A small volume high-precision blue film wafer platform

Abstract

The application relates to the technical field of semiconductor manufacturing, and discloses a small-volume high-precision blue film wafer platform, which comprises a base, a Y-axis movement platform, an X-axis movement platform, a rotating shaft ring, a rotating platform, a tension adapter plate, a blue film top disc, a blue film chuck, a pressing mechanism and a stop block. The platform realizes accurate movement in the Y-axis and X-axis directions through a motor screw driving assembly, realizes rotation of the rotating shaft ring through a rotating driving source, and realizes tension control of the blue film through a spiral belt wheel and a spiral screw, so that high-precision positioning and tight flattening of the blue film wafer are realized. The application has the advantages of small volume, high precision, high efficiency, blue film tension control and the like, can be applied to high-precision chip mounters and other semiconductor manufacturing equipment, solves the core pain points of large volume, low precision and dependence on manual operation of a traditional blue film wafer platform, significantly improves packaging efficiency, yield and process adaptability, and provides a high-efficiency and reliable core module support for advanced semiconductor packaging technology.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, and discloses a small-size high-precision blue film wafer platform. BACKGROUND

[0002] With the rapid growth of applications such as artificial intelligence, Internet of Things, smart phones and automotive electronics, the performance requirements of high-performance computing and data storage devices are increasing, and the feature size of chips has reached the physical limit. The traditional packaging cannot meet the performance requirements of the devices, and advanced packaging technologies (such as 2.5D / 3D packaging, wafer-level packaging, and heterogeneous integration) have become an important way to improve chip performance. As the chip size continues to shrink and the integration continues to improve, high-precision chip mounters, as key equipment in advanced packaging processes, mainly achieve accurate grabbing of chips from the already cut wafers, and through flipping, transmission positioning and pressure self-adaptation, the chips are placed on the effective position of the high-precision platform carrier, or the chips and the carrier are bonded together with the help of flux. As the core module of the high-precision chip mounter, the blue film wafer alignment platform uses high-precision servo motors, linear encoders and advanced control algorithms to ensure the accurate positioning of the motion platform XYθ, and the blue film tension control system realizes the tight and flat blue film for accurate picking. Therefore, it is necessary to have higher precision (micron level or even sub-micron level) and more complex process capability to support multi-chip integration and micro-bump welding.

[0003] The existing blue film wafer alignment platform realizes the displacement of the XY two-axis direction through a simple lead screw motion, and the angle deflection depends on manual operation, which is low in efficiency and prone to errors. In addition, due to the small space, the blue film tension control system is not designed, which cannot guarantee the tight and flat blue film for accurate picking. Therefore, how to design a high-precision XYθ motion platform with a blue film tension control system in a small size is a technical problem to be solved in the field, and it is also an important invention to improve the chip mounting precision of packaging, ensure the yield of products, and improve the overall effective production efficiency. SUMMARY

[0004] In view of this, the present application aims to provide a small-size high-precision blue film wafer platform to solve the problems pointed out in the background.

[0005] In order to achieve the above-mentioned application purpose, the technical scheme adopted is as follows:

[0006] A small-size high-precision blue film wafer platform, comprising:

[0007] a base, which is horizontally arranged;

[0008] a Y-axis motion platform, which is slidably connected to the top of the base along the Y-axis direction, and the Y-axis motion platform is connected with a first motor lead screw driving assembly for driving the sliding thereof;

[0009] An X-axis movement platform is slidably connected to the top of the Y-axis movement platform in the X-axis direction, and a second motor-screw driving assembly for driving the sliding of the X-axis movement platform is connected to the X-axis movement platform.

[0010] A rotating collar is rotatably connected to the X-axis movement platform, the axis of the rotating collar extends in the Z-axis direction, and a first rotating driving source for driving the rotation of the rotating collar is connected to the rotating collar.

[0011] A rotating platform is coaxially connected to the rotating collar, a plurality of spiral pulleys are rotatably arranged on the rotating platform, a spiral screw extending in the Z-axis direction is coaxially connected to each of the spiral pulleys, and a second rotating driving source for driving the synchronous rotation of the spiral pulleys is arranged on the rotating platform.

[0012] A tension adapter plate is coaxially arranged on the top of the rotating platform and is threadedly connected to each of the spiral screws.

[0013] A blue film top disc is coaxially arranged on the top of the tension adapter plate.

[0014] Two sets of blue film chucks are arranged, each of the blue film chucks comprises a base, a clamping plate, and a roller, two bases are symmetrically arranged on the rotating platform in the Y-axis direction and are respectively located on the two sides of the blue film top disc, a clamping plate extending above the blue film top disc is arranged on the top of each of the bases, and at least two rollers are symmetrically arranged on the opposite side of each of the bases.

[0015] As a further improvement of the present application, a pressing mechanism and a stopper are further included, the pressing mechanism comprises a telescopic driving source and a pressing block, the pressing block is rotatably arranged on one side of the rotating platform and is located between the two bases, the pressing block is connected with the telescopic driving source for driving the movement of the pressing block, and the stopper is arranged on the rotating platform and is located on the opposite side of the pressing block.

[0016] As a further improvement of the present application, the base comprises a base plate and a sliding bottom plate, the base plate is horizontally arranged, the sliding bottom plate is slidably connected to the base plate in the Y-axis direction, and the Y-axis movement platform is slidably connected to the sliding bottom plate in the Y-axis direction.

[0017] As a further improvement of the present application, a handle is arranged on the sliding bottom plate.

[0018] As a further improvement of the present application, the X-axis movement platform is rotatably connected with three V-shaped bearings arranged in a ring array through a rotating shaft, the rotating collar is arranged between the V-shaped bearings, the rotating collar is rotatably connected with each of the V-shaped bearings through the annular protrusions coaxially arranged on the side surface of the rotating collar, and the annular protrusions are V-shaped.

[0019] As a further improvement of the present application, any of the rotating shafts is connected to the X-axis movement platform in a radial sliding manner along the rotating shaft ring, and a limiting block is arranged on the side of the rotating shaft away from the rotating shaft ring, and an elastic member is connected between the limiting block and the rotating shaft.

[0020] As a further improvement of the present application, the first rotating drive source is arranged on the X-axis movement platform, the output end of the first rotating drive source is connected with a first synchronous pulley, the first synchronous pulley is wound with a first synchronous belt, and the two ends of the first synchronous belt are connected with the clamping seats arranged symmetrically on the circumferential surface of the rotating shaft ring.

[0021] As a further improvement of the present application, the X-axis movement platform is arranged with idlers arranged symmetrically on the two sides of the first rotating drive source, and the two ends of the first synchronous belt are connected with the clamping seats after passing through the two idlers in sequence.

[0022] As a further improvement of the present application, the second rotating drive source is arranged on the rotating platform, the output end of the second rotating drive source is coaxially connected with a second synchronous pulley, and the second synchronous pulley is wound with a second synchronous belt passing through the helical pulleys in sequence.

[0023] As a further improvement of the present application, the tension adapter plate is arranged with a plurality of helical seats, the helical seats are coaxially arranged with threaded through holes and are threadedly connected with the helical leadscrews, respectively.

[0024] The present application has the following advantages:

[0025] 1. The present application realizes micron-level positioning through three-axis high-precision linkage, realizes high-precision motion control (micron level or even sub-micron level) in X, Y and θ three-axis directions through the motor lead screw driving assembly of the Y-axis and X-axis movement platform and the synchronous pulley and idler transmission design of the rotating shaft ring, significantly improves the wafer positioning precision, and meets the stringent requirements of advanced packaging on chip picking and placing.

[0026] 2. The present application adopts the synergistic effect of the helical lead screw and the tension adapter plate, drives a plurality of helical pulleys to rotate synchronously through the second rotating drive source, accurately adjusts the Z-axis height of the blue film top disc, ensures that the blue film is uniformly tight and flat, realizes the automatic control of the blue film tension in combination with the rollers and the pressing block and the stop block of the pressing mechanism of the blue film chuck, avoids the error caused by manual intervention, and improves the chip picking success rate.

[0027] 3. The compact structure design of the present application saves space, and through the layered sliding layout of the base and the sliding bottom plate, the integrated support structure of the rotating shaft ring and the V-shaped bearing, and the vertical stacking design of each movement component, the overall volume of the platform is greatly reduced, which is suitable for the clean room environment with limited space in semiconductor manufacturing.

[0028] 4. The application has high stability and anti-interference ability, through the cooperation of V-shaped bearing and V-shaped annular protrusion of rotating collar, the rotating friction and vibration are reduced; through the radial self-adaptive adjustment function of elastic member and limiting block, the assembly gap is compensated and the external impact is absorbed, the stability and long-term reliability of the platform under high-speed motion are ensured.

[0029] 5. The application reduces the manual operation time and the risk of misoperation through full-automatic angle adjustment (θ axis) and blue film tension control, supports multi-chip integration, micro-bump welding and other complex processes, and significantly improves the packaging and die efficiency and product yield. BRIEF DESCRIPTION OF DRAWINGS

[0030] The accompanying drawings, which form a part of this application, are used to provide a further understanding of the application, and are incorporated herein in conjunction with this application as a part of the disclosure of the application. The schematic embodiments of the application and the descriptions thereof are used to explain the application, and do not constitute an improper limitation on the application. In the drawings:

[0031] Figure 1 is a structural schematic diagram of the application;

[0032] Figure 2 is a structural schematic diagram of the application after hiding the Y-axis motion platform 2;

[0033] Figure 3 is a structural schematic diagram of the application related to the rotating collar;

[0034] Figure 4 is Figure 3 is an enlarged view of the A part in the middle;

[0035] Figure 5 is a structural schematic diagram of the application related to the rotating platform;

[0036] Figure 6 is a structural schematic diagram of the application related to the blue film chuck;

[0037] Figure 7 is a structural schematic diagram of the application related to the pressing mechanism.

[0038] In the drawings: 1, base; 2, Y-axis motion platform; 3, first motor lead screw driving assembly; 4, X-axis motion platform; 5, second motor lead screw driving assembly; 6, rotating collar; 7, first rotating driving source; 8, rotating platform; 9, spiral pulley; 10, spiral lead screw; 11, second rotating driving source; 12, tensioning adapter plate; 13, blue film top disc; 14, blue film chuck; 15, base; 16, clamping plate; 17, roller; 18, pressing mechanism; 19, telescopic driving source; 20, pressing block; 21, stop block; 22, base plate; 23, sliding bottom plate; 24, handle; 25, rotating shaft; 26, V-shaped bearing; 27, annular protrusion; 28, limiting block; 29, elastic member; 30, clamping seat; 31, idler; 32, spiral seat. Detailed Implementation

[0039] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0040] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0041] like Figures 1-7 As shown, a small-volume, high-precision blue film wafer platform includes:

[0042] Base 1, which is set horizontally;

[0043] Y-axis motion platform 2 is slidably connected to the top of the base 1 along the Y-axis direction. The Y-axis motion platform 2 is connected to a first motor lead screw drive assembly 3 for driving its sliding.

[0044] X-axis motion platform 4 is slidably connected to the top of Y-axis motion platform 2 along the X-axis direction. The X-axis motion platform 4 is connected to a second motor lead screw drive assembly 5 for driving its sliding.

[0045] A rotating collar 6 is rotatably connected to the X-axis motion platform 4. The axis of the rotating collar 6 extends along the Z-axis direction, and the rotating collar 6 is connected to a first rotation drive source 7 for driving its rotation.

[0046] A rotating platform 8 is coaxially connected to the rotating collar 6. Multiple helical pulleys 9 are rotatably arranged on the rotating platform 8. Each helical pulley 9 is coaxially connected to a helical screw 10 extending along the Z-axis direction. A second rotational drive source 11 is provided on the rotating platform 8 to drive the helical pulleys 9 to rotate synchronously.

[0047] The tensioning adapter plate 12 is coaxially disposed on the top of the rotating platform 8 and threadedly connected to each of the spiral screws 10;

[0048] Blue film top plate 13 is coaxially disposed on the top of the tensioning adapter plate 12;

[0049] A blue film chuck 14 is provided with two groups, the blue film chuck 14 includes a base 15, a clamping plate 16 and a roller 17, two base 15 are symmetrically arranged along the Y axis direction on the rotating platform 8 and are respectively located on both sides of the blue film top disc 13, the top of the base 15 is provided with a clamping plate 16 extending to the top of the blue film top disc 13, and at least two rollers 17 are symmetrically arranged on the opposite side of the base 15.

[0050] Further comprising a pressing mechanism 18 and a stop block 21, which includes a telescopic drive source 19 and a pressing block 20, the pressing block 20 is rotatably arranged on one side of the rotating platform 8 and located between the two bases 15, the pressing block 20 is connected with the telescopic drive source 19 for driving its movement, the stop block 21 is arranged on the rotating platform 8 and located on the opposite side of the pressing block 20.

[0051] The base 1 includes a base plate 22 and a sliding bottom plate 23, the base plate 22 is horizontally arranged, the sliding bottom plate 23 is slidably connected to the base plate 22 along the Y axis direction, and the Y axis movement platform 2 is slidably connected to the sliding bottom plate 23 along the Y axis direction.

[0052] The sliding bottom plate 23 is provided with a handle 24.

[0053] The X axis movement platform 4 is rotatably connected with three V-shaped bearings 26 arranged in a ring array through a rotating shaft 25, the rotating shaft ring 6 is arranged between the V-shaped bearings 26, the rotating shaft ring 6 is rotatably connected with each V-shaped bearing through the coaxially arranged ring-shaped protrusion 27 on the side surface, and the ring-shaped protrusion 27 is V-shaped and matched with the contact surface of the V-shaped bearing 26.

[0054] Any rotating shaft 25 is slidably connected to the X axis movement platform 4 along the radial direction of the rotating shaft ring 6, and a limiting block 28 is arranged on the side of the rotating shaft 25 away from the rotating shaft ring 6, and an elastic element 29 is connected between the limiting block 28 and the rotating shaft 25.

[0055] The first rotating drive source 7 is arranged on the X axis movement platform 4, the output end of the first rotating drive source 7 is connected with a first synchronous pulley (not shown in the figure), a first synchronous belt (not shown in the figure) is wound on the first synchronous pulley, and the two ends of the first synchronous belt are respectively connected with clamping seats 30 symmetrically arranged on the circumferential surface of the rotating shaft ring 6.

[0056] The X axis movement platform 4 is provided with idler pulleys 31 symmetrically arranged on both sides of the first rotating drive source 7, and the two ends of the first synchronous belt are sequentially wound around the two idler pulleys 31 and connected with the clamping seats 30.

[0057] The second rotating driving source 11 is arranged on the rotating platform 8, and the output end of the second rotating driving source 11 is coaxially connected with a second synchronous pulley (not shown in the figure), and a second synchronous belt (not shown in the figure) is arranged on the second synchronous pulley and sequentially passes through each spiral pulley 9.

[0058] A plurality of spiral seats 32 are arranged on the tension adapter plate 12, and a threaded hole is coaxially arranged on each spiral seat 32 and is threadedly connected with one spiral lead screw 10.

[0059] In the embodiment, the first motor lead screw driving assembly 3 and the second motor lead screw driving assembly 5 are both conventional technical means for those skilled in the art. The first rotating driving source 7 and the second rotating driving source 11 both adopt the motor commonly used by those skilled in the art. The power components of the present application are all connected with the controller, and the action thereof is controlled through the controller.

[0060] Working principle:

[0061] The base (1) is horizontally arranged to provide a stable foundation for the whole platform. The Y-axis moving platform (2) is driven by the first motor lead screw driving assembly (3) to slide along the Y-axis direction of the base (1), so as to realize high-precision displacement of the wafer in the Y-axis direction.

[0062] The X-axis moving platform (4) is driven by the second motor lead screw driving assembly (5) to slide along the X-axis direction of the Y-axis moving platform (2), and cooperates with the Y-axis movement to realize two-dimensional (XY) precise positioning of the wafer in the plane.

[0063] The rotating collar (6) is driven by the first rotating driving source (7), and the axis thereof extends along the Z-axis. The first synchronous pulley and the synchronous belt (guided by the idler pulley 31) transmit power to the clamping seat (30) on the circumference of the rotating collar (6), so as to drive the rotating collar (6) to rotate around the Z-axis, and realize angle adjustment of the wafer in the θ-axis.

[0064] The rotating platform (8) is coaxially fixed on the top of the rotating collar (6), and a plurality of spiral pulleys (9) arranged thereon are driven to synchronously rotate by the second rotating driving source (11). The spiral pulley (9) drives the coaxial spiral lead screw (10) to rotate, so as to move the tension adapter plate (12) up and down along the Z-axis, and accurately adjust the height of the blue film top disc (13) through the thread cooperation between the spiral seat (32) and the spiral lead screw (10), so as to realize tension control of the blue film.

[0065] The two groups of blue film chucks (14) are symmetrically arranged on the two sides of the rotating platform (8), and the edge of the blue film is clamped by the clamping plate (16) and the roller (17) on the base (15). The extension driving source (19) of the pressing mechanism (18) drives the pressing block (20) to move, cooperates with the stop block (21) to apply uniform pressure to the blue film, ensures that the blue film is tight and flat, and facilitates accurate pickup of the chip.

[0066] The X-axis movement platform (4) is connected with three annular array V-shaped bearings (26) through a rotating shaft (25), the V-shaped annular protrusion (27) of the rotating shaft ring (6) is in contact with the V-shaped bearing (26), the stability and low friction during rotation of the rotating shaft ring (6) are ensured, and the movement precision of the theta axis is improved.

[0067] The rotating shaft (25) realizes radial sliding through the elastic element (29) and the limiting block (28), the assembly gap between the rotating shaft ring (6) and the V-shaped bearing (26) is automatically compensated, and vibration and error are reduced.

[0068] Through the three-axis linkage of the Y-axis (2), the X-axis (4) and the rotating shaft ring (6), high-precision positioning of the wafer in the XY theta direction is realized; the height of the blue film top disc (13) is adjusted by the screw rod (10) driving the tension adapter plate (12), combined with the blue film chuck (14) and the pressing mechanism (18), the uniformity of the blue film tension is ensured; the design of the V-shaped bearing (26) and the elastic element (29) guarantees the movement stability and micron-level precision. Finally, efficient and accurate alignment and tension control of the blue film wafer are realized under small volume, and the advanced packaging process requirements are met.

[0069] Through the three-axis precision driving, automatic tension control and compact structure design, the core pain points of the traditional blue film wafer platform, such as large volume, low precision and dependence on manual operation, are solved, the packaging efficiency, yield and process adaptability are significantly improved, and the efficient and reliable core module support is provided for the advanced packaging technology of semiconductors.

[0070] The above only describes the preferred embodiments of the present application and is not used to limit the present application. For those skilled in the art, the present application can have various changes and variations. Any modification, equivalent replacement, improvement, component disassembly or combination made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A small volume high precision blue film wafer platform, characterized in that, The utility model relates to a kind of blue film automatic loading and unloading device, including: Base station, it is horizontally arranged; Y-axis movement platform, it is slidably connected to the top of the base station along Y-axis direction, the Y-axis movement platform is connected with the first motor lead screw drive assembly for driving its sliding; X-axis movement platform, it is slidably connected to the top of the Y-axis movement platform along X-axis direction, the X-axis movement platform is connected with the second motor lead screw drive assembly for driving its sliding; Rotary collar, it is rotatably connected to the X-axis movement platform, the axis of the rotary collar extends along Z-axis direction, and the rotary collar is connected with the first rotary drive source for driving its rotation; Rotary platform, it is coaxially connected to the rotary collar, a plurality of helical pulleys are rotatably arranged on the rotary platform, each helical pulley is coaxially connected with a helical lead screw extending along Z-axis direction on the rotary platform, and the rotary platform is provided with the second rotary drive source for driving the helical pulleys synchronous rotation; Tensioning adapter plate, it is coaxially arranged on the top of rotary platform and is threadedly connected with each helical lead screw; Blue film top disc, it is coaxially arranged on the top of the tensioning adapter plate; Blue film chuck, it is provided with two groups, the blue film chuck includes base, clamping plate and roller, two bases are symmetrically arranged along Y-axis direction on the rotary platform and are respectively located on the two sides of the blue film top disc, the top of the base is provided with a clamping plate extending above the blue film top disc, and at least two rollers are symmetrically arranged on the opposite side of the two bases.

2. The small volume high precision blue film wafer platform according to claim 1, wherein: It further includes a pressing mechanism and a stop block, which includes a telescopic drive source and a pressing block, the pressing block is rotatably arranged on one side of the rotary platform and located between the two bases, the pressing block is connected with the telescopic drive source for driving its movement, and the stop block is arranged on the rotary platform and located on the opposite side of the pressing block.

3. The small volume high precision blue film wafer platform according to claim 1, characterized in that: The base station includes a base plate and a sliding bottom plate, the base plate is horizontally arranged, the sliding bottom plate is slidably connected to the base plate along Y-axis direction, and the Y-axis movement platform is slidably connected to the sliding bottom plate along Y-axis direction.

4. The small volume high precision blue film wafer platform according to claim 3, characterized in that: A handle is arranged on the sliding bottom plate.

5. The small volume high precision blue film wafer platform according to claim 1, characterized in that: The X-axis movement platform is rotatably connected with three V-shaped bearings arranged in a ring array through a rotating shaft, the rotary collar is arranged between the V-shaped bearings, the rotary collar is rotatably connected with each V-shaped bearing through the annular protrusion coaxially arranged on the side surface thereof, and the annular protrusion is V-shaped.

6. The small volume high precision blue film wafer platform according to claim 5, characterized in that: Any rotating shaft is slidably connected to the X-axis movement platform along the radial direction of the rotary collar, and a limiting block is arranged on the side of the rotating shaft away from the rotary collar, and an elastic member is connected between the limiting block and the rotating shaft.

7. The small volume high precision blue membrane wafer platform according to claim 1, wherein: The first rotary drive source is arranged on the X-axis movement platform, the output end of the first rotary drive source is connected with a first synchronous pulley, a first synchronous belt is wound around the first synchronous pulley, and the two ends of the first synchronous belt are respectively connected with clamping seats symmetrically arranged on the circumferential surface of the rotary collar.

8. The small volume high precision blue membrane wafer platform according to claim 7, characterized in that: A idler wheel is arranged on the X-axis movement platform symmetrically on both sides of the first rotary drive source, and the two ends of the first synchronous belt are sequentially wound around the two idler wheels and connected with the clamping seats.

9. The small volume high precision blue membrane wafer platform according to claim 1, wherein: A second rotary drive source is arranged on the rotating platform, and an output end of the second rotary drive source is coaxially connected with a second synchronous pulley, and a second synchronous belt is arranged on the second synchronous pulley and sequentially passes through the helical pulleys.

10. The small volume high precision blue membrane wafer platform according to claim 1, wherein: A plurality of helical seats are arranged on the tension adapter plate, and a threaded through hole is coaxially arranged on each helical seat and is threadedly connected with one helical lead screw.

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