Preparation method of sanding electroplating liquid for high-dispersion electroplating diamond wire

Abstract

The invention belongs to the technical field of electroplating diamond wire production, and discloses a high-dispersion sanding electroplating solution for an electroplating diamond wire. Firstly, a dispersing agent is prepared by mixing a hydrogen bond acceptor and an alcohol hydrogen bond donor under specific conditions, and the hydrogen bond acceptor comprises a nonionic surfactant containing polyhydroxy, ether bonds or amido and a cationic surfactant containing polar groups capable of forming hydrogen bonds; the alcohol hydrogen bond donor is selected from short-chain alcohol and polyhydric alcohol; secondly, carborundum is added into a dispersing agent, and carborundum dispersion liquid with good dispersity is obtained through stirring; and finally, adding the emery dispersion liquid into the nickel aminosulfonate plating liquid to obtain the emery electroplating liquid with better dispersity. A hydrogen bond network is formed by a hydrogen bond acceptor and alcohols, so that the melting point of a system is reduced, the dispersion uniformity of carborundum in electroplating liquid is remarkably improved, and agglomeration is avoided; the preparation method is simple, convenient and low in cost, can effectively improve the electroplating quality, prolongs the service life of the diamond wire, improves the cutting efficiency, and has good industrial application value.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of electroplated diamond wire production, and particularly relates to a preparation method of a high-dispersion sanding electroplating solution for electroplated diamond wire. BACKGROUND

[0002] Diamond wire is a cutting tool made by firmly holding high-hardness and high-wear-resistance diamond abrasive grains on a steel wire substrate through electroplating. Electroplated diamond wire has the advantages of high cutting efficiency, small sawing force, neat sawing seam, smooth cutting surface, high material yield, low noise, and small environmental pollution, and is not only suitable for processing ordinary hard and brittle materials such as stone and glass, but also particularly suitable for sawing valuable hard and brittle materials such as ceramics, gemstones and crystal.

[0003] In the production process of electroplated diamond wire, the dispersibility of diamond sand in the electroplating solution directly affects the electroplating quality and the performance of diamond wire. The traditional dispersion method has problems such as poor dispersion effect and poor stability, which leads to uneven distribution of diamond sand on the surface of diamond wire and reduces the cutting efficiency and service life of the product. Therefore, it is of great significance to develop a high-dispersion sanding electroplating solution for improving the production quality of electroplated diamond wire. SUMMARY

[0004] The application aims to provide a sanding electroplating solution and a preparation method thereof, which significantly improve the dispersibility of diamond sand in the production of electroplated diamond wire by combining a specific surfactant with an alcohol hydrogen bond donor, thereby improving the quality and performance of electroplated diamond wire.

[0005] The preparation method of the high-dispersion sanding electroplating solution for electroplated diamond wire comprises the following steps:

[0006] (1) Preparation of dispersant:

[0007] Mix the hydrogen bond acceptor and the alcohol hydrogen bond donor at a molar ratio of 1:2 to 1:8, stir and react at 50-90℃ for 1-3 hours, and cool to room temperature to obtain the sanding dispersant;

[0008] (2) Add diamond sand to the sanding dispersant of step (1), control the temperature of the sanding dispersant to be 25-60℃, stir for 10-30 minutes after pouring into the diamond sand, and obtain a diamond sand dispersion liquid with good dispersibility;

[0009] (3) Add the diamond sand dispersion liquid obtained in step (2) to the nickel sulfamate plating solution, control the temperature of the nickel sulfamate plating solution to be 25-60℃, and stir for 20-50 minutes to obtain a sanding electroplating solution with good dispersibility, which is used for subsequent electroplated diamond wire production.

[0010] Further, in step (1), the hydrogen bond acceptor includes, but is not limited to, non-ionic surfactants containing polyhydroxy, ether bond or amide group, and cationic surfactants containing hydrogen bond forming polar groups.

[0011] Further, in step (1), the alcohol hydrogen bond donor is selected from one or more of short-chain alcohol and polyhydric alcohol.

[0012] Further, in step (2), the ratio of the amount of corundum to the amount of corundum dispersant is 1000g: 1000mL-1500mL.

[0013] Further, in step (3), the temperature of both the corundum dispersion and the nickel sulfamate plating solution is maintained at 25-60℃ before the corundum dispersion is added to the nickel sulfamate plating solution.

[0014] Further, in step (3), the ratio of the amount of corundum dispersion to the amount of nickel sulfamate plating solution is 1000g: 1000mL-2000mL, and the mass concentration of nickel sulfamate in the nickel sulfamate plating solution is 1-6%.

[0015] The beneficial effects of the present application compared to the prior art are:

[0016] The corundum particles treated by the method of the present application are not adhered to each other, and the method of the present application can greatly improve the dispersibility of corundum. The method of the present application has high treatment efficiency and can achieve the purpose of batch dispersion control of plated sand, reduce the difference between dispersion batches, and improve production efficiency.

[0017] The present application uses boiling deionized water to prepare an amino sulfonic acid solution, which can improve the surface activity of plated sand. The nickel sulfamate plating solution and the dispersant are added to the corundum at 50℃ to improve the compatibility of the solution and the corundum. The nickel sulfamate plating solution is acidic and can remove impurities on the surface of the diamond during activation, thereby improving the purity of the corundum. The dispersant can inhibit the adhesion between the corundum particles and keep the particles in a good dispersed state. In addition, the present application strictly controls the proportion of corundum, nickel sulfamate plating solution, dispersant and plating solution to simulate the environment of the corundum during production. At the same time, the surface activity of the corundum is improved and stabilized, so that the use effect of the plated sand reaches the best. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is the electron microscope photo of the corundum plated sand by the method of Example 6 of the present application;

[0019] Figure 2 is the electron microscope photo of the corundum plated sand without adding dispersant. DETAILED DESCRIPTION

[0020] The present application will be further described below in conjunction with specific examples.

[0021] Example 1

[0022] The high-dispersion electroplating gold wire with sand electroplating solution comprises the following steps:

[0023] (1) Mix polyvinylpyrrolidone K30 and polyethylene glycol 200 at a mass ratio of 1:4, stir and react at 50℃ for 3 hours, and cool to room temperature to obtain dispersant No. 1 (DES1);

[0024] (2) According to the ratio of 1000g of diamond sand and 1500mL of DES1, add diamond sand into DES1, control the temperature of DES1 at 60℃, and stir for 30 minutes after pouring the diamond sand to obtain a diamond sand dispersion liquid with good dispersibility;

[0025] (3) Add the nickel sulfamate plating solution into boiling deionized water to prepare a nickel sulfamate plating solution with a mass concentration of 1%, according to the ratio of 1000g of diamond sand dispersion liquid and 1000mL of electroplating solution, add the diamond sand dispersion liquid obtained in step (2) into the nickel sulfamate plating solution, control the temperature of the nickel sulfamate plating solution at 60℃, and stir for 50 minutes to obtain a sand electroplating solution with good dispersibility for subsequent electroplating diamond wire production.

[0026] Example 2

[0027] (1) Mix oleylamine and n-butanol at a molar ratio of 1:2, stir and react at 90℃ for 1 hour, and cool to room temperature to obtain dispersant No. 2 (DES2);

[0028] (2) According to the ratio of 1000g of diamond sand and 1500mL of DES2, add diamond sand into DES2, control the temperature of DES2 at 25℃, and stir for 10 minutes after pouring the diamond sand to obtain a diamond sand dispersion liquid with good dispersibility;

[0029] (3) Add the nickel sulfamate plating solution into boiling deionized water to prepare a nickel sulfamate plating solution with a mass concentration of 6%, according to the ratio of 1000g of diamond sand dispersion liquid and 1500mL of electroplating solution, add the diamond sand dispersion liquid obtained in step (2) into the nickel sulfamate plating solution, control the temperature of the nickel sulfamate plating solution at 25℃, and stir for 20 minutes to obtain a sand electroplating solution with good dispersibility for subsequent electroplating diamond wire production.

[0030] Example 3

[0031] (1) Mix tetradecyltrimethylammonium chloride and glycerol at a molar ratio of 1:8, stir and react at 50℃ for 2 hours, and cool to room temperature to obtain dispersant No. 3 (DES3);

[0032] (2) According to the proportion of 1000g of corundum and 1500mL of dispersant, the corundum is added to DES3, the temperature of DES3 is controlled to be 30℃, and stirring is performed for 10 minutes after pouring the corundum, to obtain a corundum dispersion liquid with good dispersibility;

[0033] (3) The nickel sulfamate plating solution is added to boiling deionized water to prepare a nickel sulfamate plating solution with a mass concentration of 2%, the corundum dispersion liquid obtained in step (2) is added to the nickel sulfamate plating solution according to the proportion of 1000g of corundum dispersion liquid and 1400mL of plating solution, the temperature of the nickel sulfamate plating solution is controlled to be 30℃, and stirring is performed for 40 minutes, to obtain a corundum plating solution with good dispersibility, which is used for subsequent production of corundum wire plating.

[0034] Example 4:

[0035] (1) Polyethylene glycol hexadecyl ether is mixed with isopropyl alcohol at a molar ratio of 1:8, stirring is performed at 80℃ for 1 hour, and then the mixture is cooled to room temperature, to obtain dispersant No. 4 (DES4);

[0036] (2) According to the proportion of 1000g of corundum and 1500mL of dispersant, the corundum is added to DES4, the temperature of DES4 is controlled to be 25℃, and stirring is performed for 10 minutes after pouring the corundum, to obtain a corundum dispersion liquid with good dispersibility;

[0037] (3) The nickel sulfamate plating solution is added to boiling deionized water to prepare a nickel sulfamate plating solution with a mass concentration of 4%, the corundum dispersion liquid obtained in step (2) is added to the nickel sulfamate plating solution according to the proportion of 1000g of corundum dispersion liquid and 1800mL of plating solution, the temperature of the nickel sulfamate plating solution is controlled to be 25℃, and stirring is performed for 50 minutes, to obtain a corundum plating solution with good dispersibility, which is used for subsequent production of corundum wire plating.

[0038] Example 5:

[0039] (1) Oil amine is mixed with ethylene glycol at a molar ratio of 1:4, stirring is performed at 60℃ for 1 hour, and then the mixture is cooled to room temperature, to obtain dispersant No. 5 (DES5);

[0040] (2) According to the proportion of 1000g of corundum and 1400mL of dispersant, the corundum is added to DES5, the temperature of DES5 is controlled to be 40℃, and stirring is performed for 20 minutes after pouring the corundum, to obtain a corundum dispersion liquid with good dispersibility;

[0041] (3) The nickel sulfamate plating solution is added to the boiling deionized water to prepare a nickel sulfamate plating solution with a mass concentration of 6%. The diamond sand dispersion solution obtained in step (2) is added to the nickel sulfamate plating solution at a ratio of 1000 g: 2000 mL, and the temperature of the nickel sulfamate plating solution is controlled at 40°C. After stirring for 30 minutes, a diamond sand plating solution with good dispersion is obtained, which is used for subsequent production of electroplated diamond wire.

[0042] Example 6:

[0043] (1) Polyethylene glycol 200 is mixed with ethylene glycol at a molar ratio of 1:4, and stirred at 80°C for 1 hour. After cooling to room temperature, dispersion agent No. 6 (DES6) is obtained.

[0044] (2) Diamond sand is added to DES6 at a ratio of 1000 g: 1300 mL, and the temperature of DES6 is controlled at 50°C. After stirring for 20 minutes after pouring in the diamond sand, a diamond sand dispersion solution with good dispersion is obtained.

[0045] (3) The nickel sulfamate plating solution is added to the boiling deionized water to prepare a nickel sulfamate plating solution with a mass concentration of 6%. The diamond sand dispersion solution obtained in step (2) is added to the nickel sulfamate plating solution at a ratio of 1000 g: 1800 mL, and the temperature of the nickel sulfamate plating solution is controlled at 50°C. After stirring for 50 minutes, a diamond sand plating solution with good dispersion is obtained, which is used for subsequent production of electroplated diamond wire.

[0046] Figure 1 The electron microscope photo of the electroplated diamond wire using DES6 dispersant. DES6, with the help of steric hindrance effect, builds a physical barrier between diamond particles with its long chain structure, hindering the agglomeration between particles, so that the diamond powder is more evenly distributed on the surface of the plating layer. Compared with Figure 2 without the addition of DES6, the size of the diamond cluster is significantly reduced, the degree of concave-convex on the surface of the plating layer is reduced, the dispersion of diamond particles is more regular, and the agglomeration phenomenon is significantly alleviated, which reflects the improvement of the dispersion stability of diamond powder in the plating solution by DES6, and is beneficial to optimizing the cutting performance and service life of the electroplated diamond wire.

[0047] Example 7:

[0048] (1) Polyethylene glycol hexadecyl ether is mixed with glycerol at a molar ratio of 1:8, and stirred at 90°C for 3 hours. After cooling to room temperature, dispersion agent No. 7 (DES7) is obtained.

[0049] (2) According to the proportion of 1000 g of corundum and 1200 mL of dispersant, the corundum is added to the DES 7, the temperature of the DES 7 is controlled to be 50°C, and after pouring the corundum, stirring is performed for 20 minutes to obtain a corundum dispersion liquid with good dispersibility;

[0050] (3) The nickel sulfamate plating solution is added to the boiling deionized water to prepare a nickel sulfamate plating solution with a mass concentration of 6%, the corundum dispersion liquid obtained in step (2) is added to the nickel sulfamate plating solution according to the proportion of 1000 g of corundum dispersion liquid and 1600 mL of plating solution, the temperature of the nickel sulfamate plating solution is controlled to be 50°C, and stirring is performed for 50 minutes to obtain a corundum plating solution with good dispersibility, which is used for subsequent production of corundum wire plating.

[0051] Example 8:

[0052] (1) Cetyltrimethylammonium chloride and glycerol are mixed according to a molar ratio of 1:6, stirring is performed at 60°C for 2 hours, and the mixture is cooled to room temperature to obtain dispersant No. 8 (DES 8);

[0053] (2) According to the proportion of 1000 g of corundum and 1300 mL of dispersant, the corundum is added to the DES 8, the temperature of the DES 8 is controlled to be 30°C, and after pouring the corundum, stirring is performed for 20 minutes to obtain a corundum dispersion liquid with good dispersibility;

[0054] (3) The nickel sulfamate plating solution is added to the boiling deionized water to prepare a nickel sulfamate plating solution with a mass concentration of 4%, the corundum dispersion liquid obtained in step (2) is added to the nickel sulfamate plating solution according to the proportion of 1000 g of corundum dispersion liquid and 1600 mL of plating solution, the temperature of the nickel sulfamate plating solution is controlled to be 30°C, and stirring is performed for 40 minutes to obtain a corundum plating solution with good dispersibility, which is used for subsequent production of corundum wire plating.

[0055] Example 9:

[0056] (1) Oleylamine and n-butanol are mixed according to a molar ratio of 1:4, stirring is performed at 80°C for 1 hour, and the mixture is cooled to room temperature to obtain dispersant No. 9 (DES 9);

[0057] (2) According to the proportion of 1000 g of corundum and 1100 mL of dispersant, the corundum is added to the DES 9, the temperature of the DES 9 is controlled to be 50°C, and after pouring the corundum, stirring is performed for 20 minutes to obtain a corundum dispersion liquid with good dispersibility;

[0058] (3) Adding the sulfamate nickel plating solution to boiling deionized water to prepare a sulfamate nickel plating solution with a mass concentration of 2%, adding the corundum dispersion obtained in step (2) to the sulfamate nickel plating solution according to the ratio of 1000g of corundum dispersion and electroplating solution to 1900mL, controlling the temperature of the sulfamate nickel plating solution to 50°C, stirring for 20 minutes, and obtaining a sand electroplating solution with good dispersion, which is used for subsequent electroplating diamond wire production.

[0059] Example 10:

[0060] (1) Oleylamine and n-propanol were mixed in a molar ratio of 1:2, stirred and reacted at 80°C for 1 hour, and cooled to room temperature to obtain dispersant No. 10 (DES10);

[0061] (2) Add corundum to DES10 at a ratio of 1000 g corundum to dispersant 1400 mL, control the temperature of DES10 to 60°C, pour in the corundum and stir for 20 minutes to obtain a corundum dispersion with good dispersion;

[0062] (3) Adding the sulfamate nickel plating solution to boiling deionized water to prepare a sulfamate nickel plating solution with a mass concentration of 3%, adding the corundum dispersion obtained in step (2) to the sulfamate nickel plating solution according to the ratio of corundum dispersion to electroplating solution 1000g:2000mL, controlling the temperature of the sulfamate nickel plating solution to 60°C, stirring for 50 minutes, and obtaining a sand plating solution with good dispersibility for subsequent electroplating diamond wire production.

[0063] Note: The above embodiments are only used to illustrate the present invention and are not intended to limit the technical solutions described in the present invention. Therefore, although this specification has described the present invention in detail with reference to the above embodiments, it should be understood by those skilled in the art that the present invention may still be modified or replaced by equivalents. All technical solutions and improvements that do not depart from the spirit and scope of the present invention should be included within the scope of the claims of the present invention.

Claims

1. A method for preparing a high-dispersion electroplating solution for diamond wire, characterized in that: The following steps are involved: (1) Preparation of dispersant: Mix a hydrogen bond acceptor and an alcohol hydrogen bond donor in a molar ratio of 1:2-1:8, stir and react at 50-90°C for 1-3 hours, and cool to room temperature to obtain a sand dispersant; (2) adding corundum to the upper sand dispersant described in step (1), controlling the temperature of the upper sand dispersant to be 25-60° C., pouring in the corundum and stirring for 10-30 minutes to obtain a corundum dispersion; (3) adding the diamond abrasive dispersion obtained in step (2) to the nickel sulfamate plating solution, controlling the temperature of the nickel sulfamate plating solution to 25-60° C., and stirring for 20-50 minutes to obtain a diamond abrasive plating solution with good dispersion for subsequent electroplating diamond wire production.

2. The preparation method according to claim 1, characterized in that In step (1), the hydrogen bond acceptor is a surfactant, including but not limited to non-ionic surfactants containing polyhydroxyl groups, ether bonds or amide groups, and cationic surfactants containing polar groups that can form hydrogen bonds.

3. The preparation method according to claim 1, characterized in that In step (1), the alcohol hydrogen bond donor is selected from one or more of short-chain alcohols and polyols.

4. The preparation method according to claim 1, characterized in that In step (2), the usage ratio of corundum to sand dispersant is 1000g:1000mL-1500mL.

5. The preparation method according to claim 1, characterized in that In step (3), before the corundum dispersion is added to the nickel sulfamate plating solution, the temperature of the corundum dispersion and the nickel sulfamate plating solution are both maintained at 25 to 60°C.

6. The preparation method according to claim 1, characterized in that In step (3), the usage ratio of the corundum dispersion liquid and the nickel sulfamate plating solution is 1000g:1000mL-2000mL.

7. The preparation method according to claim 1, characterized in that In step (3), the mass concentration of nickel sulfamate in the nickel sulfamate plating solution is 1-6%.

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