A multi-board power-on testing device and method based on FPC production
By combining an elastic clamping mechanism and a floating three-dimensional platform, the problem of unstable clamping of FPC under high temperature conditions is solved, and stable clamping and efficient testing of flexible printed circuit boards are achieved.
Patent Information
- Application Number
- CN202511241771.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-02
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2045-09-02
AI Technical Summary
Existing FPC production multi-board power-on testing equipment cannot effectively guarantee the clamping stability of flexible printed circuit boards under high temperature conditions. Rigid clamping methods are prone to causing FPC edge tearing or pad detachment, and the clamping force is too small to resist the impact of high temperature airflow or deformation displacement.
An elastic clamping mechanism is adopted, which adjusts the clamping force through elastic telescopic airbags and drive mechanism, and combined with a floating three-dimensional platform to achieve multi-degree-of-freedom motion to compensate for the three-dimensional thermal deformation of the FPC and ensure clamping stability.
Under high-temperature conditions, the elastic clamping mechanism adaptively adjusts the clamping force to prevent FPC tearing or pad detachment, and the floating three-dimensional platform compensates for thermal deformation, improving test stability and efficiency.
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Figure CN120801992B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of FPC production and testing equipment technology, and in particular to a multi-board power-on testing device and method based on FPC production. Background Technology
[0002] In the high-temperature electrical conduction testing of FPCs (Flexible Printed Circuit Boards) in an aging furnace, due to their material properties, testing environment, and technical requirements for electrical conduction testing, multi-board electrical conduction testing equipment for FPCs still has the following shortcomings during use:
[0003] For example, Chinese Patent Publication No. CN114755566A discloses a three-dimensional transfer-type circuit board aging test machine, including a test chamber. The front end of the test chamber is hinged with a transparent glass door. The test chamber is equipped with an adjustable temperature heating device for heating the circuit board and a cooling device for rapid cooling of the circuit board. The test chamber is also equipped with a clamping and flipping device and a strength testing device. This invention can perform aging tests on circuit boards of different specifications. Specifically, the clamping unit can clamp and fix circuit boards of different specifications by using a spacing adjustment mechanism and a first hydraulic cylinder to control the movement of the flipping disc. At the same time, this application can flip multiple circuit boards in the test chamber simultaneously to ensure uniform heating of the circuit boards and improve the accuracy of the circuit board aging test.
[0004] During aging tests on circuit boards, clamps are typically used to secure the flexible printed circuit board (FPC) to ensure stable connections. However, the aforementioned aging test apparatus uses a rigid clamping method, which is unsuitable for FPCs. Because the substrate and copper foil of FPCs are relatively thin, their material strength decreases significantly under high temperatures. Excessive clamping force can easily cause tearing at the edges of the FPC or detachment of the solder pads from the substrate; conversely, insufficient clamping force cannot effectively resist the impact of high-temperature airflow or displacement caused by deformation. Therefore, rigid clamping cannot effectively guarantee the clamping stability of FPCs during high-temperature aging tests. Summary of the Invention
[0005] The purpose of this application is to provide a multi-board power-on testing device and method based on FPC production, which can effectively solve the problems mentioned in the background art.
[0006] To achieve the above objectives, this application provides the following technical solution: a multi-board power-on testing device based on FPC production, comprising an aging furnace material rack disposed within an aging furnace and multiple material plates disposed on the aging furnace material rack. Multiple circuit boards are disposed on the material plates, and all circuit boards are electrically connected to the aging furnace via electrical signals. An elastic clamping mechanism is disposed between the material plates and the circuit boards for clamping the circuit boards. The elastic clamping mechanism includes: multiple pairs of clamping rods, multiple pairs of clamping plates, multiple elastic telescopic airbags, and a driving mechanism. Each pair of clamping rods has a slot, and the two sides of the circuit board are disposed on the clamping rods through the slots. A pair of clamping plates is slidably connected within the slot of each clamping rod for clamping the circuit board. The elastic telescopic airbags are disposed on the clamping rods and are used to push the clamping plates to move, thereby providing clamping force on the circuit board. The driving mechanism is mounted on the clamping rods and is used to drive the elastic telescopic airbags to expand or compress, thereby adjusting the clamping force of the slots on the circuit board.
[0007] Preferably, the clamping rod is provided with a connecting tube and a telescopic corrugated tube; one end of the connecting tube is connected to the elastic telescopic airbag, and the other end of the connecting tube is connected to the telescopic corrugated tube. The elastic telescopic airbag is connected to the clamping plate through the connecting tube and the telescopic corrugated tube. When the elastic telescopic airbag expands under force, the positive pressure inside the elastic telescopic airbag is transmitted to the telescopic corrugated tube through the connecting tube, causing the telescopic corrugated tube to stretch under force, thereby driving the clamping plate to move and enhance the clamping force on the circuit board.
[0008] Preferably, the driving mechanism includes a gear, a push block, a limiting mechanism, and a pair of racks; the gear is rotatably connected to the clamping rod around its axis, the pair of racks are slidably connected to the clamping rod along the extension and retraction direction of the elastic telescopic airbag, and the pair of racks are respectively meshed on both sides of the gear; the push block is slidably connected to the clamping rod, and the push block is fixed to one of the racks; the limiting mechanism is disposed on the clamping rod and is used to limit the expansion and compression state of the elastic telescopic airbag.
[0009] Preferably, the limiting mechanism includes a pawl and a second return spring; the pawl is rotatably connected to the clamping rod via a rotating shaft, and a ratchet groove adapted to the pawl is provided on one of the racks; a first return spring is provided on the pawl; when the pawl loses its restraint, the first return spring is used to drive the pawl to rotate so that the pawl resumes engagement with the ratchet groove; the second return spring is provided between the clamping rod and the push block.
[0010] Preferably, a floating three-dimensional platform is provided between the material plate and the elastic clamping mechanism; the floating three-dimensional platform includes an X-axis sliding layer, a Y-axis sliding layer, and a Z-axis floating layer; the X-axis sliding layer is installed on the material plate and is used to provide micro-floating in the X direction when the circuit board is deformed; the Y-axis sliding layer is installed on the X-axis sliding layer and is used to provide micro-floating in the Y direction when the circuit board is deformed; the Z-axis floating layer is installed between the Y-axis sliding layer and the clamping rod and is used to provide micro-floating in the Z direction when the circuit board is deformed.
[0011] Preferably, the X-axis sliding layer includes a first base, a first slide rail, a first slider, and a third return spring; the first slide rail is disposed on the material plate, the first slider is fixed to the bottom of the first base, and the first base is slidably connected to the first slide rail through the first slider; the third return spring is disposed between the first slider and the material plate; when the first base is unrestricted, the third return spring is used to drive the first base to move and reset.
[0012] Preferably, the Y-axis sliding layer includes a second base, a second slide rail, a second slider, and a fourth return spring; the second slide rail is disposed on the first base, the second slider is fixed to the bottom of the second base, the second base is slidably connected to the second slide rail through the second slider, and the fourth return spring is disposed between the second slider and the second base; when the second base is unrestricted, the fourth return spring is used to drive the second base to move and reset.
[0013] Preferably, the Z-axis floating layer includes a ball joint and multiple limiting shafts; the ball joint is disposed between the second base and the clamping rod; the ball joint includes a ball head and a housing; the housing is fixed to the first base, one end of the ball head is connected to the housing, and the other end of the ball head is fixed to the clamping rod; the multiple limiting shafts are fixed to the housing; one end of the multiple limiting shafts extends downward to connect with the second base, and the other end of the multiple limiting shafts extends upward to form a protrusion; the ball head and the housing are fitted with a clearance fit.
[0014] Preferably, a fifth return spring is provided between the protrusion and the clamping rod; when the clamping rod is unrestrained, the fifth return spring is used to drive the clamping rod to move so that the clamping rod remains in a horizontal return state.
[0015] A method for testing the power-on performance of multiple boards manufactured using FPC, employing the aforementioned power-on performance testing device for multiple boards manufactured using FPC; specifically including the following steps:
[0016] Step 1, Elastic Clamping: First, the circuit board is initially clamped on both sides by the clamping plates on a pair of clamping rods to achieve initial fixation of the circuit board in space; then, the elastic telescopic airbag connected to the clamping plates is used to further achieve elastic clamping of the circuit board.
[0017] Step 2, Clamping Adjustment: The expansion or contraction of the elastic telescopic airbag is controlled by the drive mechanism; when the drive mechanism drives the elastic telescopic airbag to expand, it will push the clamping plate connected to it to move towards the circuit board; when the drive mechanism drives the elastic telescopic airbag to contract, it will move the clamping plate away from the circuit board, so as to adjust the clamping force of the clamping plate on the circuit board.
[0018] In summary, the technical effects and advantages of this invention are as follows:
[0019] This invention has a reasonable structure. By setting up an elastic clamping mechanism and controlling the expansion and contraction of the elastic telescopic airbag, the elastic force can be adaptively adjusted to ensure that the FPC is stably clamped during high-temperature deformation, thus solving the problem caused by excessive rigid clamping force in existing systems. Moreover, it can clamp multiple FPCs at the same time, with each pair of clamping rods corresponding to one FPC, which is suitable for the needs of simultaneous testing of multiple boards and improves testing efficiency.
[0020] In this invention, a floating three-dimensional platform is set up to achieve multi-degree-of-freedom motion through layered stacking: when the FPC undergoes X, Y, and Z displacement or tilting due to high temperature, it can drive the independent and coordinated movement of each layer to fully compensate for the three-dimensional thermal deformation of the FPC; it can release the mechanical stress generated by the thermal expansion and contraction of the FPC; and in conjunction with the elastic clamping mechanism, it forms a dual compensation mechanism of clamping and floating, further improving the stability of FPC testing. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the aging furnace material rack in this invention;
[0023] Figure 2 This is a partial three-dimensional enlarged structural diagram of the material plate in this invention;
[0024] Figure 3 This is a three-dimensional enlarged structural diagram of the elastic clamping mechanism and floating three-dimensional platform of the present invention;
[0025] Figure 4 This is a partially cross-sectional, enlarged three-dimensional structural diagram of the elastic clamping mechanism and floating three-dimensional platform of the present invention;
[0026] Figure 5 For the present invention Figure 4 Enlarged structural diagram of region A in the middle;
[0027] Figure 6This is a three-dimensional enlarged schematic diagram of a portion of the elastic clamping mechanism of the present invention;
[0028] Figure 7 For the present invention Figure 6 Enlarged structural diagram of region B in the middle;
[0029] Figure 8 This is a three-dimensional enlarged structural diagram of the floating three-dimensional platform of the present invention;
[0030] Figure 9 This is a partially cross-sectional, enlarged stereoscopic structural diagram of the floating three-dimensional platform of the present invention;
[0031] Figure 10 For the present invention Figure 9 A magnified structural diagram of region C in the middle;
[0032] Figure 11 This is a flowchart of the method of the present invention.
[0033] In the diagram: 1. Aging furnace material rack; 2. Material plate; 3. Circuit board; 4. Elastic clamping mechanism; 41. Clamping rod; 42. Groove; 43. Clamping plate; 44. Elastic telescopic airbag; 45. Connecting pipe; 46. Telescopic corrugated pipe; 47. Drive mechanism; 471. Gear; 472. Rack; 473. Push block; 474. Limiting mechanism; 4741. Pawl; 4742. Rattle groove; 4743. Second return spring; 5. Floating three-dimensional platform; 51. X-axis sliding layer; 511. First slide rail; 512. First slider; 513. Third return spring; 52. Y-axis sliding layer; 521. Second slide rail; 522. Second slider; 523. Fourth return spring; 53. Z-axis floating layer; 531. Ball joint; 5311. Ball head; 5312. Housing; 532. Limiting shaft; 533. Fifth return spring. Detailed Implementation
[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0035] Example 1: Please refer to Figures 1-6The multi-board power-on testing device based on FPC production shown includes an aging furnace material rack 1 installed inside an aging furnace and multiple material plates 2 installed on the aging furnace material rack 1. Multiple circuit boards 3 are mounted on the material plates 2, and all circuit boards 3 are electrically connected to the aging furnace via electrical signals. An elastic clamping mechanism 4 is provided between the material plates 2 and the circuit boards 3 for clamping the circuit boards 3. The elastic clamping mechanism 4 includes: multiple pairs of clamping rods 41, multiple pairs of clamping plates 43, multiple elastic telescopic airbags 44, and a drive mechanism 47. Each pair of clamping rods 41 has a slot 42, and the two sides of the circuit boards 3 are open to... A slot 42 is provided on the clamping rod 41; a pair of clamping plates 43 are slidably connected in the slot 42 of each clamping rod 41 and are used to clamp the circuit board 3; an elastic telescopic airbag 44 is provided on the clamping rod 41 and is used to push the clamping plates 43 to move, so as to provide clamping force on the circuit board 3; it can be understood that each clamping plate 43 corresponds to an elastic telescopic airbag 44, and the elastic telescopic airbag 44 is used to drive the pair of clamping plates 43 to move relative to or towards each other; a drive mechanism 47 is installed on the clamping rod 41 and is used to drive the elastic telescopic airbag 44 to expand or compress, so as to adjust the clamping force of the slot 42 on the circuit board 3.
[0036] It should be noted that the elastic telescopic airbag 44 is made of silicone rubber, which is existing technology and will not be described in detail. The elastic telescopic airbag 44 is fixed in the inner cavity of the clamping rod 41, and its telescopic end is connected to the clamping plate 43 through the connecting rod. When the elastic telescopic airbag 44 expands, it pushes the clamping plate 43 closer to the FPC, and when it contracts, it drives the clamping plate 43 away.
[0037] The elastic telescopic airbag 44 achieves adaptive clamping through the conversion of air pressure and mechanical force: when the elastic telescopic airbag 44 inflates, the internal air pressure increases, pushing the clamping plate 43 to apply clamping force to the FPC; when the FPC expands due to high temperature, its reaction force on the clamping plate 43 causes the elastic telescopic airbag 44 to be slightly compressed, and the clamping force decreases adaptively with the deformation of the FPC to avoid excessive compression; when the FPC contracts, the elastic telescopic airbag 44 maintains a certain amount of expansion under the action of the drive mechanism 47 to ensure that the clamping does not loosen; this elastic buffering mechanism, unlike the fixed force output of traditional rigid clamping, achieves dynamic matching between the clamping force and the deformation of the FPC.
[0038] By adaptively adjusting the elastic force, the FPC is kept stably clamped during high-temperature deformation, which solves the problems of excessive rigid clamping force causing FPC tearing and pad detachment, and insufficient force causing displacement. It can also clamp multiple FPCs at the same time, with each pair of clamping rods 41 corresponding to one FPC, which can meet the needs of multi-board synchronous testing and improve testing efficiency.
[0039] Please see Figures 1-4The clamping rod 41 is provided with a connecting tube 45 and a telescopic corrugated tube 46. One end of the connecting tube 45 is connected to the elastic telescopic airbag 44, and the other end of the connecting tube 45 is connected to the telescopic corrugated tube 46. The elastic telescopic airbag 44 is connected to the clamping plate 43 through the connecting tube 45 and the telescopic corrugated tube 46. When the elastic telescopic airbag 44 is inflated by force, the positive pressure inside the elastic telescopic airbag 44 is transmitted to the telescopic corrugated tube 46 through the connecting tube 45, causing the telescopic corrugated tube 46 to stretch under force, thereby driving the clamping plate 43 to move and enhance the clamping force on the circuit board 3.
[0040] It should be noted that when the elastic telescopic airbag 44 inflates, the internal positive pressure is transmitted to the telescopic bellows 46 through the connecting pipe 45, causing the telescopic bellows 46 to elongate due to the increased internal air pressure, thereby pushing the clamping plate 43 to move towards the FPC. Conversely, when the elastic telescopic airbag 44 compresses, the air pressure inside the telescopic bellows 46 decreases, and it contracts under the reaction force of the FPC or the action of the drive mechanism 47, causing the clamping plate 43 to return to its original position. The connecting pipe 45 ensures lossless transmission of air pressure, while the telescopic bellows 46 compensates for the displacement of the clamping plate 43 through its own deformation, achieving efficient conversion between air pressure and mechanical displacement.
[0041] The flexible transmission of the corrugated tube avoids a direct rigid connection between the elastic telescopic airbag 44 and the clamping plate 43, reducing stress concentration when the elastic telescopic airbag 44 expands and extending the service life of the airbag; at the same time, it ensures that the clamping force is evenly transmitted to the clamping plate 43, avoiding excessive local stress on the FPC due to uneven force transmission.
[0042] Please see Figures 1-4 The drive mechanism 47 includes a gear 471, a push block 473, a limiting mechanism 474, and a pair of racks 472. The gear 471 is rotatably connected to the clamping rod 41 around its axis. The pair of racks 472 are slidably connected to the clamping rod 41 along the extension and retraction direction of the elastic telescopic airbag 44, and the pair of racks 472 are respectively meshed on both sides of the gear 471. The push block 473 is slidably connected to the clamping rod 41, and the push block 473 is fixed to one of the racks 472. The limiting mechanism 474 is disposed on the clamping rod 41 and is used to limit the expansion and compression state of the elastic telescopic airbag 44.
[0043] It should be noted that the drive mechanism 47 achieves reverse force transmission through the meshing of gear 471 and rack 472: when the push block 473 is pushed to move, the rack 472 connected to it drives gear 471 to rotate clockwise, while the other rack 472 moves in the opposite direction, compressing the elastic telescopic airbag 44, thus reducing the clamping force; when the push block 473 is pulled in the opposite direction, gear 471 rotates counterclockwise, the other rack 472 retracts, and the elastic telescopic airbag 44 expands under its own elasticity, thus increasing the clamping force. This structure transforms unidirectional drive into bidirectional force output, achieving precise adjustment of the clamping force; the mechanical transmission for adjusting the clamping force is more compact than pure pneumatic or electric adjustment, making it suitable for the high-temperature, confined space inside the aging furnace; and the high transmission precision of gear 471 and rack 472 allows for fine-tuning of the clamping force, meeting the clamping requirements of FPCs of different thicknesses.
[0044] Please see Figures 1-4 The limiting mechanism 474 includes a pawl 4741 and a second return spring 4743. The pawl 4741 is rotatably connected to the clamping rod 41 via a rotating shaft. One of the racks 472 has a ratchet groove 4742 adapted to the pawl 4741. A first return spring is provided on the pawl 4741. When the pawl 4741 loses its restraint, the first return spring is used to drive the pawl 4741 to rotate so that the pawl 4741 resumes engagement with the ratchet groove 4742. The second return spring 4743 is disposed between the clamping rod 41 and the push block 473.
[0045] It should be noted that the limiting mechanism 474 forms a one-way lock through the pawl 4741 and the ratchet groove 4742 to maintain the clamping force: when the push block 473 is pushed to adjust the clamping force, the rack 472 moves, and the pawl 4741 is lifted by the inclined surface of the ratchet groove 4742 to overcome the spring force of the first return spring, allowing the rack 472 to move; when the push block 473 is released, the pawl 4741 is inserted into the ratchet groove 4742 under the action of the first return spring, preventing the rack 472 from moving in the opposite direction, thereby locking the current clamping force; if the reverse adjustment is required, the pawl 4741 needs to be manually moved to disengage from the ratchet groove 4742. At this time, the second return spring 4743 pushes the push block 473 to reset, thereby reducing the clamping force; the limiting mechanism 474 is designed to prevent unexpected changes in the clamping force due to vibration or micro-leakage of the elastic telescopic airbag 44 during the test, ensuring clamping stability; the operation is convenient, and the clamping force can be maintained without continuous external force, reducing the cost of manual or automated control.
[0046] Example 2: The technical solution in this example differs from that in Example 1 in that: Please refer to... Figures 1-4A floating three-dimensional platform 5 is provided between the material plate 2 and the elastic clamping mechanism 4. The floating three-dimensional platform 5 includes an X-axis sliding layer 51, a Y-axis sliding layer 52 and a Z-axis floating layer 53. The X-axis sliding layer 51 is installed on the material plate 2 and is used to provide micro-floating in the X direction when the circuit board 3 is deformed. The Y-axis sliding layer 52 is installed on the X-axis sliding layer 51 and is used to provide micro-floating in the Y direction when the circuit board 3 is deformed. The Z-axis floating layer 53 is installed between the Y-axis sliding layer 52 and the clamping rod 41 and is used to provide micro-floating in the Z direction when the circuit board 3 is deformed.
[0047] It should be noted that the floating three-dimensional platform 5 achieves multi-degree-of-freedom motion through layered stacking: when the FPC elongates in the X direction due to high temperature, it drives the elastic clamping mechanism 4 and the Z-direction floating layer 53 and Y-direction sliding layer 52 to slide along the X-axis with the X-direction sliding layer 51; when Y-direction expansion occurs, the Z-direction floating layer 53 slides along the Y-axis with the Y-direction sliding layer 52; when Z-direction warping or angular deformation occurs, the Z-direction floating layer 53 achieves Z-direction displacement or tilting through its own structure. The movement of each layer is independent and can be coordinated, comprehensively compensating for the three-dimensional thermal deformation of the FPC; releasing the mechanical stress generated by the thermal expansion and contraction of the FPC, avoiding cracking of copper foil circuits or substrates, especially in bending areas; and working in conjunction with the elastic clamping mechanism 4, forming a dual compensation mechanism of clamping and floating, further improving the stability of FPC testing.
[0048] Please see Figures 1-4 The X-axis sliding layer 51 includes a first base, a first slide rail 511, a first slider 512, and a third return spring 513. The first slide rail 511 is disposed on the material plate 2, and the first slider 512 is fixed to the bottom of the first base. The first base is slidably connected to the first slide rail 511 through the first slider 512. The third return spring 513 is disposed between the first slider 512 and the material plate 2. When the first base loses its restraint, the third return spring 513 is used to drive the first base to move and reset.
[0049] It should be noted that when the FPC undergoes thermal deformation in the X direction, the tension on the elastic clamping mechanism 4 is transmitted to the first base through the Z-direction floating layer 53 and the Y-direction sliding layer 52, pushing the first slider 512 to slide along the first slide rail 511, compressing or stretching the third return spring 513 to achieve X-direction displacement compensation; when the temperature decreases and the FPC contracts, the elastic force of the third return spring 513 pulls the first slider 512 to reset, causing the first base to return to its initial position; the X-direction sliding layer 51 accurately compensates for the X-direction thermal deformation of the FPC, avoiding tensile stress caused by forced constraint; and the third return spring 513 automatically resets, ensuring that the platform position is consistent after each test, which facilitates consistency of multiple batch tests.
[0050] Please see Figures 1-4The Y-axis sliding layer 52 includes a second base, a second slide rail 521, a second slider 522, and a fourth return spring 523. The second slide rail 521 is disposed on the first base, the second slider 522 is fixedly disposed on the bottom of the second base, and the second base is slidably connected to the second slide rail 521 through the second slider 522. The fourth return spring 523 is disposed between the second slider 522 and the second base. When the second base is unrestricted, the fourth return spring 523 is used to drive the second base to move and reset.
[0051] It should be noted that, similar to the principle of the X-axis sliding layer 51, when the FPC undergoes thermal deformation in the Y-axis, it pushes the second slider 522 to slide along the second slide rail 521, and the fourth return spring 523 deforms to store energy; when the FPC contracts, the elastic force of the fourth return spring 523 drives the second base to return to its original position. The Y-axis sliding layer 52 and the X-axis sliding layer 51 are vertically superimposed to jointly achieve deformation compensation of the FPC in any direction in the plane; the Y-axis thermal deformation compensation covering the FPC, together with the X-axis, forms stress release in all directions in the plane; the structure is symmetrical, the sliding resistance is small, and it ensures that the platform can smoothly follow the deformation of the FPC.
[0052] Please see Figures 1-4 The Z-direction floating layer 53 includes a ball joint 531 and multiple limiting shafts 532. The ball joint 531 is disposed between the second base and the clamping rod 41. The ball joint 531 includes a ball head 5311 and a housing 5312. The housing 5312 is fixed to the first base. One end of the ball head 5311 is connected to the housing 5312, and the other end of the ball head 5311 is fixed to the clamping rod 41. Multiple limiting shafts 532 are fixed to the housing 5312. One end of the multiple limiting shafts 532 extends downward and connects to the second base, and the other end of the multiple limiting shafts 532 extends upward to form a protrusion. The ball head 5311 and the housing 5312 are fitted with a clearance fit.
[0053] It should be noted that the ball joint 531 achieves multi-angle floating through the clearance fit between the ball head 5311 and the housing 5312: when the FPC warps in the Z direction, the ball head 5311 rotates within the housing 5312, causing the clamping rod 41 to tilt, compensating for the angular deformation of the FPC; when the FPC undergoes a slight change in the Z direction, the ball head 5311 can move slightly up and down along the housing 5312 to achieve Z-direction displacement compensation. The limiting shaft 532, through contact with the clamping rod 41, limits the maximum tilt angle of the ball head 5311, preventing excessive rotation that could cause the FPC to detach; the Z-direction floating layer 53 solves the deformation stress problem of the FPC in the Z direction and angular direction, making it particularly suitable for testing FPCs with bending areas; the limiting shaft 532 ensures that the floating range is controllable, improving the safety of the device.
[0054] Please see Figures 1-4A fifth return spring 533 is provided between the protrusion and the clamping rod 41; when the clamping rod 41 is unrestrained, the fifth return spring 533 is used to drive the clamping rod 41 to move so that the clamping rod 41 remains in a horizontal return state.
[0055] It should be noted that, under normal conditions, the fifth return spring 533 is in a slightly compressed state, applying an upward balanced elastic force to the clamping rod 41, causing the ball head 5311 to fit against the bottom of the groove of the housing 5312, ensuring that the clamping rod 41 remains horizontal; when the FPC deforms and causes the clamping rod 41 to tilt or sink, the spring at the corresponding position is further compressed or extended to store return energy; when the deformation disappears, the spring force drives the clamping rod 41 to return to a horizontal state; the fifth return spring 533 ensures the horizontal posture of the clamping rod 41 when there is no external force, which facilitates the clamping and positioning of the FPC; and assists the ball joint 531 in returning to its normal position, avoiding platform displacement caused by gravity or minor vibrations.
[0056] A method for testing the power-on performance of multiple boards manufactured using FPC, employing the aforementioned power-on performance testing device for multiple boards manufactured using FPC; specifically including the following steps:
[0057] Step 1, Elastic clamping: First, the circuit board 3 is initially clamped on both sides by the clamping plates 43 on a pair of clamping rods 41 to achieve initial fixation of the circuit board 3 in space; then, the elastic telescopic airbag 44 connected to the clamping plates 43 is used to further achieve elastic clamping of the circuit board 3.
[0058] Step 2, Clamping Adjustment: The expansion or contraction of the elastic telescopic airbag 44 is controlled by the drive mechanism 47; when the drive mechanism 47 drives the elastic telescopic airbag 44 to expand, it will push the clamping plate 43 connected to it to move towards the circuit board 3; when the drive mechanism 47 drives the elastic telescopic airbag 44 to contract, it will move the clamping plate 43 away from the circuit board 3, so as to adjust the clamping force of the clamping plate 43 on the circuit board 3.
[0059] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A multi-board power-on testing device based on FPC production, comprising multiple material boards (2) arranged on an aging furnace material rack (1) inside an aging furnace, wherein multiple circuit boards (3) are arranged on the material boards (2), characterized in that: An elastic clamping mechanism (4) is provided between the material plate (2) and the circuit board (3); a floating three-dimensional platform (5) is provided between the material plate (2) and the elastic clamping mechanism (4); the elastic clamping mechanism (4) includes multiple pairs of clamping rods (41) and multiple elastic telescopic airbags (44); each pair of clamping rods (41) is provided with a slot (42), and the two sides of the circuit board (3) are provided on the clamping rods (41) through the slots (42); the elastic telescopic airbags (44) are provided on the clamping rods (41) and are used to provide clamping force on the circuit board (3); the floating three-dimensional platform (5) is provided between the material plate (2) and the elastic clamping mechanism (44). The dynamic three-dimensional platform (5) includes an X-axis sliding layer (51), a Y-axis sliding layer (52), and a Z-axis floating layer (53); the X-axis sliding layer (51) is installed on the material plate (2) and is used to provide micro-floating in the X direction when the circuit board (3) is deformed; the Y-axis sliding layer (52) is installed on the X-axis sliding layer (51) and is used to provide micro-floating in the Y direction when the circuit board (3) is deformed; the Z-axis floating layer (53) is installed between the Y-axis sliding layer (52) and the clamping rod (41) and is used to provide micro-floating in the Z direction when the circuit board (3) is deformed.
2. The multi-board power-on testing device based on FPC production according to claim 1, characterized in that: The clamping rod (41) is provided with a connecting tube (45) and a telescopic corrugated tube (46); one end of the connecting tube (45) is connected to the elastic telescopic airbag (44), and the other end of the connecting tube (45) is connected to the telescopic corrugated tube (46). The elastic telescopic airbag (44) is connected to the clamping plate (43) through the connecting tube (45) and the telescopic corrugated tube (46). When the elastic telescopic airbag (44) is inflated by force, the positive pressure inside the elastic telescopic airbag (44) is transmitted to the telescopic corrugated tube (46) through the connecting tube (45), causing the telescopic corrugated tube (46) to stretch under force, thereby driving the clamping plate (43) to move and enhance the clamping force on the circuit board (3).
3. The multi-board power-on testing device based on FPC production according to claim 1, characterized in that: The elastic clamping mechanism (4) also includes multiple pairs of clamping plates (43) and a driving mechanism (47); a pair of clamping plates (43) are slidably connected in the slot (42) of each clamping rod (41) and are used to clamp the circuit board (3); the driving mechanism (47) is installed on the clamping rod (41) and is used to drive the elastic telescopic airbag (44) to expand or compress in order to adjust the clamping force of the slot (42) on the circuit board (3).
4. The multi-board power-on testing device based on FPC production according to claim 3, characterized in that: The drive mechanism (47) includes a gear (471), a pusher (473), a limiting mechanism (474), and a pair of racks (472); the gear (471) is rotatably connected to the clamping rod (41) about its axis, and the pair of racks (472) are slidably connected to the clamping rod (41) along the extension and retraction direction of the elastic telescopic airbag (44), and the pair of racks (472) are respectively meshed on both sides of the gear (471); the pusher (473) is slidably connected to the clamping rod (41), and the pusher (473) is fixed to one of the racks (472); the limiting mechanism (474) is provided on the clamping rod (41) and is used to limit the expansion and compression state of the elastic telescopic airbag (44).
5. The multi-board power-on testing device based on FPC production according to claim 4, characterized in that: The limiting mechanism (474) includes a pawl (4741) and a second return spring (4743); the pawl (4741) is rotatably connected to the clamping rod (41) via a rotating shaft, and a ratchet groove (4742) adapted to the pawl (4741) is provided on one of the racks (472); a first return spring is provided on the pawl (4741); when the pawl (4741) loses its restriction, the first return spring is used to drive the pawl (4741) to rotate so that the pawl (4741) resumes engagement with the ratchet groove (4742); the second return spring (4743) is provided between the clamping rod (41) and the push block (473).
6. The multi-board power-on testing device based on FPC production according to claim 5, characterized in that: The X-axis sliding layer (51) includes a first base, a first slide rail (511), a first slider (512), and a third reset spring (513); the first slide rail (511) is disposed on the material plate (2), the first slider (512) is fixed to the bottom of the first base, and the first base is slidably connected to the first slide rail (511) through the first slider (512); the third reset spring (513) is disposed between the first slider (512) and the material plate (2); when the first base loses its restraint, the third reset spring (513) is used to drive the first base to move and reset.
7. The multi-board power-on testing device based on FPC production according to claim 6, characterized in that: The Y-axis sliding layer (52) includes a second base, a second slide rail (521), a second slider (522), and a fourth reset spring (523); the second slide rail (521) is disposed on the first base, the second slider (522) is fixed to the bottom of the second base, the second base is slidably connected to the second slide rail (521) through the second slider (522), and the fourth reset spring (523) is disposed between the second slider (522) and the second base; when the second base is unrestricted, the fourth reset spring (523) is used to drive the second base to move and reset.
8. The multi-board power-on testing device based on FPC production according to claim 7, characterized in that: The Z-direction floating layer (53) includes a ball joint (531) and a plurality of limiting shafts (532); the ball joint (531) is disposed between the second base and the clamping rod (41); the ball joint (531) includes a ball head (5311) and a housing (5312); the housing (5312) is fixed to the first base, one end of the ball head (5311) is connected to the housing (5312), and the other end of the ball head (5311) is fixed to the clamping rod (41); the plurality of limiting shafts (532) are fixed to the housing (5312); one end of the plurality of limiting shafts (532) extends downward and connects to the second base, and the other end of the plurality of limiting shafts (532) extends upward to form a protrusion; The ball head (5311) and the shell (5312) are fitted with a clearance.
9. A multi-board power-on testing device based on FPC production according to claim 8, characterized in that: A fifth return spring (533) is provided between the protrusion and the clamping rod (41); when the clamping rod (41) loses its restraint, the fifth return spring (533) is used to drive the clamping rod (41) to move so that the clamping rod (41) remains in a horizontal return state.
10. A method for testing the power-on performance of multiple boards based on FPC production, characterized in that: The multi-board power-on testing device based on FPC production as described in claim 3 specifically includes the following steps: Step 1, elastic clamping: First, the circuit board (3) is initially clamped on both sides by the clamping plates (43) on a pair of clamping rods (41) to achieve initial fixation of the circuit board (3) in the spatial position; then, the elastic telescopic airbag (44) connected to the clamping plates (43) is used to achieve elastic clamping of the circuit board (3); Step 2, clamping adjustment: The expansion or contraction of the elastic telescopic airbag (44) is controlled by the drive mechanism (47); when the drive mechanism (47) drives the elastic telescopic airbag (44) to expand, it will push the clamping plate (43) connected to it to move towards the circuit board (3); when the drive mechanism (47) drives the elastic telescopic airbag (44) to contract, it will make the clamping plate (43) move away from the circuit board (3) so as to adjust the clamping force of the clamping plate (43) on the circuit board (3).
Citation Information
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