Bending detection devices, methods, head-mounted devices and computer program products

Abstract

This application discloses a bending detection device, method, head-mounted device, and computer program product, belonging to the field of smart wearable technology. The bending detection device includes: an FPC component comprising multiple signal layers arranged in parallel when the FPC component is not bent; sensing electrodes are disposed at designated positions on at least two adjacent signal layers, the designated positions being within the bending activity area of ​​the FPC component; and a state detection module electrically connected to at least two adjacent sensing electrodes. The state detection module detects the capacitance value between the at least two adjacent sensing electrodes and determines the bending state of the FPC component based on the change in capacitance value. This application reduces the complexity of folding state detection.

Description

Technical Field

[0001] This application relates to the field of smart wearable technology, and more particularly to bending detection devices, methods, head-mounted devices, and computer program products. Background Technology

[0002] AR (Augmented Reality) glasses are a common type of smart wearable device. When using AR glasses, you generally need to unfold the temples of the glasses before putting them on your head. After use, you will fold the temples and put the glasses back into the case. The working state of the AR glasses will also automatically switch according to the folding state of the temples.

[0003] Currently, the folding state of the temples is detected in real time by setting up dedicated physical devices (such as Hall effect devices and matching magnets) at the connection between the frame and the temples. However, this also requires precise evaluation and simulation of the placement of the physical devices during the research and development process, as well as high assembly precision during the production process. This makes the solution highly complex and has insufficient mass production efficiency. Summary of the Invention

[0004] The main objective of this application is to provide a bending detection device, method, head-mounted device, and computer program product, aiming to solve the technical problem of how to reduce the complexity of folding state detection.

[0005] To achieve the above objectives, embodiments of this application provide a bending detection device, the bending detection device comprising:

[0006] The FPC (Flexible Printed Circuit) assembly includes multiple signal layers, each of which is arranged in parallel when the FPC assembly is not bent. At least two adjacent signal layers have sensing electrodes at designated locations, which are located within the bending activity area of ​​the FPC assembly.

[0007] A state detection module is electrically connected to at least two adjacent sensing electrodes. The state detection module is used to detect the capacitance value between at least two adjacent sensing electrodes and determine the bending state of the FPC component based on the change in the capacitance value.

[0008] In one embodiment, the FPC component further includes:

[0009] A protective layer that covers each of the signal layers and fills the spaces between the signal layers.

[0010] In one embodiment, the FPC component further includes:

[0011] An air gap is provided between signal layers that are located in the bending activity area and contain the sensing electrodes, or the air gap is provided between each of the signal layers located in the bending activity area.

[0012] In one embodiment, the state detection module includes:

[0013] A capacitance measuring unit is electrically connected to at least two adjacent sensing electrodes, and the capacitance measuring unit is used to detect the capacitance value between at least two adjacent sensing electrodes.

[0014] The main control unit is electrically connected to the capacitance measurement unit and is used to determine the bending state of the FPC component based on the change in capacitance value.

[0015] In one embodiment, the state detection module is used for:

[0016] If the capacitance value is detected to be at its minimum, it is determined that the FPC component is not bent.

[0017] If the capacitance value is detected to be greater than the minimum value, it is determined that the FPC component is bent.

[0018] If the capacitance value is detected to be at its maximum value, it is determined that the FPC component is in a folded state.

[0019] Furthermore, to achieve the above objectives, this application also provides a bending detection method, which is applied to the bending detection device described above, and includes:

[0020] Detect the capacitance value between at least two adjacent sensing electrodes;

[0021] The bending state of the FPC component is determined based on the change in the capacitance value.

[0022] In one embodiment, determining the bending state of the FPC component based on the change in capacitance value includes:

[0023] When the capacitance value is at its minimum, it is determined that the FPC component is not bent;

[0024] If the capacitance value is greater than the minimum value, it is determined that the FPC component is bent.

[0025] When the capacitance value is at its maximum, the FPC component is determined to be in a folded state.

[0026] Furthermore, to achieve the above objectives, this application also provides a head-mounted device, which includes a foldable component and a bending detection device as described above. The foldable component includes a frame, a pivot, and temples connected in sequence. The FPC component in the bending detection device is inserted into the foldable component, and the state detection module in the bending detection device is disposed in the frame or the temples. The bending detection device is used to detect the folding state of the foldable component.

[0027] In one embodiment, the bending detection device is also used to adjust the working state of the head-mounted device according to the folding state.

[0028] In addition, to achieve the above objectives, this application also provides a computer program product, which includes a computer program that, when executed by a processor, implements the bending detection method as described above.

[0029] This application proposes a bending detection device, method, head-mounted device, and computer program product, overcoming the problems of high process complexity and insufficient mass production efficiency caused by the reliance on dedicated physical devices for folding state detection in related technologies. The bending detection device includes: an FPC component comprising multiple signal layers arranged in parallel when the FPC component is not bent; sensing electrodes are disposed at designated positions on at least two adjacent signal layers, the designated positions being within the bending activity area of ​​the FPC component; and a state detection module electrically connected to at least two adjacent sensing electrodes, the state detection module detecting the capacitance value between the at least two adjacent sensing electrodes and determining the bending state of the FPC component based on the change in capacitance value. This application embodiment adds sensing electrodes to the bending activity area of ​​the FPC component and detects the change in capacitance between the sensing electrodes. Based on the inherent characteristic that the capacitance changes with the distance between the boards, it can intuitively reflect whether the FPC component is bent. When the bending activity area of ​​the FPC component is corresponding to the space between the frame and the temple, the folding state of the temple can be quickly determined by detecting the bending state of the FPC component. The process has low complexity, does not require the addition of special physical devices, and can significantly improve production efficiency and reduce costs. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0031] Figure 1This is a schematic diagram of the structure of a bending detection device provided in an embodiment of this application;

[0032] Figure 2 This is a schematic diagram of one embodiment of the FPC component in a bending detection device provided in this application.

[0033] Figure 3 A schematic diagram illustrating another implementation of the FPC component in a bending detection device provided in this application embodiment;

[0034] Figure 4 This is a schematic diagram of one embodiment of the state detection module in a bending detection device provided in this application.

[0035] Figure 5 This is a flowchart illustrating a bending detection method provided in an embodiment of this application.

[0036] The realization of the objectives, functional features and advantages of the embodiments of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.

[0037] Explanation of icon numbers:

[0038] 10. FPC component; 11. Signal layer; 12. Sensing electrode; 13. Bending area; 20. Status detection module; 14. Protective layer; 15. Air gap; 21. Capacitance measurement unit; 22. Main control unit. Detailed Implementation

[0039] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the embodiments of this application.

[0040] The bending detection device, method, head-mounted device, and computer program product provided in this application are specifically described through the following embodiments. First, the bending detection device in the embodiments of this application is described.

[0041] This application provides a bending detection device, referring to... Figure 1 , Figure 1 This is a schematic diagram of a bending detection device provided in an embodiment of this application. The bending detection device includes:

[0042] FPC component 10 includes multiple signal layers 11, each signal layer 11 is arranged in parallel when the FPC component 10 is not bent, and a sensing electrode 12 is provided at a designated position of at least two adjacent signal layers 11, the designated position being located in the bending activity area 13 of the FPC component 10.

[0043] The state detection module 20 is electrically connected to at least two adjacent sensing electrodes 12. The state detection module 20 is used to detect the capacitance value between at least two adjacent sensing electrodes 12 and determine the bending state of the FPC component 10 based on the change in capacitance value.

[0044] In this embodiment, the bending detection device can be used to detect the folding state of the temples of eyeglasses. The FPC assembly 10 can be inserted into the frame, temples, and the connecting part between them. The bending activity area 13 of the FPC assembly 10 can be continuously distributed in the frame, connecting part, and temples. The designated position of the sensing electrode 12 can correspond to the connecting part with the largest change in bending angle. When the temples are not folded, the FPC assembly 10 will not bend. Therefore, the multiple signal layers 11 contained in the FPC assembly 10 are arranged in parallel. At this time, the distance between the sensing electrodes 12 is the largest, and the corresponding capacitance value is small. When the temples are bent, the part of each signal layer 11 in the bending activity area 13 will be squeezed by external stress, resulting in a decrease in the interlayer distance. Correspondingly, the distance between the sensing electrodes 12 will also decrease, and the capacitance value between the sensing electrodes 12 will increase accordingly.

[0045] As an example, the signal layer 11 in this embodiment can be a copper foil layer, and signal lines made of rolled copper can be laid in the signal layer 11. The sensing electrode 12 can be made based on the copper foil in the area of ​​the signal layer 11 where no signal lines are laid, and signal lines are led out from the sensing electrode 12 to be electrically connected to the state detection module 20. It is understood that the signal layer 11 in this embodiment can also be made of other conductor materials, and this embodiment does not limit it.

[0046] In this embodiment, the state detection module 20 can be set in the frame or temple of the mirror. Its capacitance measurement function can be implemented using the remaining pins of the main control chip in the frame or temple, without the need to add an extra chip and without introducing excessive costs.

[0047] In this embodiment, in order to achieve capacitance detection, a sensing electrode 12 needs to be set at a designated position in at least two signal layers 11, so that the state detection module 20 can achieve capacitance detection by connecting the two sensing electrodes 12. It is understood that sensing electrodes 12 can also be set in three or more signal layers 11, and the state detection module 20 can select multiple groups of adjacent sensing electrodes 12 to perform capacitance detection, and then comprehensively judge the bending state of the FPC component 10 based on the capacitance value changes of different groups.

[0048] This embodiment provides a bending detection device. By adding sensing electrodes 12 to the bending activity area 13 of the FPC assembly 10 and detecting the change in capacitance between the sensing electrodes 12, based on the inherent characteristic that the capacitance changes with the distance between the plates, it can intuitively reflect whether the FPC assembly 10 is bent. When the bending activity area 13 of the FPC assembly 10 is corresponding to the space between the frame and the temple, the folding state of the temple can be quickly determined by detecting the bending state of the FPC assembly 10. The process has low complexity, does not require the addition of special physical devices, and can significantly improve production efficiency and reduce costs.

[0049] In some feasible embodiments, the FPC component 10 may further include:

[0050] A protective layer 14 covers each signal layer 11 and fills the spaces between each signal layer 11.

[0051] In this embodiment, the protective layer 14 can be made of materials such as coverlay (a protective film, also called a cover film or encapsulation, which is a material that is an insulating material and an adhesive bonded together with the substrate), adhesive, or dielectric. By setting the protective layer 14, the signal lines can be protected from short circuits. In practical applications, different signal layers 11 can also be bonded together by heat pressing using the protective layer 14 to reduce the size of the FPC assembly 10. It should be noted that the more signal layers 11 are pressed together, the thicker the FPC assembly 10 will be, and the more difficult it will be to bend.

[0052] In some feasible embodiments, the FPC component 10 may further include:

[0053] Air gap 15 is disposed between signal layers 11 in the bending activity region 13 and containing sensing electrodes 12, or air gap 15 is disposed between each signal layer 11 in the bending activity region 13.

[0054] In this embodiment, after the protective layer 14 that was originally filled between the signal layers 11 is removed, an air gap 15 is formed between the signal layers 11, and the two signal layers 11 with the air gap 15 are no longer bound to each other.

[0055] It should be noted that without the air gap 15, the signal layers 11 would be bound together due to the protective layer 14 filling them. When the FPC assembly 10 is bent, the signal layers 11 in the bending activity area 13 would move synchronously. Since the bending radius of the outer signal layer 11 is larger than that of the inner signal layer 11, the outer signal layer 11 would experience greater stress and be more easily damaged. However, with the air gap 15, the interaction between the signal layers 11 in the bending activity area 13 with the air gap 15 is reduced when the FPC assembly 10 is bent, and the interlayer stress is also reduced. This provides better protection for the signal layers 11 in the bending activity area 13, and the number of bends that the FPC assembly 10 can withstand is greatly increased, making the product equipped with this FPC assembly 10 more durable.

[0056] In some feasible embodiments, the state detection module 20 may further include:

[0057] The capacitance measurement unit 21 is electrically connected to at least two adjacent sensing electrodes 12 and is used to detect the capacitance value between at least two adjacent sensing electrodes 12.

[0058] The main control unit 22 is electrically connected to the capacitance measurement unit 21. The main control unit 22 is used to determine the bending state of the FPC component 10 based on the change in capacitance value.

[0059] In this embodiment, the main control unit 22 can be a main control chip located in the temple or frame of the glasses. The capacitance measurement unit 21 can be implemented using the idle pins on the main control chip, without the need to add an additional chip, thus avoiding excessive costs. It is understood that even if the capacitance measurement unit 21 is implemented using an additional chip, this embodiment is more cost-effective than the solution that requires adding a dedicated physical device to know the folding state of the temple.

[0060] In some feasible embodiments, the state detection module 20 described above can be specifically used for:

[0061] If the capacitance value is detected to be at its minimum, it is determined that the FPC component 10 is not bent;

[0062] If the detected capacitance value is greater than the minimum value, it is determined that the FPC component 10 is bent;

[0063] If the capacitance value is detected to be at its maximum, it is determined that the FPC component 10 is in a folded state.

[0064] In this embodiment, the detected capacitance value changes with the distance between the sensing electrodes 12. When the distance between the sensing electrodes 12 reaches its maximum, the capacitance value is at its minimum; when the distance between the sensing electrodes 12 reaches its minimum, the capacitance value is at its maximum. When the FPC component 10 is not bent, the spacing between the signal layers 11 in the bending activity area 13 is at its maximum, and the distance between the sensing electrodes 12 also reaches its maximum, resulting in the minimum detected capacitance value. Therefore, when the detected capacitance value is at its minimum, it can be determined that the FPC component 10 is not bent. Similarly, when the detected capacitance value is greater than the minimum, it indicates that the distance between the sensing electrodes 12 is less than the maximum, meaning that the signal layers 11 in the bending activity area 13 have begun to move closer to each other under external stress, and the FPC component 10 is in a bent state. When the detected capacitance value is at its maximum, it indicates that the distance between the sensing electrodes 12 has reached its minimum, meaning that the signal layers 11 in the bending activity area 13 have tended to be completely fitted under the action of external stress, and it can be determined that the FPC component 10 is in a folded state.

[0065] Furthermore, to achieve the above objectives, embodiments of this application also provide a bending detection method, referring to... Figure 5 , Figure 5 This is a flowchart illustrating a bending detection method provided in an embodiment of this application. The bending detection method is applied to the bending detection device provided in the above embodiment and includes steps S10 to S20.

[0066] Step S10: Detect the capacitance value between at least two adjacent sensing electrodes;

[0067] Step S20: Determine the bending state of the FPC component based on the change in capacitance value.

[0068] In some feasible embodiments, step S20 above may specifically include:

[0069] Step S201: When the capacitance value is at its minimum, determine that the FPC component is not bent;

[0070] Step S202: If the capacitance value is greater than the minimum value, it is determined that the FPC component has been bent.

[0071] Step S203: When the capacitance value is at its maximum, determine that the FPC component is in a folded state.

[0072] The bending detection method proposed in this embodiment belongs to the same technical concept as the bending detection device proposed in the above embodiments. Technical details not described in detail in this embodiment can be found in any of the above embodiments. Furthermore, this embodiment has the same beneficial effects as the above embodiments of the bending detection device.

[0073] In addition, this application embodiment also provides a head-mounted device, which includes a foldable component and a bending detection device provided in the above embodiment. The foldable component includes a frame, a pivot, and a temple connected in sequence. The FPC component in the bending detection device is inserted into the foldable component. The state detection module in the bending detection device is disposed in the frame or temple. The bending detection device is used to detect the folding state of the foldable component.

[0074] As an example, the head-mounted device could be AR glasses.

[0075] In some feasible embodiments, the bending detection device is also used to adjust the operating state of the head-mounted device according to the folding state of the foldable component.

[0076] As an example, when the foldable component is not folded, it can be considered that the user needs to use the head-mounted device, and the working state of the head-mounted device is switched to a high-power state; when the foldable component is folded, it can be considered that the user does not need to use the head-mounted device, and the working state of the head-mounted device is switched to a low-power state. It is understood that the working state adjustment methods provided in this embodiment are only some feasible examples, and can be flexibly adjusted according to actual needs. This embodiment does not limit this.

[0077] The head-mounted device proposed in this embodiment belongs to the same technical concept as the bending detection device proposed in the above embodiments. Technical details not described in detail in this embodiment can be found in any of the above embodiments. Furthermore, this embodiment has the same beneficial effects as the above embodiments of the bending detection device.

[0078] In addition, to achieve the above objectives, this application also provides a computer program product, which includes a computer program that, when executed by a processor, implements the bending detection method provided in the above embodiments.

[0079] The computer program product proposed in this embodiment belongs to the same technical concept as the bending detection method proposed in the above embodiments. Technical details not described in detail in this embodiment can be found in any of the above embodiments. Furthermore, this embodiment has the same beneficial effects as the above embodiments of the bending detection method.

[0080] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0081] Furthermore, in the embodiments of this application, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of the embodiments of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B.

[0082] In the embodiments of this application, unless otherwise expressly specified and limited, the terms "connection" and "fixed" should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0083] It should also be understood that references to "one embodiment" or "some embodiments" in the specification of embodiments of this application mean that one or more embodiments of this application include the specific features, structures, or characteristics described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof all mean "including but not limited to," unless otherwise specifically emphasized.

[0084] It should be noted that the technical solutions of the various embodiments of this application can be combined with each other, but only if they are implemented by those skilled in the art. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the embodiments of this application.

[0085] The above are merely optional embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the description and drawings of this application, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A bending detection device, characterized in that, The bending detection device includes: The FPC assembly includes multiple signal layers, each of which is arranged in parallel when the FPC assembly is not bent. Sensing electrodes are disposed at designated locations on at least two adjacent signal layers, the designated locations being within the bending activity area of ​​the FPC assembly. The signal layers contain signal lines made of conductive material, and the sensing electrodes are made of conductive material based on the areas of the signal layers where the signal lines are not disposed. A state detection module is electrically connected to at least two adjacent sensing electrodes. The state detection module is used to detect the capacitance value between at least two adjacent sensing electrodes and determine the bending state of the FPC component based on the change in the capacitance value.

2. The bending detection device as described in claim 1, characterized in that, The FPC component also includes: A protective layer that covers each of the signal layers and fills the spaces between the signal layers.

3. The bending detection device as described in claim 2, characterized in that, The FPC component also includes: An air gap is provided between signal layers that are located in the bending activity area and contain the sensing electrodes, or the air gap is provided between each of the signal layers located in the bending activity area.

4. The bending detection device as described in claim 1, characterized in that, The status detection module includes: A capacitance measuring unit is electrically connected to at least two adjacent sensing electrodes, and the capacitance measuring unit is used to detect the capacitance value between at least two adjacent sensing electrodes. The main control unit is electrically connected to the capacitance measurement unit and is used to determine the bending state of the FPC component based on the change in the capacitance value.

5. The bending detection device as described in any one of claims 1 to 4, characterized in that, The status detection module is used for: If the capacitance value is detected to be at its minimum, it is determined that the FPC component is not bent. If the detected capacitance value is greater than the minimum value, it is determined that the FPC component is bent; If the capacitance value is detected to be at its maximum value, it is determined that the FPC component is in a folded state.

6. A bending detection method, characterized in that, The bending detection method is applied to the bending detection device as described in any one of claims 1 to 5, comprising: Detect the capacitance value between at least two adjacent sensing electrodes; The bending state of the FPC component is determined based on the change in the capacitance value.

7. The bending detection method as described in claim 6, characterized in that, Determining the bending state of the FPC component based on the change in capacitance value includes: When the capacitance value is at its minimum, it is determined that the FPC component is not bent; If the capacitance value is greater than the minimum value, it is determined that the FPC component is bent. When the capacitance value is at its maximum value, the FPC component is determined to be in a folded state.

8. A head-mounted device, characterized in that, The head-mounted device includes a foldable assembly and a bending detection device as described in any one of claims 1 to 5. The foldable assembly includes a frame, a pivot, and a temple connected in sequence. The FPC component in the bending detection device is inserted into the foldable assembly. The state detection module in the bending detection device is disposed in the frame or the temple. The bending detection device is used to detect the folding state of the foldable assembly.

9. The head-mounted device as claimed in claim 8, characterized in that, The bending detection device is also used to adjust the working state of the head-mounted device according to the folding state.

10. A computer program product, characterized in that, The computer program product includes a computer program that, when executed by a processor, implements the bending detection method as described in claim 6 or 7.

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