Immersed liquid cooling module

Abstract

The invention relates to the technical field of data center heat dissipation, and particularly discloses an immersed liquid cooling module which comprises a liquid cooling box and a shell. A CPU module can be mounted on the inner wall of the liquid cooling box; the shell is installed on the inner wall of the liquid cooling box and communicated with the interior of the liquid cooling box, and a GPU module can be installed on the inner wall of the shell; a water conveying mechanism capable of conveying a liquid cooling medium into the liquid cooling box is also arranged in the liquid cooling box; the water conveying mechanism can enable the CPU module and the GPU module to be immersed in the liquid cooling medium; the liquid cooling medium is conveyed through the water conveying mechanism, and the liquid cooling box is filled with the liquid cooling medium, so that the CPU module, the GPU module and other components are completely immersed in the liquid cooling medium, an air cooling mode is replaced by an immersion liquid cooling mode, the cooling effect is improved, and the possibility that the performance stability and the service life of a chip are affected due to too high temperature is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of data center heat dissipation, and in particular to an immersion liquid cooling module. Background Art

[0002] Data centers generate a large amount of heat during the computing process. To ensure the normal operation of the data center, it is necessary to dissipate heat from the data center's processing modules in a timely manner to reduce the possibility of damage to the chips in the data center's processing modules due to excessive temperatures in a high-density computing environment.

[0003] In the existing technology, the processing modules of data centers mainly use air cooling or liquid cooling plates for heat dissipation. However, air cooling has low heat dissipation efficiency for chips, and liquid cooling plates can only dissipate heat for local chips. During long-term computing in data centers, it is difficult to meet the heat dissipation requirements in high-density computing environments, resulting in excessively high chip temperatures that affect performance stability and service life. Summary of the Invention

[0004] The present application provides an immersion liquid cooling module, which enables the chips of the data center to be completely immersed in the liquid cooling medium to ensure uniform and stable heat dissipation of the chips of the data center and ensure the normal operation of the data center.

[0005] This application provides an immersion liquid cooling module, which adopts the following technical solutions: An immersion liquid cooling module comprises a liquid cooling box and a shell; a CPU module can be mounted on the inner wall of the liquid cooling box; the shell is mounted on the inner wall of the liquid cooling box and communicates with the interior of the liquid cooling box, and a GPU module can be mounted on the inner wall of the shell; the liquid cooling box is also provided with a water supply mechanism for supplying liquid cooling medium into the liquid cooling box; the water supply mechanism can immerse the CPU module and the GPU module in the liquid cooling medium.

[0006] By adopting the above technical solution, when the CPU module and GPU module in the liquid cooling box are cooled, the liquid cooling medium is transported into the liquid cooling box through the water supply mechanism and the liquid cooling box is filled, so that the CPU module, GPU module and other components are completely immersed in the liquid cooling medium. The cooling effect is improved by replacing the air cooling method with immersion liquid cooling, and the possibility of the chip performance stability and service life being affected by excessive temperature is reduced.

[0007] Preferably, the water delivery mechanism includes a water separator, a first delivery component and a second delivery component; the water separator is arranged outside the liquid cooling box, and a water inlet is provided on one side of the water separator; the water inlet can be connected to an external liquid cooling medium circulation system; the water separator is provided with a first water outlet and a second water outlet on the side away from the water inlet; the first delivery component is arranged on the first water outlet, and the first delivery component can deliver the liquid cooling medium in the water separator to the CPU module to cool the CPU module; the second delivery component is arranged on the second water outlet, and the second delivery component can deliver the liquid cooling medium in the water separator to the GPU module to cool the GPU module.

[0008] By adopting the above technical solution, when the chip is subjected to liquid cooling, the external liquid cooling medium circulation system transports the liquid cooling medium from the water inlet to the water distributor, and then diverts the liquid cooling medium through the first water outlet and the second water outlet. The first transport component causes the liquid cooling medium to diffuse on the surface of the CPU module, thereby water-cooling the CPU module; the second transport component causes the liquid cooling medium to diffuse on the surface of the GPU module, thereby water-cooling the GPU module.

[0009] Preferably, the first conveying component includes an assembly seat, a first cooling block and a first cover plate; the assembly seat is installed on the inner wall of the liquid cooling box where the CPU module is located; the first cooling block is installed in the assembly seat and contacts the CPU module; the first cover plate is installed on the first cooling block, and a first pipe is provided on the first cover plate; the end of the first pipe away from the first cover plate is connected to the first water outlet, and the first pipe connects the first water outlet and the top surface of the first cooling block.

[0010] By adopting the above technical solution, the first cooling block is brought into contact with the heat source surface of the CPU module, prompting the first cooling block to dissipate the heat of the CPU module. The arrangement of the assembly seat and the first cover plate is used to fix the first cooling block. The liquid cooling medium in the water distributor can be transported to the assembly seat through the first pipe, prompting the liquid cooling medium to fully contact and exchange heat with the first cooling block, so that the first cooling block can better cool down and dissipate heat for the CPU module, and the liquid cooling medium is finally collected in the liquid cooling box for immersion cooling of other electrical components.

[0011] Preferably, the second conveying assembly includes a second cooling block and a second cover plate; the second cooling block is installed on the inner wall of the shell where the GPU module is located and contacts the GPU module; the second cover plate is covered on the top surface of the second cooling block and is detachably connected to the inner wall of the shell, and a second pipe is provided on the second cover plate; the end of the second pipe away from the second cover plate is connected to the second water outlet, and the second pipe connects the second water outlet and the top surface of the second cooling block.

[0012] By adopting the above technical solution, the second cooling block is brought into contact with the heat source surface of the GPU module, thereby prompting the second cooling block to dissipate the heat of the GPU module. The second cover plate is provided to fix the second cooling block. When the liquid cooling medium in the water distributor is output through the second pipeline, the liquid cooling medium will fully contact the second cooling block and exchange heat, so as to prompt the second cooling block to better cool down and dissipate heat for the GPU module, and finally the liquid cooling medium will be collected in the liquid cooling box for immersion cooling of other electrical components.

[0013] Preferably, a plurality of first fins are provided on the top surface of the first cooling block; and first gap channels are provided between adjacent first fins.

[0014] By adopting the above technical solution, the first gap channel formed by the cooperation of multiple first fins can expand the contact area between the liquid cooling medium and the first cooling block, facilitate the rapid spreading of the liquid cooling medium on the surface of the first cooling block, and improve the heat dissipation effect of the first cooling block.

[0015] Preferably, the bottom surface of the first cover plate is provided with a first guide groove arranged in a direction perpendicular to the first fin.

[0016] By adopting the above technical solution, after the liquid-cooling medium is output from the outlet end of the first pipe, it can be quickly spread along the first guide groove, prompting the liquid-cooling medium to flow quickly and evenly into the first gap channel. Through the cooperation of the first guide groove and the first gap channel, the liquid-cooling medium is prompted to flow quickly at the location of the CPU module, reducing the possibility of the liquid-cooling medium temperature at the location of the CPU module being too high, and improving the cooling effect on the CPU module.

[0017] Preferably, a diffusion port is provided on the assembly seat; the diffusion port is connected to the liquid cooling box and the space where the first fin is located.

[0018] By adopting the above technical solution, the liquid cooling medium that quickly spreads along the surface of the first cooling block can flow into the liquid cooling box through the diffuser port, so that the liquid cooling medium can fill the liquid cooling box and perform immersion cooling on other electrical components.

[0019] Preferably, a plurality of second fins are provided on the top surface of the second cooling block; and second gap channels are provided between adjacent second fins.

[0020] By adopting the above technical solution, the second gap channel formed by multiple second fins can expand the contact area between the liquid cooling medium and the second cooling block, facilitate the rapid spreading of the liquid cooling medium on the surface of the second cooling block, and improve the heat dissipation effect of the second cooling block.

[0021] Preferably, the bottom surface of the second cover plate is provided with a second guide groove arranged in a direction perpendicular to the second fin.

[0022] By adopting the technical scheme, after the liquid cooling medium is output from the second pipeline outlet end, the liquid cooling medium can be quickly spread along the second flow guide groove, so that the liquid cooling medium quickly and uniformly flows into the second gap channel, and through the cooperation of the second flow guide groove and the second gap channel, the liquid cooling medium quickly flows at the position of the GPU module, so that the possibility of the liquid cooling medium being too high at the position of the GPU module is reduced, and the cooling effect of the GPU module is improved.

[0023] In summary, the present application has the following beneficial effects: 1. When the CPU module and the GPU module in the liquid cooling box are cooled, the water delivery mechanism can deliver and fill the liquid cooling medium in the liquid cooling box, so that the CPU module, the GPU module and other components are completely immersed in the liquid cooling medium, so that the cooling effect is improved by replacing the air cooling mode with the immersion cooling mode, and the possibility of affecting the performance stability and service life of the chip due to high temperature is reduced. 2. The first gap channel and the second gap channel can expand the contact area of the liquid cooling medium with the first cooling block and the second cooling block, so that the liquid cooling medium quickly spreads on the surface of the first cooling block and the second cooling block, thereby improving the heat dissipation effect of the first cooling block and the second cooling block, and further improving the cooling effect of the chip. 3. The first flow guide groove and the second flow guide groove can make the liquid cooling medium quickly and uniformly flow into the first gap channel and the second gap channel, so that the liquid cooling medium quickly flows at the position of the CPU module and the GPU module, thereby reducing the possibility of the liquid cooling medium being too high at the position of the CPU module and the GPU module, and improving the cooling effect of the CPU module and the GPU module. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 is a structural diagram of an immersion liquid cooling module; Figure 2 is a schematic diagram of the internal structure of the liquid cooling box in the present application; Figure 3 is a structural diagram of the first conveying assembly in the present application; Figure 4 is a structural diagram of the first cover plate in the present application; Figure 5 is a schematic diagram of the cooperation structure of the shell and the second conveying assembly in the present application; Figure 6 is a structural diagram of the second cover plate in the present application.

[0025] Explanation of the accompanying drawings: 1. Liquid cooling box; 2. Shell; 3. Water delivery mechanism; 31. Water distributor; 311. Water inlet; 312. First water outlet; 313. Second water outlet; 32. First conveying component; 321. Assembly seat; 322. First cooling block; 323. First cover plate; 324. First pipe; 325. First fin; 326. First guide groove; 327. Diffuser; 33. Second conveying component; 331. Second cooling block; 332. Second cover plate; 333. Second pipe; 334. Second fin; 335. Second guide groove. DETAILED DESCRIPTION

[0026] The present invention will be described in further detail below with reference to the accompanying drawings. Like components are denoted by like reference numerals. It should be noted that the terms "front," "rear," "left," "right," "upper," "lower," "bottom," and "top" used in the following description refer to directions in the accompanying drawings, and the terms "inner" and "outer" refer to directions toward or away from the geometric center of a particular component, respectively.

[0027] The present invention discloses an immersion liquid cooling module, such as Figure 1 and Figure 2 As shown, it includes a liquid cooling box 1, a group of shells 2 and a water supply mechanism 3. A pair of CPU modules are installed on the inner wall of the liquid cooling box 1. A group of shells 2 are installed on the inner wall of the liquid cooling box 1 and communicate with the liquid cooling box 1. A GPU module can be installed on the inner wall of each shell 2. The water supply mechanism 3 is set on the liquid cooling box 1. The water supply mechanism 3 can transport external liquid cooling medium into the liquid cooling box 1, so that the CPU module and the GPU module are immersed in the liquid cooling medium. The liquid cooling medium material is an insulating medium, and mineral oil, silicone oil or fluorinated liquid can be used.

[0028] The water supply mechanism 3 can transport the liquid cooling medium into the liquid cooling box 1 and fill the liquid cooling box 1, so that the CPU module, GPU module and other components are completely immersed in the liquid cooling medium. The cooling effect is improved by replacing the air cooling method with the immersion liquid cooling method, and the possibility of the chip being affected by excessive temperature and affecting the performance stability and service life is reduced.

[0029] like Figure 1 and Figure 2As shown, the water delivery mechanism 3 includes a water separator 31, a pair of first delivery components 32 and a group of second delivery components 33. The water separator 31 is arranged outside the liquid cooling box 1. A water inlet 311 that can be connected to an external liquid cooling medium circulation system is provided on one side of the water separator 31, and a pair of first water outlets 312 and a group of second water outlets 313 are provided on the other side of the water separator 31; a pair of first delivery components 32 are respectively provided on a pair of first water outlets 312, and the liquid cooling medium in the water separator 31 can be respectively delivered to a pair of CPU modules; a group of second delivery components 33 are respectively provided on a group of second water outlets 313, and the liquid cooling medium in the water separator 31 can be respectively delivered to a group of GPU modules. A connecting pipe connected to the outside is provided on the outer wall of the liquid cooling shell; a valve is provided on the connecting pipe.

[0030] The device is placed in a cooling medium, and an external liquid cooling medium circulation system is used to transport the liquid cooling medium from the water inlet 311 to the water distributor 31. The liquid cooling medium is then diffused on the surface of the CPU module and the GPU module through the first conveying component 32 and the second conveying component 33, respectively, to cool the CPU module and the GPU module by water, and the liquid cooling medium is filled in the liquid cooling box 1 to realize immersion liquid cooling of the electrical components. The setting of the connecting pipe can realize the circulation of the liquid cooling medium between the liquid cooling box 1 and the outside world.

[0031] like Figure 1 、 Figure 2 and Figure 3 As shown, the first conveying component 32 includes an assembly seat 321, a first cooling block 322, a first cover plate 323 and a first pipe 324. The assembly seat 321 is installed on the outer wall of the liquid cooling box 1 where the CPU module is located, and the first cooling block 322 is installed in the assembly seat 321. The bottom surface of the first cooling block 322 contacts the heating surface of the CPU module. The first cover plate 323 is installed on the assembly seat 321 and covers the top surface of the first cooling block 322. One end of the first pipe 324 is fixedly connected to the top surface of the first cover plate 323, and the other end is fixedly connected to the end of the first water outlet 312. The first pipe 324 connects the water distributor 31 and the top surface space of the first cooling block 322.

[0032] The liquid cooling medium in the water distributor 31 can be transported to the assembly seat 321 through the first pipe 324, so that the liquid cooling medium and the first cooling block 322 can fully contact and exchange heat, so that the first cooling block 322 can better cool and dissipate heat for the CPU module. After cooling the first cooling block 322, the liquid cooling medium finally flows into the liquid cooling box 1 to realize immersion liquid cooling.

[0033] like Figure 2 and Figure 3As shown, a plurality of vertical first fins 325 are provided on the top surface of the first cooling block 322, and first gap channels are provided at equal intervals between adjacent first fins 325. A pair of diffusers 327 are provided on the assembly seat 321, and the diffusers 327 connect the liquid cooling box 1 with the space where the first fins 325 are located in the assembly seat 321.

[0034] The provision of the first gap channel can expand the contact area between the liquid cooling medium and the first cooling block 322 , facilitate the rapid spreading of the liquid cooling medium on the surface of the first cooling block 322 , and improve the heat dissipation effect of the first cooling block 322 .

[0035] like Figure 3 and Figure 4 As shown, a first guide groove 326 is provided on the bottom surface of the first cover plate 323 at the outlet position of the first pipe 324. The first guide groove 326 is arranged perpendicular to the length direction of the first fin 325, and a gap of 1 mm is formed between the first guide groove 326 and the top surface of the first cooling block 322.

[0036] The cooperation between the first guide groove 326 and the first gap channel can promote the rapid flow of the liquid cooling medium at the location of the CPU module, thereby reducing the possibility of the liquid cooling medium at the location of the CPU module being too high in temperature.

[0037] like Figure 1 、 Figure 2 and Figure 5 As shown, the second conveying assembly 33 includes a second cooling block 331, a second cover plate 332 and a second pipe 333. The second cooling block 331 is installed on the inner wall of the shell 2 where the GPU module is located. The bottom surface of the second cooling block 331 contacts the heating surface of the GPU module. The second cover plate 332 is covered on the top surface of the second cooling block 331. Bolts that detachably connect the second cover plate 332 to the shell 2 are provided at the four corners of the second cover plate 332. One end of the second pipe 333 is fixed to the top surface of the second cover plate 332, and the other end is fixed to the end of the second water outlet 313. The second pipe 333 connects the water distributor 31 with the space where the top surface of the second cooling block 331 is located and is connected to the liquid cooling box 1.

[0038] After being outputted by the second pipe 333, the liquid cooling medium in the water distributor 31 will fully contact and exchange heat with the second cooling block 331, so as to enable the second cooling block 331 to better cool and dissipate heat for the GPU module. After cooling the second cooling block 331, the liquid cooling medium finally flows into the liquid cooling box 1, so that the liquid cooling medium fills the liquid cooling box 1 to perform immersion liquid cooling on other electrical components.

[0039] like Figure 2 and Figure 5 As shown, the second cooling block 331 is vertically provided with a plurality of second fins 334 , and second gap channels are equally spaced between two adjacent second fins 334 .

[0040] The provision of the second gap channel can expand the contact area between the liquid-cooling medium and the second cooling block 331 , facilitate the rapid spreading of the liquid-cooling medium on the surface of the second cooling block 331 , and improve the heat dissipation effect of the second cooling block 331 .

[0041] like Figure 5 and Figure 6 As shown, a second guide groove 335 is provided on the bottom surface of the second cover plate 332 at the outlet position of the second pipe 333. The second guide groove 335 is arranged perpendicular to the length direction of the second fin 334. A gap of 1 mm is formed between the second guide groove 335 and the top surface of the second cooling block 331.

[0042] The cooperation between the second guide groove 335 and the second gap channel can promote the rapid flow of liquid cooling medium at the location of the GPU module, reduce the possibility of excessive temperature of the liquid cooling medium at the location of the GPU module, and improve the cooling effect on the GPU module.

[0043] Working principle: When cooling the CPU module and GPU module in the liquid cooling box 1, the liquid cooling medium is transported to the water distributor 31 through the external liquid cooling medium circulation system, and the liquid cooling medium is divided through the first water outlet 312 and the second water outlet 313. The liquid cooling medium output from the first water outlet 312 is transported to the assembly seat 321 through the first pipe 324. The liquid cooling medium output from the first pipe 324 will quickly spread along the first guide groove 326, so that the liquid cooling medium flows quickly and evenly into the first gap channel, facilitating the rapid spreading of the liquid cooling medium on the surface of the first cooling block 322 and converging into the liquid cooling box 1 through the diffuser 327 to achieve cooling of the first cooling block 322. When the liquid cooling box 1 is full of liquid cooling medium, the liquid cooling medium continuously output from the outlet end of the first pipe 324 will disturb the liquid cooling medium at the location of the CPU module, prompting the liquid cooling medium to flow quickly, reducing the possibility of local overtemperature of the liquid cooling medium at the location of the CPU module due to stagnation, thereby improving the cooling effect of the CPU module. The liquid cooling medium output from the second water outlet 313 is output from the second pipe 333. The liquid cooling medium output from the second pipe 333 will quickly spread along the second guide groove 335, so that the liquid cooling medium will quickly and evenly flow into the second gap channel, which facilitates the liquid cooling medium to quickly spread on the surface of the second cooling block 331 and converge into the liquid cooling box 1, thereby achieving cooling of the second cooling block 331. When the liquid cooling box 1 is full of liquid cooling medium, the liquid cooling medium continuously output from the outlet end of the second pipe 333 will disturb the liquid cooling medium at the location of the GPU module, prompting the liquid cooling medium to flow quickly, reducing the possibility of the liquid cooling medium at the location of the GPU module being locally overheated due to being stationary, thereby improving the cooling effect on the GPU module. The present application replaces the air cooling mode with the immersion liquid cooling mode to ensure uniform and stable heat dissipation of all chips in the data center, so as to ensure normal operation of the data center.

[0044] The above are preferred embodiments of the present application, and do not limit the protection scope of the present application, so that: any equivalent changes made according to the structure, shape, principle of the present application should be covered within the protection scope of the present application.

Claims

1. An immersion liquid cooling module, characterized in that: The invention comprises a liquid cooling box (1) and a shell (2); a CPU module can be installed on the inner wall of the liquid cooling box (1); the shell (2) is installed on the inner wall of the liquid cooling box (1) and is in communication with the interior of the liquid cooling box (1); a GPU module can be installed on the inner wall of the shell (2); a water supply mechanism (3) is further provided on the liquid cooling box (1) for supplying liquid cooling medium into the liquid cooling box (1); the water supply mechanism (3) can immerse the CPU module and the GPU module in the liquid cooling medium.

2. The immersion liquid cooling module according to claim 1, characterized in that: The water delivery mechanism (3) comprises a water separator (31), a first delivery component (32) and a second delivery component (33); the water separator (31) is arranged outside the liquid cooling box (1), and a water inlet (311) is arranged on one side of the water separator (31); the water inlet (311) can be communicated with an external liquid cooling medium circulation system; a first water outlet (312) and a second water outlet (313) are arranged on a side of the water separator (31) away from the water inlet (311); the first delivery component (32) is arranged on the first water outlet (312), and the first delivery component (32) can deliver the liquid cooling medium in the water separator (31) to the CPU module to cool the CPU module; the second delivery component (33) is arranged on the second water outlet (313), and the second delivery component (33) can deliver the liquid cooling medium in the water separator (31) to the GPU module to cool the GPU module.

3. The immersion liquid cooling module according to claim 2, characterized in that: The first conveying component (32) comprises an assembly seat (321), a first cooling block (322) and a first cover plate (323); the assembly seat (321) is mounted on the inner wall of the liquid cooling box (1) at the location of the CPU module; the first cooling block (322) is mounted in the assembly seat (321) and contacts the CPU module; the first cover plate (323) is mounted on the first cooling block (322), and a first pipe (324) is provided on the first cover plate (323); the end of the first pipe (324) away from the first cover plate (323) is connected to the first water outlet (312), and the first pipe (324) communicates the first water outlet (312) with the top surface of the first cooling block (322).

4. The immersion liquid cooling module according to claim 2, characterized in that: The second conveying assembly (33) includes a second cooling block (331) and a second cover plate (332); the second cooling block (331) is mounted on the inner wall of the housing (2) where the GPU module is located and contacts the GPU module; the second cover plate (332) is mounted on the top surface of the second cooling block (331) and is detachably connected to the inner wall of the housing (2); a second pipe (333) is provided on the second cover plate (332); the end of the second pipe (333) away from the second cover plate (332) is connected to the second water outlet (313), and the second pipe (333) communicates the second water outlet (313) with the top surface of the second cooling block (331).

5. The immersion liquid cooling module according to claim 3, characterized in that: A plurality of first fins (325) are provided on the top surface of the first cooling block (322); and first gap channels are provided between adjacent first fins (325).

6. The immersion liquid cooling module according to claim 5, characterized in that: The bottom surface of the first cover plate (323) is provided with a first guide groove (326) arranged in a direction perpendicular to the first fin (325).

7. The immersion liquid cooling module according to claim 5, characterized in that: A diffusion port (327) is provided on the assembly seat (321); the diffusion port (327) is connected to the liquid cooling box (1) and the space where the first fin (325) is located.

8. The immersion liquid cooling module according to claim 4, characterized in that: A plurality of second fins (334) are provided on the top surface of the second cooling block (331); and second gap channels are provided between adjacent second fins (334).

9. The immersion liquid cooling module according to claim 8, characterized in that: The bottom surface of the second cover plate (332) is provided with a second guide groove (335) arranged in a direction perpendicular to the second fin (334).

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