Metallographic specimen preparation method

Abstract

The invention discloses a metallographic specimen preparation method, and belongs to the technical field of material performance detection. According to the preparation method of the metallographic specimen, the inlaid specimen and the transfer specimen matched with the grinding and polishing clamp of the grinding and polishing machine are prepared firstly, then the transfer specimen is clamped to the grinding and polishing clamp, then the inlaid specimen is fixedly connected with the clamped transfer specimen, and then the inlaid specimen can be installed on the grinding and polishing machine. The embedded sample can be ground and polished by utilizing a traditional grinding and polishing machine, so that the limitation of the traditional grinding and polishing machine on the shape and the size of the embedded sample is eliminated, for example, a large-size metallographic sample can be prepared, the preparation efficiency of the metallographic sample can be improved, and the cost is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of material performance detection, and particularly relates to a metallographic sample preparation method. BACKGROUND

[0002] Composite materials are increasingly widely used in the fields of aerospace and aviation due to their excellent mechanical properties such as light weight, high specific strength and high specific modulus. However, the special layup structure formed in the design and processing of composite materials and the defects such as pores and delamination inevitably formed in the production process will affect the mechanical properties of the materials and their application scenarios.

[0003] Metallographic analysis is of great significance in the analysis and application of composite materials because it can directly reflect the internal organizational structure of the composite materials. In order to make the metallographic sample of the composite material show the real morphology of the material under test during metallographic analysis, the surface of the sample should be as smooth as possible, so the metallographic sample preparation needs to go through processes such as embedding, grinding and polishing.

[0004] Cold embedding has been maturely applied to the embedding of metallographic samples. Generally, epoxy resin, polyester resin or acrylic resin is used as a filler, and the resin mixed with a curing agent is injected into a mold and left to cure at room temperature for a period of time. Cold embedding does not cause changes in the structure of the sample, so it is particularly suitable for materials that are sensitive to temperature and / or pressure.

[0005] At present, cold embedding usually uses a mold matched with a metallographic grinding and polishing machine, and the size of the prepared sample is generally small, usually about 20mmx10mm. Due to the size of the mold, the number and size of samples that can be embedded at one time are limited, and the efficiency of the metallographic sample prepared by this method is low due to the long curing time at room temperature.

[0006] In addition, for some special test pieces, the characteristic region to be observed is large, which exceeds the limitation of the traditional metallographic sample processing method. If the existing sample size (20mmx10mm) is still used, the observation range will be reduced and the integrity of the structure observation will be reduced. At the same time, large-sized metallographic samples are difficult to be matched with traditional metallographic grinding and polishing machines, and special customized metallographic grinding and polishing machines need to be used, which greatly increases the detection cost.

[0007] Therefore, it is urgent to improve the embedding and polishing method of metallographic samples. SUMMARY

[0008] The present application aims to provide a metallographic sample preparation method which not only eliminates the limitation of traditional grinding and polishing machines on the shape and size of metallographic samples, but also improves the efficiency of metallographic sample preparation and reduces the cost.

[0009] To achieve the above object, the following technical solutions are provided.

[0010] The method for preparing the metallographic sample comprises the following steps:

[0011] The adapter sample is prepared based on parameters of the grinding and polishing jig of the grinding and polishing machine;

[0012] The inlay sample is prepared;

[0013] The adapter sample is clamped in the grinding and polishing jig;

[0014] The inlay sample is fixedly connected with the adapter sample;

[0015] The inlay sample is polished by the grinding and polishing machine.

[0016] As a preferred technical solution of the above method for preparing the metallographic sample, the inlay sample is prepared, comprising the following steps:

[0017] The inlay mold is made based on parameters of the inlay sample;

[0018] The sample is placed in the inlay mold;

[0019] The inlay filler is injected into the inlay mold;

[0020] The inlay filler is solidified to prepare the inlay sample.

[0021] As a preferred technical solution of the above method for preparing the metallographic sample, the inlay mold is made of carbon fiber composite material.

[0022] As a preferred technical solution of the above method for preparing the metallographic sample, when the inlay filler is injected into the inlay mold, the inlay mold is placed in a vacuum environment.

[0023] As a preferred technical solution of the above method for preparing the metallographic sample, when the inlay filler is solidified, the inlay filler is placed in a room temperature environment.

[0024] As a preferred technical solution of the above method for preparing the metallographic sample, an inner wall of the inlay mold is provided with a demolding layer.

[0025] As a preferred technical solution of the above method for preparing the metallographic sample, the inlay mold is made based on parameters of the inlay sample, comprising the following steps:

[0026] A carbon fiber composite material plate is prepared based on parameters of the inlay sample;

[0027] The carbon fiber composite material plate is processed based on the parameters of the inlay sample to prepare a plurality of mold substrates;

[0028] Splice and fixedly connect a plurality of the mold substrates to make the inlay mold.

[0029] As a preferred technical solution of the above-mentioned metallographic sample preparation method, when the plurality of mold substrates are fixedly connected, the plurality of mold substrates are fixedly connected through adhesive tape.

[0030] As a preferred technical solution of the above-mentioned metallographic sample preparation method, when the plurality of mold substrates are fixedly connected through adhesive tape, the adhesive tape seals the gap between any two adjacent mold substrates.

[0031] As a preferred technical solution of the above-mentioned metallographic sample preparation method, placing the sample in the inlay mold includes the following steps:

[0032] Fixing the sample in the inlay mold through the sample inlaying filler.

[0033] As a preferred technical solution of the above-mentioned metallographic sample preparation method, the inlay sample and the adapter sample are fixedly connected through double-sided adhesive tape.

[0034] As a preferred technical solution of the above-mentioned metallographic sample preparation method, when the inlay sample and the adapter sample are fixedly connected, the center of the inlay sample is arranged to correspond to the center of the grinding and polishing clamp.

[0035] Compared with the prior art, the beneficial effects of the present application are:

[0036] The metallographic sample preparation method of the present application first prepares an inlay sample and an adapter sample adapted to the grinding and polishing clamp of the grinding and polishing machine, then clamps the adapter sample on the grinding and polishing clamp, and then fixedly connects the inlay sample and the clamped adapter sample, so that the inlay sample can be installed on the grinding and polishing machine, and the inlay sample can be polished by using the traditional grinding and polishing machine. Not only does it eliminate the limitations of the traditional grinding and polishing machine on the shape and size of the inlay sample, such as being able to prepare a large-size metallographic sample, but also improves the preparation efficiency of the metallographic sample and reduces the cost. BRIEF DESCRIPTION OF DRAWINGS

[0037] Figure 1 The flowchart of the metallographic sample preparation method in the embodiment of the present application;

[0038] Figure 2 The structure diagram of the grinding and polishing clamp of the grinding and polishing machine in the prior art;

[0039] Figure 3 The structure diagram of the adapter sample and the inlay sample in the embodiment of the present application;

[0040] Figure 4 The structure diagram of the inlay mold in the embodiment of the present application;

[0041] Figure 5 A detailed flow chart of the method for preparing a metallographic sample in the embodiment of the present application.

[0042] Reference signs:

[0043] 10, polishing fixture; 11, clamping structure; 20, adapter sample; 30, inlaid sample; 40, inlaid mold; 41, mold base plate; 50, double-sided tape. DETAILED DESCRIPTION

[0044] In order to make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0045] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative labor fall within the scope of protection of the present application.

[0046] It should be noted that: similar reference numbers and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0047] In the description of the present application, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship when the product of the present application is usually placed, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" and the like are only used to distinguish the description, and cannot be understood as indicating or implying relative importance. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0048] In the description of the present application, it is necessary to point out that, unless otherwise explicitly specified and limited, the terms "arranged", "connected" should be understood broadly, for example, can be fixedly connected, can be detachably connected, or integrally connected; can be mechanically connected, or electrically connected. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0049] In the present application, unless otherwise explicitly specified and limited, the "on" or "under" of the first feature to the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the "on", "above" and "over" of the first feature to the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the first feature is higher in horizontal height than the second feature. The "under", "below" and "under" of the first feature to the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the first feature is lower in horizontal height than the second feature.

[0050] The embodiments of the present application are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary, only for explaining the present application, and cannot be understood as a limitation of the present application.

[0051] As Figures 1 to 3 shown, the present embodiment provides a metallographic sample preparation method, comprising the following steps:

[0052] S1, preparing an adapter sample 20 based on the parameters of the grinding and polishing clamp 10 of the grinding and polishing machine;

[0053] S2, preparing an inlay sample 30;

[0054] S3, clamping the adapter sample 20 to the grinding and polishing clamp 10;

[0055] S4, fixedly connecting the inlay sample 30 with the adapter sample 20;

[0056] S5, grinding and polishing the inlay sample 30 by using the grinding and polishing machine.

[0057] The metallographic sample preparation method of the embodiment first prepares the inlay sample 30 and the adapter sample 20 matched with the grinding and polishing fixture 10 of the grinding and polishing machine, then clamps the adapter sample 20 on the grinding and polishing fixture 10, and then fixes and connects the inlay sample 30 with the clamped adapter sample 20, so that the inlay sample 30 can be installed on the grinding and polishing machine, and the inlay sample 30 can be polished by using the traditional grinding and polishing machine. Not only the shape and size of the inlay sample 30 are not limited by the traditional grinding and polishing machine, such as being able to prepare a large-size metallographic sample, but also the preparation efficiency of the metallographic sample is improved and the cost is reduced.

[0058] As shown in Figure 4 Optionally, the inlay sample 30 is prepared, including the following steps:

[0059] The inlay mold 40 is made based on the parameters of the inlay sample 30;

[0060] The sample is placed in the inlay mold 40;

[0061] The inlay sample 40 is injected with an inlay filler;

[0062] The inlay filler is solidified to make the inlay sample 30.

[0063] The inlay mold 40 is made according to the size of the inlay sample 30, that is, the size of the inlay mold 40 and the shape of the forming cavity can be freely selected, so that the number of samples that can be inlaid at one time, the shape of the sample and the size of the sample can be freely selected, in other words, a plurality of samples can be inlaid at one time, and there is no limitation on the shape and size of the sample, which improves the preparation efficiency of the metallographic sample, and makes the use scene of the metallographic sample preparation method of the embodiment more free and the application range wider. It is not only suitable for preparing small-size metallographic samples, but also suitable for preparing large-size and different-shaped metallographic samples.

[0064] It should be noted that the parameters of the inlay sample 30 include the shape and size of the inlay sample 30, and / or the number and size of the samples inlaid by the inlay sample 30.

[0065] Optionally, the inlay mold 40 is made of carbon fiber composite material. When the inlay filler is injected into the inlay mold 40, since the amount of inlay filler to be injected is large, multiple glue adjustments are required, which inevitably leads to uneven glue adjustment, and further leads to local rapid solidification, generating a large amount of heat, further causing rapid solidification of the entire inlay filler, and generating more heat, which is usually up to 250°C. The inlay mold 40 made of carbon fiber composite material has stronger temperature resistance and will not smoke or burn due to high temperature. Moreover, the inlay mold 40 made of carbon fiber composite material is lighter in weight, easy to carry, can reduce the labor intensity of workers, and improve safety. It should be noted that the carbon fiber composite material is a material in the prior art. For example, the carbon fiber composite material includes carbon fiber-resin composite material.

[0066] Optionally, when the inlay filler is injected into the inlay mold 40, the inlay mold 40 is placed in a vacuum environment, so that the inlay filler can be injected while eliminating the bubbles in the inlay filler, thereby improving the quality of the inlay sample 30.

[0067] Optionally, when the inlay filler is solidified, the inlay filler is placed in a room temperature environment. In other words, in this embodiment, the inlay sample 30 is prepared by using a cold inlay method, so that the change of the sample tissue will not be caused, and therefore the cold inlay method is particularly suitable for samples which are sensitive to temperature and / or pressure, such as foam materials or porous materials.

[0068] It should be noted that the material of the inlay filler is not limited in this embodiment. In other words, the inlay filler of this embodiment uses an inlay filler in the prior art which can be solidified in a room temperature environment, such as epoxy resin, polyester resin or acrylic resin.

[0069] Optionally, the inner wall of the inlay mold 40 is provided with a release layer, which not only facilitates the subsequent demolding operation of the inlay sample 30, and is beneficial to improving the preparation efficiency of the inlay sample 30, but also makes the surface of the prepared inlay sample 30 relatively smooth, which is beneficial to the subsequent polishing and polishing operation. For example, the release cloth is laid on the inner wall of the inlay mold 40 to form the release layer.

[0070] Optionally, the inlay mold 40 is made based on the parameters of the inlay sample 30, including the following steps:

[0071] The carbon fiber composite material plate is prepared based on the parameters of the inlay sample 30;

[0072] The carbon fiber composite material plate is processed based on the parameters of the inlay sample 30 to make a plurality of mold substrates 41;

[0073] The plurality of mold substrates 41 are spliced and fixedly connected to make the inlay mold 40.

[0074] It is understood that the inlay mold 40 is made by splicing and securely connecting multiple separately manufactured mold bases 41. This allows for better manufacturability and lower costs compared to an integrally molded carbon fiber composite inlay mold 40. Of course, the inlay mold 40 can also be made from scrap carbon fiber composite sheet material from the factory, achieving waste recycling and significantly reducing costs.

[0075] Optionally, when multiple mold substrates 41 are assembled and fixedly connected, adhesive tape is used to securely connect the multiple mold substrates 41. This improves processing convenience and reduces costs while ensuring the structural strength of the inlay mold 40. Exemplarily, the adhesive tape is a single-sided pressure-sensitive tape or paper tape. Of course, other adhesive tapes known in the art may also be used.

[0076] Optionally, when multiple mold substrates 41 are fixedly connected by tape, the tape can seal the gap between any two adjacent mold substrates 41, and the tape can be used as a barrier to prevent uncured liquid mounting filler from overflowing from the gap between the mold substrates 41.

[0077] It should be noted that when using tape to fix multiple mold substrates 41, the staff can manually press two adjacent mold substrates 41 to minimize the gap between the two adjacent mold substrates 41 and reduce the risk of the mounting filler overflowing from the gap between the mold substrates 41.

[0078] Optionally, placing the sample in the mounting mold 40 includes the following steps:

[0079] The sample is fixed in the mounting mold 40 by a mounting filler.

[0080] By first securing the sample in the mounting mold 40 with a mounting filler and then injecting the mounting filler into the mounting mold 40, sample displacement can be avoided, thereby improving the quality of the mounted specimen 30. It should be noted that for samples such as foam or porous materials, which are relatively light in weight, first securing the sample in the mounting mold 40 with a mounting filler and then injecting the mounting filler into the mounting mold 40 can prevent the sample from floating.

[0081] like Figure 3 As shown, the mounted specimen 30 and the transition specimen 20 are optionally fixedly connected by double-sided tape 50. This not only facilitates quick connection of the mounted specimen 30 and the transition specimen 20, but also facilitates rapid separation of the mounted specimen 30 from the transition specimen 20 after grinding and polishing the mounted specimen 30, thereby improving the efficiency of metallographic specimen preparation. For example, the double-sided tape 50 is a strong double-sided tape known in the art, thereby ensuring a reliable connection between the mounted specimen 30 and the transition specimen 20.

[0082] It should be noted that the size of the double-sided tape 50 needs to match the size of the adapter sample 20, in other words, the double-sided tape 50 should be cut according to the size of the adapter sample 20 as much as possible, and be laid flat on the adapter sample 20.

[0083] Optionally, when the inlaid sample 30 is fixedly connected with the adapter sample 20, the center of the inlaid sample 30 is arranged to correspond to the center of the grinding clamp 10, thereby improving the clamping stability of the inlaid sample 30, and being beneficial to improving the polishing quality.

[0084] Figure 5 is a detailed flowchart of the metallographic sample preparation method provided by the embodiment, as shown in the figure, the metallographic sample preparation method of the embodiment comprises the following steps: Figure 5

[0085] S101, preparing a plurality of carbon fiber composite material plates based on the parameters of the inlaid sample 30.

[0086] The manufacturing method of the carbon fiber composite material plate is a prior art, which will not be described here. It should be noted that the size of the carbon fiber prepreg (the size of the carbon fiber prepreg is generally 100mm*100mm, and the size of the carbon fiber prepreg can also be adjusted according to the actual use scene) and the layering information (generally, the thickness of each layer of carbon fiber prepreg is more than 3mm, a total of 20 layers, and the thickness of each layer and the total number of layers can also be adjusted according to the actual use scene) required by the inlaid sample 30 are designed first, and then cured (such as curing by vacuum oven or autoclave) to manufacture the carbon fiber composite material plate (i.e. carbon fiber composite material laminate).

[0087] S102, processing the plurality of carbon fiber composite material plates based on the parameters of the inlaid sample 30 to manufacture a plurality of mold substrates 41.

[0088] Exemplarily, based on the parameters of the inlaid sample 30, the carbon fiber composite material plate is processed by a grinding machine to obtain a mold substrate 41 of a required size.

[0089] It should be noted that in other embodiments, a large-size carbon fiber composite material plate can also be prepared based on the parameters of the inlaid sample 30, and then the large-size carbon fiber composite material plate is divided into a plurality of small-size carbon fiber composite material plates by machining, and then the plurality of small-size carbon fiber composite material plates are processed based on the parameters of the inlaid sample 30 to manufacture a plurality of mold substrates 41.

[0090] S103, splicing and fixedly connecting the plurality of mold substrates 41 to manufacture an inlaid mold 40.

[0091] ​Before the plurality of mold substrates 41 are spliced and fixedly connected, release cloth is pasted on the surface of the plurality of mold substrates 41, and the release cloth is located on the inner side of the inlaid mold 40, so as to facilitate subsequent release.

[0092] In this embodiment, the two adjacent mold substrates 41 are fixedly bonded by the adhesive tape to form the inlaid mold 40, which is convenient to operate and facilitates subsequent release.

[0093] S104, placing the sample in the inlaid mold 40.

[0094] When a large number of inlaid samples 30 need to be made, a plurality of samples can be sequentially placed on the bottom plate of the inlaid mold 40 at the same time.

[0095] S105, injecting the sample filling agent into the inlaid mold 40.

[0096] When the sample is a porous material or other light material, the sample filling agent such as epoxy resin is first brushed on the bottom surface of the sample, and then cured for three to four hours to fix the sample in the inlaid mold 40, and then the prepared sample filling agent such as epoxy resin is injected.

[0097] S106, curing the sample filling agent to form the inlaid sample 30.

[0098] Exemplarily, the inlaid mold 40 is placed in a container with vacuumizing function such as a vacuum dryer or a vacuum oven, the vacuum pump is turned on to make the inlaid mold 40 as a whole in a vacuum environment, the sample filling agent is injected while eliminating bubbles in the sample filling agent, and the defoaming is completed after about half an hour to one hour, then the vacuum pump is turned off, and the sample filling agent is cured at room temperature.

[0099] After the curing is completed, the adhesive tape on the inlaid mold 40 is removed, the inlaid sample 30 is taken out, and then the mold substrate 41 is cleaned, which can be reused.

[0100] S107, preparing the adapter sample 20 based on the parameters of the polishing clamp 10 of the polishing machine.

[0101] Figure 2 The structure diagram of the polishing clamp of the polishing machine in the prior art is shown in Figure 2 The polishing clamp 10 of the polishing machine is a polishing disc, which is provided with a plurality of clamping structures 11 (the clamping jaws of the clamping structure 11 are not shown in the figure), therefore, a plurality of adapter samples 20 need to be prepared, and the plurality of adapter samples 20 are clamped one by one in the plurality of clamping structures 11. It should be noted that in combination with Figure 2 and Figure 3 The shape and size of the adapter sample 20 need to be set according to the parameters of the polishing clamp 10 of the polishing machine, so that the adapter sample 20 can be clamped in the polishing clamp 10.

[0102] The adapter sample 20 is prepared by a conventional metallographic sample preparation method, which will not be described herein.

[0103] S108, clamping the adapter sample 20 on the grinding and polishing clamp 10.

[0104] S109, fixing and connecting the inlaid sample 30 with the adapter sample 20.

[0105] The inlaid sample 30 and the adapter sample 20 are fixed by strong double-sided tape.

[0106] S110, grinding and polishing the inlaid sample 30 by using a grinding and polishing machine.

[0107] When starting grinding and polishing, the inlaid sample 30 is ground flat on both sides by pre-grinding in the same direction at low speed and low pressure, and then the parameters are gradually adjusted to increase the pressure and speed. The operation method can refer to the conventional metallographic sample grinding and polishing method. It should be noted that after each grinding process, the water droplets and dust on the back of the inlaid sample 30 need to be cleaned, and the adhesion of the strong double-sided tape needs to be checked to ensure that the adapter sample 20 is firmly connected with the inlaid sample 30.

[0108] It should be noted that the metallographic sample preparation method of the embodiment has no limitation on the material and structure of the sample. It can not only be used to make metallographic samples of foams or structures with honeycomb sandwich, but also be used to make metallographic samples of inorganic fiber-resin composite materials, polymer materials or metal materials.

[0109] In summary, the metallographic sample preparation method of the embodiment can make large-size inlaid samples 30 for observing large-size metallography, and can also grind and polish the large-size inlaid samples 30 on the conventional grinding and polishing machine, so that both sides of the inlaid sample 30 after grinding and polishing can meet the requirements of metallographic observation, greatly reducing the grinding and polishing cost of large-size metallographic samples. At the same time, the metallographic sample preparation method of the embodiment cures the inlaid sample 30 at room temperature, so it has good application prospect in the observation of low-temperature cured carbon fiber-resin composite materials, pressure-sensitive foam sandwich and honeycomb sandwich structures, and is conducive to promoting the high-level development of composite materials in the aviation industry.

[0110] Note that the above merely describes preferred embodiments of the present application and the principles of the technology applied. Those skilled in the art will understand that the present application is not limited to the specific embodiments described herein, and that various obvious changes, modifications and substitutions can be made without departing from the scope of the present application. Therefore, although the present application has been described in detail through the above embodiments, the present application is not limited to the above embodiments, and can include more other equivalent embodiments without departing from the concept of the present application, and the scope of the present application is determined by the scope of the claims.

Claims

1. A method for preparing a metallographic sample, characterized in that: The steps include: Prepare the transfer specimen based on the parameters of the grinding and polishing fixture of the grinding and polishing machine; Preparation of mounted specimens; Clamping the transfer sample on the grinding and polishing fixture; Fixedly connecting the inlaid specimen and the transfer specimen; The inlaid sample is ground and polished by the grinding and polishing machine.

2. The metallographic sample preparation method according to claim 1, characterized in that: Preparation of a mounted specimen, comprising the following steps: Making a mounting mold based on the parameters of the mounting specimen; placing the sample in the mounting mold; injecting a mounting filler into the mounting mold; The mounting filler is cured to produce the mounted specimen.

3. The method for preparing a metallographic sample according to claim 2, wherein: The inlay mold is made of carbon fiber composite material.

4. The method for preparing a metallographic sample according to claim 2, wherein: When injecting the mounting filler into the mounting mold, the mounting mold is placed in a vacuum environment.

5. The metallographic sample preparation method according to claim 2, characterized in that: When the mounting filler is solidified, the mounting filler is kept at room temperature.

6. The method for preparing a metallographic sample according to claim 2, wherein: The inner wall of the inlay mold is provided with a demoulding layer.

7. The metallographic sample preparation method according to claim 2, characterized in that: The steps of making a mounting mold based on the parameters of the mounting sample include: Preparation of carbon fiber composite panels based on the parameters of the mounted specimens; Processing the carbon fiber composite material plate based on the parameters of the inlaid sample to produce a plurality of mold substrates; A plurality of the mold base plates are assembled and fixedly connected to form the inlaid mold.

8. The method for preparing a metallographic sample according to claim 7, wherein: When the plurality of mold substrates are assembled and fixedly connected, the plurality of mold substrates are fixedly connected by adhesive tape.

9. The method for preparing a metallographic sample according to claim 8, wherein: When the plurality of mold substrates are fixedly connected by the adhesive tape, the adhesive tape seals the gap between any two adjacent mold substrates.

10. The metallographic sample preparation method according to claim 2, characterized in that: Placing the sample in the inlay mold comprises the following steps: The sample is fixed in the mounting mold by means of mounting filler.

11. The method for preparing a metallographic sample according to any one of claims 1 to 10, characterized in that: The inlaid sample and the transfer sample are fixedly connected by double-sided adhesive tape.

12. The method for preparing a metallographic sample according to any one of claims 1 to 10, characterized in that: When the inlaid sample is fixedly connected to the transfer sample, the center of the inlaid sample is arranged corresponding to the center of the grinding and polishing fixture.

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