Quartz semiconductor package and method of use

Abstract

The application discloses a quartz semiconductor packaging device and a use method, relates to the technical field of quartz semiconductor packaging, and comprises a workbench, one side of the workbench is provided with a telescopic cylinder, an upper die is fixedly connected to the lower side of the workbench and penetrates through the telescopic cylinder, a lower die is arranged on the inner bottom of the workbench and is arranged below the upper die, a quartz semiconductor chip is arranged on the inner side of the lower die, and an injection molding channel is formed in one side of the lower die; and a lifting block is arranged in the upper die. Through cooperation of extrusion blocks and other components, reciprocating pressure can be applied to injection molding material around the quartz semiconductor chip, the material is caused to be more closely attached to the pins and the chip of the quartz semiconductor chip, micro voids are reduced, the density of the packaging layer is improved, and the effect of packaging the quartz semiconductor chip is greatly improved.

Description

Technical Field

[0001] This invention relates to the field of quartz semiconductor packaging technology, specifically a quartz semiconductor packaging device and its usage method. Background Technology

[0002] Quartz semiconductors refer to key components made of quartz materials used in semiconductor manufacturing. They are mainly used in core processes such as high-temperature diffusion and etching in wafer processing and have characteristics such as high temperature resistance and low thermal expansion.

[0003] In conventional packaging processes, although packaging can be completed by placing a quartz semiconductor chip in a lower mold, injecting packaging material (such as epoxy resin, silicone, etc.) after mold closing, and then cooling, the packaging quality is difficult to guarantee because the packaging process relies too heavily on the fluidity of the material itself. Due to the narrow space and complex structure around the quartz semiconductor chip (especially at the corners), the fluidity of the packaging material decreases significantly in these areas. It is difficult to completely fill the chip by its own flow, resulting in gaps or incomplete filling. This fails to completely encapsulate the chip pins and the chip body, leading to protection failure. Furthermore, the material easily traps air during flow, and the air cannot escape naturally in "dead corner" areas such as corners due to space limitations, forming bubbles or voids. At the same time, the pressure gradually decreases during material flow, resulting in loose bonding of material particles, further increasing microscopic voids and reducing the density of the packaging layer. To address these issues, we provide a quartz semiconductor packaging device and method. Summary of the Invention

[0004] The purpose of this invention is to provide a quartz semiconductor packaging device and method of use, in order to solve the problem that relying solely on the fluidity of the packaging material for filling makes it difficult to fit tightly to the chip, and even if the cavity is filled, uneven density may occur due to the decrease in flow pressure, thereby reducing the packaging effect.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a quartz semiconductor packaging device, comprising: a worktable, a telescopic cylinder mounted on one side of the worktable, an upper mold fixedly connected to the lower part of the telescopic cylinder extending through the lower part of the worktable, a lower mold mounted on the inner bottom of the worktable and positioned below the upper mold, a quartz semiconductor chip disposed on the inner side of the lower mold, and an injection channel formed on one side of the lower mold; a lifting block disposed inside the upper mold; a pressing mechanism disposed inside the lifting block for squeezing the packaging material overflowing from the corners; a heating unit disposed below the lifting block for maintaining a constant temperature of the packaging material and improving the flow effect; and an auxiliary component disposed inside the upper mold for driving the lifting block to move up and down.

[0006] As a further embodiment of the present invention: the tight mechanism includes a plurality of first air guide grooves formed on the inner side of the lifting block, and the top of the first air guide grooves penetrates through the lifting block. A first piston rod is slidably connected inside each first air guide groove. One end of the first piston rod extends to the outside of the first air guide groove and is fixedly connected to an auxiliary circular plate. A second spring is installed between the auxiliary circular plate and the lifting block. A spherical rod is fixedly connected to the top of the auxiliary circular plate. A plurality of second air guide grooves are formed on the inner side of the lifting block, and each second air guide groove is connected to a first air guide groove through a connecting air groove. A second piston rod is slidably connected inside the second air guide groove. One end of the second piston rod penetrates to the bottom of the lifting block and is fixedly connected to a pressing block. A set of second heating wires is installed inside each pressing block.

[0007] As a further embodiment of the present invention: the tight mechanism further includes a lifting groove formed inside the upper mold, a drive motor is fixedly connected inside the upper mold, an auxiliary rotating rod is fixedly connected to the execution end of the drive motor, and the auxiliary rotating rod is rotatably connected to the inner side of the upper mold, one end of the auxiliary rotating rod passes through the inner side of the lifting groove and is fixedly connected to a circular frame, and a plurality of trapezoidal abutment blocks that abut against the spherical rod are fixedly connected to the bottom of the circular frame, and the plurality of trapezoidal abutment blocks are distributed at equal distances around the bottom of the circular frame.

[0008] As a further embodiment of the present invention: the heating unit includes a heat-conducting plate fixedly connected to the bottom of the lifting block, and a first heating wire is installed on the inner side of the heat-conducting plate.

[0009] As a further embodiment of the present invention: the auxiliary component includes a lead screw fixedly connected to the bottom of the auxiliary rotating rod, a sleeve threadedly connected to the outer wall of the lead screw, two auxiliary sliders fixedly connected to the outer wall of the sleeve, a moving groove matching the auxiliary slider being opened on the inner side of the lifting block, the auxiliary slider being slidably connected to the lifting block through the moving groove, and a limiting slider being fixedly connected to each side of the lifting block, a rectangular groove matching the limiting slider being opened on the inner side of the lifting groove, the limiting slider being slidably connected to the lifting groove through the rectangular groove.

[0010] As a further embodiment of the present invention: multiple trapezoidal sliders are fixedly connected to the inner side of the circular frame, and multiple trapezoidal grooves matching the trapezoidal sliders are provided on the outer wall of the auxiliary rotating rod. The trapezoidal sliders are slidably connected to the auxiliary rotating rod through the trapezoidal grooves.

[0011] As a further embodiment of the present invention: a plurality of limiting rotating rods are fixedly connected to the bottom of the circular frame, and a limiting circular groove matching the limiting rotating rod is opened on the top of the lifting block. The limiting rotating rod is disposed inside the limiting circular groove and abuts against the top of the lifting block.

[0012] As a further embodiment of the present invention: a fixed circular plate is fixedly connected to the outer wall of the auxiliary rotating rod, and a first spring is installed between the fixed circular plate and the circular frame, wherein the elastic force of the first spring is greater than the elastic force of the combination of multiple second springs.

[0013] The present invention also discloses a quartz semiconductor packaging method, which uses the above-mentioned quartz semiconductor packaging device and includes the following steps:

[0014] S1. When it is necessary to perform injection molding and packaging of the quartz semiconductor chip, the quartz semiconductor chip is first placed inside the groove of the lower mold. After it is placed, the telescopic cylinder is activated to drive the upper mold and the lower mold to close. At this time, the injection molding and packaging machine is started, and the injection material is input from the injection channel into the lower mold for packaging. During this process, the injection material at the corner of the lower mold is reciprocated by multiple extrusion blocks.

[0015] S2. When the extrusion block is reciprocating, the second heating wire inside the extrusion block ensures that the temperature at the bottom of the extrusion block is always the same as the temperature of the injection molding material, so that the injection molding material can maintain its original fluidity when it is extruded, and the reciprocating thrust of the extrusion block can effectively push the material to fill the fine area.

[0016] S3. When the upper mold and the lower mold are in contact, the heat-conducting plate heats the injected encapsulation material through the first heating wire to keep it in a flowing state, thereby ensuring the temperature uniformity of the entire cavity material.

[0017] S4. When the auxiliary rotating rod is rotating, the sleeve is driven to rise by the lead screw, and the lifting block is also driven to rise, so that it moves to a specified height, and the quartz semiconductor chip is completely packaged by the injection molding machine.

[0018] S5. After injection molding is completed, the drive motor drives the trapezoidal abutment block to return to its original position and stop, so that the multiple extrusion blocks return to their initial state. At this time, the lifting block maintains its height. After the injection molding material cools down, the telescopic cylinder drives the upper mold to move upward to its initial position, and the drive motor is restarted to rotate in the opposite direction, so that the lifting block returns to its initial state. Then, the worker takes out the packaged quartz semiconductor chip, puts in a new quartz semiconductor chip, and continues to perform injection molding and packaging on the new quartz semiconductor chip.

[0019] Compared with the prior art, the beneficial effects of the present invention are:

[0020] 1. By using components such as extrusion blocks, reciprocating pressure can be applied to the injection molding material around the quartz semiconductor chip, causing the material to adhere more tightly to the chip's pins and the chip itself. The packaging quality of quartz semiconductor chips largely depends on the complete encapsulation of the chip's periphery (especially complex areas such as corners) by the injection molding material. Due to the narrow space and poor flowability at corners, the injection molding material is prone to insufficient filling and gaps. The reciprocating extrusion of the extrusion block can push the material towards these corner gaps through continuous pressure, forcing the material to fill all the tiny gaps and ensuring that the chip is completely covered by the packaging material. This avoids protection failure due to incomplete filling. At the same time, during the injection molding process, the material flow may trap air, forming bubbles, especially in "dead corners" such as corners. These bubbles are difficult to expel naturally, leading to voids inside the packaging layer. The continuous pressure generated by the reciprocating extrusion can push the bubbles towards the material edge or the extrusion mold. At the same time, repeated compaction makes the material particles more tightly bonded, reducing microscopic gaps and increasing the density of the packaging layer, thereby significantly improving the packaging effect of quartz semiconductor chips.

[0021] 2. By setting up components such as a second heating wire, the injection molding material maintains its original fluidity, ensuring that the reciprocating thrust of the extrusion block effectively pushes the material to fill fine areas. This prevents delamination or incomplete filling caused by the cooling breakage of cold shut material due to insufficient fluidity. Furthermore, if the temperature of the extrusion block is too low, the cooled material may stick to the bottom of the extrusion block, causing material to be carried up during reciprocating extrusion. The material is pulled up by the extrusion block, which disrupts the continuity of the material inside the cavity, forming local voids or accumulations. Consistent temperature can avoid this adhesion, ensuring that the extrusion block can act evenly on the material surface with each press, maintaining the stability of pressure transmission, thereby further ensuring filling integrity, structural uniformity, and packaging reliability.

[0022] 3. By setting up a heating unit, when the upper mold and the lower mold are in contact, the heat-conducting plate heats the injected encapsulation material through the first heating wire to keep it in a flowing state, thereby ensuring the temperature uniformity of the material in the entire cavity and avoiding temperature gradients caused by local material cooling, such as in areas far from the extrusion block. This also prevents filling gaps caused by poor flow of the injection molding material. Through cooperation with the extrusion block, air can be better discharged, and the injection molding material can be tightly bonded to every part of the quartz semiconductor chip, thereby improving the overall encapsulation effect.

[0023] 4. By setting auxiliary components, the lifting block moves slowly upward with the injection progress, and the cavity volume increases synchronously. This is equivalent to allowing air to escape time. The air can be discharged through the mold venting groove in the opposite direction of the injection material flow, which can reduce the bubble generation rate and improve the injection effect. In addition, the extrusion block continuously extrudes the injected injection material. The continuous reciprocating extrusion ensures that the material is always constrained and compacted by external force throughout the entire process from injection to cavity shaping. This is equivalent to adding pressure insurance to each stage of dynamic filling, thereby improving the continuity of the equipment during injection and thus improving the encapsulation effect. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of the present invention;

[0025] Figure 2 This is a cross-sectional view of the lower mold of the present invention;

[0026] Figure 3 This is a schematic diagram of the internal structure of the upper mold of the present invention;

[0027] Figure 4 This is a cross-sectional view of the auxiliary rotating rod of the present invention;

[0028] Figure 5 This is a schematic diagram of the connection structure between the auxiliary rotating rod and the circular frame of the present invention;

[0029] Figure 6 This is an exploded view of the circular frame of the present invention;

[0030] Figure 7 This is a schematic diagram of the internal structure of the lifting block of the present invention;

[0031] Figure 8 This is a schematic diagram of the internal structure of the first air guide groove of the present invention;

[0032] Figure 9 This is a schematic diagram of the internal structure of the extrusion block of the present invention;

[0033] Figure 10 This is a diagram showing the working state of the lifting block of the present invention when it rises to its highest point.

[0034] In the diagram: 1. Workbench; 2. Upper mold; 3. Lower mold; 4. Quartz semiconductor chip; 5. Lifting block; 6. Extrusion block; 7. Heat-conducting plate; 8. Lifting groove; 9. Drive motor; 10. Auxiliary rotating rod; 11. Fixed circular plate; 12. First spring; 13. Circular frame; 14. Limiting rotating rod; 15. Limiting circular groove; 16. Trapezoidal abutment block; 17. First piston rod; 18. Auxiliary circular plate; 19. Second spring; 20. Ball rod; 21. Limiting slider; 22. Trapezoidal slider; 23. Lead screw; 24. First heating wire; 25. Sleeve; 26. Auxiliary slider; 27. First air guide groove; 28. Second air guide groove; 29. ​​Connecting air groove; 30. Second piston rod; 31. Second heating wire; 32. Injection channel; 33. Telescopic cylinder. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In the description of this invention, it should be noted that unless otherwise explicitly specified and limited, the terms "installed," "connected," "linked," and "set up" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. The following describes embodiments of the invention based on its overall structure.

[0037] Please see Figures 1-10This embodiment provides a quartz semiconductor packaging device, including: a worktable 1, a telescopic cylinder 33 installed on one side of the worktable 1, the actuating end of the telescopic cylinder 33 extending through to the bottom of the worktable 1 and fixedly connected to an upper mold 2, a lower mold 3 installed on the inner bottom of the worktable 1 and positioned below the upper mold 2, a quartz semiconductor chip 4 disposed on the inner side of the lower mold 3, and an injection channel 32 opened on one side of the lower mold 3; a lifting block 5 disposed inside the upper mold 2; and a sealing mechanism disposed inside the lifting block 5 for squeezing the packaging material overflowing from the corners, the sealing mechanism including a plurality of first air guide grooves 27 opened on the inner side of the lifting block 5, the top of the first air guide grooves 27 extending through the lifting block 5, a first piston rod 17 slidably connected inside each first air guide groove 27, one end of the first piston rod 17 extending to the outside of the first air guide groove 27 and fixedly connected to an auxiliary circular plate 18, and a second spring 19 installed between the auxiliary circular plate 18 and the lifting block 5. A ball rod 20 is fixedly connected to the top of the auxiliary circular plate 18. Multiple second air guide grooves 28 are opened on the inner side of the lifting block 5. Each second air guide groove 28 is connected to a first air guide groove 27 through a connecting air groove 29. A second piston rod 30 is slidably connected inside the second air guide groove 28. One end of the second piston rod 30 passes through to the bottom of the lifting block 5 and is fixedly connected to a pressing block 6. A set of second heating wires 31 are installed inside the pressing block 6. The tight mechanism also includes a lifting groove 8 opened inside the upper mold 2. A drive motor 9 is fixedly connected inside the upper mold 2. An auxiliary rotating rod 10 is fixedly connected to the execution end of the drive motor 9. The auxiliary rotating rod 10 is rotatably connected to the inner side of the upper mold 2. One end of the auxiliary rotating rod 10 passes through to the inner side of the lifting groove 8 and is fixedly connected to a circular frame 13. Multiple trapezoidal abutment blocks 16 that abut against the ball rod 20 are fixedly connected to the bottom of the circular frame 13. The multiple trapezoidal abutment blocks 16 are evenly distributed around the bottom of the circular frame 13.

[0038] The lower mold 3 is connected to the injection molding and packaging machine through the injection channel 32. Since the injection molding and packaging machine performs injection molding is existing technology, it will not be described in detail here. In the initial state of the equipment, the bottom of the lifting block 5 is flush with the bottom of the upper mold 2, and the bottom of the extrusion block 6 is initially flush with the bottom of the lifting block 5.

[0039] Multiple extrusion blocks 6 are distributed at the four corners of the bottom of the lifting block 5;

[0040] When the quartz semiconductor chip 4 needs to be injection molded, the quartz semiconductor chip 4 is first placed inside the groove of the lower mold 3. After placement, the telescopic cylinder 33 is activated to drive the upper mold 2 to fit with the lower mold 3. At this time, the injection molding machine is started, and the injection material is input into the lower mold 3 from the injection channel 32. At this time, the drive motor 9 is activated to drive the auxiliary rotating rod 10 to rotate, and the auxiliary rotating rod 10 drives the circular frame 13 to rotate, so that the trapezoidal abutment block 16 at the bottom of the circular frame 13 abuts against the ball rod 20. When the ball rod 20 moves from the highest point to the lowest point of the trapezoidal abutment block 16, it pushes the ball rod 20 to move downward, thereby driving the first piston rod 17 to input air from the connecting air channel 29 into the second air channel 28 inside the first air channel 27. This, in turn, drives the second piston rod 30 to drive the extrusion block 6 to extrude the injection material at the corner of the lower mold 3. When the ball rod 20 separates from the trapezoidal abutment block 16, under the action of the second spring 19, it passes through the auxiliary circular plate 18. The first piston rod 17 is driven to return to its original position, thereby driving the extrusion block 6 to reciprocate and extrude the injection molding material under the contact of multiple trapezoidal abutment blocks 16 and ball rod 20. This allows for targeted reciprocating pressure on the injection molding material around the quartz semiconductor chip 4, promoting a tighter fit between the material and the pins and chip of the quartz semiconductor chip 4. The packaging quality of the quartz semiconductor chip largely depends on the complete wrapping of the chip's periphery (especially complex areas such as corners) by the injection molding material. Due to the narrow space and poor flow at the corners, the injection molding material is prone to insufficient filling and gaps. The reciprocating extrusion of the extrusion block can push the material to flow into the corner gaps through continuous pressure, forcing the material to fill all the tiny gaps, ensuring that the chip is completely covered by the packaging material, and avoiding protection failure due to incomplete filling. At the same time, during the injection molding process, the material may carry air and form bubbles, especially in "dead corners" such as corners, where bubbles are difficult to expel naturally, leading to voids inside the packaging layer. The continuous pressure generated by reciprocating extrusion can push air bubbles toward the edge of the material or the extrusion die. At the same time, repeated compaction makes the material particles more tightly bound, reduces microscopic gaps, and increases the density of the encapsulation layer, thereby significantly improving the encapsulation effect of quartz semiconductor chip 4.

[0041] When the extrusion block 6 is reciprocating, the second heating wire 31 inside the extrusion block 6 ensures that the temperature of the bottom of the extrusion block 6 is always the same as the temperature of the injection molding material. This allows the injection molding material to maintain its original fluidity during extrusion, ensuring that the reciprocating thrust of the extrusion block 6 effectively pushes the material to fill fine areas. This prevents delamination or incomplete filling caused by the cooling breakage of cold shut material due to insufficient fluidity. Furthermore, if the temperature of the extrusion block 6 is too low, the cooled material may stick to the bottom of the extrusion block 6, causing material carrying during reciprocating extrusion. The material is pulled up by the extrusion block 6, disrupting the continuity of the material inside the cavity and forming local voids or accumulations. Consistent temperature can avoid this adhesion, ensuring that the extrusion block 6 can act evenly on the material surface with each press, maintaining the stability of pressure transmission, thereby further ensuring filling integrity, structural uniformity, and packaging reliability.

[0042] Please see Figures 2-7 The heating unit is located below the lifting block 5 and is used to keep the packaging material at a constant temperature and improve the flow effect. The heating unit includes a heat-conducting plate 7 fixedly connected to the bottom of the lifting block 5, and a first heating wire 24 is installed on the inner side of the heat-conducting plate 7.

[0043] When the upper mold 2 and the lower mold 3 are fitted together, the heat-conducting plate 7 heats the injected encapsulation material through the first heating wire 24, keeping it in a flowing state, thereby ensuring the temperature uniformity of the material in the entire cavity, avoiding temperature gradients caused by local material cooling, such as in areas far from the extrusion block 6, and preventing filling gaps caused by poor flow of the injection molding material. Through cooperation with the extrusion block 6, air can be better discharged, and the injection molding material can be tightly bonded to every part of the quartz semiconductor chip 4, thereby improving the overall encapsulation effect.

[0044] Please see Figures 3 to 10An auxiliary component, located inside the upper mold 2, is used to drive the lifting block 5 to rise and fall. The auxiliary component includes a lead screw 23 fixedly connected to the bottom of the auxiliary rotating rod 10. A sleeve 25 is threaded onto the outer wall of the lead screw 23. Two auxiliary sliders 26 are fixedly connected to the outer wall of the sleeve 25. A moving groove matching the auxiliary sliders 26 is opened on the inner side of the lifting block 5. The auxiliary sliders 26 are slidably connected to the lifting block 5 through the moving groove. A limiting slider 21 is fixedly connected to each side of the lifting block 5. A rectangular groove matching the limiting slider 21 is opened on the inner side of the lifting groove 8. The limiting slider 21 is slidably connected to the lifting groove 8 through the rectangular groove. The circular frame 13... Multiple trapezoidal sliders 22 are fixedly connected to the inner side. Multiple trapezoidal grooves matching the trapezoidal sliders 22 are opened on the outer wall of the auxiliary rotating rod 10. The trapezoidal sliders 22 are slidably connected to the auxiliary rotating rod 10 through the trapezoidal grooves. Multiple limiting rotating rods 14 are fixedly connected to the bottom of the circular frame 13. A limiting circular groove 15 matching the limiting rotating rod 14 is opened on the top of the lifting block 5. The limiting rotating rod 14 is set inside the limiting circular groove 15 and abuts against the top of the lifting block 5. A fixed circular plate 11 is fixedly connected to the outer wall of the auxiliary rotating rod 10. A first spring 12 is installed between the fixed circular plate 11 and the circular frame 13. The elastic force of the first spring 12 is greater than the elastic force of the combination of multiple second springs 19.

[0045] When the auxiliary rotating rod 10 rotates, it simultaneously drives the lead screw 23 to rotate. At this time, the sleeve 25 of the lead screw 23 moves inside the moving groove through the auxiliary slider 26. When the auxiliary slider 26 moves to the top of the moving groove, the injection material inside the lower mold 3 is filled (the speed at which the encapsulation material is filled inside the lower mold 3 is the same as the speed at which the drive motor 9 drives the auxiliary slider 26 to move to the highest point. Since this can be implemented under the control of the PLC controller in the existing technology, it is not described in detail in this solution). The lead screw 23 drives the lifting block 5 to move upward through the sleeve 25. The speed at which the lifting block 5 rises is the same as the speed at which the injection material is injected. The lifting block 5 stops when it moves to the designated position. The straight distance between the bottom of the lifting block 5 after it moves to the designated position and the bottom of the upper mold 2 matches the height of the cavity inside the lower mold 3. The lifting block 5 moves upward slowly with the injection progress, and the cavity volume increases synchronously. This is equivalent to giving the air time to escape. The air can be discharged through the mold exhaust groove in the opposite direction of the injection material flow, which can reduce the bubble generation rate and thus improve the injection effect.

[0046] Furthermore, when the lifting block 5 rises, it pushes the limiting rotating rod 14 through the limiting circular groove 15, thereby enabling the circular frame 13 to move upward within the trapezoidal groove of the auxiliary rotating rod 10 via the trapezoidal slider 22. Under the action of the first spring 12, the trapezoidal abutment block 16 at the bottom of the circular frame 13 can continue to abut against the ball rod 20 during the rising process, thereby enabling the extrusion block 6 to continuously extrude the injected injection molding material. The continuous reciprocating extrusion, through uninterrupted periodic pressure, ensures that the material is always constrained and compacted by external force throughout the entire process from injection to cavity shaping, which is equivalent to adding pressure insurance to each stage of dynamic filling, thereby improving the continuity of the equipment during injection molding and thus improving the packaging effect.

[0047] After injection molding is completed, the drive motor 9 drives the trapezoidal abutment block 16 to return to its original position and stop, so that the multiple extrusion blocks 6 return to their initial state. At this time, the lifting block 5 maintains its height. After the injection molding material cools down, the telescopic cylinder 33 drives the upper mold 2 to move upward to its initial position and restarts the drive motor 9 to rotate in the opposite direction, so that the lifting block 5 returns to its initial state. Then, the staff takes out the packaged quartz semiconductor chip 4, puts in a new quartz semiconductor chip 4, and continues to repeat the above operation, thereby improving the applicability of the equipment.

[0048] The following describes a quartz semiconductor packaging method in conjunction with the aforementioned quartz semiconductor packaging device, specifically including the following steps:

[0049] S1. When it is necessary to perform injection molding and packaging of quartz semiconductor chip 4, first place quartz semiconductor chip 4 in the groove of lower mold 3. After placing it, start telescopic cylinder 33 to drive upper mold 2 and lower mold 3 to close the mold. At this time, the injection molding and packaging machine starts and inputs injection material from injection channel 32 into the lower mold 3 for packaging operation. During this process, multiple extrusion blocks 6 reciprocate to extrude the injection material at the corners of lower mold 3.

[0050] S2. When the extrusion block 6 is reciprocating, the second heating wire 31 inside the extrusion block 6 ensures that the temperature at the bottom of the extrusion block 6 is always the same as the temperature of the injection molding material, so that the injection molding material can maintain its original fluidity when it is being extruded, and the reciprocating thrust of the extrusion block 6 can effectively push the material to fill the fine areas.

[0051] S3. When the upper mold 2 and the lower mold 3 are in contact, the heat-conducting plate 7 heats the injected encapsulation material through the first heating wire 24 to keep it in a flowing state, thereby ensuring the temperature uniformity of the entire cavity material.

[0052] S4. When the auxiliary rotating rod 10 rotates, it drives the sleeve 25 to rise through the lead screw 23, and at the same time drives the lifting block 5 to rise, so that it moves to the specified height, and the quartz semiconductor chip 4 is completely packaged by the injection molding machine.

[0053] S5. After injection molding is completed, the drive motor 9 drives the trapezoidal abutment block 16 to return to its original position and stop, so that the multiple extrusion blocks 6 return to their initial state. At this time, the lifting block 5 maintains its height. After the injection molding material cools down, the telescopic cylinder 33 drives the upper mold 2 to move upward to its initial position and restarts the drive motor 9 to rotate in the opposite direction, so that the lifting block 5 returns to its initial state. Then, the staff takes out the packaged quartz semiconductor chip 4, puts in a new quartz semiconductor chip 4, and continues to perform injection molding and packaging on the new quartz semiconductor chip 4.

[0054] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A quartz semiconductor packaging device, characterized in that, include: A workbench (1) is provided with a telescopic cylinder (33) installed on one side of the workbench (1). The actuating end of the telescopic cylinder (33) extends through to the bottom of the workbench (1) and is fixedly connected to an upper mold (2). A lower mold (3) is installed on the bottom inner side of the workbench (1) and is located below the upper mold (2). A quartz semiconductor chip (4) is provided on the inner side of the lower mold (3). An injection channel (32) is provided on one side of the lower mold (3). The lifting block (5) is located inside the upper mold (2); A compaction mechanism is provided inside the lifting block (5) for squeezing the packaging material that overflows from the corners. The compaction mechanism includes a plurality of second air guide grooves (28) opened inside the lifting block (5). A second piston rod (30) is slidably connected inside the second air guide groove (28). One end of the second piston rod (30) passes through to the bottom of the lifting block (5) and is fixedly connected to a squeezing block (6). A set of second heating wires (31) is installed inside the squeezing block (6). A heating unit is located below the lifting block (5) to maintain the temperature of the encapsulation material and improve the flow effect; An auxiliary component is located inside the upper mold (2) and is used to drive the lifting block (5) to move up and down; The tight mechanism includes a plurality of first air guide grooves (27) opened inside the lifting block (5), and the top of the first air guide groove (27) passes through the lifting block (5). A first piston rod (17) is slidably connected inside each first air guide groove (27). One end of the first piston rod (17) extends to the outside of the first air guide groove (27) and is fixedly connected to an auxiliary circular plate (18). A second spring (19) is installed between the auxiliary circular plate (18) and the lifting block (5). A ball rod (20) is fixedly connected to the top of the auxiliary circular plate (18). Each second air guide groove (28) is connected to a first air guide groove (27) through a connecting air groove (29). The tight mechanism also includes a lifting groove (8) opened inside the upper mold (2). A drive motor (9) is fixedly connected inside the upper mold (2). An auxiliary rotating rod (10) is fixedly connected to the execution end of the drive motor (9). The auxiliary rotating rod (10) is rotatably connected to the inner side of the upper mold (2). One end of the auxiliary rotating rod (10) passes through the inner side of the lifting groove (8) and is fixedly connected to a circular frame (13). A plurality of trapezoidal abutment blocks (16) that abut against the spherical rod (20) are fixedly connected to the bottom of the circular frame (13). The plurality of trapezoidal abutment blocks (16) are evenly distributed around the bottom of the circular frame (13).

2. The quartz semiconductor packaging device according to claim 1, characterized in that, The heating unit includes a heat-conducting plate (7) fixedly connected to the bottom of the lifting block (5), and a first heating wire (24) is installed on the inner side of the heat-conducting plate (7).

3. The quartz semiconductor packaging device according to claim 2, characterized in that, The auxiliary component includes a lead screw (23) fixedly connected to the bottom of the auxiliary rotating rod (10). A sleeve (25) is threadedly connected to the outer wall of the lead screw (23). Two auxiliary sliders (26) are fixedly connected to the outer wall of the sleeve (25). A moving groove matching the auxiliary slider (26) is opened on the inner side of the lifting block (5). The auxiliary slider (26) is slidably connected to the lifting block (5) through the moving groove. A limiting slider (21) is fixedly connected to each side of the lifting block (5). A rectangular groove matching the limiting slider (21) is opened on the inner side of the lifting groove (8). The limiting slider (21) is slidably connected to the lifting groove (8) through the rectangular groove.

4. The quartz semiconductor packaging device according to claim 3, characterized in that, Multiple trapezoidal sliders (22) are fixedly connected to the inner side of the circular frame (13). Multiple trapezoidal grooves matching the trapezoidal sliders (22) are opened on the outer wall of the auxiliary rotating rod (10). The trapezoidal sliders (22) are slidably connected to the auxiliary rotating rod (10) through the trapezoidal grooves.

5. A quartz semiconductor packaging device according to claim 4, characterized in that, The bottom of the circular frame (13) is fixedly connected with multiple limiting rotating rods (14), and the top of the lifting block (5) is provided with a limiting circular groove (15) that matches the limiting rotating rod (14). The limiting rotating rod (14) is set inside the limiting circular groove (15) and abuts against the top of the lifting block (5).

6. A quartz semiconductor packaging device according to claim 5, characterized in that, A fixed circular plate (11) is fixedly connected to the outer wall of the auxiliary rotating rod (10). A first spring (12) is installed between the fixed circular plate (11) and the circular frame (13). The elastic force of the first spring (12) is greater than the elastic force of the combination of multiple second springs (19).

7. A method for packaging quartz semiconductors, characterized in that, The quartz semiconductor packaging device according to claim 6 includes the following steps: S1. When it is necessary to perform injection molding and packaging of the quartz semiconductor chip (4), the quartz semiconductor chip (4) is first placed inside the groove of the lower mold (3). After it is placed, the telescopic cylinder (33) is started to drive the upper mold (2) and the lower mold (3) to close the mold. At this time, the injection molding and packaging machine is started, and the injection material is input from the injection channel (32) into the lower mold (3) for packaging operation. During this process, the injection material at the corner of the lower mold (3) is reciprocated by multiple extrusion blocks (6). S2. When the extrusion block (6) is reciprocating, the second heating wire (31) inside the extrusion block (6) ensures that the temperature at the bottom of the extrusion block (6) is always the same as the temperature of the injection molding material, so that the injection molding material can maintain its original fluidity when it is extruded, and ensure that the reciprocating thrust of the extrusion block (6) effectively pushes the material to fill the fine area. S3. When the upper mold (2) and the lower mold (3) are in contact, the heat-conducting plate (7) heats the injected encapsulation material through the first heating wire (24) to keep it in a flowing state, thereby ensuring the temperature uniformity of the entire cavity material. S4. When the auxiliary rotating rod (10) is rotating, the sleeve (25) is driven to rise by the lead screw (23) and the lifting block (5) is driven to rise, so that it moves to the specified height, and the quartz semiconductor chip (4) is completely packaged by the injection molding machine. S5. After injection molding is completed, the drive motor (9) drives the trapezoidal abutment block (16) to return to its original position and stop, so that the multiple extrusion blocks (6) return to their initial state. At this time, the lifting block (5) maintains its height. After the injection molding material cools down, the telescopic cylinder (33) drives the upper mold (2) to move upward to its initial position, and restarts the drive motor (9) to make it rotate in the opposite direction, so that the lifting block (5) returns to its initial state. Then, the staff takes out the packaged quartz semiconductor chip (4), puts in a new quartz semiconductor chip (4), and continues to perform injection molding and packaging on the new quartz semiconductor chip (4).

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