Display device

Abstract

A display device comprises a driving substrate, a flexible printed circuit board, a microcontroller unit (MCU), a driving integrated circuit and a wire. The driving substrate comprises an upper surface and a lower surface. The flexible printed circuit board is electrically connected with the driving substrate and is arranged on the upper surface of the driving substrate. The microcontroller unit is arranged on the upper surface of the driving substrate. The driving integrated circuit is arranged on the upper surface of the driving substrate. The wire is connected with the microcontroller unit and the driving integrated circuit and is arranged on the upper surface of the driving substrate. Through the design, the wiring length is reduced, the impedance is reduced, the structural complexity is simplified, and the size is reduced. As the step of assembling the driving substrate and a printed circuit board in the traditional method is omitted, the process steps and time can be shortened, and the cost is reduced. According to the design of the double-layer flexible printed circuit board, a printed circuit board in a traditional method can be omitted, passive elements are integrated on the flexible printed circuit board, and the low-power-consumption Bluetooth module is integrated into the microcontroller unit.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a display device. BACKGROUND

[0002] In the prior art, a gold wire is used to connect a printed circuit board and a driving integrated circuit, and then solder is used to bond the driving integrated circuit to a conductive pad on the printed circuit board. Finally, a packaging material is used for packaging. The microcontroller unit is located on the printed circuit board, and the driving substrate and the printed circuit board are connected through a flexible printed circuit board.

[0003] Such a design results in complex distribution of the traces, increased length, and increased impedance. The structures interfere with each other, resulting in an increased size of the assembled display device. Therefore, how to provide a display device that can solve the above problems is still one of the research directions that need to be urgently studied. SUMMARY

[0004] One embodiment of the present disclosure is a display device.

[0005] In one embodiment, the display device includes a driving substrate, a flexible printed circuit board, a microcontroller unit (MCU), a driving integrated circuit, and a trace. The driving substrate includes a top surface and a bottom surface. The flexible printed circuit board is electrically connected to the driving substrate and is disposed on the top surface of the driving substrate. The microcontroller unit is disposed on the top surface of the driving substrate. The driving integrated circuit is disposed on the top surface of the driving substrate. The trace connects the microcontroller unit and the driving integrated circuit, wherein the trace is disposed on the top surface of the driving substrate.

[0006] In one embodiment, the driving substrate includes a display area and a peripheral area, wherein the microcontroller unit is located in the peripheral area.

[0007] In one embodiment, the driving integrated circuit is located in the peripheral area.

[0008] In one embodiment, the peripheral area of the driving substrate includes a connection area, which is located on a side of the driving substrate adjacent to the flexible printed circuit board.

[0009] In one embodiment, the display device further includes a conical granule Au bump connecting the driving integrated circuit and the top surface of the driving substrate.

[0010] In one embodiment, the display device further includes a non-conductive film disposed between the driving integrated circuit and the top surface of the driving substrate.

[0011] In one embodiment, the display device further includes a waterproof adhesive disposed on the top surface of the driving substrate and covering the driving integrated circuit.

[0012] In an embodiment, the microcontroller unit further includes a Bluetooth module.

[0013] In an embodiment, the flexible printed circuit board is folded back to the lower surface of the driving substrate.

[0014] In an embodiment, the flexible printed circuit board includes a polyimide film, two resin layers, and two copper foil layers, wherein the two resin layers are respectively between the polyimide film and the two copper foil layers.

[0015] In an embodiment, the display device further includes a microcontroller unit control circuit disposed on the flexible printed circuit board and electrically connected with the microcontroller unit.

[0016] In an embodiment, the display device further includes a housing covering the driving substrate, the flexible printed circuit board, and the microcontroller unit.

[0017] Another embodiment of the present disclosure is a display device.

[0018] In an embodiment, the display device includes a driving substrate, a flexible printed circuit board, a microcontroller unit, and a driving integrated circuit. The driving substrate includes a display area and a peripheral area. The flexible printed circuit board is electrically connected with the driving substrate and disposed on the peripheral area of the driving substrate. The microcontroller unit is disposed on the peripheral area of the driving substrate. The driving integrated circuit is disposed on the peripheral area of the driving substrate.

[0019] In an embodiment, the driving substrate includes an upper surface and a lower surface, and the display device further includes a wire connecting the microcontroller unit and the driving integrated circuit, wherein the wire is on the upper surface of the driving substrate.

[0020] In an embodiment, the wire is a straight line.

[0021] In an embodiment, the microcontroller unit is on the upper surface of the driving substrate.

[0022] In an embodiment, the peripheral area includes a connecting area on a side of the driving substrate adjacent to the flexible printed circuit board, and the wire is on the peripheral area.

[0023] In an embodiment, the wire is between the display area and the flexible printed circuit board.

[0024] In an embodiment, the microcontroller unit is between the display area and the flexible printed circuit board.

[0025] In an embodiment, the driving integrated circuit is between the display area and the flexible printed circuit board.

[0026] In the above-described embodiment, the display device's microcontroller unit is disposed on the upper surface of the driver substrate, and its connection area with the driver integrated circuit is centralized. Consequently, the wiring connecting the microcontroller unit and the driver integrated circuit can be designed to be straight and does not require passing through a flexible printed circuit board (FPC) or connectors for connecting to additional printed circuit boards. This design reduces wiring length and impedance. The disclosed display device offers the advantages of simplified structural complexity and reduced size. By omitting the conventional assembly steps of the driver substrate and printed circuit board, the process steps and time are shortened, reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a side view of a display device according to an embodiment of the present disclosure;

[0028] Figure 2 is a top view of a display device according to another embodiment of the present disclosure;

[0029] Figure 3 is a schematic diagram of the packaging of a microcontroller unit of a display device according to another embodiment of the present disclosure;

[0030] Figure 4 is a schematic diagram of a flexible printed circuit board according to an embodiment of the present disclosure;

[0031] Figure 5 yes Figure 1 Schematic diagram of the display device after packaging.

[0032]

Explanation of symbols

[0033] 100: Display device

[0034] 110: driving substrate

[0035] 112: Upper surface

[0036] 114: Lower surface

[0037] 116: Display layer

[0038] 120: Flexible printed circuit board

[0039] 122:Polyimide film

[0040] 124: resin layer

[0041] 126: copper foil layer

[0042] 128:Battery circuit

[0043] 129: DC Circuit

[0044] 130: Microcontroller unit

[0045] 132: Bluetooth module

[0046] 134: microcontroller unit control circuit

[0047] 140: driving integrated circuit

[0048] 150: wire

[0049] 160: cone-shaped gold bump

[0050] 170: non-conductive film

[0051] 180: waterproof adhesive

[0052] 190: housing

[0053] DA: display area

[0054] PA: peripheral area

[0055] CA: connection area DETAILED DESCRIPTION

[0056] Embodiments of the present disclosure will be described below with reference to the drawings. Numerous specific details will be set forth in the following description in order to provide a thorough understanding. However, it will be appreciated that these specific details are not intended to limit the present disclosure.

[0057] Figure 1 FIG. 1 is a side view of a display device 100 according to an embodiment of the present disclosure. The display device 100 includes a driving substrate 110, a flexible printed circuit board 120, and a microcontroller unit 130 (MCU). The driving substrate 110 includes an upper surface 112 and a lower surface 114. A display layer 116 is disposed on the upper surface 112 of the driving substrate 110. The display device 100 is, for example, an electrophoretic display, and the display layer 116 is, for example, an electronic ink layer. The flexible printed circuit board 120 is electrically connected to the driving substrate 110 and disposed on the upper surface 112 of the driving substrate 110. The microcontroller unit 130 of the present disclosure is disposed on the upper surface 112 of the driving substrate 110, which is a design of a system on panel (SoP).

[0058] Figure 2 FIG. 2 is a top view of the display device 100 according to another embodiment of the present disclosure. In Figure 2 the flexible printed circuit board 120 is folded back to the lower surface 114 of the driving substrate 110. The display device 100 further includes a driving integrated circuit 140 and a wire 150, which are disposed on the upper surface 112 of the driving substrate 110. The wire 150 connects the microcontroller unit 130 and the driving integrated circuit 140. The microcontroller unit 130 further includes a Bluetooth module 132. The Bluetooth module 132 can be a Bluetooth low energy (BLE) embedded in the microcontroller unit 130.

[0059] The driving substrate 110 has a display area DA and a peripheral area PA. The microcontroller unit 130 and the driving integrated circuit 140 are disposed on the connection area CA of the peripheral area PA adjacent to the flexible printed circuit board 120.

[0060] In a conventional display device, a flexible printed circuit board is used to connect a printed circuit board. A microcontroller unit is disposed on the printed circuit board for a system on PCB (SoP) design. Thus, the traces in the conventional design need to pass through the flexible printed circuit board, a connector and the printed circuit board. This results in an increased length of the traces and a plurality of sections with turns.

[0061] The microcontroller unit 130 of the display device 100 of the present disclosure is disposed on the driving substrate 110 and concentrated on the connection area CA. Thus, the traces 150 can be designed in a straight line and do not need to pass through the flexible printed circuit board 120 or a connector for connecting an additional printed circuit board. By such a design, the length of the traces 150 can be reduced and the impedance can be lowered.

[0062] Figure 3 A packaging diagram of the microcontroller unit 130 of the display device 100 according to another embodiment of the present disclosure is shown. The display device 100 further includes conical granule Au bumps 160, a non-conductive film 170 and a waterproof adhesive 180. The conical granule Au bumps 160 connect the driving integrated circuit 140 and the upper surface 112 of the driving substrate 110. The non-conductive film 170 is disposed between the driving integrated circuit 140 and the upper surface 112 of the driving substrate 110 so as to adhere the driving integrated circuit 140 to the upper surface 112. The waterproof adhesive 180 is disposed on the upper surface 112 of the driving substrate 110 and covers the driving integrated circuit 140. For example, the waterproof adhesive 180 is an RTV (room temperature vulcanized) silicone rubber.

[0063] A conventional driving integrated circuit packaging technique connects a printed circuit board and a driving integrated circuit by wire bonding and a lead frame, and then bonds the driving integrated circuit to a conductive pad on the printed circuit board by soldering. Finally, a mold compound is used for encapsulation. The structures of the driving substrate and the system on PCB each have a required space. When the driving substrate and the printed circuit board are connected by a flexible printed circuit board, the allowable space for the structures to interfere with each other needs to be considered, resulting in an increased volume.

[0064] Thus, compared with the conventional packaging technique, the display device 100 of the present disclosure has the advantages of simplified structure complexity and reduced volume. Since the step of assembling the driving substrate 110 and the printed circuit board in the conventional method is omitted, the process steps and time can be shortened, and the cost can be reduced.

[0065] Figure 4 is a schematic view of a flexible printed circuit board 120 according to an embodiment of the present disclosure. Referring to Figure 1 and Figure 4 The flexible printed circuit board 120 is folded back to the lower surface 114 of the driving substrate 110. The flexible printed circuit board 120 includes a polyimide film 122, two resin layers 124, and two copper foil layers 126. The two resin layers 124 are respectively located between the polyimide film 122 and the two copper foil layers 126. In other words, the flexible printed circuit board 120 of the present disclosure is a double-layer design.

[0066] Referring to Figure 2 The flexible printed circuit board 120 further includes a battery circuit 128 and a direct current circuit 129. The direct current circuit 129 is electrically connected to the driving integrated circuit 140. The display device 100 further includes a microcontroller unit control circuit 134 disposed on the flexible printed circuit board 120 and electrically connected to the microcontroller unit 130.

[0067] Through the double-layer design of the flexible printed circuit board 120, the printed circuit board in the conventional practice can be omitted, and only the passive elements (the battery circuit 128, the direct current circuit 129, and the microcontroller unit control circuit 134, etc.) originally disposed on the printed circuit board are integrated on the flexible printed circuit board 120, and the low-power consumption Bluetooth module 132 is integrated into the microcontroller unit 130. Through the above structural design, the length of the overall wiring 150 of the display device 100 can be shortened, and the impedance value can be reduced.

[0068] Figure 5 is a schematic view of the display device 100 after encapsulation of Figure 1 The display device 100 further includes a housing 190 covering the driving substrate 110, the flexible printed circuit board 120, and the microcontroller unit 130. The microcontroller unit 130 of the assembled display device 100 is located above the overall display device 100. Through the protection of the housing 190, the safety, temperature resistance, and humidity resistance of the microcontroller unit 130 located on the upper surface 112 can be maintained.

[0069] In summary, the microcontroller unit of the display device of the present disclosure is disposed on the upper surface of the driving substrate, and is concentrated with the driving integrated circuit in the connection area. Therefore, the wire connecting the microcontroller unit and the driving integrated circuit can be designed in a straight line and does not need to pass through the flexible printed circuit board or the connector for connecting the additional printed circuit board. Through such design, the wire length can be reduced, and the impedance is lowered. The display device of the present disclosure has the advantages of simplifying the structure complexity and reducing the volume. Since the step of assembling the driving substrate and the printed circuit board in the conventional method is omitted, the process steps and time are shortened, and the cost is reduced. Through the design of the double-layer flexible printed circuit board, the printed circuit board in the conventional method can be omitted, and only the passive elements originally disposed on the printed circuit board need to be integrated on the flexible printed circuit board, and the low-power Bluetooth module is integrated into the microcontroller unit. Through the above-mentioned structure design, the wire length of the display device as a whole is shortened, and the impedance value is lowered.

[0070] Although the present disclosure has been disclosed in the above embodiments, it is not intended to limit the present disclosure, and any person skilled in the art can make various modifications and decorations without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the appended claims.

Claims

1. A display device, characterized by comprising: The display device comprises: a driving substrate comprising an upper surface and a lower surface; a flexible printed circuit board electrically connected to the driving substrate and disposed on the upper surface of the driving substrate; a micro controller unit (MCU) disposed on the upper surface of the driving substrate; a driving integrated circuit disposed on the upper surface of the driving substrate; and a wire connecting the micro controller unit and the driving integrated circuit, wherein the wire is disposed on the upper surface of the driving substrate. The driving substrate comprises a display area and a peripheral area, wherein the micro controller unit is located in the peripheral area.

2. The display device of claim 1, wherein, The driving integrated circuit is located in the peripheral area.

3. The display device of claim 2, wherein, The peripheral area of the driving substrate comprises a connecting area located on a side of the driving substrate adjacent to the flexible printed circuit board.

4. The display device of claim 2, wherein, The display device further comprises:

5. The display device of claim 1, wherein a conical granule Au bump connecting the driving integrated circuit and the upper surface of the driving substrate. The display device further comprises:

6. The display device of claim 1, wherein a non-conductive film disposed between the driving integrated circuit and the upper surface of the driving substrate. The display device further comprises:

7. The display device of claim 1, wherein a waterproof adhesive disposed on the upper surface of the driving substrate and covering the driving integrated circuit. The micro controller unit further comprises a Bluetooth module.

8. The display device of claim 1, wherein, The flexible printed circuit board is folded back to the lower surface of the driving substrate.

9. The display device of claim 1, wherein The flexible printed circuit board comprises a polyimide film, two resin layers and two copper foil layers, wherein the two resin layers are respectively located between the polyimide film and the two copper foil layers.

10. The display device of claim 1, wherein The display device further comprises:

11. The display device of claim 1, wherein a micro controller unit control circuit disposed on the flexible printed circuit board and electrically connected to the micro controller unit. The display device further comprises:

12. The display device of claim 1, wherein a housing covering the driving substrate, the flexible printed circuit board and the micro controller unit. The display device comprises:

13. A display device comprising: a driving substrate comprising a display area and a peripheral area; a flexible printed circuit board electrically connected to the driving substrate and disposed on the peripheral area of the driving substrate; a micro controller unit disposed on the peripheral area of the driving substrate; and a driving integrated circuit disposed on the peripheral area of the driving substrate. The driving substrate comprises an upper surface and a lower surface, and the display device further comprises:

14. The display device of claim 13, wherein, a wire connecting the micro controller unit and the driving integrated circuit, wherein the wire is located on the upper surface of the driving substrate. The wire is a straight line.

15. The display device of claim 14, wherein, The micro controller unit is located on the upper surface of the driving substrate.

16. The display device of claim 14, wherein, The peripheral area comprises a connecting area located on a side of the driving substrate adjacent to the flexible printed circuit board, and the wire is located in the peripheral area.

17. The display device of claim 14, wherein, The wire is located between the display area and the flexible printed circuit board.

18. The display apparatus of claim 14, wherein The micro controller unit is located between the display area and the flexible printed circuit board.

19. The display device of claim 13, wherein, The driving integrated circuit is located between the display area and the flexible printed circuit board.

20. The display device of claim 13, wherein, ​

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