Thermoelectric refrigeration temperature control system

Abstract

The invention belongs to the technical field of equipment heat dissipation, and particularly relates to a thermoelectric refrigeration temperature control system which is used for heat dissipation of a heating device, the heating device is in heat conduction connection with a thermoelectric refrigerator, the system comprises a heat transfer structure, the heat transfer structure is in heat conduction connection with the heating device, and a metal block is arranged on the heat transfer structure. The metal block is in heat conduction connection with the heat transfer structure and makes contact with the piezoelectric ceramic I or the pressure sensor I. The piezoelectric ceramic I or the pressure sensor I is electrically connected with the temperature control module, and the temperature control module is electrically connected with the thermoelectric refrigerating unit. The device emits heat, the metal block deforms, then the piezoelectric ceramic or the pressure sensor generates an electric signal, the electric signal can control the power of the thermoelectric refrigerating unit through the temperature control module without depending on a traditional temperature sensor any more, the installation and arrangement problems of the temperature sensor are solved, and the metal block, the piezoelectric ceramic or the pressure sensor are simple in structure and low in cost. The reliability can be improved, and the miniaturization design is realized.

Description

Technical Field

[0001] The present invention belongs to the technical field of equipment heat dissipation, and in particular relates to a thermoelectric refrigeration temperature control system. Background Art

[0002] like Figure 1 The thermoelectric cooling and heat dissipation device shown is installed between the inner and outer shells of the chassis. It adjusts the thermoelectric cooling power by monitoring the temperature of key components within the chassis, thereby dissipating heat from the functional modules within the chassis. For functional modules with temperature feedback, the power of the thermoelectric cooler can be automatically adjusted based on the temperature of the functional module. However, for functional modules without temperature feedback, the power of the thermoelectric cooler needs to be adjusted based on the temperature of the temperature sensor. Temperature sensors are typically thermocouples, which require two wires to connect at different locations, making installation complex and space-consuming. As the level of integration of functional modules increases, the space within the functional modules to accommodate temperature sensors becomes smaller, making installation and layout more difficult. In addition, thermocouple-type temperature sensors are large and have poor reliability. Summary of the Invention

[0003] To solve the above technical problems, the present invention provides a thermoelectric refrigeration temperature control system, which solves the installation and arrangement problems of temperature sensors and realizes the reliability and miniaturization design of the system.

[0004] The objectives of the present invention are achieved by the following technical solutions: A thermoelectric cooling temperature control system is proposed in accordance with the present invention, for dissipating heat from a heat-generating device, the heat-generating device being thermally connected to a thermoelectric cooler. The system comprises a heat transfer structure, the heat transfer structure being thermally connected to the heat-generating device, a metal block disposed on the heat transfer structure, the metal block being thermally connected to the heat transfer structure, the metal block being in contact with a piezoelectric ceramic 1 or a pressure sensor 1, the piezoelectric ceramic 1 or the pressure sensor 1 being electrically connected to a temperature control module, and the temperature control module being electrically connected to the thermoelectric cooler.

[0005] Compared with the prior art, the present invention is beneficial in that:

[0006] The present invention proposes a thermoelectric cooling temperature control system. The device generates heat, causing the metal block to deform, which in turn causes the piezoelectric ceramic or pressure sensor to generate an electrical signal. The electrical signal can control the power of the thermoelectric cooler through the temperature control module, so that the structure can automatically adjust the power of the thermoelectric cooler according to the temperature of the heating device. It no longer relies on traditional temperature sensors, solving the installation and layout problems of temperature sensors. In addition, the metal block, piezoelectric ceramic or pressure sensor have a simple structure, which can improve reliability and achieve a miniaturized design.

[0007] Further, the heat transfer structure is further provided with an insulating block, the insulating block is in heat insulation connection with the heat transfer structure, the insulating block is in contact with the piezoelectric ceramic II or the pressure sensor II, the piezoelectric ceramic II or the pressure sensor II is electrically connected with the temperature control module, the metal blocks and the insulating blocks are arranged in groups, the distance between the metal blocks and the insulating blocks in the same group on the heat transfer structure is close so that the metal blocks, the insulating blocks and the corresponding piezoelectric ceramics or pressure sensors have equal or similar deformation under vibration conditions.

[0008] Compared with the prior art, the present application has the advantages of:

[0009] When the temperature control system works under vibration conditions, the relative displacement between the metal block and the piezoelectric ceramic I or the pressure sensor is caused due to vibration, and the contact pressure is affected, and the electric signal transmitted by the corresponding piezoelectric ceramic or pressure sensor of the metal block is inaccurate. After the insulating block is arranged, the insulating block only deforms due to vibration, and after the electric signal of the corresponding piezoelectric ceramic or pressure sensor of the insulating block is transmitted to the temperature control module, the temperature control module processes the electric signals of the two piezoelectric ceramics or pressure sensors, calculates the electric signal caused by temperature deformation, offsets the electric signal caused under vibration conditions, corrects the error electric signal caused under vibration conditions, and makes the temperature control more accurate.

[0010] Further, the temperature control module comprises a memory, a control logic circuit, an amplification circuit for amplifying an input signal, and a power supply.

[0011] Further, the system has a dynamic compensation function, the initial contact deformation between the metal block and the piezoelectric ceramic I or the pressure sensor I and the initial contact deformation between the insulating block and the piezoelectric ceramic II or the pressure sensor II under static and initial temperature conditions are set as Δx0, the deformation causes the corresponding piezoelectric ceramic or pressure sensor to generate a voltage V0; the heating device generates heat, the deformation amount of the metal block is Δx1, the actual deformation amount of the metal block caused by temperature is Δx1-Δx0, the voltage generated by the piezoelectric ceramic I or the pressure sensor I when Δx1 deforms is V1, the temperature control module receives the voltage V0 and the voltage V1 and outputs the working voltage or current of the thermoelectric refrigerator under static conditions after processing.

[0012] When the system vibrates, the deformation amount of the piezoelectric ceramic I or pressure sensor I corresponding to the position of the metal block and the heat insulating block is set as Δx2, the total deformation amount of the metal block and the corresponding piezoelectric ceramic I or pressure sensor I is Δx1±Δx2, the voltage corresponding to the piezoelectric ceramic I or pressure sensor I is V3, the total deformation amount of the heat insulating block and the corresponding piezoelectric ceramic II or pressure sensor II is Δx0±Δx2, and the voltage corresponding to the piezoelectric ceramic II or pressure sensor II is V4; the difference between the deformation amounts of the metal block and the heat insulating block is (Δx1±Δx2)-(Δx0±Δx2)=Δx1-Δx0, and the difference between the voltage V3 and the voltage V4 remains unchanged, so that the working voltage or current output by the temperature control module remains unchanged to realize the dynamic compensation function.

[0013] Further, the system is arranged in a case, the case includes a case shell, the case shell includes an inner shell and an outer shell, a thermoelectric refrigerator is arranged between the inner shell and the outer shell, the thermoelectric refrigerator is in thermal conductive connection with the inner shell and the outer shell; a cold plate structure is inserted into the case shell, a module connector on the cold plate structure is inserted into a back plate connector on a back plate assembly of the case, and the thermoelectric refrigerator is in electrical connection with the back plate assembly; the cold plate structure includes a cold plate shell, the cold plate shell is in thermal conductive connection with the inner shell, and a functional PCB is arranged in the cold plate shell, functional chips and the module connector are arranged on the functional PCB, the heat generating device is the functional chip, and the functional chip is in thermal conductive connection with the cold plate shell.

[0014] Further, a group of metal blocks and heat insulating blocks are arranged on the inner wall of the cold plate shell, a piezoelectric ceramic I or a pressure sensor I in contact with the metal block, a piezoelectric ceramic II or a pressure sensor II in contact with the heat insulating block, and a temperature control module are arranged on the functional PCB.

[0015] Further, a heat conductive boss is arranged on the inner wall of the cold plate shell, the functional chip is in thermal conductive connection with the heat conductive boss through a heat conductive adhesive pad, and the metal block and the heat insulating block are arranged on the heat conductive boss.

[0016] Further, a temperature control device is arranged on the inner shell, the temperature control device includes a temperature control device shell, the temperature control device shell is in thermal conductive connection with the inner shell, a temperature control PCB is arranged in the temperature control device shell, a temperature control module, a piezoelectric ceramic I or a pressure sensor I, and a piezoelectric ceramic II or a pressure sensor II are integrally arranged on the temperature control PCB, a metal block in contact with the piezoelectric ceramic I or the pressure sensor I and a heat insulating block in contact with the piezoelectric ceramic II or the pressure sensor II are arranged on the inner wall of the temperature control device shell; the temperature control module is in electrical connection with the back plate assembly.

[0017] Further, a heat dissipation tooth is arranged on the outer wall of the outer shell, a fan for dissipating heat from the outer shell is arranged on the outer side of the case, and the fan is in electrical connection with the corresponding temperature control device on the outer shell.

[0018] Further, a heat insulation plate is arranged between the inner shell and the outer shell, and a hole is formed in the heat insulation plate, and a thermoelectric refrigerator is nested in the hole.

[0019] The above description is only a summary of the technical scheme of the present application, in order to more clearly understand the technical means of the present application, and to be implemented according to the content of the specification, and in order to make the purpose, characteristics and advantages of the present application more obvious and easy to understand, the following preferred embodiments are described in detail below, and the accompanying drawings are as follows. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 A schematic view of the thermoelectric refrigerator in the case shell in an embodiment of the present application is shown in the figure.

[0021] Figure 2 A schematic view of the case in embodiment 1 of the present application is shown in the figure.

[0022] Figure 3 A schematic view of the case in embodiment 2 of the present application is shown in the figure.

[0023] Figure 4 A sectional view of the first embodiment of the temperature control structure in embodiment 1 or 2 of the present application is shown in the figure.

[0024] Figure 5 A sectional view of the second embodiment of the temperature control structure in embodiment 1 or 2 of the present application is shown in the figure.

[0025] Figure 6 A sectional view of the cold plate structure in the embodiment shown in the figure is shown in the figure. Figure 2

[0026] A sectional view of the cold plate structure in the embodiment shown in the figure is shown in the figure. Figure 7 Figure 6 A sectional view of the cold plate structure in the embodiment shown in the figure is shown in the figure.

[0027] Figure 8 Figure 3 A sectional view of the cold plate structure in the embodiment shown in the figure is shown in the figure.

[0028] Figure 9 A sectional view of the cold plate structure in the embodiment shown in the figure is shown in the figure. Figure 8

[0029] A sectional view of the cold plate structure in the embodiment shown in the figure is shown in the figure. Figure 10

[0030] A sectional view of the cold plate structure in the embodiment shown in the figure is shown in the figure. Figure 11

[0031] A sectional view of the cold plate structure in the embodiment shown in the figure is shown in the figure. Figure 12 ​​Schematic cross-section of a second embodiment of the temperature control structure of a thermoelectric refrigeration temperature control system in Example 1 or 2 of the present invention;

[0032] Figure 13 for Figure 12 A schematic diagram of the embodiment shown when vibrating.

[0033] Reference numerals:

[0034] 1-Functional chip, 2-Thermal conductive pad, 3-Heat transfer structure, 4-Metal block, 41-Metal block I, 42-Metal block II, 5-Piezoelectric ceramic, 51-Piezoelectric ceramic I, 52-Piezoelectric ceramic II, 6-Functional PCB board, 7-Cold plate housing, 8-Heat dissipation boss, 9-Module connector, 10-Back plate assembly, 11-Cold plate structure, 12-Thermoelectric cooler, 13-Inner housing, 14-Insulation board, 15-Outer housing, 151-Heat dissipation teeth, 16-Temperature control PCB board, 17-Temperature control device, 18-Temperature control device housing, 19-Temperature control module. DETAILED DESCRIPTION

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0036] An embodiment of a thermoelectric cooling temperature control system of the present invention is applied to a chassis. The system uses a thermoelectric cooler 12 to dissipate heat from the chassis and a cold plate structure 11 inside the chassis.

[0037] like Figures 1 to 3 As shown, the front of the chassis is an opening for inserting a cold plate structure 11, and the rear end is provided with a backplane assembly 10, which is provided with a backplane connector. A module connector 9 is provided at the rear end of the cold plate structure 11. In this embodiment, the module connector 9 can be an LRM connector or a VPX connector. After the cold plate structure 11 is inserted into the chassis, the module connector 9 mates with the backplane connector, establishing signal communication between the cold plate structure 11 and the backplane assembly 10, as well as between the cold plate structures 11.

[0038] The case comprises a case shell, a cold plate structure 11 is inserted in the case shell, a cold plate shell 7 of the cold plate structure 11 is in contact with the case shell to realize heat conduction. Double-layer shells are arranged on the upper, lower, left and right parts of the case shell, which are an inner shell 13 and an outer shell 15 respectively, and the cold plate shell 7 is in contact with the inner shell 13. A heat insulation plate 14 is arranged between the inner shell 13 and the outer shell 15, a plurality of holes are distributed on the heat insulation plate 14, and a thermoelectric refrigerator 12 is nested in each hole, and two end faces of the thermoelectric refrigerator 4 are in contact with the inner shell 13 and the outer shell 15 respectively.

[0039] After the cold plate structure 11 is inserted in the case and in contact with the inner shell 13, when the cold plate structure 11 operates, the functional chip inside the cold plate structure 11 generates heat, the heat is first transmitted to the cold plate shell 7, and then the heat is transmitted to the inner shell 13. The thermoelectric refrigerator 12 operates to transmit the heat of the inner shell 13 to the outer shell 15, the outer shell 15 is distributed with heat dissipation teeth 151 to dissipate the heat to the outside, thereby realizing heat dissipation of the cold plate structure 11 and the case. By controlling the power of the thermoelectric refrigerator 12, the speed of heat transmission can be controlled, the speed of heat dissipation is controlled, and the power of the thermoelectric refrigerator 12 is proportional to the speed of heat dissipation. The thermoelectric refrigerator 12 is in communication connection with the back plate 7.

[0040] The heat of the inner shell 13 is taken away by the thermoelectric refrigerator 12, and then the heat of the cold plate shell 7 is taken away, thereby dissipating heat for the functional chip 1 in contact with the cold plate shell 7.

[0041] The application outputs a current for controlling the power of the thermoelectric refrigerator 4 through the temperature control structure, thereby realizing control of the speed of heat dissipation. The temperature control structure in the application has two implementation manners, which are described below.

[0042] The first implementation manner of the temperature control structure in the embodiment of the application is shown in Figure 4 The embodiment is described in the form that the piezoelectric ceramic 5 and the functional chip 1 are integrated on the functional PCB board 6. The piezoelectric ceramic 5 and the functional chip 1 are integrated on the functional PCB board 6, a heat conduction adhesive pad 2 is arranged between the functional chip 1 and the heat transfer structure 3 to ensure that the heat conduction connection between the functional chip 1 and the heat transfer structure 3 is stable and reliable. A metal block 4 is arranged at the other end of the heat transfer structure 3, and the metal block 4 is in contact with the piezoelectric ceramic 5. The heat transfer structure 3 is made of a heat-conducting material and can transmit the heat of the functional chip 1 to the metal block 4.

[0043] The piezoelectric ceramic 5 has a piezoelectric effect, that is, when the piezoelectric ceramic 5 deforms, an electric signal is generated, and the power of the thermoelectric refrigerator 4 can be controlled by using the electric signal.

[0044] When the device is working, the heat of the functional chip 1 is transferred to the heat transfer structure 3 through the heat-conducting adhesive pad 2, and the heat is transferred from the heat transfer structure 3 to the metal block 4, which has the characteristics of high heat conduction and high expansion coefficient. After being heated, the metal block 4 deforms due to expansion, and the deformation of the metal block 4 acts on the piezoelectric ceramic 5, so that the piezoelectric ceramic 5 generates an electric signal. The electric signal is amplified to form a suitable electric current (voltage) to control the power of the thermoelectric cooler 4, thereby controlling the temperature of the functional chip 1.

[0045] The temperature control module is arranged on the functional PCB board 6, and the temperature control module includes a storage module, a control logic circuit, a power supply, and an amplification circuit, as shown in Figure 11 The piezoelectric ceramic 5 is electrically connected to the temperature control module through the functional PCB board 6, so that the electric signal generated by the piezoelectric ceramic 5 can be transmitted to the temperature control module.

[0046] The power supply provides suitable voltage (current) for the components such as the amplification circuit, the storage module, and the control logic circuit.

[0047] The amplification circuit amplifies the input piezoelectric ceramic electric signal appropriately and provides a cut-off upper limit to avoid excessive voltage (current) from damaging the thermoelectric cooler.

[0048] The storage module mainly stores the corresponding relationship and operation rules of parameters such as the power of the functional chip, the expansion amount of the metal block, the piezoelectric ceramic voltage (current), and the temperature.

[0049] The control logic circuit mainly controls the amplification multiple of the amplification circuit according to the data of the storage module, and outputs a signal for controlling the power of the thermoelectric cooler and the priority when multiple piezoelectric ceramics work at the same time.

[0050] Suppose the heat consumption of the functional chip 1 is W1, and the temperature corresponding to the heat transfer structure 3 is t1

[0051] The relationship between t1 and W1 can be expressed as

[0052] t1=f(W1) (1)

[0053] When the temperature of the heat transfer structure 3 is t1, the expansion amount (the expansion amount, deformation amount, or displacement amount mentioned in the present application are all the expansion amount, deformation amount, or displacement amount generated in the interaction direction of the metal block and the piezoelectric ceramic) Δx of the metal block 4 can be expressed as

[0054] Δx=f(t1) (2)

[0055] When the expansion amount of the metal block 4 is Δx, the voltage (current) change amount ΔV of the piezoelectric ceramic 5 can be expressed as

[0056] ΔV=f(Δx) (3)

[0057] When the current (voltage) variation is ΔV, the thermoelectric refrigeration current A output by the temperature control module is

[0058] A = f (ΔV) (4)

[0059] The thermoelectric refrigeration current A output by the temperature control module is W2, and the expression of the power of the thermoelectric refrigerator is

[0060] W2 = f (A) (5)

[0061] The power W2 of the thermoelectric refrigerator and the temperature t2 of the functional chip are expressed as

[0062] t2 = f (W2) (6)

[0063] By combining equations 1-6, the relationship between the temperature t2 of the functional chip, the heat consumption W1 of the functional chip 1 and the power W2 of the thermoelectric refrigerator can be obtained. The control principle of the temperature control structure is shown in Figure 10 .

[0064] The temperature control structure in this embodiment can automatically regulate the power of the thermoelectric refrigerator according to the device temperature, avoid the thermoelectric refrigerator running at full speed all the time, and no longer rely on the traditional temperature sensor, solve the installation and arrangement problem of the temperature sensor, and realize the reliability and miniaturization design of the system

[0065] A second embodiment of the temperature control structure in the embodiment of the application is shown in Figure 5 . The difference between this embodiment and the first embodiment is that the metal block 4 on the heat transfer structure 3 is replaced by two metal blocks I 41 and metal block II 42 with similar distances, wherein a heat insulation plate is arranged between the metal block II 42 and the heat transfer structure 3 to avoid heat transfer from the heat transfer structure 3 to the metal block II 42; correspondingly, on the PCB board 6, the piezoelectric ceramic 5 is replaced by piezoelectric ceramic I 51 and piezoelectric ceramic II 52, the piezoelectric ceramic I 51 is in contact with the metal block I 41, and the piezoelectric ceramic II 52 is in contact with the metal block II 42.

[0066] When the temperature control structure is used under vibration conditions, the structure and devices in the temperature control structure will be deformed, and the deformation caused by vibration and temperature may distort the electric signal generated by the piezoelectric ceramic.

[0067] In an ideal case, the electric signal output by the piezoelectric ceramic I 51 is positively correlated with the temperature, that is, the higher the temperature, the greater the expansion of the metal block I 41, and the greater the electric signal (voltage or current) generated by the piezoelectric ceramic I 51. As Figure 12 , Figure 13As shown, under the vibration condition, the expansion amount of the metal block I 41 due to temperature is Δx1, the deformation amount (i.e. displacement amount) of the functional PCB board 6 and the piezoelectric ceramics I 51 and II 52 on the functional PCB board 6 due to vibration at the corresponding positions of the metal block I 41 and the metal block II 42 is Δx2. When the deformation directions of Δx1 and Δx2 are the same and Δx2>Δx1, the piezoelectric ceramic I 51 is out of contact with the metal block I 41, and the pressure on the piezoelectric ceramic I 51 is reduced or even disappears; when the deformation directions of Δx1 and Δx2 are the same and Δx2<Δx1, the piezoelectric ceramic I 51 is not out of contact, but the deformation amount of Δx2 will offset part of the deformation amount of Δx1, resulting in a reduction in the pressure on the piezoelectric ceramic I 51; when the deformation directions of Δx1 and Δx2 are opposite, the contact pressure between the piezoelectric ceramic I 51 and the metal block I 41 is increased, and the pressure on the piezoelectric ceramic I 51 is increased. The above situations will all result in inaccurate electric signals generated by the piezoelectric ceramic I 51 (the electric signals are larger or smaller under different vibration conditions at the same temperature).

[0068] In the embodiment, two piezoelectric ceramics and two metal blocks are provided, wherein the metal block I 41 is in thermal contact with the heat transfer structure 3, and the heat of the heat transfer structure 3 can be transferred to the metal block I 41, so that the metal block I 41 can automatically deform and expand with temperature change, and the output electric signal of the piezoelectric ceramic I 51 can change with temperature change; the metal block II 42 is provided with a heat insulation plate between the heat transfer structure 3, so as to realize heat insulation connection and avoid heat transfer to the metal block II 42, thereby avoiding expansion and deformation of the metal block II 42 due to temperature change.

[0069] The initial contact deformation Δx0 between the metal block I 41 and the piezoelectric ceramic I 51 and between the metal block II 42 and the piezoelectric ceramic II 52 in the static and initial temperature state is set, and the deformation makes the corresponding piezoelectric ceramic generate a voltage V0. The functional chip 1 starts to work and starts to generate heat, the deformation amount of the metal block I 41 is Δx1, and the metal block II 42 is heat-insulated from the heat transfer structure 3 and will not deform due to temperature, and the deformation amount is still Δx0. The actual deformation amount of the metal block I 41 due to temperature is Δx1-Δx0, the voltage generated by the piezoelectric ceramic when Δx0 deforms is V0, and the voltage generated by the piezoelectric ceramic when Δx1 deforms is V1. The deformation amount and the voltage generated by the piezoelectric ceramic have a corresponding relationship, which can be stored in the storage module in advance. The temperature control module receives the voltages generated by the two piezoelectric ceramics and calculates the difference, which is the voltage value corresponding to the deformation amount due to temperature, and then converts the calculated voltage into the current required by the thermoelectric cooler and transmits it to the thermoelectric cooler to cool the functional chip 1.

[0070] When the temperature control structure is vibrated under the above temperature condition (i.e. the expansion amount of the metal block I 41 is Δx1), the positions of the metal block I 41 and the metal block II 42 are close to each other, and the vibration deformation amounts of the piezoelectric ceramics on the PCB at the corresponding positions are consistent or have a small difference, which can be uniformly set as Δx2. At this time, the total deformation amount of the metal block I 41 and the piezoelectric ceramic I 51 is Δx1±Δx2 (the sum of the deformation amount caused by temperature and the deformation amount caused by vibration), the piezoelectric ceramic I 51 correspondingly generates a voltage V3, the total deformation amount of the metal block II 42 and the piezoelectric ceramic II 52 is Δx0±Δx2 (the deformation amount caused by vibration), and the piezoelectric ceramic II 52 correspondingly generates a voltage V4. Since the difference between the deformation amounts of the metal block I 41 and the metal block II 42 is (Δx1±Δx2)-(Δx0±Δx2)=Δx1-Δx0 (the deformation amount caused by vibration is removed), the temperature control module receives the voltages generated by the two piezoelectric ceramics and calculates the difference, the difference between the voltage V3 and the voltage V4 remains unchanged compared with the difference when there is no vibration, the voltage (current) output by the temperature control module remains unchanged and is not affected by vibration, and the error signal output caused by the structural deformation factor can be improved. Then, the voltage (current) is converted into the current required by the thermoelectric cooler and is transmitted to the thermoelectric cooler, the functional chip 1 is cooled, and thus the dynamic compensation function is realized.

[0071] When the temperature control structure works, the heat of the functional chip 1 is transmitted to the heat transfer structure 3 through the heat-conducting rubber pad 2, the temperature of the metal block I 41 rises to generate deformation, the deformation of the metal block I 41 acts on the piezoelectric ceramic I 51, the piezoelectric effect of the piezoelectric ceramic I 51 generates an electric signal (voltage or current), the electric signal is processed and amplified by the temperature control module to form a suitable current (voltage) and is transmitted to the thermoelectric cooler, and then the power of the thermoelectric cooler is controlled to further change the temperature of the functional chip 1. The temperature control module corrects the electric signal emitted by the piezoelectric ceramic I 51 under the vibration condition by receiving the electric signal generated by the piezoelectric ceramic II 52, and avoids the influence of vibration on the accuracy of the electric signal.

[0072] In other embodiments of the temperature control structure in the embodiment of the application, the functional chip 1 can be replaced by other heat generating devices which generate heat and need to be cooled during work, for example, the whole functional module or the case.

[0073] In other embodiments of the temperature control structure in the embodiment of the application, the functional chip 1 or other heat generating devices can not be provided with the heat-conducting rubber pad 2 between the functional chip 1 or other heat generating devices and the heat transfer structure 3, i.e. the functional chip 1 or other heat generating devices are directly contacted with the heat transfer structure 3.

[0074] In other embodiments of the temperature control structure in the embodiments of the present application, the heat transfer structure 3 can be an integral whole or a plurality of structures in contact or thermally connected to form a heat transfer link.

[0075] In other embodiments of the temperature control structure in the embodiments of the present application, the metal block can be integrally arranged with the heat transfer structure 3, or the metal block and the heat transfer structure 3 can be thermally connected through other heat conductors.

[0076] In other embodiments of the temperature control structure in the embodiments of the present application, the piezoelectric ceramic can be replaced by a pressure sensor, so that the metal block I is in contact with the pressure sensor I, and the metal block II is in contact with the pressure sensor II.

[0077] In other embodiments of the temperature control structure in the embodiments of the present application, the functional chip 1 or other heat generating device, the piezoelectric ceramic or the pressure sensor, and the temperature control module can be integrated on the PCB 6, or can be adjusted according to the application scenario to realize electrical connection through wires. Alternatively, the functional chip 1 or other heat generating device is separately arranged, and the piezoelectric ceramic or the pressure sensor and the temperature control module are integrated on the PCB 6.

[0078] In other embodiments of the temperature control structure in the embodiments of the present application, the metal block II 42 can be replaced by other forms of heat-insulating blocks that cannot conduct heat, such as plastic blocks, and the heat-insulating blocks are arranged near the metal block I 41.

[0079] In other embodiments of the temperature control structure in the embodiments of the present application, based on the first or second embodiment, a plurality of metal blocks or a plurality of groups of metal blocks (including the metal block I and the metal block II) can be arranged according to the number and distribution position of the heat generating device, to accurately monitor the temperature of the heat generating device and feed back to the temperature control module.

[0080] In the prior art, a plurality of cold plate structures 11 are inserted into the case, the functional PCB 6 is arranged in the cold plate structure 11, and the functional chip 1 is arranged on the PCB 6. A thermoelectric cooler 12 is arranged in the case, and the cold plate structure 11 in the case is cooled by the thermoelectric cooler 12. The control mode of the thermoelectric cooler is determined by the type of the functional chip and the communication link, which is as follows:

[0081] a) For functional chip 1, the type of functional chip 1 depends on whether a temperature control module is designed inside the functional chip 1 in the field of heat dissipation technology, for example, some functional chips 1 have some pins for temperature control, and the pin is electrically connected with a thermoelectric cooler, and the thermoelectric cooler can change the power according to the power of the functional chip 1.

[0082] b) For the communication link, the complete communication link of the case is in turn the cold plate structure (board card), LRM / VPX connector, backplane assembly, thermoelectric cooler and other electrical structures, among which the cold plate structure has no wiring to the temperature control pin of the functional chip 1, the LRM / VPX connector has no pin connected with the wiring of the cold plate structure, the backplane assembly has no wiring to control the thermoelectric cooler, etc. Only when the cold plate structure, LRM / VPX connector, backplane assembly and thermoelectric cooler all have communication function, there is a communication link, otherwise there is no communication link.

[0083] Thus the following thermoelectric cooler control mode is generated, as shown in Table 1.

[0084]

[0085] Table 1 Thermoelectric cooler control mode

[0086] According to the speed regulation mode of Table 1 and Figure 4 , Figure 5 The structure diagram, for the control mode in the prior art which needs to rely on external sensors, the temperature control structure of the present application can be improved, and thus two kinds of thermoelectric cooler control systems can be derived:

[0087] 1) Integrated temperature control system, when the communication link is complete, the temperature control structure is integrated on the functional PCB board 6 in the cold plate structure 11, and the control signal is transmitted to the thermoelectric cooler 12 through the functional PCB board 6.

[0088] 2) External temperature control system, when the communication link is not complete or there is no communication link, the temperature control structure is designed independently and externally connected on the backplane or shell of the device (such as a case), and the control signal is transmitted to the thermoelectric cooler 12.

[0089] When the integrated temperature control system is used in the case to control the power of the thermoelectric cooler 12, as Figure 2 , Figure 6 , Figure 7As shown, it is an embodiment 1 of the thermoelectric refrigeration temperature control system using the above temperature control structure, in which the second embodiment of the temperature control structure is selected to measure the temperature more accurately. The cold plate structure 11 in the case includes a cold plate shell 7, and the cavity in the cold plate shell 7 is provided with a functional PCB board 6. The rear end of the functional PCB board 6 is provided with a module connector 9, which extends out of the cold plate shell 7 and is inserted into the back plate connector on the back plate assembly 10 in the case. In this embodiment, the module connector 9 is an LRM connector or a VPX connector. The outer wall of the cold plate shell 7 is provided with a plurality of heat dissipation teeth to increase the heat dissipation area.

[0090] A plurality of functional chips 1 are distributed on the side of the functional PCB board 6, which are devices that need to be cooled and will generate heat during the operation of the cold plate structure. The functional chips 1 are bonded with a heat-conducting rubber pad 2. The inner wall of the cold plate shell 7 is provided with a heat dissipation boss 8 corresponding to the position of the functional chip 1, and the heat-conducting rubber pad 2 is tightly attached to the heat dissipation boss 8. The heat generated by the functional chip 1 is transmitted to the cold plate shell 7 through the heat-conducting rubber pad 2 and the heat dissipation boss 8, realizing the heat-conducting connection between the functional chip 1 and the cold plate shell 7. In this embodiment, the heat dissipation boss 8 is integrally arranged with the cold plate shell 7.

[0091] The inner wall of the cold plate shell 7 is provided with a metal block I 41 and a metal block II 42, and the distance between the metal block I 41 and the metal block II 42 is small, as shown in Figure 5 The functional PCB board 6 is provided with a piezoelectric ceramic I 51 and a piezoelectric ceramic II 52 corresponding to the positions of the metal block I 41 and the metal block II 42. The metal block I 41 is in contact with the piezoelectric ceramic I 51, and the metal block II 42 is in contact with the piezoelectric ceramic II 52. An insulating plate is arranged between the metal block II 42 and the cold plate shell 7.

[0092] In this embodiment, in order to reduce the volume of the metal block I 41 and the metal block II 42, the metal block I 41 and the metal block II 42 are arranged on one of the heat dissipation bosses 8, as shown in Figure 6 Figure 7

[0093] The heat on the cold plate shell 7 is conducted to the metal block I 41, which can extrude the corresponding piezoelectric ceramic I 51 after being heated and expanded, so that the piezoelectric ceramic I 51 generates an electric signal. The temperature control module is integrally arranged on the functional PCB board 6.

[0094] The back plate assembly 10 is arranged at the rear end of the case, and after the cold plate structure 11 is inserted into the case, the module connector 6 on the cold plate structure 11 is inserted into the back plate connector on the back plate 10. The thermoelectric refrigerator 12 is electrically connected to the back plate assembly 10.

[0095] ​​The piezoelectric ceramics (including piezoelectric ceramics I and piezoelectric ceramics II) generate an electric signal input to the temperature control module, and after processing by the temperature control module, an appropriate thermoelectric refrigeration current (voltage) is output. The thermoelectric refrigeration current (voltage) is transmitted to the thermoelectric refrigerator 12 through the PCB 6, the module connector 9, the back plate connector, and the back plate assembly 10, controls the power of the thermoelectric refrigerator 12, and makes the power of the thermoelectric refrigerator 12 follow the power of the functional chip 1 to change, so as to realize the adjustment of the thermoelectric refrigeration power, and further adjust the temperature of the functional chip 1.

[0096] The thermoelectric refrigerator 12 is connected to the back plate in the case shell through a wire, and the wire includes a power supply line, a control line, and a signal feedback line. A power supply board card is arranged in the case shell, and the thermoelectric refrigerator 12 is powered through the power supply line. The electric signal emitted by the temperature control module is transmitted to the thermoelectric refrigerator through the back plate assembly and the control line, the power of the thermoelectric refrigerator is controlled, and the state of the thermoelectric refrigerator is transmitted to the back plate assembly and the temperature control module through the signal feedback line, so as to monitor the state of the thermoelectric refrigerator.

[0097] A plurality of cold plate structures 11 can be installed in the case, and a heat dissipation control module is arranged on the back plate assembly. The heat dissipation control module receives the electric signals output by the temperature control modules in the plurality of cold plate structures and selects the maximum electric signal (corresponding to the highest temperature) to control the power of the thermoelectric refrigerator, so as to ensure that the power of the thermoelectric refrigerator can meet the refrigeration demand.

[0098] In the present application, a thermoelectric refrigeration temperature control system is proposed, which can automatically adjust the power of the thermoelectric refrigerator 12 according to the temperature of the functional chip 1, and no longer relies on the traditional temperature sensor, solves the installation and arrangement problem of the temperature sensor, realizes the reliability and miniaturization design of the system, can effectively control the temperature rise of the cold plate structure (board card), and effectively improves the reliability of the electronic equipment heat dissipation.

[0099] In other embodiments of the thermoelectric refrigeration temperature control system embodiment 1, in order to accurately measure the temperature of each functional chip 1, a metal block I 41 and a metal block II 42 (the metal block is close to the corresponding functional chip 1) can be arranged on each heat dissipation boss 8, and each metal block is correspondingly attached to a piezoelectric ceramic. The heat generated by the functional chip 1 is absorbed by the nearest metal block, and the expansion of the metal block causes the corresponding piezoelectric ceramic to generate an electric signal. Since the heat transfer path is short, the metal block can accurately deform according to the heat generated by the functional chip 1, and the piezoelectric ceramic can accurately generate an electric signal according to the heat generated by the functional chip 1. The electric signals generated by the piezoelectric ceramics on the same functional PCB 6 are transmitted to the temperature control module on the functional PCB 6, and the temperature control module selects the highest value for processing and sends it to the back plate assembly 10.

[0100] In other embodiments of the thermoelectric refrigeration temperature control system of embodiment 1, the cold plate structure 11 is provided with two or more sets of metal blocks (including metal block I 41 and metal block II 42) and piezoelectric ceramics (including piezoelectric ceramic I 51 and piezoelectric ceramic II 52), which are not limited to the number and position corresponding to the functional chip 1, and are used to monitor the temperature at multiple positions in the cold plate structure. The temperature control module on the PCB 6 outputs an electrical signal for driving the thermoelectric refrigerator according to the electrical signal corresponding to the maximum deformation (i.e. the highest temperature).

[0101] In other embodiments of the thermoelectric refrigeration temperature control system of embodiment 1, the heat dissipation teeth on the cold plate shell 7 can be removed.

[0102] In other embodiments of the thermoelectric refrigeration temperature control system of embodiment 1, a fan can be provided on the outside of the case to accelerate heat dissipation of the outer shell 15. The fan is electrically connected to the back plate assembly 10, and the speed of the fan can be controlled by the heat dissipation control module. The heat dissipation control module controls the speed of the fan according to the received electrical signal.

[0103] When using an external temperature control structure to control the thermoelectric refrigerator in the case, as shown in Figure 3 , Figure 8 , Figure 9 embodiment 2 of the thermoelectric refrigeration temperature control system using the above temperature control structure, in which the second embodiment of the temperature control structure is selected to more accurately measure the temperature.

[0104] After the cold plate structure 11 is inserted into the case and comes into contact with the inner shell 13, the functional chip 1 inside the cold plate structure 11 generates heat when it is running. The heat is first transferred to the cold plate shell 7 of the cold plate structure 11, and then to the inner shell 13.

[0105] The temperature control device 17 is provided on the inner shell 1, and the temperature control device shell 18 is in thermal contact with the inner shell 1. The temperature control device 17 is in communication with the back plate assembly 10. In order to better measure the temperature, the temperature control device 17 is arranged near the temperature-sensitive chip inside the cold plate structure 11, so as to more accurately monitor the temperature of the temperature-sensitive chip and control the operation of the thermoelectric refrigerator according to the monitored temperature, so as to ensure that the temperature of the temperature-sensitive chip is within the normal range.

[0106] In this embodiment, the temperature control device 17 is installed at the rear end of the inner shell 1 of the case, as shown in Figure 8 The rear end of the case is provided with a cavity, so that the inner shell 1 is exposed in the cavity, and the temperature control device 17 is installed on the inner wall of the inner shell 13. In this embodiment, the temperature control device 17 is arranged on the inner shell 13 at the top of the case.

[0107] The temperature control device 17 is integrally arranged by a temperature control device shell 18. In the embodiment, the top outer wall of the temperature control device shell 18 is in contact with the inner shell 13. The inner wall of the temperature control device shell 18 is provided with a metal block I 41 and a metal block II 42. The distance between the metal block I 41 and the metal block II 42 is small, as shown in FIG. 5. Figure 9 The inner cavity of the temperature control device shell 18 is provided with a temperature control PCB 16. The temperature control PCB 16 is arranged in the inner cavity of the temperature control device shell 18 by a support (not shown in the figure). The temperature control PCB 16 is electrically connected with the back plate assembly 10.

[0108] The temperature control PCB 20 is provided with a piezoelectric ceramic I 51 and a piezoelectric ceramic II 52 corresponding to the positions of the metal block I 41 and the metal block II 42. The metal block I 41 is in contact with the piezoelectric ceramic I 51. The metal block II 42 is in contact with the piezoelectric ceramic II 52. The metal block II 42 is provided with a heat insulation plate between the temperature control device shell 18 to avoid heat transfer from the temperature control device shell 18 to the metal block II 42. The temperature control PCB 16 is integrally arranged with a temperature control module 19.

[0109] The heat of the inner shell 13 is transferred to the temperature control device shell 18. The heat on the temperature control device shell 18 is conducted to the metal block I 41. The metal block I 41 is expanded after being heated. The expanded metal block I 41 can press the corresponding piezoelectric ceramic I 51. The piezoelectric ceramic has a piezoelectric effect. When the piezoelectric ceramic is deformed, an electric signal is generated. The temperature control module 19 can control the power of the thermoelectric cooler by using the electric signal.

[0110] When the cold plate structure 11 works, the heat is transferred to the temperature control device shell 18 through the inner shell 13. The temperature of the metal block I 41 rises and deforms. The deformation of the metal block I 41 acts on the piezoelectric ceramic I 51. The piezoelectric effect of the piezoelectric ceramic I 51 generates an electric signal (voltage or current). The electric signal is processed and amplified by the temperature control module 19 to form a suitable current (voltage). The current (voltage) is transmitted to the thermoelectric cooler 12 through the back plate assembly 10 to control the power of the thermoelectric cooler, and further change the temperature of the cold plate structure 11. The temperature control module 19 corrects the electric signal generated by the piezoelectric ceramic I 51 under the vibration condition by receiving the electric signal generated by the piezoelectric ceramic II 52 to avoid the influence of vibration on the accuracy of the electric signal.

[0111] In the embodiment, the metal block I 41 and the metal block II 42 are arranged on the top inner wall of the temperature control device shell 18 to shorten the distance from the inner shell 13.

[0112] The external thermoelectric cooling temperature control system can be directly installed on the traditional case for use. The thermoelectric cooler and the temperature control device 17 can be directly installed on the outside of the case, which is convenient for improving the existing technology, especially for the sealed case.

[0113] In other embodiments of the embodiment 2 of the thermoelectric refrigeration temperature control system, the temperature control device 17 can be directly electrically connected with the thermoelectric refrigerator 12.

[0114] In other embodiments of the embodiment 2 of the thermoelectric refrigeration temperature control system, the radiating teeth on the cold plate shell 7 can be removed.

[0115] In other embodiments of the embodiment 2 of the thermoelectric refrigeration temperature control system, multiple temperature control devices 17 can be installed in the cabinet, each of which controls the operation of several thermoelectric refrigerators 12. For example, a temperature control device 17 can be arranged on each of the upper, lower, left and right inner shells 13, and each temperature control device 17 controls the operation of the thermoelectric refrigerator 12 on the corresponding inner shell 13. When the temperature of the inner shell 1 at a certain position is too high, the power of the thermoelectric refrigerator 12 at that position can be controlled separately to speed up the refrigeration.

[0116] In other embodiments of the embodiment 2 of the thermoelectric refrigeration temperature control system, a fan can be arranged outside the cabinet to speed up the heat dissipation of the outer shell 15. The speed of the fan can be controlled by the temperature control device 17. The temperature control device 17 is distributed on the outer shell 15, and the temperature control device 17 controls the speed of the fan according to the temperature of the outer shell 15.

[0117] Although the embodiments of the present application have been shown and described, it is understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A thermoelectric refrigeration temperature control system for dissipating heat from a heating element, wherein the heating element is thermally connected to a thermoelectric cooler (12), characterized in that: The system comprises a heat transfer structure (3), wherein the heat transfer structure (3) is thermally connected to a heating device, a metal block is arranged on the heat transfer structure (3), the metal block is thermally connected to the heat transfer structure (3), the metal block is in contact with a piezoelectric ceramic I (51) or a pressure sensor I, the piezoelectric ceramic I (51) or the pressure sensor I is electrically connected to a temperature control module, and the temperature control module is electrically connected to a thermoelectric cooler (12).

2. The thermoelectric refrigeration temperature control system according to claim 1, characterized in that: The heat transfer structure (3) is further provided with an insulating block, the insulating block is thermally connected to the heat transfer structure (3), the insulating block is in contact with the piezoelectric ceramic II (52) or the pressure sensor II, the piezoelectric ceramic II (52) or the pressure sensor II is electrically connected to the temperature control module, the metal block and the insulating block are arranged in a group, and the distance between the metal block and the insulating block in the same group on the heat transfer structure (3) is close so that equal or similar deformation occurs between the metal block, the insulating block and the corresponding piezoelectric ceramic or pressure sensor under vibration conditions.

3. The thermoelectric refrigeration temperature control system according to claim 2, characterized in that: The temperature control module includes a memory, a control logic circuit, an amplifier circuit for amplifying input signals, and a power supply.

4. The thermoelectric refrigeration temperature control system according to claim 3, characterized in that: The system has a dynamic compensation function, and the initial contact deformation between the metal block and the piezoelectric ceramic I (51) or the pressure sensor I, and between the insulation block and the piezoelectric ceramic II (52) or the pressure sensor II in the static and initial temperature states is set to Δx0, and the deformation causes the corresponding piezoelectric ceramic or pressure sensor to generate a voltage V0; the heating device generates heat, the deformation amount of the metal block is Δx1, and the actual deformation amount of the metal block due to temperature is Δx1-Δx0. When the Δx1 deformation occurs, the voltage generated by the piezoelectric ceramic I (41) or the pressure sensor I is V1. The temperature control module receives the voltage V0 and the voltage V1 and outputs the working voltage or current of the thermoelectric cooler in the static state after processing; When the system vibrates, the deformation of the piezoelectric ceramic I (51) or pressure sensor I, the piezoelectric ceramic II (52) or pressure sensor II at the corresponding positions of the metal block and the insulation block due to vibration is set to Δx2, the total deformation of the metal block and the corresponding piezoelectric ceramic I (51) or pressure sensor I is Δx1±Δx2, the voltage corresponding to the piezoelectric ceramic I (51) or pressure sensor I is V3, the total deformation of the insulation block and the corresponding piezoelectric ceramic II (52) or pressure sensor II is Δx0±Δx2, the voltage corresponding to the piezoelectric ceramic II (52) or pressure sensor II is V4; the difference between the deformation of the metal block and the insulation block is (Δx1±Δx2)-(Δx0±Δx2)=Δx1-Δx0, correspondingly, the difference between the voltage V3 and the voltage V4 remains unchanged, so that the working voltage or current output by the temperature control module remains unchanged to achieve a dynamic compensation function.

5. A thermoelectric refrigeration temperature control system according to any one of claims 2 to 4, characterized in that: The system is arranged in a chassis, the chassis comprises a chassis shell, the chassis shell comprises an inner shell (13) and an outer shell (15), a thermoelectric cooler (12) is arranged between the inner shell (13) and the outer shell (15), and the thermoelectric cooler (12) is thermally connected to the inner shell (13) and the outer shell (15); a cold plate structure (11) is inserted into the chassis shell, a module connector (9) on the cold plate structure (11) is plugged into a backplane connector on a backplane assembly (10) in the chassis, and the thermoelectric cooler (12) is electrically connected to the backplane assembly (10); the cold plate structure (11) comprises a cold plate shell (7), the cold plate shell (7) is thermally connected to the inner shell (13), a functional PCB board (6) is arranged in the cold plate shell (7), a functional chip (1) and a module connector (9) are arranged on the functional PCB board (6), the heating device is a functional chip (1), and the functional chip (1) is thermally connected to the cold plate shell (7).

6. The thermoelectric refrigeration temperature control system according to claim 5, characterized in that: The inner wall of the cold plate housing (7) is provided with a group of metal blocks and heat-insulating blocks, and the functional PCB board (6) is provided with a piezoelectric ceramic I (51) or a pressure sensor I in contact with the metal block, a piezoelectric ceramic II (52) or a pressure sensor II in contact with the heat-insulating block, and a temperature control module.

7. The thermoelectric refrigeration temperature control system according to claim 6, characterized in that: The inner wall of the cold plate shell (7) is provided with a heat-conducting boss (8); the functional chip (1) is heat-conductingly connected to the heat-conducting boss (8) via a heat-conducting adhesive pad (2); and the metal block and the heat-insulating block are arranged on the heat-conducting boss (8).

8. The thermoelectric refrigeration temperature control system according to claim 5, characterized in that: A temperature control device (17) is provided on the inner shell (13), the temperature control device (17) comprising a temperature control device shell (18), the temperature control device shell (18) being heat-conductively connected to the inner shell (13), a temperature control PCB (16) being provided in the temperature control device shell (18), a temperature control module, a piezoelectric ceramic I (51) or a pressure sensor I, a piezoelectric ceramic II (52) or a pressure sensor II being integrated on the temperature control PCB (16), a metal block in contact with the piezoelectric ceramic I (51) or the pressure sensor I, and a heat-insulating block in contact with the piezoelectric ceramic II (52) or the pressure sensor II being provided on the inner wall of the temperature control device shell (18); and the temperature control module is electrically connected to the back plate assembly (10).

9. The thermoelectric refrigeration temperature control system according to claim 8, characterized in that: The outer wall of the outer shell (15) is provided with heat dissipation teeth (151), and a fan for dissipating heat from the outer shell (15) is provided on the outside of the chassis, and the fan is electrically connected to a corresponding temperature control device on the outer shell (15).

10. The thermoelectric refrigeration temperature control system according to claim 5, characterized in that: A heat insulation board (14) is provided between the inner shell (13) and the outer shell (15), a hole is provided on the heat insulation board (14), and a thermoelectric cooler (12) is nested in the hole.

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