IC support and unassembled display module

Abstract

The embodiment of the invention provides an IC (integrated circuit) support and an unassembled display module, and the IC support comprises a main body part which comprises an IC protection area and a peripheral reinforcing area, and the peripheral reinforcing area is provided with a plurality of concave parts and convex parts which are in one-to-one correspondence, the first area is opposite to the IC protection area, the second area and the third area are located on the two sides of the IC protection area and extend in the width direction, and the interiors of the second area, the IC protection area and the third area are of hollow structures. The bending part is located on the outer side of the first area, connected with the main body part and bent in the first direction, and the first direction is the protruding direction of the protruding part; the inclined part is connected with the second area, extends in the first direction and inclines in the direction away from the main body part; and the bonding part is connected with the inclined part, and the bottom surface of the bonding part is lower than the bottom surface of the main body part. The overall thickness and weight of the IC support are reduced under the condition that the strength is guaranteed, the risk that an IC is damaged is reduced, and the production yield of the display module is improved while the production cost of the display module is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to an IC support and an unassembled display module. BACKGROUND

[0002] IC (integrated circuit) is an important component in OLED (Organic Light Emitting Display), and an IC support is installed on the IC during the assembly process of the OLED for protecting the IC.

[0003] However, the existing IC support has a large thickness, low strength, large weight, is inconvenient to produce, has a high production cost, and can cause damage to the IC due to the large weight of the IC support when the IC support is located below the IC during the turning of the IC in the assembly process of the OLED. SUMMARY

[0004] The purpose of the embodiments of the present application is to provide an IC support and an unassembled display module, which can reduce the overall thickness, weight and manufacturing cost of the IC support for protecting the IC under the condition of ensuring the strength, thereby reducing the risk of damage to the IC, and further reducing the production cost of the display module and improving the production yield of the display module.

[0005] The specific technical solutions are as follows:

[0006] Embodiments of the first aspect of the present application provide an IC support, which comprises: a main body part comprising an IC protection area and a peripheral strengthening area, the peripheral strengthening area being located at the outer periphery of the IC protection area, a plurality of recesses being provided on a first surface of the peripheral strengthening area, a plurality of protrusions being provided on a second surface of the peripheral strengthening area, the recesses and the protrusions corresponding one by one, part or all of the plurality of protrusions being used for bottom support, the peripheral strengthening area comprising a first area opposite to the IC protection area and a second area and a third area located on both sides of the IC protection area, the second area and the third area extending in a second direction, the second direction being the width direction of the IC protection area, and the extension length of the second area being greater than the extension length of the third area, the inside of the second area, the IC protection area and the third area being a hollow structure; a bending part for edge protection, connected with the main body part and located outside the first area, the bending part being bent in a first direction, the first direction being the protrusion protruding direction; an inclined part, one side of the inclined part being connected with the second area, the inclined part extending in the first direction and inclining in a direction away from the main body part; and an adhesive part connected with the other side of the inclined part, used for adhesive fixing of the IC support, the inclination direction of the inclined part making the bottom surface of the adhesive part lower than the bottom surface of the main body part.

[0007] In some embodiments of the present application, the projection outer contour of the recesses and the protrusions in the first direction is a polygon or a circle.

[0008] In some embodiments of the present application, the convex portion comprises a first portion and a second portion arranged in sequence along the first direction, the first portion is a prism or a cylinder structure, and the second portion is a pyramid or a circular truncated cone structure, and the cross-sectional area of the outer contour of the second portion gradually decreases in the direction away from the second surface.

[0009] In some embodiments of the present application, the adjacent two surfaces of the second portion are connected by a circular arc, and the corners of the second portion are rounded.

[0010] In some embodiments of the present application, the bending portion is divided into a plurality of bending segments by a plurality of partitions, and the proportion of the plurality of bending segments on the bending portion is less than the plurality of partitions.

[0011] In some embodiments of the present application, a plurality of reinforcing ribs are arranged between the inner surface of the bending segment and the second surface.

[0012] In some embodiments of the present application, the angle between the inner surface of the inclined portion and the second surface is greater than or equal to 135° and less than or equal to 165°.

[0013] In some embodiments of the present application, the overall thickness of the IC support is less than or equal to 1.2 mm.

[0014] In some embodiments of the present application, the material of the IC support is polycarbonate.

[0015] Embodiments of the second aspect of the present application propose a display module that is not assembled, which uses the IC support in any of the embodiments of the first aspect in the assembly process. The display module comprises a display panel and a heat dissipation film supported on the back of the display panel. The display panel comprises a display area, a bending area, a transition area, and a binding area. The transition area connects the bending area and the binding area. The binding area is placed on the side of the heat dissipation film away from the display panel through the bending area. The binding area is provided with an IC. The adhesive portion is adhered to the bending area. The IC protection area is arranged corresponding to the IC. The bending area is provided with a first protective adhesive layer. The transition area is provided with a second protective adhesive layer. The thickness of the second protective adhesive layer is greater than the thickness of the first protective adhesive layer. The convex portion located in the first area is arranged on the second protective adhesive layer. The convex portion located in the second area and the third area has a gap with the heat dissipation film. The bending portion is arranged in relative spacing with the lower edge of the display module.

[0016] In some embodiments of the present application, the thickness of the second protective adhesive layer is greater than or equal to 0.3 mm and less than or equal to 0.8 mm.

[0017] The embodiment of the third aspect of the application proposes an unassembled display module, the IC support in any one of the embodiments of the first aspect is used in the assembling process, the display module comprises a display panel and a heat dissipation film supported on the back of the display panel, the display panel comprises a display area, a bending area, a transition area and a binding area, the transition area connects the bending area and the binding area, the binding area is placed on the side of the heat dissipation film away from the display panel through the bending area, the binding area is provided with an IC, the adhesive part is bonded on the bending area, the IC protection area is arranged correspondingly to the IC, the bending area and the transition area are provided with a first protective glue layer, the transition area is provided with a foam corresponding to the position of the convex part of the first area, the convex part located in the first area is arranged on the foam, the convex parts located in the second area and the third area have a spacing between the heat dissipation film, and the bending part is arranged in a relative spacing from the lower edge of the display module.

[0018] The embodiment of the application has the following beneficial effects:

[0019] The embodiment of the present application provides an IC support and an unassembled display module, the IC support comprises: a main body part, comprising an IC protection area and a peripheral reinforcing area, the peripheral reinforcing area is located at the outer periphery of the IC protection area, a plurality of recesses are arranged on the first surface of the peripheral reinforcing area, a plurality of protrusions are arranged on the second surface, the recesses and the protrusions correspond to each other, part or all of the plurality of protrusions are used for bottom support, the peripheral reinforcing area comprises a first area opposite to the IC protection area and a second area and a third area located on both sides of the IC protection area, the second area and the third area extend in a second direction, the second direction is the width direction of the IC protection area, and the extension length of the second area is greater than that of the third area, and the inside of the second area, the IC protection area and the third area is a hollow structure; a bending part used for edge protection, connected with the main body part and located on the outside of the first area, the bending part bends in a first direction, and the first direction is the protrusion protruding direction; an inclined part, one side of the inclined part is connected with the second area, the inclined part extends in the first direction and inclines in the direction away from the main body part; and an adhesive part connected with the other side of the inclined part and used for adhesively fixing the IC support, the inclination direction of the inclined part makes the bottom surface of the adhesive part lower than the bottom surface of the main body part. The plurality of protrusions and the plurality of recesses can be used as reinforcing ribs, increase the cross-sectional area of the IC support, thereby increasing the strength of the IC support, and are beneficial to reducing the risk of deformation of the IC support. In the case of meeting the support requirement, the thickness of the IC support can be reduced, and through the protrusion support, only the local thickness needs to be increased, the weight of the IC support can be further reduced, and the risk of falling of the IC support is reduced. The hollow structure in the inside of the second area, the IC protection area and the third area is not only beneficial to reducing the weight of the IC support, but also can avoid higher components on the binding area, and is beneficial to reducing the risk of damage of the higher components. The bending part can accommodate the IC edge in the space formed by the bending part and the second surface, and is beneficial to reducing the risk of damage of the IC edge caused by collision. The adhesive part is connected through the inclined part, and the required material is less, and the weight of the IC support is reduced. Therefore, through the above setting, the overall thickness and weight of the IC support can be reduced under the condition of ensuring the strength, the risk of damage of the IC is reduced, and the production rate of the display module is improved while the production cost of the display module is reduced.

[0020] Of course, implementing any product or method of the present application does not necessarily require achieving all the advantages described above at the same time. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description only show some embodiments of the present application, and other embodiments can also be obtained by those skilled in the art based on these drawings.

[0022] Figure 1aA structure schematic diagram of an IC support in an embodiment of the present application;

[0023] Figure 1b A structure schematic diagram of an IC support in an embodiment of the present application; Figure 1a A structure schematic diagram of an IC support in an embodiment of the present application;

[0024] Figure 2 A structure schematic diagram of an IC support in an embodiment of the present application; Figure 1a A structure schematic diagram of an IC support in an embodiment of the present application;

[0025] Figure 3 A structure schematic diagram of an IC support in an embodiment of the present application; Figure 1a A structure schematic diagram of an IC support in an embodiment of the present application;

[0026] Figure 4 A structure schematic diagram of an IC support in an embodiment of the present application; Figure 3 A structure schematic diagram of an IC support in an embodiment of the present application;

[0027] Figure 5 A structure schematic diagram of an IC support in an embodiment of the present application;

[0028] Figure 6 A structure schematic diagram of an IC support in an embodiment of the present application; Figure 5 A structure schematic diagram of an IC support in an embodiment of the present application;

[0029] Figure 7 A structure schematic diagram of an IC support in an embodiment of the present application; Figure 5 A structure schematic diagram of an IC support in an embodiment of the present application;

[0030] Figure 8 A structure schematic diagram of an IC support in an embodiment of the present application; Figure 5 A structure schematic diagram of an IC support in an embodiment of the present application.

[0031] The drawings show: a display module 00; an IC support 01; a main body part 10; an IC protection area 11; a peripheral reinforcing area 12; a first surface 121; a second surface 122; a recess 123; a protrusion 124; a first part 1241; a second part 1242; a first area 125; a second area 126; a third area 127; a bending part 20; a partition 21; a bending section 22; a reinforcing rib 23; an inclined part 30; an adhesive part 40; a first direction X; a second direction Y; a display panel 02; a display area 021; a bending area 022; a transition area 023; a binding area 024; a first protective adhesive layer 025; a second protective adhesive layer 026; a foam 027; an IC 03; a heat dissipation film 04. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art based on the present application belong to the scope of protection of the present application.

[0033] An embodiment of the first aspect of the present application proposes an IC support 01, asFigure 1a , Figure 1b and Figure 2As shown, the IC support 01 includes a main body part 10, a bending part 20, an inclined part 30 and an adhesive part 40. The main body part 10 includes an IC protection area 11 and a peripheral reinforcing area 12 located at the outer periphery of the IC protection area 11, a plurality of recesses 123 are provided on the first surface 121 of the peripheral reinforcing area 12, and a plurality of protrusions 124 are provided on the second surface 122, the recesses 123 and the protrusions 124 correspond one by one, part or all of the plurality of protrusions 124 are used for bottom support, the peripheral reinforcing area 12 includes a first area 125 opposite to the IC protection area 11 and a second area 126 and a third area 127 located on both sides of the IC protection area 11, the second area 126 and the third area 127 extend in the second direction Y, the second direction Y is the width direction of the IC protection area 11, and the extension length of the second area 126 is greater than that of the third area 127, the inside of the second area 126, the IC protection area 11 and the third area 127 is a hollow structure; the bending part 20 is used for edge protection, the bending part 20 is connected with the main body part 10 and located outside the first area 125, the bending part 20 bends in the first direction X, the first direction X is the protrusion direction of the protrusion 124; the inclined part 30 is connected with the second area 126 on one side, the inclined part 30 extends along the first direction X and inclines away from the main body part 10; the adhesive part 40 is connected with the other side of the inclined part 30, the adhesive part 40 is used for the adhesive fixing of the IC support 01, and the inclination direction of the inclined part 30 makes the bottom surface of the adhesive part 40 lower than the bottom surface of the main body part. The bottom surface of the adhesive part 40 is the surface on the same side as the second surface 122. The specific setting of the adhesive part 40 is not limited in the application, as long as it meets the requirements of the application, for example, the adhesive part 40 can realize the adhesive fixing of the IC support 01 by setting the back glue or double-sided adhesive tape on the bottom surface. A plurality of protrusions 124 are provided on the main body part 10, part of the protrusions 124 are used for bottom support, and optionally, the protrusions 124 of the first area 125 can be used for bottom support. The plurality of protrusions 124 and the plurality of recesses 123 can be used as reinforcing ribs to increase the cross-sectional area of the IC support 01, thereby increasing the strength of the IC support 01 and reducing the risk of deformation of the IC support 01. The thickness of the IC support 01 can be reduced under the condition of meeting the support requirement, and the IC support 01 is supported by the protrusions 124, only the local thickness needs to be increased, which can further reduce the weight of the IC support 01. It can be understood that the overall thickness of the IC support 01 refers to the average thickness of the IC support 01, which is conducive to reducing the risk of falling off of the IC support 01. The hollow structure inside the second area 126, the IC protection area 11 and the third area 127 not only helps to reduce the weight of the IC support 01, but also avoids the higher components on the binding area 024, which is conducive to reducing the risk of damage to the higher components. The bending part 20 can accommodate the edge of the IC 03 in the space formed by the bending part 20 and the second surface 122, which is conducive to reducing the risk of damage to the edge of the IC 03 caused by collision. The adhesive part is connected through the inclined part 30, which requires less material and is conducive to reducing the weight of the IC support 01.Therefore, the overall thickness and weight of the IC support 01 can be reduced while the strength is ensured, which is beneficial to reduce the risk of damage of the IC 03, and further beneficial to improve the production yield of the display module 00 while reducing the production cost of the display module 00.

[0034] The specific production method of the IC support 01 is not limited in the application, and any method that can achieve the purpose of the application can be used, for example, the injection molding process can be used for production.

[0035] In some embodiments of the application, the projection outer contour of the recess 123 and the convex portion 124 along the first direction X is a polygon or a circle. The projection outer contour of the recess 123 and the convex portion 124 along the first direction X is a simple and regular projection, which is beneficial to production and reduces the production cost of the IC support 01, thereby reducing the production cost of the display module 00.

[0036] It can be understood that, generally, in order to facilitate production and manufacturing, the shape of the projection outer contour of the recess 123 and the convex portion 124 along the first direction X is consistent, for example, the shape of the projection outer contour of the recess 123 and the convex portion 124 along the first direction X is rectangular. However, the shape of the projection outer contour of the recess 123 and the convex portion 124 along the first direction X can also be inconsistent, for example, the projection outer contour of the recess 123 along the first direction X is rectangular, and the projection outer contour of the convex portion 124 along the first direction X is circular. The shape of the projection outer contour of the recess 123 and the convex portion 124 along the first direction X is different, which can combine the structural characteristics of the two shapes.

[0037] The specific formation method of the recess 123 and the convex portion 124 is not limited in the application, and any method that can achieve the purpose of the application can be used, for example, the corresponding structure can be added to the injection mold to form the recess 123 and the convex portion 124.

[0038] In some embodiments of the application, as Figure 4As shown, the convex part 124 includes a first part 1241 and a second part 1242 arranged in sequence along the first direction X, the first part 1241 is a prism or cylinder structure, and the second part 1242 is a prism or cylinder structure, and the cross-sectional area of the outer contour of the second part 1242 gradually decreases in the direction away from the second surface 122 (X direction). Through the above arrangement, the surface area of the IC support 01 at the position of the convex part 124 can be increased, thereby facilitating the increase of the strength of the IC support. Moreover, the second part 1242 is a prism or cylinder structure in structure, and the slope on the prism or cylinder can disperse a part of the load in the horizontal direction and reduce the stress in the vertical direction, thereby being able to reduce the stress transmitted to the bottom surface by the convex part 124 and avoid crushing the display module below the IC support 01. Moreover, the second part 1242 is a prism or cylinder structure, which can reduce the difficulty of production. For example, if the IC support 01 is produced by using an injection molding process, the second part 1242 being a prism or cylinder structure is beneficial for demolding, so the above arrangement is also beneficial for reducing the production cost of the IC support 01, thereby being beneficial for reducing the production cost of the display module 00.

[0039] In some embodiments of the present application, the adjacent two surfaces of the second part 1242 are transitioned by a circular arc, and the corner position of the second part 1242 is rounded. The above arrangement can reduce the risk of the edge of the second part 1242 scratching the IC 03, and is beneficial for improving the production yield of the display module 00.

[0040] In some embodiments of the present application, as shown in Figure 2 The bending part 20 is divided into a plurality of bending segments 22 by a plurality of partitions 21, and the proportion of the plurality of bending segments 22 on the bending part 20 is less than that of the plurality of partitions 21. Dividing the bending part 20 into a plurality of bending segments 22 can reduce the weight of the IC support 01 while providing sufficient protection to the edge of the IC 03, which is beneficial for reducing the production cost of the IC support 01, thereby being beneficial for reducing the production cost of the display module 00.

[0041] In some embodiments of the present application, as shown in Figure 4 A plurality of reinforcing ribs 23 are arranged between the inner surface of the bending segment 22 and the second surface 122. The arrangement of the reinforcing ribs 23 can improve the strength of the bending part 20, which can strengthen the strength of the IC support 01 and reduce the risk of damage to the IC 03 caused by the bending part 20 being forced to break or bend, thereby being beneficial for improving the production yield of the display module 00.

[0042] It can be understood that when the bending part 20 is integral, the strength can be increased by arranging a plurality of reinforcing ribs 23; when the bending part 20 is divided into a plurality of bending sections 22 by a plurality of partitions 21, the strength can also be increased by arranging a plurality of reinforcing ribs 23. At this time, since the strength of each bending section 22 is shorter, at least one reinforcing rib 23 is arranged between the inner surface of each bending section 22 and the second surface 122.

[0043] In some embodiments of the present application, as shown in Figure 3 The angle A between the inner surface of the inclined part 30 and the second surface 122 is greater than or equal to 135° and less than or equal to 165°. For example, the angle between the inner surface of the inclined part 30 and the second surface 122 can be 135°, 140°, 145°, 150°, 155°, 160°, 165°, or a range formed by any two of them. It can be understood that the larger the angle A between the inner surface of the inclined part 30 and the second surface 122, the smaller the bending degree, and vice versa. In order to increase the step difference between the bonding part 40 and the main body part 10, the angle A can be reduced. Of course, under the condition of a certain step difference, reducing the angle A can reduce the extension length of the inclined part 30, which is beneficial to reduce the weight of the IC support 01, and at the same time, it is beneficial to reduce the risk of damage to the IC 03, thereby improving the production yield of the display module 00.

[0044] Specifically, the setting range of the angle A can be considered comprehensively according to the extension length of the inclined part 30 and the step difference between the bonding part 40 and the main body part 10.

[0045] In some embodiments of the present application, the overall thickness of the IC support 01 is less than or equal to 1.2mm, for example, it can be 1.2mm, 1.1mm, 1.0mm, 0.9mm, etc. The IC support 01 increases the strength of the IC support 01 by arranging a plurality of recesses 123 and a plurality of protrusions 124 as reinforcing ribs. At the same time, the plurality of recesses 123 and the plurality of protrusions 124 are arranged one by one, similar to the inverted buckle structure, the plurality of protrusions 124 support, which can improve the support strength of the IC support 01, so the overall thickness of the IC support 01 can reach 1.2mm or even below. Compared with the overall thickness of the IC support in the prior art, which is generally 1.5mm, the self-weight of the IC support 01 is greatly reduced. Therefore, after being attached to the display module, it is not easy to peel off even if it is turned over. It can better protect the IC 03 during the transportation and assembly of the display module, improve the production yield of the display module, and reduce the production cost.

[0046] At the same time, since the IC support 01 is thinned as a whole, the production material of the IC support 01 is reduced, which can reduce the manufacturing cost of the IC support 01, and is beneficial to reduce the production cost of the display module 00.

[0047] In some embodiments of the present application, the material of the IC support 01 is polycarbonate (PC). PC has high impact resistance, strength and rigidity, is not easy to deform, has good wear resistance, fatigue resistance and aging resistance, and is relatively light, which is conducive to reducing the weight of the IC support 01 while ensuring the strength of the IC support 01. At the same time, PC has good electrical insulation and is easy to process, which is conducive to improving the production yield of the display module and reducing production costs.

[0048] Embodiments of the second aspect of the present application propose an unassembled display module 00, which uses the IC support 01 in any of the embodiments of the first aspect in the assembly process. As shown in Figure 5 、 Figure 6 and Figure 7 , the display module 00 includes a display panel 02 and a heat dissipation film 04 supported on the back of the display panel 02. The display panel 02 includes a display area 021, a bending area 022, a transition area 023, and a binding area 024. The transition area 023 connects the bending area 022 and the binding area 024. The binding area 024 is placed on the side of the heat dissipation film 04 away from the display panel 02 through the bending area 022. The binding area 024 is provided with an IC 03. The adhesive part 40 is adhered to the bending area 022. The IC protection area 11 is arranged corresponding to the IC 03. Further, as shown in Figure 7 , along the first direction X, the distance D1 from the IC protection area 11 to the IC 03 is greater than or equal to 1.0 mm and less than or equal to 2.0 mm. For example, the distance D1 from the IC protection area 11 to the IC 03 can be: 1.0 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, 1.5 mm, 1.6 mm, 1.7 mm, 1.8 mm, 1.9 mm, 2.0 mm, or a range between any two of them. While ensuring that no interference occurs with the components on the IC 03, the overall height of the IC support 01 is smaller, which is conducive to reducing the weight of the IC support 01, while reducing the risk of damage to the IC 03. The bending area 022 is provided with a first protective glue layer 025, and the transition area 023 is provided with a second protective glue layer 026. The thickness of the second protective glue layer 026 is greater than the thickness of the first protective glue layer 025. The convex part 124 located in the first area 125 is arranged on the second protective glue layer 026. The convex part 124 located in the second area 126 and the third area 127 has a gap between the heat dissipation film 04. The bending part 20 is arranged in relative spacing with the lower edge of the display module 00. Further, as shown in Figure 7As shown, the distance D2 between the bending portion 20 and the lower edge of the display module 00 is greater than or equal to 3.0 mm and less than or equal to 4.0 mm. For example, the distance D2 between the bending portion 20 and the lower edge of the display module 00 can be 3.0 mm, 3.1 mm, 3.2 mm, 3.3 mm, 3.4 mm, 3.5 mm, 3.6 mm, 3.7 mm, 3.8 mm, 3.9 mm, 4.0 mm, or a range between any two of the values. The distance between the bending portion 20 and the display module 00 ensures that when the bending portion 20 is stressed, the display module 00 is not affected, thereby protecting not only the IC 03 but also the display module 00. Moreover, the bending portion 20 and the IC protection area 11 have sufficient buffer space, so that when the bending portion is stressed, the stress is not directly transmitted to the IC protection area 11 and the IC 03 below the IC protection area 11. The adhesive portion 40 does not directly contact the IC 03, and the protrusions 124 in the first area 125 are arranged on the second protective adhesive layer 026 and do not directly contact the IC 03 or the other vulnerable parts of the display module 00. The protrusions 124 in the second area 126 and the third area 127 are spaced apart from the heat dissipation film 04, and the bending portion 20 is also spaced apart from the edge of the display module 00 while accommodating the edge of the IC 03. Therefore, through the above arrangement, the IC support 01 can protect the IC 03, and the risk of damage to the IC 03 or the display module 00 by the IC support 01 is small, which is beneficial to improving the production yield of the display module 00.

[0049] In some embodiments of the present application, the thickness of the second protective adhesive layer 026 is greater than or equal to 0.3 mm and less than or equal to 0.8 mm. For example, the thickness of the second protective adhesive layer 026 can be 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, or a range between any two of the values. The thickness of the second protective adhesive layer 026 is relatively thick, which on the one hand can reduce the overall height of the protrusions 124, which is beneficial to reducing the overall weight of the IC support 01, and on the other hand is also beneficial to reducing the risk of damage to the peripheral area of the second protective adhesive layer 026 by the protrusions 124.

[0050] The present application does not limit the specific material of the second protective adhesive layer 026, as long as it can achieve the purpose of the present application. For example, it can be MCL adhesive (Metal Cover Layer, product protective adhesive).

[0051] The thickness of the first protective adhesive layer 025 is about 0.07 mm, and the materials of the first protective adhesive layer 025 and the second protective adhesive layer 026 can be the same, for example, both are MCL adhesive. When the materials of the two are the same, the second protective adhesive layer 026 only needs to increase the coating thickness when the first protective adhesive layer 025 is coated. The first protective adhesive layer 025 is used to protect the display panel 02 of the bending area 022.

[0052] Embodiments of the third aspect of the present application provide an unassembled display module 00, which uses the IC support 01 in any embodiment of the first aspect during the assembly process, as shown in Figure 5 、 Figure 6 and Figure 8 , the display module 00 comprises a display panel 02 and a heat dissipation film 04 supported on the back of the display panel 02, the display panel 02 comprises a display area 021, a bending area 022, a transition area 023 and a binding area 024, the transition area 023 connects the bending area 022 and the binding area 024, the binding area 024 is placed on the side of the heat dissipation film 04 away from the display panel 02 through the bending area 022, the binding area 024 is provided with an IC 03, an adhesive part 40 is adhered on the bending area 022, an IC protection area 11 is provided corresponding to the IC 03, the bending area 022 and the transition area 023 are provided with a first protective adhesive layer 025, the transition area 023 is provided with a foam 027 corresponding to the position of the convex part 124 of the first area 125, the convex part 124 located in the first area 125 is arranged on the foam 027, the convex part 124 located in the second area 126 and the third area 127 has a gap with the heat dissipation film 04, and the bending part 20 is arranged in relative spacing with the lower edge of the display module 00. The adhesive part 40 does not directly contact the IC 03, and the convex part 124 of the first area 125 arranged on the foam 027 does not directly contact the IC 03 or other vulnerable parts of the display module 00, and the convex part 124 located in the second area 126 and the third area 127 has a gap with the heat dissipation film 04, and the bending part 20 also has a gap between the edge containing the IC 03 and the edge of the display module 00. Therefore, through the above arrangement, the IC support 01 can protect the IC 03, and the IC 03 support 01 has less risk of damaging the IC 03 or the display module 00, which is conducive to improving the production yield of the display module 00.

[0053] The specific material of the foam 027 is not limited in the present application, which can achieve the purpose of the present application, for example, it can be PU foam.

[0054] It should be noted that, in this document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without more limitations, an element preceded by "comprises... " does not, without more constraints, foreclose the existence of additional identical elements in the process, method, article, or apparatus that comprises the recited element.

[0055] Each of the embodiments in the specification is described in a relevant manner, and the same or similar parts between the embodiments can be referred to each other. Each of the embodiments focuses on the difference from other embodiments. In particular, for the system embodiments, since they are basically similar to the method embodiments, the description is relatively simple, and the relevant parts can be referred to the part of the method embodiments.

[0056] The above only describes the preferred embodiments of the present application, and is not used to limit the protection scope of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An IC bracket, characterized in that: The IC bracket includes: The main body includes an IC protection area and a peripheral reinforcement area, wherein the peripheral reinforcement area is located at the periphery of the IC protection area. A plurality of recesses are provided on a first surface of the peripheral reinforcement area, and a plurality of protrusions are provided on a second surface. The recesses and protrusions correspond to each other one-to-one, and some or all of the multiple protrusions are used for bottom support. The peripheral reinforcement area includes a first area opposite the IC protection area and a second area and a third area located on both sides of the IC protection area. The second area and the third area extend in a second direction, which is the width direction of the IC protection area. The extension length of the second area is greater than the extension length of the third area. The interiors of the second area, the IC protection area, and the third area are hollow structures. a bent portion, for edge protection, connected to the main portion and located outside the first area, wherein the bent portion bends in a first direction, where the first direction is a protruding direction of the convex portion; an inclined portion, one side of which is connected to the second region, and the inclined portion extends along the first direction and is inclined in a direction away from the main body; The adhesive portion is connected to the other side of the inclined portion and is used for adhesively fixing the IC bracket. The inclined direction of the inclined portion makes the bottom surface of the adhesive portion lower than the bottom surface of the main body.

2. The IC bracket according to claim 1, characterized in that: The projected outer contours of the concave portion and the convex portion along the first direction are polygonal or circular.

3. The IC bracket according to claim 2, characterized in that: The convex portion includes a first part and a second part arranged in sequence along the first direction, the first part is a prism or cylindrical structure, and the second part is a truncated cone or frustum structure. In the direction away from the second surface, the cross-sectional area of ​​the outer contour of the second part gradually decreases.

4. The IC bracket according to claim 3, characterized in that: There is an arc transition between two adjacent surfaces of the second part, and the corners of the second part are rounded.

5. The IC bracket according to claim 1, characterized in that: The bending portion is divided into a plurality of bending segments by a plurality of partitions, and the proportion of the plurality of bending segments on the bending portion is smaller than that of the plurality of partitions.

6. The IC bracket according to claim 5, characterized in that: A plurality of reinforcing ribs are provided between the inner surface of the bending section and the second surface.

7. The IC bracket according to claim 1, characterized in that: An angle between the inner surface of the inclined portion and the second surface is greater than or equal to 135° and less than or equal to 165°.

8. The IC bracket according to claim 1, characterized in that: The overall thickness of the IC bracket is less than or equal to 1.2 mm.

9. The IC bracket according to claim 1, characterized in that: The material of the IC bracket is polycarbonate.

10. An unassembled display module, using the IC bracket according to any one of claims 1 to 9 during the assembly process, the display module comprising a display panel and a heat dissipation film supported on the back of the display panel, the display panel comprising a display area, a bending area, a transition area and a binding area, the transition area connecting the bending area and the binding area, the binding area being placed on the side of the heat dissipation film away from the display panel through the bending area, the binding area being provided with an IC, the adhesive portion being adhered to the bending area, the IC protection area being arranged corresponding to the IC, the bending area being provided with a first protective adhesive layer, the transition area being provided with a second protective adhesive layer, the thickness of the second protective adhesive layer being greater than the thickness of the first protective adhesive layer, the convex portion located in the first area being provided on the second protective adhesive layer, the convex portion located in the second area and the third area being spaced apart from the heat dissipation film, and the bending portion being spaced apart relative to the lower edge of the display module.

11. The display module according to claim 10, wherein: The thickness of the second protective adhesive layer is greater than or equal to 0.3 mm and less than or equal to 0.8 mm.

12. An unassembled display module, which uses the IC bracket according to any one of claims 1 to 9 during the assembly process, wherein the display module includes a display panel and a heat dissipation film supported on the back of the display panel, the display panel includes a display area, a bending area, a transition area and a binding area, the transition area connects the bending area and the binding area, the binding area is placed on the side of the heat dissipation film away from the display panel through the bending area, the binding area is provided with an IC, the adhesive portion is adhered to the bending area, the IC protection area is arranged corresponding to the IC, the bending area and the transition area are provided with a first protective adhesive layer, the transition area is provided with foam at the position of the convex portion corresponding to the first area, the convex portion located in the first area is provided on the foam, the convex portion located in the second area and the third area is spaced apart from the heat dissipation film, and the bending portion is spaced relative to the lower edge of the display module.

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