IC deviation detection device and method

Abstract

According to the IC deviation detection device and method, a product bearing platform is arranged on a movable sliding table A; the camera bearing assembly comprises a camera assembly and a movable sliding table B; the camera assembly is arranged on the movable sliding table B; the camera assembly is used for shooting the contact part of the IC chip pin of the test product and the ITO connecting line; the image analysis assembly is in signal communication with the camera assembly; the moving directions of the movable sliding table A and the movable sliding table B are perpendicular to each other; the product is adsorbed to the product bearing platform; using auxiliary light to irradiate the connecting part of the IC golden finger of the product and the ITO on the glass; the image of the contact part is shot by the camera, the brightness of the ITO and the IC golden finger part in the image is larger than that of other parts in the image, the image is analyzed, the alignment state of the ITO and the IC golden finger in the image is analyzed, and if the ITO and the IC golden finger are not aligned, it is judged that the position of the IC is not aligned.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of electronic screen production and manufacturing, and particularly relates to an IC offset detection device and method. BACKGROUND

[0002] Electronic paper modules are now widely used in the fields of supermarket price tags, electronic books, mobile phones and other electronic devices. With the increasing market demand and the increasing maturity of automatic equipment, the production capacity demand of electronic paper modules is also increasing.

[0003] The production method of the electronic paper module product in the IC binding also highlights the bottleneck as follows: the existing particle AOI detection equipment cannot meet the requirements of mass production in terms of rejection rate and over-checking rate, and cannot meet the on-site production; the phenomenon of IC offset anomaly accounts for a high proportion in the binding defect, the existing equipment uses the BOM particle arrangement to determine the detection method of the IC X / Y direction offset, and the over-checking rate is high and unstable.

[0004] Manual detection of IC offset cannot be achieved, the existing detection method of the equipment cannot meet the standard requirements in terms of rejection rate and over-checking rate, and cannot meet the production, which affects the manufacturing and maintenance costs; in order to meet the production needs, it is urgent to carry out reform. SUMMARY

[0005] The technical problem to be solved by the present application is to avoid the low detection efficiency and high defect rate of the IC binding in the prior art, and to provide an IC offset detection device and method, which can improve the detection efficiency, and the detection offset detection device and method in the present application can realize the online production of the product pipeline and meet the normal production of different demand products.

[0006] The technical solution of the application for solving the above technical problem is an IC offset detection device for detecting the connection quality of the IC gold finger and the ITO wire on the glass in a product, comprising: a test product bearing assembly, a camera bearing assembly and an image analysis assembly; the test product bearing assembly comprises a product bearing platform and a moving slide A; the product bearing platform is used for placing the tested product; the product bearing platform is arranged on the moving slide A; the camera bearing assembly comprises a camera assembly and a moving slide B; the camera assembly is arranged on the moving slide B; the camera assembly is used for shooting the contact part of the IC chip pin and the ITO wire of the test product; the image analysis assembly is in signal communication with the camera assembly; the moving directions of the moving slide A and the moving slide B are perpendicular to each other; the camera shoots to obtain the image of the contact part, the brightness of the ITO and the IC gold finger part in the image is greater than the brightness of other parts in the image, the image analysis assembly acquires the image, analyzes the alignment state of the ITO and the IC gold finger in the image, and if the ITO and the IC gold finger are not aligned, it is determined that the IC position is not correct.

[0007] The image analysis assembly can be a computer.

[0008] The test control module can further include a motor drive module electrically connected to the moving slide table B.

[0009] The camera carrying assembly can further include an auxiliary light source assembly arranged on the moving slide table B and capable of moving synchronously with the camera assembly.

[0010] The camera and the auxiliary light source assembly can be arranged at a set angle, which is greater than 30 degrees and less than 60 degrees.

[0011] The product carrying platform can be a vacuum suction platform, and the product can be suctioned to the vacuum suction platform through a plurality of suction holes.

[0012] The technical solution of the present application for solving the above technical problem can also be an IC offset detection method based on the IC offset detection device, which includes the following steps: A, suctioning the product to the product carrying platform; B, irradiating the IC gold finger and the ITO connecting part on the glass with auxiliary light; C, capturing an image; D, analyzing the image to analyze the alignment state of the ITO and the IC gold finger, and determining that the IC position is incorrect if the ITO and the IC gold finger are not aligned.

[0013] In step C, step C10 can be included, which involves capturing an image, analyzing the image, obtaining the X-axis position of the IC gold finger part in the image, and driving the moving slide table A to make the IC gold finger part reach the set position if the position deviates from the set position.

[0014] In step C, step C20 can be included, which involves capturing an image, analyzing the image, obtaining the Y-axis position of the IC gold finger part in the image, and driving the moving slide table B to make the IC gold finger part reach the set position if the position deviates from the set position.

[0015] Step C30 can be further included, which involves capturing an image to obtain the overall width of the IC gold finger or the total number of IC gold fingers, and capturing multiple images if one image cannot capture the entire IC gold finger, each image being used to detect a corresponding part.

[0016] One of the beneficial effects of the technical solution in the present application is that the brightness of the ITO and the IC gold finger part in the image is greater than the brightness of other parts in the image, which facilitates image recognition, minimizes the image recognition workload, and improves the recognition efficiency.

[0017] One of the beneficial effects of the technical scheme in the application is that the image analysis component is a computer, which improves the adaptability of the device and facilitates expansion.

[0018] One of the beneficial effects of the technical scheme in the application is that the test control module is set, which facilitates the control of the moving parts during the test process.

[0019] One of the beneficial effects of the technical scheme in the application is that the auxiliary light source component is arranged on the moving sliding table B, and the auxiliary light source component and the camera component can move synchronously, which facilitates the provision of the set lighting conditions and the obtaining of images more conducive to high-speed identification.

[0020] One of the beneficial effects of the technical scheme in the application is that the illumination direction of the auxiliary light source component is set at a set angle, which is conducive to obtaining images most conducive to identification.

[0021] One of the beneficial effects of the technical scheme in the application is that the product bearing platform is a vacuum suction platform, which facilitates the bearing of glass ITO display substrates.

[0022] One of the beneficial effects of the technical scheme in the application is that software and hardware cooperate to perform image recognition, which improves the IC offset detection efficiency.

[0023] One of the beneficial effects of the technical scheme in the application is that detection is performed in two directions of X and Y axes, which improves the accuracy of detection.

[0024] One of the beneficial effects of the technical scheme in the application is that multiple pictures are taken, which facilitates detection of more positions. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 is a schematic block diagram of an IC offset detection device Figure 1 ;

[0026] Figure 2 is a schematic block diagram of an IC offset detection device Figure 2 ;

[0027] Figure 3 is a schematic block diagram of an IC offset detection device Figure 3 ;

[0028] Figure 4 is a schematic diagram of an IC offset detection device

[0029] Figure 5 is a detection obtained by an IC offset detection device Figure 1 ;

[0030] Figure 6 is a detection obtained by an IC offset detection device Figure 2 . DETAILED DESCRIPTION

[0031] The embodiments of the present application will be described below in further detail in conjunction with the accompanying drawings.

[0032] It should be noted that the following description of the preferred embodiments is merely illustrative of the application and does not in any way point to limitations of the application. The description of the preferred embodiments of the application serves merely as an illustration of the general principles of the application. The embodiments described in the present application are only a part of the embodiments of the present application and are not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0033] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application. In addition, the terms "first", "second", and technical features numbered with Arabic numerals 1, 2, 3, and the like, and "A" and "B" such numbering, are only for the purpose of description and are for the convenience of illustration, and do not represent a time or spatial sequence relationship; cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited by "first", "second", and technical features numbered with Arabic numerals 1, 2, 3, and the like can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "several" is two or more, unless otherwise specifically limited.

[0034] As Figures 1 to 3The utility model relates to an IC offset detection device for detecting the connection quality of IC gold fingers and ITO connecting wires on glass in products, which comprises a test product bearing assembly, a camera bearing assembly and an image analysis assembly, wherein the test product bearing assembly comprises a product bearing platform and a moving slide A, the product bearing platform is used for placing the tested product, and the product bearing platform is arranged on the moving slide A; the camera bearing assembly comprises a camera assembly and a moving slide B, the camera assembly is arranged on the moving slide B, and the camera assembly is used for shooting the contact position of IC chip pins and ITO connecting wires of the test product; the image analysis assembly is in signal communication with the camera assembly; the moving directions of the moving slide A and the moving slide B are perpendicular to each other; the camera shoots the image of the contact position, the brightness of the ITO and IC gold finger position in the image is greater than that of other positions in the image, the image analysis assembly acquires the image, analyzes the alignment state of the ITO and IC gold fingers in the image, and determines that the IC position is incorrect if the ITO and IC gold fingers are misaligned.

[0035] The image analysis assembly is a computer.

[0036] As Figures 2 to 3 , the IC offset detection device further comprises a test control module, the test control module comprises a motor drive module, the motor drive module is in electrical drive connection with the moving slide B, and the motor drive module is in electrical drive connection with the moving slide A.

[0037] As Figures 2 to 3 , the camera bearing assembly further comprises an auxiliary light source assembly, the auxiliary light source assembly is arranged on the moving slide B, and the auxiliary light source assembly and the camera assembly can move synchronously.

[0038] As Figure 4 , the illumination direction of the camera and the auxiliary light source assembly is arranged at a set angle, the set angle is greater than 30 degrees and less than 60 degrees, and specifically, the set angle can be 45 degrees.

[0039] As Figure 4 , the product bearing platform is a vacuum adsorption platform, adsorption small holes are distributed on the vacuum adsorption platform, and the glass part of the product is adsorbed on the vacuum adsorption platform.

[0040] An IC offset detection method based on the above IC offset detection device, steps A: adsorbing the product on the product bearing platform; step B: irradiating the IC gold fingers and ITO connecting wire parts of the product with auxiliary light; step C: shooting the image; step D: analyzing the image, analyzing the alignment state of the ITO and IC gold fingers in the image, and determining that the IC position is incorrect if the ITO and IC gold fingers are misaligned. Figure 5 The alignment state of the ITO and IC gold fingers is shown. Figure 6 The misalignment state of the ITO and IC gold fingers is shown.

[0041] Step C10, take an image, analyze the image, obtain the X-axis position of the IC gold finger part in the image, and drive the moving slide A if the position deviates from the set position so that the IC gold finger part reaches the set position.

[0042] Step C includes step C20, taking an image, analyzing the image, obtaining the Y-axis position of the IC gold finger part in the image, and driving the moving slide B if the position deviates from the set position so that the IC gold finger part reaches the set position.

[0043] Step C also includes step C30, taking an image, obtaining the overall width of the IC gold finger or the total number of IC gold fingers; if one picture cannot capture the entire IC gold finger, multiple pictures are taken respectively, and each picture is used to detect the corresponding part.

[0044] AOI (Automated Optical Inspection) is a high-precision automatic detection technology based on optical principles and machine vision technology. Its detection equipment is mainly used for efficient identification and analysis of product appearance defects, process quality, etc. in industrial production.

[0045] The image analysis component in the present application includes an AOI detection device. The core working principle of the AOI detection device is to capture the image of the detection object through a high-resolution camera (such as a combination of 150 million pixel main camera + 20 million pixel auxiliary camera), compare it with the pre-set qualified parameter database, and use image processing algorithms (such as weight imaging difference analysis, color extraction, and binary) to identify defects and mark. On the hardware side, there are at least optical imaging modules (CCD cameras, light source systems), mechanical transmission mechanisms. On the software side, it is based on logical algorithms and image analysis techniques, supporting defect classification, data analysis, and real-time feedback.

[0046] In the present application, the production method for AOI detection deviation of new particles is to add a set of 45° angle LED strong auxiliary light source beside the vision camera, model EST-XT, mainly to distinguish the color difference of ITO width and IC gold finger width and peripheral gap imaging, so that the peripheral gap presents black, the ITO width and the IC gold finger width present white, and the coincidence degree of the two white colors of the vision software is analyzed to give a judgment on the deviation.

[0047] In the present application, the obtained image, the taken image, the image of the glass ITO width and the IC gold finger width in the image is white, and the rest is black. The production compares whether the white areas of the ITO width and the IC gold finger width overlap to determine whether the IC binding is deviated, thereby solving the problem of high material rejection rate of the equipment, making the equipment meet the production, and improving the yield of the product.

[0048] Through the carrying manipulator, the product is placed on the vacuum adsorption platform and fixed by vacuum suction, the visual detection camera and the auxiliary light source are moved under the product IC binding, the module drives the camera and the auxiliary light source to move to take a color picture, after the photographing is completed, the software analysis processing gives the result, the equipment control manipulator takes away the product and replaces the next group of products, and the cycle is repeated, that is, the overall action of the new particle AOI detection deviation.

[0049] The IC gold finger has particles, and the vision is judged by the overlap of the white area presented by the ITO and the gold finger; the new particle AOI detection deviation movement process: through the carrying manipulator, the product is placed on the vacuum adsorption platform and fixed by vacuum suction, the visual detection camera and the auxiliary light source are moved under the product IC binding, the module drives the camera and the auxiliary light source to move to take a color picture, after the photographing is completed, the software analysis processing gives the result, the equipment control manipulator takes away the product and replaces the next group of products, and the cycle is repeated, that is, the overall action of the new particle AOI detection deviation.

[0050] By increasing the 45° auxiliary light source, the ITO width and the IC gold finger width present white, which is distinguished from the surrounding black area, the vision analyzes the coincidence degree of the two white areas to judge the IC deviation, and solves the problems of high equipment detection rate and high material rejection rate

[0051] As shown in the drawings, the above is only an embodiment of the present application, and does not limit the patent scope of the present application, and any equivalent structure or equivalent process transformation using the content of the application specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An IC deviation detection device, characterized in that: Used to detect the connection quality between IC gold fingers and ITO wires on glass in products. Including: test product carrying components, camera carrying components, image analysis components; The test product carrying assembly includes a product carrying platform and a movable slide A. The product carrying platform is used to place the tested product. The product carrying platform is set on the movable slide A. The camera carrying assembly includes a camera assembly and a movable slide B; The camera assembly is arranged on the movable slide B; the camera assembly is used to photograph the contact area between the IC chip pin and the ITO connection line of the test product; the image analysis assembly is in signal communication with the camera assembly; The moving directions of the movable slide A and the movable slide B are perpendicular to each other; The camera captures an image of the contact portion, wherein the brightness of the ITO and IC gold finger portion in the image is greater than the brightness of other portions in the image. The image analysis component acquires the image and analyzes the alignment status of the ITO and IC gold finger in the image. If the ITO and IC gold finger are not aligned, it is determined that the IC position is incorrect.

2. The IC displacement detection device according to claim 1, wherein: The image analysis component is a computer.

3. The IC displacement detection device according to claim 1, wherein: It also includes a test control module, which includes a motor drive module. The motor drive module is electrically connected to the movable slide B; the motor drive module is electrically connected to the movable slide A.

4. The IC displacement detection device according to claim 1, wherein: The camera supporting assembly also includes an auxiliary light source assembly, which is arranged on the movable slide B. The auxiliary light source assembly and the camera assembly can move synchronously.

5. The IC displacement detection device according to claim 4, characterized in that: The illumination directions of the camera and the auxiliary light source assembly are set to a set angle, and the set angle is greater than 30 degrees and less than 60 degrees.

6. The IC displacement detection device according to claim 1, wherein: The product carrying platform is a vacuum adsorption platform, on which adsorption holes are distributed, and the glass part of the product is adsorbed on the vacuum adsorption platform.

7. A method for detecting IC misalignment, based on the IC misalignment detection device according to any one of claims 1 to 6, characterized in that: include Step A: Adsorb the product onto the product carrying platform; Step B: Use auxiliary light to illuminate the connection between the IC gold finger and the ITO on the glass; Step C: Capture an image; Step D: Analyze the image, analyze the alignment status of the ITO and IC gold fingers in the image, and if the ITO and IC gold fingers are not aligned, it is determined that the IC position is incorrect.

8. The IC misalignment detection method according to claim 7, wherein: Step C includes step C10, capturing an image, analyzing the image, obtaining the X-axis position of the IC gold finger portion in the image, and if the position deviates from the set position, driving the movable slide A to make the IC gold finger portion reach the set position.

9. The IC misalignment detection method according to claim 7, wherein: Step C includes step C20, capturing an image, analyzing the image, obtaining the Y-axis position of the IC gold finger portion in the image, and if the position deviates from the set position, driving the movable slide B so that the IC gold finger portion reaches the set position.

10. The IC misalignment detection method according to claim 7, wherein: The method further includes step C30, capturing an image to obtain the overall width of the IC gold fingers or the total number of IC gold fingers; if one image cannot capture all of the IC gold fingers, multiple images are captured separately, and each image is used to detect a corresponding part.

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