Wafer level LED packaging structure for LED lamp bead production
The threaded connection between the outer shell and the needle sleeve structure solves the problem of dispensing needle stringing affecting the LED chip adhesive, ensuring the luminous effect and packaging quality of the LED light.
Patent Information
- Application Number
- CN202511319502.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-16
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2045-09-16
AI Technical Summary
In existing technologies, when residual adhesive in the dispensing needle is carried out by gas, the adhesive on the LED patch is easily deformed by the gas blowing, which affects the light emission effect of the LED lamp.
The outer shell and dispensing tube are connected by threads. The rotation of the outer shell causes the dispensing tube to move up and down. Combined with the needle tube sleeve, the dispensing needle is wiped, which avoids the gas blowing the glue and solves the problem of stringing.
This technology ensures that the adhesive on the LED chip is not affected when dealing with stringing issues caused by the dispensing needle, thereby improving the luminous effect and packaging quality of the LED light.
Smart Images

Figure CN120790442B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of LED packaging, in particular to a wafer-level LED packaging structure for LED lamp bead production. BACKGROUND
[0002] The LED packaging process is a process of combining a light-emitting diode chip with supporting circuits, heat dissipation components and other components, and achieving sealing protection through packaging materials. This process not only determines the appearance and optical properties of the LED device, but also directly relates to its working life and running stability. According to the differences in packaging structure and material properties, LED packaging can be divided into various technical routes, such as dome packaging, surface mount packaging, integrated module packaging, etc.
[0003] In the actual operation of chip packaging, epoxy resin material is often used for dispensing and fixing. This process may cause the glue to flow downward due to differences in glue viscosity or gravity, making it difficult to separate the chip carrier from the glue interface. When the dispensing needle performs reciprocating motion, a filament-like connection (i.e., the filament phenomenon) is easily formed between the glue and the carrier. If there are too many such connections, it will cause the patch glue to cover the solder pad area of the circuit board, ultimately causing soldering defects.
[0004] A kind of LED patch lamp bead packaging equipment is disclosed in Chinese patent with authorization announcement No. CN116364833B, the equipment includes placing plate, L-shaped plate is installed on the upper end of placing plate, L-shaped plate horizontal section lower end installs encapsulation device, encapsulation device below is placed device installed on the upper end of placing plate, by the encapsulation glue remaining in the rectangular sleeve is discharged to the lamp bead, avoid the filament phenomenon between the encapsulation glue in the rectangular sleeve and the lamp bead when it resets;Gas is discharged from the dispensing needle in this equipment, the residual glue in the dispensing needle can be taken out by the gas when it is discharged, the glue liquid without on the dispensing needle, in this way, the dispensing needle can avoid the filament problem when moving back and forth.
[0005] However, the above-mentioned equipment solves the problem of filament phenomenon during packaging, but the gas discharged from the dispensing needle is easy to blow to the glue liquid on the LED patch, because the glue liquid on the LED patch is just dropped and coated, and has not yet solidified, and is easy to deform when subjected to the blowing of the gas, affecting the light-emitting effect of the LED lamp in the later period. SUMMARY
[0006] The present application provides a wafer-level LED packaging structure for LED lamp bead production, which solves the technical problem that the residual glue in the dispensing needle is taken out by gas in the prior art, but the glue liquid on the LED patch is easy to deform when subjected to the blowing of the gas; and achieves the technical effect that when the filament phenomenon occurs on the dispensing needle, the glue liquid on the LED patch is not affected.
[0007] The application provides a wafer-level LED packaging structure for LED lamp bead production, which comprises a base plate and a dispensing component; a gantry is arranged on the base plate, and a feeding component is arranged on the mesa of the base plate; the dispensing component comprises a fixing block, an outer shell, a needle tube sleeve and a dispensing tube; the fixing block is in sliding connection with the gantry, and the outer shell is in rotational connection with the fixing block; the dispensing tube comprises a tube body, a tube cover and a dispensing needle; the tube body is in threaded connection in the outer shell, the tube cover is detachably mounted on the top opening of the tube body, and the dispensing needle is arranged at the bottom of the tube body; a connecting tube is connected to the top of the tube cover, and one end of the connecting tube, which is away from the tube cover, is connected with an air pump; the air pump is mounted on the gantry; a limiting rod is vertically arranged on the fixing block, a limiting buckle is arranged on the sidewall of the top of the tube body, and the limiting rod is in sliding connection with the limiting buckle; the needle tube sleeve is connected to the bottom of the outer shell, the dispensing needle is in sliding connection with the needle tube sleeve, and the outer wall of the dispensing needle is in abutment with the inner wall of the needle tube sleeve.
[0008] Preferably, an inner driving component is arranged in the fixing block, and an output shaft of the inner driving component is coaxially connected with a driving wheel through the fixing block; the sidewall of the driving wheel is connected with the sidewall of the outer shell, and the driving wheel is used for driving the outer shell to rotate.
[0009] Preferably, an annular sliding rail is arranged on the inner wall of the fixing block, and an annular sliding block is arranged on the outer wall of the outer shell, and the sliding block is in sliding embedding in the sliding rail.
[0010] Preferably, an outer thread is arranged on the sidewall of the tube body, and an inner thread, which is in meshing connection with the outer thread, is arranged on the inner wall of the outer shell.
[0011] Preferably, the needle tube sleeve comprises a mounting shell, a wiping roll and a bottom cover; the top of the mounting shell is coaxially connected with the outer shell, the wiping roll is placed in the mounting shell, and the bottom cover is detachably connected to the bottom of the mounting shell.
[0012] Preferably, a rope groove and a tensioning rope are arranged in the mounting shell, one end of the tensioning rope is connected to the inner wall of the mounting shell, and the other end of the tensioning rope is connected with a counterweight through the rope groove.
[0013] Preferably, the rope groove is an arc-shaped groove, and the tensioning rope is arranged along the rope groove, so that the shape of the part of the tensioning rope in the mounting shell is arc-shaped.
[0014] Preferably, a knocking component is arranged on the outer shell, and the knocking component comprises a plurality of connecting ropes, a plurality of knocking balls and a plurality of telescopic ropes; the plurality of connecting ropes are annularly distributed around the central axis of the outer shell; one end of the connecting rope is connected with the inner wall of the outer shell, and the other end of the connecting rope is connected with the knocking ball; one telescopic rope is connected between two adjacent knocking balls.
[0015] Preferably, when the knocking ball abuts against the outer shell, the telescopic rope is in a relaxed state.
[0016] The one or more technical solutions provided in the application have at least the following technical effects or advantages:
[0017] By setting the threaded shell and the glue dispensing pipe, the shell drives the glue dispensing pipe to move up and down during rotation, and the bottom of the shell is provided with a needle tube sleeve, which can wipe the glue dispensing needle as the needle tube sleeve rotates with the shell and the glue dispensing needle moves up and down in the glue dispensing pipe; The technical problem that the residual glue in the glue dispensing needle is blown out by gas in the prior art, but the glue liquid on the LED patch is easily deformed by the gas; The technical effect that when the glue dispensing needle is treated to have a wire drawing phenomenon, the glue liquid on the LED patch is not affected. BRIEF DESCRIPTION OF DRAWINGS
[0018] Figure 1 It is a whole schematic view of the wafer-level LED packaging structure for LED lamp bead production of the application;
[0019] Figure 2 It is a glue dispensing component structure schematic view of the wafer-level LED packaging structure for LED lamp bead production of the application;
[0020] Figure 3 It is a fixing block structure schematic view of the wafer-level LED packaging structure for LED lamp bead production of the application;
[0021] Figure 4 It is an outer shell and pipe assembly schematic view of the wafer-level LED packaging structure for LED lamp bead production of the application;
[0022] Figure 5 It is a needle tube sleeve structure schematic view of the wafer-level LED packaging structure for LED lamp bead production of the application;
[0023] Figure 6 It is a counterweight block schematic view of the wafer-level LED packaging structure for LED lamp bead production of the application;
[0024] Figure 7 It is a tensioning rope schematic view of the wafer-level LED packaging structure for LED lamp bead production of the application;
[0025] Figure 8 It is a tensioning rope tensioning and wiping roll schematic view of the wafer-level LED packaging structure for LED lamp bead production of the application;
[0026] Figure 9 It is a knocking component structure schematic view of the wafer-level LED packaging structure for LED lamp bead production of the application.
[0027] In the figure: 100, the bottom plate; 110, the gantry; 111, the air pump; 112, the connecting pipe; 113, the sliding drive part; 120, the feeding part; 200, the dispensing part; 210, the fixed block; 211, the inner drive part; 212, the drive wheel; 213, the limiting rod; 220, the outer shell; 230, the needle tube sleeve; 231, the mounting shell; 232, the wiping roll; 233, the bottom cover; 234, the tensioning rope; 235, the counterweight; 240, the dispensing tube; 241, the tube body; 242, the tube cover; 243, the dispensing needle; 244, the limiting buckle; 300, the knocking part; 310, the connecting rope; 320, the knocking ball; 330, the telescopic rope. DETAILED DESCRIPTION
[0028] In order to facilitate the understanding of the present application, the present application will be described in more detail below with reference to the relevant drawings; the preferred embodiments of the present application are shown in the drawings, but the present application can be implemented in many different forms and is not limited to the embodiments described herein; on the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.
[0029] It should be noted that the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are only for illustrative purposes and do not represent the only embodiment.
[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs; the terms used herein in the specification of the present application are only for the purpose of describing the specific embodiments and are not intended to limit the present application; the term "and / or" used herein includes any and all combinations of one or more related listed items.
[0031] Embodiment: As shown in the figure, the wafer-level LED packaging structure for LED lamp bead production of the present application comprises a bottom plate 100, a dispensing part 200, a power assembly and a control unit. Figure 1
[0032] Among them, the power assembly is used to provide energy for the operation of the packaging structure, preferably an alternating current power supply or a battery; the control unit is used to control the coordinated operation of each component of the packaging structure, preferably a programmable logic controller; both are prior art and will not be described here.
[0033] The bottom plate 100 is provided with a gantry 110, and the dispensing part 200 is slidingly arranged on the gantry 110.
[0034] Optionally, the dispensing component 200 is slidably arranged on the gantry 110 through a sliding driving component 113, which can be a linear guide rail assembly. The linear guide rail assembly is a prior art and will not be described here.
[0035] The feeding component 120 is arranged on the table top of the base plate 100.
[0036] It should be noted that the feeding component 120 can be a conveyor belt device or a conveyor plate assembly, and the LED chips to be packaged are arranged on the feeding component 120. The feeding component 120 is a common structure in the prior art and will not be described here.
[0037] The moving direction of the dispensing component 200 on the gantry 110 is perpendicular to the feeding direction of the feeding component 120.
[0038] Optionally, the gantry 110 is slidably arranged on the base plate 100 through a linear guide rail assembly, and the sliding direction of the gantry 110 on the base plate 100 is the same as the feeding direction of the feeding component 120.
[0039] The dispensing component 200 comprises a fixing block 210, an outer shell 220, a needle tube sleeve 230, and a dispensing tube 240.
[0040] The fixing block 210 is slidably connected with the gantry 110.
[0041] It should be noted that the fixing block 210 can be mounted on a linear guide rail assembly, and the linear guide rail assembly drives the fixing block 210 to move, thereby driving the dispensing tube 240 to move.
[0042] The outer shell 220 is a circular tube structure, and the outer shell 220 is rotatably connected with the fixing block 210.
[0043] As shown in Figure 3 The inner wall of the fixing block 210 is provided with an annular sliding rail, and the outer wall of the outer shell 220 is provided with an annular sliding block, and the sliding block is slidably embedded in the sliding rail.
[0044] The central axis of the outer shell 220 is vertically arranged.
[0045] The dispensing tube 240 comprises a tube body 241, a tube cover 242, and a dispensing needle 243.
[0046] The tube body 241 is threadedly connected in the outer shell 220, the tube cover 242 is detachably mounted on the top opening of the tube body 241, and the dispensing needle 243 is arranged at the bottom of the tube body 241.
[0047] The tube body 241 is a circular tube structure, and the tube body 241 is coaxially arranged with the outer shell 220.
[0048] It should be noted that the pipe cover 242 can be threadedly connected on the top opening of the pipe body 241, the pipe body 241 stores encapsulation glue liquid, and the glue injection needle 243 is used for injecting the glue liquid on the LED chip.
[0049] Optionally, the inner part of the outer shell 220 can be embedded with a temperature control component, such as an electric heating wire, for adjusting the temperature of the glue liquid in the pipe body 241. The temperature control component is prior art, and will not be described here.
[0050] The top of the pipe cover 242 is connected with the connecting pipe 112, and the end of the connecting pipe 112 away from the pipe cover 242 is connected with the air pump 111.
[0051] The air pump 111 can be installed on the gantry 110.
[0052] It should be noted that the connecting pipe 112 has a certain length, so that the glue injection pipe 240 moves on the gantry 110 without being affected by the connecting pipe 112, and the air pump 111 and the glue injection pipe 240 are staggered, and the air pump 111 is prior art, which will not be described here.
[0053] As shown in Figure 4 , the side wall of the pipe body 241 is provided with external threads, and the inner wall of the outer shell 220 is provided with internal threads engaged with the external threads.
[0054] As shown in Figure 2 , Figure 3 and Figure 4 , the fixing block 210 is vertically provided with a limiting rod 213, and the top side wall of the pipe body 241 is provided with a limiting buckle 244, and the limiting rod 213 slides through the limiting buckle 244.
[0055] Among them, the limiting buckle 244 is provided with a limiting opening, and the limiting rod 213 passes through the limiting opening.
[0056] As shown in Figure 2 and Figure 4 , the bottom of the outer shell 220 is connected with a needle tube sleeve 230.
[0057] The glue injection needle 243 slides through the needle tube sleeve 230, and the outer wall of the glue injection needle 243 is attached to the inner wall of the needle tube sleeve 230.
[0058] It should be noted that in this embodiment, the inner layer of the needle tube sleeve 230 is superfine fiber dust-free cloth or sub-superfine fiber dust-free cloth, which can wipe the glue injection needle 243.
[0059] As shown in Figure 2 , Figure 3 and Figure 4As shown, in another embodiment of the present application, the fixing block 210 is internally provided with an inner driving component 211, and an output shaft of the inner driving component 211 is coaxially connected with the driving wheel 212 through the fixing block 210.
[0060] The inner driving component 211 can be a small rotary motor, and the small rotary motor has a function of forward and reverse rotation and self-locking.
[0061] The side wall of the driving wheel 212 is connected with the side wall of the outer shell 220, and the driving wheel 212 is used to drive the outer shell 220 to rotate.
[0062] It should be noted that the transmission mode of the driving wheel 212 and the outer shell 220 can be gear transmission, at this time, the structure of the driving wheel 212 is a gear structure, and a ring-shaped tooth is correspondingly formed on the side wall of the outer shell 220; the transmission mode of the driving wheel 212 and the outer shell 220 can also be friction transmission, at this time, the structure of the driving wheel 212 is a friction wheel; the transmission mode of the driving wheel 212 and the outer shell 220 is prior art, and will not be described in detail here.
[0063] Optionally, the bottom of the needle sleeve 230 can be provided with an image acquisition component (not shown in the figure), such as an industrial camera, which is used to acquire the position information of the dispensing needle 243, so that after the dispensing needle 243 is lowered to a specified height, the distance between the dispensing needle 243 and the LED chip is appropriate, and the dispensing packaging can be smoothly performed.
[0064] It can be understood that in the embodiment, the driving wheel 212 is driven to rotate by the inner driving part 211, and then the outer shell 220 is driven to rotate; under the limitation of the limiting buckle 244 and the limiting rod 213, the glue dispensing pipe 240 can only move up and down and is difficult to rotate, and when the outer shell 220 rotates, the glue dispensing pipe 240 can move up or down under the transmission effect of the inner thread and the outer thread; when glue dispensing is needed, the outer shell 220 rotates forward (for example, rotates clockwise) to drive the glue dispensing pipe 240 to move downward, and after the glue dispensing pipe 240 moves to a suitable height, the air pump 111 pumps air into the pipe body 241 through the connecting pipe 112, and under the action of air pressure, the glue dispensing pipe 240 dispenses and encapsulates the LED chip, and after the encapsulation is completed, the outer shell 220 rotates reversely (for example, rotates counterclockwise) to drive the glue dispensing pipe 240 to move upward, and in the process of moving upward of the glue dispensing pipe 240, the glue dispensing part 200 is translated to above the next LED chip to be encapsulated under the action of the sliding driving part 113; when the glue dispensing and encapsulation of the LED chips in the same row are completed, the feeding part 120 can be driven to move the LED chips; or the gantry 110 can be translated along the bottom plate 100, so that the glue dispensing pipe 240 can continuously dispense and encapsulate the subsequent LED chips; in addition, with the upward and downward movement of the glue dispensing needle 243, the glue dispensing needle 243 will axially rub against the inner layer of the needle tube sleeve 230, and at the same time, because the outer shell 220 rotates, the glue dispensing needle 243 will radially rub against the inner layer of the needle tube sleeve 230, so that the inner layer of the needle tube sleeve 230 can clean and wipe the glue remaining on the glue dispensing needle 243 in real time; with the upward and downward movement of the glue dispensing needle 243 before and after dispensing and the translation of the glue dispensing part 200 as a whole, even if the glue dispensing needle 243 appears to be wired (the glue on the glue dispensing needle 243 is connected to the glue on the chip in a wire shape), the wire connection will be disconnected in the sudden movement of the glue dispensing needle 243; and after being wiped by the needle tube sleeve 230, the wired phenomenon can be reduced, and the wired phenomenon caused by overflow of glue from the glue dispensing needle 243 can be avoided; the glue dispensing needle 243 can be retracted into the needle tube sleeve 230 when not in use, which can protect the glue dispensing needle 243 to a certain extent.
[0065] It should be noted that a plurality of glue dispensing parts 200 can be arranged on the gantry 110, and the plurality of glue dispensing parts 200 can simultaneously dispense and encapsulate the LED chips; at this time, the connecting pipe 112 is the same as the number of glue dispensing parts 200 and one-to-one correspondence, and the air pump 111 is a multi-output gas delivery assembly (which is prior art).
[0066] Alternatively, the number of glue dispensing parts 200 is 2 to 6.
[0067] Further, as Figure 5 and Figure 6As shown, in another embodiment of the present application, the needle sleeve 230 comprises a mounting shell 231, a wiping roll 232 and a bottom cover 233.
[0068] The top of the mounting shell 231 is coaxially connected with the outer shell 220, the wiping roll 232 is placed in the mounting shell 231, and the bottom cover 233 is detachably connected to the bottom of the mounting shell 231.
[0069] The bottom cover 233 is threadedly connected to the bottom of the mounting shell 231.
[0070] It should be noted that the top opening radius of the mounting shell 231 is the same as the outer radius of the dispensing needle 243, and the bottom opening radius of the mounting shell 231 is the same as the outer radius of the wiping roll 232; the wiping roll 232 is a through cylinder, and the inner radius of the wiping roll 232 is the same as the outer radius of the dispensing needle 243.
[0071] It should be noted that the wiping roll 232 can be supported by ultra-fine fiber dust-free cloth or sub-ultra-fine fiber dust-free cloth.
[0072] It can be understood that by unscrewing the bottom cover 233, the wiping roll 232 inside the mounting shell 231 can be taken out for replacement, avoiding secondary pollution of the dispensing needle 243 caused by long-term use, reducing the glue residue on the dispensing needle 243, and improving the quality of LED dispensing packaging.
[0073] It should be noted that since the wiping roll 232 is placed inside the mounting shell 231, and the inner wall of the wiping roll 232 is in contact with the dispensing needle 243, and the outer wall of the wiping roll 232 is in contact with the mounting shell 231, when the outer shell 220 rotates to drive the needle sleeve 230 to rotate, there is a friction force between the mounting shell 231 and the wiping roll 232, and there is also a friction force between the wiping roll 232 and the dispensing needle 243, which causes displacement difference between the wiping roll 232 and the dispensing needle 243, and a certain displacement difference between the mounting shell 231 and the wiping roll 232 (for example, the dispensing needle 243 does not rotate, the mounting shell 231 rotates three turns, and the wiping roll 232 only rotates one and a half turns), which causes the contact position between the wiping roll 232 and the dispensing needle 243 to be not constant during each dispensing of the dispensing needle 243, so that the dispensing needle 243 can be more uniformly in contact with the inner wall of the wiping roll 232, and the glue residue on the dispensing needle 243 can be distributed at different positions of the inner wall of the wiping roll 232, rather than accumulated together, improving the wiping effect and service life of the wiping roll 232, and further reducing the glue residue of the dispensing needle 243.
[0074] As Figure 4As shown, during the moving up of the dispensing component 200, the space formed by the bottom of the outer shell 220, the top of the needle sleeve 230 and the dispensing component 200 becomes larger, so that this part of the space is in a negative pressure state, and the wiping roll 232 is made of flexible material, which tends to be tightened to stick to the dispensing needle 243 under the action of the negative pressure, so that the friction between the dispensing needle 243 and the wiping roll 232 increases, and the wiping effect of the wiping roll 232 is better; during the moving down of the dispensing component 200, the space formed by the bottom of the outer shell 220, the top of the needle sleeve 230 and the dispensing component 200 becomes smaller, so that this part of the space is in a positive pressure state, and the wiping roll 232 is made of flexible material, which tends to expand away from the dispensing needle 243 under the action of the positive pressure, so that the friction between the dispensing needle 243 and the wiping roll 232 decreases, and the dispensing needle 243 can better extend out of the wiping roll 232 for dispensing packaging.
[0075] As shown in the drawings, Figures 5 to 8 The installation shell 231 is internally provided with a rope groove and a tensioning rope 234, one end of the tensioning rope 234 is connected to the inner wall of the installation shell 231, and the other end of the tensioning rope 234 passes out of the installation shell 231 along the rope groove and is connected with the counterweight 235.
[0076] The tensioning rope 234 is located outside the wiping roll 232.
[0077] It should be noted that the rope groove is an arc-shaped groove, and the tensioning rope 234 is arranged along the rope groove, so that the part of the tensioning rope 234 located in the installation shell 231 is arc-shaped (not in a taut state).
[0078] It should be noted that the rope groove, the tensioning rope 234 and the counterweight 235 are the same in number and correspond to each other, the number of the tensioning rope 234 can be multiple, and the multiple tensioning ropes 234 are arranged staggered.
[0079] It can be understood that, with the rotation of the outer shell 220 driving the needle sleeve 230, the counterweight 235 will pull the tensioning rope 234 under the action of centrifugal force, and the tensioning rope 234 will exert a squeezing force on the wiping roll 232, so that the friction between the wiping roll 232 and the dispensing needle 243 increases, and the wiping roll 232 can play a better wiping role; during the moving down of the dispensing component 200, the space formed by the bottom of the outer shell 220, the top of the needle sleeve 230 and the dispensing component 200 becomes smaller, so that this part of the space is in a positive pressure state, and the wiping roll 232 is made of flexible material, which tends to expand away from the dispensing needle 243 under the action of the positive pressure, so that the tensioning rope 234 can reset under the driving of the wiping roll 232, the friction between the dispensing needle 243 and the wiping roll 232 decreases, and the dispensing needle 243 can better extend out of the wiping roll 232 for dispensing packaging.
[0080] It should be noted that the mass and material of the counterweight 235 are selected according to actual needs, which are not described here; the length of the tensioning rope 234 is selected according to the length of the rope groove, so that the tensioning rope 234 and the counterweight 235 will not contact the glue dispensing needle 243.
[0081] Further, as shown in Figure 2 and Figure 9 , the outer shell 220 is provided with a knocking component 300, which includes a plurality of connecting ropes 310, a plurality of knocking balls 320 and a plurality of elastic ropes 330.
[0082] Among them, the number of connecting ropes 310 and knocking balls 320 is the same and one-to-one correspondence.
[0083] A plurality of connecting ropes 310 are annularly distributed around the central axis of the outer shell 220.
[0084] One end of the connecting rope 310 is connected with the inner wall of the outer shell 220, and the other end of the connecting rope 310 is connected with the knocking ball 320.
[0085] Among them, a plurality of knocking balls 320 are annularly distributed around the central axis of the outer shell 220, and the connecting rope 310 can be a nylon rope.
[0086] A plurality of elastic ropes 330 are connected between adjacent two knocking balls 320.
[0087] Specifically, the two ends of the elastic rope 330 are connected with the adjacent two knocking balls 320 respectively.
[0088] Optionally, when the knocking ball 320 abuts against the outer shell 220, the elastic rope 330 is in a relaxed state.
[0089] Optionally, the elastic rope 330 can be an elastic rope
[0090] It should be noted that the number of knocking components 300 can be multiple, and the plurality of knocking components 300 are distributed along the axial direction of the outer shell 220, and the plurality of knocking components 300 are arranged staggered.
[0091] Optionally, the number of knocking components 300 can be two.
[0092] It should be noted that the mass and material of the knocking ball 320 are selected according to actual needs, which are not described here; the length of the elastic rope 330 is selected according to actual needs, which is not described here.
[0093] It can be understood that, with the rotation of the outer shell 220, the knocking ball 320 is thrown away under the centrifugal force, so that the knocking ball 320 is far away from the outer shell 220; when the outer shell 220 stops rotating, under the restriction of the connecting rope 310 and the telescopic rope 330, the knocking ball 320 collides directly with the outer shell 220, so that the outer shell 220 vibrates, and then the vibration is conducted to the dispensing pipe 240, so that the glue liquid in the dispensing pipe 240 vibrates, and then the air bubbles in the glue liquid are shaken out, the quality of dispensing packaging of the dispensing pipe 240 is improved; in addition, since the knocking ball 320 does not directly collide with the dispensing pipe 240, it will not hinder the up and down movement of the dispensing pipe 240, and will not cause direct damage to the dispensing pipe 240.
[0094] The preferred embodiments of the present application have been described above with the aid of drawings and are not intended to limit the present application, and various modifications and changes can be made by those skilled in the art based on the principles of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A wafer-level LED packaging structure for LED lamp bead production, characterized in that, The bottom plate (100) and the dispensing component (200) are included. The gantry (110) is arranged on the bottom plate (100), and the feeding component (120) is arranged on the table top of the bottom plate (100); The dispensing component (200) includes a fixed block (210), an outer shell (220), a needle tube sleeve (230) and a dispensing tube (240); The fixed block (210) is in sliding connection with the gantry (110), and the outer shell (220) is in rotational connection with the fixed block (210); The dispensing tube (240) includes a tube body (241), a tube cover (242) and a dispensing needle (243); The tube body (241) is in threaded connection in the outer shell (220), the tube cover (242) is detachably installed on the top opening of the tube body (241), and the dispensing needle (243) is arranged at the bottom of the tube body (241); The top of the tube cover (242) is connected with a connecting pipe (112), and the end, away from the tube cover (242), of the connecting pipe (112) is connected with the air pump (111); The air pump (111) is installed on the gantry (110); The fixed block (210) is vertically provided with a limiting rod (213), and the top side wall of the tube body (241) is provided with a limiting buckle (244), and the limiting rod (213) slides through the limiting buckle (244); The bottom of the outer shell (220) is connected with the needle tube sleeve (230), the dispensing needle (243) slides through the needle tube sleeve (230), and the outer wall of the dispensing needle (243) is attached to the inner wall of the needle tube sleeve (230); The needle tube sleeve (230) includes an installation shell (231), a wiping roll (232) and a bottom cover (233); The top of the installation shell (231) is coaxially connected with the outer shell (220), the wiping roll (232) is placed in the installation shell (231), and the bottom cover (233) is detachably connected at the bottom of the installation shell (231); The inside of the installation shell (231) is provided with a rope groove and a tensioning rope (234), one end of the tensioning rope (234) is connected to the inner wall of the installation shell (231), and the other end of the tensioning rope (234) passes out of the installation shell (231) along the rope groove and is connected with a counterweight (235); The rope groove is an arc-shaped groove, and the tensioning rope (234) is arranged along the rope groove, so that the shape of the part of the tensioning rope (234) located in the installation shell (231) is arc-shaped; The outer shell (220) is provided with a knocking component (300), and the knocking component (300) includes a plurality of connecting ropes (310), a plurality of knocking balls (320) and a plurality of telescopic ropes (330); The plurality of connecting ropes (310) are annularly distributed around the central axis of the outer shell (220); One end of the connecting rope (310) is connected with the inner wall of the outer shell (220), and the other end of the connecting rope (310) is connected with the knocking ball (320); Adjacent two knocking balls (320) are connected with one telescopic rope (330).
2. The wafer-level LED package structure for LED lamp bead production of claim 1, wherein, The inside of the fixed block (210) is provided with an inner driving component (211), and the output shaft of the inner driving component (211) passes through the fixed block (210) and is coaxially connected with the driving wheel (212); The side wall of the driving wheel (212) is connected with the side wall of the outer shell (220), and the driving wheel (212) is used for driving the outer shell (220) to rotate.
3. The wafer-level LED package structure for LED lamp bead production of claim 1, wherein, An annular sliding rail is arranged on the inner wall of the fixed block (210), and an annular sliding block is arranged on the outer wall of the outer shell (220) and is slidingly embedded in the sliding rail.
4. The wafer-level LED package structure for LED lamp bead production of claim 1, wherein, An outer thread is arranged on the side wall of the pipe body (241), and an inner thread that is engaged with the outer thread is arranged on the inner wall of the outer shell (220).
5. The wafer-level LED package structure for LED lamp bead production of claim 1, wherein, When the knocking ball (320) abuts against the outer shell (220), the elastic rope (330) is in a relaxed state.
Citation Information
Patent Citations
A packaging equipment for LED chip lamp beads
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