Chip burning management system and method and storage medium

Abstract

The invention belongs to the technical field of automation control, and discloses a chip burning management system and method and a storage medium, and the system comprises a communication module which is used for obtaining work order information of a current to-be-burnt chip issued by a manufacturing execution system; the image generation module is used for generating a first target image according to the work order information; the burning control module is used for analyzing the first target image, obtaining to-be-burnt software and a calibration coordinate, controlling calibration of a starting point coordinate of an execution mechanism on the burner according to the calibration coordinate, obtaining a preset burning coordinate according to adapter model information in the to-be-burnt software, and burning the to-be-burnt software according to the preset burning coordinate. According to the method and the device, the to-be-burnt software is calibrated, so that the programmer burns the to-be-burnt software into the current to-be-burnt chip according to the preset burning coordinate and the calibrated starting point, calibration of the coordinates of the starting point of the execution mechanism on the programmer is realized, highly automatic chip burning can be realized, and the burning accuracy is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of automation control, and in particular to a chip programming management system and method and a storage medium. BACKGROUND

[0002] In the field of modern electronic manufacturing, chip programming as a key link in the production process of embedded systems, Internet of Things devices, industrial control modules and other electronic products directly affects the production efficiency, consistency and quality stability of products. With the development of intelligent manufacturing, Industry 4.0 and automated production lines, the traditional programming method relying on manual operation or single programming equipment has been difficult to meet the production needs of large quantities, high precision and traceability.

[0003] Currently, chip programming is usually completed by a dedicated programmer cooperating with host computer software. The operator needs to manually select the programming program, configure the parameters, connect the target chip and execute the programming task. Such a method has the following problems: 1. The operation relies on manual judgment and is prone to errors: such as incorrect program version selection, improper programming parameter configuration, which may cause the entire batch of products to malfunction or rework.

[0004] 2. Lack of centralized control mechanism: multiple programming devices run independently, and unified scheduling and permission control of programming tasks cannot be achieved.

[0005] 3. Weak data traceability: programming records are scattered, and there is a lack of unified log management and version control mechanism, making it difficult to meet the requirements of ISO quality management system or customer audit.

[0006] 4. Insufficient security: the integrity of the programming content is not checked or permission controlled, and there is a risk of illegal programs being burned in, which may cause product function abnormalities or security vulnerabilities.

[0007] 5. Unable to adapt to flexible production needs: facing small batch, multi-variety customized production mode, the traditional programming system lacks flexible configuration and remote scheduling capability.

[0008] To improve the automation level and process controllability of chip programming, some existing systems introduce centralized programming platforms, permission management modules and programming result recording mechanisms. However, these solutions usually focus on device management or task scheduling, and have not yet achieved full-process closed-loop control of programming content, operation permission, verification mechanism and production data.

[0009] In addition, the existing system still has problems such as response lag, complex configuration, poor scalability in programming strategy configuration, version management, and exception detection, and is difficult to meet the actual needs of efficient, safe and traceable programming management in the intelligent manufacturing scene.

[0010] Therefore, the prior art still needs to be improved and enhanced. SUMMARY

[0011] The present application provides a chip programming management system and method and storage medium, aiming to solve the problem of low automation and high error rate in the chip programming process in the prior art.

[0012] In a first aspect, an embodiment of the present application provides a chip programming management system, comprising: a communication module, an image generation module and a programming control module connected in sequence; the communication module is further connected with a manufacturing execution system, and the programming control module is further connected with a programming machine; The communication module is configured to obtain work order information of a current chip to be programmed issued by the manufacturing execution system. The image generation module is configured to generate a first target image according to the work order information. The programming control module is configured to analyze the first target image, obtain software to be programmed and calibration coordinates, control calibration of a starting point coordinate of an execution mechanism on the programming machine according to the calibration coordinates, and obtain preset programming coordinates according to adapter model information in the software to be programmed, so that the programming machine programs the software to be programmed into the current chip to be programmed according to the preset programming coordinates and the calibrated starting point.

[0013] In some embodiments, the chip programming management system further comprises a verification module connected with the manufacturing execution system. The verification module is configured to obtain programmed information returned by the manufacturing execution system when the first chip and the last chip in the current batch of chips are programmed, compare the work order information with the programmed information, and issue a warning signal when the difference value exceeds a preset maximum threshold, and record a programming report of the programmed chip.

[0014] In some embodiments, the chip programming management system further comprises a data uploading module connected with the manufacturing execution system. The data uploading module is configured to receive programming result information returned by the programming machine when the chip programming is completed, generate a second target image according to the programming result information and the work order information, upload the second target image and the programming result information to the manufacturing execution system for real-time query.

[0015] In some embodiments, the chip burning management system further comprises: a warehouse management module; the warehouse management module is connected with the manufacturing execution system; The warehouse management module is configured to bind the second target image of the currently burned chip with the positioning information of the rack where the chip is located, and save the information into the corresponding work order information on the manufacturing execution system for positioning query.

[0016] In some embodiments, the chip burning management system further comprises: an identification control module; the identification control module is connected with the manufacturing execution system; The identification control module is configured to generate a target identification according to the work order information, and control an execution mechanism on the burning machine to print the target identification on the burned chip by using laser engraving technology or dotting method for identity recognition.

[0017] In some embodiments, the execution mechanism comprises: a mechanical arm and a camera group; the burning control module is specifically configured to, analyze the first target image to obtain the software to be burned and the calibration coordinates; control the camera group to take pictures of the positions of the first chip in the material taking area and the material placing area respectively to obtain the actual coordinates of the first chip in the material taking area and the material placing area respectively; In the material taking area and the material placing area, compare the actual coordinates of the first chip with the corresponding preset coordinates to calculate the deviation value and adjust the starting point of the suction nozzle on the mechanical arm accordingly; After obtaining the adapter model information in the software to be burned, query the preset burning coordinates corresponding to the adapter model information from a configuration table.

[0018] In some embodiments, the burning control module is further configured to, After analyzing the adapter model information in the software to be burned, compare the adapter model information with the adapter model information identified by the programmer on the burning machine, and if they are inconsistent, issue a warning signal; When controlling the mechanical arm to move according to the plurality of preset coordinate points in the preset burning coordinates in sequence each time, control the camera group to take pictures of and identify the actual coordinate points of the mechanical arm; Compare the preset coordinate points with the actual coordinate points, and if the difference exceeds a preset maximum threshold, issue a warning signal.

[0019] In a second aspect, the embodiments of the present application provide a chip burning management method, comprising: obtain the work order information of the currently burned chip issued by the manufacturing execution system; According to the work order information, a first target image is generated; The first target image is analyzed to obtain the to-be-burned software and calibration coordinates; According to the calibration coordinates, the starting point coordinates of the execution mechanism on the burning machine are calibrated, and preset burning coordinates are obtained according to the adapter model information in the to-be-burned software, so that the burning machine burns the to-be-burned software into the current to-be-burned chip according to the preset burning coordinates and the calibrated starting point.

[0020] In some embodiments, according to the calibration coordinates, the starting point coordinates of the execution mechanism on the burning machine are calibrated, and preset burning coordinates are obtained according to the adapter model information in the to-be-burned software, including: The camera group in the execution mechanism is controlled to take pictures and identify the position of the first chip in the material taking area and the material placing area, respectively, to obtain the actual coordinates of the first chip in the material taking area and the material placing area, respectively; In the material taking area and the material placing area, the actual coordinates of the first chip are compared with the corresponding preset coordinates to calculate a deviation value, so as to adjust the grabbing starting point of the suction nozzle on the mechanical arm in the execution mechanism; After obtaining the adapter model information in the to-be-burned software, the preset burning coordinates corresponding to the adapter model information are queried from a configuration table.

[0021] In a third aspect, the embodiments of the present application provide a computer readable storage medium storing a computer program, which is executed by a processor to implement the steps of the chip burning management method.

[0022] Compared with the prior art, the chip burning management system and method and storage medium provided by the present application, in the system, the communication module is used to obtain the work order information of the current to-be-burned chip issued by the manufacturing execution system; the image generation module is used to generate a first target image according to the work order information; the burning control module is used to analyze the first target image to obtain to-be-burned software and calibration coordinates, control the calibration of the starting point coordinates of the execution mechanism on the burning machine according to the calibration coordinates, and obtain preset burning coordinates according to the adapter model information in the to-be-burned software, so that the burning machine burns the to-be-burned software into the current to-be-burned chip according to the preset burning coordinates and the calibrated starting point. Not only the starting point coordinates of the execution mechanism on the burning machine are calibrated, but also the chip burning is highly automated, and the accuracy of burning is improved. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some of the embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.

[0024] Figure 1 A structural block diagram of the chip burning management system provided by the present application; Figure 2 A flowchart of the chip burning management method provided by the present application; Figure 3 A flowchart of the chip burning management method provided by the present application; Figure 4 A schematic diagram of the calibration of the starting point coordinates and the acquisition of the preset burning coordinates in the chip burning management method provided by the present application.

[0025] Reference signs: 1-manufacturing execution system; 2-burning machine; 10-communication module; 20-image generation module; 30-burning control module; 40-checking module; 50-data uploading module; 60-warehouse management module; 70-identification control module. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present application will be described clearly and completely in the following with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments.

[0027] The components of the embodiments of the present application generally described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of the present application.

[0028] In the following, the terms "include", "have", and their synonymous words used in various embodiments of the present application are only intended to represent specific features, numbers, steps, operations, elements, components, or combinations of the foregoing, and should not be understood as excluding the existence or possibility of adding one or more other features, numbers, steps, operations, elements, components, or combinations of the foregoing. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0029] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which various embodiments of the present application belong. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined in various embodiments of the present application.

[0030] The present application provides a chip burning management system and method and a storage medium. In the chip burning management system, after obtaining the work order information of the current chip to be burned issued by the manufacturing execution system through the communication module, the image generation module generates a first target image according to the work order information. Finally, the burning control module analyzes the first target image, obtains the software to be burned and the calibration coordinates, controls the calibration of the starting point coordinates of the execution mechanism on the burning machine according to the calibration coordinates, and obtains the preset burning coordinates according to the adapter model information in the software to be burned, so that the burning machine burns the software to be burned into the current chip to be burned according to the preset burning coordinates and the calibrated starting point, thereby realizing the calibration of the starting point coordinates of the execution mechanism on the burning machine by using the automatically analyzed calibration coordinates, the automatic burning of the software to be burned according to the preset burning coordinates, effectively improving the accuracy of burning, reducing the error rate, and realizing information traceability.

[0031] The chip burning management method design scheme is described below through some specific embodiments.

[0032] Please refer to Figure 1 The present application embodiment provides a chip burning management system, comprising: The communication module 10, the image generation module 20 and the burning control module 30 are connected in sequence; the communication module 10 is also connected with the manufacturing execution system 1, and the burning control module 30 is also connected with the burning machine 2.

[0033] The communication module 10 is used to obtain the work order information of the current chip to be burned issued by the manufacturing execution system 1.

[0034] The image generation module 20 is used to generate a first target image according to the work order information.

[0035] The burning control module 30 is used to analyze the first target image, obtain the software to be burned and the calibration coordinates, calibrate the starting point coordinates of the actuator on the burning machine 2 according to the calibration coordinates, and obtain the preset burning coordinates based on the adapter model information in the software to be burned, so that the burning machine 2 can burn the software to be burned into the current chip to be burned according to the preset burning coordinates and the calibrated starting point. The actuator includes: a robotic arm and a camera group.

[0036] The first target image can be a QR code for identification. Work order information includes chip specifications (such as Flash, MCU, or EMMC), device part number, device bit number, programming quantity, programming software part number, post-programming checksum, and program storage path. The Manufacturing Execution System (MES) is the core management system that connects the enterprise planning layer with the underlying automation equipment. It primarily enables refined control and real-time optimization of the entire programming process.

[0037] See also Figure 2 The flowchart of the chip automatic burning control method is shown. For example, the chip burning management process is specifically implemented as follows: First, after entering the PO (Purchase Order) work order number, the communication module 10 automatically downloads and parses the work order information for the chip to be programmed from the MES (Manufacturing Execution System 1). This seamlessly integrates with the enterprise management system, reduces human input errors, and improves data accuracy. Subsequently, the image generation module 20 analyzes information such as the chip specifications and programming path, and prints a QR code label, the first target image. This provides a standardized entry point for subsequent programming calls and ensures a one-to-one correspondence between the program and the physical material.

[0038] Then, the operator uses the burning control module 30 to scan the first target image, and the system automatically retrieves the burning program and loads it into the second automatic burning machine (ie, burning machine 2). In addition, burning machine 2 automatically calibrates the nozzle position and adapter coordinates and waits for material loading.

[0039] Secondly, the burning control module 30 is used to scan and analyze the first target image (corresponding to Figure 2The middle scan two-dimensional code is scanned to obtain the burning program path, the software to be burned, and the calibration coordinates of the current chip to be burned, and the burning program path is automatically loaded to the burning machine 2. The starting point coordinates of the actuator on the burning machine 2 are calibrated according to the calibration coordinates, that is, the starting point positions of the mechanical arm in the material taking area and the material placing area are calibrated respectively, so that the position error of the mechanical arm when moving to the starting point each time is less than the allowable value (for example, within ±0.05 mm), so as to realize accurate burning from the starting point position.

[0040] Finally, the preset burning coordinates are obtained according to the adapter model information in the software to be burned, so that the final burning machine 2 burns the software to be burned into the current chip to be burned according to the preset burning coordinates and the calibrated starting point, thereby completing the burning of the current chip to be burned. Next, similarly, the above operation is repeated for other chips to be burned until all the chips to be burned in all batches are burned.

[0041] It can be understood that in the present application, after the first target image is generated according to the obtained work order information, the calibration coordinates are obtained, the starting point coordinates of the actuator on the burning machine 2 are calibrated according to the calibration coordinates, and the preset burning coordinates are obtained according to the adapter model information in the software to be burned, so that the burning machine 2 burns the software to be burned into the current chip to be burned according to the preset burning coordinates and the calibrated starting point, thereby realizing automatic calibration of the starting point coordinates and automatic burning of the chip during burning.

[0042] Further, before the chip burning management system and the burning machine 2 establish communication, the burning machine 2 is first subjected to device self-calibration, that is, the burning machine 2 is powered on and an initialization program is loaded to realize initialization operation. Whether the states of various interface modules (such as USB, JTAG (Joint Test Action Group, chip-level debugging and programming interface), SPI (Serial Peripheral Interface, high-speed short-distance chip-to-chip synchronous communication protocol), UART (Universal Asynchronous Receiver / Transmitter, asynchronous serial point-to-point communication protocol)) are normal. Then, a communication connection is established with the host control system (such as through TCP / IP or serial port protocol), and finally, a user instruction or a trigger automatic burning process is waited.

[0043] Then, the model, version and firmware compatibility of the chip to be burned are identified to avoid misburning, and an identity query instruction is sent to the plurality of chips to be burned through a specified communication protocol. Then, the ID information, version number and product number returned by the chip to be burned are received. Then, the corresponding burning configuration file is matched from the database according to the chip ID.

[0044] Meanwhile, it is judged whether the current chip has been burned with firmware, if there is historical data, it enters the erasing process to prevent the conflict of new and old firmware, if not, it enters the burning software program.

[0045] In one implementation method, the chip burning management system further comprises a verification module 40, and the verification module 40 is connected with the manufacturing execution system 1.

[0046] The verification module 40 is configured to, when the first chip and the last chip in the current batch of chips are burned, respectively acquire the burned information returned by the manufacturing execution system 1, compare the work order information with the burned information, and when the difference value between the comparison exceeds the preset maximum threshold, issue a warning signal, and record the burning report of the burned chip.

[0047] Exemplarily, continuing to refer to Figure 2 After the device initialization is completed, the burning stage is entered. At this time, the embodiment of the present application further provides a first-last piece calibration mechanism, that is, when the first chip in the current batch of chips is burned, the burned information returned by the manufacturing execution system 1 at this time is acquired, and the chip specification and the checksum in the work order information of the first chip are compared with the chip specification and the checksum in the burned information of the first chip (that is, corresponding to the first piece in the middle Checksum value is matched), if the difference value between the checksums exceeds the preset maximum threshold, a warning signal is issued, and the burning is stopped; if not, the first piece Check OK is marked on the MES first piece confirmation position. Figure 2

[0048] After that, the same batch of chips are sequentially burned. Similarly, the same calibration method is adopted for the last chip, mainly comparing the chip specification and the checksum in the work order information of the last chip with the chip specification and the checksum in the burned information of the last chip (that is, corresponding to the last piece in the middle Checksum value is matched), if the difference value between the checksums exceeds the preset maximum threshold, a warning signal is issued, and the burning is stopped; if not, the last piece Check OK is marked on the MES first piece confirmation position. Among them, the method of “current count = total number of the current batch of chips - 1?” is adopted to judge whether it is the last chip, when the count = total number of the current batch of chips - 1, the next chip is the last chip. Figure 2

[0049] Finally, the burning report of all the burned chips in the batch is recorded, including the bad information appeared and the like.

[0050] ​​It can be understood that by comparing the first chip and the last chip respectively with the burned information, and issuing an alarm and stopping burning when the difference value is too much (exceeding the preset maximum threshold), the automatic verification and real-time quality control of the first and last pieces are realized, which not only ensures the consistency of the whole batch, prevents the batch from being out of the batch, but also effectively improves the accuracy of burning and effectively reduces the quality risk.

[0051] In one embodiment, the chip burning management system further comprises a data uploading module 50, and the data uploading module 50 is connected with the manufacturing execution system 1.

[0052] The data uploading module 50 is used for receiving the burning result information returned by the burning machine 2 when the chip burning is completed, and generating a second target image according to the burning result information and the work order information, and uploading the second target image and the burning result information to the manufacturing execution system 1 for real-time query.

[0053] The second target image can be a two-dimensional code for material tracing.

[0054] Exemplarily, after the current chip to be burned is burned, the burning machine 2 returns the burning result information, then the data uploading module 50 generates a second target image of a two-dimensional code according to the burning result information (including: program version, material number, burning time, burning times (including burning success times and burning failure times)) and the work order information (including: work order number, chip specification, device material number, bit number, burning software material number, checksum, etc.). At the same time, the data uploading module 50 also uploads the second target image and the burning result information to the corresponding marking position of the manufacturing execution system 1 for real-time query, so as to realize real-time collection and visual management of the production process data, and the second target image can be used for identity recognition, subsequent quality inspection, warehousing and logistics tracking of the material in the subsequent production link.

[0055] In one embodiment, the chip burning management system further comprises a warehouse management module 60, and the warehouse management module 60 is connected with the manufacturing execution system 1.

[0056] The warehouse management module 60 is used for binding the second target image of the current burned chip with the positioning information of the rack where the chip is located, and saving the information to the corresponding work order information of the manufacturing execution system 1 for positioning query.

[0057] Exemplarily, after the current chip is burned, the operator places the burned tray (current burned chip) on the bottom rack to be shipped out. Then, the warehouse management module 60 can automatically bind the second target image of the current burned chip with the positioning information (which can be in the form of a rack number two-dimensional code containing the rack bit number information) of the rack where the chip is located.

[0058] If the two-dimensional code on the rack contains structured data (such as Rack-05-Slot12), then the rack number is parsed as Rack-05, and the slot coordinate is parsed as Slot12 (slot 12) after scanning the code. Then, the operator scans the tray two-dimensional code (i.e., the second target image, containing the chip batch / serial number, etc.) and the rack two-dimensional code (containing the rack number and slot information, such as Rack-07-Slot15), and a binding relationship is automatically generated.

[0059] Secondly, the marked position corresponding to the work order is uploaded to the MES, that is, the binding data is pushed to the work order table, material traceability table, and rack inventory table in the MES through the MES interface called by the industrial computer, so as to facilitate the next station to take materials, thereby realizing accurate positioning of the tray, facilitating positioning tracking and taking, improving warehouse management efficiency and accuracy, and supporting rapid material taking in the downstream process.

[0060] In an embodiment, the chip burning management system further comprises: An identification control module 70 connected with the manufacturing execution system 1.

[0061] The identification control module 70 is configured to generate a target identification according to the work order information, and control the execution mechanism on the burning machine 2 to print the target identification on the burned chip by laser engraving technology or dotting, for identity recognition.

[0062] For example, referring to Figure 2 The present application also provides a laser engraving technical solution: After each burning, a unique target identification (such as a laser-engraved code) is generated according to the work order information of the currently burned chip, and the laser on the manufacturing execution system 1 is controlled to print the target identification on the burned chip by laser engraving technology or dotting, for identity recognition, to prevent material mixing, thereby providing a permanent identification, enhancing traceability, and improving anti-counterfeiting and quality management capabilities.

[0063] In an embodiment, the burning control module 30 is further configured to, After analyzing the adapter model information of the software to be burned, compare it with the adapter model information recognized by the programmer on the burning machine 2, and if they are inconsistent, issue a warning signal; When the mechanical arm moves according to the plurality of preset coordinate points in the preset burning coordinates, the camera group photographs and recognizes the actual coordinate points of the mechanical arm; Compare the preset coordinate points with the actual coordinate points, and if the difference exceeds the preset maximum threshold, issue a warning signal.

[0064] For example, the present application also provides an adapter signal recognition mechanism: After obtaining the software to be burned, the software is automatically loaded to the burning machine 2. The programmer on the burning machine 2 recognizes the adapter model information, and the adapter model information is returned after the burning control module 30 reads the software to be burned. Then, the adapter model information is compared with the adapter model information recognized by the programmer: if they are inconsistent, a warning message is issued, and the burning is stopped to remind the staff to check.

[0065] Moreover, a Site (burning site) position automatic calibration and updating mechanism is also provided: Before entering the burning work, the burning site can be calibrated and updated first, that is, the mechanical arm is first controlled to move to each preset Site position (that is, a preset coordinate point, each Site coordinate can include parameters such as X, Y, Z, and angle θ) in turn, and the actual coordinate point of the mechanical arm is photographed and recognized at each preset coordinate point by using a camera group (for example, a CCD camera).

[0066] Then, the preset coordinate point is compared with the actual coordinate point: if it is found that the deviation between the two exceeds a preset maximum threshold, a warning signal is issued to prompt the staff to check the adapter installation state. At the same time, the coordinate calibrated by the staff is automatically overlaid on the preset coordinate point, and is uniformly saved in the "adapter configuration library" of the burning machine 2 software, so as to ensure the accuracy of the subsequent burning process.

[0067] It can be understood that through the adapter signal recognition and the automatic calibration and updating of the preset burning coordinates, the accuracy of the burning is effectively guaranteed.

[0068] In an implementation method, the burning control module 30 is specifically used for, parsing the first target image to obtain the software to be burned and the calibration coordinates.

[0069] controlling the camera group to photograph and recognize the position of the first chip in the material taking area and the material placing area respectively, and correspondingly obtaining the actual coordinates of the first chip in the material taking area and the material placing area.

[0070] In the material taking area and the material placing area, the actual coordinates of the first chip are compared with the corresponding preset coordinates to calculate the deviation value, so as to correspondingly adjust the grabbing starting point of the suction nozzle on the mechanical arm.

[0071] After obtaining the adapter model information in the software to be burned, the preset burning coordinates corresponding to the adapter model information are queried from the configuration table.

[0072] Among them, the system has an adapter database built-in, which stores a plurality of Site coordinates corresponding to each adapter, that is, the preset burning coordinates.

[0073] Exemplarily, after the first target image is generated, the operator scans and analyzes the first target image by using the burning control module 30 to obtain the software to be burned and the calibration coordinates, and automatically loads them to the burning station.

[0074] Then, the control camera group respectively takes pictures of the positions of the first chips in the tray area (such as a tray) and the tray area (such as a socket) on the burning machine 2, respectively, and uses an image processing algorithm to identify the center position of the grid where the first chip is located, extracts the pixel coordinates of the chip in the XY plane and converts them into actual physical coordinates, and then combines the Z-axis height sensor data to obtain the complete XYZ coordinate value, that is, the actual coordinates of the first chip in the two areas.

[0075] Secondly, the deviation value between the actual coordinates of the first chip in the tray area and the corresponding preset coordinates in the manufacturing execution system 1 is calculated, so as to adjust the grabbing starting point of the suction nozzle on the mechanical arm in the tray area according to the deviation value. Similarly, the deviation value between the actual coordinates of the first chip in the tray area and the corresponding preset coordinates is calculated, so as to adjust the grabbing starting point of the suction nozzle on the mechanical arm in the tray area according to the deviation value, and save the coordinate parameters of the calibrated grabbing starting point to the "adapter tray parameter configuration" module of the software of the burning machine 2, so as to support the direct calling in the subsequent burning task of the same adapter model.

[0076] Finally, after obtaining the adapter model information in the software to be burned, the preset burning coordinates corresponding to the adapter model information are queried from the configuration table or the database.

[0077] Please refer to Figure 3 The embodiment of the present application provides a chip burning management method, which comprises steps S100-S400: S100, obtaining the work order information of the current chip to be burned issued by the manufacturing execution system 1; S200, generating a first target image according to the work order information; S300, analyzing the first target image to obtain the software to be burned and the calibration coordinates; S400, controlling the starting point coordinates of the actuator on the burning machine 2 according to the calibration coordinates, and obtaining the preset burning coordinates according to the adapter model information in the software to be burned, so that the burning machine 2 burns the software to be burned into the current chip to be burned according to the preset burning coordinates and the calibrated starting point.

[0078] Exemplarily, in the embodiment, the above-mentioned chip burning management method can be described in correspondence with the specific functions of each module in the above-mentioned chip burning management system, and will not be described here.

[0079] In one implementation method, please refer to Figure 4According to the calibration coordinate control, the starting point coordinates of the execution mechanism on the burning machine 2 are calibrated, and preset burning coordinates are obtained according to the adapter model information in the software to be burned, including: S401, control the camera group in the execution mechanism to take pictures and identify the positions of the first chips in the material taking area and the material placing area respectively, and the actual coordinates of the first chips in the material taking area and the material placing area are obtained correspondingly; S402, in the material taking area and the material placing area, the actual coordinates of the first chips are compared and calculated with the corresponding preset coordinates to adjust the grabbing starting point of the suction nozzle on the mechanical arm in the execution mechanism; S403, after obtaining the adapter model information in the software to be burned, the preset burning coordinates corresponding to the adapter model information are queried from the configuration table.

[0080] Exemplarily, in the embodiment, the calibration of the starting point coordinates and the acquisition of the preset burning coordinates can be described correspondingly with reference to the specific functions of the burning control module 30, which will not be described here.

[0081] The application also provides a computer readable storage medium for storing the computer program used in the terminal device. For example, the computer readable storage medium can include but is not limited to U disk, mobile hard disk, read-only memory (ROM), random access memory (RAM), magnetic disk or optical disk and various storage program codes.

[0082] In several embodiments provided in the present application, it should be understood that the disclosed devices and methods can also be implemented in other ways. The device embodiments described above are only schematic. For example, the flowcharts and structural diagrams in the drawings show the possible implementation architectures, functions and operations of the devices, methods and computer program products according to the embodiments of the present application. In this regard, each block in the flowchart or block diagram can represent a module, a program segment or a part of code, which contains one or more executable instructions for realizing the specified logical function. It should also be noted that in alternative implementation ways, the functions noted in the blocks can also occur in different order from that noted in the drawings. For example, two consecutive blocks can actually be executed substantially in parallel, and sometimes they can be executed in reverse order, depending on the functions involved. It should also be noted that each block in the structural diagram and / or flowchart, and the combination of blocks in the structural diagram and / or flowchart, can be realized by a special hardware-based system which executes the specified functions or actions, or can be realized by a combination of special hardware and computer instructions.

[0083] In addition, each functional module or unit in each embodiment of the present application can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.

[0084] The functions, if implemented in the form of software functional modules and sold or used as independent products, can be stored in a computer readable storage medium. Based on such an understanding, the technical solutions of the present application, in essence or the parts that contribute to the prior art, or parts of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes a number of instructions for causing a computer device (which can be a smart phone, a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in each embodiment of the present application.

[0085] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in the present application, which should be covered within the protection scope of the present application.

Claims

1. A chip burning management system, characterized in that: include: A communication module, an image generation module, and a burning control module are connected in sequence; the communication module is also connected to a manufacturing execution system, and the burning control module is also connected to a burning machine; The communication module is used to obtain the work order information of the chip to be burned currently issued by the manufacturing execution system; The image generation module is used to generate a first target image according to the work order information; The burning control module is used to analyze the first target image, obtain the software to be burned and the calibration coordinates, calibrate the starting point coordinates of the actuator on the burning machine according to the calibration coordinates, and obtain the preset burning coordinates according to the adapter model information in the software to be burned, so that the burning machine burns the software to be burned into the current chip to be burned according to the preset burning coordinates and the calibrated starting point.

2. The chip burning management system according to claim 1, characterized in that: Also includes: Verification module; The verification module is connected to the manufacturing execution system; The verification module is used to obtain the burned information returned by the manufacturing execution system when the first chip and the last chip in the current batch of chips are burned, compare the work order information with the burned information, and issue a warning signal when the difference value exceeds a preset maximum threshold, and then record the burning report of the burned chip.

3. The chip burning management system according to claim 1, characterized in that: Also includes: Data upload module; the data upload module is connected to the manufacturing execution system; The data upload module is used to receive the burning result information returned by the burner when the chip burning is completed, generate a second target image based on the burning result information and the work order information, and upload the second target image and the burning result information to the manufacturing execution system for real-time query.

4. The chip burning management system according to claim 3, characterized in that: Also includes: Warehouse management module; The warehouse management module is connected to the manufacturing execution system; The warehouse management module is used to bind the second target image of the currently programmed chip with the positioning information of the rack where it is located, and save it to the corresponding work order information on the manufacturing execution system for positioning query.

5. The chip burning management system according to claim 1, characterized in that: Also includes: Identification control module; the identification control module is connected to the manufacturing execution system; The identification control module is used to generate a target identification according to the work order information, and control the actuator on the burner to use laser engraving technology or dotting to print the target identification on the burned chip for identity recognition.

6. The chip burning management system according to claim 1, characterized in that: The execution mechanism includes: a mechanical arm and a camera group; the burning control module is specifically used to: parsing the first target image to obtain the software to be burned and the calibration coordinates; Controlling the camera group to take photos and identify the positions of the first chip in the material picking area and the material discharge area respectively, and obtaining the actual coordinates of the first chip in the material picking area and the material discharge area; In the picking area and the unloading area, the actual coordinates of the first chip are compared with the corresponding preset coordinates to calculate the deviation value, so as to adjust the grabbing starting point of the nozzle on the robot arm accordingly; After obtaining the adapter model information in the software to be burned, the preset burning coordinates corresponding to the adapter model information are queried from the configuration table.

7. The chip burning management system according to claim 6, characterized in that: The burning control module is further used to: After parsing the software to be burned to obtain the adapter model information, the adapter model information is compared with the adapter model information identified by the programmer on the burner, and a warning signal is issued if there is a mismatch; When the robot arm is controlled to move sequentially according to a plurality of preset coordinate points in the preset burning coordinates each time, the camera group is controlled to take pictures of and identify the actual coordinate points of the robot arm; The preset coordinate point is compared with the actual coordinate point, and a warning signal is issued if the difference exceeds a preset maximum threshold.

8. A chip burning management method, characterized in that: include: Get the work order information of the chip to be programmed issued by the manufacturing execution system; generating a first target image according to the work order information; Analyzing the first target image to obtain the software to be burned and the calibration coordinates; The starting point coordinates of the actuator on the burner are calibrated according to the calibration coordinate control, and the preset burning coordinates are obtained according to the adapter model information in the software to be burned, so that the burner burns the software to be burned into the current chip to be burned according to the preset burning coordinates and the calibrated starting point.

9. The chip burning management method according to claim 8, characterized in that: The step of controlling the starting point coordinates of the actuator on the burner according to the calibration coordinates and obtaining the preset burning coordinates according to the adapter model information in the software to be burned includes: Controlling the camera group in the actuator to take photos and identify the positions of the first chip in the material picking area and the material discharge area respectively, and obtaining the actual coordinates of the first chip in the material picking area and the material discharge area; In the picking area and the unloading area, the actual coordinates of the first chip are compared with the corresponding preset coordinates to calculate the deviation value, so as to adjust the grabbing starting point of the nozzle on the robot arm in the actuator accordingly; After obtaining the adapter model information in the software to be burned, the preset burning coordinates corresponding to the adapter model information are queried from the configuration table.

10. A computer-readable storage medium, characterized in that A computer program is stored, and when the computer program is executed by a processor, the steps of the chip burning management method according to any one of claims 8 to 9 are implemented.

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