A vapor chamber and electronic device

Abstract

This application relates to heat dissipation equipment, disclosing a vapor chamber and an electronic device to improve the heat dissipation performance of the vapor chamber, thereby enhancing the working performance of the electronic device. The vapor chamber includes a first cover plate, a second cover plate, and a liquid-absorbing core. The first cover plate and the second cover plate are fixedly connected and enclose a cavity, which includes an evaporation cavity and a condensation cavity arranged opposite to each other. The liquid-absorbing core is disposed in the cavity and includes a first surface and a second surface. The first surface faces the first cover plate, and the second surface faces the second cover plate. The liquid-absorbing core is provided with micropores, micropillars, and microgrooves. The micropores extend from the first surface to the second surface, the micropillars are disposed on the second surface, and the microgrooves are disposed on at least one of the first or second surfaces. The two ends of the microgrooves are respectively connected to the evaporation cavity and the condensation cavity. The pore diameter of the micropores, the diameter of the micropillars, and the width of the microgrooves are all greater than or equal to 10 μm and less than or equal to 500 μm.

Description

Technical Field

[0001] This application relates to the field of heat dissipation equipment technology, and more particularly to a heat spreader and electronic equipment. Background Technology

[0002] With the increasing integration of the electronics industry, the performance of electronic devices is constantly improving, but their power consumption and heat generation are also increasing dramatically. A vapor chamber (VC) is a commonly used heat dissipation component in electronic devices; it is a cavity structure with a capillary structure on its inner wall and filled with a working fluid. It generally includes an evaporation chamber and a condensation chamber. In the evaporation chamber, the liquid working fluid absorbs heat conducted by the heat source electronic devices and transforms into a vapor phase. In the condensation chamber, the vapor phase working fluid condenses, releasing heat and transforming back into a liquid phase. The liquid working fluid then flows back to the evaporation chamber through the capillary action of the capillary structure, continuously circulating in this manner. In related technologies, the capillary structure of a vapor chamber often struggles to balance strong capillary force and high permeability, limiting the liquid return capacity of the capillary structure and thus affecting the heat dissipation capacity of the vapor chamber.

[0003] Therefore, how to improve the heat dissipation performance of the vapor chamber is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0004] This application provides a heat spreader and an electronic device to improve the heat dissipation performance of the heat spreader, thereby enhancing the operating performance of the electronic device.

[0005] In a first aspect, this application provides a heat spreader, which may include a first cover plate, a second cover plate, and a liquid-absorbing core. The first cover plate and the second cover plate can be fixedly connected and enclosed to form a cavity, which includes an evaporation cavity and a condensation cavity. The liquid-absorbing core is disposed in the cavity and includes a first surface and a second surface disposed opposite to each other, with the first surface facing the first cover plate and the second surface facing the second cover plate. The liquid-absorbing core is provided with micropores, micropillars, and microgrooves. The micropores can penetrate from the first surface of the liquid-absorbing core to its second surface; the micropillars are disposed on the second surface of the liquid-absorbing core; the microgrooves are disposed on at least one of the first surface or the second surface, and the two ends of the microgrooves are respectively connected to the evaporation cavity and the condensation cavity. The extended structure of the microgrooves gives them anisotropic characteristics, thus providing a guiding effect for the reflux of the liquid working fluid in the heat spreader from the condensation cavity to the evaporation cavity, thereby increasing the reflux rate of the liquid working fluid to the evaporation cavity. Among them, the pore diameter of the micropore, the column diameter of the microcolumn, and the groove width of the microgroove can all be greater than or equal to 10um and less than or equal to 500um.

[0006] In this application, the liquid-absorbing core of the vapor chamber utilizes microstructures such as micropores, micropillars, and microgrooves at the micrometer scale to effectively enhance both capillary force and permeability, solving the problem of limited liquid return capacity in single-type capillary structures. Furthermore, the integrated structural design of the liquid-absorbing core not only enhances overall rigidity but also avoids the drawbacks of excessive thickness in composite capillary structures. Therefore, the vapor chamber provided in this application can effectively improve heat dissipation performance by enhancing the liquid return capacity of the liquid-absorbing core while achieving a small-size design, thereby meeting the application requirements of thin and light electronic devices and improving their operating performance.

[0007] In some embodiments, the surface of the second cover plate facing away from the cavity includes a heat source region, the orthographic projection of which onto the thickness of the vaporizer plate lies within the orthographic projection of the evaporation cavity onto the thickness of the vaporizer plate. The heat source region can be used to contact the heat source electronic components of the electronic device. The heat generated by these components can be transferred through the second cover plate to the liquid working fluid within the evaporation cavity. Thus, the heat source electronic components achieve cooling through heat dissipation, and the liquid working fluid within the evaporation cavity absorbs heat and transforms into a liquid working fluid.

[0008] In some implementations, the second surface of the wicking core includes a first region and a second region. The first region may be located within the evaporation chamber, and the second region may be at least partially located within the condensation chamber. The pore size of the micropores in the first region may be smaller than that in the second region, and the pore density in the first region may be greater than that in the second region. By reducing the pore size of the micropores in the first region and increasing the pore density, the wicking core can provide more evaporation sites and evaporation area in the corresponding heat source region, thereby improving the evaporation efficiency of the wicking core in this part and providing a reliable guarantee for the vapor chamber to support higher critical heat flux densities. The micropores in the second region only need to ensure normal capillary reflux; therefore, the pore size can be relatively large, and the pore density can be relatively sparse.

[0009] In some implementations, the micropores in the first region can be formed using laser etching. This not only meets the requirements for small size and high density processing of the micropores in the first region, but also offers high control precision, allowing for precise control of the pore size, position, and arrangement density of the micropores. The micropores in the second region can be formed using chemical etching. Chemical etching is a relatively simple and efficient process with relatively low costs. It can meet the processing requirements of the micropores in the second region and also helps to reduce the overall manufacturing cost of the liquid-absorbing core.

[0010] In some implementations, the second surface of the wicking core includes a first region and a second region. The first region may be located within the evaporation chamber, and the second region may be at least partially located within the condensation chamber. The diameter of the micropillars in the first region is smaller than that in the second region, and the arrangement density of the micropillars in the first region is greater than that in the second region. By reducing the diameter of the micropillars in the first region and increasing the arrangement density of the micropillars, the meniscus area of ​​the liquid working fluid can be increased, allowing the wicking core to provide more evaporation area in the corresponding heat source region, thereby improving the evaporation efficiency of the wicking core in this region and enhancing the heat dissipation effect on the heat source electronic devices. Conversely, by increasing the diameter of the micropillars in the second region and decreasing the arrangement density of the micropillars, sufficient support strength can be provided for the wicking core, and the permeability of the wicking core can be increased, thereby reducing the backflow resistance of the working fluid.

[0011] In some implementations, the micropillars in the first region and the micropillars in the second region can both be formed by chemical etching. For example, the micropillars in the first region and the micropillars in the second region can be formed simultaneously by etching masks with different patterns to simplify the process flow of the liquid-absorbing core and improve its processing efficiency.

[0012] In some embodiments, the wicking core further includes an insulating cavity located between the evaporation cavity and the condensation cavity. The wicking core includes a first core, at least a portion of which may be located within the insulating cavity. Microchannels are disposed within the first core, such that after the working fluid liquefies in the condensation cavity, the liquid working fluid can flow into the evaporation cavity under the directional guidance of the multiple microchannels, accelerating the reflux rate of the liquid working fluid.

[0013] In some embodiments, the liquid-absorbing core may further include a second core, which comprises a first sub-core and a second sub-core, wherein at least a portion of the first sub-core is located within the evaporation chamber, and at least a portion of the second sub-core is located within the condensation chamber. Micropillars may be disposed at least on the first and second sub-cores of the second core. The micropillars spaced apart on the first and second sub-cores give them isotropic properties, thus allowing the working fluid in the evaporation and condensation chambers to flow in all directions, accelerating the rate of evaporation or condensation of the working fluid, and enabling the heat spreader to achieve more efficient heat dissipation.

[0014] In some implementations, the first sub-core and the second sub-core are spaced apart, with the first core located between the first and second sub-cores. Along the reflux direction of the liquid working fluid, the first, second, and third sub-cores can be considered as arranged in series. Most of the liquid working fluid liquefied in the condensation chamber can be transported to the evaporation chamber through the microchannels of the first core, thereby further improving the reflux rate of the liquid working fluid.

[0015] In some embodiments, the second core may further include a third sub-core, at least partially located within the insulation cavity. The third sub-core and the first core may be arranged side-by-side between the first and second sub-cores. Along the reflux direction of the liquid working fluid, a portion of the liquefied liquid working fluid in the condensation cavity is transported to the evaporation cavity through the microchannels of the first core, and a portion of the liquid working fluid is transported to the evaporation cavity through the gaps between the micropillars of the third sub-core. This liquid-absorbing core exhibits improved reflux capacity and relatively lower processing costs.

[0016] In some embodiments, the first sub-core may include a first notch facing the second sub-core, and the second sub-core may include a second notch facing the first sub-core. The first core may include a fourth, a fifth, and a sixth sub-core. The fourth sub-core is located between the first and second sub-cores. The fifth sub-core is connected to the side of the fourth sub-core facing the first sub-core and is located within the first notch. The sixth sub-core is connected to the side of the fourth sub-core facing the second sub-core and is located within the second notch. Along the reflux direction of the liquid working fluid, the first, fourth, and second sub-cores can be considered as arranged in series, with the fifth sub-core arranged in parallel with a portion of the first sub-core, and the sixth sub-core arranged in parallel with a portion of the second sub-core. Because the microgroove has a relatively large coverage area, the reflux capacity of this liquid-absorbing core can be effectively improved.

[0017] In some implementations, all micropores can be located in the second core to simplify the processing of the liquid-absorbing core and improve its processing efficiency while accelerating the reflux of the liquid working fluid. Alternatively, in other implementations, some micropores can be located in the second core, while others can be located in the first core. In this way, the liquid-absorbing core can not only increase the reflux rate of the liquid working fluid but also reduce the risk of the liquid working fluid being stored in the insulation cavity, thereby enabling the heat spreader to reliably dissipate heat from the heat source electronic devices.

[0018] In some implementations, the first core and the second core may each include a first layer structure and a second layer structure, with the second layer structure disposed on the side of the first layer structure facing the first cover plate. Micropillars can form the second layer structure of the first core and the second layer structure of the second core. That is, micropillars can be arranged on the entire second surface of the liquid-absorbing core, thereby reliably supporting the entire liquid-absorbing core and effectively improving the permeability of the liquid-absorbing core.

[0019] In some implementations, the microchannels can be disposed on the side of the first layer structure of the first core facing the first cover plate. That is, the microchannels and microcolumns are disposed on opposite sides. After the working fluid is liquefied in the condensation chamber, the liquid working fluid can flow into the evaporation chamber under the directional flow of multiple microchannels, thereby accelerating the reflux rate of the liquid working fluid.

[0020] In some implementations, the side of the first layer structure of the first core facing the second cover plate and the side of the first layer structure of the second core facing the second cover plate together form the second surface. Some microgrooves can be disposed on the side of the first layer structure of the first core facing the second cover plate, while other microgrooves can be disposed on the end face of the micropillars of the first core, thereby increasing the coverage area of ​​the microgrooves in the first core and accelerating the reflux rate of the liquid working fluid.

[0021] In some embodiments, the first core and the second core may each include a first layer structure and a second layer structure, with the second layer structure disposed on the side of the first layer structure facing the second cover plate. Micropillars can form the second layer structure of the second core, while microgrooves are disposed on the side of the second layer structure of the first core facing the second cover plate. In this embodiment, the micropillars and microgrooves are disposed on the same side, and can be at least partially disposed in the same layer, thereby helping to reduce the thickness of the liquid-absorbing core, and consequently helping to reduce the overall thickness of the heat spreader.

[0022] In some embodiments, the liquid-absorbing core may include a thinned portion formed by a partial recess on the first surface, the thickness of which is less than the thickness of the portion of the liquid-absorbing core excluding the thinned portion. Because the thickness of the thinned portion is relatively small, the length of the micropores disposed in the thinned portion is also relatively short, which helps to accelerate the circulation efficiency of the working fluid between the evaporation chamber and the condensation chamber, thereby improving the heat dissipation efficiency of the vapor chamber.

[0023] In some embodiments, the liquid-absorbing core may include a thickened portion formed by a partial protrusion on the second surface. The distance between the thickened portion and the second cover plate may be smaller than the distance between the portion of the liquid-absorbing core other than the thickened portion and the second cover plate. Because the distance between the thickened portion and the second cover plate is relatively small, the capacity of the liquid working fluid is correspondingly reduced. This allows for a higher evaporation rate of the liquid working fluid even when the power of the heat source electronic device is relatively low, thereby achieving efficient heat dissipation for the heat source electronic device.

[0024] In some implementations, a recess is partially provided on the first surface of the liquid-absorbing core, and a protrusion is partially provided on the second surface of the liquid-absorbing core, with the recess and protrusion arranged opposite each other along the thickness direction of the liquid-absorbing core. This design enables the liquid working fluid in the evaporation chamber to achieve a high evaporation rate and also helps to accelerate the circulation efficiency of the working fluid between the evaporation chamber and the condensation chamber.

[0025] In some embodiments, the second cover plate includes a first arched portion that arches towards the interior of the cavity. A groove can be formed on the side of the second cover plate facing away from the cavity at a position corresponding to the first arched portion. This groove can be used to accommodate heat-generating electronic devices to improve heat dissipation. The liquid-absorbing core includes a second arched portion that arches towards the first cover plate. The second arched portion is disposed opposite to the first arched portion, thereby avoiding interference between the liquid-absorbing core and the second cover plate.

[0026] In some implementations, the surface of the first cover plate facing the cavity has a plurality of protrusions spaced apart, and air passages can be formed between adjacent protrusions. These air passages are connected to the evaporation cavity and the condensation cavity respectively. The vaporized working fluid in the evaporation cavity can flow to the condensation cavity through the air passages, thereby using the air passages to guide the vaporized working fluid and improve the flow efficiency of the vaporized working fluid.

[0027] In other embodiments, there can be multiple liquid-absorbing cores arranged sequentially at intervals. Adjacent liquid-absorbing cores can form air channels, which are connected to the evaporation chamber and the condensation chamber respectively, thereby guiding the vapor-phase working fluid. In this design, the overall thickness of the vapor chamber is relatively small, making it more suitable for applications in thin and light electronic devices.

[0028] Secondly, this application also provides a heat spreader, which may include a first cover plate, a second cover plate, and a liquid-absorbing core. The first cover plate and the second cover plate can be fixedly connected and enclosed to form a cavity, which includes an evaporation cavity and a condensation cavity. The liquid-absorbing core is disposed in the cavity and includes a first surface and a second surface disposed opposite to each other, with the first surface facing the first cover plate and the second surface facing the second cover plate. The liquid-absorbing core is provided with micropores and micropillars. The micropores can extend from the first surface of the liquid-absorbing core to its second surface, and the micropillars are disposed on the second surface of the liquid-absorbing core. The pore diameter of the micropores and the diameter of the micropillars can both be greater than or equal to 10 μm and less than or equal to 500 μm. The second surface of the liquid-absorbing core includes a first region and a second region. The first region can be located in the evaporation cavity, and the second region can be at least partially located in the condensation cavity. The pore diameter of the micropores in the first region can be smaller than the pore diameter of the micropores in the second region, and the arrangement density of the micropores in the first region can be greater than the arrangement density of the micropores in the second region.

[0029] In this application, the liquid-absorbing core of the vapor chamber is designed with microstructures such as micropores and micropillars at the micrometer scale, effectively improving both capillary force and permeability. The integrated structural design of the liquid-absorbing core not only enhances overall rigidity but also avoids the defects of excessive thickness in composite capillary structures. Therefore, the vapor chamber provided in this application can effectively improve heat dissipation performance by enhancing the liquid return capacity of the liquid-absorbing core while achieving a small-size design, thus meeting the application requirements of thin and light electronic devices and improving their operating performance. Furthermore, by reducing the pore size of the micropores in the first region and increasing the micropore density, the liquid-absorbing core can provide more evaporation sites and evaporation area in the corresponding heat source region, thereby improving the evaporation efficiency of the liquid-absorbing core in this part and providing a reliable guarantee for the vapor chamber to support higher critical heat flux densities. The micropores in the second region only need to ensure normal capillary reflux; therefore, the pore size can be relatively large, and the density can be relatively sparse to reduce the processing difficulty of the liquid-absorbing core.

[0030] In some implementations, the micropores in the first region can be formed using laser etching. This not only meets the requirements for small size and high density processing of the micropores in the first region, but also offers high control precision, allowing for precise control of the pore size, position, and arrangement density of the micropores. The micropores in the second region can be formed using chemical etching. Chemical etching is a relatively simple and efficient process with relatively low costs. It can meet the processing requirements of the micropores in the second region and also helps to reduce the overall manufacturing cost of the liquid-absorbing core.

[0031] In some implementations, the diameter of the micropillars in the first region is smaller than that in the second region, and the arrangement density of the micropillars in the first region is greater than that in the second region. By reducing the diameter of the micropillars in the first region and increasing the arrangement density, the meniscus area of ​​the liquid working fluid can be increased, allowing the wicking core to provide more evaporation area in the corresponding heat source region, thereby improving the evaporation efficiency of the wicking core in this part and enhancing the heat dissipation effect on the heat source electronic devices. Conversely, by increasing the diameter of the micropillars in the second region and decreasing the arrangement density, sufficient support strength can be provided for the wicking core, and the permeability of the wicking core can be increased, thereby reducing the backflow resistance of the working fluid.

[0032] In some embodiments, the liquid-absorbing core may also be provided with microgrooves, which are at least located on one of the first or second surfaces. The two ends of each microgroove are connected to the evaporation chamber and the condensation chamber, respectively. The width of each microgroove is greater than or equal to 10 μm and less than or equal to 500 μm. The extended structure of the microgrooves gives them anisotropic properties, thus guiding the reflux of the liquid working fluid from the condensation chamber to the evaporation chamber within the temperature-sensing plate, thereby increasing the reflux rate of the liquid working fluid to the evaporation chamber.

[0033] Thirdly, this application also provides a heat spreader, which may include a first cover plate, a second cover plate, and a liquid-absorbing core. The first cover plate and the second cover plate can be fixedly connected and enclosed to form a cavity, which includes an evaporation cavity and a condensation cavity. The liquid-absorbing core is disposed in the cavity and includes a first surface and a second surface disposed opposite to each other, with the first surface facing the first cover plate and the second surface facing the second cover plate. The liquid-absorbing core is provided with micropores and micropillars. The micropores can extend from the first surface of the liquid-absorbing core to its second surface, and the micropillars are disposed on the second surface of the liquid-absorbing core. The pore diameter of the micropores and the diameter of the micropillars can both be greater than or equal to 10 μm and less than or equal to 500 μm. The second surface of the liquid-absorbing core includes a first region and a second region. The first region can be located in the evaporation cavity, and the second region can be at least partially located in the condensation cavity. The micropores in the first region and the micropores in the second region can be formed by different processes.

[0034] In this application, the liquid-absorbing core of the vapor chamber effectively enhances both capillary force and permeability by incorporating microstructures such as micropores and micropillars at the micrometer scale. The integrated structural design of the liquid-absorbing core not only strengthens the overall rigidity but also avoids the defects of excessive thickness in composite capillary structures. Therefore, the vapor chamber provided in this application can effectively improve heat dissipation performance by enhancing the liquid return capacity of the liquid-absorbing core while achieving a small-size design, thereby meeting the application requirements of thin and light electronic devices and improving their operating performance. Furthermore, by employing different processes to form the micropores in the first and second regions, appropriate processing techniques can be selected based on the required micropore size in the first region and the required micropore size in the second region, thus helping to improve the processing accuracy of the micropores.

[0035] In some implementations, the pore size of the micropores in the first region can be smaller than that in the second region, and the pore density in the first region can be greater than that in the second region. By reducing the pore size of the micropores in the first region and increasing the pore density, the liquid-absorbing core can provide more evaporation sites and evaporation area in the corresponding heat source region, thereby improving the evaporation efficiency of the liquid-absorbing core in this part and providing a reliable guarantee for the vapor chamber to support higher critical heat flux densities. The micropores in the second region only need to ensure normal capillary reflux; therefore, the pore size can be relatively large, and the pore density can be relatively sparse.

[0036] In some implementations, the micropores in the first region can be formed using laser etching. This not only meets the requirements for small size and high density processing of the micropores in the first region, but also offers high control precision, allowing for precise control of the pore size, position, and arrangement density of the micropores. The micropores in the second region can be formed using chemical etching. Chemical etching is a relatively simple and efficient process with relatively low costs. It can meet the processing requirements of the micropores in the second region and also helps to reduce the overall manufacturing cost of the liquid-absorbing core.

[0037] In some implementations, the diameter of the micropillars in the first region is smaller than that in the second region, and the arrangement density of the micropillars in the first region is greater than that in the second region. By reducing the diameter of the micropillars in the first region and increasing the arrangement density, the meniscus area of ​​the liquid working fluid can be increased, allowing the wicking core to provide more evaporation area in the corresponding heat source region, thereby improving the evaporation efficiency of the wicking core in this part and enhancing the heat dissipation effect on the heat source electronic devices. Conversely, by increasing the diameter of the micropillars in the second region and decreasing the arrangement density, sufficient support strength can be provided for the wicking core, and the permeability of the wicking core can be increased, thereby reducing the backflow resistance of the working fluid.

[0038] In some embodiments, the liquid-absorbing core may also be provided with microgrooves, which are at least located on one of the first or second surfaces. The two ends of each microgroove are connected to the evaporation chamber and the condensation chamber, respectively. The width of each microgroove is greater than or equal to 10 μm and less than or equal to 500 μm. The extended structure of the microgrooves gives them anisotropic properties, thus guiding the reflux of the liquid working fluid from the condensation chamber to the evaporation chamber within the temperature-sensing plate, thereby increasing the reflux rate of the liquid working fluid to the evaporation chamber.

[0039] Fourthly, this application also provides an electronic device, which includes a heat source electronic device and a vapor chamber as described in any of the embodiments of the first to third aspects. The heat source electronic device is in thermal contact with the surface of the second cover plate of the vapor chamber facing away from the cavity. Exemplarily, the orthogonal projection of the heat source region in the thickness direction of the vapor chamber is located within the orthogonal projection range of the evaporation cavity in the thickness direction of the vapor chamber. During operation, the liquid working fluid in the evaporation cavity absorbs the heat generated by the heat source electronic device and is converted into a vapor working fluid. The vapor working fluid flows to the condensation cavity, where it condenses and releases heat, converting back into a liquid working fluid. The liquid working fluid flows back into the evaporation cavity through the gaps between the micropillars and the microgrooves of the liquid-absorbing core. This cycle repeats continuously, thereby achieving continuous heat dissipation for the heat source electronic device. Attached Figure Description

[0040] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0041] Figure 2 A schematic diagram of the structure of an electronic device provided in another embodiment of this application;

[0042] Figure 3 A schematic diagram of the structure of an electronic device provided in another embodiment of this application;

[0043] Figure 4 This is a schematic diagram of the planar structure of a heat spreader provided in an embodiment of this application;

[0044] Figure 5 for Figure 4 A schematic diagram of a cross-sectional structure of the heat spreader at point AA is shown.

[0045] Figure 6a and Figure 6b A schematic diagram of the liquid-absorbing core provided in an embodiment of this application on the second side;

[0046] Figure 7a and Figure 7b A schematic diagram of the liquid-absorbing core provided in an embodiment of this application on the second side;

[0047] Figure 8 for Figure 4 A schematic diagram of a cross-sectional structure of the heat spreader at point BB is shown;

[0048] Figure 9 for Figure 8 A schematic diagram of the cross-sectional structure of the liquid absorption core of the temperature distribution plate shown;

[0049] Figure 10a for Figure 9 The diagram shows a structural schematic of the liquid-absorbing core on the second side;

[0050] Figure 10b for Figure 10a A schematic diagram of the structure of the liquid-absorbing core on the first side;

[0051] Figure 11 for Figure 9 The diagram shows another structural schematic of the liquid-absorbing core on the second side;

[0052] Figure 12a for Figure 9 The diagram shows another structural schematic of the liquid-absorbing core on the second side;

[0053] Figure 12b for Figure 12a A schematic diagram of the structure of the liquid-absorbing core on the first side;

[0054] Figure 13 for Figure 9The diagram shows another structural schematic of the liquid-absorbing core on the second side;

[0055] Figure 14a for Figure 9 The diagram shows another structural schematic of the liquid-absorbing core on the second side;

[0056] Figure 14b for Figure 14a A schematic diagram of the structure of the liquid-absorbing core on the first side;

[0057] Figure 15 for Figure 9 The diagram shows another structural schematic of the liquid-absorbing core on the second side;

[0058] Figure 16 for Figure 4 A schematic diagram of another cross-sectional structure of the heat spreader at BB;

[0059] Figure 17 for Figure 16 A schematic diagram of the cross-sectional structure of the liquid absorption core of the temperature distribution plate shown;

[0060] Figure 18 for Figure 17 The diagram shows a structural schematic of the liquid-absorbing core on the second side;

[0061] Figure 19 for Figure 4 A schematic diagram of another cross-sectional structure of the heat spreader at BB;

[0062] Figure 20 for Figure 19 A schematic diagram of the cross-sectional structure of the liquid absorption core of the temperature distribution plate shown;

[0063] Figure 21a for Figure 20 The diagram shows a structural schematic of the liquid-absorbing core on the first side;

[0064] Figure 21b for Figure 20 The diagram shows another structural schematic of the liquid-absorbing core on the first side;

[0065] Figure 22a for Figure 20 The diagram shows another structural schematic of the liquid-absorbing core on the first side;

[0066] Figure 22b for Figure 20 The diagram shows another structural schematic of the liquid-absorbing core on the first side;

[0067] Figure 23a for Figure 20 The diagram shows another structural schematic of the liquid-absorbing core on the first side;

[0068] Figure 23b for Figure 20 The diagram shows another structural schematic of the liquid-absorbing core on the first side;

[0069] Figure 24 for Figure 4 A schematic diagram of another cross-sectional structure of the heat spreader at point AA;

[0070] Figure 25 for Figure 4 A schematic diagram of another cross-sectional structure of the heat spreader at point AA;

[0071] Figure 26 for Figure 4 A schematic diagram of another cross-sectional structure of the heat spreader at point AA;

[0072] Figure 27 This is a schematic diagram of the cross-sectional structure of a heat spreader provided in an embodiment of this application;

[0073] Figure 28 This is a schematic diagram of the cross-sectional structure of a heat exchanger provided in an embodiment of this application.

[0074] Figure label:

[0075] 1000 - Electronic device; 100 - Housing; 110 - First housing; 120 - Second housing; 130 - Shaft; 200 - Heat source electronic device;

[0076] 300 - Heat spreader; 3001 - First section; 3002 - Second section; 3003 - Third section; 310 - First cover plate; 311 - Boss; 312 - Air passage;

[0077] 320 - Second cover plate; 321 - Heat source area; 322 - First arched part; 323 - Groove; 330 - Liquid absorption core; 330a - First surface; 330b - Second surface;

[0078] 330b1 - First region; 330b2 - Second region; 331 - Micropore; 332 - Micropillar; 333 - Microgroove; 334 - First core;

[0079] 3341 - First layer structure of the first core; 3342 - Second layer structure of the first core; 3343 - Fourth sub-core; 3344 - Fifth sub-core;

[0080] 3345 - Sixth sub-core; 335 - Second core; 3351 - First sub-core; 33511 - First notch; 3352 - Second sub-core;

[0081] 33521 - Second notch; 3353 - First layer structure of the second core; 3354 - Second layer structure of the second core; 3355 - Third sub-core;

[0082] 336-Thinned portion; 3361-Recess; 337-Thickened portion; 3371-Protrusion; 338-Second arched portion; 339-Allowing groove; 340-Cavity;

[0083] 341 - Evaporation chamber; 342 - Condensation chamber; 343 - Insulation chamber. Detailed Implementation

[0084] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings. However, the exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein. The same reference numerals in the figures denote the same or similar structures, and therefore repeated descriptions of them will be omitted. The terms expressing position and direction described in the embodiments of this application are illustrative based on the accompanying drawings, but changes can be made as needed, and all such changes are included within the scope of protection of this application. The accompanying drawings of the embodiments of this application are only for illustrating relative positional relationships and do not represent actual scale.

[0085] It should be noted that specific details are set forth in the following description to facilitate understanding of this application. However, the embodiments of this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the embodiments of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0086] A vapor chamber is a commonly used heat dissipation device in electronic equipment. It is a cavity 340 with an internal capillary structure (also called a liquid wick 330) and filled with a working fluid. The basic working principle of the vapor chamber is as follows: the liquid working fluid absorbs heat conducted by the heat source electronic device in the evaporation cavity 341 of the cavity 340 and is converted into a vapor phase working fluid. The vapor phase working fluid condenses and releases heat in the condensation cavity 342 of the cavity 340 and is converted back into a liquid phase working fluid. The liquid working fluid flows back to the evaporation cavity 341 through the capillary action of the liquid wick 330, and this cycle continues to achieve continuous heat dissipation for the heat source electronic device.

[0087] The wicking core 330 is a key component for achieving high heat dissipation performance in a vapor chamber. In related technologies, the wicking core 330 generally employs a wire mesh capillary structure, a powder sintered capillary structure, a grooved capillary structure, or a composite capillary structure of two or more of these types. Among these, wire mesh and powder sintered capillary structures have relatively strong capillary force but low permeability, resulting in greater resistance to transporting the liquid working fluid. Groove capillary structures have relatively good permeability and low transport resistance, but weaker capillary force. Therefore, a wicking core 330 using a single capillary structure often struggles to balance strong capillary force and high permeability, limiting its liquid return capability. While composite capillary structures, such as a wire mesh and grooved composite or a powder sintered and grooved composite, can balance capillary force and permeability to some extent, they are often too thick, failing to meet the application requirements of thin and light electronic devices.

[0088] In view of this, embodiments of this application provide a heat spreader and an electronic device to improve the heat dissipation performance of the heat spreader without increasing its thickness, thereby enhancing the operating performance of the electronic device. The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0089] Figure 1 This is a schematic diagram of the structure of an electronic device 1000 provided in an embodiment of this application. (Reference) Figure 1 As shown in this embodiment, the electronic device 1000 can be a candybar-style electronic device, such as a candybar mobile phone or a tablet computer. The electronic device 1000 includes a housing 100 and a heat source electronic device 200 and a heat spreader 300 disposed within the housing 100. The heat source electronic device 200 includes, but is not limited to, a central processing unit (CPU), an artificial intelligence (AI) processor, a system-on-chip (SoC), a power management unit, or other devices requiring heat dissipation. The heat spreader 300 can be a rigid heat spreader 300, which makes thermally conductive contact with the heat source electronic device 200. The heat generated by the heat source electronic device 200 can be dispersed through the heat spreader 300 to relatively cooler areas within the housing 100, thereby controlling the operating temperature of the heat source electronic device 200 within an appropriate temperature range and ensuring the reliable operation of the electronic device 1000.

[0090] Figure 2 and Figure 3 This is a schematic diagram of the structure of an electronic device 1000 provided in some other embodiments of this application. In these embodiments, the electronic device 1000 is a foldable electronic device, for example, it can be... Figure 2 The large folding phone shown may be... Figure 3The small foldable phone shown could also be a foldable tablet, laptop, foldable wearable device, etc. (See also...) Figure 2 and Figure 3 The electronic device 1000 includes a first housing 110, a second housing 120, and a rotating shaft 130. The first housing 110 and the second housing 120 are rotatably connected to both sides of the rotating shaft 130 so that the electronic device 1000 can be folded or unfolded according to different usage scenarios.

[0091] The heat source electronic device 200 of the electronic device can be disposed within the first housing 110. The heat spreader 300 includes a first part 3001, a second part 3002, and a third part 3003. The first part 3001 is disposed within the first housing 110 and is in thermally conductive contact with the heat source electronic device 200. The second part 3002 is disposed within the second housing 120. The third part 3003 passes through the rotating shaft 130 and connects the first part 3001 and the second part 3002. The heat generated by the heat source electronic device 200 can be dispersed through the first part 3001 to a relatively cooler area in the first housing 110, or through the third part 3003 and the second part 3002 to a relatively cooler area in the second housing 120. This allows the operating temperature of the heat source electronic device 200 to be controlled within an appropriate temperature range, ensuring the reliable operation of the electronic device 1000.

[0092] Figure 4 This is a schematic diagram of the planar structure of a heat spreader 300 provided in an embodiment of this application. Figure 5 for Figure 4 The diagram shows a cross-sectional structure of the heat spreader 300 at point AA. (See also...) Figure 4 and Figure 5 As shown, in this embodiment, the temperature distribution plate 300 includes a first cover plate 310, a second cover plate 320, and a liquid-absorbing core 330. The first cover plate 310 and the second cover plate 320 are fixedly connected and can enclose a cavity 340, in which the liquid-absorbing core 330 is disposed. Furthermore, the cavity 340 is filled with a working fluid that can transform between a vapor phase and a liquid phase with temperature changes. For example, the working fluid can be, but is not limited to, at least one of pure water, ethylene glycol, alcohol, or ammonia.

[0093] Within the cavity 340 of the temperature-sensing plate 300, the working fluid can transform between the vapor and liquid phases with temperature changes. Based on the phase state of the working fluid, the cavity 340 of the temperature-sensing plate 300 can be roughly divided into an evaporation cavity 341, a condensation cavity 342, and an adiabatic cavity 343. In this embodiment, the liquid working fluid evaporates and absorbs heat in the evaporation cavity 341, then transforms into a vapor phase. The vapor phase working fluid condenses and releases heat in the condensation cavity 342, transforming back into a liquid phase, and then flows back to the evaporation cavity 341 through the capillary action of the wicking core 330. The adiabatic cavity 343 is located between the evaporation cavity 341 and the condensation cavity 342. The working fluid in the adiabatic cavity 343 can be considered to have essentially no heat exchange with the outside environment. The essence of capillary action is a surface phenomenon related to surface flow and liquid surface equilibrium shape caused by the existence of surface tension, such as the formation of droplets or curved liquid surfaces, and the rise or fall of the liquid surface in the capillary pores. When the balance between surface tension and gravity of a liquid in the tiny pores of a capillary structure is broken, it will overcome gravity and rise or move. The liquid-absorbing core 330 achieves the transport of liquid working fluid through this principle.

[0094] In one implementation, the planar shape of the heat spreader 300 can be... Figure 4 The rectangular vapor chamber 300 shown includes an evaporation chamber 341, a condensation chamber 342, and an insulation chamber 343. This type of vapor chamber 300 can be applied to... Figure 1 In the straight-plate electronic device shown. In another implementation, the planar shape of the heat spreader 300 can also be irregular, for example, in applications... Figure 2 The vapor chamber 300 in the foldable electronic device shown has a cavity 340 including an evaporation cavity 341, two condensation cavities 342, and two insulation cavities 343. The evaporation cavity 341, one condensation cavity 342, and one insulation cavity 343 are located within a first portion 3001 of the vapor chamber 300. Another condensation cavity 342 is located within a second portion 3002 of the vapor chamber 300. Another insulation cavity 343 is located within a third portion 3003 of the vapor chamber 300, and in local areas of the first portion 3001 and the second portion 3002 near the third portion 3003. For example, it can be applied to… Figure 3 The vapor chamber 300 in the foldable electronic device shown has a cavity 340 including an evaporation cavity 341, a condensation cavity 342 and an insulation cavity 343. The evaporation cavity 341 is located in the first part of the vapor chamber 300, the condensation cavity 342 is located in the second part of the vapor chamber 300, and the insulation cavity 343 is located in the third part of the vapor chamber 300, as well as in the local area of ​​the first part 3001 and the second part 3002 near the third part 3003.

[0095] In this embodiment, the first cover plate 310 and the liquid-absorbing core 330 can be spaced apart, and the gap between the first cover plate 310 and the liquid-absorbing core 330 can allow the vapor phase working fluid to flow. Exemplarily, the surface of the first cover plate 310 facing the cavity 340 has a plurality of protrusions 311 spaced apart, and a gas channel 312 can be formed between two adjacent protrusions 311. The gas channel 312 connects the evaporation cavity 341 and the condensation cavity 342. The vapor phase working fluid after vaporization in the evaporation cavity 341 can flow to the condensation cavity 342 through the gas channel 312, thereby using the gas channel 312 to provide a guiding effect for the vapor phase working fluid.

[0096] The surface of the second cover plate 320 facing away from the cavity 340 includes a heat source region 321. The relative arrangement direction of the first cover plate 310 and the second cover plate 320 (i.e., the thickness direction of the heat spreader 300) is defined as the first direction. The orthographic projection of the evaporation cavity 341 in the first direction covers the orthographic projection of the heat source region 321 in the first direction. This heat source region 321 is used for thermally conductive contact with the heat source electronic device. The heat generated by the heat source electronic device can be transferred to the liquid working fluid in the evaporation cavity 341 through the second cover plate 320. In this way, the heat source electronic device achieves cooling through heat dissipation, and the liquid working fluid in the evaporation cavity 341 is converted into a liquid working fluid through heat absorption.

[0097] The first cover plate 310 and the second cover plate 320 can be welded or sealed together using a sealing connection structure such as sealant. The first cover plate 310 and the second cover plate 320 can be made of rigid material, and the heat spreader 300 using cover plates of this material can be applied to flat electronic devices. Alternatively, the first cover plate 310 and the second cover plate 320 can also be made of flexible material, and the heat spreader 300 using cover plates of this material can be applied to foldable electronic devices to utilize the bendable properties of the flexible material to adapt to the repeated folding and unfolding of foldable electronic devices.

[0098] For example, in some embodiments, the first cover plate 310 and the second cover plate 320 may be made of a single-layer metal material, such as including but not limited to copper, copper alloy, aluminum, aluminum alloy, steel, stainless steel, titanium, titanium alloy, aluminum-magnesium alloy, amorphous alloy, shape memory alloys (SMA), high entropy alloys (HEAs), or metal-ceramic composite materials (referring to composite materials formed by doping ceramic particles such as silicon carbide into a metal matrix, wherein the ceramic particles are used to improve the performance of the material, such as improving stiffness and strength), etc.

[0099] In other embodiments, the first cover plate 310 and the second cover plate 320 may also be made of composite layer materials. Composite layer materials refer to layered composite materials formed by calendering, electroplating or other methods from one or more materials of a single metallic type and a single non-metallic type, such as composite materials of different metals, composite materials of metal and ceramics, composite materials of metal and polymer materials, etc.

[0100] The absorbent core 330 can be made of a metal with excellent thermal conductivity, such as copper or aluminum. For example, the absorbent core 330 can be made of C1020 oxygen-free copper. The absorbent core 330 includes a first surface 330a and a second surface 330b that are disposed opposite to each other. The first surface 330a of the absorbent core 330 faces the first cover plate 310, and the second surface 330b of the absorbent core 330 faces the second cover plate 320.

[0101] In this embodiment, the absorbent core 330 may be provided with micropores 331, which can extend from the first surface 330a to the second surface 330b of the absorbent core 330. Furthermore, the absorbent core 330 may also be provided with micropillars 332, which are disposed on the second surface 330b of the absorbent core 330. The end face of the micropillar 332 facing the second cover plate 320 contacts the second cover plate 320, thus supporting the entire absorbent core 330. For example, the micropillars 332 may be located at a position on the second surface 330b where no micropores 331 are provided, to avoid blocking the micropores 331. Further, the absorbent core 330 may also be provided with microgrooves 333, which may be provided on at least one of the first surface 330a or the second surface 330b, for example... Figure 5 The illustrated embodiment shows a case where multiple microgrooves 333 are disposed on the first surface 330a, that is, multiple microgrooves 333 and multiple micropillars 332 are disposed on opposite sides.

[0102] Micropores 331, micropillars 332, and microgrooves 333 can be understood as micron-sized structures. In specific implementations, there can be multiple micropores 331, micropillars 332, and microgrooves 333. Multiple microstructures on the micron scale can give the liquid-absorbing core 330 strong capillary force, improving its liquid return capability. Specifically, micropores 331 can be circular or approximately circular, micropillars 332 can be cylindrical or approximately cylindrical, and microgrooves 333 are approximately equal-width grooves to reduce the fabrication difficulty of micropores 331, micropillars 332, and microgrooves 333. Here, the width of a microgroove 333 at a certain location can be considered as the dimension in a direction orthogonal to the extension direction at that location.

[0103] The aperture of the micropore 331, the diameter of the micropillar 332, and the width of the microgroove 333 can all be greater than or equal to 10 μm and less than or equal to 500 μm. For example, the aperture of the micropore 331 can be 100 μm, 95 μm, 80 μm, 72 μm, 65 μm, etc.; the diameter of the micropillar 332 can be 200 μm, 180 μm, 165 μm, 153 μm, 130 μm, etc.; and the width of the microgroove 333 can be 100 μm, 80 μm, 68 μm, 40 μm, 35 μm, etc.

[0104] Since the micropores 331, micropillars 332, and microgrooves 333 are all relatively microscopic structures that are not easily observed with the naked eye, schematic drawings are used in the accompanying drawings of the various embodiments of this application to highlight their design features. The number, shape, and size of the micropores 331, micropillars 332, and microgrooves 333 in the drawings are not subject to change. Figure 5 The accompanying figures below are for illustrative purposes only and are not intended to represent the actual structure.

[0105] In this embodiment, the two ends of the microgroove 333 are connected to the evaporation chamber 341 and the condensation chamber 342, respectively. That is, the microgroove 333 extends between the evaporation chamber 341 and the condensation chamber 342. The extended structure of the microgroove 333 gives it anisotropic characteristics, thus providing a guiding effect for the reflux of the liquid working fluid from the condensation chamber 342 to the evaporation chamber 341, and improving the reflux rate of the liquid working fluid to the evaporation chamber 341.

[0106] In one implementation, the microchannel 333 can extend in a straight line. For example, the extension direction of the microchannel 333 can be the relative orientation of the evaporation chamber 341 and the condensation chamber 342. This allows the microchannel 333 to have a shorter extension length, thereby helping to further accelerate the reflux rate of the liquid working fluid. In another implementation, the extension direction of the microchannel 333 can also be curved or zigzag. This application does not specifically limit the extension shape of the microchannel 333, as long as it can connect the evaporation chamber 341 and the condensation chamber 342.

[0107] The microgrooves 333 can be formed using laser etching processes, such as ultrafast laser equipment like femtosecond lasers (which emit laser pulses lasting only a few femtoseconds, one femtosecond equals one quadrillionth of a second) or picosecond lasers (which last on the picosecond scale, one picosecond equals one trillionth of a second). Laser etching allows for precise control of the width and depth of the microgrooves 333, meeting the requirements for small-size processing. Furthermore, laser etching can create hydrophilic micro / nano structures on the walls of the microgrooves 333, thereby enabling the wicking core 330 to provide stronger capillary force and accelerate the reflux of the liquid working fluid.

[0108] During operation, the liquid working medium in the evaporation chamber 341 absorbs the heat generated by the heat source electronic device and is converted into a vapor working medium. The vapor working medium flows through the micropores 331 of the liquid absorption core 330 to the air channel 312 between the first surface 330a of the liquid absorption core 330 and the first cover plate 310, and then flows through the air channel 312 to the condensation chamber 342. After condensing and releasing heat in the condensation chamber 342, it is converted into a liquid working medium. The liquid working medium flows back to the evaporation chamber 341 through the gaps between the micropillars 332 and the microgrooves 333 of the liquid absorption core 330. This cycle repeats, thus achieving continuous heat dissipation for the heat source electronic device.

[0109] In this embodiment, the liquid-absorbing core 330 of the heat spreader 300, through the provision of microstructures such as micropores 331, micropillars 332, and microgrooves 333, effectively enhances both capillary force and permeability, solving the problem of limited liquid return capacity of single-type capillary structures. Furthermore, the integrated structural design of the liquid-absorbing core 330 not only enhances overall rigidity but also avoids the defects of excessive thickness in composite capillary structures. Therefore, the heat spreader 300 provided in this embodiment can effectively improve heat dissipation performance by enhancing the liquid return capacity of the liquid-absorbing core 330 while achieving a small-size design, thereby meeting the application requirements of thin and light electronic devices and improving the working performance of electronic devices.

[0110] Figure 6a and Figure 6b This is a schematic diagram of the liquid-absorbing core 330 provided in the embodiments of this application on the second surface 330b, to clearly illustrate the design of the micropores 331. Figure 6a and Figure 6b Micropillar 332 and microgroove 333 are omitted. Please refer to the original text for further details. Figure 6a and Figure 6b As shown in the embodiment of this application, the second surface 330b of the liquid-absorbing core 330 includes a first region 330b1 and a second region 330b2. The first region 330b1 is located within the evaporation chamber 341, and at least a portion of the second region 330b2 is located within the condensation chamber 342. For example, in Figure 6a In the illustrated embodiment, the orthographic projection of the first region 330b1 in the first direction substantially coincides with the orthographic projection of the heat source region 321 in the first direction, and the orthographic projection of the second region 330b2 in the first direction covers a portion of the orthographic projection of the condensing cavity 342, the insulating cavity 343, and the evaporating cavity 341 in the first direction; or, in Figure 6b In the embodiment shown, the orthographic projection of the first region 330b1 in the first direction roughly coincides with the orthographic projection of the evaporation chamber 341 in the first direction, and the orthographic projection of the second region 330b2 in the first direction roughly coincides with the orthographic projections of the condensation chamber 342 and the adiabatic chamber 343 in the first direction.

[0111] In some embodiments, the pore size of the micropores 331 in the first region 330b1 may be smaller than the pore size of the micropores 331 in the second region 330b2, and the arrangement density of the micropores 331 in the first region 330b1 may be greater than the arrangement density of the micropores 331 in the second region 330b2, or in other words, the center-to-center distance of the micropores 331 in the first region 330b1 may be smaller than the center-to-center distance of the micropores 331 in the second region 330b2. By reducing the pore size and center-to-center distance of the micropores 331 in the first region 330b1, the liquid-absorbing core 330 can provide more evaporation sites and evaporation area in the portion corresponding to the heat source region 321, thereby improving the evaporation efficiency of the liquid-absorbing core 330 in this portion. This provides a reliable guarantee for the vapor chamber 300 to support higher critical heat flux (CHF) and meets the heat dissipation requirements of the highly integrated and performance-oriented heat source electronic device 200. For the remaining areas of micropores 331, the pore diameter and spacing of micropores 331 can be relatively large, as long as normal capillary reflux can be guaranteed.

[0112] The apertures of all micropores 331 in the first region 330b1 can be the same, and the center-to-center distance between any two micropores 331 in the first region 330b1 can also be the same. Similarly, the apertures of all micropores 331 in the second region 330b2 can be the same, and the center-to-center distance between any two micropores 331 in the second region 330b2 can also be the same, in order to further reduce the processing difficulty of the liquid absorption core 330. In addition, the same dimensions defined in the embodiments of this application are not limited to absolute complete consistency, and small deviations due to processing errors are allowed.

[0113] Based on the design difference in size between the micropores 331 in the first region 330b1 and the micropores 331 in the second region 330b2, the micropores 331 in the first region 330b1 and the micropores 331 in the second region 330b2 can be formed by different processes, so as to minimize the overall manufacturing difficulty of the liquid absorption core 330 while meeting the size requirements of the micropores 331 in different regions.

[0114] For example, in one embodiment, the micropores 331 of the first region 330b1 can be formed by laser etching, such as using ultrafast laser equipment like femtosecond lasers or picosecond lasers. Forming the micropores 331 by laser etching not only meets the requirements for small size and high density processing of the micropores 331 in the first region 330b1, but also offers high control precision, allowing for precise control of the aperture, position, and center-to-center distance of the micropores 331 in the first region 330b1.

[0115] The micropores 331 in the second region 330b2 can be formed by a chemical etching process, such as wet etching or dry etching. Chemical etching is a technique that uses a chemical reaction to remove specific portions of a surface. Specifically, in this embodiment, a portion of the pre-formed micropores 331 in the second region 330b2 can be removed by a chemical reaction, thereby obtaining the desired porous structure. The chemical etching process is relatively simple and efficient, and the process cost is also relatively low. It can not only meet the processing requirements of the micropores 331 in the second region 330b2, but also help reduce the overall manufacturing cost of the liquid-absorbing core 330.

[0116] Figure 7a and Figure 7b This is a schematic diagram of the liquid absorption core 330 provided in the embodiments of this application on the second surface 330b, to clearly illustrate the design of the micropillar 332. Figure 7a and Figure 7b Micropore 331 and microgroove 333 are omitted. Figure 7a and Figure 7b As shown in the embodiment of this application, the second surface 330b of the liquid-absorbing core 330 can also be divided into a first region 330b1 and a second region 330b2. The specific positions of the first region 330b1 and the second region 330b2 can be referred to the description of the foregoing embodiment, and will not be repeated here.

[0117] In this embodiment, the diameter of the micropillars 332 in the first region 330b1 is smaller than the diameter of the micropillars 332 in the second region 330b2, and the arrangement density of the micropillars 332 in the first region 330b1 is greater than the arrangement density of the micropillars 332 in the second region 330b2. In other words, the center-to-center distance of the micropillars 332 in the first region 330b1 is smaller than the center-to-center distance of the micropillars 332 in the second region 330b2. By reducing the diameter and center-to-center distance of the micropillars 332 in the first region 330b1, the meniscus area of ​​the liquid working fluid can be increased, allowing the absorbing core 330 to provide more evaporation area in the corresponding heat source region 321. This improves the evaporation efficiency of the absorbing core 330 in this part and enhances the heat dissipation effect on the heat source electronic device 200. For the micropillars 332 located in the condensation chamber 342 and the insulation chamber 343, a larger column diameter can provide sufficient support strength for the liquid absorbing core 330, while a larger column center distance can increase the permeability of the liquid absorbing core 330, reduce the backflow resistance of the liquid working fluid, and thus enhance the heat dissipation efficiency of the liquid absorbing core 330.

[0118] The micropillars 332 in the first region 330b1 and the micropillars 332 in the second region 330b2 can both be formed by chemical etching. In a specific implementation, the micropillars 332 in the first region 330b1 and the micropillars 332 in the second region 330b2 can be formed by simultaneous etching using masks with different patterns, in order to simplify the process flow of the liquid-absorbing core 330 and improve the processing efficiency of the liquid-absorbing core 330.

[0119] Figure 8 for Figure 4 The diagram shows a cross-sectional structure of the heat spreader 300 at point BB. Figure 8 An example is shown where the micropillars 332 and microgrooves 333 are arranged on the same side. (Reference) Figure 8 As shown in the embodiment of this application, the liquid absorption core 330 includes a first core 334, at least a portion of which is located within the insulation cavity 343. For example, the first core 334 may be entirely located within the insulation cavity 343; or, along the length direction of the heat spreader 300 (i.e., the relative arrangement direction of the evaporation cavity 341 and the condensation cavity 342), one end of the first core 334 extends into the evaporation cavity 341 or the condensation cavity 342, or both ends of the first core 334 extend into the evaporation cavity 341 and the condensation cavity 342, respectively.

[0120] In one embodiment, multiple microchannels 333 are disposed in the first core 334. In this way, after the working fluid is liquefied in the condensation chamber 342, the liquid working fluid can flow into the evaporation chamber 341 under the directional flow guidance of the multiple microchannels 333, thereby accelerating the reflux rate of the liquid working fluid.

[0121] Continue to refer to Figure 8 The liquid-absorbing core 330 may further include a second core 335, which includes a first sub-core 3351 and a second sub-core 3352. At least a portion of the first sub-core 3351 is located within the evaporation chamber 341, and at least a portion of the second sub-core 3352 is located within the condensation chamber 342. For example, the first sub-core 3351 may be entirely located within the evaporation chamber 341, and the second sub-core 3352 may be entirely located within the evaporation chamber 341; or, along the length of the heat spreader 300, one end of the first core 334 may extend into the insulation chamber 343, and one end of the second core 3352 may also extend into the insulation chamber 343.

[0122] Multiple micropillars 332 may be disposed at least in the second core 335, wherein some micropillars 332 are disposed in the first sub-core 3351 and some micropillars 332 are disposed in the second sub-core 3352. The micropillars 332 distributed at intervals on the first sub-core 3351 and the second sub-core 3352 give them isotropic characteristics, so the working fluid in the evaporation chamber 341 and the condensation chamber 342 can flow in all directions, accelerating the evaporation or condensation rate of the working fluid and enabling the heat spreader 300 to achieve more efficient heat dissipation.

[0123] Figure 9 for Figure 8 A schematic cross-sectional view of the liquid-absorbing core 330 of the temperature distribution plate 300 shown. (See also...) Figure 8 and Figure 9As shown, in some embodiments, the first core 334 and the second core 335 each include a first layer structure and a second layer structure. The second layer structure of both cores is disposed on the side of their first layer structure facing the second cover plate 320. Multiple micropillars 332 can be formed as the second layer structure 3354 of the second core 335. The side of the first layer structure 3353 of the second core 335 facing the second cover plate 320 can be considered as a portion of the second surface 330b of the liquid-absorbing core 330. The other portion of the second surface 330b of the liquid-absorbing core 330 is formed by the side of the second layer structure 3342 of the first core 334 facing the second cover plate 320. That is, the second surface 330b of the liquid-absorbing core 330 is a stepped surface. Multiple microgrooves 333 are disposed on the side of the second layer structure of the first core 334 facing the second cover plate 320. Therefore, in this embodiment, the micropillars 332 and microgrooves 333 are not only disposed on the same side of the liquid absorption core 330, but the micropillars 332 and microgrooves 333 can also be disposed at least partially in the same layer, which helps to reduce the thickness of the liquid absorption core 330, and thus reduces the overall thickness of the temperature distribution plate 300.

[0124] Figure 10a for Figure 9 The diagram shows a structural schematic of the absorbent core 330 on its second side. (Reference) Figure 10a As shown in this embodiment, along the length of the heat spreader 300, the first sub-core 3351 and the second sub-core 3352 can be arranged at intervals, with the first core 334 located between the first sub-core 3351 and the second sub-core 3352. In this design, along the reflux direction of the liquid working fluid, the first sub-core 3351, the first core 334, and the second sub-core 3352 can be considered as arranged in series. Most of the liquid working fluid liquefied in the condensation chamber can be transported to the evaporation chamber through the microgrooves 333 of the first core 334, thereby further improving the reflux rate of the liquid working fluid.

[0125] Figure 10b for Figure 10a The diagram shows a structural schematic of the absorbent core 330 on its first side. See also... Figure 10a and Figure 10b As shown, in this embodiment, all of the multiple micropores 331 can be disposed in the second core 335, wherein some micropores 331 are disposed in the first sub-core 3351, and other micropores 331 are disposed in the second sub-core 3352, while the first core 334 does not have micropores 331. This simplifies the processing technology of the liquid-absorbing core 330 and improves the processing efficiency of the liquid-absorbing core 330 while accelerating the reflux of the liquid working fluid.

[0126] Please refer to the above. Figure 9 and Figure 10bIn this embodiment, the micropillars 332 form the second layer structure 3354 of the second core 335, and the micropores 331 penetrate the first layer structure of the second core 335. Therefore, the height of the micropillars 332 is the thickness of the second layer structure 3354 of the second core 335, and the depth of the micropores 331 is the thickness of the first layer structure 3353 of the second core 335. In a specific implementation, the thickness of the first layer structure 3351 of the second core 335 can be less than or equal to the thickness of the second layer structure 3354 of the second core 335. That is, the layer thickness occupied by the micropores 331 is less than or equal to the layer thickness occupied by the micropillars 332. This can improve the capillary force of the first core 334 and reduce the risk of burn-out in the heat spreader 300 due to insufficient recirculation of the working fluid.

[0127] Figure 11 for Figure 9 The diagram shows another structural representation of the absorbent core 330 on the second side. (Reference) Figure 11 As shown, in this embodiment, the micropores 331 can be disposed in either the first core 334 or the second core 335. During the flow of the vapor-phase working fluid from the evaporation chamber to the condensation chamber, some of the vapor-phase working fluid may condense within the adiabatic chamber (see reference). Figure 8 By providing micropores 331 in the first core 334, the condensed working fluid can flow through the micropores 331 to the area below the absorbing core 330 (i.e., the space between the absorbing core 330 and the second cover plate 320), and then flow into the evaporation chamber 341 under the guidance of the microgrooves 333. Therefore, the absorbing core 330 in this embodiment can not only improve the reflux rate of the liquid working fluid, but also reduce the risk of the liquid working fluid being stored in the insulation chamber 343, thereby enabling the heat spreader 300 to reliably dissipate heat for the heat source electronic device 200.

[0128] Please refer to the above. Figure 9 and Figure 11 As shown, in this embodiment, for the first core 334, the depth of the microgroove 333 can be greater than the thickness of the second layer structure 3342 of the first core 334, or it can be less than or equal to the thickness of the second layer structure 3342 of the first core 334. This application does not impose any restrictions on this. Let the overall thickness of the first core 334 be d0, and the depth of the microgroove 333 be d1. Then the depth of the micropore 331 is at least d0-d1. In specific implementation, d0-d1≤d1, that is, the layer thickness occupied by the micropore 331 is less than or equal to the layer thickness occupied by the microgroove 333. By increasing the depth of the microgroove 333, the capillary force and permeability of the liquid-absorbing core 330 can be effectively improved, thereby reducing the liquid return resistance of the liquid-absorbing core 330 and improving the liquid return capacity of the liquid-absorbing core 330.

[0129] Figure 12a for Figure 9The diagram shows another structural representation of the absorbent core 330 on the second side. (Reference) Figure 12a As shown in the embodiments of this application, the second core 335 may further include a third sub-core 3355, at least a portion of which is located within the insulation cavity. For example, the third sub-core 3355 may be entirely located within the insulation cavity 343; or, along the length of the heat spreader 300, one end of the third sub-core 3355 may extend into the evaporation cavity 341 or the condensation cavity 342, or both ends of the third sub-core 3355 may extend into the evaporation cavity 341 and the condensation cavity 342, respectively.

[0130] The third sub-core 3355 and the first core 334 are arranged along the width direction of the heat spreader 300, that is, the third sub-core 3355 and the first core 334 are arranged side by side between the first sub-core 3351 and the second sub-core 3352. In one implementation, the third sub-core 3355 and the first core 334 can each be one, and the third sub-core 3355 and the first core 334 are arranged side by side; in another implementation, there can be two third sub-cores 3355 and one first core 334, and the first core 334 can be arranged between the two third sub-cores 3355; in yet another implementation, there can be one third sub-core 3355 and two first cores 334, and the third sub-core 3355 can be arranged between the two first cores 334; in yet another implementation, there can be multiple third sub-cores 3355 and multiple first cores 334, and the multiple third sub-cores 3355 and multiple first cores 334 are arranged alternately. Figure 12a The example shown is a case where the first core 334 is disposed between two third sub-cores 3355.

[0131] In this design, the third sub-core 3355 and the first core 334 are arranged in parallel along the reflux direction of the liquid working fluid, and are also arranged as a whole in series between the first sub-core 3351 and the second sub-core 3352. Part of the liquid working fluid, after liquefaction in the condensation chamber, is transported to the evaporation chamber through the microgrooves 333 of the first core 334, while another part is transported to the evaporation chamber through the gaps between the micropillars 332 of the third sub-core 3355. This design improves the reflux capacity of the liquid-absorbing core 330 to a certain extent, and also reduces the processing cost.

[0132] Figure 12b for Figure 12a The diagram shows a structural schematic of the absorbent core 330 on its first side. See also... Figure 12a and Figure 12bAs shown, in this embodiment, all the micropores 331 can be provided in the first sub-core 3351, the second sub-core 3352, and the third sub-core 3355 of the second core 335, while the first core 334 does not have micropores 331. This simplifies the processing technology of the liquid-absorbing core 330 and improves the processing efficiency of the liquid-absorbing core 330 while accelerating the reflux of the liquid working fluid.

[0133] Figure 13 for Figure 9 The diagram shows another structural representation of the absorbent core 330 on the second side. (Reference) Figure 13 As shown, in this embodiment, the micropores 331 can be disposed not only in each sub-core of the second core 335, but also in the first core 334. Therefore, the first core 334 is provided with both microgrooves 333 and micropores 331. Through this design, the liquid-absorbing core 330 can not only improve the reflux rate of the liquid working fluid, but also reduce the risk of the liquid working fluid being stored in the insulation cavity 343, thereby enabling the heat spreader 300 to reliably dissipate heat for the heat source electronic device 200.

[0134] Figure 14a for Figure 9 The diagram shows another structural representation of the absorbent core 330 on the second side. (Reference) Figure 14a As shown in this embodiment, the first sub-core 3351 includes a first notch 33511 facing the second sub-core 3352, and the second sub-core 3352 includes a second notch 33521 facing the first sub-core 3351. The first core 334 includes a fourth sub-core 3343, a fifth sub-core 3344, and a sixth sub-core 3345. The fourth sub-core 3343 is located between the first sub-core 3351 and the second sub-core 3352. The fifth sub-core 3344 is connected to the side of the fourth sub-core 3343 facing the first sub-core 3351 and is located within the first notch 33511. The sixth sub-core 3345 is connected to the side of the fourth sub-core 3343 facing the second sub-core 3352 and is located within the second notch 33521.

[0135] In this design, along the reflux direction of the liquid working fluid, the first sub-core 3351, the fourth sub-core 3343, and the second sub-core 3352 can be considered as arranged in series, the fifth sub-core 3344 is arranged in parallel with a portion of the first sub-core 3351, and the sixth sub-core 3345 is arranged in parallel with a portion of the second sub-core 3352. Because the microgroove 333 has a relatively large coverage area, the reflux capability of this liquid-absorbing core 330 can be effectively improved.

[0136] Figure 14b for Figure 14aThe diagram shows a structural schematic of the absorbent core 330 on its first side. See also... Figure 14a and Figure 14b As shown, in this embodiment, all of the micropores 331 can be set in the first sub-core 3351 and the second sub-core 3352 of the second core 335, while the first core 334 is not provided with micropores 331, so as to simplify the processing technology of the liquid absorption core 330 and improve the processing efficiency of the liquid absorption core 330 while accelerating the reflux of the liquid working fluid.

[0137] Figure 15 for Figure 9 The diagram shows another structural representation of the absorbent core 330 on the second side. (Reference) Figure 15 As shown, in this embodiment, the micropores 331 can be disposed in each sub-core of the second core 335 or in each sub-core of the first core 334. Therefore, each sub-core of the first core 334 is provided with both microgrooves 333 and micropores 331. Through this design, the liquid-absorbing core 330 can not only improve the reflux rate of the liquid working fluid, but also reduce the risk of the liquid working fluid being stored in the insulation cavity 343, thereby enabling the heat spreader 300 to reliably dissipate heat for the heat source electronic device 200.

[0138] In addition, Figures 10a to 15 In the illustrated embodiment, the pore diameter and center-to-center distance of the micropores 331 in the liquid absorption core 330 can also be referenced. Figure 6a and Figure 6b The description of the illustrated embodiment is modified for design differentiation; the diameter and center-to-center distance of the micropillars 332 can also be referenced. Figure 7a and Figure 7b The description of the illustrated embodiment is designed differently, and the specifics will not be elaborated further here.

[0139] Figure 16 for Figure 4 The diagram shows another cross-sectional structure of the heat spreader 300 at BB. Figure 17 for Figure 16 The diagram shows a cross-sectional view of the liquid absorption core 330 of the temperature distribution plate 300. Figure 16 and Figure 17 An example is also shown where the micropillars 332 and microgrooves 333 are arranged on the same side. (Reference) Figure 16 and Figure 17 As shown in the embodiments of this application, the division of the first core 334 and the second core 335 in the liquid absorption core 330 can be referred to the foregoing. Figures 8 to 15The embodiments shown will not be described in detail here. The first core 334 and the second core 335 each include a first layer structure and a second layer structure. The second layer structure of both cores is disposed on the side of their first layer structure facing the second cover plate 320. The side of the first layer structure 3341 of the first core 334 facing the first cover plate 310 and the side of the first layer structure 3353 of the second core 335 facing the first cover plate 310 together form the first surface 330a of the liquid-absorbing core 330. The side of the first layer structure 3341 of the first core 334 facing the second cover plate 320 and the side of the first layer structure 33553 of the second core 335 facing the second cover plate 320 together form the second surface 330b of the liquid-absorbing core 330.

[0140] Multiple micropillars 332 are disposed on the first core 334 and the second core 335, and the multiple micropillars 332 can form a second layer structure 3342 of the first core 334 and a second layer structure 3354 of the second core 335. That is to say, the second surface 330b of the liquid-absorbing core 330 can be fully arranged with micropillars 332, thereby reliably supporting the entire liquid-absorbing core 330 and effectively improving the permeability of the liquid-absorbing core 330.

[0141] Figure 18 for Figure 17 The diagram shows a structural schematic of the absorbent core 330 on the second side. See also... Figure 17 and Figure 18 As shown in the embodiment of this application, the microgroove 333 can not only be disposed on the side of the first layer structure of the first core 334 facing the second cover plate 320, but also on the end face of the micropillar 332 of the first core 334, thereby increasing the coverage area of ​​the microgroove 333 in the first core 334 and accelerating the reflux rate of the liquid working fluid.

[0142] In a specific implementation, the microgrooves 333 of the first layer structure of the first core 334 and the microgrooves 333 on the end face of the micropillars 332 of the first core 334 can be formed simultaneously by laser etching process, thereby improving the processing efficiency of the liquid absorption core 330.

[0143] Of course, in some other embodiments, the microgroove 333 can be disposed not only in the first core 334, but also in the second core 335, for example, on the surface of the first layer structure of the second core 335 facing the second cover plate 320 and the end face of the micropillar 332 of the second core 335, so as to further accelerate the reflux rate of the liquid working fluid.

[0144] In addition, in this embodiment, the multiple micropores 331 can be disposed in either the first core 334 or the second core 335, thereby increasing the coverage area of ​​the micropores 331 in the liquid-absorbing core 330 and improving the capillary force of the liquid-absorbing core 330.

[0145] Combination Figure 17 and Figure 18 As shown, in the second core 335, micropillars 332 form the second layer structure 3354 of the second core 335, and micropores 331 penetrate the first layer structure 3353 of the second core 335. Therefore, the height of the micropillars 332 is the thickness of the second layer structure 3354 of the second core 335, and the depth of the micropores 331 is the thickness of the first layer structure 3353 of the second core 335. The thickness of the first layer structure 3353 of the second core 335 can be less than or equal to the thickness of the second layer structure 3354 of the second core 335, that is, the layer thickness occupied by the micropores 331 is less than or equal to the layer thickness occupied by the micropillars 332. In the first core 334, the overall thickness of the first layer structure 3341 of the first core 334 is defined as d2, and the depth of the microgroove 333 is defined as d1'. Therefore, the depth of the micropores 331 in the first core 334 is at least d2 - d1'. In specific implementation, d2 - d1' ≤ d1', meaning the layer thickness occupied by the micropores 331 is less than or equal to the layer thickness occupied by the microgroove 333. By increasing the height of the micropillars 332 of the second core 335 and the depth of the microgrooves 333 of the first core 334, the capillary force and permeability of the liquid-absorbing core 330 can be effectively improved, thereby enhancing the liquid return capacity of the liquid-absorbing core 330.

[0146] In addition, Figure 17 and Figure 18 In the illustrated embodiment, the pore diameter and center-to-center distance of the micropores 331 in the liquid absorption core 330 can also be referenced. Figure 6a and Figure 6b The description of the illustrated embodiment is modified for design differentiation; the diameter and center-to-center distance of the micropillars 332 can also be referenced. Figure 7a and Figure 7b The description of the illustrated embodiment is designed differently, and the specifics will not be elaborated further here.

[0147] Figure 19 for Figure 4 The diagram shows another cross-sectional structure of the heat spreader 300 at BB. Figure 19 An example of a configuration where the micropillars 332 and microgrooves 333 are arranged on opposite sides is shown. (Reference) Figure 19As shown in this embodiment, the liquid-absorbing core 330 includes a first core 334 and a second core 335. At least a portion of the first core 334 is located within the insulation cavity 343, and the second core 335 includes a first sub-core 3351 and a second sub-core 3352. At least a portion of the first sub-core 3351 is located within the evaporation cavity 341, and at least a portion of the second sub-core 3352 is located within the condensation cavity 342. Multiple microgrooves 333 are disposed on the side of the first layer structure of the first core 334 facing the first cover plate 310. Thus, after the working fluid liquefies in the condensation cavity 342, the liquid working fluid can flow into the evaporation cavity 341 under the directional guidance of the multiple microgrooves 333, accelerating the reflux rate of the liquid working fluid.

[0148] Figure 20 for Figure 19 A schematic cross-sectional view of the liquid-absorbing core of the temperature distribution plate 300 is shown. (See also...) Figure 19 and Figure 20 As shown, the first core 334 and the second core 335 each include a first layer structure and a second layer structure. The second layer structure of both cores is disposed on the side of their first layer structure facing the second cover plate 320. The side of the first layer structure 3341 of the first core 334 facing the first cover plate 310 and the side of the first layer structure 3353 of the second core 335 facing the first cover plate 310 together form the first surface 330a of the liquid-absorbing core 330. The side of the first layer structure 3341 of the first core 334 facing the second cover plate 320 and the side of the first layer structure 3353 of the second core 335 facing the second cover plate 320 together form the second surface 330b of the liquid-absorbing core 330.

[0149] Multiple micropillars 332 are disposed on the first core 334 and the second core 335, and the multiple micropillars 332 can form a second layer structure of the first core 334 and the second core 335. That is to say, the second surface 330b of the liquid-absorbing core 330 can be fully arranged with micropillars 332 to effectively improve the capillary force of the liquid-absorbing core 330.

[0150] Figure 21a for Figure 20 The diagram shows a structural schematic of the liquid-absorbing core 330 on the first side. Referring to 21a, in this embodiment, along the length of the heat spreader 300, the first sub-core 3351 and the second sub-core 3352 of the second core 335 are spaced apart, and the first core 334 is located between the first sub-core 3351 and the second sub-core 3352. In this design, along the reflux direction of the liquid working fluid, the first sub-core 3351, the first core 334, and the second sub-core 3352 can be considered as arranged in series. The liquid working fluid liquefied in the condensation chamber 342 can be transported to the evaporation chamber 341 through the microgrooves 333 of the first core 334, thereby further improving the reflux rate of the liquid working fluid.

[0151] In addition, in this embodiment, some of the micropores 331 are disposed in the second core 335, while other micropores 331 can be disposed in the first core 334. For example, these other micropores 331 can be disposed in a local area of ​​the first core 334 near the first sub-core 3351, and in a local area of ​​the first core 334 near the second sub-core 3352. By superimposing microgrooves 333 and micropores 331 at both ends of the first sub-core 3351, the capillary force of the liquid-absorbing core 330 can be improved to a certain extent while simplifying the processing technology of the liquid-absorbing core 330.

[0152] Of course, in some other embodiments, the micropores 331 can also be all provided in the first sub-core 3351 and the second sub-core 3352, while the first core 334 is not provided with micropores 331. This can further simplify the processing technology of the liquid absorption core 330 and improve the processing efficiency of the liquid absorption core 330.

[0153] Figure 21b for Figure 20 The diagram shows another structural representation of the absorbent core 330 on its first side. (See reference) Figure 21b As shown in the embodiments of this application, the micropores 331 can be disposed in the second core 335 or the first core 334. In the first core 334, the micropores 331 can be distributed in the entire area of ​​the first core 334 to effectively improve the capillary force of the liquid-absorbing core 330.

[0154] Figure 22a for Figure 20 The diagram shows another structural representation of the absorbent core 330 on its first side. (See reference) Figure 22a As shown in the embodiments of this application, the second core 335 may further include a third sub-core 3355, at least a portion of which is located within the insulation cavity 343 (see reference). Figure 19 (As shown). The third sub-core 3355 and the first core 334 are arranged side by side between the first sub-core 3351 and the second sub-core 3352. Along the reflux direction of the liquid working fluid, the third sub-core 3355 and the first core 334 are arranged in parallel, and the two are arranged as a whole in series between the first sub-core 3351 and the second core 3352. The reflux capacity of this liquid-absorbing core 330 is improved to a certain extent, and the processing cost is relatively low.

[0155] In addition, in this embodiment, besides the second core 335 being provided with micropores 331, the local area of ​​the first core 334 near the first sub-core 3351 and the local area of ​​the first core 334 near the second sub-core 3352 can also be provided with micropores 331, so as to simplify the processing technology of the liquid-absorbing core 330 while improving the capillary force of the liquid-absorbing core 330 to a certain extent.

[0156] Figure 22b for Figure 20 The diagram shows another structural representation of the absorbent core 330 on its first side. (See reference) Figure 22b As shown in the embodiment of this application, the second core 335 is provided with micropores 331, and the first core 334 is provided with micropores 331 and microgrooves 333. The micropores 331 and microgrooves 333 can be distributed in the entire area of ​​the first core 334 to effectively improve the capillary force of the liquid-absorbing core 330.

[0157] Figure 23a for Figure 20 The diagram shows another structural representation of the absorbent core 330 on its first side. (See reference) Figure 23a As shown in this embodiment, the first sub-core 3351 includes a first notch 33511 facing the second sub-core 3352, and the second sub-core 3352 includes a second notch 33521 facing the first sub-core 3351. The first core 334 includes a fourth sub-core 3343, a fifth sub-core 3344, and a sixth sub-core 3345. The fourth sub-core 3343 is located between the first sub-core 3351 and the second sub-core 3352. The fifth sub-core 3344 is connected to the side of the fourth sub-core 3343 facing the first sub-core 3351 and is located within the first notch 33511. The sixth sub-core 3345 is connected to the side of the fourth sub-core 3343 facing the second sub-core 3352 and is located within the second notch 33521.

[0158] Along the reflux direction of the liquid working fluid, the first sub-core 3351, the fourth sub-core 3343, and the second sub-core 3352 can be considered as arranged in series, the fifth sub-core 3344 is arranged in parallel with a portion of the first sub-core 3351, and the sixth sub-core 3345 is arranged in parallel with a portion of the second sub-core 3352. Because the microgroove 333 has a relatively large coverage area, the reflux capability of this liquid-absorbing core 330 can be effectively improved.

[0159] In addition, in this embodiment, besides the second core 335 being provided with micropores 331, the local areas of the fourth sub-core 3343 near the first sub-core 3351, the local areas of the fourth sub-core 3343 near the second sub-core 3352, the local areas of the fifth sub-core 3344 located within the first notch 33511, and the local areas of the sixth sub-core 3345 located within the second notch 33521 can all be provided with micropores 331, so as to simplify the processing technology of the liquid-absorbing core 330 while improving the capillary force of the liquid-absorbing core 330 to a certain extent.

[0160] Figure 23b for Figure 20 The diagram shows another structural representation of the absorbent core 330 on its first side. (See reference) Figure 23b As shown in this embodiment, the fifth sub-core 3344 and the sixth sub-core 3345 of the first core 334 are provided with micropores 331 and microgrooves 333 throughout their entirety. Micropores 331 and microgrooves 333 are also provided in localized areas of the fourth sub-core 3343 near the first sub-core 3351 and localized areas of the fourth sub-core 3343 near the second sub-core 3352. By increasing the area of ​​the micropores 331, the capillary force of the liquid-absorbing core 330 can be effectively improved.

[0161] Of course, in some other embodiments, the fourth sub-core 3343 may also be provided with micropores 331 and microgrooves 333 throughout its entire area to further improve the capillary force of the liquid-absorbing core 330.

[0162] exist Figures 20 to 23b In the embodiments shown, in the second core 335, micropillars 332 can form a second layer structure 3354 of the second core 335, and micropores 331 penetrate the first layer structure 3353 of the second core 335. Therefore, the height of the micropillars 332 is the thickness of the second layer structure 3354 of the second core 335, and the depth of the micropores 331 is the thickness of the first layer structure 3353 of the second core 335. The thickness of the first layer structure 3353 of the second core 335 can be less than or equal to the thickness of the second layer structure 3354 of the second core 335, that is, the layer thickness occupied by the micropores 331 is less than or equal to the layer thickness occupied by the micropillars 332. In the first core 334, the overall thickness of the first layer structure 3341 of the first core 334 is defined as d2', and the depth of the microgroove 333 is d1”. Therefore, the depth of the micropores 331 in the first core 334 is at least d2'-d1”. In specific implementation, d2'-d1” ≤ d1”, meaning the layer thickness occupied by the micropores 331 is less than or equal to the layer thickness occupied by the microgroove 333. By increasing the height of the micropillars 332 of the second core 335 and the depth of the microgrooves 333 of the first core 334, the capillary force of the liquid-absorbing core 330 can be effectively improved, thereby enhancing the liquid return capacity of the liquid-absorbing core 330.

[0163] Furthermore, in the above embodiments, the pore diameter and center-to-center distance of the micropores 331 of the liquid-absorbing core 330 can also be referred to... Figure 6a and Figure 6b The description of the illustrated embodiment is modified for design differentiation; the diameter and center-to-center distance of the micropillars 332 can also be referenced. Figure 7a and Figure 7b The description of the illustrated embodiment is designed differently, and the specifics will not be elaborated further here.

[0164] Figure 24 for Figure 4 A schematic diagram of another cross-sectional structure of the heat spreader 300 shown at point AA. (Reference) Figure 24 As shown in the embodiment of this application, the liquid-absorbing core 330 includes a thinning portion 336, which is formed by a partial recess 3361 on the first surface 330a of the liquid-absorbing core 330. The thickness of the thinning portion 336 is less than the thickness of the portion of the liquid-absorbing core 330 other than the thinning portion 336. Exemplarily, the thinning portion 336 may be located within the evaporation chamber 341.

[0165] Within the evaporation chamber 341, the liquid working fluid between the wick 330 and the second cover plate 320 absorbs heat and evaporates into a vapor working fluid. At least a portion of the vapor working fluid flows through the micropores 331 in the thinning section 336 into the gas passage 312 between the wick 330 and the first cover plate 310. Because the thickness of the thinning section 336 is relatively small, the length of the micropores 331 in the thinning section 336 is also relatively short. This reduces the flow resistance of the vapor working fluid to the gas passage 312, helping to accelerate the circulation efficiency of the working fluid between the evaporation chamber 341 and the condensation chamber 342, thereby improving the heat dissipation efficiency of the heat spreader 300.

[0166] Figure 25 for Figure 4 A schematic diagram of another cross-sectional structure of the heat spreader 300 shown at point AA. (Reference) Figure 25 In this embodiment, the liquid-absorbing core 330 includes a thickened portion 337, which is formed by a partial protrusion 3371 on the second surface 330b of the liquid-absorbing core 330. The distance between the thickened portion 337 and the second cover plate 320 is smaller than the distance between the portion of the liquid-absorbing core 330 excluding the thickened portion 337 and the second cover plate 320. For example, the thickened portion 337 may be located within the evaporation chamber 341.

[0167] Inside the evaporation chamber 341, since the distance between the thickened part 337 and the second cover plate 320 is relatively small, the capacity of the liquid working medium in the evaporation chamber 341 is also reduced accordingly. In this way, even when the power of the heat source electronic device is low (the heat generated by the heat source electronic device is less), the liquid working medium can achieve a high evaporation rate, thereby achieving efficient heat dissipation for the heat source electronic device.

[0168] In addition, the distance between the liquid-absorbing core 330 and the second cover plate 320 in the condensing chamber 342 and the adiabatic chamber 343 is relatively large, so the condensing chamber 342 and the adiabatic chamber 343 can accommodate more liquid working fluid, which helps the temperature distribution plate 300 to support a higher critical heat flux density.

[0169] Figure 26 for Figure 4 A schematic diagram of another cross-sectional structure of the heat spreader 300 shown at point AA. (Reference) Figure 26 As shown in this embodiment, a recess 3361 is partially provided on the first surface 330a of the liquid-absorbing core 330, and a protrusion 3371 is partially provided on the second surface 330b of the liquid-absorbing core 330. Both the recess 3361 and the protrusion 3371 are located within the evaporation chamber 341, and are arranged opposite to each other along the thickness direction of the liquid-absorbing core 330. In specific implementation, the depth of the recess 3361 can be greater than, equal to, or less than the height of the protrusion 3371. This design enables the liquid working medium in the evaporation chamber 341 to achieve a high evaporation rate without increasing the flow resistance of the vapor working medium after evaporation to the gas channel 312, thereby effectively improving the heat dissipation performance of the heat spreader 300.

[0170] exist Figures 24 to 26 In the embodiments shown, the micropillars 332 and microgrooves 333 can be arranged on the same side or on opposite sides, and the specific details will not be illustrated here.

[0171] Figure 27 This is a schematic cross-sectional view of a temperature distribution plate 300 provided in an embodiment of this application. (Reference) Figure 27 As shown in this embodiment, the second cover plate 320 includes a first arched portion 322 disposed towards the interior of the cavity 340, forming a groove 323 on the side surface of the second cover plate 320 facing away from the cavity 340. Exemplarily, the groove 323 may be located in the heat source region of the second cover plate 320. When the heat spreader 300 is assembled into an electronic device, the heat source electronic components of the electronic device can be at least partially accommodated within the groove 323. This improves the fit and contact area between the heat source electronic components and the heat spreader 300, enhancing the heat dissipation effect on the heat source electronic components. Furthermore, it reduces the overall thickness of the assembled heat source electronic components and the heat spreader 300, thereby contributing to a reduction in the thickness of the electronic device.

[0172] The liquid-absorbing core 330 includes a second arched portion 338 disposed opposite to the first arched portion 322. The second arched portion 338 arches toward the first cover plate 310. Thus, a clearance groove 339 can be formed on the second surface 330b of the liquid-absorbing core 330. The clearance groove 339 can avoid the first arched portion 322 of the second cover plate 320, so as to avoid interference between the liquid-absorbing core 330 and the second cover plate 320 and improve the structural practicality of the temperature equalization plate 300.

[0173] Figure 28 This is a schematic cross-sectional view of a temperature distribution plate 300 provided in an embodiment of this application. (Reference) Figure 28 As shown in the embodiments of this application, the temperature distribution plate 300 may include a plurality of liquid-absorbing cores 330, which are arranged sequentially at intervals. Exemplarily, the plurality of liquid-absorbing cores 330 may be arranged along the width direction of the temperature distribution plate 300. Each liquid-absorbing core 330 may adopt the design described in the foregoing embodiments, and the specific details will not be repeated here.

[0174] The first surface 330a of the liquid-absorbing core 330 is in contact with the first cover plate 310, and the micropillars 332 of the second surface 330b of the liquid-absorbing core 330 are in contact with the second cover plate 320. In this way, a gas channel 312 can be formed between two adjacent liquid-absorbing cores 330. The gas channel 312 connects the evaporation chamber and the condensation chamber. The vaporized working fluid in the evaporation chamber can flow into the condensation chamber through the gas channel 312, thus providing a guiding function for the vaporized working fluid. In this design, the overall thickness of the heat spreader 300 is relatively small, making it more suitable for applications in thin and light electronic devices.

[0175] The following is based on Figure 26 Taking the heat spreader 300 shown in the diagram as an example, the manufacturing method of the heat spreader 300, in which the micropillars 332 and microgrooves 333 are arranged on the same side, will be described. The manufacturing method of the heat spreader 300 includes the following steps:

[0176] Step 1: Form a first cover plate 310 and a second cover plate 320 by stamping or etching, and provide a liquid injection port on the first cover plate 310 or the second cover plate 320. The first cover plate 310 and the second cover plate 320 are made of a flexible composite layer material so that the fabricated heat spreader 300 can be applied to foldable electronic devices. For example, both the first cover plate 310 and the second cover plate 320 include a first copper layer, a polyimide layer and a second copper layer stacked sequentially. The thicknesses of the first copper layer, the polyimide layer and the second copper layer are 12 μm, respectively, so the thicknesses of the first cover plate 310 and the second cover plate 320 are 0.036 mm.

[0177] Step 2: A recess 3361 is formed on the first surface 330a of the absorbent core 330 by chemical etching, and a protrusion 3371 is formed on the second surface 330b of the absorbent core 330 in the area corresponding to the recess 3361. The depth of the recess 3361 is approximately 0.02 mm, and the height of the protrusion 3371 is also approximately 0.02 mm. The absorbent core 330 can be made of C1020 oxygen-free copper with a thickness of 0.05 mm.

[0178] Step 3: Micropillars 332 and some micropores 331 are formed on the second surface 330b of the liquid absorption core 330 by chemical etching. Combined with... Figures 6a to 7b As shown, the micropillars 332 located in the first region 330b1 have a diameter of approximately 100 μm, a center-to-center distance of approximately 250 μm, and a height of approximately 20 μm; the micropillars 332 located in the second region 330b2 have a diameter of approximately 200 μm, a center-to-center distance of approximately 500 μm, and a height of approximately 40 μm. Some micropores 331 are located within the second region 330b2; the pore diameter of the micropores 331 is approximately 80 μm, and the center-to-center distance is approximately 100 μm.

[0179] Step 4: Combining Figure 11 As shown, microgrooves 333 and additional micropores 331 are formed on the first core 334 of the liquid absorption core 330 by laser etching. Multiple microgrooves 333 are disposed on the second surface 330b of the liquid absorption core 330, that is, multiple microgrooves 333 are disposed on the same side as multiple micropillars 332. The groove depth of the microgrooves 333 is approximately 40 μm, the groove width is approximately 30 μm, and the groove spacing is approximately 50 μm. The additional micropores 331 are located within the first region 330b1 of the second surface 330b of the liquid absorption core 330, with a pore diameter of approximately 20 μm and a center-to-center distance of approximately 40 μm.

[0180] Step 5: After cleaning the first cover plate 310, the second cover plate 320 and the liquid absorption core 330, the end of the micropillar 332 on the second surface 330b of the liquid absorption core 330 is fixedly connected to the second cover plate 320 by diffusion welding.

[0181] Step 6: Diffusion connection between the edge region of the first cover plate 310 and the edge region of the second cover plate 320 to form a cavity 340, so as to enclose the liquid-absorbing core 330 in the cavity 340.

[0182] Step 7: Extract air from cavity 340 through the injection port. After evacuating cavity 340 to a vacuum state, inject working fluid into cavity 340 through injection pipe, then seal injection port and remove injection pipe.

[0183] The temperature distribution plate 300 manufactured using the manufacturing method provided in this application has the following advantages:

[0184] First, the micropillars 332 in the first region 330b1 have relatively small diameters and center-to-center distances, which can increase the meniscus area of ​​the liquid working fluid, allowing the absorbing core 330 to provide more evaporation area in the corresponding heat source region 321. The micropillars 332 in the second region 330b2 have relatively large diameters and center-to-center distances, which can provide sufficient support strength for the absorbing core 330 and increase the permeability of the absorbing core 330, reducing the backflow resistance of the liquid working fluid.

[0185] Secondly, the pore size and center-to-center distance of the micropores 331 in the first region 330b1 are relatively small, which allows the liquid-absorbing core 330 to provide more evaporation sites and evaporation area in the corresponding heat source region 321, thereby improving the evaporation efficiency of the liquid-absorbing core 330 in this part; the pore size and center-to-center distance of the micropores 331 in the second region 330b2 are relatively large, which can reduce the manufacturing process difficulty while ensuring normal capillary reflux.

[0186] Furthermore, by causing a localized area of ​​the liquid-absorbing core 330 to sink, the evaporation rate of the liquid working fluid at the corresponding location within the cavity 340 can be increased. Additionally, the capacity of the liquid working fluid at other locations within the cavity 340 can be increased, which helps the temperature distribution plate 300 to support a higher critical heat flux density.

[0187] Furthermore, multiple microchannels 333 are disposed in the first core 334. After the working fluid is liquefied in the condensation chamber 342, the liquid working fluid can flow into the evaporation chamber 341 under the directional flow guidance of the multiple microchannels 333, thereby accelerating the reflux rate of the liquid working fluid.

[0188] The following is based on Figure 27 Taking the heat spreader 300 shown in the diagram as an example, the manufacturing method of the heat spreader 300, in which the micropillars 332 and microgrooves 333 are arranged on the same side, will be described. The manufacturing method of the heat spreader 300 includes the following steps:

[0189] Step 1: A first cover plate 310 and a second cover plate 320 are formed by stamping. Multiple protrusions 311 are formed on one side surface of the first cover plate 310, and a first arched portion 322 is formed in the second cover plate 320. An injection port is provided on either the first cover plate 310 or the second cover plate 320. The first cover plate 310 and the second cover plate 320 are made of rigid material, such as a steel-copper composite material with a thickness of 0.15 mm.

[0190] Step 2: The liquid-absorbing core 330 is formed into a second arched portion 338 by stamping. The liquid-absorbing core 330 can be made of C1020 oxygen-free copper with a thickness of 0.04mm.

[0191] Step 3, Combining Figure 18As shown, micropillars 332 are formed on the second surface 330b of the liquid absorption core 330 by chemical etching, and micropores 331 are formed in areas avoiding multiple micropillars 332, such that the micropores 331 surround each micropillar 332. The micropillars 332 have a diameter of approximately 200 μm, a center-to-center distance of approximately 500 μm, and a height of approximately 20 μm; the micropores 331 have a diameter of approximately 80 μm and a center-to-center distance of approximately 100 μm.

[0192] Step 4: Microgrooves 333 are formed on the second surface 330b of the liquid absorption core 330 and the end face of the micropillar 332 by laser etching. The depth of the microgrooves 333 is between 10um and 15um, the width is approximately 30um, and the spacing between the grooves is approximately 50um.

[0193] Step 5: After cleaning the first cover plate 310, the second cover plate 320 and the liquid absorption core 330, the end of the micropillar 332 on the second surface 330b of the liquid absorption core 330 is fixedly connected to the second cover plate 320 by diffusion welding.

[0194] Step 6: Diffusion connection between the edge region of the first cover plate 310 and the edge region of the second cover plate 320 to form a cavity 340, so as to enclose the liquid-absorbing core 330 in the cavity 340.

[0195] Step 7: Extract air from cavity 340 through the injection port. After evacuating cavity 340 to a vacuum state, inject working fluid into cavity 340 through injection pipe, then seal injection port and remove injection pipe.

[0196] The temperature distribution plate 300 manufactured using the manufacturing method provided in this application has the following advantages:

[0197] First, the heat spreader 300 can accommodate the heat source electronic device 200 through the groove 323 of the second cover plate 320. This not only improves the fit and contact area between the heat source electronic device 200 and the heat spreader 300 and enhances the heat dissipation of the heat source electronic device 200, but also reduces the overall thickness of the heat source electronic device 200 and the heat spreader 300 after assembly, thereby helping to reduce the thickness of the electronic device.

[0198] Secondly, by forming small-sized microgrooves 333 through laser etching, the capillary force of the liquid-absorbing core 330 can be improved, and the directional flow guidance capability of the liquid-absorbing core 330 can be enhanced, thereby accelerating the reflux rate of the liquid working fluid to the evaporation chamber 341.

[0199] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat spreader (300), characterized in that, It includes a first cover plate (310), a second cover plate (320) and a liquid-absorbing core (330). The first cover plate (310) and the second cover plate (320) are fixedly connected and enclosed to form a cavity (340). The cavity (340) includes an evaporation cavity (341) and a condensation cavity (342). The liquid-absorbing core (330) is an integral structure, disposed within the cavity (340). The liquid-absorbing core (330) includes a first surface (330a) and a second surface (330b). The first surface (330a) faces the first cover plate (310), and the second surface (330b) faces the second cover plate (320). The liquid-absorbing core (330) is provided with micropores (331), micropillars (332), and microgrooves (333). The micropores (331) extend from the first surface (330a) to the second cover plate (320). The micro-pillar (332) is disposed on the second surface (330b), the micro-pillar (332) protrudes from the second surface (330b) toward the second cover plate (320), and the end face of the micro-pillar (332) facing the second cover plate (320) contacts the second cover plate (320). The micro-groove (333) is disposed on at least one of the first surface (330a) or the second surface (330b), and the two ends of the micro-groove (333) are respectively connected to the evaporation chamber (341) and the condensation chamber (342). The aperture of the micropore (331), the diameter of the microcolumn (332), and the width of the microgroove (333) are all greater than or equal to 10 μm and less than or equal to 500 μm.

2. The temperature distribution plate (300) as described in claim 1, characterized in that, The second surface (330b) includes a first region (330b1) and a second region (330b2), the first region (330b1) being located within the evaporation chamber (341) and the second region (330b2) being at least partially located within the condensation chamber (342); The pore size of the micropores (331) in the first region (330b1) is smaller than that of the micropores (331) in the second region (330b2), and the arrangement density of the micropores (331) in the first region (330b1) is greater than that of the micropores (331) in the second region (330b2).

3. The temperature distribution plate (300) as described in claim 2, characterized in that, The micropores (331) in the first region (330b1) are formed by laser etching, and the micropores (331) in the second region (330b2) are formed by chemical etching.

4. The heat spreader (300) as described in any one of claims 1-3, characterized in that, The second surface (330b) includes a first region (330b1) and a second region (330b2), the first region (330b1) being located within the evaporation chamber (341) and the second region (330b2) being at least partially located within the condensation chamber (342); The diameter of the micropillars (332) in the first region (330b1) is smaller than the diameter of the micropillars (332) in the second region (330b2), and the arrangement density of the micropillars (332) in the first region (330b1) is greater than the arrangement density of the micropillars (332) in the second region (330b2).

5. The temperature distribution plate (300) as described in any one of claims 1-4, characterized in that, The cavity (340) further includes an insulating cavity (343) located between the evaporation cavity (341) and the condensation cavity (342); the liquid absorption core (330) includes a first core (334), at least a portion of which is located within the insulating cavity (343); The microgroove (333) is disposed on the first core (334).

6. The temperature distribution plate (300) as described in claim 5, characterized in that, The liquid absorption core (330) further includes a second core (335), which includes a first sub-core (3351) and a second sub-core (3352). At least a portion of the first sub-core (3351) is located in the evaporation chamber (341), and at least a portion of the second sub-core (3352) is located in the condensation chamber (342). The micropillar (332) is at least disposed in the second core (335).

7. The temperature distribution plate (300) as described in claim 6, characterized in that, The first sub-core (3351) and the second sub-core (3352) are spaced apart, and the first core (334) is located between the first sub-core (3351) and the second sub-core (3352).

8. The temperature distribution plate (300) as described in claim 6, characterized in that, The second core (335) further includes a third sub-core (3355), at least a portion of which is located within the insulation cavity (343); The third sub-core (3355) and the first core (334) are arranged side by side between the first sub-core (3351) and the second sub-core (3352).

9. The temperature distribution plate (300) as described in claim 6, characterized in that, The first sub-core (3351) includes a first notch (33511) facing the second sub-core (3352), and the second sub-core (3352) includes a second notch (33521) facing the first sub-core (3351). The first core (334) includes a fourth sub-core (3343), a fifth sub-core (3344), and a sixth sub-core (3345). The fourth sub-core (3343) is located between the first sub-core (3351) and the second sub-core (3352). The fifth sub-core (3344) is connected to the side of the fourth sub-core (3343) facing the first sub-core (3351) and is located within the first notch (33511). The sixth sub-core (3345) is connected to the side of the fourth sub-core (3343) facing the second sub-core (3352) and is located within the second notch (33521).

10. The heat spreader (300) as described in any one of claims 6-9, characterized in that, All the micropores (331) are disposed in the second core (335); or, Some of the micropores (331) are disposed in the second core (335), and other micropores (331) are disposed in the first core (334).

11. The heat spreader (300) as described in any one of claims 6-10, characterized in that, The first core (334) and the second core (335) respectively include a first layer structure and a second layer structure, with the second layer structure disposed on the side of the first layer structure facing the second cover plate (320); The micropillars (332) form the second layer structure (3342) of the first core (334) and the second layer structure (3354) of the second core (335).

12. The heat spreader (300) as described in claim 11, characterized in that, The microgroove (333) is disposed on the side of the first layer structure of the first core (334) facing the first cover plate (310).

13. The heat spreader (300) as described in claim 11, characterized in that, The first layer structure (3341) of the first core (334) facing the second cover plate (320) and the first layer structure (3353) of the second core (335) facing the second cover plate (320) form the second surface (330b). Some of the microgrooves (333) are disposed on the side of the first layer structure (3341) of the first core (334) facing the second cover plate (320), and some of the microgrooves (333) are disposed on the end face of the micropillars (332) of the first core (334).

14. The heat spreader (300) as described in any one of claims 6-10, characterized in that, The first core (334) and the second core (335) respectively include a first layer structure and a second layer structure, with the second layer structure disposed on the side of the first layer structure facing the second cover plate (320); The micropillars (332) form the second layer structure (3354) of the second core (335); The microgroove (333) is disposed on the side of the second layer structure (3342) of the first core (334) facing the second cover plate (320).

15. The heat spreader (300) as described in any one of claims 1-14, characterized in that, The absorbent core (330) includes a thinned portion (336) formed by a partial recess in the first surface (330a), the thickness of which is less than the thickness of the portion of the absorbent core (330) excluding the thinned portion (336).

16. The heat spreader (300) as described in any one of claims 1-15, characterized in that, The absorbent core (330) includes a thickened portion (337) formed by a partial protrusion of the second surface (330b). The distance between the thickened portion (337) and the second cover plate (320) is smaller than the distance between the portion of the absorbent core (330) other than the thickened portion (337) and the second cover plate (320).

17. The heat spreader (300) as described in any one of claims 1-16, characterized in that, The second cover plate (320) includes a first arch (322) arching toward the interior of the cavity (340), and a groove (323) is formed on the side surface of the second cover plate (320) facing away from the cavity (340) at a position corresponding to the first arch (322). The liquid-absorbing core (330) includes a second arched portion (338) that arches toward the first cover plate (310), and the second arched portion (338) is disposed opposite to the first arched portion (322).

18. The heat spreader (300) as described in any one of claims 1-17, characterized in that, The first cover plate (310) has a plurality of protrusions (311) spaced apart on one side of the cavity (340), and an air passage (312) is formed between adjacent protrusions (311). The air passage (312) is connected to the evaporation cavity (341) and the condensation cavity (342) respectively.

19. The heat spreader (300) as described in any one of claims 1-17, characterized in that, There are multiple liquid-absorbing cores (330), which are arranged sequentially at intervals. An air passage (312) is formed between adjacent liquid-absorbing cores (330), and the air passage (312) is connected to the evaporation chamber (341) and the condensation chamber (342) respectively.

20. A heat spreader (300), characterized in that, It includes a first cover plate (310), a second cover plate (320) and a liquid-absorbing core (330). The first cover plate (310) and the second cover plate (320) are fixedly connected and enclosed to form a cavity (340). The cavity (340) includes an evaporation cavity (341) and a condensation cavity (342). The liquid-absorbing core (330) is an integral structure, disposed within the cavity (340). The liquid-absorbing core (330) includes a first surface (330a) and a second surface (330b), the first surface (330a) facing the first cover plate (310), and the second surface (330b) facing the second cover plate (320). The liquid-absorbing core (330) is provided with micropores (331) and micropillars (332). The micropores (331) are formed by the first... The surface (330a) extends through to the second surface (330b), and the micropillar (332) is disposed on the second surface (330b). The micropillar (332) protrudes from the second surface (330b) toward the second cover plate (320), and the end face of the micropillar (332) facing the second cover plate (320) contacts the second cover plate (320). The aperture of the microhole (331) and the diameter of the micropillar (332) are both greater than or equal to 10 μm and less than or equal to 500 μm. The second surface (330b) includes a first region (330b1) and a second region (330b2), the first region (330b1) being located within the evaporation chamber (341), and the second region (330b2) being at least partially located within the condensation chamber (342); the pore size of the micropores (331) in the first region (330b1) is smaller than the pore size of the micropores (331) in the second region (330b2), and the arrangement density of the micropores (331) in the first region (330b1) is greater than the arrangement density of the micropores (331) in the second region (330b2).

21. The heat spreader (300) as described in claim 20, characterized in that, The micropores (331) in the first region (330b1) are formed by laser etching, and the micropores (331) in the second region (330b2) are formed by chemical etching.

22. The heat spreader (300) as described in claim 20 or 21, characterized in that, The diameter of the micropillars (332) in the first region (330b1) is smaller than the diameter of the micropillars (332) in the second region (330b2), and the arrangement density of the micropillars (332) in the first region (330b1) is greater than the arrangement density of the micropillars (332) in the second region (330b2).

23. The heat spreader (300) as described in any one of claims 20-22, characterized in that, The liquid absorption core (330) is provided with micro grooves (333), and the micro grooves (333) are provided on at least one of the first surface (330a) and the second surface (330b). The two ends of the micro grooves (333) are respectively connected to the evaporation chamber (341) and the condensation chamber (342). The width of the microgroove (333) is greater than or equal to 10 μm and less than or equal to 500 μm.

24. A heat spreader (300), characterized in that, It includes a first cover plate (310), a second cover plate (320) and a liquid-absorbing core (330). The first cover plate (310) and the second cover plate (320) are fixedly connected and enclosed to form a cavity (340). The cavity (340) includes an evaporation cavity (341) and a condensation cavity (342). The liquid-absorbing core (330) is an integral structure, disposed within the cavity (340). The liquid-absorbing core (330) includes a first surface (330a) and a second surface (330b), the first surface (330a) facing the first cover plate (310), and the second surface (330b) facing the second cover plate (320). The liquid-absorbing core (330) is provided with micropores (331) and micropillars (332). The micropores (331) are formed by the first... The surface (330a) extends through to the second surface (330b), and the micropillar (332) is disposed on the second surface (330b). The micropillar (332) protrudes from the second surface (330b) toward the second cover plate (320), and the end face of the micropillar (332) facing the second cover plate (320) contacts the second cover plate (320). The aperture of the microhole (331) and the diameter of the micropillar (332) are both greater than or equal to 10 μm and less than or equal to 500 μm. The second surface (330b) includes a first region (330b1) and a second region (330b2), the first region (330b1) being located within the evaporation chamber (341), and the second region (330b2) being at least partially located within the condensation chamber (342); the micropores (331) of the first region (330b1) and the micropores (331) of the second region (330b2) are formed by different processes.

25. The heat spreader (300) as described in claim 24, characterized in that, The pore size of the micropores (331) in the first region (330b1) is smaller than that of the micropores (331) in the second region (330b2), and the arrangement density of the micropores (331) in the first region (330b1) is greater than that of the micropores (331) in the second region (330b2).

26. The heat spreader (300) as described in claim 24 or 25, characterized in that, The micropores (331) in the first region (330b1) are formed by laser etching, and the micropores (331) in the second region (330b2) are formed by chemical etching.

27. The heat spreader (300) as described in any one of claims 24-26, characterized in that, The diameter of the micropillars (332) in the first region (330b1) is smaller than the diameter of the micropillars (332) in the second region (330b2), and the arrangement density of the micropillars (332) in the first region (330b1) is greater than the arrangement density of the micropillars (332) in the second region (330b2).

28. The heat spreader (300) as described in any one of claims 24-27, characterized in that, The liquid absorption core (330) is provided with micro grooves (333), and the micro grooves (333) are provided on at least one of the first surface (330a) and the second surface (330b). The two ends of the micro grooves (333) are respectively connected to the evaporation chamber (341) and the condensation chamber (342). The width of the microgroove (333) is greater than or equal to 10 μm and less than or equal to 500 μm.

29. An electronic device (1000), characterized in that, Includes a heat source electronic device (200) and a heat spreader (300) as described in any one of claims 1-28, wherein the heat source electronic device (200) is in thermal contact with the surface of the second cover plate (320) of the heat spreader (300) facing away from the cavity (340).

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