the positioning function of the hollow structure, it not only ensures the clamping stability, but also optimizes the plating uniformity through the electric field balance effect of the steel mesh.

[0059] The conductor clamping frame 2010 not only provides stable structural support for the subsequent electroplating process, but also optimizes the electric field distribution. At the same time, it also cooperates with the previous overflow circulation filtration system 1020 and the drag cylinder treatment. The previous process has purified the electroplating solution and improved the activity of the cylinder body. The conductor clamping frame 2010, as a conductive medium, can conduct uniform current to various parts of the board to be plated 200. During electroplating, it can form a coordinated electric field environment with the board to be plated 200, so that during the entire electroplating process, the board to be plated 200 can form a uniform copper plating layer in a stable electric field and clean solution environment, ultimately improving the fineness and quality stability of the flexible circuit board.

[0060] Furthermore, the size of the removed middle area is smaller than the size of the flexible circuit board on one side, and larger than the size of the effective area of ​​the flexible circuit board.

[0061] The hollow structure formed must precisely match the plate 200 to be plated, and its edge must fall within the tool edge 400 of the plate 200 to be plated, ensuring that the plate can be firmly clamped without covering the effective area to be plated, thereby ensuring the accuracy of electroplating.

[0062] Optionally, the conductor holding frame 2010 is made of stainless steel.

[0063] On the one hand, the stainless steel material can form a stable electric field balance with the plate to be plated 200 during electroplating. Unlike the titanium mesh that cannot deposit a copper layer, the stainless steel mesh frame will be plated with a copper layer simultaneously with the plate to be plated 200. By expanding its own conductive area, it is equivalent to indirectly increasing the edge conductive area of ​​the plate to be plated 200, and can effectively absorb the uneven electric field lines originally concentrated at the edge of the plate, making the current distribution more uniform. It directly improves the problem of excessive edge copper thickness caused by traditional clamps only clamping the two ends, and further improves the fineness of the plating.

[0064] On the other hand, the stainless steel mesh frame has the advantage of recyclability. After electroplating is completed, the copper layer deposited on the surface can be completely removed through conventional processes such as micro-etching and stripping, without damaging the conductor clamping mesh frame 2010 body, so that it can be reused in multiple batches of production, which is compatible with the long-term stable operation requirements of the overflow circulation filtration system 1020.

[0065] Optionally, the mesh number of the conductor holding frame 2010 is 10 meshes to 400 meshes.

[0066] For flexible circuit boards with different wiring densities, the electric field distribution is further optimized by dynamically matching the mesh size of the grid frame (10 to 400 meshes), forming an effect similar to the wiring density of the plate 200 to be electroplated, which helps to improve the uniformity of electroplating.

[0067] See also Figure 7 , Figure 7 Schematic cross-sectional view of a plating plate according to an embodiment of the present invention.

[0068] Step S40: Take the accompanying plating plate 30; arrange the accompanying plating plate 30 and the composite plate to be plated 20, place them in the drag tank overflow plating tank 10 for electroplating, and then process them through the post-processing to form a flexible circuit board.

[0069] Optionally, the accompanying plating plate 30 is composed of two steel meshes (including a first steel mesh 3010 and a second steel mesh 3020) clamping a filter cloth 3030, and the size of the filter cloth 3030 is smaller on one side than the first steel mesh 3010 and the second steel mesh 3020.

[0070] From the perspective of coordination with the previous process, the first steel mesh 3010 and the second steel mesh 3020 are preferably made of stainless steel, continuing the conductive properties of the conductor clamping mesh frame 2010 in step S30, forming an effective balance for the electric field lines around the electroplating plate 200, and can also be reused (refer to the description of step S30, which will not be repeated here), and coordinated with the recycling mechanism of the drag cylinder plate.

[0071] The single-side size of the filter cloth 3030 is smaller than that of the first steel mesh 3010 and the second steel mesh 3020, so that when the liquid medicine flows through the accompanying plating plate 30, it will first pass through the filter cloth 3030 to absorb tiny impurities (such as dry film debris and copper powder particles), and then pass through the first steel mesh 3010 or the second steel mesh 3020 to enter the area to be electroplated, effectively absorbing impurities in the electroplating liquid medicine and improving the flatness of the electroplated copper layer. Especially for the vertical continuous electroplating process, the front accompanying plating plate 30 can "pre-filter" the liquid medicine to prevent impurities from directly adhering to the surface of the plate to be electroplated 200, and together with the overflow circulation filtration system 1020, it constructs a multi-layer purification barrier to ensure the processing of high-precision coatings.

[0072] Optionally, the mesh of the first steel mesh 3010 and the second steel mesh 3020 is 10 to 500 mesh, which is approximately matched with the mesh of the grid frame of the combined plate to be electroplated 20 and the line density, further optimizing the uniformity of the electric field line distribution, and improving the plating precision.

[0073] Optionally, the material of the filter cloth 3030 is polyester, polypropylene, nylon, or other composite filter materials, which can resist the erosion of electroplating solution without dissolving, and cooperates with the overflow circulation filter system 1020 in step S10 to form a synergistic effect. On this basis, the filter cloth 3030 can ensure long-term stable impurity adsorption capacity by corrosion resistance.

[0074] Optionally, the electroplating line is a gantry line, and the number of the auxiliary plating plate 30 on both sides of the adjacent plate to be electroplated 200 is greater than or equal to 1; the electroplating line is a vertical continuous electroplating line, and the number of the auxiliary plating plate 30 on both sides of the adjacent plate to be electroplated 200 is greater than or equal to 2, preferably 4, 6 or 8 in actual production.

[0075] By increasing the number of steel meshes to strengthen the uniform distribution of electric field lines, and by means of the superposition of more filter cloths 3030 to improve the adsorption effect of the impurities in the solution, the high-precision production of the vertical continuous electroplating line is matched.

[0076] Optionally, if the plate to be electroplated 200 includes a large plate to be electroplated and a small plate to be electroplated, the number of the auxiliary plating plate 30 between the large plate to be electroplated and the small plate to be electroplated is greater than or equal to 2, wherein the size of the auxiliary plating plate 30 gradually decreases from the side close to the large plate to be electroplated to the side close to the small plate to be electroplated, forming a stepped transition.

[0077] Please refer to Figure 8 , Figure 8 The arrangement structure diagram of the plate to be electroplated group and the auxiliary plating plate group in the embodiment of the application.

[0078] Optionally, a plurality of plates to be electroplated 200 are arranged adjacent to form a plate to be electroplated group 4010, and a plurality of auxiliary plating plates 30 are arranged to form an auxiliary plating plate group 4020, two auxiliary plating plate groups 4020 are arranged on both sides of the adjacent plate to be electroplated group 4010, forming an arrangement structure 40; further improving the filtering and adsorption effect of the electroplating solution, and improving the electroplating precision and uniformity.

[0079] Optionally, after electroplating is completed, the conductor clamping grid frame 2010, the auxiliary plating plate 30 and the drag cylinder plate can be sequentially subjected to film stripping, first cleaning, stripping, and second cleaning.

[0080] Film stripping is aimed at the dry film impurities adsorbed by the conductor clamping grid frame 2010, the auxiliary plating plate 30 and the drag cylinder plate during the electroplating process, which are completely removed by the film stripping solution, so as to avoid the influence of impurity residues on the next use and ensure the cleanliness of the tool surface.

[0081] The first cleaning is to clean the residual film stripping solution to ensure the stripping effect.

[0082] The stripping process uses a stripping solution to remove the copper layer formed by electroplating on the surface of the above-mentioned tool without damaging the tool body (the conductor clamping frame 2010 and the accompanying plating plate 30 made of stainless steel), and can restore its conductive and filtering properties. It is compatible with the reuse requirements of the conductor clamping frame 2010 in step S30 and the recycling design of the accompanying plating plate 30 in step S40.

[0083] The second cleaning removes the residual plating solution to ensure that the tool will not contaminate the electroplating solution when it is put into use next time.

[0084] Through this series of post-processing, the conductor clamping frame 2010, the accompanying plating plate 30 and the drag cylinder plate can be reused many times, which not only reduces production costs, but also coordinates with the systematic design of "purification-electroplating-recycling" of the entire technical solution to ensure the stability of electroplating quality in continuous production.

[0085] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention description and drawings under the inventive concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A method for manufacturing a flexible circuit board with fine copper plating for a high-speed computing power module, wherein a flexible copper-clad laminate is processed according to design data to form a plate to be electroplated, and the plate to be electroplated is processed in an electroplating tank to form the flexible circuit board, characterized in that: The production method comprises the following steps: S10: setting an overflow tank on the top of the electroplating tank and setting an overflow circulation filtration system on the electroplating tank to form an overflow electroplating tank; The liquid inlet and the liquid outlet of the overflow circulation filtration system are respectively connected to the bottom end of the overflow tank and the electroplating tank through pipes. The overflow circulation filtration system consists of a pump body and a filtration system; S20: Take a metal plate, make a metal mesh plate, and form a drag cylinder plate; then use the drag cylinder plate to drag the overflow electroplating cylinder to form a drag cylinder overflow electroplating cylinder; S30: Take a conductor mesh frame, remove the middle area corresponding to the plate to be plated, and form a conductor clamping mesh frame with a hollow structure, and then use the conductor clamping mesh frame to clamp the plate to be plated to form a composite plate to be plated; S40: taking a accompanying plating plate; arranging the accompanying plating plate and the composite plate to be electroplated, placing them in the overflow plating tank of the drag tank for electroplating, and forming the flexible circuit board through post-processing.

2. The method for manufacturing a flexible circuit board with fine copper plating for a high-speed computing power module according to claim 1, characterized in that: The overflow trough is arranged on the outside of the electroplating tank, and the top of the overflow trough is higher than the top of the electroplating tank.

3. The method for manufacturing a flexible circuit board with fine copper plating for a high-speed computing power module according to claim 1, characterized in that: An overflow baffle is added to the top of the side wall inside the electroplating tank, wherein the bottom of the overflow baffle is fixed to the side wall and forms the overflow trough with the side wall and the overflow trough; The height of the overflow baffle is lower than the top of the electroplating tank.

4. The method for manufacturing a flexible circuit board with fine copper plating for a high-speed computing power module according to claim 1, characterized in that: The mesh size of the metal mesh plate is 100 to 500 meshes.

5. The method for manufacturing a flexible circuit board with fine copper plating for a high-speed computing power module according to claim 1 or 4, characterized in that: The metal mesh plate is made of stainless steel, titanium, titanium alloy or aluminum.

6. The method for manufacturing a flexible circuit board with fine copper plating for a high-speed computing power module according to claim 1, characterized in that: The accompanying plating plate is composed of two steel meshes sandwiching a filter cloth, and the size of the filter cloth is smaller than that of the steel mesh on one side.

7. The method for manufacturing a flexible circuit board with fine copper plating for a high-speed computing power module according to claim 1, characterized in that: The plate to be electroplated includes a forming line, the area outside the forming line is a tool edge, and the edge of the hollow structure falls within the range of the tool edge in the composite plate to be electroplated.

8. The method for manufacturing a flexible circuit board with fine copper plating for a high-speed computing power module according to claim 1, characterized in that: The electroplating plating line is a gantry line, and the number of the accompanying plating plates on both sides of the adjacent plate to be plated is greater than or equal to 1; the electroplating plating line is a vertical continuous electroplating line, and the number of the accompanying plating plates on both sides of the adjacent plate to be plated is greater than or equal to 2.

9. The method for manufacturing a flexible circuit board with fine copper plating for a high-speed computing power module according to claim 7, characterized in that: Several of the plates to be plated are arranged adjacent to each other to form a plate group to be plated, and several of the accompanying plated plates are arranged to form an accompanying plate group. Two accompanying plate groups are respectively arranged on both sides of the adjacent plate groups to be plated.

10. The method for manufacturing a flexible circuit board with fine copper plating for a high-speed computing power module according to claim 1, characterized in that: After the electroplating is completed, the conductor clamping screen frame, the accompanying plating plate and the drag cylinder plate can be subjected to film stripping, first cleaning, stripping and second cleaning in sequence.

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