Probe card test mother board

Abstract

The invention discloses a probe card testing mother board, relates to the technical field of semiconductor testing, and discloses the probe card testing mother board which comprises a cover plate and a probe card fixing plate rotatably connected with the cover plate. An ox horn joint and a conductive connecting piece are arranged on the cover plate, the ox horn joint is used for connecting a testing machine, and the ox horn joint is electrically connected with the conductive connecting piece; the conductive connecting piece is arranged on the side, facing the probe card fixing plate, of the cover plate, and when the cover plate is pressed to the probe card fixing plate, the conductive connecting piece is electrically connected with the probe of the probe card. According to the invention, the problem that the connection between the probe card and the test machine is tedious in the traditional scheme is solved, the reliability and efficiency of the connection are improved, in addition, an operator can replace the probe card more quickly for testing, the test period is greatly shortened, and the test efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor testing, in particular to a probe card test motherboard. BACKGROUND

[0002] In the electronic core industry, the probe card is the core consumable in the wafer testing link, and mainly functions to realize the electrical connection between the chips on the wafer and the tester, transmit the test signals of the tester to the chips, and transmit the response signals of the chips back to the tester, so as to complete the electrical performance and function test of the chips.

[0003] In the related technical solution, when the probe card is connected to the tester, each pin on the probe card needs to be connected to the interface socket or terminal row of the tester through a cable. Once the probe card is replaced, the operator must strictly follow the pin definition to reconnect all the cables, which is cumbersome to operate. SUMMARY

[0004] The present application provides a probe card test motherboard, which can save the process of reconnecting the tester cable when testing and replacing the probe card, greatly improving the test efficiency and operation convenience.

[0005] To achieve the above-mentioned purpose, the present application provides a probe card test motherboard, which comprises a cover plate and a probe card fixing plate rotatably connected to the cover plate. The probe card fixing plate is used to fix the probe card to be tested. The cover plate is provided with a bull horn and a conductive connecting piece, the bull horn is used to connect the tester, and the bull horn is electrically connected to the conductive connecting piece. The conductive connecting piece is arranged on one side of the cover plate facing the probe card fixing plate, and when the cover plate is pressed to the probe card fixing plate, the conductive connecting piece is electrically connected to the probe of the probe card.

[0006] In an embodiment, the probe card fixing plate is provided with a vacuum adsorption device, which is used to adsorb the cover plate by vacuum adsorption when the cover plate and the probe card fixing plate are pressed.

[0007] In an embodiment, the probe card fixing plate is provided with a vacuum adsorption device, which is used to adsorb the cover plate by vacuum adsorption when the cover plate and the probe card fixing plate are pressed.

[0008] In an embodiment, the vacuum adsorption device comprises: A pipeline interface is used to connect a vacuum pump. suction holes arranged on the surface of the probe card fixing plate; vacuum pipes arranged inside the probe card fixing plate, which are in communication with the pipe interface and the suction holes; sealing rings arranged around the suction holes.

[0009] In an embodiment, the probe card test motherboard further comprises a locking device for locking the cover plate and the probe card fixing plate.

[0010] In an embodiment, the cover plate comprises: a top layer on which the cowhorn connectors are arranged, the wire harness end of the cowhorn connector being used for connecting the test machine; an intermediate interconnection layer which is electrically connected with the plug-in end of the cowhorn connector; a connector mounting layer which is electrically connected with the intermediate interconnection layer, and the connector mounting layer is provided with the conductive connectors on the side facing the probe card fixing plate.

[0011] In an embodiment, the conductive connectors are elastic conductive connectors.

[0012] In an embodiment, the conductive connectors are spring pins.

[0013] In an embodiment, the conductive connectors comprise a plurality of conductive connectors, and the arrangement of the plurality of conductive connectors matches the arrangement of the probes on the probe card.

[0014] In an embodiment, the probe card fixing plate further comprises a leveling mechanism for adjusting the horizontal state of the probe card fixing plate.

[0015] In an embodiment, the probe card fixing plate is provided with a positioning pin for positioning the probe card.

[0016] The probe card test motherboard provided in the present application has at least the following technical effects: The probe card test motherboard of the application comprises a cover plate, a probe card fixing plate rotatably connected with the cover plate; a bull horn and a conductive connecting piece are arranged on the cover plate, the bull horn is used for connecting a test machine, the bull horn is electrically connected with the conductive connecting piece; the conductive connecting piece is arranged on one side of the cover plate facing the probe card fixing plate, and when the cover plate is pressed to the probe card fixing plate, the conductive connecting piece is electrically connected with the probe of the probe card. By adding the cover plate in the probe card test motherboard, the bull horn and the conductive connecting piece are integrated on the cover plate, the bull horn conducts the signal of the test machine to the conductive connecting piece, when the cover plate is pressed to the probe card fixing plate, the conductive connecting piece is electrically connected with the probe, thereby the signal of the test machine is transmitted to the probe, the problem that the connection between the probe card and the test machine is complicated in the traditional scheme is solved, the reliability and efficiency of the connection are improved, and the operation difficulty and the error probability are reduced. In addition, when a new probe card is replaced, only the upper cover plate is opened, the new probe card is placed on the probe card fixing plate, and then the cover plate is pressed, so that the signal connection between the new probe card and the test machine is realized, the rapid replacement test of the probe card can be supported, the test period is greatly shortened, and the test efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0017] The drawings incorporated into the specification and constituting a part of the specification show embodiments consistent with the application and, together with the specification, serve to explain the principles of the application.

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced below, and obviously, other drawings can also be obtained by those skilled in the art without creative labor.

[0019] Figure 1 A structural schematic diagram of a probe test system to which the probe card test motherboard of the application is applied; Figure 2 A structural schematic diagram of one of the embodiments of the probe card test motherboard of the application; Figure 3 An exploded schematic diagram of the cover plate in the probe card test motherboard of the application; Figure 4 A Figure 3 A local enlarged view of A in FIG. 6; Figure 5 A structural schematic diagram of the cover plate in the probe card test motherboard of the application in an embodiment; Figure 6 A schematic diagram of the positional relationship between the through hole and the step in the probe card test motherboard of the application; Figure 7 A structural schematic diagram of the probe fixing plate in the probe card test motherboard of the application in an embodiment; Figure 8 A flowchart of a probe performance test method provided for the embodiment; Figure 9 A structural block diagram of a line communication test system provided for the application.

[0020] In the figure, M1 is a probe card test motherboard; M2 is a leveling mechanism; M3 is a probe test device; M4 is a test device positioning mechanism; M21 is a vertical slide rail; M22 is an extension arm; M23 is a fixed plate lifting mechanism; M24 is a fixed plate overturning mechanism; M25 is a fixed plate vacuum chuck; M41 is a Y-axis module; M42 is an X-axis module; M43 is a Z-axis module; 1 is a cover plate; 2 is a probe card fixed plate; 3 is a locking device; 4 is a rotating seat; 11 is a horn joint; 12 is a top layer; 13 is an intermediate interconnection layer; 14 is a connecting piece mounting layer; 141 is a needle plate; 15 is a conductive connecting piece; 16 is a through hole; 7 is a boss; 21 is a pipeline interface; 22 is a suction hole; 25 is a positioning pin; 31 is a handle assembly; and 32 is an embedded hole. DETAILED DESCRIPTION

[0021] It should be understood that the specific embodiments described herein are merely intended to explain the technical solutions of the present application, and are not intended to limit the present application.

[0022] In order to better understand the technical solutions of the present application, the following will be described in detail in combination with the accompanying drawings and specific embodiments.

[0023] In the related technical solutions, when the probe card is connected with the test machine, each pin on the probe card needs to be connected to the interface or terminal of the test machine through a cable. Once the probe card is replaced, the operator must strictly follow the pin definition to reconnect all the cables, which is cumbersome to operate.

[0024] To solve the above problems, the present application provides a probe card test motherboard. The probe card test motherboard of the present embodiment can be applied to a probe test system. Please refer to Figure 1 , Figure 1 A structural diagram of a probe test system is shown. The probe test system includes a probe card test motherboard M1, Figure 1 only the probe card fixed plate on the probe card test motherboard is drawn, and the specific structure of the probe card test motherboard will be described in the related content below), a leveling mechanism M2, a probe test device M3, and a test device positioning mechanism M4. The probe card test motherboard M1 is used to place and fix the probe card.

[0025] The leveling mechanism M2 is used to adjust and position the probe card fixed plate in the probe card test motherboard M1.

[0026] The probe testing device M3 is used for testing mechanical performance and electrical performance of the probe, and comprises a testing platform, an electrical performance testing mechanism and a pressure testing mechanism arranged on the testing platform, and a visual detection mechanism, the testing platform is used for contacting with the probe to be tested, so that the electrical performance testing mechanism and the pressure testing mechanism test the probe to be tested, and the visual detection mechanism is used for visually detecting the probe to be tested.

[0027] Preferably, the leveling mechanism M2 comprises a vertical sliding rail M21, an extension arm M22, a fixed plate lifting mechanism M23, a fixed plate overturning mechanism M24 and a plurality of fixed plate positioning assemblies, the vertical sliding rail M21 is provided with a movable part, the extension arm M22 is fixedly connected to the movable part, and the fixed plate lifting mechanism M23 drives the movable part to move up and down along the vertical sliding rail M21; the fixed plate overturning mechanism M24 is arranged at the end of the extension arm M22, the extension arm M22 is connected to the probe card fixed plate through the fixed plate overturning mechanism M24, and the fixed plate overturning mechanism M24 drives the probe card fixed plate to overturn up and down; each fixed plate positioning assembly comprises a fixed plate vacuum chuck M25 and a positioning tower vacuum lock, the plurality of fixed plate vacuum chucks M25 are uniformly arranged at the edges of the probe card fixed plate, and the positioning tower vacuum lock is fixedly arranged on the equipment support; during testing, the positioning tower vacuum lock locks the fixed plate vacuum chuck M25 to fix the probe card fixed plate.

[0028] Specifically, the probe card is mounted on the probe card testing motherboard M1, the fixed plate overturning mechanism M24 rotates the probe card fixed plate, so that the probes on the probe card are downward and face the probe testing device M3; the fixed plate lifting mechanism M23 is used for adjusting the height of the probe card fixed plate, and the plurality of fixed plate positioning assemblies are used for fixing the probe card fixed plate.

[0029] Preferably, the probe testing device M3 is installed above the testing device positioning mechanism M4 and moves with the testing device positioning mechanism M4; the testing device positioning mechanism M4 comprises a Y-axis module M41, an X-axis module M42 and a Z-axis module M43 arranged in sequence from bottom to top, wherein the X-axis module M42 and the Y-axis module M41 drive the probe testing module M43 to move in the horizontal direction, and the Z-axis module M43 drives the probe testing device M3 to move in the vertical direction.

[0030] Preferably, the Z-axis module M43 comprises an upper sliding block, a lower sliding block and an L-shaped support, the upper sliding block and the lower sliding block are in contact through a slope with a predetermined inclination; the L-shaped support comprises a vertical guide plate and a horizontal guide plate arranged perpendicular to each other, the upper sliding block and the lower sliding block move along the guide rails on the vertical guide plate and the horizontal guide plate respectively, and when the lower sliding block moves along the horizontal guide plate, the upper sliding block is driven to move up and down along the vertical guide plate. Specifically, the Z-axis module M43 converts the vertical lifting movement into horizontal movement by two sliding assemblies which contact each other on an inclined surface, and increases the precision of the vertical movement of the probe test module.

[0031] The contact surface between the upper sliding block and the lower sliding block is an inclined surface, and the inclination angle and length of the inclined surface determine the ratio of the displacement distance between the upper sliding block and the lower sliding block. The width of the lower sliding block is smaller than the width of the upper sliding block, so that the lower sliding block can move below the upper sliding block. Specifically, the Z-axis module M43 further includes a Z-axis lifting motor and a Z-axis lifting screw, and the Z-axis lifting motor drives the lower sliding block to move horizontally through the Z-axis lifting screw. The inclined surface of the bottom surface of the upper sliding block has a first end and a second end, wherein the distance between the first end and the horizontal guide plate is greater than the distance between the second end and the horizontal guide plate. When the lower sliding block moves from the first end to the second end of the upper sliding block, the lower sliding block pushes the upper sliding block to move upwards, and when the lower sliding block moves from the second end to the first end of the upper sliding block, the lower sliding block drives the upper sliding block to move downwards. Preferably, the visual detection mechanism includes a camera and an optical element, the camera adopts a telecentric lens, and the optical element is arranged corresponding to the telecentric lens to change the light reflected by the needle tip of the probe card, so that the telecentric lens obtains the image of the needle tip of the probe card. Preferably, a needle pressure sensor and an electrical performance test sensor are arranged below the test platform to collect the needle pressure and electrical performance data of the probe.

[0032] The specific implementation of the probe card test motherboard of the embodiment of the present application will be described in detail below with reference to the accompanying drawings.

[0033] Please refer to Figures 2-5 The probe card test motherboard M1 of the embodiment includes a cover plate 1 and a probe card fixing plate 2 rotatably connected to the cover plate 1. The probe card fixing plate 2 is used to fix the probe card to be tested, and the cover plate 1 is provided with a horn joint 11 and a conductive connecting piece 15. The horn joint 11 is used to connect the test machine, and the horn joint 11 is electrically connected with the conductive connecting piece 15. Specifically, the conductive connecting piece 15 is provided with a plurality of conductive connecting pieces 15, and each conductive connecting piece 15 is arranged on the side of the cover plate 1 facing the probe card fixing plate 2. When the cover plate 1 is pressed to the probe card fixing plate 2, the conductive connecting piece 15 is electrically connected with the probe of the probe card.

[0034] In some embodiments, the cover plate 1 is rotatably connected to the probe card fixing plate 2 through a rotating seat 4.

[0035] Specifically, the horn connector 11 is a connector for crimping a ribbon cable. In this embodiment, the wire harness end of the horn connector 11 is used to connect to a test machine, and the plug-in end is used to electrically connect to the conductive connector 15. The plug-in end of the horn connector 11 can be implemented by a metal terminal. In some embodiments, the plug-in end can include an array of pins (i.e., surface gold-plated straight pins / bent pins).

[0036] In this embodiment, the horn connector 11 serves as an interface unit at the test machine end, which can access various resources of the test machine (including test signals, control signals, etc.). The plug-in end of the horn connector 11 is electrically connected to the conductive connector 15, so that the signals output by the test machine can be transmitted to the conductive connector 15 and, through the pressing operation of the cover plate 1, the mechanical pressure is used to form electrical contact between the conductive connector 15 and the tail end of the probe, thereby transmitting the signals of the test machine to the probe. The tail end of the probe refers to the area where the probe tail contacts the pad on the probe card. The flow direction of the test signal in the entire process is: test machine → horn connector → conductive connector → probe tail → probe tip.

[0037] Through the probe card test motherboard provided in this embodiment, the operator does not need to connect each pin on the probe card to each resource port of the test machine one by one through a cable, solving the problem of complicated connection between the probe card and the test machine in the traditional scheme, reducing the operation difficulty and the probability of error. By using the horn connector and the conductive connector together, the signals of the test machine are switched to the conductive connector. When the cover plate is pressed to the probe card fixing plate, the conductive connector is electrically connected to the probe, thereby transmitting the resources or signals of the test machine to the probe, realizing the line communication between the probe and the test machine. At the same time, when the operator replaces the probe card, it is not necessary to reconnect the test machine cable. Only by opening the cover plate and placing the new probe card on the probe card fixing plate, and then closing the cover plate, the electrical connection between the new probe card and the test machine can be realized, which can replace the probe card for testing faster, greatly shortening the test period and improving the test efficiency.

[0038] In some embodiments, the probe card fixing plate 2 is provided with a positioning pin 25 for positioning the probe card to be placed.

[0039] In some embodiments, the cover plate 1 adopts a composite multi-layer structure. Specifically, please refer to Figures 2-4 , the cover plate 1 includes a top layer 12, an intermediate interconnection layer 13, and a connector mounting layer 14. The top layer 12 is provided with the horn connector 11, the wire harness end of which is used to connect to the test machine, and the plug-in end of the horn connector 11 penetrates through the top layer 12 and is welded on the intermediate interconnection layer 13. The connector mounting layer 14 is electrically connected to the intermediate interconnection layer 13, and the side of the connector mounting layer 14 facing the probe card fixing plate 2 is provided with the conductive connector 15.

[0040] Specifically, an array of mounting slots is provided on the upper surface of the top layer 12, and each mounting slot is used to install a bullhorn connector 11. The intermediate interconnection layer 13 adopts a printed circuit board, and the plug-in end of the bullhorn connector 11 is soldered to the printed circuit board through a solder pad to achieve electrical connection between the plug-in end of the bullhorn connector 11 and the intermediate interconnection layer 13. The intermediate interconnection layer 13 is electrically connected to the connector mounting layer 14 through a routing structure and a via design. A pin plate 141 is provided on the connector mounting layer 14, and arranged and distributed through holes 16 are provided on the pin plate 141. The size of the through hole 16 matches the conductive connector 15. The conductive connector 15 is installed on the through hole 16, and the electrical connection part of the conductive connector 15 protrudes from the surface of the connector mounting layer 14. The surface of the electrical connection part of the conductive connector 15 is treated by gold plating or silver plating to improve the conductivity and corrosion resistance of the conductive connector 15, ensuring that a stable electrical connection can be maintained during long-term use.

[0041] In some embodiments, a plurality of conductive connectors 15 are provided, and the plurality of conductive connectors 15 match the arrangement of the probes on the probe card to ensure that during the process of pressing the cover plate 1 to the probe card fixing plate 2 in the vertical direction, each conductive connector 15 can achieve one-to-one contact with the tail connection end of the corresponding probe to form a stable electrical connection, thereby ensuring the complete transmission of the test signal between the probe and the test machine.

[0042] In some embodiments, the conductive connector 15 is an elastic conductive connector. During the pressing operation of the cover plate 1, the spring structure built into the elastic conductive connector will be compressed under the action of the pressing force. Through this compression deformation design, a continuous and uniform pressure can be generated from the cover plate 1 to the probe card fixing plate 2 from top to bottom. This pressure can make the elastic conductive connector fit tightly with the surface of the probe card, effectively eliminating the tiny gaps and mechanical vibrations on the contact surface. Through the synergistic effect of the mechanical positioning structure and the elastic compensation mechanism, each conductive connector 15 can contact the tail connection end of the probe, which not only ensures the formation of stable electrical contact between the conductive connector 15 and the probe, but also can dynamically adapt to the tiny displacements caused by mechanical vibrations, thereby ensuring the continuity and stability of signal transmission.

[0043] Preferably, the conductive connector 15 is a spring pin. A spring pin is a connection terminal that utilizes a built-in spring to achieve elastic, retractable contact. The spring pin consists of a needle tube, a needle tip, and a spring. The spring force ensures a reliable, low-resistance electrical connection between the needle tip and the probe's tail connector. When pressure is released, the spring pushes the needle tip back into place.

[0044] See Figure 7In some preferred embodiments, a boss 7 is arranged at the position of each through hole 16 of the needle plate 141, the boss 7 is in the shape of a truncated cone as a whole and is arranged around the through hole 16, coaxial with the through hole 16, the inner diameter of the upper surface of the boss 7 is slightly larger than the outer diameter of the conductive connecting piece 15 to form a certain guiding gap. Taking the conductive connecting piece 15 as a spring needle for example, when the spring needle is inserted into the through hole 16, the boss 7 can guide the spring needle to accurately enter the predetermined position, avoiding the inclination or position deviation of the spring needle due to installation deviation. At the same time, the boss 7 can also play a certain limiting role. During the pressing process of the cover plate 1, the spring needle will be subjected to a certain pressure and there is a risk of excessive movement in the vertical direction. Through the design of the boss 7, when the spring needle moves downward to a certain extent, the spring needle can be limited to avoid the misalignment of the tail end of the spring needle and the probe due to the angle deviation of the spring needle, which ensures that the contact between the spring needle and the probe always remains in the correct position and angle, ensuring the stability and reliability of signal transmission.

[0045] Please refer to Figure 2 In some embodiments, the probe card test mother plate further comprises a locking device 3 for locking the cover plate 1 and the probe card fixing plate 2.

[0046] Specifically, please refer to Figure 2 The locking device 3 comprises a handle assembly 31 arranged on the cover plate 1 and an embedded hole 32 arranged on the upper surface of the probe card fixing plate 2. In some embodiments, the handle assembly 31 comprises a handle and a connecting rod, the handle is provided with anti-slip texture, and the connecting rod penetrates the upper cover plate 1 and extends downward. The bottom of the connecting rod is provided with a protruding block for cooperating with the corresponding embedded hole on the probe card fixing plate 2. The handle assembly 31 and the embedded hole 32 can comprise a plurality of, and the position of the protruding block of each handle assembly 31 corresponds to the position of the embedded hole 32, so that the protruding block can be clamped on the embedded hole 32. Preferably, the number of handle assemblies 31 and embedded holes 32 is 2, and the two handle assemblies 31 are symmetrically arranged at the edges of the upper surface of the cover plate 1, and the two embedded holes 32 are symmetrically arranged at the edges of the probe fixing plate 2.

[0047] In some embodiments, the handle assembly 31 comprises a handle and a threaded connecting rod, the handle is provided with a non-slip texture, and the threaded connecting rod penetrates through the cover plate 1 and extends downward. The threaded connecting rod is provided with threads matched with the corresponding screw holes on the probe card fixing plate 2. The specifications and pitches of the threads are matched with the corresponding screw holes on the probe card fixing plate 2, which ensures that the threads can be smoothly screwed into the screw holes and achieve reliable locking connection. When locking the cover plate 1 and the probe card fixing plate 2, the operator places the cover plate 1 on the probe card fixing plate 2, aligns the threaded connecting rod with the corresponding screw holes. Then, rotate the handle, the threaded connecting rod gradually screws into the screw hole with the rotation of the handle, as the screwing depth increases, the gap between the cover plate 1 and the probe card fixing plate 2 gradually decreases, until they are tightly fitted, achieving locking.

[0048] In some embodiments, the probe card fixing plate 2 is provided with a vacuum suction device for suctioning the cover plate 1 by vacuum suction when the cover plate 1 and the probe card fixing plate 2 are pressed together.

[0049] Please refer to Figure 7 , the vacuum suction device comprises a pipeline interface 21, a suction hole 22, a vacuum pipeline (not shown in the figure) and a sealing ring (not shown in the figure). Among them, the pipeline interface 21 is used to connect the vacuum pump; the suction hole 22 is arranged on the surface of the probe card fixing plate 2, the vacuum pipeline is arranged inside the probe card fixing plate 2, and the vacuum pipeline is in communication with the pipeline interface 21 and the suction hole 22, and the sealing ring is arranged around the suction hole 22.

[0050] Specifically, the pipeline interface 21 is arranged at the edge, side or bottom of the upper surface of the probe card fixing plate 2, and the inner diameter size is matched with the outer diameter of the vacuum pump output pipeline, so as to ensure that the connection is tight and leak-proof, and the stable operation of the vacuum suction device is ensured.

[0051] The suction hole 22 is arranged in the contact area of the surface of the probe card fixing plate 2 and the cover plate 1. The number of suction holes 22 can be designed according to the specific size of the probe card fixing plate 2. For example, for small probe card fixing plates 2, 2-4 suction holes 22 can be arranged, and for large probe card fixing plates, the number of suction holes 22 can be designed to be 6-10 or even more.

[0052] Further, in order to ensure that the cover plate 1 is uniformly stressed during pressing, and to avoid poor sealing caused by uneven local stress, every two suction holes 22 are symmetrically designed on the probe card fixing plate 2. Through this symmetrical layout, the vacuum suction force can be uniformly distributed on the contact surface between the cover plate 1 and the probe card fixing plate 2, improving the stability and reliability of the suction. Preferably, the suction holes 22 can be symmetrically designed around the placement area of the probe card.

[0053] Preferably, the suction hole 22 is designed in a circular shape, which can reduce air flow resistance.

[0054] The sealing ring corresponds to the adsorption hole 22 and is arranged on the surface of the probe card fixing plate 2 around the adsorption hole 22. By designing the sealing ring around the adsorption hole 22, the small gap between the cover plate 1 and the probe card fixing plate 2 can be filled to prevent vacuum leakage. The sealing ring can be made of rubber materials such as silicone rubber, fluorine rubber, etc.

[0055] Further, to optimize the performance of the sealing ring, reduce the friction coefficient between the sealing ring and the cover plate 1, and reduce the wear caused by friction, the surface of the sealing ring can be coated with silicone oil or fluorine lubricant. Silicone oil has good lubricity and chemical stability, and fluorine lubricant has higher temperature resistance and chemical corrosion resistance.

[0056] Through the symmetrical layout of the adsorption holes and the optimized design of the sealing rings, the cover plate can be uniformly stressed and tightly attached to the probe card fixing plate during the cover plate pressing process. At the same time, the vacuum pump provides a stable vacuum source to the vacuum pipeline through the pipeline interface, so that a negative pressure is formed at the adsorption hole, and the cover plate is firmly adsorbed on the fixing plate. This design enables the contact surface of the cover plate to be tightly attached to the probe card, ensuring that the signal of the conductive connector can be reliably transmitted to the tail end of the probe, realizing reliable electrical connection between the probe and the tester.

[0057] Please refer to Figure 8 , Figure 8 is a flowchart of the probe performance test method provided in the embodiment. The probe performance test method of the embodiment includes steps S10-S40: Step S10, connect the horn joint of the probe card test motherboard to the tester.

[0058] Specifically, the wire harness end of the horn joint is connected to the port of the tester through the tester cable.

[0059] Step S20, open the cover plate of the probe card test motherboard, and place the probe card to be tested on the probe card fixing plate of the probe card test motherboard.

[0060] The probe card test motherboard in the embodiment includes a locking device for locking the cover plate and the probe card fixing plate. Specifically, if the locking device of the probe card test motherboard is in the unlocked state, the cover plate is opened; if the locking device of the cover plate is in the locked state, the locking device is unlocked and the cover plate is opened.

[0061] Step S30, press the cover plate to the probe card fixing plate, so that the conductive connector of the cover plate and the probe card are electrically connected.

[0062] In the embodiment, the probe card fixing plate is further provided with a vacuum adsorption device. When the cover plate is pressed against the probe card fixing plate, the vacuum adsorption device on the probe card fixing plate is used to perform a vacuum adsorption operation. After the vacuum adsorption operation is performed, the cover plate and the probe card fixing plate are locked by the locking device.

[0063] Further, the probe card fixing plate is provided with pressure sensors. The number of the pressure sensors is at least two. Preferably, the number of the pressure sensors is four. The four pressure sensors are symmetrically arranged at four corners of the probe card fixing plate with the center of the probe card fixing plate as the reference. When the cover plate is pressed, the pressure values detected by the four pressure sensors on the probe card fixing plate can intuitively reflect the distribution of the pressure on the probe card fixing plate.

[0064] In some embodiments, the pressing process of the cover plate against the probe card fixing plate can include: Step a1, connect the pipeline interface of the vacuum adsorption device to the vacuum pump through a conduit, and calibrate the zero point of each pressure sensor on the probe card fixing plate.

[0065] Step a2, close the cover plate, and insert the threaded connecting rod of the locking device into the corresponding screw hole on the probe card fixing plate.

[0066] In the embodiment, the locking device includes a handle and a threaded connecting rod. The threaded connecting rod extends downward through the cover plate. The threaded connecting rod is provided with threads for cooperating with the corresponding screw hole on the probe card fixing plate. When the cover plate is closed, the tail of the threaded connecting rod is inserted into the corresponding screw hole, thereby achieving the clamping of the cover plate against the probe card fixing plate.

[0067] Step a3, start the vacuum pump to perform the vacuum adsorption, and monitor the pressure values detected by each pressure sensor. If the difference between the pressure values is within the preset pressure error range, stop the vacuum adsorption operation. If the difference between the pressure values is not within the preset pressure error range, rotate the handle to adjust the depth of the threaded connecting rod screwed into the screw hole until the difference between the pressure values is within the preset pressure error range, and stop the vacuum adsorption operation.

[0068] Specifically, if the difference between each pressure value is within the preset pressure error range, it indicates that the pressure distribution between the cover plate and the probe card fixing plate is uniform, at which time the vacuum adsorption operation can be stopped. If the difference between each pressure value is not within the preset pressure error range, it indicates that the pressure distribution is not uniform, then the handle of the handle assembly is rotated to adjust the screwing depth between the threaded connecting rod and the screw hole, thereby changing the contact pressure between the connecting rod and the screw hole, and further adjusting the pressure applied to the probe card fixing plate, until the difference between the pressure values detected by each pressure sensor is relatively small, to ensure that the pressure between the cover plate and the probe card fixing plate is uniformly distributed, avoid affecting the electrical connection performance of the spring needle and the probe contact due to uneven pressure, and thereby causing the signal transmitted to the probe by the test machine to be unstable.

[0069] Step S40, the performance of the probe of the probe card is tested by the probe testing device.

[0070] Specifically, the probe card testing device includes a test platform and an electrical performance testing mechanism and a pressure testing mechanism and a visual detection mechanism arranged on the test platform. During testing, the test platform is moved by the testing device positioning device to contact the probes on the probe card, and the needle tip image of the probe card is obtained by the visual detection structure, and the probe position and needle tip diameter are obtained by analyzing the needle tip image, thereby completing the position and needle tip diameter test of the probe. In addition, a certain pressure value can be applied to the probe by the pressure testing mechanism arranged on the test platform to complete the pressure test of the probe.

[0071] The embodiment transmits the resources of the test machine to the probe through the horn joint and the conductive connecting piece, without connecting each pin of the probe card to the corresponding resource port of the test machine one by one through the cable, so that the probe and the test machine can be quickly connected, thereby enabling the probe test to be smoothly and efficiently carried out, and greatly improving the probe performance test efficiency.

[0072] In a preferred embodiment, before placing the probe card to be tested on the probe card fixing plate of the probe card test motherboard, further comprising: Calibrate the probe card fixing plate horizontally.

[0073] Specifically, before testing, a calibration jig is placed on the probe card fixing plate, the calibration jig includes a glass plate, and a plurality of target points are designed on the glass plate; each target point is tracked and measured by a laser ranging module to obtain a measurement value of each target point; if the difference between the measurement values of each target point exceeds the preset error range, the horizontal state of the probe card fixing plate is adjusted by the leveling mechanism until the difference between the measurement values of each target point is within the preset error range.

[0074] In an alternative embodiment, before the performance test of the probe card by the probe test device, the method further comprises: conducting a line communication test between the test machine and the probe card.

[0075] By way of example, the execution steps of the line communication test can include: providing a test matrix, and connecting each test channel of the test matrix to the test machine and the horn connector of the test matrix respectively; providing a source measurement unit, and connecting the source measurement unit to the test matrix; applying a preset current value to each test channel by the source measurement unit; determining whether the line between the test machine and the probe card is in communication according to the measurement value of each test channel measured by the source measurement unit.

[0076] Please refer to Figure 9 , Figure 9 The structure block diagram of the line communication test system is shown. The line communication test system includes a test matrix and a source measurement unit, and the test matrix is connected to the test machine and the horn connector of the probe card test motherboard respectively. The positive and negative poles of the source measurement unit are connected to the test matrix, and the source measurement unit is connected to the test machine. The test matrix includes a plurality of test channels, and each test channel corresponds to the channel of each probe on the probe card and the corresponding resource port of the test machine.

[0077] In the specific implementation, the test machine sends a control instruction to the test matrix to control the opening of the channel switch of the corresponding test channel. Each test channel is equipped with an independent channel switch. After selecting the test channel, the test machine further controls the source measurement unit to output a preset current value. The source measurement unit outputs the preset current to the selected test channel according to the instruction of the test machine. The source measurement unit accurately measures the current flowing through the test channel and feeds back the measured measurement value to the test machine. The test machine analyzes and judges according to the received measurement value: if the measurement value is within the preset range, it means that the line between the probe corresponding to the test channel and the corresponding resource port of the test machine is in good communication, and the signal can be normally transmitted. If the measurement value exceeds the preset range, for example, the current value is too small or almost zero, it means that there is a line communication problem in the test channel.

[0078] Through the above scheme, the line communication between the test machine and the probe card can be comprehensively detected, and potential connection problems can be found and located in time.

[0079] In an alternative embodiment, the probe performance test method can further include: After completing the performance test of the probe card, open the cover plate and place a new probe card on the probe card fixing plate; The cover plate is pressed onto the probe card fixing plate, and the new probe card is subjected to performance testing by the probe testing device.

[0080] In an optional embodiment, the probe performance testing method can further include: When the probe card is subjected to performance testing by the probe testing device, the test data of each probe on the probe card are synchronously collected and stored to the cloud server; Based on the test data stored in the cloud server, a performance test report of the probe card is generated, and the performance test report includes the performance parameters of each probe, test result analysis, and comparison with historical test data. The performance test report is evaluated by a preset data analysis algorithm to determine whether the probe card has performance abnormalities; If there are performance abnormalities, a corresponding abnormality diagnosis report is generated and sent to a designated terminal device. Specifically, during the performance testing of the probe card by the probe testing device, the performance parameter data of each probe, such as the contact resistance, on-off time, and signal transmission delay of the probe, are acquired in real time by means of the data acquisition module. The data acquisition module is connected to each test point of the probe card and can acquire data at high frequency and high precision. The acquired data are transmitted in real time to the cloud server through an encrypted network transmission protocol, such as the SSL / TLS protocol. The cloud server adopts a distributed storage architecture to store data on multiple physical nodes to ensure the security and reliability of the data. At the same time, time stamp, probe identifier, and other metadata information are added to each data during storage to facilitate subsequent query and analysis.

[0081] Based on the test data stored in the cloud server, the system calls the report generation module. The module first cleans and pre-processes the data to remove duplicate data and outliers. Then, according to a pre-set report template, the performance parameters of each probe are statistically analyzed, and statistical quantities such as mean and standard deviation are calculated to intuitively show the stability of the probe performance. In terms of test result analysis, by comparing the standard performance indicators, it is determined whether each probe is qualified, and the results are presented in a combination of charts (such as bar charts and line charts) and text. At the same time, the current test data are compared with the historical test data to analyze the trend of the probe performance, for example, by comparing the contact resistance changes of the same probe in different batches of tests to determine whether its performance has degraded. Finally, all the analysis results are integrated to generate a complete performance test report containing the performance parameters of each probe, test result analysis, and comparison with historical test data.

[0082] After generating the performance test report, the system will start the preset data analysis algorithm to evaluate the report. These algorithms are based on machine learning or statistical principles, such as using trained classification models (such as support vector machines, random forests) to determine whether there is a performance anomaly in the probe card, or by calculating the confidence interval of the data to identify abnormal data points. If the algorithm determines that there is a performance anomaly, the anomaly diagnosis module will further analyze the cause of the anomaly, such as through correlation analysis to find the relationship between the performance anomaly probe and other related factors (such as test environment temperature, probe usage frequency), and generate a detailed anomaly diagnosis report. The report contains anomaly phenomenon description, possible cause analysis, recommended solutions, etc. Finally, the system sends the anomaly diagnosis report to the designated terminal device, such as the engineer's computer, mobile phone APP, through email, message push, etc. so that relevant personnel can handle it in time.

[0083] Among them, the data acquisition module can include a signal acquisition front end, a signal conditioning circuit, a data processing unit, and a data transmission interface. The signal acquisition front end is connected to each probe of the probe card for real-time acquisition of electrical signals during the probe performance test process; the acquired signals are transmitted to the signal conditioning circuit, which amplifies, filters, and processes the signals to improve signal quality; the processed signals enter the data processing unit, which performs preliminary analysis and processing on the signals and adds metadata information such as timestamps and probe identifiers; finally, the processed data is transmitted to the cloud server in an encrypted manner through the data transmission interface, realizing real-time storage of test data. The data acquisition module adopts modular design, and each component cooperates with each other to ensure accurate acquisition and efficient transmission of test data.

[0084] The traditional scheme needs to be connected and disconnected when replacing the probe card, which is not only complicated to operate, but also easy to cause connection errors or signal interference due to human error. The probe performance test method provided in the embodiment does not need to perform the operation of disconnecting and reconnecting the cable. The operator only needs to simply open the cover, place the new probe card, and close the cover to quickly realize the signal connection between the new probe and the tester. This convenient operation method greatly shortens the probe card replacement time, improves the test efficiency, reduces the risk of test failure caused by cable connection problems, and ensures the stability and reliability of the probe performance test.

[0085] The above only describes some embodiments of the present application, and does not limit the patent scope of the present application. Any equivalent structural transformation based on the technical concept of the present application, or direct / indirect application in other related technical fields is included in the patent protection scope of the present application.

Claims

1. A probe card test motherboard, characterized in that: The probe card test motherboard includes a cover plate and a probe card fixing plate rotatably connected to the cover plate; The probe card fixing plate is used to fix the probe card to be tested; The cover plate is provided with a horn connector and a conductive connector, the horn connector is used to connect to the testing machine, and the horn connector is electrically connected to the conductive connector; The conductive connecting member is arranged on a side of the cover plate facing the probe card fixing plate. When the cover plate is pressed onto the probe card fixing plate, the conductive connecting member is electrically connected to the probes of the probe card.

2. The probe card test motherboard according to claim 1, wherein: The probe card fixing plate is provided with a vacuum adsorption device, and the vacuum adsorption device is used to adsorb the cover plate by vacuum adsorption when the cover plate and the probe card fixing plate are pressed together.

3. The probe card test motherboard according to claim 2, wherein: The vacuum adsorption device comprises: Pipeline interface, used to connect the vacuum pump; adsorption holes, arranged on the surface of the probe card fixing plate; a vacuum pipeline, disposed inside the probe card fixing plate and connected to the pipeline interface and the adsorption hole; A sealing ring is arranged around the adsorption hole.

4. The probe card test motherboard according to claim 1, wherein: The probe card test motherboard further includes a locking device, and the locking device is used to lock the cover plate and the probe card fixing plate.

5. The probe card test motherboard according to any one of claims 1 to 4, wherein: The cover plate comprises: a top layer, on which the horn connector is provided, and a wiring harness end of the horn connector is used for connecting to the testing machine; An intermediate interconnection layer, electrically connected to the plug-in end of the horn connector; A connector mounting layer is electrically connected to the intermediate interconnection layer, and the conductive connector is provided on a side of the connector mounting layer facing the probe card fixing plate.

6. The probe card test motherboard according to any one of claims 1 to 4, wherein: The conductive connecting member is an elastic conductive connecting member.

7. The probe card test motherboard according to claim 6, wherein: The conductive connecting piece is a spring pin.

8. The probe card test motherboard according to claim 6, wherein: There are a plurality of conductive connecting members, and the arrangement of the plurality of conductive connecting members matches the arrangement of the probes on the probe card.

9. The probe card test motherboard according to any one of claims 1 to 4, wherein: The probe card fixing plate further includes a leveling mechanism, and the leveling structure is used to adjust the horizontal state of the probe card fixing plate.

10. The probe card test motherboard according to any one of claims 1 to 4, wherein: The probe card fixing plate is provided with positioning pins, and the positioning pins are used to position the probe card.

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